WO2018113706A1

WO2018113706A1 - Electronic chip used together with circuit board belonging to imaging cartridge, and imaging cartridge and method for restoring imaging cartridge

Info

Publication number: WO2018113706A1
Application number: PCT/CN2017/117545
Authority: WO
Inventors: 刘卫臣; 孙学进; 李博
Original assignee: 珠海艾派克微电子有限公司
Priority date: 2016-12-20
Filing date: 2017-12-20
Publication date: 2018-06-28
Also published as: CN107839347B; CN207889361U; CN107953677B; CN107953677A; CN207889362U; CN107839347A; CN207889360U

Abstract

Provided are an electronic chip (12) used together with a circuit board (11) belonging to an imaging cartridge (1), and an imaging cartridge (1) and method for restoring the imaging cartridge (1), said electronic chip (12) comprising: a substrate, a second storage element (123), and a back contact terminal (125); if the electronic chip (12) matches the circuit board (11) on the imaging cartridge (1), the substrate of the electronic chip (12) covers only one part of at least one first connection terminal (1121) of the circuit board (11), and exposes a contact part (1120) of the first connection terminal (1121) and used for electrical contact with a probe (2) of an imaging device; the back contact terminal (125) arranged on the reverse side of the substrate of the electronic chip (12) partially covers the first connection terminal (1121) and is electrically connected to the first connection terminal (1121); a second storage element (123) of the electronic chip (12) passes via the back contact terminal (125) and is electrically connected to the partially covered first connection terminal (1121).

Description

Electronic chip, imaging cartridge and method for repairing imaging cartridge for use with a circuit board attached to an imaging cartridge

This application claims the Chinese patent application No. 201621404078.0 filed on Dec. 20, 2016, entitled "A Recycling Chip for Ink Cartridges and Ink Cartridges" and the name "Applied for Installation" on August 5, 2017. The priority of the above-identified application is incorporated herein by reference.

Technical field

The present invention relates to the field of printing imaging consumables, and more particularly to an electronic chip, an imaging cartridge, and a method for repairing an imaging cartridge for use with a circuit board attached to an imaging cartridge.

Background technique

With the popularity of office automation, printing equipment has become an indispensable device in office activities. Common printing equipment includes laser printers and inkjet printers. Wherein, in the laser printer, a printer body and a toner cartridge installed in the printer, in the inkjet printer, including a printer body and an ink cartridge installed in the printer, the toner cartridge and the ink cartridge may be collectively referred to as toner and ink. The imaging cartridge of the image forming material is mounted not only in the printing apparatus but also in other types of image forming apparatuses such as a copying machine.

The chip of the imaging cartridge is usually mounted with a chip for storing ink or toner related data, and the chip is generally fixed on the outer surface of the cartridge. When the imaging cartridge is mounted to the imaging device, the chip on the outer surface of the imaging cartridge can The data is in contact with the probe on the main body side of the image forming apparatus, so that the storage element of the chip is electrically connected to the probe on the main body side of the image forming apparatus through the connection terminal of the chip surface to complete data communication between the image forming apparatus and the chip.

In the imaging cartridge of the prior art, when the imaging material in the imaging cartridge is exhausted, the imaging material data information stored by the storage element of the imaging cartridge chip has also been rewritten to be exhausted, and in the recycling of the imaging cartridge of the type, It is not only necessary to refill the imaging material in the imaging cartridge, to repair the structure that cannot work normally in the imaging cartridge, but also to reset the data information in the chip to the data information sufficient for the imaging material, and the data information is caused by the limitation of the chip rewriting circuit. When it is difficult to perform resetting, such as when the imaging material data information of the chip is rewritten to be depleted, the storage circuit of the storage element The self-destruction is no longer available. In this case, the chip on the imaging cartridge needs to be removed and a new chip is installed, and the storage element of the new chip is used to replace the storage element of the chip that cannot be used to complete the data communication with the imaging device. Realize recycling and recycling of the imaging cartridge.

In the process of recycling and reusing the imaging cartridge, the existing chip is usually fixed to the surface of the imaging cartridge by a fixing structure on the cartridge of the imaging cartridge, however, the process of removing the chip is liable to damage the cartridge of the imaging cartridge. The fixed structure makes the new chip not easy to be detached or can not be fixed to the imaging box, so that the imaging box can no longer be recycled; moreover, directly replacing the whole chip will make the regeneration cost of the imaging box recycling and recycling process too high. .

Summary of the invention

The electronic chip, the imaging cartridge and the repair imaging cartridge method provided by the invention for use together with the circuit board attached to the imaging cartridge can realize the recycling of the imaging cartridge, and can fully utilize the connection terminal contacts on the original chip. Save the production material of the regenerative chip to achieve the purpose of reducing the recycling cost, realize the maximum recycling; also protect the fixed structure on the imaging box, prolong the service life of the imaging box, reduce the waste of resources, and greatly improve the imaging The box recovers the recycling rate.

In a first aspect, the present invention provides an electronic chip for use with a circuit board attached to an imaging cartridge for detachably mounting to an imaging device, the imaging device including a probe for making electrical contact with the imaging cartridge The imaging cartridge includes a circuit board fixed thereto, the circuit board including a connection terminal and a first storage element, the connection terminal being for making electrical contact with a probe of the image forming apparatus, the connection terminal including at least one first connection terminal, the first storage element Electrically connected to the at least one first connection terminal, the electronic chip includes: a substrate, a second storage element fixed on the substrate, and at least one backing terminal disposed on the back surface of the substrate, the back surface of the substrate being electronic chip matched to the imaging a circuit board on the box when the substrate of the electronic chip faces a side of the circuit board, and the second storage element is electrically connected to at least one of the back terminals;

When the electronic chip is matched to the circuit board on the imaging cartridge, the substrate of the electronic chip covers only a portion of at least one of the first connection terminals of the circuit board, and the first connection terminal is exposed for exploration with the imaging device a contact portion of the needle electrical contact, wherein the first connection terminal is covered by a back contact terminal portion disposed on a back surface of the electronic chip substrate, and electrically connected to the first connection terminal, so that the second storage element of the electronic chip is connected Terminal and partially covered first connection terminal The electrical connection is used to implement the cooperation of the electronic chip and the circuit board. The second storage element of the electronic chip replaces at least part of the function of the first storage element of the circuit board with the probe of the imaging device.

Optionally, the substrate of the electronic chip is provided with a terminal through hole at a corresponding position of the contact portion of the at least one of the first connection terminals, and the electronic chip passes through the terminal through hole when the electronic chip is matched to the circuit board. A contact portion of the first connection terminal for making electrical contact with a probe of an imaging device is exposed.

Optionally, when the imaging cartridge including the circuit board and the electronic chip is mounted to the imaging device, the probe of the imaging device electrically contacts the contact portion of the first connection terminal of the circuit board through the terminal through hole of the electronic chip .

Optionally, the backing terminal on the electronic chip substrate is matched with the terminal through hole; wherein

A portion of the first connection terminal is covered by the back contact terminal and the contact portion of the first connection terminal is exposed by the terminal through hole.

Optionally, the backing terminal is at least partially disposed on a back surface of the substrate of the electronic chip on an upper edge or a side edge side of the terminal through hole.

Optionally, the substrate of the electronic chip is provided with a terminal groove at a corresponding position of the contact portion of the at least one first connection terminal and a surrounding area thereof, and when the electronic chip is matched to the circuit board, the electronic chip passes through the The terminal recess exposes a contact portion of the first connection terminal for electrical contact with a probe of an imaging device.

Optionally, the terminal groove is: a substrate of the electronic chip extends to a lower edge of the substrate along a corresponding position of the contact portion of the first connection terminal, and a contact portion formed on the substrate from the lower edge to the first connection terminal The groove opening of the corresponding position.

Optionally, when the imaging cartridge including the circuit board and the electronic chip is mounted to the imaging device, the probe of the imaging device passes through the terminal groove of the electronic chip and is swiped to the circuit board along the terminal groove A contact portion of the connection terminal.

Optionally, the backing terminal on the electronic chip substrate is matched with the terminal groove; wherein

A portion of the first connection terminal of the circuit board is covered by the back contact terminal and the contact portion of the first connection terminal is exposed by the terminal groove.

Optionally, the backing terminal is at least partially disposed on a back surface of the substrate of the electronic chip on an upper edge or a side edge side of the terminal groove.

Optionally, the substrate edge of the electronic chip is located on one side or one side of the corresponding position of the contact portion of the at least one of the first connection terminals and an adjacent side thereof, when the electronic chip is matched to the circuit board The substrate of the electronic chip covers one side or one side of the first connection terminal and its adjacent side, and exposes a contact portion of the first connection terminal for making electrical contact with a probe of the image forming apparatus.

Optionally, the backing terminal on the electronic chip substrate is disposed on the back surface of the substrate at the edge of the substrate where the electronic chip covers the first connection terminal, and the side or side of the first connection terminal is covered by the backing terminal and the phase thereof Adjacent side.

Optionally, the backing terminal is at least partially disposed on a back surface of a lower edge or a side edge of the substrate covering the first connection terminal of the electronic chip.

Optionally, the backing terminal is arranged in a square shape, a rectangular shape, a circular shape, an elliptical shape, an arc shape or a ring shape.

Optionally, the backing terminal disposed on the back surface of the electronic chip substrate is soldered to the partially covered first connecting terminal, and a soldering structure is formed on the covering area of the backing terminal and the first connecting terminal to implement the electronic chip. The back terminal is electrically connected to the first connection terminal of the circuit board.

Optionally, a viscous material is attached to the back surface of the substrate of the electronic chip for bonding and fixing the electronic chip to the circuit board.

Optionally, the substrate of the electronic chip adopts a flexible circuit board.

Optionally, the substrate of the electronic chip is a transparent material or a translucent material.

In a second aspect, the present invention also provides an electronic chip for use with a circuit board attached to an imaging cartridge for detachably mounting to an imaging device, the imaging device including a probe for electrical contact with the imaging cartridge a needle, the imaging cartridge includes a circuit board fixed thereon, the circuit board includes a connection terminal and a first storage element, the connection terminal is for making electrical contact with a probe of the image forming apparatus, and the connection terminal includes a plurality of electrically connected to the first storage element a first connection terminal, the plurality of first connection terminals are arranged in at least two rows, and the electronic chip comprises: a substrate, a second storage element fixed on the substrate, and at least one backing terminal disposed on the back surface of the substrate, the back surface of the substrate When the electronic chip is matched to the circuit board on the imaging box, the substrate of the electronic chip faces the side of the circuit board, and the second storage element is electrically connected to the at least one of the back terminals;

When the electronic chip is matched to the circuit board on the imaging cartridge, the substrate of the electronic chip covers only a portion of at least one of the plurality of first connection terminals of the circuit board, and is exposed a contact portion of the at least one first connection terminal partially contacting the probe of the image forming apparatus, wherein the first connection terminal is covered by a back contact terminal portion disposed on a back surface of the electronic chip substrate, and Electrically connecting to the first connecting terminal, so that the second storage element of the electronic chip is electrically connected to the partially connected first connecting terminal via the backing terminal, so as to realize the cooperation between the electronic chip and the circuit board, and the electronic chip The second storage element replaces at least a portion of the functionality of the first storage element of the circuit board with data communication with the probe of the imaging device.

Optionally, the electronic chip further includes: at least one positive terminal disposed on a front surface of the substrate, the front surface of the substrate is a side of the electronic chip facing away from the circuit board when the electronic chip is matched to the circuit board, and the second storage The component is electrically connected to at least one of the positive terminals;

The at least one positive terminal corresponds to the at least one first connection terminal and at least partially covers the corresponding first connection terminal when the electronic chip is mated to the circuit board.

Optionally, the at least one positive terminal at least partially covers a contact portion of the corresponding first connection terminal for making electrical contact with a probe of the imaging device; and the positive terminal blocks the first connection terminal from The electrical contact of the probe of the imaging device is electrically contacted by the positive terminal to the probe of the imaging device, the positive terminal not being electrically connected to the partially covered first connection terminal.

Optionally, the at least one backing terminal and the at least one positive terminal of the electronic chip are arranged in at least two rows corresponding to the plurality of first connecting terminals of the circuit board;

At least one of the backing terminals is disposed on the first row adjacent to the lower edge of the electronic chip substrate, and is electrically connected to at least one of the first connecting terminals of the first row of the circuit board.

Optionally, the first row of the electronic chip is all a backing terminal, and the other rows are all positive terminals.

Optionally, the backing terminal disposed in the first row is disposed on a back surface of the substrate on which the electronic chip covers the lower edge of the substrate of the first connection terminal of the circuit board, and the upper half of the first connection terminal is covered by the backing terminal And exposing the contact portion of the first connection terminal.

Optionally, the electronic chip further includes: at least one soldering terminal disposed on the back surface of the substrate, the soldering terminal being opposite to the positive terminal disposed on the front surface of the substrate; and the electronic chip passing through the soldering terminal and the backing terminal disposed on the back surface of the substrate Soldering to the at least partially covered first connection terminal.

Optionally, a solder terminal corresponding to the reset terminal RST and/or the power terminal VCC in the first connection terminal of the circuit board on the back surface of the electronic chip substrate is electrically connected to the back of the electronic chip substrate A backing terminal corresponding to the ground terminal GND of the first connection terminal of the circuit board.

Optionally, the substrate of the electronic chip is provided with a terminal through hole at a corresponding position of the contact portion of the at least one first connection terminal, or at a corresponding position of the contact portion of the at least one first connection terminal and a surrounding area thereof Providing a terminal groove, the electronic chip exposing the contact portion of the first connection terminal for electrical contact with the probe of the imaging device via the terminal through hole or the terminal groove when the electronic chip is matched to the circuit board, or

The substrate edge of the electronic chip is located on one side or one side of the corresponding position of the contact portion of the at least one first connection terminal and the adjacent side thereof, and when the electronic chip is matched to the circuit board, the substrate of the electronic chip covers the first connection terminal One side or side and its adjacent side, and exposing the first connection terminal for contact with the probe of the imaging device.

Optionally, the electronic chip is provided with a plurality of the backing terminals, and the plurality of backing terminals are arranged in at least two rows corresponding to the plurality of first connecting terminals of the circuit board;

In at least one row of the back terminals remote from the lower edge of the electronic chip substrate, a terminal through hole/terminal groove is respectively disposed on the substrate of the electronic chip corresponding to each of the back terminals, and the circuit board is covered by the back terminal A portion of the first connection terminal and the contact portion of the first connection terminal is exposed by the terminal through hole/terminal groove.

Optionally, in the first row of the backing terminals adjacent to the lower edge of the electronic chip substrate, each of the backing terminals is disposed on the back surface of the substrate on the lower edge of the substrate where the electronic chip covers the first connection terminal of the circuit board. The upper half of the first connection terminal is covered by the backing terminal and the contact portion of the first connection terminal is exposed.

Optionally, in the at least two rows of the backing terminals, a terminal through hole is respectively disposed on the substrate of the electronic chip corresponding to each of the backing terminals, and a part of the first connecting terminal of the circuit board is covered by the backing terminal And contacting the contact portion of the first connection terminal by the terminal through hole.

Optionally, the connection terminal of the circuit board further includes two second connection terminals electrically connected to the detecting component, and the two second connection terminals are arranged at two ends of the first connection terminal of one of the rows ,

The substrate of the electronic chip is disposed such that when the electronic chip is matched to the circuit board, a substrate edge of the electronic chip is located between a first connection terminal and a second connection terminal of the circuit board, the electronic The substrate of the chip covers only the first connection terminal of the circuit board and its surrounding area, and exposes the second connection terminal of the circuit board, or the electronic chip further includes a through hole, when the electronic chip is matched to the circuit board, the substrate of the electronic chip covers only the first connection terminal of the circuit board and a surrounding area thereof, and the circuit board is exposed through the through hole The second connection terminal.

Optionally, the connection terminal of the circuit board further includes at least one third connection terminal, and is arranged at one end of the at least one row of the first connection terminals.

When the electronic chip is matched to the circuit board, a substrate edge of the electronic chip is located between a first connection terminal and a third connection terminal of the circuit board, and a substrate of the electronic chip covers only the circuit board a first connection terminal and a surrounding area thereof, and exposing a third connection terminal of the circuit board, or, when the electronic chip is matched to the circuit board, the substrate of the electronic chip covers only the circuit board a first connection terminal and a surrounding area thereof, and the third connection terminal of the circuit board is exposed through the through hole.

In a third aspect, the present invention provides an imaging cartridge detachably mounted to an imaging device, the imaging device including a probe for making electrical contact with the imaging cartridge, the imaging cartridge including a circuit board fixed thereto The circuit board includes a connection terminal for electrically contacting a probe of the imaging device, and a first storage element, wherein the imaging cartridge further includes the first electronic chip or the second electronic device chip.

Optionally, a groove is disposed around a sidewall of the imaging device mounted with the circuit board; wherein

The second storage element of the electronic chip is disposed on a back surface of the substrate of the electronic chip, and when the electronic chip is matched to the circuit board, the second storage element is received in the groove.

In a fourth aspect, the present invention provides a method of repairing an imaging cartridge, the method comprising:

Providing a used imaging cartridge; wherein the imaging cartridge includes a circuit board having at least one first connection terminal;

Attaching an electronic chip to the circuit board, the substrate of the electronic chip covering only a portion of at least one of the first connection terminals of the circuit board;

Having the electronic chip receive an electrical signal transmitted to the at least one first connection terminal from the at least one first connection terminal that is only partially covered.

Optionally, when the electronic chip is attached to the circuit board, the substrate of the electronic chip covers only a portion of the at least one of the first connection terminals of the circuit board, and the first connection terminal is exposed for use with the imaging device The probe is in electrical contact with the contact.

Optionally, when the electronic chip is attached to the circuit board, the base of the electronic chip The edge of the plate covers a portion of the at least one first connection terminal and exposes a contact portion of the first connection terminal, or the substrate of the electronic chip is provided with a terminal through hole or a terminal groove via the terminal through hole or The terminal groove exposes a contact portion of the first connection terminal.

Optionally, at least one backing terminal is disposed on a back surface of the substrate of the electronic chip, and the at least one first connecting terminal is covered by at least one backing terminal portion of the electronic chip when the electronic chip is attached to the circuit board, and Electrically connected to the first connection terminal.

Optionally, when attaching the electronic chip to the board,

Soldering at least one back terminal of the electronic chip to the at least one first connection terminal of the partially covered circuit board.

Optionally, the circuit board has a plurality of first connection terminals, and when the electronic chip is attached to the circuit board, the substrate of the electronic chip covers only a portion of the at least one of the first connection terminals, and at least partially covers Other first connection terminals.

Optionally, the method further includes:

The electronic chip is caused to intercept an electrical signal transmitted to the other first connection terminal from the at least partially covered other first connection terminals.

Optionally, at least one positive terminal is disposed on the front surface of the substrate of the electronic chip, and the other first connection terminal is at least partially covered by at least one positive terminal of the electronic chip when the electronic chip is attached to the circuit board.

Optionally, at least one soldering terminal opposite to the positive terminal is disposed on the back surface of the substrate of the electronic chip, when the electronic chip is attached to the circuit board,

At least one solder terminal of the electronic chip is soldered to the other first connection terminal at least partially covered by the positive terminal.

Optionally, the circuit board includes a first storage element electrically connected to the first connection terminal, when the electronic chip is attached to the circuit board,

At least one of the first connection terminals is electrically connected to a line cut between the first storage elements in advance.

Optionally, when attaching the electronic chip to the circuit board, electrically connecting at least one of a power terminal VCC, a reset terminal RST, and a data terminal DAT in the first connection terminal to the first The wiring between the storage elements is broken or cut.

Optionally, the substrate of the electronic chip is made of a transparent material or a translucent material, and the electronic chip is used. When attached to the circuit board, the electronic chip is aligned to the first connection terminal of the circuit board through the substrate of the electronic chip.

Optionally, the method further includes:

A recess is formed around the side wall of the imaging cartridge on which the circuit board is mounted, and the second storage element of the electronic chip is housed in the recess when the electronic chip is attached to the circuit board.

An electronic chip, an imaging cartridge, and a repair imaging cartridge method for use with a circuit board attached to an imaging cartridge, wherein the substrate of the electronic chip includes at least one backing disposed on a side facing the circuit board. a terminal, when the electronic chip is mounted on the circuit board, the electronic chip covers a portion of the first connection terminal of the circuit board through the back contact terminal and exposes the first connection terminal and The probes are in contact with the connected contacts. And, when the imaging cartridge mounted with the electronic chip and the circuit board is mounted to the imaging device, the probe on the imaging device side passes through the substrate to expose the area of the contact portion and the first connection terminal on the circuit board The contacts are in contact and perform data communication with the second storage element of the electronic chip through the backing terminal overlying the first connection terminal.

Therefore, in the embodiment of the present invention, the connection terminal of the electronic chip in the prior art is disposed to cover a portion of the first connection terminal of the native chip and the contact portion is exposed, and the data communication between the second storage element and the imaging device is completed. The utility model can not only realize the recycling of the imaging cartridge, but also fully utilize the first connection terminal contact on the circuit board, save the manufacturing material of the electronic chip, and achieve the purpose of reducing the recycling cost.

DRAWINGS

1 is a schematic structural view of an electronic chip and a circuit board of an imaging box according to an embodiment of the present invention;

2 is a partial schematic structural view of an electronic chip and a circuit board of an imaging box according to an embodiment of the present invention;

3 is a schematic partial structural view showing an electronic chip and a circuit board of an imaging box according to another embodiment of the present invention;

4 is a schematic structural view of a circuit board and an electronic chip of an imaging cartridge in contact with a probe of an imaging device according to another embodiment of the present invention;

FIG. 5 is a partial structural diagram of an electronic chip and a circuit board of an imaging box according to still another embodiment of the present invention; FIG.

6 is a schematic structural view of a native chip according to still another embodiment of the present invention;

FIG. 7 is a partial structural diagram of a native chip mounted to an imaging cartridge according to still another embodiment of the present invention; FIG.

8 is a partial structural schematic view showing the mounting of a regenerative chip to an imaging cartridge having a native chip according to still another embodiment of the present invention;

Figure 9 is a schematic view showing the contact of an imaging cartridge and a probe mounted with a reproducing chip and a native chip according to still another embodiment of the present invention.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. It is only a part of the embodiments of the invention, not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

Embodiment 1

Embodiment 1 of the present invention provides an electronic chip (regeneration chip 12) for use with a circuit board (native chip 11) attached to an imaging cartridge for detachably mounting to an imaging device, the imaging device including A probe for electrical contact with the imaging cartridge, as shown in FIGS. 1 to 5, the imaging cartridge includes a native chip fixed thereto, the native chip 11 including a connection terminal and a first storage element 113, and the connection terminal is used for imaging The probe of the device is in electrical contact, the connection terminal includes at least one first connection terminal 1121, and the first storage element 113 is electrically connected to the at least one first connection terminal 1121, wherein the regenerative chip 12 comprises: a substrate fixed on the substrate a second storage element 123, and at least one backing terminal 125 disposed on the back surface of the substrate, wherein the back surface of the substrate is the side of the substrate of the regenerative chip 12 facing the native chip 11 when the regenerative chip 12 is matched to the original chip 11 on the imaging cassette, Two storage elements 123 are electrically connected to at least one of the back terminals 125;

When the regenerative chip 12 is matched to the native chip 11 on the imaging cartridge, the substrate of the reconstituted chip 12 covers only a portion of at least one of the first connection terminals 1121 of the native chip 11, and the first connection terminal 1121 is exposed. a contact portion 1120 electrically contacting the probe of the image forming apparatus, wherein the first connection terminal 1121 is partially covered by the backing terminal 125 disposed on the back surface of the substrate of the regenerative chip 12, and is electrically connected to the first connection terminal 1121, The second storage element 123 of the regenerative chip 12 is electrically connected via the backing terminal 125 and the partially covered first connection terminal 1121 to realize The green chip 12 is used in conjunction with the native chip 11, and the second storage element 123 of the regenerative chip 12 is in data communication with the probe of the imaging device in place of at least part of the function of the first storage element 113 of the native chip 11.

It should be noted that the backing terminal of the regenerative chip has a one-to-one correspondence with the partially covered first connecting terminal, that is, each backing terminal of the regenerative chip covers only a part of the first connecting terminal and is electrically connected thereto. Optionally, the regenerative chip may respectively provide a corresponding backing terminal for each of the first connecting terminals of the original chip, so that each of the backing terminals covers a part of each of the first connecting terminals, or may be only one of the original chips or a part of the first connecting terminal is provided with a corresponding backing terminal, so that the backing terminal covers a part of the one or a part of the first connecting terminal; and the second storage element of the regenerative chip can replace all functions of the first storage element of the original chip, That is, the data communication with the imaging device is completely completed by the second storage element of the regenerative chip, and only part of the function of the first storage element of the native chip can be replaced, and the second storage element and the first storage element are jointly completed with the imaging device. data communication.

The embodiment of the present invention provides a regenerative chip for matching a native chip to an imaging cartridge. The substrate of the regenerative chip includes at least one backing terminal disposed on a side facing the native chip. When the regenerative chip is matched to the native chip, the back of the regenerative chip is The terminal is electrically connected to cover a portion of the first connection terminal of the native chip and exposes a contact portion of the first connection terminal for electrical contact with the probe, when the imaging cartridge mounted with the regenerative chip 12 and the native chip 11 is mounted to the imaging device The probe on the imaging device side is in contact with the contact portion 1120 of the first connection terminal 1121 on the native chip 11, and the second storage of the backup terminal 125 and the regenerative chip 12 over the first connection terminal 1121 is electrically connected The component performs data communication.

Therefore, in the embodiment of the present invention, the regenerative chip is disposed to electrically connect a portion of the first connection terminal covering the native chip and expose the contact portion, and the data communication between the second storage element of the regenerative chip and the printer is completed, and not only the imaging cartridge can be realized. Recycling can also fully utilize the first connection terminal contacts on the original chip, saving the material for the regenerative chip, achieving the purpose of reducing the recycling cost, and achieving maximum recycling.

At the same time, it is not necessary to remove and reinstall the original chip installed on the imaging box, thereby protecting the fixed structure on the imaging box, prolonging the service life of the imaging box, reducing waste of resources, and avoiding taking off during recycling. In the process of the original chip, the fixing structure on the imaging cartridge case is easily damaged, so that the chip is not fixed firmly or cannot be fixed to the imaging cartridge, which greatly improves the problem. The pass rate of the imaging cartridge recycling regeneration.

Specifically, the manner in which the substrate of the regenerative chip exposes the contact portion of the first connection terminal of the native chip in the embodiment of the present invention includes: providing a terminal through hole at a corresponding position of the contact portion of the at least one first connection terminal, a terminal groove is disposed at a corresponding position of the contact portion of the at least one first connection terminal and a surrounding portion thereof, and a substrate edge of the regenerative chip is located at a side or a side of a corresponding position of the contact portion of the at least one first connection terminal and a phase thereof One of the adjacent sides or a combination of any ones.

Optionally, as shown in FIG. 2, at least one terminal through hole 124 is disposed on the substrate of the regenerative chip 12, and the terminal through hole 124 corresponds to the first connection terminal 1121 of the native chip 11, and is matched in the regenerative chip 12. When the native chip 11 is reached, the substrate of the regenerative chip 12 exposes the first connection terminal 1121 of the native chip 11 via the terminal through hole 124 for the contact portion 1120 that is in electrical contact with the probe of the image forming apparatus.

Further, the backing terminal 125 on the substrate of the regenerative chip 12 is matched with the terminal through hole 124, and a part of the first connection terminal 1121 of the native chip 11 is covered by the backing terminal 125 and exposed by the terminal through hole 124. The contact portion 1120 of the terminal 1121 is connected. Optionally, the backing terminal 125 may be disposed in a square, rectangular, circular, elliptical or other shape. The backing terminal 125 is at least partially disposed on the back side of the substrate of the regenerative chip on the upper edge side of the terminal through hole 124. When the imaging cartridge is mounted in the imaging device, the side where the regenerative chip and the native chip are in contact with the probe with respect to the swiping direction of the probe is the lower side, and the side opposite to the lower side is the upper side, the upper edge The terminal through hole 124 is adjacent to the upper side edge; or alternatively, the back contact terminal 125 is at least partially disposed in a ring shape or an arc shape along an annular back surface formed by the substrate at the edge of the terminal through hole 124.

For example, in conjunction with FIG. 2, a first connection terminal 1121 corresponding to the first connection terminal 1121 of the native chip 11 and exposing the native chip 11 is provided on the substrate of the reproduction chip 12 for electrical contact with the probe of the imaging device. When the terminal through hole 124 of the contact portion 1120, the substrate of the regenerative chip 12 includes at least one terminal through hole 124 and a back contact terminal 125 adjacent to the terminal through hole 124. The back contact terminal 125 is disposed on the back surface of the substrate of the regenerative chip 12, and the terminal The via 124 and the backing terminal 125 are matched and aligned with the first connection terminal 1121 of the native chip. When the regenerative chip 12 is matched to the imaging cartridge on which the native chip 11 is mounted, the substrate of the regenerative chip 12 where the backing terminal 125 is located covers a portion of the first connection terminal 1121 of the native chip 11 and is backed by the terminal 125 and the covered At least a portion of the first connection terminal 1121 of the native chip 11 is in contact with each other At the same time, the terminal via 124 on the substrate of the regenerative chip 12 exposes the contact portion 1120 of the first connection terminal 1121 that is in electrical contact with the probe of the imaging device.

When the imaging cartridge mounted with the regenerative chip 12 and the native chip 11 is mounted to the imaging device, the probe on the imaging device side passes through the terminal through hole 124 on the substrate of the regenerative chip 12 and contacts the first connection terminal 1121 of the native chip 11. The portion 1120 is in contact with each other, and the backing terminal 125 electrically connected through the first connection terminal 1121 performs data communication with the second storage element 123 of the regenerative chip 12.

During the mounting process of the imaging cartridge, the probe on the imaging device side abuts from the lower edge of the substrate of the regenerative chip 12 and the substrate of the regenerative chip 12 abuts into the terminal through hole 124 to realize the first connection terminal 1121 with the native chip 11. Electrical contact. The relative position and shape of the backing terminal 125 and the terminal through hole 124 may be appropriately set, and it is only required to ensure that at least a part of the back surface of the first connecting terminal 1121 is covered with the first connecting terminal when the reproducing chip 12 covers the native chip 11 1121 is electrically connected to the back contact terminal 125 and the contact portion 1120 of the first connection terminal 1121 is exposed by the terminal through hole 124. Preferably, the backing terminal 125 is at least partially located on the back surface of the regenerative chip substrate at the upper portion of the terminal through hole 124, that is, the terminal through hole 124 is closer to the lower edge of the substrate of the regenerative chip 12 than the backing terminal 125. Therefore, when the probe is swiped on the substrate of the regenerative chip 12, it does not pass through the area of the back contact terminal 125, thereby avoiding damage to the electrical connection structure of the back contact terminal 125 and the first connection terminal 1121, and prolonging the regenerative chip and The service life of the original chip; similarly, the backing terminal 125 is disposed on the back surface of the regenerative chip substrate at least part of the upper portion of the terminal through hole 124 and the two sides thereof, and the probe can be prevented from passing through the back terminal 125 region. The electrical connection structure of the terminal 125 and the first connection terminal 1121 affects.

It should be noted that, in consideration of the influence of the probe passing through the region of the back terminal 125 on the electrical connection structure of the back terminal 125 and the first connection terminal 1121, the preferred structure of the embodiment does not regenerate the lower portion of the terminal through hole 124. The back surface of the chip substrate is not provided with a backing terminal 125. It is also conceivable that the backing terminal 125 may be disposed on the back surface of the regenerative chip substrate at least a part of the lower portion of the terminal through hole 124 and the two sides thereof, although the probe may be traced through the area of the back terminal 125 at the lower portion of the terminal through hole 124. The electrical connection structure of the backing terminal 125 and the first connecting terminal 1121 is affected to cause an electrical connection failure, as long as the backing terminal 125 maintains a good electrical connection with the first connecting terminal 1121 in an area where the other probes are not crossed. Will not affect the probe and the first Data communication of two storage elements. For example, the backing terminal 125 may also be disposed as an annular terminal along the annular back surface formed by the substrate at the edge of the terminal through hole 124. The terminal through hole 124 only exposes the contact portion 1120 of the central region of the first connection terminal 1121, and the terminal through hole The backing terminal 125 is provided on the back surface of the substrate of the reproducing chip 12 covering the first connection terminal 1121 of the native chip 11 around the 124.

In the present embodiment, the regenerative chip 12 is disposed to electrically connect a portion of the first connection terminal 1121 of the native chip 11 and expose the contact portion 1120 of the first connection terminal 1121, and the first connection on the native chip 11 can be effectively utilized. The terminal contact saves the manufacturing material of the regenerative chip and achieves the purpose of reducing the recovery cost; moreover, the structure of the contact portion 1120 of the first connection terminal 1121 exposed by the terminal via 124 is not covered by the regenerative chip on the native chip 11. 12 causes the chip to be thickened, so that the telescopic deformation stroke of the probe that is in contact with the first connection terminal 1121 is increased to shorten the elastic deformation life of the probe, and the probe of the imaging device can be effectively protected.

Alternatively, as shown in FIG. 3, at least one terminal recess 126 is disposed on the substrate of the regenerative chip 12, and the terminal recess 126 corresponds to the first connection terminal 1121 of the native chip 11 and along the first connection. The corresponding portion of the contact portion 1120 of the terminal 1121 extends to the lower edge of the substrate of the regenerated chip 12, and a groove opening is formed on the substrate of the regenerative chip 12 from the lower edge to the corresponding portion of the contact portion 1120 of the first connection terminal 1121; When the chip 12 is mated to the native chip 11, the substrate of the regenerative chip 12 exposes the first connection terminal 1121 of the native chip 11 via the terminal recess 126 for the contact portion 1120 in electrical contact with the probe of the imaging device.

Further, the backing terminal 125 on the substrate of the regenerative chip 12 is matched with the terminal recess 126, and a portion of the first connecting terminal 1121 of the native chip 11 is covered by the backing terminal 125 and exposed by the terminal recess 126. The contact portion 1120 of the terminal 1121 is connected. Optionally, the backing terminal 125 may be arranged in a square, rectangular, circular, elliptical or the like, or may be arranged in an arc shape, and the backing terminal 125 is at least partially disposed on the substrate of the regenerative chip on the terminal recess 126. The back side of the edge side, or the back surface of the substrate of the reproducing chip at least partially disposed on the side of the side edge of the terminal groove 126. The backing terminal 125 may be disposed only on the upper edge or the side edge side of the terminal groove 126 in a lump shape, or may be disposed at least partially along the arcuate back surface formed by the substrate on the upper edge and the two side edges of the terminal groove 126. Curved back terminal.

For example, in conjunction with FIG. 3, when the substrate of the regenerative chip 12 is provided with a terminal recess 126 recessed from the lower edge to the corresponding portion of the contact portion 1120 of the first connection terminal 1121, the terminal recess 126 and the first of the native chip 11 The connection terminal 1121 corresponds to and exposes the first of the native chip 11 When the connection terminal 1121 is used for the contact portion 1120 in electrical contact with the probe of the image forming apparatus, similar to the terminal through hole 124 shown in FIG. 2, the backing terminal 125 is adjacent to and matched with the terminal recess 126 and is native The first connection terminal 1121 of the chip is aligned.

Similar to the relative position and shape between the terminal through hole 124 and the backing terminal shown in FIG. 2, the backing terminal 125 may be at least partially disposed at the upper edge or the side edge of the terminal groove 126, and only needs to be secured. When the regenerative chip 12 covers the native chip 11 , at least a part of the substrate in the first connection terminal 1121 is disposed on the back surface of the substrate, and the back connection terminal 125 is electrically connected to the first connection terminal 1121 and the first connection terminal 1121 is exposed by the terminal groove 126 . The contact portion 1120 is sufficient.

4, when the imaging cartridge mounted with the regenerative chip 12 and the native chip 11 is mounted to the image forming apparatus, the probe 2 on the imaging device side passes through the terminal recess 126 from the lower edge of the substrate of the native chip 11 and the substrate of the native chip 11. Abutting and sliding along the terminal recess 126 to the first connection terminal 1121 enables electrical contact with the first connection terminal 1121 of the native chip 11. Compared with the terminal through hole of FIG. 2, the structure in which the regenerative chip 12 is provided with the terminal recess 126 in the embodiment can also guide the probe 2 to the first connection terminal 1121 of the native chip 11 and is in good contact with the contact portion 1120. Conducive to the positioning and installation of the imaging cartridge chip; and avoiding the terminal through hole provided by the regenerative chip, which leads to the contact connection during the installation of the imaging cartridge, because the probe needs to be drawn from the lower edge of the regenerative chip into the terminal through hole. When the probe is swiped on the substrate of the regenerative chip, the telescopic deformation stroke of the probe is still increased, the probe of the imaging device is more effectively protected, and the probe is prevented from passing through the terminal through hole and the first connection. The terminal connection is easy to cause the probe to scratch the lower edge of the terminal through hole and damage the probe when the imaging cartridge is removed from the imaging device.

Alternatively, as shown in FIG. 5, the substrate edge of the regenerative chip 12 is located on one side or one side of the corresponding position of the contact portion of the first connection terminal and its adjacent side, when the regenerative chip 12 is matched to the native chip 11. The substrate of the regenerative chip 12 covers one side or one side of the first connection terminal 1121 of the native chip 11 and its adjacent side, and exposes the contact portion of the first connection terminal 1121 for electrical contact with the probe of the image forming apparatus. 1120.

Further, the backing terminal 125 on the substrate of the regenerative chip 12 is disposed on the back surface of the substrate at the edge of the substrate covering the first connecting terminal 1121 of the regenerative chip 12, and a part of the first connecting terminal 1121 is covered by the backing terminal 125 and is The substrate edge uncovered region of the regenerative chip 12 exposes the contact portion 1120 of the first connection terminal 1121.

Optionally, the upper half of the first connection terminal 1121 is covered by the lower edge of the substrate of the regenerative chip 12 And the substrate of the regenerative chip 12 is entirely located above the first connection terminal 1121, and the backing terminal 125 may be disposed in a square, rectangular, circular, elliptical or other shape, and disposed on the lower edge of the substrate of the regenerative chip 12 The back side of the substrate is covered; or the lower half of the first connection terminal 1121 is covered by the upper edge of the substrate of the regenerative chip 12 and the substrate of the regenerative chip 12 is entirely located in the lower area of the first connection terminal 1121, and the backing terminal 125 is disposed on the regenerative chip. The back surface of the substrate on the upper edge side of the substrate 12; or the side of the first connection terminal 1121 is covered by the substrate side edge of the regenerative chip 12, and the entire substrate of the regenerative chip 12 is located on the side of the side of the first connection terminal 1121, The backing terminal 125 is provided on the back surface of the substrate on the side of the substrate side edge of the reproducing chip 12.

Optionally, the upper and side halves of the first connection terminal 1121 are covered by the lower edge and one side edge of the substrate of the regenerative chip 12, and the backing terminal 125 is at least partially formed along the lower edge of the substrate and the side of the edge. Or disposed in an arc shape, or the upper and side halves of the first connection terminal 1121 are covered by the upper edge and the one side edge of the substrate of the regenerative chip 12, and the back contact terminal 125 is formed at least partially along the upper edge and the side edge of the substrate. The curved back is arranged in an arc shape.

For example, in conjunction with FIG. 5, when the substrate edge of the regenerative chip is located on one side or one side of the corresponding position of the contact portion of the first connection terminal and its adjacent side, the backing terminal is disposed on the regenerative chip to cover the first connection terminal. When the back surface of the substrate is at the edge of the substrate, for example, as illustrated in FIG. 5, the backing terminal 125 is disposed on the back surface of the substrate on the lower edge side of the substrate of the regenerative chip 12, and when the regenerative chip 12 is matched to the original chip 11, the substrate of the reconstituted chip 12 is under The edge covers the upper half of the first connection terminal 1121 of the native chip 11 and the entire substrate of the regenerative chip 12 is located above the first connection terminal 1121. The back contact terminal 125 corresponds to the upper half of the first connection terminal 1121, and is exposed. A contact portion 1120 of the first connection terminal 1121 for making electrical contact with a probe of the imaging device.

When the imaging cartridge on which the regenerative chip 12 and the native chip 11 are mounted is mounted to the image forming apparatus, the probe 2 on the imaging device side directly abuts from the lower edge of the substrate of the native chip 11 and is swiped to the first connection. The terminal 1121 achieves electrical contact with the first connection terminal 1121 of the native chip 11.

In this embodiment, the lower edge of the substrate of the regenerative chip 12 coincides with the cover edge of the back contact terminal 125, which saves the cost of processing the terminal through hole or the terminal groove, greatly saves the material of the regenerated chip, and can greatly reduce the detection. The contact of the needle with the regenerated chip substrate reduces the risk of displacement or lift of the regenerative chip due to the swipe of the probe.

Further, the backing terminal 125 disposed on the back surface of the substrate of the regenerative chip 12 is soldered to the partially covered first connection terminal 1121, and a soldering structure is formed on the coverage area of the backing terminal 125 and the first connection terminal 1121 to realize a regenerative chip. The back terminal 125 of 12 is electrically connected to the first connection terminal 1121 of the native chip 11.

Specifically, the solder bump is preliminarily solidified on the backing terminal 125 of the regenerative chip 12 or the solder paste is pre-coated on the region of the first chip terminal 1121 of the primary chip 11 for contact with the backing terminal 125, when the regenerating chip 12 is regenerated. When matching to the native chip 11, the front surface of the substrate of the regenerative chip 12 corresponding to the backing terminal 125 is pressed by the soldering pin, and the backing terminal 125 is in aligning contact with the first connecting terminal 1121 of the native chip 11, and is soldered by high voltage pulse of the soldering pin or Ultrasonic welding solders the backing terminal 125 to the first connection terminal 1121 and forms a soldering structure, so that the second storage element on the regenerative chip 12 is electrically connected to the contact portion 1120 of the first connection terminal 1121 through the backing terminal 125, and is regenerated. The chip 12 is solder-fixed to the substrate of the native chip 11 without being detached from the image forming cartridge.

Optionally, a viscous material is attached to the back surface of the substrate of the regenerative chip 12.

Specifically, the regenerative chip 12 can be bonded and fixed to the native chip 11 , and a viscous material such as glue or double-sided tape is attached to the back surface of the substrate of the regenerative chip 12 , and the substrate of the reconstituted chip 12 is pasted and fixed to the substrate of the native chip 11 without It is preferable to apply a viscous material to the back surface area of the substrate of the regenerative chip 12 which is in contact with the native chip 11 so that the regenerative chip 12 can be attached to the original chip 11 substrate. Firmly adhered to the original chip 11 substrate to prevent the edge of the substrate of the regenerative chip 12 from affecting the mounting of the imaging cartridge to the image forming apparatus.

Further, the substrate of the regenerated chip 12 is a flexible circuit board.

Specifically, when the regenerative chip 12 is matched to the imaging cartridge including the native chip 11, the back surface of the substrate of the reconstituted chip 12 for contacting the substrate plane of the native chip 11 is not provided with other protrusions and is a planar substrate, and the reconstituted chip 12 is The flexible circuit board with better deformation can better adapt to the difference in height between the sidewall surface of the imaging cartridge and the plane of the substrate of the original chip 11, and ensure that the regenerated chip 12 is well attached to the surface of the sidewall of the original chip 11 and the imaging cartridge, so that the paste is pasted. And/or the soldering is more secure, and the flexible circuit board can enhance the flexibility of the substrate, and it is easier for the probe to abut the lower edge of the substrate of the regenerative chip 12 to the first connecting terminal 1121 area.

Optionally, the substrate of the regenerative chip 12 is made of a transparent material or a translucent material.

Specifically, when the regenerative chip 12 is matched to the imaging cartridge including the native chip 11, the positioning terminal 125 of the regenerative chip 12 is accurately covered to the first connection terminal 1121 of the native chip 11 and is provided by the terminal through hole 124/ for accurate positioning. The terminal recess 126 / the edge of the substrate exposes the contact portion 1120 of the first connection terminal 1121 , and the substrate of the regenerative chip 12 is provided as a transparent material or a translucent material. When the substrate of the regenerative chip 12 is covered to the native chip 11 , the regenerative film can be regenerated. The substrate of the chip 12 has a good alignment between the back-contact terminal 125 on the back surface of the substrate of the regenerative chip 12 and the first connection terminal 1121 of the native chip 11 covered by the substrate of the regenerative chip 12, thereby improving the efficiency of positioning and mounting of the regenerative chip 12.

Embodiment 2

Embodiment 1 of the present invention provides a regenerative chip in which a backing terminal is disposed on a back surface of a substrate for electrically connecting to a first connection terminal of a native chip. However, in the prior art, a connection terminal of a native chip usually has a plurality of or more And arranged in different forms, the second embodiment of the present invention provides another regenerative chip for a specific application.

Continuing with FIG. 1 to FIG. 5, the second embodiment of the present invention provides another electronic chip (regeneration chip 12) for use with a circuit board (native chip 11) attached to an imaging cartridge. The imaging cartridge is used for Removably mounted to an imaging device, the imaging device includes a probe for making electrical contact with the imaging cartridge, the imaging cartridge including a native chip affixed thereto, the native chip 11 including a connection terminal and a first storage element 113, the connection terminal being for The connection terminal includes a plurality of first connection terminals 1121 electrically connected to the first storage element 113. The plurality of first connection terminals 1121 are arranged in at least two rows, wherein the regenerative chip 12 comprises: a substrate, a second storage element 123 fixed on the substrate, and at least one backing terminal 125 disposed on the back surface of the substrate, the back surface of the substrate being the substrate of the regenerative chip 12 facing the native chip 11 when the regenerative chip 12 is matched to the native chip 11 One side, the second storage element 123 is electrically connected to at least one of the back terminals 125;

When the regenerative chip 12 is matched to the native chip 11, the substrate of the regenerative chip 12 covers only a portion of at least one of the plurality of first connection terminals 1121 of the native chip 11, wherein the substrate is disposed on the regenerative chip 12 The rear back terminal 125 partially covers the first connection terminal 1121 and is electrically connected to the first connection terminal 1121 such that the second storage element 123 of the regenerative chip 12 passes through the back contact terminal 125 and the partially covered first connection The terminal 1121 is electrically connected, and the regenerative chip 12 is used in cooperation with the native chip 11 to regenerate the chip. The second storage element 123 of 12 replaces at least a portion of the functionality of the first storage element 113 of the native chip 11 with data communication with the probe of the imaging device.

And, the substrate of the regenerated chip 12 exposes the contact portion 1120 of the at least one first connection terminal 1121 partially covered for electrical contact with the probe of the image forming apparatus.

Specifically, the structure of the contact portion 1120 of the first connection terminal 1121 of the substrate of the regenerative chip 12 may be the same as that of the terminal through hole 124, the terminal groove 126, and the substrate edge listed in the first embodiment. .

Generally, the plurality of first connection terminals 1121 of the native chip 11 are arranged in at least two rows in such a manner that the imaging cartridge is mounted in the direction of the imaging device, that is, the probe of the imaging device is swiped relative to the regenerative chip and the native chip. In the direction, the plurality of first connection terminals 1121 of the native chip 11 are arranged in at least two rows perpendicular to the mounting direction. Accordingly, in the at least two rows of the first connection terminals 1121, there is a probe preferentially associated with the imaging device. The first row of contacts (ie, the bottom row closest to the lower edge of the substrate) and at least a second row that is subsequently in contact with the probe of the imaging device.

When the number of the backing terminals 125 corresponding to the plurality of first connection terminals 1121 of the native chip 11 on the regenerative chip 12 is less than the number of the first connection terminals 1121, that is, not all of the first connection terminals 1121 are The portion of the substrate of the regenerated chip is partially covered and the contact portion is exposed. Preferably, the regenerative chip 12 further includes:

At least one positive terminal 1221 disposed on a front surface of the substrate, the front surface of the substrate is a side of the substrate of the regenerative chip 12 facing away from the native chip 11 when the regenerative chip 12 is matched to the native chip 11, and the second storage element 123 and at least one of the positive terminals 1221 Electrical connection

When the regenerative chip 12 is matched to the native chip 11, the at least one positive terminal 1221 corresponds to the at least one first connection terminal 1121, and at least partially covers the corresponding first connection terminal 1121, and the positive terminal 1221 does not A connection terminal 1121 is electrically connected.

The first connection terminal 1121 of the substrate of the regenerative chip 12 covering the native chip 11 is specifically disposed such that the at least one positive terminal 1221 covers at least the contact of the corresponding first connection terminal 1121 for electrical contact with the probe of the imaging device. The portion 1120, and the positive connection terminal 1221 replaces the first connection terminal 1121 to complete electrical contact with the probe of the imaging device. Thereby, the positive terminal 1221 blocks the probe of the image forming apparatus to electrically contact the first connection terminal 1121, and electrically connects the probe of the image forming apparatus to the second storage element 123 of the reproduction chip 12 to implement the second storage element 123 of the reproduction chip 12 instead. At least part of the function of the first storage element 113 of the native chip 11 Data communication with the probe of the imaging device.

Preferably, at least one backing terminal 125 and at least one positive terminal 1221 of the regenerative chip 12 are arranged in at least two rows corresponding to the plurality of first connecting terminals 1121 of the native chip 11, and the at least one backing terminal 125 is disposed on It is adjacent to the first row of the lower edge of the substrate and is electrically connected to at least one first connection terminal 1121 of the first row of the native chip 11.

Preferably, the backing terminal 125 of the regenerative chip 12 is disposed in the first row and the positive terminal 1221 is disposed in the other row, that is, the connecting terminals of the first row of the regenerative chip 12 are all disposed as the backing terminal 125, and the other rows are The connection terminals are all set to the positive connection terminal 1221.

Further, the backing terminal 125 disposed in the first row is disposed on the back surface of the substrate on which the regenerative chip 12 covers the lower edge of the substrate of the first connection terminal 1121 of the native chip 11, and the first connection terminal is covered by the backing terminal 125. The upper portion of 1121 exposes the contact portion 1120 of the first connection terminal 1121.

For example, in conjunction with FIG. 5, the primary chip 11 is provided with five first connection terminals 1121 and arranged in two rows in a direction perpendicular to the mounting direction, wherein the three first connection terminals 1121 are arranged close to the lower edge of the substrate. In the first row, the other two first connection terminals 1121 are arranged in a second row. The backing terminal 125 and the positive terminal 1221 of the regenerative chip 12 are in one-to-one correspondence with the first connecting terminal 1121 of the native chip 11, and are also arranged in two rows, wherein the three terminals of the first row are connected. All of the terminals are 125, the two terminals of the second row are all the positive terminals 1221, and the three back terminals 125 of the first row are all disposed on the back surface of the substrate at the lower edge of the substrate of the regenerative chip 12.

When the regenerative chip 12 is matched to the native chip 11, the lower edge of the substrate of the regenerative chip 12 is located in the upper half of the first connection terminal 1121 of the first row of the native chip 11, and the backing terminal 125 of the first row of the regenerative chip 12 is disposed. Electrically connecting the upper half of the first connection terminal 1121 of the first row and exposing the contact portion 1120 of each of the first connection terminals 1121; the positive terminal 1221 of the second row disposed on the regenerative chip 12 respectively covers the corresponding The first connection terminal 1121 of the second row on the native chip 11 and the electrical connection of the first connection terminal 1121 of the second row to the probe is blocked.

When the imaging cartridge on which the regenerative chip 12 and the native chip 11 are mounted is mounted to the image forming apparatus, the probe of the image forming apparatus directly abuts from the lower edge of the substrate of the native chip 11 and is swiped from the bottom to the bottom, for The probe in electrical contact with the first row of connection terminals is swiped to the native chip 11 The first connection terminal 1121 of the first row is in contact with the contact portion 1120 of the first connection terminal 1121 to achieve electrical contact with the first row of connection terminals, and the probe for electrically contacting the second row of connection terminals is swiped to the regenerative chip The lower edge of the substrate of 12 is abutted against the substrate of the regenerative chip 12 to the positive terminal 1221 of the regenerative chip 12 and is in contact with the contact portion of the positive terminal 1221 to achieve electrical contact with the second row of connection terminals, thereby realizing the regenerative chip 12 The second storage element 123 is electrically contacted with the first row of probes of the first row of the native chip 11 of the native chip 11 electrically connected by the backing terminal 125 of the first row of the regenerative chip 12, and passes through the regenerative chip 12 The positive terminal 1221 of the second row is in electrical contact with the second row of probes of the imaging device.

Further, the regenerative chip 12 further includes: at least one soldering terminal disposed on the back surface of the substrate, the soldering terminal being opposite to the positive terminal 1221 disposed on the front surface of the substrate; and the regenerative chip 12 passing through the soldering terminal and the backing terminal disposed on the back surface of the substrate 125 is soldered to the at least partially covered first connection terminal 1121.

Specifically, the regenerative chip 12 can be soldered and fixed to the native chip 11 by pre-solidifying the solder bumps on the soldering terminal and the backing terminal 125 or pre-applying the solder paste on the first connecting terminal 1121. Further, by providing the soldering terminals on the back surface of the substrate of the reproducing chip 12, the reproducing chip 12 can be more firmly fixed to the substrate of the original chip 11 without being detached from the image forming cartridge.

It should be noted that the positive terminal 1221 disposed on the front surface of the substrate and the solder terminal on the back surface of the opposite substrate may be electrically connected to realize the electrical connection of the positive terminal 1221 to the first connection terminal 1121 of the native chip 11, thereby realizing the regenerative chip 12 The second storage element 123 cooperates with the first storage element 113 of the native chip 11 to perform data communication with the imaging device. Alternatively, the positive terminal 1221 disposed on the front surface of the substrate may not be electrically connected to the solder terminal on the opposite side of the substrate. Further, the second storage element 123 of the regenerative chip 12 is implemented to replace all functions of the first storage element 113 of the native chip 11 and complete data communication with the imaging device.

Generally, the first connection terminal 1121 of the native chip 11 includes a power supply terminal VCC, a ground terminal GND, a reset terminal RST, a clock terminal CLK, a data terminal DAT, and the like. The power supply terminal VCC and the ground terminal GND are used for the chip to receive a high-level power supply signal VCC and a low-level ground signal GND from the imaging device, and the reset terminal RST is used for the chip to receive the initialization and end of the work from the imaging device. The reset enable signal, the clock terminal CLK and the data terminal DAT are used for the chip to receive the clock signal CLK and the data signal DAT for data transmission from the imaging device, respectively. In the first connection terminals 1121 arranged in two rows, the ground terminal GND is located in the first row and the reset terminal RST and/or the power supply terminal VCC are located in the second row.

Further, the solder terminal corresponding to the reset terminal RST and/or the power supply terminal VCC of the native chip 11 on the back surface of the substrate of the regenerative chip 12 is electrically connected to the back surface of the substrate of the regenerative chip 12 corresponding to the ground terminal GND of the native chip 11 Terminal.

Specifically, when the second storage element 123 of the regenerative chip 12 replaces all the functions of the first storage element 113 of the native chip 11 and completely completes data communication with the imaging device, in order to prevent the first connection terminal 1121 from being electrically connected to the first row The connected first storage element 113 may interfere with data communication of the second storage element 123 with the imaging device, and the regenerative chip 12 is preferentially set as a solder terminal corresponding to the reset terminal RST and/or the power supply terminal VCC of the native chip 11 on the back surface of the substrate. Electrically connected to the back terminal of the back surface of the substrate corresponding to the ground terminal GND of the native chip 11, when the regenerative chip 12 is matched to the native chip 11, the reset terminal RST of the native chip 11 and/or the power terminal VCC are soldered via the solder The terminal is electrically connected to the ground terminal GND, so that when the imaging cartridge mounted with the regenerative chip 12 and the native chip 11 is mounted to the imaging device, the probe of the imaging device is in electrical contact with the ground terminal GND of the native chip 11 and the ground signal GND is applied, The reset terminal RST and/or the power supply terminal VCC electrically connected to the first storage element 113 cause the first storage because the ground signal GND is always received The device 113 is always unable to perform initialization of the start operation when the reset signal is switched to the high level and/or obtain the power required for the operation, and therefore, the first storage element 113 is always inoperable without interfering with the data communication of the second storage element 123 with the imaging device. .

When the number of the backing terminals 125 corresponding to the plurality of first connection terminals 1121 of the native chip 11 on the regenerative chip 12 is equal to the number of the first connection terminals 1121, that is, each of the first connection terminals 1121 is regenerated. The substrate of the chip partially covers and exposes the contact portion, and the structure of the contact portion 1120 of the regenerative chip 12 that is matched with the plurality of the back contact terminals 125 to expose the first connection terminal 1121 can be combined in various combinations.

Preferably, the plurality of backing terminals 125 of the regenerative chip 12 are arranged in at least two rows corresponding to the plurality of first connecting terminals 1121 of the native chip 11, wherein at least one row of the backing terminals 125 away from the lower edge of the substrate Each of the backing terminals 125 is disposed on the substrate of the regenerative chip 12 with a terminal through hole 124/terminal recess 126, and a part of the first connecting terminal 1121 of the native chip 11 is covered by the backing terminal 125 and The terminal through hole 124 / the terminal groove 126 exposes the contact portion 1120 of the first connection terminal 1121 .

In a first mode, preferably, in the first row of the backing terminals 125 near the lower edge of the substrate, each of the backing terminals 125 is disposed on the lower edge of the substrate of the first connecting terminal 1121 of the primary chip 11 of the regenerative chip 12 On the back surface of the substrate, the upper half of the first connection terminal 1121 is covered by the backing terminal 125 and the contact portion 1120 of the first connection terminal 1121 is exposed.

Preferably, in the at least two rows of the backing terminals 125, the substrate of the regenerative chip 12 is respectively provided with a terminal through hole 124 corresponding to each of the backing terminals 125, and the backing terminal 125 covers the original A portion of the first connection terminal 1121 of the chip 11 and the contact portion 1120 of the first connection terminal 1121 are exposed by the terminal through hole 124.

Specifically, in combination with the examples shown in FIG. 2, FIG. 3 and FIG. 5, the terminal through hole 124, the terminal groove 126 or the lower substrate edge structure on the substrate of the regenerative chip 12 matching the backing terminal 125 have been described in detail in the first embodiment. , will not repeat them here. The connection terminals of the regenerative chip 12 electrically connected to the second storage element 123 are all disposed as the back connection terminals 125. When the regenerative chips 12 are matched to the native chips 11, each of the backing terminals 125 is electrically connected to each of the first connection terminals 1121. Each of the first connection terminals 1121 is simultaneously electrically connected to the first storage element 113 and the second storage element 123. Correspondingly, when the imaging cartridge mounted with the regenerative chip 12 and the native chip 11 is mounted to the imaging device, the probe on the imaging device side passes through the terminal through hole 124, the terminal recess 126 or the substrate disposed on the substrate of the regenerative chip 12 The edge electrically contacts each of the first connection terminals 1121, thereby enabling the second storage element 123 of the regenerative chip 12 to co-respond with the first storage element 113 of the native chip 11 and complete data communication with the imaging device. Alternatively, if the second storage element 123 of the regenerative chip 12 is set to replace all functions of the first storage element 113 of the native chip 11 and complete data communication with the imaging device in its entirety, it is necessary to pre-set the first of the native chip 11 in advance. The connection terminal 1121 is electrically connected to at least one line cut between the first storage elements 113, for example, the wiring between the power supply terminal VCC/the reset terminal RST/data terminal DAT and the first storage element 113 is cut or cut. .

Similar to the first embodiment, the regenerative chip for matching the original chip to the imaging cartridge provided in the second embodiment can also electrically connect a part of the first connection terminal covering the native chip by using the backing terminal provided on the back surface of the substrate. And exposing the contact portion of the first connection terminal for electrical contact with the probe, and realizing and combining with the first connection terminal having the plurality of rows by the combination of the back contact terminal and the positive terminal or the back contact terminal and the substrate bare structure of the regenerative chip The good matching of the original chip not only saves the production materials of the regenerative chip, but also achieves the purpose of reducing the recycling cost, and protects The fixed structure on the imaging box prolongs the service life of the imaging box, reduces the waste of resources, and avoids the damage of the fixed structure on the imaging box body during the process of removing the original chip during recycling, so that the chip is not fixed. The problem of being secure or unable to fix to the imaging cartridge greatly improves the yield of the imaging cartridge for recycling.

Further, the connection terminal of the native chip 11 further includes two second connection terminals 1122 respectively disposed at two ends of one of the first connection terminals 1121.

Optionally, the two second connection terminals 1122 are detection terminals electrically connected to the detecting component 114, and are arranged at two ends of the first row of first connection terminals 1121.

Specifically, the detecting component 114 may be a piezoelectric component, a capacitance measuring component, or the like, for the imaging device to detect the remaining amount of the imaging material in the imaging cartridge, and the two second connecting terminals 1122 are margin detecting terminals; the detecting component 114 may also be It is a component for a chip mounting of an imaging device for detecting an imaging cartridge by a resistive element or the like, and the two second connection terminals 1122 are mounting detection terminals. The imaging device outputs a corresponding detection signal to one of the second connection terminals 1122, and receives a response signal via the detection element 114 at the other second connection terminal 1122, thereby determining the remaining amount of the imaging material in the imaging cartridge or determining the installation of the imaging cartridge. status.

Based on the above arrangement, the regenerative chip provided in this embodiment may be further configured to: when the regenerative chip 12 is matched to the native chip 11, the substrate edge of the regenerative chip 12 is located at the first connection terminal 1121 and the second connection terminal 1122 of the native chip 11. Between the substrates of the regenerated chip 12 covers only the first connection terminal 1121 of the native chip 11 and its surrounding area, and the second connection terminal 1122 of the native chip 11 is exposed.

Or the regenerative chip may be disposed such that the regenerative chip 12 is further provided with a through hole. When the regenerative chip 12 is matched to the native chip 11, the substrate of the regenerative chip 12 covers only the first connection terminal 1121 of the native chip 11 and its surrounding area, and The second connection terminal 1122 of the native chip 11 is exposed through the through hole.

Specifically, the regenerative chip 12 covers only the first connection terminal 1121 of the native chip 11 and its surrounding area and exposes the second connection terminal 1122 of the native chip 11 via the substrate edge or the through hole, and the second connection terminal 1122 of the native chip 12 is utilized. The circuit and the circuit complete the detection function of the imaging device, which saves the production material of the regenerative chip and achieves the purpose of reducing the recycling cost.

Further, the connection terminal of the native chip 11 further includes at least one third connection terminal 1123 and is disposed at one end of the at least one row of the first connection terminals 1121 away from the lower edge of the substrate. It is used by the imaging device to detect the installation state of the imaging cartridge.

Correspondingly, the regenerative chip may further be disposed such that when the regenerative chip 12 is matched to the native chip 11, the substrate edge of the regenerative chip 12 is located between the first connection terminal 1121 and the third connection terminal 1123 of the native chip 11, and the regenerative chip 12 is The substrate covers only the first connection terminal 1121 of the native chip 11 and its surrounding area, and exposes the third connection terminal 1123 of the native chip 11.

Or the regenerative chip may be disposed such that the regenerative chip 12 is further provided with a through hole. When the regenerative chip 12 is matched to the native chip 11, the substrate of the regenerative chip 12 covers only the first connection terminal 1121 of the native chip 11 and its surrounding area, and The third connection terminal 1123 of the native chip 11 is exposed through the through hole.

Embodiments of the present invention also provide an imaging cartridge detachably mounted to an imaging device, the imaging device including a probe for making electrical contact with the imaging cartridge, the imaging cartridge including a native chip fixed thereto, a native chip 11 includes a connection terminal for electrically contacting the probe of the imaging device, and a first storage element 113, wherein the imaging cartridge further includes the regenerative chip 12 provided by any of the above embodiments.

Further, a groove is disposed around the side wall of the imaging cartridge on which the native chip 11 is mounted, and the second storage element 123 of the regenerative chip 12 is disposed on the back surface of the substrate of the regenerative chip 12, and the regenerative chip 12 is matched to the native chip. At 11 o'clock, the second storage element 123 is received in the recess. Thereby, the space after the reproduction chip 12 is matched to the original chip 11 of the imaging cartridge can be saved.

Embodiment 3

Corresponding to the regenerative chip 12 provided in the first embodiment and the second embodiment, the present embodiment provides a method for matching an electronic chip (regeneration chip 12) to a circuit board (native chip 11) attached to the imaging cartridge for repair imaging. Box method:

S101: providing a used imaging cartridge, the imaging cartridge includes a native chip 11, the native chip 11 has at least one first connection terminal 1121;

S102: attaching the regenerative chip 12 to the native chip 11, the substrate of the regenerative chip 12 covering only a portion of at least one of the first connection terminals 1121 of the native chip 11;

S103: The regenerative chip 12 is caused to receive an electrical signal transmitted from the at least one first connection terminal 1121 that is partially covered to the at least one first connection terminal 1121.

Further, in step S102: when the regenerative chip 12 is attached to the native chip 11, The substrate of the regenerative chip 12 covers only a portion of at least one of the first connection terminals 1121 of the native chip 11, and exposes the contact portion 1120 of the first connection terminal 1121 for electrical contact with the probe of the imaging device;

Further, when the regenerative chip 12 is attached to the native chip 11, the substrate edge of the regenerative chip 12 covers a portion of the at least one first connection terminal 1121 and exposes the contact portion 1120 of the first connection terminal 1121, Alternatively, the substrate of the regenerative chip 12 is provided with a terminal through hole 124 or a terminal recess 126, through which the contact portion 1120 of the first connection terminal 1121 is exposed;

Further, the back surface of the substrate of the regenerative chip 12 is provided with at least one backing terminal 125. When the regenerative chip 12 is attached to the native chip 11, at least one backing terminal 125 of the regenerative chip 12 partially covers the at least one first connecting terminal. 1121, and electrically connected to the first connection terminal 1121;

Further, when the regenerative chip 12 is attached to the native chip 11, at least one backing terminal 125 of the regenerative chip 12 is soldered to the at least one first connection terminal 1121 of the partially covered native chip 11;

Further, the native chip 11 has a plurality of first connection terminals 1121. In step S102, the regenerative chip 12 is attached to the native chip 11, and the substrate of the regenerative chip 12 covers only at least one of the first connection terminals 1121. a portion, and at least partially covering the other first connection terminals 1121;

Further, the method further includes the step of: S104: causing the regenerative chip 12 to intercept an electrical signal transmitted to the other first connection terminal 1121 from the at least partially covered other first connection terminals 1121.

Further, at least one positive terminal 1221 is disposed on the front surface of the substrate of the regenerative chip 12, and when the regenerative chip 12 is attached to the native chip 11, at least one positive terminal 1221 of the regenerative chip 12 at least partially covers the other first connection terminal 1121 ;

Further, at least one soldering terminal facing the positive terminal 1221 is disposed on the back surface of the substrate of the regenerative chip 12, and at least one soldering terminal of the regenerative chip 12 is soldered to the positive terminal at least when the regenerative chip 12 is attached to the original chip 11. The other first connection terminal 1121 of the native chip 11 partially covered.

Further, the native chip 11 further includes a first storage element 113, the first connection The terminal 1121 is electrically connected to the first storage element 113, and in step S102: at least one of the first connection terminals 1121 is electrically connected to the first storage element 113 in advance when the regenerative chip 12 is attached to the native chip 11. Cut off between lines;

Further, the at least one first connection terminal 1121 includes at least a power terminal VCC, a reset terminal RST, and a data terminal DAT, and electrically connects at least one of the power terminal VCC, the reset terminal RST, and the data terminal DAT to the first storage element in advance. The wiring between 113 is cut or cut.

Further, the substrate of the regenerative chip 12 is made of a transparent material or a translucent material. In step S102, when the regenerative chip 12 is attached to the native chip 11, the reconstituted chip 12 is aligned to the substrate through the regenerative chip 12 to At least one first connection terminal 1121 of the native chip 11.

Further, the method further includes the steps of: S105: opening a groove around the sidewall of the imaging cartridge on which the native chip 11 is mounted, and when attaching the regenerative chip 12 to the native chip 11, the second storage element 123 of the reconstituted chip 12 It is housed in the above groove.

Corresponding to the regenerative chip 12 provided in the first embodiment and the second embodiment, the method for repairing the imaging cartridge provided in the embodiment can be used to match the regenerative chip 12 to the original chip 11 of the imaging cartridge, and the regenerative chip 12 The data communication with the imaging device is completed by using at least part of the material of the native chip 11, thereby achieving the purpose of reducing the recovery cost and protecting the fixed structure of the imaging cartridge, and greatly improving the yield of the imaging cartridge for recycling.

Embodiment 4

As shown in FIGS. 6-9, an embodiment of the present invention provides a regenerative chip 12 for mounting to an imaging cartridge 1 for detachably mounting to an imaging device, the imaging device including for electrically charging with the imaging cartridge 1. In contact with the probe, the imaging cartridge 1 includes a native chip 11 and a fixing structure 131 for fixing the native chip. The native chip 11 includes a first connection terminal 1121 connected to the first storage element 113 and a second connection connected to the detection element 114. The terminal 1122, the regenerative chip 12 includes a substrate on which is disposed a connection terminal 1221 for making electrical contact with the imaging device probe and a second storage element 123 connected to the connection terminal 1121, wherein the connection terminal 1221 is located on a side of the substrate facing away from the imaging cassette ;

When the regenerative chip 12 is mounted to the imaging cartridge 1, the regenerative chip 12 covers the first connection terminal 1121 of the native chip 11 and exposes the second connection terminal 1122 of the native chip 11.

A regenerative chip for mounting to an imaging cartridge provided by an embodiment of the present invention, and a regenerative chip is provided a connection terminal electrically contacting the imaging device probe and a second storage element connected to the connection terminal covering the first connection terminal of the native chip, and replacing the first storage of the native chip by the second storage element and the connection terminal of the regenerative chip The component and the first connection terminal electrically contact the imaging device probe and complete data communication, and at the same time, the regenerative chip is also connected to the second connection terminal of the native chip and connected to the second connection terminal and used for detecting the ink remaining amount or the imaging cartridge The installed detecting component is electrically contacted with the imaging device probe through the exposed second connecting terminal to receive the detection signal of the ink remaining amount, the imaging cartridge installation, etc., and fully utilizes the intact detecting component of the original chip and the second connection connected with the detecting component. Terminal.

Therefore, in the embodiment of the present invention, the second storage element of the regenerative chip and the connection terminal, and the second connection terminal of the original chip and the detection element jointly realize the normal operation of the imaging cartridge, thereby completing the regeneration and utilization of the imaging cartridge, and at the same time, the implementation The example also saves the production cost of the regenerative chip and realizes the maximum regeneration of the regenerative chip and the original chip.

In summary, in the embodiment of the present invention, the regenerative chip can quickly complete the reproduction and utilization of the imaging box in combination with the native chip, and fully utilize the second connection terminal and the detecting component of the original chip, thereby saving the production cost of the regenerative chip. It realizes the maximum recycling; on the other hand, it protects the fixed structure on the imaging box, realizes the recycling of the imaging box, prolongs the service life of the imaging box, reduces the waste of resources, and avoids the removal of the original chip during recycling. In the process, the fixing structure on the imaging box body is easily damaged, so that the chip is not fixed firmly or can not be fixed to the imaging box, which greatly improves the recovery rate of the imaging box.

Alternatively, the arrangement of the connection terminals 1221 of the regenerative chip 12 is the same as the arrangement of the first connection terminals 1121 of the native chip 11.

Optionally, the substrate of the regenerative chip 12 is disposed in a rectangular structure in a region of the connection terminal 1221 and its surroundings, the rectangular structure including the connection terminal 1221 disposed at a corresponding position of the first connection terminal 1121 and the second connection terminal 1122 a through hole corresponding to the position, wherein the rectangular structure covers the substrate edge of the native chip 11 and the first connection terminal 1121 in electrical contact with the imaging device probe, and is exposed by the through hole to be in electrical contact with the imaging device probe Two connection terminals 1122.

Preferably, the substrate edge of the regenerative chip 12 is disposed along the edge of the connection terminal 12 in the region of the connection terminal 1221 and its surroundings to form a "T"-shaped structure, and is covered by the "T"-shaped structure to be in electrical contact with the imaging device probe. The first connection terminal 1121.

Further, when the regenerative chip 12 is mounted to the imaging cartridge 1, the substrate edge of the regenerative chip 12 is located between the first connection terminal 1121 and the second connection terminal 1221 covered by the connection terminal 1221.

In this embodiment, the substrate edge of the regenerative chip is disposed along an edge of the connection terminal and is located between the first connection terminal and the second connection terminal covered by the connection terminal, so that the substrate of the regenerative chip forms a first connection terminal covering only the native chip. The structure that barely exposes the second connection terminal in electrical contact with the imaging device probe and isolates the connection terminal of the regenerative chip from the second connection terminal not only improves the stability of the connection between the probe and the connection terminal, but also facilitates the installation of the imaging cartridge. The second connection terminal is in contact with the imaging device side probe when the imaging device is in contact, and the connection terminal of the regenerative chip and the second connection terminal are separated to facilitate protection of the connection terminal of the regenerative chip to prevent a potential short circuit risk.

Further, the native chip is further provided with at least one third connection terminal 1123 for detecting the imaging cartridge mounting or detecting a short circuit between the second connection terminal 1122 and the third connection terminal 1123, when the regenerative chip 12 is mounted to the imaging cartridge 1, The regenerative chip 12 exposes the third connection terminal 1123 of the native chip 11. Alternatively, the substrate edge of the regenerative chip 12 is located between the first connection terminal 1121 and the third connection terminal 1223 covered by the connection terminal 1221.

Specifically, as shown in FIG. 6, the native chip 11 includes a substantially rectangular substrate, and two positioning slots 111 are disposed on the substrate. The plurality of connection terminals 112 of the native chip 11 and the storage element 113 are disposed on the substrate surface. When the original chip 11 is mounted on the ink cartridge 1, the substrate facing away from the ink cartridge 1 is referred to as the front surface of the substrate of the native chip 11, and the substrate adjacent to the ink cartridge 1 is referred to as the substrate back surface of the native chip 11. The two positioning slots 111 are respectively disposed at two ends of the long side of the substrate of the native chip 11, which are respectively a positioning slot and a positioning hole. The plurality of connection terminals 112 are arranged on the front surface of the substrate between the two positioning slots 111, and are symmetrically arranged in two rows along the vertical direction of the connection of the two positioning slots 111. The storage element 113 is a first device, and the native chip 11 further includes a second device 114. The second device 114 may be a sensor for detecting the remaining amount of ink, or may be a mounting detecting member for detecting the mounting of the ink cartridge, the storage element 113 and the second device 114 are both disposed on the back surface of the substrate. The plurality of connection terminals 112 include a first connection terminal 1121 connected to the memory element 113 and a second connection terminal 1122 connected to the second device 114. The first connection terminal 1121 is for contacting the probe of the imaging device. Receiving a low voltage data communication signal of the imaging device and the storage element, and the second connection terminal 1122 is configured to be in contact with the probe of the imaging device The imaging device drives the sensor or the high voltage detection signal of the mounting detecting component, wherein the plurality of connecting terminals 112 may further include at least one third connecting terminal 1123 for detecting contact with the probe of the image forming apparatus to detect whether the ink cartridge is mounted or the second connecting terminal 1122 is Short circuit with the third connection terminal 1123. As shown in FIG. 6, the native chip 11 includes nine native connection terminals 112, wherein three first connection terminals 1121 and two second connection terminals 1122 form a first row of connection terminals, and two second connections. The terminals are respectively located at two ends of the first row of connection terminals, the two first connection terminals 1121 and the two third connection terminals 1123 constitute a second row of connection terminals, and the two third connection terminals are respectively located at two ends of the second row of connection terminals . When the imaging cartridge 1 mounted with the native chip 11 is mounted to the image forming apparatus, the connection terminal 112 of the native chip 11 is in contact with the imaging device side probe, and the contact portion 1120 is an approximately rectangular shadow at the center of the connection terminal 112.

The partial structure of the ink cartridge on which the native chip 11 is mounted on the imaging cartridge 1 is as shown in FIG. 7. The two positioning posts 131 (fixed structures) on the imaging cartridge 1 respectively pass through the positioning slots and positioning holes of the native chip 11, and are positioned on the positioning post. The end of the 131 is formed with a locking cap having an inner diameter larger than the positioning groove of the native chip 11 and the inner diameter of the positioning hole, and the native chip 11 is prevented from coming off the original chip 11 from the ink cartridge 1. The positioning groove and the positioning hole which are covered by the locking cap of the positioning post 131 are indicated by dotted lines in FIG. 7, and similarly, the storage element 113 and the second device 114 located on the back surface of the substrate of the native chip 11 are accommodated in the groove of the ink cartridge 1. Inside, and marked with dashed lines in Figure 7.

As shown in FIG. 8, the structure in which the substrate of the regenerative chip 12 covers the first connection terminal 1121 of the native chip 11 and the second connection terminal 1122 and the third connection terminal 1123 of the native chip 11 are exposed may be set as: In the surrounding area, the substrate of the regenerative chip 12 is approximately rectangular, and the substrate is provided with a connection terminal 122 and a through hole. The connection terminal 122 is distributed at the first connection terminal position of the two rows of connection terminals, and the through hole is distributed in the two rows of connection terminals. The second connection terminal and the third connection terminal position, when the regenerative chip 12 is mounted to the imaging cartridge 1 including the native chip 11, the substrate of the reconstitution chip 12 covers the edge of the substrate of the native chip 11 in the direction of the two rows of connection terminals, In the connection terminal region, the connection terminal 122 of the regenerative chip 12 covers the first connection terminal 1121 of the native chip 11, and the through hole of the regenerative chip 12 is located at the position of the second connection terminal 1122 and the third connection terminal 1123 of the native chip 11. The second connection terminal 1122 and the third connection terminal 1123 of the native chip 11 are exposed and can be brought into contact with the probe on the imaging device side passing through the through hole.

Alternatively, the substrate of the regenerative chip 12 is approximately "T" in the area of the connection terminal and its surroundings. The substrate edge of the regenerative chip 12 is disposed along the edge of the connection terminal 122, and the connection terminal 122 is distributed at the first connection terminal position of the two rows of connection terminals. When the regenerative chip 12 is mounted to the imaging cartridge 1 including the native chip 11, in two In the direction in which the connection terminals are arranged, the substrate of the regenerative chip 12 covers only the first connection terminal 1121 of the native chip 11 and exposes the second connection terminal 1122 of the native chip 11 and the substrate edge of the third connection terminal 1123 and the native chip 11. The substrate edge of the regenerative chip 12 is distributed between the connection terminal 122 and the second connection terminal 1122 / the third connection terminal 1123, such that the substrate of the regenerative chip 12 covers only the structure of the first connection terminal 1121 and does not probe the imaging device with the native device. The contact of the second connection terminal 1122 / the third connection terminal 1123 of the chip 11 constitutes an influence, and it is more advantageous to mount and detach the imaging cartridge on which the native chip and the reproduction chip are mounted from the image forming apparatus.

Therefore, the substrate of the above-described regenerated chip 12 covers the first connection terminal 1121 of the native chip 11 and exposes the structure of the second connection terminal 1122 and the third connection terminal 1123 of the native chip 11, when the regenerative chip 12 is mounted to the main chip 11 including When the cartridge 1 is imaged, the substrate edge or the through-hole edge of the regenerated chip 12 is distributed between the connection terminal 122 and the second connection terminal 1122 such that the connection terminal 122 and the second connection terminal 1122 to which the high-voltage signal is applied by the image forming apparatus are not in one plane. And the difference in the height of the substrate edge of the regenerative chip 12 between the two connection terminals can effectively reduce the risk of the second connection terminal 1122 and the connection terminal 122 being short-circuited, causing the second storage element 123 to be damaged by the high voltage, and regenerating The substrate edge or the through-hole edge of the chip 12 is distributed between the connection terminal 122 and the third connection terminal 1123 such that the connection terminal 122 of the regenerative chip 12 is higher than the plane in which the third connection terminal 1123 is located, and the connection terminal 122 is connected to the third connection. The terminal 1123 is more easily contacted with the probe of the imaging device, and can be ensured that the imaging device passes the third connection terminal 1123. When the imaging cartridge mounted state, the connection terminal 122 has remained stable in contact with the imaging device probe.

Optionally, one side of the regenerative chip 12 adjacent to the native chip 11 is provided as a planar substrate.

Optionally, the regenerative chip 12 is attached with a viscous material on a side of the native chip 11;

Or a side of the regenerative chip 12 adjacent to the native chip 11 is provided with solder contacts for soldering to the first connection terminals of the covered native chip.

Specifically, when the regenerative chip 12 is fixed to the imaging cartridge 1 including the native chip 11, the back surface of the reconstituted chip 12 for contacting the substrate plane of the native chip 11 is not provided with other protrusions and is a planar substrate, thereby ensuring regeneration. The back surface of the substrate of the chip 12 is bonded to the base of the native chip 11 The front side of the board is kept in planar contact. In the first type of fixing, the regenerative chip 12 can be soldered to the original chip 11, and the solder contact is disposed on the back surface of the substrate of the regenerative chip 12 opposite to the front surface of the substrate. When the chip 12 is mounted to the imaging cartridge 1 including the native chip 11, the soldering contact on the back surface of the substrate of the reproducing chip 12 is paired with the first connecting terminal 1121 of the native chip 11, and is pre-solidified on the soldering contact of the reproducing chip 12. Solder bumps are pre-coated with solder paste on the first connection terminal 1121 of the native chip 11, and the connection terminals on the front surface of the substrate of the regenerative chip 12 are pressed by the solder pins to make the solder contacts contact the first connection terminals of the native chip 11 in alignment. The soldering contact is soldered to the first connection terminal via high-voltage pulse welding or ultrasonic welding of the soldering pin, so that the regenerative chip 12 is soldered and fixed to the substrate of the native chip 11 without being detached from the imaging cartridge 1; The regenerative chip 12 can be bonded to the original chip 11, and a viscous material such as glue or double-sided tape is attached to the back surface of the substrate of the regenerative chip 12, and the regenerative core is removed. The substrate of 12 is adhered and fixed to the substrate of the original chip 11 without being detached from the image forming cartridge 1. Preferably, the adhesive material is uniformly applied to the back surface area of the substrate of the reproducing chip 12 that is in contact with the original chip 11, so that the reproducing chip 12 is pasted. The back edge of the substrate of the regenerative chip 12 can also be firmly adhered to the front surface of the substrate of the original chip 11 to the front surface of the substrate of the original chip 11. The edge of the substrate of the regenerative chip 12 is prevented from affecting the alignment of the connecting terminal with the imaging device probe.

Specifically, when the regenerative chip 12 is mounted to the imaging cartridge 1 including the native chip 11, the connection terminal 122 of the regenerative chip 12 is accurately covered with the first connection terminal 1121 of the native chip 11 for accurate positioning, and the substrate of the reconstitution chip 12 is set to When the substrate of the regenerated chip 12 is covered by the transparent chip or the translucent material, the connection terminal 122 on the front surface of the regenerative chip 12 and the original chip 11 substrate covered by the regenerative chip 12 substrate can be transmitted through the substrate of the reconstitution chip 12 The first connection terminals 1121 on the front side are aligned one by one, thereby improving the efficiency of positioning and mounting of the regenerative chip.

Optionally, the fixing structure comprises at least two positioning posts 131 and a locking cap disposed at the end of the positioning post and used for fixing the native chip. The substrate of the regenerative chip 12 is provided with at least one positioning slot 121. The positioning slot 121 may include a positioning slot disposed at the edge of the regenerative chip, or a positioning hole disposed in the middle of the regenerative chip, or a combination of the positioning slot and the positioning hole.

Optionally, at least one positioning slot 121 of the regenerative chip 12 is opposite to the locking cap of the fixing structure, and the opening size of the at least one positioning slot 121 is slightly larger than the edge size of the locking cap.

Specifically, when the regenerative chip 12 is mounted to the imaging cartridge 1 including the native chip 11, the positioning of the regenerative chip 12 and the positioning post 131 of the fixed native chip 11 are reproducible when the regenerative chip 12 covers the native chip 11 for accurate positioning. A positioning slot 121 is disposed on the substrate of the chip 12, that is, the substrate of the regenerative chip 12 includes a positioning slot 121. The positioning slot 121 can be specifically a positioning hole or a positioning slot. When the regenerative chip 12 covers the native chip 11 and is mounted to the imaging box. At 1 o'clock, the positioning hole or the positioning groove of the regenerative chip 12 is opposed to the locking cap of the positioning post 131 of the fixed original chip 11 of the imaging cartridge 1, and at least a portion of the locking cap is exposed to the positioning hole or the positioning groove. Preferably, the positioning hole or the positioning slot opening size of the regenerative chip 12 is slightly larger than the edge size of the locking cap. When the regenerative chip 12 covers the native chip 11, the locking cap of the positioning post 131 is just exposed to the positioning hole of the regenerative chip 12. Or the positioning groove and the edge of the locking cap are connected with the inner edge of the positioning hole or the positioning groove, and the structure which is arranged to be edge-connected can more easily determine the accurate positioning when the regenerative chip is mounted to the imaging cartridge, and can effectively reduce the possible occurrence. Small size positioning deviation. The positioning holes or the positioning grooves of the regenerative chip 12 may be provided only one, or one positioning hole or a positioning groove may be provided for each positioning post. Since the positioning post or the positioning slot and the connecting terminal 122 on the regenerative chip 12 are arranged in the same manner as the native chip 11, when the regenerative chip 12 covers the native chip 11, the positioning hole or the positioning slot and the positioning post of the imaging cartridge 1 are used. The alignment of the positioning slots 111 of the 131/native chip 11 enables a good alignment between the connection terminals when the regenerative chip 12 covers the native chip 11.

As shown in FIG. 8, two positioning slots 111 are provided at both ends of the long side of the substrate of the native chip 11, and two rows are symmetrically arranged in the vertical direction along the line connecting the two positioning slots 111 in the two positioning slots 111. For the structure of the connection terminal, the regenerative chip 12 provided in this embodiment may be provided with two positioning slots 121, which are respectively paired with the two positioning slots 111 of the native chip 11, or the regenerative chip 12 may be provided with only one positioning slot. The hole 121 is aligned with one of the positioning slots 111 of the native chip 11, and the substrate edge of the regenerative chip 12 is disposed to align with the substrate edge of the native chip 11 at the end where the positioning slot is not provided, when the regenerative chip 12 is mounted to include When the imaging cartridge 1 of the native chip 11 is used, the positioning slot 121 of the regenerative chip 12 is aligned with the positioning slot 111 of the native chip 11, and the edge of the substrate of the connection terminal 122 facing away from the positioning slot 121 and the native chip 11 The short sides of the substrate are aligned to achieve good alignment between the connection terminals when the regenerative chip 12 covers the native chip 11.

Optionally, the positioning of the corresponding regenerative chip 12 is matched by the locking cap protruding from the native chip 11. The slot is fixed to the regenerative chip 12;

Or the fixing structure is configured as a positioning buckle, and the positioning reel is matched with the corresponding positioning slot to fix the regenerative chip 12.

Optionally, the minimum distance between the at least two positioning slots 121 in the regenerative chip 12 is greater than the minimum distance between the corresponding two locking caps;

Or the maximum distance between the edges of the at least two positioning slots 121 in the regenerative chip 12 is smaller than the maximum distance between the corresponding two locking caps, so that the locking cap generates a clamping force in the radial direction of the positioning slot. Used to fix the regenerative chip 12.

Specifically, the regenerative chip 12 in this embodiment is provided with a positioning slot 121 matching the fixing structure of the imaging cartridge 1. The positioning post 131 for fixing the native chip on the imaging cassette 1 is also a fixed structure on the imaging cassette 1. The number of the positioning posts 131 in the fixed structure is usually two, and the number of corresponding positioning slots 121 is also two. Each of the positioning slots 121 is matched with a positioning post 131. The top end of the positioning post 131 is provided with a mushroom-shaped locking cap for locking the native chip 11 to prevent the native chip 11 from falling off. The locating chip 11 is provided with two positioning slots 111, and the two positioning slots 111 are respectively disposed at two ends of the long side of the substrate of the native chip 11, which are respectively a positioning slot and a positioning hole. The plurality of connection terminals 112 are arranged on the front surface of the substrate between the two positioning slots 111, and are symmetrically arranged in two rows along the vertical direction of the connection of the two positioning slots 111.

Therefore, in order to realize the fixing of the regenerative chip 12 by the rendition chip 12 and the fixing structure, the minimum distance between the at least two positioning slots 121 is slightly larger than the corresponding locking caps of the two positioning posts 131. The minimum distance between the edges or the maximum distance between the edges of the two positioning holes is slightly smaller than the maximum distance between the corresponding edges of the locking caps of the two positioning posts, so that the regenerative chip 12 is mounted to include the native chip 11 When the imaging cartridge 1 is imaged, the positioning post 131 of the imaging cartridge 1 can catch the inner edge of the positioning slot 121 of the regenerative chip 12 to fix the regenerative chip 12.

Alternatively, the length of the regenerative chip 12 does not exceed the length of the locking cap at the top end of the fixed structure to protrude the native chip 11.

Specifically, since the length of each of the positioning posts 131 protruding from the locking cap of the native chip 11 is short, in order for the positioning post 131 to fix the regenerative chip 12 firmly, the thickness of the regenerative chip 12 does not exceed the top of the fixed structure 13 as much as possible. The locking cap protrudes the length of the native chip 11 to make it solid The locking cap at the end of the fixed structure 13 can sufficiently catch the reproducing chip 12 to prevent the reproducing chip 12 from coming off the fixing structure 13. Preferably, the thickness of the regenerative chip 12 is between 0.2 mm and 0.3 mm, so that the locking cap of the fixing structure 13 coincides with the thickness of the positioning slot 121 of the regenerative chip 12 when the regenerative chip 12 is mounted to the imaging cartridge, thereby The inner edge of the positioning slot of the regenerative chip 12 can be caught.

Further, the substrate of the regenerative chip 12 in this embodiment may also be a rigid PCB sheet having a thickness of between 0.2 mm and 0.3 mm, or a flexible circuit board having a thinner thickness and better flexibility. The regenerative chip 12 can be fixed by the hard PCB thin plate by the positioning post 131 of the imaging cartridge 1 locking the cap to the inner edge of the positioning slot 121 of the regenerative chip 12. The flexible circuit board with better deformation can better adapt to the difference in height between the sidewall surface of the imaging box and the locking cap of the original chip 11 and the positioning post 131, and ensure that the regenerative chip is well attached to the original chip 11 and the imaging box. The surface of the side wall makes the sticking and fixing more secure, and the flexible circuit board can enhance the flexibility of the substrate, and it is easier for the probe to abut the lower edge of the substrate to the connection terminal area.

Optionally, the substrate of the regenerative chip 12 is a flexible circuit board.

Optionally, the second storage element 123 is disposed on the back surface of the substrate of the regenerative chip 12 . Further, the imaging cartridge 1 is provided with a recess in which the second storage element 123 is located when the regenerative chip 12 is mounted to the imaging cartridge 1.

Specifically, the imaging device probe 2 is disposed in a sheet-like thin metal sheet structure and is opposite to the connection terminal 122 of the regenerative chip 12, the second connection terminal 1122 of the native chip, and the third connection terminal 1123 of the native chip. And can be pressed inward to elastically expand and contract. As shown in FIG. 9, when the imaging cartridge 1 including the reproduction chip 12 and the native chip 11 is mounted to the image forming apparatus and the imaging cartridge 1 is mounted upright, the two rows of connection terminals of the reproduction chip 12 and the native chip 11 are aligned perpendicular to the vertical direction of the imaging cartridge 1. Cloth, for example, according to the arrangement shown in Figure 6-3, the first row of five connection terminals are arranged in the lower row and the second row of four connection terminals are arranged in the upper row, correspondingly, the first row The edge of the substrate near and parallel to the five connection terminals is referred to as the lower edge of the substrate, and the edge of the substrate adjacent to and parallel to the second row of four connection terminals is referred to as the upper edge of the substrate. In the process of mounting the imaging cartridge 1 to the image forming apparatus, the imaging device probe 2 for abutting contact with the connection terminal 122 on the regenerative chip 12 abuts against the lower edge of the substrate of the reconstitution chip 12, and continues to be inserted downward into the imaging cartridge. 1. The lower edge of the substrate of the regenerative chip 12 of the imaging cartridge 1 presses the probe 2 inwardly elastically, and the probe 2 is slid across the surface of the substrate of the reconstituted chip 12 and the probe 2 is drawn to the regenerative chip 12 when the imaging cartridge 1 is mounted. The terminal 122 is in abutting contact with the contact portion 1120 region at the center of the connection terminal 122. Similarly, the imaging device probe 2 for abutting contact with the second connection terminal 1122 or the third connection terminal 1123 on the native chip 11 is crossed. The surface of the substrate of the native chip 11 is in contact with the area of the contact portion 1120 of the second connection terminal 1122 or the third connection terminal 1123.

As shown in FIG. 8 and FIG. 9, the substrate of the regenerative chip 12 in this embodiment includes four portions: a second portion for covering the first connection terminal 1121 of the native chip 11, and a second portion is connected and extended to cover the native chip. A first portion of the lower edge of the substrate of the substrate 11 connects the second portion and extends a third portion that covers the upper edge of the substrate of the native chip 11, connects the third portion and faces the fourth portion that extends away from the second portion.

The second portion of the substrate is provided with a connection terminal 122 and is disposed in an inverted "T" shape along the edge of the connection terminal 122. When the regenerative chip 12 covers the native chip 11, the side edges of the second portion of the substrate are distributed. Between the terminal 122 and the second connection terminal 1122 / the third connection terminal 1123; the first portion of the substrate is connected to the inverted "T" shaped wider end of the second portion of the substrate, and maintains the same width extending to the lower edge of the substrate of the regenerative chip 12, when regenerated When the chip 12 covers the native chip 11, the first portion of the substrate covers the positioning hole of the native chip 11 and the lower edge of the substrate of the regenerative chip 12 is aligned with the lower edge of the substrate of the native chip 11. The third portion of the substrate is connected to the inverted "T" of the second portion of the substrate. Forming a narrower end and extending to a wider width to the fourth portion, the fourth portion of the substrate is provided with a second storage element 123 of the regenerative chip 12, and when the regenerative chip 12 covers the native chip 11, the third portion of the substrate is covered The positioning groove of the native chip 11 and the upper edge of the substrate and the sidewall of the imaging box surrounding the native chip 11; when the fourth portion of the substrate covers the sidewall surface of the imaging cartridge, A groove is disposed on the surface of the side wall of the box, and the second storage element 123 on the fourth portion is received in the recess. Alternatively, the second storage element 123 may be disposed on the back surface of the substrate of the regenerative chip 12, that is, the regenerative chip 12 Mounted on the side of the imaging cartridge 1 facing the side wall surface of the imaging cartridge, the fourth portion of the substrate covers the recess and the second storage element is hidden in the recess, or the second storage element 123 is disposed on the regenerative chip 12 The front side of the substrate, that is, the side of the imaging chip 1 that is mounted away from the side wall surface of the imaging cartridge, is mounted on the side of the imaging cartridge 1 with the storage element, and the fourth portion of the substrate is hidden in the recess together with the storage element.

Thereby, the four portions of the regenerative chip 12 are connected in a positive "T" shape which is wide and narrow, and when the regenerative chip 12 covers the original chip 11 and is attached to the imaging cartridge 1, the second portion of the substrate is pasted to the first of the native chip 11. The connection terminal 1121 area covers the connection terminal 122 and replaces the native chip 11 The first connection terminal 1121, the first partial substrate is pasted to the native chip 11 to guide the probe 2 to the connection terminal 122 via the first partial substrate surface, and the side edges of the first partial substrate and the second partial substrate are distributed on the connection terminal 122 and The structure between the second connection terminal 1122 / the third connection terminal 1123 enables the probes respectively contacting the regenerative chip or the native chip to be swiped from the lower edge of the respective substrate to the connection terminal region, and the substrate of the regenerative chip is not hindered for use with The probe of the contact point of the original chip is swiped by the probe, and the probe for contacting the third connection terminal can be swiped along the boundary line between the substrate edge of the regenerative chip and the front surface of the substrate of the original chip, which is advantageous for facilitating The chip and probe are aligned correctly when the imaging cartridge is mounted to the imaging device, and the risk of mis-contact of the probe with other adjacent connection terminals when the imaging cartridge is installed is reduced. The third and fourth portions of the substrate having a larger size and a larger area are pasted to the surface of the original chip 11 and the side wall of the imaging cartridge to ensure that the regenerative chip is firmly fixed to the imaging cartridge 1, preferably positioned on the third portion of the substrate (positioning) The slot 121) ensures accurate positioning when the regenerative chip covers the native chip. Preferably, the second storage element 123 disposed on the back surface of the fourth portion of the substrate may be hidden in a recess previously provided on the imaging cassette 1 or in a later recessed manner. The space of the sidewall surface of the imaging cartridge is saved, and the edge of the fourth portion of the substrate surrounding the second storage element is adhered and fixed to the sidewall surface of the imaging cartridge to ensure that the second storage element is sealed in the groove, avoiding the The second storage element portion of the substrate shedding affects the normal use of the imaging cartridge.

Optionally, the lower edge of the substrate of the regenerative chip 12 is longer than the lower edge of the substrate of the native chip 11. When the regenerative chip 12 is mounted to the imaging cartridge 1, the lower edge of the substrate of the reconstituted chip 12 covers the lower edge of the substrate of the native chip 11 and is pasted. To the surface of the imaging cartridge 1.

Specifically, in order to prevent the probe from abutting to the lower edge of the substrate, the force of the regenerative chip substrate and the probe in the vertical direction is too large to cause the relocation of the regenerative chip to be misaligned or the lower edge of the regenerated chip substrate is unfavorable. The sub-mounting, the substrate of the regenerative chip of the embodiment adopts a flexible circuit board, and the substrate further comprises a fifth portion of the substrate connected to the first partial substrate and extending in a direction away from the second portion, when the regenerative chip 12 covers the native chip 11 When the imaging cartridge 1 is reached, the first partial substrate is aligned with the substrate of the native chip 11 along the lower edge of the substrate of the native chip 11, and the fifth portion of the substrate is covered along the lower edge of the substrate of the native chip 11 to the sidewall of the imaging cartridge below the lower edge of the substrate of the native chip 11. Since the first partial substrate and the fifth partial substrate are coated on the lower edge of the substrate of the native chip 11 and pasted to the sidewall surface of the imaging cartridge, the probe preferentially contacts the front surface of the substrate at the interface between the first portion and the fifth partial substrate, and is drawn along the front surface of the substrate to Connecting the terminal area can effectively avoid the probe first Contact at the edge of the substrate causes the edge of the substrate to be lifted or the entire substrate to be displaced.

Embodiment 5

An embodiment of the present invention further provides an imaging cartridge 1 including the above-described regenerative chip 12.

Optionally, the imaging cartridge 1 is provided with a groove around the sidewall of the native chip 11; wherein

The second storage element of the regenerative chip 12 is disposed on the back surface of the substrate of the regenerative chip 12, and when the regenerative chip 12 is mounted to the imaging cartridge 1, the second storage element is housed in the recess.

Embodiment 6

Corresponding to the regenerative chip 12 of the fourth embodiment, the embodiment of the present invention further provides a method for mounting the regenerative chip 12 to the imaging cartridge 1, the method comprising:

S11, providing the used imaging cartridge 1; wherein the imaging cartridge 1 includes a native chip 11, the native chip 11 has at least one first connection terminal 1121 and at least one second connection terminal 1122;

S12, the regenerative chip 12 is fixed to the native chip 11, the substrate of the regenerative chip 12 covers the first connection terminal 1121 of the native chip 11 and exposes the second connection terminal 1122 of the native chip;

S13. The connection terminal 1221 of the regenerative chip intercepts an electrical signal transmitted to the first connection terminal from the first connection terminal 1121 of the covered native chip.

Alternatively, when the regenerative chip 12 is fixed to the native chip 11, the substrate edge of the regenerative chip 12 is located between the first connection terminal 1121 and the exposed second connection terminal 1122 covered by the connection terminal 1221.

Optionally, the fixing the regenerative chip 12 to the native chip 11 includes:

a solder contact is disposed on a side of the regenerative chip 12 adjacent to the native chip 11, and the regenerative chip 12 is soldered to the first connection terminal 1121 of the covered native chip 11;

Alternatively, a viscous material is attached to one side of the regenerative chip 12 adjacent to the native chip 11, and the reconstituted chip 12 is bonded and fixed to the native chip 11;

Alternatively, a positioning slot 111 matching the fixing structure of the fixed native chip 12 on the imaging cartridge 1 is disposed on the substrate of the reproducing chip 12, and the reproducing chip 12 is fixed to the native chip 11 by the fixing structure.

Optionally, the method further includes:

S14, a recess is formed around the side wall of the imaging cartridge 1 on which the native chip 11 is mounted. When the regenerative chip 12 is fixed to the native chip 11, the second storage element of the reconstituted chip 12 is accommodated in the recess.

The above is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope of the present invention. All should be covered by the scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

An electronic chip for use with a circuit board attached to an imaging cartridge for detachably mounting to an imaging device, the imaging device including a probe for making electrical contact with the imaging cartridge, The imaging cartridge includes a circuit board affixed thereto, the circuit board including a connection terminal and a first storage element for electrically contacting a probe of the imaging device, the connection terminal including at least one a first connection terminal, the first storage element is electrically connected to the at least one first connection terminal, wherein the electronic chip comprises:

Substrate,

a second storage element affixed to the substrate,

And at least one backing terminal disposed on the back surface of the substrate, wherein the back surface of the substrate is the side of the substrate of the electronic chip facing the circuit board when the electronic chip is matched to the circuit board on the imaging box,

The second storage element is electrically connected to at least one of the back terminals;

When the electronic chip is matched to a circuit board on the imaging cartridge, the substrate of the electronic chip covers only a portion of at least one of the first connection terminals of the circuit board, and the first connection terminal is exposed a contact for electrically contacting a probe of the imaging device,

The first connection terminal is covered by the back contact terminal portion disposed on the back surface of the electronic chip substrate, and is electrically connected to the first connection terminal.
The electronic chip according to claim 1, wherein the substrate of the electronic chip is provided with a terminal through hole at a corresponding position of the contact portion of at least one of the first connection terminals, and the electronic chip is matched to In the case of the circuit board, the electronic chip exposes the contact portion of the first connection terminal for electrical contact with a probe of the imaging device via the terminal through hole.
The electronic chip according to claim 2, wherein when an imaging cartridge including the circuit board and the electronic chip is mounted to the imaging device, a probe of the imaging device passes through the electronic chip The terminal through hole electrically contacts the contact portion of the first connection terminal of the circuit board.
The electronic chip according to claim 2, wherein the backing terminal on the electronic chip substrate is matched with the terminal through hole, and a part of the first connecting terminal is covered by the backing terminal And exposing the first connection terminal by the terminal through hole Contact part.
The electronic chip according to claim 4, wherein the backing terminal is at least partially disposed on a back surface of the substrate of the electronic chip on an upper edge or a side edge side of the terminal through hole.
The electronic chip according to claim 1, wherein the substrate of the electronic chip is provided with a terminal groove at a position corresponding to the contact portion of at least one of the first connection terminals and a surrounding area thereof, and When the electronic chip is mated to the circuit board, the electronic chip exposes the contact portion of the first connection terminal for electrical contact with a probe of the imaging device via the terminal recess.
The electronic chip according to claim 6, wherein the terminal recess is such that a substrate of the electronic chip extends to a lower edge of the substrate along a corresponding position of the contact portion of the first connection terminal. A groove opening formed in the substrate from the lower edge to a corresponding position of the contact portion of the first connection terminal.
The electronic chip according to claim 7, wherein when an imaging cartridge including the circuit board and the electronic chip is mounted to the imaging device, a probe of the imaging device passes through the electronic chip The terminal groove is swiped along the terminal recess to the contact portion of the first connection terminal of the circuit board.
The electronic chip according to claim 6, wherein the backing terminal on the electronic chip substrate is matched with the terminal groove, and a part of the first connecting terminal is covered by the backing terminal And exposing the contact portion of the first connection terminal by the terminal groove.
The electronic chip according to claim 9, wherein the backing terminal is at least partially disposed on a back surface of the substrate of the electronic chip on an upper edge or a side edge side of the terminal groove.
The electronic chip according to claim 1, wherein a substrate edge of the electronic chip is located on one side or one side of a corresponding position of the contact portion of at least one of the first connection terminals and an adjacent side thereof. When the electronic chip is matched to the circuit board, the substrate of the electronic chip covers one side or one side of the first connection terminal and its adjacent side, and the first connection terminal is exposed for The contact of the probe of the imaging device is in electrical contact.
The electronic chip according to claim 11, wherein said electronic chip The backing terminal on the substrate is disposed on a back surface of the substrate at an edge of the substrate where the electronic chip covers the first connection terminal, and the back contact terminal covers one side or one side of the first connection terminal and Its adjacent side.
The electronic chip according to claim 12, wherein the backing terminal is at least partially disposed on a back surface of the lower edge or side edge of the substrate on which the electronic chip covers the first connection terminal.
The electronic chip according to any one of claims 1 to 13, wherein the backing terminal is provided in a square shape, a rectangular shape, a circular shape, an elliptical shape, an arc shape or a ring shape.
The electronic chip according to any one of claims 1 to 13, wherein the back terminal of the back surface of the electronic chip substrate is soldered to the partially covered first connection terminal.
The electronic chip according to any one of claims 1 to 13, characterized in that the back surface of the substrate of the electronic chip is adhered with a viscous material for bonding and fixing the electronic chip to the circuit board.
The electronic chip according to claim 15, wherein the substrate of the electronic chip employs a flexible circuit board.
The electronic chip according to claim 17, wherein the substrate of the electronic chip is a transparent material or a translucent material.
An electronic chip for use with a circuit board attached to an imaging cartridge for detachably mounting to an imaging device, the imaging device including a probe for making electrical contact with the imaging cartridge, The imaging cartridge includes a circuit board affixed thereto, the circuit board including a connection terminal and a first storage element for electrically contacting a probe of the imaging device, the connection terminal including a plurality of a first connection terminal electrically connected to the first storage element, the plurality of first connection terminals being arranged in at least two rows, wherein the electronic chip comprises:

Substrate,

a second storage element affixed to the substrate,

And at least one backing terminal disposed on the back surface of the substrate, wherein the back surface of the substrate is the side of the substrate of the electronic chip facing the circuit board when the electronic chip is matched to the circuit board on the imaging box,

The second storage element is electrically connected to at least one of the back terminals;

The base of the electronic chip when the electronic chip is matched to a circuit board on the imaging cartridge The board covers only a portion of at least one of the plurality of first connection terminals of the circuit board and exposes the partially covered at least one first connection terminal for exploration with the imaging device The contact point of the needle electrical contact,

The first connection terminal is covered by the back contact terminal portion disposed on the back surface of the electronic chip substrate, and is electrically connected to the first connection terminal.
The electronic chip according to claim 19, wherein the electronic chip further comprises:

At least one positive terminal disposed on a front surface of the substrate, wherein the front surface of the substrate is a side of the electronic chip facing away from the circuit board when the electronic chip is matched to the circuit board,

The second storage element is electrically connected to at least one of the positive terminals;

When the electronic chip is mated to the circuit board, the at least one positive terminal corresponds to at least one of the first connection terminals and at least partially covers the corresponding first connection terminal.
The electronic chip according to claim 20, wherein said at least one positive terminal at least partially covers a contact portion of said corresponding first connection terminal for making electrical contact with a probe of said imaging device,

And the positive terminal blocks electrical contact of the first connection terminal with a probe of the imaging device and is electrically contacted by the positive terminal to a probe of the imaging device,

The positive terminal is not electrically connected to the partially covered first connection terminal.
The electronic chip according to claim 20, wherein at least one of the backing terminals and the at least one positive terminal of the electronic chip are arranged in at least two rows corresponding to the plurality of first connecting terminals of the circuit board; among them,

At least one of the backing terminals is disposed on the first row adjacent to the lower edge of the electronic chip substrate, and is electrically connected to at least one of the first connecting terminals of the first row of the circuit board.
The electronic chip according to claim 22, wherein the first row of the electronic chip is all a backing terminal, and the other rows are all positive terminals.
The electronic chip according to claim 23, wherein the back row of the first row is disposed on a back surface of the substrate at a lower edge of the substrate where the electronic chip covers the first connection terminal of the circuit board, The backing terminal covers an upper portion of the first connection terminal and exposes the contact portion of the first connection terminal.
The electronic chip according to claim 20, wherein the electronic chip further comprises:

At least one soldering terminal disposed on a back surface of the substrate, the soldering terminal being opposite to the positive terminal disposed on a front surface of the substrate;

The electronic chip is soldered to the at least partially covered first connection terminal by the soldering terminal and the backing terminal disposed on the back surface of the substrate.
The electronic chip according to claim 25, wherein the solder terminal of the back surface of the electronic chip substrate corresponding to the reset terminal RST and/or the power terminal VCC of the first connection terminal of the circuit board is electrically Connected to the back contact terminal of the back surface of the electronic chip substrate corresponding to the ground terminal GND of the first connection terminal of the circuit board.
The electronic chip according to claim 19, wherein the substrate of the electronic chip is provided with a terminal through hole at a corresponding position of the contact portion of the at least one first connection terminal, or at the at least one first a terminal groove is disposed on the corresponding position of the contact portion of the connection terminal and the surrounding area thereof, and the electronic chip is exposed through the terminal through hole or the terminal groove when the electronic chip is matched to the circuit board The first connection terminal is for the contact portion in electrical contact with a probe of the imaging device, or

a substrate edge of the electronic chip is located on one side or one side of the corresponding position of the contact portion of the at least one first connection terminal and an adjacent side thereof, when the electronic chip is matched to the circuit board, a substrate of the electronic chip covering one side or one side of the first connection terminal and an adjacent side thereof, and exposing the contact portion of the first connection terminal for making electrical contact with a probe of the imaging device .
The electronic chip according to claim 27, wherein the electronic chip is provided with a plurality of the backing terminals, and the plurality of backing terminals correspond to the plurality of first connecting terminals of the circuit board Arranged in at least two rows;

In at least one row of the back terminals remote from the lower edge of the electronic chip substrate, the terminal through holes or the terminal grooves are respectively disposed on the substrate of the electronic chip corresponding to each of the back terminals, The backing terminal covers a portion of the first connection terminal of the circuit board and exposes the contact portion of the first connection terminal by the terminal through hole or the terminal groove.
The electronic chip according to claim 28, wherein each of said back terminals is disposed in said first row of back terminals adjacent to a lower edge of said electronic chip substrate An electronic chip covers a back surface of the substrate at a lower edge of the substrate of the first connection terminal of the circuit board, and the upper half of the first connection terminal is covered by the back contact terminal and the first connection terminal is exposed Said contact.
The electronic chip according to claim 28, wherein in the at least two rows of the back terminals, the terminal through holes are respectively disposed on the substrate of the electronic chip corresponding to each of the back terminals, A portion of the first connection terminal of the circuit board is covered by the back contact terminal and the contact portion of the first connection terminal is exposed by the terminal through hole.
The electronic chip according to any one of claims 19 to 30, wherein the connection terminal of the circuit board further comprises two second connection terminals electrically connected to the detecting element, the two second connection terminals Arranged at one end of one of the first connection terminals of one of the rows,

The substrate of the electronic chip is disposed such that when the electronic chip is matched to the circuit board, a substrate edge of the electronic chip is located between a first connection terminal and a second connection terminal of the circuit board, the electronic The substrate of the chip covers only the first connection terminal of the circuit board and its surrounding area, and exposes the second connection terminal of the circuit board, or

The electronic chip further includes a through hole, when the electronic chip is matched to the circuit board, the substrate of the electronic chip covers only the first connection terminal of the circuit board and its surrounding area, and through the through hole The second connection terminal of the circuit board is exposed.
The electronic chip according to claim 31, wherein the connection terminal of the circuit board further comprises at least one third connection terminal arranged at one end of the at least one row of the first connection terminals,

When the electronic chip is matched to the circuit board, a substrate edge of the electronic chip is located between a first connection terminal and a third connection terminal of the circuit board, and a substrate of the electronic chip covers only the circuit board a first connection terminal and a surrounding area thereof, and exposing the third connection terminal of the circuit board, or

When the electronic chip is matched to the circuit board, the substrate of the electronic chip covers only the first connection terminal of the circuit board and its surrounding area, and the third of the circuit board is exposed through the through hole Connection terminal.
An imaging cartridge detachably mounted to an imaging device, the imaging device including a probe for making electrical contact with the imaging cartridge, the imaging cartridge including a circuit board affixed thereto, the circuit board including a connection a terminal and a first storage element, the connection terminal being used with the imaging device The probe is in the form of an electronic chip according to any one of claims 1 to 18, or an electronic chip according to any one of claims 19 to 32.
The imaging cartridge according to claim 33, wherein a groove is provided around the side wall of the imaging cartridge on which the circuit board is mounted;

A second storage element of the electronic chip is disposed on a back surface of the substrate of the electronic chip, and the second storage element is received in the recess when the electronic chip is matched to the circuit board.
A method of repairing an imaging cartridge, the method comprising:

Providing a used imaging cartridge; wherein the imaging cartridge includes a circuit board having at least one first connection terminal;

Attaching an electronic chip to the circuit board, the substrate of the electronic chip covering only a portion of at least one of the first connection terminals of the circuit board;

Having the electronic chip receive an electrical signal transmitted to the at least one first connection terminal from the at least one first connection terminal that is only partially covered.
The method according to claim 35, wherein when the electronic chip is attached to the circuit board, the substrate of the electronic chip covers only at least one of the first connection terminals of the circuit board a portion and exposing the contact portion of the first connection terminal for electrical contact with the probe of the imaging device.
The method according to claim 36, wherein, when the electronic chip is attached to the circuit board, a substrate edge of the electronic chip covers a portion of the at least one first connection terminal and is exposed a contact portion of the first connection terminal, or a substrate through hole or a terminal groove is disposed on the substrate of the electronic chip, and the contact of the first connection terminal is exposed through the terminal through hole or the terminal groove unit.
The method according to claim 35, wherein at least one backing terminal is disposed on a back surface of the substrate of the electronic chip, and when the electronic chip is attached to the circuit board, the electronic chip is The at least one back terminal portion covers the at least one first connection terminal and is electrically connected to the first connection terminal.
The method according to claim 38, wherein said at least one back terminal of said electronic chip is soldered to said partially covered circuit when said electronic chip is attached to said circuit board The at least one first connection terminal of the board.
The method according to claim 35, wherein said circuit board has a plurality of said first connection terminals, and said substrate of said electronic chip is only covered when said electronic chip is attached to said circuit board At least one of the first connection terminals and at least partially covering the other first connection terminals.
The method of claim 40, wherein the method further comprises:

And causing the electronic chip to intercept an electrical signal transmitted to the other first connection terminal from the at least partially covered other first connection terminals.
The method according to claim 40, wherein at least one positive terminal is disposed on a front surface of the substrate of the electronic chip, and at least one positive connection of the electronic chip is attached when the electronic chip is attached to the circuit board The terminal at least partially covers the other first connection terminals.
The method according to claim 42, wherein at least one soldering terminal facing the positive terminal is disposed on a back surface of the substrate of the electronic chip, and when the electronic chip is attached to the circuit board,

At least one of the solder terminals of the electronic chip is soldered to the other first connection terminal at least partially covered by the positive terminal.
A method according to any of claims 35-43, wherein said circuit board includes a first storage element electrically coupled to said first connection terminal, said electronic chip being attached to said circuit board Time,

At least one of the first connection terminals is electrically connected to a line cut between the first storage elements in advance.
The method according to claim 44, wherein when said electronic chip is attached to said circuit board,

The wiring electrically connecting at least one of the power supply terminal VCC, the reset terminal RST, and the data terminal DAT of the first connection terminal to the first storage element is cut or cut in advance.
The method according to any one of claims 35-43, wherein the substrate of the electronic chip is made of a transparent material or a translucent material, and when the electronic chip is attached to the circuit board,

Aligning the electronic chip to the first connection terminal of the circuit board through a substrate of the electronic chip.
The method of any of claims 35-43, wherein the method further comprises:

Grooves are formed around the side wall of the imaging cartridge on which the circuit board is mounted,

The second storage element of the electronic chip is housed within the recess when the electronic chip is attached to the circuit board.