WO2018090752A1 - 一种pc模块组件 - Google Patents
一种pc模块组件 Download PDFInfo
- Publication number
- WO2018090752A1 WO2018090752A1 PCT/CN2017/105039 CN2017105039W WO2018090752A1 WO 2018090752 A1 WO2018090752 A1 WO 2018090752A1 CN 2017105039 W CN2017105039 W CN 2017105039W WO 2018090752 A1 WO2018090752 A1 WO 2018090752A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- module
- heat dissipation
- bracket
- air outlet
- connecting member
- Prior art date
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
- H04L9/40—Network security protocols
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
Abstract
Description
Claims (10)
- 一种PC模块组件,其特征在于,包括PC模块支架,所述PC模块支架包括底壁和第一侧壁,所述底壁与所述第一侧壁固定连接,所述第一侧壁上设有第一出风口,所述PC模块组件还包括散热结构,所述散热结构的进风口与所述第一出风口连通。
- 如权利要求1所述的PC模块组件,其特征在于,所述散热结构包括导风筒和上端子支架,所述导风筒的进风口与所述第一出风口连通,所述上端子支架上设有多个散热孔,多个所述散热孔与所述导风筒的出风口连通。
- 如权利要求2所述的PC模块组件,其特征在于,所述导风筒的材质为EVA。
- 如权利要求2所述的PC模块组件,其特征在于,所述散热孔为椭圆形。
- 如权利要求1所述的PC模块组件,其特征在于,所述第一侧壁上设有第一散热出口。
- 如权利要求1或5所述的PC模块组件,其特征在于,所述PC模块支架上还设有第二侧壁,所述第二侧壁上设有第二散热出口。
- 如权利要求1所述的PC模块组件,其特征在于,所述PC模块支架上还设有第一连接件,所述PC模块支架的一端通过所述第一连接件架设于壁挂条上。
- 如权利要求7所述的PC模块组件,其特征在于,所述第一连接件为L型,所述第一连接件的竖直段与所述底壁固定连接,所述第一连接件的水平段与所述壁挂条固定连接。
- 如权利要求8所述的PC模块组件,其特征在于,所述PC模块支架上还设有第二连接件,所述PC模块支架的另一端通过所述第二连接件架设于右端子支架上。
- 如权利要求9所述的PC模块组件,其特征在于,所述第二 连接件通过铆钉铆接在所述右端子支架上。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019523160A JP6732123B2 (ja) | 2016-11-17 | 2017-09-30 | Pcモジュールアセンブリ |
KR1020197006631A KR102205377B1 (ko) | 2016-11-17 | 2017-09-30 | Pc 모듈 어셈블리 |
US16/347,068 US10990143B2 (en) | 2016-11-17 | 2017-09-30 | PC module assembly |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621241421.4 | 2016-11-17 | ||
CN201621241421.4U CN206322089U (zh) | 2016-11-17 | 2016-11-17 | 一种pc模块组件 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2018090752A1 true WO2018090752A1 (zh) | 2018-05-24 |
Family
ID=59264431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2017/105039 WO2018090752A1 (zh) | 2016-11-17 | 2017-09-30 | 一种pc模块组件 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10990143B2 (zh) |
JP (1) | JP6732123B2 (zh) |
KR (1) | KR102205377B1 (zh) |
CN (1) | CN206322089U (zh) |
WO (1) | WO2018090752A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN206322089U (zh) | 2016-11-17 | 2017-07-11 | 广州视源电子科技股份有限公司 | 一种pc模块组件 |
Citations (6)
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US6141214A (en) * | 1997-10-02 | 2000-10-31 | Samsung Electronics Co., Ltd. | Cooling apparatus for electronic systems and computer systems with such apparatus |
CN1414442A (zh) * | 2001-10-22 | 2003-04-30 | 联想(北京)有限公司 | 台式电脑主机的风流管制系统 |
CN202372903U (zh) * | 2011-12-05 | 2012-08-08 | 赖子恒 | 电脑机壳 |
CN203193672U (zh) * | 2012-10-18 | 2013-09-11 | 汉柏科技有限公司 | 一种rmi架构网络防火墙设备 |
CN203387414U (zh) * | 2013-08-01 | 2014-01-08 | 深圳市英威腾交通技术有限公司 | 一种牵引变流装置 |
CN206322089U (zh) * | 2016-11-17 | 2017-07-11 | 广州视源电子科技股份有限公司 | 一种pc模块组件 |
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US6151213A (en) * | 1999-05-12 | 2000-11-21 | 3Com Corporation | Ventilation and cooling control system for modular platforms |
US6449150B1 (en) * | 2000-11-13 | 2002-09-10 | Cisco Technology, Inc. | Method and system for cooling a card shelf |
JP4012091B2 (ja) * | 2003-02-20 | 2007-11-21 | 富士通株式会社 | 電子装置の冷却構造及び情報処理装置 |
US6795314B1 (en) * | 2003-03-25 | 2004-09-21 | Hewlett-Packard Development Company, L.P. | Removable fan module and electronic device incorporating same |
JP2005136236A (ja) | 2003-10-30 | 2005-05-26 | Kyocera Corp | 太陽電池モジュールおよびその製造方法 |
WO2007112109A2 (en) * | 2006-03-24 | 2007-10-04 | Slt Logic Llc | Modular chassis providing scalable mechanical, electrical and environmental functionality for microtca and advanced tca boards |
JP2008166375A (ja) * | 2006-12-27 | 2008-07-17 | Nec Corp | プラグインユニット及び電子機器 |
WO2008127672A2 (en) * | 2007-04-11 | 2008-10-23 | Slt Logic Llc | Modular blade for providing scalable mechanical, electrical and environmental functionality in the enterprise using advanced tca boards |
US7843685B2 (en) * | 2008-04-22 | 2010-11-30 | International Business Machines Corporation | Duct system for high power adapter cards |
CN201298197Y (zh) | 2008-10-22 | 2009-08-26 | 鸿富锦精密工业(深圳)有限公司 | 电脑壳体 |
TW201119563A (en) * | 2009-11-26 | 2011-06-01 | Hon Hai Prec Ind Co Ltd | Heat dissipation system and electronic device using the same |
CN103543804A (zh) | 2012-07-13 | 2014-01-29 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
JP5606561B2 (ja) | 2013-01-30 | 2014-10-15 | 株式会社東芝 | 電子機器 |
KR101587453B1 (ko) * | 2013-05-28 | 2016-01-22 | 윤동구 | 멀티 디바이스 베이 및 디바이스에 따른 pci express 스위치의 인터페이스 변환설정 방법 및 장치 |
KR101473406B1 (ko) * | 2013-07-12 | 2014-12-16 | 주식회사 디지탈웨어 | 벽걸이용 컴퓨터 케이스 |
KR20150001993U (ko) * | 2013-11-18 | 2015-05-28 | 케스웰 인코포레이티드 | 가이드 커버를 구비한 기기 본체(機體) 구조 |
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2016
- 2016-11-17 CN CN201621241421.4U patent/CN206322089U/zh active Active
-
2017
- 2017-09-30 KR KR1020197006631A patent/KR102205377B1/ko active IP Right Grant
- 2017-09-30 US US16/347,068 patent/US10990143B2/en active Active
- 2017-09-30 JP JP2019523160A patent/JP6732123B2/ja active Active
- 2017-09-30 WO PCT/CN2017/105039 patent/WO2018090752A1/zh active Application Filing
Patent Citations (6)
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US6141214A (en) * | 1997-10-02 | 2000-10-31 | Samsung Electronics Co., Ltd. | Cooling apparatus for electronic systems and computer systems with such apparatus |
CN1414442A (zh) * | 2001-10-22 | 2003-04-30 | 联想(北京)有限公司 | 台式电脑主机的风流管制系统 |
CN202372903U (zh) * | 2011-12-05 | 2012-08-08 | 赖子恒 | 电脑机壳 |
CN203193672U (zh) * | 2012-10-18 | 2013-09-11 | 汉柏科技有限公司 | 一种rmi架构网络防火墙设备 |
CN203387414U (zh) * | 2013-08-01 | 2014-01-08 | 深圳市英威腾交通技术有限公司 | 一种牵引变流装置 |
CN206322089U (zh) * | 2016-11-17 | 2017-07-11 | 广州视源电子科技股份有限公司 | 一种pc模块组件 |
Also Published As
Publication number | Publication date |
---|---|
JP6732123B2 (ja) | 2020-07-29 |
CN206322089U (zh) | 2017-07-11 |
KR20190034655A (ko) | 2019-04-02 |
JP2019527446A (ja) | 2019-09-26 |
US20200073449A1 (en) | 2020-03-05 |
KR102205377B1 (ko) | 2021-01-19 |
US10990143B2 (en) | 2021-04-27 |
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