WO2018130288A1 - Système de couche barrière et procédé de fabrication d'un système de couche barrière dans un procédé continu rouleau à rouleau - Google Patents

Système de couche barrière et procédé de fabrication d'un système de couche barrière dans un procédé continu rouleau à rouleau Download PDF

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Publication number
WO2018130288A1
WO2018130288A1 PCT/EP2017/050597 EP2017050597W WO2018130288A1 WO 2018130288 A1 WO2018130288 A1 WO 2018130288A1 EP 2017050597 W EP2017050597 W EP 2017050597W WO 2018130288 A1 WO2018130288 A1 WO 2018130288A1
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WIPO (PCT)
Prior art keywords
barrier layer
layer
barrier
buffer layer
depositing
Prior art date
Application number
PCT/EP2017/050597
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English (en)
Inventor
Neil Morrison
Jose Manuel Dieguez-Campo
Heike Landgraf
Stefan Hein
Tobias Stolley
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Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to PCT/EP2017/050597 priority Critical patent/WO2018130288A1/fr
Priority to CN201780083056.XA priority patent/CN110177683B/zh
Priority to TW107100100A priority patent/TWI703614B/zh
Publication of WO2018130288A1 publication Critical patent/WO2018130288A1/fr

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Definitions

  • Embodiments of the present disclosure relate to barrier layer systems adapted for use in an electro-optical device and methods for manufacturing such barrier layer systems in a continuous roll-to-roll process.
  • embodiments of the present disclosure relate to barrier layer systems including a stack of layers deposited on a flexible substrate. More specifically, embodiments of the present disclosure relate to barrier layer systems which are manufactured by a continuous roll-to-roll vacuum deposition process.
  • Processing of flexible substrates is in high demand in the packaging industry, semiconductor industries and other industries. Processing may consist of coating a flexible substrate with a desired material, such as a metal, in particular aluminum, semiconductors and dielectric materials, etching and other processing steps conducted on a substrate for the desired applications.
  • Systems performing this task typically include a process drum, e.g., a cylindrical roller, coupled to a processing system for transporting the substrate, and on which at least a portion of the substrate is processed.
  • a process drum e.g., a cylindrical roller
  • R2R roll-to-roll
  • a process e.g. a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, and a plasma enhanced chemical vapor deposition (PECVD) process
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • PECVD plasma enhanced chemical vapor deposition
  • PVD physical vapor deposition
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • PECVD plasma enhanced chemical vapor deposition
  • Examples of products made of a coated flexible substrate are touch panels or organic light emitting diode (OLED) displays, which have received significant interest recently in display applications in view of their faster response times, larger viewing angles, higher contrast, lighter weight, lower power, and amenability to flexible substrates, as compared to liquid crystal displays (LCD).
  • OLED organic light emitting diode
  • LCD liquid crystal displays
  • barrier layer systems adapted for use in electro-optical devices and methods for manufacturing such barrier layer systems that overcome at least some of the problems in the art.
  • a barrier layer system adapted for use in an electro-optical device.
  • the barrier layer system includes a flexible substrate, a first barrier layer and a second barrier layer.
  • the first barrier layer and the second barrier layer are configured to have barrier properties against water/oxygen permeation.
  • the barrier layer system includes a polymeric buffer layer provided between the first barrier layer and the second barrier layer.
  • the polymeric buffer layer is configured to increase a permeation path length between the first barrier layer and the second barrier layer.
  • a barrier layer system adapted for use in an electro-optical device.
  • the barrier layer system includes a flexible substrate of polymeric material, a first barrier layer and a second barrier layer, wherein the first barrier layer and the second barrier layer are configured to have barrier properties against water/oxygen permeation.
  • a barrier layer thickness T BR1 of the first barrier layer is 50 nm ⁇ T BR1 ⁇ 125 nm and a barrier layer thickness T BR2 of the second barrier layer is 50 nm ⁇ T BR2 ⁇ 125 nm.
  • the first barrier layer and the second barrier layer are made of SiN x and the first barrier layer and the second barrier layer each have a fracture toughness K Ic of 4 MPa m 0 5 ⁇ K Ic ⁇ 6 MPa m 0 - 5 .
  • the barrier layer system includes a polymeric buffer layer provided between the first barrier layer and the second barrier layer.
  • the polymeric buffer layer is configured to increase a permeation path length between the first barrier layer and the second barrier layer, wherein a buffer layer thickness T BF of the polymeric buffer layer is 250 nm ⁇ T BF ⁇ 350 nm, and wherein the polymeric buffer layer is made of nHA/EGDA20.
  • a method for manufacturing a barrier layer system in a continuous roll-to-roll process includes providing a flexible substrate to at least one first processing zone, at least one second processing zone, and at least one third processing zone without breaking vacuum. Further, the method includes depositing a first barrier layer of inorganic material on the flexible substrate in the at least one first processing zone, depositing a buffer layer of organic material on the first barrier layer in the at least one second processing zone, and depositing a second barrier layer of inorganic material on the buffer layer in the at least one third processing zone. In particular, depositing the first barrier layer, depositing the buffer layer and depositing the second barrier layer includes using the same precursor.
  • Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus.
  • FIGS. 1 and 2 show schematic views of a barrier layer system according to embodiments described herein; shows a detailed view of a portion of a barrier layer system according to embodiments described herein for illustrating the function of the polymeric buffer layer; shows a schematic view of a barrier layer system according to further embodiments described herein; shows a detailed view of a portion of the barrier layer system of FIG.
  • FIG. 4 A for illustrating the function of the polymeric buffer layers; shows a schematic view of a processing system for manufacturing a barrier layer system according to embodiments described herein; shows a schematic view of an electro-optical device having a barrier layer system according to embodiments described herein; and shows a flow chart illustrating a method for manufacturing a barrier layer system in a continuous roll-to-roll process according to embodiments described herein.
  • a “barrier layer system” is to be understood as a stack of layers having barrier properties against water vapor and oxygen transmission.
  • a “barrier layer system” as described herein can include alternating layers (diades) including a polymeric buffer layer and a barrier layer.
  • the barrier layer includes SiN x and the polymeric buffer layer includes polyethylene glycol methacrylate (PGMA) and/or ethylene glycol diamine (EGDA).
  • PGMA polyethylene glycol methacrylate
  • EGDA ethylene glycol diamine
  • a barrier layer system as described herein can be understood as a ultrahigh barrier (UHB) system having a water vapor transmission rate (WVTR; in units of g per cm 2 and day) and/or an oxygen transmission rate (OTR; in units of g per cm 2 and day) of less than 10 ⁇ 4 , specifically less than 10 ⁇ 5 , and more specifically less than lO 6 .
  • a barrier layer system as described herein can be transparent.
  • transparent as used herein can particularly include the capability of a structure to transmit light with relatively low scattering, so that, for example, light transmitted therethrough can be seen in a substantially clear manner.
  • a "flexible substrate” may be characterized in that the substrate is bendable.
  • the flexible substrate may be a foil.
  • a flexible substrate as described herein can be processed in a continuous roll-to-roll process as described herein, for instance in a roll-to-roll processing system as described herein.
  • the flexible substrate as described herein is suitable for manufacturing coatings or electronic devices on the flexible substrate.
  • a flexible substrate as described herein can be transparent, e.g. the flexible substrate may be made of a transparent polymer material.
  • a flexible substrate as described herein may include materials like polyethylene terephthalate (PET), polycarbonate (PC), polyethylene (PE), polyimide (PI), polyurethane (PU), poly(methacrylic acid methyl ester), triacetyl cellulose, cellulose triacetate (TAC), cyclo olefin polymer, poly(ethylene naphthalate), one or more metals, paper, combinations thereof, and already coated substrates like Hard Coated PET (HC-PET) or Hard Coated TAC (HC-TAC) and the like.
  • PET polyethylene terephthalate
  • PC polycarbonate
  • PE polyethylene
  • PI polyimide
  • PU polyurethane
  • PU poly(methacrylic acid methyl ester)
  • TAC cyclo olefin polymer
  • HC-PET Hard Coated PET
  • HC-TAC Hard Coated TAC
  • a "barrier layer” is to be understood as a layer having barrier properties against water vapor and oxygen transmission.
  • a barrier layer as described herein can have water vapor transmission rate WVTR of less than 3x 10 3 g/m 2 per day.
  • a barrier layer of the present disclosure can include SiN x , particularly consist of SiN x .
  • a "polymeric buffer layer” is to be understood as a layer of polymeric material including polyethylene glycol methacrylate (PGMA) and/or ethylene glycol diamine (EGDA).
  • PGMA polyethylene glycol methacrylate
  • EGDA ethylene glycol diamine
  • a polymeric buffer layer as described herein is to be understood as a layer configured to increase a permeation path length, e.g. for water vapor or oxygen, through the buffer layer, for instance from one side of the buffer layer to an opposing other side of the buffer layer.
  • a "permeation path length” is to be understood as the length of a path a molecule travels when the molecule permeates through a material, e.g. through the polymeric buffer layer as described herein.
  • FIG. 1 shows a schematic view of a barrier layer system 100 according to embodiments described herein.
  • the barrier layer system 100 adapted for use in an electro-optical device includes a flexible substrate 101 , a first barrier layer 1 10 and a second barrier layer 120.
  • the flexible substrate 101 may include a polymer material selected from the group consisting of: polycarbonate, polyethylene terephthalate, poly(methacrylic acid methyl ester), triacetyl cellulose, cyclo olefin polymer, and poly(ethylene naphthalate).
  • the first barrier layer 1 10 and the second barrier layer 120 are configured to have barrier properties against water/oxygen permeation.
  • the barrier layer system includes a polymeric buffer layer 1 15 provided between the first barrier layer 1 10 and the second barrier layer 120, as exemplarily shown in FIG. 1. More specifically, as described in more detail with respect to FIG. 3, the polymeric buffer layer 1 15 is configured to increase a permeation path length between the first barrier layer 1 10 and the second barrier layer 120.
  • an improved barrier layer system is provided.
  • embodiments of the barrier layer system as described herein provide for a layer system having improved barrier properties with respect to water vapor or oxygen compared to conventional barrier layer systems.
  • electro-optical devices e.g. display devices or touch panels
  • an improved product durability of the electro-optical devices can be achieved.
  • the polymeric buffer layer 1 15 may have a thickness T BF of approximately 400 nm, particularly approximately 300 nm, more particularly approximately 250 nm. It is to be understood that in the present disclosure, the term "approximately” shall include values deviating from the associated value by ⁇ 5%. Accordingly, for example, approximately 400 nm is to be understood as 400 nm ⁇ 20 nm. [0027] Accordingly, by providing a barrier layer system having a polymeric buffer layer as described herein, the barrier properties of the barrier layer system with respect to water vapor or oxygen is improved. Further, a thickness ratio TR of a buffer layer thickness T BF of the polymeric buffer layer to a barrier layer thickness T BR i of the first barrier layer may in particular be beneficial for increasing the barrier properties of the barrier layer system as described herein.
  • the barrier layer system 100 may include a first polymeric buffer layer 1 14 provided between the flexible substrate 101 and the first barrier layer 1 10.
  • the first polymeric buffer layer 1 14 may be configured to increase a permeation path length between the flexible substrate 101 and the first barrier layer 1 10.
  • the first polymeric buffer layer 1 14 may have a thickness T BF1 corresponding to the thickness T BF of the polymeric buffer layer 1 15 provided between the first barrier layer 110 and the second barrier layer 120.
  • the first polymeric buffer layer 114 can include at least one material selected form the group consisting of: PGMA, EGDA, and nHA/EGDA (nHexa- Acrylate/ethylene glycol diamine, particularly nHA/EGDA20.
  • PGMA PGMA
  • EGDA EGDA
  • nHA/EGDA nHexa- Acrylate/ethylene glycol diamine, particularly nHA/EGDA20.
  • a thickness ratio TR1 as described herein may in particular be beneficial for increasing the barrier properties of the barrier layer system as described herein.
  • the barrier layer thickness T BR I of the first barrier layer 110 is 50 nm ⁇ T BR I ⁇ 300 nm.
  • the barrier layer thickness T BR I of the first barrier layer 110 can be selected from a range having a lower limit of 50 nm, particularly a lower limit of 75 nm, more particularly a lower limit of 100 nm and an upper limit of 200 nm, particularly an upper limit of 250 nm, more particularly an upper limit of 300 nm.
  • the barrier layer thickness T BR1 of the first barrier layer 110 can be approximately 100 nm; approximately 150 nm, approximately 200 nm, or approximately 250 nm.
  • a barrier layer thickness T BR2 of the second barrier layer 120 is 50 nm ⁇ T BR2 ⁇ 300 nm.
  • the barrier layer thickness T BR2 of the second barrier layer 120 can be selected from a range having a lower limit of 50 nm, particularly a lower limit of 75 nm, more particularly a lower limit of 100 nm and an upper limit of 200 nm, particularly an upper limit of 250 nm, more particularly an upper limit of 300 nm.
  • the barrier layer thickness T BR2 of the second barrier layer 120 can be approximately 100 nm; approximately 150 nm, approximately 200 nm, or approximately 250 nm.
  • the polymeric buffer layer 115 may include at least one material selected form the group consisting of: PGMA, EGDA, and nHA/EGD A, particularly nH A/EGD A20.
  • FIG. 3 shows a detailed view of a portion of a barrier layer system according to embodiments described herein for illustrating the function of the polymeric buffer layer.
  • FIG. 3 shows the barrier layer system having a flexible substrate 101, a first barrier layer 110, a polymeric buffer layer 115, and a second barrier layer 120, as described herein. Further, in FIG. 3, defects D in the first barrier layer 110 and the second barrier layer 120 are indicated as black squares.
  • the dotted lines from the defects D in the first barrier layer 110 through the polymeric buffer layer 115 to the defects in the second barrier layer 120 indicate the permeation path of molecules, e.g. water vapor or oxygen, permeating through the layer system. Accordingly, as shown in FIG. 3, by providing a barrier layer system having a polymeric buffer layer as described herein, the permeation path length for molecules, e.g. water vapor or oxygen, through the barrier layer system can be increased, such that the barrier properties of the barrier layer system are improved compared to conventional barrier layer systems.
  • the first barrier layer 110 and the second barrier layer 120 include SiN x .
  • the first barrier layer and the second barrier layer may consist of SiN x .
  • Such a configuration may in particular be beneficial for improving the barrier properties of the barrier layer system with respect to water vapor or oxygen.
  • the fracture toughness K lc of the first barrier layer and/or the second barrier layer can be 4 MPa m 0 5 ⁇ K Ic ⁇ 6 MPa m 0 5 .
  • a water vapor transmission rate WVTR of the first barrier layer 110 is less than 3x 10 3 g/m 2 per day.
  • the water vapor transmission rate WVTR of the first barrier layer 110 can be approximately 2x 10 " 3 g/m 2 per day.
  • the water vapor transmission rate WVTR is typically measured with a permeation unit, e.g. the permeation unit "Aquatran 2", at 40°C and 100% relative humidity (RH).
  • RH relative humidity
  • a water vapor transmission rate WVTR of the second barrier layer 120 is less than 3x 10 3 g/m 2 per day.
  • the water vapor transmission rate WVTR of the second barrier layer 120 can be approximately 2x 10 " 3 g/m 2 per day, e.g. measured with the permeation unit "Aquatran 2", at 40°C and 100% relative humidity (RH).
  • the barrier layer system 100 further comprises at least one layer stack 130 provided on the second barrier layer 120.
  • the at least one layer stack 130 can include a further polymeric buffer layer 135 and a further barrier layer 140.
  • the further polymeric buffer layer 135 may be configured to increase a permeation path length between the second barrier layer 120 and the further barrier layer 140.
  • the further polymeric buffer layer 135 may include at least one material selected from the group consisting of: PGMA, EGDA, and nHA/EGDA, particularly nHA/EGDA20.
  • the further polymeric buffer layer 135 may have a thickness of approximately 400 nm, particularly approximately 300 nm, more particularly approximately 250 nm.
  • the further barrier layer 140 can include SiN x .
  • the further barrier layer 140 may consist of SiN x .
  • the barrier layer thickness T BRF of the further barrier layer 140 can be 50 nm ⁇ T BRF ⁇ 300 nm.
  • the barrier layer thickness T BRF of the further barrier layer 140 can be selected from a range having a lower limit of 50 nm, particularly a lower limit of 75 nm, more particularly a lower limit of 100 nm and an upper limit of 200 nm, particularly an upper limit of 250 nm, more particularly an upper limit of 300 nm.
  • the barrier layer thickness T BRF of the further barrier layer 140 can be approximately 100 nm; approximately 150 nm, approximately 200 nm, or approximately 250 nm.
  • a water vapor transmission rate WVTR of the further barrier layer 140 is less than 3 x 10 3 g/m 2 per day.
  • the water vapor transmission rate WVTR of further barrier layer 140 can be approximately 2x 10 " 3 g/m 2 per day, e.g. measured with the permeation unit "Aquatran 2", at 40°C and 100% relative humidity (RH).
  • FIG. 4B a detailed view of a portion of the barrier layer system of FIG. 4A is shown. In particular, FIG.
  • FIG. 4B shows the barrier layer system having a flexible substrate 101, a first barrier layer 110, a polymeric buffer layer 115, a second barrier layer 120, a further polymeric buffer layer 135, and a further barrier layer 140, as described herein.
  • defects D in the first barrier layer 110, the second barrier layer 120 and the further barrier layer 140 are indicated as black squares.
  • the dotted lines from the defects D of the first barrier layer 110 through the polymeric buffer layer 115, the defects D of the second barrier layer 120, and the further polymeric buffer layer 135 to the defects D in the further barrier layer 140 indicate the permeation path of molecules, e.g. water vapor or oxygen, permeating through the layer system. Accordingly, as shown in FIG.
  • the permeation path length for molecules, e.g. water vapor or oxygen, through the barrier layer system can be increased, such that the barrier properties of the barrier layer system are improved compared to conventional barrier layer systems. Accordingly, it is to be understood that by providing further layer stacks corresponding to the at least one layer stack 130, the barrier properties of the barrier layer system can be improved even further.
  • the barrier layer system 100 adapted for use in an electro-optical device includes a flexible substrate 101 of polymeric material, a first barrier layer 1 10 and a second barrier layer 120, wherein the first barrier layer and the second barrier layer are configured to have barrier properties against water/oxygen permeation.
  • a barrier layer thickness T B RI of the first barrier layer is 50 nm ⁇ T B RI ⁇ 125 nm and a barrier layer thickness T B R2 of the second barrier layer is 50 nm ⁇ T B R2 ⁇ 125 nm.
  • the first barrier layer and the second barrier layer are made of SiN x and the first barrier layer and the second barrier layer each have a fracture toughness Ki c of 4 MPa m0.5 ⁇ Ki c ⁇ 6 MPa m 0 5 .
  • the barrier layer system 100 includes a polymeric buffer layer 1 15 layer provided between the first barrier layer 1 10 and the second barrier layer 120.
  • the polymeric buffer layer is configured to increase a permeation path length between the first barrier layer and the second barrier layer, wherein a buffer layer thickness T BF of the polymeric buffer layer is 250 nm ⁇ T BF ⁇ 350 nm, and wherein the polymeric buffer layer is made of nHA/EGDA20.
  • the barrier layer system is well suited for being manufactured in a continuous roll-to-roll process, particularly a continuous vacuum deposition roll-to-roll process.
  • FIG. 5 shows a roll-to-roll processing system configured for carrying out a method for manufacturing a barrier layer system in a continuous roll-to-roll process as exemplarily described in more detail with reference to FIG. 7.
  • the processing system 300 can include at least three chamber portions, such as a first chamber portion 302 A, a second chamber portion 302B and a third chamber portion 302C.
  • a third chamber portion 302C At the third chamber portion 302C, one or more deposition sources 630 and optionally an etching station 430 can be provided as processing tools.
  • a flexible substrate 101 e.g. a flexible substrate as described herein, is provided on a first roll 764, e.g. having a winding shaft. The flexible substrate is unwound from the first roll 764 as indicated by the substrate movement direction shown by arrow 108.
  • a separation wall 701 is provided for separation of the first chamber portion 302 A and the second chamber portion 302B.
  • the separation wall 701 can further be provided with gap sluices 740 to allow the flexible substrate 101 to pass therethrough.
  • a vacuum flange 312 provided between the second chamber portion 302B and the third chamber portion 302C can be provided with openings to take up at least some processing tools.
  • the flexible substrate 101 is moved through the deposition areas provided at a coating drum 710 and corresponding to positions of the deposition sources 630.
  • the coating drum 710 rotates around an axis such that the flexible substrate 101 moves in the direction of arrow 108.
  • the flexible substrate 101 is guided via one, two or more rollers from the first roll 764 to the coating drum 710 and from the coating drum 710 to the second roll 764', e.g. having a winding shaft, on which the flexible substrate 101 is wound after processing thereof.
  • the deposition sources 630 can be configured for depositing the layers of the layer stack as described herein.
  • at least one deposition source can be adapted for deposition of the first barrier layer 110
  • at least one deposition source can be adapted for deposition of the polymeric buffer layer 115
  • at least one deposition source can be adapted for deposition of the second barrier layer 120.
  • at least one deposition source which is adapted for deposition of the further polymeric buffer layer 135 and at least one deposition source which is adapted for deposition of the further barrier layer 140 polymeric buffer layer can be provided.
  • a deposition source may be provided which is adapted for deposition of the first polymeric buffer layer 114.
  • the first chamber portion 302A is separated in an interleaf chamber portion unit 302A1 and a substrate chamber portion unit 302A2.
  • interleaf rolls 766/766' and interleaf rollers 305 can be provided as a modular element of the processing system 300.
  • the processing system 300 can further include a pre-heating unit 394 to heat the flexible substrate.
  • a pre-treatment plasma source 392 e.g. an RF (radio frequency) plasma source can be provided to treat the substrate with a plasma prior to entering the third chamber portion 302C.
  • an optical measurement unit 494 for evaluating the result of the substrate processing and/or one or more ionization units 492 for adapting the charge on the substrate can be provided.
  • the deposition material may be chosen according to the deposition process and the later application of the coated substrate.
  • the deposition material of the deposition sources may be selected according to the respective material of the polymeric buffer layers and the barrier layers, as described herein.
  • an electro-optical device 150 having a barrier layer system 100 according to any embodiments described herein is provided.
  • barrier layer systems as described herein can beneficially be used in optical applications, for instance protection of OLEDs.
  • the barrier layer system of the present disclosure can also be used in different applications.
  • the barrier layer system of the present disclosures can be used in the field of packaging for instance of food for which high oxygen protection is beneficial, for example fresh pasta, sliced meat, dried fruit, or snacks.
  • the barrier layer system as described herein may provide a gas barrier and transparent properties in order provide a product's visibility.
  • the method includes providing (see block 210) a flexible substrate to at least one first processing zone, at least one second processing zone, and at least one third processing zone without breaking vacuum.
  • the first processing zone may include a first deposition source adapted for deposition of the first barrier layer 110.
  • the second processing zone may include a deposition source adapted for deposition of the polymeric buffer layer 115.
  • the third processing zone may include a deposition source adapted for deposition of the second barrier layer 120.
  • the first processing zone may include a first deposition source adapted for deposition of the first polymeric buffer layer 114
  • the second processing zone may include a deposition source adapted for deposition of the first barrier layer 110
  • the third processing zone may include a deposition source adapted for deposition of the polymeric buffer layer 115.
  • the method includes depositing (see block 220) a first barrier layer 110 of inorganic material on the flexible substrate 101 in the at least one first processing zone, depositing (see block 230) a polymeric buffer layer 115 of organic material on the first barrier layer 110 in the at least one second processing zone, and depositing (see block 240) a second barrier layer 120 of inorganic material on the polymeric buffer layer 115 in the at least one third processing zone.
  • depositing the first barrier layer 110, depositing the polymeric buffer layer 115 and depositing the second barrier layer 120 includes using the same precursor.
  • the method includes depositing (see block 220) a first polymeric buffer layer 114 of organic material on the flexible substrate in the at least one first processing zone, depositing (see block 230) a first barrier layer 110 of inorganic material on the first polymeric buffer layer 114 in the at least one second processing zone, and depositing (see block 240) a polymeric buffer layer 115 of organic material on the first barrier layer 110 in the at least one third processing zone.
  • depositing the first polymeric buffer layer 114, depositing the first barrier layer 110, and depositing the polymeric buffer layer 115 includes using the same precursor.
  • depositing the first barrier layer 110, depositing the first polymeric buffer layer 114 and/or depositing the polymeric buffer layer 115, and depositing the second barrier layer 120 includes using a PECVD process and/or a HWCVD (Hot Wire Chemical Vapor Deposition) process.
  • a PECVD process and/or a HWCVD Hot Wire Chemical Vapor Deposition
  • the first barrier layer 110 and/or the first polymeric buffer layer 114 and/or the polymeric buffer layer 115 and/or the second barrier layer 120 as described herein may be deposited using a low temperature microwave PECVD process.
  • using the same precursor includes using at least one precursor selected from the group consisting of: HMDSO hexamethyldisiloxane; TOMCAT Tetramethyl Cyclotetrasiloxane (C 4 H 16 0 4 Si 4 ); HMDSN Hexamethyldisilazane ([(CH 3 )3Si] 2 NH); and TEOS Tetraethyl Orthosilicate (Si(OC 2 H 5 ) 4 ).
  • the method may include depositing at least one layer stack 130 as described herein. It is to be understood that depositing the at least one layer stack 130 includes depositing the further polymeric buffer layer 135 and depositing the further barrier layer 140. Further, it is to be understood that correspondingly adapted deposition sources can be used for depositing the further polymeric buffer layer 135 and for depositing the further barrier layer 140.
  • the further polymeric buffer layer 135 can be deposited in accordance to the other polymeric buffer layers, e.g the polymeric buffer layer 115 or the first polymeric buffer layer 114.
  • the further barrier layer 140 can be deposited in accordance to the other barrier layers, e.g the first barrier layer 110 or the second barrier layer 120.

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  • Laminated Bodies (AREA)

Abstract

La présente invention concerne un système de couche barrière (100) conçu pour être utilisé dans un dispositif électro-optique. Le système de couche barrière comprend un substrat souple (101) ; une première couche barrière (110) et une seconde couche barrière (120), la première couche barrière (110) et la seconde couche barrière (120) étant conçues pour avoir des propriétés de barrière contre la perméation de l'eau/de l'oxygène. En outre, le système de couche barrière comprend une couche tampon polymère (115) disposée entre la première couche barrière (110) et la seconde couche barrière (120), la couche tampon polymère (115) étant conçue pour augmenter une longueur de trajet de perméation entre la première couche barrière (110) et la seconde couche barrière (120).
PCT/EP2017/050597 2017-01-12 2017-01-12 Système de couche barrière et procédé de fabrication d'un système de couche barrière dans un procédé continu rouleau à rouleau WO2018130288A1 (fr)

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CN201780083056.XA CN110177683B (zh) 2017-01-12 2017-01-12 阻挡层系统、具有阻挡层系统的光电装置以及用于以连续卷绕式工艺制造阻挡层系统的方法
TW107100100A TWI703614B (zh) 2017-01-12 2018-01-02 阻障層系統、具有其之光電裝置、以及在連續捲繞式製程中用於製造阻障層系統的方法

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