WO2018171130A1 - 太阳能芯片、太阳能电池组件和汽车 - Google Patents

太阳能芯片、太阳能电池组件和汽车 Download PDF

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WO2018171130A1
WO2018171130A1 PCT/CN2017/101489 CN2017101489W WO2018171130A1 WO 2018171130 A1 WO2018171130 A1 WO 2018171130A1 CN 2017101489 W CN2017101489 W CN 2017101489W WO 2018171130 A1 WO2018171130 A1 WO 2018171130A1
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solar
substrate
solar chip
bypass diode
chip
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PCT/CN2017/101489
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English (en)
French (fr)
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明巧红
高卫民
徐康聪
萧寒松
严艇
俞翔
郭光喜
田甜
孙杰
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东汉新能源汽车技术有限公司
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Publication of WO2018171130A1 publication Critical patent/WO2018171130A1/zh

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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • the utility model relates to a solar cell technology, in particular to a solar chip, a solar cell module and an automobile.
  • the solar cell module is usually formed by connecting a plurality of solar chips in series or in parallel, and a bypass diode is connected in parallel at both ends of the solar cell module.
  • the bypass diode is forward-conducted to protect the solar cell module.
  • the purpose of the utility model is to provide a solar chip, a solar cell module and an automobile to solve the problems in the prior art, improve the control precision, and simplify the installation and construction of the solar cell module.
  • the utility model provides a solar chip, which comprises:
  • the substrate is provided with a groove and a through hole, and the substrate is pasted with a thin film battery;
  • bus bar conductive strips respectively attached to the substrate, wherein the positive and negative electrodes of the bypass diode are provided with lead wires, and the lead wires are connected to the bus bar conductive strip through the through holes; the bus bar conductive strip A positive electrode terminal and a negative electrode terminal are collected on the back surface of the substrate.
  • the grooves are located on both sides of the thin film battery.
  • the through hole is located in the trench Inside.
  • the present invention also provides a solar cell module comprising an array of a plurality of solar chips, wherein the array includes at least one solar chip provided by the present invention.
  • the utility model further provides a solar vehicle, which comprises the solar battery module provided by the utility model, and the substrate of each solar chip is spliced as the roof of the solar vehicle.
  • the solar chip, the solar cell module and the automobile provided by the utility model arrange the bypass diode by opening a groove and a through hole on the substrate, so that each solar chip is controlled by an independent bypass diode, thereby making a single solar chip Once damage occurs, it will not affect other chips, improving control accuracy.
  • FIG. 1 is a schematic structural view of a thin film battery hidden by a solar chip according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of an array in a solar cell module according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural view of a trench opened on a substrate
  • FIG. 4 is a schematic view showing a state of a lead of a bypass diode on a trench
  • Figure 5 is a schematic structural view of a thin film battery
  • FIG. 6 is an electrical schematic diagram of a solar cell module according to an embodiment of the present invention.
  • FIG. 1 is a schematic view showing the structure of a thin film battery in a solar chip according to an embodiment of the present invention.
  • the embodiment of the present invention provides a solar chip 1 , wherein a plurality of solar chips 1 form an array, and a plurality of arrays constitute a solar cell module.
  • 2 is a schematic structural view of an array in a solar cell module according to an embodiment of the present invention. As shown in FIG. 2, the figure shows three arrays 2 described above.
  • FIG. 3 is a schematic structural view of a trench formed on a substrate.
  • the substrate 11 includes a substrate 11 (a battery disposed on the substrate 11 is hidden in FIG. 1).
  • a groove 14 and a through hole are formed in the substrate 11, and a thin film battery is attached to the substrate.
  • the bypass diode 12 is disposed in the trench 14, and the trench 14 is laterally and vertically opened on the substrate 11.
  • FIG. 4 is a schematic view of a lead state of a bypass diode on a trench.
  • a plurality of bus bar conductive strips 13 are respectively attached to the substrate 11.
  • the positive and negative electrodes of the bypass diode 12 are respectively provided with leads 15, and the lead wires 15 pass through the through holes 16
  • Correspondingly connected to the bus bar conductive strip 13; the bus bar conductive strip 13 is collected on the back side of the substrate 11 into a positive terminal and a negative terminal.
  • the assembled positive and negative terminals are each independently connected to a corresponding number of channels of the solar controller (MPPT), and the influence of the independent channels has less influence on the MPPT.
  • MPPT solar controller
  • the solar chip 1 provided by the embodiment of the present invention is provided with a groove and a through hole on the substrate of each solar chip, and a bypass diode is arranged in the groove, so that each independent solar chip is separated by a separate bypass diode. Control, so that a single chip is affected will not affect other chips.
  • the trenches 14 are located on both sides of the thin film battery in such a manner that the bypass diodes 12 are connected in parallel on both sides of the thin film battery to be connected to the positive and negative electrodes of the thin film battery for wiring.
  • the trenches 14 can be formed on the substrate 11 and on both sides of the thin film battery.
  • the trenches 14 are located on the side of each array, such as Figure 3 shows.
  • the through hole 16 is located in the trench 14, so that the number of punched holes of the lead wire can be reduced, which facilitates the wire harness connection, and can also facilitate the flatness of the surface of the solar chip package.
  • the bypass diode 12 is located in a trench formed in the front surface of the substrate 11, and is guided through the through hole 16 through the lead 15 to the back surface of the substrate 11.
  • the bus bar 13 also extends to the back surface of the substrate 11, and is connected to the positive and negative terminals of the bypass diode 12.
  • the thin film battery 4 is provided with a positive electrode 41 and a negative electrode 42, and a connection end 43 for connecting to the bypass diode.
  • the bypass diode 12 passes through the bus bar 13 and
  • the positive electrode 41 and the negative electrode 42 of the thin film battery 4 are connected to each other, collected, and taken out from the back surface of the substrate 11, and connected to the MPPT.
  • the thin film battery 4 presses the above-mentioned bus bar conductive strips 13 together during the pasting process, and the electrical connection can be realized after the thin film battery 4 is firmly attached.
  • the bus bar conductive strips 13 are preferably fixedly connected by means of multi-point soldering.
  • the embodiment of the present invention further provides a solar cell module.
  • the solar cell module includes an array 2 composed of a plurality of solar chips, wherein the array 2 includes at least one solar energy provided by any embodiment of the present invention. chip.
  • each solar chip 1 is controlled by an independent bypass diode 12, and when a single solar chip exhibits a hot spot effect, the bypass diode 12 acts as a bypass, allowing the current generated by other solar chips to flow out of the bypass diode and input into the MPPT 3, so that the solar power generation system continues to generate electricity without being caused by a problem with a certain solar chip. The situation that the power generation circuit is not available.
  • the embodiment of the present invention further provides a solar energy vehicle, comprising the solar battery module provided by any embodiment of the present invention, wherein the substrate of each solar chip is spliced as the roof of the solar automobile.
  • the solar chip, the solar cell module and the solar vehicle provided by the embodiments of the present invention have the following advantages:
  • Each solar chip is controlled by an independent bypass diode, and the influence of a single solar chip has no effect on other chips;
  • Each solar chip has an independent substrate, which is convenient for operation and construction: after all solar cell module packages are completed online, it is installed on the roof of the solar car, which facilitates precise positioning and precise positioning operation of the punching device, and can realize batch Streamlined operation;

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Abstract

提供一种太阳能芯片、太阳能电池组件和汽车。太阳能芯片（1）包括：基板（11），基板上开设有沟槽（14）和贯通孔（16），基板上粘贴有薄膜电池（4）；旁路二极管（12），容置在沟槽中；多条汇流导电带（13），分别粘贴在基板上，旁路二极管的正极和负极均设置引线（15），引线穿过贯通孔与汇流导电带对应相连；汇流导电带在基板的背面汇集成正极端和负极端。提供的太阳能芯片、太阳能电池组件和汽车通过在基板上开设沟槽和贯通孔来对旁路二极管进行布置，使每个太阳能芯片均由独立的旁路二极管控制，进而使单个太阳能芯片一旦发生损坏也不会对其他芯片产生影响，提高了控制精度。

Description

太阳能芯片、太阳能电池组件和汽车 技术领域
本实用新型涉及太阳能电池技术，尤其涉及一种太阳能芯片、太阳能电池组件和汽车。
背景技术
太阳能电池组件通常是由多个太阳能芯片串联或并联而成，在太阳能电池组件的两端并联旁路二极管。当太阳能电池组件发送损坏或由于被遮挡而变成负载时，旁路二极管发生正向导通，以对太阳能电池组件起到保护的作用。
但是，现有技术中没有对单个太阳能芯片进行独立控制，导致单个芯片一旦发生损坏对其他芯片也会产生影响。另外，现有技术中的太阳能芯片的电气系统均是集成操作和施工，操作施工难度大，旁路二极管的布置精度也难以控制。
实用新型内容
本实用新型的目的是提供一种太阳能芯片、太阳能电池组件和汽车，以解决现有技术中的问题，提高控制精度，简化太阳能电池组件的安装和施工。
本实用新型提供了一种太阳能芯片，其中，包括：
基板，所述基板上开设有沟槽和贯通孔，所述基板上粘贴有薄膜电池；
旁路二极管，设置在所述沟槽中；
多条汇流导电带，分别粘贴在所述基板上，所述旁路二极管的正极和负极均设置引线，所述引线穿过所述贯通孔与所述汇流导电带对应相连；所述汇流导电带在所述基板的背面汇集成正极端和负极端。
如上所述的太阳能芯片，其中，优选的是，所述沟槽位于所述薄膜电池的两侧。
如上所述的太阳能芯片，其中，优选的是，所述贯通孔位于所述沟槽 内。
如上所述的太阳能芯片，其中，优选的是，所述汇流导电带通过多点锡焊固定连接。
本实用新型还提供了一种太阳能电池组件，包括由多个太阳能芯片构成的阵列，其中，所述阵列中至少包括一个本实用新型提供的太阳能芯片。
本实用新型又提供了一种太阳能汽车，其中，包括本实用新型提供的太阳能电池组件，每个太阳能芯片的基板拼接后作为所述太阳能汽车的车顶。
本实用新型提供的太阳能芯片、太阳能电池组件和汽车通过在基板上开设沟槽和贯通孔来对旁路二极管进行布置，使每个太阳能芯片均由独立的旁路二极管控制，进而使单个太阳能芯片一旦发生损坏也不会对其他芯片产生影响，提高了控制精度。
附图说明
图1为本实用新型实施例提供的太阳能芯片隐去了薄膜电池的结构示意图；
图2为本实用新型实施例提供的太阳能电池组件中的一个阵列的结构示意图；
图3为在基板上开设的沟槽的结构示意图；
图4为旁路二极管在沟槽上的引线状态示意图；
图5为薄膜电池的结构示意图；
图6为本实用新型实施例提供的太阳能电池组件的电气原理图。
附图标记说明：
1-太阳能芯片 11-基板 12-旁路二极管 13-汇流导电带 14-沟槽 15-引线 16-贯通孔 2-阵列 3-MPPT 4-薄膜电池 41-正极 42-负极 43-连接端
具体实施方式
下面详细描述本实用新型的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似 功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本实用新型，而不能解释为对本实用新型的限制。
图1为本实用新型实施例提供的太阳能芯片隐去了薄膜电池的结构示意图，本实用新型实施例提供了一种太阳能芯片1，多个太阳能芯片1构成阵列，多个阵列构成太阳能电池组件，图2为本实用新型实施例提供的太阳能电池组件中的一个阵列的结构示意图，如图2所示，该图示出了三个上述的阵列2。
图3为在基板上开设的沟槽的结构示意图，请参照图1至图3，针对太阳能芯片1来说，其包括基板11(图1中隐去了设置在基板11上的电池)、旁路二极管12和多条汇流导电带13。如图2所示，基板11上开设有沟槽14和贯通孔(图2未示出)，基板上粘贴有薄膜电池。旁路二极管12设置在沟槽中14，沟槽14交叉地以横向和竖向开设在基板11上。
图4为旁路二极管在沟槽上的引线状态示意图，多条汇流导电带13分别粘贴在基板11上，旁路二极管12的正极和负极均设置引线15，引线15穿过所述贯通孔16与所述汇流导电带13对应相连；所述汇流导电带13在所述基板11的背面汇集成正极端和负极端。汇集后的正极端和负极端各自独立接入太阳能控制器(MPPT)的相应数量通道，独立通道的影响对MPPT的影响较小。
本实用新型实施例提供的太阳能芯片1在每个太阳能芯片的基板上均设置有沟槽和贯通孔，在沟槽内布置旁路二极管，使每个独立的太阳能芯片均由独立的旁路二极管控制，由此使单个芯片受影响后不会对其他芯片产生影响。
优选的是，沟槽14位于薄膜电池的两侧，这样的布置方式使旁路二极管12并联在薄膜电池的两侧，与薄膜电池的正极和负极相连，便于布线。
对于单个太阳能芯片1而言，沟槽14可以开设在基板11上且位于薄膜电池的两侧，当太阳能芯片1构成多个阵列2后，沟槽14就会位于每个阵列的边侧，如图3所示。
优选的是，贯通孔16位于沟槽14内，从而可以减少引线的打孔数量，利于线束连接，同时也能利于太阳能芯片封装表面的平整。如图4所示， 旁路二极管12位于开设在基板11正面的沟槽内，并通过引线15穿过贯通孔16引至基板11的背面。汇流导电带13也延伸到基板11的背面，与旁路二极管12的正极和负极对应相连。
图5为薄膜电池的结构示意图，如图5所示，薄膜电池4上设置有正极41和负极42，以及用于与旁路二极管相连的连接端43，旁路二极管12通过汇流导电带13与薄膜电池4的正极41和负极42分别相连，并汇集后从基板11的背面引出，与MPPT相连。
进一步地，薄膜电池4在粘贴过程中，将上述汇流导电带13压贴在一起，待薄膜电池4粘贴牢固之后即可实现电气连接。为了增加电气连接的可靠性，优选地将汇流导电带13通过多点锡焊的方式固定连接。
本实用新型实施例还提供了一种太阳能电池组件，参照图2，太阳能电池组件包括由多个太阳能芯片构成的阵列2，其中，该阵列2中至少包括一个本实用新型任意实施例提供的太阳能芯片。
图6为本实用新型实施例提供的太阳能电池组件的电气原理图，从图6中可以看出，每个太阳能芯片1均由独立的旁路二极管12控制，当单个太阳能芯片出现热斑效应不能发电时，旁路二极管12起旁路作用，让其它太阳能芯片所产生的电流从旁路二极管流出，输入到MPPT 3中，使太阳能发电系统继续发电，不会因为某一片太阳能芯片出现问题而产生发电电路不通的情况。
本实用新型实施例又提供了一种太阳能汽车，其中，包括本实用新型任意实施例提供的太阳能电池组件，每个太阳能芯片的基板拼接后作为所述太阳能汽车的车顶。
本实用新型实施例提供的太阳能芯片、太阳能电池组件和太阳能汽车具有如下优点：
1、每个太阳能芯片均由独立的旁路二极管控制，单个太阳能芯片的影响对其他芯片无影响；
2、电池组之间的电气连接均在基板上独立完成，组成若干块独立的太阳能板后，再将独立的太阳能板正负极通过顶盖的过孔穿进车内，最终各自独立接入MPPT的相应数量通道，独立通道的影响对MPPT整体的影响小；
3、薄膜电池在粘贴过程中，将汇流导电带压贴在一起，待薄膜电池粘贴牢固之后即可实现电气连接。
4、每个太阳能芯片具有独立的基板，方便操作施工：在所有太阳能电池组件封装在线下完成之后，再安装于太阳能汽车的车顶上，利于精密定位、打孔设备精确定位操作，可实现批量化流水线作业；
5、线下安装布置旁路二极管、线束，易于操作、易于实现规范化作业。
以上依据图式所示的实施例详细说明了本实用新型的构造、特征及作用效果，以上所述仅为本实用新型的较佳实施例，但本实用新型不以图面所示限定实施范围，凡是依照本实用新型的构想所作的改变，或修改为等同变化的等效实施例，仍未超出说明书与图示所涵盖的精神时，均应在本实用新型的保护范围内。

Claims (6)

  1. 一种太阳能芯片，其特征在于，包括：
    基板，所述基板上开设有沟槽和贯通孔，所述基板上粘贴有薄膜电池；
    旁路二极管，设置在所述沟槽中；
    多条汇流导电带，分别粘贴在所述基板上，所述旁路二极管的正极和负极均设置引线，所述引线穿过所述贯通孔与所述汇流导电带对应相连；所述汇流导电带在所述基板的背面汇集成正极端和负极端。
  2. 根据权利要求1所述的太阳能芯片，其特征在于，所述沟槽位于所述薄膜电池的两侧。
  3. 根据权利要求2所述的太阳能芯片，其特征在于，所述贯通孔位于所述沟槽内。
  4. 根据权利要求1-3任一项所述的太阳能芯片，其特征在于，所述汇流导电带通过多点锡焊固定连接。
  5. 一种太阳能电池组件，包括由多个太阳能芯片构成的阵列，其特征在于，所述阵列中至少包括一个权利要求1-4任一项所述的太阳能芯片。
  6. 一种太阳能汽车，其特征在于，包括权利要求5所述的太阳能电池组件，每个太阳能芯片的基板拼接后作为所述太阳能汽车的车顶。
PCT/CN2017/101489 2017-03-22 2017-09-13 太阳能芯片、太阳能电池组件和汽车 WO2018171130A1 (zh)

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