WO2018096629A1

WO2018096629A1 - Component mounter

Info

Publication number: WO2018096629A1
Application number: PCT/JP2016/084840
Authority: WO
Inventors: 政利藤田
Original assignee: 株式会社Ｆｕｊｉ
Priority date: 2016-11-24
Filing date: 2016-11-24
Publication date: 2018-05-31
Also published as: JP6718977B2; JPWO2018096629A1

Abstract

A component mounter is provided with: a substrate transport device that has a pair of transport conveyors for transporting a substrate; a head that collects a component and mounts that component on the substrate transported to a prescribed position; a parallel link mechanism with which the head is moved by a plurality of link mechanisms; and a component supply device placed below the substrate transport device, the component supply device supplying components to a supply position at which it is possible for the head to collect the component from between the pair of transport conveyors.

Description

Component mounting equipment

This specification discloses a component mounting apparatus.

Conventionally, in a component mounting apparatus that mounts a component using a suction nozzle that sucks and holds the component, a device that moves a movable part (head) provided with the suction nozzle using a parallel link mechanism has been proposed. For example, the component mounting apparatus disclosed in Patent Document 1 feeds and supplies a component to a position near the lower position of the movable portion and a moving device that reciprocates a stage on which a workpiece on which the component is mounted is moved to the lower position of the movable portion. A supply device.

JP 2016-127187 A

In the component mounting apparatus described above, the moving device and the supplying device are arranged side by side along the moving direction of the stage. For this reason, since it is necessary to ensure the installation space of a moving apparatus and the installation space of a supply apparatus separately in the moving direction of a stage, it leads to the enlargement of a component mounting apparatus.

The main component of the component mounting apparatus of the present disclosure is to have a compact configuration in which the head is moved by a parallel link mechanism.

The component mounting apparatus according to the present disclosure employs the following means in order to achieve the main purpose described above.

A component mounting apparatus according to the present disclosure includes a substrate transport device having a pair of transport conveyors for transporting a substrate, a head that collects components and mounts the substrate on a predetermined position, and a plurality of link mechanisms to mount the head. A parallel link mechanism that moves, and a component supply device that is disposed below the substrate transfer device and supplies the component to a supply position where the head can pick up the component from between the pair of transfer conveyors. This is the gist.

A component mounting apparatus according to the present disclosure is disposed below a substrate transfer device having a pair of transfer conveyors for transferring a substrate, and supplies components to a supply position where a head can pick up components from between the pair of transfer conveyors A supply device is provided. For this reason, since the component supply device can be stored below the substrate transfer device, it is not necessary to separately secure the installation space for the substrate transfer device and the installation space for the component supply device along the substrate transfer direction. can do. As a result, the component mounting apparatus can be made compact.

1 is a configuration diagram showing an outline of the configuration of a component mounting apparatus 10. FIG. 3 is a block diagram relating to control of the component mounting apparatus 10. The block diagram of the parallel link mechanism 40. FIG. FIG. 3 is a configuration diagram of a head unit 60. Explanatory drawing of the components supply position P. FIG. Explanatory drawing which shows the mode of operation | movement of the feeder unit 31. FIG. FIG. 3 is a configuration diagram of a revolving caster 18 and a fixing mechanism 80. FIG. 6 is an explanatory view showing a state of operation of the fixing mechanism 80. The block diagram which shows the outline of a structure of the component mounting apparatus 10B of a modification.

1 is a block diagram showing an outline of the configuration of the component mounting apparatus 10, FIG. 2 is a block diagram relating to control of the component mounting apparatus 10, FIG. 3 is a configuration diagram of a parallel link mechanism 40, and FIG. 4 is a configuration diagram of a unit 60. FIG. 5 is an explanatory diagram of the component supply position P, FIG. 6 is an explanatory diagram showing the operation of the feeder unit 31, and FIG. 7 is a configuration diagram of the swivel caster 18 and the fixing mechanism 80. FIG. 6 is an explanatory view showing a state of operation of the fixing mechanism 80. 1 and 3 is the X-axis direction, the front-rear direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

The component mounting apparatus 10 is an apparatus for mounting components on a flat board S. As shown in FIG. 1, the board transport device 20, the component supply device 30, the parallel link mechanism 40, the head unit 60, The turning caster 18, the fixing mechanism 80, and the control device 100 are provided. In addition, the component mounting apparatus 10 includes a support structure 11 that supports each component. The support structure 11 has a rectangular bottom plate 12, four short columns 13 standing on the bottom plate 12, and four corners supported by the short columns 13, and is framed in a rectangular frame shape by front and rear, left and right frame members 14 a to 14 d. A rectangular frame 14, two long struts 15 standing on the rear side of the bottom plate 12 and longer than the short struts 13, and a top plate 16 supported on the upper ends of the long struts 15. The bottom plate 12 has the control device 100 mounted on the upper surface, and the turning caster 18 and the fixing mechanism 80 attached to the lower surface. The rectangular frame 14 is attached with the substrate transfer device 20 and the component supply device 30. The head unit 60 is attached to the top plate 16 via the parallel link mechanism 40 or the parallel link mechanism 40.

As shown in FIG. 1, the substrate transfer device 20 includes a side frame 22, a belt conveyor 24 provided on the side frame 22, and a drive device (not shown) that drives the belt conveyor 24. The side frames 22 are provided in a pair of front and rear on the front and

rear frame members

14 a and 14 b of the rectangular frame 14. Since the belt conveyor 24 is provided in each of a pair of side frames 22, it is arrange | positioned in parallel at intervals in the front-back direction. The substrate transport device 20 transports the substrate S along the left-right direction in FIG. 1 by driving the belt conveyor 24. For example, the substrate transport device 20 transports the substrate S from left to right.

1, 5, and 6, the component supply device 30 includes a feeder unit 31 that is fixed under the

frame members

14 a and 14 b so as to be disposed below the substrate transfer device 20. The feeder unit 31 includes a plurality of tape feeders 32 and a feeder base 34. Each tape feeder 32 supplies parts by feeding the tape in the longitudinal direction by a feeder from a reel on which a tape containing a plurality of parts is wound. The feeder base 34 is set such that a plurality of tape feeders 32 are detachable along the longitudinal direction. The feeder base 34 is arranged below the rectangular frame 14 so that the longitudinal direction of the tape feeder 32 is the left-right direction, that is, the longitudinal direction is parallel to the transport direction of the substrate S. For this reason, each tape feeder 32 feeds parts in the left-right direction (here, from right to left), and the supply position P of the parts is located below the opening 14k of the rectangular frame 14, as shown in FIG. Become. Note that the substrate S in FIG. 5 has been transported to the position where the components are mounted by the substrate transport device 20. For this reason, the supply position P is a position adjacent to the substrate S in the transport direction (left-right direction) of the substrate S in the range not covered by the substrate S. That is, the component sent out to the supply position P by the tape feeder 32 and the substrate S at the mounting position are located adjacent to each other in the left-right direction.

The feeder base 34 of the present embodiment has a front wall located in front of the component feeding direction in the tape feeder 32 and side walls extending in the left-right direction in FIG. 1 from both sides of the front wall. A side wall located in front is referred to as a side wall 35. The feeder base 34 is provided with a hinge 36 supported by a frame member 14a in front of the rectangular frame 14 between the front wall and the side wall 35, and is rotatable about the hinge 36 ( (See FIGS. 5 and 6). The position of the feeder base 34 shown in FIG. 5 is referred to as a supply position because each tape feeder 32 can supply components to the supply position P in the opening 14k. The side wall 35 is provided with a lock pin 37 that is urged upward by a spring (not shown) and whose upper end protrudes from the upper surface of the side wall 35. The lock pin 37 can be lowered by an operator through a knob protruding from a long hole 35a formed on the front side of the side wall 35 in FIG. When the operator does not perform a lowering operation, the upper end of the lock pin 37 protrudes from the upper surface of the side wall 35 by the biasing force of the spring, and fits into a hole (not shown) formed in the lower surface of the frame member 14a. As a result, the feeder base 34 is locked at the supply position shown in FIG. Further, when the operator performs a lowering operation, the lock pin 37 is lowered against the urging force of the spring and is accommodated in the side wall 35. As a result, the engagement between the lock pin 37 and the hole on the lower surface of the frame member 14a is released, so that the feeder base 34 can rotate in the direction of the arrow in FIG. The operator rotates the feeder base 34 to the position indicated by the solid line in FIG. 6, that is, the attachment / detachment position rotated 90 degrees from the supply position to the near side, so that the attachment / detachment direction of each tape feeder 32 is the substrate S. The direction is orthogonal to the transport direction. Thereby, the operator can attach and detach the tape feeder 32 from the front of the component mounting apparatus 10. Thus, in this embodiment, the feeder unit 31 (feeder base 34) can be rotated 90 degrees in the horizontal direction so that an operator can easily attach and detach the tape feeder 32.

At the position on the left side of the feeder unit 31, as shown in FIGS. 1, 5, and 6, a mounting plate 29 is stretched over the lower surfaces of the

frame members

14a and 14b before and after the rectangular frame 14, and this mounting plate 29 A parts camera 28 is attached to the camera. When the suction nozzle 61 that sucks the component supplied to the supply position P is positioned above the parts camera 28, the parts camera 28 images the component P sucked by the suction nozzle 61 from below and controls the image. Output to the device 100.

As shown in FIG. 3, the parallel link mechanism 40 includes a movable portion 41 that supports the head unit 60, a housing 42 that is fixed to the top plate 16, and a movable portion 41 that is supported by the housing 42 and moves in the XYZ directions. Three

link mechanisms

43, 44, and 45 are provided. That is, the parallel link mechanism 40 moves the movable part 41 about three axes. The link mechanism 43 is driven by the servo motor 43a (see FIG. 2) as an actuator disposed in the housing 42, the drive link 43b driven by the servo motor 43a, and the drive of the drive link 43b, and the movable portion 41. And a driven link 43c connected to the. The drive link 43b and the driven link 43c are connected via a ball joint or the like, and the driven link 43c and the movable portion 41 are connected via a universal joint or the like. Similarly to the link mechanism 43, the

link mechanisms

44 and 45 include

servo motors

44a and 45a (see FIG. 2), drive links 44b and 45b, and driven

links

44c and 45c, respectively. Further, in the parallel link mechanism 40 of the present embodiment, a dynamic vibration absorber 50 having a cantilever structure is attached to the outer peripheral surface of the housing 42.

As shown in FIG. 3, the dynamic vibration absorber 50 includes a fixing portion 51, a leaf spring 53, and a weight fixing portion 55. The fixing portion 51 is fixed to the outer peripheral surface of the casing 42 by bolts 52 and cantilever-supports a leaf spring 53 as an elastic body extending in the vertical direction. In addition, the fixing | fixed part 51 is formed with the elongate hole 51a extended in an up-down direction, and the volt | bolt 52 is penetrated by this elongate hole 51a. As for the leaf | plate spring 53, the base end part is fixed to the fixing | fixed part 51, and the weight fixing | fixed part 55 and the weight board 56 as a mass body are attached to the front-end | tip part. A plurality of rectangular plate-like weight plates 56 can be attached to and detached from the weight fixing portion 55 from above. The weight plate 56 is formed with a slit 56a notched upward from the center of the lower side in the direction of FIG. 3, and a bolt 57 inserted through the slit 56a is fastened to a bolt hole (not shown) in the weight fixing portion 55. As a result, the weight plate 56 is fixed to the weight fixing portion 55. For this reason, the operator can easily change the number of weight plates 56 attached to and detached from the weight fixing portion 55. The dynamic vibration absorber 50 changes the weight of the weight plate 56 and the weight fixing portion 55 as a mass body by changing the number of weight plates 56 or changes the position of the bolt 52 in the long hole 51a. The vibration frequency can be adjusted. Moreover, the acceleration sensor 49 (refer FIG. 2) which detects the acceleration of the housing | casing 42 is attached to the housing | casing 42 of this embodiment. The acceleration sensor 49 outputs the detected acceleration information to the control device 100.

The head unit 60 includes a rotary head 62, an R-axis actuator 65, a Z-axis actuator 71, and a Q-axis actuator 75 as shown in FIG. In the rotary head 62, a plurality of nozzle holders 63 that hold the suction nozzle 61 are arranged on the circumference coaxial with the rotation axis at a predetermined angular interval (for example, 45 degrees or 60 degrees). Each nozzle holder 63 is biased upward by a spring (not shown). Although not shown, the head unit 60 supplies the suction nozzle 61 with negative pressure from the negative pressure source via an air pipe connected to the negative pressure source such as a vacuum pump. The part P is adsorbed.

The R-axis actuator 65 includes an R-axis drive rod 66 driven by a servo motor 66a (see FIG. 2) and an index shaft 67 whose upper end is connected to the R-axis drive rod 66 via a universal joint. The servo motor 66 a of the R-axis actuator 65 is disposed in the housing 42 of the parallel link mechanism 40. The index shaft 67 has a lower end connected to the rotary head 62. The R-axis actuator 65 intermittently rotates the rotary head 62 by a predetermined angle by driving the servo motor 66a intermittently and rotating the index shaft 67 via the R-axis drive rod 66. As a result, the R-axis actuator 65 causes the suction nozzles 61 disposed on the rotary head 62 to pivotally move by a predetermined angle in the circumferential direction. The R-axis actuator 65 includes an R-axis encoder 67a (see FIG. 2) that detects the rotation angle of the index shaft 67.

The Z-axis actuator 71 includes a Z-axis drive rod 72 driven by a servo motor 72a (see FIG. 2) and a ball screw shaft 73 whose upper end is connected to the Z-axis drive rod 72 via a universal joint. The ball screw shaft 73 is attached with a Z-axis slider 74 that is screwed into a threaded portion so as to be movable up and down in the Z-axis direction. The Z-axis slider 74 includes a lever portion 74 a that contacts the upper end portion 64 of the nozzle holder 63. The Z-axis actuator 71 drives the servo motor 72a and rotates the ball screw shaft 73 via the Z-axis drive rod 72, thereby moving the Z-axis slider 74 in the Z-axis direction. Thereby, the Z-axis actuator 71 moves the nozzle holder 63 (suction nozzle 61) in the Z-axis direction against the bias of the spring. The Z-axis actuator 71 includes a Z-axis encoder 73a (see FIG. 2) that detects the movement position of the Z-axis slider 74.

The Q-axis actuator 75 includes a Q-axis drive rod 76 driven by a servo motor 76a (see FIG. 2), and a rotary shaft 77 whose upper end is connected to the Q-axis drive rod 76 via a universal joint. A driving gear 77 b is attached to the lower end of the rotating shaft 77. Here, on the index shaft 67 of the R-axis actuator 65, a rotating body 78 formed with a driven gear 78a meshing with the drive gear 77b is rotatably supported. The driven gear 78 a of the rotating body 78 is also meshed with a nozzle gear 64 a formed at the upper end portion 64 of the nozzle holder 63. The Q-axis actuator 75 drives the servo motor 76a to rotate the rotating shaft 77 through the Q-axis driving rod 76, thereby rotating the rotating body 78 and meshing the driven gear 78a with the driven gear 78a. Each nozzle holder 63 is rotated about its axis by meshing between 78a and the nozzle gear 64a. Thereby, the Q-axis actuator 75 rotates the nozzle holder 63 (suction nozzle 61) around the axis (Q direction), respectively. The Q-axis actuator 75 includes a Q-axis encoder 77a (see FIG. 2) that detects the rotation angle of the rotation shaft 77.

As shown in FIGS. 1, 7, and 8, the turning caster 18 is attached to each of the four bases 19 fixed to the four corners of the lower surface of the bottom plate 12 so as to be capable of turning. The operator can move the support structure 11 including the bottom plate 12 by the swivel casters 18 rolling on the floor surface FL of a factory or the like where the component mounting apparatus 10 is installed. That is, the component mounting apparatus 10 can be moved while the moving direction is arbitrarily changed by the turning caster 18.

The fixing mechanism 80 includes a suction cup 90 and an elevating mechanism 82 for raising and lowering the suction cup 90 as shown in FIGS. The fixing mechanism 80 is in an unlocked state (see FIG. 7) in which the component mounting apparatus 10 can be moved by the turning caster 18 and a locked state (see FIG. 8) in which the movement of the component mounting apparatus 10 by the turning caster 18 is impossible. Switch. A total of four fixing mechanisms 80 are provided in the vicinity of the turning casters 18 at the four corners on the lower surface of the bottom plate 12.

The elevating mechanism 82 includes a cylindrical body 83, a rod 84, an adjuster bolt 85,

nuts

86 and 86, a lock pedal 87, and an unlock pedal 88. The cylindrical body 83 is a cylindrical member whose upper end flange portion is fixed to the lower surface of the bottom plate 12, and a pair of long holes 83a extending in the vertical direction are formed on the side surfaces at positions opposed to each other in the radial direction. The rod 84 is a columnar member that is disposed so as to be movable up and down in the cylindrical body 83 and is urged upward in the drawing with respect to the cylindrical body 83 by a spring (not shown). The rod 84 is formed with a female screw hole (not shown) at the center of the shaft on the lower end side. The adjuster bolt 85 is formed with a male screw that is screwed into the female screw hole of the rod 84, and the lower end is joined to the suction cup 90. The nuts 86, 86 are screwed into the adjuster bolt 85, and the upper nut 86 functions to position the adjuster bolt 85 (suction cup 90) with respect to the rod 84, and the lower nut 86 functions to prevent loosening. . The lock pedal 87 includes two plates extending in parallel so as to sandwich the cylindrical body 83, a rotating shaft 87 a that pivotally supports both plates on the cylindrical body 83 on one end side, and a second end side. And a pressing plate 87b for connecting both plates. The unlock pedal 88 includes two plates extending in parallel so as to sandwich the cylindrical body 83, and a slide shaft 88a that pivotally supports the two plates at one end side in a long hole 83a of the cylindrical body 83; A pressing plate 88b for connecting the two plates on the other end side. 7 and 8 show only the plates on the front side of the lock pedal 87 and the unlock pedal 88. FIG. The two plates of the unlock pedal 88 are arranged inside the two plates of the lock pedal 87. Further, the lock pedal 87 and the unlock pedal 88 are connected to each other via a connecting shaft 89 attached to the approximate center of the plate. The slide shaft 88a is connected to the rod 84, and the rod 84 also moves up and down as the slide shaft 88a moves up and down.

The suction cup 90 includes a substantially disc-shaped rubber material 91 whose bottom center is formed in a concave shape on the lower side, a metal cover 92 formed so as to cover the rubber material 91 and joined to the rubber material 91, And a lever 93 disposed in an opening 92a formed in the upper portion. The cover 92 is joined to the lower end of the adjuster bolt 85 at the center of the upper surface. The lever 93 is connected to the upper part of the rubber material 91 and can be rotated between an upright state (see FIG. 7) and a tilted state (see FIG. 8) with the pivot shaft 93a as a fulcrum. The upper part of the rubber material 91 is lifted up in a standing state. For this reason, in a state where the rubber material 91 is in close contact with the floor surface FL or the like, the lever 93 is tilted to increase the negative pressure in the concave portion of the rubber material 91 so as to be reliably adsorbed to the floor surface FL. Can do.

7, when the pressing plate 87b of the lock pedal 87 is pushed down by the operator in the unlocked state shown in FIG. 7, the lock pedal 87 rotates clockwise around the rotation shaft 87a. As the lock pedal 87 rotates, the unlock pedal 88 rotates counterclockwise around the connecting shaft 89 while the slide shaft 88a descends in the long hole 83a. Further, the rod 84 is pushed out of the cylindrical body 83 against the urging force of the spring as the slide shaft 88a is lowered, and moves to the lower end position shown in FIG. Thereby, the fixing mechanism 80 is fixed in the locked state of FIG. In the locked state shown in FIG. 8, the pressing plate 88b of the unlock pedal 88 is exposed from between the lock pedals 87 and can be pushed down by the operator.

Here, the stroke amount St, which is the amount of movement (lifting amount) of the rod 84, is from the lower end of the rubber material 91 of the sucker 90 in the unlocked state to the lower end (floor surface FL) of the swivel caster 18 as shown in FIG. The distance is set slightly longer than the distance. For this reason, when the rod 84 moves to the lower end position, the turning caster 18 is slightly lifted from the floor surface FL (see FIG. 8). Further, when the rod 84 moves to the lower end position, the rubber material 91 of the suction cup 90 is pressed against the floor surface FL and is brought into close contact with the floor surface FL. In this state, when the operator tilts the lever 93 of the suction cup 90, the negative pressure in the recess of the rubber material 91 can be increased and the suction cup 90 can be reliably adsorbed to the floor surface FL. Thereby, the operator can fix the support structure 11 including the bottom plate 12 to the floor surface FL. That is, the component mounting apparatus 10 is fixed to the floor surface FL by the fixing mechanism 80.

Further, in the locked state shown in FIG. 8, the fixing mechanism 80 releases the suction of the suction cup 90 by bringing the lever 93 of the suction cup 90 upright. When the pressing plate 88b of the unlock pedal 88 is pushed down by the operator, the unlock pedal 88 rotates clockwise around the connecting shaft 89, and the lock pedal 87 counterclockwise around the rotating shaft 87a. To turn. Further, as the unlock pedal 88 rotates, the slide shaft 88a moves upward in the long hole 83a, so that the rod 84 rises and is pulled into the cylindrical body 83 together with the urging force of the spring. As a result, the fixing mechanism 80 is in the unlocked state shown in FIG. 7, and the component mounting apparatus 10 can be moved by the turning caster 18.

As shown in FIG. 2, the control device 100 is configured as a microprocessor centered on a CPU 101, and includes a ROM 102 that stores processing programs, an HDD 103 that stores various data, and a RAM 104 that is used as a work area. . The control device 100 inputs an image signal from the parts camera 28, acceleration information from the acceleration sensor 49, rotation angle information from the R-axis encoder 67a, Z-axis encoder 73a, and Q-axis encoder 77a in the head unit 60. In addition, the control device 100 is connected to the substrate transport device 20, the parts camera 28, the component supply device 30, the

servo motors

43 a, 44 a, 45 a of the parallel link mechanism 40, the

servo motors

66 a, 72 a, 76 a of the head unit 60, and the suction nozzle 61. The drive signal is output. The control device 100 calculates the vibration frequency of the housing 42 based on the acceleration information from the acceleration sensor 49. The acceleration sensor 49 may be configured to be detachable from the housing 42 and the acceleration information detected by the acceleration sensor 49 may be output to a measurement device different from the control device 100. When doing so, another measurement device may calculate the vibration frequency of the housing 42 based on the acceleration information from the acceleration sensor 49.

Various operations and various operations of the component mounting apparatus 10 configured in this way are performed as follows. In the installation work of the component mounting apparatus 10, the operator first operates each unlock pedal 88 of the fixing mechanism 80 to bring the fixing mechanism 80 into the unlocked state, and the swiveling caster 18 puts the component mounting apparatus 10 in a desired installation position. Move to. When the component mounting apparatus 10 is moved to the installation position, the operator operates each lock pedal 87 of the fixing mechanism 80 to lower each sucker 90 to the floor surface FL by each lifting mechanism 82 and each swivel caster 18. Raise slightly. At this time, the operator confirms the level of the bottom plate 12, the rectangular frame 14, the top plate 16, etc., and if there is an inclination, the suction cup 90 is adjusted by the adjuster bolt 85 and the nut 86 so that the inclination is reduced. Adjust the height position. And an operator makes each lever 93 of each suction cup 90 tilt, and makes each suction cup 90 adsorb | suck to the floor surface FL. As a result, the fixing mechanism 80 is locked, and the component mounting apparatus 10 is reliably fixed to the floor surface FL at a desired installation position. As described above, the component mounting apparatus 10 according to the present embodiment is configured to be movable, and can be reliably fixed to the floor surface FL to suppress excessive vibration during component mounting. In addition, although illustration is abbreviate | omitted, an operator installs the several component mounting apparatus 10 adjacent so that the board | substrate S can be delivered between board | substrate conveyance apparatuses 20. FIG. Thereby, a production line having a plurality of component mounting apparatuses 10 is configured. In addition, since the component mounting apparatus 10 is configured to be movable, the operator can easily change the line configuration according to the production form. That is, a production line having a plurality of component mounting apparatuses 10 can flexibly cope with changes in production needs.

Also, the operator performs a setting operation of the tape feeder 32 to the component supply device 30. In this setting work, the worker first releases the lock at the supply position by the lock pin 37 and rotates the feeder base 34 to the attachment / detachment position. Then, the operator removes the tape feeder 32 unnecessary for production from the feeder base 34 and attaches the tape feeder 32 necessary for production to the feeder base 34. When the operator attaches the necessary tape feeder 32 to the feeder base 34, the operator rotates the feeder base 34 from the attachment / detachment position to the supply position, and fits the lock pin 37 into the hole on the lower surface of the frame member 14a. The stand 34 is locked. Thus, the operator can easily attach and detach the tape feeder 32 from the front of the component mounting apparatus 10 by rotating the feeder base 34.

In addition, the worker performs vibration control work for the parallel link mechanism 40. This vibration control work is performed with a trial run when the component mounting apparatus 10 is fixed to a new installation position. As the trial operation, for example, the parallel link mechanism 40 is driven to move the head unit 60 between the component supply position P and the component mounting position on the substrate S. The control device 100 calculates the vibration frequency of the housing 42 based on the acceleration information detected by the acceleration sensor 49 during the trial operation, and notifies the operator of the vibration frequency via a monitor (not shown). Further, the operator determines the number of weight plates 56 attached to the weight fixing portion 55 so that the vibration frequency of the dynamic vibration absorber 50 matches or is closest to the vibration frequency of the housing 42. For example, the operator obtains a relationship between the number of the weight plates 56 and the vibration frequency of the dynamic vibration absorber 50 in advance through experiments or the like, and based on the obtained relationship and the vibration frequency of the housing 42, the weight plate 56. Determine the number of sheets. Then, the operator sets the determined number of weight plates 56 on the weight fixing portion 55 and fixes them with the bolts 57. As described above, the fixed portion 51 of the dynamic vibration absorber 50 is attached to the housing 42 by tightening the bolts 52 inserted into the elongated holes 51a extending in the vertical direction. For this reason, the operator may adjust the vibration frequency of the dynamic vibration absorber 50 by adjusting the fastening position in the vertical direction of the fixed portion 51 together with the adjustment of the number of the weight plates 56. Thereby, since the component mounting apparatus 10 can suppress the vibration generated in the housing 42 with the movement of the movable portion 41 (head unit 60), it is possible to suppress a decrease in the positional accuracy of the head unit 60. it can.

The mounting operation of the component mounting apparatus 10 thus prepared is performed as follows. First, the control device 100 controls the substrate transport device 20 to transport the substrate S to a predetermined position (see FIG. 5), and controls the component supply device 30 to supply necessary components to the supply position P. In addition, the control device 100 controls the parallel link mechanism 40 and the head unit 60 so that the component supplied to the supply position P is sucked by the suction nozzle 61. When each suction nozzle 61 picks up a component, the control device 100 controls the parallel link mechanism 40 so that the head unit 60 moves to the mounting position of the substrate S via the parts camera 28. When the head unit 60 is on the parts camera 28, the control device 100 controls the parts camera 28 so as to capture an image, and calculates the amount of displacement of the component that is attracted to the suction nozzle 61 based on the captured image. To do. Then, the control device 100 corrects the mounting position of the component based on the calculated deviation amount, and controls the parallel link mechanism 40 and the head unit 60 so as to mount the component at the corrected mounting position. Since the component mounting apparatus 10 can suppress vibration generated in the housing 42 by the dynamic vibration absorber 50, vibration of the parallel link mechanism 40 and the head unit 60 can also be suppressed. For this reason, it can suppress that the adsorption | suction precision and mounting precision of components resulting from a vibration fall. In addition, since it is not necessary to pick up and mount the component after the head unit 60 moves to the supply position P or the mounting position and waits for the vibration to attenuate, the component is quickly picked up or mounted. be able to. Further, the component mounting apparatus 10 has a compact configuration in which the component supply device 30 is disposed below the substrate transfer device 20 so that the component sent to the supply position P and the substrate S are adjacent in the left-right direction. Is located. For this reason, the moving distance of the head unit 60 from the component supply position P to the component mounting position on the substrate S can be shortened. In addition, since the parts camera 28 is disposed below the substrate transfer device 20, the moving distance that the head unit 60 moves to capture an image can be shortened. Therefore, since the component mounting apparatus 10 can move the head unit 60 efficiently, the component mounting operation can be performed efficiently.

Here, the correspondence between the constituent elements of the present embodiment and the constituent elements of the present disclosure will be clarified. The component mounting apparatus 10 of the present embodiment corresponds to the component mounting apparatus of the present disclosure, the board transfer apparatus 20 corresponds to the board transfer apparatus, the head unit 60 corresponds to the head, and the parallel link mechanism 40 corresponds to the parallel link mechanism. The component supply device 30 corresponds to the component supply device. The tape feeder 32 corresponds to a feeder, and the feeder base 34 corresponds to a feeder base. The parts camera 28 corresponds to a camera disposed below the substrate transport apparatus, and the parts camera 28B corresponds to a camera disposed above the substrate transport apparatus.

As described above, the component mounting apparatus 10 according to the present embodiment is disposed below the substrate transport device 20 having the pair of belt conveyors 24 that transport the substrate S, and the head unit 60 receives components from between the belt conveyors 24. A component supply device 30 is provided to supply components so that they can be collected. For this reason, since the component supply apparatus 30 can be stored under the board | substrate conveyance apparatus 20, the installation space of the board | substrate conveyance apparatus 20 and the installation space of the component supply apparatus 30 are ensured separately along the conveyance direction of the board | substrate S. As what is not necessary, the component mounting apparatus 10 can have a compact configuration.

The component mounting apparatus 10 supplies components to a supply position P by a plurality of feeders 32 that send components in a direction parallel to the conveyance direction of the substrate S. The supply position P covers the substrate S at the time of mounting. This is a position adjacent to the substrate S in the transport direction within the undisclosed range. Therefore, it is possible to efficiently mount the head unit 60 by shortening the moving distance of the head unit 60 from the component supply position P to the component mounting position on the substrate S.

Also, the component mounting apparatus 10 includes a feeder base 34 that is detachably attached along a predetermined direction in which a plurality of tape feeders 32 send components. The feeder base 34 can be rotated between a supply position where a predetermined direction is parallel to the transport direction of the substrate S and an attachment / detachment position where the tape feeder 32 can be attached / detached more easily than the supply position. The operator can easily replace the tape feeder 32 while configuring the apparatus 10 in a compact manner.

Further, the component mounting apparatus 10 includes a parts camera 28 that is disposed below the board transfer device 20 and that can pick up the components collected by the head unit 60 from between the belt conveyors 24. For this reason, since the parts camera 28 can be stored under the board | substrate conveyance apparatus 20, the component mounting apparatus 10 can be made still more compact structure.

The invention of the present disclosure is not limited to the above-described embodiment, and it goes without saying that the invention can be implemented in various modes as long as it belongs to the technical scope of the invention of the present disclosure.

For example, in the embodiment described above, the acceleration sensor 49 is provided in the housing 42, and the weight plate 56 for setting the vibration frequency according to the vibration frequency of the housing 42 based on the acceleration information of the acceleration sensor 49 is provided in the dynamic vibration absorber 50. Although it should be attached, it is not limited to this. For example, a weight plate 56 may be attached to the dynamic vibration absorber 50 in order to obtain a vibration frequency derived by a simulation or the like considering the use conditions of the component mounting apparatus 10.

In the above-described embodiment, the dynamic vibration absorber 50 can adjust the number of the weight plates 56, that is, the weight of the mass body. However, the present invention is not limited to this, and the mass of the mass body having a predetermined weight can be adjusted. The body may be attached. In such a case, the weight value of the mass body for obtaining a representative value of the vibration frequency of the housing 42 from an experiment or the like assuming some use conditions of the component mounting apparatus 10 and obtaining the vibration frequency according to the representative value. The height may be a predetermined weight.

In the embodiment described above, the dynamic vibration absorber 50 is attached to the casing 41 of the parallel link mechanism 40. However, the present invention is not limited to this, and the dynamic vibration absorber 50 may not be attached.

In the embodiment described above, the support structure 11 that can be moved by the revolving caster 18 supports not only the parallel link mechanism 40 that moves the head unit 60 but also the substrate transfer device 20, the component supply device 30, and the control device 100. However, it is not limited to this. For example, the support structure 11 movable by the swivel caster 18 supports only the parallel link mechanism 40 that moves the head unit 60, and another support structure supports the substrate transfer device, the component supply device, the control device, and the like. May be.

In the embodiment described above, the suction cup 90 is moved up and down by the lifting mechanism 82 having the lock pedal 87 and the unlock pedal 88, but the present invention is not limited to this. That is, the suction cup 90 is placed at a position where the suction cup 90 is separated from the floor surface FL so that the suction cup 90 can be moved by the revolving caster 18 and at a position where the suction cup 90 contacts the floor surface FL so that the suction cup 90 can be attracted to the floor surface FL. Any mechanism may be used as long as it is raised and lowered.

In the embodiment described above, the suction cup 90 performs the adsorption to the floor surface FL and the support structure 11. However, the present invention is not limited to this, and the suction cup only performs the adsorption to the floor surface FL. The support may be performed by a separate member. For example, the lifting mechanism 82 having the lock pedal 87 and the unlock pedal 88 may be attached with a disk-shaped support plate having no suction cup function, and the support plate may support the support structure 11. Further, the suction cup may be moved up and down in conjunction with the support plate, and fixed so that the support plate does not move by contacting the floor surface FL and adsorbing it to the floor surface FL.

In the embodiment described above, the height position of each suction cup 90 can be adjusted by the adjuster bolt 85 and the nut 86. However, the present invention is not limited to this, and the height position of each suction cup 90 cannot be adjusted. May be constant.

In the above-described embodiment, the component mounting apparatus 10 can be moved by the revolving caster 18. However, the present invention is not limited to this, and the component mounting apparatus 10 may be fixed without moving. In such a case, the support structure 11 is not limited to the one that is fixed to the floor surface FL by the suction cup 90, and may be one that is fixed to the floor surface FL by an anchor bolt or the like.

In the above-described embodiment, the feeder base 34 of the feeder unit 31 is rotated 90 degrees horizontally with the hinge 36 as a fulcrum. However, the present invention is not limited to this, and the feeder base 34 rotates to a position where the tape feeder 32 can be easily attached and detached. If possible. Further, the feeder base 34 is not limited to the one that rotates in the horizontal direction, and the feeder base 34 is moved from the supply position to the attachment / detachment position where the tape feeder 32 can be attached / detached more easily than the supply position. It only needs to be movable.

In the above-described embodiment, the feeder base 34 of the feeder unit 31 is attached to the rectangular frame 14 so as to be rotatable, but is not limited thereto, and may be attached so as not to be rotatable. In this case, the feeder base 34 is arranged so that the longitudinal direction of the tape feeder 32 to be set is the front-rear direction, that is, the feeding direction of the components of the tape feeder 32 is the substrate S of the substrate transport apparatus 20. It is good also as what arrange | positions so that it may orthogonally cross in a conveyance direction. In this way, even if the feeder base 34 does not rotate, the operator can easily attach and detach the tape feeder 32 to the feeder base 34 from the front of the component mounting apparatus 10.

In the above-described embodiment, the component supply position P by the feeder unit 31 is set to a position adjacent to the board S at the time of mounting in the left-right direction, but the present invention is not limited to this, and the supply position P is not covered by the board S at the time of mounting. It may be a position, and may be a position separated from the substrate S at the time of mounting.

In the above-described embodiment, the component supply device 30 includes only the feeder unit 31. However, the present invention is not limited to this, and the components are supplied by other methods such as a tray unit that supplies components by a tray in which the components are arranged. A component supply unit may be provided. In this case, any component supply unit may be arranged so as to be able to supply components from below the substrate transfer apparatus 20. Alternatively, some of the component supply units may be arranged so that components can be supplied from above the substrate transfer device 20.

In the above-described embodiment, the parts camera 28 is disposed below the substrate transfer device 20 and adjacent to the feeder unit 31. However, the present invention is not limited to this, and the parts camera 28 is positioned below the substrate transfer device 20. Anything can be used. Alternatively, the parts camera 28 is not limited to be disposed below the substrate transfer device 20, and may be disposed above the substrate transfer device 20. FIG. 9 shows a component mounting apparatus 10B according to a modified example in this case. In the modification of FIG. 9, the same reference numerals are given to the same configurations as those in the above-described embodiment, and detailed description thereof is omitted.

9, in the component mounting apparatus 10B of the modified example of FIG. 9, the parts camera 28 </ b> B is attached to an attachment plate 29 </ b> B that is erected upward from the back surface of the side frame 22 on the rear side of the board transfer device 20. In this modification, the parts camera 28B is arranged at a position behind the supply position P (see FIG. 5). Unlike the above-described embodiment, the parallel link mechanism 40B includes three

link mechanisms

46, 47, and 48 in addition to the three

link mechanisms

43, 44, and 45. This parallel link mechanism 40B adjusts the position in the XYZ directions by the three

link mechanisms

43, 44, 45, and the rotation angles (pitch angle, roll angle, yaw angle) around each axis by the three

link mechanisms

46, 47, 48. This is a 6-axis mechanism capable of adjusting the angle. In the head unit 60B, the

servo motors

66a, 72a, and 76a of the R-axis actuator 65, the Z-axis actuator 71, and the Q-axis actuator 75 are accommodated in the movable portion 41B. For this reason, unlike the embodiment described above, the R-axis drive rod 66, the Z-axis drive rod 72, and the Q-axis drive rod 76 are not provided between the casing 42 and the movable portion 41B. In addition, each

servo motor

66a, 72a, 76a in the movable part 41B is electrically connected to the control device 100 by wiring not shown. For these reasons, in the component mounting apparatus 10B of the modified example, not only the movable portion 41B can be moved, but also the posture of the movable portion 41B can be changed. For example, the posture of the head unit 60B can be changed from a downward posture in which the lower surface of the rotary head 62 faces downward to a horizontal posture in which the lower surface becomes lateral. Therefore, the component mounting apparatus 10B picks up the components with the suction nozzles 61 in the downward posture of the head unit 60B, and then changes the head unit 60B to the horizontal posture by driving the parallel link mechanism 40B, thereby capturing an image with the parts camera 28B. can do. Then, the component mounting apparatus 10B can mount the component on the substrate S by moving the head unit 60B to the mounting position on the substrate S while changing the head unit 60B to the downward posture again after image capturing.

As described above, the parallel link mechanism 40B of the component mounting apparatus 10B according to the modification can change the posture of the head unit 60B in a direction different from the direction when the head unit 60B collects or mounts the components. In addition, since the parts camera 28B is disposed above the substrate transfer device 20 and the head unit 60B can take an image by changing the posture, the head unit 60B needs to move for imaging by the parts camera 28B. Absent. Therefore, the head unit 60B can move quickly from the component supply position to the component mounting position, so that the component mounting operation can be performed efficiently.

As described above, the component mounting apparatus according to the present disclosure includes a substrate transport apparatus having a pair of transport conveyors that transport a board, a head that collects components and mounts them on the substrate that has been transported to a predetermined position, A parallel link mechanism that moves the head by a link mechanism, and a component that is disposed below the substrate transfer device and that supplies the component to a supply position where the head can collect the component from between the pair of transfer conveyors And a supply device.

In the component mounting apparatus according to the present disclosure, the component supply device supplies the component to the supply position by a plurality of feeders that send the component in a direction parallel to the conveyance direction of the substrate, and the supply position is the predetermined position. It is good also as what is a position adjacent to the said board | substrate in the said conveyance direction among the ranges which are not covered with the said board | substrate. In this way, it is possible to efficiently mount the head by shortening the moving distance of the head from the component supply position to the component mounting position on the substrate.

In the component mounting apparatus according to the present disclosure, the component supply device includes a feeder base that is detachably attached along a predetermined direction in which the plurality of feeders send the component, and the feeder base has the predetermined direction of the substrate. It is possible to rotate between a supply position parallel to the transport direction and an attach / detach position where the predetermined direction intersects the transport direction so that the feeder can be attached / detached more easily than the supply position. Good. In this way, even when a component supply device including a plurality of feeders and a feeder base is stored below the substrate transfer device, each feeder can be easily attached and detached and replaced.

The component mounting apparatus according to the present disclosure may include a camera that is disposed below the board conveyance device and that can capture the component collected by the head from between the pair of conveyance conveyors. By so doing, the camera can be housed below the board transfer device, so that the component mounting apparatus can be made more compact.

In the component mounting apparatus according to the present disclosure, the parallel link mechanism can change a posture of the head in a direction different from a direction in which the head collects or mounts the component, and is above the substrate transfer device. It is good also as what is equipped with the camera which can arrange | position and image | photograph the said components extract | collected by the said head with the attitude | position of the said different direction. By doing so, the camera can be accommodated above the board transfer device, so that the component mounting apparatus can be made more compact.

The present disclosure can be used in the technical field of work devices that perform various work such as mounting work.

10, 10B component mounting device, 11 support structure, 12 bottom plate, 13 short strut, 14 rectangular frame, 14a, 14b, 14c, 14d frame material, 14k opening, 15 long strut, 16 top plate, 18 swivel caster, 19 base , 20 substrate transfer device, 22 side frame, 24 belt conveyor, 28, 28B parts camera, 29, 29B mounting plate, 30 parts supply device, 31 feeder unit, 32 tape feeder, 34 feeder stand, 35 side wall, 35a long hole, 36 hinge, 37 lock pin, 40, 40B parallel link mechanism, 41, 41B movable part, 42 housing, 43, 44, 45, 46, 47, 48 link mechanism, 43a, 44a, 45a servo motor, 43b, 44b, 45b drive link, 43c, 44c, 4 c Drive link, 49 acceleration sensor, 50 dynamic vibration absorber, 51 fixed part, 51a long hole, 52 bolt, 53 leaf spring, 55 weight fixed part, 56 weight plate, 56a slit, 57 bolt, 60, 60B head unit, 61 Suction nozzle, 62 rotary head, 63 nozzle holder, 64 upper end, 64a nozzle gear, 65 R axis actuator, 66 R axis drive rod, 66a, 72a, 76a servo motor, 67 index axis, 67a, 73a, 77a encoder, 71 Z Axis actuator, 72 Z-axis drive rod, 73 Ball screw shaft, 74 Z-axis slider, 74a lever part, 75 Q-axis actuator, 76 Q-axis drive rod, 77 rotation shaft, 77b drive gear, 78 rotation body, 78a driven gear, 80 Fixed Structure, 82 elevating mechanism, 83 cylindrical body, 83a long hole, 84 rod, 85 adjuster bolt, 86 nut, 87 lock pedal, 87a rotating shaft, 87b pressing plate, 88 unlocking pedal, 88a sliding shaft, 88b pressing plate , 89 connecting shaft, 90 sucker, 91 rubber material, 92 cover, 92a opening, 93 lever, 93a rotating shaft, 100 control device, 101 CPU, 102 ROM, 103 HDD, 104 RAM, P supply position, S substrate.

Claims

A substrate transfer device having a pair of transfer conveyors for transferring a substrate;
A head that collects components and mounts them on the board that is transported to a predetermined position;
A parallel link mechanism for moving the head by a plurality of link mechanisms;
A component supply device that is arranged below the substrate transfer device and supplies the component to a supply position where the head can extract the component from between the pair of transfer conveyors,
A component mounting apparatus comprising:
The component mounting apparatus according to claim 1,
The component supply device supplies the component to the supply position by a plurality of feeders that send the component in a direction parallel to the conveyance direction of the substrate.
The supply position is a position adjacent to the substrate in the transport direction within a range not covered by the substrate at the predetermined position.
The component mounting apparatus according to claim 2,
The component supply device includes a feeder base that is detachably attached along a predetermined direction in which the plurality of feeders send the component.
The feeder base is provided with a supply position in which the predetermined direction is parallel to the transport direction of the substrate, and attachment / detachment in which the predetermined direction intersects the transport direction so that the feeder can be attached / detached more easily than the supply position. A component mounting device that can be rotated to the desired position.
The component mounting apparatus according to any one of claims 1 to 3,
A component mounting apparatus, comprising: a camera that is disposed below the substrate transfer device and capable of imaging the component collected by the head from between the pair of transfer conveyors.
The component mounting apparatus according to any one of claims 1 to 3,
The parallel link mechanism can change the orientation of the head in a direction different from the direction in which the head collects or mounts the component,
A component mounting apparatus, comprising: a camera that is disposed above the substrate transfer device and capable of imaging the component collected by the head in a posture in which the head is in the different orientation.