WO2018110926A1 - Module d'affichage et procédé de fabrication associé - Google Patents

Module d'affichage et procédé de fabrication associé Download PDF

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Publication number
WO2018110926A1
WO2018110926A1 PCT/KR2017/014501 KR2017014501W WO2018110926A1 WO 2018110926 A1 WO2018110926 A1 WO 2018110926A1 KR 2017014501 W KR2017014501 W KR 2017014501W WO 2018110926 A1 WO2018110926 A1 WO 2018110926A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
emitting diode
sunshade
display module
module substrate
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Application number
PCT/KR2017/014501
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English (en)
Korean (ko)
Inventor
김병순
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지엘비텍 주식회사
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Publication of WO2018110926A1 publication Critical patent/WO2018110926A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Definitions

  • the present invention relates to a display module and a method of manufacturing the same. More specifically, a plurality of light emitting diode bare chips are directly mounted on a module substrate having a circuit pattern, and the plurality of light emitting diodes are mounted on the module substrate. A display module is manufactured by integrally molding all bare chips. Furthermore, the plurality of light emitting diode bare chips are directly mounted on a module substrate equipped with a sunshade, and the plurality of light emitting diode bare chips are directly mounted. And a display module manufactured by molding the sunshade and a method of manufacturing the same.
  • a light emitting diode is a semiconductor device that emits light by converting electrical energy into light, and is widely used for various purposes such as displaying information in various electronic products.
  • the light emitting diode can be driven with low power and its life is long, recently, a display in which a plurality of light emitting diodes (LED) are arranged is used, and is also used as an indoor or outdoor electronic display board.
  • the plurality of light emitting diodes (LEDs) may be arranged in a matrix to form a display module, and the display modules may be arranged to form a display having a required size.
  • FIG. 1 illustrates a structure of configuring a display by mounting a sun shade 30 on an LED panel 10 in which a light emitting diode (LED) is arranged in Korean Patent Publication No. 10-0988765.
  • 2 illustrates a cross-sectional view of a display in which the sun shade 30 is mounted on an LED panel 10 in which a plurality of light emitting diodes (LEDs) are arranged.
  • the sun shade 30 having a more precise and fine structure is required, and the display manufacturing process is accompanied with problems such as deterioration of color uniformity and deterioration of contrast (contrast). It may cause problems such as deterioration of workability, increase of defective rate, and cost increase.
  • the sunshade 30 is made of a block unit structure to mount one or more block unit sunshade 30 to configure the display, wherein the sunshade 30 is attached to the fine structure accurately Difficulties follow, and in particular, by applying an adhesive or the like to a small area (1 mm or less) of the attachment surface of the lower portion of the sunshade 30, dropping of the sunshade 30 may occur due to a decrease in adhesive strength, and furthermore, As a plurality of sun shades 30 are repeatedly attached to form a large-area display, color uniformity is generated due to variations in material composition, production time (LOT), and so on, resulting in unevenness in the display. May appear. In addition, a problem of rapid cost increase may occur due to a decrease in workability and an increase in defect rate in a high-resolution display manufacturing process along with quality problems such as lower contrast.
  • LOT production time
  • a plurality of light emitting diodes should be arranged at close intervals, such as 1 mm or less, so that the size of the light emitting diodes (LEDs) is also smaller than 1 mm. What can be done is required.
  • a unit light emitting diode having a structure in which a light emitting diode (LED) bare chip illustrated in FIG. 2 is mounted on a substrate (LED PCB) and packaged.
  • LED PCB substrate
  • the size of a light emitting device such as a light emitting diode (LED) mounted in a display board having the same area is reduced to 1 mm or less, and at the same time, a light emitting device such as the light emitting diode (LED)
  • the distance between them should be densely mounted to 1mm or less, so that the number of light emitting devices such as light emitting diodes (LEDs) to be mounted rapidly increases from 3 to 5 times in order to realize high resolution within the same area.
  • a significant increase in process (SMT) costs is a major factor in raising costs. (For example, as the size and spacing of light emitting devices become dense to 1mm, 0.5mm, 0.3mm, etc., the number of light emitting devices to be mounted may rapidly increase to 1600, 4000, 8000, etc.)
  • a large area is usually installed in a high structure such as a wall of a building, which may require a lot of equipment, manpower, and cost.
  • quality problems may occur due to the installation environment, external moisture, pollution, and inflow of foreign matters.
  • the frequency of occurrence of high frequency and quality problems can be costly for maintenance, so quality control to improve the reliability of the product is very important.
  • the present invention is to solve the problems of the prior art as described above, and an object of the present invention is to provide a display manufacturing method capable of effectively manufacturing a high-resolution display module is arranged a plurality of light emitting diode (LED) elements.
  • LED light emitting diode
  • an object of the present invention is to provide a display manufacturing method that can effectively suppress the increase in cost in the manufacturing process, such as surface mount process (SMT) according to the production of a high-resolution display module.
  • SMT surface mount process
  • an object of the present invention is to provide a display manufacturing method that can effectively prevent contamination by an external environment even in a display having a high resolution.
  • a method of manufacturing a display module including a plurality of light emitting devices comprising: (a) forming a plurality of light emitting diode bare chips on a module substrate; Mounting; And (b) forming a molding layer integrally molding the plurality of light emitting diode bare chips on the module substrate.
  • (p) may further comprise the step of preparing a module substrate having a sunshade (sunshade).
  • the light emitting diode bare chip and the sunshade may be molded together.
  • the height of the molding layer may be higher than or equal to the height of the sunshade.
  • step (b) may include forming a light shielding layer on the upper portion of the molding layer by printing, injection, or dispensing with a black, white, or colored material.
  • the method may further include an electrode connecting step of directly connecting an electrode of a bare chip and an electrode of the module substrate.
  • the sunshade may be formed by printing or printing a predetermined ink on the module substrate once or several times through a silk screen process.
  • step (p) it is possible to form a sunshade (sunshade) by injecting a predetermined material on the upper portion of the module substrate through an injection process or by mounting an injection.
  • a sunshade may be formed by stacking a predetermined material on the module substrate once or several times by using a dispenser.
  • the step (p) may include a step of forming a light shielding wall by filling a filler in the groove formed on the top of the sunshade.
  • the method may include forming a sun shade surrounding the light blocking wall.
  • the method may further include forming a diffusion layer on the light emitting diode bare chip to diffuse light emitted from the light emitting diode bare chip.
  • the molding layer may include a diffusion agent for diffusing light emitted from the light emitting diode bare chip.
  • the method may further include forming a lens structure on the light emitting diode bare chip to control light emitted from the light emitting diode bare chip.
  • a display module includes a display module including a plurality of light emitting devices, including: a module substrate; A plurality of light emitting diode bare chips mounted on the module substrate; And a molding layer integrally molding the plurality of light emitting diode bare chips mounted on the module substrate.
  • the module substrate may be a module substrate having a sunshade (sunshade).
  • the molding layer may mold the light emitting diode bare chip and the sunshade together.
  • the height of the molding layer may be higher than or equal to the height of the sunshade.
  • a light shielding layer which replaces the function of the sunshade, minimizes external light reflection and blocks light in some areas, may be formed by printing, injection, coating, or dispensing.
  • the sunshade may include a light blocking wall formed by filling a filler in the groove formed on the upper portion.
  • sunshade may be formed in a structure surrounding the light shielding wall formed on the module substrate.
  • the light emitting diode bare chip may further include a diffusion layer configured to diffuse light emitted from the light emitting diode bare chip.
  • the molding layer may include a diffusion agent for diffusing light emitted from the light emitting diode bare chip.
  • the molding layer is formed of a black, white or colored material on the upper part of the molding layer to replace the function of the sunshade to suppress the reflection of light applied from the outside, and is emitted from the light emitting diode bare chip (barechip) It may include a light blocking layer that blocks light in some areas.
  • a light emitting diode bare chip (mount chip) is mounted on the module substrate and the plurality of By forming a display module by totally molding a light emitting diode bare chip and the sunshade, it is possible to effectively manufacture a high resolution display module.
  • a light emitting diode device is fabricated by mounting a light emitting diode bare chip on a device substrate (LED PCB), and then the light emitting diode device is not mounted on a module substrate through a surface mount process (SMT). Instead, by directly mounting the light emitting diode bare chip on the module substrate, an increase in cost in a manufacturing process such as a surface mount process (SMT) according to manufacturing a high resolution display module can be effectively suppressed.
  • SMT surface mount process
  • the present invention by forming a molding layer for molding the plurality of light emitting diode bare chip (chip) and the sunshade (sunshade), it is possible to effectively prevent contamination by the external environment even in a display having a higher resolution It becomes possible.
  • FIG. 1 is an exploded view of a display having a sunshade according to the prior art.
  • FIG. 2 is a cross-sectional view of a display equipped with a sun shade according to the prior art.
  • FIG. 3 is a flowchart illustrating a manufacturing method of a display module according to an exemplary embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a display module according to an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of the display module according to each step of the manufacturing method of the display module according to an embodiment of the present invention.
  • FIG. 6 is a cross-sectional view of a display module further including a light blocking layer according to an embodiment of the present invention.
  • FIG. 7 is a perspective view of a display module according to an embodiment of the present invention.
  • FIG. 8 is a cross-sectional view of a display module having a light blocking wall embedded in a sun shade according to an embodiment of the present invention.
  • FIG. 9 is a cross-sectional view of a display module including a diffusion layer or a diffusion agent according to an embodiment of the present invention.
  • FIG. 10 is a cross-sectional view of a display module including a molding layer in which a lens structure is formed, according to an exemplary embodiment.
  • FIG. 11 is a cross-sectional view of a display module having a molded surface layer according to an embodiment of the present invention.
  • FIG. 12 is a cross-sectional view of a display module having a structure in which a light shielding layer replaces a sun shade according to an embodiment of the present invention.
  • FIG. 13A and 13B are photographs showing the waterproof effect of the display module according to an embodiment of the present invention.
  • first and second may be used to describe various components, but the components are not limited by the terms, and the terms are used to distinguish one component from another component. Used only as
  • FIG. 2 illustrates a cross-sectional view of a display module according to the prior art.
  • the light emitting diode bare chip 11 is first mounted on the device substrate 13, and then the light emitting diode bare chip 11 is formed using a bonding wire 12. Is connected to the electrode of the device substrate 13 to form a light emitting diode device (10).
  • a mold layer 30 may be formed on the light emitting diode element 10.
  • the light emitting diode device 10 is mounted on a module substrate 21 for configuring a display module through a surface mounting technology (SMT), and in some cases, the module substrate 21.
  • the driving circuit 40 is mounted on the lower surface.
  • the sun shade 22 manufactured by plastic injection or the like is mounted on the module substrate 21 on which the light emitting diode device 10 is mounted.
  • the module manufacturing method after using the module substrate without the sunshade (sunshade), or further configures the module substrate 210 in which the sunshade 220 is integrated, the module By mounting the light emitting diode bare chip 110 on the substrate 210 to configure a display module, a high resolution display module can be manufactured more effectively.
  • the light emitting diode bare chip 11 is mounted on the element substrate 13 to fabricate the light emitting diode element 10, and then the light emitting diode element 10 is mounted on the module substrate 21 through a surface mounting process (SMT).
  • SMT surface mounting process
  • Figure 3 illustrates a flow chart of a manufacturing method of a display module according to an embodiment of the present invention.
  • the manufacturing method of the display module according to an embodiment of the present invention, a method for manufacturing a display module having a plurality of light emitting elements, (a) a plurality of light emitting diode bear on the module Mounting a chip (S110) and (b) forming a molding layer integrally molding the plurality of light emitting diode bare chips on the module substrate (S120).
  • the light emitting device may be a light emitting diode bare chip.
  • step (p) may further comprise the step of preparing a module substrate having a sunshade (sunshade).
  • FIG. 4 illustrates a cross-sectional view of a display module according to an embodiment of the present invention.
  • the display module may include a module substrate 210 and a plurality of light emitting devices mounted on the module substrate 210.
  • the light emitting device may be a light emitting diode bare chip.
  • the module substrate 210 may be a module substrate 210 having the sunshade 220 integrated therein.
  • FIG 5 illustrates a cross-sectional view of the display module according to each step of the manufacturing method of the display module according to an embodiment of the present invention.
  • step S110 prior to step S110, as shown in Figure 5 (a) it can be prepared a module substrate 210 having a sunshade 220.
  • the sunshade 220 may be formed by printing a predetermined ink once or several times on the module substrate 210 through a silk screen process, or the module substrate 210 through an injection process. It is also possible to form the sunshade 220 by injecting a predetermined material on top of the (). Further, by mounting the injection molding on the module substrate 210, the module substrate 210 having the sunshade 220 is provided. Can be used as well). In addition, the sunshade 220 may be formed by stacking a predetermined material once or several times on the upper portion of the module substrate 210 using a dispenser.
  • a temperature capable of appropriately forming the sunshade 220 without damaging the module substrate 210 may be applied in consideration of the material of the injection molded product and the module substrate 210. .
  • the height of the sun shade 220 may be determined in consideration of the height of a light emitting device such as a light emitting diode bare chip (mounted chip) mounted on the module substrate 210.
  • a light emitting device such as a light emitting diode bare chip (mounted chip) mounted on the module substrate 210.
  • the sun shade 220 when the sun shade 220 is formed by using the silk screen process, the sun shade 220 may be formed by printing a predetermined ink on the upper portion of the module substrate 210 once or several times. Can be. More specifically, in the silk screen process, the sun shade 220 having a predetermined height (for example, 1 mm or less) may be formed by repeatedly stacking the 100 ⁇ m height several times.
  • the height of the sun shade 220 may be determined in consideration of the height of the light emitting device such as a light emitting diode bare chip (mounted chip) mounted on the module substrate 210.
  • the light emitting device such as a light emitting diode bare chip (mounted chip) mounted on the module substrate 210.
  • heat curing at a predetermined temperature for example, 150 to 200 ° C.
  • irradiating ultraviolet rays (UV) according to the material of the ink is cured.
  • the sun shade 220 may be formed through a process such as the like.
  • the sunshade 220 may be formed by stacking a predetermined material on the module substrate 210 once or several times by using one or a plurality of nozzles.
  • the diameter of the nozzle used in the dispenser process may be selected in consideration of the shape of the sunshade 220 to be formed (for example, 1mm or less).
  • the height of the sunshade 220 may be determined in consideration of the height of the light emitting device such as a light emitting diode bare chip (mounted on the module substrate 210), the height of the dam (Dam) to be formed.
  • the height of the light emitting device such as a light emitting diode bare chip (mounted on the module substrate 210)
  • the height of the dam (Dam) to be formed.
  • the lamination After performing the lamination once or several times in the dispenser process, it is thermally cured at a predetermined temperature (for example, 150 to 200 ° C.) or irradiated with ultraviolet (UV), depending on the type of material used.
  • a predetermined temperature for example, 150 to 200 ° C.
  • UV ultraviolet
  • a separate sunshade according to the prior art 22
  • various problems that may occur when the module is mounted on the module substrate for example, the sun shade 30 is damaged in the process of mounting the sun shade 30 having a precise and fine structure according to high resolution. It may be difficult to properly mount the sunshade 30 in the correct position, so that the workability in the high-resolution display manufacturing process, the problem that the defective rate increases, etc.) can be effectively solved.
  • the sunshade 22 manufactured separately is manufactured. It is not necessary to apply an adhesive for attaching, and the work of attaching the separately manufactured sunshade 22 to the module substrate 210 is also unnecessary, thereby improving workability and effectively reducing manufacturing cost. In addition, it is possible to effectively lower the defect rate, such as color uniformity and contrast decrease due to the drop of the sunshade 22 due to the decrease in the adhesive strength of the adhesive, the variation of materials, processes, etc. during manufacture. .
  • the light shielding wall 221 may be formed by filling a filler in a groove formed on the sunshade 220.
  • the light blocking wall 221 may be formed by filling a filler in the formed groove.
  • a sunshade 220 having a groove formed in advance on the module substrate 210 may be formed on the module substrate 210, and a light blocking wall 221 may be formed by filling a filler in the groove.
  • the sun shade 220 surrounding the light blocking wall 210 is formed to form a sun shade wall 210.
  • Shade 220 may also be configured.
  • the light blocking wall 221 using silicon having a color such as black or white, light may be blocked more effectively, thereby more effectively preventing interference with an adjacent light emitting diode bare chip 110. .
  • a light emitting device is mounted on the module substrate 210.
  • the light emitting device may be a light emitting diode bare chip 110. That is, in the related art, a light emitting diode bare chip 11 is typically mounted on an element substrate 13 (see FIG. 2), and the light emitting diode bare chip 11 is bonded using a bonding wire 12.
  • the display module is configured by mounting the light emitting diode device 10 to the module substrate 210. In order to construct a display module having a high resolution, a method of miniaturizing the size of the light emitting diode device 10 has been required.
  • the gap between the light emitting devices can be effectively reduced by mounting the light emitting diode bare chip 110 directly on the module substrate 210.
  • the resolution of the display module can be greatly increased.
  • an electrode connection step of connecting the light emitting diode bare chip 110 to an electrode of the module substrate 210 is performed. It may further include. Accordingly, in the present invention, the light emitting diode bare chip 110 is directly mounted on the module substrate 210 and electrically connected through wire bonding, thereby greatly reducing the size of the light emitting device and drastically improving the resolution of the display module. You can do it. In some cases, the electrodes may be connected by a method of directly connecting an electrode of the light emitting diode bare chip and an electrode of the module substrate.
  • the cost in the manufacturing process such as surface mount process (SMT) according to the high resolution display module fabrication It is also possible to effectively suppress the increase.
  • SMT surface mount process
  • the method may further include mounting the driving circuit 400 on the lower surface of the module substrate 210. Accordingly, by including a driving circuit 400 for driving the display module, it is possible to implement a display module by saving space and cost.
  • step S120 as shown in FIG. 5 (d), the molding layer 300 integrally molding the plurality of light emitting diode bare chips 110 is formed. Furthermore, in step S120, the molding layer 300 may mold the plurality of light emitting diode bare chips 110 and the sunshade 220 together.
  • the molding layer 300 has the light emitting diode bare chip 110 mounted on a module substrate 210 provided with the sun shade, and then the light emitting diode bare chip 110 and the sun shade ( 220, the upper part of the entire molding is molded, as compared with FIG. 2 according to the prior art, the shape and function may have a significant difference.
  • the height of the molding layer 300 may be higher than or equal to the height of the sunshade 220. Accordingly, the molding layer 300 may include the light emitting diode bare chip 110 and the sunshade 220. ) Will be molded by embedding them all.
  • the side portion of the light emitting diode bare chip 110 is present.
  • the area between the and the sunshade 220 is also molded by the molding layer 300, thereby effectively blocking the inflow of contaminants such as moisture and foreign matters from the outside.
  • the molding layer 300 forms a flat planar structure even on the top of the sunshade 220, and as shown in FIG. 6, the light is blocked on the top of the sunshade 220.
  • the light shielding layer 500 can be formed more efficiently.
  • the sun shade layer 500 has a prefabricated structure, as shown in FIG.
  • the molding layer 300 forms a flat planar structure while molding the sunshade 220 and the light emitting diode bare chip 110.
  • the light shielding layer 500 can be effectively formed on the molding layer 300.
  • the light blocking layer 500 may be configured using various materials capable of effectively blocking light such as silicon, such as black silicon, plastic, and epoxy.
  • various processes such as injection, printing, or silk screen, a dispenser, a dam-fill, and the like may be applied.
  • the molding layer 300 is usually 100um or less (20 to 50um). It may be formed in a thickness, and in order to improve the adhesive strength in the epoxy (epoxy) material, etc. constituting the molding layer 300, to improve the characteristics such as heat resistance, moisture resistance, etc. based on a black heat-based ink or the like based on a high heat-resistant epoxy material Can be.
  • the shape of the light blocking layer 500 may be configured such that the opening of the upper portion of the light emitting device forms an appropriate shape such as a circle or a rectangle.
  • the display module manufacturing method according to an embodiment of the present invention, a diffusion layer for diffusing light emitted from the light emitting diode bare chip (110) on the light emitting diode bare chip (110) ( The method may further include forming 600).
  • the molding layer 300 may include a diffusion agent 610 for diffusing light emitted from the light emitting diode bare chip 110.
  • the diffusion layer 600 may be a diffusion layer 600 having an average surface roughness Ra of which a surface roughness of 0.01 or more is used to effectively diffuse the light emitted from the light emitting diode bare chip 110.
  • the diffusion agent 610 may be included in the molding layer 300, SiO 2, TiO 2, or the like, which may effectively diffuse light emitted from the light emitting diode bare chip 110.
  • FIG. 7 illustrates a perspective view of a display module according to an embodiment of the present invention.
  • the display module according to an embodiment of the present invention a display module having a plurality of light emitting elements, a module substrate 210, a plurality of light emitting mounted on the module substrate 210
  • the diode bare chip 110 may include a molding layer 300 integrally molding the plurality of light emitting diode bare chips 210 mounted on the module substrate 210.
  • the module substrate 210 may be a module substrate 210 having a sunshade 220 integrated therein.
  • the molding layer 300 may have a structure of molding the light emitting diode bare chip 110 and the sunshade 220 together. Accordingly, the display module according to an embodiment of the present invention molds the entire plurality of light emitting diode bare chips 110 and sunshades 220 provided on the module substrate 210. As well as reducing the manufacturing cost, it is possible to effectively prevent contamination by the external environment to improve the stability and life of the product.
  • the height of the molding layer 300 is preferably higher than or equal to the height of the sunshade 220.
  • a light shielding layer 221 may be formed on the molding layer 300 to block light of a partial region including an upper region of the sunshade 220.
  • the sunshade 220 is provided with a light blocking wall 221, and the light emitted from the adjacent light emitting diode bare chip 110. It can also suppress the interference of more effectively.
  • FIG. 8 illustrates a cross-sectional view of a display module having a light blocking wall 221 embedded in the sun shade 220 according to an exemplary embodiment of the present invention.
  • the sunshade 220 may be configured to include a light shielding wall 221 formed by filling a filler in the groove formed on the upper portion. have.
  • the sunshade 220 is formed on the module substrate 210 and a groove is formed in the upper portion thereof, and then the light blocking wall 221 may be formed by filling a filler in the formed groove.
  • a sunshade 220 having a groove formed on the upper portion thereof may be formed on the module substrate 210, and the light blocking wall 221 may be formed by filling a filler in the groove.
  • the sunshade 220 according to an embodiment of the present invention, it is to be configured in a structure surrounding the light shielding wall 221 generated on the module substrate 210 It may be.
  • the light blocking wall 221 may be formed using silicon having a color such as black, white, and the like, thereby effectively blocking the light of the adjacent light emitting diode bare chip 110, and thus emitting light adjacent to the light. The interference by the diode bare chip 110 can be prevented more effectively.
  • FIG 9 illustrates a cross-sectional view of the display module including the diffusion layer 600 or the diffusion agent 610 according to an embodiment of the present invention.
  • a diffusion layer 600 may be further included to diffuse the light emitted from the light emitting diode.
  • the diffusion layer 600 may be a diffusion layer 600 having an average surface roughness Ra of which a surface roughness of 0.01 or more is used to effectively diffuse the light emitted from the light emitting diode bare chip 110. Since the light emitting intensity of the conventional light emitting diode bare chip 110 is concentrated in the straight direction, the diffusion layer 600 may be provided as described above to diffuse the straight light, thereby improving the characteristics of the display module such as a viewing angle.
  • FIG. 9A illustrates a structure in which the diffusion layer 600 is formed on the mold layer 300
  • the present invention is not necessarily limited thereto and may be viewed in addition to FIG. 9B.
  • the diffusion layer 600 may be formed on the top surface of the light emitting diode bare chip 110.
  • the molding layer 300 includes a diffusion agent 610 that diffuses light emitted from the light emitting diode bare chip 110.
  • the configuration is illustrated.
  • the diffusion agent 610 may be included in the molding layer 300, and SiO 2, TiO 2, or the like may be used to effectively diffuse light emitted from the light emitting diode bare chip 110.
  • the diffusing agent 610 may also improve the characteristics of the display module such as a viewing angle by diffusing the light emitted from the light emitting diode bare chip 110.
  • FIG. 10 illustrates a cross-sectional view of the display module including the molding layer 300 in which the lens structure 310 according to the exemplary embodiment of the present invention is formed.
  • FIG. 10 (a) illustrates a case where one convex lens structure 310a is formed on the molding layer 300
  • FIG. 10 (b) illustrates an upper portion of the molding layer 300
  • FIG. 10C illustrates a case in which two convex lens structures 310b are formed
  • FIG. 10C illustrates a case in which one concave lens structure 310c is formed on the molding layer 300.
  • the lens structure 310 may improve light emission characteristics of the display module by refracting light emitted from the light emitting diode bare chip 110.
  • the lens structure 310 may be configured to be integrated with the molding layer 300, and further, a separate lens structure may be formed on the molding layer 300. It is also possible to configure the form to which 310 is attached.
  • FIG. 11 illustrates a cross-sectional view of a display module including a molding layer 300 in which a diffusion structure 320 is formed through surface treatment according to an embodiment of the present invention.
  • FIG. 9 a structure in which light emitted from the light emitting diode bare chip 110 is diffused using the diffusion layer 600 or the diffusion agent 610 configured separately is illustrated in FIG. 10, but the molding layer 300 is illustrated in FIG. 10.
  • the structure of forming the diffusion structure 320 on the upper part of the molding layer 300 by surface treatment for the top of the) is illustrated.
  • the molding layer 300 may effectively diffuse light emitted from the light emitting diode bare chip 110 when the average surface roughness Ra has a surface roughness of 0.01 or more. .
  • the molding layer 300 may have a complex structure in which both the lens structure 310 and the diffusion structure 320 are provided. Accordingly, as shown in FIG. 11C, the molding layer 300 may include a diffusion structure 320c formed on the surface of the lens, and thus the light emitting diode bare chip 110 may be provided. At the same time, the light emitted from the light may be refracted and diffused to improve light emission characteristics of the display module.
  • FIG. 12 illustrates a cross-sectional view of a display module having a structure in which the light shielding layer 500 according to an embodiment of the present invention replaces the sun shade 220.
  • the sunshade 220 is not provided according to the light emitting characteristics of the light emitting diode bare chip 110, the size of the light blocking layer 500, and the standard according to the environment of use of the display module. If not, the light shielding layer 500 may replace the function of the sunshade 220.
  • the sunshade 220 Is not provided, and the light shielding layer 500 suppresses reflection of light applied from the outside, and blocks the light of a portion of the light emitted from the light emitting diode bare chip 110. It can replace the function of.
  • FIGS. 13A and 13B illustrate photographs showing the waterproof effect of the display module according to an exemplary embodiment of the present invention.
  • FIG. 13A (a) shows a sample photograph of a display module according to an embodiment of the present invention
  • FIG. 13A (b) shows a display module according to an embodiment of the present invention mounted on an experimental jig. The shape is illustrated.
  • the molding layer 300 seamlessly molds the entire light emitting diode bare chip 110 and the sunshade 220.
  • the inflow of contaminants such as moisture and foreign matters from the outside can be blocked, and furthermore, even when used in an environment such as underwater or rainfall, water penetrates into the molding layer 300 to allow the light emitting diode bare chip. 110 can be effectively blocked so as not to deteriorate.
  • the display module according to the exemplary embodiment of the present invention was able to operate without problems even in an environment such as underwater or rainfall.
  • the display module according to an embodiment of the present invention may not only be used in an environment such as underwater or rainfall, but also effectively prevents contamination or deterioration due to an external environment, thereby improving stability and lifespan of the display module. do.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne un module d'affichage et un procédé de fabrication associé et, plus particulièrement, un module d'affichage et un procédé de fabrication associé, le module d'affichage étant fabriqué par montage direct d'une pluralité de puces de support de diode électroluminescente sur un substrat de module portant des motifs de circuit formés sur ce dernier et par moulage d'une seule pièce de toutes les puces de support de diode électroluminescente sur le substrat de module, le module d'affichage étant de plus fabriqué par montage direct de la pluralité de puces de support de diode électroluminescente sur le substrat de module comportant un pare-soleil et par moulage complet de la pluralité de puces de support de diode électroluminescente et du pare-soleil. La présente invention fournit un procédé de fabrication de dispositif d'affichage selon lequel le module d'affichage est formé par une formation du substrat de module comportant le pare-soleil, par un montage des puces de support de diode électroluminescente sur le substrat de module comportant le pare-soleil, et par un moulage complet de la pluralité de puces de support de diode électroluminescente et du pare-soleil, et permettant ainsi de fabriquer efficacement un module d'affichage à haute résolution et, de plus, d'empêcher efficacement une augmentation de coût d'un processus de fabrication tel qu'une technologie de montage en surface (SMT) du fait de la fabrication du module d'affichage à haute résolution, et une contamination par un environnement externe.
PCT/KR2017/014501 2016-12-12 2017-12-12 Module d'affichage et procédé de fabrication associé WO2018110926A1 (fr)

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KR20210140886A (ko) 2020-05-14 2021-11-23 삼성전자주식회사 디스플레이 모듈 및 디스플레이 모듈의 제조 방법
US20220149246A1 (en) * 2020-11-12 2022-05-12 Seoul Semiconductor Co., Ltd. Light emitting module and method of manufacturing the same and display apparatus having the same

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JP2006221067A (ja) * 2005-02-14 2006-08-24 Idec Corp 表示デバイス
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