WO2018171095A1

WO2018171095A1 - Method for preparing electronic device shell, electronic device shell and electronic device

Info

Publication number: WO2018171095A1
Application number: PCT/CN2017/093943
Authority: WO
Inventors: 张斌; 张少辉; 岳永保; 王伟
Original assignee: 华为技术有限公司
Priority date: 2017-03-20
Filing date: 2017-07-21
Publication date: 2018-09-27
Also published as: CN109076116A

Abstract

A method for preparing an electronic device shell, an electronic device shell and an electronic device, comprising: adhering a glue grasping mechanism (200) to a semi-finished shell (110); carrying out nanocrystallization processing on the semi-finished shell (110) and the glue grabbing mechanism (200) so that nano-pores are formed on the surface of the semi-finished shell (110); and forming a plastic connecting piece (300) connected to the semi-finished shell (110) and the glue grabbing mechanism (200) by means of an injection molding process. The glue grasping mechanism (200) is adhered to a semi-finished shell (110), and the glue grasping mechanism (200) is covered by liquid plastics in an injection molding process, and solidified to form. The glue grasping mechanism (200) may increase the contact area between the plastic connector (300) and the semi-finished shell (110), thereby increasing the bonding strength between the plastic connector (300) and the semi-finished shell (110), which may reduce the probability of a metal shell and the plastic connector (300) coming apart after undergoing impact and improve the reliability of an electronic product.

Description

Electronic device housing preparation method and electronic device housing and electronic device

The present application claims the priority of the Chinese patent application No. 201710166831.X filed on March 20, 2017, entitled "A method for improving the bonding strength of metal and plastic in a nano-injection technology", the entire contents of which are incorporated by reference. The way is incorporated into this text.

Technical field

The present application relates to the field of mechanical processing, and in particular, to a method for manufacturing an electronic device housing, an electronic device housing, and an electronic device.

Background technique

Metal casings have been widely used in the field of consumer electronics because of their unique hand and texture. In communication terminal products such as mobile phones and tablets, the use of a metal casing shields the antenna signal, resulting in a decline in communication quality. In order to ensure the communication quality of the communication terminal products, the current common solution is to process the slit on the metal casing, so that the antenna signal is radiated to the outside of the metal casing through the slit to improve the strength of the antenna signal. At the slotted position of the metal casing, a plastic connecting member is required for filling, and each part of the metal casing divided by the slit is connected to maintain the integrity of the metal casing.

At present, plastic joints are generally formed on the metal casing by injection molding. In order to improve the bonding strength between the metal casing and the plastic connector, nano-injection technology (NMT) is often used to combine the metal casing with the plastic. By nano-injection technology, the metal surface can be formed into tiny holes with a diameter of about 20 nm to 40 nm. The plastic penetrates into the holes of the metal surface during the injection molding process and is connected with the metal to improve the connection between the metal and the plastic. The strength of the bond between the pieces.

However, the strength of the connection between the metal casing and the plastic connector that is currently connected by nano-injection technology still cannot meet the required connection strength standard. When the electronic product is subjected to drop test or other strength test, the metal casing and the plastic are connected. After the impact, the piece still has a large probability of detachment, resulting in a decline in the reliability of the electronic product.

Summary of the invention

The embodiment of the present application provides a method for manufacturing an electronic device housing, an electronic device housing, and an electronic device.

In a first aspect, an embodiment of the present application provides a method for manufacturing an electronic device housing, including:

Bonding the gripping mechanism to the semi-finished product of the housing body;

Performing nano-processing on the shell body semi-finished product and the gripping mechanism to form a nano-hole in the surface of the shell body semi-finished product;

A plastic connector connected to the housing body semi-finished product and the gripping mechanism is formed by an injection molding process.

In the above preparation method, the rubber gripping mechanism is adhered to the semi-finished product of the shell body. During the injection molding process, the liquid plastic is coated with the gripping mechanism and solidified, and the gripping mechanism can increase the gap between the plastic connecting member and the semi-finished product of the housing body. The contact area can increase the bonding strength between the plastic connecting piece and the semi-finished product of the casing body, and the probability that the metal casing and the plastic connecting member are detached after being impacted can be reduced, thereby improving the reliability of the electronic product.

In combination with the above first aspect, in a first possible implementation of the first aspect, the bonding the glue gripping mechanism The semi-finished product of the housing body specifically includes:

Applying an adhesive to the bonding area of the semi-finished product of the housing body, and/or the bonding area of the gripping mechanism;

Bonding the bonding area of the gripping mechanism to the bonding area of the semi-finished product of the housing body;

The adhesive is cured.

By the above method, the housing body semi-finished product can be bonded to the gripping mechanism by an adhesive.

In conjunction with the first possible implementation of the first aspect, in a second possible implementation of the first aspect, the bonding area of the semi-finished product of the housing body, and/or the gripping glue The bonding area of the mechanism is coated with an adhesive, and specifically includes:

The adhesive is sprayed on the bonding area of the semi-finished product of the housing body, and/or the bonding area of the gripping mechanism.

Through the above method, the spraying adhesive can improve the coverage uniformity of the bonding area of the adhesive to the semi-finished product of the casing body or the bonding area of the rubber-gathering mechanism, thereby improving the connection strength between the semi-finished product of the casing body and the gripping mechanism. .

In conjunction with the second possible implementation of the first aspect, in a third possible implementation of the first aspect, the bonding area of the bonding region of the rubber gripping mechanism and the semi-finished product of the housing body After the bonding, the thickness of the adhesive is from 0.08 mm to 0.12 mm.

According to the above method, when the thickness of the adhesive is from 0.08 mm to 0.12 mm, the connection strength between the semi-finished product of the casing body and the gripping mechanism can be improved.

In conjunction with the third possible implementation of the first aspect, in a fourth possible implementation of the first aspect, the adhesive is a two-component acrylate adhesive.

Through the above method, the two-component acrylate adhesive has good acid and alkali resistance and high temperature resistance, and can reduce the probability of failure of the connection between the rubber gripping mechanism and the semi-finished product of the shell body in an acid-base environment, and improve the shell. The strength of the connection between the body semi-finished product and the gripping mechanism.

In conjunction with the third possible implementation of the first aspect, in a fifth possible implementation manner of the first aspect, the adhesive is a phenolic resin adhesive or an organic silicone adhesive, After the bonding area of the rubber gripping mechanism and the bonding area of the semi-finished product of the housing body are combined, the method further includes:

A sealing material is disposed on the edge of the adhesive to isolate the adhesive from the external environment.

Through the above method, in order to further reduce the production cost of the electronic device casing, the adhesive body phenolic resin adhesive or the organic silicone adhesive is used to bond the semi-finished product of the casing body and the rubber gripping mechanism. Reducing the probability that the adhesive will contact with the acid solution during the nano-treatment process, thereby causing the connection failure, and the sealing material is disposed on the edge of the adhesive to isolate the adhesive from the external environment, in the acid-base treatment process. The sealing material can reduce the probability of the adhesive contacting with the acid and alkali, thereby reducing the failure of the adhesive under the action of acid and alkali, thereby causing the probability of connection failure, and improving the housing while reducing the production cost of the electronic device housing. The strength of the connection between the body semi-finished product and the gripping mechanism.

In conjunction with the fifth possible implementation manner of the foregoing first aspect, in a sixth possible implementation manner of the first aspect, after the housing body semi-finished product and the rubber gripping mechanism are subjected to nanometer processing, include:

The sealing material is removed.

Through the above method, in order to avoid the influence of the sealing material on the formation of the plastic connecting member during the injection molding process, the sealing material needs to be removed after the nano-treatment to ensure the yield of the plastic connecting member.

In conjunction with the third possible implementation of the first aspect, in a seventh possible implementation of the first aspect, the forming a plastic connected to the housing body semi-finished product and the gripping mechanism by an injection molding process The connecting piece specifically includes:

In the injection molding process, the gripping mechanism is clamped by a clamp to keep the position between the gripping mechanism and the semi-finished product of the housing body fixed.

Through the above method, the gripping mechanism is clamped by the clamp in the injection molding process to maintain the position between the gripping mechanism and the semi-finished product of the body, thereby reducing the misalignment of the gripping mechanism caused by the impact of the plastic liquid during the injection molding process. Probability increases the yield of the electronics housing.

The first possible aspect of the first aspect, the first possible implementation of the first aspect, the second possible implementation of the first aspect, the third possible implementation of the first aspect, and the fourth possible aspect of the first aspect Implementation of the first aspect, a fifth possible implementation of the first aspect, a sixth possible implementation of the first aspect, a seventh possible implementation of the first aspect, an eighth possible In an implementation manner, before the bonding the gluing mechanism to the semi-finished product of the housing body, the method further includes:

Stamping the metal sheet to form a preform of the housing body;

Forming a rubberized structure on the preform body of the casing body by numerically machining, and obtaining the casing body semi-finished product; wherein the rubber covering structure is a portion of the casing body semi-finished product connected to the plastic connecting member.

Through the above method, the shell blank is formed by stamping the metal sheet, and the shell blank is numerically processed to obtain the shell body semi-finished product, compared with the prior art using the forged metal ingot and combined with the numerical control processing method. Less CNC machining time is required to reduce the production cost of the electronics housing.

In conjunction with the eighth possible implementation of the first aspect, in a ninth possible implementation manner of the first aspect, the forming of the housing body semi-finished product and the gripping mechanism is formed by the injection molding process After the plastic connector, it also includes:

Forming a non-adhesive structure on the preform of the casing by numerically machining; wherein the non-glued structure is a structure on the semi-finished product of the casing body that is not connected to the plastic connecting member;

The housing body semi-finished product is surface treated.

Through the above method, after the numerical control processing and surface treatment of the semi-finished product of the casing body, the finished product of the electronic device casing can be obtained.

In a second aspect, an embodiment of the present application provides an electronic device housing, including a housing body, a rubber gripping mechanism, and a plastic connecting member, wherein the plastic connecting member is coupled to the housing body and the gripping mechanism, wherein the housing body and The glue gripping mechanisms are bonded together.

In the electronic device housing, a rubber gripping mechanism is adhered to the housing body, and the plastic connecting member is connected with the housing body and the gripping mechanism, and the gripping mechanism can increase the contact area between the plastic connecting member and the semi-finished product of the housing body. Thereby, the bonding strength between the plastic connecting member and the semi-finished product of the casing body can be increased, and the probability that the metal casing and the plastic connecting member are detached after being impacted can be reduced, and the reliability of the electronic product can be improved.

In conjunction with the above second aspect, in a first possible implementation of the second aspect, the housing body is stamped and formed from a stamped sheet.

In the above electronic device casing, the casing body is stamped and formed by metal plate, which can reduce the man-hours for numerically processing the casing body and reduce the production cost of the electronic device casing.

In a third aspect, an electronic device according to the embodiment of the present application includes the electronic device housing provided in the second aspect.

In the above electronic device, a rubber gripping mechanism is adhered to the housing body of the housing, and the plastic connecting member is connected with the housing body and the gripping mechanism, and the gripping mechanism can increase the plastic connecting member and the semi-finished product of the housing body. The contact area can increase the bonding strength between the plastic connecting piece and the semi-finished product of the casing body, and the probability that the metal casing and the plastic connecting member are detached after being impacted can be reduced, thereby improving the reliability of the electronic product.

DRAWINGS

1 is a process flow diagram of a method for preparing an electronic device housing according to an embodiment of the present application;

2 is a schematic structural view of a preform of a housing body according to an embodiment of the present application;

3 is a schematic structural view of a semi-finished product of a housing body according to an embodiment of the present application;

4 is a schematic diagram of a connection relationship between a semi-finished product of a casing body and a rubber gripping mechanism according to an embodiment of the present application;

Figure 5 is a process flow diagram of the step S103 shown in Figure 1;

6 is a schematic diagram showing a connection relationship between a semi-finished product of a casing body and a plastic connecting member according to an embodiment of the present application;

Figure 7 is a perspective view of the plastic connector shown in Figure 6;

Figure 8 is a cross-sectional structural view of the plastic connector shown in Figure 6;

Figure 9 is a schematic view showing the working state of the jig in the injection molding process;

FIG. 10 is a structural schematic view of a semi-finished product of a casing body obtained by numerically machining after an injection molding process.

detailed description

The embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

Hereinafter, some of the terms in the present application will be explained to be understood by those skilled in the art.

Multiple means two or more.

In addition, it should be understood that in the description of the present application, the terms "first", "second" and the like are used only to distinguish the purpose of description, and are not to be understood as indicating or implying relative importance, nor as an indication. Or suggest the order.

The embodiment of the present invention provides a method for manufacturing an electronic device casing, which is used to solve the problem that the reliability of the electronic product is reduced due to insufficient connection strength between the metal casing and the plastic connector in the prior art.

Referring to FIG. 1 , FIG. 1 is a process flow diagram of a method for fabricating an electronic device housing according to an embodiment of the present invention. The preparation method includes:

In step S101, the metal sheet is stamped to form a preform body of the casing body.

Among them, the metal plate may be a stainless steel plate, an aluminum alloy plate, a magnesium alloy plate or a copper plate. In this embodiment, the material of the metal plate is not limited. Referring to FIG. 2, FIG. 2 is a schematic structural view of a preform of a casing body. The preform of the casing body is a shell-like or sheet-like structure formed by stamping a metal sheet, and the shell body shown in FIG. The blank 100 has a shell structure. In the specific production, after the preform of the casing body is obtained, the blank of the casing body needs to be deburred and cleaned to facilitate subsequent processing.

Step S102, forming a rubber-coated structure on the preform of the casing body by numerically machining, and obtaining a semi-finished product of the casing body.

Wherein, the rubber covering structure is a portion where the semi-finished product of the casing body is connected with the plastic connecting member. Specifically, in the case of a mobile phone and a tablet computer product, the rubber-clad structure includes an antenna opening, a headphone hole, a data interface hole, and the like, which are required to be filled with plastic. Referring to FIG. 3, FIG. 3 is a schematic structural view of a semi-finished product of a casing body. The casing body semi-finished product 110 is formed with an antenna slit 111, an earphone hole 112 and a data interface hole 113 by numerically controlled processing. In actual production, the quantity and type of the rubber-coated structure should be set and processed according to actual production requirements.

In the prior art, a metal ingot is forged and combined with a numerical control processing method to prepare a metal shell, that is, a metal ingot is forged into a preform having a certain thickness, and a rubber-coated structure is formed on the preform by numerically controlled processing. Since the thickness of the preform formed by forging is thick, the amount of cutting required is large, which increases the man-hour of numerical control machining, resulting in an increase in the cost of numerical control machining of the metal casing. In the embodiment, the blank of the shell body is formed by stamping with a metal plate. Since the thickness of the metal sheet is thin, the amount of cutting required for the preform of the shell body formed is small, so that the blank of the shell body can be reduced. The working hours of CNC machining can further reduce the cost of CNC machining.

In step S103, the rubber gripping mechanism is bonded to the semi-finished product of the housing body.

Wherein, the gripping mechanism is a part that is connected with the semi-finished product of the casing and can increase the connection strength between the plastic connecting piece and the semi-finished product of the casing. The gripping mechanism is generally a hollow or thin-walled structure and includes one or more connections. Holes, in the specific implementation, the gripping mechanism can be formed by stamping, sheet metal or casting or welding process. When the plastic connecting member is formed by the injection molding process, the liquid plastic wraps the gripping mechanism and passes through the connecting hole. After the liquid plastic solidifies and forms the plastic connecting member, the plastic connecting member and the gripping mechanism are nested with each other, thereby improving the two. The strength of the connection between them is not easy to break off after being stressed. Referring to FIG. 4, FIG. 4 is a schematic diagram showing the connection relationship between the semi-finished product of the housing body and the gripping mechanism. The housing main body 110 shown in FIG. 4 is provided with an antenna slit 111, and the housing main semi-finished product 110 is located at the antenna opening 111. The two parts of the two sides need to be connected by a plastic connecting member. Each of the two sides of the antenna opening 111 is provided with a rubber gripping mechanism 200. The inner portion of each gripping mechanism 200 is hollow and is provided with a plurality of connecting holes 210. During the injection molding process, liquid plastic fills the inside of each gripping mechanism 200, passes through each of the connecting holes 210, and wraps each of the gripping mechanisms 200, and the liquid plastic passing through the connecting holes 210 solidifies to form a pin. The structure connects the plastic connecting member and the gripping mechanism 200 to each other.

In the prior art, when the metal shell is prepared by the method of forging and numerical control processing, the gripping mechanism can also be formed on the metal blank by numerical control processing, and the semi-finished product of the shell body and the gripping mechanism are formed by cutting the same blank, 2 The one-piece structure, this method will increase the number of CNC machining hours. In this embodiment, since the rubber gripping mechanism and the semi-finished product of the housing body are not integrated, the numerical control processing for forming the gripping mechanism on the blank is not required, and the numerical control processing man-hour is reduced. In the method for manufacturing an electronic device casing provided by the embodiment, the rubber-collecting mechanism and the semi-finished product of the casing body are in surface contact connection, and the shearing strength of the bonding surface is 30 MPa or more, specifically, the rubber-collecting mechanism and the casing For example, the connection area between the bodies is 5 mm × 2 mm. It can be seen from the test that the shearing force of the gripping mechanism can be more than 300N. Therefore, the electronic device housing preparation method provided by the embodiment can meet the connection strength requirement between the rubber gripping mechanism and the housing, and the metal shell can be reduced during the actual use of the electronic device or during the drop test and other strength testing. The probability of detachment from the plastic connector. Moreover, the material of the gripping mechanism in this embodiment may be different from the semi-finished product of the housing body. Specifically, the gripping mechanism may be stainless steel, aluminum alloy or ceramic material, which increases the material selection range of the gripping mechanism.

Specifically, referring to FIG. 5, when the gripping mechanism is bonded to the semi-finished product of the housing body, the following steps are included:

In step S1031, an adhesive is applied to the bonding region of the semi-finished product of the casing body and/or the bonding region of the gripping mechanism.

Specifically, the bonding area of the semi-finished product of the housing body is an area on the surface of the semi-finished product of the housing body to be connected with the gripping mechanism, and the bonding area of the gripping mechanism is the semi-finished product of the shell body on the surface of the gripping mechanism. The area of the connection. In the process of applying the adhesive, the adhesive may be applied only to the bonding area of the semi-finished product of the housing body, or the adhesive may be applied only to the bonding area of the gripping mechanism, and may also be in the housing body. The bonding area of the semi-finished product and the bonding area of the gripping mechanism are simultaneously coated with an adhesive.

In order to improve the uniformity of application of the adhesive, in one embodiment, the adhesive is applied by spraying to the bonding area of the semi-finished product of the housing body and the bonding area of the gripping mechanism. Applying the adhesive by spraying can improve the uniformity of the distribution of the adhesive on the bonding area of the semi-finished product of the housing body and the bonding area of the gripping mechanism. When bonding the semi-finished product of the housing body and the gripping mechanism, The bubble between the semi-finished product of the casing body and the gripping mechanism is less likely to occur, and the thickness distribution of the adhesive is relatively uniform, which can improve the connection strength between the semi-finished product of the casing body and the gripping mechanism. In a specific implementation, the adhesive can be sprayed by a glue sprayer.

In addition to applying the adhesive by spraying, in other embodiments, the adhesive may be applied by application or dispensing.

In step S1032, the bonding area of the rubber gripping mechanism and the bonding area of the semi-finished product of the housing body are aligned.

Specifically, after the bonding area of the gripping mechanism and the bonding area of the semi-finished product of the housing body are combined, the housing body A layer of adhesive is formed between the semi-finished product and the gripping mechanism, and the two are connected by an adhesive layer. In order to ensure the strength of the connection between the semi-finished product of the casing body and the gripping mechanism, in one embodiment, the thickness of the adhesive formed after the bonding region of the gripping mechanism and the bonding region of the semi-finished product of the casing body are combined It is 0.08mm-0.12mm. When the thickness of the adhesive is within this range, the connection between the semi-finished product of the casing body and the gripping mechanism can be high, which satisfies the use requirement.

In step S1033, the adhesive is cured.

Specifically, the adhesive may be a one-component adhesive or a two-component adhesive. When the adhesive is cured, the adhesive may be cured at a normal temperature according to the curing property of the adhesive, or The adhesive is selected to be cured by heating, or a curing agent is selected to cure the adhesive.

In the specific implementation, due to the need for nano-treatment in the nano-injection process, it is necessary to place the glue-carrying mechanism and the shell body semi-finished product in a strong acid and alkali environment, and in the injection molding process, the glue after bonding The semi-finished product of the mechanism and the shell body needs to be in contact with the high-temperature liquid plastic, in order to reduce the probability of failure of the adhesive in the acid-base environment and the high-temperature environment, thereby ensuring the connection strength between the gripping mechanism and the semi-finished product of the shell body, the adhesive It needs to have the properties of acid and alkali resistance and high temperature resistance. In one embodiment, the adhesive is a two-component acrylate adhesive, and the acid-base resistance and high temperature resistance of the two-component acrylate adhesive can satisfy The acid and alkali resistance requirements during the nanocrystallization process and the high temperature performance requirements during the injection molding process.

Step S104, performing nano-processing on the semi-finished product of the housing body and the gripping mechanism to form a nano-hole in the surface of the semi-finished product of the housing body.

The nano-treatment process is a process of forming nano-holes on the surface of the semi-finished product of the shell body. The diameter of the nano-holes is between 20 nm and 40 nm, and the inner wall is a honeycomb structure, which can improve the between the semi-finished products of the shell body and the plastic connecting parts. The strength of the bond.

In the nano-treatment of the semi-finished product of the casing body, the currently commonly used method is the T treatment method invented by Taiseiplas Co., Ltd., in which the glue-collecting mechanism after bonding and the semi-finished product of the casing body are placed in the lye. Washing off the surface grease, and then placing the gripping mechanism and the semi-finished product of the shell body in the acid solution, etching a large-sized nano-hole on the surface of the semi-finished product of the shell body, and finally placing the gripping mechanism and the shell body semi-finished product weakly In the acidic T liquid, honeycomb nanopores are etched in the large-sized nanopores.

In addition, Chinese researchers have also developed a nano-processing method called E treatment. E treatment is a combination of electrochemical principle and chemical corrosion principle. In the process, the semi-finished product of the shell body is also stepped into the alkali. In liquid and acid.

When the material of the gripping mechanism is made of metal, the nano-holes are also formed on the gripping mechanism during the nano-processing process. In the subsequent injection molding process, the nano-holes on the gripping mechanism can improve the connection between the gripping mechanism and the plastic. The strength of the bond between the pieces.

Step S105, forming a plastic connecting member connected to the housing body semi-finished product and the gripping mechanism by an injection molding process.

Among them, the injection molding process is realized by in-mold injection molding. Specifically, polyphenylenesulphide (PPS) plastic, polybutylene terephthalate (PBT) plastic, poly-o-phthalene can be used for the plastic. Injection molding fluidity materials such as polyphthalamide (PPA) plastic or polyamide 66 (Polyamide 66; PA66) plastic. In the injection molding process, the liquid plastic fills the antenna opening, the earphone hole and the like on the semi-finished product of the shell body, and wraps the gripping mechanism to connect the semi-finished parts of the shell body which are divided by the antenna slit. 6 to 8, FIG. 6 is a schematic view showing the connection relationship between the semi-finished product of the casing body and the plastic connecting member, FIG. 7 is a perspective view of the plastic connecting member shown in FIG. 6, and FIG. 8 is a plastic connecting device shown in FIG. Sectional structure of the piece It is intended that, as shown in FIG. 6, the plastic connecting member 300 is connected to the housing body semi-finished product 100. As shown in FIG. 7, the plastic connecting member 300 wraps the two gripping mechanisms 200, as shown in FIG. 8, the plastic connecting member 300 and The rubber gripping mechanisms 200 are nested one inside the other.

In the injection molding process, the gripping mechanism is subjected to the impact of high temperature liquid plastic, in order to reduce the probability of the gripping mechanism being misaligned in the high temperature environment. In a specific embodiment, the gripping mechanism can be clamped by the clamp in the injection molding process. The gripping mechanism keeps the position between the gripping mechanism and the semi-finished product of the housing body fixed. Referring to FIG. 9, FIG. 9 is a schematic view showing the working state of the jig during the injection molding process. Specifically, the jig can be realized by the die pressing pin 400 shown in FIG. 9, and the die pressing pin 400 can press the gripping mechanism 200. The position between the gripping mechanism 200 and the housing body blank 110 is maintained fixed, and the mold presser 400 is removed after the injection molding process is completed.

Step S106, forming a non-glued structure on the preform blank by numerical control processing.

The non-glued structure is a structure on the semi-finished product of the housing body that is not connected to the plastic connecting member; specifically, the camera hole, the fingerprint sensor hole and the like. Referring to FIG. 10, FIG. 10 is a schematic structural view of a semi-finished product of a casing body obtained by numerically machining after an injection molding process. In the semi-finished product 110 of the casing body shown in FIG. 10, an antenna slit 111, an earphone hole 112 and a data line interface are shown. The holes 113 are each filled with a plastic connecting member, and the camera hole 114 and the fingerprint sensor hole 115 are formed by numerically processing. In the specific implementation, after the numerical control processing process, the semi-finished product of the housing body needs to be deburred for subsequent processing operations.

Step S107, performing surface treatment on the semi-finished product of the casing body.

In the specific implementation, the surface treatment process includes: a polishing process, a cleaning process, a sandblasting process, an anodizing process, and a laser engraving process. After the surface treatment process, the finished electronic device casing can be obtained.

In the above step S103, in addition to bonding with a two-component acrylate adhesive having good acid and alkali resistance and heat resistance, in order to reduce the cost of the adhesive, in other embodiments, phenolic can also be used. The resin adhesive or the organic silicone adhesive adheres to the gripping mechanism and the semi-finished product of the shell body, and the acid-base resistance of the phenolic resin adhesive or the organic silicone adhesive is compared with the two-component acrylate adhesive. In order to reduce the connection failure between the gripping mechanism and the semi-finished product of the housing body due to acid-base corrosion during the nano-forming process, the sealing material may be used to seal the edge of the adhesive to reduce the adhesive in the nano-treatment. In the process of contact with acid and alkali, in a specific embodiment, when the adhesive is a two-component acrylate adhesive, the bonding area of the bonding area of the gripping mechanism and the semi-finished product of the housing body is After the combination, the sealing material is disposed on the edge of the adhesive to isolate the adhesive from the external environment.

Specifically, the sealing material may be made of titanium, silicon dioxide or ceramics or the like. The sealing material can be arranged as an annular sheet structure, and the inner ring can be arranged according to the shape of the outer contour of the adhesive between the corresponding gripping mechanism and the semi-finished product of the housing body, in the bonding area of the gripping mechanism and the shell After the bonding regions of the body body semi-finished products are combined, the sealing material is inserted between the rubber picking mechanism and the semi-finished product of the casing body, thereby functioning to isolate the external environment from the adhesive.

In order to further reduce the production cost of the electronic device casing, the sealing material is used when bonding the semi-finished product of the casing body and the rubber-collecting mechanism by using a phenolic resin adhesive or an organic silicone adhesive which is generally resistant to acid and alkali. It is disposed at the edge of the adhesive to isolate the adhesive from the external environment. In the acid-base treatment process, the sealing material can reduce the probability of the adhesive contacting the acid and alkali, thereby reducing the adhesive under the action of acid and alkali. The failure, which in turn leads to the failure of the connection, can improve the connection strength between the semi-finished product of the housing body and the gripping mechanism while reducing the production cost of the electronic device housing.

In a specific embodiment, after the sealing material is sealed by the sealing material and subjected to the nano-treatment process, in the injection molding process, in order to avoid the influence of the sealing material on the formation of the plastic connecting member during the injection molding process, After the nano-processing of the shell body semi-finished product and the gripping mechanism, the method further includes: removing the sealing material. It can avoid the influence of the sealing material on the formation of the plastic connecting piece during the injection molding process and ensure the yield of the plastic connecting piece.

The electronic device housing preparation method provided in this embodiment can be applied to a housing manufacturing process of a mobile phone, a tablet computer, a notebook computer, and a smart wearable device. The production yield of the electronic device housing can be improved, and the production cost of the electronic device housing can be reduced.

Based on the same inventive concept, an embodiment of the present application further provides an electronic device housing, including a housing body, a rubber gripping mechanism, and a plastic connecting member, wherein the plastic connecting member is coupled to the housing body and the gripping mechanism, wherein the housing body Bonding with the gripping mechanism. Specifically, the electronic device housing provided by the embodiment can be applied to a mobile phone, a tablet computer, a notebook computer or a smart wearable device.

In the electronic device casing provided by the embodiment of the present application, a rubber gripping mechanism is adhered to the shell body, the plastic connecting member is connected with the shell body and the gripping mechanism, and the gripping mechanism can increase the plastic connecting member and the semi-finished product of the shell body. The contact area between the two can increase the bonding strength between the plastic connecting member and the semi-finished product of the casing body, and the probability of the metal casing and the plastic connecting member being detached after being impacted is reduced, thereby improving the reliability of the electronic product.

In a specific embodiment, the housing body is stamped and formed from stamped sheet metal. The working time of the numerical control processing on the housing body can be reduced, and the production cost of the electronic device housing is reduced.

Based on the same inventive concept, an embodiment of the present application further provides an electronic device, including the above electronic device housing. Specifically, the electronic device provided in this embodiment may be a mobile phone, a tablet computer, a notebook computer, or a smart wearable device.

In the electronic device provided by the embodiment of the present application, a rubber gripping mechanism is adhered to the shell body of the housing, and the plastic connecting component is connected with the shell body and the gripping mechanism, and the gripping mechanism can increase the plastic connecting member and the shell. The contact area between the semi-finished products of the body, thereby increasing the bonding strength between the plastic connecting piece and the semi-finished product of the casing body, so that the probability of the metal casing and the plastic connecting piece being detached after being impacted is reduced, and the reliability of the electronic product is improved. Sex.

It is apparent that those skilled in the art can make various changes and modifications to the embodiments of the present application without departing from the spirit and scope of the embodiments of the present application. Thus, it is intended that the present invention cover the modifications and variations of the embodiments of the present invention.

Claims

A method for preparing an electronic device housing, comprising:

Bonding the gripping mechanism to the semi-finished product of the housing body;

Performing nano-processing on the shell body semi-finished product and the gripping mechanism to form a nano-hole in the surface of the shell body semi-finished product;

A plastic connector connected to the housing body semi-finished product and the gripping mechanism is formed by an injection molding process.
The method of manufacturing a casing of an electronic device according to claim 1, wherein the bonding the gluing mechanism to the semi-finished product of the casing body comprises:

Applying an adhesive to the bonding area of the semi-finished product of the housing body, and/or the bonding area of the gripping mechanism;

Bonding the bonding area of the gripping mechanism to the bonding area of the semi-finished product of the housing body;

The adhesive is cured.
The method of manufacturing an electronic device casing according to claim 2, wherein the bonding area of the semi-finished product of the casing body and/or the bonding area of the gluing mechanism is coated with an adhesive Specifically, including:

The adhesive is sprayed on the bonding area of the semi-finished product of the housing body, and/or the bonding area of the gripping mechanism.
The method of manufacturing an electronic device casing according to claim 3, wherein the thickness of the adhesive after the bonding area of the rubber picking mechanism is combined with the bonding area of the semi-finished product of the housing body It is 0.08mm-0.12mm.
The method of manufacturing an electronic device casing according to claim 4, wherein the adhesive is a two-component acrylate adhesive.
The method for preparing an electronic device casing according to claim 4, wherein the adhesive is a phenolic resin adhesive or an organic silicone adhesive, and the bonding region of the rubber gripping mechanism is After the bonding area of the semi-finished product of the housing body is combined, the method further includes:

A sealing material is disposed on the edge of the adhesive to isolate the adhesive from the external environment.
The method of manufacturing the electronic device housing according to claim 6, wherein after the nano-finishing treatment of the housing body semi-finished product and the gripping mechanism, the method further comprises:

The sealing material is removed.
The method of manufacturing a housing of an electronic device according to claim 4, wherein the forming a plastic connector connected to the housing body semi-finished product and the gripping mechanism by an injection molding process comprises:

In the injection molding process, the gripping mechanism is clamped by a clamp to keep the position between the gripping mechanism and the semi-finished product of the housing body fixed.
The method for manufacturing an electronic device casing according to any one of claims 1 to 8, wherein before the bonding the gluing mechanism to the semi-finished product of the casing body, the method further comprises:

Stamping the metal sheet to form a preform of the casing;

Forming a rubber-clad structure on the preform of the casing by a numerical control process, and obtaining the semi-finished product of the casing body; wherein the rubber-coated structure is a structure connected to the plastic connecting member on the semi-finished product of the casing body.
The method of manufacturing a housing of an electronic device according to claim 9, further comprising: after the forming a plastic connector connected to the housing body semi-finished product and the gripping mechanism by an injection molding process, further comprising:

Forming a non-glued structure on the preform blank by numerically controlled machining; wherein the non-glued structure is the shell a structure on the body semi-finished product that is not connected to the plastic connecting member;

The housing body semi-finished product is surface treated.
An electronic device housing, comprising: a housing body, a rubber gripping mechanism and a plastic connecting member, wherein the plastic connecting member is coupled to the housing body and the gripping mechanism, wherein the housing body And the rubber gripping mechanism is bonded by an adhesive.
The electronic device housing according to claim 11, wherein the housing body is stamped and formed from a stamped sheet.
An electronic device comprising the electronic device housing of claim 11 or 12.