WO2018086314A1 - 一种连接器及通信设备 - Google Patents

一种连接器及通信设备 Download PDF

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Publication number
WO2018086314A1
WO2018086314A1 PCT/CN2017/081548 CN2017081548W WO2018086314A1 WO 2018086314 A1 WO2018086314 A1 WO 2018086314A1 CN 2017081548 W CN2017081548 W CN 2017081548W WO 2018086314 A1 WO2018086314 A1 WO 2018086314A1
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WO
WIPO (PCT)
Prior art keywords
connector
connection end
communication device
backplane
target board
Prior art date
Application number
PCT/CN2017/081548
Other languages
English (en)
French (fr)
Inventor
李宇涛
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2018086314A1 publication Critical patent/WO2018086314A1/zh
Priority to US16/393,630 priority Critical patent/US10516227B2/en
Priority to US16/688,337 priority patent/US10665975B2/en
Priority to US16/856,629 priority patent/US10879636B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/75—Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/735—Printed circuits including an angle between each other
    • H01R12/737—Printed circuits being substantially perpendicular to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Definitions

  • the present invention relates to the field of information technology, and in particular, to a connector and a communication device.
  • the backplane is the core component of the frame communication device.
  • the backplane and multiple boards are connected to each other to implement signal interconnection between different boards.
  • the single board 11 is connected to the back board 13 through the backplane connector 12 (the backplane connector 12 includes a first backplane connector 12a and a setting provided on the single board 11 A second backplane connector 12b) on the backplane 13.
  • the board 11 is provided with a device such as a chip 14 .
  • the chip 14 can communicate with the backplane connector 12 through the trace 15 on the board 11 and pass through the backplane.
  • the connector 12 transmits an electrical signal to the backplane 13, which is ultimately transmitted by the backplane 13 to other boards.
  • the transmission loss of the high-speed cable is lower than the transmission loss of the trace 15
  • the transmission loss of the electrical signal can be reduced.
  • the transition connector 21 can be added to the single board 11, and at both ends of the high-speed cable 22.
  • the cable connector 23 is separately added. The one end of the cable connector 23 is connected to the chip 14, and the other end of the cable connector 23 is connected to the transition connector 21, and the transition connector 21 directs the received high-speed electrical signal into the trace 15 in the board 11 and finally The backing plate 13 is reached through the backplane connector 12.
  • the electrical signal sent by the chip 14 to the backplane 13 is first transmitted on the high-speed cable 22, and then guided by the transition connector 21, and the wiring in the board 11 is traced. 15 is transferred to the backplane 13.
  • the transmission loss of the electrical signal can be reduced when the electrical signal is transmitted on the high-speed cable 22, since the transition connector 21 is added to the single board 11, the electrical signal is transmitted on the adjacent signal line in the transition connector 21.
  • the crosstalk phenomenon is caused, and since a part of the transmission path of the electric signal is also transmitted on the trace 15, the transmission loss caused by the trace 15 cannot be lowered.
  • Embodiments of the present invention provide a connector and a communication device, which can eliminate crosstalk caused by adding a transition connector and reduce transmission loss of an electrical signal during transmission.
  • an embodiment of the present invention provides a connector including a connector body and three connection ends disposed on the connector body, wherein M (M ⁇ 1) signal interfaces in the first connection end One-to-one correspondence with the M signal interfaces in the second connection end, the first connection end is connected to the backplane connector on the backplane, the second connection end is connected to one end of the transmission cable, and the other end of the transmission cable is connected Connected to the communication device on the target board.
  • the backplane is used to implement communication between X boards.
  • the target board is any one of X (X ⁇ 1) boards.
  • the third connection is used for the third board. Secure the connector body to the target board.
  • the electrical signals from the communication devices on the target board can pass directly through the transmission cable and
  • the connector is transmitted to the backplane without going through the traces set in the target board.
  • the transmission loss of the transmission cable is generally lower than the transmission loss of the traces in the target board. Therefore, the transmission of electrical signals during transmission can be reduced. loss.
  • the electrical signal on the transmission cable is directly transmitted to the backplane through the connector, it is not necessary to guide the electrical signal from the transmission cable to the routing in the target board through the transition connector, thereby avoiding the existing Additional crosstalk in the technology when the electrical signal is routed through the transition connector to the traces within the board.
  • the signal interface may be a signal interface in the form of a pin, a conductive contact in the form of a gold finger, or a signal interface in the form of a solder ball array package.
  • M signal pins are disposed through the first connection end and the second connection end, and two ends of each signal pin respectively serve as a signal interface in the first connection end. And a signal interface in the second connection.
  • the connector body is provided with a package substrate, and the package substrate is provided with M wires, one end of each wire is connected to a signal interface in the first connection end, and the wire is another One end is connected to a signal interface in the second connection end.
  • the grounding pin is disposed in the first connecting end, the second connecting end, and the third connecting end, wherein the grounding pin of the first connecting end is in communication with the grounding pin of the third connecting end; the second connection The grounding pin of the terminal is also connected with the grounding pin of the third connecting end, so that the electrical signal forms a complete loop during the transmission process, and the grounding pin of the first connecting end and the grounding pin of the second connecting end are grounded to provide a unified signal for the electrical signal.
  • the reference plane keeps the impedance of the electrical signal consistent and continuous during transmission.
  • the grounding pin of the third connecting end is fixed to the target board by a crimp connection, or the grounding pin of the third connecting end is fixed to the target board by a welded connection.
  • the two ends of the transmission cable are respectively provided with a first cable connector and a second cable connector, wherein the transmission cable is connected to the second connector through the first cable connector The transmission cable is connected to the communication device through the second cable connector.
  • the M signal interfaces in the second connection end constitute N input ends, each input end includes at least one signal interface, N ⁇ 1; wherein the target board is provided with N communications
  • the device each communication device is connected to an input through a transmission cable.
  • each input terminal can be connected to a communication device on the target board through a transmission cable.
  • N communication devices on the target board can directly transmit electrical signals to the backplane through the connector, which greatly The transmission loss of the electrical signal during transmission is reduced.
  • the connector body is a housing that supports and/or secures the three connectors described above.
  • a PCB circuit is disposed on the target board, and the PCB circuit is used to complete a preset communication function.
  • an embodiment of the present invention provides a communications device, including a backplane and X boards connected to the backplane, wherein the target board is provided with a communication device, and the communication device passes through the connector of any of the foregoing Connected to the backplane, the target board is any one of X boards.
  • the first connection end of the connector is connected to the backplane connector of the backboard; the second connection end of the connector is connected to one end of the transmission cable, and the other end of the transmission cable and the communication device Connection; the third connection end of the connector is connected to the target board.
  • the third connection end of the connector is connected to the target board through the gusset, and the splicing board is a sub-card of the target board, and is used to implement at least one communication function of the target board.
  • the target board can be set by not The same gusset plate to achieve different functions.
  • the communication device may be at least one of a chip, a processor, and a memory.
  • the names of the above connectors or communication devices are not limited to the devices themselves, and in actual implementation, these devices may appear under other names. As long as the functions of the respective devices are similar to the present invention, they are within the scope of the claims and the equivalents thereof.
  • FIG. 1 is a schematic structural view 1 of a connection structure between a single board and a back board in the prior art
  • FIG. 2 is a schematic diagram 2 of a connection structure between a single board and a back board in the prior art
  • FIG. 3 is a schematic diagram of an internal structure of a communication device according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural diagram 1 of a connector according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram 1 of a connection structure between a target single board and a back board according to an embodiment of the present disclosure
  • FIG. 6 is a schematic diagram 1 of an internal structure of a connector according to an embodiment of the present invention.
  • FIG. 7 is a second schematic structural diagram of a connector according to an embodiment of the present disclosure.
  • FIG. 8 is a schematic structural diagram of a transmission cable according to an embodiment of the present invention.
  • FIG. 9 is a schematic structural diagram 2 of a connector according to an embodiment of the present disclosure.
  • FIG. 10 is a schematic diagram 2 of a connection structure between a target single board and a back board according to an embodiment of the present invention.
  • first and second are used for descriptive purposes only, and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining “first” and “second” may include one or more of the features either explicitly or implicitly. In the description of the present invention, "a plurality” means two or more unless otherwise stated.
  • Embodiments of the present invention provide a connector that can be applied to any communication device that needs to communicate by connecting X (X ⁇ 1) boards through a backplane.
  • FIG. 3 it is a schematic diagram of a possible internal structure of the above communication device.
  • the backplane 31 is provided with a plurality of backplane connectors 32 arranged in an array.
  • the different panels 33 can be connected to the corresponding backplane connectors 32 by the connector 100 provided in the embodiment of the present invention to make different singles.
  • the board 33 is mounted on the back board 31, and communication devices (e.g., chips) on the different boards 33 can communicate through the back board 31.
  • the connector 100 provided by the embodiment of the present invention is described in detail below by taking the connection mode of the target board and the backboard 31 as an example.
  • the target board is any one of the X boards 33.
  • the target board is provided with a PCB (Printed Circuit Board) circuit, and the PCB circuit can be used to complete a preset communication function, for example,
  • PCB Printed Circuit Board
  • the embodiment of the present invention does not impose any limitation on the message parsing, data transmission, data reception, and the like.
  • the connector 100 includes: a connector body 41, and three connection ends (ie, a first connection end 42, a second connection end 43, and a third connection disposed on the connector body 41. End 44).
  • the connector The body 41 is a housing that supports and/or secures the above three connection ends.
  • the first connection end 42 is connected to the backplane connector 32 on the backboard 31; the second connection end 43 is connected to one end of the transmission cable 45 (ie, 45a shown in FIG. 5), and the transmission line
  • the other end of the cable 45 i.e., 45b shown in Fig. 5 is coupled to the communication device 46 on the target single board 33a; the third connection end 44 (not shown in Fig. 5) is used to secure the connector body 41 to the target unit.
  • the plate 33a On the plate 33a.
  • the M signal interfaces 51a in the first connection end 42 are in one-to-one correspondence with the M signal interfaces 51b in the second connection end 43, and M ⁇ 1.
  • the electrical signal sent by the communication device 46 can be directly transmitted from the signal interface 51b in the second connection terminal 42 to the signal interface 51a in the first connection terminal 42 via the transmission cable 45, and then transmitted through the backplane connector 32.
  • the electrical signal from the communication device 46 on the target board 33a can be directly transmitted to the backplane 31 through the transmission cable 45 and the connector 100 without passing through the routing provided in the target board 33a.
  • the transmission loss of the transmission cable 45 is generally lower than the transmission loss of the traces in the target board 33a, and therefore, the transmission loss of the electrical signal during transmission can be reduced.
  • the signal interface 51a in the first connection end 42 and the signal interface 51b in the second connection end 43 may also be referred to as pin pins, and the appearance thereof may have various forms.
  • the signal interface 51a and the signal interface 51b may specifically be a signal interface in the form of a pin, or a conductive contact in the form of a connecting finger, or may be in the form of a BGA (Ball Grid Array).
  • BGA Bit Grid Array
  • the signal interface 51a and the signal interface 51b are exemplified by a signal interface in the form of a pin.
  • M are disposed through the first connection end 42 and the second connection end 43.
  • the signal pin 52 has two ends of each signal pin 52 as a signal interface 51a in the first connection end 42 and a signal interface 51b in the second connection end 43, respectively.
  • the electrical signal from the communication device 46 received by the signal interface 51a can be transmitted directly to the signal interface 51b via the signal pin 52, and then transmitted to the backplane connector 32 on the backplane 31 by the signal interface 51b.
  • a package substrate similar to a PCB can also be disposed in the connector body 41.
  • M wires may be disposed in the package substrate, one end of each wire is connected to a signal interface 51a in the first connection end 42, and the other end of the wire may be connected to a signal interface 51b in the second connection end 43. Therefore, the M signal interfaces 51a in the first connection end 42 and the M signal interfaces 51b in the second connection end 43 are connected in one-to-one correspondence, and the embodiment of the present invention does not impose any limitation.
  • first connection end 42 may further include other signal interfaces than the above M signal interfaces 51a.
  • second connection terminal 43 may also include other signal interfaces than the M signal interfaces 51b described above. Then, when the number of signal interfaces in the first connection terminal 42 is different from the number of signal interfaces in the second connection terminal 43, there may be a part of the signal interface being idle. For example, 10*10 signal interfaces 51a are disposed in the first connection end 42, and 8*8 signal interfaces 51b are disposed in the second connection end 43, and 8*8 signals in the first connection end 42 are at this time.
  • the interface 51a is in one-to-one correspondence with the 8*8 signal interfaces 51b in the second connection end 43, and the remaining 36 (10*10-8*8) signal interfaces 51a in the first connection end 42 are idle. .
  • the first connection end 42, the second connection end 43, and the third connection end 44 can be Set the ground pin 61.
  • the grounding pin of the first connecting end 42 can communicate with the grounding pin 61 of the third connecting end 44 through the grounding pin; and the grounding pin 61 of the second connecting end 43 can also be grounded through the grounding pin and the third connecting end 44.
  • the stitches 61 are connected.
  • the ground pin 61 in the first connecting end 42 and the second connecting end 43 are respectively connected with the ground pin 61 of the third connecting end 44, so that the electrical signal forms a complete loop during the transmission.
  • a unified reference plane can be provided for the electrical signal, so that the impedance of the electrical signal is consistent and continuous during transmission, thereby improving the SI (Signal Integrity) of the electrical signal during transmission, and Reduce EMI (Electromagnetic Interference) of electrical signals during transmission.
  • grounding pin 61 of the first connecting end 42 and the grounding pin of the second connecting end 43 can be respectively connected to the grounding pin 61 of the first connecting end 42 and the second connecting end 43 respectively.
  • the grounding pins of the connecting end 44 can also be connected to the same grounding pin in the three connecting ends 44, which is not limited in this embodiment of the present invention.
  • grounding pin 61 of the third connecting end 44 may be fixed to the target single-plate 33a by a crimping connection, or may be fixed to the target single-plate 33a by a welded connection, which is not limited in the embodiment of the present invention.
  • the transmission cable 45 may be a QSFP (Quad Small Form-factor Pluggable), a QSFP+ (Quad Small Form-factor Pluggable Plus), and a CX (eXtended Capability Form-).
  • QSFP Quad Small Form-factor Pluggable
  • QSFP+ Quad Small Form-factor Pluggable Plus
  • CX Extended Capability Form-
  • the first cable connector 45a and the second cable connector 45b may be respectively disposed at two ends of the transmission cable 45.
  • the transmission cable 45 can be connected to the second connection end 43 via the first cable connector 45a and to the communication device 46 via the second cable connector 45b.
  • the first cable connector 45a and the second cable connector 45b may be a gold finger connector, which is not limited in this embodiment of the present invention.
  • the M signal interfaces 51b in the second connection terminal 43 may constitute N (N ⁇ 1) input terminals 62 (each input terminal 62 includes at least one signal interface 51b).
  • each input 62 can be coupled to a communication device 46 on the target board 33a via a transmission cable 45.
  • the N communication devices 46 on the target board 33a can directly transmit the electrical signals to the backplane 31 through the connector 100, which greatly reduces the transmission loss of the electrical signals during transmission.
  • the embodiment of the present invention further provides a communication device, where the communication device includes a backboard and X boards connected to the backboard.
  • a communication device is disposed on the target board (the target board is any one of the X boards), and the communication device is connected to the backplane by any one of the connectors 100 described above.
  • FIG. 5 it is a schematic diagram of a connection structure between the target single board 33a and the back board 31 inside the communication device.
  • the first connection end 41 of the connector 100 is connected to the backplane connector 32 on the backboard 31, and the second connection end 42 of the connector 100 is connected to one end of the transmission cable 45, and the other end of the transmission cable 45 is connected.
  • the third connection end 43 of the connector 100 is used to secure the connector body 41 to the target board 33a.
  • the signal interface 51a in the first connection end 41 connected to the backplane connector 32 may be in a bent shape.
  • the signal interface 51a in the first connection end 41 connected to the backplane connector 32 may be in a straight form.
  • the M signal interfaces 51a in the first connection end 42 are in one-to-one correspondence with the M signal interfaces 51b in the second connection end 43, and M ⁇ 1.
  • the communication device 46 can transmit the electrical signal that needs to be transmitted to the transmission cable 45 through the straight-out high-speed interface, and then the electrical signal is directly transmitted by the transmission cable 45 to the backplane connector 32 through the connector 100 to reach the backplane 31. To reduce the transmission loss and crosstalk of the electrical signal during transmission.
  • the target board 33a is provided with a gusset 63 (the gusset 63 is a daughter card of the target board 33a, which can be used to implement at least one function of the target board 33a),
  • the third connecting end 44 is disposed on the gusset 63, that is, connected to the target single board 33a through the gusset 63. While the first connection end 41 is still connected to the backplane connector 32 on the backplane 31, the second connection end 42 is still connected to the transmission cable 45.
  • the target board 33a can implement different communication functions by providing different gussets 63, and the gusset 63 can be used as a FRU (Field Replace Unit) as compared with the target board 33a. Higher, easier to deploy, and lower maintenance costs.
  • FRU Field Replace Unit
  • the communication device may be a chip, a processor, or a function module having a specific function
  • the processor may be a central processing unit (CPU), a general-purpose processor, or a digital signal processor (Digital Signal Processor, DSP), Application-Specific Integrated Circuit (ASIC), Field Programmable Gate Array (FPGA) or other programmable logic device, transistor logic device, hardware component, or any combination thereof. It is possible to implement or carry out the various illustrative logical blocks, modules and circuits described in connection with the present disclosure.
  • the processor may also be a combination of computing functions, for example, including one or more microprocessor combinations, a combination of DSP (Digital Signal Processing) and a microprocessor, etc., which is not limit.
  • the communication function implemented by the target board 33a or the gusset 63 in the above embodiment may be implemented by the processor executing corresponding software instructions.
  • the software instructions may be composed of corresponding software modules, which may be stored in a random access memory (RAM), a flash memory, a read only memory (ROM), an erasable programmable read only memory. (Erasable Programmable ROM, EPROM), electrically erasable programmable read only memory (EEPROM), registers, hard disk, removable hard disk, compact disk read only (CD-ROM) or any other form of storage medium known in the art.
  • An exemplary storage medium is coupled to the processor to enable the processor to read information from, and write information to, the storage medium.
  • the storage medium may also be an integral part of the processor, which is not limited in this embodiment of the present invention.
  • the functions described herein can be implemented in hardware, software, firmware, or any combination thereof.
  • the functions may be stored in a computer readable medium or transmitted as one or more instructions or code on a computer readable medium.
  • Computer readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one location to another.
  • a storage medium may be any available media that can be accessed by a general purpose or special purpose computer.

Abstract

一种连接器（100）及通信设备，属于通信技术领域，可消除因增设过渡连接器带来的串扰现象，并降低电信号在传输过程中的传输损耗。连接器包括：连接器本体（41），以及设置在连接器本体上的三个连接端，其中，第一连接端（42）内的M个信号接口（51a）与第二连接端（43）内的M个信号接口（51b）一一对应连通，第一连接端与背板（31）上的背板连接器（32）连接，第二连接端与传输线缆（45）的一端（45a）连接，传输线缆的另一端（45b）与目标单板（33a）上的通信器件（46）连接，背板用于实现X个单板（33）之间的通信，目标单板为X个单板中的任一个，M≥１，X≥１；第三连接端（44）用于将连接器本体固定在目标单板上。

Description

一种连接器及通信设备
本申请要求于2016年11月14日提交中国专利局、申请号为201611029644.9、发明名称为“一种连接器及通信设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及信息技术领域，尤其涉及一种连接器及通信设备。
背景技术
背板是框式通信设备中的核心部件，背板与多个单板之间相互连接，可实现不同单板之间的信号互联。如图1所示，对于传统框式通信设备，单板11通过背板连接器12与背板13连接(背板连接器12包括设置在单板11上的第一背板连接器12a和设置在背板13上的第二背板连接器12b)。其中，单板11上设置有芯片14等器件，芯片14需要与其他单板上的器件传输电信号时，可通过单板11上的走线15与背板连接器12连通，进而通过背板连接器12将电信号传输至背板13，最终由背板13将该电信号传输至其他单板上。
如果使用高速线缆(高速线缆的传输损耗低于走线15的传输损耗)直接连接芯片14和背板连接器12，可以降低电信号的传输损耗。基于此，为了将高速线缆固定在单板上实现芯片14与背板13的通信，如图2所示，可在单板11上增加过渡连接器21，并在高速线缆22的两端分别增加线缆连接器23。其中，一端线缆连接器23与芯片14相连，另一端线缆连接器23与过渡连接器21相连，过渡连接器21将接收到的高速电信号导入单板11内的走线15，最终仍通过背板连接器12到达背板13。
也就是说，在图2所示的连接结构中，芯片14向背板13发送的电信号，首先在高速线缆22上传输，进而经过过渡连接器21的引导，在单板11内的走线15上传输至背板13。在高速线缆22上传输电信号时虽然可以降低电信号的传输损耗，但是，由于在单板11内增设了过渡连接器21，电信号在过渡连接器21内相邻的信号线上传输时会造成串扰现象，并且，由于电信号的一部分传输路径还是在走线15上传输的，因此，由走线15带来的传输损耗并不能降低。
发明内容
本发明的实施例提供一种连接器及通信设备，可消除因增设过渡连接器带来的串扰现象，并降低电信号在传输过程中的传输损耗。
为达到上述目的，本发明的实施例采用如下技术方案：
第一方面，本发明的实施例提供一种连接器，包括连接器本体，以及设置在连接器本体上的三个连接端，其中，第一连接端内的M(M≥1)个信号接口与第二连接端内的M个信号接口一一对应连通，第一连接端与背板上的背板连接器连接，第二连接端与传输线缆的一端连接，而传输线缆的另一端与目标单板上的通信器件连接，该背板用于实现X个单板之间的通信，该目标单板为X(X≥1)个单板中的任一个；第三连接端用于将连接器本体固定在目标单板上。这样，目标单板上通信器件发出的电信号可以直接通过传输线缆和 连接器传输至背板，无需经过目标单板内设置的走线，而传输线缆的传输损耗一般低于目标单板内走线的传输损耗，因此，可以降低电信号在传输过程中的传输损耗。
另外，由于传输线缆上的电信号是通过连接器直接传输至背板的，无需通过过渡连接器将电信号从传输线缆引导至目标单板内的走线，因此，还可以避免现有技术中电信号通过过渡连接器引导至单板内的走线时额外增加的串扰。
在一种可能的设计方式中，上述信号接口可以为针脚形式的信号接口，可以为金手指形式的导电触片，或者，可以为焊球阵列封装形式的信号接口。
在一种可能的设计方式中，在连接器本体内，贯穿第一连接端和第二连接端设置有M根信号针，每根信号针的两端分别作为第一连接端内的一个信号接口和第二连接端内的一个信号接口。
在一种可能的设计方式中，上述连接器本体内设置有封装基板，该封装基板内设置有M条导线，每条导线的一端与第一连接端内的一个信号接口相连，该导线的另一端与第二连接端内的一个信号接口相连。
在一种可能的设计方式中，第一连接端、第二连接端以及第三连接端内均设置有接地针脚，其中，第一连接端的接地针脚与第三连接端的接地针脚连通；第二连接端的接地针脚也与第三连接端的接地针脚连通，使得电信号在传输过程中形成一个完整的回路，同时，第一连接端的接地针脚和第二连接端的接地针脚接地后可以为电信号提供一个统一的参考平面，使电信号在传输过程中其阻抗大小保持一致和连续。
在一种可能的设计方式中，第三连接端的接地针脚通过压接式连接固定于目标单板上，或者，第三连接端的接地针脚通过焊接式连接固定于目标单板上。
在一种可能的设计方式中，传输线缆的两端分别设置有第一线缆连接头和第二线缆连接头，其中，传输线缆通过第一线缆连接头与第二连接端连接，传输线缆通过第二线缆连接头与通信器件连接。
在一种可能的设计方式中，第二连接端内的M个信号接口组成N个输入端，每个输入端包括至少一个信号接口，N≥1；其中，目标单板上设置有N个通信器件，每个通信器件通过一条传输线缆与一个输入端连接。这样，每个输入端都可以通过一条传输线缆与目标单板上的一个通信器件相连，那么，目标单板上的N个通信器件均可以通过连接器直接将电信号传输至背板，大大降低了电信号在传输过程中的传输损耗。
在一种可能的设计方式中，连接器本体为支撑和/或固定上述三个连接端的壳体。
在一种可能的设计方式中，目标单板上设置有PCB电路，该PCB电路用于完成预设的通信功能。
第二方面，本发明的实施例提供一种通信设备，包括背板以及与背板相连的X个单板，其中，目标单板上设置有通信器件，通信器件通过上述任一项的连接器与背板连接，目标单板为X个单板中的任一个。
在一种可能的设计方式中，连接器的第一连接端与背板的背板连接器连接；连接器的第二连接端与传输线缆的一端连接，传输线缆的另一端与通信器件连接；连接器的第三连接端与目标单板连接。
在一种可能的设计方式中，连接器的第三连接端通过扣板与目标单板连接，扣板为目标单板的子卡，用于实现目标单板的至少一项通信功能。这样，目标单板可以通过设置不 同的扣板来实现不同的功能。
在一种可能的设计方式中，上述通信器件可以是芯片、处理器以及存储器中的至少一个。
本发明中，上述连接器或通信设备的名字对设备本身不构成限定，在实际实现中，这些设备可以以其他名称出现。只要各个设备的功能和本发明类似，即属于本发明权利要求及其等同技术的范围之内。
本发明的这些方面或其他方面在以下实施例的描述中会更加简明易懂。
附图说明
图1为现有技术中单板与背板的连接结构示意图一；
图2为现有技术中单板与背板的连接结构示意图二；
图3为本发明实施例提供的一种通信设备的内部结构示意图；
图4为本发明实施例提供的一种连接器的结构示意图一；
图5为本发明实施例提供的一种目标单板与背板的连接结构示意图一；
图6为本发明实施例提供的一种连接器的内部结构示意图一；
图7为本发明实施例提供的一种连接器的内部结构示意图二；
图8为本发明实施例提供的一种传输线缆的结构示意图；
图9为本发明实施例提供的一种连接器的结构示意图二；
图10为本发明实施例提供的一种目标单板与背板的连接结构示意图二。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行详细描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。
另外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，除非另有说明，“多个”的含义是两个或两个以上。
本发明的实施例提供一种连接器，可应用于任何需要通过背板连接X(X≥1)个单板进行通信的通信设备。如图3所示，为上述通信设备的一种可能的内部结构示意图。其中，背板31上设置有阵列排布的多个背板连接器32，不同的单板33可以通过本发明实施例提供的连接器100与相应的背板连接器32连接，使不同的单板33安插在背板31上，那么，不同单板33上的通信器件(例如芯片)便可以通过背板31实现通信。
基于图3所示的通信设备的内部结构示意图，以下，以目标单板与背板31的连接方式为例，详细阐述本发明实施例提供的连接器100。
其中，该目标单板为上述X个单板33中的任一个，目标单板上设置有PCB(Printed Circuit Board，印制电路板)电路，该PCB电路可用于完成预设的通信功能，例如报文解析、数据发送以及数据接收等，本发明实施例对此不作任何限制。
具体的，如图4所示，上述连接器100包括：连接器本体41，以及设置在连接器本体41上的三个连接端(即第一连接端42、第二连接端43以及第三连接端44)。该连接器 本体41为支撑和/或固定上述三个连接端的壳体。
如图5所示，第一连接端42与背板31上的背板连接器32连接；第二连接端43与传输线缆45的一端(即图5所示的45a)连接，而传输线缆45的另一端(即图5所示的45b)与目标单板33a上的通信器件46相连；第三连接端44(图5中未示出)用于将连接器本体41固定在目标单板33a上。
其中，如图6所示，第一连接端42内的M个信号接口51a，与第二连接端43内的M个信号接口51b一一对应连通，M≥1。
这样，通信器件46发出的电信号经传输线缆45后，可以从第二连接端42内的信号接口51b直接传输至第一连接端42内的信号接口51a，进而经背板连接器32传输至背板31。也就是说，目标单板33a上通信器件46发出的电信号可以直接通过传输线缆45和连接器100传输至背板31，无需经过目标单板33a内设置的走线。而传输线缆45的传输损耗一般低于目标单板33a内走线的传输损耗，因此，可以降低电信号在传输过程中的传输损耗。另外，由于传输线缆45上的电信号是通过连接器100直接传输至背板31的，无需通过过渡连接器将电信号从传输线缆45引导至目标单板33a内的走线，因此，还可以避免现有技术中电信号通过过渡连接器引导至单板内的走线时额外增加的串扰。
需要说明的是，上述第一连接端42内的信号接口51a，以及第二连接端43内的信号接口51b也可以称为pin脚，其外观可以有多种形态。例如，信号接口51a和信号接口51b具体可以为针脚形式的信号接口，也可以为金手指(connecting finger)形式的导电触片，或者，还可以为BGA(Ball Grid Array，焊球阵列封装)形式的信号接口，本发明实施例对此不作任何限制。
示例性的，以信号接口51a和信号接口51b为针脚形式的信号接口举例，仍如图6所示，在连接器本体41内，贯穿第一连接端42和第二连接端43设置有M根信号针52，每根信号针52的两端分别作为第一连接端42内的一个信号接口51a和第二连接端43内的一个信号接口51b。这样，信号接口51a接收到的来自通信器件46的电信号后，可以直接通过信号针52传输至信号接口51b，再由信号接口51b传输至背板31上的背板连接器32。
当然，也可以在连接器本体41内设置类似于PCB的封装基板。此时，可以在封装基板内设置M条导线，每条导线的一端与第一连接端42内的一个信号接口51a相连，导线的另一端可以与第二连接端43内的一个信号接口51b相连，从而实现第一连接端42内的M个信号接口51a与第二连接端43内的M个信号接口51b一一对应连通，本发明实施例对此不做任何限制。
另外，需要说明的是，第一连接端42内还可以包括除上述M个信号接口51a之外的其他信号接口。类似的，第二连接端43内也可以包括除上述M个信号接口51b之外的其他信号接口。那么，当第一连接端42内信号接口的数量与第二连接端43内信号接口的数量不一致时，可能有一部分信号接口为闲置的。例如，第一连接端42内设置有10*10个信号接口51a，而第二连接端43内设置有8*8个信号接口51b，此时，第一连接端42内的8*8个信号接口51a与第二连接端43内的8*8个信号接口51b是一一对应连通的，而第一连接端42内剩余的36(10*10-8*8)个信号接口51a为闲置的。
进一步地，如图7所示，第一连接端42、第二连接端43以及第三连接端44内均可 设置接地针脚61。其中，第一连接端42的接地针脚可通过接地针与第三连接端44的接地针脚61连通；并且，第二连接端43的接地针脚61也可通过接地针与第三连接端44的接地针脚61连通。
其中，分别将第一连接端42和第二连接端43内的接地针脚61与第三连接端44的接地针脚61连通，可以使电信号在传输过程中形成一个完整的回路。同时，接地后可以为电信号提供一个统一的参考平面，使电信号在传输过程中其阻抗大小保持一致和连续，从而提高电信号在传输过程中的SI(Signal Integrity，信号完整性)，并降低电信号在传输过程中的EMI(Electromagnetic Interference，电磁辐射)。
需要说明的是，分别以第一连接端42和第二连接端43内的一个接地针脚61为例，第一连接端42的接地针脚与第二连接端43内的接地针脚可以分别连接到三连接端44内不同的接地针脚上，也可以连接到三连接端44内的同一个接地针脚上，本发明实施例对此不作限制。
进一步地，第三连接端44的接地针脚61可以通过压接式连接固定于目标单板33a上，也可以通过焊接式连接固定于目标单板33a上，本发明实施例对此不作限制。
另外，上述传输线缆45具体可以为QSFP(Quad Small Form-factor Pluggable，四小型可插拔)、QSFP+(Quad Small Form-factor Pluggable Plus，四小型可插拔加)、CXP(eXtended Capability Form-factor Pluggable，扩展容量可拔插)、SAS(Serial Attached SCSI，串行连接SCSI)等各种类型的高速线缆，本发明实施例对此不作限制。
具体的，如图8所示，传输线缆45的两端可以分别设置第一线缆连接头45a和第二线缆连接头45b。这样，仍如图5所示，传输线缆45可以通过第一线缆连接头45a与第二连接端43连接，并且，通过第二线缆连接头45b与通信器件46连接。
示例性的，第一线缆连接头45a和第二线缆连接头45b具体可以为金手指连接器，本发明实施例对此不作限制。
进一步地，如图9所示，第二连接端43内的M个信号接口51b可以组成N(N≥1)个输入端62(每个输入端62包括至少一个信号接口51b)。这样，每个输入端62都可以通过一条传输线缆45与目标单板33a上的一个通信器件46相连。那么，目标单板33a上的N个通信器件46均可以通过连接器100直接将电信号传输至背板31，大大降低了电信号在传输过程中的传输损耗。
基于上述实施例中所示的任一种连接器100，本发明实施例还提供一种通信设备，该通信设备包括背板以及与背板相连的X个单板。其中，目标单板(目标单板为上述X个单板中的任一个)上设置有通信器件，该通信器件通过上述任一种连接器100与背板连接。
仍以图5为例，为通信设备内部的目标单板33a与背板31之间的连接结构示意图。其中，连接器100的第一连接端41与背板31上的背板连接器32连接，连接器100的第二连接端42与传输线缆45的一端连接，而传输线缆45的另一端与目标单板33a上的通信器件46相连，连接器100的第三连接端43用于将连接器本体41固定在目标单板33a上。
其中，当上述背板连接器32内的针脚为直公形态时，与背板连接器32相连的第一连接端41内的信号接口51a可以为弯母形态。当上述背板连接器32内的针脚为弯母形态时，与背板连接器32相连的第一连接端41内的信号接口51a可以为直公形态。
并且，第一连接端42内的M个信号接口51a，与第二连接端43内的M个信号接口51b是一一对应连通的，M≥1。
这样，通信器件46可以通过直出高速接口将需要传输的电信号传输至传输线缆45，再由传输线缆45将该电信号通过连接器100直接传输至背板连接器32到达背板31，以降低电信号在传输过程中的传输损耗和串扰。
进一步地，如图10所示，当目标单板33a上设置有扣板63(扣板63为目标单板33a的子卡，可用于实现目标单板33a的至少一项功能)时，可以将上述第三连接端44设置在扣板63上，即通过扣板63与目标单板33a连接。而第一连接端41仍然与背板31上的背板连接器32连接，第二连接端42仍然与传输线缆45相连。
这样，目标单板33a可以通过设置不同的扣板63来实现不同的通信功能，并且，与目标单板33a可相比，扣板63作为FRU(Field Replace Unit现场可更换单元)，其灵活性更高，更容易部署，维护成本更低。
另外，上述通信器件可以是芯片、处理器或具有特定功能的功能模块，其中，上述处理器可以是中央处理器(Central Processing Unit，CPU)，通用处理器，数字信号处理器(Digital Signal Processor，DSP)，专用集成电路(Application-Specific Integrated Circuit，ASIC)，现场可编程门阵列(Field Programmable Gate Array，FPGA)或者其他可编程逻辑器件、晶体管逻辑器件、硬件部件或者其任意组合。其可以实现或执行结合本发明公开内容所描述的各种示例性的逻辑方框，模块和电路。所述处理器也可以是实现计算功能的组合，例如包含一个或多个微处理器组合，DSP(Digital Signal Processing，数字信号处理)和微处理器的组合等等，本发明实施例对此不作限制。
需要说明的是，上述实施例中目标单板33a或扣板63所实现的通信功能，可以由处理器执行相应的软件指令的方式来实现。该软件指令可以由相应的软件模块组成，软件模块可以被存放于随机存取存储器(Random Access Memory，RAM)、闪存、只读存储器(Read Only Memory，ROM)、可擦除可编程只读存储器(Erasable Programmable ROM，EPROM)、电可擦可编程只读存储器(Electrically EPROM，EEPROM)、寄存器、硬盘、移动硬盘、只读光盘(CD-ROM)或者本领域熟知的任何其它形式的存储介质中。一种示例性的存储介质耦合至处理器，从而使处理器能够从该存储介质读取信息，且可向该存储介质写入信息。当然，存储介质也可以是处理器的组成部分，本发明实施例对此不作限制。
本领域技术人员应该可以意识到，在上述一个或多个示例中，本发明所描述的功能可以用硬件、软件、固件或它们的任意组合来实现。当使用软件实现时，可以将这些功能存储在计算机可读介质中或者作为计算机可读介质上的一个或多个指令或代码进行传输。计算机可读介质包括计算机存储介质和通信介质，其中通信介质包括便于从一个地方向另一个地方传送计算机程序的任何介质。存储介质可以是通用或专用计算机能够存取的任何可用介质。
以上所述的具体实施方式，对本发明的目的、技术方案和有益效果进行了进一步详细说明，所应理解的是，以上所述仅为本发明的具体实施方式而已，并不用于限定本发明的保护范围，凡在本发明的技术方案的基础之上，所做的任何修改、等同替换、改进等，均应包括在本发明的保护范围之内。

Claims (11)

  1. 一种连接器，其特征在于，包括连接器本体，以及设置在所述连接器本体上的三个连接端，其中，
    第一连接端内的M个信号接口与第二连接端内的M个信号接口一一对应连通，所述第一连接端与背板上的背板连接器连接，所述第二连接端与传输线缆的一端连接，所述传输线缆的另一端与目标单板上的通信器件连接，所述背板用于实现X个单板之间的通信，所述目标单板为所述X个单板中的任一个，M≥1，X≥1；
    第三连接端用于将所述连接器本体固定在所述目标单板上。
  2. 根据权利要求1所述的连接器，其特征在于，在所述连接器本体内，贯穿所述第一连接端和所述第二连接端设置有M根信号针，每根信号针的两端分别作为所述第一连接端内的一个信号接口和所述第二连接端内的一个信号接口。
  3. 根据权利要求1或2所述的连接器，其特征在于，所述第一连接端、所述第二连接端以及所述第三连接端内均设置有接地针脚，其中，
    所述第一连接端的接地针脚与所述第三连接端的接地针脚连通；
    所述第二连接端的接地针脚与所述第三连接端的接地针脚连通。
  4. 根据权利要求3所述的连接器，其特征在于，所述第三连接端的接地针脚通过压接式连接固定于所述目标单板上，或者，所述第三连接端的接地针脚通过焊接式连接固定于所述目标单板上。
  5. 根据权利要求1-4中任一项所述的连接器，其特征在于，所述传输线缆的两端分别设置有第一线缆连接头和第二线缆连接头，其中，
    所述传输线缆通过所述第一线缆连接头与所述第二连接端连接，所述传输线缆通过所述第二线缆连接头与所述通信器件连接。
  6. 根据权利要求1-5中任一项所述的连接器，其特征在于，所述第二连接端内的M个信号接口组成N个输入端，每个输入端包括至少一个信号接口，N≥1；
    其中，所述目标单板上设置有N个通信器件，每个通信器件通过一条传输线缆与一个输入端连接。
  7. 根据权利要求1-6中任一项所述的连接器，其特征在于，所述连接器本体为支撑和/或固定所述三个连接端的壳体。
  8. 根据权利要求1-7中任一项所述的连接器，其特征在于，所述目标单板上设置有印刷电路板PCB电路，所述PCB电路用于完成预设的通信功能。
  9. 一种通信设备，其特征在于，包括背板以及与所述背板相连的X个单板，其中，目标单板上设置有通信器件，所述通信器件通过如权利要求1-8中任一项所述的连接器与所述背板连接，所述目标单板为所述X个单板中的任一个。
  10. 根据权利要求9所述的通信设备，其特征在于，
    所述连接器的第一连接端与所述背板的背板连接器连接；
    所述连接器的第二连接端与传输线缆的一端连接，所述传输线缆的另一端与所述通信器件连接；
    所述连接器的第三连接端与所述目标单板连接。
  11. 根据权利要求9或10所述的通信设备，其特征在于，所述连接器的第三连接端通过扣板与所述目标单板连接，所述扣板为所述目标单板的子卡，用于实现所述目标单板的至少一项功能。
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