WO2018104109A1 - Verfahren zum reparieren von reflektiven optischen elementen für die euv-lithographie - Google Patents
Verfahren zum reparieren von reflektiven optischen elementen für die euv-lithographie Download PDFInfo
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- WO2018104109A1 WO2018104109A1 PCT/EP2017/080645 EP2017080645W WO2018104109A1 WO 2018104109 A1 WO2018104109 A1 WO 2018104109A1 EP 2017080645 W EP2017080645 W EP 2017080645W WO 2018104109 A1 WO2018104109 A1 WO 2018104109A1
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- coating
- cover
- damaged area
- reflective optical
- euv lithography
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
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- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
- G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
- G21K1/062—Devices having a multilayer structure
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K2201/00—Arrangements for handling radiation or particles
- G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
- G21K2201/061—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements characterised by a multilayer structure
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K2201/00—Arrangements for handling radiation or particles
- G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
- G21K2201/067—Construction details
Definitions
- the present invention relates to a method for repairing reflective optical elements for EUV lithography, comprising a substrate and a coating which reflects at an operating wavelength in the range between 5 nm and 20 nm. Further, it relates to a collector mirror for EUV lithography, which has a substrate and a coating which reflects at an operating wavelength in the range between 5 nm and 20 nm.
- EUV lithography devices for the lithography of semiconductor devices, reflective optical elements for the extreme ultraviolet (EUV) wavelength range (eg, wavelengths between about 5 nm and 20 nm), such as photomasks or mirrors based on multilayer systems for quasi-normal incidence or mirrors, are included metallic surface used for grazing incidence. Since EUV lithography devices in the extreme ultraviolet (EUV) wavelength range (eg, wavelengths between about 5 nm and 20 nm), such as photomasks or mirrors based on multilayer systems for quasi-normal incidence or mirrors, are included metallic surface used for grazing incidence. Since EUV lithography devices in the
- Contamination of the optically used coating of the reflective optical elements which arises due to the short-wave irradiation together with residual gases in the operating atmosphere can be reduced. Since a plurality of reflective optical elements are usually arranged one behind the other in an EUV lithography device, even smaller contaminations on each individual reflective optical element have a greater effect on the overall reflectivity.
- Contamination can occur, for example due to moisture residues.
- Water molecules are split by the EUV radiation and the resulting oxygen radicals oxidize the optically active surfaces of the reflective optical
- hydrocarbons Another source of contamination is hydrocarbons, which may originate, for example, from the vacuum pumps used in EUV lithography apparatuses or from residues of photoresists which are to be patterned on the
- Semiconductor substrates are used, and lead under the influence of the operating radiation to carbon contaminants on the reflective optical elements.
- Collector mirrors which are used in conjunction with a laser-based EUV plasma light source comes as an additional source of contamination, the material that a Plasma is excited, for example tin added. While oxidative contaminations are usually irreversible, in particular carbon contaminants and, where appropriate, tin can be removed, inter alia, by treatment with reactive hydrogen in that the reactive hydrogen reacts with it to form volatile compounds. Reactive hydrogen can be hydrogen radicals or ionized hydrogen atoms or molecules.
- Delamination is caused by the penetration of reactive hydrogen into the reflective coating, particularly mechanical or coating defects.
- the diffused reactive hydrogen can become molecular
- Reflection of the heat radiation in the direction of the beam path of the EUV lithography device can be damaged in particular the subsequent reflective optical elements.
- This object is achieved by a method for repairing reflective optical elements for EUV lithography, which has a substrate and a coating which reflects at a working wavelength in the range between 5 nm and 20 nm, with the steps:
- Coatings are coatings based on multilayer systems, which are particularly suitable for normal and quasi-normal incidence and are based on Bragg reflection, as well as coatings with only one or a few layers, which are suitable for grazing incidence and are based on total reflection ,
- the coating may contain additional layers such as u.a. Protective layer systems as a conclusion to the vacuum, polishing or smooth layers on the substrate or spectral filter layers for deflecting unwanted radiation wavelength ranges such as infrared radiation.
- Inspection systems are done, with which the surface of the coating is scanned.
- Hydrogen permeability a sufficiently durable repair damaged reflective optical element can be achieved with little time and monetary effort to maintain the operation of an EUV lithography device can.
- the cover can already be prepared for stock and, if a damaged spot is located during an inspection, are applied immediately or possibly adapted quickly to the surface shape in order to achieve the best possible coverage. This allows a very fast repair.
- a surface structure may contribute to reflecting unwanted radiation components, such as from the ultraviolet or infrared wavelength range, in a different direction than the radiation in the range of the working wavelength. This can also be with convex or concave
- cover units in the form of convex caps. They also have the advantage of being able to cover bubbles and spalling well.
- a coating corresponding to the reflective coating on the surface of the cover member may result in increased reflectivity in the range of working wavelength at the repaired location, ideally as high as at an undamaged location.
- the cover is attached by means of adhesive on the coating of the reflective optical element.
- the cover can be attached over the entire surface or by applying adhesive dots or partial surfaces or lines.
- Adhesives are preferably used which are resistant to heat and / or as little as possible outgassing in a vacuum.
- Other suitable ways to attach cover elements include u.a. Soldering, welding, in particular spot welding or wringing.
- the cover is formed as a film or cover unit.
- Cover unit has the advantage of greater mechanical stability and that it can be prefabricated.
- a film can be better ad hoc adapted to the damaged area to be repaired as well as the surface course of the coating in the area of the damaged area.
- the cover with angular and / or curved boundary
- the cover can have a round, square, polygonal or completely free form.
- the boundary is adapted to the shape of the damaged area.
- the cover has an ellipsoidal or elongated shape.
- a cover element which comprises one or more materials from the group comprising metal, steel, stainless steel, invar, aluminum, molybdenum, tantalum, niobium, silicon, titanium, zirconium, hafnium, scandium, yttrium, lanthanum, cerium, copper, silver, Gold, platinum, rhodium, palladium, ruthenium, glass, ceramics and alumina.
- metal steel, stainless steel, invar, aluminum, molybdenum, tantalum, niobium, silicon, titanium, zirconium, hafnium, scandium, yttrium, lanthanum, cerium, copper, silver, Gold, platinum, rhodium, palladium, ruthenium, glass, ceramics and alumina.
- a cover coating is applied to the damaged area.
- a cover coating is suitable for reducing the further delamination of the coating in the event of blistering.
- the cover coating is applied by tinning, gilding, electroplating, oxidizing, nitriding and / or deposition by means of atmospheric pressure plasma.
- the tinning and gilding can be done for example via metal melts or films.
- the above procedures have all been proven to apply to damaged areas of the coating of reflective optical elements material that covers the damaged area. Thus, an enlargement of the damaged area can be suppressed.
- the procedures can be combined to apply different layers to the damaged area.
- the application of a cover coating can be carried out manually or automatically with the aid of, for example, a robot arm.
- a metal layer comprising gold, platinum, rhodium, palladium, ruthenium, molybdenum, tantalum, niobium, silicon, titanium, zirconium, hafnium, aluminum, scandium, yttrium, lanthanum and / or cerium is applied as a cover coating by electroplating or by means of atmospheric pressure.
- Plasma has a cover coating comprising one or more of molybdenum, tantalum, niobium, silicon, titanium, zirconium,
- Coating materials of reflective optical elements offer good protection against reactive hydrogen.
- coating material is removed in its area before covering the damaged area.
- a cover or a cover coating can be better avoided by this pretreatment extending the damaged area over time. The strength and durability of the cover or the cover coating can be increased.
- a collector mirror for EUV lithography which has a substrate and a coating which reflects at a working wavelength in the range between 5 nm and 20 nm, wherein the coating locally has a cover element, wherein the cover element has a surface structure, a convex or concave surface or a coating corresponding to the coating of the collector mirror or a combination thereof.
- a surface structure can contribute to the fact that unwanted radiation components, for example from the infrared wavelength range, are reflected in a different direction than the radiation in the range of the operating wavelength. This can also be achieved with convex or concave surfaces. Particularly preferred are cover units in the form of convex caps. They also have the advantage that they can be well covered with bubbles and flaking and in particular reflect long-wave radiation such as infrared radiation in no preferred direction.
- Coating on the surface of the cover member may result in increased reflectivity in the range of operating wavelength at the repaired location, ideally as high as at an undamaged location.
- Covers are, for example, platelets or thin sheets.
- the cover is formed as a foil or cover unit.
- a cover unit has the advantage of greater mechanical stability and that it can be prefabricated.
- a film can be better ad hoc adapted to the damaged area to be repaired as well as the surface course of the coating in the area of the damaged area.
- the cover member comprises one or more of the group materials metal, steel, stainless steel, invar, aluminum, molybdenum, tantalum, niobium, silicon, titanium, zirconium, hafnium, scandium, yttrium, lanthanum, cerium, copper, silver, gold, platinum , Rhodium, palladium,
- the coating locally has a cover coating, in particular for sealing a damaged area.
- the cover coating comprises one or more of molybdenum, tantalum, niobium, silicon, titanium, zirconium, hafnium, aluminum, scandium, yttrium, lanthanum, cerium, their oxides, their nitrides, their carbides, their borides, gold , Platinum, rhodium, palladium, ruthenium, carbon, boron carbide and boron nitride.
- these materials adhere well to the usual coating materials of collector mirrors for EUV lithography and on the other hand offer good protection against reactive hydrogen.
- FIG. 1 schematically shows an embodiment of an EUV lithography apparatus with reflective optical elements
- Figure 2 schematically shows the structure of an exemplary reflective optical
- FIG. 3 schematically shows a reflective optical element for EUV lithography with different damaged areas
- FIG. 4 shows the reflective optical element from FIG. 3 after the
- Figure 5a shows schematically another reflective optical element which has been repaired by means of a cover element
- FIG. 5a is a diagrammatic representation of FIG. 5a.
- FIG. 1 schematically shows an EUV lithography device 10.
- Essential components are the illumination system 14, the photomask 17 and the
- the EUV lithography apparatus 10 is operated under vacuum conditions so that the EUV radiation is absorbed as little as possible in its interior.
- a plasma source or a synchrotron can serve as the radiation source 12.
- the example shown here is a plasma source.
- the emitted radiation in the wavelength range of about 5 nm to 20 nm is first from
- the illumination system 14 has two mirrors 15, 16.
- the mirrors 15, 16 direct the beam onto the photomask 17, which has the structure to be imaged on the wafer 21.
- the photomask 17 is also a reflective optical element for the EUV and soft X-ray wavelength range, which is replaced depending on the manufacturing process.
- the beam reflected by the photomask 17 is projected onto the wafer 21, thereby imaging the structure of the photomask onto it.
- the projection system 20 has two mirrors 18, 19. It should be noted that both the projection system 20 and the illumination system 14 may each have only one or even three, four, five or more mirrors.
- the collector mirror 13 is a quasi-normal incidence mirror 50, the coating 52 of which is on a multilayer system 54 based, as shown schematically in Figure 2.
- These are alternately applied layers of a higher refractive index real part at the operating wavelength at which, for example, the lithographic exposure is performed (also called spacer 57) and a lower refractive index material at the operating wavelength (also called absorber 56) ), wherein an absorber-spacer pair forms a stack 55. This somehow simulates a crystal whose
- Lattice planes correspond to the absorber layers, where Bragg reflection takes place.
- the thicknesses of the individual layers 57, 56 as well as the repeating stack 55 may be constant over the entire multilayer system 54 or may vary, depending on which spectral or angle-dependent reflection profile is to be achieved.
- Reflection profile can also be selectively influenced by the basic structure
- Absorber 56 and spacer 57 is supplemented by more more and less absorbent materials to increase the maximum possible reflectivity at the respective operating wavelength.
- absorber and / or spacer materials can be exchanged for one another or the stacks can be constructed from more than one absorber and / or spacer material.
- the absorber and spacer materials can have constant or varying thicknesses over all stacks in order to optimize the reflectivity.
- additional layers may also be provided as diffusion barriers between spacer and absorber layers 57, 56. For example, for one
- Working wavelength of 13.4 nm common material combination is molybdenum as absorber and silicon as a spacer material.
- a stack 55 usually has a thickness of 6.7 nm, wherein the spacer layer 57 is usually thicker than the absorber layer 56.
- the coating 52 also has a protective layer 53, which may also consist of more than one layer, and a spectral filter layer 58, which serves to radiation from unwanted wavelength ranges such as from the radiation source 12 also emitted ultraviolet radiation or infrared radiation with which the plasma of the radiation source 12 is excited to filter out of the beam path of the working radiation in the EUV wavelength range.
- the spectral filter layer 58 may, for example, have a diffraction grating structure. In many cases it is made of metal alloys,
- the protective layer 53 may be used, for example, in a molybdenum-silicon multilayer system, and the like. from one location
- Silicon nitride and a layer of ruthenium be constructed as a conclusion to the vacuum.
- the coating 52 is arranged on a substrate 51.
- Typical substrate materials for Reflective optical elements for EUV lithography, in particular collector mirrors are glass-ceramic, quartz glass, doped quartz glass, silicon, silicon carbide, silicon-infiltrated silicon carbide, copper, aluminum and their alloys.
- the collector mirror can also be designed as a mirror for grazing incidence.
- he may, for example, on a substrate made of a copper or aluminum alloy, a polishing layer of, inter alia, nickel-phosphorus or amorphous silicon and above a ruthenium layer as a coating.
- it may additionally have a spectral filter layer.
- this may also be structured to be, for example, ultraviolet or
- the radiation source can be a plasma radiation source, in which tin droplets are excited by means of CO 2 lasers to give a plasma which emits radiation in the EUV wavelength range.
- tin can penetrate into the EUV lithography device and in particular on the surface of the
- the tin contamination is negligible and, in particular, contamination based on oxygen or carbon can occur.
- the reflective optical elements of an EUV lithography device they are operated in vacuum with an admixture of hydrogen at a low partial pressure. Under the influence of the EUV radiation, reactive hydrogen forms from the molecular hydrogen in the form of
- Hydrogen radicals and hydrogen ions are converted by wall collisions to a large extent in hydrogen radicals.
- the reactive hydrogen together with the contaminants form volatile tin or carbon compounds which can be pumped out.
- Coating or at the border to the substrate can recombine.
- the conversion into molecular hydrogen leads to an increase in volume. Bubbles form beneath the surface resulting in localized delamination of some or all of the surface Can lead coating. Delaminated sites can have a high reflectivity in the infrared range. This is particularly problematic for collector mirrors when used in conjunction with a laser plasma radiation source from which not only EUV radiation but also infrared radiation leaks because of the laser. If too much infrared radiation is coupled into the further beam path, the
- FIG. 3 shows by way of example and schematically hydrogen-induced defects 63, 64, 65, 66 in a coating 62 of a reflective optical element 60 for EUV lithography, for example a collector mirror, on a substrate 61.
- Coating 62 may be constructed, for example, as previously explained in FIG. 2, in particular for normal or quasi-normal angles of incidence, or else as explained for grazing incidence.
- the coating 62 is not damaged all the way down to the substrate 61, but this can happen with all damaged areas.
- the defect 63 is a bubble caused by an accumulation of molecular hydrogen in the coating 62.
- An already burst bubble is shown as a damaged spot 65.
- At the damaged area 64 of the chipped part of the coating 62 is already completely broken off and is the underlying part of the
- Coating 62 free and can be damaged by contamination or diffusing hydrogen. At the damaged areas 63, 64, 65, there may be disturbing infrared reflections.
- the reflective optical element 60 for the EUV lithography which has a substrate 61 and a coating 62 which reflects at a working wavelength in the range between 5 nm and 20 nm, first a damaged spot in the
- Coating are located.
- the localization of particular damage caused by hydrogen damage, especially bubbles and flaking can be done for example by visual inspection, as they have a macroscopic extent, for example in the submillimeter to centimeter range in many cases. It can also be supported by Inspection systems are done, with which the surface of the coating is scanned.
- the localized damaged area Before the localized damaged area is covered with one or more materials, preferably with low hydrogen permeability, it can be covered before covering
- Coating material are removed in the area of the damaged area. This is
- the damaged area 66 shown in Figure 3 done and can be done for example by grinding, drilling, milling or similar processes. For example, it is possible to penetrate into non-delaminated regions of the coating 62 or to open or remove only one bubble.
- the removal of coating material has the advantage that further delamination at the damaged area can be better prevented or the damaged area can be better covered.
- FIG. 4 Various covering options are shown in FIG. 4 by way of example and schematically for the now repaired reflective optical element 70, which may be formed approximately as a collector mirror. It should be noted that all
- covering elements may be applied to damaged areas, which may be formed, inter alia, as a covering unit or film.
- damaged areas which may be formed, inter alia, as a covering unit or film.
- the damaged area 63 has been covered in the form of a bubble with a covering unit 71 in the form of a cap.
- the cap 71 is made of a
- the cap 71 may also be made of tantalum, niobium, silicon, titanium, zirconium, hafnium, scandium, yttrium, lanthanum, cerium, copper, silver, gold, platinum, rhodium, palladium, ruthenium or any one of
- the cap 71 was adhesively bonded with a low-gassing adhesive, such as a mineral filled one
- the cap 71 can be glued over the entire surface or only by means of points or a ring. Overflowing adhesive is largely uncritical because it burns in operation upon irradiation with EUV radiation in the presence of hydrogen. A gap in the bond is to be regarded as uncritical, since the reactive hydrogen recombines in the gap between the cap 71 and coating 62 by wall collisions to harmless molecular hydrogen.
- the cap 71 has a convex top. This has the advantage that infrared radiation is scattered diffusely on the cap 71. To amplify this effect, the
- cap 71 may be passivated by a galvanic layer.
- the cap cross-section can be weakened by preferably rotationally symmetrical notches, grooves 71 1 or lamellae, as in the illustrated cap 71, in order to reduce thermal stresses of the cap material relative to the substrate material.
- Thermal expansion coefficients may also be advantageous for flexible cap materials. Covering elements, in particular cover units, can be used on the undamaged
- Coating 62 are glued to a damaged area 63, 64, 65 around. Especially with cap-shaped cover units even with concave ground, as it can often be present at collector mirrors, even bubbles and throws are covered. In particular, if the coating does not adhere very well to the substrate or if a bubble is too large, the coating may be partially damaged at the corresponding defect, for example, to the spectral filter layer or even all the way through the substrate. Grinding, etching, ion beam deceleration or plasma etching are removed. The
- Covering in particular a cap-shaped cover unit can then be adhered to the substrate or an adhesive coating area. It is advantageous if a few millimeters of undamaged coating are present in the edge region of the covering element, which can be covered by the covering element in order to prevent penetration of reactive hydrogen under the covering element as far as possible.
- the cover also have, for example, a projection as an adhesive edge.
- the cover unit can also be designed, for example, as a plate or sheet.
- a film 72 can also be applied to a damaged area, as in the example shown in FIG. 4 at damaged area 64.
- Suitable materials include aluminum, aluminum alloys, titanium, copper, Steel, silver, gold, but also ceramics and glasses proved by
- Hydrogen radicals are penetrated very little.
- suitable materials are generally metals, stainless steel, invar, molybdenum, tantalum, niobium, silicon, zirconium, hafnium, scandium, yttrium, lanthanum, cerium, platinum, rhodium, palladium, ruthenium, combinations of said materials or materials containing them or theirs Combinations have. They can have thicknesses ranging from a few atomic layers, as in gold leaf, up to a few hundred microns.
- One advantage of films is that they can be easily cut to fit the shape of the damaged area to be covered. As a result, they are particularly suitable for elongated and irregularly shaped damaged areas, for example also for scratches.
- the film may for example be previously preformed concave or with a flat, soft tool, such as a cotton swab or a
- Foam stamp to be formed directly on the surface.
- a flat piece of foil or thin sheet can be applied.
- By having a round shape it is also possible to repair damaged areas in coatings of reflective optical elements with a slightly higher degree of curvature in a hydrogen-tight manner.
- the attachment of the film 72 can be explained as before for the cap member formed as a cover 71.
- a filled adhesive is used and the bonding can be flat, in points or as an adhesive ring or sections thereof.
- inorganic adhesive systems such as soda water glass can be used.
- a fastening by, for example, electric welding, laser welding or soldering is possible, which can also be done selectively.
- the film can be temporarily fixed to facilitate fastening by welding or soldering.
- self-adhesive film pieces For example, self-adhesive aluminum foils having acrylic resin-based adhesive are commercially available.
- curable adhesive to a film or thin sheet metal or even to a cover unit protected by a protective film so that the adhesive hardens only after removal of the protective film and after application of the covering element, in particular by contact with atmospheric moisture, oxygen or UV radiation.
- a chemical activator can be sprayed on before application, if the cover element, in particular in the embodiment as a film, does not have all the components of the adhesive and the missing or missing components are to be added during application.
- the film to be applied can be covered on both sides with auxiliary films.
- the adhesive-side auxiliary film is removed. Subsequently, the film is placed on the damaged area to be repaired and by selective pressure on the other auxiliary film, the adhesive-coated side of the film is attached to the coating around the damaged area.
- This approach has the advantage that the size and shape of the actually applied film must be determined only at the moment of application.
- Wavelength ranges in the beam path of the EUV lithography device as possible to prevent the films can be provided with a macroscopic surface structure, as exemplified in Figure 4 in the cover 72 as an example
- Surface structure 721 indicated. For example, they may be wrinkled or embossed to reduce directional reflection of UV or IR radiation. Coarse embossed film is commercially available. You can also use your own embossing matrices.
- Embossed patterns of tetrahedra have proven to be suitable for avoiding UV or IR reflections in the further beam path of EUV lithography with appropriate alignment.
- the films or thin sheets can be provided with a poorly reflective infrared radiation layer, for example by anodizing, oxidizing, pickling or etching, such as acid.
- cover elements can also be a coating according to
- a covering element 73 designed as a plate 732 with a coating 731 suitable for reflection of EUV radiation is indicated in FIG.
- the wafer 732 may be made of, for example, silicon, glass, sapphire, or generally a metal.
- the coated plate 73 also has a surface structuring in order to radiation from unwanted wavelength ranges, in particular
- Damage site 66 was prepared in the present example by exposing the area prior to covering
- Damage site 66 coating material was removed in its area. This can i.a. done by grinding, drilling or milling.
- a first way to apply a cover coating is to oxidize the material exposed at the defect 66. This can be done for example by an acid treatment with an oxidizing acid such as nitric acid, which is particularly suitable when nickel-phosphorous is exposed.
- the oxidation may also be by means of an atmospheric pressure air and / or oxygen plasma.
- Atmospheric pressure inert gas plasma in particular with argon or helium, and the corresponding volatile compounds may also be applied protective coatings comprising one or more of the materials of the group molybdenum, tantalum, niobium,
- Silicon titanium, zirconium, hafnium, aluminum, scandium, yttrium, lanthanum, cerium, their oxides, their nitrides, their carbides, their borides, gold, platinum, rhodium, palladium, ruthenium, carbon, boron carbide and boron nitride or consist thereof.
- Atmospheric air plasmas can also nitride exposed material at the damaged area.
- atmospheric pressure Plasma devices including those in which the plasma unit is barely larger than a pen and can also be handled. Such a plasma unit can be automated by hand or in combination with a robot arm. The second option is especially preferred when using gases that would be harmful to humans.
- a particular advantage of the atmospheric pressure plasma is that a very dense plasma can be provided with a very low heating effect and so even very sensitive coatings can be processed. In particular, when compressed air can be used as a process gas for the atmospheric pressure plasma, the operating costs are very low.
- a damaged area can also be repaired by electroplating and passivated against reactive hydrogen.
- An example is the electroplating with the help of commercially available equipment, the electroplating unit is designed in principle as a kind of cotton swab, which can be powered by a power connection. Particularly preferred is the electroplating of one or more precious or semiprecious metals,
- Suitable materials are rhodium, palladium, molybdenum, tantalum, niobium, silicon, titanium, zirconium, hafnium, aluminum, scandium, yttrium, lanthanum and cerium. Pure metals, combinations thereof or alloys or materials containing them may be applied.
- a damaged spot can be sealed by tin drops of a size in the millimeter range.
- the damaged area can be prepared like spot 66 by ablation. It is also possible to drill or mill a blister such as damaged area 63, so that the tin penetrates into the open bladder.
- a damaged spot already covered with tin can additionally be covered with further layers or covering elements. It is also particularly advantageous, the tinned
- FIG. 5 schematically illustrates another reflective optical element designed as a collector mirror 80.
- the collector mirror 80 has a damaged area 67 in its coating 62 on the substrate 61.
- the damaged area 67 was by applying a Covering element 75 is repaired, which is designed as a covering unit with concave surface.
- the cover member 75 may be formed differently in different variants. Exemplary variants are shown schematically in FIGS. 5b to 5e. The
- Cover member 75a of Figure 5b has a rectangular boundary
- Covering element 75b from FIG. 5c has an elliptical boundary; the cover element 75c from FIG. 5d has a polygonal boundary; and the cover element 75d from FIG. 5e has a freely shaped, predominantly curved edge.
- the shape of the boundary can be adapted to the shape of the respective damaged area.
- the influence of the cover element in the form of an abrupt light-dark transition can be reduced. As a result, the imaging performance of the EUV lithography device suffers less from repair.
- EUV lithography collector mirrors operated with tin plasma sources and repaired in the manner described above do not show hydrogen-generated bubble growth on the repaired defects after tin cleaning with hydrogen radicals or after prolonged operation with a tin plasma source. It should be noted that the repair process presented here also for
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- Spectroscopy & Molecular Physics (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Health & Medical Sciences (AREA)
- Plasma & Fusion (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
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Abstract
Description
Claims
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020197019256A KR102489457B1 (ko) | 2016-12-06 | 2017-11-28 | Euv 리소그래피용 반사 광학 요소를 수리하기 위한 방법 |
| CN201780075747.5A CN110050310B (zh) | 2016-12-06 | 2017-11-28 | 修复euv光刻的反射光学元件的方法 |
| US16/433,572 US11099484B2 (en) | 2016-12-06 | 2019-06-06 | Method for repairing reflective optical elements for EUV lithography |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102016224200.8 | 2016-12-06 | ||
| DE102016224200.8A DE102016224200A1 (de) | 2016-12-06 | 2016-12-06 | Verfahren zum Reparieren von reflektiven optischen Elementen für die EUV-Lithographie |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US16/433,572 Continuation US11099484B2 (en) | 2016-12-06 | 2019-06-06 | Method for repairing reflective optical elements for EUV lithography |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2018104109A1 true WO2018104109A1 (de) | 2018-06-14 |
Family
ID=60473549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2017/080645 Ceased WO2018104109A1 (de) | 2016-12-06 | 2017-11-28 | Verfahren zum reparieren von reflektiven optischen elementen für die euv-lithographie |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11099484B2 (de) |
| KR (1) | KR102489457B1 (de) |
| CN (1) | CN110050310B (de) |
| DE (1) | DE102016224200A1 (de) |
| WO (1) | WO2018104109A1 (de) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016213831A1 (de) | 2016-07-27 | 2018-02-01 | Carl Zeiss Smt Gmbh | Reflektives optisches Element für die EUV-Lithographie |
| DE102019200852A1 (de) * | 2019-01-24 | 2020-01-16 | Carl Zeiss Smt Gmbh | Verfahren zur Überwachung des Zustandes eines Spiegels einer EUV-Projektionsbelichtungsanlage |
| KR20230027099A (ko) * | 2020-06-29 | 2023-02-27 | 에이에스엠엘 네델란즈 비.브이. | Euv 소스를 위한 액적 생성기에서 액적을 가속시키는 장치 및 방법 |
| US11402743B2 (en) * | 2020-08-31 | 2022-08-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mask defect prevention |
| US12346020B2 (en) * | 2021-02-12 | 2025-07-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Optical assembly with coating and methods of use |
| KR102867854B1 (ko) * | 2021-03-23 | 2025-10-02 | 삼성전자주식회사 | 극자외선 광원 시스템의 컬렉터 세정 방법 |
| DE102021208674A1 (de) | 2021-08-10 | 2023-02-16 | Carl Zeiss Smt Gmbh | EUV-Kollektor zum Einsatz in einer EUV-Projektionsbelichtungsanlage |
| CN119954390B (zh) * | 2025-02-24 | 2025-10-10 | 四川蜀旺辰昇新材料有限责任公司 | 用于二氧化碳激光tgv的无碱陶瓷玻璃及其制备方法 |
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2016
- 2016-12-06 DE DE102016224200.8A patent/DE102016224200A1/de not_active Ceased
-
2017
- 2017-11-28 KR KR1020197019256A patent/KR102489457B1/ko active Active
- 2017-11-28 WO PCT/EP2017/080645 patent/WO2018104109A1/de not_active Ceased
- 2017-11-28 CN CN201780075747.5A patent/CN110050310B/zh active Active
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2019
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20190088550A (ko) | 2019-07-26 |
| DE102016224200A1 (de) | 2018-06-07 |
| CN110050310A (zh) | 2019-07-23 |
| US11099484B2 (en) | 2021-08-24 |
| KR102489457B1 (ko) | 2023-01-18 |
| CN110050310B (zh) | 2023-10-13 |
| US20190302628A1 (en) | 2019-10-03 |
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