WO2018133143A1 - Oled封装方法 - Google Patents
Oled封装方法 Download PDFInfo
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- WO2018133143A1 WO2018133143A1 PCT/CN2017/073724 CN2017073724W WO2018133143A1 WO 2018133143 A1 WO2018133143 A1 WO 2018133143A1 CN 2017073724 W CN2017073724 W CN 2017073724W WO 2018133143 A1 WO2018133143 A1 WO 2018133143A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8794—Arrangements for heating and cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Definitions
- the present invention relates to the field of display technologies, and in particular, to an OLED packaging method.
- OLED Organic Light-Emitting Diode
- organic electroluminescent display also known as an organic electroluminescent display
- OLED Organic Light-Emitting Diode
- High definition and contrast ratio, near 180° viewing angle, wide temperature range, flexible display and large-area full-color display, etc., are recognized by the industry as the most promising display device.
- the OLED device generally includes a substrate, an anode disposed on the substrate, a hole injection layer disposed on the anode, a hole transport layer disposed on the hole injection layer, and a light-emitting layer disposed on the hole transport layer.
- the principle of illumination of OLED devices is that semiconductor materials and organic luminescent materials are driven by electric fields, causing luminescence by carrier injection and recombination.
- an OLED device generally uses an indium tin oxide (ITO) pixel electrode and a metal electrode as anodes and cathodes of the device, respectively.
- ITO indium tin oxide
- electrons and holes are injected from the cathode and the anode to the electron transport layer and hole transport, respectively.
- the layers, electrons and holes migrate to the light-emitting layer through the electron transport layer and the hole transport layer, respectively, and meet in the light-emitting layer to form excitons and excite the light-emitting molecules, and the latter emits visible light through radiation relaxation.
- the existing OLED display device generally needs to provide a cover plate above the OLED device to encapsulate the OLED device, in order to improve the airtightness between the cover plate and the substrate, and avoid the invasion of external water vapor and oxygen to make the performance of the OLED device.
- a glass paste (Frit) as an adhesive between the cover plate and the base substrate, and the glass paste is adhered to the cover plate and the base substrate by laser sealing.
- FIG. 1 is a schematic structural view of an OLED display device using a cover plate and a glass paste package, comprising a substrate substrate 100', an OLED device 200' disposed on the substrate substrate 100', and A cover 300' above the OLED device 200', and a glass paste 400' disposed on the periphery of the OLED device 200' and connecting the base substrate 100' and the cover 300'.
- the OLED display device is fabricated, the OLED device 200' is first fabricated on the substrate substrate 100', and then a ring of glass glue 400' is coated on the cover 300' corresponding to the periphery of the OLED device 200', and then the glass paste 400 is applied.
- the object of the present invention is to provide an OLED packaging method, which is simple in operation, low in production cost, good in packaging effect, and high in product yield.
- the present invention provides an OLED packaging method, including the following steps:
- Step 1 providing a substrate, forming an OLED device on the substrate, and forming a water-releasing layer on the substrate corresponding to the periphery of the OLED device;
- Step 2 providing a cover plate, coating a ring of glass glue on the cover plate corresponding to the periphery of the OLED device, the position of the glass glue corresponding to the water-releasing layer;
- Step 3 sintering the glass glue at a high temperature
- Step 4 in a vacuum environment, the side of the cover plate coated with the glass glue and the substrate substrate are formed with a pair of OLED devices, so that the glass glue is in contact with the water-releasing layer;
- Step 5 introducing an aqueous gas to exotherm the water-releasing layer, and heating the molten glass glue to bond the substrate and the cover.
- the shape of the water-releasing layer is a rectangular frame.
- the width of the water-releasing layer is greater than the width of the glass glue.
- the material of the water-releasing layer includes one or more of sodium and magnesium.
- the water-releasing layer is formed by evaporation or sputtering.
- the glass glue is applied by screen printing, dispensing, or nozzle printing.
- the material of the cover plate is glass.
- the aqueous gas is water vapor or air.
- the invention also provides an OLED packaging method, comprising the following steps:
- Step 1 providing a substrate, forming an OLED device on the substrate, and forming a water-releasing layer on the substrate corresponding to the periphery of the OLED device;
- Step 2 providing a cover plate, coating a ring of glass glue on the cover plate corresponding to the periphery of the OLED device, the position of the glass glue corresponding to the water-releasing layer;
- Step 3 sintering the glass glue at a high temperature
- Step 4 in a vacuum environment, the side of the cover plate coated with the glass glue and the substrate substrate are formed with a pair of OLED devices, so that the glass glue is in contact with the water-releasing layer;
- Step 5 introducing an aqueous gas to cause the reaction of the water-releasing layer to exotherm, heating the molten glass glue to bond the substrate and the cover plate;
- the shape of the water-releasing layer is a rectangular frame
- the water-releasing layer is formed by evaporation or sputtering.
- the invention provides an OLED packaging method, in which a glass glue is coated on a periphery of a corresponding OLED device on a cover plate, and a water-repellent heat-dissipating layer is formed on the substrate substrate corresponding to the glass glue, and the cover plate is After the base substrate is paired, the glass glue is contacted with the water-releasing heat-releasing layer, and then the water-containing gas is introduced to make the water-releasing heat-dissipating layer react and exotherm, thereby heating the molten glass glue to bond the cover plate and the base substrate, and the existing Compared with the technology, the laser process is not required, the cost of the laser device is saved, the production cost is reduced, and the heat generated by the water release layer is controlled and uniform, the package effect is good, and the product yield is high.
- FIG. 1 is a schematic structural view of an existing OLED display device using a cover plate and a glass paste
- step 1 of the OLED packaging method of the present invention is a schematic diagram of step 1 of the OLED packaging method of the present invention.
- step 2 of the OLED packaging method of the present invention is a schematic diagram of step 2 of the OLED packaging method of the present invention.
- FIG. 5 is a schematic diagram of step 4 of the OLED packaging method of the present invention.
- FIG. 6 is a schematic diagram of step 5 of the OLED packaging method of the present invention.
- the present invention provides an OLED packaging method, including the following steps:
- Step 1 Referring to FIG. 3, a substrate substrate 100 is provided on which an OLED device 200 is formed, on which a water-releasing layer 300 is formed corresponding to the periphery of the OLED device 200.
- a TFT array layer is disposed on the base substrate 100, and the OLED device 200 is formed on the TFT array layer.
- the water-releasing layer 300 is used to react with water to exotherm in a subsequent process, thereby heating the molten glass glue.
- the material of the water-releasing layer 300 may be easily reacted with water.
- the material of the water-releasing layer 300 includes one or more of sodium (Na) and magnesium (Mg), and of course, other heats that can react with water can be selected. s material.
- the water-releasing layer 300 is formed by evaporation or sputtering.
- the thickness of the water-releasing layer 300 can be designed according to actual product requirements, and the heat released by the reaction with water can make the glass glue reach the melting temperature.
- Step 2 please refer to FIG. 4, a cover plate 400 is provided, and a ring of glass glue 500 is coated on the cover plate 400 corresponding to the periphery of the OLED device 200, and the position of the glass glue 500 corresponds to the water-releasing heat release layer 300. .
- the shape of the glass glue 500 is a rectangular frame
- the shape of the water-repellent heat-dissipating layer 300 is also a rectangular frame, so that the water-releasing layer 300 can heat the entire glass glue 500.
- the width of the water-releasing layer 300 is greater than the width of the glass glue 500.
- the material of the cover plate 300 is glass.
- the glass paste 500 is applied by screen printing, Dispenser, or Nozzle print.
- Step 3 Sintering the glass paste 500 at a high temperature.
- the high temperature sintering step removes the solvent and the organic binder in the glass paste 500.
- Step 4 referring to FIG. 5, the side of the cover plate 400 coated with the glass paste 500 and the substrate substrate 100 are formed in a vacuum environment to form a pair of the OLED device 200, so that the glass paste 500 and the water contact heat Layer 300 is in contact.
- Step 5 referring to FIG. 6, the water-containing heat release layer 300 is reacted and exothermic by introducing an aqueous gas, and the molten glass paste 500 is heated to bond the base substrate 100 and the cover 400.
- the aqueous gas is water vapor or air, preferably water vapor.
- VAS Vacuum Align System
- the water-releasing layer 300 reacts with water to release a large amount of heat, and at the same time, produces a powdery solid and melts.
- the glass glue 500 in the state completely covers the powdery solid while bonding the base substrate 100 and the cover 400.
- a water-repellent heat-dissipating layer 300 is formed on the substrate substrate 100 by applying a ring of glass glue 500 on the outer surface of the corresponding OLED device 200 on the cover plate 400, and the cover is formed in a vacuum environment.
- One side of the plate 400 having the glass paste 500 is paired with the side of the base substrate 100 having the OLED device 200, and the glass paste 500 is brought into contact with the water-releasing layer 300, and then an aqueous gas is introduced, and the water in the aqueous gas can be combined with
- the water-releasing layer 300 reacts to release a large amount of heat to the water-releasing layer 300, and further heats and melts the glass paste 500 in contact with the water-releasing layer 300, thereby enabling the glass paste 500 to be bonded to the lining.
- the base substrate 100 and the cover plate 400 complete the packaging of the OLED; since the water-releasing layer 300 can design the thickness of the water and control the amount of the water-containing gas, the heat of the glass paste 500 can be obtained.
- the laser process saves the cost of the laser device and reduces the production cost.
- the heat generated by the water release layer 300 is controllable, and the heat is evenly distributed on the water-releasing layer 300, without the need for debugging of the laser process, and the operation is simple.
- the melting effect of the glass glue 500 is improved, the packaging effect of the OLED is ensured, and the product yield can be effectively improved.
- a glass paste is coated on the periphery of the corresponding OLED device on the cover plate, and a water-releasing layer is formed on the substrate substrate corresponding to the glass glue, and the cover plate and the substrate substrate are paired.
- the glass glue is contacted with the water-releasing layer, and then the water-containing gas is introduced to make the water-releasing layer react and exotherm, thereby heating the molten glass glue to bond the cover plate and the substrate, compared with the prior art.
- No laser process is required, the cost of the laser equipment is saved, the production cost is reduced, and the heat generated by the water release layer is controlled and uniform, the packaging effect is good, and the product yield is high.
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Abstract
一种OLED封装方法，在盖板（400）上对应OLED器件（200）的外围涂布玻璃胶（500），并在衬底基板（100）上对应玻璃胶（500）形成遇水放热层（300），将盖板（400）与衬底基板（100）对组后使玻璃胶（500）与遇水放热层（300）接触，而后通入含水气体使遇水放热层（300）反应放热，从而加热熔融玻璃胶（500）使其结合盖板（400）与衬底基板（100），与现有技术相比，无需激光制程，节省了激光设备的费用，降低生产成本，同时遇水放热层（300）产生的热量可控且均匀，封装效果好，产品良率高。
Description
本发明涉及显示技术领域，尤其涉及一种OLED封装方法。
有机发光二极管(Organic Light-Emitting Diode，OLED)显示器，也称为有机电致发光显示器，是一种新兴的平板显示装置，由于其具有自发光、驱动电压低、发光效率高、响应时间短、清晰度与对比度高、近180°视角、使用温度范围宽，可实现柔性显示与大面积全色显示等诸多优点，被业界公认为是最有发展潜力的显示装置。
OLED器件通常包括：基板、设于基板上的阳极、设于阳极上的空穴注入层、设于空穴注入层上的空穴传输层、设于空穴传输层上的发光层、设于发光层上的电子传输层、设于电子传输层上的电子注入层、及设于电子注入层上的阴极。OLED器件的发光原理为半导体材料和有机发光材料在电场驱动下，通过载流子注入和复合导致发光。具体的，OLED器件通常采用氧化铟锡(ITO)像素电极和金属电极分别作为器件的阳极和阴极，在一定电压驱动下，电子和空穴分别从阴极和阳极注入到电子传输层和空穴传输层，电子和空穴分别经过电子传输层和空穴传输层迁移到发光层，并在发光层中相遇，形成激子并使发光分子激发，后者经过辐射弛豫而发出可见光。
现有的OLED显示装置一般需要在OLED器件的上方设置盖板以对OLED器件进行封装，为了提升盖板与衬底基板之间的气密性，避免外界水汽和氧气的侵入使得OLED器件的性能下降，需要在盖板与衬底基板之间设置作为粘着剂的玻璃胶(Frit)，并采用激光密封(Laser sealing)的方式使玻璃胶粘合于盖板与衬底基板。图1为现有的一种采用盖板与玻璃胶封装的OLED显示装置的结构示意图，包括衬底基板100’、设于所述衬底基板100’上的OLED器件200’、设于所述OLED器件200’上方的盖板300’、及设于OLED器件200’外围且连接所述衬底基板100’与盖板300’的玻璃胶400’。该OLED显示装置在制作时，首先在衬底基板100’上制作OLED器件200’，接着对应OLED器件200’的外围在盖板300’上涂布一圈玻璃胶400’，之后对玻璃胶400’进行高温烧结去除溶剂及有机粘结剂，然后将盖板300’涂有玻璃胶400’的一侧与衬底基板100’设有OLED器件200’的一侧
对组，并利用激光照射玻璃胶400’使其熔融从而结合衬底基板100’与盖板300’，最后进行切割制程，完成OLED显示装置的制作。然而，对玻璃胶400’进行激光照射的机台价格昂贵，使OLED显示装置的成本大大增加，同时激光照射玻璃胶的工艺较难控制，很容易造成封装失效，影响OLED显示装置的品质。
发明内容
本发明的目的在于提供一种OLED封装方法，操作简单，生产成本低，封装效果好，产品良率高。
为实现上述目的，本发明提供一种OLED封装方法，包括如下步骤：
步骤1、提供一衬底基板，在所述衬底基板上形成OLED器件，在所述衬底基板上对应OLED器件的外围形成遇水放热层；
步骤2、提供一盖板，在所述盖板上对应OLED器件的外围涂布一圈玻璃胶，所述玻璃胶的位置与遇水放热层对应；
步骤3、高温烧结所述玻璃胶；
步骤4、在真空环境下将盖板涂布有玻璃胶的一侧与衬底基板形成有OLED器件的一侧对组，使玻璃胶与遇水放热层接触；
步骤5、通入含水气体使遇水放热层反应放热，加热熔融玻璃胶使其结合衬底基板与盖板。
所述遇水放热层的形状为矩形框。
所述遇水放热层的宽度大于玻璃胶的宽度。
所述遇水放热层的材料包括钠、及镁中的一种或多种。
所述步骤1中通过蒸镀或溅射的方式形成遇水放热层。
所述步骤2中通过丝网印刷、点胶、或喷嘴打印的方式涂布玻璃胶。
所述盖板的材料为玻璃。
所述含水气体为水汽或空气。
本发明还提供一种OLED封装方法，包括如下步骤：
步骤1、提供一衬底基板，在所述衬底基板上形成OLED器件，在所述衬底基板上对应OLED器件的外围形成遇水放热层；
步骤2、提供一盖板，在所述盖板上对应OLED器件的外围涂布一圈玻璃胶，所述玻璃胶的位置与遇水放热层对应；
步骤3、高温烧结所述玻璃胶；
步骤4、在真空环境下将盖板涂布有玻璃胶的一侧与衬底基板形成有OLED器件的一侧对组，使玻璃胶与遇水放热层接触；
步骤5、通入含水气体使遇水放热层反应放热，加热熔融玻璃胶使其结合衬底基板与盖板；
其中，所述遇水放热层的形状为矩形框；
其中，所述步骤1中通过蒸镀或溅射的方式形成遇水放热层。
本发明的有益效果：本发明提供的一种OLED封装方法，在盖板上对应OLED器件的外围涂布玻璃胶，并在衬底基板上对应玻璃胶形成遇水放热层，将盖板与衬底基板对组后使玻璃胶与遇水放热层接触，而后通入含水气体使遇水放热层反应放热，从而加热熔融玻璃胶使其结合盖板与衬底基板，与现有技术相比，无需激光制程，节省了激光设备的费用，降低生产成本，同时遇水放热层产生的热量可控且均匀，封装效果好，产品良率高。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为现有的一种采用盖板与玻璃胶封装的OLED显示装置的结构示意图；
图2为本发明的OLED封装方法的流程图；
图3为本发明的OLED封装方法的步骤1的示意图；
图4为本发明的OLED封装方法的步骤2的示意图；
图5为本发明的OLED封装方法的步骤4的示意图；
图6为本发明的OLED封装方法的步骤5的示意图。
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图2，本发明提供一种OLED封装方法，包括如下步骤：
步骤1、请参阅图3，提供一衬底基板100，在所述衬底基板100上形成OLED器件200，在所述衬底基板100上对应OLED器件200的外围形成遇水放热层300。
具体地，所述衬底基板100上设有TFT阵列层，所述OLED器件200形成于所述TFT阵列层上。
具体地，所述遇水放热层300用于在后续的制程中与水反应放热，从而加热熔融玻璃胶，具体地，所述遇水放热层300的材料可选择易与水反应并放出大量热量的活泼金属，优选地，所述遇水放热层300的材料包括钠(Na)、及镁(Mg)中的一种或多种，当然也可选择其他可与水反应放热的材料。
具体地，所述步骤1中通过蒸镀或溅射(sputter)的方式形成遇水放热层300。
具体地，所述遇水放热层300的厚度可根据实际的产品需求进行设计，满足其与水反应放出的热量能够使玻璃胶达到熔融的温度即可。
步骤2、请参阅图4，提供一盖板400，在所述盖板400上对应OLED器件200的外围涂布一圈玻璃胶500，所述玻璃胶500的位置与遇水放热层300对应。
具体地，所述玻璃胶500的形状为矩形框，所述遇水放热层300的形状与其一致也为矩形框，使遇水放热层300能够对整个玻璃胶500进行加热。
进一步地，为进一步确保后续制程遇水放热层300能够对整个玻璃胶500进行有效加热，所述遇水放热层300的宽度大于玻璃胶500的宽度。
具体地，所述盖板300的材料为玻璃。
具体地，所述步骤2中通过丝网印刷(Screen print)、点胶(Dispenser)、或喷嘴打印(Nozzle print)的方式涂布玻璃胶500。
步骤3、高温烧结所述玻璃胶500。
具体地，该高温烧结步骤可去除玻璃胶500中的溶剂和有机粘着剂。
步骤4、请参阅图5，在真空环境下将盖板400涂布有玻璃胶500的一侧与衬底基板100形成有OLED器件200的一侧对组，使玻璃胶500与遇水放热层300接触。
步骤5、请参阅图6，通入含水气体使遇水放热层300反应放热，加热熔融玻璃胶500使其结合衬底基板100与盖板400。
具体地，所述含水气体为水汽或空气，优选为水汽。
具体地，所述步骤4及步骤5均在真空贴合系统(Vacuum Align System，VAS)中进行。
具体地，当所述遇水放热层300的材料选择钠或镁中的一种或多种时，所述遇水放热层300与水反应后放出大量热量，同时产生粉末状固体，熔融状态的玻璃胶500结合衬底基板100与盖板400的同时完全包覆住粉末状固体。
本发明的OLED封装方法，通过在盖板400上对应OLED器件200外围涂布一圈玻璃胶500，在衬底基板100上对应玻璃胶500形成遇水放热层300，在真空环境下将盖板400具有玻璃胶500的一侧与衬底基板100具有OLED器件200的一侧进行对组使玻璃胶500与遇水放热层300接触，接着通入含水气体，含水气体中的水能够与遇水放热层300进行反应，使遇水放热层300释放出大量的热量，进而对与遇水放热层300接触的玻璃胶500进行加热使其熔融，从而使玻璃胶500能够结合衬底基板100与盖板400，完成OLED的封装；由于遇水放热层300能够通过对其厚度进行设计并控制通入含水气体的量即可获得能够使玻璃胶500达到熔融温度的热量，无需激光制程，节省了激光设备的费用，降低生产成本，同时遇水放热层300产生的热量可控，且热量均匀分布在遇水放热层300上，无需激光工艺的调试，操作简单，使玻璃胶500的熔融效果提升，保证了OLED的封装效果，能有效提升产品良率。
综上所述，本发明的OLED封装方法，在盖板上对应OLED器件的外围涂布玻璃胶，并在衬底基板上对应玻璃胶形成遇水放热层，将盖板与衬底基板对组后使玻璃胶与遇水放热层接触，而后通入含水气体使遇水放热层反应放热，从而加热熔融玻璃胶使其结合盖板与衬底基板，与现有技术相比，无需激光制程，节省了激光设备的费用，降低生产成本，同时遇水放热层产生的热量可控且均匀，封装效果好，产品良率高。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。
Claims (14)
- 一种OLED封装方法，包括如下步骤：步骤1、提供一衬底基板，在所述衬底基板上形成OLED器件，在所述衬底基板上对应OLED器件的外围形成遇水放热层；步骤2、提供一盖板，在所述盖板上对应OLED器件的外围涂布一圈玻璃胶，所述玻璃胶的位置与遇水放热层对应；步骤3、高温烧结所述玻璃胶；步骤4、在真空环境下将盖板涂布有玻璃胶的一侧与衬底基板形成有OLED器件的一侧对组，使玻璃胶与遇水放热层接触；步骤5、通入含水气体使遇水放热层反应放热，加热熔融玻璃胶使其结合衬底基板与盖板。
- 如权利要求1所述的OLED封装方法，其中，所述遇水放热层的形状为矩形框。
- 如权利要求2所述的OLED封装方法，其中，所述遇水放热层的宽度大于玻璃胶的宽度。
- 如权利要求1所述的OLED封装方法，其中，所述遇水放热层的材料包括钠、及镁中的一种或多种。
- 如权利要求1所述的OLED封装方法，其中，所述步骤1中通过蒸镀或溅射的方式形成遇水放热层。
- 如权利要求1所述的OLED封装方法，其中，所述步骤2中通过丝网印刷、点胶、或喷嘴打印的方式涂布玻璃胶。
- 如权利要求1所述的OLED封装方法，其中，所述盖板的材料为玻璃。
- 如权利要求1所述的OLED封装方法，其中，所述含水气体为水汽或空气。
- 一种OLED封装方法，包括如下步骤：步骤1、提供一衬底基板，在所述衬底基板上形成OLED器件，在所述衬底基板上对应OLED器件的外围形成遇水放热层；步骤2、提供一盖板，在所述盖板上对应OLED器件的外围涂布一圈玻璃胶，所述玻璃胶的位置与遇水放热层对应；步骤3、高温烧结所述玻璃胶；步骤4、在真空环境下将盖板涂布有玻璃胶的一侧与衬底基板形成有 OLED器件的一侧对组，使玻璃胶与遇水放热层接触；步骤5、通入含水气体使遇水放热层反应放热，加热熔融玻璃胶使其结合衬底基板与盖板；其中，所述遇水放热层的形状为矩形框；其中，所述步骤1中通过蒸镀或溅射的方式形成遇水放热层。
- 如权利要求9所述的OLED封装方法，其中，所述遇水放热层的宽度大于玻璃胶的宽度。
- 如权利要求9所述的OLED封装方法，其中，所述遇水放热层的材料包括钠、及镁中的一种或多种。
- 如权利要求9所述的OLED封装方法，其中，所述步骤2中通过丝网印刷、点胶、或喷嘴打印的方式涂布玻璃胶。
- 如权利要求9所述的OLED封装方法，其中，所述盖板的材料为玻璃。
- 如权利要求9所述的OLED封装方法，其中，所述含水气体为水汽或空气。
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| CN104119810A (zh) * | 2013-04-25 | 2014-10-29 | 京东方科技集团股份有限公司 | 封框胶及其封合方法、显示面板及显示装置 |
| CN104600222A (zh) * | 2015-02-04 | 2015-05-06 | 京东方科技集团股份有限公司 | 封装方法、显示面板及显示装置 |
| CN104617128A (zh) * | 2015-01-23 | 2015-05-13 | 京东方科技集团股份有限公司 | 一种显示面板及其制作方法和显示装置 |
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| KR102181237B1 (ko) * | 2014-03-17 | 2020-11-23 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| CN104966726A (zh) * | 2015-07-03 | 2015-10-07 | 深圳市华星光电技术有限公司 | 一种oled显示面板及其封装方法 |
| KR102439308B1 (ko) * | 2015-10-06 | 2022-09-02 | 삼성디스플레이 주식회사 | 표시장치 |
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| CN104119810A (zh) * | 2013-04-25 | 2014-10-29 | 京东方科技集团股份有限公司 | 封框胶及其封合方法、显示面板及显示装置 |
| CN103531718A (zh) * | 2013-10-25 | 2014-01-22 | 上海大学 | Oled封装结构 |
| CN104617128A (zh) * | 2015-01-23 | 2015-05-13 | 京东方科技集团股份有限公司 | 一种显示面板及其制作方法和显示装置 |
| CN104600222A (zh) * | 2015-02-04 | 2015-05-06 | 京东方科技集团股份有限公司 | 封装方法、显示面板及显示装置 |
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