WO2018155054A1 - Dispositif et procédé de traitement de substrat - Google Patents

Dispositif et procédé de traitement de substrat Download PDF

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Publication number
WO2018155054A1
WO2018155054A1 PCT/JP2018/002151 JP2018002151W WO2018155054A1 WO 2018155054 A1 WO2018155054 A1 WO 2018155054A1 JP 2018002151 W JP2018002151 W JP 2018002151W WO 2018155054 A1 WO2018155054 A1 WO 2018155054A1
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WO
WIPO (PCT)
Prior art keywords
liquid
valve
processing
substrate
pipe
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PCT/JP2018/002151
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English (en)
Japanese (ja)
Inventor
仁司 中井
Original Assignee
株式会社Ｓｃｒｅｅｎホールディングス
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from JP2017242942A external-priority patent/JP6975630B2/ja
Application filed by 株式会社Ｓｃｒｅｅｎホールディングス filed Critical 株式会社Ｓｃｒｅｅｎホールディングス
Priority to KR1020197022463A priority Critical patent/KR102226378B1/ko
Priority to CN201880009209.0A priority patent/CN110235226B/zh
Publication of WO2018155054A1 publication Critical patent/WO2018155054A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to a substrate processing apparatus and a substrate processing method.
  • substrates to be processed include semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field (Emission Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, and photomasks.
  • substrate semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field (Emission Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, and photomasks.
  • substrate ceramic substrate, solar cell substrate and the like.
  • a substrate processing apparatus that performs processing using a processing liquid on a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display panel is used.
  • a substrate processing apparatus includes a spin chuck that rotates the substrate while holding the substrate substantially horizontal, a nozzle for discharging the processing liquid onto the substrate held by the spin chuck, and a processing liquid that supplies the processing liquid to the nozzle.
  • a pipe and a processing liquid valve interposed in the middle of the processing liquid pipe are included.
  • Patent Document 1 discloses a substrate processing apparatus for detecting a leakage failure of a processing liquid valve.
  • the substrate processing apparatus includes a processing liquid suction pipe branched from a branch position set in a vertical portion downstream of the processing liquid valve in the processing liquid piping, a suction apparatus connected to a tip of the processing liquid suction pipe, And a liquid level sensor arranged slightly upstream from the branch position. After completion of the operation of discharging the processing liquid from the nozzle, the suction device sucks the processing liquid and retracts the front end surface of the processing liquid to the branch position.
  • the liquid level sensor monitors the liquid surface height of the processing liquid in the vertical portion, and when the liquid surface height reaches a predetermined height, the substrate processing apparatus determines a leakage failure of the processing liquid valve.
  • Patent Document 1 it is necessary to suck the processing liquid with a suction device and retract the front end surface of the processing liquid to the branch position every time the discharge operation of the processing liquid from the nozzle ends. Since it is necessary to largely retract the front end surface of the processing liquid, it takes time to suck the processing liquid. That is, by performing such suction, there is a possibility that the throughput is deteriorated. Therefore, it is required to detect leakage of the processing liquid from the supply valve (processing liquid valve) using another method.
  • one object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of detecting leakage of processing liquid from a supply valve without degrading throughput.
  • One embodiment of the present invention includes a substrate holding unit for holding a substrate, a processing liquid nozzle for discharging a processing liquid for processing the substrate, a supply pipe for supplying the processing liquid to the processing liquid nozzle, A supply valve that is interposed in the supply pipe and opens and closes the supply pipe, and a flow of the treatment liquid discharged from the treatment liquid nozzle and not supplied to the substrate held in the substrate holding unit
  • a liquid leakage detection unit for detecting leakage of processing liquid from the piping, the supply valve, the flow valve interposed in the flow piping and opening and closing the flow piping, and the flow of the flow piping Detection for detecting the processing liquid collected in the upstream area upstream of the valve or the processing liquid branched from the upstream area and stored in the branch area where the processing liquid can be stored.
  • a leakage detection unit that detects leakage from the supply valve based on processing liquid accumulated in the upstream region or the branch region when the supply valve and the flow valve are closed.
  • the distribution valve interposed in the distribution pipe is closed in a state where the supply valve interposed in the supply pipe is closed.
  • the liquid supplied to the flow pipe can be stored in the upstream region or the branch region.
  • the processing liquid leaked from the supply valve is discharged from the processing liquid nozzle and supplied to the distribution pipe. Since the flow valve is in a closed state, when there is leakage from the supply valve, the processing liquid leaked from the supply valve is stored in the upstream region or the branch region. Therefore, by detecting the processing liquid accumulated in the upstream region or the branch region, it is possible to satisfactorily detect the leakage from the supply valve.
  • the processing liquid discharged from the processing liquid nozzle is used to detect the leakage of the processing liquid from the supply valve, the leakage of the processing liquid from the supply valve can be detected without greatly retreating the front end surface of the processing liquid. . Therefore, it is possible to detect the leakage of the processing liquid from the supply valve while reducing the throughput.
  • the processing liquid nozzle is disposed above the substrate held by the substrate holding unit and from above the substrate held by the substrate holding unit. It further includes a nozzle moving unit that moves between the retracted position and the retracted position.
  • the distribution pipe includes a retraction flow pipe through which the processing liquid discharged from the processing liquid nozzle disposed at the retreat position flows.
  • leakage from the supply valve is detected using the evacuation flow pipe. Since the leakage from the supply valve is detected using the retraction flow pipe through which the processing liquid supplied to the substrate does not flow during the substrate processing, the leakage from the supply valve can be detected with high accuracy.
  • the substrate processing apparatus further includes a pot for receiving a processing liquid discharged from the processing liquid nozzle disposed at the retracted position.
  • the evacuation distribution pipe includes a drainage pipe connected to the pot, and a treatment liquid received in the pot flows for drainage.
  • the processing liquid nozzle is disposed at the retreat position.
  • the processing liquid discharged from the processing liquid nozzle in a state where the processing liquid nozzle is disposed at the retracted position is received by the pot and then supplied to the drain pipe.
  • leakage from the supply valve can be detected during non-treatment.
  • the liquid leakage detection unit executes a valve closing process for closing the flow valve in a state where the processing liquid nozzle is disposed at the retracted position.
  • the flow valve is closed in a state where the processing liquid nozzle is disposed at the retracted position.
  • the nozzle moving unit executes a moving step of moving the processing liquid nozzle arranged at the retracted position from the retracted position to another position. Moreover, the said leak detection unit performs the 1st valve opening process which opens the said distribution valve in a closed state prior to the said movement process.
  • the flow valve in the closed state is opened before the moving step of moving from the retracted position to another position.
  • the processing liquid can be discharged out of the upstream area or the branch area. Therefore, it is possible to prevent the processing liquid from being accumulated in the upstream region or the branch region during a period in which the leakage detection is not performed. Therefore, the next leak detection can be performed satisfactorily.
  • the liquid leakage detection unit is in a closed state prior to a retreat discharge step of opening the supply valve in a state where the processing liquid nozzle is disposed at the retreat position. A second valve opening process is performed.
  • the flow valve in the closed state is opened before the retreat discharge process. Therefore, the retracting and discharging process can be performed while maintaining the flow valve in the open state, whereby the retracting and discharging process can be performed satisfactorily.
  • a third valve opening step is further performed, which opens the flow valve in the closed state.
  • the detector detects the processing liquid accumulated in the upstream region. Further, when the processing liquid nozzle is disposed at the processing position and the supply valve is in an open state, the liquid leakage detection unit validates the liquid leakage detection by the liquid leakage detection unit and removes the predetermined liquid In this case, the leak detection by the leak detection unit is invalidated.
  • the liquid leakage detection unit is configured to perform the liquid leakage detection unit during execution of a retraction discharge process that opens the supply valve in a state where the processing liquid nozzle is disposed at the retraction position. Disable leak detection.
  • the leakage detection is invalidated during the execution of the retreat discharge process.
  • the processing liquid flows through the retreat flow piping.
  • the flow of the processing liquid in the retreat flow pipe during the retreat discharge process is erroneously detected as a leak from the supply valve.
  • the leak detection is invalidated during the execution of the evacuation / discharge process, it is possible to reliably detect only the leak from the supply valve.
  • the liquid leakage detection unit detects that there is liquid leakage from the supply valve when the liquid leakage from the supply valve is detected in a predetermined detection amount within a predetermined detection period. If the detected amount of processing liquid is not detected within the detection period after the flow valve is closed, it may be detected that there is no leakage from the supply valve.
  • the detector includes a liquid level sensor that detects whether or not the liquid level of the processing liquid accumulated in the upstream region or the branch region has reached a predetermined height.
  • the processing liquid accumulated in the upstream region or the branch region can be detected by the liquid level sensor having a relatively simple configuration. Therefore, compared with the case where the processing liquid falling from the processing liquid nozzle is directly detected, the liquid leakage from the supply nozzle can be detected at a low cost.
  • the supply pipe includes a first pipe part in which the supply valve is interposed, a second pipe part extending upward from a downstream end of the first pipe part, A third piping portion extending horizontally from a downstream end of the second piping portion; and a fourth piping portion connecting the third piping portion and the processing liquid nozzle. Further, after the treatment liquid is discharged from the treatment liquid nozzle, the treatment liquid in the supply pipe is sucked, and the front end surface of the treatment liquid is set to the third pipe part or the fourth pipe part. It further includes a suction device for suctioning to a predetermined retracted position.
  • One embodiment of the present invention includes a supply pipe for supplying a treatment liquid to a treatment liquid nozzle, a supply valve interposed in the supply pipe for opening and closing the supply pipe, and a treatment liquid discharged from the treatment liquid nozzle.
  • a substrate processing method executed in a substrate processing apparatus including a distribution pipe through which a processing liquid not supplied to the substrate flows and a distribution valve interposed in the distribution pipe to open and close the distribution pipe, A valve closing step for closing the flow valve in a state in which the supply valve is in a closed state; and an upstream upstream of the flow valve in the flow pipe in the closed state of the supply valve and the closed state of the flow valve. Processing from the supply valve based on the processing liquid accumulated in the side area or the processing liquid branched from the upstream area and stored in the branch area where the processing liquid can be stored And a leakage detection step of detecting a leak, a substrate processing method.
  • the distribution valve interposed in the distribution pipe is closed.
  • the liquid supplied to the flow pipe can be stored in the upstream region or the branch region.
  • the processing liquid leaked from the supply valve is discharged from the processing liquid nozzle and supplied to the distribution pipe. Since the flow valve is in a closed state, when there is leakage from the supply valve, the processing liquid leaked from the supply valve is stored in the upstream region or the branch region. Therefore, by detecting the processing liquid accumulated in the upstream region or the branch region, it is possible to satisfactorily detect the leakage from the supply valve.
  • the processing liquid discharged from the processing liquid nozzle is used to detect the leakage of the processing liquid from the supply valve, the leakage of the processing liquid from the supply valve can be detected without greatly retreating the front end surface of the processing liquid. . Therefore, it is possible to detect the leakage of the processing liquid from the supply valve while reducing the throughput.
  • the flow pipe includes a retreat flow pipe through which the treatment liquid discharged from the treatment liquid nozzle is disposed at a retreat position where the flow pipe is retreated from the upper side of the substrate to the side.
  • the treatment liquid nozzle prior to the valve closing step, the treatment liquid nozzle is disposed at the retracted position. Therefore, the flow valve is closed in a state where the supply valve is closed and the processing liquid nozzle is disposed at the retracted position. Thereby, when there is a leak from the supply valve, the processing liquid leaked from the supply valve can be stored in the upstream region or branch region of the evacuation flow pipe. Then, by detecting the processing liquid stored in the upstream region or the branch region, it is possible to detect the leakage from the supply valve in the retraction flow pipe.
  • the substrate processing method includes a moving step of moving the processing liquid nozzle disposed at the retracted position from the retracted position to another position, and a closing process prior to the moving step.
  • the flow valve in the closed state is opened before the moving step of moving from the retracted position to another position.
  • the substrate processing method opens the supply valve in a state in which the processing liquid nozzle is disposed at the retracted position, so that the processing liquid nozzle performs processing liquid from the processing liquid nozzle for pre-dispensing. And a second valve opening step of opening the flow valve in the closed state prior to the retracting and discharging step.
  • the closed distribution valve is opened prior to the retreat discharge process. Therefore, the retracting and discharging process can be performed while maintaining the flow valve in the open state, whereby the retracting and discharging process can be performed satisfactorily.
  • the substrate processing method includes a third valve opening step of opening the flow valve in a closed state when the leak detection step detects a leak from the supply valve. Further included.
  • the processing liquid stored in the upstream region or branch region of the distribution pipe is released outside the upstream region by opening the closed flow valve. can do.
  • the liquid leakage detection step is effective when the processing liquid nozzle is disposed at the processing position and the supply valve is open.
  • a detection invalidation step for invalidating the leakage detection in the leakage detection step is included in other predetermined cases.
  • the leakage detection by the leakage detection unit is enabled. As a result, leakage from the supply valve can be detected during non-treatment.
  • the detection invalidation step invalidates leak detection in the leak detection step when the treatment liquid nozzle is disposed at the treatment position and the supply valve is opened. To do.
  • the leakage detection is invalidated during the execution of the retreat discharge process.
  • the processing liquid flows through the retreat flow piping.
  • the type of detector used in the leakage detection process there is a possibility that the flow of the processing liquid in the evacuation flow pipe during the evacuation discharge process is erroneously detected as a leakage from the supply valve.
  • the leak detection since the leak detection is invalidated during the execution of the evacuation / discharge process, only the leak from the supply valve can be reliably detected.
  • the liquid leakage detection step detects that there is liquid leakage from the supply valve when the liquid leakage from the supply valve is detected in a predetermined detection amount within a predetermined detection period. In the case where the detected amount of processing liquid is not detected within the detection period after the flow valve is closed, a step of detecting that there is no leakage from the supply valve may be included.
  • FIG. 1 is a schematic view of a substrate processing apparatus according to an embodiment of the present invention viewed in the horizontal direction.
  • FIG. 2 is a block diagram for explaining an electrical configuration of a main part of the substrate processing apparatus.
  • FIG. 3 is a time chart showing the open / close state of the supply valve, the position state of the treatment liquid nozzle, the open / close state of the flow valve, and the valid / invalid state of the detection output of the liquid level sensor.
  • FIG. 4A is a schematic diagram for explaining a standby step (S1 in FIG. 3).
  • FIG. 4B is a schematic diagram for explaining the pre-dispensing step (S2 in FIG. 3).
  • FIG. 4C is a schematic diagram for explaining chemical liquid suction after the pre-dispensing step.
  • FIG. 4D is a schematic diagram for explaining a nozzle arrangement step (S3 in FIG. 3) and a chemical solution step (S4 in FIG. 3).
  • FIG. 4E is a schematic diagram for explaining chemical liquid suction after the chemical process.
  • FIG. 4F is a schematic view when chemical liquid leaks from the processing liquid nozzle in the standby step (S1 in FIG. 3).
  • FIG. 5 is a flowchart for explaining the flow of leakage detection.
  • FIG. 6 is a diagram showing a main part of a substrate processing apparatus according to the second embodiment of the present invention related to the second embodiment of the present invention.
  • FIG. 7 is a time chart showing the open / close state of the supply valve, the position state of the chemical nozzle, the open / close state of the flow valve, and the valid / invalid state of the detection output of the liquid level sensor according to the second embodiment of the present invention.
  • FIG. 8 is a schematic diagram in the case where there is a leakage of the chemical solution from the chemical nozzle in the standby step (S1 in FIG. 7).
  • FIG. 9 is a diagram for explaining a first modification of the second embodiment of the present invention.
  • FIG. 10 is a diagram for explaining a second modification of the second embodiment of the present invention.
  • FIG. 1 is a view of the substrate processing apparatus 1 according to the first embodiment of the present invention as seen in the horizontal direction.
  • the substrate processing apparatus 1 is a single-wafer type apparatus that processes a disk-shaped substrate W such as a semiconductor wafer one by one.
  • the substrate processing apparatus 1 includes a processing unit 2 that processes a substrate W using a processing liquid (chemical solution and rinsing liquid), a transfer robot (not shown) that loads the substrate W into and out of the processing unit 2, and a substrate processing apparatus. 1 and a control device 3 for controlling the opening and closing of the valve.
  • a processing liquid chemical solution and rinsing liquid
  • a transfer robot not shown
  • the processing unit 2 includes a box-shaped processing chamber 4 and a spin chuck (substrate) that rotates the substrate W about a vertical rotation axis A1 that passes through the center of the substrate W while holding the substrate W horizontally in the processing chamber 4. Holding unit) 5 and one or a plurality of processing liquid nozzles that discharge the processing liquid toward the substrate W held by the spin chuck 5.
  • the spin chuck 5 includes a disc-shaped spin base 6 held in a horizontal posture, a plurality of clamping pins 7 that hold the substrate W in a horizontal posture above the spin base 6, and a central portion of the spin base 6.
  • a spin shaft 8 extending downward, and a spin motor 9 that rotates the spin shaft 8 to rotate the substrate W and the spin base 6 about the rotation axis A1.
  • the spin chuck 5 is not limited to the clamping chuck in which the plurality of clamping pins 7 are brought into contact with the peripheral end surface of the substrate W, and the back surface (lower surface) of the substrate W which is a non-device forming surface is adsorbed to the upper surface of the spin base 6.
  • a vacuum chuck that holds the substrate W horizontally may be used.
  • the processing unit 2 includes a rinse liquid nozzle 10 that discharges the rinse liquid downward toward the upper surface of the substrate W held by the spin chuck 5, and a rinse liquid that guides the rinse liquid from the rinse liquid supply source to the rinse liquid nozzle 10.
  • a pipe 11 and a rinse liquid valve 12 that opens and closes the inside of the rinse liquid pipe 11 are included.
  • the rinse liquid is, for example, pure water (deionized water).
  • the rinse liquid is not limited to pure water, but may be any of carbonated water, electrolytic ion water, hydrogen water, ozone water, and hydrochloric acid water having a diluted concentration (for example, about 10 to 100 ppm). You may provide the water nozzle moving apparatus which scans the liquid landing position with respect to the upper surface of the board
  • the processing unit 2 includes a chemical liquid nozzle (processing liquid nozzle) 13 that discharges a chemical liquid (processing liquid) toward the upper surface of the substrate W held by the spin chuck 5, and a nozzle arm in which the chemical liquid nozzle 13 is attached to the tip. 14 and a nozzle moving unit 15 that moves the chemical liquid nozzle 13 by swinging the nozzle arm 14 around a predetermined swing shaft (not shown).
  • the chemical nozzle 13 is attached to a nozzle arm 14 that extends in the horizontal direction with the discharge port 13a directed downward, for example.
  • the nozzle moving unit 15 includes a processing position P1 (a position indicated by a solid line in FIG. 1) set above the substrate W and a retreat position P2 (a broken line in FIG. 1) for retreating to the side of the spin chuck 5. (Horizontal).
  • the processing unit 2 further includes a supply pipe 16 that guides a chemical solution from a chemical solution supply source (not shown) to the chemical nozzle 13.
  • a supply valve 18 for opening and closing the supply pipe 16 and a flow meter 19 for measuring the flow rate of the chemical liquid flowing through the supply pipe 16 are interposed in this order from the chemical liquid nozzle 13 side.
  • the supply piping 16 includes, in order from the chemical supply source side, a first piping portion 16a in which a supply valve 18 is interposed, a second piping portion 16b extending upward from the downstream end of the first piping portion 16a, A third piping portion 16c extending horizontally from the downstream end of the second piping portion 16b, and a fourth piping portion 16d extending downward from the downstream end of the third piping portion 16c and connected to the chemical liquid nozzle 13. .
  • the supply valve 18 is interposed in the middle of the first piping portion 16a.
  • the first and third pipe portions 16a and 16c extend horizontally.
  • the 3rd piping part 16c is arrange
  • the height H is, for example, several tens of centimeters.
  • the second piping portion 16b connects the first piping portion 16a and the third piping portion 16c.
  • the second piping portion 16b extends, for example, in the vertical direction.
  • the fourth piping portion 16 d connects the third piping portion 16 c and the chemical nozzle 13.
  • the fourth piping portion 16d extends in the up-down direction, for example.
  • the first to fourth pipe portions 16a to 16d are constituted by a single continuous pipe, and the pipe diameters are common to each other.
  • the chemical solution is, for example, sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, aqueous ammonia, hydrogen peroxide, organic acid (eg, citric acid, oxalic acid, etc.), organic alkali (eg, TMAH: tetramethylammonium hydroxide, etc.), A liquid containing an organic solvent (for example, IPA: isopropyl alcohol, etc.) and at least one of a surfactant and a corrosion inhibitor.
  • organic acid eg, citric acid, oxalic acid, etc.
  • organic alkali eg, TMAH: tetramethylammonium hydroxide, etc.
  • a liquid containing an organic solvent for example, IPA: isopropyl alcohol, etc.
  • IPA isopropyl alcohol, etc.
  • the processing unit 2 includes a suction device 17.
  • the suction device 17 is a diaphragm type suction device.
  • the diaphragm-type suction device includes a cylindrical head interposed in the middle of the supply pipe 16 (first pipe portion 16a) and a diaphragm housed in the head. By driving the diaphragm, This is a suction device having a known configuration that changes the volume of the flow path formed (see Japanese Patent Application Laid-Open No. 2016-111306).
  • a diaphragm-type suction device has a weak suction force (suction speed) compared to an ejector-type suction device.
  • the diaphragm-type suction device has a smaller amount of chemical liquid that can be sucked than the ejector-type suction device.
  • the suction device 17 is configured separately from the supply valve 18, but the suction device 17 may be provided using a part of the supply valve 18.
  • the processing unit 2 includes a standby pot 20 arranged around the spin chuck 5 in plan view.
  • the standby pot 20 is a box-shaped pot for receiving the chemical liquid discharged from the chemical liquid nozzle 13 disposed at the retreat position P2.
  • a drainage pipe 21 is connected to the bottom of the standby pot 20.
  • the chemical solution received in the standby pot 20 is sent to a drainage treatment facility (not shown) outside the machine via the drainage pipe 21. Therefore, the chemical solution discharged to the standby pot 20 is not supplied to the substrate W.
  • a flow valve 22 for opening and closing the drainage pipe 21 is interposed.
  • the liquid is supplied to the drainage pipe 21, so that the chemical liquid that collects in the upstream area (hereinafter simply referred to as “upstream area”) 22 of the drainage pipe 21 from the circulation valve 22.
  • the detector for detecting is arranged.
  • the detector is a liquid level sensor 24 (see FIG. 4F) that detects whether or not the liquid level of the chemical liquid accumulated in the upstream region 23 has reached a predetermined height.
  • the processing unit 2 further includes a cylindrical processing cup 30 that surrounds the spin chuck 5. As shown in FIG. 1, the processing cup 30 is disposed outward (in a direction away from the rotation axis A ⁇ b> 1) from the substrate W held by the spin chuck 5.
  • the processing cup 30 surrounds the spin base 6.
  • the processing liquid is supplied to the substrate W while the spin chuck 5 is rotating the substrate W, the processing liquid supplied to the substrate W is shaken off around the substrate W.
  • the upper end portion 30 a of the processing cup 30 that opens upward is disposed above the spin base 6. Therefore, the processing liquid (chemical solution, rinsing liquid, etc.) discharged around the substrate W is received by the processing cup 30. Then, the processing liquid received by the processing cup 30 is sent to a processing facility (not shown).
  • FIG. 2 is a block diagram for explaining the electrical configuration of the main part of the substrate processing apparatus 1.
  • the control device 3 is configured using, for example, a microcomputer.
  • the control device 3 includes an arithmetic unit such as a CPU, a fixed memory device, a storage unit such as a hard disk drive, and an input / output unit.
  • the storage unit stores a program executed by the arithmetic unit.
  • the control device 3 controls operations of the spin motor 9, the nozzle moving unit 15, the suction device 17 and the like according to a predetermined program.
  • the control device 3 controls the opening / closing operations of the rinse liquid valve 12, the supply valve 18, the flow valve 22, and the like. Further, the detection output from the liquid level sensor 24 is input to the control device 3.
  • the liquid leakage detection unit for detecting liquid leakage from the supply valve 18 is constituted by the flow valve 22, the detector (liquid level sensor 24) and the control device 3.
  • an unprocessed substrate W is carried into the processing chamber 4 by the transfer robot, and the substrate W spins with its surface (device formation surface) facing upward.
  • the wafer is transferred to the chuck 5 and the substrate W is held on the spin chuck 5.
  • the chemical nozzle 13 is moved to the retracted position P2 (the position indicated by the broken line in FIG. 1). ).
  • the discharge port 13 a of the chemical liquid nozzle 13 faces the standby pot 20.
  • the control device 3 controls the nozzle moving unit 15 to pull out the chemical nozzle 13 disposed at the retracted position P2 to the processing position P1 (position indicated by a solid line in FIG. 1), and the upper surface of the rotating substrate W.
  • the chemical liquid is discharged to the chemical nozzle 13 toward Thereby, the chemical solution is supplied to the entire upper surface of the substrate W.
  • the control device 3 controls the nozzle moving unit 15 to return the chemical liquid nozzle 13 from the processing position P1 to the retreat position P2.
  • the control device 3 causes the rinsing liquid nozzle 10 to discharge the rinsing liquid toward the rotating substrate W.
  • the rinsing liquid is supplied to the entire upper surface of the substrate W, and the chemical liquid adhering to the substrate W is washed away (rinsing step).
  • the control device 3 stops the discharge of the rinse liquid from the rinse liquid nozzle 10 and then rotates the substrate W on the spin chuck 5 at a high rotation speed. Thereby, the rinse liquid adhering to the substrate W is shaken off around the substrate W by centrifugal force. Therefore, the rinse liquid is removed from the substrate W, and the substrate W is dried (drying process). Thereafter, the processed substrate is unloaded from the processing chamber 4 by the transfer robot.
  • FIG. 3 shows the open / close state of the supply valve 18, the position state of the chemical nozzle 13, the open / close state of the flow valve 22, and the liquid level from the standby step (S 1) through the chemical step (S 4) to the standby step (S 1).
  • 3 is a time chart showing valid / invalid states of detection output of a sensor 24.
  • FIG. 4A is a schematic diagram for explaining the standby step (S1).
  • FIG. 4B is a schematic diagram for explaining a pre-dispensing step (a retreat discharge step, S2).
  • FIG. 4C is a schematic diagram for explaining chemical liquid suction after the chemical liquid process (S4).
  • Drawing 4D is a mimetic diagram for explaining a nozzle arrangement process (S3) and a chemical solution process (S4).
  • FIG. 4E is a schematic diagram for explaining chemical liquid suction after the chemical liquid process (S4).
  • FIG. 4F is a schematic diagram when the chemical liquid leaks from the chemical nozzle 13 in the standby step (S1 in
  • the control device 3 causes the pre-dispensing step (S2) for discharging unnecessary chemical liquid (for example, chemical liquid that has deteriorated with time or chemical liquid whose temperature has decreased) in the supply pipe 16 and the chemical liquid nozzle 13 from the retreat position P2.
  • Step (S5) is performed.
  • the state in which the chemical nozzle 13 is disposed at the retreat position P2 and the pre-dispensing step (S2) is not being executed is referred to as a standby step (S1).
  • the feature of this processing example is that the flow valve 22 interposed in the drainage pipe 21 is normally closed in the standby step (S1). With such a configuration, detection of liquid leakage from the supply valve 18 is realized in the standby step (S1).
  • the pre-dispensing step (S2) when a predetermined period has elapsed since the previous execution of the chemical processing, the pre-dispensing step (S2) is performed prior to the start of the chemical processing.
  • this processing example will be described by taking the case of performing the pre-dispensing step (S2) as an example.
  • the pre-dispensing step (S2) Not executed.
  • the chemical nozzle 13 is disposed at the retreat position P2 before the chemical processing is started (standby step (S1)). After the end of the previous chemical processing, the chemical nozzle 13 is retracted from the processing position P1 to the retracted position P2, and the chemical nozzle 13 continues to be disposed at the retracted position P2.
  • the control device 3 closes the flow valve 22 and validates the leakage detection by the detector (liquid level sensor 24). That is, the control device 3 monitors whether or not there is a leak detection from the supply valve 18.
  • a pre-dispensing step (S2) is performed.
  • the control device 3 Prior to the start of the pre-dispensing step (S2), the control device 3 opens the flow valve 22 in the closed state. It also disables leak detection by the detector. The open state of the flow valve 22 and the invalidity of the leak detection by the detector are continued until the nozzle retracting step (S5) is completed. That is, the control device 3 does not monitor whether or not there is a leakage detection from the supply valve 18 in the pre-dispensing step (S2) to the nozzle retracting step (S5).
  • the control device 3 opens the supply valve 18 in a state where the chemical nozzle 13 is disposed at the retreat position P2.
  • the chemical liquid from the chemical liquid supply source is supplied to the chemical liquid nozzle 13 through the supply pipe 16, and the chemical liquid is discharged from the discharge port 13a of the chemical liquid nozzle 13 as shown in FIG. 4B.
  • the chemical liquid discharged from the chemical liquid nozzle 13 is received by the standby pot 20 and then flows through the drainage pipe 21. Since the flow valve 22 is in the open state, the chemical liquid flowing through the drainage pipe 21 passes through the drainage pipe 21 and is guided to a predetermined processing facility.
  • the control device 3 closes the supply valve 18. After the supply valve 18 is closed, the control device 3 drives the suction device 17 to suck a predetermined amount of the chemical solution inside the supply pipe 16. By suction of the chemical liquid, as shown in FIG. 4C, the tip surface of the chemical liquid inside the supply pipe 16 is retracted. When the distal end surface of the chemical solution is retracted to the retreat position P3, the control device 3 stops driving the suction device 17.
  • the tip surface of the chemical solution may be retracted to the retracted position P3 set in the fourth piping portion 16d.
  • the control device 3 executes a nozzle arrangement step (S3). That is, as shown in FIG. 4D, the control device 3 controls the nozzle moving unit 15 while keeping the supply valve 18 closed, and pulls out the chemical nozzle 13 from the retracted position P2 to the processing position P1.
  • a chemical solution process (S4) is performed. Specifically, after the chemical nozzle 13 is disposed at the processing position P1, the control device 3 opens the supply valve 18. Thereby, the chemical liquid from the chemical liquid supply source is supplied to the chemical liquid nozzle 13 through the supply pipe 16, and the chemical liquid is discharged from the discharge port 13a of the chemical liquid nozzle 13 as shown in FIG. 4D. The chemical liquid discharged from the chemical nozzle 13 is supplied to the substrate W.
  • the control device 3 drives the suction device 17 to suck a predetermined amount of the chemical solution inside the supply pipe 16. As shown in FIG. 4E, the tip end surface of the chemical solution inside the supply pipe 16 is retracted by the suction of the chemical solution.
  • the control device 3 stops driving the suction device 17.
  • the tip surface of the chemical solution may be retracted to the retracted position P3 set in the fourth piping portion 16d.
  • the retreat position P3 may be set not on the fourth piping portion 16d but on the third piping portion 16c.
  • control device 3 executes a nozzle retracting step (S5). That is, the control device 3 controls the nozzle moving unit 15 while maintaining the open state of the supply valve 18 to return the chemical liquid nozzle 13 disposed at the processing position P1 to the retreat position P2.
  • the control device 3 closes the flow valve 22 in the open state and enables the leak detection by the detector. That is, the control device 3 resumes monitoring whether or not there is leakage detection from the supply valve 18 (resumption of the standby step (S1)).
  • the liquid level sensor 24 (see FIG. 4F) is, for example, a transmission type position sensor having a pair of light emitting elements 24a and light receiving elements 24b. It is detected whether or not the height of the chemical solution stored in the tube reaches the optical axis (optical axis by the light emitting element 24a and the light receiving element 24b) set at a predetermined detection height position.
  • the position sensor may be a reflective sensor instead of a transmissive sensor.
  • the position sensor may be a liquid level sensor that directly detects the height of the liquid level of the chemical stored in the upstream region 23.
  • the liquid level sensor 24 is not limited to a position sensor, and the liquid level sensor 24 may be configured by a capacitance type sensor. Since the distribution valve 22 is closed, when there is leakage from the supply valve 18, the chemical liquid leaked from the supply valve 18 is stored in the upstream region 23. Therefore, the leakage from the supply valve 18 can be detected well by detecting that the chemical solution is stored in the upstream region 23.
  • FIG. 5 is a flowchart for explaining the flow of leakage detection.
  • the control device 3 monitors whether or not there is a leakage detection from the supply valve 18 in the standby step (S1) (T1).
  • the standby step (S1) if it is determined that the liquid level of the chemical liquid stored in the upstream region 23 has reached the detection height position based on the detection output from the liquid level sensor 24 (YES in T1) ),
  • the control device 3 displays a warning on the monitor (not shown) of the substrate processing apparatus 1 that the liquid leaks from the supply valve 18 (T2).
  • Information indicating leakage from the supply valve 18 may be recorded as a log in a storage unit (not shown) of the control device 3. In this case, a warning indicating leakage from the supply valve 18 may not be displayed on the monitor.
  • the chemical liquid nozzle 13 is disposed at the retracted position P2, and the supply valve 18 interposed in the supply pipe 16 is closed, and the liquid supply nozzle 18 is interposed in the drainage pipe 21.
  • the mounted flow valve 22 is closed.
  • the liquid supplied to the drainage pipe 21 can be stored in the upstream region 23.
  • the chemical liquid leaked from the supply valve 18 is discharged from the chemical liquid nozzle 13 and supplied to the drain pipe 21. Since the flow valve 22 is in a closed state, when there is leakage from the supply valve 18, the chemical liquid that has leaked from the supply valve 18 is stored in the upstream region 23. Therefore, by detecting the liquid level of the chemical liquid stored in the upstream region 23, the liquid leakage from the supply valve 18 can be detected well.
  • the supply valve Since the chemical liquid discharged from the chemical liquid nozzle 13 is used to detect the leakage of the chemical liquid from the supply valve 18, the supply valve is not retreated to the second piping part (vertical part) 16 b. The leakage of the chemical solution from 18 can be detected. Therefore, the leakage of the chemical solution from the supply valve 18 can be detected while reducing the processing throughput.
  • the closed distribution valve 22 is opened prior to the pre-dispensing step (S2).
  • a pre-dispensing process (S2) can be performed, maintaining the distribution
  • the flow valve 22 in the closed state is opened before the arrangement step (S3).
  • the chemical can be discharged out of the upstream region 23. Therefore, it is possible to prevent the chemical liquid from being accumulated in the upstream region 23 during a period when the leakage detection is not performed. Therefore, the next leak detection can be performed satisfactorily.
  • the leak detection is enabled in the chemical process (S4), and the leak detection is disabled in the pre-dispensing process (S2).
  • the supply valve 18 if liquid leakage detection is enabled in the pre-dispensing step (S2), the supply valve 18 The possibility of false detection of leaking liquid cannot be completely excluded. However, in this embodiment, since the leak detection is invalidated during the execution of the pre-dispensing step (S2), only the leak from the supply valve 18 can be reliably detected.
  • the leak detection according to the present embodiment is detected after the processing liquid leaking from the supply valve 18 is accumulated, it is possible to detect a leak at a minute flow rate.
  • the detection by the flow meter 19 has a problem that leakage of a minute flow rate cannot be detected, such leakage of a minute flow rate can be detected well.
  • the detection by the flow meter 19 there is a concern about the influence of air biting due to foaming when the supply valve 18 is closed, but there is no such fear in the leak detection according to the present embodiment.
  • FIG. 6 is a diagram showing a main part of the substrate processing apparatus 201 according to the second embodiment of the present invention.
  • FIG. 7 is a time chart showing the open / close state of the supply valve 18, the position state of the chemical nozzle 13, the open / close state of the flow valve, and the valid / invalid state of the detection output of the liquid level sensor 224.
  • FIG. 8 is a schematic diagram when chemical liquid leaks from the chemical nozzle 13 in the standby step (S1 in FIG. 7).
  • portions corresponding to the respective portions shown in the first embodiment are denoted by the same reference numerals as in FIGS. 1 to 5 and description thereof is omitted.
  • the substrate processing apparatus 201 according to the second embodiment is different from the substrate processing apparatus 1 according to the first embodiment in that a detector (liquid level sensor 224) for detecting leakage is located in the upstream region.
  • a detector liquid level sensor 2214 for detecting leakage
  • the processing liquid collected in the branch area (branch drainage pipe 221) branched from the upstream area 23 is detected instead of detecting the processing liquid accumulated in the area 23. This will be specifically described below.
  • the upstream region 23 of the drainage pipe 21 includes a vertical portion 23a extending along the vertical direction.
  • a branch drainage pipe 221 is branched and connected to the middle part of the vertical part 23a.
  • the branch drainage pipe 221 includes, in order from the branch connection position 23b, a first pipe part 221a, a second pipe part 221b extending vertically upward from the downstream end of the first pipe part 221a, and a second pipe part 221b.
  • 3rd piping part 221c extended horizontally from the downstream end of this, and 4th piping part 221d extended below from the downstream end of 3rd piping part 221c.
  • the tip of the fourth piping portion 221d is connected to a predetermined processing facility.
  • the first and third piping portions 221a and 221c extend horizontally.
  • the second piping portion 221b connects the first piping portion 221a and the third piping portion 221c.
  • the second piping portion 221b extends, for example, along the vertical direction.
  • the fourth piping portion 221d connects the third piping portion 221c and the processing facility.
  • the fourth piping portion 221d extends, for example, in the vertical direction.
  • the first to fourth pipe portions 221a to 221d are configured by a single continuous pipe.
  • the inner diameter of the second piping portion 221b is a small diameter (for example, about 8 mm).
  • the liquid level sensor 224 detects the height of the chemical liquid stored in the second piping portion 221b. Since the liquid level sensor 224 has the same configuration as the liquid level sensor 224 (see FIG. 4F), the same reference numerals as those in FIG.
  • the detection output from the liquid level sensor 224 is input to the control device 3.
  • the circulation valve 22, the detector (the liquid level sensor 224), and the control device 3 constitute a liquid leakage detection unit that detects liquid leakage from the supply valve 18.
  • the branch drainage pipe 221 branches from the upstream area 23 (vertical portion 23a) of the drainage pipe 21, the chemical liquid flowing in the upstream area 23 is branched in the state where the flow valve 22 is opened. It is not led to 221, but is led to the downstream side of the flow valve 22 in the drainage pipe 21.
  • the chemical solution when the chemical solution is supplied to the upstream region 23 in the closed state of the flow valve 22, the chemical solution overflows in the upstream region 23, and the chemical solution flows into the branch drainage pipe 221. Accumulated inside.
  • the liquid level sensor 224 detects the height of the chemical stored in the second piping portion 221b.
  • a standby process (S1 in FIG. 7), a pre-dispensing process (a retreat discharge process; FIG. 7).
  • S2 a pre-dispensing process
  • S3 in FIG. 7 a nozzle arrangement step
  • S4 in FIG. 7 a chemical solution step
  • FIG. 7 shows the open / close state of the supply valve 18, the position state of the chemical nozzle 13, and the flow from the standby step (S 1 in FIG. 7) to the standby step (S 1 in FIG. 7) through the chemical solution step (S 4 in FIG. 7).
  • 6 is a time chart showing an open / close state of a valve 22 and a valid / invalid state of a detection output of a liquid level sensor 224.
  • FIG. 8 is a schematic diagram when chemical liquid leaks from the chemical nozzle 13 in the standby step (S1 in FIG. 7).
  • the chemical leaked from the supply valve 18 is discharged from the chemical nozzle 13 as shown in FIG. To be supplied.
  • the flow of leakage detection is the same as in the case of the first embodiment (see FIG. 5). That is, the control device 3 monitors whether or not there is a leak detection from the supply valve 18 in the standby step (S1 in FIG. 7) (T1 in FIG. 5). In the standby step (S1 in FIG. 7), based on the detection output from the liquid level sensor 224, the liquid level of the chemical stored in the second pipe portion 221b of the branch drain pipe 221 is the detected height position. 5 (YES in T1 in FIG. 5), the control device 3 displays a warning on the monitor (not shown) of the substrate processing apparatus 1 that the liquid has leaked from the supply valve 18 (T2 in FIG. 5). . Information indicating leakage from the supply valve 18 may be recorded as a log in a storage unit (not shown) of the control device 3. In this case, a warning indicating leakage from the supply valve 18 may not be displayed on the monitor.
  • the control device 3 determines YES at T1 in FIG.
  • the control device 3 opens the flow valve 22 in the closed state (T3 in FIG. 5).
  • the chemical liquid stored in the branch drainage pipe 221 can be discharged out of the machine through the downstream portion of the drainage pipe 21 relative to the flow valve 22.
  • leakage detection by the detector is performed over the entire processing period. Enabled.
  • the flow valve 22 when the flow valve 22 is opened, the chemical liquid flowing through the upstream region 23 is not guided to the branch drainage pipe 221 and the flow valve 22 is closed. Only, the chemical solution flows into the branch drainage pipe 221. Therefore, it is not necessary to invalidate the leak detection by the detector (liquid level sensor 224) in the chemical liquid process (S3 in FIG. 7). Therefore, as compared with the first embodiment, complicated control of switching between valid / invalid of leak detection becomes unnecessary.
  • the downstream end of the branch drainage pipe 221 is not connected to the processing facility, but rather than the flow valve 22 in the branch drainage pipe 221. May also be connected to the downstream portion.
  • the branch drainage pipe 221 includes a fifth pipe part 221e that connects the downstream end of the fourth pipe part 221d and the downstream side part of the branch drainage pipe 221 with respect to the flow valve 22. May be.
  • the downstream end of the branch drainage pipe 221 is connected to the upstream side of the branch connection position 23b in the upstream region 23 as in the second modification shown in FIG. May be.
  • a degassing pipe 231 for degassing may be branched and connected like a branch drainage pipe 221.
  • the gas vent pipe 231 is branched and connected to the downstream end (upper end) of the second pipe portion 221b.
  • the control device 3 when the chemical nozzle 13 is disposed at the retracted position P2, the control device 3 has been described as closing the flow valve 22 in the open state, but the flow valve 22 is closed.
  • the predetermined delay period D1 (see FIG. 3) may be delayed from the arrangement of the chemical nozzle 13 at the retracted position P2.
  • the closing of the flow valve 22 and the activation of the leakage detection by the detector are performed in synchronization, the activation of the leakage detection by the detector is more predetermined than the closing of the flow valve 22.
  • the delay period D2 (see FIG. 3) may be delayed.
  • the closing of the flow valve 22 and the start of effective leakage detection by the detector are after the pre-dispensing step (S2), the end of the nozzle retracting step (S5). It may be performed prior to.
  • the liquid leakage from the supply valve 18 is detected in the pre-dispensing drain pipe 21 or the branch drain pipe 221 branched from the drain pipe 21.
  • the pipes (distribution pipes) for detecting leakage are pipes connected to cups that are not used in the chemical liquid process (S4) among the cups included in the processing cup 30 that receives the processing liquid scattered from around the substrate.
  • drainage piping may be used.
  • the pipe (circulation pipe) to be detected for leakage may be an exhaust pipe (not shown).
  • a diaphragm-type suction device has been described as an example of the suction device 17, but a siphon-type suction device may be employed instead.
  • the detected amount of leakage from the supply valve 18 reaches a predetermined detection amount within a predetermined detection period, there is leakage from the supply valve 18. It may be detected. In this case, if the predetermined detection amount is not reached within a predetermined detection period, it is detected that there is no liquid leakage.
  • the processing liquid that is the target of leakage detection is described as a chemical liquid, but the processing liquid that is the target of leakage detection is a rinse liquid. Also good.
  • the substrate processing apparatus 1,201 is an apparatus for processing a disk-shaped substrate W.
  • the substrate processing apparatus 1,201 is a glass for a liquid crystal display device.
  • An apparatus for processing a polygonal substrate such as a substrate may be used.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

La présente invention concerne un dispositif de traitement de substrat comprenant : une unité de maintien de substrat servant à maintenir un substrat ; une buse de liquide de traitement servant à déverser un liquide de traitement afin de traiter le substrat ; un tuyau d'alimentation servant à alimenter la buse de liquide de traitement en liquide de traitement ; une vanne d'alimentation placée entre les tuyaux d'alimentation qui ouvre et ferme le tuyau d'alimentation ; un tuyau de circulation par lequel circule un liquide de traitement ayant été déversé par la buse de liquide de traitement et n'ayant pas été fourni au substrat maintenu par l'unité de maintien de substrat ; et une unité de détection de fuite servant à détecter la fuite du liquide de traitement par la vanne d'alimentation, équipée d'une vanne de circulation placée entre les tuyaux de circulation et qui ouvre et ferme le tuyau de circulation et d'un détecteur destiné à détecter le liquide de traitement recueilli dans une zone côté amont du tuyau de circulation du côté amont par rapport à la vanne de circulation ou le liquide de traitement recueilli dans une zone de ramification ramifiée à partir de la zone côté amont et pouvant recueillir le liquide de traitement, et à détecter le liquide qui a fui de la vanne d'alimentation en fonction du liquide de traitement recueilli dans la zone côté amont ou la zone de ramification tandis que les vannes d'alimentation et de circulation sont fermées.
PCT/JP2018/002151 2017-02-27 2018-01-24 Dispositif et procédé de traitement de substrat WO2018155054A1 (fr)

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CN201880009209.0A CN110235226B (zh) 2017-02-27 2018-01-24 基板处理装置以及基板处理方法

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JP2017242942A JP6975630B2 (ja) 2017-02-27 2017-12-19 基板処理装置および基板処理方法
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TWI748238B (zh) * 2018-08-31 2021-12-01 台灣積體電路製造股份有限公司 洩漏檢測系統、整合裝置及洩漏檢測方法

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