JP3962983B2 - Connector, developing cartridge, and image forming apparatus - Google Patents

Connector, developing cartridge, and image forming apparatus Download PDF

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Publication number
JP3962983B2
JP3962983B2 JP2002057179A JP2002057179A JP3962983B2 JP 3962983 B2 JP3962983 B2 JP 3962983B2 JP 2002057179 A JP2002057179 A JP 2002057179A JP 2002057179 A JP2002057179 A JP 2002057179A JP 3962983 B2 JP3962983 B2 JP 3962983B2
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Prior art keywords
memory
connector
contact
board
substrate
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JP2002057179A
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JP2003255780A (en
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克巳 岡本
順二 城越
毅 青木
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Seiko Epson Corp
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Seiko Epson Corp
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Description

【0001】
【発明の属する技術分野】
本発明はトナー消費量等のデータの読み取り/書き込みを行うためのメモリIC基板を内蔵したコネクタ、該コネクタが取り付けられた現像カートリッジ及び画像形成装置に関する。
【0002】
【従来の技術】
プリンタ等の画像形成装置においては、現像カートリッジにメモリICを取り付け、装置本体側コネクタと接続して各色トナーの残量情報、交換されたカートリッジか否かの新旧判別情報、カートリッジが装着されたか否かを本体側に知らせるための装着情報、現像バイアス等の画像形成条件、何回カートリッジが交換使用されたかのリサイクル情報等を書き込み、現像カートリッジを装着したときにその履歴情報が装置本体側において認識できるようにしている。
【0003】
この場合、インクジェットプリンタ等のカートリッジにおいては、履歴情報が書き込まれるメモリIC基板をコネクタに電線をかしめて繋いだり、メモリIC基板をコネクタ端子にハンダ付けするようにしている。
【0004】
【発明が解決しようとする課題】
従来の現像カートリッジに取り付けられるメモリICにおいては、データの読み取り/書き込み時に装置本体側コネクタと接触して直接機械的力が加えられるため、メモリICの接点寿命が短く、また、現像ローラには高い電圧が加えるられるため、その影響による電界ノイズを接点部材側が拾いやすく、静電気やトナー汚染等による誤動作が生じ、メモリICの保護や接点の安定性確保の点が必ずしも十分とは言えなかった。
【0005】
また、メモリIC基板の端子を電線をかしめてコネクタと繋ぐ方法では、かしめ不良の発生、電線が切れる等の接点不良が発生し、メモリIC基板をコネクタ端子にハンダ付けする方法では、ハンダ付け不良によって接点不良が発生する等の問題があるとともに、メモリICを再利用しようとしても、熱を加えて取り外さなければならず、その場合取り外しても熱により書き込まれている情報が破壊されてしまうという問題がある。
【0006】
また、特に、最も長い接点部材ほどアンテナとなって電界ノイズを拾いやすいことになる。そのため、本実施形態では、アース端子43Gを現像ローラから最も遠い位置に配置するようにしている。もちろん、アース端子以外でも長い端子は外側に配置することが好ましい。
【0007】
【課題を解決するための手段】
本発明は上記課題を解決しようとするもので、メモリICのトナー汚れや静電気の影響を回避するとともに、メモリIC基板の挿入取り付けを安定化させることを目的とする。
本発明は、弾性を有する樹脂からなるメモリIC基板の先端と係合する位置決め取り付け部と、メモリIC基板の後端を係止するフック部を備え、メモリIC基板の端子とバネ接触する接点が2列構成であり、メモリIC基板が接点保護部材に内包されるコネクタにおいて、前記端子は基板中央より位置決め取り付け部側に近く、前記接点のバネ支点はフック部側に近く、かつ2列構成の1列目は低バネ荷重で位置決め取り付け部側、2列目は高バネ荷重で基板中央部側にあることを特徴とする。
また、本発明は、上記コネクタを端部に固定した現像カートリッジを特徴とする。
また、本発明は、上記現像カートリッジを有する画像形成装置を特徴とする。
【0008】
【発明の実施の形態】
以下、本発明の実施の形態を図面を参照しつつ説明する。
図1は本実施形態の画像形成装置の例を説明する図である。
感光体1は図示しない帯電ユニットで帯電された後、露光ユニット2による画像露光で静電潜像が形成される。この静電潜像はロータリ現像ユニット3のロータリフレーム30に装着された現像カートリッジ31〜34の現像ローラから一色ずつ順次4色のトナーが供給されて現像される。感光体1には、転写ベルト駆動ローラ5で駆動される転写ベルト4が1次転写位置で対向し、各色のトナー像は転写ベルト4に1次転写されてベルト上で色重ねされる。
【0009】
一方、給紙カセット6から取り出された用紙は搬送路7を通り、転写ベルト駆動ローラ5と対向する転写ローラ8の2次転写位置で転写ベルト上の4色トナー像が一括転写される。このとき、転写ベルト4上の画像先端はベルト位置検出センサ9によって検出され、画像先端と用紙先端とが合うように制御される。2次転写された用紙は定着ユニット10で定着され、両面印字の場合には再度搬送路7に戻り、裏面側に画像が転写される。転写、定着後の用紙は装置外に排出される。
【0010】
ロータリ式現像ユニット3の4色の現像カートリッジ31〜34にはメモリIC内蔵コネクタ40(詳細は後述)がそれぞれ取り付けられ、装置本体側のコネクタ50からデータの読み取り/書き込みができるようになっている。装置本体側コネクタ50はモータ内蔵の駆動部51により駆動されて前進/後退し、カートリッジ交換時には前進してコネクタ40と電気的に接続してメモリICのデータの読み取り/書き込みを行い、通常時は後退している。各現像カートリッジは、装置本体に設けられた現像カートリッジ交換用開口11の位置で取り外して交換可能である。また、画像形成装置には排気ダクト12が設けられ、現像ローラと感光体が当接する現像ニップ部付近の吸引口14から飛散トナー等を吸引し、フィルタ13を通して排気している。この場合、コネクタ接続部が飛散トナーから影響を受けないように、メモリIC内蔵コネクタ40と本体装置側コネクタ50とが接続する位置は、現像ユニットの回転方向でみて現像ニップ部より上流側に配置する。
【0011】
図2はロータリ式現像ユニットにおける現像カートリッジの交換、メモリICのデータの読み取り/書き込み、現像待機の各ポジションを説明する図である。ロータリ式現像ユニットのホームポジションは、ポジション検出板37の切り欠き位置をポジション検出センサ36で検出することにより検知される。
【0012】
図2(a)は現像器交換位置(ポジション▲1▼)を説明する図である。前述したように、装置本体側には現像器交換口11が設けられており、ロータリ式現像ユニット3の各現像ローラ▲1▼〜▲4▼は、現像器交換口11の位置において交換可能である。このポジション▲1▼においては、各現像カートリッジのコネクタ40は本体側コネクタ50とは対向せず、また感光体1も現像ローラと対向しない。
【0013】
図2(b)はメモリICへの読み取り/書き込みと共に、現像ローラが感光体と対向して現像する位置を示している(ポジション▲2▼)。装置本体側から読み取り/書き込み指令が出ると、ポジション▲2▼の位置関係になって装置本体側コネクタ50が動作し、コネクタ40と接続してデータの読み取り/書き込みが行われる。
【0014】
図2(c)はロータリ現像器ユニットによる現像がある色から別の色に切り替わるときの途中の位置(ポジション▲3▼)で、感光体と現像ローラとは対向していない。
【0015】
図3はコネクタ接続時と離間時とを説明する図である。
図3(a)に示すように、接続時には装置本体側コネクタ50がモータ駆動で前進し、後述するようにメモリIC内蔵コネクタ40側のガイド部材でガイドされて嵌合し、端子同士が摺動して電気的に接続し、離間時にはコネクタ50が装置本体側に後退して両者が離間する。なお、コネクタ40はコネクタ固定ネジ48で現像器ユニットに、コネクタ50はコネクタ固定ピン53で装置本体に固定されている。
【0016】
図4はロータリ式現像ユニットを説明する図である。
ロータリ式現像ユニット3は板金からなる側板20、21に取り付けられ、ロータリフレーム30に取り付けられた現像カートリッジ31〜34の端部にはメモリIC内蔵コネクタ40が固定されている。本実施形態では側板21がギヤ駆動される側、側板20が反駆動側で、駆動部の熱の影響を受けないように反駆動側の側板20を絞って形成した収納部22に設けたコネクタカバー39にメモリIC内蔵コネクタ40が固定される。収納部22は装置本体側コネクタ50が離当接する面以外はコネクタ40を包囲して現像ローラにかかる電圧の影響を受けないようにシールドする役割を果たしている。メモリIC内蔵コネクタ40自身はコネクタカバー39で覆われ、収納部を形成する板金からメモリICへ静電気の影響がないように、収納部内面には樹脂製リングからなるIC保護部材38が設けられている。
【0017】
図5は本実施形態のメモリIC内蔵コネクタを説明する図で、図5(a)は平面図、図5(b)は正面図、図5(c)は図5(a)のA−A断面図である。
メモリIC内蔵コネクタ40は接続時の衝撃を受け止める部材である基板41の一方の面(本体装置側コネクタと接続する表面)の外縁に近い両側部分に2つのガイド部材42が直立して設けられ、基板41の他方の面(裏面)にメモリIC基板46を内包する接点保護部材45が備えられ、これらは筐体47として一体に形成されている。また、ガイド部材42と一体にガイド部材より内側に、接点部材43、44がそれぞれガイド部材42と平行に直立して設けられている。ガイド部材42を接点部材の外側に配置したのは、ガイド部材を包囲して本体側コネクタが嵌合する際の挿入安定性を図り、接点の接触状態を安定化させるためである。
【0018】
本実施形態では筐体47の表側(現像ローラ端部から遠い側)に4本の接点部材43、裏側(現像ローラ端部に近い側)に3本の接点部材44が2列構成にして設けられ、全体としてコンパクト化を図っている。もちろん、接点部材は2列に限定されず、1列や3列にしてもよい。これら接点部材の各端子は、図6に示すように、表側の4つの端子はデータ端子、装着検知端子、アース(GND)端子、データの読み込み/書き込み端子であり、裏側の3つの端子はクロック端子、電源端子、チップセレクト(CS)端子である。
【0019】
これら接点部材43、44は、図5(c)に示すように、接続時に本体側コネクタ端子が摺動して接触する接点端子43a、44aを構成している。接点部材43,44は基板41のスルーホールを通してその裏側に延び、メモリIC基板46の端子と弾性的に接触するバネ性の接点端子43b,44bを備えている。そして、接点保護部材45にメモリIC基板46を取り付けたとき、バネ性の接点端子43b,44bがメモリIC基板46の端子に弾性的に接触し、メモリIC基板46は接点端子43b,44bからのバネ力で接点保護部材45の取り付け面に押しつけられ、基板41から離間した浮いた状態で保持される。そのため、モータ駆動で本体側コネクタ50が前進してコネクタ40に当接しても、接点部材43,44の端子43a、44aが本体側コネクタ端子と摺動して接触するだけで、当接の衝撃は基板41で受け止められ、メモリIC基板46は基板41から離間して支持されているので、メモリIC基板46の端子と接点43b,44bとの接触部に衝撃は直接伝わらない。
【0020】
このように、コネクタ40は衝撃受け部材である基板41の一方の面に本体側コネクタとの摺動接点をもち、基板41の裏側に基板から浮いて支持されたメモリIC基板との固定接点をもつようにしたので、本体側コネクタとの接続時の衝撃が基板41で受け止められてメモリIC基板側に伝えられず、メモリIC基板との接点が安定して形成される。
また、コネクタに取付けられるメモリIC基板はトナー汚れによる接点不良、静電気の影響によるデータ破壊等から守るため、直接表側に出さない所で接点を持たせることが望ましい。本実施形態においては、ICメモリ基板を接点保護部材45で覆い、その部分においてバネ性接点により支持するようにしている。
【0021】
図5に示す7本の接点部材のうち、両側のガイド部材42と1列に設けられた4本の接点部材は、図4から分かるように、現像ローラから離れた外側に位置し、残りの3本の接点部材は現像ローラ側に配置される。そして、前側の4本の接点部材のうち、アース端子である43Gが最も長く形成され、本体側コネクタと接続するときに、1番最初に接触するようにしている。
【0022】
ところで、現像するタイミングでは現像ローラには2KVp−pの電圧がかかり、その影響による電界ノイズを接点部材側が拾いやすい。特に、最も長い接点部材ほどアンテナとなって電界ノイズを拾いやすいことになる。そのため、本実施形態では、アース端子43Gを現像ローラから最も遠い位置に配置するようにしている。もちろん、アース端子以外でも長い端子は外側に配置することが好ましい。
【0023】
図7はメモリIC基板のコネクタ本体への装着を説明する図である。
図7(a)はコネクタの裏面側からみたメモリIC基板装着状態を示す図であり、メモリIC基板46には切り欠き46aがその中心よりずれた位置に設けられ、切り欠きの両側において基板先端長さが異ならせてある。この基板先端に合わせる形でコネクタ本体側には窪みを有する位置決め取り付け部60が形成され、この窪みの深さが切り欠きの両側において異なっている。そのため、左右を逆にして基板先端を位置決め取り付け部60に挿入しようとしてもうまくいかず、誤挿入が防止できるようになっている。一方、基板の後端はコネクタ本体のフック61に係止するように構成されている。
【0024】
図7(b)はメモリIC基板の装着を説明する断面図である。本実施形態のメモリIC基板46は弾性(バネ性)を有する樹脂からなっており、基板先端を位置決め取り付け部60に挿入し、基板の後端をコネクタ本体側に回転させながら押しつけ、基板の弾性を利用して反らせて挿入し、フック61に係止する。このときメモリIC基板の端子はバネ性の接点端子43b,44bと弾性的に接触し、接点のバネ力によりメモリIC基板は位置決め取り付け部60、フック61側に押しつけられており、装着が安定するとともに、接点状態が安定化する。
【0025】
メモリIC基板を再利用する場合、メモリIC基板をインクジェットプリンタの場合のように、ハンダ付け等で固着してしまうと、これを取り外すためにはIC自体に熱をかけてしまうことになり、メモリ内の情報が破壊されてしまう可能性がある。一方、メモリICを取り付けたままでメモリ内の情報を読み取ろうとすると、インクジョットプリンタ等に比して装置が大きい電子写真装置では大きな装置の一部に取り付けたメモリICに端子を当ててその内容を読み取ることになるためその操作だけでも極めて煩雑である。
【0026】
そこで、本実施形態のようにバネ性の接点部材でメモリIC基板との端子の接点をとることにより、メモリICが着脱可能となり、コネクタ本体自体を固定したとしても、それを取り外すことによりメモリIC自体は容易に取り外して回収でき、その内容を読み取って再利用に役立たせることが可能である。
【0027】
図8はメモリIC基板を装着するコネクタの要部断面図である。
コネクタ40の筐体47の両側に設けられた接点部材43,44はコネクタ本体の裏面側に延び、折り曲げてバネ性を付与し、それぞれ接点43b,44bを形成している。コネクタ本体には、前述したように、位置決め取り付け部60、フック61が形成され、位置決め取り付け部60に切り欠きを有するメモリIC基板46が位置決め取り付け部の窪みに入り込み、基板を押し倒してフック61に係止して基板のバネ性を利用して装着する構造になっており、この時メモリIC基板の端子63,64がコネクタ側の接点43b,44bと接触して固定接点を構成する。
【0028】
本実施形態においてはメモリIC基板の端子は2列構成63,64で中央より位置決め取り付け部60側に近くなるようにし、バネ支点P1,P2はできるだけ端子63,64から離すためにフック61側に近くなるようにする。このような構成とすることにより、メモリIC基板を装着したときに端子63,64と接点43b,44bとがバネ力によりやわらかく当接し、安定した接点力が得られる。
【0029】
また、バネ支点P1、P2の位置はほぼ同じ位置であるため、バネ支点から接点43bまでの長さは、バネ支点から接点44bより長く、同じバネ材料を使用しているため接点43bの接点力は、接点44bの接点力より小さい。メモリIC基板の装着は、図示のように端子63,64に近い側の先端を位置決め取り付け部60の窪みに挿入して基板を押し倒し、他端をフック部材に押し込んで係止するので、最初に当接する方の端子を接点力の小さい低バネ荷重接点43bとして装着し易くしするとともに装着を安定化させ、また、弱い力で装着できるためメモリIC基板が損傷しにくく再利用に資することができる。
【0030】
また、図5で説明したように、接点部材43は4接点側、接点部材44は3接点側である。このように、複数列構成(本実施形態では2列)の接点の場合で各列の接点数が同数でない場合には、多数側の接点(低バネ荷重接点43b)を位置決め取り付け部側とすることにより、装着に要する力が大きくなるのを防ぎ、装着し易くするとともに、装着を安定化させ、また、弱い力で装着できるため、同様にメモリIC基板が損傷しにくく再利用に資することができる。
【0031】
また、低バネ荷重接点と高バネ荷重接点が同数でない場合には、上記のように低バネ荷重接点の数を多くする。低バネ荷重なので接点が多くても問題は生ぜず、接点部の力はバネ圧力で決まるので、数が増えても端子に対する支障は生じない。
【0032】
また、多数側の接点(低バネ荷重接点43b)を位置決め取り付け部側としたときに、相対的に接点力の大きい高バネ荷重接点44bをメモリIC基板の中央部側にくるようにすると、メモリIC基板を装着したときに中央部のバネ接点圧を高くすることができる。中央部のバネ接点圧を上げることにより、メモリIC基板を装着した後、基板を中央から押し上げる状態となり、位置決め取り付け部側、フック部側共に均等に圧力がかかって、安定した取付けが可能である。
基板の取り付け状態が安定化する。
【0033】
【発明の効果】
以上のように本発明によれば、接点が筐体が覆われているため、トナー汚れや静電気の影響を回避することが可能であり、さらにバネ荷重の異なる複数列の端子が存在する場合に、基板中央部のバネ荷重を他の接点より高くすることにより、基板を挿入取り付け後、位置決め取り付け部側、フック側共に均等に圧力がかかって基板の取付け状態が安定化するという効果が得られる。
【図面の簡単な説明】
【図1】 本発明の画像形成装置を説明する図である。
【図2】 現像カートリッジの交換、メモリICのデータの読み書き、現像待機の各ポジションを説明する図である。
【図3】 メモリICへのコネクタ接続と離間を説明する図である。
【図4】 ロータリ式現像器ユニットを説明する図である。
【図5】 メモリIC内蔵のコネクタを説明する図である。
【図6】 コネクタ端子を説明する図である。
【図7】 メモリIC基板のコネクタ本体への装着を説明する図である。
【図8】 メモリIC基板を装着するコネクタの要部断面図である。
【符号の説明】
1…感光体、2…露光ユニット、3…ロータリ式現像ユニット、4…転写ベルト、5…転写ベルト駆動ローラ、6…給紙カセット、7…用紙搬送路、8…転写ローラ、9…位置検出センサ、10…定着ユニット、11…現像カートリッジ交換用開口、12…排気ダクト、13…フィルタ、14…吸引口、20,21…側板、30…ロータリフレーム、31〜34…現像カートリッジ、36…ポジション検出センサ、37…ポジション検出板、38…IC保護部材、39…コネクタカバー、40,50…コネクタ、41…基板、42…ガイド部材、43,44…接点部材、45…接点保護部材、46…メモリIC基板、46a…切り欠き、60…位置決め取り付け部、61…フック、63,64…端子。
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a connector incorporating a memory IC substrate for reading / writing data such as toner consumption, a developing cartridge to which the connector is attached, and an image forming apparatus.
[0002]
[Prior art]
In an image forming apparatus such as a printer, a memory IC is attached to the developing cartridge and connected to the connector on the apparatus main body side, information on the remaining amount of toner of each color, information on whether or not the cartridge has been replaced, information on whether or not the cartridge has been mounted Installation information for informing the main body side, image forming conditions such as developing bias, recycling information on how many times the cartridge has been used for replacement, etc. are written, and history information can be recognized on the main body side when the developing cartridge is attached. I am doing so.
[0003]
In this case, in a cartridge such as an ink jet printer, a memory IC board on which history information is written is connected by caulking an electric wire to a connector, or the memory IC board is soldered to a connector terminal.
[0004]
[Problems to be solved by the invention]
In a memory IC attached to a conventional developing cartridge, since the mechanical force is directly applied by contacting the connector on the apparatus body side when reading / writing data, the contact life of the memory IC is short, and the developing roller is high. Since a voltage is applied, electric field noise due to the influence is easily picked up by the contact member side, malfunctions due to static electricity, toner contamination, etc. occur, and it is not always sufficient to protect the memory IC and ensure the stability of the contact.
[0005]
In addition, the method of connecting the terminals of the memory IC board to the connector by caulking the electric wires may cause contact defects such as caulking defects or wire breakage, and the method of soldering the memory IC board to the connector terminals may cause poor soldering. In addition, there is a problem such as a contact failure caused by the memory, and even if the memory IC is to be reused, it must be removed by applying heat, in which case the information written by the heat will be destroyed even if it is removed. There's a problem.
[0006]
In particular, the longer contact member becomes an antenna and tends to pick up electric field noise. Therefore, in the present embodiment, the ground terminal 43G is arranged at a position farthest from the developing roller. Of course, long terminals other than the ground terminal are preferably arranged outside.
[0007]
[Means for Solving the Problems]
An object of the present invention is to solve the above-described problems, and an object of the present invention is to avoid the influence of toner contamination and static electricity on a memory IC and to stabilize the insertion and mounting of a memory IC board.
The present invention includes a positioning attachment portion that engages with a front end of a memory IC substrate made of an elastic resin, and a hook portion that engages a rear end of the memory IC substrate, and a contact that makes spring contact with a terminal of the memory IC substrate. In the connector in which the memory IC substrate is included in the contact protection member in the two-row configuration, the terminal is closer to the positioning attachment portion side than the center of the substrate, the spring fulcrum of the contact is closer to the hook portion side, and the two-row configuration The first row is on the positioning attachment portion side with a low spring load, and the second row is on the substrate center side with a high spring load.
In addition, the present invention is characterized by a developing cartridge in which the connector is fixed to an end.
The present invention is also characterized by an image forming apparatus having the developing cartridge.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram illustrating an example of an image forming apparatus according to the present embodiment.
After the photoreceptor 1 is charged by a charging unit (not shown), an electrostatic latent image is formed by image exposure by the exposure unit 2. The electrostatic latent image is developed by sequentially supplying four colors of toner from the developing rollers of the developing cartridges 31 to 34 mounted on the rotary frame 30 of the rotary developing unit 3 one by one. A transfer belt 4 driven by a transfer belt driving roller 5 is opposed to the photoreceptor 1 at a primary transfer position, and toner images of respective colors are primarily transferred to the transfer belt 4 and superimposed on the belt.
[0009]
On the other hand, the four-color toner images on the transfer belt are collectively transferred at the secondary transfer position of the transfer roller 8 facing the transfer belt driving roller 5 through the paper path taken out of the paper feed cassette 6. At this time, the leading edge of the image on the transfer belt 4 is detected by the belt position detection sensor 9 and controlled so that the leading edge of the image and the leading edge of the paper are aligned. The second-transferred paper is fixed by the fixing unit 10, and in the case of double-sided printing, it returns to the conveyance path 7 again, and the image is transferred to the back side. The paper after transfer and fixing is discharged out of the apparatus.
[0010]
Each of the four color developing cartridges 31 to 34 of the rotary developing unit 3 is provided with a memory IC built-in connector 40 (details will be described later) so that data can be read / written from the connector 50 on the apparatus body side. . The device main body side connector 50 is driven by a drive unit 51 with a built-in motor to move forward / backward, and when the cartridge is replaced, it moves forward and is electrically connected to the connector 40 to read / write data in the memory IC. Retreating. Each developing cartridge can be removed and replaced at the position of the developing cartridge replacement opening 11 provided in the apparatus main body. Further, the image forming apparatus is provided with an exhaust duct 12 that sucks scattered toner and the like from the suction port 14 near the developing nip where the developing roller and the photosensitive member abut, and exhausts them through the filter 13. In this case, the position where the memory IC built-in connector 40 and the main unit side connector 50 are connected is arranged upstream of the developing nip portion in the rotation direction of the developing unit so that the connector connecting portion is not affected by the scattered toner. To do.
[0011]
FIG. 2 is a diagram for explaining the positions of the developing cartridge exchange, the reading / writing of data in the memory IC, and the development standby in the rotary developing unit. The home position of the rotary developing unit is detected by detecting the notch position of the position detection plate 37 with the position detection sensor 36.
[0012]
FIG. 2A is a diagram for explaining the developing device replacement position (position {circle around (1)}). As described above, the developing device exchange port 11 is provided on the apparatus main body side, and the developing rollers (1) to (4) of the rotary developing unit 3 can be exchanged at the position of the developing device exchange port 11. is there. In this position (1), the connector 40 of each developing cartridge does not face the main body side connector 50, and the photosensitive member 1 does not face the developing roller.
[0013]
FIG. 2B shows the position where the developing roller develops to face the photosensitive member, along with reading / writing to the memory IC (position (2)). When a read / write command is issued from the apparatus main body side, the apparatus main body side connector 50 operates in a positional relationship of position (2) and is connected to the connector 40 to read / write data.
[0014]
FIG. 2C shows a position (position {circle around (3)}) when the development by the rotary developer unit is switched from one color to another, and the photoconductor and the developing roller are not opposed to each other.
[0015]
FIG. 3 is a diagram for explaining when the connector is connected and when the connector is separated.
As shown in FIG. 3A, at the time of connection, the apparatus main body side connector 50 is advanced by motor drive, and is guided and fitted by a guide member on the memory IC built-in connector 40 side as will be described later, and the terminals slide. Thus, when the connectors are separated from each other, the connector 50 is retracted toward the apparatus main body and the two are separated. The connector 40 is fixed to the developing unit by a connector fixing screw 48, and the connector 50 is fixed to the apparatus main body by a connector fixing pin 53.
[0016]
FIG. 4 is a diagram for explaining the rotary developing unit.
The rotary developing unit 3 is attached to side plates 20 and 21 made of sheet metal, and a memory IC built-in connector 40 is fixed to the end of the developing cartridges 31 to 34 attached to the rotary frame 30. In this embodiment, the side plate 21 is a gear-driven side, the side plate 20 is a non-driving side, and a connector provided in a storage portion 22 formed by narrowing the side plate 20 on the non-driving side so as not to be affected by the heat of the driving portion. The memory IC built-in connector 40 is fixed to the cover 39. The housing portion 22 surrounds the connector 40 except for the surface where the apparatus main body side connector 50 is separated and abutted, and serves to shield it from being affected by the voltage applied to the developing roller. The memory IC built-in connector 40 itself is covered with a connector cover 39, and an IC protection member 38 made of a resin ring is provided on the inner surface of the storage portion so that static electricity does not affect the memory IC from the sheet metal forming the storage portion. Yes.
[0017]
5A and 5B are diagrams for explaining the memory IC built-in connector according to the present embodiment. FIG. 5A is a plan view, FIG. 5B is a front view, and FIG. 5C is an AA line in FIG. It is sectional drawing.
The memory IC built-in connector 40 is provided with two guide members 42 upright on both side portions near the outer edge of one surface (surface connected to the main unit side connector) of the substrate 41 which is a member that receives an impact at the time of connection, A contact protection member 45 containing the memory IC substrate 46 is provided on the other surface (back surface) of the substrate 41, and these are integrally formed as a housing 47. Further, contact members 43 and 44 are provided so as to be integral with the guide member 42 and on the inner side of the guide member 42 in parallel with the guide member 42. The reason why the guide member 42 is disposed outside the contact member is to stabilize the contact state of the contact point by enclosing the guide member so as to improve the insertion stability when the main body side connector is fitted.
[0018]
In this embodiment, four contact members 43 are provided in a two-row configuration on the front side (side far from the end of the developing roller) of the casing 47 and three contact members 44 are provided on the back side (side near the end of the developing roller). As a whole, the size is reduced. Of course, the contact members are not limited to two rows, and may be one row or three rows. As shown in FIG. 6, the four terminals on the front side are a data terminal, a mounting detection terminal, a ground (GND) terminal, and a data read / write terminal, and the three terminals on the back side are clock terminals. A terminal, a power supply terminal, and a chip select (CS) terminal.
[0019]
As shown in FIG. 5 (c), these contact members 43 and 44 constitute contact terminals 43a and 44a with which the main body side connector terminal slides and contacts when connected. The contact members 43 and 44 are provided with spring-like contact terminals 43 b and 44 b that extend through the through holes of the substrate 41 to the back side thereof and elastically contact the terminals of the memory IC substrate 46. When the memory IC board 46 is attached to the contact protection member 45, the spring contact terminals 43b and 44b elastically contact the terminals of the memory IC board 46, and the memory IC board 46 is connected to the contact terminals 43b and 44b. It is pressed against the attachment surface of the contact protection member 45 by a spring force and is held in a floating state separated from the substrate 41. Therefore, even if the main body side connector 50 moves forward and comes into contact with the connector 40 by driving the motor, the contact 43, 44 of the contact members 43 and 44 only slides and comes into contact with the main body side connector terminal. Is received by the substrate 41, and the memory IC substrate 46 is supported away from the substrate 41. Therefore, the impact is not directly transmitted to the contact portion between the terminal of the memory IC substrate 46 and the contacts 43b and 44b.
[0020]
Thus, the connector 40 has a sliding contact with the main body side connector on one surface of the substrate 41 which is an impact receiving member, and a fixed contact with the memory IC substrate supported by being floated from the substrate on the back side of the substrate 41. Therefore, the impact at the time of connection with the main body side connector is received by the substrate 41 and is not transmitted to the memory IC substrate side, and the contact with the memory IC substrate is stably formed.
Further, in order to protect the memory IC board attached to the connector from contact failure due to toner contamination, data destruction due to the influence of static electricity, etc., it is desirable to have a contact where it does not come out directly. In the present embodiment, the IC memory substrate is covered with the contact protection member 45, and the portion is supported by the spring contact.
[0021]
Of the seven contact members shown in FIG. 5, the four contact members provided in one row with the guide members 42 on both sides are located outside the developing roller as shown in FIG. The three contact members are arranged on the developing roller side. Of the four contact members on the front side, the ground terminal 43G is formed to be the longest and is the first to contact when connected to the main body side connector.
[0022]
By the way, at the timing of development, a voltage of 2 KVp-p is applied to the developing roller, and the electric field noise due to the influence is easily picked up by the contact member side. In particular, the longest contact member becomes an antenna and easily picks up electric field noise. Therefore, in the present embodiment, the ground terminal 43G is arranged at a position farthest from the developing roller. Of course, long terminals other than the ground terminal are preferably arranged outside.
[0023]
FIG. 7 is a diagram for explaining the mounting of the memory IC board to the connector main body.
FIG. 7A is a view showing a memory IC board mounted state as seen from the back side of the connector. The memory IC board 46 is provided with a notch 46a at a position shifted from the center thereof, and the front end of the board on both sides of the notch. The lengths are different. A positioning attachment portion 60 having a recess is formed on the connector body side so as to match the tip of the substrate, and the depth of the recess is different on both sides of the notch. For this reason, even if it is attempted to insert the front end of the substrate into the positioning attachment portion 60 with the left and right sides reversed, it is possible to prevent erroneous insertion. On the other hand, the rear end of the board is configured to be engaged with the hook 61 of the connector body.
[0024]
FIG. 7B is a cross-sectional view for explaining the mounting of the memory IC substrate. The memory IC substrate 46 of the present embodiment is made of a resin having elasticity (spring property), and the front end of the substrate is inserted into the positioning attachment portion 60 and pressed while rotating the rear end of the substrate toward the connector main body side. Is inserted by being warped, and locked to the hook 61. At this time, the terminals of the memory IC board are elastically contacted with the spring contact terminals 43b and 44b, and the memory IC board is pressed against the positioning attachment portion 60 and the hook 61 by the spring force of the contacts, so that the mounting is stable. At the same time, the contact state is stabilized.
[0025]
When reusing a memory IC board, if the memory IC board is fixed by soldering or the like as in the case of an ink jet printer, the IC itself is heated to remove it, and the memory The information inside may be destroyed. On the other hand, if an attempt is made to read the information in the memory with the memory IC attached, an electrophotographic apparatus having a larger apparatus than an ink jet printer or the like applies a terminal to the memory IC attached to a part of the larger apparatus, and the contents are read. Since it is read, the operation alone is extremely complicated.
[0026]
Therefore, the memory IC can be attached / detached by taking the contact of the terminal with the memory IC substrate with a spring-like contact member as in this embodiment, and even if the connector body itself is fixed, the memory IC can be removed by removing it. It can be easily removed and collected, and its contents can be read and used for reuse.
[0027]
FIG. 8 is a cross-sectional view of the main part of the connector to which the memory IC board is mounted.
The contact members 43 and 44 provided on both sides of the housing 47 of the connector 40 extend to the back side of the connector main body and bend to give spring properties to form the contacts 43b and 44b, respectively. As described above, the connector body is formed with the positioning attachment portion 60 and the hook 61, and the memory IC substrate 46 having a notch in the positioning attachment portion 60 enters the recess of the positioning attachment portion, and pushes the substrate down to the hook 61. It is structured to be locked and mounted by utilizing the spring property of the board. At this time, the terminals 63 and 64 of the memory IC board come into contact with the contacts 43b and 44b on the connector side to constitute fixed contacts.
[0028]
In the present embodiment, the terminals of the memory IC board are arranged in two rows 63 and 64 so that they are closer to the positioning mounting portion 60 side than the center, and the spring fulcrums P1 and P2 are on the hook 61 side so as to be as far away from the terminals 63 and 64 as possible. Try to be close. With such a configuration, when the memory IC board is mounted, the terminals 63 and 64 and the contacts 43b and 44b are softly brought into contact with each other by a spring force, and a stable contact force can be obtained.
[0029]
Further, since the positions of the spring fulcrums P1 and P2 are substantially the same, the length from the spring fulcrum to the contact 43b is longer than that from the spring fulcrum to the contact 44b, and since the same spring material is used, the contact force of the contact 43b Is smaller than the contact force of the contact 44b. As shown in the figure, the memory IC board is mounted by inserting the tip on the side close to the terminals 63 and 64 into the recess of the positioning attachment portion 60 to push down the board and pushing the other end into the hook member to be locked. The terminal to be contacted is easily mounted as a low spring load contact 43b with a small contact force, and the mounting is stabilized, and since the mounting can be performed with a weak force, the memory IC substrate is hardly damaged and can be reused. .
[0030]
Further, as described in FIG. 5, the contact member 43 is on the 4-contact side, and the contact member 44 is on the 3-contact side. As described above, in the case of the contacts in a plurality of rows (in this embodiment, two rows), when the number of contacts in each row is not the same, the multiple contacts (low spring load contacts 43b) are set as the positioning attachment portion side. As a result, it is possible to prevent an increase in force required for mounting, to facilitate mounting, to stabilize the mounting, and to mount with a weak force, so that the memory IC substrate is similarly unlikely to be damaged and contributes to reuse. it can.
[0031]
When the number of low spring load contacts and the number of high spring load contacts are not the same, the number of low spring load contacts is increased as described above. Since the spring load is low, there is no problem even if there are many contacts, and the force at the contact portion is determined by the spring pressure.
[0032]
Further, if the high-spring load contact 44b having a relatively large contact force is located on the center side of the memory IC board when the contact on the multiple side (low spring load contact 43b) is on the positioning attachment portion side, When the IC substrate is mounted, the spring contact pressure at the center can be increased. By mounting the spring contact pressure at the center, after mounting the memory IC board, the board is pushed up from the center, and pressure is evenly applied to both the positioning attachment part side and the hook part side, enabling stable attachment. .
The board mounting state is stabilized.
[0033]
【The invention's effect】
As described above, according to the present invention, since the casing is covered with the contacts, it is possible to avoid the influence of toner contamination and static electricity, and when there are multiple rows of terminals with different spring loads. By making the spring load at the center of the board higher than that of other contacts, after the board has been inserted and mounted, the positioning mounting part side and the hook side are equally pressured to stabilize the board mounting state. .
[Brief description of the drawings]
FIG. 1 is a diagram illustrating an image forming apparatus of the present invention.
FIGS. 2A and 2B are diagrams illustrating positions for replacement of a developing cartridge, reading / writing of data in a memory IC, and development standby. FIGS.
FIG. 3 is a diagram illustrating connector connection and separation from a memory IC.
FIG. 4 is a diagram illustrating a rotary developing unit.
FIG. 5 is a diagram illustrating a connector with a built-in memory IC.
FIG. 6 is a diagram illustrating a connector terminal.
FIG. 7 is a diagram illustrating mounting of a memory IC board to a connector body.
FIG. 8 is a cross-sectional view of a main part of a connector to which a memory IC board is attached.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Photosensitive body, 2 ... Exposure unit, 3 ... Rotary type developing unit, 4 ... Transfer belt, 5 ... Transfer belt drive roller, 6 ... Paper feed cassette, 7 ... Paper conveyance path, 8 ... Transfer roller, 9 ... Position detection Sensors, 10: Fixing unit, 11: Opening for developing cartridge replacement, 12 ... Exhaust duct, 13 ... Filter, 14 ... Suction port, 20, 21 ... Side plate, 30 ... Rotary frame, 31-34 ... Developing cartridge, 36 ... Position Detection sensor, 37 ... Position detection plate, 38 ... IC protection member, 39 ... Connector cover, 40, 50 ... Connector, 41 ... Substrate, 42 ... Guide member, 43, 44 ... Contact member, 45 ... Contact protection member, 46 ... Memory IC board, 46a ... notch, 60 ... positioning attachment, 61 ... hook, 63, 64 ... terminal.

Claims (3)

弾性を有する樹脂からなるメモリIC基板の先端と係合する位置決め取り付け部と、メモリIC基板の後端を係止するフック部を備え、メモリIC基板の端子とバネ接触する接点が2列構成であり、メモリIC基板が接点保護部材に内包されるコネクタにおいて、前記端子は基板中央より位置決め取り付け部側に近く、前記接点のバネ支点はフック部側に近く、かつ2列構成の1列目は低バネ荷重で位置決め取り付け部側、2列目は高バネ荷重で基板中央部側にあることを特徴とするコネクタ。。It has a positioning attachment part that engages with the tip of the memory IC board made of elastic resin, and a hook part that locks the rear end of the memory IC board, and contacts in spring contact with the terminals of the memory IC board are in two rows Ah is, in the connector memory IC substrate is encapsulated in contact protection member, the terminal the first column near the positioning attachment part side than the substrate center, the spring fulcrum of the contact near the hook portion side, and two rows configuration Is a positioning attachment portion side with a low spring load, and the second row is on the substrate center side with a high spring load. . 請求項1記載のコネクタを端部に固定したことを特徴とする現像カートリッジ。  2. A developing cartridge, wherein the connector according to claim 1 is fixed to an end. 請求項2記載の現像カートリッジを有する画像形成装置。  An image forming apparatus having the developing cartridge according to claim 2.
JP2002057179A 2002-03-04 2002-03-04 Connector, developing cartridge, and image forming apparatus Expired - Fee Related JP3962983B2 (en)

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