WO2018181761A1

WO2018181761A1 - Sealing film, method for manufacturing electronic component device, and electronic component device

Info

Publication number: WO2018181761A1
Application number: PCT/JP2018/013344
Authority: WO
Inventors: 野村　豊; 裕介渡瀬; 弘邦荻原; 知世金子; 鈴木　雅彦
Original assignee: 日立化成株式会社
Priority date: 2017-03-31
Filing date: 2018-03-29
Publication date: 2018-10-04
Also published as: JPWO2018181761A1; JP7115469B2; CN110462818A; TW201903989A; KR20190132401A; CN117438381A; KR102440947B1; CN110462818B; TWI733014B

Abstract

Disclosed is a sealing film for sealing an electronic component, said sealing film being provided with a seal resin layer having: a first resin layer containing a first thermosetting resin and a first inorganic filler; and a second resin layer containing a second thermosetting resin and a second inorganic filler. The curing shrinkage ratio of the second resin layer, which has a sealing surface that is made to face toward the electronic component side when the electronic component is to be sealed, is larger than the curing shrinkage ratio of the first resin layer.

Description

Sealing film, method for manufacturing electronic component device, and electronic component device

The present invention relates to a sealing film, in particular, a sealing film used for sealing a semiconductor device such as a semiconductor chip or embedding an electronic component placed on a printed wiring board, and a semiconductor device using the sealing film The present invention relates to an electronic component device manufacturing method and the like, and an electronic component device.

As the electronic devices become lighter and thinner, semiconductor devices are becoming smaller and thinner. A mounting form such as a semiconductor device having almost the same size as a semiconductor chip or a package-on-package in which a semiconductor device is stacked on the semiconductor device is also widely adopted. In the future, it is expected that semiconductor devices will be further reduced in size and thickness.

As the semiconductor chip becomes finer and the number of terminals increases, it becomes difficult to provide all the terminals for external connection on the semiconductor chip. For example, when a large number of terminals for external connection are provided, the pitch between the terminals is reduced and the height of the terminals is reduced, so that it is difficult to ensure connection reliability after the semiconductor device is mounted. Therefore, many new mounting methods have been proposed in order to reduce the size and thickness of the semiconductor device.

For example, after rearranging semiconductor chips made from a semiconductor wafer and separated into individual pieces at an appropriate interval, this is sealed with a solid or liquid sealing resin, and the resulting sealed molded product is sealed. A mounting method in which a terminal for external connection is further provided in a stop resin portion and a semiconductor device manufactured using the mounting method have been proposed (see, for example, Patent Documents 1 to 4).

The sealing of the rearranged semiconductor chip is usually performed by molding using a liquid or solid resin sealing material. In the mounting method described above, steps such as formation of wiring for arranging external connection terminals and formation of external connection terminals are performed on the sealed molded product produced by sealing.

Since the process of forming the wiring and the external terminal is performed on the sealed molded product, the more semiconductor chips to be rearranged, the more semiconductor devices that can be manufactured in one process. Therefore, increasing the size of the sealed molded product has been studied. For example, in order to cope with the use of a semiconductor manufacturing apparatus at the time of wiring formation, a wafer-shaped encapsulated molded product may be formed. In that case, the manufacturing process is simplified and the cost is reduced by increasing the diameter of the wafer (see, for example, Patent Documents 5 and 6). On the other hand, the use of a sealed molded product as a panel is also being studied so that it is possible to use a printed wiring board manufacturing apparatus or the like that can be made larger and cheaper than a semiconductor manufacturing apparatus.

Japanese Patent No. 3616615 JP 2001-244372 A Japanese Patent Laid-Open No. 2001-127095 US Patent Application Publication No. 2007/205513 Japanese Patent No. 5385247 JP 2012-224062 A

However, when the size of the encapsulated molded product is increased, the problem of warpage of the encapsulated molded product that occurs when the thermosetting sealing resin is cooled to room temperature tends to become significant. The warp generated in the sealed molded product may cause a positional shift in the dicing process and the rewiring process, and may cause a decrease in the reliability of the package. In addition, if the warp is large, for example, when the insulating resin for rewiring is a liquid material, there is a problem that the sealing molded product cannot be fixed to the coater chuck for applying the liquid material. It may be difficult to form the insulating resin layer.

This invention is made | formed in view of the said situation, The manufacturing method of the electronic component apparatus using the sealing film which can fully suppress the curvature of a sealing molding, the said sealing film, and And an electronic component device.

One aspect of the present invention is a first resin layer containing a first thermosetting resin and a first inorganic filler, and a second resin containing a second thermosetting resin and a second inorganic filler. A sealing film for sealing an electronic component is provided. The second resin layer has a sealing surface directed toward the electronic component when the electronic component is sealed, and the second resin layer and the first resin layer are laminated in this order from the sealing surface side. Yes. The cure shrinkage rate in the second resin layer is larger than the cure shrinkage rate in the first resin layer.

The sealing film according to one aspect of the present invention can sufficiently suppress the warpage of the sealed molded product by having the above-described configuration.

The ratio of the cure shrinkage rate of the second resin layer to the cure shrinkage rate of the first resin layer may be greater than 1 and less than 10.

The first thermosetting resin and the second thermosetting resin may be the same or different epoxy resins.

According to another aspect of the present invention, the sealing resin layer of the sealing film according to the one aspect of the present invention described above and the electronic component disposed opposite to the sealing surface are pressed under heating, thereby sealing An electronic component device comprising: embedding an electronic component in a resin layer; and curing the sealing resin layer to form a sealing layer that is a cured product of the sealing resin layer and seals the electronic component. A method of manufacturing is provided.

Still another aspect of the present invention provides an electronic component device including an electronic component and a sealing portion that seals the electronic component. The sealing part may be a cured product of the sealing resin layer of the sealing film according to the present invention described above. The electronic component may be surrounded by a cured product of the second resin layer in the sealing portion.

In the electronic component device and the manufacturing method thereof, the electronic component may include a semiconductor chip. In this case, the electronic component device is generally a semiconductor device.

According to one aspect of the present invention, there is provided a sealing film that can sufficiently suppress warpage of a sealed molded product. In addition, a method for manufacturing an electronic component device such as a semiconductor device using the sealing film and an electronic component device such as a semiconductor device are also provided.

It is a schematic cross section which shows the sealing film which concerns on one Embodiment. (A) is a schematic cross section of a sealing molded product when a semiconductor chip is sealed with a conventional single-layer sealing film, and (b) is a sealing film according to an embodiment having different curing shrinkage rates. It is a schematic cross section of the sealing molding at the time of sealing a semiconductor chip. It is a schematic cross section for explaining one embodiment of a method of manufacturing a semiconductor device. It is a schematic cross section for explaining one embodiment of a method of manufacturing a semiconductor device.

Hereinafter, embodiments of the present invention will be described in detail with appropriate reference to the drawings. However, the present invention is not limited to the following embodiments.

FIG. 1 is a schematic cross-sectional view showing a sealing film according to an embodiment. The sealing film according to this embodiment is a sealing film for sealing an electronic component, and includes a first resin layer 1 containing a first thermosetting resin and a first inorganic filler, A sealing resin layer 10 having a two-layer structure including two thermosetting resins and a second resin layer 2 containing a second inorganic filler is provided. The main surface on the second resin layer 2 side is a sealing surface 2S directed toward the electronic component when the electronic component is sealed.

The cure shrinkage rate of the second resin layer 2 is larger than the cure shrinkage rate of the first resin layer 1. By sealing an electronic component using such a sealing film, even in the case of a large-sized sealing molded product, the sealing molded product when the sealing film is returned to room temperature after being thermally cured. Warpage can be suppressed. Furthermore, it is possible to seal the electronic component with good embedding.

The reason why such an effect is obtained is not particularly limited, but the present inventors consider as follows. First, since sealing with a resin sealing material usually has a difference between the linear expansion coefficient of an object to be sealed such as a semiconductor chip and the linear expansion coefficient of a resin sealing material, room temperature after the resin sealing material is thermally cured. When it is returned to the above, there is a large difference between the shrinkage amount of the resin sealing material and the shrinkage amount of the sealed object. For example, when a silicon chip is used as a semiconductor chip and a sealing molded product is produced using an epoxy resin sealing material, the linear expansion coefficient of the silicon chip is 3.4 ppm / ° C., whereas the epoxy resin sealing material The linear expansion coefficient is about 6 ppm / ° C. even when the inorganic filler is filled at a high ratio, and the thermal contraction between the silicon chip and the epoxy resin sealing material due to the difference in the linear expansion coefficient. There is a difference in quantity. Therefore, for example, as shown in FIG. 2A, in the sealing molded product 100 obtained by sealing the semiconductor chip 20 with the single-layer sealing film 3, the cured product 3a side of the resin sealing material is usually used. That is, a warp occurs in a direction in which the side on which the semiconductor chip 20 with a small shrinkage is not embedded is concave.

On the other hand, in the case of the sealing film according to the present embodiment, as shown in FIG. 2B, when the semiconductor chip 20 is embedded on the second resin layer 2 side, the first resin layer 1 Since the second resin layer 2 has a larger amount of heat shrinkage than the second resin layer 2, the total amount of heat shrinkage between the second resin layer 2 and the semiconductor chip 20 is close to the heat shrinkage amount of the first resin layer 1. Become. The warp accompanying the thermal contraction of the cured product 1a of the first resin layer after the thermosetting and the warp accompanying the thermal contraction of the cured product 2a of the second resin layer cancel each other, resulting in a cured product of the sealing film. It is considered that warpage of the sealing molded product 100 including the sealing portion 10a and the semiconductor chip 20 sealed thereto can be suppressed.

In the sealing film according to the present embodiment, the second resin layer having a high cure shrinkage rate has a relatively high flow rate in the course of curing by heating, as compared with the first resin layer having a low cure shrinkage rate. It is easy to have sex. Therefore, by embedding the electronic component on the second resin layer side, it is possible to seal the electronic component with a favorable embedding property in which occurrence of unfilling is suppressed.

Furthermore, in the case of the sealing film according to the present embodiment, since the elastic modulus of the first and second resin layers is not limited, a material having a high elastic modulus can be applied as the thermosetting resin. Therefore, the sealing film according to the present embodiment is excellent in handleability, and is less likely to be warped due to the problem of displacement of electronic components such as a semiconductor chip and the stress of the rewiring layer after the rewiring layer is provided. This is also excellent.

The cure shrinkage rates of the first and second resin layers can be determined by the following method, for example, based on the change in specific gravity before and after the heat curing of each resin layer. When the specific gravity of the resin layer at 23 ° C. before heat curing is d ₀ and the specific gravity of the resin layer cooled to 23 ° C. after heat curing is d ₁ , the formula: cure shrinkage rate (%) = {(d ₁ −d ₀ ) / d ₁ } × 100 can determine the cure shrinkage. Heat curing is performed under a predetermined pressure (for example, 3 MPa). The heating conditions for heat curing are adjusted so that the resin layer is sufficiently cured and no volume change due to curing occurs. Moreover, a cure shrinkage rate can also be calculated | required from the change of the volume before and behind heat-hardening of each resin layer. Specifically, it can be determined based on the ratio of the difference in volume change before and after heat curing with respect to the volume of each resin layer before heat curing. For example, using a PVT tester, the curing shrinkage rate (shrinkage amount) can be determined from the volume change with respect to the temperature of the sample of the resin layer filled in the mold. In this case, the curing shrinkage rate can be obtained by holding the sample at the curing temperature until the volume of the sample does not substantially change. The curing shrinkage rate may include not only shrinkage due to the curing reaction of the thermosetting resin but also shrinkage due to a decrease in constituent materials accompanying the curing process, such as volatilization of the solvent.

The ratio of the cure shrinkage rate of the second resin layer to the cure shrinkage rate of the first resin layer is not particularly limited as long as it is larger than 1, but from the viewpoint of more effectively suppressing the warpage of the sealed molded product, 1 .05 or more, 1.10 or more, or 1.15 or more. The upper limit of the ratio of the curing shrinkage rate of the second resin layer to the curing shrinkage rate of the first resin layer is not particularly limited, but is, for example, less than 10.

The curing shrinkage rate of the first resin layer may be, for example, 0.4% or less, 0.3% or less, or 0.2% or less from the viewpoint of suppressing warpage and dimensional stability of the molded product.

The cure shrinkage rate of the second resin layer is, for example, 0.2% or more, 0.3% or more, or 0.4% or more from the viewpoint of more effectively correcting the warp by using cure shrinkage. Good. The curing shrinkage rate of the second resin layer may be, for example, 2.0% or less, 1.5% or less, or 1.0% or less from the viewpoint of dimensional stability of the molded product.

The method for adjusting the curing shrinkage rate of the first and second resin layers is not particularly limited. For example, a method of selecting different types of the first thermosetting resin contained in the first resin layer and the second thermosetting resin contained in the second resin layer, a curing agent or curing One selected from a method of changing the type and / or content of the catalyst and a method of adjusting the curing rate by changing the degree of thermal history in the process of forming the first resin layer and the second resin layer. The curing shrinkage rate of the first and second resin layers may be adjusted by the above method.

In the case of the method based on the thermal history, the curing rate can be increased by increasing the thermal history in the process of forming the resin layer. Generally, when the curing rate increases, the curing shrinkage rate due to heat curing from that state tends to decrease. The magnitude of the heat history can be adjusted by, for example, the drying temperature and the drying time for forming the first and second resin layers. By applying a varnish-like resin composition for forming a second resin layer on the first resin layer and heating the coated varnish-like resin composition together with the first resin layer, The thermal history received by the first resin layer may be made larger than the thermal history received by the second resin layer, thereby relatively increasing the curing rate of the first resin layer. The curing rate can be evaluated based on, for example, a curing heat value measured by differential scanning calorimetry. The curing heating value in the resin composition (solvent-free or varnish) used for the resin layer formation is regarded as a standard (curing rate 0%), and the curing rate can be obtained from the ratio of the curing heating value in the resin layer to that. .

The thickness of the first resin layer and the second resin layer is not particularly limited, but may be, for example, 30 to 800 μm, 50 to 500 μm, or 80 to 300 μm, respectively. When the thickness is 30 μm or more, good embedding property of the electronic component is particularly easily obtained. If the thickness is 800 μm or less, the effect of the present invention can be obtained at a higher level. The thicknesses of the first resin layer and the second resin layer may be substantially the same or different from each other. However, in the case where they are different, from the viewpoint of suppressing warpage and reducing the thickness of the electronic component, The thickness may be smaller than the thickness of the second resin layer. The total thickness of the first resin layer and the second resin layer (the thickness of the sealing resin layer) is not particularly limited, but may be 50 to 1000 μm.

The first resin layer contains a first thermosetting resin and a first inorganic filler, and the second resin layer contains a second thermosetting resin and a second inorganic filler. The first thermosetting resin and the second thermosetting resin may be the same as or different from each other, but combining the thermosetting resins different from each other may result in the first resin layer and the second thermosetting resin being combined. It can be a method for making the curing shrinkage rate of the resin layer different. Each of the first thermosetting resin and the second thermosetting resin may be a thermosetting resin described below. Here, “same” means that the structures of the compounds as the thermosetting resin are substantially the same.

The thermosetting resin may be a compound that can form a crosslinked structure by a thermosetting reaction. Examples thereof include epoxy resins, phenol resins, unsaturated imide resins, cyanate resins, isocyanate resins, benzoxazine resins, and oxetanes. Examples include resins, amino resins, unsaturated polyester resins, allyl resins, dicyclopentadiene resins, silicone resins, triazine resins, and melamine resins. These may be used alone or in combination of two or more. These thermosetting resins can be combined with a curing agent and / or a curing catalyst if necessary. From the viewpoint of excellent fluidity and suitable for embedding electronic components, an epoxy resin can be used.

The epoxy resin is not particularly limited, but may be a compound having two or more epoxy groups (or glycidyl groups) in one molecule. Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol AP type epoxy resin (1,1-bis (4-hydroxyphenyl) -1-phenylethanediglycidyl ether), and bisphenol AF type epoxy resin (2,2- Bis (4-hydroxyphenyl) hexafluoropropane diglycidyl ether), bisphenol B type epoxy resin (2,2-bis (4-hydroxyphenyl) butanediglycidyl ether), bisphenol BP type epoxy resin (bis (4-hydroxyphenyl) ) Diphenylmethane diglycidyl ether), bisphenol C type epoxy resin (2,2-bis (3-methyl-4-hydroxyphenyl) propane diglycidyl ether), bisphenol E type epoxy resin (1,1-bis (4-H) Roxyphenyl) ethanediglycidyl ether), bisphenol F type epoxy resin, bisphenol G type epoxy resin (2,2-bis (4-hydroxy-3-isopropylphenyl) propane diglycidyl ether), bisphenol M type epoxy resin (1, 3-bis [2- (4-hydroxyphenyl) -2-propyl] benzenediglycidyl ether), bisphenol P-type epoxy resin (1,4-bis (2- (4-hydroxyphenyl) -2-propyl) benzenedi Glycidyl ether), bisphenol PH type epoxy resin (5,5 ′-(1-methylethylidene) -bis [1,1 ′-(bisphenyl) -2-ol] propanediglycidyl ether), bisphenol TMC type epoxy resin ( 1,1-bis (4-hydroxypheny ) -3,3,5-trimethylcyclohexane diglycidyl ether), bisphenol Z type epoxy resin (1,1-bis (4-hydroxyphenyl) cyclohexane diglycidyl ether), bisphenol S type such as hexanediol bisphenol S diglycidyl ether Epoxy resin, novolak type epoxy resin (phenol novolak type epoxy resin, etc.), biphenyl type epoxy resin, biphenyl aralkyl type epoxy resin, naphthalene type epoxy resin, epoxidized product of phenol and aromatic aldehyde having phenolic hydroxyl group , Dicyclopentadiene type epoxy resins, dicyclopentadiene aralkyl type epoxy resins, bixylenol type epoxy resins such as bixylenol diglycidyl ether, hydrogenated bisphenol A Examples thereof include hydrogenated bisphenol A type epoxy resins such as glycidyl ether, dibasic acid-modified diglycidyl ether type epoxy resins, tris (2,3-epoxypropyl) isocyanurate, and aliphatic epoxy resins.

Commercial products can be used as the epoxy resin. Commercially available epoxy resins include EXA4700 (tetrafunctional naphthalene type epoxy resin) manufactured by DIC Corporation, and NC-7000 (polyfunctional solid epoxy resin containing naphthalene skeleton) manufactured by Nippon Kayaku Co., Ltd., Nippon Kayaku Co., Ltd. EPPN-502H (trisphenol epoxy resin) and other epoxidized products of condensates of phenols and aromatic aldehydes having a phenolic hydroxyl group, DIC Corporation Epicron HP-7200H (dicyclopentadiene skeleton-containing polyfunctional solid epoxy Resin) dicyclopentadiene aralkyl epoxy resin, Nippon Kayaku Co., Ltd. NC-3000H (biphenyl skeleton-containing polyfunctional solid epoxy resin) and other biphenyl aralkyl epoxy resin, DIC Corporation Epicron N660, and Epicron 690, Novolac epoxy resin such as EOCN-104S manufactured by Nippon Kayaku Co., Ltd., Tris (2,3-epoxypropyl) isocyanurate such as TEPIC manufactured by Nissan Chemical Industries, Ltd., Epicron 860 manufactured by DIC Corporation, Epicron 900-IM , Epicron EXA-4816, and Epicron EXA-4822, Araldite AER280 manufactured by Asahi Ciba Co., Ltd., Epototo YD-134 manufactured by Tohto Kasei Co., Ltd., JER834 and JER872 manufactured by Mitsubishi Chemical Corporation, ELA-134 manufactured by Sumitomo Chemical Co., Ltd., oil Epicoat 807, 815, 825, 827, 828, 834, 1001, 1004, 1007, and 1009 manufactured by Kasei Shell Epoxy Co., Ltd., DER-330, 301, and 361 manufactured by Dow Chemical Company, and YD812 manufactured by Tohto Kasei Co., Ltd. Bisphenol A type epoxy resin such as YDF8170, bisphenol F type epoxy resin such as JER806 manufactured by Mitsubishi Chemical Corporation, naphthalene type epoxy resin such as Epicron HP-4032 manufactured by DIC Corporation, Epicron HP-4032 manufactured by DIC Corporation, etc. Examples thereof include a naphthalene type epoxy resin, a phenol novolak type epoxy resin such as Epicron N-740 manufactured by DIC Corporation, and an aliphatic epoxy resin such as Nadecol DLC301 manufactured by Nagase ChemteX Corporation. These epoxy resins may be used individually by 1 type, and may use 2 or more types together.

The content of the first thermosetting resin in the first resin layer is 5% by mass on the basis of the total amount of the first resin layer, from the viewpoint of sufficiently ensuring the film formability even in the presence of the inorganic filler described later. The amount may be 10% by mass or more, or 15% by mass or more. From the viewpoint of further reducing curing shrinkage, the content of the first thermosetting resin in the first resin layer is 40% by mass or less, 30% by mass or less, or 20% by mass based on the total amount of the first resin layer. It may be the following.

The content of the second thermosetting resin in the second resin layer is 10% by mass or more and 15% by mass or more based on the total amount of the second resin layer from the viewpoint of more effectively correcting the warp by curing shrinkage. Or 20 mass% or more. From the viewpoint of dimensional stability of the encapsulated molded product, the content of the second thermosetting resin in the second resin layer is 45% by mass or less, 35% by mass or less, or 30% based on the total amount of the second resin layer. It may be less than mass%.

The curing agent that can be combined with the thermosetting resin is not particularly limited. For example, when an epoxy resin is used as the thermosetting resin, the curing agent has 1 reactive group with an epoxy group (glycidyl group). It may be a compound having two or more in the molecule. A hardening | curing agent may be used individually by 1 type, and may use 2 or more types together.

Examples of the curing agent include phenol resins, acid anhydrides, imidazole compounds, aliphatic amines, and alicyclic amines.

The phenol resin is not particularly limited as long as it is a compound having two or more phenolic hydroxyl groups in one molecule. Examples of the phenol resin include phenol compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A and bisphenol F, or naphthol compounds such as α-naphthol, β-naphthol and dihydroxynaphthalene, and formaldehyde, acetaldehyde, propionaldehyde. , Resins obtained by condensation or cocondensation with aldehyde compounds such as benzaldehyde and salicylaldehyde under an acidic catalyst, biphenyl skeleton type phenol resin, paraxylylene-modified phenol resin, metaxylylene / paraxylylene-modified phenol resin, melamine-modified phenol resin, terpene-modified Phenolic resin, dicyclopentadiene modified phenolic resin, cyclopentadiene modified phenolic resin, polycyclic aroma Examples thereof include a ring-modified phenol resin and a xylylene-modified naphthol resin.

Commercial products can be used as phenolic resins. Examples of commercially available phenol resins include Phenolite LF2882, Phenolite LF2822, Phenolite TD-2090, Phenolite TD-2149, Phenolite VH-4150, and Phenolite VH4170, manufactured by Dainippon Ink and Chemicals, Inc. PAPS-PN2 manufactured by Kikai Kogyo Co., Ltd., XLC-LL and XLC-4L manufactured by Mitsui Chemicals, Inc., SN-100, SN-180, SN-300, SN-395, and SN-400 manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. Examples include TrisP-HAP, TrisP-PA, TriP-PHBA, CyRS-PRD4 manufactured by Honshu Chemical Industry Co., Ltd., and MTPC, SK Resin HE910-10 manufactured by Air Water Co., Ltd.

The content of the curing agent is not particularly limited. For example, when an epoxy resin is used as the thermosetting resin and a phenol resin is used as the curing agent, the equivalent ratio of epoxy group to phenolic hydroxyl group (epoxy group / phenolic hydroxyl group) is 0.5 to 3.0 or 1 0 to 1.5. In the case of other curing agents, the equivalent ratio of the epoxy group to the reactive group of the epoxy group (epoxy group / reactive group with the epoxy group) is 0.5 to 3.0 or 1.0 to 1.5. It may be.

The curing catalyst that can be combined with the epoxy resin is not particularly limited, but is preferably an amine-based, imidazole-based, urea-based, or phosphorus-based curing catalyst. Examples of amine-based curing catalysts include 1,8-diazabicyclo [5.4.0] undecene-7, 1,5-diazabicyclo [4.3.0] nonene-5, and the like. Examples of the imidazole-based curing catalyst include 2-ethyl-4-methylimidazole and 1-cyanoethyl-2-ethyl-4-methylimidazole. Examples of urea-based curing catalysts include 3-phenyl-1,1-dimethylurea. Examples of the phosphorus-based curing catalyst include triphenylphosphine and its addition reaction product, (4-hydroxyphenyl) diphenylphosphine, bis (4-hydroxyphenyl) phenylphosphine, tris (4-hydroxyphenyl) phosphine, and the like. Among these, in particular, imidazole-based curing accelerators are rich in derivatives, and it is easy to obtain a desired activation temperature. Examples of commercially available imidazole-based curing accelerators include 2PHZ-PW and 2P4MZ manufactured by Shikoku Kasei Kogyo Co., Ltd.

The content of the curing catalyst is not particularly limited, but is, for example, 0.05 to 1.0 part by mass or 0.1 to 0.5 part by mass with respect to 100 parts by mass of the total amount of the thermosetting resin. It's okay.

The first inorganic filler and the second inorganic filler may be the same or different from each other.

Examples of inorganic fillers include barium sulfate, barium titanate, amorphous silica, crystalline silica, fused silica, spherical silica, talc, clay, magnesium carbonate, calcium carbonate, aluminum oxide, aluminum hydroxide, silicon nitride, and nitride. Examples thereof include particles such as aluminum. Silica particles are preferred as the inorganic filler from the viewpoint of easily obtaining desired cured film characteristics because of its relatively low coefficient of thermal expansion. An inorganic filler may be used individually by 1 type, and may use 2 or more types together. The shape of the inorganic filler is not limited to a spherical shape, and may be a flake shape (plate shape) or a fiber shape. The second inorganic filler contained in the second resin layer may be a spherical inorganic filler in which fluidity is easily obtained from the viewpoint of embedding of the electronic component.

The surface of the inorganic filler may be modified. Although the method of surface modification is not particularly limited, the method using a silane coupling agent is simple, a silane coupling agent having a wide variety of functional groups can be used, and desired properties are easily imparted. Examples of the silane coupling agent include alkyl silane, alkoxy silane, vinyl silane, epoxy silane, amino silane, acrylic silane, methacryl silane, mercapto silane, sulfide silane, isocyanate silane, sulfur silane, styryl silane, and alkyl chloro silane.

Specific examples of the silane coupling agent include methyltrimethoxysilane, dimethyldimethoxysilane, trimethylmethoxysilane, methyltriethoxysilane, methyltriphenoxysilane, ethyltrimethoxysilane, n-propyltrimethoxysilane, diisopropyldimethoxysilane, isobutyl. Trimethoxysilane, diisobutyldimethoxysilane, isobutyltriethoxysilane, n-hexyltrimethoxysilane, n-hexyltriethoxysilane, cyclohexylmethyldimethoxysilane, n-octyltriethoxysilane, n-dodecylmethoxysilane, phenyltrimethoxysilane, Diphenyldimethoxysilane, triphenylsilanol, methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, -Octyldimethylchlorosilane, tetraethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- (2-aminoethyl) aminopropyltrimethoxysilane, 3- (2-aminoethyl) aminopropylmethyl Dimethoxysilane, 3-phenylaminopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldimethoxy Silane, bis (3- (triethoxysilyl) propyl) disulfide, bis (3- (triethoxysilyl) propyl) tetrasulfide, vinyltriacetoxysilane, vinyltrimethoxysilane, vinyltriet Sisilane, vinyltriisopropoxysilane, allyltrimethoxysilane, diallyldimethylsilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-mercaptopropyltrimethoxy Examples include silane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltriethoxysilane, N- (1,3-dimethylbutylidene) -3-aminopropyltriethoxysilane, and aminosilane. These may be used individually by 1 type and may use 2 or more types together.

The average particle diameter of the inorganic filler is not particularly limited, but may be, for example, 0.01 to 50 μm. The average particle diameter of the inorganic filler is measured by, for example, a laser diffraction method.

The content of the first inorganic filler in the first resin layer is 60% by mass or more, 70% by mass or more, or 80% by mass or more based on the total amount of the first resin layer from the viewpoint of reducing the amount of heat shrinkage. It may be. From the viewpoint of sufficiently securing the film formability, the content of the first inorganic filler in the first resin layer is 95% by mass or less, 90% by mass or less, or 85% by mass based on the total amount of the first resin layer. % Or less.

The content of the second inorganic filler in the second resin layer is 55% by mass or more, 65% by mass or more, or 70 based on the total amount of the second resin layer from the viewpoint of dimensional stability of the sealed molded product. It may be at least mass%. From the viewpoint of sufficiently securing the film formability, the content of the second inorganic filler in the second resin layer is 95% by mass or less, 90% by mass or less, or 85% by mass based on the total amount of the second resin layer. % Or less.

The first resin layer and the second resin layer may contain components other than those described above. Such a component may be a component generally used for a sealing film. Examples thereof include antioxidants, flame retardants, ion scavengers, pigments, dyes, silane coupling agents, and elastomers.

The sealing film may further include a film-like support. In this case, the first resin layer and the second resin layer are usually provided in this order from the support side. Although a support body will not be specifically limited if it can be removed after sealing, For example, a polymer film or metal foil can be used.

Examples of the polymer film that can be used as the support include, for example, a polyethylene film, a polyolefin film such as a polypropylene film, a polyester film such as a polyethylene terephthalate film, a polyvinyl chloride film, a polycarbonate film, an acetylcellulose film, a polyimide film, a polyamide film, And tetrafluoroethylene film. As metal foil which can be used as a support body, copper foil and aluminum foil are mentioned, for example.

The film-like support may be subjected to release treatment in order to facilitate peeling. Examples of the release treatment method include a method in which a release agent is applied to the surface of the support and dried. Examples of the release agent include siloxane-based, fluorine-based, and olefin-based release agents. The surface of the metal foil may be etched with an acid or the like.

The thickness of the film-like support is not particularly limited, but may be 2 to 200 μm from the viewpoint of workability and drying property when the resin layer is formed by coating. If the thickness of the support is 2 μm or more, the support may be damaged when the varnish resin composition is applied to form a resin layer, or the support may be deformed by the weight of the varnish resin composition. Is less likely to occur. If the thickness of the support is 200 μm or less, the drying of the varnish-like resin composition (removal of the organic solvent) can be efficiently performed even when using a dryer that blows hot air mainly from both the coated surface and the back surface. It can be carried out.

The sealing film is a protective layer that covers the main surface opposite to the support of the sealing resin layer (or the second resin layer) for the purpose of protecting the first resin layer and the second resin layer. For example, a protective film) may be further provided. By providing the protective layer, the handleability of the sealing film can be improved, and the problem that the resin layer sticks to the back surface of the support when the sealing film is wound can be avoided.

Although it does not specifically limit as a protective layer, For example, the thing similar to what was illustrated as said film-form support body can be used.

The thickness of the protective layer is not particularly limited, but may be, for example, 12 to 100 μm from the viewpoint of sufficient protective effect and reducing the thickness when the sealing film is wound into a roll.

The sealing film according to the present embodiment forms, for example, a first resin layer and a second resin layer, and bonds them together, or a first resin layer and a second resin layer on a film-like support. It can manufacture by forming the resin layer in order.

The first resin layer and the second resin layer can be formed by mixing components constituting each of them and depositing the obtained resin composition. An organic solvent is added to the resin composition to be formed to prepare a varnish-like resin composition, which is coated on a support, and the coating film is dried to thereby form a first resin layer and a second resin layer. May be formed. Application | coating on the support body of a varnish-like resin composition, and drying of a coating film may be performed continuously, unwinding a support body from the roll of a support body, for example. The curing shrinkage rate of the first resin layer and the second resin layer may be adjusted according to the drying conditions at this time.

The warpage of the sealed molded product obtained by using the sealing film can be evaluated by, for example, producing a wafer level package or an evaluation substrate imitating the wafer level package. At that time, the embedding property of the semiconductor chip can be evaluated at the same time.

Next, a method for manufacturing an electronic component device using the sealing film of this embodiment will be described. In the following, an embodiment of a method for manufacturing a semiconductor device having a semiconductor chip as a representative example of an electronic component will be specifically described.

3 and 4 are schematic cross-sectional views showing an embodiment of a method for manufacturing a semiconductor device. In the method according to the present embodiment, the temporary fixing material 40 is pasted on the substrate 30 and the plurality of semiconductor chips 20 are temporarily fixed on the temporary fixing material 40 ((a) in FIG. 3). The semiconductor chip 20 seals the semiconductor chip 20 and the sealing film (sealing resin layer) 10 having the first resin layer 1 and the second resin layer 2 provided on the first resin layer 1. In a direction facing the sealing surface 2S of the resin layer 10 (direction in which the sealing surface 2S of the second resin layer 2 is in contact with the semiconductor chip), the layers are pressed under heating in this state, and the sealing resin A step of embedding the semiconductor chip 20 in the layer 10 (FIGS. 3B and 3C) and a step of curing the sealing film 10 in which the semiconductor chip 20 is embedded (FIG. 3C) are provided. By the curing, a sealed portion 10a is formed which includes the cured product 1a of the first resin layer and the cured product 2a of the second resin layer, and seals the semiconductor chip 20. In the sealing part 10a, the boundary between the cured product 1a of the first resin layer and the cured product 2a of the second resin layer is not necessarily clear.

In the method of this embodiment, a laminating method may be used for pressing the sealing film, or a compression mold may be used.

The laminator used in the laminating method is not particularly limited, and examples thereof include a roll type and a balloon type laminator. Among these, from the viewpoint of further improving the embedding property, a balloon type capable of vacuum pressurization may be employed.

The temperature for embedding the semiconductor chip (for example, the laminating temperature) is adjusted so that the sealing resin layer 10 (particularly the second resin layer 2) flows and the semiconductor chip is embedded. This temperature is set below the softening point when a support is present. Further, this temperature may be a temperature at which the second resin layer exhibits a minimum melt viscosity or a temperature in the vicinity thereof. The pressure for embedding the semiconductor chip varies depending on the size and density of the semiconductor chip (or electronic component), but may be 0.2 to 1.5 MPa, or 0.3 to 1.0 MPa, for example. The pressing time is not particularly limited, but may be 20 to 600 seconds, 30 to 300 seconds, or 40 to 120 seconds.

Curing of the sealing resin layer (the first resin layer and the second resin layer) can be performed, for example, in the atmosphere or under an inert gas. The curing temperature is not particularly limited, and may be 80 to 280 ° C., 100 to 240 ° C., or 120 to 200 ° C. If the curing temperature is 80 ° C. or higher, the curing of the sealing film proceeds sufficiently and the occurrence of defects can be particularly effectively suppressed. When the curing temperature is 280 ° C. or lower, the occurrence of heat damage to other materials can be suppressed. The curing time is not particularly limited, but may be 30 to 600 minutes, 45 to 300 minutes, or 60 to 240 minutes. When the curing time is within these ranges, the sealing resin layer is sufficiently cured, and good production efficiency can be obtained. The curing conditions may be a combination of a plurality of conditions with different temperatures and / or times.

Embedding the electronic component (semiconductor chip 20) in the sealing resin layer 10 and curing the sealing resin layer 10 to form the sealing portion 10a may be separate steps, It may be a step performed simultaneously or continuously. For example, by pressing the sealing resin layer and the electronic component while heating, the electronic component is embedded in the sealing resin layer and the sealing resin layer is cured to form a sealing portion for sealing the electronic component. Also good.

In the present embodiment, a semiconductor device can be obtained through the following insulating layer formation, wiring pattern formation, ball mounting, and dicing steps. In order to perform these steps efficiently with high accuracy, it is desirable that the warpage of the sealed molded product 100 is small.

First, the temporarily fixing material 40 is peeled off together with the substrate 30 to obtain a sealing molded product 100 including the semiconductor chip 20 and a sealing portion 10a for sealing the semiconductor chip 20 (FIG. 4A). The semiconductor chip 20 is exposed in one main surface of the sealing molded product 100. An insulating layer 50 is provided on the main surface of the sealed molded product on the side where the semiconductor chip 20 is exposed ((b) of FIG. 4). Next, the wiring 54 is formed by patterning the insulating layer 50, and the ball 56 is mounted on the patterned insulating layer 52 ((c) of FIG. 4).

Next, the sealed molding is separated into pieces by the dicing cutter 60 ((d) and (e) in FIG. 4). Thereby, the semiconductor device 200 provided with the semiconductor chip 20 and the sealing part 10a which is the hardened | cured material of the sealing resin layer of the sealing film which concerns on this embodiment is obtained. In the semiconductor device 200, the semiconductor chip 20 is embedded in the sealing portion 10a so as to be surrounded by the cured product 2a of the second resin layer in the sealing portion 10a.

As mentioned above, although preferred embodiment of the manufacturing method of the sealing film which concerns on this invention, and a semiconductor device and an electronic component apparatus was described, this invention is not necessarily limited to embodiment mentioned above, The meaning is You may change suitably in the range which does not deviate.

Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples.

Preparation of sealing film The following materials were prepared as components constituting the sealing film.
[Thermosetting resin]
A1: Bisphenol F type epoxy resin (manufactured by Mitsubishi Chemical Corporation, JER806 / epoxy equivalent: 160)
[Curing agent]
B1: Phenol novolac resin (Asahi Organic Materials Co., Ltd., PAPS-PN2 / hydroxyl group equivalent: 104)
B2: Trismethane type phenol resin (manufactured by Honshu Chemical Industry Co., Ltd., TrisP-HAP / hydroxyl group equivalent: 102)
[Inorganic filler]
C1: Silica (manufactured by Admatechs Co., Ltd., SX-E2, treated with phenylaminosilane / average particle size 5.8 μm)
[Curing catalyst]
D1: Imidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2PHZ-PW)
[Organic solvent]
E1: Methyl ethyl ketone

Example 1
497.5 g of the organic solvent E1 was put in a 10 L plastic container, 3500 g of the inorganic filler C1 was added thereto, and the inorganic filler C1 was dispersed in the organic solvent with a stirring blade. To this dispersion, 300 g of thermosetting resin A1 and 460 g of curing agent B1 were added, and the dispersion was stirred. After visually confirming that the thermosetting resin A1 and the curing agent B1 were dissolved, 2.5 g of the curing catalyst D1 was added, and the dispersion was further stirred for 1 hour. The dispersion was filtered through nylon # 200 mesh (opening 75 μm), and the filtrate was obtained as a varnish-like resin composition.

The obtained varnish-like resin composition was applied to a film-like support (polyethylene terephthalate having a thickness of 38 μm) under the following conditions using a coating machine, and the support and the coating film were applied in a drying furnace. The coating film was dried by passing at a predetermined drying speed, and the first resin layer or the second resin layer (thickness 100 μm) was formed on the support. The coating and drying speed means the moving speed of the support. The temperature of drying conditions and the furnace length mean the temperature in the drying furnace and the moving distance of the support in the drying furnace, respectively. The same applies to other examples and comparative examples.
(First resin layer)
Coating head method: Comma coating and drying speed: 2 m / min Drying conditions (temperature / furnace length): 110 ° C./3.3 m, 130 ° C./3.3 m, 140 ° C./3.3 m
(Second resin layer)
Coating head method: Comma coating and drying speed: 3 m / min Drying conditions (temperature / furnace length): 90 ° C / 3.3m, 110 ° C / 3.3m, 120 ° C / 3.3m

The 1st resin layer and the 2nd resin layer were bonded together by vacuum lamination, and the sealing film which has the sealing resin layer of 2 layer composition provided with the 1st resin layer and the 2nd resin layer was obtained. .

(Example 2)
A varnish-like resin composition was produced in the same manner as in Example 1 except that the amount of the curing catalyst D1 was changed from 2.5 g to 7.5 g. The obtained varnish-like resin composition was applied to a film-like support (polyethylene terephthalate having a thickness of 38 μm) under the following conditions using a coating machine, and the support and the coating film were applied in a drying furnace. The coating film was dried by passing at a predetermined drying speed, and a first resin layer (thickness 100 μm) was formed on the support.
Coating head method: Comma coating and drying speed: 2 m / min Drying conditions (temperature / furnace length): 110 ° C./3.3 m, 130 ° C./3.3 m, 140 ° C./3.3 m

A varnish-like resin composition was produced in the same manner as in Example 1. The obtained varnish-like resin composition was applied on a film-like support (38 μm-thick polyethylene terephthalate) using a coating machine under the following conditions, and the support and the coating film were predetermined in a drying furnace. The coating film was dried by passing it at a drying speed of 2 to form a second resin layer (thickness 100 μm) on the support.
Coating head method: Comma coating and drying speed: 2 m / min Drying conditions (temperature / furnace length): 90 ° C./3.3 m, 110 ° C./3.3 m, 120 ° C./3.3 m

(Example 3)
A varnish-like resin composition was produced in the same manner as in Example 1 except that the amount of the curing catalyst D1 was changed from 2.5 g to 7.5 g. The obtained varnish-like resin composition was applied to a film-like support (polyethylene terephthalate having a thickness of 38 μm) under the following conditions using a coating machine, and the support and the coating film were applied in a drying furnace. The coating film was dried by passing at a predetermined drying speed, and a first resin layer (thickness 100 μm) was formed on the support.
Coating head method: Comma coating and drying speed: 3 m / min Drying conditions (temperature / furnace length): 110 ° C./3.3 m, 130 ° C./3.3 m, 140 ° C./3.3 m

A varnish-like resin composition was produced in the same manner as in Example 1. Coating is performed on a film-like support (38 μm thick polyethylene terephthalate) using a coating machine under the following conditions, and the support and the coating are passed through a drying furnace at a predetermined drying speed. Was dried to form a second resin layer (thickness: 100 μm) on the support.
Coating head method: Comma coating and drying speed: 2 m / min Drying conditions (temperature / furnace length): 90 ° C./3.3 m, 110 ° C./3.3 m, 120 ° C./3.3 m

Example 4
A varnish-like resin composition was produced in the same manner as in Example 1. Using a coating machine, apply on a film-like support (38 μm thick polyethylene terephthalate) under the following conditions, and dry the coating to form a first resin layer (100 μm thick) on the support. did.
Coating head method: Comma coating and drying speed: 2 m / min Drying conditions (temperature / furnace length): 90 ° C./3.3 m, 110 ° C./3.3 m, 120 ° C./3.3 m

A varnish-like resin composition was prepared in the same manner as in Example 1. Coating is performed on a film-like support (38 μm thick polyethylene terephthalate) using a coating machine under the following conditions, and the support and the coating are passed through a drying furnace at a predetermined drying speed. Was dried to form a second resin layer (thickness: 100 μm) on the support.

Coating head method: Comma coating and drying speed: 2.5 m / min Drying conditions (temperature / furnace length): 90 ° C./3.3 m, 110 ° C./3.3 m, 120 ° C./3.3 m

(Example 5)
A varnish-like resin composition was produced in the same manner as in Example 1. Coating is performed on a film-like support (38 μm thick polyethylene terephthalate) using a coating machine under the following conditions, and the support and the coating are passed through a drying furnace at a predetermined drying speed. Was dried to form a first resin layer (thickness: 100 μm) on the support.
Coating head method: Comma coating and drying speed: 2 m / min Drying conditions (temperature / furnace length): 90 ° C./3.3 m, 110 ° C./3.3 m, 120 ° C./3.3 m

497.5 g of the organic solvent E1 was put in a 10 L plastic container, 3500 g of the inorganic filler C1 was added thereto, and the inorganic filler C1 was dispersed in the organic solvent with a stirring blade. To this dispersion, 296 g of thermosetting resin A1 and 464 g of curing agent B2 were added, and the dispersion was stirred. After visually confirming that the thermosetting resin A1 and the curing agent B2 were dissolved, 2.5 g of the curing catalyst D1 was added, and the dispersion was further stirred for 1 hour. The dispersion was filtered through nylon # 200 mesh (opening 75 μm) to obtain a filtrate as a varnish-like resin composition.

The obtained varnish-like resin composition was applied to a film-like support (polyethylene terephthalate having a thickness of 38 μm) under the following conditions using a coating machine, and the support and the coating film were applied in a drying furnace. The coating film was dried by passing at a predetermined drying speed, and a second resin layer (thickness: 100 μm) was formed on the support.
Coating head method: Comma coating and drying speed: 3 m / min Drying conditions (temperature / furnace length): 90 ° C / 3.3m, 110 ° C / 3.3m, 120 ° C / 3.3m

(Example 6)
497.5 g of the organic solvent E1 was put in a 10 L plastic container, 3350 g of the inorganic filler C1 was added thereto, and the inorganic filler C1 was dispersed in the organic solvent with a stirring blade. To this dispersion, 360 g of thermosetting resin A1 and 550 g of curing agent B1 were added, and the dispersion was stirred. After visually confirming that the thermosetting resin A1 and the curing agent B1 were dissolved, 3.0 g of the curing catalyst D1 was added, and the dispersion was further stirred for 1 hour. The dispersion was filtered through nylon # 200 mesh (opening 75 μm) to obtain a filtrate as a varnish-like resin composition.

The obtained varnish-like resin composition was applied to a film-like support (polyethylene terephthalate having a thickness of 38 μm) under the following conditions using a coating machine, and the support and the coating film were applied in a drying furnace. The coating film was dried by passing at a predetermined drying speed, and a first resin layer (thickness 100 μm) was formed on the support.
Coating head method: Comma coating and drying speed: 3 m / min Drying conditions (temperature / furnace length): 90 ° C / 3.3m, 110 ° C / 3.3m, 120 ° C / 3.3m

497.5 g of the organic solvent E1 was put in a 10 L plastic container, 3200 g of the inorganic filler C1 was added thereto, and the inorganic filler C1 was dispersed in the organic solvent with a stirring blade. To this dispersion, 419 g of thermosetting resin A1 and 641 g of curing agent B1 were added, and the dispersion was stirred. After visually confirming that the thermosetting resin A1 and the curing agent B1 were dissolved, 3.5 g of the curing catalyst D1 was added, and the dispersion was further stirred for 1 hour. The dispersion was filtered through nylon # 200 mesh (opening 75 μm) to obtain a filtrate as a varnish-like resin composition.

(Comparative Example 1)
The same varnish-like resin composition as in Example 1 was coated on a film-like support (polyethylene terephthalate having a thickness of 38 μm) using a coating machine under the following conditions, and the support and the coating film were dried in a drying furnace. The coating film was dried by passing the inside at a predetermined drying speed, and a first resin layer and a second resin layer (thickness 100 μm) were formed on the support.
(First resin layer)
Coating head method: Comma coating and drying speed: 3 m / min Drying conditions (temperature / furnace length): 90 ° C / 3.3m, 110 ° C / 3.3m, 120 ° C / 3.3m
(Second resin layer)
Coating head method: Comma coating and drying speed: 2 m / min Drying conditions (temperature / furnace length): 110 ° C./3.3 m, 130 ° C./3.3 m, 140 ° C./3.3 m

(Comparative Example 2)
The same varnish-like resin composition as in Example 1 was coated on a film-like support (polyethylene terephthalate having a thickness of 38 μm) using a coating machine under the following conditions, and the support and the coating film were dried in a drying furnace. The coating film was dried by passing through the inside at a predetermined drying speed to form a first resin layer (thickness: 100 μm) on the support.
Coating head method: Comma coating and drying speed: 2 m / min Drying conditions (temperature / furnace length): 90 ° C./3.3 m, 110 ° C./3.3 m, 120 ° C./3.3 m

A varnish-like resin composition was produced in the same manner as in Example 1 except that the amount of the curing catalyst D1 was changed from 2.5 g to 7.5 g. The obtained varnish-like resin composition was applied to a film-like support (polyethylene terephthalate having a thickness of 38 μm) under the following conditions using a coating machine, and the support and the coating film were applied in a drying furnace. The coating film was dried by passing at a predetermined drying speed, and a second resin layer (thickness: 100 μm) was formed on the support.
Coating head method: Comma coating and drying speed: 2 m / min Drying conditions (temperature / furnace length): 110 ° C./3.3 m, 130 ° C./3.3 m, 140 ° C./3.3 m

(Comparative Example 3)
The same varnish-like resin composition as in Example 1 was coated on a film-like support (polyethylene terephthalate having a thickness of 38 μm) using a coating machine under the following conditions, and the support and the coating film were dried in a drying furnace. The coating film was dried by passing through the inside at a predetermined drying speed to form a first resin layer (thickness: 100 μm) on the support.
Coating head method: Comma coating and drying speed: 2 m / min Drying conditions (temperature / furnace length): 90 ° C./3.3 m, 110 ° C./3.3 m, 120 ° C./3.3 m

The same varnish-like resin composition as in Example 1 was coated on a film-like support (polyethylene terephthalate having a thickness of 38 μm) using a coating machine under the following conditions, and the support and the coating film were dried in a drying furnace. The coating film was dried by passing through the inside at a predetermined drying speed to form a second resin layer (thickness: 100 μm) on the support.
Coating head method: Comma coating and drying speed: 1.5 m / min Drying conditions (temperature / furnace length): 90 ° C./3.3 m, 110 ° C./3.3 m, 120 ° C./3.3 m

(Comparative Example 4)
The same varnish-like resin composition as in Example 1 was coated on a film-like support (polyethylene terephthalate having a thickness of 38 μm) using a coating machine under the following conditions, and the support and the coating film were dried in a drying furnace. The coating film was dried by passing the inside at a predetermined drying speed, and a resin layer (thickness: 100 μm) was formed on the support.
Coating head method: Comma coating and drying speed: 2 m / min Drying conditions (temperature / furnace length): 90 ° C./3.3 m, 110 ° C./3.3 m, 120 ° C./3.3 m

The two resin layers obtained were bonded together by vacuum lamination to obtain a sealing film having a single-layer sealing resin layer with a thickness of 200 μm.

(Comparative Example 5)
497.5 g of the organic solvent E1 was put in a 10 L plastic container, 3500 g of the inorganic filler C1 was added thereto, and the inorganic filler C1 was dispersed in the organic solvent with a stirring blade. To this dispersion, 296 g of thermosetting resin A1 and 464 g of curing agent B2 were added, and the dispersion was stirred. After visually confirming that the thermosetting resin A1 and the curing agent B2 were dissolved, 2.5 g of the curing catalyst D1 was added, and the dispersion was further stirred for 1 hour. The dispersion was filtered through nylon # 200 mesh (opening 75 μm) to obtain a filtrate as a varnish-like resin composition.

The obtained varnish-like resin composition was applied on a film-like support (38 μm thick polyethylene terephthalate) under the following conditions using a coating machine, the coating film was dried, and a resin layer (thickness) 100 μm) was formed on the support.
Coating head method: Comma coating and drying speed: 3 m / min Drying conditions (temperature / furnace length): 90 ° C / 3.3m, 110 ° C / 3.3m, 120 ° C / 3.3m

Table 1 summarizes the blending amount, thickness, drying speed, drying conditions, and curing shrinkage ratio of the resin composition in each example.

Evaluation test (curing shrinkage)
The sealing film support produced in each of the above Examples and Comparative Examples was peeled off to obtain an evaluation sample for measuring the curing shrinkage rate. Curing shrinkage (%) was measured under the following conditions using a PVT tester (manufactured by Toyo Seiki Seisakusho Co., Ltd.). The results are shown in Tables 1 and 2.
Evaluation sample mass: 8 g
Heating condition: Temperature raised from 40 ° C to 140 ° C, held at 140 ° C for 2 hours, then cooled to room temperature (23 ° C): 3 MPa
Cylinder diameter: 11.284 mm (area: 1.0 cm ² )

(Warpage and chip embedding)
A SUS plate having a diameter of 220 mm and a thickness of 1.5 mm was prepared as a support. A temporary fixing film was attached to one side of the SUS plate using a laminator. The temporarily fixing film protruding from the SUS plate was cut off with a cutter knife.

Subsequently, a silicon chip having a size of 7.3 mm × 7.3 mm and a thickness of 150 μm was arranged on the temporary fixing film in a lattice shape to obtain an evaluation substrate. The number of mounted silicon chips was 193, and the distance (pitch) between the silicon chips was 9.6 mm in both the vertical and horizontal directions. A die sorter (CAP3500 manufactured by Canon Machinery Co., Ltd.) was used for the arrangement of the silicon chips. The load at the time of arrangement was 1 kgf per silicon chip.

The sealing resin layers of the respective sealing films prepared in the examples and comparative examples are superimposed on the prepared evaluation substrate so that the second resin layer faces the silicon chip, and a vacuum laminator is used in that state. By pressing the sealing resin layer and the silicon chip while heating, the silicon chip was embedded in the sealing resin layer and the sealing resin layer was thermally cured to form a sealing portion for sealing the silicon chip. Remove the temporary fixing film from the obtained sealing molded product, and use the ruler to determine the direction of warping of the sealing molded product and the amount of warping from the bottom surface to the most warped portion with the silicon chip side facing down. It was measured. The “convex” in the direction of warping means that warping has occurred in a direction that is convex toward the sealing portion.

The surface on the silicon chip side of the sealing molded product peeled off from the temporarily fixing film was visually confirmed, and the chip embedding property was determined based on whether or not the resin was filled between the silicon chips. The case where there was no unfilled part was determined as “good”. In Comparative Example 1, warpage was not evaluated because there was a problem in embedding.

Table 2 and Table 3 show the evaluation results. According to the sealing film of the example in which the cure shrinkage rate of the second resin layer is larger than the cure shrinkage rate of the first resin layer, the silicon chip can be sealed with good embeddability, and Warpage was sufficiently suppressed.

DESCRIPTION OF SYMBOLS 1 ... 1st resin layer, 1a ... Hardened | cured material of 1st resin layer, 2 ... 2nd resin layer, 2a ... Hardened | cured material of 2nd resin layer, 3 ... Resin sealing material, 3a ... Resin sealing Hardened material, 10 ... sealing film (sealing resin layer), 10a ... hardened material of sealing resin layer, 20 ... semiconductor chip, 30 ... substrate, 40 ... temporary fixing material, 50 ... insulating layer, 52 ... pattern Insulated insulating layer, 54 ... wiring, 56 ... ball, 60 ... dicing cutter, 100 ... sealed molded product, 200 ... semiconductor device.

Claims

A sealing film for sealing an electronic component,
Sealing having a first resin layer containing a first thermosetting resin and a first inorganic filler, and a second resin layer containing a second thermosetting resin and a second inorganic filler With a resin layer,
The second resin layer has a sealing surface directed toward the electronic component when the electronic component is sealed, and the second resin layer and the first resin layer are on the sealing surface side. Are stacked in this order,
The sealing film whose cure shrinkage rate of a said 2nd resin layer is larger than the cure shrinkage rate of a said 1st resin layer.
The sealing film according to claim 1, wherein a ratio of a curing shrinkage rate of the second resin layer to a cure shrinkage rate of the first resin layer is more than 1 and less than 10.
The sealing film according to claim 1 or 2, wherein the first thermosetting resin and the second thermosetting resin are the same or different epoxy resins.
The sealing resin layer of the sealing film according to any one of claims 1 to 3 and an electronic component disposed to face the sealing surface are pressed under heating, whereby the sealing resin layer Embedding electronic components,
Curing the sealing resin layer to form a sealing portion that is a cured product of the sealing resin layer and seals the electronic component;
A method for manufacturing an electronic component device.
The method according to claim 4, wherein the electronic component includes a semiconductor chip.
An electronic component, and a sealing portion that seals the electronic component,
The sealing portion is a cured product of the sealing resin layer of the sealing film according to any one of claims 1 to 3.
Electronic component device.
The electronic component device according to claim 6, wherein the electronic component includes a semiconductor chip.
The electronic component device according to claim 6, wherein the electronic component is surrounded by a cured product of the second resin layer in the sealing portion.