WO2018086196A1 - Film électroluminescent et son procédé de préparation - Google Patents

Film électroluminescent et son procédé de préparation Download PDF

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Publication number
WO2018086196A1
WO2018086196A1 PCT/CN2016/111148 CN2016111148W WO2018086196A1 WO 2018086196 A1 WO2018086196 A1 WO 2018086196A1 CN 2016111148 W CN2016111148 W CN 2016111148W WO 2018086196 A1 WO2018086196 A1 WO 2018086196A1
Authority
WO
WIPO (PCT)
Prior art keywords
electroluminescent film
silicone oil
vinyl
catalyst
methyl vinyl
Prior art date
Application number
PCT/CN2016/111148
Other languages
English (en)
Chinese (zh)
Inventor
刘祥龙
王杰斌
Original Assignee
东莞市翔龙能源科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 东莞市翔龙能源科技有限公司 filed Critical 东莞市翔龙能源科技有限公司
Publication of WO2018086196A1 publication Critical patent/WO2018086196A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2483/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Definitions

  • the invention relates to the field of illuminating illumination, in particular to an electroluminescent film and a preparation method thereof.
  • LED lighting technology is the third generation of electric light source. Compared with the first generation of thermal radiation electric light source and the second generation of gas discharge electric light source, LED light source has high efficiency, life is 100 times that of incandescent lamp, and energy saving is sodium lamp. 70% of the results have been widely applied and leaps and bounds. However, LED light sources also have many disadvantages such as large heat generation, glare, complicated packaging process, high cost, and many faults.
  • packaging is the key link. Specifically, the luminescence mechanism of semiconductor materials determines a single LED. The chip cannot emit white light of continuous spectrum. Therefore, it is necessary to mix two or more complementary colors of light to form white light.
  • white LED blue LED+YAG yellow phosphor, RGB Three-color LED, UV LED+ multi-color phosphor, and the realization of white LED is in the packaging.
  • LED The preparation of white light chips requires very complicated process steps, such as cleaning the support, crystal expansion, solid crystal, short baking, wire bonding (gold wire), pre-testing, filling (including phosphor), long baking, post-testing, Divided color separation, packaging, etc. Filling and baking are key steps in the packaging process.
  • the packaging process has many drawbacks, such as dispensing with a dispenser, the package adhesive is not easy to mix evenly; the phosphor powder is heavy, easy to settle, causing large changes in color temperature and index, and must be sorted; the package adhesive is not easy to defoam, resulting in packaging There are many defective products in the chip; many production processes, long working hours, low efficiency, high cost, low yield and poor stability.
  • LED white light sources now have obvious shortcomings in production, use, and manufacturing costs. Especially when LED white light source is applied as a surface light source, existing LED white light sources often cannot solve the uniform light emission. The problem of degree can not meet the needs of practical use and industrial production.
  • An object of the present invention is to provide an electroluminescent film and a method of fabricating the same that overcomes the deficiencies of existing LEDs, particularly white LEDs.
  • the technical solution adopted by the present invention is: an electroluminescent film, the mass ratio of each component is:
  • the catalyst is a Custer Platinum catalyst.
  • the component of the inhibitor is 1-ethynyl-1-cyclohexanol, 2-phenyl-3-butyn-2-ol, One or more of 3,5-dimethyl-1-hexyne-3-ol.
  • composition of the tackifier is vinyl triethoxysilane, vinyl tris(ethoxymethoxy)silane, ⁇ -(3,4- Epoxycyclohexyl)ethyltrimethoxysilane, ⁇ -methacryloxypropyltrimethoxysilane, ⁇ -methacryloxypropylmethyldimethoxysilane, ⁇ - Methacryloyloxypropylmethyldiethoxysilane, ⁇ -(2,3-epoxypropoxy)propylmethyldimethoxysilane, ⁇ -(2,3-epoxypropoxy) Propyltrimethoxysilane, ⁇ -(2,3- One or more of propylene oxide propyl triethoxysilane.
  • the invention also discloses a preparation method of an electroluminescent film based on the above formula component, and the specific steps are as follows:
  • Step 1 Weigh the ingredients and mix well.
  • Step 2 The mixture obtained by mixing the steps 1 is placed in a kneader and kneaded uniformly.
  • step 3 the object obtained in the step 2 is extruded into a film having a thickness of 0.05 to 2 mm.
  • the principle of wave-particle duality is adopted, and the LED is utilized.
  • the wave emitted by the wafer activates the luminescent film to illuminate and utilizes certain bands of LEDs.
  • the advantages of high luminous efficiency of the crystal are adjusted to improve the luminous efficiency of the luminescent film, and at the same time, a pure light source with high brightness and no glare can be obtained, and the brightness of the light source can exceed 200 lm/W or more, and the LED is not required.
  • the luminescent film can be activated by directly attaching a complete luminescent film to the surface of the substrate.
  • the present invention can adjust the color temperature of the light source by directly adjusting the formulation of the luminescent film in real time.
  • the color temperature of the light source is no longer with the LED
  • the package of the chip is related, and the radiation heat dissipation by the invention is adopted, and the heat dissipation area of the nano-radiation heat-dissipating material and the surface light-emitting film is large, so that the P-N junction temperature of the surface light source and the external temperature of the light source are greatly reduced.
  • the formula of the invention is simple and convenient to manufacture, and the prepared electroluminescent film is obviously superior to the existing LED light-emitting structure from photoelectricity, industrial production convenience and unit production cost, and has wide application space.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un film électroluminescent, comprenant les constituants suivants en masse : 48,05 à 49,21 % de poudre fluorescente, 19,69 % de caoutchouc de méthylvinyle-silicone, 8,68 à 9,84 % de résine de silicone à viscosité élevée de méthylvinyle MQ, 8,68 à 9,84 % de silice fumée, 8,68 à 9,84 % d'huile de silicone vinylique, 0,019 à 0,59 % d'huile de silicone à groupe hydroxyle, 0,01 à 0,98 % de matériau de dissipation thermique à nano-rayonnement, 0,19 % d'huile de silicone contenant de l'hydrogène, 0,00009 à 0,0019 % d'inhibiteur, 0,0006 à 0,0019 % de catalyseur, et 0,19 à 0,98 % d'agent poisseux. La présente invention a une formule simple et est pratique à préparer ; en outre, le film électroluminescent préparé est évidemment meilleur qu'une structure électroluminescente à DEL existante en termes de photoélectricité, de commodité de production industrielle, et de coût de production unitaire, et peut être largement appliqué.
PCT/CN2016/111148 2016-11-10 2016-12-20 Film électroluminescent et son procédé de préparation WO2018086196A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610989244.6A CN106589961A (zh) 2016-11-10 2016-11-10 一种电致发光膜及其制备方法
CN201610989244.6 2016-11-10

Publications (1)

Publication Number Publication Date
WO2018086196A1 true WO2018086196A1 (fr) 2018-05-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/111148 WO2018086196A1 (fr) 2016-11-10 2016-12-20 Film électroluminescent et son procédé de préparation

Country Status (2)

Country Link
CN (1) CN106589961A (fr)
WO (1) WO2018086196A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113418837A (zh) * 2021-06-10 2021-09-21 厦门多彩光电子科技有限公司 一种紫外led封装胶质量的评估方法
CN115813591A (zh) * 2022-10-25 2023-03-21 哈尔滨工程大学 一种牙齿咬合应力分布检测方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113185844B (zh) * 2021-05-18 2023-05-12 王文雨 一种超薄硅橡胶薄膜及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202268388U (zh) * 2011-10-13 2012-06-06 杭州友旺科技有限公司 辐射式散热陶瓷基板大功率led封装结构
CN104789186A (zh) * 2015-04-28 2015-07-22 杭州福斯特光伏材料股份有限公司 一种单组份不出油型led灯丝触变胶及其制备方法
CN104893600A (zh) * 2015-05-14 2015-09-09 天津德高化成新材料股份有限公司 发光二极管快速封装粘性荧光胶膜及制备方法及应用
CN105567105A (zh) * 2015-12-30 2016-05-11 天津德高化成光电科技有限责任公司 高折射率芯片级封装led白光芯片荧光胶膜及制备方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105018022B (zh) * 2014-04-28 2017-08-11 天津德高化成新材料股份有限公司 一种快速固化发光二极管灯丝封装胶及制备方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202268388U (zh) * 2011-10-13 2012-06-06 杭州友旺科技有限公司 辐射式散热陶瓷基板大功率led封装结构
CN104789186A (zh) * 2015-04-28 2015-07-22 杭州福斯特光伏材料股份有限公司 一种单组份不出油型led灯丝触变胶及其制备方法
CN104893600A (zh) * 2015-05-14 2015-09-09 天津德高化成新材料股份有限公司 发光二极管快速封装粘性荧光胶膜及制备方法及应用
CN105567105A (zh) * 2015-12-30 2016-05-11 天津德高化成光电科技有限责任公司 高折射率芯片级封装led白光芯片荧光胶膜及制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113418837A (zh) * 2021-06-10 2021-09-21 厦门多彩光电子科技有限公司 一种紫外led封装胶质量的评估方法
CN115813591A (zh) * 2022-10-25 2023-03-21 哈尔滨工程大学 一种牙齿咬合应力分布检测方法

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Publication number Publication date
CN106589961A (zh) 2017-04-26

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