WO2018087902A1 - Dispositif électronique pour refroidissement par immersion dans un liquide, unité d'alimentation électrique et système de refroidissement - Google Patents

Dispositif électronique pour refroidissement par immersion dans un liquide, unité d'alimentation électrique et système de refroidissement Download PDF

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Publication number
WO2018087902A1
WO2018087902A1 PCT/JP2016/083618 JP2016083618W WO2018087902A1 WO 2018087902 A1 WO2018087902 A1 WO 2018087902A1 JP 2016083618 W JP2016083618 W JP 2016083618W WO 2018087902 A1 WO2018087902 A1 WO 2018087902A1
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Prior art keywords
electronic device
power supply
cooling
supply unit
voltage
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PCT/JP2016/083618
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English (en)
Japanese (ja)
Inventor
齊藤　元章
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株式会社ＥｘａＳｃａｌｅｒ
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Priority to JP2018549728A priority Critical patent/JP6644906B2/ja
Priority to PCT/JP2016/083618 priority patent/WO2018087902A1/fr
Publication of WO2018087902A1 publication Critical patent/WO2018087902A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Definitions

  • the present invention relates to an electronic device and a power supply unit, and more particularly to an electronic device and a power supply unit that are immersed in a coolant in a cooling device and directly cooled.
  • the present invention also relates to a cooling system using the electronic device and the power supply unit.
  • an electronic device generally refers to an electronic device that requires ultra-high performance operation or stable operation, such as a supercomputer or a data center, and generates a large amount of heat from itself, but is not limited thereto. is not.
  • the power supply unit is a step-down device that steps down a high voltage input (for example, DC 380 V, AC 200 V) from an external power source to a DC voltage output (for example, DC 48 V (including DC 47.5 V), DC 12 V) for electronic equipment.
  • a high voltage input for example, DC 380 V, AC 200 V
  • a DC voltage output for example, DC 48 V (including DC 47.5 V), DC 12 V
  • liquid cooling Conventionally, air cooling and liquid cooling have been used to cool supercomputers and data centers.
  • the liquid cooling type is generally considered to have good cooling efficiency because it uses a liquid that has a heat transfer performance far superior to that of air.
  • an immersion cooling system that uses a fluorocarbon-based coolant is superior to electronic device maintenance (specifically, for example, adjustment, inspection, repair, replacement, expansion, etc.) as compared with a system that uses synthetic oil. In recent years, it has attracted attention.
  • the present inventor has already developed a small-sized immersion cooling device with excellent cooling efficiency for a small-scale immersion cooling supercomputer.
  • This apparatus is applied to and operated in a small supercomputer “Suiren” installed at the High Energy Accelerator Research Organization (Non-patent Document 1).
  • Non-Patent Document 2 Non-Patent Document 3
  • ExaScaler-1 an immersion-cooled small supercomputer, measures the value equivalent to the world's first in the latest supercomputer power consumption performance ranking “Green500” by improving performance by more than 25% ”, March 31, 2015. Press release, ExaScaler Co., Ltd., URL: http://www.exascaler.co.jp/wp-content/uploads/2015/03/20150331.pdf “Aiming to be an Exa-class high-performance machine, renewing semiconductors, cooling and connections (top)”, Nikkei Electronics July 2015 issue, pp.
  • An electronic device applied to an immersion cooling device is usually a power source that steps down a high voltage input supplied from an external power source to a low voltage output used in a device such as a processor, storage device, or network card of the electronic device. It has a unit. Since the power supply unit is connected to an external power supply via a power cable, the power supply unit is placed at the top of the electronic device so that a connector plug of the power cable can be easily connected.
  • a connector plug of the power cable can be easily connected.
  • an immersion cooling apparatus containing several tens of electronic devices dozens of network cables and tens of thick power cables are wired above these electronic devices. In addition, there is a problem that the efficiency of maintenance of electronic devices is hindered.
  • the volume, length, and weight of the power supply unit may occupy 1 ⁇ 4 to 1 / of the entire volume, length, and weight of the electronic device.
  • a cooling tank hereinafter sometimes referred to as “immersion tank”
  • depth is deep.
  • a relatively heavy power supply unit is placed at the top of the electronic device, the center of gravity of the electronic device, and consequently the center of gravity of the entire immersion cooling device, becomes high, which may cause instability against large vibrations such as a large earthquake. there were.
  • HVCD system high voltage direct current (hereinafter referred to as “HVDC”) of DC 380 V to electronic devices such as servers installed in data centers.
  • HVDC high voltage direct current
  • the main advantage of the HVDC system is a significant reduction in power loss.
  • a DC 380V supplied from an external power source is converted to DC 48V and supplied to the electronic device, the power loss generated in the electronic device is Compared to the power loss in the case of supplying DC 12V, it can theoretically be reduced to 1/16. Since the power loss generated in the electronic device is released as heat, the reduction of the power loss is effective for improving the cooling efficiency of the immersion cooling system. Therefore, it is desired to develop a power supply unit having a new configuration for adapting the immersion cooling electronic device to the HVDC system.
  • an electronic device that is immersed in a cooling liquid in a cooling device and directly cooled is A carrier substrate having a voltage input terminal for supplying a DC voltage for the electronic device, wherein the voltage input terminal is electrically connected to a voltage output terminal of a power supply unit; and
  • a support member that supports the substrate so as to be positioned at the top of the power supply unit installed at the bottom of a cooling tank included in the cooling device; including.
  • the support member may include a backboard or a frame structure in which the carrier substrate is fixed to one surface.
  • the backboard or frame structure is slidably supported by a plurality of support pillars that are vertically erected and fixed in the cooling bath. Good.
  • the backboard or frame structure may include a support pin or a guide pin inserted from above into a bracket fixed in the cooling bath.
  • the power supply unit that is immersed in the cooling liquid in the cooling device and directly cooled is A unit board comprising a voltage input terminal for supplying an external power supply voltage and a voltage output terminal, wherein the voltage output terminal is electrically connected to a voltage input terminal of an electronic device; A step-down device mounted on the unit substrate; Including The power supply unit is installed at the bottom of a cooling tank provided in the cooling device so that the electronic device is positioned on the power supply unit when the electronic device is electrically connected to the power supply unit, It is cooled by the coolant flowing in from the bottom or flowing in from other parts of the cooling tank.
  • the unit substrate forms a flow channel through which the coolant flows between one surface of the unit substrate and the bottom portion. Furthermore, it is good to arrange
  • the unit substrate may have a flow channel through which the cooling liquid is passed through the unit substrate.
  • the step-down device may include a converter module that steps down an external high-voltage DC voltage of 200V-420V to a DC voltage of 24V-52V.
  • the step-down device performs AC / DC conversion and step-down conversion of a 100V-250V single-phase or three-phase external high-voltage AC voltage into a DC voltage of 24V-52V.
  • the converter module may be included.
  • the step-down device includes any one or more of a power factor correction circuit, a noise filter, an additional rectifier, and a surge circuit.
  • a peripheral circuit may be included.
  • supply of a voltage to the electronic device is started when detecting a state in which the voltage output terminal is coupled to the voltage input terminal of the electronic device.
  • a first controller may be further included.
  • control unit is installed in the upper part of the liquid level of the cooling liquid in the cooling tank, the wall surface structure part of the cooling tank, or the vicinity of the cooling tank. It is preferable to further include a second controller that detects ON / OFF of a switch that can be operated from the panel and switches start / cut-off of voltage supply to the electronic device.
  • an electronic device that is immersed in a cooling liquid in a cooling device and directly cooled is A carrier substrate having a voltage input terminal for supplying a DC voltage for the electronic device, wherein the voltage input terminal is electrically connected to a voltage output terminal of a power supply unit; and A plurality of module connectors arranged on one surface of the carrier substrate; A plurality of module boards, each of the plurality of module boards having a module connector plug electrically coupled to each of the plurality of module connectors; A plurality of support plates attached at predetermined intervals in the longitudinal direction of the carrier substrate, wherein the adjacent support plates hold both ends of the plurality of module substrates; and When the electronic device is electrically connected to the power supply unit, a support member that supports the carrier substrate so as to be positioned above the power supply unit installed at the bottom of a cooling tank included in the cooling device; including.
  • the support member may include a backboard or a frame structure in which the carrier substrate is fixed to one surface.
  • the backboard or the frame structure is slidably supported by a plurality of support pillars that are vertically fixed in the cooling tank. Good.
  • the backboard or frame structure includes a support pin or a guide pin inserted from above into a bracket fixed in the cooling bath. Good.
  • the backboard or frame structure is composed of an outer frame portion and a beam portion that crosses the inside of the outer frame portion in the width direction, A plurality of support plates may be attached to the outer frame portion and the beam portion.
  • each of the support plates is formed with a plurality of grooves, and each of the plurality of grooves has an end portion of the plurality of module substrates. Each may be inserted.
  • each of the plurality of module boards includes a module board on which a processor and a memory are mounted, a module board on which a programmable logic device is mounted, and a network communication board.
  • a module board equipped with an adapter card function, a module board equipped with a storage device, or a combination of two or more of the processor and memory, the programmable logic device, the adapter card function for network communication, or the storage device It is good that it is a composite module board mounted.
  • a power supply unit is a power supply unit that is directly cooled by being immersed in a coolant in a cooling device,
  • a unit board comprising a power supply voltage input terminal for supplying an external power supply voltage, and a voltage output terminal, wherein the voltage output terminal is electrically connected to a voltage input terminal of an electronic device,
  • a step-down device mounted on the unit substrate;
  • the power supply unit is installed at the bottom of a cooling tank provided in the cooling device so that the electronic device is positioned on the upper part of the power supply unit when the electronic device is electrically connected to the power supply unit.
  • the stage holds the unit substrate so as to form a flow channel between one surface of the unit substrate and the bottom through which the coolant flowing in from the bottom passes.
  • a plurality of spacers for forming the flow channel may be attached to the stage.
  • the stage includes a flat plate placed on the bottom portion, and the flat plate is formed with a hole through which the cooling liquid flowing from the bottom portion is passed. It is good to have.
  • the stage is attached with a plurality of support pillars standing upright in the cooling bath, and the plurality of support pillars are the electronic units.
  • a backboard or a frame structure included in the device may be slidably supported.
  • a switch for switching start / cut-off of voltage supply to the electronic device is further provided on the upper end or side surface of the plurality of support pillars. Good.
  • the step-down device may include a converter module that steps down an external high-voltage DC voltage of 200V-420V to a DC voltage of 24V-52V. .
  • the step-down device performs AC / DC conversion of a 100V-250V single-phase or three-phase external high-voltage AC voltage to a DC voltage of 24V-52V, and It is preferable to include a converter module that steps down.
  • the step-down device includes any one or more of a power factor correction circuit, a noise filter, an additional rectifier, and a surge circuit.
  • the peripheral circuit may be included.
  • the voltage when a state in which the voltage output terminal is coupled to the voltage input terminal of the electronic device is detected, the voltage is supplied to the electronic device. It may further include a first controller to start.
  • the power supply unit is installed in the upper part of the liquid level of the cooling liquid in the cooling tank, the wall surface structure part of the cooling tank, or in the vicinity of the cooling tank. It is preferable to further include a second controller that detects ON / OFF of a switch that can be operated from the control panel and switches start / cut-off of voltage supply to the electronic device.
  • a cooling system A cooling device; A plurality of electronic devices that are immersed in a cooling liquid in the cooling device and directly cooled; A plurality of power supply units that are immersed in a cooling liquid in the cooling device and directly cooled; Including
  • the cooling device has a cooling tank having an open space formed by a bottom wall and a side wall, and a plurality of inflow openings through which the cooling liquid flows are formed at the bottom of the cooling tank, and circulates through the cooling tank.
  • Each of the plurality of electronic devices includes a voltage input terminal that supplies a DC voltage for the electronic device
  • Each of the plurality of power supply units includes a power supply voltage input terminal for supplying an external power supply voltage, and a voltage output terminal electrically connected to the voltage input terminal of the electronic device
  • Each of the power supply units is installed at the bottom of the cooling tank so that the electronic device is positioned on the upper part of the power supply unit when each of the electronic devices is electrically connected to each of the power supply units.
  • the power supply unit and the electronic device are cooled by a coolant flowing from the bottom.
  • each of the electronic devices may include a carrier substrate having the voltage input terminal and a support member that supports the carrier substrate.
  • the support member may include a backboard or a frame structure in which the carrier substrate is fixed to one surface.
  • the power supply unit includes a unit substrate including the power supply voltage input end and a power supply output end, a step-down device mounted on the unit substrate, A stage to which the unit substrate is fixed, and the stage forms a flow channel between one surface of the unit substrate and the bottom through which a coolant flowing in from the bottom passes. It is preferable to hold the unit substrate.
  • a plurality of spacers for forming the flow channel may be attached to the stage.
  • the stage includes a flat plate placed on the bottom, and the flat plate is formed with a hole through which the coolant flowing from the bottom passes. It is good to have.
  • the stage is attached with a plurality of support pillars standing upright in the cooling bath, and the plurality of support pillars are the electrons.
  • a backboard or a frame structure included in the device may be slidably supported.
  • the power supply unit since the power supply unit is abolished from the electronic device, the wiring of the power cable at the top of the electronic device is unnecessary, the cable wiring can be simplified, and the maintainability of the electronic device can be improved. it can. Since the combined length of the electronic device according to the present invention and the power supply unit can be shortened, the cooling tank can be designed to have a low height. Furthermore, since a relatively heavy power supply unit is placed at the bottom of the cooling tank, the center of gravity of the entire immersion cooling device can be lowered, and vibration resistance can be improved.
  • the cooling tank having an “open space” in this specification includes a cooling tank having a simple sealed structure that does not impair maintainability of the electronic device.
  • a structure in which a top plate for closing the open space of the cooling tank can be placed in the opening of the cooling tank, or a structure in which the top plate can be detachably attached via packing etc. is a simple sealed structure It can be said.
  • FIGS. 1 is a perspective view of an electronic device 100 according to an embodiment of the present invention
  • FIG. 2 is a side view
  • FIG. 3 is a front view
  • FIG. 4 is a partial assembly view.
  • the electronic device 100 is an electronic device that is immersed and cooled directly in a cooling liquid in a cooling device described later.
  • the electronic device 100 includes a backboard or frame structure 110 (hereinafter simply referred to as “backboard 110”), a plurality of module substrates 120, a carrier substrate 121, and a plurality of support plates 115 and 117. As illustrated, the power supply unit is discarded from the electronic device 100. As will be described later, the power supply unit is installed at the bottom of the cooling tank provided in the cooling device.
  • the backboard 110 constitutes a support member that supports the carrier substrate 121.
  • the backboard 110 includes an outer frame portion 110b and a beam portion 110c that traverses the outer frame portion 110b in the width direction.
  • a hanging metal fitting hole 111 is formed through which a hanging tool is passed when the electronic device 100 is put into or taken out of the cooling tank.
  • the backboard 110 includes a pair of support pins or guide pins 113 (hereinafter simply referred to as “support pins 113”) extending downward from the lower portion of the outer frame portion 110b.
  • the plurality of support plates 115 and 117 are attached to the outer frame portion 110 b and the beam portion 110 c via fasteners such as screws that penetrate the carrier substrate 121.
  • the carrier substrate 121 is fixed to one surface of the backboard 110, and the plurality of support plates 115 and 117 are attached at predetermined intervals in the longitudinal direction of the carrier substrate 121.
  • Each of the support plates 115 and 117 is formed with a plurality of grooves, and each of the end portions of the plurality of module substrates 120 is inserted into each of the plurality of grooves. In this way, the adjacent support plates 115 and 117 hold both ends of the plurality of module substrates 120.
  • a DC voltage input connector 131 for supplying a DC voltage for electronic equipment is provided at the bottom of the carrier substrate 121.
  • the DC voltage input connector 131 corresponds to a voltage input end provided on the carrier substrate 121.
  • a plurality of module connectors 128 are arranged on one surface of the carrier substrate 121.
  • Each of the plurality of module boards 120 has a module connector plug 129 that is electrically coupled to each of the plurality of module connectors. Therefore, each module substrate 120 can be inserted into the carrier substrate 121 and pulled out from the carrier substrate 121.
  • two network cards 123 are attached to the carrier substrate 121.
  • 32 module substrates 120 are attached to the carrier substrate 121, but the number of the module substrates 120 is arbitrary and is not particularly limited.
  • the type of the module board 120 is the module board on which the processor and the memory in the illustrated example are mounted (however, FIG. 1-4 shows only the processor 124 and the main memory socket 127 to which the heat sink is thermally connected), Module board with programmable logic device, module board with adapter card function for network communication, module board with storage device, processor and memory, programmable logic device, adapter card function for network communication or storage device
  • a composite module substrate on which two or more of them are mounted in combination may be used, and is not particularly limited.
  • a system-on-chip semiconductor device for example, Intel® Xeon® processor D product family manufactured by Intel® Corporation
  • an ultra-low-profile memory module for example, a general-purpose 32 GB memory.
  • DDR4 Double-Data-Rate4
  • VLP DIMM very low profile, Dual Inline Memory Module
  • FPGA Field-Programmable Gate Array
  • network communication a device compliant with Ethernet or InfiniBand may be used
  • a flash storage such as M.2 SSD (Solid State Drive) or mSATA SSD may be used as the storage device.
  • a plurality of sliders 112 are provided on a surface opposite to one surface of the backboard 110 via a slider holding portion 114 along the longitudinal direction of the outer frame portion 110 b of the backboard 110. Is attached.
  • a pair of sliders 112 attached to both the left and right sides of the outer frame portion 110b are engaged with rail grooves provided in adjacent support pillars, which are fixed upright in a cooling tank described later, The backboard 110 is supported so as to be slidable (up and down in the vertical direction).
  • the electronic device 100 When the electronic device 100 configured as described above slides the backboard 110 with respect to the plurality of support pillars and is immersed in the cooling liquid in the cooling device and directly cooled, the electronic device 100 circulates in the electronic device.
  • the cooling liquid to be moved from the lower side to the upper side of the electronic device 100 is a hole 117a provided in the support plate 117 ⁇ a space between adjacent module substrates 120 ⁇ a hole 117a ⁇ a space between adjacent module substrates 120 ⁇ a hole 117a ⁇ adjacent.
  • the space between the matching module substrates 120 is passed through the holes 115a provided in the support plate 115 in order, and heat is quickly and efficiently taken away from the module substrate 120 and the carrier substrate 121.
  • 100 stable operations can be secured.
  • Each module substrate 120 can be attached to the carrier substrate 121 and removed from the carrier substrate 121. Thereby, adjustment, inspection, repair, replacement, expansion, etc. can be performed for each module substrate 120, so that the maintainability is remarkably improved.
  • FIG. 5 is a perspective view showing an example of the unit substrate 21 in the power supply unit 20 according to the embodiment of the present invention.
  • FIG. 6 is a perspective view showing an example of the stage 22 in the power supply unit 20 according to the embodiment of the invention.
  • FIG. 7 is a perspective view showing a state in which the unit substrate 21 is mounted on the stage 22.
  • the power supply unit 20 is a component not included in the electronic device 100, and is installed at the bottom of the cooling tank provided in the cooling device.
  • the power supply unit 20 includes a unit substrate 21 and a step-down device 215 mounted on the unit substrate 21. As shown in FIG. 5, the unit substrate 21 outputs a power supply voltage input connector 212 that supplies an external power supply voltage from an external power supply (not shown) via a power supply cable 211 and a DC voltage that is stepped down by the step-down device 215. A DC voltage output connector 213.
  • the power supply voltage input connector 212 corresponds to the voltage input terminal of the unit substrate 21, and the DC voltage output connector 213 corresponds to the voltage output terminal.
  • the step-down device 215 is, for example, a converter module that steps down an external high-voltage DC voltage of 200V-420V to a DC voltage of 24V-52V, or a single-phase or three-phase external high-voltage AC voltage of 100V-250V, It is preferable to include a converter module that performs AC / DC conversion and step-down to a DC voltage. More specifically, the former converter module may be capable of stepping down DC380V to DC48V, and the latter converter module may be capable of AC / DC conversion and stepping down to DC48V from AC200V.
  • the step-down device 215 may include any one or more peripheral circuits of a power factor correction circuit, a noise filter, an additional rectifier, and a surge circuit, as needed.
  • a heat sink 216 for heat dissipation is preferably thermally connected to the surface of the step-down device 215.
  • the unit substrate 21 may include a plurality of input fuses 217 that protect against failure. As shown in FIGS. 5 and 7, the unit substrate 21 is fixed to the stage 22 via a plurality of spacers 218. Thus, the unit substrate 21 is arranged away from the bottom so as to form a flow channel 219 through which the coolant flows between one surface of the unit substrate 21 and the bottom of the cooling tank described later.
  • the unit substrate 21 may be configured to have a flow channel through which the coolant passes.
  • the unit substrate 21 may be formed in a hierarchical structure or a hollow structure having an intermediate space, and a cooling liquid may be passed through the structure.
  • the stage 22 includes a flat plate placed at the bottom of a cooling tank described later. Near the center in the width direction of the flat plate, a plurality of holes 23 through which the coolant flowing in from the bottom is passed are formed at intervals in the longitudinal direction. Further, a plurality of notches 24 are formed at intervals in the longitudinal direction at the end in the width direction of the flat plate. The adjacent cutouts 24 have a length and a width necessary for the adjacent cutouts 24 to form the same hole as the hole 23 when the plurality of stages 22 are arranged side by side.
  • a plurality of support pillars 25 are vertically mounted on the stage 22 using an L-shaped bracket 26. Therefore, when the stage 22 is installed in the bottom part of a cooling tank, the some support pillar 25 will stand upright in a cooling tank.
  • a plurality of brackets 27 are fixed on the stage 22.
  • a support pin insertion hole 28 is formed in the bracket 27.
  • a rail groove 251 is formed in each of the plurality of support pillars 25.
  • the pair of sliders 112 included in the backboard 110 of the electronic device 100 are engaged with rail grooves 251 provided in adjacent support pillars, so that the backboard 110 is supported so as to be slidable (up and down in the vertical direction). .
  • the electronic device 100 can raise or lower the backboard 110 by sliding the backboard 110 with respect to the plurality of support pillars 25.
  • the pair of support pins 113 extending downward from the lower part of the outer frame portion 110 b of the backboard 110 of the electronic device 100 are supported by the pair of brackets 27 fixed to the power supply unit 20.
  • the DC voltage output connector 213 of the power supply unit 20 and the DC voltage input connector 131 of the electronic device 100 are accurately aligned.
  • the DC voltage output connector 213 and the DC voltage input connector 131 are electrically connected.
  • the pair of support columns 25 and the pair of brackets 27 support the weight of the electronic device 100 of one unit.
  • the power supply unit 20 may further include a first controller that starts supplying a DC voltage to the electronic device 100 when it detects that the DC voltage output connector 213 is coupled to the DC voltage input connector 131 of the electronic device 100.
  • the first controller may be mounted on the unit substrate 21 as an additional circuit or an electronic mechanism. As a result, the electronic device 100 can be plugged in immediately by energizing the electronic device 100 by simply lowering the electronic device 100 into the cooling tank and coupling the electronic device 100 to the power supply unit 20.
  • the power supply unit 20 detects ON / OFF of a switch that can be operated from the upper part of the liquid level of the cooling liquid in the cooling tank, the wall surface structure part of the cooling tank, or a control panel installed in the vicinity of the cooling tank, A second controller that switches start / disconnection of voltage supply to the electronic device 100 may be further included. Thereby, since an operator can switch ON / OFF for every electronic device 100 manually, a maintainability can be improved.
  • the second controller may also be mounted on the unit board 21 as an additional circuit or an electronic mechanism.
  • a switch for sending a signal for switching start / cut of voltage supply to the electronic device 100 to the second controller may be provided at the upper end or the side surface of each of the plurality of support pillars 25.
  • an immersion cooling apparatus for directly cooling an electronic device 100 and a power supply unit 20 according to an embodiment of the present invention described above by immersing them in a cooling liquid will be described with reference to the drawings. explain.
  • a configuration of a high-density immersion cooling apparatus that stores and cools a total of 24 electronic devices 100 and power supply units 20 in 6 ⁇ 4 sections of a cooling tank will be described. This is merely an example, and the number of units of the electronic device in the high-density immersion cooling apparatus is arbitrary, and does not limit the configuration of the electronic device that can be used in the present invention.
  • the immersion cooling apparatus 1 includes a cooling tank 10, and an open space 10 a is formed by the bottom wall 11 and the side wall 12 of the cooling tank 10.
  • a plurality of inflow openings 150 into which the coolant flows are formed in the bottom wall (bottom portion) 11 in a 9 ⁇ 3 pattern.
  • the side wall 12 is formed with a power cable introduction port 12a, a network cable introduction port 12b, and an outflow opening 170 formed in the vicinity of the liquid surface of the coolant.
  • the immersion cooling device 1 has a top plate 10b for closing the open space 10a of the cooling bath 10. During maintenance work of the immersion cooling device 1, the top plate 10 b is removed from the opening to open the open space 10 a, and during operation of the immersion cooling device 1, the top plate 10 b is placed in the opening of the cooling tank 10 to open it. The space 10a can be closed.
  • the cooling tank 10 is filled with a sufficient amount of coolant to immerse the entire electronic device 100 (see FIG. 10).
  • coolant trade names of 3M Company “Fluorinert (trademark of 3M Company, hereinafter the same) FC-72” (boiling point 56 ° C.), “Fluorinert FC-770” (boiling point 95 ° C.), “Fluorinert FC-3283” ( Fluorine inert liquid composed of perfluorinated compounds (perfluorocarbon compounds) known as “Fluorinert FC-40” (boiling point 155 ° C.), “Fluorinert FC-43” (boiling point 174 ° C.) Although it can be used, it is not limited to these. Since Fluorinert FC-40 and FC-43 have a boiling point higher than 150 ° C. and are extremely difficult to evaporate, when one of them is used as a cooling liquid, the liquid level in the cooling tank 10 is long. This is advantageous over
  • a plurality of inflow headers 16 having a coolant inlet 15 at one end are provided below the bottom wall 11 of the cooling tank 10.
  • a receiving portion 17 having a coolant outlet 18 is provided outside the side wall 12 of the cooling tank 10. The receiving part 17 covers the outflow opening 170 and receives the coolant flowing out from the outflow opening 170 without leaking.
  • each of the plurality of holes 23 formed in the stage 22 and the notches 24 adjacent to each other, which are substantially the same as the holes 23, are respectively formed in the plurality of inflow openings 150 formed in the bottom wall 11. Match. Therefore, the cooling liquid flowing in from the inflow opening 150 is not blocked by the power supply unit 20.
  • the coolant since a flow channel through which the coolant flows is secured between the unit substrate 21 of the power supply unit 20 and the stage 22 (bottom wall 11), the coolant quickly and efficiently heats from both sides of the unit substrate 21. Take away. Accordingly, the cooling efficiency of the power supply unit 20 is excellent.
  • the cooling tank 10 can be designed to have a low height (a shallow depth).
  • the coolant flowing in from the inflow opening 150 flows from the lower side to the upper side of the electronic device 100, the hole 117 a provided in the support plate 117 ⁇ the space between the adjacent module substrates 120 ⁇ the hole 117 a ⁇ the adjacent module substrate 120.
  • the heat is quickly and efficiently taken from the module substrate 120 and the carrier substrate 121 through the space in the order ⁇ the hole 117a ⁇ the space between the adjacent module substrates 120 ⁇ the hole 115a provided in the support plate 115.
  • the coolant thus warmed reaches the outlet 18 through the outlet opening 170 and the receiving portion 17.
  • a pipe (not shown) that leads to the inlet 15 through a heat exchanger (not shown) is connected to the outlet 18, and the cooling liquid is cooled in the heat exchanger, and the cooled cooling liquid flows into the inlet 15. To be supplied.
  • the immersion cooling apparatus 1 since all of the plurality of power supply units 20 are fixed on the plurality of stages 22, six electronic devices on one stage 22 are provided. After 100 is taken out from the cooling tank 10, the stage 22 is lifted and taken out from the cooling tank 10, so that the power supply unit 20 can be adjusted, inspected, repaired, replaced, expanded, and the like.
  • the power cable 211 connected to each of the power supply units 20 can pass a space between the lower part of the electronic device 100 and the stage 22.
  • the wiring of the power cable 211 may be a wiring that is introduced from the power cable introduction port 12a, runs along the side wall 12, passes through the bottom of the cooling tank 10, and reaches the power supply voltage input connector 212 of the unit substrate 21. Wiring in the upper part of the device 100 is not necessary. Therefore, cable wiring can be simplified and the maintainability of the electronic device can be improved.
  • the present invention can be widely applied to an immersion cooling electronic device mounted with ultra-high density.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dispositif électronique qui est immergé dans un liquide de refroidissement à l'intérieur d'un dispositif de refroidissement et refroidi directement. Le dispositif électronique comprend : un substrat de support comprenant une borne d'entrée de tension qui fournit une tension continue au dispositif électronique ; et un élément de support qui supporte le substrat de support. La borne d'entrée de tension est connectée électriquement à une borne de sortie de tension dans une unité d'alimentation électrique. L'élément de support supporte le substrat de support de façon à être positionné dans une section supérieure de l'unité d'alimentation électrique disposée dans la section inférieure d'un réservoir de refroidissement disposé dans le dispositif de refroidissement, lorsque le dispositif électronique est électriquement connecté à l'unité d'alimentation électrique. L'élément de support peut comprendre un panneau arrière ou une structure de cadre sur une surface duquel est fixé le substrat de support. Le panneau arrière ou la structure de cadre peut être supporté coulissant par une pluralité de colonnes de support érigées verticalement et fixées à l'intérieur du réservoir de refroidissement. Le panneau arrière ou la structure de cadre peut comprendre une broche de support ou une broche de guidage insérée, par le haut, dans un support fixé à l'intérieur du réservoir de refroidissement.
PCT/JP2016/083618 2016-11-12 2016-11-12 Dispositif électronique pour refroidissement par immersion dans un liquide, unité d'alimentation électrique et système de refroidissement WO2018087902A1 (fr)

Priority Applications (2)

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JP2018549728A JP6644906B2 (ja) 2016-11-12 2016-11-12 液浸冷却用電子機器、及び電源ユニット、並びに冷却システム
PCT/JP2016/083618 WO2018087902A1 (fr) 2016-11-12 2016-11-12 Dispositif électronique pour refroidissement par immersion dans un liquide, unité d'alimentation électrique et système de refroidissement

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PCT/JP2016/083618 WO2018087902A1 (fr) 2016-11-12 2016-11-12 Dispositif électronique pour refroidissement par immersion dans un liquide, unité d'alimentation électrique et système de refroidissement

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JPS62219597A (ja) * 1986-03-19 1987-09-26 松下電器産業株式会社 プリント基板取付装置
JPH09172278A (ja) * 1995-12-19 1997-06-30 Fujitsu Ltd ブロック積み上げ型通信装置
JPH09232780A (ja) * 1996-02-22 1997-09-05 雪生 ▲高▼橋 電子機器用キャビネット
JP2007066480A (ja) * 2005-09-02 2007-03-15 Hitachi Ltd ディスクアレイ装置
JP3163213U (ja) * 2006-05-16 2010-10-07 ハードコア コンピューター、インク． 液体浸漬冷却システム
WO2016117098A1 (fr) * 2015-01-22 2016-07-28 株式会社ＥｘａＳｃａｌｅｒ Instrument électronique et appareil de refroidissement pour instrument électronique

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112543575A (zh) * 2019-09-23 2021-03-23 上海微电子装备（集团）股份有限公司 一种板卡插接模组及电控盒
CN112543575B (zh) * 2019-09-23 2022-03-04 上海微电子装备（集团）股份有限公司 一种板卡插接模组及电控盒

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