DE102011085170A1 - Control module for automatic transmission control of e.g. passenger car, has electronic package, circuit board and support plate mechanically connected with each other, where rigid portion of circuit board is glued with support plate - Google Patents

Abstract

The module (10) has an electronic package (16), a circuit board (14) i.e. rigid-flexible printed circuit board (PCB), and a support plate (12) mechanically connected with each other. The electronic package stands in thermal contact with the support plate. A rigid portion of the circuit board is glued with the support plate. A double-side adhesive film (18) is provided for adhering the circuit board and support plate. The circuit board has an aperture (20) in which the electronic package is arranged so that the electronic package is located in direct thermal contact with the support plate. The electronic package comprises an integrated transmission control unit.

Description

FIELD OF THE INVENTION

The invention relates to a control module, preferably for a transmission control of an automatic transmission.

BACKGROUND OF THE INVENTION

Control modules for transmission controls may include, but are not limited to, control electronics, power electronics, discrete components such as sensors, and at least one connector for connection to the vehicle wiring harness. The control modules are partially installed under transmission oil and can be exposed to high temperatures in the gearbox. In order to protect the sensitive electronics against the aggressive transmission oil (ATF), the electronics are usually housed in a sealed electronic module.

In this case, for example, a control electronics can be accommodated in a hermetically sealed control unit housing. The contacting with peripheral components can then take place via a stamped grid and with cable connections. In this case, the electronic component can be fastened to the stamped grid by means of laser welding. Also, the contacting via a flex foil, i. via a flexible printed circuit board, which is mounted on a support plate, which can serve to dissipate the heat generated in the electronic component.

SUMMARY OF THE INVENTION

It is an object of the invention to provide a cost and installation-friendly control module.

This object is solved by the subject matter of the independent claims. Further embodiments of the invention will become apparent from the dependent claims and from the following description.

One aspect of the invention relates to a control module or control device for a vehicle.

According to one embodiment of the invention, the control module comprises a carrier plate, a printed circuit board or PCB and an electronic component. The electronic component, the printed circuit board and the carrier plate are mechanically connected to one another such that the electronic component is in thermal contact with the carrier plate. Next, a rigid portion of the circuit board is glued to the carrier plate. In this way, a stable and vibration-proof connection between the carrier plate and circuit board can be created in a simple manner without holes or holes for rivets or screws in the carrier plate and / or the circuit board are necessary. Also can be simplified in this way, the installation of the control module.

The circuit board may be a completely rigid circuit board glued to the support plate. The circuit board can therefore be glued to the carrier plate. When using a rigid circuit board, no or only low tooling costs are incurred compared to a stamped grid. In addition, the pattern creation time can be significantly reduced because printed circuit boards are available very quickly in series quality. Changes can be implemented very quickly, since no elaborate punching and / or overmoulding tools have to be changed. This results in a reduction of development costs and development time. The use of a rigid circuit board instead of a flex foil can also result in a cost advantage.

The electronic component or an electronics housing can be a cuboidal body, for example a plastic body, in which electronic components are cast. For example, the electronic device may include an iTCU (Integral Transmission Control Unit), i. comprise an integrated transmission control unit.

The electronic module may include, for example, a control electronics, a memory and / or power electronics.

The circuit board may have openings (pads), can be inserted through the contact elements (pins) of the electronic module and soldered to the circuit board. Components of the control module, such as the electronic module, a sensor with pins, a plug contact, wire clips, male connectors / punched grid can be attached by means of through-pins and by soldering on the circuit board. In addition, the contact elements can also be glued to the circuit board.

The electrical contacting of the circuit board with the electronic module can be done with a soldering process.

Since the electronic component can be soldered to the circuit board before bonding the circuit board to the carrier plate, the soldering process can be simplified. The assembly of the electronic module on the circuit board can be done in a standard soldering, since only the circuit board to be soldered components and no other module parts such as the support plate must be introduced into the soldering. When Tiegelöten heat is "sucked" by surrounding metal parts, which can significantly increase the quality of the soldering and simplify the soldering tools.

In the transmission control module also a sensor and a plug contact can be integrated, which are for example also attached to the support plate and / or the circuit board.

According to one embodiment of the invention, the control module comprises a double-sided adhesive film for bonding the printed circuit board and the carrier plate. For the adhesive bond, for example, it is proposed to apply the adhesive with an adhesive film. This may be, for example, a double-sided adhesive acrylic adhesive film.

According to one embodiment of the invention, the printed circuit board comprises a rigid and a flexible portion. The circuit board may also be glued to the flexible portion with the carrier plate. In this way, the flexible portion, which can serve to match the circuit board to the support plate, are fixed to the support plate.

According to one embodiment of the invention, the printed circuit board comprises a through opening in which the electronic component is arranged, so that the electronic component is in direct thermal contact with the carrier plate. The heat from the electronic module can thus be derived directly into the carrier plate. This also opens up the possibility of directly adhering the electronic component to the carrier plate with a thermally highly conductive adhesive.

According to one embodiment of the invention, the carrier plate comprises a thermally highly conductive material and is designed to dissipate heat from the electronic component. The entire support plate may consist of a thermally highly conductive material, such as a metal such as aluminum. The carrier plate may be a sheet or a composite of plastic and sheet metal. The (aluminum) carrier plate can represent a heat sink for the electronic component. As a result, the power loss of the electronic module can be increased and cheaper components can be used in the electronic module.

According to one embodiment of the invention, the support plate comprises a recess in which the electronic component is arranged. The recess can be made for example by punching or deformation of a sheet.

According to one embodiment of the invention, the electronic component is received between the carrier plate and the printed circuit board and thereby protected from both sides.

According to one embodiment of the invention, the electronic component is glued to the carrier plate, for example with a particularly good heat-conducting adhesive. An additional mechanical fixation can be omitted.

According to one embodiment of the invention, the electronic component is pressed with a spring against the carrier plate. Also in this way a good thermal connection between the electronic component and the carrier plate can be produced.

According to one embodiment of the invention, the carrier plate on a through opening (for example, a bore or a recess) for receiving at least one projecting from the circuit board electrical contact. Through this recess in the support plate, which can be used for soldering the electrical contact to the circuit board, a recess can be formed on the opposite side of the electronic component of the support plate. This recess can be closed to protect against chips from the gearbox by means of a simple cover or potting. This eliminates complex components and there are cost advantages and quality improvement. The through opening in the circuit board may be closed with a cover or with a potting material.

According to one embodiment of the invention, the carrier plate has a depression (a bead or a deformed or dented section) for receiving at least one electrical contact point projecting from the printed circuit board. The pad may include the electrical contact and solder for connecting the electrical contact to the circuit board.

The recess can serve to protect the direct solder joint from metal chips as suspended matter in the transmission oil. A separate component, such as a chip protection cover is not necessary. With chip protection, it is possible to prevent metal chips from generating a short circuit at the contact elements (pins) and the solder joints in the control module.

Since the carrier plate with the recesses must have no openings, the heat dissipation from the electronics module in the carrier plate can be made over the entire surface. The waste heat from the electronic module can be carried over the full cross-section of the metal plate for cooling oil flow towards or to screw-on points or to cooling surfaces in the transmission. The carrier plate can serve for heat distribution, as a heat buffer and as a cooling surface for the control module.

According to one embodiment of the invention, an electrical contact point for connecting the electronic component to the printed circuit board comprises an electrical contact (for example a pin), which is guided through an opening in the circuit board and which surrounds the circuit board U-shaped. This facilitates the fixing of the electronic module to the circuit board before soldering. In addition, the electrical contact is not as far from the PCB as not bent pin.

According to one embodiment of the invention, electrical contact points for connecting the electronic component to the printed circuit board between the printed circuit board and the electronic component are covered with a chip protection. Again, this can serve to protect against short circuits between the pads by metal chips from the transmission. The chip protection may comprise a chip protection film, a lid and / or a potting material.

According to one embodiment of the invention, the printed circuit board is connected to the carrier plate with a first adhesive bond and the electronic component is connected to the carrier plate with a second adhesive bond. Both components can be glued together with two different types of adhesive or adhesive film. The second adhesive bond may have a higher thermal conductivity than the first adhesive bond. Thus, on the one hand a good heat dissipation from the electronic module can be performed in the support plate and on the other hand, the solder joints are particularly well sealed, as various adhesives that are particularly well optimized for the task can be used.

Embodiments of the invention will now be described in detail with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE FIGURES

1 shows a control module according to an embodiment of the invention schematically in cross section.

2 shows a control module according to an embodiment of the invention schematically in cross section.

3 shows a control module according to an embodiment of the invention schematically in cross section.

4 shows a control module according to an embodiment of the invention schematically in cross section.

5 shows a composite of a printed circuit board and an electronic module for a control module according to an embodiment of the invention schematically in cross section.

6 shows a support plate for a control module according to an embodiment of the invention schematically in cross section.

7 shows a support plate for a control module according to an embodiment of the invention schematically in cross section.

8th shows a control module according to an embodiment of the invention schematically in cross section.

9 shows a control module according to an embodiment of the invention schematically in cross section.

10 shows a support plate for a control module according to an embodiment of the invention schematically in plan view.

11 shows a support plate for a control module according to an embodiment of the invention schematically in plan view.

12 shows a section of a control module according to an embodiment of the invention schematically in cross section.

13 shows a section of a control module according to an embodiment of the invention schematically in cross section.

14 shows a section of a control module according to an embodiment of the invention schematically in cross section.

Basically, identical or similar parts are provided with the same reference numerals.

DETAILED DESCRIPTION OF EMBODIMENTS

The 1 shows a control module 10 for the transmission control of a vehicle, which is a flat carrier plate 12 , a flat circuit board 14 and a cuboidal electronic module 16 includes. The control module 10 can be located in an automatic transmission of a road vehicle, such as a car or truck, and there are in contact with the transmission oil in the transmission.

The basis of the module is the single or multi-part carrier plate 12 , On the carrier plate is the circuit board 14 as a conductor carrier with an adhesive 18 glued. The circuit board 14 may be a completely rigid circuit board, but may also include flexible elements. For the glue 18 for mounting the circuit board 14 it can be a double-sided adhesive film 18 act. Alternatively, the adhesive may be 18 a fluid system act on what is dispensed by dispensing or printing.

The carrier plate 12 and the circuit board 14 are arranged substantially parallel to each other. The circuit board 14 has an opening 20 for receiving the electronic module 16 on. The electronic module 16 is located with its the carrier plate 12 facing side substantially at the same height as the side of the circuit board 14 that with the support plate 12 is glued.

With the same glue 18 or the same adhesive film 18 can also be the electronic component 16 on the carrier plate 12 be glued. Inside the electronic module 16 , which can be a molded plastic body no, can become electronic components 22 on a circuit carrier 24 for controlling and / or regulating engine or transmission states. The electrical signals and currents from the electronic module 16 be via a bond connection 26 on electrical contacts 28 , For example, a stamped grid or contact pins, given to the outside. The electrical contacts 28 are with the circuit board 14 electrically connected, for example via a solder joint 30 with pads 31 ,

To protect the circuit carrier 24 can the electronic module 16 be designed media-tight. In this case, the electronic module 16 be made of plastic. It is also a metal case 16 for packaging or wrapping the components 22 . 24 . 26 possible.

On the carrier plate 12 can except the electronic module 16 and the circuit board 14 be attached to other components. This may be, for example, a connector housing 32 and a sensor housing 34 act. The connector housing 32 can a plug head 36 Include contacts that have an electrical contact 38 analogous to the electrical contacts 28 to the circuit board 14 are soldered. The sensor housing 34 that has an integrated connector 40 with the carrier plate 12 can be connected, can be a sensor 42 and an electrical contact 44 include, analogous to the electrical contacts 28 with the circuit board 14 connected is.

The electrical contact 28 . 38 . 44 the module components 16 . 32 . 34 can be done by a soldering or welding process. For this purpose, the carrier plate 12 at the contact points 48 be omitted for the Kontaktierprozess, ie through openings 46 , for example, punched out 46 , include. To the contact points 48 To protect against metallic chips and thus short-circuits can be the contact area 46 or the opening 46 through a lid 50 be covered. Alternatively or in addition to this cover 50 can also be a potting compound here 52 used as chip protection.

The 2 shows a control module 10a in which the electronic component 16 as an alternative to the adhesive 18 with a spring 54 on the carrier plate 12 is pressed to a good thermal transition from the electronic component 16 to the carrier plate 12 to obtain. The carrier plate 12 and the circuit board 14 are still with the adhesive 18 bonded. The feather 54 is a leaf spring 54 passing through openings 56 in the circuit board 14 between the circuit board 14 and the carrier plate 12 intervenes. The leaf spring 54 can the electronic module 16 cover.

The 3 shows a control module 10b , which is a carrier plate 12 with a depression 58 for receiving the electronic module 16 having. The depression 58 Can be made by machining or by a forming process. Also in this variant of the electronic component 16 with a spring 54 against the carrier plate 12 be pressed. The feather 54 , which is for example a coil spring, can through an opening 60 in the circuit board 14 into the depression 58 to lead. At the control module 10b can the contact points 48 the carrier plate 12 be arranged opposite. Here is the glue joint 18 outside the electrical contacts 28 respectively.

The 4 shows a control module 10c analogous to the control module 10b in which the electronic component 16 to the inside of the recess 58 with glue 18 is glued.

The 5 shows a composite of a printed circuit board 14 and an electronic module 16 , The electronic module 16 (For example, in mold technology) is doing with its contact elements 28 or pins 28 in the pads 31 the circuit board 14 plugged. The circuit board 14 may be a single or multi-layer printed circuit board or HDI circuit board. The pins 28 can be aligned and centered over a plastic frame and chambered against each other by walls as known in the connector strips.

The pins 28 can sections 62 parallel to the PCB 14 exhibit. The sections 62 can on the circuit board 14 abut or run away from this. The circuit board 14 is below the electronic module 16 cut out and has an opening 20 for direct contact of the electronic module 16 to the carrier plate 12 on.

At the point of contact of the sections 62 to the surface of the circuit board 14 can be glue 18 be applied to the circuit board 14 and the electronic module 16 for the subsequent operations (further assembly, soldering) to fix together. This fixation can also be done by that both parts are fixed to each other before soldering by the workpiece carrier or the soldering frame.

Both components 14 . 16 (and possibly other assembled parts) can be soldered together by selective soldering (crucible, mini-wave, wave soldering) or through-hole-reflow soldering. Through-hole reflow soldering becomes solder 30 imprinted by paste and the holes 31 in the circuit board 14 covered by it. The pins 28 then pierce through this layer of paste on joining. The reflow oven is then soldered. Selective soldering becomes solder 30 brought over a crucible or a wave to the solder joint and wets there pin 28 and pad 31 ,

The 6 shows a carrier plate 12 made of sheet metal, such as an aluminum sheet, the beads 64 or depressions 64 for receiving the contact points 48 having. The carrier plate 12 of the 6 is in the area of soldering or contact point 48 closed, but with an embossing (beading) 64 formed at a distance from the metallic soldering points. As additional protection, the metal plate 12 in the bead area a lacquer layer 66 get that electrically isolated.

The 7 shows a carrier plate 12 with a tin area 68 and a plastic area 70 , The carrier plate 12 For example, a plastic plate 70 with one in the area of the electronic module 16 Inlaid / injected metal plate 68 be, which serves for heat absorption and forwarding.

The 8th shows a control module 10d made of a composite of a printed circuit board 14 and an electronic module 16 analogous to 5 and a carrier plate 12 analogous to the 6 and 7 is composed. A paragraph 68 of the electronic module 16 lies on the circuit board 14 on. At the contact point of the housing sales 68 to the surface of the circuit board 14 can be glue 18 be upset.

After selectively soldering the composite from the electronic component 16 and the circuit board 14 , the composite is on the carrier plate 12 glued. This may be a first adhesive bond 18a outside the wells 64 and a second adhesive bond 18b between the wells 64 are located. The adhesive connection 18b can be a thermally conductive adhesive bond between electronic component 16 and support plate 12 be. As an adhesive connection 18a . 18b a double-sided adhesive tape or an applied adhesive can be used. If the adhesive bond 18a from circuit board 14 to support plate 12 the same strength as the adhesive bond 18b between electronic module 16 and support plate 12 , can the electronic module 16 and the circuit board 14 be flush on its side facing the carrier plate. Otherwise, a corresponding forward or backward of the electronic module 16 be provided in the mounting device.

Outside the beads 64 (from the electronic module 16 considered from) can be a circumferential adhesive bond 18a lie, which can be as wide as possible in order to achieve a secure tightness. The bottom of the electronic module can be on the carrier plate 12 be glued over the entire surface. The solder joints 48 can also be tight (with respect to the top and bottom of the circuit board 14 ), so that the solder joints 48 hermetically encapsulated.

If no oil-tight adhesive bond 18a is reached, could oil in the one bead 64 collect. For this case, a bead 64 be deliberately perforated at one or more places to allow oil exchange. The corresponding hole 70 can be chosen so small that no chips in the bead 64 can penetrate.

The carrier plate / sheet metal plate 12 can be where no pads 31 on the bottom of the circuit board 14 lie an Austanzung 72 to reduce weight.

The pins 28 on the support plate 12 opposite side of the circuit board 14 can also be protected against chips. For this purpose, on this area a lid 74 be put on, the complete electronic module 16 with his pins 28 covering, or individual lids 74 that has a plurality of pins 28 cover. This area can also be glued over and thus protected by glued chip protection films. Also, a viscous mass 76 on the pin area 28 be applied, which hardens.

The 9 shows another control module 10e with further possibilities for gluing the components 12 . 14 . 16 ,

With a continuous adhesive connection 18c can the electronic module 16 and the circuit board 14 simultaneously with the carrier plate 12 be glued.

The adhesive connection 18a . 18c between circuit board 14 and support plate 12 can be gear oil and / or temperature resistant. The particularly good thermal conductivity adhesive connection 18b in this case can not be gear oil resistant.

Also an additional glue connection 18d for connecting the electronic module 16 with the circuit board 14 exceptionally good thermally conductive adhesive compound 18b but inside the beads 64 is possible.

The adhesive connection 18b the electronic component preferably ensures a very good heat conduction from the bottom of the electronic module 16 to the carrier plate 12 , Because common temperature resistant thermal adhesive / films are not gear oil resistant and gear oil resistant adhesives usually. have a poor thermal conductivity can be glued in a cascade: the majority of the bottom of the electronic module 16 (and / or the counter surface on the support plate 12 ) is full surface with thermal adhesive 18b or a double-sided adhesive film 18b Mistake. Around this area becomes an adhesive bead 18c . 18d closed around, which is gear oil-resistant (possibly also a double-sided adhesive tape ring 18c . 18d ). This is the thermal adhesive 18b Protected from outside against gear oil.

If more digits on the circuit board 14 On the underside can heat up, here also occasionally thermal adhesive 18b surrounded by gear oil-resistant adhesive 18a . 18c . 18d be used.

The 10 shows a carrier plate 12 with openings 46 in plan view. In the openings 46 are also shown potted solder joints, ie the potting compound 52 as well as pins 28 ,

The carrier plate 12 is under the pins 28 of the electronic module 16 stamped out so that the soldering pots penetrate and the circuit board 14 can wet. This leaves webs 78 in the carrier plate 12 between the openings 46 , through which the heat can be further distributed radially. The heat flow over the bars 78 from the hot spot in the middle of the carrier plate 12 to the edge is in the 10 represented by arrows.

With very narrow bars, heat accumulation or poor heat dissipation may occur. It does not become the full cross section of the carrier plate 12 used. In this case, thermal bridges in the form of a lid 50 or as potting compound 52 on or in the openings 46 be applied (thermally conductive and dense). That is the potting compound 52 or the lid 50 can be designed to conduct heat.

The 11 shows a carrier plate 12 with depressions 64 or beads 64 in plan view. The beads 64 can remove the solder joint from the space on the other side of the backing plate 12 complete completely.

Per connection row of the electronic component 16 is either a separate bead 64 attached or all contact rows are in a circumferential bead 64 (about the electronic module 16 around). If the beads 64 merge into each other, the support plate has an immediate bead 64 on.

The heat dissipation in the carrier plate 12 with the beads 64 can from the hot spot in the middle over the whole area around the electronic component 16 around by the material of the carrier plate 12 done as in the 11 indicated by arrows.

Since the soldering before sticking the support plate 12 can take place, no heat sink during soldering. In addition, there are no bottlenecks (webs) in relation to the heat conduction. Next offer the beads 64 a full chip protection.

As an alternative to selective soldering, reflow soldering or thermode soldering, hot air soldering, etc. can also be performed using surface-mount technology.

The 12 shows a section of a control module 10f before soldering. The 13 shows the excerpt from the 12 after soldering.

The pins 28 be in pads 31 (Holes) and the horizontal sections 62 the pins are on the solder paste 80 provided printed circuit board 14 on (typical surface mount technique). The solder paste 80 can on both sides of the pads 31 on the circuit board 14 be upset. In the pad 31 can a soldering sleeve 82 be arranged. The solder paste 80 can a pad 84 or country 84 next to the pad 31 on the circuit board 14 cover.

The pins 28 be in the horizontal area 62 fully on the circuit board 14 pressed. This can be the section 62 include a slightly resilient area. On the other side of the circuit board 14 the pins go to the PCB 14 bent over. The pins 28 grip the PCB then U-shaped.

This ensures before soldering that the pins 28 safe in the solder paste 80 before melting through a thermode, hot air, laser beam or reflow oven. As the electronic module 16 up to 150 pins 28 These may be due to the large size of the electronic package and the stiff pins 28 usually not safe by thermodes or other hold-down over the entire surface of the circuit board 14 be pressed.

The theme goes up again before the solder solidifies, ie the pin 28 can spring away from the circuit board and the solder joint 48 may be defective. The bent pins 28 ensure safe soldering.

The solder paste depot 80 on the other side (exit side of the pin 28 ) can be designed so that the pad 31 or the sleeve 82 completely by capillary action with solder 30 can fill to a tight solder joint 48 to obtain and necessary because of life solder-filled sleeve 82 , The pin 28 can about the lot 30 in and around the pad 31 or the sleeve 82 with the circuit board 14 be mechanically connected and over the solder joint of the section 62 with the country 84 electrically with the circuit board 14 be connected.

The 14 shows a further section of a control module 10g , It can also be a rigid flex PCB as a circuit board 14 used to allow a printed circuit board-Ebensprung.

The carrier plate 12 has different levels due to the flexible section 86 the circuit board 14 can be compensated. The carrier plate 12 and the circuit board 14 can be in the range of rigid sections 88 the circuit board 14 and in the area of flexible sections 86 the circuit board 14 be glued or glued 18 exhibit.

By gluing the circuit board 14 with the carrier plate 12 becomes the milled surface 90 (to the carrier plate 12 oriented) protected against transmission oil attack and thus does not constitute a weak point.

In addition, it should be noted that "encompassing" does not exclude other elements or steps, and "a" or "an" does not exclude a multitude. It should also be appreciated that features or steps described with reference to any of the above embodiments may also be used in combination with other features or steps of other embodiments described above. Reference signs in the claims are not to be considered as limiting.

Claims (12)

Control module ( 10 ) for a vehicle, the control module comprising: a carrier plate ( 12 ), a printed circuit board ( 14 ), an electronic component ( 16 ), whereby the electronic component ( 16 ), the printed circuit board ( 14 ) and the carrier plate ( 12 ) are mechanically connected to each other, wherein the electronic component ( 16 ) with the carrier plate ( 12 ) is in thermal contact, characterized in that a rigid portion of the printed circuit board ( 14 ) with the carrier plate ( 12 ) is glued. Control module ( 10 ) according to claim 1, further comprising: a double-sided adhesive film ( 18 ) for gluing the printed circuit board ( 14 ) and the carrier plate ( 12 ). Control module ( 10g ) according to claim 1 or 2, wherein the printed circuit board ( 14 ) a rigid section ( 88 ) and a flexible section ( 86 ); the circuit board ( 14 ) with the flexible section ( 86 ) with the carrier plate ( 12 ) is glued. Control module ( 10 ) according to one of the preceding claims, wherein the printed circuit board ( 14 ) an opening ( 20 ), in which the electronic component ( 16 ) is arranged so that the electronic component ( 16 ) in direct thermal contact with the carrier plate ( 12 ) stands Control module ( 10 ) according to one of the preceding claims, wherein the carrier plate ( 12 ) comprises a thermally highly conductive material and is designed to dissipate heat from the electronic module. Control module ( 10b ) according to one of the preceding claims, wherein the carrier plate ( 12 ) a recess ( 58 ), in which the electronic component ( 16 ) is arranged; and / or wherein the electronic component ( 16 ) between the carrier plate ( 12 ) and the printed circuit board ( 16 ) is recorded. Control module ( 10b . 10c )) according to one of the preceding claims, wherein the electronic component ( 16 ) with the carrier plate ( 12 ) is glued and / or wherein the electronic component ( 16 ) with a spring ( 54 ) against the carrier plate ( 12 ) is pressed. Control module ( 10 ) according to one of the preceding claims, wherein the carrier plate ( 12 ) a through opening ( 46 ) for receiving at least one of the printed circuit board ( 14 ) projecting electrical contact point ( 48 ) having; the through opening ( 46 ) with a cover ( 50 ) and / or with a potting material ( 52 ) is closed. Control module ( 10d ) according to one of the preceding claims, wherein the carrier plate ( 12 ) a recess ( 64 ) for receiving at least one of the printed circuit board ( 14 ) projecting electrical contact point ( 48 ) having Control module ( 10f ) according to one of the preceding claims, wherein an electrical contact point ( 48 ) for connecting the electronic module ( 16 ) with the printed circuit board ( 48 ) an electric Contact ( 28 ) passing through an opening ( 31 ) in the printed circuit board ( 14 ) and the printed circuit board ( 14 ) U-shaped embraces. Control module ( 10d ) according to one of the preceding claims, wherein electrical contact points ( 48 ) for connecting the electronic module ( 16 ) with the printed circuit board ( 14 ) between the printed circuit board ( 14 ) and the electronic component ( 16 ) with a chip protection ( 74 . 76 ) are covered; wherein the chip protection a chip protection film, a lid ( 74 ) and / or a potting material ( 76 ). Control module ( 10e ) according to one of the preceding claims, wherein the printed circuit board ( 14 ) with a first adhesive bond ( 18a ) with the carrier plate ( 12 ) and the electronic component ( 16 ) with a second adhesive bond ( 18b ) with the carrier plate ( 12 ) connected is; wherein the second adhesive bond ( 18b ) has a higher thermal conductivity than the first adhesive bond ( 18a ).

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