WO2018095131A1 - Quantum dot led - Google Patents

Quantum dot led Download PDF

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Publication number
WO2018095131A1
WO2018095131A1 PCT/CN2017/103466 CN2017103466W WO2018095131A1 WO 2018095131 A1 WO2018095131 A1 WO 2018095131A1 CN 2017103466 W CN2017103466 W CN 2017103466W WO 2018095131 A1 WO2018095131 A1 WO 2018095131A1
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WIPO (PCT)
Prior art keywords
transparent
sealing groove
open slot
quantum dot
bracket
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PCT/CN2017/103466
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French (fr)
Chinese (zh)
Inventor
郑少洪
Original Assignee
广州视源电子科技股份有限公司
广州视睿电子科技有限公司
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Publication of WO2018095131A1 publication Critical patent/WO2018095131A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • H01L33/06Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Definitions

  • the present invention relates to the field of semiconductor light-emitting technologies, and in particular to a quantum dot LED.
  • a quantum dot is a nano-scale semiconductor light-emitting particle, and a quantum dot LED made by combining a quantum dot and an LED (Light Emitting Diode light-emitting diode) can be used for a display device.
  • a quantum dot LED made by combining a quantum dot and an LED (Light Emitting Diode light-emitting diode) can be used for a display device.
  • the structure of the conventional quantum dot LED is as shown in FIG. 1.
  • the blue LED 1 emits high-purity blue light to the glass tube 3 which is vacuum-packed with quantum dots, and the quantum dots of different sizes excite the three primary colors to be mixed into white light, thereby A high color gamut that achieves backlighting.
  • the conventional quantum dot LED needs to complete the fixing of the blue LED 1 patch and the bracket-like structural component 2 on the LED PCB board 4, and the quantum dot glass tube 3 needs to be extended into the bracket-like structural component 2 and fixed. complex structure.
  • a quantum dot LED comprising an LED chip, a transparent separator, a transparent cover, an electrical conductor and a bracket provided with an open slot, the electrical conductor passing through the bottom of the open slot, and one end is located in the open slot The other end is located outside the open slot;
  • the transparent partition is disposed in the open slot and is fixedly and sealingly connected to the bracket, and the transparent cover is disposed on a side of the transparent partition away from the LED chip and is fixedly and sealingly connected to the bracket.
  • a first sealing groove is formed between the transparent separator and the bottom of the opening groove, and the LED chip is fixed in the bottom of the opening groove in the first sealing groove, and is electrically connected to the electric conductor.
  • a second sealing groove is formed between the transparent separator and the transparent cover, and the second sealing groove is used to fill quantum dots of at least two sizes.
  • the quantum dot LED has a first sealing groove formed by using a transparent separator and a bottom of the open groove, and a second sealing groove is formed between the transparent cover and the transparent partition, and the second sealing groove is filled with quantum dots to fix the LED wafer
  • the LED chip can be electrically connected to the outside of the open slot through the electrical conductor
  • the device is electrically connected.
  • the present invention does not require a glass tube, and the quantum dots in the bracket, the LED chip and the second sealing groove can be welded as a whole structure to the power supply device, and the overall structure is simple, and the manufacturing process is simple.
  • the quantum dots in the second sealing groove are directly disposed above the LED wafer, and the quantum dots in the second sealing groove can be excited by the light, and the utilization rate is high.
  • Figure 1 is a front elevational view of a conventional quantum dot LED
  • FIG. 2 is a front elevational view of a quantum dot LED in an embodiment.
  • a quantum dot LED in an embodiment includes a bracket 110 having an open slot, an LED chip 120, a transparent spacer 130, a transparent cover 140, and an electrical conductor 150.
  • the electrical conductor 150 passes through the open slot.
  • the bottom is located at one end in the open slot and the other end is located outside the open slot.
  • the transparent spacer 130 is disposed in the open slot and is fixedly connected to the bracket 110.
  • the transparent cover 140 is disposed on the side of the transparent spacer 130 away from the LED chip 120 and is fixedly connected to the bracket 110.
  • a first sealing groove a is formed between the transparent partition plate 130 and the bottom of the opening groove.
  • the LED chip 120 is fixed in the bottom of the opening groove in the first sealing groove, and is electrically connected to the electric conductor 150.
  • the transparent partition plate 130 and the transparent cover plate are transparently connected.
  • a second sealing groove b is formed between 140, and the second sealing groove b is used to fill quantum dots of at least two sizes.
  • the bracket 110 is used to fix the LED wafer 120, the transparent spacer 130, and the transparent cover 140.
  • the LED wafer 120 can emit colored light.
  • the transparent sealing plate 130 and the bracket 110, the transparent cover plate 140 and the bracket 110 can be fixedly sealed by using a conventionally known connection manner.
  • the transparent partition 130 and the transparent cover 140 can be chemically bonded.
  • the seamless adhesive is fixed to the bracket 110.
  • the LED chip 120 is connected to an external power supply device through the conductor 150. Specifically, the one end of the conductor 150 outside the open slot is electrically connected to the power supply device, and the LED chip 120 can be powered to cause the LED chip 120 to emit light.
  • the LED chip 120 is provided with a wire 121 electrically connected to the electrical conductor 150 , thereby achieving electrical connection between the LED chip 120 and the electrical conductor 150 .
  • the transparent spacer 130 refers to a colorless and transparent transparent partition, so that the colored light emitted by the LED chip 120 can be irradiated to the quantum dots in the second sealing groove b through the transparent spacer 130, and the quantum dots are on the LED chip. 120 colored light emitted by the excitation of the three primary colors, forming a high color gamut of white light.
  • the transparent cover 140 refers to a colorless and transparent cover plate, which does not affect the color of white light emitted by the quantum dots.
  • the quantum dot LED has a first sealing groove a formed by using the transparent spacer 130 and the bottom of the opening groove, and a second sealing groove b is formed between the transparent cover 140 and the transparent spacer 130, and the second sealing groove is filled with quantum
  • the LED chip 120 is fixed in the first sealing groove a, and the LED chip 120 is electrically connected to the power supply device outside the open slot through the electrical conductor 150.
  • the present invention does not require a glass tube, and the quantum dots in the bracket 110, the LED wafer 120 and the second sealing groove b can be welded as a whole structure to the power supply device, and the overall structure is simple.
  • the fabrication process is also simple; at the same time, the quantum dots in the second sealing groove b are directly disposed above the LED wafer 120, and the quantum dots in the second sealing groove b can be excited by light, and the utilization rate is high.
  • the first sealing groove a is a vacuum chamber. In this way, the LED wafer 120 can be prevented from being oxidized, and the light-emitting effect of the LED wafer 120 can be improved.
  • the first sealing groove a is filled with glue, and the first sealing groove a can be processed into a vacuum chamber. It can be understood that in other embodiments, the first sealing groove a can also be processed into a vacuum cavity by other means.
  • the cross section of the first sealing groove a and the second sealing groove b is an inverted isosceles trapezoid in a direction away from the bottom of the opening groove, and the symmetry of the two inverted isosceles trapezoids The axes coincide.
  • the overall width of the second sealing groove b is made larger than the width of the first sealing groove a, so that the quantum dots in the second sealing groove b can absorb the light emitted from the LED wafer 120 at a wider angle.
  • the contact surface of the bracket 110 and the first sealing groove a is provided with a protrusion 111, and the end of the bottom portion of the protrusion 111 away from the opening groove is fixedly and sealingly connected with the transparent partition plate 130.
  • the maximum width of the first sealing groove a is smaller than the minimum width of the second sealing groove b
  • the cross-sectional width of the transparent partition 130 is larger than the maximum width of the first sealing groove a and less than or equal to the minimum width of the second sealing groove b.
  • the bump 111 can function to support the transparent spacer 130, and can improve the stability of the connection between the transparent spacer 130 and the bracket 110, thereby improving the reliability of the quantum dot LED.
  • the bracket 110 is a bracket provided with a recess 112 at an opening facing the open slot, and the transparent cover 140 is sealingly connected to the recess 112.
  • the transparent cover 140 can be mounted on the bracket 110 for fixed sealing connection, and the stability of the connection between the transparent spacer 130 and the bracket 110 can be further improved, thereby further improving the reliability of the quantum dot LED.
  • the bracket 110 is an EMC (Epoxy Molding Compound) stent or a PCT (poly(trimethylene terephthalate)) stent.
  • EMC epoxy Molding Compound
  • PCT poly(trimethylene terephthalate)
  • the EMC bracket and the PCT bracket have good heat resistance and can improve the stability of the overall structure of the quantum dot LED.
  • the stent 110 can be of other types, such as a PPA (polyphthalamide) stent.
  • the bracket 110 is a white bracket.
  • the walls of the first sealing groove a and the second sealing groove b are white supports. Since white can reflect light, by using a white bracket, absorption of light can be reduced, and light utilization efficiency can be improved.
  • the LED wafer 120 is a blue LED wafer.
  • the blue light has a shorter wavelength and a larger energy, and the blue light is less harmful to the human body than the violet light. Therefore, by using a blue LED chip, the luminous effect of the quantum dot LED can be improved under the premise of ensuring the safety of use. It will be appreciated that in other embodiments, LED wafers 120 that emit other colors in visible light may also be employed.
  • the transparent spacer 130 and the transparent cover 140 are both glass sheets.
  • the glass plate has good light transmittance and heat insulation, can enhance the refraction of light, and can improve the protection effect on the thermal insulation of the quantum dots, thereby further improving the luminous effect of the quantum dot LED.
  • the electrical conductor 150 includes at least two sheets of metal.
  • the metal piece is located at one end of the open slot to be electrically connected to the power supply device to improve the stability between the bracket 110 and the power supply device. At the same time, by using at least two metal pieces, it is avoided that one of the metal pieces cannot be electrically conductive. The caused LED chip 120 is powered off, which can improve the reliability of the electrical connection between the LED chip 120 and the power supply device.
  • the quantum dot LED further includes a PCB board 160.
  • One end of the bracket 110 at the bottom of the open slot is fixed to the PCB board 160, and one end of the conductor 150 outside the open slot is electrically connected to the PCB board 160. That is, in the present embodiment, the power supply device for supplying power to the LED chip 120 is the PCB board 160.
  • the PCB board 160 has built-in processing circuitry to ensure efficient operation of the LED wafer 120.

Abstract

A quantum dot LED, comprising a holder (110) provided with an open slot, an LED wafer (120), a transparent separator (130), a transparent cover plate (140), and a conductive body (150). The conductive body passes through the bottom of the open slot. One end of the conductive body is located in the open slot, and the other end of the conductive body is located outside the open slot. The transparent separator is provided in the open slot, and is fixedly and sealably connected to the holder. The transparent cover plate is provided on the side of the transparent separator distal from the LED wafer, and is fixedly and sealably connected to the holder. A first sealing groove (a) is formed between the transparent separator and the bottom of the open slot. The LED wafer is located in the first sealing groove, is fixed on the bottom of the open slot, and is electrically connected to the conductive body. A second sealing groove (b) is formed between the transparent separator and the transparent cover plate. The second sealing groove is used for filling quantum dots having at least two sizes. Both the overall structure and the manufacturing process of the quantum dot LED are simple. Moreover, the quantum dots in the second sealing groove are directly distributed above the LED wafer, can be excited by light, and have high utilization rate.

Description

量子点LEDQuantum dot LED 技术领域Technical field
本发明涉及半导体发光技术领域,特别是涉及一种量子点LED。The present invention relates to the field of semiconductor light-emitting technologies, and in particular to a quantum dot LED.
背景技术Background technique
量子点是一种纳米级半导体发光粒子,量子点与LED(Light Emitting Diode发光二极管)结合制成的量子点LED可用于显示装置。A quantum dot is a nano-scale semiconductor light-emitting particle, and a quantum dot LED made by combining a quantum dot and an LED (Light Emitting Diode light-emitting diode) can be used for a display device.
传统的量子点LED的结构如图1所示,工作时蓝光LED 1发射出高纯度蓝光照射到真空封装有量子点的玻璃管3,由不同尺寸的量子点激发出三基色混合为白光,从而实现背光的高色域。然而,传统的这种量子点LED需要在LED PCB板4上分别完成蓝光LED 1的贴片和支架类结构件2的固定,需要将量子点玻璃管3伸进支架类结构件2并固定,结构复杂。The structure of the conventional quantum dot LED is as shown in FIG. 1. During operation, the blue LED 1 emits high-purity blue light to the glass tube 3 which is vacuum-packed with quantum dots, and the quantum dots of different sizes excite the three primary colors to be mixed into white light, thereby A high color gamut that achieves backlighting. However, the conventional quantum dot LED needs to complete the fixing of the blue LED 1 patch and the bracket-like structural component 2 on the LED PCB board 4, and the quantum dot glass tube 3 needs to be extended into the bracket-like structural component 2 and fixed. complex structure.
发明内容Summary of the invention
基于此,有必要针对上述问题,提供一种结构简单的量子点LED。Based on this, it is necessary to provide a quantum dot LED with a simple structure for the above problems.
一种量子点LED,包括LED晶片、透明隔板、透明盖板、导电体和设有开口槽的支架,所述导电体穿过所述开口槽的底部,且一端位于所述开口槽内,另一端位于所述开口槽外;A quantum dot LED comprising an LED chip, a transparent separator, a transparent cover, an electrical conductor and a bracket provided with an open slot, the electrical conductor passing through the bottom of the open slot, and one end is located in the open slot The other end is located outside the open slot;
所述透明隔板设于所述开口槽内且与所述支架固定密封连接,所述透明盖板设于所述透明隔板远离所述LED晶片一侧且与所述支架固定密封连接,所述透明隔板与所述开口槽的底部之间形成第一密封槽,所述LED晶片位于所述第一密封槽内固定于所述开口槽的底部,且与所述导电体电连接,所述透明隔板与所述透明盖板之间形成第二密封槽,所述第二密封槽用于填充至少两种尺寸的量子点。The transparent partition is disposed in the open slot and is fixedly and sealingly connected to the bracket, and the transparent cover is disposed on a side of the transparent partition away from the LED chip and is fixedly and sealingly connected to the bracket. a first sealing groove is formed between the transparent separator and the bottom of the opening groove, and the LED chip is fixed in the bottom of the opening groove in the first sealing groove, and is electrically connected to the electric conductor. A second sealing groove is formed between the transparent separator and the transparent cover, and the second sealing groove is used to fill quantum dots of at least two sizes.
上述量子点LED,通过采用透明隔板与开口槽的底部形成第一密封槽,透明盖板与透明隔板之间形成第二密封槽,第二密封槽内灌满量子点,将LED晶片固定于第一密封槽内,LED晶片通过导电体可与开口槽外部的供电 装置电连接。如此,相比于传统的量子点LED,本发明不需要玻璃管,可将支架、LED晶片和第二密封槽内的量子点作为整体结构,焊接于供电装置即可,整体结构简单,制作工艺也简单;同时,第二密封槽内的量子点直接布于LED晶片上方,第二密封槽内的量子点均可受光被激发,利用率高。The quantum dot LED has a first sealing groove formed by using a transparent separator and a bottom of the open groove, and a second sealing groove is formed between the transparent cover and the transparent partition, and the second sealing groove is filled with quantum dots to fix the LED wafer In the first sealing groove, the LED chip can be electrically connected to the outside of the open slot through the electrical conductor The device is electrically connected. Thus, compared with the conventional quantum dot LED, the present invention does not require a glass tube, and the quantum dots in the bracket, the LED chip and the second sealing groove can be welded as a whole structure to the power supply device, and the overall structure is simple, and the manufacturing process is simple. At the same time, the quantum dots in the second sealing groove are directly disposed above the LED wafer, and the quantum dots in the second sealing groove can be excited by the light, and the utilization rate is high.
附图说明DRAWINGS
图1为传统的量子点LED的正视图;Figure 1 is a front elevational view of a conventional quantum dot LED;
图2为一实施例中量子点LED的正视图。2 is a front elevational view of a quantum dot LED in an embodiment.
具体实施方式detailed description
参考图2,一实施例中的一种量子点LED,包括设有开口槽的支架110、LED晶片120、透明隔板130、透明盖板140和导电体150,导电体150穿过开口槽的底部,且一端位于开口槽内,另一端位于开口槽外。透明隔板130设于开口槽内且与支架110固定密封连接,透明盖板140设于透明隔板130远离LED晶片120一侧且与支架110固定密封连接。透明隔板130与开口槽的底部之间形成第一密封槽a,LED晶片120位于第一密封槽内固定于开口槽的底部,且与导电体150电连接,透明隔板130与透明盖板140之间形成第二密封槽b,第二密封槽b用于填充至少两种尺寸的量子点。Referring to FIG. 2, a quantum dot LED in an embodiment includes a bracket 110 having an open slot, an LED chip 120, a transparent spacer 130, a transparent cover 140, and an electrical conductor 150. The electrical conductor 150 passes through the open slot. The bottom is located at one end in the open slot and the other end is located outside the open slot. The transparent spacer 130 is disposed in the open slot and is fixedly connected to the bracket 110. The transparent cover 140 is disposed on the side of the transparent spacer 130 away from the LED chip 120 and is fixedly connected to the bracket 110. A first sealing groove a is formed between the transparent partition plate 130 and the bottom of the opening groove. The LED chip 120 is fixed in the bottom of the opening groove in the first sealing groove, and is electrically connected to the electric conductor 150. The transparent partition plate 130 and the transparent cover plate are transparently connected. A second sealing groove b is formed between 140, and the second sealing groove b is used to fill quantum dots of at least two sizes.
支架110用于固定LED晶片120、透明隔板130和透明盖板140。LED晶片120可发出有色光。具体地,可以采用现有公知的连接方式实现透明隔板130与支架110、透明盖板140与支架110的固定密封连接,例如,可以采用化学粘合剂将透明隔板130和透明盖板140无缝粘贴固定在支架110上。The bracket 110 is used to fix the LED wafer 120, the transparent spacer 130, and the transparent cover 140. The LED wafer 120 can emit colored light. Specifically, the transparent sealing plate 130 and the bracket 110, the transparent cover plate 140 and the bracket 110 can be fixedly sealed by using a conventionally known connection manner. For example, the transparent partition 130 and the transparent cover 140 can be chemically bonded. The seamless adhesive is fixed to the bracket 110.
LED晶片120通过导电体150连接外部的供电装置,具体地,导电体150位于开口槽外的一端电连接供电装置,可为LED晶片120供电以使LED晶片120发光。本实施例中,参考图2,LED晶片120设有导线121,导线121与导电体150电连接,从而实现LED晶片120与导电体150的电连接。The LED chip 120 is connected to an external power supply device through the conductor 150. Specifically, the one end of the conductor 150 outside the open slot is electrically connected to the power supply device, and the LED chip 120 can be powered to cause the LED chip 120 to emit light. In this embodiment, referring to FIG. 2 , the LED chip 120 is provided with a wire 121 electrically connected to the electrical conductor 150 , thereby achieving electrical connection between the LED chip 120 and the electrical conductor 150 .
透明隔板130指无色可透光的隔板,使得LED晶片120发出的有色光可以透过透明隔板130照射到第二密封槽b内的量子点上,量子点在LED晶片 120发出的有色光的照射下激发出三基色,形成高色域的白光。同理,透明盖板140指无色可透光的盖板,不影响量子点发出的白光的颜色。The transparent spacer 130 refers to a colorless and transparent transparent partition, so that the colored light emitted by the LED chip 120 can be irradiated to the quantum dots in the second sealing groove b through the transparent spacer 130, and the quantum dots are on the LED chip. 120 colored light emitted by the excitation of the three primary colors, forming a high color gamut of white light. Similarly, the transparent cover 140 refers to a colorless and transparent cover plate, which does not affect the color of white light emitted by the quantum dots.
上述量子点LED,通过采用透明隔板130与开口槽的底部形成第一密封槽a,透明盖板140与透明隔板130之间形成第二密封槽b,第二密封槽内b灌满量子点,将LED晶片120固定于第一密封槽a内,LED晶片120通过导电体150可与开口槽外部的供电装置电连接。如此,相比于传统的量子点LED,本发明不需要玻璃管,可将支架110、LED晶片120和第二密封槽b内的量子点作为整体结构,焊接于供电装置即可,整体结构简单,制作工艺也简单;同时,第二密封槽b内的量子点直接布于LED晶片120上方,第二密封槽b内的量子点均可受光被激发,利用率高。The quantum dot LED has a first sealing groove a formed by using the transparent spacer 130 and the bottom of the opening groove, and a second sealing groove b is formed between the transparent cover 140 and the transparent spacer 130, and the second sealing groove is filled with quantum The LED chip 120 is fixed in the first sealing groove a, and the LED chip 120 is electrically connected to the power supply device outside the open slot through the electrical conductor 150. In this way, compared with the conventional quantum dot LED, the present invention does not require a glass tube, and the quantum dots in the bracket 110, the LED wafer 120 and the second sealing groove b can be welded as a whole structure to the power supply device, and the overall structure is simple. The fabrication process is also simple; at the same time, the quantum dots in the second sealing groove b are directly disposed above the LED wafer 120, and the quantum dots in the second sealing groove b can be excited by light, and the utilization rate is high.
在一实施例中,第一密封槽a为真空腔体。如此,可避免LED晶片120被氧化,提高LED晶片120的发光效果。本实施例中,第一密封槽a内灌满胶水,可将第一密封槽a处理为真空腔体。可以理解,在其他实施例中,还可以采用其他方式将第一密封槽a处理为真空腔体。In an embodiment, the first sealing groove a is a vacuum chamber. In this way, the LED wafer 120 can be prevented from being oxidized, and the light-emitting effect of the LED wafer 120 can be improved. In this embodiment, the first sealing groove a is filled with glue, and the first sealing groove a can be processed into a vacuum chamber. It can be understood that in other embodiments, the first sealing groove a can also be processed into a vacuum cavity by other means.
在一实施例中,请继续参考图2,第一密封槽a和第二密封槽b的横截面在远离开口槽的底部的方向上呈倒等腰梯形,且两个倒等腰梯形的对称轴重合。如此,使得第二密封槽b的整体宽度大于第一密封槽a的宽度,从而第二密封槽b内的量子点可以吸收LED晶片120更广角度所发射的光。In an embodiment, referring to FIG. 2, the cross section of the first sealing groove a and the second sealing groove b is an inverted isosceles trapezoid in a direction away from the bottom of the opening groove, and the symmetry of the two inverted isosceles trapezoids The axes coincide. Thus, the overall width of the second sealing groove b is made larger than the width of the first sealing groove a, so that the quantum dots in the second sealing groove b can absorb the light emitted from the LED wafer 120 at a wider angle.
本实施例中,支架110与第一密封槽a的接触面上设有凸块111,凸块111远离开口槽的底部一端与透明隔板130固定密封连接。此时,第一密封槽a的最大宽度小于第二密封槽b的最小宽度,透明隔板130的横截面宽度大于第一密封槽a的最大宽度且小于或等于第二密封槽b的最小宽度。如此,凸块111可起到支撑透明隔板130的作用,可提高透明隔板130与支架110连接的稳定性,从而提高量子点LED的可靠性。In this embodiment, the contact surface of the bracket 110 and the first sealing groove a is provided with a protrusion 111, and the end of the bottom portion of the protrusion 111 away from the opening groove is fixedly and sealingly connected with the transparent partition plate 130. At this time, the maximum width of the first sealing groove a is smaller than the minimum width of the second sealing groove b, and the cross-sectional width of the transparent partition 130 is larger than the maximum width of the first sealing groove a and less than or equal to the minimum width of the second sealing groove b. . Thus, the bump 111 can function to support the transparent spacer 130, and can improve the stability of the connection between the transparent spacer 130 and the bracket 110, thereby improving the reliability of the quantum dot LED.
本实施例中,支架110为面向开口槽的开口处设有凹部112的支架,透明盖板140与凹部112密封连接。如此,可将透明盖板140搭载在支架110上进行固定密封连接,可进一步提高透明隔板130与支架110连接的稳定性,从而进一步提高量子点LED的可靠性。 In this embodiment, the bracket 110 is a bracket provided with a recess 112 at an opening facing the open slot, and the transparent cover 140 is sealingly connected to the recess 112. In this way, the transparent cover 140 can be mounted on the bracket 110 for fixed sealing connection, and the stability of the connection between the transparent spacer 130 and the bracket 110 can be further improved, thereby further improving the reliability of the quantum dot LED.
在一实施例中,支架110为EMC(Epoxy Molding Compound环氧树脂模塑料)支架或PCT(聚对苯二甲酸1,4-环己烷二甲酯)支架。EMC支架和PCT支架耐热性好,可提高量子点LED整体结构的稳定性。可以理解,在其他实施例中,支架110还可以采用其他类型,例如PPA(聚邻苯二酰胺)支架。In one embodiment, the bracket 110 is an EMC (Epoxy Molding Compound) stent or a PCT (poly(trimethylene terephthalate)) stent. The EMC bracket and the PCT bracket have good heat resistance and can improve the stability of the overall structure of the quantum dot LED. It will be appreciated that in other embodiments, the stent 110 can be of other types, such as a PPA (polyphthalamide) stent.
具体地,本实施例中,支架110为白色支架。第一密封槽a和第二密封槽b的壁为白色支架,由于白色可反射光,因此通过采用白色支架,可以降低对光的吸收,提高光的利用率。Specifically, in this embodiment, the bracket 110 is a white bracket. The walls of the first sealing groove a and the second sealing groove b are white supports. Since white can reflect light, by using a white bracket, absorption of light can be reduced, and light utilization efficiency can be improved.
在一实施例中,LED晶片120为蓝光LED晶片。蓝光波长较短,能量较大,且相比于紫光,蓝光对人体伤害较小。因此,通过采用蓝光LED晶片,可以在保证使用安全性的前提下,提高量子点LED的发光效果。可以理解,在其他实施例中,也可以采用发出可见光中其他颜色的LED晶片120。In an embodiment, the LED wafer 120 is a blue LED wafer. The blue light has a shorter wavelength and a larger energy, and the blue light is less harmful to the human body than the violet light. Therefore, by using a blue LED chip, the luminous effect of the quantum dot LED can be improved under the premise of ensuring the safety of use. It will be appreciated that in other embodiments, LED wafers 120 that emit other colors in visible light may also be employed.
在一实施例中,透明隔板130和透明盖板140均为玻璃板。玻璃板透光性和隔热性好,可以增强对光的折射,且可提高对量子点隔热的保护效果,从而进一步提高量子点LED的发光效果。In an embodiment, the transparent spacer 130 and the transparent cover 140 are both glass sheets. The glass plate has good light transmittance and heat insulation, can enhance the refraction of light, and can improve the protection effect on the thermal insulation of the quantum dots, thereby further improving the luminous effect of the quantum dot LED.
在一实施例中,导电体150包括至少两片金属片。金属片位于开口槽外的一端可与供电装置贴附式电连接,提高支架110与供电装置之间的稳固性,同时,通过采用至少两片金属片,可避免因其中一金属片无法导电而引起的LED晶片120断电,可以提高LED晶片120与供电装置电连接的可靠性。In an embodiment, the electrical conductor 150 includes at least two sheets of metal. The metal piece is located at one end of the open slot to be electrically connected to the power supply device to improve the stability between the bracket 110 and the power supply device. At the same time, by using at least two metal pieces, it is avoided that one of the metal pieces cannot be electrically conductive. The caused LED chip 120 is powered off, which can improve the reliability of the electrical connection between the LED chip 120 and the power supply device.
在一实施例中,上述量子点LED还包括PCB板160,开口槽的底部所在的支架110一端固定于PCB板160,且导电体150位于开口槽外的一端电连接PCB板160。即,本实施例中,用于给LED晶片120供电的供电装置为PCB板160。具体地,PCB板160内置有处理电路,以保证LED晶片120的有效工作。In one embodiment, the quantum dot LED further includes a PCB board 160. One end of the bracket 110 at the bottom of the open slot is fixed to the PCB board 160, and one end of the conductor 150 outside the open slot is electrically connected to the PCB board 160. That is, in the present embodiment, the power supply device for supplying power to the LED chip 120 is the PCB board 160. Specifically, the PCB board 160 has built-in processing circuitry to ensure efficient operation of the LED wafer 120.
以上所述实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。 The technical features of the above-described embodiments may be arbitrarily combined. For the sake of brevity of description, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be considered as the scope of this manual.
以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。 The above-described embodiments are merely illustrative of several embodiments of the present invention, and the description thereof is more specific and detailed, but is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be determined by the appended claims.

Claims (8)

  1. 一种量子点LED,其特征在于,包括LED晶片、透明隔板、透明盖板、导电体和设有开口槽的支架,所述导电体穿过所述开口槽的底部,且一端位于所述开口槽内,另一端位于所述开口槽外;A quantum dot LED, comprising: an LED chip, a transparent separator, a transparent cover, an electrical conductor, and a bracket provided with an open slot, the electrical conductor passing through a bottom of the open slot, and one end is located at the Inside the open slot, the other end is located outside the open slot;
    所述透明隔板设于所述开口槽内且与所述支架固定密封连接,所述透明盖板设于所述透明隔板远离所述LED晶片一侧且与所述支架固定密封连接,所述透明隔板与所述开口槽的底部之间形成第一密封槽,所述LED晶片位于所述第一密封槽内固定于所述开口槽的底部,且与所述导电体电连接,所述透明隔板与所述透明盖板之间形成第二密封槽,所述第二密封槽用于填充至少两种尺寸的量子点。The transparent partition is disposed in the open slot and is fixedly and sealingly connected to the bracket, and the transparent cover is disposed on a side of the transparent partition away from the LED chip and is fixedly and sealingly connected to the bracket. a first sealing groove is formed between the transparent separator and the bottom of the opening groove, and the LED chip is fixed in the bottom of the opening groove in the first sealing groove, and is electrically connected to the electric conductor. A second sealing groove is formed between the transparent separator and the transparent cover, and the second sealing groove is used to fill quantum dots of at least two sizes.
  2. 根据权利要求1所述的量子点LED,其特征在于,所述透明隔板和所述透明盖板均为玻璃板。The quantum dot LED of claim 1 wherein said transparent spacer and said transparent cover are both glass sheets.
  3. 根据权利要求1所述的量子点LED,其特征在于,所述第一密封槽和所述第二密封槽的横截面在远离所述开口槽的底部的方向上呈倒等腰梯形,且两个倒等腰梯形的对称轴重合。The quantum dot LED according to claim 1, wherein a cross section of the first sealing groove and the second sealing groove is an inverted isosceles trapezoid in a direction away from a bottom of the open groove, and two The axes of symmetry of the inverted isosceles trapezoids coincide.
  4. 根据权利要求3所述的量子点LED,其特征在于,所述支架与所述第一密封槽的接触面上设有凸块,所述凸块远离所述开口槽的底部一端与所述透明隔板固定密封连接。The quantum dot LED according to claim 3, wherein a bump is provided on a contact surface of the bracket and the first sealing groove, and the bump is away from a bottom end of the open groove and the transparent The partition is fixedly sealed.
  5. 根据权利要求3所述的量子点LED,其特征在于,所述支架为面向所述开口槽的开口处设有凹部的支架,所述透明盖板与所述凹部密封连接。The quantum dot LED according to claim 3, wherein the holder is a holder provided with a recess facing the opening of the opening groove, and the transparent cover is sealingly connected to the recess.
  6. 根据权利要求1所述的量子点LED,其特征在于,所述导电体包括至少两片金属片。The quantum dot LED of claim 1 wherein said electrical conductor comprises at least two sheets of metal.
  7. 根据权利要求1所述的量子点LED,其特征在于,所述支架为EMC支架或PCT支架。The quantum dot LED of claim 1 wherein the scaffold is an EMC scaffold or a PCT scaffold.
  8. 根据权利要求1所述的量子点LED,其特征在于,还包括PCB板,所述开口槽的底部所在的所述支架一端固定于所述PCB板,且所述导电体位于所述开口槽外的一端电连接所述PCB板。 The quantum dot LED according to claim 1, further comprising a PCB board, wherein one end of the bracket at the bottom of the open slot is fixed to the PCB board, and the electrical conductor is located outside the open slot One end is electrically connected to the PCB board.
PCT/CN2017/103466 2016-11-22 2017-09-26 Quantum dot led WO2018095131A1 (en)

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