WO2018180280A1 - 入力装置、要素データ構成方法及びプログラム - Google Patents

入力装置、要素データ構成方法及びプログラム Download PDF

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Publication number
WO2018180280A1
WO2018180280A1 PCT/JP2018/008555 JP2018008555W WO2018180280A1 WO 2018180280 A1 WO2018180280 A1 WO 2018180280A1 JP 2018008555 W JP2018008555 W JP 2018008555W WO 2018180280 A1 WO2018180280 A1 WO 2018180280A1
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data
element data
value
detection
assumed
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PCT/JP2018/008555
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English (en)
French (fr)
Japanese (ja)
Inventor
伸一 寒川井
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アルプス電気株式会社
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Application filed by アルプス電気株式会社 filed Critical アルプス電気株式会社
Priority to JP2019509107A priority Critical patent/JP6713579B2/ja
Priority to CN201880021357.4A priority patent/CN110494830B/zh
Priority to EP18777677.8A priority patent/EP3605290B1/de
Publication of WO2018180280A1 publication Critical patent/WO2018180280A1/ja
Priority to US16/583,380 priority patent/US10908737B2/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04166—Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/0418—Control or interface arrangements specially adapted for digitisers for error correction or compensation, e.g. based on parallax, calibration or alignment
    • G06F3/04186—Touch location disambiguation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04101—2.5D-digitiser, i.e. digitiser detecting the X/Y position of the input means, finger or stylus, also when it does not touch, but is proximate to the digitiser's interaction surface and also measures the distance of the input means within a short range in the Z direction, possibly with a separate measurement setup

Definitions

  • the present invention relates to an input device used for inputting information in an information device such as a computer or a smartphone, and in particular, specifies an area where an object such as a finger or a pen is close to an operation surface, and information based on the specified area. It is related with the input device which inputs.
  • an image sensing method capable of simultaneously detecting a plurality of contact positions is common.
  • a method for detecting a change in capacitance there are a mutual capacitance method for detecting a change in capacitance between two electrodes and a self-capacitance method for detecting a capacitance between an electrode and a ground.
  • a self-capacitance type sensor having a high capacitance detection sensitivity is advantageous.
  • the data configuration process is repeatedly executed in order to configure m (m> n) element data from n detection data.
  • temporary detection data is calculated from temporary element data, and the temporary element data is corrected based on a comparison between the temporary detection data and the actual detection data.
  • the accuracy of the component data to be configured improves.
  • the present invention has been made in view of such circumstances, and an object of the present invention is to easily calculate element data indicating the degree of proximity of an object in a plurality of sections on the operation surface from detection data smaller than the number of sections. And an element data configuration method and program thereof.
  • a first aspect of the present invention relates to an input device that inputs information according to the proximity of an object to an operation surface.
  • the input device detects the degree of proximity of the object in one or more detection regions on the operation surface, generates one or more detection data corresponding to the detection result for each detection region, and N as a whole M elements indicating the degree of proximity of the object in each of the sensor section that generates the detection data and M sections (M represents a natural number greater than N) that virtually section the operation surface
  • An element data configuration unit configured to configure data based on the N pieces of detection data.
  • Each of the M sections has an overlapping portion with one or more of the detection regions.
  • Each of the M element data is a sum of partial element data distributed to each of the N detection data at a predetermined ratio
  • each of the N detection data is the M element data.
  • the element data configuration unit calculates an assumed value of the N detection data as a sum of the partial element data distributed at the predetermined ratio from each of the assumed values of the M element data, Based on the N predetermined ratios set in each of the M element data, the calculated M elements so that the calculated assumed value of the N detection data approaches the N detection data.
  • the data construction process for correcting the assumed data value is repeated at least twice.
  • the element data configuration unit determines that the difference between the two assumed values in each element data is based on the two assumed values obtained by the data configuration process twice for each of the M element data. A coefficient whose absolute value decreases as the value increases is calculated. Then, the element data configuration unit calculates the difference between the first assumed value of the element data obtained by the previous data configuration process and the second assumed value of the element data obtained by the subsequent data configuration process. The sum of the value obtained by multiplying the coefficient and the first hypothesized value is calculated for each of the M sections as an estimated value of the element data obtained by repeating the data configuration process.
  • each of the M sections that virtually divide the operation surface has an overlapping portion with one or more of the detection areas, and the sense unit has 1 for each detection area.
  • the above detection data is generated. Therefore, one or more detection data indicating the degree of proximity of the object is generated for each of the M sections.
  • Each of the M element data is a sum of partial element data distributed at a predetermined ratio to each of the N detection data, and each of the N detection data is the M pieces of detection data. It approximates the sum of the partial element data distributed from the element data at the predetermined ratio. That is, the conversion from the M element data to the N detection data is defined by the N predetermined ratios set for each of the M element data.
  • hypothetical values of the N detection data are calculated as sums of the partial element data distributed at the predetermined ratio from the hypothetical values of the M element data. Further, based on the N predetermined ratios set for each of the M element data so that the calculated assumed value of the N detection data approaches the N detection data, the The assumed value of the M element data is corrected. By repeating this data configuration process many times, it is possible to obtain a convergence value of the element data that matches the N detection data.
  • the data configuration process is repeated at least twice, and the first assumed value of the element data obtained by the previous data configuration process and the data configuration process obtained later
  • the sum of the value obtained by multiplying the difference from the second hypothesized value of the element data by the coefficient and the first hypothesized value is the M pieces of estimated values of the element data obtained by repeating the data configuration process. For each of the sections. Therefore, the calculation is simplified as compared with the case where the convergence value of the element data is obtained by repeating the data configuration process many times.
  • the estimated value of the element data obtained as a sum of a value obtained by multiplying the difference between the first hypothesized value and the second hypothesized value by the coefficient and the first hypothesized value is obtained by performing the data composition process.
  • a certain amount of error is generated with respect to the convergence value of the element data obtained by being repeated many times.
  • the coefficient that minimizes this error tends to have a smaller absolute value as the difference between the two assumed values in each element data increases. Therefore, based on the two assumed values obtained by the data construction process twice for each of the M element data, the absolute value decreases as the difference between the two assumed values in each element data increases.
  • the error is reduced as compared with the case where the coefficient is set to a fixed value.
  • the element data configuration unit calculates an evaluation value according to a difference between the two assumed values in each of the M element data, and sets a value of a predetermined function using the evaluation value as a variable. It may be acquired as a coefficient. As a result, the appropriate coefficient corresponding to the difference between the two assumed values in each of the M element data is acquired.
  • the evaluation value may increase as the degree of difference between the two hypothetical values in each of the M element data increases.
  • the predetermined function may be such that the absolute value of the differential coefficient in the range where the evaluation value is smaller than the threshold is larger than the absolute value of the differential coefficient in the range where the evaluation value is larger than the threshold.
  • the difference between the two assumed values in each of the M element data tends to be smaller. Further, when the distance between the plurality of objects is short, the boundary between the plurality of objects tends to become clear by increasing the coefficient. Therefore, by increasing the absolute value of the differential coefficient in the range where the evaluation value is smaller than the threshold than the absolute value of the differential coefficient in the range where the evaluation value is larger than the threshold, The coefficient is likely to increase when the distance between the objects approaches and the evaluation value decreases, and the boundaries between the plurality of objects are likely to become clear.
  • the degree of difference may be an absolute value of a difference between the two assumed values.
  • the element data configuration unit may calculate the evaluation value according to the sum of the M degrees of difference corresponding to the M element data.
  • the predetermined function may be a linear function having a negative slope.
  • the evaluation value may increase as the difference between the two assumed values in each of the M element data increases.
  • the predetermined function may be such that the absolute value of the slope in the range where the evaluation value is smaller than the threshold value is larger than the absolute value of the slope in the range where the evaluation value is larger than the threshold value.
  • the difference between the two assumed values in each of the M element data tends to be smaller. Further, when the distance between the plurality of objects is short, the boundary between the plurality of objects tends to become clear by increasing the coefficient. Accordingly, by increasing the absolute value of the inclination in the range where the evaluation value is smaller than the threshold than the absolute value of the inclination in the range where the evaluation value is larger than the threshold, the distance between the plurality of objects When the evaluation value decreases as the value approaches, the coefficient is likely to increase, and the boundaries between the plurality of objects are likely to become clear.
  • the evaluation value may change according to a relative positional relationship between a plurality of objects close to the operation surface.
  • the two hypothetical values may be the first hypothetical value and the second hypothetical value.
  • the calculation is simplified as compared with the case where the two hypothetical values are different from the first hypothetical value and the second hypothetical value.
  • the first assumption value may be an assumption value of the element data obtained by the first data composition process
  • the second assumption value may be the element obtained by the second data composition process. Assumed value of data. As a result, the number of repetitions of the data configuration process is two, which simplifies the calculation.
  • the data configuration process is configured to convert the assumed value of the M element data into an assumption of the N detection data based on the N predetermined ratios set for each of the M element data.
  • the M element data should be multiplied by the N first coefficients based on a second process for calculating a coefficient and the N predetermined ratios set for each of the M element data.
  • a third process for converting to M second coefficients indicating a magnification and a fourth process for correcting an assumed value of the M element data based on the M second coefficients may be included.
  • the element data configuration unit uses the predetermined ratio regarding one piece of partial element data distributed from one piece of element data to one piece of detection data as one component in the first process, and the M Based on a first transformation matrix composed of M ⁇ N components corresponding to the N element data and the N detection data, a matrix including the assumed values of the M element data as components You may convert into the matrix which uses the assumed value of detection data as a component.
  • the element data configuration unit uses the predetermined ratio regarding one piece of partial element data distributed from one piece of element data to one piece of detection data as one component in the third process, and M Based on a second transformation matrix composed of M ⁇ N components corresponding to the element data and the N detection data, a matrix having the N first coefficients as components is converted into the M second coefficients. You may convert into the matrix which uses a coefficient as a component.
  • the element data configuration unit omits the first processing in the first data configuration processing, and uses the predetermined N initial values as the assumed values of the N detection data. May be done. By omitting the first process, the processing speed is improved.
  • the element data configuration unit sets M initial values based on at least one set of M element data configured immediately before as an assumed value of the M element data.
  • the first treatment may be performed using the first treatment.
  • the sensor unit outputs detection data corresponding to a first capacitance between N electrodes formed in different detection regions and an object close to the operation surface and the electrodes. And a capacitance detection unit generated for each of the electrodes.
  • One piece of subelement data approximates a second capacitance between an overlap of one of the electrodes in one section and the object, and one piece of element data represents all the data in one section.
  • one said predetermined ratio may have a value according to the area ratio of the overlapping part of one said electrode in one said division, and the overlapping part of all the said electrodes in the said one division.
  • the said element data according to the electrostatic capacitance between the overlapping part of one or more said electrodes and said object are comprised in each of said M division in the said operation surface.
  • the sensor unit includes a plurality of electrodes formed in different detection regions, each having a plurality of terminals, and having N terminals as a whole, an object close to the operation surface, and the electrodes. Charges accumulated in between are input from the N terminals, and based on the input charges, the detection data corresponding to the capacitance between the object and the electrodes is input to the N terminals. And a capacitance detection unit generated for each.
  • the capacitance detection unit may simultaneously input the electric charges accumulated in one of the electrodes from a plurality of the terminals provided in the one electrode.
  • the partial charges accumulated between the overlapping portion of the one electrode and the object in one of the sections are changed according to the conductance from the overlapping portion to each of the plurality of terminals. May be distributed as distributed charges to each of the terminals.
  • One partial element data may approximate the distributed charge distributed to one terminal by the simultaneous input.
  • One piece of the element data may approximate a combined charge obtained by combining all the partial charges accumulated in the overlapping portions of all the electrodes in one section.
  • one predetermined ratio is an area ratio between an overlapping portion of the one electrode in one section and an overlapping portion of all the electrodes in the one section, and 1 in the one electrode.
  • the said element data according to the electrostatic capacitance between the overlapping part of one or more said electrodes and said object are comprised in each of said M division in the said operation surface.
  • the plurality of terminals are provided on one electrode, and one detection data is generated for each terminal, the number of the electrodes is smaller than the number of the detection data, Configuration is simplified.
  • an input device including a sensor unit that detects the degree of proximity of an object in a plurality of different detection areas on the operation surface and generates N detection data according to the detection result.
  • M element data indicating the degree of proximity of the object in each of M sections (M represents a natural number greater than N) that virtually divides the operation surface is based on the N detection data. It is related with the element data structure method comprised.
  • Each of the M sections has an overlapping portion with one or more of the detection areas.
  • Each of the M element data is a sum of partial element data distributed to each of the N detection data at a predetermined ratio, and each of the N detection data is the M element data.
  • the element data construction method calculates an assumed value of the N detection data as a sum of the partial element data distributed at the predetermined ratio from each of the assumed values of the M element data, Based on the N predetermined ratios set in each of the M element data, the calculated M elements so that the calculated assumed value of the N detection data approaches the N detection data.
  • Each element data is based on two assumption values obtained by repeating the data composition process for correcting the assumed value of the data at least twice and each of the M element data is obtained by performing the data composition process twice.
  • the element data obtained by repeating the data composition process is the sum of the value obtained by multiplying the difference from the second assumption value of the element data obtained by the data composition process by the coefficient and the first assumption value. For each of the M sections.
  • a third aspect of the present invention is a program for causing a computer to execute the element data configuration method according to the second aspect.
  • element data indicating the degree of proximity of an object in a plurality of sections on the operation surface can be configured by simple calculation from a smaller number of detection data than the number of sections.
  • FIG. 1 is a diagram illustrating an example of the configuration of the input device according to the first embodiment.
  • 2A to 2B are diagrams illustrating a plurality of sections that virtually divide the operation surface.
  • FIG. 2A shows a plurality of sections
  • FIG. 2B shows the overlap between the sections and the detection area.
  • FIG. 3 is a diagram illustrating the relationship between N detection data and M partial element data.
  • FIG. 4 is a diagram for explaining conversion from M element data to N detection data.
  • FIG. 5 is a diagram for explaining conversion from an assumed value of M element data to an assumed value of N detected data.
  • FIG. 6 is a diagram for explaining conversion from N first coefficients to M second coefficients.
  • FIG. 7 is a flowchart for explaining an example of a method of configuring M element data from N detection data in the input device according to the first embodiment.
  • FIG. 8 is a flowchart for explaining an example of the data configuration process.
  • 9A to 9B are diagrams showing an example of the simulation result of the element data configuration process when the distance between two objects is relatively short, and shows the simulation result when the data configuration process is repeated many times.
  • FIG. 9A shows a two-dimensional distribution of the proximity degree of an object virtually set as a simulation condition.
  • FIG. 9B shows a two-dimensional distribution of element data converged by repeating the data configuration process 1000 times.
  • FIGS. 10A to 10B are diagrams showing an example of the simulation result of the element data configuration process in the input device according to the first embodiment, and show the simulation result under the same conditions as in FIG. 9A.
  • FIG. 10A shows a correlation between a value obtained by subtracting the first hypothetical value from the second hypothetical value and a value obtained by subtracting the first hypothetical value from the convergence value.
  • FIG. 10B shows a two-dimensional distribution of element data estimated using coefficients calculated from the results of two data configuration processes.
  • FIG. 11A to FIG. 11B are diagrams showing an example of the simulation result of the element data configuration process when the distance between two objects is medium, and shows the simulation result when the data configuration process is repeated many times.
  • FIG. 11A shows a two-dimensional distribution of the proximity degree of an object virtually set as a simulation condition.
  • FIG. 11B shows a two-dimensional distribution of element data converged by repeating the data configuration process 1000 times.
  • 12A to 12B are diagrams showing an example of the simulation result of the element data configuration process in the input device according to the first embodiment, and show the simulation result under the same conditions as in FIG. 11A.
  • FIG. 12A shows a correlation between a value obtained by subtracting the first hypothetical value from the second hypothetical value and a value obtained by subtracting the first hypothetical value from the convergence value.
  • FIG. 12B shows a two-dimensional distribution of element data estimated using coefficients calculated from the results of two data configuration processes.
  • FIG. 13B are diagrams showing an example of the simulation result of the element data configuration process when the distance between two objects is relatively long, and shows the simulation result when the data configuration process is repeated many times.
  • FIG. 13A shows a two-dimensional distribution of the proximity degree of an object virtually set as a simulation condition.
  • FIG. 13B shows a two-dimensional distribution of element data converged by repeating the data configuration process 1000 times.
  • 14A to 14B are diagrams showing an example of the simulation result of the element data configuration process in the input device according to the first embodiment, and show the simulation result under the same conditions as in FIG. 13A.
  • FIG. 14A shows a correlation between a value obtained by subtracting the first hypothetical value from the second hypothetical value and a value obtained by subtracting the first hypothetical value from the convergence value.
  • FIG. 14A shows a correlation between a value obtained by subtracting the first hypothetical value from the second hypothetical value and a value obtained by subtracting the first hypothetical value from the convergence value.
  • FIG. 14B shows a two-dimensional distribution of element data estimated using coefficients calculated from the results of two data configuration processes.
  • FIG. 15 is a diagram showing a correlation between the evaluation value D and the coefficient ⁇ related to the difference between the two assumed values obtained by the two data configuration processes.
  • 16A to 16B are diagrams showing simulation results when the element data configuration process is performed using a coefficient ⁇ ′ larger than the coefficient ⁇ ′ calculated based on the evaluation value D, under the same conditions as FIG. 13A. The simulation result is shown.
  • FIG. 16A shows a correlation between a value obtained by subtracting the first hypothetical value from the second hypothetical value and a value obtained by subtracting the first hypothetical value from the convergence value.
  • FIG. 16B shows a two-dimensional distribution of element data estimated using the coefficient ⁇ ′.
  • FIG. 17 is a flowchart for explaining an example of a method of constructing M element data from N detection data in the input device according to the second embodiment.
  • FIG. 18 is a diagram showing the correlation between the evaluation value D and the coefficient ⁇ related to the degree of difference between the two assumed values obtained by the two data configuration processes, using two types of linear functions with different slopes. It shows that the conversion from the evaluation value D to the coefficient ⁇ is defined.
  • 19A to 19B are diagrams showing an example of the simulation result of the element data configuration process in the input device according to the second embodiment, and show the simulation result under the same conditions as in FIG. 9A.
  • FIG. 19A shows a correlation between a value obtained by subtracting the first hypothetical value from the second hypothetical value and a value obtained by subtracting the first hypothetical value from the convergence value.
  • FIG. 19B shows a two-dimensional distribution of element data estimated using coefficients calculated from the results of two data configuration processes.
  • FIG. 20 is a diagram illustrating an example of the configuration of the input device according to the third embodiment.
  • FIG. 21 is a diagram for explaining the second capacitance between the overlapping portion of one electrode and an object in one section.
  • 22A to 22B are diagrams illustrating an example of electrode patterns in the input device according to the third embodiment.
  • FIG. 22A shows a plurality of sections on the operation surface, and FIG. 22B shows a pattern of electrodes overlapping each section.
  • 23A to 23B are diagrams showing details of the electrode pattern shown in FIG. 22B.
  • FIG. 23A shows an electrode pattern formed in the upper layer
  • FIG. 23B shows an electrode pattern formed in the lower layer.
  • FIG. 24 is a diagram illustrating an example of the configuration of the input device according to the fourth embodiment.
  • FIG. 25 is a diagram illustrating a state where electric charges are accumulated between an overlapping portion of one electrode and an object in one section.
  • FIG. 26 is a diagram illustrating a state in which charges accumulated in one electrode in one section are distributed to two terminals.
  • 27A to 27B are diagrams showing an example of electrode patterns in the input device according to the fourth embodiment.
  • FIG. 27A shows a plurality of sections on the operation surface, and FIG. 27B shows a pattern of electrodes overlapping each section.
  • 28A to 28B are diagrams showing details of the electrode pattern shown in FIG. 27B.
  • FIG. 28A shows an electrode pattern formed in the upper layer
  • FIG. 28B shows an electrode pattern formed in the lower layer.
  • FIG. 29 is a flowchart for explaining a modification of the process of configuring M element data from N detection data.
  • FIG. 30 is a flowchart for explaining another modification of the process
  • FIG. 1 is a diagram showing an example of the configuration of an input device according to the first embodiment of the present invention.
  • the input device illustrated in FIG. 1 includes a sensor unit 10, a processing unit 20, a storage unit 30, and an interface unit 40.
  • the input device according to the present embodiment is a device that inputs information according to the proximity position by bringing an object such as a finger or a pen close to an operation surface provided with a sensor.
  • proximity in this specification means being near, and does not limit the presence or absence of contact.
  • the sensor unit 10 detects the degree of proximity of an object (such as a finger or a pen) in one or more detection regions R on the operation surface 11, and generates N detection data S 1 to S N as a whole.
  • the sensor unit 10 generates one or more detection data S i for each detection region R.
  • “I” represents an integer from 1 to N.
  • each of the N detection data S 1 to S N may be referred to as “detection data S” without distinction.
  • the sensor unit 10 detects an electrostatic capacitance between the disposed electrodes and the object in the detection area R, and generates the detection result as detection data S i.
  • the sensor unit 10 may detect the degree of proximity of the object to the detection region R based on a physical quantity other than capacitance (for example, resistance change according to contact pressure).
  • the operation surface 11 of the sensor unit 10 is virtually divided by a plurality of sections A as shown in FIG. 2A.
  • a plurality of sections A are partitioned in a lattice shape.
  • Each of the plurality of sections A has an overlapping portion with one or more detection regions R.
  • one section A has an overlapping portion with four detection regions R. Therefore, the sensor unit 10 generates one or more detection data S indicating the degree of proximity of the object for each of the plurality of sections A.
  • the number of sections A is assumed to be M (N> N), which is greater than N. Further, each of the sections A may be distinguished and described as “section A j ”. “J” represents an integer from 1 to M.
  • the input device uses M element data P 1 to P indicating the degree of proximity of an object in each of the M sections A 1 to A M based on the N detection data S 1 to S N. M is configured.
  • M element data P 1 to P M may be referred to as “element data P” without distinction.
  • each of the M element data P 1 to P M is represented by the sum of the partial element data U distributed at a predetermined ratio to each of the N detection data S 1 to S N.
  • the element data P j is expressed by the following expression.
  • Each of the N detection data S 1 to S N approximates the sum of the partial element data U ij distributed from the M element data P 1 to P M at a predetermined ratio.
  • the detection data S i is expressed by the following equation.
  • FIG. 3 is a diagram illustrating the relationship between the N pieces of detection data S 1 to S N and the M pieces of element data P 1 to P M, and the relationship between the expressions (1) and (2) is illustrated. Is.
  • the detection data S i approximates a value obtained by adding the subelement data U i1 to U iM distributed from the N detection data S 1 to S N , respectively. Therefore, if the partial element data U i1 to U iM can be calculated from the element data P 1 to P M , the detection data S i can also be calculated from the equation (2).
  • detection data S i is expressed by the following equation.
  • FIG. 4 is a diagram for explaining conversion from M element data P 1 to P M to N detection data S 1 to S N.
  • the conversion from the element data P 1 to P M represented by the equation (4) to the detection data S 1 to S N is defined by N ⁇ M constant data K ij .
  • this conversion is expressed as follows using a matrix.
  • the N ⁇ M matrix (first transformation matrix K) on the left side of Equation (5) is the way in which each detection region R of the sensor unit 10 overlaps each section A, and the overlapping portion of each detection region R in each section A. This is known data that is determined by the configuration of the sensor unit 10, such as the detection sensitivity.
  • the processing unit 20 is a circuit that controls the overall operation of the input device, and includes, for example, a computer that performs processing according to the instruction code of the program 31 stored in the storage unit 30, and a logic circuit that implements a specific function. Consists of. All of the processing of the processing unit 20 may be realized based on a program in a computer, or part or all of the processing may be realized by a dedicated logic circuit.
  • the processing unit 20 includes a control unit 21, an element data configuration unit 22, and a coordinate calculation unit 23.
  • the control unit 21 controls the detection timing in the sensor unit 10. For example, the control unit 21 selects a detection region R for performing detection, samples an analog signal obtained as a detection result, generates detection data S by A / D conversion, and the like at an appropriate timing. Each circuit inside the sensor unit 10 is controlled.
  • the element data configuration unit 22 performs a process of configuring M element data P 1 to P M corresponding to M sections A based on the N detection data generated in the sensor unit 10.
  • the element data configuration unit 22 can converge the M element data P 1 to P M to a constant value by repeating the data configuration process described below many times, but simplifies the calculation process. Therefore, the data configuration process is executed twice. Then, the element data construction unit 22, the assumed value PA 1 ⁇ PA M of the M component data respectively obtained by the data configuration process of the twice the original, by relatively simple arithmetic processing, the M Element data P 1 to P M (determined values) are obtained.
  • the assumed values PA 1 to PAM of the M element data may be referred to as “assumed values PA” without being distinguished.
  • the element data configuration unit 22 is configured to store the partial element data U ij distributed at a predetermined ratio (constant data K ij ) from each of the assumed values PA 1 to PAM of the M element data in one data configuration process.
  • constant data K ij constant data
  • hypothetical values SA 1 to SAN of N detection data are calculated.
  • the element data constituting unit 22 makes the calculated assumption values SA 1 to SAN of the N detection data approach the N detection data S 1 to SN that are detection results of the sensor unit 10.
  • the assumed values PA 1 to PAM of the M element data are corrected.
  • This data configuration process specifically includes four processes (first process to fourth process).
  • the element data configuration unit 22 converts the assumed values PA 1 to PAM of M element data into N pieces of detection data based on N ⁇ M constant data K ij that is known data. converting the assumed value SA 1 ⁇ SA N. This conversion is expressed by the following expression using the first conversion matrix K from the relationship of Expression (5).
  • FIG. 5 is a diagram for explaining the conversion from the assumed values PA 1 to PAM of M element data to the assumed values SA 1 to SAN of N detection data. Since the first transformation matrix K is known data, when the assumed values PA 1 to PAM of the M element data are given, the assumed values SA 1 to SA N of the N detected data are obtained by Expression (6). Can be calculated.
  • the N-assumptions SA 1 detection data SA N are N detection data S 1 - S N becomes equal assumed value of the N detected data for SA calculating the 1 ⁇ SA first coefficient of N indicating the magnification should multiplying the N alpha 1 ⁇ alpha N.
  • the first coefficient ⁇ i is expressed by the following equation.
  • the calculation of the first coefficients ⁇ 1 to ⁇ N in the second process is expressed as follows using a matrix.
  • the element data construction unit 22 calculates M second coefficients ⁇ 1 to ⁇ M indicating the magnifications to be multiplied with the assumed values PA 1 to PAM of the M element data. That is, the element data configuration unit 22 converts the N first coefficients ⁇ 1 to ⁇ N into M second coefficients ⁇ 1 to ⁇ M based on the N ⁇ M constant data K ij .
  • the partial element data U ij distributed from the element data P j to the detection data S i occupies a ratio corresponding to the constant data K ij with respect to the entire element data P j .
  • the element data construction unit 22 when calculating the second coefficient beta j, rather than simply averaging the N first coefficients alpha 1 ⁇ alpha N, each of the first coefficient alpha 1 ⁇ alpha N Is weighted with the constant data K ij and averaged. That is, the second coefficient ⁇ j is expressed by the following equation.
  • FIG. 6 is a diagram for explaining conversion from N first coefficients ⁇ 1 to ⁇ N to M second coefficients ⁇ 1 to ⁇ M.
  • Expression (9) is expressed as follows using a matrix.
  • the M ⁇ N matrix (second transformation matrix K T ) on the left side in Expression (10) is a transposed matrix of the first transformation matrix K.
  • the element data configuration unit 22 repeats the data configuration process described above at least twice. Then, the element data construction unit 22, preceding a data structure handled by the assumed value of the obtained element data PA j (first assumed value), after the data structure of the component data obtained by processing assumptions PA j ( Based on the second hypothetical value), a definite value of the element data Pj is calculated. That is, the element data configuration unit 22 calculates the sum of the value obtained by multiplying the difference between the first assumption value and the second assumption value by the coefficient ⁇ and the first assumption value as the definite value of the element data P j. .
  • the definite value of the element data P j is expressed by the following equation.
  • “t” represents the order of repetition of the data configuration process.
  • the difference between the convergence value of the element data obtained by repetition of the data configuration process and the first assumption value is the second assumption value and the first assumption value. It tends to be proportional to the difference from the assumed value. Accordingly, the sum of the value obtained by multiplying the difference between the first hypothesized value and the second hypothesized value by the proportional coefficient ⁇ and the first hypothesized value approximates the convergence value of the element data obtained by repeating the data configuration process. .
  • the element data construction unit 22 calculates a definite value of the element data P j for each of the M sections A 1 to A M using Expression (13).
  • each of the M element data P is obtained by two data construction processes.
  • the difference (difference) between the two assumed values PA to be changed changes.
  • the coefficient ⁇ tends to decrease in absolute value as the difference (difference) between the two assumed values PA in each element data P increases. Therefore, the element data configuration unit 22 calculates the coefficient ⁇ so that the absolute value decreases as the difference (difference) between the two assumed values PA in each element data P increases.
  • the element data configuration unit 22 calculates an evaluation value D corresponding to the degree of difference between two assumed values PA in each of the M element data P, and calculates a value of a predetermined function using the evaluation value D as a variable. Obtained as coefficient ⁇ .
  • the difference between the two assumed values PA is, for example, the absolute value of the difference between the two assumed values PA.
  • the element data configuration unit 22 calculates an evaluation value D corresponding to the sum of M dissimilarities (absolute values of differences between the two assumed values PA) corresponding to the M element data P.
  • the evaluation value D and the coefficient ⁇ are calculated by the following formula, for example.
  • the two assumed values PA of the element data P used for calculating the evaluation value D are not necessarily the same as the first assumed value and the second assumed value (Equation 13) used for calculating the fixed value of the element data P. Also good.
  • the assumed value PA j t q obtained by the qth (q is an integer greater than 1) data composition process and the rth (r is an integer greater than q) data.
  • the evaluation value D may be calculated by adding the M dissimilarities corresponding to the M element data P.
  • the degree of difference between the two assumed values is not limited to the absolute value of the difference between the two assumed values.
  • the degree of difference may be defined by the ratio of two hypothetical values PA.
  • the degree of difference may be defined by a ratio in which the larger one of the two assumed values PA is the numerator and the smaller one is the denominator. Even with the degree of difference defined in this way, the value increases as the difference between the two assumed values PA increases.
  • the function of the evaluation value D that approximates the coefficient ⁇ may be a function other than a linear function (such as a function of a polynomial of second or higher order).
  • the function of the evaluation value D that defines the coefficient ⁇ may be determined by, for example, the least square method from the simulation result of the coefficient ⁇ and the evaluation value D or the result of actual measurement.
  • the function that defines the conversion from the evaluation value D to the coefficient ⁇ is not limited to that expressed by a mathematical expression.
  • conversion from the evaluation value D to the coefficient ⁇ may be defined based on a data table indicating a correspondence relationship between the evaluation value D and the coefficient ⁇ . The above is the description of the element data configuration unit 22.
  • the coordinate calculation unit 23 calculates the coordinates on the operation surface 11 where an object (finger, pen, etc.) is close based on the element data P 1 to P M configured by the element data configuration unit 22. For example, the coordinate calculation unit 23 binarizes the two-dimensional data represented by the element data P 1 to P M and sets an area in which data indicating that the objects are close to each other as a proximity area of each object. As specified. Then, the coordinate calculation unit 23 creates profile data for each of the horizontal direction and the vertical direction of the proximity region of the identified object.
  • the profile data in the horizontal direction is obtained by calculating the sum of a group of element data P j in the vertical direction of the operation surface 11 for each column and arranging the sum of the element data P j in the horizontal direction of the operation surface 11. It is.
  • the profile data in the vertical direction is obtained by calculating the sum of a group of element data P j in the horizontal direction of the operation surface 11 for each row and arranging the sum of the element data P j in the order of the vertical direction of the operation surface 11. It is.
  • Coordinate calculation unit 23 for each of the profile data and longitudinal profile data of the lateral direction, calculates the position of the position or centroid of the peak of the element data P j.
  • the horizontal position and the vertical position obtained by this calculation represent coordinates at which the object is close on the operation surface 11.
  • the coordinate calculation unit 23 stores the coordinate data obtained by such calculation in a predetermined storage area of the storage unit 30.
  • the storage unit 30 stores constant data and variable data used for processing in the processing unit 20.
  • the storage unit 30 may store a program 31 executed on the computer.
  • the storage unit 30 includes, for example, a volatile memory such as a DRAM or SRAM, a nonvolatile memory such as a flash memory, a hard disk, or the like.
  • the interface unit 40 is a circuit for exchanging data between the input device and another control device (such as a control IC for an information device equipped with the input device).
  • the processing unit 20 outputs information (such as object coordinate information and the number of objects) stored in the storage unit 30 from the interface unit 40 to a control device (not shown). Further, the interface unit 40 may acquire the program 31 executed in the computer of the processing unit 20 from a non-temporary recording medium such as an optical disk or a USB memory, a server on the network, and load the program 31 on the storage unit 30. Good.
  • the processing unit 20 acquires N pieces of detection data S 1 to S N generated by the sensor unit 10.
  • Processing unit 20 obtains the initial value of the assumed value PA 1 ⁇ PA M of element data to be used in the data configuration process (ST110) to be described later.
  • the element data configuration unit 22 acquires, for example, constant data stored in advance in the storage unit 30 as an initial value.
  • the element data configuration unit 22 may acquire the element data P 1 to P M obtained as the previous configuration result (determined value) as initial values. Alternatively, the element data configuration unit 22 calculates, for example, a moving average value of each element data based on a plurality of sets of element data P 1 to P M obtained as a plurality of configuration results (determined values) obtained immediately before. It may be acquired as the initial value of this time. When an initial value having a large error from the element data is used by performing the first data configuration process (ST110) using the initial value based on one or more sets of element data P 1 to P M configured immediately before. In comparison, the accuracy of the constituent data is improved.
  • the processing unit 20 performs a data configuration process (FIG. 8) including four processes (first process to fourth process).
  • the processing unit 20 calculates the equation (8) based on the assumed values SA 1 to SAN of the N detection data and the N detection data S 1 to SN. Thus, N first coefficients ⁇ 1 to ⁇ N are calculated.
  • the processing unit 20 performs M number of operations by calculating the equation (10) based on the N first coefficients ⁇ 1 to ⁇ N and the second transformation matrix K T. Two coefficients ⁇ 1 to ⁇ M are calculated.
  • step ST125 Based on the evaluation value D calculated in step ST120, the processing unit 20 calculates the coefficient ⁇ using Expression (14-2).
  • 9A to 14B show a method for obtaining the convergence value of the element data P by repeating the data structure process (FIG. 8) many times, and a method for obtaining the estimated value of the element data P from the results of the two data structure processes, respectively.
  • the simulation result performed about is shown.
  • FIGS. 9A to 9B and FIGS. 10A to 10B show simulation results when the distance between the two objects is relatively close
  • FIGS. 11A to 11B and FIGS. 12A to 12B show that the distance between the two objects is medium.
  • FIG. 13A to FIG. 13B and FIG. 14A to FIG. 14B show the simulation results when the distance between the two objects is relatively long.
  • FIG. 9A to 9B, FIG. 11A to FIG. 11B, and FIG. 13A to FIG. 13B show simulation results for obtaining the convergence value of the element data P by repeating the data configuration process many times.
  • FIG. 9A, FIG. 11A, and FIG. 13A show the two-dimensional distribution of the proximity degree Px of an object that is virtually set as a simulation condition.
  • N detection data S 1 to S N of the sensor unit 10 are calculated based on the proximity degree Px
  • element data P 1 to P M are configured based on the detection data S 1 to S N.
  • the numerical value of the proximity degree Px is a dimensionless relative value.
  • FIG. 9B, FIG. 11B, and FIG. 13B show the two-dimensional distribution of the element data Pc that is converged by repeating the data configuration process 1000 times.
  • the numerical value of the element data Pc is also a dimensionless relative value.
  • X and Y in the diagram showing the two-dimensional distribution are coordinate axes representing the position of each section A, and the numbers on the coordinate axes indicate coordinate values.
  • the two-dimensional distribution of the element data Pc that is converged by repeating the data configuration process many times approximates the two-dimensional distribution of the proximity degree Px of the object.
  • FIG. 10A to FIG. 10B, FIG. 12A to FIG. 12B, and FIG. 14A to FIG. 14B show the element data of this embodiment for obtaining the estimated value of the element data P based on the results of the two data configuration processes (FIG. 8).
  • the simulation result of a composition process is shown.
  • FIGS. 10A to 10B show simulation results under the same conditions as in FIG. 9A (when the distance between two objects is short), and FIGS. 12A to 12B are the same conditions as in FIG. 11A (when the distance between two objects is medium).
  • 14A to 14B show simulation results under the same conditions as in FIG. 13A (when the distance between two objects is large).
  • each plot in FIGS. 10A, 12A, and 14A corresponds to one element data Pj .
  • the slope of the proportional relationship indicated by the distributions of the plots in FIGS. 10A, 12A, and 14A changes according to the relative positional relationship between two objects close to the operation surface 11, and the slope increases as the distance between the objects increases. Has become moderate.
  • the distribution range of the value on the horizontal axis (a value obtained by subtracting the first hypothesis value from the second hypothesis value) changes according to the relative positional relationship between two objects close to the operation surface 11, and the objects are The larger the distance is, the larger the absolute value of the value obtained by subtracting the first hypothetical value from the second hypothetical value as a whole.
  • FIG. 10B, FIG. 12B, and FIG. 14B show the two-dimensional distribution of the element data P estimated using the coefficient ⁇ calculated by the equations (14-1) and (14-2). 10B, 12B, and 14B and the simulation results of FIG. 9B, FIG. 11B, and FIG.
  • the dimensional distribution is approximately close to the two-dimensional distribution of the element data Pc converged by repeating the data configuration process 1000 times.
  • FIG. 15 is a diagram showing a correlation between the evaluation value D calculated by the equation (14-1) and the coefficient ⁇ .
  • Each plot in FIG. 15 corresponds to one simulation result (FIG. 10A, FIG. 12A, FIG. 14A, etc.).
  • the slope “a 1 ” and the intercept “b 1 ” in the equation (14-2) can be obtained by numerical calculation such as the least square method from the simulation result and the actual measurement result as shown in FIG.
  • FIG. 16A to FIG. 16B are diagrams showing simulation results when element data configuration processing is performed using a coefficient ⁇ ′ larger than the coefficient ⁇ ′ calculated by the equation (14-2) based on the evaluation value D.
  • FIG. 13B shows a simulation result under the same conditions as in FIG. 13A (when the distance between two objects is long).
  • FIG. 16B shows a two-dimensional distribution of the element data P estimated by the equation (13) using the coefficient ⁇ ′.
  • the estimated two-dimensional distribution of the element data P is the two-dimensional distribution to be reproduced (FIG. 13A).
  • the error becomes larger.
  • the element data P has a negative value, which is smaller than the actual value. Even if a weak peak indicating the presence of a distant object exists in this region, the peak may be erased due to a negative error. Therefore, it is desirable to use the coefficient ⁇ having an appropriate value calculated according to the relative positional relationship between objects close to the operation surface 11. Thereby, the error of the element data as described above is reduced.
  • each of the M sections A 1 to A M that virtually section the operation surface 11 has an overlapping portion with one or more detection regions R.
  • one or more detection data S is generated for each detection region R. Therefore, one or more detection data S indicating the degree of proximity of the object is generated for each of the M sections A 1 to A M.
  • the partial element data in which each of the M element data P 1 to P M is distributed to each of the N detection data S 1 to S N at a predetermined ratio (constant data K ij , expression (3)).
  • each of the N detection data detection data S 1 to S N is a predetermined ratio (constant data K ij) from each of the M element data P 1 to P M. ) Is approximated to the sum of the partial element data U ij distributed by (Equation (2)). That is, the N number of constant data K ij, which is set to each of the M element data P 1 ⁇ P M, of M component data P 1 ⁇ P M to N pieces of detection data S 1 ⁇ S N Conversion is defined (Equation (5)).
  • N is calculated as the sum of the partial element data U ij distributed at a predetermined ratio (constant data K ij ) from each of the assumed values PA 1 to PAM of the M element data.
  • assumptions SA 1 ⁇ SA N of pieces of detection data are calculated (equation (6)). Further, M pieces of M detection data are assumed based on M ⁇ N constant data K ij so that the calculated assumption values SA 1 to S N of the N pieces of detection data approach N detection data S 1 to S N.
  • assumptions PA 1 ⁇ PA M of the element data is modified.
  • an estimated value of the element data P obtained by the above it is calculated for each of the M sections A 1 to A M (formula (13)). Therefore, the number of repetitions of the data structure process can be greatly reduced compared to the case where the convergence value of the element data P is obtained by repeating the data structure process many times, and the calculation is simplified.
  • the data configuration process is only required twice, and the calculation becomes very simple.
  • the estimated value of the element data P obtained as the sum of the values causes a certain amount of error with respect to the convergence value of the element data P obtained by repeating the data configuration process many times.
  • the coefficient ⁇ that minimizes this error tends to have a smaller absolute value as the difference between the two assumed values PA in each element data P increases.
  • the absolute value decreases as the difference between the two assumed values PA in each element data P increases.
  • the evaluation value D corresponding to the difference between the two assumed values PA in each of the M element data P is calculated, and the value of a predetermined function having the evaluation value D as a variable is a coefficient. Obtained as ⁇ .
  • an appropriate coefficient ⁇ according to the difference between the two assumed values PA in each of the M element data P can be acquired.
  • the input device according to the second embodiment is obtained by changing a part of the processing of the element data configuration unit 22 in the input device according to the first embodiment, and the other configuration is the input according to the first embodiment. Same as the device.
  • FIG. 17 is a flowchart for explaining an example of a method for constructing M element data from N detection data in the input device according to the second embodiment.
  • the flowchart shown in FIG. 17 is obtained by replacing step ST125 in the flowchart shown in FIG. 7 with steps ST130, ST135, and ST140, and the other steps are the same as the flowchart shown in FIG.
  • the element data configuration unit 22 selects a function used for calculating the coefficient ⁇ from the following two formulas according to the magnitude relationship between the evaluation value D and the threshold value TH.
  • step ST120 If the evaluation value D calculated in step ST120 is larger than the threshold value TH (Yes in ST130), the element data constituting unit 22 calculates the coefficient ⁇ by the equation (15-1) (ST135), and the evaluation value D is calculated. If it is equal to or less than the threshold value TH (No in ST130), the coefficient ⁇ is calculated by equation (15-2) (ST140).
  • FIG. 18 is a diagram showing a correlation between the evaluation value D calculated by the equation (14-1) and the coefficient ⁇ .
  • the graph shown in FIG. 18 is basically the same as FIG. 15, and the range of the coefficient ⁇ on the vertical axis is wider than that in FIG.
  • the element data configuration unit 22 switches the linear function used for calculating the coefficient ⁇ with the threshold value TH as a boundary. That is, when the evaluation value D is larger than the threshold value TH, the element data constituting unit 22 calculates the coefficient ⁇ by the equation (15-1) in which the absolute value of the negative slope is relatively small, and the evaluation value D is the threshold value. When the value is less than TH, the coefficient ⁇ is calculated by the equation (15-2) in which the absolute value of the negative slope is relatively large.
  • 19A to 19B are diagrams showing an example of the simulation result of the element data configuration process in the input device according to the present embodiment, and show the simulation result under the same conditions (when the distance between two objects is short) as in FIG. 9A.
  • FIG. 19B shows a two-dimensional distribution of element data P estimated using the coefficient ⁇ obtained by the method of the present embodiment.
  • the two-dimensional distribution shown in FIG. 19B has a clearer boundary (the position of the arrow in FIG. 19B) between the two objects than the two-dimensional distribution shown in FIG. 9B. It has become. Accordingly, when the distance between the two objects is short (when the evaluation value D is small), the boundary between the two objects may become clear by increasing the absolute value of the slope of the linear function used for calculating the coefficient ⁇ . I understand.
  • the difference between the two assumed values PA in each of the M element data P tends to decrease. Yes, and thus the evaluation value D becomes small.
  • increasing the coefficient ⁇ tends to clarify the boundary between the objects close to the operation surface 11 (FIGS. 19A to 19B). Therefore, compared to the absolute value of the slope (a 1 ) of the linear function in the range where the evaluation value D is larger than the threshold value TH, the slope (a 2 ) of the linear function in the range where the evaluation value D is smaller than the threshold value TH.
  • the coefficient ⁇ is likely to increase when the distance between objects close to the operation surface 11 approaches and the evaluation value D decreases. Thereby, the boundary between the objects can be made clearer than the distribution of the element data P converged by repeating the data configuration process.
  • the function for calculating the coefficient ⁇ from the evaluation value D is not limited to a linear function, and may be a quadratic function including a curve.
  • a coefficient ⁇ is used by using a function such that the absolute value of the derivative in the range where the evaluation value D is smaller than the threshold is larger than the absolute value of the derivative in the range where the evaluation value D is larger than the threshold.
  • FIG. 20 is a diagram illustrating an example of the configuration of the input device according to the third embodiment.
  • the input device according to the present embodiment embodies the sensor unit 10 in the input device according to the first embodiment as a capacitive sensor, and the overall configuration is the input according to the first embodiment. It is the same as the device.
  • the sensor unit 10A in the input device according to the present embodiment includes N electrodes E 1 to E N formed in different detection regions R, respectively.
  • each of the N electrodes E 1 to E N may be referred to as “electrode E” without distinction.
  • the sensor unit 10A also includes a capacitance detection unit 12 that generates detection data S corresponding to the capacitance (first capacitance) between the object close to the operation surface 11 and the electrode E.
  • the capacitance detection unit 12 generates detection data S for each of the N electrodes E.
  • the capacitance detection unit 12 samples the charge corresponding to the capacitance of the capacitor formed between the N detection electrodes E and the object, and outputs detection data S corresponding to the sampled charge.
  • the capacitance detection unit 12 includes, for example, a capacitance-voltage conversion circuit (CV conversion circuit) and an A / D conversion circuit.
  • the CV conversion circuit charges and discharges a capacitor formed between the N detection electrodes E and the object under the control of the processing unit 20, and the charge of the capacitor transmitted through the detection electrode E along with the charge and discharge. Is transferred to the reference capacitor, and a signal corresponding to the voltage generated in the reference capacitor is output.
  • the A / D conversion circuit converts the output signal of the CV conversion circuit into a digital signal at a predetermined period and outputs it as detection data S under the control of the processing unit 20.
  • the detection data of the capacitance of the electrode E i is denoted as “S i ”.
  • FIG. 21 is a diagram for explaining the second capacitance CE ij between the overlapping portion E ij of one electrode E i and the object 1 in one section A j .
  • E ij in FIG. 21 indicates an overlapping portion of the electrode E i with respect to the section A j .
  • CE ij indicates a capacitance (second capacitance) formed between the overlapping portion E ij of the electrode E i and the object 1 such as a finger.
  • the number of electrodes E 1 to E N is smaller than that of the sections A 1 to A M , but in each section A, one or more electrodes E are arranged so as to have overlapping portions E ij .
  • the electrodes E 1 to E N are arranged so that the combinations of the sections A having overlapping portions are different.
  • the other electrode E is arranged so as to have an overlapping part in the combination A other than (A 1 , A 2 ).
  • the areas of the overlapping portions in at least some of the electrodes E may be different. That is, the electrodes E 1 to E N are arranged on the operation surface 11 so that the patterns of the overlapping manner with the sections A 1 to A M are different.
  • the third electrostatic capacitance CA j Change ⁇ CA j is substantially equal to the sum of the second capacitance change ⁇ CE ij of each electrode E in the section A j , and is expressed by the following equation.
  • the second electrostatic capacitance CE ij formed between one overlapping portion E ij and the object 1 is substantially proportional to the area of the overlapping portion E ij .
  • the third capacitance CAj (formula (16)) formed between the overlapping portions of all the electrodes E i included in the section A j and the object 1 is equal to all the overlapping sections included in the section A j. It is almost proportional to the area.
  • the constant data K ij second electrostatic It represents the ratio between the capacitance change ⁇ CE ij and the third capacitance change ⁇ CA j .
  • equation (17) is expressed as the following equation.
  • Equation (19) is expressed as follows using a matrix.
  • the element data P j of the section A j is proportional to the third capacitance change ⁇ CA j
  • the capacitance detection data S i by the capacitance detector 12 is proportional to the first capacitance change ⁇ CE i
  • partial element data U ij of the overlapping portion E ij is proportional to the second capacitance change ⁇ CE ij. That is, the following expression is established.
  • the equations (16) to (20) of the present embodiment are equal to the equations (1) to (5) already described. Accordingly, in the present embodiment, as in the first embodiment, it is possible to configure M element data P 1 to P M from N detection data S 1 to S N.
  • FIG. 22A to 22B are diagrams illustrating an example of electrode patterns in the input device according to the third embodiment.
  • FIG. 22A shows 20 sections (A 1 to A 20 ) of the operation surface 11, and
  • FIG. 22B shows 18 electrode patterns (E 1 to E 18 ) overlapping each section A.
  • 23A to 23B are diagrams showing details of the electrode patterns (E 1 to E 18 ) shown in FIG. 22B.
  • 23A shows eight electrode patterns (E 1 to E 8 ) formed in the upper layer
  • FIG. 23B shows ten electrode patterns (E 9 to E 18 ) formed in the lower layer.
  • the operation surface 11 of the sensor unit 10A is substantially rectangular, and is divided into a 4 ⁇ 5 grid pattern by 20 sections A 1 to A 20 .
  • the sections A 1 to A 5 are arranged in numerical order from the first column to the fifth column in the first row, and the sections A 6 to A 10 are arranged from the first column to the fifth column in the second row.
  • the sections A 11 to A 15 are arranged in numerical order from the first column to the fifth column in the third row, and the sections A 16 to A 20 are arranged in the fourth line. They are arranged in numerical order from the first column to the fifth column.
  • the electrodes E 1 to E 4 are positioned in this order from the first row to the fourth row of the grid pattern, and extend from the first column to the fourth column, respectively. ing.
  • the ratio of the area occupied by the electrodes E 1 to E 4 in each section is 4/8 in the first column, 3/8 in the second column, 2/8 in the third column, 1 / in the fourth column. It is eight.
  • the electrodes E 5 to E 8 are located in this order in the first to fourth rows of the lattice pattern, and extend from the fifth column to the second column, respectively.
  • the ratio of the area occupied by the electrodes E 5 to E 8 in each section is 4/8 in the fifth column, 3/8 in the fourth column, 2/8 in the third column, 1 / in the second column. It is eight.
  • the electrodes E 9 to E 13 are positioned in this order in the first column to the fifth column of the lattice pattern, and extend from the first row to the third row, respectively. ing.
  • the ratio of the area occupied by the electrodes E 9 to E 13 in each section is 3/6 in the first row, 2/6 in the second row, and 1/6 in the third row.
  • the electrodes E 14 to E 18 are located in this order in the first column to the fifth column of the lattice pattern, and extend from the fourth row to the second row, respectively.
  • the ratio of the area occupied by the electrodes E 14 to E 18 in each section is 3/6 in the fourth row, 2/6 in the third row, and 1/6 in the second row.
  • the constant data K 11 on the segmented A 1 electrode E 1 is 4/8
  • constant data K 12 on the segmented A 2 electrodes E 1 is 3/8
  • constant data on the segmented A 3 electrodes E 1 K 13 is 2/8
  • constant data K 14 on the segmented a 4 electrode E 1 is 1/8.
  • the detection data S is obtained by a simplified calculation process as in the first embodiment. More element data P can be configured.
  • FIG. 24 is a diagram illustrating an example of the configuration of the input device according to the fourth embodiment.
  • the input device according to the present embodiment is obtained by replacing the sensor unit 10A in the input device according to the third embodiment with a sensor unit 10B, and the overall configuration is the same as that of the input device according to the third embodiment. is there.
  • the sensor unit 10B has J electrodes ER 1 to ER J formed in different detection regions R, respectively.
  • each of the J electrodes ER 1 to ER J may be referred to as “electrode ER” without distinction.
  • the electrodes ER each have a plurality of terminals T, and the J electrodes ER have N terminals T as a whole.
  • the number J of electrodes ER is half of the number N of terminals T.
  • the electrode ER is formed of a material having a higher resistance value than a general metal (for example, ITO used for a transparent conductive film).
  • the electrostatic capacitance detection unit 12 inputs charges accumulated between the object close to the operation surface 11 and the electrode ER from the N terminals T, and based on the input charges, the object and the electrode ER The detection data S corresponding to the capacitance between is generated for each of the N terminals T.
  • the capacitance detecting unit 12 inputs the electric charge simultaneously from a plurality of terminals T provided on the one electrode ER. As a result, the charge accumulated on the electrode ER is distributed to the plurality of terminals T. At this time, the charge distribution ratio is expected to be proportional to the conductance (reciprocal of the resistance value) from the location where the charge is accumulated on the electrode ER to the terminal T. That is, more charge is distributed to the terminal T having a large conductance.
  • FIG. 25 is a diagram illustrating a state in which the partial charges QP kj are accumulated between the overlapping portion ER kj of one electrode ER k and the object 1 in one section A j .
  • FIG. 26 is a diagram showing a state in which this partial charge Q kj is distributed to the two terminals T k (1) and T k (2) of the electrode ER k .
  • K represents an integer from 1 to J.
  • K (1) and “k (2)” indicate integers from 1 to N associated with the integer k, respectively.
  • G k (1) j indicates the conductance from the overlapping portion ER kj to the terminal T k (1)
  • G k (2) j indicates the overlapping portion ER kj to the terminal.
  • the conductance up to T k (2) is shown.
  • CER kj indicates a capacitance between the overlapping portion ER kj and the object 1.
  • QD k (1) j indicates the distributed charge distributed to the terminal T k (1) among the partial charges QP kj .
  • QD k (2) j indicates the distributed charge distributed to the terminal T k (2) among the partial charges QP kj .
  • the capacitance detection unit 12 includes two charge amplifiers 12-k (1) and 12-k (2) that simultaneously input charges from the two terminals Tk (1) and Tk (2) .
  • the charge amplifiers 12-k (1) and 12-k (2) each include an operational amplifier OP, a capacitor Cf, and switches SW1 and SW2.
  • the capacitor Cf and the switch SW1 are connected in parallel between the output of the operational amplifier OP and the inverting input terminal.
  • the switch SW2 selectively inputs the ground potential or the driving voltage V to the non-inverting input terminal of the operational amplifier.
  • the inverting input terminal of the operational amplifier OP is connected to the corresponding terminal T of the electrode ER kj .
  • the switches SW1 of the charge amplifiers 12-k (1) and 12-k (2) are turned on, and the switch SW2 inputs the drive voltage V to the non-inverting input terminal of the operational amplifier.
  • a voltage substantially equal to the drive voltage V is applied to the two terminals T k (1) and T k (2) , and a partial charge QP kj is accumulated between the overlapping portion ER kj and the object 1. .
  • Partial charge QP kj is a sum of distributed charge QD k (1) j distributed to terminal T k (1) and distributed charge QD k (2) j distributed to terminal T k (2) .
  • the distributed charges QD k (1) j and QD k (2) j have conductances G k (1) j , G k (2 ) from the overlapping portion ER kj to the two terminals T k (1) , T k (2). ) Proportional to j .
  • the coefficients indicating the conductance ratio are “KG k (1) j ” and “KG k (2) j ”
  • the distributed charges QD k (1) j and QD k (2) j are respectively expressed by the following equations. .
  • the coefficients KG k (1) j and KG k (1) j are expressed by the following equations using conductances G k (1) j and G k (2) j .
  • the partial charge QP kj is proportional to the capacitance CER kj between the overlapping portion ER kj and the object 1 in the section A j, and the capacitance CER kj is substantially proportional to the area of the overlapping portion ER kj . Accordingly, when the area ratio between the overlapping portion ER kj of the electrode ER k and the overlapping portion of all the electrodes in the section A j is “KS kj ”, the partial charge QP kj is expressed by the following equation.
  • equations (29-1) and (29-2) are expressed by the following equations: Is done.
  • the detected charge input from the terminal T i to the capacitance detection unit 12 is “QD i ”, the detected charge QD i is the sum of all the distributed charges QD ij related to the terminal T i.
  • the following equation is obtained from (31).
  • Equation (32) can be expressed as follows using a matrix.
  • the element data P j of the section A j is proportional to the combined charge Q j
  • the detection data S i of the terminal T i by the capacitance detection unit 12 is proportional to the detection charge QD i
  • the overlapping portion E ij The element data U ij is proportional to the distributed charge QD ij . That is, the following expression is established.
  • the expressions (31), (32), (33), (34) of the present embodiment are expressed by the expressions (3), (4), (5) already described. , (1). Accordingly, in the present embodiment, as in the first embodiment, it is possible to configure M element data P 1 to P M from N detection data S 1 to S N.
  • FIG. 27A to 27B are diagrams showing an example of electrode patterns in the input device according to the fourth embodiment.
  • FIG. 27A shows 20 sections (A 1 to A 20 ) of the operation surface 11, and
  • FIG. 27B shows nine electrode patterns (ER 1 to ER 9 ) overlapping each section A.
  • 28A to 28B are diagrams showing details of the electrode patterns (ER 1 to ER 9 ) shown in FIG. 27B.
  • 28A shows four electrode patterns (ER 1 to ER 4 ) formed in the upper layer
  • FIG. 28B shows five electrode patterns (ER 5 to ER 9 ) formed in the lower layer.
  • the twenty sections A 1 to A 20 shown in FIG. 27A form a 4 ⁇ 5 grid pattern, as in FIG. 22A.
  • the electrodes ER 1 to ER 4 are located in this order in the first to fourth rows of the lattice pattern, and extend from the first column to the fifth column, respectively. .
  • the ratio of the area occupied by the electrodes E 1 to E 4 in each section is all 1 ⁇ 2.
  • the electrodes E 1 to E 4 have terminals T 1 to T 4 at the end on the first column side and terminals T 5 to T 8 at the end on the fifth column side.
  • the electrodes E 5 to E 9 are positioned in this order in the first column to the fifth column of the lattice pattern, and extend from the first row to the fourth row, respectively. .
  • the ratio of the area occupied by the electrodes E 5 to E 9 in each section is all 1 ⁇ 2.
  • the electrodes E 5 to E 9 have terminals T 9 to T 13 at the end on the first row side, and terminals T 14 to T 18 at the end on the fourth row side.
  • the terminal T 1 of the electrode ER 1 As an example, attention is paid to the terminal T 1 of the electrode ER 1.
  • the overlapping portions ER 11 between compartments A 1 and the electrode ER 1, the terminal T 1 is connected directly. Therefore, it is approximated that the partial charges QP 11 accumulated in the overlapping portion ER 11 are all distributed to the terminal T 1 . Further, the partial charge QP 11 is 1 ⁇ 2 of the combined charge Q 1 from the ratio of the area of the overlapping portion ER 11 occupying the section A 1 . Therefore, the constant data K 11 on the segmented A 1 electrode ER 1 is 1/2.
  • Overlapping portions ER 12 between compartments A 2 and the electrode ER 1 is connected across one section to the terminal T 1, is connected to the terminal T 5 separates third compartment. Therefore, it is approximated that 3/4 of the partial charge QP 12 accumulated in the overlapping portion ER 12 is distributed to the terminal T 1 and 1/4 is distributed to the terminal T 5 .
  • the overlapping portion ER 13 between the section A 3 and the electrode ER 1 is connected to the terminal T 1 with two sections separated and connected to the terminal T 5 with two sections separated. Therefore, of the partial charges QP 13 accumulated in the overlapping portion ER 13 , it is approximated that 1/2 is distributed to the terminal T 1 and 1/2 is distributed to the terminal T 5 . Further, the partial charge QP 13 is 1 ⁇ 2 of the combined charge Q 3 from the ratio of the area of the overlapping portion ER 13 occupying the section A 3 . Therefore, the constant data K 13 on the segmented A 2 electrodes ER 1 is 1/4.
  • the overlapping portion ER 14 between the section A 4 and the electrode ER 1 is connected to the terminal T 1 by three sections and connected to the terminal T 5 by one section. Therefore, it is approximated that 1/4 of the partial charge QP 14 stored in the overlapping portion ER 14 is distributed to the terminal T 1 and 3/4 is distributed to the terminal T 5 . Further, the partial charge QP 14 is 1 ⁇ 2 of the combined charge Q 4 from the ratio of the area of the overlapping portion ER 14 occupying the section A 4 . Therefore, the constant data K 14 on the segmented A 4 electrodes ER 1 becomes 1/8.
  • the overlapping portion ER 15 between the section A 5 and the electrode ER 1 is directly connected to the terminal T 5 . Therefore, it is approximated that all the partial charges QP 15 accumulated in the overlapping portion ER 15 are distributed to the terminal T 5 . Therefore, the constant data K 15 on the segmented A 5 electrodes ER 1 is zero.
  • the constant data K 11 , K 12 , K 13 , K 14 , and K 15 are 1/2, 3/8, 1/4, 1/8, and 0, respectively.
  • a first transformation matrix K consisting of 18 ⁇ 20 pieces of constant data K ij.
  • the first transformation matrix K is the same as Equation (22).
  • the element data P larger than the number of the detection data S can be configured by the simplified arithmetic processing as in the first embodiment.
  • a plurality of terminals T are provided for one electrode ER, and one detection data S is generated for each terminal T. Therefore, the number of electrodes ER is greater than the number of detection data S. Less. Therefore, the sensor unit 10B can have a simpler configuration.
  • FIG. 29 is a flowchart for explaining a modification of the process of constructing M element data P from N detection data S.
  • the assumed value PA 1 ⁇ PA M element data obtained in step ST105 as the initial value
  • assumed values SA 1 detection data ⁇ SA N Is calculated.
  • this calculation result is always constant regardless of the detection data S 1 to S N , it is not necessary to calculate each time the element data P 1 to P M are configured. Therefore, in the flowchart of the modification shown in FIG. 29, the calculation step (first process) of the detection data hypothetical values SA 1 to SA N is omitted when the first data configuration process (ST110A) is performed.
  • element data constituting section 22 calculation step of assumptions SA 1 ⁇ SA N detection data when performing initial data configuration processing (ST110A) (first treatment, ST 200 in FIG. 8) without a storage unit It acquires assumptions SA 1 ⁇ SA N detection data as the initial value of 30, etc. (ST105A).
  • Element data construction unit 22 when performing the second data configuration process (ST115) based on the assumed value PA 1 ⁇ PA M element data corrected by the previous data configuration process (ST110A), assuming the detected data
  • the values SA 1 to SA N are calculated (first process).
  • the processing speed can be improved by omitting the calculation step (first processing) of the assumption values SA 1 to SA N of the detection data when performing the first data configuration processing (ST110A).
  • FIG. 30 is a flowchart for explaining another modified example of the process of configuring M element data P from N detection data S.
  • an estimated value of a result obtained by multiple data configuration processes is calculated from the results of two data configuration processes.
  • the data configuration process may be repeated many times (L times) by the process of the flowchart of FIG. 30 to increase the accuracy of the definite values of the element data P 1 to P M.
  • Steps ST300 to ST305 in the flowchart shown in FIG. 30 are the same as steps ST100 to ST105 in the flowchart shown in FIG.
  • the element data configuration unit 22 repeats the data configuration process (FIG.

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