WO2018132981A1 - 一种用于矩阵排列芯片的不良品标记识别装置 - Google Patents

一种用于矩阵排列芯片的不良品标记识别装置 Download PDF

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Publication number
WO2018132981A1
WO2018132981A1 PCT/CN2017/071571 CN2017071571W WO2018132981A1 WO 2018132981 A1 WO2018132981 A1 WO 2018132981A1 CN 2017071571 W CN2017071571 W CN 2017071571W WO 2018132981 A1 WO2018132981 A1 WO 2018132981A1
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chip
matrix array
substrate
image
array chip
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PCT/CN2017/071571
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English (en)
French (fr)
Inventor
赵余成
张伟宏
谭巧灵
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深圳市汇顶科技股份有限公司
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Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to PCT/CN2017/071571 priority Critical patent/WO2018132981A1/zh
Priority to CN201780000010.7A priority patent/CN107004622B/zh
Publication of WO2018132981A1 publication Critical patent/WO2018132981A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices

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  • the present application relates to the field of chip testing technologies, and in particular, to a defective article marking device for matrix arraying chips.
  • the matrix array chip (Strip chip) has a plurality of chips arranged in a matrix on a strip substrate, and the chip has a certain spatial distance from the chip, so that the customer can cut into the shape and size that he needs.
  • a defective chip such as an appearance or an electrical performance failure often exists on the strip substrate.
  • the defective chip is detected, it is usually identified by the defective product mark whether the chip is a defective chip.
  • the chip for identifying defective products is only used for image acquisition and recognition of a single chip, and the image collection and recognition by a pair of chips arranged in a matrix on the strip substrate causes the recognition efficiency to be low.
  • the image is collected on a strip substrate by a pair of chips arranged in a matrix, and the moving device is required to move the substrate so that the cameras are aligned one by one to the chip to be identified, resulting in high detection cost and complicated process.
  • one of the technical problems to be solved by the embodiments of the present application is to provide a defective product mark recognition device for matrix array chips, which is used for efficiently performing defect identification mark identification of a matrix array chip, reducing detection cost, and operating The process is simple.
  • the embodiment of the present application provides a defective product mark identification device for a matrix array chip, comprising: a moving device that drives a substrate of the matrix array chip to move, and a camera that performs image acquisition on each chip on the substrate, The moving device moves each chip on the substrate to an ideal region of illumination conditions, the camera captures each chip image of the ideal region of the illumination condition, and splices the collected chip images into a complete image of the substrate. Identifying the complete image A matrix array chip having defective product marks.
  • the present application further provides a method for identifying a defective product mark for a matrix array chip, comprising:
  • a matrix array chip having a defective product mark is identified for the complete image.
  • the mobile device of the present application moves each chip on the substrate to an ideal area of illumination conditions to enable the camera to capture images of each chip, and splicing the collected chip images into the completeness of the substrate.
  • the application can efficiently realize the defective product mark recognition of the matrix array chip, and reduces the detection cost, and the operation flow is simple.
  • FIG. 1 is a schematic structural view of a defective article marking device for matrix array chips of the present application
  • FIG. 2 is a schematic view showing reflection of a surface of a substrate in a defective article marking device for matrix array chips according to the present application
  • FIG. 3 is a schematic view showing an ideal region of illumination conditions in a defective article marking device for matrix array chips of the present application
  • FIG. 4 is a flow chart of a method for identifying a defective product mark for a matrix array chip according to the present application
  • step S4 is a flow chart of step S4 in the method for identifying a defective product mark for matrix array chips according to the present application
  • FIG. 6 is a schematic diagram of template selection in a method for identifying a defective product in a matrix array chip according to the present application
  • step S42 is a flow of step S42 in the method for identifying a defective product in the matrix array chip of the present application.
  • FIG. 8 is a schematic diagram of a chip outline in a method for identifying a defective product in a matrix array chip according to the present application.
  • the mobile device of the present application moves each chip on the substrate to an ideal area of illumination conditions to enable the camera to capture images of each chip, and splicing the collected chip images into a complete image of the substrate, for the complete
  • the image identifies a matrix array chip with defective product marks. Therefore, the mobile device only needs to drive the substrate to an ideal area of illumination conditions to enable the camera to capture images of the chips without moving the substrate to align the cameras one by one with the chip to be identified.
  • the application can efficiently realize the defective product mark recognition of the matrix array chip, and reduces the detection cost, and the operation flow is simple.
  • the present application provides a defective article marking device for matrix arraying a chip, comprising: a moving device 11 for moving a substrate of the matrix array chip, and performing image collection on each chip on the substrate Camera 12.
  • the moving device 11 moves each chip on the substrate 2 to an ideal area for illumination conditions, and the camera 12 captures each chip image of the ideal region of the illumination condition, and splices the collected chip images into the substrate. A complete image for which a matrix array chip having a defective product mark is identified.
  • the mobile device 11 only needs to drive the substrate 2 to an ideal area of illumination conditions so that The camera 12 collects images of the chips without moving the substrate 2 to align the cameras 12 one by one with the chips to be identified.
  • the application can efficiently realize the defective product mark recognition of the matrix array chip, and reduces the detection cost, and the operation flow is simple.
  • the chip area on the strip substrate is only 1/100 or less of the substrate area, so for each chip in the complete image of the substrate It can be clearly seen that the camera 12 uses a camera with a resolution of 5 megapixels.
  • the camera 12 is calibrated, the distance between the substrate and the camera lens is 20 cm to 25 cm, and the lens of the camera adopts a focal length of 6 mm to 12 mm. Wide angle lens.
  • the embodiment of the present application arranges a light source on both sides of the substrate to ensure uniform brightness on the left and right.
  • the light source arrangement in the embodiment of the present application is arranged in a diagonal side light manner. Therefore, only diffuse reflection light is generated on the surface of the substrate, and the diffuse reflection light is weak, and the image capturing of the camera 12 is less affected.
  • the light source adopts a strip light source of 250*20 mm.
  • the length of the strip substrate is generally 24 cm, and the two ends of the substrate are weakly received.
  • the ideal area of the illumination condition is: the matrix arrangement
  • the difference between the maximum value and the minimum value of the gray scale average value of the chip is not more than 20.
  • the ideal region of the illumination condition is an interval region of 60 mm to 200 mm from the light source.
  • the present application further provides a method for identifying a defective product mark for a matrix array chip.
  • the method includes:
  • the length of the strip substrate is generally 24 cm, and the two ends of the substrate are weakly received.
  • the ideal area of the illumination condition is: the gray level of the matrix array chip The area where the difference between the maximum value and the minimum value of the mean is not more than 20.
  • the ideal region of the illumination condition is an interval region of 60 mm to 200 mm from the light source.
  • S2. Collect, by the camera, image of each chip of the ideal region of the illumination condition.
  • the chip area on the strip substrate is only 1/100 or less of the substrate area, so for each chip in the complete image of the substrate It can be clearly seen that the camera 12 uses a camera with a resolution of 5 megapixels.
  • the camera 12 is calibrated, the distance between the substrate and the camera lens is 20 cm to 25 cm, and the lens of the camera adopts a focal length of 6 mm to 12 mm. Wide angle lens.
  • the embodiment of the present application arranges a light source on both sides of the substrate to ensure uniform brightness on the left and right.
  • the light source arrangement in the embodiment of the present application is arranged in a diagonal side light manner. Therefore, only diffuse reflection light is generated on the surface of the substrate, and the diffuse reflection light is weak, and the image capturing of the camera 12 is less affected.
  • the light source adopts a strip light source of 250*20 mm.
  • the embodiment of the present application may cause the camera to perform the step S2 multiple times, that is, multiple times to acquire images of the chips in the ideal region of the illumination condition, and multiple acquisitions.
  • the image is synthesized as a complete image of the substrate.
  • the step S2 is performed twice in a plurality of times.
  • the step S4 includes:
  • the step S41 is specifically: using the chip peripheral image and the peripheral mark as a template, and identifying the position of each chip on the substrate by using a template matching algorithm to extract an image of each matrix array chip.
  • the chip upper portion 61 and the lower portion 62 are used as templates to avoid the defective product mark 63 at the center of the chip.
  • the embodiment of the present application locks the chips by template matching. The position on the substrate is thereby extracted from the images of the matrix array chips.
  • the step S42 includes:
  • S421 Extract contours of the matrix array chips, and calculate an area included in the contour.
  • the outline of the matrix array chip 81 having no defective product mark includes a chip pin
  • the outline of the matrix array chip 82 having a defective product mark includes the outline of the chip pin and the defective article mark. Therefore, the outline of the matrix array chip 82 having the defective product mark includes an area larger than the area included in the outline of the matrix array chip 81 having no defective product mark.
  • the chip is arranged in a matrix with a defective product mark.
  • Each chip typically contains 22 pins, pins with a total area of 3300mm 2
  • the present embodiment sets a threshold value of the embodiment application It is 3500mm 2 , which can effectively screen out matrix array chips with defective product marks.
  • the mobile device only needs to drive the substrate to an ideal area of illumination conditions to enable the camera to capture images of the chips without moving the substrate to align the cameras one by one with the chip to be identified.
  • the application can efficiently realize the defective product mark recognition of the matrix array chip, and reduces the detection cost, and the operation flow is simple.
  • embodiments of the embodiments of the present application can be provided as a method, apparatus (device), or computer program product. Therefore, the embodiments of the present application may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware. Moreover, embodiments of the present application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) including computer usable program code.
  • computer-usable storage media including but not limited to disk storage, CD-ROM, optical storage, etc.
  • Embodiments of the present application are described with reference to flowchart illustrations and/or block diagrams of methods, apparatus, and computer program products according to embodiments of the present application. It will be understood that each flow and/or block of the flowchart illustrations and/or FIG.
  • These computer program instructions can be provided to general purpose computers, special meters A processor, an embedded processor, or a processor of another programmable data processing device to produce a machine such that instructions executed by a processor of a computer or other programmable data processing device are generated for implementation in a flow or in a flowchart A flow and/or block diagram of a device in a box or a plurality of functions specified in a plurality of blocks.
  • the computer program instructions can also be stored in a computer readable memory that can direct a computer or other programmable data processing device to operate in a particular manner, such that the instructions stored in the computer readable memory produce an article of manufacture comprising the instruction device.
  • the apparatus implements the functions specified in one or more blocks of a flow or a flow and/or block diagram of the flowchart.
  • These computer program instructions can also be loaded onto a computer or other programmable data processing device such that a series of operational steps are performed on a computer or other programmable device to produce computer-implemented processing for execution on a computer or other programmable device.
  • the instructions provide steps for implementing the functions specified in one or more of the flow or in a block or blocks of a flow diagram.

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Abstract

一种用于矩阵排列芯片的不良品标记识别装置，所述装置包括：带动所述矩阵排列芯片的基板进行移动的移动装置（11），以及对所述基板上的各芯片进行图像采集的摄像头（12），所述移动装置（11）令所述基板上的各芯片移动至光照条件理想区域，所述摄像头（12）采集所述光照条件理想区域的各芯片图像，并将采集的各芯片图像拼接为所述基板的完整图像，针对所述完整图像识别出具有不良品标记的矩阵排列芯片。该装置用以实现矩阵排列芯片的不良品标记识别，降低检测成本，且操作流程简单。

Description

一种用于矩阵排列芯片的不良品标记识别装置 技术领域
本申请涉及芯片测试技术领域，尤其涉及一种用于矩阵排列芯片的不良品标记识别装置。
背景技术
随着指纹识别和移动支付浪潮的到来，指纹芯片迎来了爆发增长，而为满足不同手机产商对指纹芯片不同形状及不同尺寸的要求，矩阵排列芯片(Strip芯片)应运而生。矩阵排列芯片(Strip芯片)是在一条状基板上有多颗成矩阵排列的芯片，芯片与芯片之间有一定的空间距离，这样方便客户切割成自己需要的形状与尺寸。
条状基板上往往存在外观、电气性能故障等不良品芯片，在对所述不良品芯片进行检测时，通常通过识别不良品标记分辨芯片是否为不良品芯片。传统芯片测试中识别不良品芯片仅针对单颗芯片进行图像采集和识别，在条状基板上逐一对多颗成矩阵排列的芯片进行图像采集和识别造成识别效率低下。并且，在条状基板上逐一对多颗成矩阵排列的芯片进行图像采集，需要移动装置移动所述基板以使摄像头逐一对准需识别的芯片，造成检测成本高，流程复杂。
因此，如何高效的实现矩阵排列芯片的不良品标记识别,成为现有技术中亟需解决的技术问题。
发明内容
有鉴于此，本申请实施例所解决的技术问题之一在于提供一种用于矩阵排列芯片的不良品标记识别装置，用以高效实现矩阵排列芯片的不良品标记识别，降低检测成本，且操作流程简单。
本申请实施例提供一种用于矩阵排列芯片的不良品标记识别装置，包括：带动所述矩阵排列芯片的基板进行移动的移动装置，以及对所述基板上的各芯片进行图像采集的摄像头，所述移动装置令所述基板上的各芯片移动至光照条件理想区域，所述摄像头采集所述光照条件理想区域的各芯片图像，并将采集的各芯片图像拼接为所述基板的完整图像，针对所述完整图像识别出 具有不良品标记的矩阵排列芯片。
对应上述装置，本申请还提供一种用于矩阵排列芯片的不良品标记识别方法，包括：
令移动装置将基板上的各芯片移动至光照条件理想区域；
通过所述摄像头采集所述光照条件理想区域的各芯片图像；
将采集的各芯片图像拼接为所述基板的完整图像；
针对所述完整图像识别出具有不良品标记的矩阵排列芯片。
由以上技术方案可见，本申请所述移动装置令所述基板上的各芯片移动至光照条件理想区域以使所述摄像头采集各芯片图像，并将采集的各芯片图像拼接为所述基板的完整图像，针对所述完整图像识别出具有不良品标记的矩阵排列芯片。因此，所述移动装置仅需要带动所述基板至光照条件理想区域以使所述摄像头采集各芯片图像，无需移动所述基板以使摄像头逐一对准需识别的芯片。本申请可以高效的实现矩阵排列芯片的不良品标记识别，且降低了检测成本，操作流程简单。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请中记载的一些实施例，对于本领域普通技术人员来讲，还可以根据这些附图获得其它的附图。
图1是本申请用于矩阵排列芯片的不良品标记识别装置的结构示意图；
图2是本申请用于矩阵排列芯片的不良品标记识别装置中基板表面的反射示意图；
图3是本申请用于矩阵排列芯片的不良品标记识别装置中光照条件理想区域示意图；
图4是本申请用于矩阵排列芯片的不良品标记识别方法的流程图；
图5是本申请用于矩阵排列芯片的不良品标记识别方法中步骤S4的流程图；
图6是本申请用于矩阵排列芯片的不良品标记识别方法中模板选取的示意图；
图7是本申请用于矩阵排列芯片的不良品标记识别方法中步骤S42的流 程图；
图8是本申请用于矩阵排列芯片的不良品标记识别方法中芯片轮廓示意图。
具体实施方式
本申请所述移动装置令所述基板上的各芯片移动至光照条件理想区域以使所述摄像头采集各芯片图像，并将采集的各芯片图像拼接为所述基板的完整图像，针对所述完整图像识别出具有不良品标记的矩阵排列芯片。因此，所述移动装置仅需要带动所述基板至光照条件理想区域以使所述摄像头采集各芯片图像，无需移动所述基板以使摄像头逐一对准需识别的芯片。本申请可以高效的实现矩阵排列芯片的不良品标记识别，且降低了检测成本，操作流程简单。
当然，实施本申请实施例的任一技术方案必不一定需要同时达到以上的所有优点。
为了使本领域的人员更好地理解本申请实施例中的技术方案，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请实施例一部分实施例，而不是全部的实施例。基于本申请实施例中的实施例，本领域普通技术人员所获得的所有其它实施例，都应当属于本申请实施例保护的范围。
下面结合本申请实施例附图进一步说明本申请实施例具体实现。
在示例性实施例的以下描述，参考由其所附的附图，其中通过图解方式示出的特定实施例可被实践。它要理解的是，其它实施例可以使用和结构的改变可以由不脱离各种实施例的范围。
参见图1，本申请提供一种用于矩阵排列芯片的不良品标记识别装置，包括：带动所述矩阵排列芯片的基板进行移动的移动装置11，以及对所述基板上的各芯片进行图像采集的摄像头12。
所述移动装置11令所述基板2上的各芯片移动至光照条件理想区域，所述摄像头12采集所述光照条件理想区域的各芯片图像，并将采集的各芯片图像拼接为所述基板的完整图像，针对所述完整图像识别出具有不良品标记的矩阵排列芯片。
因此，所述移动装置11仅需要带动所述基板2至光照条件理想区域以使 所述摄像头12采集各芯片图像，无需移动所述基板2以使摄像头12逐一对准需识别的芯片。本申请可以高效的实现矩阵排列芯片的不良品标记识别，且降低了检测成本，操作流程简单。
在本申请一具体实现中，由于条状基板的常规尺寸为7.6*24cm，条状基板上的芯片面积仅为基板面积的1/100或者更小，因此为了所述基板的完整图像中各芯片都能清晰可见，所述摄像头12采用500万像素分辨率的摄像机。
具体地，为减小所述摄像头12采集图像的桶形畸变，对所述摄像头12进行标定，所述基板与所述摄像头的镜头距离为20cm～25cm，所述摄像头的镜头采用6mm～12mm焦距的广角镜头。
在本申请另一具体实现中，参见图2，由于所述基板表面光滑，易产生镜面反射。为避免镜面反射影响所述摄像头12进行图像采集，本申请实施例在基板两侧布置光源，保证左右亮度均匀。本申请实施例所述光源布置采用斜侧光方式布置。从而在基板表面仅产生漫反射光线，漫反射光线较弱，对所述摄像头12进行图像采集的影响较小。
具体地，由于本申请实施例基板边长较长，所述光源采用250*20mm的条形光源。
在本申请再一具体实现中，所述条状基板长度一般为24cm，基板两端受光较弱，为保证每颗芯片光照均匀，参见图3，所述光照条件理想区域为：所述矩阵排列芯片的灰度平均值的最大值和最小值之差不大于20的区域。
具体地，所述光照条件理想区域为：距离所述光源60mm～200mm的区间区域。
对应上述装置，本申请还提供一种用于矩阵排列芯片的不良品标记识别方法，参见图4，所述方法包括：
S1、令移动装置将基板上的各芯片移动至光照条件理想区域。
所述条状基板长度一般为24cm，基板两端受光较弱，为保证每颗芯片光照均匀，参见图3，所述光照条件理想区域为：所述矩阵排列芯片的灰度平 均值的最大值和最小值之差不大于20的区域。
具体地，所述光照条件理想区域为：距离所述光源60mm～200mm的区间区域。
S2、通过所述摄像头采集所述光照条件理想区域的各芯片图像。
在本申请一具体实现中，由于条状基板的常规尺寸为7.6*24cm，条状基板上的芯片面积仅为基板面积的1/100或者更小，因此为了所述基板的完整图像中各芯片都能清晰可见，所述摄像头12采用500万像素分辨率的摄像机。
具体地，为减小所述摄像头12采集图像的桶形畸变，对所述摄像头12进行标定，所述基板与所述摄像头的镜头距离为20cm～25cm，所述摄像头的镜头采用6mm～12mm焦距的广角镜头。
在本申请另一具体实现中，参见图2，由于所述基板表面光滑，易产生镜面反射。为避免镜面反射影响所述摄像头12进行图像采集，本申请实施例在基板两侧布置光源，保证左右亮度均匀。本申请实施例所述光源布置采用斜侧光方式布置。从而在基板表面仅产生漫反射光线，漫反射光线较弱，对所述摄像头12进行图像采集的影响较小。
具体地，由于本申请实施例基板边长较长，所述光源采用250*20mm的条形光源。
S3、将采集的各芯片图像拼接为所述基板的完整图像。
为了更加准确的拼接所述基板的完整图像，本申请实施例可以令所述摄像头多次执行所述步骤S2，即多次采集所述光照条件理想区域的各芯片图像，将多次采集的所述图像合成为所述基板的完整图像。
具体地，所述多次执行所述步骤S2一般为两次。
S4、针对所述完整图像识别出具有不良品标记的矩阵排列芯片。
在本申请一具体实现中，参见图5，所述步骤S4包括：
S41、在所述完整图像中提取各矩阵排列芯片的图像。
所述步骤S41具体为：使用所述芯片外围图像及周边标记作为模板，通过模板匹配算法识别出各芯片在所述基板上的位置以提取各矩阵排列芯片的图像。
具体地，参见图6，使用所述芯片上方61与下方62作为模板，避开所述芯片中心的不良品标记63。本申请实施例通过模板匹配，锁定所述各芯片 在所述基板上的位置，从而提取各矩阵排列芯片的图像。
S42、通过所述各矩阵排列芯片的图像，识别出具有不良品标记的矩阵排列芯片。
参见图7，所述步骤S42包括：
S421、提取所述各矩阵排列芯片的轮廓，并计算所述轮廓包含的面积。
提取各矩阵排列芯片的图像后，提取各矩阵排列芯片的轮廓，然后计算图像中轮廓所包含的面积。参见图8，无不良品标记的矩阵排列芯片81的轮廓包含芯片管脚，有不良品标记的矩阵排列芯片82的轮廓包含芯片管脚和不良品标记的轮廓。因此，有不良品标记的矩阵排列芯片82的轮廓包含的面积大于无不良品标记的矩阵排列芯片81的轮廓包含的面积。
S422、如果所述面积大于预设阈值，则为具有不良品标记的矩阵排列芯片。
由于矩阵排列芯片的每个管脚在矩阵排列芯片的图像上的面积为15mm*10mm＝150mm2，每颗芯片一般包含22个管脚，管脚总面积为3300mm2，本申请实施例设置阈值为3500mm2，可以有效筛选出具有不良品标记的矩阵排列芯片。
因此，所述移动装置仅需要带动所述基板至光照条件理想区域以使所述摄像头采集各芯片图像，无需移动所述基板以使摄像头逐一对准需识别的芯片。本申请可以高效的实现矩阵排列芯片的不良品标记识别，且降低了检测成本，操作流程简单。
本领域的技术人员应明白，本申请实施例的实施例可提供为方法、装置(设备)、或计算机程序产品。因此，本申请实施例可采用完全硬件实施例、完全软件实施例、或结合软件和硬件方面的实施例的形式。而且，本申请实施例可采用在一个或多个其中包含有计算机可用程序代码的计算机可用存储介质(包括但不限于磁盘存储器、CD-ROM、光学存储器等)上实施的计算机程序产品的形式。
本申请实施例是参照根据本申请实施例的方法、装置(设备)和计算机程序产品的流程图和/或方框图来描述的。应理解可由计算机程序指令实现流程图和/或方框图中的每一流程和/或方框、以及流程图和/或方框图中的流程和/或方框的结合。可提供这些计算机程序指令到通用计算机、专用计 算机、嵌入式处理机或其它可编程数据处理设备的处理器以产生一个机器，使得通过计算机或其它可编程数据处理设备的处理器执行的指令产生用于实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能的装置。
这些计算机程序指令也可存储在能引导计算机或其它可编程数据处理设备以特定方式工作的计算机可读存储器中，使得存储在该计算机可读存储器中的指令产生包括指令装置的制造品，该指令装置实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能。
这些计算机程序指令也可装载到计算机或其它可编程数据处理设备上，使得在计算机或其它可编程设备上执行一系列操作步骤以产生计算机实现的处理，从而在计算机或其它可编程设备上执行的指令提供用于实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能的步骤。
尽管已描述了本申请实施例的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例作出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本申请实施例范围的所有变更和修改。显然，本领域的技术人员可以对本申请实施例进行各种改动和变型而不脱离本申请实施例的精神和范围。这样，倘若本申请实施例的这些修改和变型属于本申请实施例权利要求及其等同技术的范围之内，则本申请实施例也意图包含这些改动和变型在内。

Claims (14)

  1. 一种用于矩阵排列芯片的不良品标记识别装置，包括：带动所述矩阵排列芯片的基板进行移动的移动装置，以及对所述基板上的各芯片进行图像采集的摄像头，其特征在于，所述移动装置令所述基板上的各芯片移动至光照条件理想区域，所述摄像头采集所述光照条件理想区域的各芯片图像，并将采集的各芯片图像拼接为所述基板的完整图像，针对所述完整图像识别出具有不良品标记的矩阵排列芯片。
  2. 根据权利要求1所述的识别装置，其特征在于，所述摄像头采用500万像素分辨率的摄像机。
  3. 根据权利要求2所述的识别装置，其特征在于，所述基板与所述摄像头的镜头距离为20cm～25cm。
  4. 根据权利要求3所述的识别装置，其特征在于，所述摄像头的镜头采用6mm～12mm焦距的广角镜头。
  5. 根据权利要求1所述的识别装置，其特征在于，所述基板的两侧均布置光源。
  6. 根据权利要求5所述的识别装置，其特征在于，所述光源布置采用斜侧光方式布置。
  7. 根据权利要求6所述的识别装置，其特征在于，所述光源采用250mm*20mm的条形光源。
  8. 根据权利要求1所述的识别装置，其特征在于，所述光照条件理想区域为：所述矩阵排列芯片的灰度平均值的最大值和最小值之差不大于20的区域。
  9. 根据权利要求8所述的识别装置，其特征在于，所述光照条件理想区域为：距离所述光源60mm～200mm的区间区域。
  10. 一种用于矩阵排列芯片的不良品标记识别方法，其特征在于，包括：
    令移动装置将基板上的各芯片移动至光照条件理想区域；
    通过所述摄像头采集所述光照条件理想区域的各芯片图像；
    将采集的各芯片图像拼接为所述基板的完整图像；
    针对所述完整图像识别出具有不良品标记的矩阵排列芯片。
  11. 根据权利要求10所述的识别方法，其特征在于，所述针对所述完整 图像识别出具有不良品标记的矩阵排列芯片包括：
    在所述完整图像中提取各矩阵排列芯片的图像；
    通过所述各矩阵排列芯片的图像，识别出具有不良品标记的矩阵排列芯片。
  12. [根据细则91更正 07.02.2017]　
    根据权利要求11所述的识别方法，其特征在于，所述在所述完整图像中提取各矩阵排列芯片的图像具体为：使用所述芯片外围图像及周边标记作为模板，通过模板匹配算法识别出各芯片在所述基板上的位置以提取各矩阵排列芯片的图像。
  13. [根据细则91更正 07.02.2017]
    根据权利要求12所述的识别方法，其特征在于，所述通过所述各矩阵排列芯片的图像，识别出具有不良品标记的矩阵排列芯片包括：
    提取所述各矩阵排列芯片的轮廓，并计算所述轮廓包含的面积；
    如果所述面积大于预设阈值，则为具有不良品标记的矩阵排列芯片。
  14. [根据细则91更正 07.02.2017]　
    根据权利要求13所述的识别方法，其特征在于，所述预设阈值为3500mm2。
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