WO2018107958A1 - 一种增强型焊柱制备装置及制备方法 - Google Patents

一种增强型焊柱制备装置及制备方法 Download PDF

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Publication number
WO2018107958A1
WO2018107958A1 PCT/CN2017/113266 CN2017113266W WO2018107958A1 WO 2018107958 A1 WO2018107958 A1 WO 2018107958A1 CN 2017113266 W CN2017113266 W CN 2017113266W WO 2018107958 A1 WO2018107958 A1 WO 2018107958A1
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wire
welding
welding wire
solder
copper strip
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PCT/CN2017/113266
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English (en)
French (fr)
Inventor
黄颖卓
林鹏荣
练滨浩
王勇
姚全斌
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北京微电子技术研究所
北京时代民芯科技有限公司
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Publication of WO2018107958A1 publication Critical patent/WO2018107958A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0205—Non-consumable electrodes; C-electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • B23K35/402—Non-consumable electrodes; C-electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies

Definitions

  • the invention relates to an enhanced welding column preparation device and a preparation method thereof, and belongs to the field of ceramic electronic component packaging.
  • Ceramic ball grid array package as a package of ball grid array package has the advantages of high interconnect density, high air tightness, good moisture resistance and high reliability.
  • Ceramic column grid array package is the development and improvement of ceramic ball grid array package. Replacing the ball grid with a column grid greatly increases the thermal fatigue problem caused by the thermal expansion mismatch between the alumina ceramic shell and the epoxy printed circuit board, thereby improving the reliability of assembly.
  • the ceramic pillar grid array package is resistant to high temperatures, high voltages, and high reliability for large sizes and high densities.
  • the pillars used in ceramic column grid array packages mainly include 90Pb10Sn conventional solder columns and reinforced solder columns.
  • the enhanced solder columns are due to their solder columns.
  • Material properties, compared to conventional solder columns Higher package reliability and product usability.
  • the reinforced column is a composite structure compared with the 90Pb10Sn conventional column.
  • the reinforced copper wire is wound on the surface of the solder column and 63Sn37Pb is immersed to enhance the strength of the column itself. It is more difficult to prepare.
  • the problem solved by the technology of the present invention is to overcome the deficiencies of the prior art and provide an enhanced solder column preparation device and a preparation method.
  • an enhanced welding column preparation device comprising a wire feeding mechanism, a copper tape winding mechanism, a copper tape dip welding mechanism, and a wire leveling cutting mechanism;
  • the wire feeding mechanism is configured to convey a straight welding wire to the copper tape winding mechanism; the copper tape winding mechanism spirally winds the copper tape at a certain angle on the surface of the conveyed wire; the copper tape dip welding mechanism infiltrates the surface of the wire wound around the copper tape Layer soldering, the copper strip and the welding wire are tightly welded together to obtain a reinforced welding wire, and transmitted to the wire cutting mechanism; the wire screed cutting mechanism first flattens the reinforced welding wire, and then cuts the welding wire according to the required length, and obtains more Root enhanced solder column.
  • the wire feeding mechanism includes a wire conveying structure and a first wire leveling structure
  • the wire conveying structure comprises a rotating screw and a bracket for fixing the rotating screw, and the welding wire is placed on the rotating screw;
  • the first welding wire leveling structure comprises a plurality of sets of rollers, and the plurality of sets of rollers are symmetrically located on the upper and lower sides of the welding wire, and are closely clamped and clamped with the welding wire, and the welding wire can be pre-leveled from the upper and lower surfaces, and the welding wire is transmitted outward.
  • the copper tape winding mechanism includes a limiting hole and a sleeve, a copper belt conveying structure and a spiral winding structure;
  • the sleeve is located in the limiting hole, and the sleeve and the limiting hole cooperate to precisely level the welding wire conveyed by the welding wire feeding mechanism;
  • the spiral wound structure can be rotated 360° along the welding wire under the driving of the motor, and the copper belt conveying structure is fixed on the spiral winding structure.
  • the copper belt conveying structure comprises a pair of rollers for clamping the copper belt and transmitting the copper belt
  • the wire is wound around the wire under the rotation of the spiral wound structure.
  • the copper strip dip soldering mechanism includes a flux wetting structure and a solder infiltration structure
  • the flux wetting structure includes a first groove, a first roller set and a heating stage, the first groove is for placing a flux, and a through hole is formed on the sidewall of the first groove above the flux;
  • the roller set is located in the first groove, and the welding wire can pass through the through hole into the first roller set, the first roller set ensures that the welding wire can be completely wetted in the flux, and the heating stage is used for the flux in the first groove Heating to ensure that the flux can flow and have adhesion;
  • the solder wetting structure includes a second groove, a second roller set, a heater and a temperature control system, the second groove is for placing the solder, and a through hole is formed on the sidewall of the second groove above the solder;
  • the two roller sets are located in the second groove, and the welding wire can pass through the through hole into the second roller set, the second roller set ensures that the welding wire can be completely wetted in the solder; the heater completely melts the solder in the second groove
  • the temperature control system maintains the temperature in the second groove within an appropriate temperature range.
  • the wire leveling and cutting mechanism comprises a second wire leveling structure and a wire cutting structure
  • the second welding wire leveling structure comprises a plurality of sets of rollers, and the plurality of sets of rollers are symmetrically located on the upper and lower sides of the reinforced welding wire, and are closely clamped and clamped with the reinforced welding wire for enhancing the upper and lower surfaces.
  • the wire is pre-leveled and transported outward;
  • the wire cutting structure comprises a blade set and a pneumatic motor, the blade set comprises two blades, the spacing of the two blades is the same as the length to be cut, the cutting direction of the two blades is perpendicular to the wire conveying direction; the air motor is connected to the external compressed air The air motor pushes the blade group outward under the action of compressed air to realize the cutting of the welding wire.
  • the method for preparing an enhanced solder column by using the preparation device comprises the following steps:
  • the copper strip dip soldering mechanism is heated by the heating stage and the heater.
  • the heating temperature of the control heating stage is 80 ° C to 150 ° C, and the heating temperature of the heater is 230 ° C to 250 ° C.
  • step (4) the motor in the copper wire winding mechanism is controlled to start by controlling the wire feeding mechanism and the wire leveling and cutting mechanism.
  • the present invention has the following beneficial effects:
  • the device of the invention has simple operation and high degree of automation, and can realize batch preparation of the enhanced welding column.
  • the wire feeding mechanism can straighten the wire with high crimping degree by wire flattening, so that the surface of the wire is zero-damaged, which is beneficial to the subsequent copper tape winding and dip soldering process.
  • the copper strip winding mechanism can spirally wrap the copper strip around the surface of the welding wire at a certain angle. During the winding process, the surface of the welding wire is less damaged, and the winding angle is consistent. After the winding, the gap between the copper strip and the surface of the welding wire is less than 50 ⁇ m, which effectively protects the subsequent copper strip. The quality of the weld.
  • the copper strip dip soldering mechanism can dip the surface of the welding wire and the copper strip with a layer of solder, and form a good soldering between the copper strip and the surface of the welding wire.
  • the void ratio in the welding wire can be less than 1%, and the thickness of the soldering solder is The accuracy is better than ⁇ 20 ⁇ m;
  • the wire cutting mechanism pushes the blade to cut the reinforced wire by the air motor, and the reinforced wire can be automatically cut into a plurality of fixed length welding columns, the length consistency is better than ⁇ 20 ⁇ m, the roundness of the welding column is good and the shape is good. .
  • Figure 1 is a schematic view of an enhanced solder column preparation device
  • Figure 2 is a schematic view of the welding wire supply mechanism
  • Figure 3 is a schematic view of a copper tape winding mechanism
  • Figure 4 is a schematic view of a copper strip dip soldering mechanism
  • Figure 5 is a schematic view of the wire leveling and cutting mechanism.
  • the invention provides an enhanced welding column preparation device, as shown in FIG. 1, comprising a wire feeding mechanism 1, a copper tape winding mechanism 2, a copper tape dip welding mechanism 3 and a wire leveling cutting mechanism 4.
  • the wire feeding mechanism 1 is for conveying a straight welding wire to the copper tape winding mechanism 2, as shown in Fig. 2, comprising a wire conveying structure 11 and a first wire leveling structure 12, the wire conveying structure 11 comprising a rotating screw and one for The holder of the rotating screw is fixed, and a coil of wire is placed on the rotating screw to adjust the wire feeding mechanism 1 to an appropriate height to ensure horizontal movement of the wire throughout the apparatus.
  • the first welding wire leveling structure 12 comprises a plurality of sets of rollers, and the plurality of sets of rollers are symmetrically located on the upper and lower sides of the welding wire, such as three sets of rollers, and three rollers on the upper and lower sides of the welding wire are tightly fitted and clamped with the welding wire, and the welding wire can be pre-prepared from the upper and lower surfaces. Leveling and conveying the wire outward.
  • the copper tape winding mechanism 2 spirally winds the copper tape at an angle on the surface of the conveyed wire. As shown in FIG. 3, the copper tape winding mechanism 2 includes a limiting hole 21 and a sleeve 22, a copper tape conveying structure 23, and a spiral winding structure 24.
  • the sleeve 22 is located in the limiting hole 21, and the sleeve 22 and the limiting hole 21 cooperate to precisely level the welding wire conveyed by the wire feeding mechanism 1.
  • the sleeve is made of a flexible material and is placed to damage the welding wire.
  • the outer diameter of the sleeve is the same as the inner diameter of the limiting hole, and the thickness of the sleeve is about 0.55 mm.
  • the spiral wound structure 24 is capable of 360° rotation along the wire under the driving of the motor, and the copper tape conveying structure 23 is fixed on the spiral winding structure 24, and the copper tape conveying structure 23 includes a pair of rollers for clamping the copper tape, and The copper strip is transferred to the wire at a speed, and the copper strip is wound around the wire under the rotation of the spiral wound structure 24.
  • the tilt angle of the copper strip can be adjusted by adjusting the angle between the copper strip transfer structure 23 and the spiral wound structure 24. Degree and the distance between the copper strips.
  • the invention cooperates with the precise cooperation of the various mechanisms, so that the copper strip is closely attached to the surface of the welding wire, and there is no gap of more than 50 ⁇ m between the copper strip and the welding wire, thereby ensuring the subsequent dip soldering effect of the copper strip.
  • the copper strip dip soldering mechanism 3 dipped a layer of solder on the surface of the wire wound around the copper strip, and the copper strip and the welding wire were tightly welded together to obtain a reinforced type welding wire, which was transferred to the wire cutting mechanism 4.
  • the copper strip dip soldering mechanism 3 includes a flux wetting structure 31 and a solder wetting structure 32.
  • the flux infiltrating structure 31 mainly passes the surface of the copper wire wound through the flux tank through the roller to uniformly apply a uniform flux to the surface.
  • the flux wetting structure 31 includes a first groove 311, a first roller set 312, and a heating stage 313 for placing a flux and processing on the sidewall of the first groove 311 above the flux.
  • the solder wetting structure 32 welds the flux coated wire.
  • the solder wetting structure 32 includes a second groove 321, a second roller set 322, a heater 323, and a temperature control system 324 for placing solder and a second groove 321 sidewall above the solder.
  • the through hole is processed; the second roller set 322 is located in the second groove 321 , and the welding wire can pass through the through hole into the second roller set 322 , and the second roller set 322 ensures that the welding wire can be completely wetted in the solder;
  • the 323 causes the solder in the second recess 321 to be completely melted, and the temperature control system 324 maintains the temperature in the second recess 321 within an appropriate temperature range. Between 230 ° C and 250 ° C, this temperature ensures solder melting while ensuring solder quality.
  • the wire leveling and cutting mechanism 4 first flattens the reinforced welding wire, and then cuts the wire according to the required length to obtain a plurality of reinforced welding columns.
  • the wire leveling and cutting mechanism 4 includes a second wire leveling structure 41 and a wire cutting structure 42.
  • the second wire leveling structure 41 includes a plurality of sets of rollers, and the plurality of sets of rollers are symmetrically located on the upper and lower sides of the reinforcing wire. It is tightly clamped with the reinforced wire for pre-leveling the reinforced wire from the upper and lower surfaces and conveying it outward.
  • the wire cutting structure 42 comprises a blade set and a pneumatic motor, the blade set comprises two blades, the spacing of the two blades is the same as the length to be cut, the cutting direction of the two blades is perpendicular to the wire conveying direction; the air motor is in communication with the external compressed air, The air motor pushes the blade group outward under the action of compressed air to cut the wire and form a section of the welding column.
  • the roller group involved in the device of the present invention can be connected to the controller, and the roller group can be controlled by the controller.
  • an 80Pb20Sn reinforced solder column which has an outer dimension of ⁇ 0.51 mm and a height of 2.2 mm; a chemical composition of lead content of 80% by weight and a tin content of 20% by weight.
  • Heating the copper strip dip soldering mechanism 3 setting the heating temperature to 80 ° C to 150 ° C on the heating stage of the flux infiltrating structure 31, and setting the heating temperature to 230 ° C to 250 on the heater of the solder infiltrating structure °C, wait for the actual temperature to reach the set temperature and stabilize for 10min;
  • the object of the present invention is to change the situation that the domestically unable to independently prepare the reinforced welding column, and provide an apparatus and method for preparing the reinforced welding column by wire flattening, copper tape winding, immersion tin and cutting.
  • the device and method The operation is simple, and the welding wire is automatically cut by the blade, which can ensure the prepared surface of the welding rod has a good surface state and flatness of the end surface.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

一种增强型焊柱制备装置，包括焊丝供给机构（1）、铜带缠绕机构（2）、铜带浸焊机构（3）和焊丝整平切断机构（4），利用焊丝供给机构（1）提供平直的焊丝，铜带缠绕机构（2）将一定厚度的铜带缠绕到焊丝上，经过铜带浸焊机构（3）将整个焊丝外表面浸锡，得到增强型焊丝，并传送给焊丝整平切断机构（4）进行整平后切断，得到多根增强型焊柱。还公开了一种增强型焊柱制备方法。本装置及方法操作简便，能保证制备的焊柱具有良好的表面状态和端面平整性。

Description

一种增强型焊柱制备装置及制备方法
本申请要求于2016年12月14日提交中国专利局、申请号为201611156361.0、发明名称为“一种增强型焊柱制备装置及制备方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及一种增强型焊柱制备装置及制备方法，属于陶瓷电子元器件封装领域。
背景技术
现代集成电路技术飞速发展，集成电路的小型化、高速化和高可靠性要求电子元器件向小型化和集成化转变，同时促使新的封装技术也随之不断出现和发展。陶瓷球栅阵列封装作为球栅阵列封装的一种封装形式具有互连密度高、气密性强、耐湿性能好和可靠性高等优点，陶瓷柱栅阵列封装是陶瓷球栅阵列封装的发展和改进，用柱栅取代球栅，大大环节了氧化铝陶瓷外壳与环氧树脂印制电路板之间由于热膨胀系不匹配带来的热疲劳问题，从而提高了组装的可靠性。陶瓷柱栅阵列封装具有耐高温、耐高压和高可靠的特性，适用于大尺寸和高密度的情况。因此在军事、航空和航天电子产品制造领域占有重要的地位。但焊柱的制备一直成为制约我国陶瓷柱栅阵列封装的关键因素，陶瓷柱栅阵列封装所用焊柱主要有90Pb10Sn常规焊柱和增强型焊柱两种，增强型焊柱由于其焊柱本身的材料属性，相比于常规焊柱其具 有更高的封装可靠性及产品的可使用性。从制备角度来讲，增强型焊柱与90Pb10Sn常规焊柱相比，增强型焊柱为复合性结构，通过焊锡柱表面铜带的缠绕和63Sn37Pb浸润，增强焊柱本身的强度，其结构更复杂，制备难度更高。
发明内容
本发明技术解决的问题是：克服现有技术的不足，提供一种增强型焊柱制备装置及制备方法。
本发明的技术解决方案是：一种增强型焊柱制备装置，包括焊丝供给机构、铜带缠绕机构、铜带浸焊机构和焊丝整平切断机构；
所述焊丝供给机构用于向铜带缠绕机构传送平直的焊丝；铜带缠绕机构在传送过来的焊丝表面以一定角度螺旋缠绕铜带；铜带浸焊机构在缠绕铜带的焊丝表面浸润一层焊锡，使铜带和焊丝紧密焊接在一起，得到增强型焊丝，并传送给焊丝切断机构；焊丝整平切断机构首先将增强型焊丝整平，然后按照要求的长度对焊丝进行切断，得到多根增强型焊柱。
所述焊丝供给机构包括焊丝传送结构和第一焊丝整平结构；
焊丝传送结构包括一个旋转螺杆和一个用于固定旋转螺杆的支架，旋转螺杆上放置成卷的焊丝；
第一焊丝整平结构包括多组滚轮，多组滚轮对称地位于焊丝上下两侧，与焊丝紧密贴合夹紧，可从上下表面将焊丝进行预整平，并将焊丝向外传送。
所述铜带缠绕机构包括限位孔及套管、铜带传送结构和螺旋缠绕 结构；
套管位于限位孔中，套管和限位孔配合用于将焊丝供给机构传送过来的焊丝进行精密整平；
螺旋缠绕结构在电机的带动下能够沿焊丝进行360°旋转，铜带传送结构固定在螺旋缠绕结构上，铜带传送结构包含一对滚轮，该滚轮用于夹紧铜带，并将铜带传送给焊丝，在螺旋缠绕结构的旋转下将铜带缠绕在焊丝上。
所述铜带浸焊机构包括助焊剂浸润结构和焊料浸润结构；
助焊剂浸润结构包括第一凹槽、第一滚轮组和加热台，所述第一凹槽用于放置助焊剂，且在助焊剂上方的第一凹槽侧壁上加工有通孔；第一滚轮组位于第一凹槽中，焊丝能够穿过通孔进入第一滚轮组中，所述第一滚轮组保证焊丝能够完全浸润在助焊剂中，加热台用于将第一凹槽中助焊剂加热，保证助焊剂能够流动且具有粘附性；
焊料浸润结构包括第二凹槽、第二滚轮组、加热器和温控系统，所述第二凹槽用于放置焊料，且在焊料上方的第二凹槽侧壁上加工有通孔；第二滚轮组位于第二凹槽中，焊丝能够穿过通孔进入第二滚轮组中，所述第二滚轮组保证焊丝能够完全浸润在焊料中；加热器使第二凹槽内的焊料全部熔化，温控系统使第二凹槽内温度保持在适当温度范围内。
所述焊丝整平切断机构包括第二焊丝整平结构和焊丝切断结构；
第二焊丝整平结构包括多组滚轮，多组滚轮对称地位于增强型焊丝上下两侧，与增强型焊丝紧密贴合夹紧，用于从上下表面将增强型 焊丝进行预整平，并向外传送；
焊丝切断结构包括刀片组和气动马达，所述刀片组包括两个刀片，两个刀片的间距与要切断的长度相同，两个刀片的切断方向与焊丝传送方向垂直；气动马达与外部压缩空气连通，气动马达在压缩空气的作用下向外推动刀片组，实现对焊丝切断。
利用所述制备装置制备增强型焊柱的方法，包括如下步骤：
(1)将焊柱制备装置接通电源和气源，测试其电、气均连接正常；
(2)将成卷的焊丝放入焊丝供给机构中，将铜带放入铜带供给机构中，使用镊子将焊丝和铜带的端头穿入制备装置中，调整焊丝供给机构的高度，以保证焊丝水平；
(3)为铜带浸焊机构加热；
(4)控制焊丝供给机构、焊丝整平切断机构和铜带缠绕机构开始运行，使增强型焊柱制备装置开始工作，进行增强型焊柱的制备；
(5)将制备好的增强型焊柱进行筛选和清洗；
(6)制备完成后关闭电源和气源。
所述步骤(3)中，通过加热台和加热器为铜带浸焊机构加热。
通过加热台和加热器为铜带浸焊机构加热时，控制加热台的加热温度为80℃～150℃，加热器的加热温度为230℃～250℃。
当加热台和加热器达到加热温度后，稳定5min-30min。
所述步骤(4)中，通过控制焊丝供给机构和焊丝整平切断机构的滚轮、铜带缠绕机构中的电机开始运行。
与现有技术相比，本发明具有如下有益效果：
1、本发明装置操作简便，自动化程度高，可实现增强型焊柱的批量制备。
2、焊丝供给机构通过焊丝整平可将高卷曲度的焊丝平直化，使焊丝表面零损伤，利于后续铜带缠绕及浸焊过程。
3、铜带缠绕机构可将铜带以一定角度螺旋缠绕在焊丝表面，缠绕过程中焊丝表面损伤小，缠绕角度一致性好，缠绕后铜带与焊丝表面间隙小于50μm，有效保障后续铜带浸焊的质量。
4、铜带浸焊机构可将焊丝和铜带表面浸焊上一层焊料，并使铜带与焊丝表面形成良好焊接，通过控制温度，可使焊丝内空洞率小于1％，浸焊焊料厚度精度优于±20μm；
5、焊丝切断机构通过气动马达推动刀片对增强型焊丝进行切断，可将增强型焊丝自动切断成多根固定长度的焊柱，长度一致性优于±20μm，焊柱端头圆度和平整形良好。
附图说明
图1为增强型焊柱制备装置示意图；
图2为焊丝供给机构示意图；
图3为铜带缠绕机构示意图；
图4为铜带浸焊机构示意图；
图5为焊丝整平切断机构示意图。
具体实施方式
下面结合实施例对本发明作进一步详细的描述：
本发明提出一种增强型焊柱制备装置，如图1所示，包括焊丝供给机构1、铜带缠绕机构2、铜带浸焊机构3和焊丝整平切断机构4。
焊丝供给机构1用于向铜带缠绕机构2传送平直的焊丝，如图2所示，包括焊丝传送结构11和第一焊丝整平结构12，焊丝传送结构11包括一个旋转螺杆和一个用于固定旋转螺杆的支架，旋转螺杆上放置成卷的焊丝，将焊丝供给机构1调整到合适的高度，确保焊丝在整个装置中处于水平运动。第一焊丝整平结构12包括多组滚轮，多组滚轮对称地位于焊丝上下两侧如三组滚轮，焊丝上下各三个滚轮，与焊丝紧密贴合夹紧，可从上下表面将焊丝进行预整平，并将焊丝向外传送。
铜带缠绕机构2在传送过来的焊丝表面以一定角度螺旋缠绕铜带。如图3所示，铜带缠绕机构2包括限位孔21及套管22、铜带传送结构23和螺旋缠绕结构24。
套管22位于限位孔21中，套管22和限位孔21配合用于将焊丝供给机构1传送过来的焊丝进行精密整平。套管采用柔性材料制成，放置对焊丝造成损伤，套管的外径尺寸与限位孔的内径尺寸一致，套管厚度为0.55mm左右。
螺旋缠绕结构24在电机的带动下能够沿焊丝进行360°旋转，铜带传送结构23固定在螺旋缠绕结构24上，铜带传送结构23包含一对滚轮，该滚轮用于夹紧铜带，并以一定速度将铜带传送给焊丝，在螺旋缠绕结构24的旋转下将铜带缠绕在焊丝上。可通过调整铜带传送结构23与螺旋缠绕结构24之间的角度，调节铜带缠绕时的倾斜角 度和铜带缠绕的间距。本发明通过各机构的精密配合，使铜带紧密贴合在焊丝表面，铜带和焊丝间无50μm以上的间隙，保障后续铜带浸焊效果。
铜带浸焊机构3在缠绕铜带的焊丝表面浸润一层焊锡，使铜带和焊丝紧密焊接在一起，得到增强型焊丝，并传送给焊丝切断机构4。如图4所示，铜带浸焊机构3包括助焊剂浸润结构31和焊料浸润结构32。
助焊剂浸润结构31主要通过滚轮使表面缠绕铜带的焊丝匀速平稳通过助焊剂槽，使其表面涂敷上均匀的一层助焊剂。助焊剂浸润结构31包括第一凹槽311、第一滚轮组312和加热台313，所述第一凹槽311用于放置助焊剂，且在助焊剂上方的第一凹槽311侧壁上加工有通孔；第一滚轮组312位于第一凹槽311中，焊丝能够穿过通孔进入第一滚轮组312中，所述第一滚轮组312保证焊丝能够完全浸润在助焊剂中，加热台用于将第一凹槽311中助焊剂加热到适当温度，使助焊剂具有一定的流动性和粘附性。
焊料浸润结构32对涂敷好助焊剂的焊丝进行焊接。焊料浸润结构32包括第二凹槽321、第二滚轮组322、加热器323和温控系统324，所述第二凹槽321用于放置焊料，且在焊料上方的第二凹槽321侧壁上加工有通孔；第二滚轮组322位于第二凹槽321中，焊丝能够穿过通孔进入第二滚轮组322中，所述第二滚轮组322保证焊丝能够完全浸润在焊料中；加热器323使第二凹槽321内的焊料全部熔化，温控系统324使第二凹槽321内温度保持在适当温度范围内保持在 230℃～250℃之间，该温度能够保证焊料熔化，同时保证焊接质量。
焊丝整平切断机构4首先将增强型焊丝整平，然后按照要求的长度对焊丝进行切断，得到多根增强型焊柱。如图5所示，焊丝整平切断机构4包括第二焊丝整平结构41和焊丝切断结构42，第二焊丝整平结构41包括多组滚轮，多组滚轮对称地位于增强型焊丝上下两侧，与增强型焊丝紧密贴合夹紧，用于从上下表面将增强型焊丝进行预整平，并向外传送。焊丝切断结构42包括刀片组和气动马达，刀片组包括两个刀片，两个刀片的间距与要切断的长度相同，两个刀片的切断方向与焊丝传送方向垂直；气动马达与外部压缩空气连通，气动马达在压缩空气的作用下向外推动刀片组，实现对焊丝切断，形成一段一段的焊柱。
为了进一步提高本套装置的自动化程度，可以将本发明装置中涉及的滚轮组与控制器连接，通过控制器控制滚轮组工作。
以制备80Pb20Sn增强型焊柱为例，其外形尺寸为Ф0.51mm，高为2.2mm；化学成分中铅含量为80％wt，锡含量为20％wt。
具体实施步骤如下：
(1)将焊柱制备装置接通电源和气源，测试其电、气均连接正常；
(2)选用Ф0.53mm套管安放于限位孔中，选用刀片组进行焊丝切断，刀片组中两个刀片的距离为2.2mm；
(3)将成卷的80Pb20Sn焊丝放入焊丝供给机构中，将15μm厚纯铜带放入铜带供给机构中。使用镊子将焊丝和铜带的端头穿入整个机构中，保证焊丝的水平；
(4)为铜带浸焊机构3加热：在助焊剂浸润结构31的加热台上设定加热温度为80℃～150℃，在焊料浸润结构的加热器上设定加热温度为230℃～250℃，等待实际温度达到设定温度后稳定10min；
(5)控制焊丝供给机构1和焊丝整平切断机构4的滚轮、铜带缠绕机构2中的电机开始运行，使增强型焊柱制备装置开始工作，进行增强型焊柱的制备；
(6)将制备好的增强型焊柱进行筛选和清洗；
(7)关闭电源和气源。
本发明的目的在于改变目前国内无法自主制备增强型焊柱的情况，提供一种通过焊丝整平、铜带缠绕、浸锡和切断的方式制备增强型焊柱的装置及方法，该装置及方法操作简便，且通过刀片自动切断焊丝，能保证制备的焊柱具有良好的表面状态和端面平整性。
本发明说明书中未作详细描述的内容属于本领域专业技术人员的公知技术。

Claims (10)

  1. 一种增强型焊柱制备装置，其特征在于：包括焊丝供给机构(1)、铜带缠绕机构(2)、铜带浸焊机构(3)和焊丝整平切断机构(4)；
    所述焊丝供给机构(1)用于向铜带缠绕机构(2)传送平直的焊丝；铜带缠绕机构(2)在传送过来的焊丝表面以一定角度螺旋缠绕铜带；铜带浸焊机构(3)在缠绕铜带的焊丝表面浸润一层焊锡，使铜带和焊丝紧密焊接在一起，得到增强型焊丝，并传送给焊丝切断机构(4)；焊丝整平切断机构(4)首先将增强型焊丝整平，然后按照要求的长度对焊丝进行切断，得到多根增强型焊柱。
  2. 根据权利要求1所述的一种增强型焊柱制备装置，其特征在于：所述焊丝供给机构(1)包括焊丝传送结构(11)和第一焊丝整平结构(12)；
    焊丝传送结构(11)包括一个旋转螺杆和一个用于固定旋转螺杆的支架，旋转螺杆上放置成卷的焊丝；
    第一焊丝整平结构(12)包括多组滚轮，多组滚轮对称地位于焊丝上下两侧，与焊丝紧密贴合夹紧，从上下表面将焊丝进行预整平，并将焊丝向外传送。
  3. 根据权利要求1所述的一种增强型焊柱制备装置，其特征在于：所述铜带缠绕机构(2)包括限位孔(21)及套管(22)、铜带传送结构(23)和螺旋缠绕结构(24)；
    套管(22)位于限位孔(21)中，套管(22)和限位孔(21)配合用于将焊丝供给机构(1)传送过来的焊丝进行精密整平；
    螺旋缠绕结构(24)在电机的带动下能够沿焊丝进行360°旋转，铜带传送结构(23)固定在螺旋缠绕结构(24)上，铜带传送结构(23)包含一对滚轮，该滚轮用于夹紧铜带，并将铜带传送给焊丝，在螺旋缠绕结构(24)的旋转下将铜带缠绕在焊丝上。
  4. 根据权利要求1所述的一种增强型焊柱制备装置，其特征在于：所述铜带浸焊机构(3)包括助焊剂浸润结构(31)和焊料浸润结构(32)；
    助焊剂浸润结构(31)包括第一凹槽(311)、第一滚轮组(312)和加热台(313)，所述第一凹槽(311)用于放置助焊剂，且在助焊剂上方的第一凹槽(311)侧壁上加工有通孔；第一滚轮组(312)位于第一凹槽(311)中，焊丝能够穿过通孔进入第一滚轮组(312)中，所述第一滚轮组(312)保证焊丝能够完全浸润在助焊剂中，加热台(313)用于将第一凹槽(311)中助焊剂加热，保证助焊剂能够流动且具有粘附性；
    焊料浸润结构(32)包括第二凹槽(321)、第二滚轮组(322)、加热器(323)和温控系统(324)，所述第二凹槽(321)用于放置焊料，且在焊料上方的第二凹槽(321)侧壁上加工有通孔；第二滚轮组(322)位于第二凹槽(321)中，焊丝能够穿过通孔进入第二滚轮组(322)中，所述第二滚轮组(322)保证焊丝能够完全浸润在焊料中；加热器(323)使第二凹槽(321)内的焊料全部熔化，温控系统 (324)使第二凹槽(321)内温度保持在适当温度范围内。
  5. 根据权利要求4所述的一种增强型焊柱制备装置，其特征在于：所述焊丝整平切断机构(4)包括第二焊丝整平结构(41)和焊丝切断结构(42)；
    第二焊丝整平结构(41)包括多组滚轮，多组滚轮对称地位于增强型焊丝上下两侧，与增强型焊丝紧密贴合夹紧，用于从上下表面将增强型焊丝进行预整平，并向外传送；
    焊丝切断结构(42)包括刀片组和气动马达，所述刀片组包括两个刀片，两个刀片的间距与要切断的长度相同，两个刀片的切断方向与焊丝传送方向垂直；气动马达与外部压缩空气连通，气动马达在压缩空气的作用下向外推动刀片组，实现对焊丝切断。
  6. 利用权利要求1-5中任意一项所述制备装置制备增强型焊柱的方法，其特征在于包括如下步骤：
    (1)将焊柱制备装置接通电源和气源，测试其电、气均连接正常；
    (2)将成卷的焊丝放入焊丝供给机构中，将铜带放入铜带供给机构中，使用镊子将焊丝和铜带的端头穿入制备装置中，调整焊丝供给机构的高度，以保证焊丝水平；
    (3)为铜带浸焊机构(3)加热；
    (4)控制焊丝供给机构(1)、焊丝整平切断机构(4)和铜带缠绕机构(2)开始运行，使增强型焊柱制备装置开始工作，进行增强型焊柱的制备；
    (5)将制备好的增强型焊柱进行筛选和清洗；
    (6)制备完成后关闭电源和气源。
  7. 根据权利要求6所述制备增强型焊柱的方法，其特征在于：所述步骤(3)中，通过加热台(313)和加热器(323)为铜带浸焊机构(3)加热。
  8. 根据权利要求7所述制备增强型焊柱的方法，其特征在于：通过加热台(313)和加热器(323)为铜带浸焊机构(3)加热时，控制加热台(313)的加热温度为80℃～150℃，加热器(323)的加热温度为230℃～250℃。
  9. 根据权利要求8所述制备增强型焊柱的方法，其特征在于：当加热台(313)和加热器(323)达到加热温度后，稳定5min-30min。
  10. 根据权利要求6所述制备增强型焊柱的方法，其特征在于：所述步骤(4)中，通过控制焊丝供给机构(1)和焊丝整平切断机构(4)的滚轮、铜带缠绕机构(2)中的电机开始运行。
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