WO2018149029A1 - 一种高可靠性hemt制作方法 - Google Patents
一种高可靠性hemt制作方法 Download PDFInfo
- Publication number
- WO2018149029A1 WO2018149029A1 PCT/CN2017/081592 CN2017081592W WO2018149029A1 WO 2018149029 A1 WO2018149029 A1 WO 2018149029A1 CN 2017081592 W CN2017081592 W CN 2017081592W WO 2018149029 A1 WO2018149029 A1 WO 2018149029A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- hemt
- high reliability
- dielectric layer
- metal
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 28
- 238000002161 passivation Methods 0.000 claims abstract description 18
- 238000000151 deposition Methods 0.000 claims abstract description 12
- 238000005530 etching Methods 0.000 claims abstract description 4
- 230000004888 barrier function Effects 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 230000005533 two-dimensional electron gas Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 239000012535 impurity Substances 0.000 description 6
- 230000005669 field effect Effects 0.000 description 5
- 230000035882 stress Effects 0.000 description 5
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66431—Unipolar field-effect transistors with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Definitions
- the invention relates to a high reliability HEMT manufacturing method and belongs to the field of field effect transistor fabrication.
- High electron mobility transistors also known as modulation doped field effect transistors (MODFETs), also known as two-dimensional electron gas field effect transistors (2DEGFETs)
- MODFETs modulation doped field effect transistors
- 2DEGFETs two-dimensional electron gas field effect transistors
- HEMT channel field effect transistor
- HEMT High Efficiency Magnetoresistive Tunneling
- a wide bandgap material such as AlGaAs
- a narrow bandgap material such as GaAs
- a wide band gap material doped with an N-type impurity in the heterojunction serves as a supply layer for electrons to supply a large amount of electrons to the undoped narrow band gap material.
- the two-dimensional electron gas with no impurity scattering is used as the conductive channel, and the electron concentration in the channel is modulated by the gate voltage, and the source region and the drain region are disposed on both sides of the gate.
- the field effect transistor is the HEMT.
- the two-dimensional electron gas electron concentration of HEMT is caused by the difference of conduction energy between two semiconductor materials.
- the polarization effect of AlGaN and GaN also produces two-dimensional electron gas, and external stress causes electrons in two-dimensional electron gas.
- the concentration changes.
- the gate region of the device is covered by a thin dielectric layer and a passivation layer, that is, the region indicated by 1 in the figure.
- the existing process scheme can reduce the influence of the dielectric layer and the passivation layer on the device performance, but since the dielectric layer and the passivation layer are too thin, the reliability of the device in a humid environment is very poor.
- the present invention provides a high reliability HEMT manufacturing method.
- a high reliability HEMT manufacturing method comprising the following steps,
- Step 1 depositing a dielectric layer on the formed HEMT device, and planarizing the dielectric layer;
- Step 2 etching a plurality of through holes or grooves on the planarized dielectric layer
- Step 3 depositing a metal layer in the via hole or the trench, and planarizing the metal layer;
- step 4 a passivation layer is deposited on the planarized metal layer and the dielectric layer.
- the top surface of the planarized metal layer is flush with the top surface of the planarized dielectric layer.
- the stress of the dielectric layer ranges from -1 x 10 9 to 1 x 10 9 dyne/cm 2 .
- the dielectric layer includes a plurality of layers of media, and a dielectric barrier layer is disposed between adjacent two layers of media.
- the bottom of the metal layer is provided with a metal barrier layer.
- the passivation layer is SiN and/or SiON. .
- the invention adopts metal filling after opening first, and then depositing a passivation layer, and by optimizing the structure of the passivation layer, the moisture resistance of the device can be ensured, and the device has high reliability in working in a humid environment. At the same time, by adjusting the thickness and stress of the passivation layer, adjustment and optimization of device performance can be achieved.
- Figure 1 shows an existing HEMT.
- FIG. 2 is a schematic view of a low stress dielectric layer after deposition and planarization.
- FIG. 3 is a schematic view after etching a through hole or a groove.
- Figure 4 is a schematic view of the metal after deposition.
- Fig. 5 is a schematic view of the metal after planarization treatment.
- Figure 6 is a HEMT of the present invention.
- a high reliability HEMT manufacturing method includes the following steps:
- Step 1 As shown in FIG. 2, a dielectric layer is deposited on the formed HEMT device, and the dielectric layer 2 is planarized.
- CMP Chemical Mechanical Polishing
- the dielectric layer 2 includes one or more layers of dielectrics having a stress range of -1 ⁇ 10 9 to 1 ⁇ 10 9 dyne / cm 2 , if
- a dielectric barrier layer is disposed between two adjacent layers of media.
- Step 2 as shown in FIG. 3, a plurality of through holes or grooves 5 are etched on the dielectric layer 2 after the planarization process.
- Step 3 as shown in FIGS. 4 and 5, a metal layer 3 is deposited in the via hole or trench 5, and the metal layer 3 is planarized.
- the top surface of the planarized metal layer 3 is flush with the top surface of the planarized dielectric layer 2, and the metal layer 3 may be gold, copper, aluminum, etc., and the bottom of the metal layer 3 is provided with a metal barrier layer such as titanium. And or titanium nitride.
- Step 4 as shown in FIG. 6, a passivation layer 4 is deposited on the metal layer 3 and the dielectric layer 2 after the planarization process, and the passivation layer 4 is SiN and/or SiON.
- the above method adopts metal filling after opening first, and then depositing the passivation layer 4.
- the moisture resistance of the device can be ensured, and the device has high reliability in a humid environment;
- Layer 4 thickness and stress can be optimized for device performance.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Junction Field-Effect Transistors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (6)
- 一种高可靠性HEMT制作方法,其特征在于:包括以下步骤,步骤1,在成型后的HEMT器件上淀积介质层,并对介质层进行平坦化处理;步骤2,在平坦化处理后的介质层上刻蚀若干通孔或槽;步骤3,在通孔或槽中淀积金属层,并对金属层进行平坦化处理;步骤4,在平坦化处理后的金属层和介质层上淀积钝化层。
- 根据权利要求1所述的一种高可靠性HEMT制作方法,其特征在于:平坦化处理后的金属层顶面与平坦化处理后的介质层顶面齐平。
- 根据权利要求1或2所述的一种高可靠性HEMT制作方法,其特征在于:所述介质层的应力范围为-1×109~1×109dyne/cm2。
- 根据权利要求3所述的一种高可靠性HEMT制作方法,其特征在于:所述介质层包括多层介质,相邻两层介质之间设置有介质阻挡层。
- 根据权利要求1或2所述的一种高可靠性HEMT制作方法,其特征在于:所述金属层的底部设置有金属阻挡层。
- 根据权利要求1所述的一种高可靠性HEMT制作方法,其特征在于:所述钝化层为SiN和/或SiON。
Applications Claiming Priority (2)
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CN201710086139.6A CN106920747A (zh) | 2017-02-17 | 2017-02-17 | 一种高可靠性hemt制作方法 |
CN2017100861396 | 2017-02-17 |
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WO2018149029A1 true WO2018149029A1 (zh) | 2018-08-23 |
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PCT/CN2017/081592 WO2018149029A1 (zh) | 2017-02-17 | 2017-04-24 | 一种高可靠性hemt制作方法 |
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WO (1) | WO2018149029A1 (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101162695A (zh) * | 2006-10-09 | 2008-04-16 | 西安能讯微电子有限公司 | 氮化镓hemt器件表面钝化及提高器件击穿电压的工艺 |
CN102237405A (zh) * | 2010-05-07 | 2011-11-09 | 富士通半导体股份有限公司 | 复合半导体器件及其制造方法 |
CN102714219A (zh) * | 2009-12-10 | 2012-10-03 | 特兰斯夫公司 | 反侧设计的iii-氮化物器件 |
CN103904110A (zh) * | 2014-01-20 | 2014-07-02 | 西安电子科技大学 | 加栅场板耗尽型绝缘栅AlGaN/GaN器件结构及其制作方法 |
-
2017
- 2017-02-17 CN CN201710086139.6A patent/CN106920747A/zh active Pending
- 2017-04-24 WO PCT/CN2017/081592 patent/WO2018149029A1/zh active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101162695A (zh) * | 2006-10-09 | 2008-04-16 | 西安能讯微电子有限公司 | 氮化镓hemt器件表面钝化及提高器件击穿电压的工艺 |
CN102714219A (zh) * | 2009-12-10 | 2012-10-03 | 特兰斯夫公司 | 反侧设计的iii-氮化物器件 |
CN102237405A (zh) * | 2010-05-07 | 2011-11-09 | 富士通半导体股份有限公司 | 复合半导体器件及其制造方法 |
CN103904110A (zh) * | 2014-01-20 | 2014-07-02 | 西安电子科技大学 | 加栅场板耗尽型绝缘栅AlGaN/GaN器件结构及其制作方法 |
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