JP2003243070A - Connector, cartridge for development, and image forming device - Google Patents

Connector, cartridge for development, and image forming device

Info

Publication number
JP2003243070A
JP2003243070A JP2002042878A JP2002042878A JP2003243070A JP 2003243070 A JP2003243070 A JP 2003243070A JP 2002042878 A JP2002042878 A JP 2002042878A JP 2002042878 A JP2002042878 A JP 2002042878A JP 2003243070 A JP2003243070 A JP 2003243070A
Authority
JP
Japan
Prior art keywords
memory
connector
substrate
contact
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002042878A
Other languages
Japanese (ja)
Inventor
Katsumi Okamoto
克己 岡本
Junji Shirokoshi
順二 城越
Takeshi Aoki
毅 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2002042878A priority Critical patent/JP2003243070A/en
Publication of JP2003243070A publication Critical patent/JP2003243070A/en
Withdrawn legal-status Critical Current

Links

Abstract

<P>PROBLEM TO BE SOLVED: To arrange so that a memory IC is installed in a hidden position, preclude a poor contacting performance owing to contamination of toner and also a destruction of the data due to influence of the static electricity, and enable recycling by mounting the base board of memory IC removably. <P>SOLUTION: The connector according to the invention is equipped with the base board of memory IC covered with a casing 45 and conductive members 43 and 44 having a connecting terminal for connection with the body device side connector and connecting terminals 43b and 44b for connections with the base board of memory IC, wherein a resilience is given to the connecting terminals for connection with the base board of memory IC of the conductive members. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明はトナー消費量等のデ
ータの読み取り/書き込みを行うためのメモリICを内
蔵したコネクタ、該コネクタが取り付けられた現像カー
トリッジ及び画像形成装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector incorporating a memory IC for reading / writing data such as toner consumption, a developing cartridge to which the connector is attached, and an image forming apparatus.

【0002】[0002]

【従来の技術】プリンタ等の画像形成装置においては、
現像カートリッジにメモリICを取り付け、装置本体側
コネクタと接続して各色トナーの残量情報、交換された
カートリッジか否かの新旧判別情報、カートリッジが装
着されたか否かを本体側に知らせるための装着情報、現
像バイアス等の画像形成条件、何回カートリッジが交換
使用されたかのリサイクル情報等を書き込み、現像カー
トリッジを装着したときにその履歴情報が装置本体側に
おいて認識できるようにしている。
2. Description of the Related Art In an image forming apparatus such as a printer,
A memory IC is attached to the developing cartridge and connected to the connector of the main body of the apparatus, the remaining amount information of each color toner, the old and new discrimination information as to whether or not the cartridge has been exchanged, and the mounting for notifying the main body whether or not the cartridge has been mounted. Information, image forming conditions such as developing bias, recycling information about how many times the cartridge has been exchanged and used, etc. are written so that when the developing cartridge is mounted, the history information can be recognized on the apparatus main body side.

【0003】この場合、インクジェットプリンタ等のカ
ートリッジにおいては、履歴情報が書き込まれるメモリ
IC基板をコネクタに電線をかしめて繋いだり、メモリ
IC基板をコネクタ端子にハンダ付けするようにしてい
る。
In this case, in a cartridge of an ink jet printer or the like, a memory IC substrate on which history information is written is connected to a connector by caulking an electric wire, or the memory IC substrate is soldered to a connector terminal.

【0004】[0004]

【発明が解決しようとする課題】従来の現像カートリッ
ジに取り付けられるメモリICにおいては、データの読
み取り/書き込み時に装置本体側コネクタと接触して直
接機械的力が加えられるため、メモリICの接点寿命が
短く、また、直接見える位置に配置されたり、静電気や
トナー汚染等による誤動作が生じ、メモリICの保護や
接点の安定性確保の点が必ずしも十分とは言えなかっ
た。
In the conventional memory IC mounted on the developing cartridge, the contact life of the memory IC is shortened because mechanical force is directly applied to the memory IC by contact with the connector of the apparatus main body when reading / writing data. It is short, and it is placed in a position where it can be seen directly, and malfunctions due to static electricity, toner contamination, etc. occur, so that it cannot be said that the protection of the memory IC and the stability of the contacts are always sufficient.

【0005】また、メモリIC基板の端子を電線をかし
めてコネクタと繋ぐ方法では、かしめ不良の発生、電線
が切れる等の接点不良が発生し、メモリIC基板をコネ
クタ端子にハンダ付けする方法では、ハンダ付け不良に
よって接点不良が発生する等の問題があるとともに、メ
モリICを再利用しようとしても、熱を加えて取り外さ
なければならず、その場合取り外しても熱により書き込
まれている情報が破壊されてしまうという問題がある。
Further, in the method of crimping the wire of the terminal of the memory IC board and connecting it to the connector, contact failure such as occurrence of caulking failure and disconnection of the wire occurs, and in the method of soldering the memory IC board to the connector terminal, There is a problem such as contact failure due to defective soldering, and even if the memory IC is to be reused, it must be removed by applying heat. In that case, even if removed, the written information is destroyed by the heat. There is a problem that it will end up.

【0006】[0006]

【課題を解決するための手段】本発明はメモリICを隠
した位置に配置できるとともに、トナー汚れによる接点
不良や、静電気の影響によるデータの破壊等を防ぎ、メ
モリIC基板を着脱して再利用可能にすることを目的と
する。そのために請求項1の発明は、筐体で覆われたメ
モリIC基板を有するとともに、本体装置側コネクタと
の接続端子及びメモリIC基板との接続端子を有する導
電性部材を備えたコネクタにおいて、前記導電性部材の
メモリIC基板との接続端子にバネ性を付与したことを
特徴とする。また、請求項2の発明は、前記メモリIC
基板先端をコネクタ本体の取り付け部に挿入し、メモリ
IC基板の後端を弾性を利用してコネクタ本体のフック
部に引っかけることによりメモリIC基板がコネクタ本
体に装着されることを特徴とする。また、請求項3の発
明は、前記メモリIC基板は、コネクタ本体の取り付け
部に挿入される先端の中心からずらして位置決め用の切
り欠きが形成されていること特徴とする。また、請求項
4の発明は、前記導電性部材のメモリIC基板との接続
端子列と、メモリIC基板の端子列とを揃えたことを特
徴とする。また、請求項5の発明は、上記コネクタが端
部に固定された現像カートリッジを特徴としている。ま
た、請求項6の発明は、上記現像カートリッジを有する
画像形成装置を特徴としている。
According to the present invention, the memory IC can be arranged at a hidden position, contact failure due to toner stains, data destruction due to the influence of static electricity, etc. can be prevented, and the memory IC substrate can be detached and reused. The purpose is to enable. Therefore, the invention according to claim 1 has a memory IC substrate covered with a housing, and a connector provided with a conductive member having a connection terminal with a main device side connector and a connection terminal with a memory IC substrate, It is characterized in that the connection terminal of the conductive member with the memory IC substrate is provided with a spring property. The invention of claim 2 provides the memory IC
The memory IC board is mounted on the connector body by inserting the front end of the board into the mounting portion of the connector body and hooking the rear end of the memory IC board on the hook portion of the connector body by using elasticity. Further, the invention of claim 3 is characterized in that the memory IC substrate is formed with a notch for positioning which is displaced from the center of the tip inserted into the attachment portion of the connector body. Further, the invention of claim 4 is characterized in that the connection terminal array of the conductive member with the memory IC board is aligned with the terminal array of the memory IC board. Further, the invention of claim 5 is characterized by a developing cartridge having the connector fixed to an end thereof. The invention of claim 6 is characterized by an image forming apparatus having the developing cartridge.

【0007】[0007]

【発明の実施の形態】以下、本発明の実施の形態を図面
を参照しつつ説明する。図1は本実施形態の画像形成装
置の例を説明する図である。感光体1は図示しない帯電
ユニットで帯電された後、露光ユニット2による画像露
光で静電潜像が形成される。この静電潜像はロータリ現
像ユニット3のロータリフレーム30に装着された現像
カートリッジ31〜34の現像ローラから一色ずつ順次
4色のトナーが供給されて現像される。感光体1には、
転写ベルト駆動ローラ5で駆動される転写ベルト4が1
次転写位置で対向し、各色のトナー像は転写ベルト4に
1次転写されてベルト上で色重ねされる。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram illustrating an example of the image forming apparatus according to the present exemplary embodiment. After the photoconductor 1 is charged by a charging unit (not shown), an electrostatic latent image is formed by image exposure by the exposure unit 2. This electrostatic latent image is developed by sequentially supplying four colors of toner one by one from the developing rollers of the developing cartridges 31 to 34 mounted on the rotary frame 30 of the rotary developing unit 3. The photoconductor 1 has
The transfer belt 4 driven by the transfer belt driving roller 5 is 1
The toner images of the respective colors face each other at the next transfer position and are primarily transferred to the transfer belt 4 so that the colors are superposed on the belt.

【0008】一方、給紙カセット6から取り出された用
紙は搬送路7を通り、転写ベルト駆動ローラ5と対向す
る転写ローラ8の2次転写位置で転写ベルト上の4色ト
ナー像が一括転写される。このとき、転写ベルト4上の
画像先端はベルト位置検出センサ9によって検出され、
画像先端と用紙先端とが合うように制御される。2次転
写された用紙は定着ユニット10で定着され、両面印字
の場合には再度搬送路7に戻り、裏面側に画像が転写さ
れる。転写、定着後の用紙は装置外に排出される。
On the other hand, the paper taken out from the paper feed cassette 6 passes through the conveyance path 7, and the four-color toner images on the transfer belt are collectively transferred at the secondary transfer position of the transfer roller 8 facing the transfer belt driving roller 5. It At this time, the leading edge of the image on the transfer belt 4 is detected by the belt position detection sensor 9,
It is controlled so that the leading edge of the image and the leading edge of the paper match. The sheet that has been secondarily transferred is fixed by the fixing unit 10, and in the case of double-sided printing, returns to the transport path 7 again, and the image is transferred to the back side. The sheet after transfer and fixing is discharged outside the apparatus.

【0009】ロータリ式現像ユニット3の4色の現像カ
ートリッジ31〜34にはメモリIC内蔵コネクタ40
(詳細は後述)がそれぞれ取り付けられ、装置本体側の
コネクタ50からデータの読み取り/書き込みができる
ようになっている。装置本体側コネクタ50はモータ内
蔵の駆動部51により駆動されて前進/後退し、カート
リッジ交換時には前進してコネクタ40と電気的に接続
してメモリICのデータの読み取り/書き込みを行い、
通常時は後退している。各現像カートリッジは、装置本
体に設けられた現像カートリッジ交換用開口11の位置
で取り外して交換可能である。また、画像形成装置には
排気ダクト12が設けられ、現像ローラと感光体が当接
する現像ニップ部付近の吸引口14から飛散トナー等を
吸引し、フィルタ13を通して排気している。この場
合、コネクタ接続部が飛散トナーから影響を受けないよ
うに、メモリIC内蔵コネクタ40と本体装置側コネク
タ50とが接続する位置は、現像ユニットの回転方向で
みて現像ニップ部より上流側に配置する。
The four-color developing cartridges 31 to 34 of the rotary type developing unit 3 are provided with a memory IC built-in connector 40.
(Details will be described later) are attached respectively, and data can be read / written from the connector 50 on the apparatus main body side. The device main body side connector 50 is driven by a drive unit 51 with a built-in motor to move forward / backward, and when the cartridge is replaced, moves forward to electrically connect to the connector 40 to read / write data in the memory IC.
It is usually retreating. Each developing cartridge can be removed and replaced at the position of the developing cartridge replacement opening 11 provided in the main body of the apparatus. Further, the image forming apparatus is provided with an exhaust duct 12, which sucks scattered toner and the like from a suction port 14 near a developing nip portion where a developing roller and a photoconductor contact each other, and exhausts the toner through a filter 13. In this case, the position where the memory IC built-in connector 40 and the main body apparatus side connector 50 are connected is arranged on the upstream side of the developing nip portion in the rotation direction of the developing unit so that the connector connecting portion is not affected by the scattered toner. To do.

【0010】図2はロータリ式現像ユニットにおける現
像カートリッジの交換、メモリICのデータの読み取り
/書き込み、現像待機の各ポジションを説明する図であ
る。ロータリ式現像ユニットのホームポジションは、ポ
ジション検出板37の切り欠き位置をポジション検出セ
ンサ36で検出することにより検知される。
FIG. 2 is a view for explaining each position of the rotary type developing unit for replacement of the developing cartridge, reading / writing of data in the memory IC, and developing standby. The home position of the rotary developing unit is detected by detecting the notch position of the position detection plate 37 with the position detection sensor 36.

【0011】図2(a)は現像器交換位置(ポジション
)を説明する図である。前述したように、装置本体側
には現像器交換口11が設けられており、ロータリ式現
像ユニット3の各現像ローラ〜は、現像器交換口1
1の位置において交換可能である。このポジションに
おいては、各現像カートリッジのコネクタ40は本体側
コネクタ50とは対向せず、また感光体1も現像ローラ
と対向しない。
FIG. 2A is a view for explaining the developing device replacement position. As described above, the developing device exchange port 11 is provided on the apparatus main body side, and each of the developing rollers of the rotary developing unit 3 is connected to the developing device exchange port 1.
It is replaceable in position 1. In this position, the connector 40 of each developing cartridge does not face the main assembly side connector 50, and the photoconductor 1 also does not face the developing roller.

【0012】図2(b)はメモリICへの読み取り/書
き込みと共に、現像ローラが感光体と対向して現像する
位置を示している(ポジション)。装置本体側から読
み取り/書き込み指令が出ると、ポジションの位置関
係になって装置本体側コネクタ50が動作し、コネクタ
40と接続してデータの読み取り/書き込みが行われ
る。
FIG. 2B shows a position (position) where the developing roller faces the photoconductor and develops, as well as reading / writing to the memory IC. When a read / write command is issued from the apparatus body side, the apparatus body side connector 50 operates in a positional relationship, and the apparatus body side connector 50 is connected to read / write data.

【0013】図2(c)はロータリ現像器ユニットによ
る現像がある色から別の色に切り替わるときの途中の位
置(ポジション)で、感光体と現像ローラとは対向し
ていない。
FIG. 2 (c) shows a position (position) in the middle of when the development by the rotary developing unit is switched from one color to another color, and the photosensitive member and the developing roller are not opposed to each other.

【0014】図3はコネクタ接続時と離間時とを説明す
る図である。図3(a)に示すように、接続時には装置
本体側コネクタ50がモータ駆動で前進し、後述するよ
うにメモリIC内蔵コネクタ40側のガイド部材でガイ
ドされて嵌合し、端子同士が摺動して電気的に接続し、
離間時にはコネクタ50が装置本体側に後退して両者が
離間する。なお、コネクタ40はコネクタ固定ネジ48
で現像器ユニットに、コネクタ50はコネクタ固定ピン
53で装置本体に固定されている。
FIG. 3 is a diagram for explaining the time of connecting the connector and the time of separating. As shown in FIG. 3A, at the time of connection, the device main body side connector 50 is driven forward by a motor, and is guided and fitted by a guide member on the side of the memory IC built-in connector 40 as described later, and the terminals slide with each other. And connect electrically,
At the time of separation, the connector 50 retreats toward the main body of the apparatus and the two are separated. The connector 40 has a connector fixing screw 48.
The connector 50 is fixed to the developing device unit, and the connector 50 is fixed to the apparatus main body by connector fixing pins 53.

【0015】図4はロータリ式現像ユニットを説明する
図である。ロータリ式現像ユニット3は板金からなる側
板20、21に取り付けられ、ロータリフレーム30に
取り付けられた現像カートリッジ31〜34の端部には
メモリIC内蔵コネクタ40が固定されている。本実施
形態では側板21がギヤ駆動される側、側板20が反駆
動側で、駆動部の熱の影響を受けないように反駆動側の
側板20を絞って形成した収納部22に設けたコネクタ
カバー39にメモリIC内蔵コネクタ40が固定され
る。収納部22は装置本体側コネクタ50が離当接する
面以外はコネクタ40を包囲して現像ローラにかかる電
圧の影響を受けないようにシールドする役割を果たして
いる。メモリIC内蔵コネクタ40自身はコネクタカバ
ー39で覆われ、収納部を形成する板金からメモリIC
へ静電気の影響がないように、収納部内面には樹脂製リ
ングからなるIC保護部材38が設けられている。
FIG. 4 is a diagram for explaining the rotary developing unit. The rotary developing unit 3 is attached to the side plates 20 and 21 made of sheet metal, and the memory IC built-in connector 40 is fixed to the ends of the developing cartridges 31 to 34 attached to the rotary frame 30. In the present embodiment, the side plate 21 is gear-driven, the side plate 20 is the non-driving side, and the connector provided in the housing 22 formed by squeezing the side plate 20 on the non-driving side so as not to be affected by the heat of the driving unit. The memory IC built-in connector 40 is fixed to the cover 39. The accommodating portion 22 surrounds the connector 40 except for the surface on which the apparatus main body side connector 50 separates and abuts, and serves to shield the connector from being affected by the voltage applied to the developing roller. The memory IC built-in connector 40 itself is covered with a connector cover 39, and a memory IC is formed from a metal plate forming a storage portion.
An IC protection member 38 made of a resin ring is provided on the inner surface of the storage unit so as not to be affected by static electricity.

【0016】図5は本実施形態のメモリIC内蔵コネク
タを説明する図で、図5(a)は平面図、図5(b)は
正面図、図5(c)は図5(a)のA−A断面図であ
る。メモリIC内蔵コネクタ40は接続時の衝撃を受け
止める部材である基板41の一方の面(本体装置側コネ
クタと接続する表面)の外縁に近い両側部分に2つのガ
イド部材42が直立して設けられ、基板41の他方の面
(裏面)にメモリIC基板46を内包する接点保護部材
45が備えられ、これらは筐体47として一体に形成さ
れている。また、ガイド部材42と一体にガイド部材よ
り内側に、接点部材43、44がそれぞれガイド部材4
2と平行に直立して設けられている。ガイド部材42を
接点部材の外側に配置したのは、ガイド部材を包囲して
本体側コネクタが嵌合する際の挿入安定性を図り、接点
の接触状態を安定化させるためである。
5A and 5B are views for explaining the memory IC built-in connector of the present embodiment. FIG. 5A is a plan view, FIG. 5B is a front view, and FIG. 5C is a view of FIG. 5A. It is an AA sectional view. In the connector 40 with a built-in memory IC, two guide members 42 are provided upright on both side portions near the outer edge of one surface of the substrate 41 (a surface to be connected to the main body apparatus side connector) which is a member for receiving an impact at the time of connection. On the other surface (rear surface) of the board 41, a contact protection member 45 including a memory IC board 46 is provided, and these are integrally formed as a housing 47. Further, the contact members 43 and 44 are provided inside the guide member 42 integrally with the guide member 42, respectively.
It is installed upright in parallel with 2. The guide member 42 is arranged outside the contact member in order to stabilize the contact state of the contact by surrounding the guide member and ensuring insertion stability when the main body side connector is fitted.

【0017】本実施形態では筐体47の表側(現像ロー
ラ端部から遠い側)に4本の接点部材43、裏側(現像
ローラ端部に近い側)に3本の接点部材44が2列構成
にして設けられ、全体としてコンパクト化を図ってい
る。もちろん、接点部材は2列に限定されず、1列や3
列にしてもよい。これら接点部材の各端子は、図6に示
すように、表側の4つの端子はデータ端子、装着検知端
子、アース(GND)端子、データの読み込み/書き込
み端子であり、裏側の3つの端子はクロック端子、電源
端子、チップセレクト(CS)端子である。
In this embodiment, four contact members 43 are arranged on the front side (the side far from the developing roller end) of the housing 47, and three contact members 44 are arranged in two rows on the back side (the side closer to the developing roller end). It is provided as a whole and is designed to be compact as a whole. Of course, the contact members are not limited to two rows, one row or three rows.
You can make a line. As shown in FIG. 6, for each terminal of these contact members, four terminals on the front side are a data terminal, a mounting detection terminal, a ground (GND) terminal, a data read / write terminal, and three terminals on the back side are clock terminals. These are terminals, power supply terminals, and chip select (CS) terminals.

【0018】これら接点部材43、44は、図5(c)
に示すように、接続時に本体側コネクタ端子が摺動して
接触する接点端子43a、44aを構成している。接点
部材43,44は基板41のスルーホールを通してその
裏側に延び、メモリIC基板46の端子と弾性的に接触
するバネ性の接点端子43b,44bを備えている。そ
して、接点保護部材45にメモリIC基板46を取り付
けたとき、バネ性の接点端子43b,44bがメモリI
C基板46の端子に弾性的に接触し、メモリIC基板4
6は接点端子43b,44bからのバネ力で接点保護部
材45の取り付け面に押しつけられ、基板41から離間
した浮いた状態で保持される。そのため、モータ駆動で
本体側コネクタ50が前進してコネクタ40に当接して
も、接点部材43,44の端子43a、44aが本体側
コネクタ端子と摺動して接触するだけで、当接の衝撃は
基板41で受け止められ、メモリIC基板46は基板4
1から離間して支持されているので、メモリIC基板4
6の端子と接点43b,44bとの接触部に衝撃は直接
伝わらない。
These contact members 43 and 44 are shown in FIG.
As shown in FIG. 5, contact terminals 43a and 44a which the main body side connector terminal slides into contact with at the time of connection are configured. The contact members 43 and 44 are provided with spring-like contact terminals 43b and 44b which extend through the through holes of the substrate 41 to the back side thereof and elastically contact with the terminals of the memory IC substrate 46. Then, when the memory IC substrate 46 is attached to the contact protection member 45, the spring-shaped contact terminals 43b and 44b are connected to the memory I.
The memory IC substrate 4 is elastically contacted with the terminals of the C substrate 46,
6 is pressed against the mounting surface of the contact protection member 45 by the spring force from the contact terminals 43b and 44b, and is held in a floating state separated from the substrate 41. Therefore, even if the main body side connector 50 moves forward and comes into contact with the connector 40 by the motor drive, the terminals 43a and 44a of the contact members 43 and 44 only slide and come into contact with the main body side connector terminal, and the impact of the contact is generated. Is received by the substrate 41, and the memory IC substrate 46 is the substrate 4
The memory IC substrate 4 is supported separately from the memory IC substrate 1.
No impact is directly transmitted to the contact portion between the terminal 6 and the contacts 43b and 44b.

【0019】このように、コネクタ40は衝撃受け部材
である基板41の一方の面に本体側コネクタとの摺動接
点をもち、基板41の裏側に基板から浮いて支持された
メモリIC基板との固定接点をもつようにしたので、本
体側コネクタとの接続時の衝撃が基板41で受け止めら
れてメモリIC基板側に伝えられず、メモリIC基板と
の接点が安定して形成される。
As described above, the connector 40 has a sliding contact with the connector on the main body side on one surface of the substrate 41 which is an impact receiving member, and a memory IC substrate which is supported by being floated from the substrate on the back side of the substrate 41. Since the fixed contact is provided, the impact at the time of connection with the main body side connector is not received by the substrate 41 and transmitted to the memory IC substrate side, and the contact with the memory IC substrate is stably formed.

【0020】図7はメモリIC基板のコネクタ本体への
装着を説明する図である。図7(a)はコネクタの裏面
側からみたメモリIC基板装着状態を示す図であり、メ
モリIC基板46には切り欠き46aがその中心よりず
れた位置に設けられ、切り欠きの両側において基板先端
長さが異ならせてある。この基板先端に合わせる形でコ
ネクタ本体側には窪みを有する取り付け部60が形成さ
れ、この窪みの深さが切り欠きの両側において異なって
いる。そのため、左右を逆にして基板先端を取り付け部
60に挿入しようとしてもうまくいかず、誤挿入が防止
できるようになっている。一方、基板の後端はコネクタ
本体のフック61に引っかけるように構成されている。
FIG. 7 is a diagram for explaining the mounting of the memory IC board on the connector body. FIG. 7A is a diagram showing a mounted state of the memory IC substrate as viewed from the back surface side of the connector. The memory IC substrate 46 is provided with a notch 46a at a position displaced from the center thereof, and the substrate tip is provided on both sides of the notch. The lengths are different. A mounting portion 60 having a recess is formed on the connector body side so as to match the tip of the board, and the depth of the recess is different on both sides of the notch. Therefore, even if the left and right sides are reversed and the tip end of the substrate is inserted into the mounting portion 60, it is not successful and erroneous insertion can be prevented. On the other hand, the rear end of the board is configured to be hooked on the hook 61 of the connector body.

【0021】図7(b)はメモリIC基板の装着を説明
する断面図である。本実施形態のメモリIC基板46は
弾性(バネ性)を有する樹脂からなっており、基板先端
を取り付け部60に挿入し、基板の後端をコネクタ本体
側に回転させながら押しつけ、基板の弾性を利用して反
らせて挿入し、フック61に引っかけて止めるようにす
る。このときメモリIC基板の端子はバネ性の接点端子
43b,44bと弾性的に接触し、接点のバネ力により
メモリIC基板は取り付け部60、フック61側に押し
つけられており、装着が安定するとともに、接点状態が
安定化する。
FIG. 7B is a sectional view for explaining the mounting of the memory IC substrate. The memory IC substrate 46 of this embodiment is made of a resin having elasticity (spring property), and the front end of the substrate is inserted into the mounting portion 60, and the rear end of the substrate is pressed while being rotated toward the connector main body side so that the elasticity of the substrate is increased. Use it to bend and insert it, and hook it on the hook 61 to stop it. At this time, the terminals of the memory IC board elastically contact the spring-like contact terminals 43b and 44b, and the spring force of the contacts presses the memory IC board toward the mounting portion 60 and the hook 61 side. , The contact condition is stabilized.

【0022】このようにメモリIC基板46を基板41
の裏側に筐体47と一体の接点保護部材45で覆うよう
にし、メモリIC基板をコネクタ本体に弾性的に着脱可
能に取り付ける構成であるため、メモリICを隠した位
置に配置できるとともに、直接表に出ないところにメモ
リICの接点があるためトナー汚れによる接点不良や、
静電気の影響によるデータの破壊等を防ぐことができ、
接点の信頼性を向上させることができる。また、半田付
けなどの場合にはメモリIC基板を取り外すために熱を
加えなければならないのに対して、コネクタ本体を装置
本体から取り外すことでメモリICを容易に回収して再
利用することができる。
In this way, the memory IC substrate 46 is connected to the substrate 41.
Since the contact protection member 45 integrated with the housing 47 covers the back side of the memory IC and the memory IC substrate is elastically detachably attached to the connector body, the memory IC can be arranged in a hidden position and directly exposed. Since there is a contact point of the memory IC in a place where
It is possible to prevent data destruction due to the influence of static electricity,
The reliability of the contact can be improved. Further, in the case of soldering or the like, heat must be applied to remove the memory IC substrate, whereas the memory IC can be easily collected and reused by removing the connector body from the apparatus body. .

【0023】[0023]

【発明の効果】以上のように本発明によれば、筐体でメ
モリIC基板を覆う構成としたことにより、メモリIC
を隠した位置に配置できるとともに、直接表に出ないと
ころにメモリICの接点があるためトナー汚れによる接
点不良や、静電気の影響によるデータの破壊等を防ぐこ
とができ、接点の信頼性を向上させることができる。さ
らに、メモリIC基板に弾性を有する材料を使用し、コ
ネクタ本体に弾性的に着脱可能に取り付けるようにした
ので、組み立て性が向上するとともに、再利用を図るこ
とができる。また、端子列を複数列構成とすることによ
り、コネクタのコンパクト化を図り、また、メモリIC
基板に位置決め用の切り欠きを設けることにより基板の
誤挿入を防止することが可能である。
As described above, according to the present invention, the memory IC substrate is covered with the housing, so that the memory IC
Can be placed in a hidden position, and because the contact of the memory IC is not directly exposed, contact failure due to toner stains and data destruction due to the influence of static electricity can be prevented, improving contact reliability. Can be made. Further, since the memory IC substrate is made of an elastic material and is elastically detachably attached to the connector main body, the assembling property is improved and the reusing can be promoted. Further, by forming the terminal row in a plurality of rows, the connector can be made compact, and the memory IC
By providing a notch for positioning on the board, it is possible to prevent erroneous insertion of the board.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の画像形成装置を説明する図である。FIG. 1 is a diagram illustrating an image forming apparatus of the present invention.

【図2】 現像カートリッジの交換、メモリICのデー
タの読み書き、現像待機の各ポジションを説明する図で
ある。
FIG. 2 is a diagram illustrating each position of replacement of a developing cartridge, reading / writing of data from / in a memory IC, and development standby.

【図3】 メモリICへのコネクタ接続と離間を説明す
る図である。
FIG. 3 is a diagram illustrating connector connection to and separation from a memory IC.

【図4】 ロータリ式現像器ユニットを説明する図であ
る。
FIG. 4 is a diagram illustrating a rotary developing device unit.

【図5】 メモリIC内蔵のコネクタを説明する図であ
る。
FIG. 5 is a diagram illustrating a connector with a built-in memory IC.

【図6】 コネクタ端子を説明する図である。FIG. 6 is a diagram illustrating a connector terminal.

【図7】 メモリIC基板のコネクタ本体への装着を説
明する図である。
FIG. 7 is a diagram illustrating how the memory IC board is attached to the connector body.

【符号の説明】[Explanation of symbols]

1…感光体、2…露光ユニット、3…ロータリ式現像ユ
ニット、4…転写ベルト、5…転写ベルト駆動ローラ、
6…給紙カセット、7…用紙搬送路、8…転写ローラ、
9…位置検出センサ、10…定着ユニット、11…現像
カートリッジ交換用開口、12…排気ダクト、13…フ
ィルタ、14…吸引口、20,21…側板、30…ロー
タリフレーム、31〜34…現像カートリッジ、36…
ポジション検出センサ、37…ポジション検出板、38
…IC保護部材、39…コネクタカバー、40,50…
コネクタ、41…基板、42…ガイド部材、43,44
…接点部材、45…接点保護部材、46…メモリIC基
板、46a…切り欠き、60…位置決め部、61…フッ
ク。
1 ... Photosensitive member, 2 ... Exposure unit, 3 ... Rotary developing unit, 4 ... Transfer belt, 5 ... Transfer belt drive roller,
6 ... Paper feed cassette, 7 ... Paper transport path, 8 ... Transfer roller,
9 ... Position detection sensor, 10 ... Fixing unit, 11 ... Development cartridge replacement opening, 12 ... Exhaust duct, 13 ... Filter, 14 ... Suction port, 20, 21 ... Side plate, 30 ... Rotary frame, 31-34 ... Development cartridge , 36 ...
Position detection sensor, 37 ... Position detection plate, 38
... IC protection member, 39 ... Connector cover, 40, 50 ...
Connector, 41 ... Board, 42 ... Guide member, 43, 44
... contact member, 45 ... contact protection member, 46 ... memory IC substrate, 46a ... notch, 60 ... positioning portion, 61 ... hook.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 青木 毅 長野県諏訪市大和3丁目3番5号 セイコ ーエプソン株式会社内 Fターム(参考) 2C061 CG02 CG03 CG12 CG13 2H171 FA02 FA05 FA13 GA09 GA11 GA16 GA19 GA20 GA29 JA06 JA45 JA50 JA51 MA02 MA07 MA11 MA20 QA02 QA06 QA08 QA24 QB15 QB34 QC03 QC36 SA11 SA14 SA19 SA22 SA26 5E021 FA05 FB01 FB14 FB18 FC32 FC40 JA05 KA05 MA08 MA31 MA32 5E023 AA04 AA18 AA21 BB02 BB19 BB22 CC22 DD18 DD28 EE07 FF07 GG01 GG15 HH01 HH05 HH18 HH30    ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takeshi Aoki             Seiko, 3-3-3 Yamato, Suwa City, Nagano Prefecture             -In Epson Corporation F-term (reference) 2C061 CG02 CG03 CG12 CG13                 2H171 FA02 FA05 FA13 GA09 GA11                       GA16 GA19 GA20 GA29 JA06                       JA45 JA50 JA51 MA02 MA07                       MA11 MA20 QA02 QA06 QA08                       QA24 QB15 QB34 QC03 QC36                       SA11 SA14 SA19 SA22 SA26                 5E021 FA05 FB01 FB14 FB18 FC32                       FC40 JA05 KA05 MA08 MA31                       MA32                 5E023 AA04 AA18 AA21 BB02 BB19                       BB22 CC22 DD18 DD28 EE07                       FF07 GG01 GG15 HH01 HH05                       HH18 HH30

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 筐体で覆われたメモリIC基板を有する
とともに、本体装置側コネクタとの接続端子及びメモリ
IC基板との接続端子を有する導電性部材を備えたコネ
クタにおいて、前記導電性部材のメモリIC基板との接
続端子にバネ性を付与したことを特徴とするコネクタ。
1. A connector comprising a conductive member having a memory IC substrate covered with a housing and having a connection terminal with a main body apparatus side connector and a connection terminal with a memory IC substrate. A connector characterized in that a connection terminal with a memory IC substrate is provided with a spring property.
【請求項2】 前記メモリIC基板先端をコネクタ本体
の取り付け部に挿入し、メモリIC基板の後端を弾性を
利用してコネクタ本体のフック部に引っかけることによ
りメモリIC基板がコネクタ本体に装着されることを特
徴とする請求項1記載のコネクタ。
2. The memory IC board is attached to the connector main body by inserting the front end of the memory IC board into the mounting portion of the connector main body and hooking the rear end of the memory IC board to the hook portion of the connector main body by using elasticity. The connector according to claim 1, wherein:
【請求項3】 前記メモリIC基板は、コネクタ本体の
取り付け部に挿入される先端の中心からずらして位置決
め用の切り欠きが形成されていること特徴とする請求項
2記載のコネクタ。
3. The connector according to claim 2, wherein the memory IC substrate is formed with a notch for positioning which is displaced from the center of the tip inserted into the mounting portion of the connector body.
【請求項4】 前記導電性部材のメモリIC基板との接
続端子列と、メモリIC基板の端子列とを揃えたことを
特徴とする請求項1乃至3いずれか記載のコネクタ。
4. The connector according to claim 1, wherein a connection terminal row of the conductive member and the memory IC board is aligned with a terminal row of the memory IC board.
【請求項5】 請求項1記載のコネクタが端部に固定さ
れたことを特徴とする現像カートリッジ。
5. A developing cartridge, wherein the connector according to claim 1 is fixed to an end portion.
【請求項6】 請求項5記載の現像カートリッジを有す
ることを特徴とする画像形成装置。
6. An image forming apparatus comprising the developing cartridge according to claim 5.
JP2002042878A 2002-02-20 2002-02-20 Connector, cartridge for development, and image forming device Withdrawn JP2003243070A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002042878A JP2003243070A (en) 2002-02-20 2002-02-20 Connector, cartridge for development, and image forming device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002042878A JP2003243070A (en) 2002-02-20 2002-02-20 Connector, cartridge for development, and image forming device

Publications (1)

Publication Number Publication Date
JP2003243070A true JP2003243070A (en) 2003-08-29

Family

ID=27782844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002042878A Withdrawn JP2003243070A (en) 2002-02-20 2002-02-20 Connector, cartridge for development, and image forming device

Country Status (1)

Country Link
JP (1) JP2003243070A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010513093A (en) * 2006-12-21 2010-04-30 イーストマン コダック カンパニー Data and fixing device for print reservoir

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010513093A (en) * 2006-12-21 2010-04-30 イーストマン コダック カンパニー Data and fixing device for print reservoir

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