WO2018097036A1 - 粘着性積層フィルムおよび電子装置の製造方法 - Google Patents
粘着性積層フィルムおよび電子装置の製造方法 Download PDFInfo
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- WO2018097036A1 WO2018097036A1 PCT/JP2017/041331 JP2017041331W WO2018097036A1 WO 2018097036 A1 WO2018097036 A1 WO 2018097036A1 JP 2017041331 W JP2017041331 W JP 2017041331W WO 2018097036 A1 WO2018097036 A1 WO 2018097036A1
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- Prior art keywords
- adhesive
- resin layer
- laminated film
- heat
- pressure
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Images
Classifications
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- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
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- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/116—Primary casings; Jackets or wrappings characterised by the material
- H01M50/124—Primary casings; Jackets or wrappings characterised by the material having a layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Definitions
- the present invention relates to a method for manufacturing an adhesive laminated film and an electronic device.
- the characteristics of an electronic component may be evaluated.
- the characteristic evaluation process of the electronic component for example, the characteristic evaluation of the electronic component is performed at a high temperature or a low temperature.
- Patent Document 1 Japanese Patent Laid-Open No. 10-163281
- Patent Document 1 Japanese Patent Laid-Open No. 10-163281
- Patent Document 1 dicing is performed on a semiconductor wafer on which a plurality of semiconductor elements are formed, and a tester is applied to electrodes formed on the semiconductor elements in a state in which the positional relationship between the semiconductor elements subjected to the dicing is maintained.
- the semiconductor device is manufactured by pressing and electrically connecting the contact terminal connected to the semiconductor device, and inspecting the semiconductor device by an operation characteristic test on the semiconductor device by the tester in the connected state. A method is described.
- the present inventor has found that the adhesive film for temporarily fixing the electronic component is deformed or melted when the characteristic evaluation of the electronic component is performed at a high temperature or low temperature in the conventional method of manufacturing an electronic device. I found out. In this case, a position shift of the electronic component on the adhesive film occurs, and the subsequent pickup of the electronic component cannot be performed well.
- the conventional adhesive film has room for improvement in the pick-up property of the electronic component after the characteristic evaluation of the electronic component at high temperature or low temperature.
- the electronic component 70A on the adhesive film 50A is once picked up on a tray 80A or the like as shown in FIG.
- the part 70A is transferred by a robot and placed on the sample stage 90A, the characteristics of the electronic part 70A are evaluated at high or low temperature, and then the electronic part 70A is again transferred to the tray 80A or the like by the robot.
- the process was complicated. That is, the present inventors have found that there is room for improvement in the conventional method for manufacturing an electronic device in terms of both simplifying the characteristic evaluation process of the electronic component and picking up the electronic component. It was.
- the present invention has been made in view of the above circumstances, and provides an adhesive film capable of simplifying the characteristic evaluation process of an electronic component and accurately picking up the electronic component.
- the film for temporarily fixing the electronic component has a heat resistant resin layer, a flexible resin layer, and an adhesive resin layer in this order, and between the heat resistant resin layer and the flexible resin layer.
- the following adhesive laminated film and electronic device manufacturing method are provided.
- the peel strength P 0 between the heat-resistant resin layer and the flexible resin layer measured by the following method in accordance with JIS Z0237, is 0.01 N / 25 mm or more and 2.0 N / 25 mm or less
- the peel strength P 1 between the heat-resistant resin layer and the flexible resin layer after heat-treating the adhesive laminated film at 160 ° C. for 4 hours is 0.05 N / 25 mm or more and 1.5 N / 25 mm or less.
- the adhesive laminated film is attached to the silicon wafer so that the adhesive resin layer is in contact with the silicon wafer.
- the heat-resistant resin layer was peeled from the flexible resin layer in the direction of 180 degrees under the conditions of 25 ° C. and a tensile speed of 300 mm / min, and the strength (N / 25 mm) at that time was Measure twice and use the average value as the peel strength.
- the adhesive laminated film according to the above [1] or [2] The heat-resistant resin layer has a melting point of 200 ° C. or higher, or the heat-resistant resin layer does not have a melting point.
- fusing point of the said flexible resin layer is 100 degreeC or more and 250 degrees C or less.
- the adhesive laminated film in which the heat resistant resin which comprises the said heat resistant resin layer contains the 1 type (s) or 2 or more types selected from the group which consists of a polyimide, polyamide, and polyester.
- the adhesive laminated film in which the flexible resin constituting the flexible resin layer contains one or more selected from the group consisting of polyester elastomers, polyamide elastomers, polyimide elastomers, and polybutylene terephthalate.
- An adhesive laminated film further comprising an adhesive layer between the heat resistant resin layer and the flexible resin layer.
- the adhesive laminated film in which the adhesive layer contains a (meth) acrylic adhesive contains a (meth) acrylic adhesive.
- the (meth) acrylic pressure-sensitive adhesive contains a (meth) acrylic pressure-sensitive adhesive resin and a crosslinking agent, The adhesive laminated film whose content of the said crosslinking agent in the said (meth) acrylic-type adhesive is 5 mass parts or more with respect to 100 mass parts of said (meth) acrylic-type adhesive resins.
- the adhesive laminated film according to the above [9] The adhesive laminated film in which the said crosslinking agent contains the 1 type (s) or 2 or more types selected from an epoxy-type compound, an isocyanate type compound, and an aziridine type compound.
- the pressure-sensitive adhesive laminated film wherein the (meth) acrylic pressure-sensitive adhesive resin contained in the (meth) acrylic pressure-sensitive adhesive contains a structural unit derived from a polyfunctional monomer having two or more carbon-carbon double bonds in the molecule.
- the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer contains one or more selected from (meth) acrylic pressure-sensitive adhesives, silicone-based pressure-sensitive adhesives, urethane-based pressure-sensitive adhesives, olefin-based pressure-sensitive adhesives, and styrene-based pressure-sensitive adhesives.
- Adhesive laminated film [13] In the adhesive laminated film according to any one of the above [1] to [12], The adhesive laminated film whose total light transmittance of the said adhesive laminated film is 80% or more.
- An adhesive laminate film used for the adhesive laminate film in a method for producing an electronic device comprising: [16] A structure comprising an adhesive laminated film having a heat-resistant resin layer, a flexible resin layer, and an adhesive resin layer in this order, and one or more electronic components attached on the adhesive resin layer.
- An electronic device manufacturing method comprising: The manufacturing method of the electronic device which uses the adhesive laminated film as described in any one of said [1] thru
- step (D) in the state where the region where the electronic component is attached in the adhesive resin layer is expanded in the in-plane direction of the film, the interval between the adjacent electronic components is expanded.
- FIG. 1 is a cross-sectional view schematically showing an example of the structure of an adhesive laminated film 50 according to an embodiment of the present invention.
- FIG. 2 is a cross-sectional view schematically showing an example of a method for manufacturing an electronic device according to an embodiment of the present invention.
- the adhesive laminated film 50 which concerns on this embodiment has the heat resistant resin layer 10, the flexible resin layer 20, and the adhesive resin layer 30 in this order.
- the pressure-sensitive adhesive laminated film 50 in accordance with JIS Z0237, from the viewpoint of maintaining good adhesion between the heat-resistant resin layer 10 and the flexible resin layer 20 before the pickup process of the electronic component 70.
- the peel strength P 0 between the heat-resistant resin layer 10 and the flexible resin layer 20 measured by the following method is 0.01 N / 25 mm or more and 2.0 N / 25 mm or less.
- the adhesive laminated film 50 which concerns on this embodiment, it is based on JISZ0237 below from a viewpoint which can peel the heat resistant resin layer 10 from the flexible resin layer 20 after the characteristic evaluation process of the electronic component 70 below.
- the peel strength P 1 between the heat-resistant resin layer 10 and the flexible resin layer 20 after heat-treating the adhesive laminated film 50 at 160 ° C. for 4 hours is 0.05 N / 25 mm or more. 5 N / 25 mm or less. (Measurement method of peel strength)
- the adhesive laminated film 50 is attached to the silicon wafer so that the adhesive resin layer 30 is in contact with the silicon wafer.
- the heat-resistant resin layer 10 is peeled from the flexible resin layer 20 in the direction of 180 degrees under the conditions of 25 ° C. and a tensile speed of 300 mm / min, and the strength (N / 25 mm) at that time is Measure twice and use the average value as the peel strength.
- the inventors of the present invention have made extensive studies in order to realize a pressure-sensitive adhesive film that can simplify the characteristic evaluation process of the electronic component and can accurately pick up the electronic component.
- an adhesive laminated film having a heat-resistant resin layer, a flexible resin layer, and an adhesive resin layer in this order is used as a film for temporarily fixing an electronic component.
- the present inventors have found that the method of peeling off the conductive resin layer is effective as a method for achieving both simplification of the characteristic evaluation process of the electronic component and pickup property of the electronic component.
- the present inventors have found that the peel strength P 0 and the peel strength P 1 between the heat resistant resin layer 10 and the flexible resin layer 20 are within the above ranges.
- the heat-resistant resin layer 10 is applied after the characteristic evaluation process of the electronic component 70. It has been found for the first time that it can be satisfactorily peeled from the flexible resin layer 20. That is, the pressure-sensitive adhesive laminated film 50 according to the present embodiment sets the peel strength P 0 between the heat-resistant resin layer 10 and the flexible resin layer 20 to be equal to or higher than the above-described lower limit value. It becomes possible to maintain the adhesiveness between the heat resistant resin layer 10 and the flexible resin layer 20 in the front.
- the peel strength P 1 between the heat resistant resin layer 10 and the soft resin layer 20 is set to lower than or equal to the upper limit value, the electronic component 70 Characterization step Later, the heat-resistant resin layer 10 can be favorably peeled from the flexible resin layer 20.
- the peel strength P 0 between the heat-resistant resin layer 10 and the flexible resin layer 20 is 0.01 N / 25 mm or more and 2.0 N / 25 mm or less, preferably 0.02 N / 25 mm or more, more preferably 0.04 N / 25 mm or more, and preferably 1.5 N / 25 mm or less, more preferably 1.0 N / 25 mm or less, still more preferably 0.5 N / 25 mm or less, particularly preferably Is 0.3 N / 25 mm or less.
- the peel strength P 1 is equal to or less than 0.05 N / 25 mm or more 1.5 N / 25 mm between the heat-resistant resin layer 10 and the soft resin layer 20, Preferably, it is 1.0 N / 25 mm or less, more preferably 0.7 N / 25 mm or less, particularly preferably 0.5 N / 25 mm or less, and preferably 0.08 N / 25 mm or more, more preferably 0.10 N / 25 mm or more. is there.
- the peel strength P 0 and the peel strength P 1 between the heat-resistant resin layer 10 and the flexible resin layer 20 are, for example, an adhesive layer described later between the heat-resistant resin layer 10 and the flexible resin layer 20.
- the surface can be controlled within the above range by subjecting the surface of the heat resistant resin layer 10 to a surface treatment.
- the peel strength P 0 and the peel strength P 1 between the heat resistant resin layer 10 and the flexible resin layer 20 can be controlled within the above ranges.
- the kind and blending ratio of the crosslinking agent in the adhesive resin constituting the adhesive layer are desired to have the peel strength P 0 and the peel strength P 1 between the heat-resistant resin layer 10 and the flexible resin layer 20. It is mentioned as an element for making it a numerical range.
- the total thickness of the pressure-sensitive adhesive laminated film 50 according to the present embodiment is preferably 25 ⁇ m or more and 1100 ⁇ m or less, more preferably 30 ⁇ m or more and 700 ⁇ m or less, and further preferably 30 ⁇ m or more, from the balance of mechanical properties and handleability. 500 ⁇ m or less.
- the adhesive laminated film 50 according to the present embodiment can be used as a film for temporarily fixing an electronic component in an electronic device manufacturing process, and can be particularly suitably used as a dicing tape.
- the total light transmittance of the adhesive laminated film 50 is preferably 80% or more, and more preferably 85% or more. By doing so, transparency can be imparted to the adhesive laminated film 50. And by making the total light transmittance of the adhesive laminated film 50 more than the said lower limit, a radiation can be more effectively irradiated to the adhesive resin layer 30, and a radiation irradiation efficiency can be improved. In addition, the total light transmittance of the adhesive laminated film 50 can be measured according to JIS K7105 (1981).
- heat resistance means the dimensional stability of the film or resin layer at high or low temperatures. That is, it means that a film or a resin layer having excellent heat resistance is less prone to deformation or melting such as expansion or contraction or softening at high or low temperatures.
- the heat-resistant resin layer 10 is a layer provided for the purpose of improving the handling properties, mechanical properties, heat resistance, and other properties of the adhesive laminated film 50.
- the heat-resistant resin layer 10 is not particularly limited as long as the heat-resistant resin layer 10 has heat resistance to such an extent that the electronic component 70 is not deformed or melted enough to cause positional displacement when the characteristics of the electronic component 70 are evaluated at high or low temperatures.
- a heat resistant resin film can be used.
- the resin constituting the heat-resistant resin film examples include polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; polyamides such as nylon-6, nylon-66, and polymetaxylene adipamide; polyimides; polyethers Polyimide; Polycarbonate; Modified polyphenylene ether; Polyacetal; Polyarylate; Polysulfone; Polyethersulfone; Polyphenylenesulfide; Polyetheretherketone; Fluorine resin; Liquid crystal polymer; Vinylidene chloride resin; Polybenzimidazole; Polybenzoxazole; One or more selected from methylpentene and the like can be mentioned.
- polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate
- polyamides such as nylon-6, nylon-66, and polymetaxylene adipamide
- polyimides polyethers Polyimide
- Polycarbonate Modified polypheny
- one or more selected from polyimide, polyamide, and polyester are preferable.
- the melting point of the heat resistant resin layer 10 is preferably 200 ° C. or higher, and more preferably 220 ° C. or higher. Or it is preferable that the heat resistant resin layer 10 does not show melting
- the heat resistant resin layer 10 may be a single layer or two or more layers.
- the form of the resin film used to form the heat resistant resin layer 10 may be a stretched film or a film stretched in a uniaxial direction or a biaxial direction. From the viewpoint of improving the heat resistance and mechanical strength of the layer 10, a film stretched in a uniaxial direction or a biaxial direction is preferable.
- the thickness of the heat resistant resin layer 10 is preferably 10 ⁇ m or more and 1000 ⁇ m or less, more preferably 10 ⁇ m or more and 500 ⁇ m or less, and further preferably 20 ⁇ m or more and 300 ⁇ m or less from the viewpoint of obtaining good film characteristics.
- the heat resistant resin layer 10 may be subjected to a surface treatment in order to improve adhesion with other layers. Specifically, corona treatment, plasma treatment, undercoat treatment, primer coat treatment, or the like may be performed.
- the heat resistant resin layer 10 is laminated so as to be peelable from the flexible resin layer 20.
- There are no particular limitations on the method of stacking in a peelable manner but for example, a method of stacking via a peelable adhesive layer (not shown) or a surface roughness of the surface of the heat-resistant resin layer 10 on the side in contact with the flexible resin layer 20. Examples of the method include adjusting the thickness and releasing the surface.
- the pressure-sensitive adhesive laminated film 50 has the heat-resistant resin layer 10 and the flexible resin from the viewpoint of facilitating the adjustment of the peel strength between the heat-resistant resin layer 10 and the flexible resin layer 20. It is preferable to further have an adhesive layer between the layer 20.
- a peelable adhesive layer for example, (1) an adhesive layer composed of a heat-expandable pressure-sensitive adhesive that can be suppressed by heating to expand, and (2) adhesive that contracts by heating.
- the heat-expandable pressure-sensitive adhesive refers to a pressure-sensitive adhesive in which thermally expandable fine particles, a foaming agent and the like are dispersed in the pressure-sensitive adhesive.
- the pressure-sensitive adhesive generally known pressure-sensitive adhesives can be used. For example, (meth) acrylic pressure-sensitive adhesives, silicone-based pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives, polyurethane-based pressure-sensitive adhesives, polyvinyl ether-based pressure-sensitive adhesives, etc. Can be mentioned.
- heat-expandable fine particles examples include fine particles obtained by encapsulating, in an elastic shell, a substance that easily gasifies and expands by heating, such as isobutane, propane, or pentane.
- foaming agent examples include chemical substances having the ability to thermally decompose to generate water, carbon dioxide gas, and nitrogen.
- the shrink film used for the double-sided adhesive film based on the shrink film include a heat shrink film that shrinks by heating.
- Examples thereof include uniaxial or biaxially stretched films such as polyethylene terephthalate, polyethylene, polystyrene, polypropylene, polyamide, polyurethane, polyvinyl chloride, and polyvinylidene chloride.
- pressure-sensitive adhesive As the pressure-sensitive adhesive provided on both sides of the shrinkable film, generally known pressure-sensitive adhesives can be used, for example, (meth) acrylic pressure-sensitive adhesives, silicone-based pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives, polyurethane-based pressure-sensitive adhesives. And polyvinyl ether-based pressure-sensitive adhesives.
- (meth) acrylic pressure-sensitive adhesives silicone-based pressure-sensitive adhesives
- rubber-based pressure-sensitive adhesives polyurethane-based pressure-sensitive adhesives.
- polyurethane-based pressure-sensitive adhesives And polyvinyl ether-based pressure-sensitive adhesives.
- the pressure-sensitive adhesive that constitutes a heat-resistant adhesive layer that can suppress the progress of adhesive strength even after high-temperature or low-temperature processing is (meth) acrylic pressure-sensitive adhesive, silicone-based pressure-sensitive adhesive, urethane-based pressure-sensitive adhesive, olefin-based pressure-sensitive adhesive, styrene System adhesives and the like.
- the (meth) acrylic adhesive contains a (meth) acrylic adhesive resin as an essential component.
- the silicone adhesive contains a silicone adhesive resin as an essential component.
- the urethane-based adhesive contains a urethane-based adhesive resin as an essential component.
- a (meth) acrylic pressure-sensitive adhesive is preferable from the viewpoint of facilitating adjustment of the peel strength between the heat-resistant resin layer 10 and the flexible resin layer 20.
- Examples of the (meth) acrylic adhesive resin used in the (meth) acrylic adhesive include, for example, a (meth) acrylic acid alkyl ester monomer unit (A) and a monomer unit having a functional group capable of reacting with a crosslinking agent ( Examples include copolymers containing B).
- (meth) acrylic acid alkyl ester means acrylic acid alkyl ester, methacrylic acid alkyl ester, or a mixture thereof.
- the (meth) acrylic adhesive resin according to this embodiment is a copolymer of a monomer mixture including, for example, a (meth) acrylic acid alkyl ester monomer (A) and a monomer (B) having a functional group capable of reacting with a crosslinking agent. Can be obtained.
- Examples of the monomer (A) forming the (meth) acrylic acid alkyl ester monomer unit (A) include (meth) acrylic acid alkyl esters having an alkyl group having about 1 to 12 carbon atoms. Preferably, it is a (meth) acrylic acid alkyl ester having an alkyl group having 1 to 8 carbon atoms. Specific examples include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, 2-ethylhexyl acrylate, and 2-ethylhexyl methacrylate. These may be used alone or in combination of two or more.
- the content of the (meth) acrylic acid alkyl ester monomer unit (A) is 100 masses of the total of all monomer units in the (meth) acrylic adhesive resin. %, It is preferably 10% by mass or more and 98.9% by mass or less, and more preferably 85% by mass or more and 95% by mass or less.
- the monomer (B) that forms the monomer (B) having a functional group capable of reacting with a crosslinking agent acrylic acid, methacrylic acid, itaconic acid, mesaconic acid, citraconic acid, fumaric acid, maleic acid, itaconic acid monoalkyl ester , Mesaconic acid monoalkyl ester, citraconic acid monoalkyl ester, fumaric acid monoalkyl ester, maleic acid monoalkyl ester, glycidyl acrylate, glycidyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, acrylamide Methacrylamide, tert-butylaminoethyl acrylate, tert-butylaminoethyl methacrylate and the like.
- Acrylic acid, methacrylic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, acrylamide, methacrylamide and the like are preferable. These may be used alone or in combination of two or more.
- the content of the monomer unit (B) is 1 mass when the total of all monomer units in the (meth) acrylic adhesive resin is 100 mass%. % To 40% by mass, more preferably 1% to 20% by mass, and still more preferably 1% to 10% by mass.
- the (meth) acrylic adhesive resin according to this embodiment is derived from the polyfunctional monomer (C) having two or more carbon-carbon double bonds in the molecule in addition to the monomer unit (A) and the monomer unit (B). It is preferable to further include a specific comonomer (hereinafter referred to as a polymerizable surfactant) unit having a property as a structural unit (hereinafter also referred to as a polyfunctional monomer unit (C)) or a surfactant.
- the (meth) acrylic adhesive resin according to this embodiment is a structural unit (C) derived from a polyfunctional monomer (C). It is preferable to contain.
- the polymerizable surfactant has a property of copolymerizing with the monomer (A), the monomer (B) and the monomer (C), and also has an action as an emulsifier when emulsion polymerization is performed.
- Monomers (C) that form the multifunctional monomer unit (C) include allyl methacrylate, allyl acrylate, divinylbenzene, vinyl methacrylate, vinyl acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri ( (Meth) acrylate, dipentaerythritol hexa (meth) acrylate, tetraethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, dipentaerythritol hexa (meth) Acrylate, 2-propenyl di-3-butenyl cyanurate, 2-hydroxyethylbis (2- (meth) acryloxyethyl) isocyanurate, tris (2-methacryloxyethyl) isocyanurate, , Both ends are diacrylate or dim
- polypropylene glycol di (meth) acrylate and polytetramethylene glycol di (meth) acrylate are used.
- polytetramethylene glycol di (meth) acrylate is more preferable.
- the content of the monomer unit (C) is 0. 0% when the total of all monomer units in the (meth) acrylic adhesive resin is 100% by mass. It is preferably 1% by mass or more and 30% by mass or less, and more preferably 0.1% by mass or more and 5% by mass or less.
- polymerizable surfactant examples include, for example, those in which a polymerizable 1-propenyl group is introduced into the benzene ring of polyoxyethylene nonylphenyl ether (manufactured by Daiichi Kogyo Seiyaku Co., Ltd .; trade name: Aqualon RN-10) RN-20, RN-30, RN-50, etc.), and a polymerized 1-propenyl group introduced into the benzene ring of an ammonium salt of polyoxyethylene nonylphenyl ether sulfate (Daiichi Kogyo Seiyaku) Product name: Aqualon HS-10, HS-20, HS-1025, etc.), and sulfosuccinic acid diester type having a polymerizable double bond in the molecule (manufactured by Kao Corporation); : Latemulu S-120A, S-180A, etc.).
- the (meth) acrylic adhesive resin according to the present embodiment may further contain a monomer unit formed of a monomer having a polymerizable double bond such as vinyl acetate, acrylonitrile, or styrene, if necessary. .
- Examples of the polymerization reaction mechanism of the (meth) acrylic adhesive resin according to this embodiment include radical polymerization, anionic polymerization, and cationic polymerization.
- Polymerization by radical polymerization is preferable in consideration of the production cost of the (meth) acrylic adhesive resin, the influence of the functional group of the monomer, and the like.
- benzoyl peroxide, di-t-butyl peroxide, dicumyl peroxide, 3,3,5-trimethylhexanoyl peroxide, di-2-ethylhexyl peroxide are used as radical polymerization initiators.
- Dicarbonate methyl ethyl ketone peroxide, t-butyl peroxyphthalate, t-butyl peroxybenzoate, di-t-butyl peroxyacetate, t-butyl peroxyisobutyrate, t-butyl peroxy-2-hexanoate, t -Butylperoxy-2-ethylhexanoate, t-butylperoxy-3,5,5-trimethylhexanoate, acetyl peroxide, isobutyryl peroxide, octanoyl peroxide, t-butyl peroxide Organic peroxides such as di-t-amyl peroxide; inorganic peroxides such as ammonium persulfate, potassium persulfate and sodium persulfate; 2,2′-azobisisobutyronitrile, 2,2′-azobis- Examples include azo compounds such as 2-methylbutyronitrile and 4,4′-azo
- inorganic peroxides such as water-soluble ammonium persulfate, potassium persulfate, and sodium persulfate, and water-soluble 4,4′-azobis are also used.
- An azo compound having a carboxyl group in the molecule such as -4-cyanovaleric acid is preferable, and an azo compound having a carboxyl group in the molecule such as ammonium persulfate or 4,4′-azobis-4-cyanovaleric acid is preferable.
- Further preferred are azo compounds having a carboxyl group in the molecule such as 4,4′-azobis-4-cyanovaleric acid.
- the (meth) acrylic pressure-sensitive adhesive preferably further contains a cross-linking agent having two or more crosslinkable functional groups in one molecule in addition to the (meth) acrylic pressure-sensitive adhesive resin.
- the cross-linking agent having two or more cross-linkable functional groups in one molecule is used to adjust the adhesive force and cohesive force by reacting with the functional group of the (meth) acrylic adhesive resin.
- Such cross-linking agents include sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, diglycerol polyglycidyl ether, glycerol polyglycidyl ether, neopentyl glycol diglycidyl ether, resorcin diglycidyl ether, etc.
- Epoxy compounds such as tetramethylene diisocyanate, hexamethylene diisocyanate, trimethylolpropane, toluene diisocyanate triadduct, polyisocyanate, diphenylmethane diisocyanate, tolylene diisocyanate; trimethylolpropane-tri- ⁇ -aziridinylpropio , Tetramethylolmethane-tri- ⁇ -aziridinylpropionate, N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), N, N′-hexamethylene-1,6-bis (1-aziridinecarboxamide), N, N′-toluene-2 , 4-bis (1-aziridinecarboxamide), trimethylolpropane-tri- ⁇ - (2-methylaziridine) propionate, and the like; N, N, N ′, N′-tetraglycidyl
- the content of the crosslinking agent in the (meth) acrylic pressure-sensitive adhesive is 5 parts by mass with respect to 100 parts by mass of the (meth) acrylic pressure-sensitive adhesive resin from the viewpoint of improving the balance between the heat resistance and adhesion of the adhesive layer.
- it is 8 parts by mass or more, more preferably 10 parts by mass or more, particularly preferably 12 parts by mass or more, and preferably 50 parts by mass or less. 30 parts by mass or less is more preferable.
- (meth) By adjusting the content of the acrylic adhesive solution of crosslinking agent, adjusting the peel strength P 0 and peel strength P 1 between the flexible resin layer 20 and the heat resistant resin layer 10 Can do.
- the (meth) acrylic pressure-sensitive adhesive according to this embodiment may further contain an ultraviolet polymerization initiator in addition to the pressure-sensitive adhesive resin.
- ultraviolet polymerization initiators include acetophenone-based photopolymerization initiators such as methoxyacetophenone; ⁇ -ketol compounds such as 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone; benzyldimethyl ketal and the like
- a benzoin photopolymerization initiator such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, or the like; a benzophenone photopolymerization initiator such as benzophenone or benzoylbenzoic acid, or the like.
- the content of the ultraviolet polymerization initiator in the adhesive is preferably 0.1 parts by mass or more and 10 parts by mass or
- the thickness of the adhesive layer is not particularly limited, but is preferably 1 ⁇ m or more and 100 ⁇ m or less, and more preferably 3 ⁇ m or more and 50 ⁇ m or less.
- the adhesive layer can be formed, for example, by applying an adhesive coating solution on the heat resistant resin layer 10 or the flexible resin layer 20.
- a conventionally known coating method such as a roll coater method, a reverse roll coater method, a gravure roll method, a bar coat method, a comma coater method, a die coater method, or the like can be employed.
- drying conditions of the applied pressure-sensitive adhesive but in general, drying is preferably performed for 10 seconds to 10 minutes in a temperature range of 80 to 200 ° C. More preferably, it is dried at 80 to 170 ° C. for 15 seconds to 5 minutes.
- it may be heated at 40 to 80 ° C. for about 5 to 300 hours.
- the surface roughness of the heat-resistant resin layer 10 on the side in contact with the flexible resin layer 20 is adjusted, and the surface is subjected to a release treatment.
- the peel strength between the heat resistant resin layer 10 and the flexible resin layer 20 can be adjusted.
- the surface roughness (Ra) of the surface of the heat-resistant resin layer 10 on the side in contact with the flexible resin layer 20 defined by JIS-B0601 is preferably 0.10 ⁇ m or more and 10 ⁇ m or less.
- a release agent such as silicone or polytetrafluoroethylene.
- the flexible resin layer 20 is a layer provided for the purpose of improving the properties such as flexibility and stretchability of the adhesive laminated film 50.
- the stretchability and flexibility of the adhesive laminated film 50 are improved, and it is easier to expand the adhesive laminated film 50 in the in-plane direction in the process of picking up the electronic component 70. it can.
- the flexible resin layer 20 is not particularly limited as long as it can be expanded in the in-plane direction, but is excellent in properties such as flexibility and stretchability, and has an adhesive property when evaluating the characteristics of the electronic component 70 at high or low temperature. What has heat resistance of the grade which can maintain adhesiveness with the resin layer 30 is preferable.
- the flexible resin constituting the flexible resin layer 20 include one or more selected from polyester elastomers, polyamide elastomers, polyimide elastomers, polybutylene terephthalate, and the like.
- the tensile elastic modulus (E ′) at 160 ° C. of the flexible resin layer 20 measured under the conditions of a sample width of 10 mm, a distance between chucks of 30 mm, and a tensile speed of 300 mm / min is 1 MPa to 300 MPa. It is preferable that it is 5 MPa or more and 150 MPa or less. This further suppresses the thermal expansion of the adhesive laminated film 50 when evaluating the characteristics of the electronic component 70 at a high temperature or a low temperature, while maintaining good properties such as flexibility and stretchability of the flexible resin layer 20. be able to.
- the melting point of the flexible resin layer 20 is preferably 100 ° C. or higher and 250 ° C. or lower.
- the thermal expansion of the pressure-sensitive adhesive laminated film 50 when the characteristics of the electronic component 70 are evaluated at a high temperature or a low temperature can be further suppressed.
- the thickness of the flexible resin layer 20 is not particularly limited, but is preferably, for example, 10 ⁇ m or more and 500 ⁇ m or less, more preferably 20 ⁇ m or more and 300 ⁇ m or less, further preferably 30 ⁇ m or more and 250 ⁇ m or less, and more preferably 50 ⁇ m or more and 200 ⁇ m. It is particularly preferred that
- the adhesive resin layer 30 is a layer that contacts and adheres to the surface of the electronic component 70 when the adhesive laminated film 50 is attached to the electronic component 70.
- Examples of the adhesive constituting the adhesive resin layer 30 include (meth) acrylic adhesives, silicone adhesives, urethane adhesives, olefin adhesives, and styrene adhesives.
- a (meth) acrylic pressure-sensitive adhesive having a (meth) acrylic polymer as a base polymer is preferable from the viewpoint that the adhesive force can be easily adjusted.
- a radiation cross-linking pressure-sensitive adhesive that reduces the pressure-sensitive adhesive force by radiation can be used. Since the adhesive resin layer 30 composed of the radiation-crosslinking type adhesive is crosslinked by irradiation with radiation and the adhesive force is remarkably reduced, the electronic component 70 is picked up from the adhesive resin layer 30 in the pickup process of the electronic component 70. It becomes easy to do. Examples of radiation include ultraviolet rays, electron beams, and infrared rays. As the radiation crosslinking adhesive, an ultraviolet crosslinking adhesive is preferable.
- Examples of the (meth) acrylic polymer contained in the (meth) acrylic adhesive include, for example, a homopolymer of a (meth) acrylic ester compound, a copolymer of a (meth) acrylic ester compound and a comonomer, and the like. Can be mentioned.
- Examples of (meth) acrylic acid ester compounds include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, hydroxyethyl (meth) acrylate, and hydroxypropyl (meth).
- Examples include acrylate, dimethylaminoethyl (meth) acrylate, and glycidyl (meth) acrylate. These (meth) acrylic acid ester compounds may be used individually by 1 type, and may be used in combination of 2 or more types.
- Examples of the comonomer constituting the (meth) acrylic copolymer include vinyl acetate, (meth) acrylonitrile, (meth) acrylamide, styrene, (meth) acrylic acid, itaconic acid, and (meth) acrylamide. , Methylol (meth) acrylamide, maleic anhydride and the like. These comonomers may be used individually by 1 type, and may be used in combination of 2 or more types.
- the radiation-crosslinking-type pressure-sensitive adhesive is, for example, a pressure-sensitive adhesive such as the above (meth) acrylic pressure-sensitive adhesive, a crosslinkable compound (component having a carbon-carbon double bond), a photopolymerization initiator or a thermal polymerization initiator, including.
- crosslinkable compound examples include monomers, oligomers or polymers having a carbon-carbon double bond in the molecule and capable of crosslinking by radical polymerization.
- crosslinkable compounds include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, tetraethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neo Esters of (meth) acrylic acid and polyhydric alcohols such as pentyl glycol di (meth) acrylate and dipentaerythritol hexa (meth) acrylate; ester (meth) acrylate oligomers; 2-propenyl di-3-butenyl cyanurate, 2 -Isocyanurates or isocyanurate compounds such as hydroxyethyl bis (2- (meth) acryloxyethyl) isocyanurate and tris
- the content of the crosslinkable compound is preferably 5 to 100 parts by mass and more preferably 10 to 50 parts by mass with respect to 100 parts by mass of the adhesive.
- the content of the crosslinkable compound is in the above range, it becomes easier to adjust the adhesive force than in the case where the content is less than the above range, and the sensitivity to heat and light is too high compared to the case where the content is larger than the above range.
- the storage stability is less likely to deteriorate.
- the photopolymerization initiator may be any compound that can be cleaved by irradiation to generate radicals, such as benzoin alkyl ethers such as benzoin methyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; benzyl, benzoin, and benzophenone.
- aromatic ketones such as ⁇ -hydroxycyclohexyl phenyl ketone; aromatic ketals such as benzyldimethyl ketal; polyvinylbenzophenone; thioxanthones such as chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, and diethylthioxanthone.
- thermal polymerization initiator examples include organic peroxide derivatives and azo polymerization initiators.
- An organic peroxide derivative is preferable because nitrogen is not generated during heating.
- thermal polymerization initiator examples include ketone peroxide, peroxyketal, hydroperoxide, dialkyl peroxide, diacyl peroxide, peroxyester, and peroxydicarbonate.
- a cross-linking agent may be added to the adhesive.
- the crosslinking agent include epoxy compounds such as sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, diglycerol polyglycidyl ether; tetramethylolmethane-tri- ⁇ -aziridinylpropionate , Trimethylolpropane-tri- ⁇ -aziridinylpropionate, N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), N, N′-hexamethylene-1,6-bis Aziridine compounds such as (1-aziridinecarboxamide); isocyanate compounds such as tetramethylene diisocyanate, hexamethylene diisocyanate, and polyisocyanate.
- a crosslinking agent may be used individually by 1 type, and may be used in combination of 2 or more type.
- the content of the cross-linking agent is 0.1 parts by mass or more and 10 parts by mass with respect to 100 parts by mass of the (meth) acrylic adhesive resin from the viewpoint of improving the balance between the heat resistance and adhesion of the adhesive resin layer 30. The following is preferable.
- the thickness of the adhesive resin layer 30 is not particularly limited, for example, it is preferably 1 ⁇ m or more and 100 ⁇ m or less, and more preferably 3 ⁇ m or more and 50 ⁇ m or less.
- the adhesive resin layer 30 can be formed, for example, by applying an adhesive coating solution on the base material layer or the flexible resin layer 20.
- a conventionally known coating method such as a roll coater method, a reverse roll coater method, a gravure roll method, a bar coat method, a comma coater method, a die coater method, or the like can be employed.
- drying conditions of the applied pressure-sensitive adhesive there are no particular restrictions on the drying conditions of the applied pressure-sensitive adhesive, but in general, drying is preferably performed for 10 seconds to 10 minutes in a temperature range of 80 to 200 ° C. More preferably, it is dried at 80 to 170 ° C. for 15 seconds to 5 minutes.
- it may be heated at 40 to 80 ° C. for about 5 to 300 hours.
- a release film may be further laminated on the pressure-sensitive adhesive resin layer 30.
- the release film include a polyester film subjected to a release treatment.
- the pressure-sensitive adhesive laminated film 50 is formed by, for example, forming the flexible resin layer 20 on one surface of the heat-resistant resin layer 10 by extrusion lamination, and applying an adhesive coating solution on the flexible resin layer 20. It can be obtained by forming the adhesive resin layer 30 by drying.
- the heat-resistant resin layer 10 and the flexible resin layer 20 may be formed by coextrusion molding, or the film-like heat-resistant resin layer 10 and the film-like flexible resin layer 20 are laminated (laminated). May be formed.
- FIG. 2 is a cross-sectional view schematically showing an example of a method for manufacturing an electronic device according to an embodiment of the present invention.
- the electronic device manufacturing method according to the present embodiment includes at least the following four steps, for example.
- B The process of evaluating the characteristic of the electronic components 70 in the state affixed on the adhesive resin layer 30
- the adhesive laminate film 50 according to this embodiment described above is used as the adhesive laminate film 50.
- the present inventor has found that the adhesive film for temporarily fixing the electronic component is deformed or melted when the characteristic evaluation of the electronic component is performed at a high temperature or low temperature in the conventional method of manufacturing an electronic device. I found out. In this case, a position shift of the electronic component on the adhesive film occurs, and the subsequent pickup of the electronic component cannot be performed well. Further, according to the study of the present inventor, when the heat resistance of the adhesive film is increased in order to suppress the deformation and melting of the adhesive film, the deformation and melting of the adhesive film are suppressed and the electronic component is misaligned.
- the conventional adhesive film has room for improvement in the pick-up property of the electronic component after the characteristic evaluation of the electronic component at high temperature or low temperature.
- the electronic component 70A on the adhesive film 50A is once picked up on a tray 80A or the like as shown in FIG.
- the part 70A is transferred by a robot and placed on the sample stage 90A, the characteristics of the electronic part 70A are evaluated at high or low temperature, and then the electronic part 70A is again transferred to the tray 80A or the like by the robot.
- the process was complicated. That is, the present inventors have found that there is room for improvement in the conventional method for manufacturing an electronic device in terms of both simplifying the characteristic evaluation process of the electronic component and picking up the electronic component. It was.
- the inventors of the present invention have made extensive studies in order to achieve the above problems.
- the heat-resistant resin layer 10, the flexible resin layer 20, and the adhesive resin layer 30 are used in this order, and the heat-resistant resin layer 50 is used before the pickup process of the electronic component 70. It was found that by peeling 10, the simplification of the characteristic evaluation process of the electronic component and the pick-up property of the electronic component can both be achieved. That is, by performing the step (B) using the adhesive laminated film 50 having the heat resistant resin layer 10, the heat resistant resin layer 10 suppresses deformation and melting of the adhesive resin layer 30 and the electronic component 70. Can be suppressed, and as a result, the electronic component 70 can be picked up more accurately in the step (D).
- the adhesive resin layer 30 and the flexible layer are removed in the step (D).
- the stretchability and flexibility of the film including the conductive resin layer 20 are improved, and the electronic component 70 can be more easily picked up in the step (D).
- the characteristic evaluation of the electronic component 70 can be performed at a high temperature or a low temperature while being stuck on the adhesive laminated film 50, the electronic component 70 is changed from the adhesive laminated film 50 before the characteristic evaluation of the electronic component 70. It is not necessary to pick up and move it to a tray or the like, and the characteristic evaluation process of the electronic component 70 can be simplified.
- the characteristic evaluation process of the electronic component 70 can be simplified, and the electronic component 70 can be manufactured. It becomes possible to pick up accurately.
- Such a structure is obtained by, for example, attaching the electronic component 70 on the adhesive resin layer 30 of the adhesive laminated film 50 and separating the electronic component 70 on the adhesive laminated film 50 as necessary. Can be produced.
- the method for manufacturing the structure 100 will be specifically described by taking the case where the electronic component 70 is a semiconductor substrate and a semiconductor chip as an example.
- a semiconductor substrate is affixed on the adhesive resin layer 30 of the adhesive laminated film 50.
- the semiconductor substrate to be attached to the adhesive laminated film 50 include substrates (for example, wafers) made of silicon, germanium, gallium-arsenic, gallium-phosphorus, gallium-arsenic-aluminum, or the like.
- the semiconductor substrate a semiconductor substrate having a circuit formed on the surface is preferably used.
- the adhesive laminated film 50 may be attached by a human hand, but is usually performed by an automatic attaching machine equipped with a roll-shaped surface protective film.
- There is no particular limitation on the temperature of the adhesive laminated film 50 and the semiconductor substrate at the time of attachment but 25 ° C. to 80 ° C. is preferable.
- the pressure between the adhesive laminated film 50 and the semiconductor substrate at the time of attachment is not particularly limited, but is preferably 0.3 MPa to 0.5 MPa.
- the semiconductor substrate on the adhesive laminated film 50 is diced into semiconductor chips.
- the dicing can be performed using a dicing blade (dicing saw), laser light, or the like.
- the electronic component 70 in the step (A) includes both a plurality of divided semiconductor chips obtained by full-cut dicing and a plurality of semiconductor chips before divided obtained by stealth dicing.
- the characteristic evaluation of the electronic component 70 is, for example, an operation check test of the electronic component 70, and can be performed using a probe card 92 having a probe terminal 95 as shown in FIG.
- the probe terminal 95 connected to the tester via the probe card 92 is brought into contact with the terminal 75 of the electronic component 70.
- the step (B) it is preferable to evaluate the characteristics of the electronic component 70 in a temperature environment of 0 ° C. or lower or 50 ° C. or higher and 200 ° C. or lower, and the characteristic evaluation of the electronic component 70 in a temperature environment of 60 ° C. or higher and 180 ° C. or lower. Is more preferable, and it is more preferable to evaluate the characteristics of the electronic component 70 in a temperature environment of 80 ° C. or higher and 160 ° C. or lower. By doing so, it is possible to accelerate the deterioration of the electronic component 70 in which the cause of the occurrence of the defect is inherent, to cause the initial failure of the electronic component 70 early, and to remove the defective product. Thereby, the electronic component 70 excellent in reliability can be obtained with a high yield. For example, by placing the structure 100 in a thermostatic bath or oven, or heating it with a heater provided on the sample stage 90, the above temperature environment can be obtained.
- the heat-resistant resin layer 10 is peeled from the adhesive laminated film 50 after the step (B).
- peeling of the adhesive laminated film 50 may be performed by hand, it can be generally performed by an apparatus called an automatic peeling machine.
- the electronic component 70 is picked up from the adhesive resin layer 30 after the step (C). With this pickup, the electronic component 70 can be peeled from the adhesive laminated film 50.
- the electronic component 70 can be picked up by a known method.
- the interval between the adjacent electronic components 70 is expanded. It is preferable to pick up the electronic component 70 from the layer 30. By doing so, the interval between the adjacent electronic components 70 is increased, so that the electronic components 70 can be easily picked up from the adhesive resin layer 30. Furthermore, the adhesive force between the electronic component 70 and the adhesive resin layer 30 is reduced due to the shear stress between the electronic component 70 and the adhesive resin layer 30 caused by the expansion of the adhesive resin layer 30 in the in-plane direction. The electronic component 70 can be easily picked up from the conductive resin layer 30.
- the adhesive resin layer 30 is irradiated with radiation before the step (D), and the adhesive resin layer 30 is cross-linked, whereby the adhesive resin for the electronic component 70 is obtained.
- FIG. By performing the step (E), the electronic component 70 can be easily picked up from the adhesive resin layer 30. Moreover, it can suppress that the surface of the electronic component 70 is contaminated with the adhesive component which comprises the adhesive resin layer 30.
- FIG. Radiation is irradiated from the surface on the opposite side to the surface at the side of the adhesive resin layer 30 of the adhesive laminated film 50, for example.
- the dose of ultraviolet rays applied to the adhesive laminated film 50 is preferably 100 mJ / cm 2 or more, and more preferably 350 mJ / cm 2 or more.
- the dose of ultraviolet rays is equal to or more than the lower limit, the adhesive strength of the adhesive resin layer 30 can be sufficiently reduced, and as a result, generation of adhesive residue on the surface of the electronic component 70 can be further suppressed.
- the upper limit of the dose of ultraviolet rays to be irradiated to the adhesive laminated film 50 is not particularly limited, from the viewpoint of productivity, for example, at 1500 mJ / cm 2 or less, preferably 1200 mJ / cm 2 or less.
- Ultraviolet irradiation can be performed using, for example, a high-pressure mercury lamp or LED.
- the step (E) may be performed before the step (B) or the step (C) or after the step (C), but before the step (B), the step (B) and the step (C ) Or between step (C) and step (D), and more preferably before step (B).
- the method for manufacturing an electronic device according to the present embodiment may include other steps other than those described above. As other steps, known steps can be used in the method of manufacturing an electronic device.
- step (D) is performed, it is generally performed in a process of mounting the obtained electronic component 70 such as a semiconductor chip on a circuit board, a manufacturing process of an electronic component such as a wire bonding process and a sealing process.
- the optional step may be further performed.
- the semiconductor substrate which has a circuit surface as the electronic component 70 you may further have the process of forming a protective film in an electrode formation and a non-circuit surface by the method normally used for the circuit formation surface of a semiconductor substrate, for example. .
- the manufacturing method provided with the process of performing electrode formation and resin sealing is also called WLP (Wafer Level Package).
- An electronic device obtained by forming a redistribution layer in a wide region exceeding the semiconductor chip area is also called a fan-out package.
- Heat-resistant resin layer 1 polyethylene terephthalate (PET) film (manufactured by Unitika, product name: Emblet (registered trademark) S-50, melting point: 260 ° C., decomposition temperature: about 400 ° C., thickness: 50 ⁇ m)
- PET polyethylene terephthalate
- Flexible resin 1 Polyester elastomer (product name: Hytrel (registered trademark) 4767N, melting point: 200 ° C., manufactured by Toray DuPont)
- Adhesive 1 UV-crosslinking acrylic adhesive
- 48 parts by weight of ethyl acrylate, 27 parts by weight of 2-ethylhexyl acrylate, 20 parts by weight of methyl acrylate, 5 parts by weight of glycidyl methacrylate, and 0.5 parts by weight of benzoyl peroxide as a polymerization initiator were mixed. This was dropped into a nitrogen-substituted flask containing 65 parts by weight of toluene and 50 parts by weight of ethyl acetate over 5 hours at 80 ° C. with stirring, and further stirred for 5 hours to be reacted.
- Adhesive resin solution 1 In deionized pure water, 0.5 parts by mass of 4,4′-azobis-4-cyanovaleric acid (manufactured by Otsuka Chemical Co., Ltd., trade name: ACVA) as a polymerization initiator and a monomer (A ) 74.3 parts by weight of acrylate-n-butyl and 13.7 parts by weight of methyl methacrylate, 9 parts by weight of 2-hydroxyethyl methacrylate as the monomer (B), and poly as a polymerizable surfactant.
- 4,4′-azobis-4-cyanovaleric acid manufactured by Otsuka Chemical Co., Ltd., trade name: ACVA
- Adhesive resin solution 2 In deionized pure water, 0.5 parts by mass of ammonium persulfate as a polymerization initiator, 63 parts by mass of 2-ethylhexyl acrylate as monomer (A), 21 parts by mass of n-butyl acrylate, And 9 parts by weight of methyl methacrylate, 3 parts by weight of 2-hydroxyethyl methacrylate as monomer (B), and polytetramethylene glycol diacrylate (manufactured by NOF Corporation, trade name; ADT-) as monomer (C) 250) 1 part by mass, a polymerizable surfactant having a polymerizable 1-propenyl group introduced into the benzene ring of the ammonium salt of polyoxyethylene nonylphenyl ether sulfate (manufactured by Daiichi Kogyo Seiyaku Co., Ltd .; 2 parts by weight of each product name: Aqualon HS-1025), and
- Adhesive coating solution 1 57.4 parts by mass of the adhesive resin solution 1, 42.6 parts by mass of the adhesive resin solution 2, 0.4 parts by mass of dimethylethanolamine, and an epoxy compound as a crosslinking agent (Ex- 1610) was mixed with 9.3 parts by mass to obtain an adhesive coating solution 1.
- Adhesive coating solution 2 Adhesive resin solution 1 was mixed with 100 parts by mass, 10.0 parts by mass of polypropylene glycol, and 1.7 parts by mass of aziridine compound (Chemite Pz-33, manufactured by Nippon Shokubai Co., Ltd.) as a crosslinking agent. Agent coating solution 2 was obtained.
- Example 1 After the pressure-sensitive adhesive coating solution 1 was applied on the heat-resistant resin layer 1, it was dried to form an adhesive layer having a thickness of 20 ⁇ m. Next, a film (thickness: 110 ⁇ m, elastic modulus: 55 MPa (according to JIS K7161; sample width: 10 mm, distance between chucks: 30 mm, tensile speed: 300 mm) formed of a flexible resin 1 serving as a flexible resin layer on the adhesive layer )))) was laminated. Subsequently, after apply
- Example 2 A pressure-sensitive adhesive laminated film was obtained in the same manner as in Example 1 except that the thickness of the adhesive layer was changed to 10 ⁇ m. The following evaluation was performed about the obtained adhesive laminated film. The obtained results are shown in Table 1.
- Example 1 A pressure-sensitive adhesive laminated film was obtained in the same manner as in Example 1 except that no adhesive layer was formed on the heat-resistant resin layer 1. The following evaluation was performed about the obtained adhesive laminated film. The obtained results are shown in Table 1.
- the strength (N / 25 mm) at that time was measured twice, and the average value was defined as P 0 .
- the adhesive laminate film is formed between the heat-resistant resin layer and the flexible resin layer in the same manner as the method for measuring the peel strength P 0. the peel strength P 1 was measured.
- the heat resistant resin layer side was the hot plate side.
- X The heat-resistant resin layer could be peeled from the flexible resin layer, but the peeling was heavy, and the silicon chip was misaligned and the adhesive resin layer and the flexible resin layer were deformed while peeling the heat-resistant resin layer. The silicon chip could not be picked up accurately.
- XX The heat-resistant resin layer and the flexible resin layer were firmly bonded, and the heat-resistant resin layer could not be peeled from the flexible resin layer.
- the adhesive laminates of Examples 1 and 2 having a peel strength P 0 of 0.01 N / 25 mm or more and 2.0 N / 25 mm or less and a peel strength P 1 of 0.05 N / 25 mm or more and 1.5 N / 25 mm or less.
- the film can be satisfactorily peeled off the heat-resistant resin layer from the flexible resin layer even after heat treatment at 160 ° C. for 4 hours on a hot plate, and the positional deviation of the silicon chip, the adhesive resin layer, and the flexible resin layer Deformation did not occur, and the subsequent silicon chip pickup could be performed with high accuracy. That is, according to the adhesive laminated film 50 according to the present embodiment, it can be understood that the electronic component characteristic evaluation process can be simplified and the electronic component can be picked up with high accuracy.
- the adhesive laminated films of Comparative Examples 1 and 2 were inferior in pick-up property of electronic parts. That is, it can be understood that the adhesive laminated films of Comparative Examples 1 and 2 cannot achieve both simplification of the characteristic evaluation process of the electronic component and pickup property of the electronic component.
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Abstract
Description
この電子部品の特性評価工程では、例えば、高温または低温で電子部品の特性評価をおこなう。こうすることで、不良発生の要因が内在している電子部品の劣化を加速でき、電子部品の初期不良を早期に発生させ、その不良品を除去することができる。これにより、信頼性に優れた電子部品を効率よく得ることができる。
まず、本発明者は、従来の電子装置の製造方法において、高温または低温で電子部品の特性評価をおこなう際に、電子部品を仮固定する粘着性フィルムが変形したり、溶融したりすることを知見した。この場合、粘着性フィルム上の電子部品の位置ズレが起こり、その後の電子部品のピックアップが上手くできなくなってしまう。
すなわち、従来の粘着性フィルムには、高温または低温での電子部品の特性評価の後における電子部品のピックアップ性において改善の余地があった。
すなわち、本発明者らは、従来の電子装置の製造方法には、電子部品の特性評価工程の簡略化と、電子部品のピックアップ性とを両立させるという観点において、改善の余地があることを見出した。
耐熱性樹脂層、柔軟性樹脂層および粘着性樹脂層をこの順番に有する粘着性積層フィルムであって、
JIS Z0237に準拠し下記の方法で測定される、上記耐熱性樹脂層と上記柔軟性樹脂層との間の剥離強度P0が0.01N/25mm以上2.0N/25mm以下であり、かつ、上記粘着性積層フィルムを160℃で4時間熱処理した後の、上記耐熱性樹脂層と上記柔軟性樹脂層との間の剥離強度P1が0.05N/25mm以上1.5N/25mm以下である粘着性積層フィルム。
(剥離強度の測定方法)
上記粘着性樹脂層がシリコンウェハに接するように、上記粘着性積層フィルムを上記シリコンウェハに貼り付ける。次いで、引張試験機を用いて、上記耐熱性樹脂層を上記柔軟性樹脂層から、25℃、引張速度300mm/分の条件で180度方向に剥離し、そのときの強度(N/25mm)を2回測定し、その平均値を剥離強度とする。
[2]
上記[1]に記載の粘着性積層フィルムにおいて、
JIS K7161に準拠し、サンプル幅10mm、チャック間距離30mm、引張速度300mm/分の条件で測定される、上記柔軟性樹脂層の160℃での引張弾性率(E')が1MPa以上300MPa以下である粘着性積層フィルム。
[3]
上記[1]または[2]に記載の粘着性積層フィルムにおいて、
上記耐熱性樹脂層の融点が200℃以上である、あるいは上記耐熱性樹脂層は融点を有さない粘着性積層フィルム。
[4]
上記[1]乃至[3]のいずれか一つに記載の粘着性積層フィルムにおいて、
上記柔軟性樹脂層の融点が100℃以上250℃以下である粘着性積層フィルム。
[5]
上記[1]乃至[4]のいずれか一つに記載の粘着性積層フィルムにおいて、
上記耐熱性樹脂層を構成する耐熱性樹脂がポリイミド、ポリアミド、およびポリエステルからなる群から選択される一種または二種以上を含む粘着性積層フィルム。
[6]
上記[1]乃至[5]のいずれか一つに記載の粘着性積層フィルムにおいて、
上記柔軟性樹脂層を構成する柔軟性樹脂がポリエステル系エラストマー、ポリアミド系エラストマー、ポリイミド系エラストマー、およびポリブチレンテレフタレートからなる群から選択される一種または二種以上を含む粘着性積層フィルム。
[7]
上記[1]乃至[6]のいずれか一つに記載の粘着性積層フィルムにおいて、
上記耐熱性樹脂層と上記柔軟性樹脂層との間に接着層をさらに有する粘着性積層フィルム。
[8]
上記[7]に記載の粘着性積層フィルムにおいて、
上記接着層が(メタ)アクリル系粘着剤を含む粘着性積層フィルム。
[9]
上記[8]に記載の粘着性積層フィルムにおいて、
上記(メタ)アクリル系粘着剤が(メタ)アクリル系粘着性樹脂および架橋剤を含み、
上記(メタ)アクリル系粘着剤中の上記架橋剤の含有量が、上記(メタ)アクリル系粘着性樹脂100質量部に対して、5質量部以上である粘着性積層フィルム。
[10]
上記[9]に記載の粘着性積層フィルムにおいて、
上記架橋剤がエポキシ系化合物、イソシアネート系化合物およびアジリジン系化合物から選択される一種または二種以上を含む粘着性積層フィルム。
[11]
上記[9]または[10]に記載の粘着性積層フィルムにおいて、
上記(メタ)アクリル系粘着剤に含まれる上記(メタ)アクリル系粘着性樹脂が、分子中に炭素-炭素二重結合を2以上有する多官能性モノマー由来の構成単位を含む粘着性積層フィルム。
[12]
上記[1]乃至[11]のいずれか一つに記載の粘着性積層フィルムにおいて、
上記粘着性樹脂層を構成する粘着剤が(メタ)アクリル系粘着剤、シリコーン系粘着剤、ウレタン系粘着剤、オレフィン系粘着剤、およびスチレン系粘着剤から選択される一種または二種以上を含む粘着性積層フィルム。
[13]
上記[1]乃至[12]のいずれか一つに記載の粘着性積層フィルムにおいて、
上記粘着性積層フィルムの全光線透過率が80%以上である粘着性積層フィルム。
[14]
上記[1]乃至[13]のいずれか一つに記載の粘着性積層フィルムにおいて、
ダイシングテープである粘着性積層フィルム。
[15]
上記[1]乃至[14]のいずれか一つに記載の粘着性積層フィルムにおいて、
耐熱性樹脂層、柔軟性樹脂層および粘着性樹脂層をこの順番に有する粘着性積層フィルムと、上記粘着性樹脂層上に貼り付けられた1または2以上の電子部品と、を備える構造体を準備する工程(A)と、
上記粘着性樹脂層上に貼り付けられた状態で、上記電子部品の特性を評価する工程(B)と、
上記工程(B)の後に上記耐熱性樹脂層を上記粘着性積層フィルムから剥離する工程(C)と、
上記工程(C)の後に上記粘着性樹脂層から上記電子部品をピックアップする工程(D)と、
を備える電子装置の製造方法における上記粘着性積層フィルムに用いられる粘着性積層フィルム。
[16]
耐熱性樹脂層、柔軟性樹脂層および粘着性樹脂層をこの順番に有する粘着性積層フィルムと、上記粘着性樹脂層上に貼り付けられた1または2以上の電子部品と、を備える構造体を準備する工程(A)と、
上記粘着性樹脂層上に貼り付けられた状態で、上記電子部品の特性を評価する工程(B)と、
上記工程(B)の後に上記耐熱性樹脂層を上記粘着性積層フィルムから剥離する工程(C)と、
上記工程(C)の後に上記粘着性樹脂層から上記電子部品をピックアップする工程(D)と、
を備える電子装置の製造方法であって、
上記粘着性積層フィルムとして上記[1]乃至[15]のいずれか一つに記載の粘着性積層フィルムを用いる電子装置の製造方法。
[17]
上記[16]に記載の電子装置の製造方法において、
上記工程(B)では、0℃以下または50℃以上200℃以下の温度環境下で上記電子部品の特性評価をおこなう電子装置の製造方法。
[18]
上記[16]または[17]に記載の電子装置の製造方法において、
上記工程(D)では、上記粘着性樹脂層における上記電子部品が貼り付けられた領域をフィルムの面内方向に拡張させて、隣接する上記電子部品間の間隔を拡大させた状態で、上記粘着性樹脂層から上記電子部品をピックアップする電子装置の製造方法。
以下、本実施形態に係る粘着性積層フィルム50について説明する。
図1は、本発明に係る実施形態の粘着性積層フィルム50の構造の一例を模式的に示した断面図である。図2は、本発明に係る実施形態の電子装置の製造方法の一例を模式的に示した断面図である。
(剥離強度の測定方法)
粘着性樹脂層30がシリコンウェハに接するように、粘着性積層フィルム50を上記シリコンウェハに貼り付ける。次いで、引張試験機を用いて、耐熱性樹脂層10を柔軟性樹脂層20から、25℃、引張速度300mm/分の条件で180度方向に剥離し、そのときの強度(N/25mm)を2回測定し、その平均値を剥離強度とする。
そして、本発明者らは上記知見を元にさらに鋭意検討した結果、耐熱性樹脂層10と柔軟性樹脂層20との間の剥離強度P0および剥離強度P1が上記範囲内である粘着性積層フィルム50が、電子部品70のピックアップ工程の前における耐熱性樹脂層10と柔軟性樹脂層20との間の接着性を維持しながら、電子部品70の特性評価工程後に耐熱性樹脂層10を柔軟性樹脂層20から良好に剥離させることができることを初めて見出した。
すなわち、本実施形態に係る粘着性積層フィルム50は、耐熱性樹脂層10と柔軟性樹脂層20との間の剥離強度P0を上記下限値以上とすることで、電子部品70のピックアップ工程の前における耐熱性樹脂層10と柔軟性樹脂層20との間の接着性を良好に保つことが可能となる。
また、本実施形態に係る粘着性積層フィルム50は、耐熱性樹脂層10と柔軟性樹脂層20との間の剥離強度P1を上記上限値以下とすることで、電子部品70の特性評価工程後に耐熱性樹脂層10を柔軟性樹脂層20から良好に剥離させることができる。
また、本実施形態に係る粘着性積層フィルム50において、耐熱性樹脂層10と柔軟性樹脂層20との間の剥離強度P1が0.05N/25mm以上1.5N/25mm以下であるが、好ましくは1.0N/25mm以下、より好ましくは0.7N/25mm以下、特に好ましくは0.5N/25mm以下、そして、好ましくは0.08N/25mm以上、より好ましくは0.10N/25mm以上である。
これらの中でも、例えば接着層を構成する粘着性樹脂における架橋剤の種類や配合割合等が、耐熱性樹脂層10と柔軟性樹脂層20との間の剥離強度P0および剥離強度P1を所望の数値範囲とするための要素として挙げられる。
ここで、本実施形態において、耐熱性とは高温または低温におけるフィルムや樹脂層の寸法安定性を意味する。すなわち、耐熱性に優れるフィルムや樹脂層ほど、高温または低温における膨張や収縮、軟化等の変形や溶融等が起き難いことを意味する。
耐熱性樹脂層10は、粘着性積層フィルム50の取り扱い性や機械的特性、耐熱性等の特性をより良好にすることを目的として設けられる層である。
耐熱性樹脂層10は、高温または低温で電子部品70の特性評価をおこなう際に、電子部品70の位置ズレが起きるほどの変形や溶融が起きない程度の耐熱性があれば特に限定されないが、例えば、耐熱性樹脂フィルムを用いることができる。
このような耐熱性樹脂層10を用いると、高温または低温で電子部品70の特性評価をおこなう際の粘着性積層フィルム50の変形をより一層抑制することができる。
また、耐熱性樹脂層10を形成するために使用する樹脂フィルムの形態としては、延伸フィルムであってもよいし、一軸方向または二軸方向に延伸したフィルムであってもよいが、耐熱性樹脂層10の耐熱性および機械的強度を向上させる観点から、一軸方向または二軸方向に延伸したフィルムであることが好ましい。
耐熱性樹脂層10は他の層との接着性を改良するために、表面処理を行ってもよい。具体的には、コロナ処理、プラズマ処理、アンダーコート処理、プライマーコート処理等を行ってもよい。
剥離可能に積層する方法は特に限定されないが、例えば、剥離可能な接着層(図示しない)を介して積層する方法や、耐熱性樹脂層10の柔軟性樹脂層20と接する側の表面の表面粗さを調整し、かつ、その表面を離型処理する方法等が挙げられる。
加熱膨張型粘着剤は粘着剤中に熱膨張性微粒子や発泡剤等が分散している粘着剤をいう。粘着剤としては、一般的に公知の粘着剤を用いることができ、例えば、(メタ)アクリル系粘着剤、シリコーン系粘着剤、ゴム系粘着剤、ポリウレタン系粘着剤、ポリビニルエーテル系粘着剤等が挙げられる。
熱膨張性微粒子としては、例えば、イソブタン、プロパン、ペンタン等の加熱によって容易にガス化して膨張する物質を、弾性を有する殻内に内包させた微粒子が挙げられる。
発泡剤としては、例えば、熱分解して、水、炭酸ガス、窒素を発生させる能力を有する化学物質等が挙げられる。
加熱により、熱膨張性微粒子や発泡剤が膨張すると、接着層の表面状態が変化し、柔軟性樹脂層20と耐熱性樹脂層10との粘着力の昂進を抑制することができ、その結果、柔軟性樹脂層20から耐熱性樹脂層10を容易に剥離することができる。
収縮性フィルムを基材とした両面粘着性フィルムに使用される収縮フィルムとしては、加熱により収縮する熱収縮フィルムが挙げられる。例えば、ポリエチレンテレフタレート、ポリエチレン、ポリスチレン、ポリプロピレン、ポリアミド、ポリウレタン、ポリ塩化ビニル、ポリ塩化ビニリデン等の一軸または二軸延伸フィルム等を挙げることができる。
収縮性フィルムの両面に設けられる粘着剤としては、一般的に公知の粘着剤を用いることができ、例えば、(メタ)アクリル系粘着剤、シリコーン系粘着剤、ゴム系粘着剤、ポリウレタン系粘着剤、ポリビニルエーテル系粘着剤等が挙げられる。
加熱により、基材の収縮性フィルムが収縮すると、接着層の表面状態が変化し、柔軟性樹脂層20と耐熱性樹脂層10との粘着力の昂進を抑制することができ、その結果、柔軟性樹脂層20から耐熱性樹脂層10を容易に剥離することができる。
高温または低温での処理後も粘着力の昂進を抑制できる耐熱性接着層を構成する粘着剤は、(メタ)アクリル系粘着剤、シリコーン系粘着剤、ウレタン系粘着剤、オレフィン系粘着剤、スチレン系粘着剤等が挙げられる。
ここで、(メタ)アクリル系粘着剤は(メタ)アクリル系粘着性樹脂を必須成分として含んでいる。シリコーン系粘着剤はシリコーン系粘着性樹脂を必須成分として含んでいる。ウレタン系粘着剤はウレタン系粘着性樹脂を必須成分として含んでいる。
これらの中でも耐熱性樹脂層10と柔軟性樹脂層20との間の剥離強度の調整をより容易にする観点等から、(メタ)アクリル系粘着剤が好ましい。
本実施形態において、(メタ)アクリル酸アルキルエステルとは、アクリル酸アルキルエステル、メタクリル酸アルキルエステル、またはこれらの混合物を意味する。
本実施形態に係る(メタ)アクリル系粘着性樹脂において、(メタ)アクリル酸アルキルエステルモノマー単位(A)の含有量は、(メタ)アクリル系粘着性樹脂中の全モノマー単位の合計を100質量%としたとき、10質量%以上98.9質量%以下であることが好ましく、85質量%以上95質量%以下であることがより好ましい。
本実施形態に係る(メタ)アクリル系粘着性樹脂において、モノマー単位(B)の含有量は、(メタ)アクリル系粘着性樹脂中の全モノマー単位の合計を100質量%としたとき、1質量%以上40質量%以下であることが好ましく、1質量%以上20質量%以下であることがより好ましく、1質量%以上10質量%以下であることがさらに好ましい。
重合性界面活性剤は、モノマー(A)、モノマー(B)およびモノマー(C)と共重合する性質を有すると共に、乳化重合する場合には乳化剤としての作用を有する。
これらは単独で使用してもよいし、2種以上を併用してもよい。これらの中でも、接着層の耐熱性や密着力とのバランスをより一層向上させる観点から、ポリプロピレングリコールジ(メタ)アクリレートおよびポリテトラメチレングリコールジ(メタ)アクリレートから選択される一種または二種以上を含むことが好ましく、ポリテトラメチレングリコールジ(メタ)アクリレートがより好ましい。
ラジカル重合反応によって重合する際、ラジカル重合開始剤として、ベンゾイルパーオキサイド、ジ-t-ブチルパーオキサイド、ジクミルパーオキサイド、3,3,5-トリメチルヘキサノイルパーオキサイド、ジ-2-エチルヘキシルパーオキシジカーボネート、メチルエチルケトンパーオキサイド、t-ブチルパーオキシフタレート、t-ブチルパーオキシベンゾエート、ジ-t-ブチルパーオキシアセテート、t-ブチルパーオキシイソブチレート、t-ブチルパーオキシ-2-ヘキサノエート、t-ブチルパーオキシ-2-エチルヘキサノエート、t-ブチルパーオキシ-3,5,5-トリメチルヘキサノエート、アセチルパーオキサイド、イソブチリルパーオキサイド、オクタノイルパーオキサイド、t-ブチルパーオキサイド、ジ-t-アミルパーオキサイド等の有機過酸化物;過硫酸アンモニウム、過硫酸カリウム、過硫酸ナトリウム等の無機過酸化物;2,2'-アゾビスイソブチロニトリル、2,2'-アゾビス-2-メチルブチロニトリル、4,4'-アゾビス-4-シアノバレリックアシッド等のアゾ化合物が挙げられる。
架橋性の官能基を1分子中に2個以上有する架橋剤は、(メタ)アクリル系粘着性樹脂が有する官能基と反応させ、粘着力および凝集力を調整するために用いる。
このような架橋剤としては、ソルビトールポリグリシジルエーテル、ポリグリセロールポリグリシジルエーテル、ペンタエリスリトールポリグリシジルエーテル、ジグリセロールポリグリシジルエーテル、グリセロールポリグリシジルエーテル、ネオペンチルグリコールジグリシジルエーテル、レソルシンジグリシジルエーテル等のエポキシ系化合物;テトラメチレンジイソシアネート、ヘキサメチレンジイソシアネート、トリメチロールプロパンのトルエンジイソシアネート3付加物、ポリイソシアネート、ジフェニルメタンジイソシアネート、トリレンジイソシアネート等のイソシアネート系化合物;トリメチロールプロパン-トリ-β-アジリジニルプロピオネート、テトラメチロールメタン-トリ-β-アジリジニルプロピオネート、N,N'-ジフェニルメタン-4,4'-ビス(1-アジリジンカルボキシアミド)、N,N'-ヘキサメチレン-1,6-ビス(1-アジリジンカルボキシアミド)、N,N'-トルエン-2,4-ビス(1-アジリジンカルボキシアミド)、トリメチロールプロパン-トリ-β-(2-メチルアジリジン)プロピオネート等のアジリジン系化合物;N,N,N',N'-テトラグリシジル-m-キシレンジアミン、1,3-ビス(N,N'-ジグリシジルアミノメチル)シクロヘキサン等の4官能性エポキシ系化合物;ヘキサメトキシメチロールメラミン等のメラミン系化合物等が挙げられる。これらは単独で使用してもよいし、2種以上を併用してもよい。
これらの中でも、エポキシ系化合物、イソシアネート系化合物およびアジリジン系化合物から選択される一種または二種以上を含むことが好ましく、接着層の耐熱性や密着力とのバランスをより一層向上させる観点から、エポキシ系化合物がより好ましい。
また、(メタ)アクリル系粘着剤中の架橋剤の含有量を調整することにより、耐熱性樹脂層10と柔軟性樹脂層20との間の剥離強度P0および剥離強度P1を調整することができる。
紫外線重合開始剤の例には、メトキシアセトフェノン等のアセトフェノン系光重合開始剤;4-(2-ヒドロキシエトキシ)フェニル(2-ヒドロキシ-2-プロピル)ケトン等のα-ケトール化合物;ベンジルジメチルケタール等のケタール系化合物;ベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル、等のベンゾイン系光重合開始剤;ベンゾフェノン、ベンゾイル安息香酸等のベンゾフェノン系光重合開始剤等が挙げられる。
粘着剤中の紫外線重合開始剤の含有量は、粘着性樹脂100質量部に対し、0.1質量部以上10質量部以下であることが好ましく、2.5質量部以上5質量部以下であることがより好ましい。
粘着剤塗布液を塗布する方法としては、従来公知の塗布方法、例えば、ロールコーター法、リバースロールコーター法、グラビアロール法、バーコート法、コンマコーター法、ダイコーター法等が採用できる。塗布された粘着剤の乾燥条件には特に制限はないが、一般的には、80~200℃の温度範囲において、10秒~10分間乾燥することが好ましい。さらに好ましくは、80~170℃において、15秒~5分間乾燥する。架橋剤と粘着剤との架橋反応を十分に促進させるために、粘着剤塗布液の乾燥が終了した後、40~80℃において5~300時間程度加熱してもよい。
ここで、JIS-B0601により規定される、耐熱性樹脂層10の柔軟性樹脂層20と接する側の表面の表面粗さ(Ra)は好ましくは0.10μm以上10μm以下である。
また、耐熱性樹脂層10の柔軟性樹脂層20と接する側の表面がシリコーンやポリテトラフルオロエチレンなどの離型剤により離型処理されていることが好ましい。
柔軟性樹脂層20は、粘着性積層フィルム50の柔軟性や伸縮性等の特性を良好にすることを目的として設けられる層である。
柔軟性樹脂層20を設けることにより、粘着性積層フィルム50の伸縮性や柔軟性が向上し、電子部品70をピックアップする工程において粘着性積層フィルム50を面内方向に拡張させることがより容易にできる。
上記柔軟性樹脂層20を構成する柔軟性樹脂としては、例えば、ポリエステル系エラストマー、ポリアミド系エラストマー、ポリイミド系エラストマー、およびポリブチレンテレフタレート等から選択される一種または二種以上が挙げられる。
このような柔軟性樹脂層20を用いると、高温または低温で電子部品70の特性評価をおこなう際の粘着性積層フィルム50の熱膨張をより一層抑制することができる。
粘着性樹脂層30は粘着性積層フィルム50を電子部品70に貼り付ける際に、電子部品70の表面に接触して粘着する層である。
放射線架橋型粘着剤としては、紫外線架橋型粘着剤が好ましい。
また、(メタ)アクリル系共重合体を構成するコモノマーとしては、例えば、酢酸ビニル、(メタ)アクリルニトリル、(メタ)アクリルアマイド、スチレン、(メタ)アクリル酸、イタコン酸、(メタ)アクリルアマイド、メチロール(メタ)アクリルアマイド、無水マレイン酸等が挙げられる。これらのコモノマーは一種単独で用いてもよく、二種以上を併用して用いてもよい。
なお、粘着剤が、ポリマーの側鎖に炭素-炭素二重結合を有する放射線架橋型ポリマーである場合は、架橋性化合物を加えなくてもよい。
粘着剤塗布液を塗布する方法としては、従来公知の塗布方法、例えば、ロールコーター法、リバースロールコーター法、グラビアロール法、バーコート法、コンマコーター法、ダイコーター法等が採用できる。塗布された粘着剤の乾燥条件には特に制限はないが、一般的には、80~200℃の温度範囲において、10秒~10分間乾燥することが好ましい。更に好ましくは、80~170℃において、15秒~5分間乾燥する。架橋剤と粘着剤との架橋反応を十分に促進させるために、粘着剤塗布液の乾燥が終了した後、40~80℃において5~300時間程度加熱してもよい。
本実施形態に係る粘着性積層フィルム50は、粘着性樹脂層30上に離型フィルムをさらに積層させてもよい。離型フィルムとしては、例えば、離型処理が施されたポリエステルフィルム等が挙げられる。
次に、本実施形態に係る粘着性積層フィルム50の製造方法の一例について説明する。
本実施形態に係る粘着性積層フィルム50は、例えば、耐熱性樹脂層10の一方の面に柔軟性樹脂層20を押出しラミネート法によって形成し、柔軟性樹脂層20上に粘着剤塗布液を塗布し乾燥させることによって、粘着性樹脂層30を形成することにより得ることができる。
また、耐熱性樹脂層10と柔軟性樹脂層20とは共押出成形によって形成してもよいし、フィルム状の耐熱性樹脂層10とフィルム状の柔軟性樹脂層20とをラミネート(積層)して形成してもよい。
次に、本実施形態に係る電子装置の製造方法について説明する。図2は、本発明に係る実施形態の電子装置の製造方法の一例を模式的に示した断面図である。
本実施形態に係る電子装置の製造方法は、例えば、以下の4つの工程を少なくとも備えている。
(A)耐熱性樹脂層10、柔軟性樹脂層20および粘着性樹脂層30をこの順番に有する粘着性積層フィルム50と、粘着性積層フィルム50の粘着性樹脂層30上に貼り付けられた1または2以上の電子部品70と、を備える構造体100を準備する工程
(B)粘着性樹脂層30上に貼り付けられた状態で、電子部品70の特性を評価する工程
(C)工程(B)の後に耐熱性樹脂層10を粘着性積層フィルム50から剥離する工程
(D)工程(C)の後に粘着性樹脂層30から電子部品70をピックアップする工程
そして、本実施形態に係る電子装置の製造方法では、粘着性積層フィルム50として、前述した本実施形態に係る粘着性積層フィルム50を使用する。
まず、本発明者は、従来の電子装置の製造方法において、高温または低温で電子部品の特性評価をおこなう際に、電子部品を仮固定する粘着性フィルムが変形したり、溶融したりすることを知見した。この場合、粘着性フィルム上の電子部品の位置ズレが起こり、その後の電子部品のピックアップが上手くできなくなってしまう。
さらに、本発明者の検討によれば、粘着性フィルムの変形や溶融を抑制するために、粘着性フィルムの耐熱性を高めると、粘着性フィルムの変形や溶融が抑制されて電子部品の位置ズレは改善される一方で、今度は粘着性フィルムの伸縮性や柔軟性が悪化し、電子部品のピックアップが上手くできなくなってしまうことが明らかになった。
すなわち、従来の粘着性フィルムには、高温または低温での電子部品の特性評価の後における電子部品のピックアップ性において改善の余地があった。
すなわち、本発明者らは、従来の電子装置の製造方法には、電子部品の特性評価工程の簡略化と、電子部品のピックアップ性とを両立させるという観点において、改善の余地があることを見出した。
すなわち、耐熱性樹脂層10を有する粘着性積層フィルム50を使用して上記工程(B)をおこなうことで、耐熱性樹脂層10により粘着性樹脂層30の変形や溶融が抑制されて電子部品70の位置ズレを抑制でき、その結果、上記工程(D)での電子部品70のピックアップをより正確におこなうことができる。
また、上記工程(B)の後に上記工程(C)をおこなうことで伸縮性や柔軟性に劣る耐熱性樹脂層10が除去されるため、上記工程(D)において、粘着性樹脂層30および柔軟性樹脂層20を備えるフィルムの伸縮性や柔軟性が良好になり、上記工程(D)での電子部品70のピックアップをより容易におこなうことができる。
さらに、粘着性積層フィルム50上に貼り付けたまま、高温または低温での電子部品70の特性評価をおこなうことができるため、電子部品70の特性評価の前に粘着性積層フィルム50から電子部品70をピックアップしてトレー等に移動させる必要がなく、電子部品70の特性評価工程を簡略化することができる。
以上のように、本実施形態に係る電子装置の製造方法によれば、上記工程(A)~(D)を備えることで、電子部品70の特性評価工程を簡略化できるとともに、電子部品70を精度よくピックアップすることが可能となる。
はじめに、粘着性積層フィルム50と、粘着性積層フィルム50の粘着性樹脂層30上に貼り付けられた1または2以上の電子部品70と、を備える構造体100を準備する。
以下、電子部品70が半導体基板および半導体チップである場合を例にして、構造体100の製造方法について具体的に説明する。
粘着性積層フィルム50に貼り付ける半導体基板としては、例えば、シリコン、ゲルマニウム、ガリウム-ヒ素、ガリウム-リン、ガリウム-ヒ素-アルミニウム等の基板(例えば、ウェハ)が挙げられる。
また、半導体基板としては、表面に回路が形成された半導体基板を用いることが好ましい。
貼り付け時の粘着性積層フィルム50および半導体基板の温度には特に制限はないが、25℃~80℃が好ましい。
また、貼り付け時の粘着性積層フィルム50と半導体基板との圧力については特に制限はないが、0.3MPa~0.5MPaが好ましい。
ここでいう「ダイシング」には、
(a)半導体基板に対してこの半導体基板の厚さと同じ深さの切れ込みを設けることによって半導体基板を分断し、複数の分断された半導体チップを得る操作(以下、「フルカットダイシング」ともいう)、および、
(b)レーザー光を照射することにより、半導体基板に対し、半導体基板の切断までには至らない変質領域を設け、複数の半導体チップを得る操作(以下、「ステルスダイシング」ともいう)が含まれる。
上記ダイシングは、ダイシングブレード(ダイシングソー)、レーザー光等を用いて行うことができる。
一方、ダイシングがステルスダイシングである場合には、ダイシングのみによっては半導体基板が複数の半導体チップに分断されるまでには至らず、ダイシング後の粘着性積層フィルム50の拡張によって半導体基板が分断されて複数の分断された半導体チップが得られる。
なお、工程(A)における電子部品70には、フルカットダイシングより得られる分断された複数の半導体チップと、ステルスダイシングにより得られる分断される前の複数の半導体チップの両方を含む。
次に、粘着性樹脂層30上に貼り付けられた状態で、電子部品70の特性を評価する。
電子部品70の特性評価は、例えば、電子部品70の動作確認テストであり、図2に示すように、プローブ端子95を有するプローブカード92を用いておこなうことができる。
例えば、電子部品70の端子75に対して、プローブカード92を介してテスタに接続されたプローブ端子95を接触させる。これにより、電子部品70とテスタとの間で、動作電力や動作試験信号等の授受を行い、電子部品70の動作特性の良否等を判別することができる。
例えば、構造体100を恒温槽やオーブンに入れるか、または試料台90に設けられたヒーターで加熱することによって、上記の温度環境下とすることができる。
次いで、工程(B)の後に耐熱性樹脂層10を粘着性積層フィルム50から剥離する。
粘着性積層フィルム50の剥離は手により行われる場合もあるが、一般には自動剥がし機と称される装置によって行うことができる。
次いで、工程(C)の後に粘着性樹脂層30から電子部品70をピックアップする。
このピックアップにより、粘着性積層フィルム50から電子部品70を剥離することができる。
電子部品70のピックアップは、公知の方法で行うことができる。
こうすることにより、隣接する電子部品70間の間隔が拡大するため、粘着性樹脂層30から電子部品70をピックアップし易くなる。さらに、粘着性樹脂層30の面内方向の拡張によって生じる、電子部品70と粘着性樹脂層30とのずり応力により、電子部品70と粘着性樹脂層30との粘着力が低下するため、粘着性樹脂層30から電子部品70をピックアップし易くなる。
本実施形態に係る電子装置の製造方法において、工程(D)の前に粘着性樹脂層30に対して放射線を照射し、粘着性樹脂層30を架橋させることで、電子部品70に対する粘着性樹脂層30の粘着力を低下させる工程(E)をさらに備えてもよい。
工程(E)をおこなうことで、粘着性樹脂層30から電子部品70を容易にピックアップすることができる。また、粘着性樹脂層30を構成する粘着成分により電子部品70の表面が汚染されることを抑制することができる。
放射線は、例えば、粘着性積層フィルム50の粘着性樹脂層30側の面とは反対側の面から照射される。
放射線として紫外線を用いる場合、粘着性積層フィルム50に対して照射する紫外線の線量は、100mJ/cm2以上が好ましく、350mJ/cm2以上がより好ましい。
紫外線の線量が上記下限値以上であると、粘着性樹脂層30の粘着力を十分に低下させることができ、その結果、電子部品70表面に糊残りが発生することをより抑制することができる。
また、粘着性積層フィルム50に対して照射する紫外線の線量の上限は特に限定されないが、生産性の観点から、例えば、1500mJ/cm2以下であり、好ましくは1200mJ/cm2以下である。
紫外線照射は、例えば、高圧水銀ランプやLEDを用いておこなうことができる。
工程(E)は工程(B)または工程(C)の前におこなってもよいし、工程(C)の後におこなってもよいが、工程(B)の前、工程(B)と工程(C)との間あるいは工程(C)と工程(D)との間におこなうことが好ましく、工程(B)の前に行うことがより好ましい。
本実施形態に係る電子装置の製造方法は、上記以外のその他の工程を有していてもよい。その他の工程としては、電子装置の製造方法において公知の工程を用いることができる。
また、電子部品の回路面に再配線層を形成する工程をさらに有してもよい。半導体チップ面積を超える広い領域に再配線層を形成することにより得られる電子装置は、ファンアウトパッケージ(Fan-out Package)とも呼ばれている。
耐熱性樹脂層1:ポリエチレンテレフタレート(PET)フィルム(ユニチカ社製、製品名:エンブレット(登録商標)S-50、融点:260℃、分解温度:約400℃、厚み:50μm)
柔軟性樹脂1:ポリエステル系エラストマー(東レ・デュポン社製、商品名:ハイトレル(登録商標)4767N、融点:200℃)
(粘着剤1(紫外線架橋型アクリル系粘着剤))
アクリル酸エチル48重量部、アクリル酸-2-エチルヘキシル27重量部、アクリル酸メチル20重量部、メタクリル酸グリシジル5重量部、および重合開始剤としてベンゾイルパーオキサイド0.5重量部を混合した。これを、トルエン65重量部、酢酸エチル50重量部が入った窒素置換フラスコ中に、撹拌しながら80℃で5時間かけて滴下し、さらに5時間撹拌して反応させた。反応終了後、この溶液を冷却し、これにキシレン25重量部、アクリル酸2.5重量部、およびテトラデシルベンジルアンモニウムクロライド1.5重量部を加え、空気を吹き込みながら80℃で10時間反応させ、光重合性炭素-炭素二重結合が導入されたアクリル酸エステル共重合体溶液を得た。
(粘着性樹脂溶液1)
脱イオンを行った純水中に、重合開始剤として4,4'-アゾビス-4-シアノバレリックアシッド(大塚化学(株)製、商品名:ACVA)を0.5質量部、モノマー(A)としてアクリル酸-n-ブチルを74.3質量部、およびメタクリル酸メチルを13.7質量部、モノマー(B)としてメタクリル酸-2-ヒドロキシエチルを9質量部、重合性界面活性剤としてポリオキシエチレンノニルフェニルエーテルの硫酸エステルのアンモニウム塩のベンゼン環に重合性の1-プロペニル基を導入したもの(第一工業製薬(株)製;商品名:アクアロンHS-1025)を3質量部それぞれ投入し、攪拌下で70~72℃において8時間乳化重合を実施し、アクリル系樹脂エマルションを得た。これをアンモニア水で中和(pH=7.0)し、固形分濃度42.5%の粘着性樹脂溶液1を得た。
脱イオンを行った純水中に、重合開始剤として過硫酸アンモニウムを0.5質量部、モノマー(A)としてアクリル酸-2-エチルヘキシルを63質量部、アクリル酸-n-ブチルを21質量部、およびメタクリル酸メチルを9質量部、モノマー(B)としてメタクリル酸-2-ヒドロキシエチルを3質量部、モノマー(C)としてポリテトラメチレングリコールジアクリレート(日本油脂(株)製、商品名;ADT-250)を1質量部、重合性界面活性剤としてポリオキシエチレンノニルフェニルエーテルの硫酸エステルのアンモニウム塩のベンゼン環に重合性の1-プロペニル基を導入したもの(第一工業製薬(株)製;商品名:アクアロンHS-1025)を2質量部それぞれ投入し、攪拌下で70~72℃において8時間乳化重合を実施し、アクリル系樹脂エマルションを得た。これをアンモニア水で中和(pH=7.0)し、固形分濃度56.5%の粘着性樹脂溶液2を得た。
粘着性樹脂溶液1を57.4質量部、粘着性樹脂溶液2を42.6質量部、ジメチルエタノールアミンを0.4質量部、架橋剤であるエポキシ系化合物(ナガセケムテックス社製、Ex-1610)を9.3質量部、それぞれ混合して、粘着剤塗布液1を得た。
粘着性樹脂溶液1を100質量部、ポリプロピレングリコールを10.0質量部、架橋剤であるアジリジン系化合物(日本触媒社製、ケミタイトPz-33)を1.7質量部、それぞれ混合して、粘着剤塗布液2を得た。
耐熱性樹脂層1上に、粘着剤塗布液1を塗布した後、乾燥させて、厚さ20μmの接着層を形成した。次いで接着層上に、柔軟性樹脂層となる柔軟性樹脂1により構成されたフィルム(厚さ:110μm、弾性率:55MPa(JIS K7161に準拠し、サンプル幅10mm、チャック間距離30mm、引張速度300mm/分の条件で測定))を積層した。
次いで、得られたフィルムの柔軟性樹脂層上に、粘着剤1の塗布液を塗布した後、乾燥させて、厚さ20μmの粘着性樹脂層を形成し、粘着性積層フィルムを得た。
得られた粘着性積層フィルムについて以下の評価をおこなった。得られた結果を表1に示す。
接着層の厚さを10μmに変更した以外は実施例1と同様にして粘着性積層フィルムを得た。
得られた粘着性積層フィルムについて以下の評価をおこなった。得られた結果を表1に示す。
耐熱性樹脂層1上に接着層を形成しない以外は実施例1と同様にして粘着性積層フィルムを得た。
得られた粘着性積層フィルムについて以下の評価をおこなった。得られた結果を表1に示す。
粘着剤塗布液1の代わりに粘着剤塗布液2を用いた以外は実施例1と同様にして粘着性積層フィルムを得た。
得られた粘着性積層フィルムについて以下の評価をおこなった。得られた結果を表1に示す。
(1)耐熱性樹脂層と柔軟性樹脂層との間の剥離強度P0および剥離強度P1の測定
耐熱性樹脂層と柔軟性樹脂層との間の剥離強度P0および剥離強度P1は、JIS Z0237に準拠し、下記の方法で測定した。
まず、粘着性樹脂層がシリコンウェハ(SUMCO社製、商品名:シリコンミラーウエハ、厚さ:760μm)に接するように、粘着性積層フィルムを上記シリコンウェハに貼り付けた。次いで、引張試験機(東洋精機社製、商品名:ストログラフ)を用いて、耐熱性樹脂層を柔軟性樹脂層から、25℃、引張速度300mm/分の条件で180度方向に剥離し、そのときの強度(N/25mm)を2回測定し、その平均値を剥離強度とP0した。
また、粘着性積層フィルムをホットプレート上で160℃、4時間熱処理した後、剥離強度P0の測定方法と同様の方法で、粘着性積層フィルムにおける耐熱性樹脂層と柔軟性樹脂層との間の剥離強度P1を測定した。ここで、耐熱性樹脂層側をホットプレート側とした。
粘着性積層フィルムの粘着性樹脂層上に電子部品(シリコンチップ)を複数個配置し、構造体を得た。
次いで、得られた構造体をホットプレート上で160℃、4時間熱処理した後、耐熱性樹脂層を柔軟性樹脂層から剥離した。ここで、耐熱性樹脂層側をホットプレート側とした。
次いで、下記の基準で電子部品のピックアップ性を評価した。
〇:耐熱性樹脂層を柔軟性樹脂層から良好に剥離できるとともに、シリコンチップの位置ズレや粘着性樹脂層および柔軟性樹脂層の変形が起きず、その後のシリコンチップのピックアップを精度よくできた
×:耐熱性樹脂層を柔軟性樹脂層から剥離できたが、剥離が重く、耐熱性樹脂層を剥離中にシリコンチップの位置ズレや粘着性樹脂層および柔軟性樹脂層の変形が起き、その後のシリコンチップのピックアップを精度よくできなかった
××:耐熱性樹脂層と柔軟性樹脂層とが強固に接着し、耐熱性樹脂層を柔軟性樹脂層から剥離できなかった
これに対し、比較例1および2の粘着性積層フィルムは電子部品のピックアップ性に劣っていた。
すなわち、比較例1および2の粘着性積層フィルムでは、電子部品の特性評価工程の簡略化と電子部品のピックアップ性とを両立できないことが理解できる。
Claims (18)
- 耐熱性樹脂層、柔軟性樹脂層および粘着性樹脂層をこの順番に有する粘着性積層フィルムであって、
JIS Z0237に準拠し下記の方法で測定される、前記耐熱性樹脂層と前記柔軟性樹脂層との間の剥離強度P0が0.01N/25mm以上2.0N/25mm以下であり、かつ、前記粘着性積層フィルムを160℃で4時間熱処理した後の、前記耐熱性樹脂層と前記柔軟性樹脂層との間の剥離強度P1が0.05N/25mm以上1.5N/25mm以下である粘着性積層フィルム。
(剥離強度の測定方法)
前記粘着性樹脂層がシリコンウェハに接するように、前記粘着性積層フィルムを前記シリコンウェハに貼り付ける。次いで、引張試験機を用いて、前記耐熱性樹脂層を前記柔軟性樹脂層から、25℃、引張速度300mm/分の条件で180度方向に剥離し、そのときの強度(N/25mm)を2回測定し、その平均値を剥離強度とする。 - 請求項1に記載の粘着性積層フィルムにおいて、
JIS K7161に準拠し、サンプル幅10mm、チャック間距離30mm、引張速度300mm/分の条件で測定される、前記柔軟性樹脂層の160℃での引張弾性率(E')が1MPa以上300MPa以下である粘着性積層フィルム。 - 請求項1または2に記載の粘着性積層フィルムにおいて、
前記耐熱性樹脂層の融点が200℃以上である、あるいは前記耐熱性樹脂層は融点を有さない粘着性積層フィルム。 - 請求項1乃至3のいずれか一項に記載の粘着性積層フィルムにおいて、
前記柔軟性樹脂層の融点が100℃以上250℃以下である粘着性積層フィルム。 - 請求項1乃至4のいずれか一項に記載の粘着性積層フィルムにおいて、
前記耐熱性樹脂層を構成する耐熱性樹脂がポリイミド、ポリアミド、およびポリエステルからなる群から選択される一種または二種以上を含む粘着性積層フィルム。 - 請求項1乃至5のいずれか一項に記載の粘着性積層フィルムにおいて、
前記柔軟性樹脂層を構成する柔軟性樹脂がポリエステル系エラストマー、ポリアミド系エラストマー、ポリイミド系エラストマー、およびポリブチレンテレフタレートからなる群から選択される一種または二種以上を含む粘着性積層フィルム。 - 請求項1乃至6のいずれか一項に記載の粘着性積層フィルムにおいて、
前記耐熱性樹脂層と前記柔軟性樹脂層との間に接着層をさらに有する粘着性積層フィルム。 - 請求項7に記載の粘着性積層フィルムにおいて、
前記接着層が(メタ)アクリル系粘着剤を含む粘着性積層フィルム。 - 請求項8に記載の粘着性積層フィルムにおいて、
前記(メタ)アクリル系粘着剤が(メタ)アクリル系粘着性樹脂および架橋剤を含み、
前記(メタ)アクリル系粘着剤中の前記架橋剤の含有量が、前記(メタ)アクリル系粘着性樹脂100質量部に対して、5質量部以上である粘着性積層フィルム。 - 請求項9に記載の粘着性積層フィルムにおいて、
前記架橋剤がエポキシ系化合物、イソシアネート系化合物およびアジリジン系化合物から選択される一種または二種以上を含む粘着性積層フィルム。 - 請求項9または10に記載の粘着性積層フィルムにおいて、
前記(メタ)アクリル系粘着剤に含まれる前記(メタ)アクリル系粘着性樹脂が、分子中に炭素-炭素二重結合を2以上有する多官能性モノマー由来の構成単位を含む粘着性積層フィルム。 - 請求項1乃至11のいずれか一項に記載の粘着性積層フィルムにおいて、
前記粘着性樹脂層を構成する粘着剤が(メタ)アクリル系粘着剤、シリコーン系粘着剤、ウレタン系粘着剤、オレフィン系粘着剤、およびスチレン系粘着剤から選択される一種または二種以上を含む粘着性積層フィルム。 - 請求項1乃至12のいずれか一項に記載の粘着性積層フィルムにおいて、
前記粘着性積層フィルムの全光線透過率が80%以上である粘着性積層フィルム。 - 請求項1乃至13のいずれか一項に記載の粘着性積層フィルムにおいて、
ダイシングテープである粘着性積層フィルム。 - 請求項1乃至14のいずれか一項に記載の粘着性積層フィルムにおいて、
耐熱性樹脂層、柔軟性樹脂層および粘着性樹脂層をこの順番に有する粘着性積層フィルムと、前記粘着性樹脂層上に貼り付けられた1または2以上の電子部品と、を備える構造体を準備する工程(A)と、
前記粘着性樹脂層上に貼り付けられた状態で、前記電子部品の特性を評価する工程(B)と、
前記工程(B)の後に前記耐熱性樹脂層を前記粘着性積層フィルムから剥離する工程(C)と、
前記工程(C)の後に前記粘着性樹脂層から前記電子部品をピックアップする工程(D)と、
を備える電子装置の製造方法における前記粘着性積層フィルムに用いられる粘着性積層フィルム。 - 耐熱性樹脂層、柔軟性樹脂層および粘着性樹脂層をこの順番に有する粘着性積層フィルムと、前記粘着性樹脂層上に貼り付けられた1または2以上の電子部品と、を備える構造体を準備する工程(A)と、
前記粘着性樹脂層上に貼り付けられた状態で、前記電子部品の特性を評価する工程(B)と、
前記工程(B)の後に前記耐熱性樹脂層を前記粘着性積層フィルムから剥離する工程(C)と、
前記工程(C)の後に前記粘着性樹脂層から前記電子部品をピックアップする工程(D)と、
を備える電子装置の製造方法であって、
前記粘着性積層フィルムとして請求項1乃至15のいずれか一項に記載の粘着性積層フィルムを用いる電子装置の製造方法。 - 請求項16に記載の電子装置の製造方法において、
前記工程(B)では、0℃以下または50℃以上200℃以下の温度環境下で前記電子部品の特性評価をおこなう電子装置の製造方法。 - 請求項16または17に記載の電子装置の製造方法において、
前記工程(D)では、前記粘着性樹脂層における前記電子部品が貼り付けられた領域をフィルムの面内方向に拡張させて、隣接する前記電子部品間の間隔を拡大させた状態で、前記粘着性樹脂層から前記電子部品をピックアップする電子装置の製造方法。
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- 2017-11-16 EP EP17873047.9A patent/EP3546540A4/en active Pending
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- 2017-11-16 CN CN201780072984.6A patent/CN110023438B/zh active Active
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Cited By (7)
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JP2018113356A (ja) * | 2017-01-12 | 2018-07-19 | リンテック株式会社 | 半導体加工用シートおよび半導体装置の製造方法 |
JP2018170427A (ja) * | 2017-03-30 | 2018-11-01 | リンテック株式会社 | 半導体加工用シートおよび半導体装置の製造方法 |
WO2020027291A1 (ja) * | 2018-08-03 | 2020-02-06 | 三菱ケミカル株式会社 | 積層体及びエポキシ樹脂シートの製造方法 |
JPWO2020027291A1 (ja) * | 2018-08-03 | 2021-08-12 | 三菱ケミカル株式会社 | 積層体及びエポキシ樹脂シートの製造方法 |
JP7327402B2 (ja) | 2018-08-03 | 2023-08-16 | 三菱ケミカル株式会社 | 積層体及びエポキシ樹脂シートの製造方法 |
CN113727844A (zh) * | 2019-04-26 | 2021-11-30 | 三井化学东赛璐株式会社 | 粘着性膜和电子装置的制造方法 |
WO2022172990A1 (ja) * | 2021-02-10 | 2022-08-18 | 三井化学東セロ株式会社 | 電子部品の製造方法、製造用フィルム及び製造用具 |
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US11453208B2 (en) | 2022-09-27 |
JPWO2018097036A1 (ja) | 2019-10-17 |
TWI759360B (zh) | 2022-04-01 |
TW201823399A (zh) | 2018-07-01 |
CN110023438B (zh) | 2022-01-25 |
US20200171802A1 (en) | 2020-06-04 |
KR20190075982A (ko) | 2019-07-01 |
EP3546540A4 (en) | 2020-10-14 |
CN110023438A (zh) | 2019-07-16 |
EP3546540A1 (en) | 2019-10-02 |
JP6876719B2 (ja) | 2021-05-26 |
KR102242913B1 (ko) | 2021-04-21 |
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