WO2018161450A8 - 一种消费电子产品的主板及终端 - Google Patents

一种消费电子产品的主板及终端 Download PDF

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Publication number
WO2018161450A8
WO2018161450A8 PCT/CN2017/087166 CN2017087166W WO2018161450A8 WO 2018161450 A8 WO2018161450 A8 WO 2018161450A8 CN 2017087166 W CN2017087166 W CN 2017087166W WO 2018161450 A8 WO2018161450 A8 WO 2018161450A8
Authority
WO
WIPO (PCT)
Prior art keywords
motherboard
pcbs
layers
electronic components
layer
Prior art date
Application number
PCT/CN2017/087166
Other languages
English (en)
French (fr)
Other versions
WO2018161450A9 (zh
WO2018161450A1 (zh
Inventor
王勇
乔吉涛
孙睿
朱福建
丁海幸
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to US16/491,978 priority Critical patent/US20200275553A1/en
Priority to EP17899686.4A priority patent/EP3585137A4/en
Priority to JP2019548968A priority patent/JP2020512688A/ja
Priority to CN201780003531.8A priority patent/CN108235832B/zh
Priority to AU2017403198A priority patent/AU2017403198B2/en
Priority to KR1020197029242A priority patent/KR20190124280A/ko
Publication of WO2018161450A1 publication Critical patent/WO2018161450A1/zh
Publication of WO2018161450A8 publication Critical patent/WO2018161450A8/zh
Publication of WO2018161450A9 publication Critical patent/WO2018161450A9/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

本发明实施例提供一种消费电子产品的主板及终端。该主板包括至少两层PCB和至少两层PCB的每一层PCB上设置的电子元器件，其中，每一层PCB构成一个单元模块。至少两层PCB层叠放置，且至少两层PCB之间电连接。任意相邻的两层PCB之间通过框架板连接，且述框架板为中间镂空或局部镂空的结构。通过将主板设计为多层复式堆叠结构，缩小主板在水平方向的占用面积，为显示模组、摄像模组、音腔组件等电子部件提供平面空间。同时，通过将主板或副板上各个功能区域比如基带电路部分、射频电路部分，拆分成多个独立的基带电路单元模块和射频电路单元模块，有利于电子元器件间导线连接的布置，从而提高电子元器件的集成度，进一步减小了主板在水平方向的占用面积。
PCT/CN2017/087166 2017-03-09 2017-06-05 一种消费电子产品的主板及终端 WO2018161450A1 (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US16/491,978 US20200275553A1 (en) 2017-03-09 2017-06-05 Mainboard for consumer electronic product, and terminal
EP17899686.4A EP3585137A4 (en) 2017-03-09 2017-06-05 MAIN BOARD AND TERMINAL FOR USE WITH ENTERTAINMENT ELECTRONICS
JP2019548968A JP2020512688A (ja) 2017-03-09 2017-06-05 消費者向け電子製品のメインボードおよび端末
CN201780003531.8A CN108235832B (zh) 2017-03-09 2017-06-05 一种消费电子产品的主板及终端
AU2017403198A AU2017403198B2 (en) 2017-03-09 2017-06-05 Mainboard for consumer electronic product, and terminal
KR1020197029242A KR20190124280A (ko) 2017-03-09 2017-06-05 소비자 전자 제품용 메인보드 및 단말기

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710138321 2017-03-09
CN201710138321.1 2017-03-09

Publications (3)

Publication Number Publication Date
WO2018161450A1 WO2018161450A1 (zh) 2018-09-13
WO2018161450A8 true WO2018161450A8 (zh) 2019-10-03
WO2018161450A9 WO2018161450A9 (zh) 2019-10-31

Family

ID=63447226

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/087166 WO2018161450A1 (zh) 2017-03-09 2017-06-05 一种消费电子产品的主板及终端

Country Status (6)

Country Link
US (1) US20200275553A1 (zh)
EP (1) EP3585137A4 (zh)
JP (1) JP2020512688A (zh)
KR (1) KR20190124280A (zh)
AU (1) AU2017403198B2 (zh)
WO (1) WO2018161450A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111029508A (zh) * 2019-12-30 2020-04-17 维沃移动通信有限公司 一种电池组件及电子设备
CN112911798B (zh) * 2021-01-18 2023-04-25 维沃移动通信有限公司 主板结构和电子设备
CN113727514A (zh) * 2021-08-26 2021-11-30 维沃移动通信有限公司 电路板组件和电子设备

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6618267B1 (en) * 1998-09-22 2003-09-09 International Business Machines Corporation Multi-level electronic package and method for making same
GB2349757B (en) * 1999-03-20 2003-07-16 Nec Technologies Watchdog circuit
JP2003069179A (ja) * 2001-08-30 2003-03-07 Sony Corp 電子部品実装基板複合体及びその組立実装方法
JP4046088B2 (ja) * 2004-02-02 2008-02-13 松下電器産業株式会社 立体的電子回路装置およびその中継基板と中継枠
JP4552565B2 (ja) * 2004-09-03 2010-09-29 日本電気株式会社 フレキシブル配線基板及び折り畳み式電子機器
JP4312148B2 (ja) * 2004-12-13 2009-08-12 パナソニック株式会社 中継基板と立体配線構造体
JP4858541B2 (ja) * 2006-06-27 2012-01-18 パナソニック株式会社 中継基板および電子回路実装構造体
WO2009078059A1 (ja) * 2007-12-14 2009-06-25 Fujitsu Limited プリント基板構造体、およびそれに用いる連接用電極
CN102098896A (zh) * 2009-12-09 2011-06-15 苏州华旃航天电器有限公司 平行安装pcb板固定结构
CN201947597U (zh) * 2010-12-08 2011-08-24 中兴通讯股份有限公司 屏蔽装置
CN202679451U (zh) * 2012-07-30 2013-01-16 深圳市子元技术有限公司 一种用于表面贴装的手机电路板
IN2014DN10875A (zh) * 2012-08-10 2015-09-11 Ericsson Telefon Ab L M
JP2014165210A (ja) * 2013-02-21 2014-09-08 Fujitsu Component Ltd モジュール基板
CN104955273B (zh) * 2014-03-31 2018-10-02 奇点新源国际技术开发(北京)有限公司 印刷电路板及网络布线系统
CN105430946A (zh) * 2014-09-04 2016-03-23 上海致维自动化控制有限公司 保护监控终端
CN204836781U (zh) * 2015-07-28 2015-12-02 江苏迪飞达电子有限公司 节约材料与空间的四层pcb板组件

Also Published As

Publication number Publication date
EP3585137A1 (en) 2019-12-25
KR20190124280A (ko) 2019-11-04
WO2018161450A9 (zh) 2019-10-31
AU2017403198B2 (en) 2020-12-24
US20200275553A1 (en) 2020-08-27
EP3585137A4 (en) 2020-03-25
JP2020512688A (ja) 2020-04-23
AU2017403198A1 (en) 2019-10-10
WO2018161450A1 (zh) 2018-09-13

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