WO2018108500A1 - Mechatronic component having a circuit board and method for producing said mechatronic component - Google Patents

Mechatronic component having a circuit board and method for producing said mechatronic component Download PDF

Info

Publication number
WO2018108500A1
WO2018108500A1 PCT/EP2017/080480 EP2017080480W WO2018108500A1 WO 2018108500 A1 WO2018108500 A1 WO 2018108500A1 EP 2017080480 W EP2017080480 W EP 2017080480W WO 2018108500 A1 WO2018108500 A1 WO 2018108500A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
electronic component
printed circuit
component
mechatronic
Prior art date
Application number
PCT/EP2017/080480
Other languages
German (de)
French (fr)
Inventor
Dominik Zacharias
Simon Porscha
Jens Heinrich
Thomas Schmidt
Bernhard Schuch
Original Assignee
Conti Temic Microelectronic Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic Gmbh filed Critical Conti Temic Microelectronic Gmbh
Publication of WO2018108500A1 publication Critical patent/WO2018108500A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads

Definitions

  • the invention enters a mechatronic component with a printed circuit board which has at least one first flat side on which a printed circuit is mounted and in which at least one electronic component is arranged on a second, opposite flat side, which has electrical connections to the first Lead the flat side of the printed circuit board.
  • the invention further relates to a method for producing an electrical connection of an electronic component with a printed circuit board.
  • Mechatronic components with a printed circuit board usually comprise a printed circuit board on which an integrated circuit is arranged and electronic components which are brought together on the printed circuit board to form an electrical circuit arrangement.
  • Such mechatronic components are used, for example, as control units in motor vehicles, for. B. used as a transmission control unit.
  • Through-printed circuit boards are often used in which electrical and / or electronic components are arranged on the underside of the printed circuit board, whose connection pins are passed through the printed circuit board and electrically contacted with the electrical circuit on the upper printed circuit board side. To the electrical contact between the connection pins of the
  • the electrical components usually have at least two contact terminals.
  • pressure sensors which usually have three contact pins, it is necessary that through the Plug PCB and solder on the back of the PCB.
  • the invention has for its object to improve a mechatronic device of the type mentioned and a method for producing a solder joint between the connection pins of the components and the circuit arrangement so that short circuits between the contact terminals of the electrical and / or electronic components are largely prevented.
  • the object is achieved according to the invention with a mechatronic
  • the electronic components referred to below are understood to mean both electronic and electrical components.
  • the electronic component has at least two electrical connection elements. Between the electronic component and the printed circuit board, an electrically non-conductive adhesive layer is arranged, which forms a tight connection between the printed circuit board and the electronic component.
  • the adhesive layer consists of an adhesive. Furthermore, it is possible that the adhesive layer consists of an adhesive film or an adhesive tape.
  • a further advantageous embodiment provides to use a gas sensor as the electronic component.
  • an adhesive, an adhesive film or an adhesive tape is applied in exact position around the push-through contacts of the printed circuit board in order to avoid electrical short circuits between the contact pins of the electronic components prior to placement and insertion.
  • adhesive film or tape is made.
  • This connection also ensures a sealing function against a sheath which can be fitted around the electronic components.
  • FIG. 1 shows a section through a mechatronic component.
  • the component shown in Figure 1 shows a circuit board 1, on the underside of an electronic component 3 is arranged.
  • it is a gas sensor with three connection pins, which form the connection elements, which are soldered to an attached to the top of the circuit board 1 electronic circuit.
  • an adhesive layer 2 is attached between the underside of the circuit board 1 and the electronic component 3, through which the connection pins are carried out ⁇ .
  • the openings on the circuit board 1 must have a larger diameter than the connection pins in order to pass through the connection pins unhindered during assembly can.
  • the adhesive layer 2 forms a cohesive connection between the connection pins and the underside of the printed circuit board 1. This avoids that solder, which can run along the connection pins in the region of the printed circuit board 1 during the soldering process, reaches the underside of the printed circuit board 1. Short circuits between the connection pins are thus reliably prevented.
  • the adhesive layer 2 may be an adhesive, an adhesive film or an adhesive tape.
  • the material used must be electrically non-conductive and adapted to both the thermal and the mechanical properties of the materials used for the printed circuit board 1 and the electronic components 3.
  • the adhesive layer 2 can also assume a sealing function with respect to enclosures which are attached to the mechatronic component.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

The invention relates to a mechatronic component, having a circuit board (1), which has at least one first flat side, on which a printed circuit is applied, and on which circuit board at least one electronic part (3) is arranged on a second, opposite flat side, which electronic component has electrical connection points that lead to the first flat side of the circuit board (1). The invention further relates to a method for establishing an electrical connection between an electronic part (3) and a circuit board (1). The electronic part (3) has at least two electrical connection elements, wherein an electrically non-conductive adhesive layer (2) is arranged between the electronic part (3) and the circuit board (1) and forms a tight connection between the circuit board (1) and the electronic part (3). The method for producing the electronic component, in which method an electronic part (3) is electrically connected to a circuit board (1), provides that, before the electronic part (3) is placed onto the circuit board (1) and connection elements of the electronic part (3) are stuck through openings in the circuit board (1), an electrically non-conductive adhesive layer (2) is applied to the circuit board (1), which is applied around the stick-through contacts of the circuit board (1) in a positionally accurate manner.

Description

Beschreibung description
Mechatronisches Bauelement mit einer Leiterplatte und Verfahren zu seiner Herstellung Mechatronic component with a printed circuit board and method for its production
Die Erfindung betritt ein mechatronisches Bauelement mit einer Leiterplatte, die wenigstens eine erste Flachseite aufweist, auf der eine gedruckte Schaltung angebracht ist und bei der auf einer zweiten, gegenüberliegenden Flachseite mindestens ein elekt- ronisches Bauteil angeordnet ist, welches elektrische Anschlüsse aufweist, die zur ersten Flachseite der Leiterplatte führen. The invention enters a mechatronic component with a printed circuit board which has at least one first flat side on which a printed circuit is mounted and in which at least one electronic component is arranged on a second, opposite flat side, which has electrical connections to the first Lead the flat side of the printed circuit board.
Die Erfindung betrifft ferner ein Verfahren zur Herstellung einer elektrischen Verbindung eines elektronischen Bauteils mit einer Leiterplatte. The invention further relates to a method for producing an electrical connection of an electronic component with a printed circuit board.
Mechatronische Bauelemente mit einer Leiterplatte umfassen üblicherweise eine Leiterplatte, auf der eine integrierte Schaltung angeordnet ist und elektronische Komponenten, die auf der Leiterplatte zu einer elektrischen Schaltungsanordnung zusammengeführt sind. Derartige mechatronische Bauelemente werden beispielsweise als Steuergeräte in Kraftfahrzeugen, z. B. als Getriebesteuergerät, eingesetzt. Häufig werden dazu durchkontaktierte Leiterplatten verwendet, bei denen elekt- rische und/oder elektronische Komponenten auf der Unterseite der Leiterplatte angeordnet werden, deren Anschlusspins durch die Leiterplatte hindurchgeführt und mit der elektrischen Schaltung auf der oberen Leiterplattenseite elektrisch kontaktiert sind. Um den elektrischen Kontakt zwischen den Anschlusspins derMechatronic components with a printed circuit board usually comprise a printed circuit board on which an integrated circuit is arranged and electronic components which are brought together on the printed circuit board to form an electrical circuit arrangement. Such mechatronic components are used, for example, as control units in motor vehicles, for. B. used as a transmission control unit. Through-printed circuit boards are often used in which electrical and / or electronic components are arranged on the underside of the printed circuit board, whose connection pins are passed through the printed circuit board and electrically contacted with the electrical circuit on the upper printed circuit board side. To the electrical contact between the connection pins of the
Komponenten und der Schaltungsanordnung herzustellen, werden diese verlötet. Components and the circuit arrangement, these are soldered.
Die elektrischen Komponenten haben in der Regel mindestens zwei Kontaktanschlüsse. Beispielsweise bei Drucksensoren, die in der Regel drei Kontaktpins haben, ist es notwendig, diese durch die Leiterplatte zu stecken und auf der Rückseite an die Leiterplatte anzulöten . The electrical components usually have at least two contact terminals. For example, in pressure sensors, which usually have three contact pins, it is necessary that through the Plug PCB and solder on the back of the PCB.
Beim Lötprozess besteht die Gefahr, dass zwischen den Kon- taktanschlüssen Kurzschlüsse entstehen. During the soldering process there is a risk of short circuits between the contact terminals.
Der Erfindung liegt die Aufgabe zugrunde, ein mechatronisches Bauelement der eingangs genannten Art und ein Verfahren zur Herstellung einer Lötverbindung zwischen den Anschlusspins der Komponenten und der Schaltungsanordnung so zu verbessern, dass Kurzschlüsse zwischen den Kontaktanschlüssen der elektrischen und/oder elektronischen Komponenten weitestgehend verhindert werden . Die Aufgabe wird erfindungsgemäß mit einem mechatronischenThe invention has for its object to improve a mechatronic device of the type mentioned and a method for producing a solder joint between the connection pins of the components and the circuit arrangement so that short circuits between the contact terminals of the electrical and / or electronic components are largely prevented. The object is achieved according to the invention with a mechatronic
Bauelement gelöst, welches die im Anspruch 1 genannten Merkmale aufweist sowie mit einem Verfahren, welches die im Anspruch 6 angegebenen Merkmale aufweist. Vorteilhafte Ausgestaltungen sind Gegenstand der Unteran¬ sprüche . Component solved, which has the features mentioned in claim 1 and with a method having the features specified in claim 6. Advantageous embodiments are the subject of Unteran ¬ claims.
Unter den im Folgenden elektronische Bauteile genannten Bauteilen sollen sowohl elektronische als auch elektrische Bauteile verstanden werden.  The electronic components referred to below are understood to mean both electronic and electrical components.
Das elektronische Bauteil weist mindestens zwei elektrische Anschlusselemente auf. Zwischen dem elektronischen Bauteil und der Leiterplatte ist eine elektrisch nichtleitende Klebschicht angeordnet, die eine dichte Verbindung zwischen Leiterplatte und elektronischem Bauteil bildet. The electronic component has at least two electrical connection elements. Between the electronic component and the printed circuit board, an electrically non-conductive adhesive layer is arranged, which forms a tight connection between the printed circuit board and the electronic component.
Eine vorteilhafte Ausgestaltung sieht vor, dass die Klebeschicht aus einem Klebstoff besteht. Ferner ist es möglich, dass die Klebeschicht aus einer Klebefolie oder einem Klebeband besteht. An advantageous embodiment provides that the adhesive layer consists of an adhesive. Furthermore, it is possible that the adhesive layer consists of an adhesive film or an adhesive tape.
Eine weitere vorteilhafte Ausgestaltung sieht vor, als elektronisches Bauteil einen Gassensor zu verwenden. A further advantageous embodiment provides to use a gas sensor as the electronic component.
Bei dem Verfahren zur Herstellung einer elektrischen Verbindung eines elektronischen Bauteils mit einer Leiterplatte wird zur Vermeidung elektrischer Kurzschlüsse zwischen den Kontaktpins der elektronischen Bauelemente vor dem Aufsetzen und Durchstecken ein Klebstoff, eine Klebefolie oder ein Klebeband positionsgenau um die Durchsteckkontakte der Leiterplatte appliziert. Beim Aufsetzen wird eine Stoffschlüssige Verbindung zwischen dem elektronischen Bauteil und der Leiterplatte mittels Klebstoff, Klebefolie oder Klebeband hergestellt. In the method for producing an electrical connection of an electronic component to a printed circuit board, an adhesive, an adhesive film or an adhesive tape is applied in exact position around the push-through contacts of the printed circuit board in order to avoid electrical short circuits between the contact pins of the electronic components prior to placement and insertion. When placing a cohesive connection between the electronic component and the circuit board by means of adhesive, adhesive film or tape is made.
Diese Verbindung gewährleistet auch eine Abdichtfunktion gegenüber einer Umhüllung, die um die elektronischen Bauteile angebracht werden kann. This connection also ensures a sealing function against a sheath which can be fitted around the electronic components.
Die Erfindung wird im Folgenden anhand eines Ausführungsbei¬ spiels näher erläutert. In der zugehörigen Zeichnung zeigt: The invention will be explained in more detail below with reference to a Ausführungsbei ¬ game. In the accompanying drawing shows:
Figur 1 einen Schnitt durch ein mechatronisches Bauelement. 1 shows a section through a mechatronic component.
Das in Figur 1 dargestellte Bauelement zeigt eine Leiterplatte 1, an deren Unterseite ein elektronisches Bauteil 3 angeordnet ist. Im dargestellten Fall handelt es sich um einen Gassensor mit drei Anschlusspins, welche die Anschlusselemente bilden, die mit einer auf der Oberseite der Leiterplatte 1 angebrachten elektronischen Schaltung verlötet sind. Zwischen der Unterseite der Leiterplatte 1 und dem elektronischen Bauteil 3 ist eine Klebschicht 2 angebracht durch welche die Anschlusspins hin¬ durchgeführt sind. Die Durchbrüche an der Leiterplatte 1 müssen einen größeren Durchmesser als die Anschlusspins aufweisen, um die Anschlusspins bei der Montage ungehindert durchstecken zu können. Die Klebschicht 2 bildet eine Stoffschlüssige Verbindung zwischen den Anschlusspins und der Unterseite der Leiterplatte 1. Dadurch wird vermieden, dass Lötzinn, welches beim Lötprozess an den Anschlusspins im Bereich der Leiterplatte 1 entlang laufen kann, an die Unterseite der Leiterplatte 1 gelangt. Kurzschlüsse zwischen den Anschlusspins werden damit sicher verhindert. The component shown in Figure 1 shows a circuit board 1, on the underside of an electronic component 3 is arranged. In the illustrated case, it is a gas sensor with three connection pins, which form the connection elements, which are soldered to an attached to the top of the circuit board 1 electronic circuit. Between the underside of the circuit board 1 and the electronic component 3, an adhesive layer 2 is attached through which the connection pins are carried out ¬ . The openings on the circuit board 1 must have a larger diameter than the connection pins in order to pass through the connection pins unhindered during assembly can. The adhesive layer 2 forms a cohesive connection between the connection pins and the underside of the printed circuit board 1. This avoids that solder, which can run along the connection pins in the region of the printed circuit board 1 during the soldering process, reaches the underside of the printed circuit board 1. Short circuits between the connection pins are thus reliably prevented.
Die Klebschicht 2 kann ein Klebstoff, eine Klebefolie oder ein Klebeband sein. Das verwendete Material muss elektrisch nicht leitend sein und sowohl an die thermischen als auch die mechanischen Eigenschaften der für die Leiterplatte 1 und die elektronischen Bauteile 3 verwendeten Materialien angepasst sein . The adhesive layer 2 may be an adhesive, an adhesive film or an adhesive tape. The material used must be electrically non-conductive and adapted to both the thermal and the mechanical properties of the materials used for the printed circuit board 1 and the electronic components 3.
Die Klebschicht 2 kann auch eine Abdichtfunktion gegenüber Umhüllungen, die auf das mechatronische Bauelement angebracht werden, übernehmen. The adhesive layer 2 can also assume a sealing function with respect to enclosures which are attached to the mechatronic component.
Bezugs zeichenliste Reference sign list
Leiterplatte circuit board
Klebschicht  adhesive layer
elektronisches Bauteil  electronic component

Claims

Patentansprüche claims
1. Mechatronisches Bauelement mit einer Leiterplatte (1), die wenigstens eine erste Flachseite aufweist, auf welcher eine gedruckte Schaltung angebracht ist und bei der auf einer zweiten, gegenüberliegenden Flachseite mindestens ein elektronisches Bauteil (3) angeordnet ist, welches elektrische Anschlüsse aufweist, die zur ersten Flachseite der Leiterplatte (1) führen, dadurch gekennzeichnet, dass das elektronische Bauteil (3) mindestens zwei elektrische1. mechatronic component with a printed circuit board (1) having at least a first flat side on which a printed circuit is mounted and in which on a second, opposite flat side at least one electronic component (3) is arranged, which has electrical connections, the lead to the first flat side of the printed circuit board (1), characterized in that the electronic component (3) at least two electrical
Anschlusselemente aufweist und zwischen dem elektronischen Bauteil (3) und der Leiterplatte (1) eine elektrisch nichtleitende Klebschicht (2) angeordnet ist, die eine dichte Verbindung zwischen Leiterplatte (1) und elektro- nischem Bauteil (3) bildet. Connecting elements and between the electronic component (3) and the circuit board (1) an electrically non-conductive adhesive layer (2) is arranged, which forms a tight connection between the printed circuit board (1) and electronic component (3).
2. Mechatronisches Bauelement nach Anspruch 1, dadurch ge¬ kennzeichnet, dass die Klebschicht (2) aus einem Klebstoff besteht . 2. Mechatronic component according to claim 1, characterized ge ¬ indicates that the adhesive layer (2) consists of an adhesive.
3. Mechatronisches Bauelement nach Anspruch 1, dadurch ge¬ kennzeichnet, dass die Klebschicht (2) aus einer Klebefolie oder einem Klebeband besteht. 3. Mechatronic component according to claim 1, characterized ge ¬ indicates that the adhesive layer (2) consists of an adhesive film or an adhesive tape.
4. Mechatronisches Bauelement nach einem der vorhergehenden Ansprüche 1, dadurch gekennzeichnet, dass das elektronische Bauteil (3) ein Gassensor ist. 4. Mechatronic component according to one of the preceding claims 1, characterized in that the electronic component (3) is a gas sensor.
5. Mechatronisches Bauelement nach einem der vorhergehenden Ansprüche 1, dadurch gekennzeichnet, dass das elektronische5. Mechatronic component according to one of the preceding claims 1, characterized in that the electronic
Bauteil (3) mit einer Umhüllung aus einem duroplastischen Kunststoff versehen ist. Component (3) is provided with a sheath made of a thermosetting plastic.
6. Verfahren zur Herstellung des elektronischen Bauelements, wobei eine elektrischen Verbindung eines elektronischen6. A method for producing the electronic component, wherein an electrical connection of an electronic
Bauteils (3) mit einer Leiterplatte (1) erfolgt, dadurch gekennzeichnet, dass vor dem Aufsetzen des elektronischen Bauteils (3) auf die Leiterplatte (1) und dem Durchstecken von Anschlusselementen des elektronischen Bauteils (3) durch Durchbrüchen in der Leiterplatte (1) eine elektri nichtleitende Klebschicht (2) auf die Leiterplatte ( 1 ) aufgebracht wird, die positionsgenau um die Durch¬ steckkontakte der Leiterplatte (1) appliziert ist. Component (3) with a printed circuit board (1), characterized in that prior to placement of the electronic component (3) on the circuit board (1) and the insertion of connecting elements of the electronic component (3) by breakthroughs in the printed circuit board (1) an electrically non-conductive adhesive layer (2) on the circuit board (1) is applied, the positionally accurate to the ¬ plug contacts of the circuit board (1) is applied.
PCT/EP2017/080480 2016-12-14 2017-11-27 Mechatronic component having a circuit board and method for producing said mechatronic component WO2018108500A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016224964.9 2016-12-14
DE102016224964.9A DE102016224964A1 (en) 2016-12-14 2016-12-14 Mechatronic component with a printed circuit board and method for its production

Publications (1)

Publication Number Publication Date
WO2018108500A1 true WO2018108500A1 (en) 2018-06-21

Family

ID=60937674

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2017/080480 WO2018108500A1 (en) 2016-12-14 2017-11-27 Mechatronic component having a circuit board and method for producing said mechatronic component

Country Status (2)

Country Link
DE (1) DE102016224964A1 (en)
WO (1) WO2018108500A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1983810A2 (en) * 2007-04-20 2008-10-22 Delphi Technologies, Inc. Method for mounting leaded component to substrate
US20090142942A1 (en) * 2005-12-27 2009-06-04 Eric Ochs Electrical device having a lubricated joint and a method for lubricating such a joint
DE102011085170A1 (en) * 2011-10-25 2013-04-25 Robert Bosch Gmbh Control module for automatic transmission control of e.g. passenger car, has electronic package, circuit board and support plate mechanically connected with each other, where rigid portion of circuit board is glued with support plate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090142942A1 (en) * 2005-12-27 2009-06-04 Eric Ochs Electrical device having a lubricated joint and a method for lubricating such a joint
EP1983810A2 (en) * 2007-04-20 2008-10-22 Delphi Technologies, Inc. Method for mounting leaded component to substrate
DE102011085170A1 (en) * 2011-10-25 2013-04-25 Robert Bosch Gmbh Control module for automatic transmission control of e.g. passenger car, has electronic package, circuit board and support plate mechanically connected with each other, where rigid portion of circuit board is glued with support plate

Also Published As

Publication number Publication date
DE102016224964A1 (en) 2018-06-14

Similar Documents

Publication Publication Date Title
DE102007006706A1 (en) Circuit arrangement with connecting device and manufacturing method thereof
DE2822245A1 (en) PROCESS FOR PRODUCING ELECTRICALLY CONDUCTIVE CONNECTIONS BETWEEN PRINTED BACK PANEL WIRING OF CIRCUIT BOARDS AND SPRING BARS AS WELL AS SUITABLE SPRING BARS FOR THIS PROCESS
EP2592914B1 (en) Clamping element
DE102012020477A1 (en) Printed circuit and electronic device with the printed circuit
EP2198484B1 (en) Electric circuit arrangement having an mid circuit mount and a connection interface connected thereto
DE10126655A1 (en) Circuit board for electronic equipment, has electronic component on first surface with first and second contact surfaces connected by solder or adhesive to first and second contact points with access to track
WO2006013145A1 (en) Printed circuit board with smd components and at least one wired component and a method for picking fixing and electrical contacting of said components
WO2016037716A1 (en) Method for solderless electrical press-in contacting of electrically conductive press-in pins in circuit boards
WO2013010525A1 (en) Connector and method for the production thereof
DE102013202898B4 (en) Sensor component for a pressure sensor
WO2018108500A1 (en) Mechatronic component having a circuit board and method for producing said mechatronic component
DE112015003374T5 (en) circuitry
DE102012213804A1 (en) Stress minimizing electrical feedthrough
WO2009135756A1 (en) Sealed plug connection
DE202015008007U1 (en) Printed circuit board assembly
WO2016000909A1 (en) Circuit-board connecting element
DE10138458A1 (en) Electrical circuit with strip-shaped conductors
DE102007017707B3 (en) Miniaturized printed circuit board shield plate arrangement for plug part or socket part of contactless working plug and socket connector, has fastening guides pairly bent out from plate that is suspended on projections by mechanical fusing
EP2906030A1 (en) Electronic assembly with electrically conductive connection
WO2008058782A1 (en) Electronic circuit arrangement having at least one flexible printed circuit, and method for connecting it to a second circuit
WO2018224232A1 (en) Assembly for supporting an integrated circuit carrier
DE102017209278A1 (en) Electronic component and method for producing an electronic component
DE102007036775A1 (en) Plug connector arrangement for control device of motor vehicle, has printed circuit board and connector pins that are attached to board, where arrangement is designed as two-part arrangement
WO2015110658A1 (en) Vehicle antennas having a flexible substrate as the antenna support
EP1897427A1 (en) Electrically conductive, mechanically flexible connection between electrical or electronic components

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17825748

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17825748

Country of ref document: EP

Kind code of ref document: A1