WO2018094700A1 - 一种光器件封装装置、光模块及光器件封装的方法 - Google Patents

一种光器件封装装置、光模块及光器件封装的方法 Download PDF

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Publication number
WO2018094700A1
WO2018094700A1 PCT/CN2016/107333 CN2016107333W WO2018094700A1 WO 2018094700 A1 WO2018094700 A1 WO 2018094700A1 CN 2016107333 W CN2016107333 W CN 2016107333W WO 2018094700 A1 WO2018094700 A1 WO 2018094700A1
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WIPO (PCT)
Prior art keywords
package
optical
optical device
disposed
packaging
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PCT/CN2016/107333
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English (en)
French (fr)
Inventor
高磊
宋小鹿
董振
赵庆
曾理
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP16922499.5A priority Critical patent/EP3534196A4/en
Priority to PCT/CN2016/107333 priority patent/WO2018094700A1/zh
Priority to CN201680084471.2A priority patent/CN108885317A/zh
Publication of WO2018094700A1 publication Critical patent/WO2018094700A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G02B6/4254—Sealed packages with an inert gas, e.g. nitrogen or oxygen

Definitions

  • the present application relates to the field of communications, and in particular, to an optical device packaging device, an optical module, and a method for packaging an optical device.
  • the optical device is divided into an active optical device and a passive optical device.
  • the active optical device is an optical device that converts an electrical signal into an optical signal or converts the optical signal into an electrical signal, and needs to be added.
  • Energy-driven work, passive optical devices are optical devices that do not require external energy to drive the work.
  • optical devices In order to meet the reliability requirements of optical devices during use, optical devices need to be packaged. Especially for active optical devices, since the active optical device is easily disabled due to the action of oxygen and water vapor in a non-hermetic environment, the hermetic package of the active optical device is of great significance for its reliability.
  • the current common structures for hermetic packaging of active optical devices are:
  • the packaging device comprises a metal tube shell, and the optical device is arranged in the metal tube shell for sealing.
  • the cost of the metal tube shell in the packaging device is high, the production cost of the optical device product is increased, and the fiber outlet sealing design is difficult. .
  • the packaging device comprises a package cover plate, and the package cavity is formed by one or two package cover plates that are coupled with the optical device to seal the package cover plate.
  • the production cost of the package device is low, but it is difficult to implement the optical device.
  • the present invention provides an optical device packaging device, an optical module, and a method for packaging an optical device, which are used to solve the problem that the optical device packaging device of the prior art cannot simultaneously realize the air-sealed mounting of the optical device and the optical coupling input and output of the optical device. The problem.
  • an optical device package device includes an optical device and two oppositely disposed package substrates, wherein:
  • a package cavity filled with a shielding gas is formed between the two package substrates, and the optical device is disposed in the package Inside the cavity;
  • An optical waveguide is disposed in the at least one package substrate, and an end surface of the first coupling end of each optical waveguide is disposed on a surface of the interior of the package cavity and coupled to the optical device, and an end surface of the second coupling end of each optical waveguide And disposed on a surface of the corresponding package substrate located outside the package cavity.
  • the package cavity includes at least one groove for accommodating the optical device, and each groove is disposed on a package substrate The surface of the interior of the package cavity.
  • an end surface of the first coupling end of each optical waveguide is disposed on an inner surface of the corresponding groove.
  • the extending direction and corresponding direction of each optical waveguide in the at least one package substrate provided with the recess The package substrates are parallel, and the end faces of the first coupling ends of the optical waveguides are disposed on the sidewalls of the corresponding grooves, and the end faces of the second coupling ends of the optical waveguides are disposed on the sides of the corresponding package substrates.
  • each optical waveguide in a fourth possible implementation manner of the first aspect, is perpendicular to the corresponding package substrate, and the first of each optical waveguide An end surface of the coupling end is disposed on a surface of the corresponding package substrate in the package cavity, and an end surface of the second coupling end of each optical waveguide is disposed on a surface of the corresponding package substrate away from the package cavity.
  • the package cavity is opposite to two surfaces of the two package substrates, and two opposite to the two package substrates respectively
  • the surface seals are formed by a sealant that is disposed around the periphery of the optical device and that is closed into a closed annular structure.
  • the two opposite surfaces of the two package substrates are respectively provided with two ring pads, each A ring pad is disposed around the periphery of the optical device, the encapsulant being solder and respectively connected to the two ring pads.
  • the solder is a copper-zinc alloy solder, a silver-copper alloy solder or a silver-copper-zinc alloy solder.
  • the at least one package substrate is provided with a power supply circuit, and the power supply output end of the power supply circuit is located in the package Inside the cavity and connected to the optical device, a power input end of the power supply circuit is located outside the package cavity.
  • the power supply circuit is disposed between the package substrate where the power supply circuit is located and the ring pad .
  • the power supply circuit includes an electrode disposed on one package substrate and disposed on another package substrate a power-on interface, an output end of the electrode is disposed in a region enclosed by the corresponding ring pad and connected to the optical device, the electricity The input end of the pole is disposed outside the area enclosed by the corresponding ring pad and connected to the powering interface.
  • the output end of the electrode is connected to the optical device by a lead wire, or the output of the electrode The terminal is directly connected to the optical device.
  • the optical device is coupled to each optical waveguide by a butt coupling, a grating coupling or an evanescent wave.
  • the optical device comprises at least one of the following:
  • Modulators filters, beam splitters, combiners, detectors, light sources.
  • the package substrate provided with the optical waveguide is a silicon-on-insulator substrate, a glass substrate, a lithium niobate substrate or a polymer substrate.
  • the package substrate on which the optical waveguide is not disposed is a ceramic substrate.
  • each optical waveguide is an optical waveguide prepared from a silicon, silicon nitride or silicon oxide material.
  • an optical module including an optical transmission end, and further includes the first aspect, the first possible implementation manner of the first aspect, the second possible implementation manner, and the third possible implementation manner.
  • an optical device packaging device provided in a sixteenth possible implementation, the optical transmission end being coupled to a second coupling end of at least one optical waveguide of the optical device packaging device.
  • the optical transmission end is coupled to each optical waveguide by a butt coupling, a grating coupling or an evanescent wave.
  • a method of packaging an optical device including:
  • an optical device disposed between the opposite two package substrates to an end surface of the first coupling end of each of the at least one package substrate in which the optical waveguide is disposed;
  • the opposite surfaces of the substrate are sealingly connected to form a package cavity around the optical device;
  • each optical waveguide is disposed on a surface inside the package cavity, and each optical waveguide further includes a second end surface disposed on a surface of the corresponding package substrate located outside the package cavity Coupling end.
  • the two surfaces of the two package substrates are sealingly connected to form a package cavity around the optical device, and the method specifically includes:
  • a sealant specifically including :
  • the sealing agent is solder, and two annular pads are respectively disposed on opposite surfaces of the two package substrates, and each annular pad is disposed around a periphery of the optical device;
  • Solder is disposed on at least one of the two ring pads, and the two ring pads are joined by soldering.
  • the solder is a copper-zinc alloy solder, a silver-copper alloy solder or a silver-copper-zinc alloy solder.
  • the two ring pads are connected by reflow soldering.
  • the shielding gas is nitrogen.
  • the package device is formed by using two package substrates to form a package cavity, which is lower in cost and is used for the package device using the metal case in the prior art.
  • An optical waveguide coupled to the optical device and coupled to the light input or output is disposed inside the package substrate, and the optical device inside the package cavity can exchange light with the outside through the optical waveguide, and realize the sealing of the optical device. The input and output of light are realized. Therefore, the optical device packaging device simultaneously solves the problem of low-cost hermetic sealing of the optical device and the optical coupling input and output of the optical device.
  • FIG. 1 is a schematic exploded view of an optical device package device according to Embodiment 1;
  • FIG. 2 is a schematic structural view of a first package substrate according to Embodiment 1;
  • FIG. 3 is a schematic structural view of a second package substrate according to Embodiment 1;
  • FIG. 4 is a schematic cross-sectional structural view of an optical device package device according to Embodiment 1;
  • FIG. 5 is a schematic cross-sectional structural view of an optical device package device according to Embodiment 1;
  • FIG. 6 is a flow chart showing a packaging method of an optical device according to Embodiment 3.
  • FIG. 7 is a flow chart of another packaging method of the optical device provided in Embodiment 3.
  • the optical device package device includes an optical device 10, and two oppositely disposed first package substrates 20 and a second package. Substrate 30.
  • the optical device 10 in this embodiment may be an active optical device or a passive optical device.
  • the optical device 10 may be a light source or a photodetector, such as a laser chip or a probe. Chip.
  • the size and thickness of the first package substrate 20 and the second package substrate 30 should be set according to the outer dimensions of the corresponding optical device, and the sizes of the two package substrates may be the same or different.
  • FIG. 4 and FIG. 5 are schematic cross-sectional structural views of an optical device package device according to Embodiment 1.
  • a package cavity 100 filled with a shielding gas is formed between two package substrates, and the optical device is formed. 10 is disposed inside the package cavity 100.
  • the package cavity 100 refers to a sealed hollow structure formed between two package substrates, and the optical device is encapsulated inside the sealed hollow structure to isolate external water vapor and oxygen.
  • the first package substrate 20 includes a surface 200
  • the second package substrate 30 includes a surface 300
  • the surface 200 and the surface 300 are oppositely disposed
  • the surface 200 and the surface 300 The first package substrate 20 is provided with a first recess 21, and the second package substrate 30 is provided with a second recess 31.
  • the two recesses serve to accommodate the optical device.
  • the periphery of the two grooves is connected by a sealant 40 to form a package cavity.
  • no groove may be disposed between the two package substrates, and only the sealant is used for connection, or a spacer having a certain thickness is connected to form a package cavity, and the optical device in the package cavity may be glued or the like. The way to fix it.
  • the shielding gas can be a common gas such as helium gas, argon gas or nitrogen gas, and can be selected according to the production process. It should be noted that, in the specific implementation process, the sealing cavity 100 may not be filled with a shielding gas, but the inside of the package cavity 100 may be set as a vacuum, and the vacuum packaging cavity may also serve as a package for the optical device. effect.
  • an optical waveguide 24 is disposed in the first package substrate 20.
  • the optical waveguide 24 has two coupling ends. As shown in FIG. 4 and FIG. 5, the end surface of the first coupling end 241 of the optical waveguide 24 is disposed. The surface of the interior of the package cavity 100 is coupled to the optical device 10, and the end surface of the second coupling end 242 of the optical waveguide 24 is disposed on the outer surface of the first package substrate 20.
  • the optical waveguide 24 extends inside the first package substrate 20. To introduce or export light into the package cavity 100, the optical device 10 inside the package cavity 100 is optically exchanged with the outside of the package cavity 100.
  • the optical device 10 when the optical device 10 is an active optical device, such as the optical device 10 being a light source, the first coupling end 241 of the optical waveguide 24 is an input end, and the second coupling end 242 is an output end. If the optical device 10 is a photodetector, the first coupling end 241 of the optical waveguide 24 is an output end, and the second coupling end 242 is an input end.
  • the optical waveguides 24 may be disposed in the first package substrate 20 and the second package substrate 30, and the optical waveguides 24 in each of the package substrates may be two or more.
  • the extending direction of the optical waveguide 24 is parallel to the first package substrate 20, and the first of each optical waveguide 24 is An end surface of the coupling end 241 is disposed on a sidewall of the first recess 21, and an end surface of the second coupling end 242 of each optical waveguide 24 is disposed on the first package substrate On the side of the 20, an optical signal can be input or output from the side of the second package substrate 30 to the optical device 10.
  • the optical input/output port of the optical device 10 faces the sidewall of the first recess 21, and the first recess 21 can function not only to accommodate the optical device 10 but also The optical input/output port of the optical device 10 interfaces with the end face of the first coupling end 241 of the optical waveguide 24.
  • each optical waveguide 24 is perpendicular to the first package substrate 20, and the end surface of the first coupling end 241 of the optical waveguide 24 is disposed on the first package substrate 20 in the package.
  • the surface of the cavity 100 is disposed, and the end surface of the second coupling end 242 of the optical waveguide 24 is disposed on the surface of the first package substrate 20 away from the package cavity 100, and the optical signal can input or output light from the bottom surface of the second package substrate 30.
  • Device 10 may not be fixed by the first recess 21, and no recess may be disposed on the first package substrate 20.
  • the optical waveguides 24 may be disposed in the above two manners.
  • the sealing agent 40 can be implemented by using an adhesive, and in order to simplify the packaging process between the two package substrates, in one embodiment, to simplify the connection structure between the two package substrates, see FIG.
  • FIG. 2 is a schematic structural view of the first package substrate 20 according to the first embodiment.
  • FIG. 3 is a schematic structural diagram of a second package substrate 30 according to Embodiment 1.
  • a first annular pad 22 is disposed on the surface 200 of the first package substrate 20, and a second annular pad 32 is disposed on the surface 300 of the second package substrate 30.
  • the first annular pad 22 and the second annular pad 32 are both disposed.
  • the first encapsulating substrate 20 and the second encapsulating substrate 30 are connected to each other in a sealed manner, and the soldering agent 40 is soldered to the first ring pad 22 and the second ring pad 32, respectively. .
  • solder may be previously disposed on the first ring pad 22 or the second ring pad 32, and the solder is melted by reflow soldering to connect the first Ring pad 22 and second ring pad 32.
  • the soldering of the first ring pad 22 and the second ring pad 32 can be integrated with other soldering processes of the optical device, further reducing the production cost of the optical device packaging device.
  • the solder may be a copper-zinc alloy solder, a silver-copper alloy solder or a silver-copper-zinc alloy solder commonly used in a reflow process, and the airtightness is superior to the binder.
  • the two package substrates may be directly connected by welding or the like, or the sealant 40 may be replaced with a spacer having a certain thickness.
  • the optical device 10 When the optical device 10 is an active optical device, the optical device needs to be powered.
  • the first package substrate 20 and the second package substrate 30 should be provided with a power supply circuit.
  • the power supply output end of the power supply circuit is located inside the package cavity 100. And connected to the optical device, the power input end of the power supply circuit is located outside the package cavity 100.
  • the first package substrate 20 and the second package substrate 30 are provided with a power supply circuit, and the power supply circuit specifically includes an electrode 23 disposed on the first package substrate 20, and The power-on interface 33 is disposed on the second package substrate 30.
  • the output end 231 of the electrode 23 is located on the first ring pad.
  • the inside of the enclosed area 22 is connected to the optical device 10 by a lead, and the input end 232 of the electrode 23 is located outside the area surrounded by the second annular pad 22.
  • the first package substrate 20 and the second package are shown.
  • the input end 232 of the electrode 23 is connected to the power-on interface 33, and the power-on interface 33 can be implemented by providing a pad on the second package substrate 30.
  • the output end 231 of the electrode 23 is connected to the optical device 10 by wires.
  • the optical device 10 can also be directly connected to the output end of the electrode 23, and specifically, the optical device 10 can be connected. Flip on the first package substrate 20.
  • the power supply circuit may be disposed only on the first package substrate 20 or the second package substrate 30, that is, the electrodes and the power supply interface may be disposed on the same package substrate.
  • the electrode 23 of the power supply circuit is disposed on the ring pad and the electrode 23 Between the package substrates.
  • the ring pads and the electrodes of the power supply circuit may be layered, that is, a pad layer and a circuit layer are formed on the surface of the package substrate, and the pad layer is located above the circuit layer.
  • the coupling manner between the optical device 10 and the optical waveguide 24 may adopt a butt coupling, a grating coupling or an evanescent wave coupling, and is specifically selected according to the production cost of the optical device packaging device and the required coupling efficiency.
  • the optical device 10 packaged inside the optical device package device includes at least one of the following devices:
  • Modulators filters, beam splitters, combiners, detectors, light sources.
  • some optical devices that do not need to be hermetically sealed may be disposed outside the package cavity 100 to simplify the production process of the optical device packaging device.
  • the package substrate is prepared by using a material capable of fabricating an optical waveguide and an electrode, for example, an insulator may be used.
  • a material capable of fabricating an optical waveguide and an electrode for example, an insulator may be used.
  • the package substrate may be a ceramic substrate.
  • the optical waveguide 24 is an optical waveguide made of silicon, silicon nitride or silicon oxide material.
  • the package cavity 100 is formed by using two package substrates to package the optical device, which is omitted from the prior art package using a metal package.
  • the metal shell has a low production cost and can further reduce the production cost when reflow soldering is used for optical device packaging.
  • the optical device packaging device simultaneously realizes the low-cost hermetic packaging of the optical device and solves the problem of optical coupling output of the optical device.
  • the embodiment provides an optical module, including an optical transmission end, where the optical transmission end includes an optical fiber.
  • the optical device packaging device as disclosed in the first embodiment above, wherein the optical transmission end is coupled to the second coupling end of the at least one optical waveguide in the optical device packaging device.
  • the butt coupling, the grating coupling or the evanescent wave coupling between the optical transmission end and each optical waveguide are specifically selected according to the production cost of the optical device packaging device and the required coupling efficiency.
  • the principle of the low-cost hermetic sealing of the optical device and the problem of solving the optical coupling output of the optical device are the same as those of the optical device packaging device provided in the first embodiment.
  • the optical module provided in this embodiment can also realize the optical device at the same time.
  • the embodiment provides a method for packaging an optical device, including:
  • an end surface of the first coupling end of each optical waveguide is disposed on a surface of the inside of the package cavity formed by connecting the two package substrates, and each of the optical waveguides further includes an end surface disposed corresponding to The package substrate is located at a second coupling end of a surface external to the package cavity.
  • the optical device can be first coupled to the optical waveguide, and then the package cavity is formed around the optical device.
  • FIG. 6 is a first embodiment of the optical device package device provided in the third embodiment.
  • a flow chart of a packaging method, the above packaging method can be implemented as follows:
  • Step S101 coupling an optical device disposed between the opposite two package substrates to an end surface of the first coupling end of each of the at least one package substrate in which the optical waveguide is disposed.
  • at least one optical waveguide has been prepared in at least one of the package substrates.
  • Step S102 sealingly connecting the opposite surfaces of the two package substrates to form a package cavity around the optical device.
  • the package cavity can be formed first around the optical device, and then the optical device is coupled to the optical waveguide.
  • FIG. 7 is another optical device package device according to Embodiment 3.
  • a flow chart of a packaging method, the above packaging method can be implemented as follows:
  • step S201 the opposite surfaces of the two package substrates are sealingly connected to form a package cavity around the optical device disposed between the opposite two package substrates.
  • Step S202 coupling the optical device to an end surface of the first coupling end of each of the at least one package substrate in which the optical waveguide is disposed.
  • at least one optical waveguide may be formed in at least one package substrate, and the optical waveguide is coupled to the optical device.
  • the above packaging method may be performed under a protective gas atmosphere, or a protective gas may be injected into the package cavity after the package cavity is formed.
  • the above packaging method can also be implemented in a vacuum environment, or in a package cavity shape. After the process, the package cavity is evacuated.
  • the two surfaces of the two package substrates are sealed and connected to form a package cavity around the optical device, and specifically includes:
  • the opposite surfaces of the two package substrates are sealed by a sealant, wherein the sealant is disposed around the periphery of the optical device and closed into a closed annular structure.
  • the sealing agent may be an adhesive, and in order to further improve the sealing performance of the sealing agent and reduce the production cost of the optical device packaging device, in one embodiment, the two package substrates may be connected by soldering. Forming the package cavity, the two surfaces of the two package substrates are sealed and sealed by a sealant, and the method includes:
  • the sealing agent is solder, and two annular pads are respectively disposed on opposite surfaces of the two package substrates, each annular pad is disposed around the periphery of the optical device; and the specific structure of the package substrate provided with the annular pad is shown in FIG. 2 And Figure 3;
  • Solder is placed on at least one of the two ring pads and the two ring pads are joined by soldering.
  • the soldering method may employ reflow soldering to melt the solder and connect the first ring pad and the second ring pad. Since reflow soldering is a common soldering process, and the use of a protective gas in reflow soldering is also a common process, the production cost of the optical device packaging device is not additionally increased, and the soldering of the first ring pad and the second ring pad can be performed. Integration with other soldering processes of optical devices further reduces the production cost of optical device packaging devices.
  • the shielding gas may be nitrogen.
  • the above solder may be selected from copper-zinc alloy solder, silver-copper alloy solder or silver-copper-zinc alloy solder, and its sealing performance is superior to that of the adhesive.
  • the two package substrates may be directly connected by welding or the like, or the sealant may be replaced with a spacer having a certain thickness.
  • two package substrates are used to form a package cavity to package the optical device, which is omitted from the prior art package using a metal package.
  • the metal shell has a low production cost and can further reduce the production cost when reflow soldering is used for optical device packaging;
  • the optical waveguide is disposed inside the package substrate and does not affect the sealing performance of the package cavity
  • the optical device inside the package cavity is coupled with the optical waveguide, and the optical waveguide can be exchanged with the outside through the optical waveguide, and the optical device is realized.
  • the sealing and the light input and output are realized at the same time. Therefore, the method of packaging the optical device simultaneously realizes the low-cost hermetic packaging of the optical device and solves the problem of the optical coupling input and output of the optical device.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

一种光器件封装装置、光模块及光器件封装的方法，用以解决现有技术中的光器件封装装置无法同时低成本实现光器件的气密封装和光器件的光耦合输入输出的问题。光器件封装装置包括光器件，还包括两个相对设置的封装基板，两个封装基板之间形成有填充保护气体的封装腔体，光器件设置于封装腔体内部；至少一个封装基板内设有光波导，每个光波导的第一耦合端的端面设置于封装腔体内部的表面、并与光器件耦合连接，每个光波导的第二耦合端的端面设置于对应的封装基板位于封装腔体外部的表面。该封装装置同时解决了光器件的低成本气密封装和光器件的光耦合输入输出的问题。

Description

一种光器件封装装置、光模块及光器件封装的方法 技术领域
本申请涉及通信领域，特别涉及一种光器件封装装置、光模块及光器件封装的方法。
背景技术
随着下一代互联网、移动通信、云计算和大数据技术的快速发展，以光为信息载体的光互连、光通信、光处理技术成为信息社会和智能城市发展的基础。
光通过光器件来成为信息载体，光器件分为有源光器件和无源光器件，有源光器件是将电信号转换成光信号、或将光信号转换成电信号的光器件，需要外加能源驱动工作，无源光器件是不需要外加能源驱动工作的光器件。
为满足光器件在使用过程中对可靠性的要求，需要对光器件进行封装。尤其对于有源光器件而言，由于有源光器件在非气密环境下极易由于氧气、水汽的作用而导致失效，因此有源光器件的气密封装对其可靠性具有重要意义。
目前对有源光器件进行气密封装的封装装置的常见结构有：
一、封装装置包括金属管壳，将光器件设置在金属管壳内进行密封，该封装装置中的金属管壳的成本较高，增加了光器件产品的生产成本，且光纤出口密封设计较为困难。
二、封装装置包括封装盖板，通过一个或两个与光器件配合连接的封装盖板形成封装腔体，对封装盖板进行密封，该封装装置的生产成本较低，但是较难实现光器件的光耦合输入输出。
因此，如何对光器件进行低成本气密封装、且实现光器件的光耦合输入输出，已成为本领域技术人员亟待解决的技术问题。
发明内容
本申请提供了一种光器件封装装置、光模块及光器件封装的方法，用以解决现有技术中的光器件封装装置无法同时低成本实现光器件的气密封装和光器件的光耦合输入输出的问题。
为实现上述目的，本申请提供如下的技术方案：
第一方面，提供一种光器件封装装置，包括光器件和两个相对设置的封装基板，其中：
所述两个封装基板之间形成有填充保护气体的封装腔体，所述光器件设置于所述封装 腔体内部；
至少一个封装基板内设有光波导，每个光波导的第一耦合端的端面设置于所述封装腔体内部的表面、并与所述光器件耦合连接，每个光波导的第二耦合端的端面设置于对应的封装基板位于所述封装腔体外部的表面。
根据上述第一方面，在第一方面的第一种可能的实现方式中，所述封装腔体包括至少一个用于容置所述光器件的凹槽，每个凹槽设置于一个封装基板位于所述封装腔体内部的表面上。
根据上述第一方面的第一种可能的实现方式，在第一方面的第二种可能的实现方式中，每个光波导的第一耦合端的端面设置于对应的凹槽的内表面。
根据上述第一方面的第二种可能的实现方式，在第一方面的第三种可能的实现方式中，设有所述凹槽的至少一个封装基板中，每个光波导的延伸方向与对应的封装基板平行，且每个光波导的第一耦合端的端面设置于对应的凹槽的侧壁，且每个光波导的第二耦合端的端面设置于对应的封装基板的侧面。
根据上述第一方面的第二种可能的实现方式，在第一方面的第四种可能的实现方式中，每个光波导的延伸方向与对应的封装基板垂直，且每个光波导的第一耦合端的端面设置于对应封装基板位于所述封装腔体内的表面，且每个光波导的第二耦合端的端面设置于对应的封装基板远离所述封装腔体的表面。
根据上述第一方面，在第一方面的第五种可能的实现方式中，所述封装腔体由所述两个封装基板相对的两个表面、以及分别与所述两个封装基板相对的两个表面密封连接的密封剂配合形成，所述密封剂围绕所述光器件的周边设置、并闭合成封闭的环形结构。
根据上述第一方面的第五种可能的实现方式，在第一方面的第六种可能的实现方式中，所述两个封装基板相对的两个表面上分别设有两个环形焊盘，每个环形焊盘围绕所述光器件的周边设置，所述密封剂为焊料且分别与所述两个环形焊盘连接。
根据上述第一方面的第六种可能的实现方式，在第一方面的第七种可能的实现方式中，所述焊料为铜锌合金焊料、银铜合金焊料或银铜锌合金焊料。
根据上述第一方面的第六种可能的实现方式，在第一方面的第八种可能的实现方式中，至少一个封装基板上设有供电电路，所述供电电路的供电输出端位于所述封装腔体内部且与所述光器件连接，所述供电电路的电源输入端位于所述封装腔体外部。
根据上述第一方面的第八种可能的实现方式，在第一方面的第九种可能的实现方式中，所述供电电路设置于所述供电电路所在的封装基板和所述环形焊盘之间。
根据上述第一方面的第九种可能的实现方式，在第一方面的第十种可能的实现方式中，所述供电电路包括设置于一个封装基板上的电极和设置于另一个封装基板上的上电接口，所述电极的输出端设置于对应的环形焊盘围成的区域内且与所述光器件连接，所述电 极的输入端设置于对应的环形焊盘围成的区域外且与所述上电接口连接。
根据上述第一方面的第十种可能的实现方式，在第一方面的第十一种可能的实现方式中，所述电极的输出端与所述光器件通过引线连接，或所述电极的输出端与所述光器件直接连接。
根据上述第一方面，在第一方面的第十二种可能的实现方式中，所述光器件与每个光波导之间对接耦合、光栅耦合或倏逝波耦合。
根据上述第一方面，在第一方面的第十三种可能的实现方式中，所述光器件包括下列器件中的至少一种：
调制器、滤波器、分束器、合束器、探测器、光源。
根据上述第一方面，在第一方面的第十四种可能的实现方式中，设有光波导的封装基板为绝缘体上硅基板、玻璃基板、铌酸锂基板或聚合物基板。
根据上述第一方面，在第一方面的第十五种可能的实现方式中，在所述两个封装基板中的一个未设置光波导时，所述未设置光波导的封装基板为陶瓷基板。
根据上述第一方面，在第一方面的第十六种可能的实现方式中，每个光波导为硅、氮化硅或氧化硅材料制备的光波导。
第二方面，提供一种光模块，包括光传输端，还包括如上述第一方面、第一方面的第一种可能的实现方式、第二种可能的实现方式、第三种可能的实现方式、第四种可能的实现方式、第五种可能的实现方式、第六种可能的实现方式、第七种可能的实现方式、第八种可能的实现方式、第九种可能的实现方式、第十种可能的实现方式、第十一种可能的实现方式、第十二种可能的实现方式、第十三种可能的实现方式、第十四种可能的实现方式、第十五种可能的实现方式和第十六种可能的实现方式中提供的光器件封装装置，所述光传输端与所述光器件封装装置中的至少一个光波导的第二耦合端耦合连接。
根据上述第二方面，在第二方面的第一种可能的实现方式中，所述光传输端与每个光波导之间对接耦合、光栅耦合或倏逝波耦合。
第三方面，提供一种光器件封装的方法，包括：
在保护气体环境下，将设置于相对的两个封装基板之间的光器件与至少一个内部设置有光波导的封装基板中的每个光波导的第一耦合端的端面耦合连接；将两个封装基板相对的两个表面密封连接，以在所述光器件周围形成封装腔体；
其中，每个光波导的所述第一耦合端的端面设置于所述封装腔体内部的表面，每个光波导还包括端面设置于对应的封装基板位于所述封装腔体外部的表面的第二耦合端。
根据上述第三方面，在第三方面的第一种可能的实现方式中，所述将两个封装基板相对的两个表面密封连接，以在所述光器件周围形成封装腔体，具体包括：
将所述两个封装基板相对的两个表面通过密封剂密封连接，其中，所述密封剂围绕所 述光器件的周边设置并闭合成封闭的环形结构。
根据上述第三方面的第一种可能的实现方式，在第三方面的第二种可能的实现方式中，所述将所述两个封装基板相对的两个表面通过密封剂密封连接，具体包括：
所述密封剂为焊料，所述两个封装基板相对的两个表面上分别设有两个环形焊盘，每个环形焊盘围绕所述光器件的周边设置；
在所述两个环形焊盘中的至少一个上设置焊料，并通过焊接将所述两个环形焊盘对合连接。
根据上述第三方面的第二种可能的实现方式，在第三方面的第三种可能的实现方式中，所述焊料为铜锌合金焊料、银铜合金焊料或银铜锌合金焊料。
根据上述第三方面的第二种可能的实现方式，在第三方面的第四种可能的实现方式中，所述两个环形焊盘通过回流焊对合连接。
根据上述第三方面，在第三方面的第五种可能的实现方式中，所述保护气体为氮气。
根据第一方面提供的光器件封装装置中，采用两个封装基板配合形成封装腔体对光器件进行封装，与现有技术中采用金属管壳的封装装置相比其成本较低，且用于与光器件耦合连接、并进行光的耦合输入或输出的光波导设置于封装基板内部，封装腔体内部的光器件通过光波导即可实现与外界的光交换，在实现光器件的密封的同时实现了光的输入和输出，因此，该光器件封装装置同时解决了光器件的低成本气密封装问题和光器件的光耦合输入输出的问题。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍。
图1是实施例一提供的一种光器件封装装置的分解结构示意图；
图2是实施例一提供的第一封装基板的结构示意图；
图3是实施例一提供的第二封装基板的结构示意图；
图4是实施例一提供的一种光器件封装装置的剖面结构示意图；
图5是实施例一提供的一种光器件封装装置的剖面结构示意图；
图6是实施例三提供的光器件的一种封装方法的流程图；
图7是实施例三提供的光器件的另一种封装方法的流程图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行描述。
实施例一
参见图1所示，图1是实施例一提供的一种光器件封装装置的分解结构示意图，该光器件封装装置包括光器件10，以及两个相对设置的第一封装基板20和第二封装基板30。本实施例中的光器件10可为有源光器件，也可为无源光器件，在光器件为有源光器件时，光器件10可为光源或光检测器，具体例如激光器芯片或探测器芯片。具体实施中，第一封装基板20和第二封装基板30的面积大小和厚度应根据对应的光器件的外形尺寸进行设置，两个封装基板的尺寸可相同也可不同。
参见图4和图5所示，图4和图5是实施例一提供的一种光器件封装装置的剖面结构示意图，两个封装基板之间形成有填充保护气体的封装腔体100，光器件10设置于封装腔体100内部。需要说明的是，封装腔体100是指在两个封装基板之间形成的密封中空结构，光器件被封装在该密封中空结构内部，以隔绝外界的水汽和氧气。封装腔体100的具体设置方式参见图4和图5中所示，第一封装基板20包括表面200，第二封装基板30包括表面300，表面200和表面300相对设置，且表面200和表面300上均设有凹槽，即第一封装基板20上设置有第一凹槽21，以及第二封装基板30上设置有第二凹槽31，两个凹槽起到容置光器件的作用，两个凹槽周边采用密封剂40连接，形成封装腔体。具体实施中，两个封装基板之间可不设置凹槽，仅采用密封剂进行连接、或采用具有一定厚度的隔垫物连接，以形成封装腔体，封装腔体内的光器件可采用胶粘等方式进行固定。还可只采用在任意一个基板上设置凹槽，两个基板位于凹槽周边的部分贴合将凹槽密封，以形成封装腔体。保护气体可采用氦气、氩气、氮气等常见的气体，具体可根据生产工艺进行选择。需要说明的是，在具体实施过程中，上述封装腔体100内也可不填充保护气体，而是将封装腔体100内部设置为真空，真空的封装腔体同样也可起到对光器件的封装作用。
继续参见图1所示，第一封装基板20内设有一个光波导24，光波导24具有两个耦合端，参见图4和图5所示，光波导24的第一耦合端241的端面设置于封装腔体100内部的表面、并与光器件10耦合连接，光波导24的第二耦合端242的端面设置于第一封装基板20的外表面，光波导24在第一封装基板20内部延伸，以将光导入或导出封装腔体100，使封装腔体100内部的光器件10与封装腔体100的外部进行光交换。具体实施中，在光器件10为有源光器件时，如光器件10为光源，则光波导24的第一耦合端241为输入端，第二耦合端242为输出端。如光器件10为光检测器，则光波导24的第一耦合端241为输出端，第二耦合端242为输入端。在其他实现方式中，第一封装基板20和第二封装基板30中均可设置光波导24，且每个封装基板内的光波导24可为两个或多个。
光波导24的设置方法参见图4和图5所示，一种实现方式中，参见图4所示，光波导24的延伸方向与第一封装基板20平行，且每个光波导24的第一耦合端241的端面设置于第一凹槽21的侧壁，且每个光波导24的第二耦合端242的端面设置于第一封装基板 20的侧面，则光信号可从第二封装基板30的侧面输入或输出到光器件10。需要说明的是，该实现方式中，光器件10的光输入/输出端口朝向第一凹槽21的侧壁，第一凹槽21除了起到容置光器件10的作用之外，还可使光器件10的光输入/输出端口与光波导24的第一耦合端241的端面对接。
另一种实现方式中，参见图5所示，每个光波导24的延伸方向与第一封装基板20垂直，且光波导24的第一耦合端241的端面设置于第一封装基板20位于封装腔体100内的表面，且光波导24的第二耦合端242的端面设置于第一封装基板20远离封装腔体100的表面，则光信号可从第二封装基板30的底面输入或输出光器件10。需要说明的是，在此实现方式中，光器件10可不通过第一凹槽21进行固定，则第一封装基板20上可不设置凹槽。
在两个封装基板内均设有光波导24，或光波导24为多个时，光波导24均可按照上述两种方式进行设置。
具体实施中，上述密封剂40可采用粘合剂实现，而为简化两个封装基板之间的封装工艺，一种具体实施方式中，为简化两个封装基板之间的连接结构，参见图2和图3所示，图2是实施例一提供的第一封装基板20的结构示意图。图3是实施例一提供的第二封装基板30的结构示意图。第一封装基板20的表面200上设有第一环形焊盘22，第二封装基板30的表面300上设有第二环形焊盘32，第一环形焊盘22和第二环形焊盘32均围绕光器件的周边设置，且上述密封剂40采用焊料，焊料分别与第一环形焊盘22和第二环形焊盘32密封连接，以将第一封装基板20和第二封装基板30对合连接。
在第一封装基板20和第二封装基板30的连接过程中，可预先将焊料设置于第一环形焊盘22或第二环形焊盘32上，并采用回流焊将焊料融化，以连接第一环形焊盘22和第二环形焊盘32。对第一环形焊盘22和第二环形焊盘32的焊接可与光器件的其他焊接工艺进行集成，进一步降低光器件封装装置的生产成本。
具体实施中，焊料可采用回流焊工艺中常用的铜锌合金焊料、银铜合金焊料或银铜锌合金焊料，其气密性优于粘合剂。
在其他实现方式中，两个封装基板之间也可以采用熔接等方式直接进行连接，或将密封剂40替换为具有一定厚度的隔垫物。
在上述光器件10为有源光器件时，需要对光器件进行供电，则第一封装基板20和第二封装基板30上应设有供电电路，供电电路的供电输出端位于封装腔体100内部且与光器件连接，供电电路的电源输入端位于封装腔体100外部。
一种具体实施方式中，参见图2和图3所示，第一封装基板20和第二封装基板30上设有供电电路，供电电路具体包括设置于第一封装基板20上的电极23，以及设置于第二封装基板30上的上电接口33。参见图2所示，电极23的输出端231位于第一环形焊盘 22围成的区域内部，且与光器件10通过引线连接，电极23的输入端232位于第二环形焊盘22围成的区域外，参见图1所示，第一封装基板20和第二封装基板30对合连接时，电极23的输入端232与上电接口33连接，上电接口33具体可采用在第二封装基板30上设置焊盘实现。具体实施中，参见图2所示，电极23的输出端231与光器件10通过引线连接，在其他实现方式中，光器件10也可与电极23的输出端直接连接，具体可将光器件10倒装于第一封装基板20上。
上述供电电路也可仅设置于第一封装基板20或第二封装基板30上，即电极和上电接口可均设置于同一个封装基板上。
为使伸入第一环形焊盘22或第二环形焊盘32围成的区域内的电极23不影响封装腔体100的密封性能，供电电路的电极23设置于环形焊盘和电极23所在的封装基板之间。具体实施中，环形焊盘和供电电路的电极可分层设置，即在封装基板的表面形成焊盘层和电路层，焊盘层位于电路层的上方。
具体实施中，光器件10与光波导24之间的耦合方式可采用对接耦合、光栅耦合或倏逝波耦合，具体根据光器件封装装置的生产成本和所需的耦合效率进行选取。
为使第一封装基板20或第二封装基板30上实现多通道集成，以及多功能集成，上述光器件封装装置内部封装的光器件10包括下列器件中的至少一种：
调制器、滤波器、分束器、合束器、探测器、光源。
具体实施中，根据实际需求，可将部分不需进行气密封装的光器件设置于封装腔体100的外部，以简化光器件封装装置的生产工艺。
具体实施中，在封装基板上需设置光波导24和电极23时，例如本实施例中的第一封装基板20，则该封装基板采用可制作光波导和电极的材料进行制备，例如可采用绝缘体上硅基板、玻璃基板、铌酸锂基板或聚合物基板。而在两个封装基板中的一个未设置光波导24时，例如本实施例中的第二封装基板30，则该封装基板可为陶瓷基板。
具体实施中，光波导24为硅、氮化硅或氧化硅材料制备的光波导。
实施例一提供的光器件封装装置中，采用两个封装基板配合形成封装腔体100，以对光器件进行封装，与现有技术中采用金属管壳的封装装置相比，由于其省去了金属管壳，其生产成本较低，且在采用回流焊进行光器件封装时可进一步降低生产成本。
同时，由于光波导24设置于封装基板内部，未影响封装腔体100的密封性能，封装腔体100内部的光器件与光波导24耦合连接，通过光波导24即可实现与外界的光交换，在实现光器件的密封的同时实现了光的输入和输出，因此，该光器件封装装置同时实现了光器件的低成本气密封装和解决了光器件的光耦合输出的问题。
实施例二
基于同一发明构思，本实施例提供一种光模块，包括光传输端，光传输端中包括光纤， 还包括如上述实施例一中提供的光器件封装装置，光传输端与光器件封装装置中的至少一个光波导的第二耦合端耦合连接。
具体实施中，光传输端与每个光波导之间对接耦合、光栅耦合或倏逝波耦合，具体根据光器件封装装置的生产成本和所需的耦合效率进行选取。
与实施例一中提供的光器件封装装置同时实现光器件的低成本气密封装和解决光器件的光耦合输出的问题的原理同理，本实施例提供的光模块同样可同时实现光器件的低成本气密封装，和解决光器件的光耦合输出的问题的，其具体实现方式参见实施例一，不再赘述。
实施例三
基于同一发明构思，本实施例提供一种光器件封装的方法，包括：
将设置于相对的两个封装基板之间的光器件与至少一个内部设置有光波导的封装基板中的光波导的第一耦合端的端面耦合连接；将两个封装基板相对的两个表面密封连接，以在光器件周围形成封装腔体。
具体地，设置有光波导的封装基板中，每个光波导的第一耦合端的端面设置于两个封装基板连接形成的封装腔体的内部的表面，每个光波导还包括端面设置于对应的封装基板位于封装腔体外部的表面的第二耦合端。
上述封装方法在具体实施中，可首先将光器件与光波导耦合连接，然后在光器件周围形成封装腔体，则参见图6所示，图6是实施例三提供的光器件封装装置的一种封装方法的流程图，上述封装方法可按照如下步骤实现：
步骤S101，将设置于相对的两个封装基板之间的光器件与至少一个内部设置有光波导的封装基板中的每个光波导的第一耦合端的端面耦合连接。该步骤在具体实施中，至少一个封装基板内已制备有至少一个光波导。
步骤S102，将两个封装基板相对的两个表面密封连接，以在光器件周围形成封装腔体。
另一种实施方式中，可首先在光器件周围形成封装腔体，然后将光器件与光波导耦合连接，则参见图7所示，图7是实施例三提供的光器件封装装置的另一种封装方法的流程图，上述封装方法可按照如下步骤实现：
步骤S201，将两个封装基板相对的两个表面密封连接，以在设置于相对的两个封装基板之间的光器件周围形成封装腔体。
步骤S202，将光器件与至少一个内部设置有光波导的封装基板中的每个光波导的第一耦合端的端面耦合连接。该步骤在具体实施中，可在至少一个封装基板内形成至少一个光波导，并将光波导与光器件耦合连接。
需要说明的是，上述封装方法可在保护气体环境下进行，也可在封装腔体形成后向封装腔体内注入保护气体。同理，也可在真空环境下实施上述封装方法，或者在封装腔体形 成后对封装腔体抽真空。
一种具体实施方式中，上述将两个封装基板相对的两个表面密封连接，以在光器件周围形成封装腔体，具体包括：
将两个封装基板相对的两个表面通过密封剂密封连接，其中，密封剂围绕光器件的周边设置并闭合成封闭的环形结构。
具体实施中，上述密封剂可选用粘合剂，而为了进一步提高密封剂的密封性能，且降低光器件封装装置的生产成本，一种具体实施方式中，可采用焊接方式连接两个封装基板并形成封装腔体，则上述将两个封装基板相对的两个表面通过密封剂密封连接，具体包括：
密封剂为焊料，两个封装基板相对的两个表面上分别设有两个环形焊盘，每个环形焊盘围绕光器件的周边设置；设置有环形焊盘的封装基板的具体结构参见图2和图3所示；
在两个环形焊盘中的至少一个上设置焊料，并通过焊接将两个环形焊盘对合连接。
具体实施中，焊接方式可采用回流焊，以将焊料融化并连接第一环形焊盘和第二环形焊盘。由于回流焊为常见的焊接工艺，且在回流焊中采用保护气体同样为常用工艺，不会额外增加光器件封装装置的生产成本，且对第一环形焊盘和第二环形焊盘的焊接可与光器件的其他焊接工艺进行集成，进一步降低光器件封装装置的生产成本。具体实施中，保护气体可为氮气。
具体实施中，上述焊料可选用铜锌合金焊料、银铜合金焊料或银铜锌合金焊料，其密封性能优于粘合剂。
在其他实现方式中，两个封装基板之间也可以采用熔接等方式直接进行连接，或将密封剂替换为具有一定厚度的隔垫物。
本实施例提供的光器件封装的方法中，采用两个封装基板配合形成封装腔体，以对光器件进行封装，与现有技术中采用金属管壳的封装装置相比，由于其省去了金属管壳，其生产成本较低，且在采用回流焊进行光器件封装时可进一步降低生产成本；
同时，由于光波导设置于封装基板内部，未影响封装腔体的密封性能，封装腔体内部的光器件与光波导耦合连接，通过光波导即可实现与外界的光交换，在实现光器件的密封的同时实现了光的输入和输出，因此，该光器件封装的方法同时实现了光器件的低成本气密封装和解决了光器件的光耦合输入输出的问题。
显然，本领域的技术人员可以对本发明实施例进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (11)

  1. 一种光器件封装装置，其特征在于，包括光器件和两个相对设置的封装基板，其中：
    所述两个封装基板之间形成有填充保护气体的封装腔体，所述光器件设置于所述封装腔体内部；
    至少一个封装基板内设有光波导，每个光波导的第一耦合端的端面设置于所述封装腔体内部的表面、并与所述光器件耦合连接，每个光波导的第二耦合端的端面设置于对应的封装基板位于所述封装腔体外部的表面。
  2. 根据权利要求1所述的光器件封装装置，其特征在于，所述封装腔体包括至少一个用于容置所述光器件的凹槽，每个凹槽设置于一个封装基板位于所述封装腔体内部的表面上。
  3. 根据权利要求2所述的光器件封装装置，其特征在于，每个光波导的第一耦合端的端面设置于对应的凹槽的内表面。
  4. 根据权利要求1所述的光器件封装装置，其特征在于，所述封装腔体由所述两个封装基板相对的两个表面、以及分别与所述两个封装基板相对的两个表面密封连接的密封剂配合形成，所述密封剂围绕所述光器件的周边设置、并闭合成封闭的环形结构。
  5. 根据权利要求4所述的光器件封装装置，其特征在于，所述两个封装基板相对的两个表面上分别设有两个环形焊盘，每个环形焊盘围绕所述光器件的周边设置，所述密封剂为焊料且分别与所述两个环形焊盘连接。
  6. 根据权利要求5所述的光器件封装装置，其特征在于，至少一个封装基板上设有供电电路，所述供电电路的供电输出端位于所述封装腔体内部且与所述光器件连接，所述供电电路的电源输入端位于所述封装腔体外部。
  7. 根据权利要求6所述的光器件封装装置，其特征在于，所述供电电路设置于所述供电电路所在的封装基板和所述环形焊盘之间。
  8. 一种光模块，包括光传输端，其特征在于，还包括如权利要求1-7任一项所述的光器件封装装置，所述光传输端与所述光器件封装装置中的至少一个光波导的第二耦合端耦合连接。
  9. 一种光器件封装的方法，其特征在于，包括：
    将设置于相对的两个封装基板之间的光器件与至少一个内部设置有光波导的封装基板中的所述光波导的第一耦合端的端面耦合连接；将两个封装基板相对的两个表面密封连接，以在所述光器件周围形成封装腔体；
    其中，每个光波导的所述第一耦合端的端面设置于所述封装腔体内部的表面，每个光 波导还包括端面设置于对应的封装基板位于所述封装腔体外部的表面的第二耦合端。
  10. 根据权利要求9所述的光器件封装的方法，其特征在于，所述将两个封装基板相对的两个表面密封连接，以在所述光器件周围形成封装腔体，具体包括：
    将所述两个封装基板相对的两个表面通过密封剂密封连接，其中，所述密封剂围绕所述光器件的周边设置并闭合成封闭的环形结构。
  11. 根据权利要求10所述的光器件封装的方法，其特征在于，所述将所述两个封装基板相对的两个表面通过密封剂密封连接，具体包括：
    所述密封剂为焊料，所述两个封装基板相对的两个表面上分别设有两个环形焊盘，每个环形焊盘围绕所述光器件的周边设置；
    在所述两个环形焊盘中的至少一个上设置焊料，并通过焊接将所述两个环形焊盘对合连接。
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