CN109076116A - A kind of electronic equipment shell preparation method and casting of electronic device, electronic equipment - Google Patents
A kind of electronic equipment shell preparation method and casting of electronic device, electronic equipment Download PDFInfo
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- CN109076116A CN109076116A CN201780022679.6A CN201780022679A CN109076116A CN 109076116 A CN109076116 A CN 109076116A CN 201780022679 A CN201780022679 A CN 201780022679A CN 109076116 A CN109076116 A CN 109076116A
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Abstract
A kind of electronic equipment shell preparation method and casting of electronic device, electronic equipment, comprising: gluing mechanism (200) will be grabbed and be adhered to enclosure body semi-finished product (110)；Nanosizing processing is carried out to the enclosure body semi-finished product (110) and described grab gluing mechanism (200), the surface of the enclosure body semi-finished product (110) is made to form nano aperture；It is formed and the enclosure body semi-finished product (110) and the plastic fastening (300) grabbing gluing mechanism (200) and connecting by Shooting Technique.Bonding grabs gluing mechanism (200) on enclosure body semi-finished product (110), in injection molding process, liquid plastic cladding grabs gluing mechanism (200) and coagulation forming, contact area between plastic fastening (300) and enclosure body semi-finished product (110) can be increased by grabbing gluing mechanism (200), so as to increase the bond strength between plastic fastening (300) and enclosure body semi-finished product (110), the probability that metal shell and plastic fastening (300) can be made to be detached from after being impacted reduces, and improves the reliability of electronic product.
Description
This application claims the priority of the Chinese patent application of the application number 201710166831.X of entitled " improving the method for metal and plastic cement binding force in a kind of nanometer of injection molding technology " for submitting on 03 20th, 2017, entire contents are incorporated herein by way of introduction in this.
This application involves field of machining, in particular to a kind of electronic equipment shell preparation method and casting of electronic device, electronic equipment.
Metal shell has been widely used at present because it is with unique feel and texture in consumer electrical product field.In mobile phone and this kind of telecom terminal product of tablet computer, its aerial signal can be caused to shield using metal shell, communication quality is caused to decline.For the communication quality for guaranteeing telecom terminal product, currently used solution is to process to crack on metal shell, is radiated aerial signal outside metal shell by cracking, to improve the intensity of aerial signal.It need to be filled using plastic fastening at the position of cracking of metal shell, and connect each section metal shell for segmentation of being cracked, keep the integrality of metal shell.
Plastic fastening is generally formed on metal shell using injection moulding at present, in order to improve the bond strength of metal shell and plastic fastening, now frequently with nanometer injection molding technology (Nano Forming Technology；NMT) metal shell is combined with plastics, nanometer injection molding technology is by carrying out nanosizing processing to metal surface, metal surface can be made to form diameter in the small hole of 20nm-40nm or so, plastics penetrate into the hole of metal surface in injection moulding process and are connected with metal, and the bond strength between metal and plastic fastening can be improved.
However, required bonding strength standard is not able to satisfy still using the bonding strength between the metal shell and plastic fastening of the connection of nanometer injection molding technology at present, when carrying out drop test or other strength tests to electronic product, metal shell and plastic fastening still have biggish probability to be detached from after being impacted, and lead to the reliability decrease of electronic product.
Summary of the invention
The embodiment of the present application provides a kind of electronic equipment shell preparation method and casting of electronic device, electronic equipment.
In a first aspect, the embodiment of the present application provides a kind of electronic equipment shell preparation method, comprising:
Gluing mechanism will be grabbed and be adhered to enclosure body semi-finished product；
Nanosizing processing is carried out to the enclosure body semi-finished product and the gluing mechanism of grabbing, the surface of the enclosure body semi-finished product is made to form nano aperture；
It is formed and the enclosure body semi-finished product and the plastic fastening grabbing gluing mechanism and connecting by Shooting Technique.
In above-mentioned preparation method, bonding grabs gluing mechanism on enclosure body semi-finished product, in injection molding process, liquid plastic cladding grabs gluing mechanism and coagulation forming, contact area between plastic fastening and enclosure body semi-finished product can be increased by grabbing gluing mechanism, so as to increase the bond strength between plastic fastening and enclosure body semi-finished product, the probability that metal shell and plastic fastening can be made to be detached from after being impacted is reduced, and improves the reliability of electronic product.
With reference to the above first aspect, in the first possible implementation of the first aspect, the gluing mechanism that will grab is adhered to
Enclosure body semi-finished product, specifically include:
In the bonding region of the enclosure body semi-finished product, and/or, the bonding region coating adhesive for grabbing gluing mechanism；
By the bonding region pairing of the bonding region for grabbing gluing mechanism and the enclosure body semi-finished product；
Solidify the bonding agent.
It, can be Nian Jie with gluing mechanism is grabbed by enclosure body semi-finished product by bonding agent by the above method.
The possible implementation of with reference to the above first aspect the first, in the second possible implementation of the first aspect, the bonding region in the enclosure body semi-finished product, and/or, the bonding region coating adhesive for grabbing gluing mechanism specifically includes:
The bonding agent is sprayed to the bonding region of the enclosure body semi-finished product, and/or, the bonding region for grabbing gluing mechanism.
By the above method, bonding agent is can be improved to the covering uniformity of the bonding region of enclosure body semi-finished product or the bonding region for grabbing gluing mechanism in spraying adhesive, and then is improved enclosure body semi-finished product and grabbed the bonding strength between gluing mechanism.
The possible implementation of second with reference to the above first aspect, in a third possible implementation of the first aspect, after the bonding region pairing of the bonding region for grabbing gluing mechanism and the enclosure body semi-finished product, the bonding agent with a thickness of 0.08mm-0.12mm.
By the above method, when bonding agent is with a thickness of 0.08mm-0.12mm, enclosure body semi-finished product can be improved and grab the bonding strength between gluing mechanism.
The third possible implementation with reference to the above first aspect, in a fourth possible implementation of the first aspect, the bonding agent are two-component acrylicester adhesive.
Pass through the above method, the acid-proof alkaline and high temperature resistance of two-component acrylicester adhesive are preferable, it can reduce and grab the probability that being connected between gluing mechanism and enclosure body semi-finished product is failed under acid or alkali environment, improve enclosure body semi-finished product and grab the bonding strength between gluing mechanism.
The third possible implementation with reference to the above first aspect, in the fifth possible implementation of the first aspect, the bonding agent is that phenolic resin class adhesive or organic silica gel class stick agent, after the bonding region pairing by the bonding region for grabbing gluing mechanism and the enclosure body semi-finished product, further includes:
Sealing material is set to the edge of the bonding agent, so that the bonding agent is isolated with external environment.
Pass through the above method, for the production cost for further decreasing casting of electronic device, agent bonding enclosure body semi-finished product are sticked using the more general bonding agent phenolic resin class adhesive of acid-proof alkaline or organic silica gel class and grab gluing mechanism, it is contacted in nanosizing treatment process with acidolysis to reduce bonding agent, and then lead to the probability of Joint failure, the edge of bonding agent is set to using sealing material, so that bonding agent is isolated with external environment, then in soda acid treatment process, sealing material can reduce the probability that bonding agent is contacted with soda acid, bonding agent is thereby reduced to fail under acid-base function, and then lead to the probability of Joint failure, enclosure body semi-finished product can be improved while reducing the production cost of casting of electronic device and grab the bonding strength between gluing mechanism.
The 5th kind of possible implementation with reference to the above first aspect, in the sixth possible implementation of the first aspect, it is described to the enclosure body semi-finished product and it is described grab gluing mechanism carry out nanosizing processing after, further includes:
Remove the sealing material.
By the above method, to avoid the sealing material in injection moulding process from impacting the formation of plastic fastening, need to remove sealing material after carrying out nanosizing processing, to guarantee the yield of plastic fastening.
The third possible implementation with reference to the above first aspect, it is in a seventh possible implementation of the first aspect, described by Shooting Technique formation and the enclosure body semi-finished product and the plastic fastening grabbing gluing mechanism and connecting, it specifically includes:
By grabbing gluing mechanism described in fixture clamping in the Shooting Technique, it is kept fixed the position grabbed between gluing mechanism and the enclosure body semi-finished product.
Pass through the above method, gluing mechanism clamping will be grabbed by fixture in Shooting Technique, to keep grabbing the position between gluing mechanism and ontology semi-finished product, can reduce and grab gluing mechanism in injection moulding process, the probability of the dislocation generated when being impacted by plastic liquid, improves the yield of casting of electronic device.
With reference to the above first aspect, the possible implementation of the first of first aspect, second of possible implementation of first aspect, the third possible implementation of first aspect, the 4th kind of possible implementation of first aspect, the 5th kind of possible implementation of first aspect, the 6th kind of possible implementation of first aspect, the 7th kind of possible implementation of first aspect, in the 8th kind of possible implementation of first aspect, it will be grabbed before gluing mechanism is adhered to enclosure body semi-finished product described, further includes:
Punching press is carried out to sheet metal, forms enclosure body just base；
By numerical control processing at the beginning of the enclosure body on base formed cover plastic structure, obtain the enclosure body semi-finished product；Wherein, the plastic structure that covers is the part that the enclosure body semi-finished product are connect with the plastic fastening.
Pass through the above method, base at the beginning of forming enclosure body using metallic plate punching, and numerical control processing is carried out to base at the beginning of enclosure body and obtains enclosure body semi-finished product, compared with the method processed in the prior art using forging and stamping metal ingot and combining with digital control, required numerical control processing working hour is less, can reduce the production cost of casting of electronic device.
The 8th kind of possible implementation with reference to the above first aspect, in the 9th kind of possible implementation of first aspect, it is described formed by Shooting Technique with the enclosure body semi-finished product and it is described grab the plastic fastening that gluing mechanism is connect after, further includes:
Non- plastic structure is covered being formed on base at the beginning of the shell by numerical control processing；Wherein, the non-plastic structure that covers is the structure not connecting with the plastic fastening on the enclosure body semi-finished product；
The enclosure body semi-finished product are surface-treated.
Casting of electronic device finished product can be obtained after carrying out numerical control processing and surface treatment to enclosure body semi-finished product by the above method.
Second aspect, the embodiment of the present application provide a kind of electronic equipment shell, including enclosure body, grab gluing mechanism and plastic fastening, plastic fastening and enclosure body and grab gluing mechanism and connect, wherein the enclosure body and described grab are bonded between gluing mechanism.
In above-mentioned casting of electronic device, it is bonded in enclosure body and grabs gluing mechanism, it plastic fastening and enclosure body and grabs gluing mechanism and connect, contact area between plastic fastening and enclosure body semi-finished product can be increased by grabbing gluing mechanism, so as to increase the bond strength between plastic fastening and enclosure body semi-finished product, the probability that metal shell and plastic fastening can be made to be detached from after being impacted reduces, and improves the reliability of electronic product.
In conjunction with above-mentioned second aspect, in the first possible implementation of the second aspect, the enclosure body is by pressing sheet material punch forming.
In above-mentioned casting of electronic device, enclosure body is formed using metallic plate punching, can be reduced the working hour for carrying out numerical control processing to enclosure body, be reduced the production cost of casting of electronic device.
The third aspect, the embodiment of the present application a kind of electronic equipment, the casting of electronic device provided including above-mentioned second aspect.
In above-mentioned electronic equipment, it is bonded in enclosure body in its shell and grabs gluing mechanism, it plastic fastening and enclosure body and grabs gluing mechanism and connect, contact area between plastic fastening and enclosure body semi-finished product can be increased by grabbing gluing mechanism, so as to increase the bond strength between plastic fastening and enclosure body semi-finished product, the probability that metal shell and plastic fastening can be made to be detached from after being impacted reduces, and improves the reliability of electronic product.
Fig. 1 is the process flow chart of casting of electronic device preparation method provided by the embodiments of the present application；
Fig. 2 is that the embodiment of the present application provides a kind of structural schematic diagram of first base of enclosure body；
Fig. 3 is a kind of structural schematic diagram of enclosure body semi-finished product provided by the embodiments of the present application；
Fig. 4 is enclosure body semi-finished product provided by the embodiments of the present application and the connection relationship diagram for grabbing gluing mechanism；
Fig. 5 is the process flow chart of step S103 shown in Fig. 1；
Fig. 6 is the connection relationship diagram of enclosure body semi-finished product and plastic fastening provided by the embodiments of the present application；
Fig. 7 is the perspective view of plastic fastening shown in fig. 6；
Fig. 8 is the schematic diagram of the section structure of plastic fastening shown in fig. 6；
Fig. 9 is the working state schematic representation of fixture in injection moulding process；
Figure 10 is the structural schematic diagram that the enclosure body semi-finished product that numerical control processing obtains are carried out after Shooting Technique.
The embodiment of the present application is described in further detail below in conjunction with attached drawing.
Hereinafter, the part term in the application is explained, so as to those skilled in the art understand that.
It is multiple, refer to two or more.
In addition, it is necessary to understand, in the description of the present application, the vocabulary such as " first ", " second " are only used for distinguishing the purpose of description, are not understood to indicate or imply relative importance, can not be interpreted as indication or suggestion sequence.
The embodiment of the present application provides a kind of electronic equipment shell preparation method, to solve the problems, such as the reliability decrease of electronic product caused by the bonding strength between metal shell and plastic fastening in the prior art is insufficient.
Shown in Figure 1, Fig. 1 is the process flow chart of casting of electronic device preparation method provided in this embodiment, which includes:
Step S101 carries out punching press to sheet metal, forms enclosure body just base.
Wherein, sheet metal can be used stainless steel materials, aluminum alloy plate materials, magnesium alloy plate or copper sheet material, in the present embodiment with no restrictions to the material of sheet metal.Shown in Figure 2, Fig. 2 is a kind of structural schematic diagram of first base of enclosure body, and just base is the shelly-shaped or laminated structure formed after sheet metal is stamped to enclosure body, and just base 100 is shell-like structure to enclosure body shown in Fig. 2.In specific production, after the base at the beginning of obtain enclosure body, also need to carry out deburring processing and cleaning treatment to base at the beginning of enclosure body, in order to subsequent processing.
Step S102, by numerical control processing at the beginning of enclosure body on base formed cover plastic structure, obtain enclosure body semi-finished product.
Wherein, covering plastic structure is the part that enclosure body semi-finished product are connect with plastic fastening.Specifically, by taking mobile phone and plate computer product as an example, covering plastic structure includes that antenna cracks, earpiece holes, data-interface hole etc. need to carry out the structure of filling plastic.Shown in Figure 3, Fig. 3 is a kind of structural schematic diagram of enclosure body semi-finished product, is formed with antenna by numerical control processing on the enclosure body semi-finished product 110 and cracks 111, earpiece holes 112 and data interface holes 113.In actual production, the value volume and range of product for covering plastic structure should be configured and process according to actual production demand.
Metal shell is generally prepared using the method for metal ingot forging and stamping combining with digital control processing in the prior art, i.e., is forged into metal ingot with certain thickness just base, then formed on first base by numerical control processing and cover plastic structure.Due to forging and stamping formed first base thickness it is thicker, needed for cutting output it is larger, increase the working hour of numerical control processing, lead to the numerical control processing increased costs of metal shell.And enclosure body just base is formed using metallic plate punching in the present embodiment, due to the thinner thickness of sheet metal, cutting output needed for the first base of its enclosure body formed is less, therefore can reduce the working hour of the numerical control processing to base at the beginning of enclosure body, and then can reduce numerical control processing cost.
Step S103 will grab gluing mechanism and be adhered to enclosure body semi-finished product.
Wherein, grabbing gluing mechanism is that the part for increasing the bonding strength between plastic fastening and shell semi-finished product is connect and can played with shell semi-finished product, it grabs gluing mechanism and is generally hollow out or thin-wall construction, and including one or more connecting holes, in specific implementation, punching press, metal plate or casting can be used or gluing mechanism is grabbed in welding procedure formation.When forming plastic fastening by Shooting Technique, liquid plastic can wrap up grabs gluing mechanism and pass through connecting hole, after liquid plastic solidify and forms plastic fastening, plastic fastening with grab gluing mechanism connection nested against one another, bonding strength between the two is improved, is not easily disconnected from after stress.It is shown in Figure 4, Fig. 4 is enclosure body semi-finished product and the connection relationship diagram for grabbing gluing mechanism, enclosure body semi-finished product 110 shown in Fig. 4 are equipped with antenna and crack 111, enclosure body semi-finished product 110 are located at crack two parts of 111 two sides of antenna and need to be attached using plastic fastening, it is respectively provided with one in crack 111 two sides of antenna and grabs gluing mechanism 200, each grab the inner hollow of gluing mechanism 200, and it is equipped with multiple connecting holes 210, in injection moulding process, the inside of gluing mechanism 200 is each grabbed in liquid plastic filling, and pass through each connecting hole 210, and each gluing mechanism 200 of grabbing is wrapped, liquid plastic across connecting hole 210 forms pin shaft structure after solidification, make plastic fastening and grabs the connection nested against one another of gluing mechanism 200.
In the prior art when the method using forging and stamping and numerical control processing prepares metal shell, can also by numerical control processing at the beginning of metal on base formed grab gluing mechanism, it enclosure body semi-finished product and grabs gluing mechanism base as at the beginning of same part and cuts and formed, the two is an integral structure, and this method will increase numerical control processing working hour.In the present embodiment, it is not integral structure due to grabbing gluing mechanism and enclosure body semi-finished product, does not need to carry out forming the numerical control processing for grabbing gluing mechanism on first base, reduce numerical control processing working hour.In casting of electronic device preparation method provided in this embodiment, it grabs and is connected between gluing mechanism and enclosure body semi-finished product for face contact, the shear strength of its bonding plane is in 30MPa or more, specifically, for grabbing the connection area between gluing mechanism and enclosure body as 5mm × 2mm, by test it is found that grabbing shearing force that gluing mechanism can be born in 300N or more.Therefore casting of electronic device preparation method provided in this embodiment can meet the bonding strength demand grabbed between gluing mechanism and shell, during the actual use of electronic equipment or progress drop test and other strength tests, the probability being detached between metal shell and plastic fastening can be reduced.Moreover, the material for grabbing gluing mechanism in the present embodiment can be different from enclosure body semi-finished product, specifically, grabbing gluing mechanism can be stainless steel, aluminium alloy or ceramic material, increase the material selection range for grabbing gluing mechanism.
Specifically, shown in Figure 5, when that will grab gluing mechanism and be adhered to enclosure body semi-finished product, include the following steps:
Step S1031, in the bonding region of enclosure body semi-finished product, and/or, grab the bonding region coating adhesive of gluing mechanism.
Specifically, for the bonding region of enclosure body semi-finished product to need and grabbing gluing mechanism the region being connected on the surface of enclosure body semi-finished product, the bonding region for grabbing gluing mechanism is the region for needing to be connected with enclosure body semi-finished product on the surface for grab gluing mechanism.During coating adhesive, it can be only in the bonding region coating adhesive of enclosure body semi-finished product, can also only in the bonding region coating adhesive for grabbing gluing mechanism, can also enclosure body semi-finished product bonding region and grab gluing mechanism bonding region simultaneously coating adhesive.
For the coating homogeneity for improving bonding agent, in a kind of specific embodiment, bonding agent using be coated on by the way of spraying the bonding regions of enclosure body semi-finished product on the bonding region for grabbing gluing mechanism.Using spraying method coating adhesive, distributing homogeneity of the bonding agent on the bonding region of enclosure body semi-finished product and the bonding region for grabbing gluing mechanism can be improved, when being bonded enclosure body semi-finished product and grabbing gluing mechanism, it enclosure body semi-finished product and grabs and is not likely to produce bubble between gluing mechanism, and the thickness distribution of bonding agent is more uniform, and enclosure body semi-finished product can be improved and grab the bonding strength between gluing mechanism.In specific implementation, glue sprayer spraying adhesive can be used.
In addition to using spraying method coating adhesive, in other embodiments, smearing, dispensing mode coating adhesive also can be used.
Step S1032 will grab the bonding region pairing of the bonding region and enclosure body semi-finished product of gluing mechanism.
Specifically, after the bonding region pairing of the bonding region and enclosure body semi-finished product that will grab gluing mechanism, enclosure body
Semi-finished product and one layer of adhesive layer of formation is grabbed between gluing mechanism, the two passes through adhesive layer connection.To guarantee enclosure body semi-finished product and grabbing the bonding strength between gluing mechanism, in a kind of specific embodiment, the bonding agent that is formed after the bonding region pairing of the bonding region and enclosure body semi-finished product of grabbing gluing mechanism with a thickness of 0.08mm-0.12mm.The thickness of bonding agent within this range when can make enclosure body semi-finished product and grab bonding strength with higher between gluing mechanism, satisfy the use demand.
Step S1033, solidifies bonding agent.
Specifically, bonding agent can be single component adhesive or two-component bonding agent, when solidifying bonding agent, according to the curing performance of bonding agent, it may be selected to solidify bonding agent at normal temperature, or selection solidifies bonding agent by heating, or selection solidifies bonding agent using curing agent.
In specific implementation, due to needing to carry out nanosizing processing in nanometer Shooting Technique, gluing mechanism of grabbing after needing to be bonded is placed in strong acid and strong base environment with enclosure body semi-finished product, and in injection moulding process, gluing mechanism of grabbing after bonding needs to contact with the liquid plastic of high temperature with enclosure body semi-finished product, to reduce the probability that bonding agent fails under acid or alkali environment and hot environment, and then guarantee to grab the bonding strength between gluing mechanism and enclosure body semi-finished product, bonding agent need to have acid and alkali-resistance and performance resistant to high temperature, in a kind of specific embodiment, bonding agent is two-component acrylicester adhesive, the acid-proof alkaline and high temperature resistance of two-component acrylicester adhesive can meet the acid-proof alkaline demand in nanosizing treatment process, and the high temperature resistance demand in injection moulding process.
Step S104 to enclosure body semi-finished product and grabs gluing mechanism progress nanosizing processing, the surface of enclosure body semi-finished product is made to form nano aperture.
Wherein, nanosizing processing is to form the treatment process of nano aperture on the surface of enclosure body semi-finished product, and for the diameter of nano aperture between 20nm-40nm, inner wall is honeycomb structure, and the bond strength between enclosure body semi-finished product and plastic fastening can be improved.
When carrying out nanosizing processing to enclosure body semi-finished product, currently used method is the T processing method of Japanese great achievement plastics (Taiseiplas) Co., Ltd. invention, gluing mechanism of grabbing after will being bonded is placed in lye with enclosure body semi-finished product, wash away surface grease, gluing mechanism will be grabbed again and enclosure body semi-finished product are placed in acid solution, larger-size nano aperture is etched on the surface of enclosure body semi-finished product, gluing mechanism will finally be grabbed and enclosure body semi-finished product are placed in weakly acidic T liquid, cellular nano hole is etched in larger-size nano aperture.
In addition, China researcher has also developed the nanosizing processing method of referred to as E processing, E processing is that equally enclosure body semi-finished product substep need to be placed in lye and acid solution during processing using processing mode of the electrochemical principle in conjunction with chemical attack principle.
When the material for grabbing gluing mechanism is metal material, then nano aperture can be equally formed on grabbing gluing mechanism in nanosizing treatment process, in subsequent Shooting Technique, grabbing the nano aperture on gluing mechanism can be improved the bond strength grabbed between gluing mechanism and plastic fastening.
Step S105 is formed and the enclosure body semi-finished product and the plastic fastening grabbing gluing mechanism and connecting by Shooting Technique.
Wherein, Shooting Technique realizes that specifically, polyphenylene sulfide (Polyphenylenesulphide can be used in plastics using in-mould injection method；PPS) plastics, polybutylene terephthalate (PBT) (Polybutylene Terephthalate；PBT) plastics, polyphthalamide (Polyphthalamide；PPA) plastics or polyamide 66 (Polyamide 66；PA66) the preferable material of the Injection Moldings such as plastics.In injection moulding process, liquid plastic cracks the antenna on enclosure body semi-finished product, earpiece holes etc. cover plastic structure filling, and will grab gluing mechanism package, and a few partial shell ontology semi-finished product for the segmentation that makes to be cracked by antenna are connected.Referring to shown in Fig. 6-Fig. 8, Fig. 6 is the connection relationship diagram of enclosure body semi-finished product and plastic fastening, and Fig. 7 is the perspective view of plastic fastening shown in fig. 6, and Fig. 8 is that the cross-section structure of plastic fastening shown in fig. 6 shows
Be intended to, as shown in fig. 6, plastic fastening 300 is connect with enclosure body semi-finished product 100, wrapped up as shown in fig. 7, plastic fastening 300 grabs gluing mechanism 200 for two, as shown in figure 8, plastic fastening 300 with grab the connection nested against one another of gluing mechanism 200.
In injection moulding process, grabbing gluing mechanism will receive the impact of liquid plastics of high temperature, the probability that dislocation is generated when gluing mechanism is impacted under high temperature environment is grabbed to reduce, in a kind of specific embodiment, gluing mechanism can be grabbed by fixture clamping in Shooting Technique, be kept fixed the position grabbed between gluing mechanism and enclosure body semi-finished product.It is shown in Figure 9, Fig. 9 show the working state schematic representation of fixture in injection moulding process, specifically, fixture can be used mold pressing 400 shown in Fig. 9 and realize, mold pressing 400 can will grab gluing mechanism 200 and compress, it is kept fixed the position grabbed between gluing mechanism 200 and enclosure body semi-finished product 110, removes mold pressing 400 after Shooting Technique.
Step S106 non-covers plastic structure being formed on base at the beginning of the shell by numerical control processing.
Wherein, the non-plastic structure that covers is the structure not connecting with plastic fastening on enclosure body semi-finished product；Specifically include video camera hole, fingerprint sensor hole etc..It is shown in Figure 10, Figure 10 is the structural schematic diagram that the enclosure body semi-finished product that numerical control processing obtains are carried out after Shooting Technique, in enclosure body semi-finished product 110 shown in Fig. 10, antenna cracks 111, earpiece holes 112 and data line interface hole 113 is filled by plastic fastening, and forms video camera hole 114 and fingerprint sensor hole 115 by numerical control processing.In specific implementation, after carrying out numerical control processing technology, also need to carry out deburring processing to enclosure body semi-finished product, to carry out later processing operation.
Step S107 is surface-treated the enclosure body semi-finished product.
Wherein, in specific implementation, above-mentioned surface treatment process successively includes: polishing process, cleaning process, blasting craft, anode oxidation process and laser carving technique.Casting of electronic device finished product can be obtained after process of surface treatment.
In above-mentioned steps S103, in addition to being bonded using acid-proof alkaline and the preferable two-component acrylicester adhesive of heat resistance, for the cost for reducing bonding agent, in other embodiments, phenolic resin class adhesive or organic silica gel class also can be used and stick agent to grabbing gluing mechanism and enclosure body semi-finished product are bonded, since phenolic resin class adhesive or organic silica gel class stick the acid-proof alkaline of agent relative to two-component acrylicester adhesive, in order to reduce during nanosizing since acid and alkali corrosion causes to grab the Joint failure between gluing mechanism and enclosure body semi-finished product, sealing material can be used to seal the edge of bonding agent, reduce contact of the bonding agent in nanosizing treatment process with soda acid, then in a specific embodiment, when bonding agent is two-component acrylicester adhesive, the bonding region that will grab gluing mechanism with After the bonding region pairing of enclosure body semi-finished product, further includes: sealing material is set to the edge of bonding agent, so that bonding agent is isolated with external environment.
Specifically, sealing material can be made with titanium, silica or ceramics etc. of substrate.Sealing material may be configured as annular wafer structure, its inner ring can be arranged according to the shape of the corresponding outer contour for grabbing the bonding agent between gluing mechanism and enclosure body semi-finished product, after the bonding region pairing of the bonding region and enclosure body semi-finished product that will grab gluing mechanism, sealing material is filled in and is grabbed between gluing mechanism and enclosure body semi-finished product, can play the role of completely cutting off external environment and bonding agent.
For the production cost for further decreasing casting of electronic device, when sticking agent bonding enclosure body semi-finished product using the more general bonding agent phenolic resin class adhesive of acid-proof alkaline or organic silica gel class and grabbing gluing mechanism, the edge of bonding agent is set to using sealing material, bonding agent is isolated with external environment, then in soda acid treatment process, sealing material can reduce the probability that bonding agent is contacted with soda acid, bonding agent is thereby reduced to fail under acid-base function, and then lead to the probability of Joint failure, it can be while reducing the production cost of casting of electronic device, it improves enclosure body semi-finished product and grabs the bonding strength between gluing mechanism.
Bonding agent is sealed and after nanosizing treatment process using sealing material, when carrying out Shooting Technique, to avoid the sealing material in injection moulding process from impacting the formation of plastic fastening, then in a specific embodiment, to enclosure body semi-finished product and grab gluing mechanism carry out nanosizing processing after, further includes: removal sealing material.It can avoid the sealing material in injection moulding process to impact the formation of plastic fastening, guarantee the yield of plastic fastening.
Casting of electronic device preparation method provided in this embodiment can be applied to mobile phone, tablet computer, laptop, intelligent wearable device shell preparation process in.The production yield of casting of electronic device can be improved, and casting of electronic device production cost can be reduced.
Based on the same inventive concept, gluing mechanism and plastic fastening are grabbed the embodiment of the present application also provides a kind of electronic equipment shell, including enclosure body, plastic fastening and enclosure body and gluing mechanism is grabbed and connect, wherein enclosure body and grabbing is bonded between gluing mechanism.Specifically, casting of electronic device provided in this embodiment can be applied to mobile phone, tablet computer, laptop or intelligent wearable device.
In casting of electronic device provided by the embodiments of the present application, it is bonded in enclosure body and grabs gluing mechanism, it plastic fastening and enclosure body and grabs gluing mechanism and connect, contact area between plastic fastening and enclosure body semi-finished product can be increased by grabbing gluing mechanism, so as to increase the bond strength between plastic fastening and enclosure body semi-finished product, the probability that metal shell and plastic fastening can be made to be detached from after being impacted reduces, and improves the reliability of electronic product.
In a kind of specific embodiment, enclosure body is by pressing sheet material punch forming.The working hour for carrying out numerical control processing to enclosure body can be reduced, the production cost of casting of electronic device is reduced.
Based on the same inventive concept, the embodiment of the present application also provides a kind of electronic equipment, including above-mentioned casting of electronic device.Specifically, electronic equipment provided in this embodiment can be mobile phone, tablet computer, laptop or intelligent wearable device.
In electronic equipment provided by the embodiments of the present application, it is bonded in enclosure body in its shell and grabs gluing mechanism, it plastic fastening and enclosure body and grabs gluing mechanism and connect, contact area between plastic fastening and enclosure body semi-finished product can be increased by grabbing gluing mechanism, so as to increase the bond strength between plastic fastening and enclosure body semi-finished product, the probability that metal shell and plastic fastening can be made to be detached from after being impacted reduces, and improves the reliability of electronic product.
Obviously, those skilled in the art can carry out various modification and variations without departing from the spirit and scope of the embodiment of the present application to the embodiment of the present application.If then the application is also intended to include these modifications and variations in this way, these modifications and variations of the embodiment of the present application belong within the scope of the claim of this application and its equivalent technologies.
Claims (13)
- A kind of electronic equipment shell preparation method characterized by comprisingGluing mechanism will be grabbed and be adhered to enclosure body semi-finished product；Nanosizing processing is carried out to the enclosure body semi-finished product and the gluing mechanism of grabbing, the surface of the enclosure body semi-finished product is made to form nano aperture；It is formed and the enclosure body semi-finished product and the plastic fastening grabbing gluing mechanism and connecting by Shooting Technique.
- Casting of electronic device preparation method according to claim 1, which is characterized in that the gluing mechanism that will grab is adhered to enclosure body semi-finished product, specifically includes:In the bonding region of the enclosure body semi-finished product, and/or, the bonding region coating adhesive for grabbing gluing mechanism；By the bonding region pairing of the bonding region for grabbing gluing mechanism and the enclosure body semi-finished product；Solidify the bonding agent.
- Casting of electronic device preparation method according to claim 2, which is characterized in that the bonding region in the enclosure body semi-finished product, and/or, the bonding region coating adhesive for grabbing gluing mechanism specifically includes:The bonding agent is sprayed to the bonding region of the enclosure body semi-finished product, and/or, the bonding region for grabbing gluing mechanism.
- Casting of electronic device preparation method according to claim 3, which is characterized in that after the bonding region pairing of the bonding region for grabbing gluing mechanism and the enclosure body semi-finished product, the bonding agent with a thickness of 0.08mm-0.12mm.
- Casting of electronic device preparation method according to claim 4, which is characterized in that the bonding agent is two-component acrylicester adhesive.
- Casting of electronic device preparation method according to claim 4, it is characterized in that, the bonding agent is that phenolic resin class adhesive or organic silica gel class stick agent, it is described by the bonding region pairing of the bonding region for grabbing gluing mechanism and the enclosure body semi-finished product after, further includes:Sealing material is set to the edge of the bonding agent, so that the bonding agent is isolated with external environment.
- Casting of electronic device preparation method according to claim 6, which is characterized in that it is described to the enclosure body semi-finished product and it is described grab gluing mechanism carry out nanosizing processing after, further includes:Remove the sealing material.
- Casting of electronic device preparation method according to claim 4, which is characterized in that it is described by Shooting Technique formation and the enclosure body semi-finished product and the plastic fastening grabbing gluing mechanism and connecting, it specifically includes:By grabbing gluing mechanism described in fixture clamping in the Shooting Technique, it is kept fixed the position grabbed between gluing mechanism and the enclosure body semi-finished product.
- Casting of electronic device preparation method according to claim 1-8, which is characterized in that will be grabbed before gluing mechanism is adhered to enclosure body semi-finished product described, further includes:Punching press is carried out to sheet metal, forms shell just base；By numerical control processing at the beginning of the shell on base formed cover plastic structure, obtain the enclosure body semi-finished product；Wherein, the plastic structure that covers is the structure connecting on the enclosure body semi-finished product with the plastic fastening.
- Casting of electronic device preparation method according to claim 9, which is characterized in that it is described formed by Shooting Technique with the enclosure body semi-finished product and it is described grab the plastic fastening that gluing mechanism is connect after, further includes:Non- plastic structure is covered being formed on base at the beginning of the shell by numerical control processing；Wherein, the non-plastic structure that covers is the shell The structure not connect with the plastic fastening on ontology semi-finished product；The enclosure body semi-finished product are surface-treated.
- A kind of electronic equipment shell, which is characterized in that including enclosure body, grab gluing mechanism and plastic fastening, the plastic fastening is connect with the enclosure body and the gluing mechanism of grabbing, wherein the enclosure body and described grab are bonded between gluing mechanism by bonding agent.
- Casting of electronic device according to claim 11, which is characterized in that the enclosure body is by pressing sheet material punch forming.
- A kind of electronic equipment, which is characterized in that including the casting of electronic device as described in claim 11 or 12.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710166831X | 2017-03-20 | ||
| CN201710166831 | 2017-03-20 | ||
| PCT/CN2017/093943 WO2018171095A1 (en) | 2017-03-20 | 2017-07-21 | Method for preparing electronic device shell, electronic device shell and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109076116A true CN109076116A (en) | 2018-12-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780022679.6A Pending CN109076116A (en) | 2017-03-20 | 2017-07-21 | A kind of electronic equipment shell preparation method and casting of electronic device, electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109076116A (en) |
| WO (1) | WO2018171095A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109676324B (en) * | 2018-12-25 | 2021-04-30 | 蓝思科技（长沙）有限公司 | Multi-component shell machining method |
| CN109885130A (en) * | 2019-03-11 | 2019-06-14 | 通达宏泰科技(苏州)有限公司 | A kind of light and thin notebook computer casing production method and light and thin notebook computer casing |
| CN114834054B (en) * | 2022-07-04 | 2022-09-02 | 福鼎市新精艺科技有限公司 | Rubber ring grabbing device of diaphragm assembling machine |
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| WO2018171095A1 (en) | 2018-09-27 |
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