WO2018084341A1 - Boîtier de capteur - Google Patents

Boîtier de capteur Download PDF

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Publication number
WO2018084341A1
WO2018084341A1 PCT/KR2016/012692 KR2016012692W WO2018084341A1 WO 2018084341 A1 WO2018084341 A1 WO 2018084341A1 KR 2016012692 W KR2016012692 W KR 2016012692W WO 2018084341 A1 WO2018084341 A1 WO 2018084341A1
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WO
WIPO (PCT)
Prior art keywords
light
unit
light source
sensor
solution
Prior art date
Application number
PCT/KR2016/012692
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English (en)
Korean (ko)
Inventor
김종욱
김재흥
김현민
전호식
최우영
이준석
윤주안
Original Assignee
크루셜텍(주)
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Application filed by 크루셜텍(주) filed Critical 크루셜텍(주)
Priority to PCT/KR2016/012692 priority Critical patent/WO2018084341A1/fr
Publication of WO2018084341A1 publication Critical patent/WO2018084341A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions

Definitions

  • the present invention relates to a sensor package, and more particularly, to a sensor package provided with a color coating layer capable of transmitting light and having an optical waveguide part for evenly inducing light provided from a light source unit to a fingerprint.
  • the portable electronic device is equipped with various security sensors.
  • security sensors include a biometric sensor, and the biometric sensor authenticates a user from biometric information such as fingerprints, blood vessels on the back of the hand, voice, and iris.
  • the fingerprint sensor is a sensor for authenticating a user by detecting a fingerprint of a finger.
  • a fingerprint sensor is widely used as a security sensor of a portable electronic device.
  • the fingerprint sensor integrates a navigation function for performing a pointer operation, such as a cursor, and is being widely used.
  • This type of fingerprint sensor is referred to as a biometric track pad (BTP). .
  • fingerprint sensors include capacitive, optical, ultrasonic, thermal, and non-contact methods, among which capacitive fingerprint sensors and optical fingerprint sensors are used.
  • the optical fingerprint sensor includes a light source unit and a light receiving unit, the light source unit irradiates light with the user's fingerprint, and the light receiving unit receives the light reflected from the user's fingerprint to detect the user's fingerprint.
  • the optical fingerprint sensor is provided with a protective layer on the light source to protect the light source and the light receiver.
  • This protective layer is usually made of a transparent material, so that light irradiated from the light source unit can be transmitted to the user's fingerprint.
  • the protective layer may be made of black capable of transmitting infrared rays.
  • the optical fingerprint sensor may not apply various colors to the protective layer. This is because, when color is applied to the protective layer using a colored paint, the light irradiated from the light source unit does not pass through the protective layer by the colored paint.
  • the electronic device provided with the optical fingerprint sensor is not manufactured in various colors.
  • the case printing layer forming the external form of the electronic device is red or blue
  • the optical fingerprint sensor made of transparent or black cannot match the color with the case printing layer. That is, when the optical fingerprint sensor is mounted on the electronic device, the optical fingerprint sensor and the case printing layer have a problem in that color heterogeneity is generated.
  • the optical fingerprint sensor has a small amount of light itself irradiated from the light source to the user's fingerprint, there is a problem that less reflected light transmitted to the light receiving unit. And the optical fingerprint sensor has a problem that the light irradiated from the light source unit is not evenly irradiated to the user's fingerprint as a whole. Due to these problems, the conventional optical fingerprint sensor has a low fingerprint recognition rate and thus may not accurately detect a user's fingerprint.
  • the technical problem of the present invention for solving the above problems is to provide a sensor package having an optical waveguide part which is provided with a color coating layer capable of transmitting light, and evenly guides the light provided from the light source unit to the fingerprint.
  • an embodiment of the present invention provides a light source unit for providing light to the object; A sensor unit provided on the substrate and receiving a light reflected from the object to detect a fingerprint; An optical system provided on an upper portion of the sensor unit and transmitting the light reflected from the object to the sensor unit; A cover part provided at an upper portion of the optical system; And a first color coating layer provided between the cover unit and the optical system, the light being transmitted to the light source unit to be irradiated to the object, and having a color, wherein the first color coating layer is not mixed with each other. It provides a sensor package that is formed from the above solution.
  • the first color coating layer is formed from a first solution and a second solution that is not mixed with each other, the first solution is made of an organic solution, the second solution may be made of a fluorine-based solution have.
  • the second solution is composed of a second solvent and a second solute dissolved in the second solvent
  • the second solvent is a hydrofluoroether, trifluorotoluene (Trifluorotoluene), octafluorotoluene and Perfluorobenzene
  • the second solute is a perfluoro polymer, polyvinyl fluoride, polyvinylidene fluoride, polytetra It can be selected from fluoroethylene and perfluoroalkoxy polymers.
  • the second solution may consist only of the second solvent.
  • the holder portion for supporting the side of the sensor; An optical waveguide part disposed between the first color coating layer and the optical system and configured to guide light provided from the light source part to the object; A touch sensing unit controlling an operation of the light source unit according to whether the object touches the cover unit; And a second color coating layer coupled to the lower portion of the optical waveguide part.
  • the holder portion may be made to electrically connect the substrate and the light source.
  • the holder portion may be made of any one of a MID (Molded Interconnect Divice), a PCB (Printed Circuit Board) and a metal.
  • MID Molded Interconnect Divice
  • PCB Print Circuit Board
  • the optical waveguide portion the core portion; An upper coating part provided on an upper surface of the core part; And a lower coating part provided on a lower surface of the core part, wherein the core part may have a larger refractive index than the upper coating part and the lower coating part.
  • the refractive index of the core portion may be 1.5 or more.
  • the light incident hole may be formed in the upper coating portion.
  • the light incident hole may be made so that the opening ratio increases from the edge of the upper coating portion toward the center.
  • the senor unit the base substrate; And a light receiving unit provided on the base substrate and receiving light reflected from the object.
  • the optical system, the glass substrate provided on the sensor unit; And a reflective layer provided on an upper portion of the glass substrate, and the sensor unit may be configured to receive reflected light incident through a pinhole formed in the reflective layer.
  • the light source unit is coupled to the substrate, disposed in the receiving space between the holder portion and the touch sensing unit, the refraction unit or reflector provided on the light source unit provided from the light source unit
  • the guided light is guided to the side surface of the optical waveguide part.
  • the sensor package is provided with a color coating layer made to allow light transmission.
  • This color coating layer is made to allow light transmission while providing various colors to the sensor package.
  • the sensor package may achieve the same color as the case printing layer through the color coating layer. Therefore, when the sensor package is mounted on the electronic device, the sensor package and the case printed layer do not generate heterogeneity due to color.
  • the sensor package is provided with an optical waveguide unit for guiding light provided from the light source unit to the user's fingerprint.
  • the optical waveguide part is made to allow total reflection. Therefore, the light incident to the optical waveguide part induces the light to be uniformly irradiated onto the fingerprint of the user contacting the cover part through total reflection.
  • the sensor package may increase the fingerprint recognition rate of the user.
  • the sensor package is provided with a touch sensing unit.
  • the touch sensing unit controls the light source unit to operate only when the user's finger contacts the cover unit. Therefore, the power consumption of the light source unit can be minimized.
  • the light incidence hole is formed such that the aperture ratio increases from the edge of the upper covering portion toward the center portion. As a result, uniform light may be irradiated to the fingerprint of the user in contact with the cover.
  • FIG. 1 is an exemplary view of a sensor package according to a first embodiment of the present invention.
  • FIG 2 is an exemplary view showing a sensor unit and an optical system according to a first embodiment of the present invention.
  • FIG 3 is an exemplary view showing a first color coating layer according to the first embodiment of the present invention.
  • FIG. 4 is a perspective view of a sensor package according to a second embodiment of the present invention.
  • FIG. 5 is an exploded perspective view of a sensor package according to a second embodiment of the present invention.
  • FIG. 6 is an exemplary cross-sectional view taken along line II of FIG. 4.
  • FIG. 7 is an operational state diagram of a sensor package according to a second embodiment of the present invention.
  • FIG 8 is an exemplary view showing an optical waveguide part according to a second embodiment of the present invention.
  • FIG. 9 is a schematic cross-sectional view of a sensor package according to a third embodiment of the present invention.
  • FIG. 10 is a schematic cross-sectional view of a sensor package according to a fourth embodiment of the present invention.
  • FIG 11 is an exemplary view of an optical waveguide unit according to a fifth embodiment of the present invention.
  • FIG. 1 is an exemplary view of a sensor package according to a first embodiment of the present invention
  • Figure 2 is an exemplary view showing a sensor unit and an optical system according to a first embodiment of the present invention
  • Figure 3 is a first embodiment of the present invention
  • the sensor package 1000 includes a light source unit 100, a sensor unit 200, an optical system 300, a first color coating layer 400, and a cover unit 500.
  • the light source unit 100 provides light for fingerprint recognition of the user.
  • the light source unit 100 is provided on the substrate 1 to provide light to the cover unit 500.
  • the light source unit 100 may be formed of an LED.
  • the light provided from the light source unit 100 may be various lights such as infrared (IR), near infrared (NIR), red, green, blue, and the like.
  • the light source unit 100 may be provided in plural along the circumference of the sensor unit 200. That is, when the sensor package 1000 is viewed from the upper plane, the light source unit 100 may be provided in plural on the upper side, the lower side, the left side, and the right side of the sensor unit 200.
  • the sensor unit 200 receives the light reflected from the object F to grasp the user's finger fingerprint information. That is, the sensor unit 200 acquires an image of light reflected from the object F and detects a fingerprint.
  • the sensor unit 200 may be a biometric sensor having a function of measuring biometric information, but is not limited thereto and may be a sensor having a different function.
  • the sensor unit 200 will be described below as a fingerprint sensor for convenience.
  • the sensor unit 200 may be provided on the substrate 1, and fingerprint information provided from the sensor unit 200 may be provided to the main board (not shown) through the substrate 1.
  • the optical system 300 is provided above the sensor unit 200.
  • the optical system 300 is configured to transmit the light reflected from the object F to the sensor unit 200.
  • the sensor unit 200 includes a base substrate 210 and a light receiving unit 220.
  • the base substrate 210 is provided on the substrate 1.
  • the base substrate 210 is electrically connected to the substrate 1.
  • the light receiver 220 is provided on the base substrate 210 and is configured to receive light reflected from the object F.
  • the light receiving unit 220 receives the light reflected from the object (F) to detect the fingerprint of the object (F). That is, the light receiver 220 detects a fingerprint by obtaining an image of light reflected from the fingerprint of the object F.
  • the light receiving unit 220 may be formed of a photodiode.
  • the optical system 300 is provided above the sensor unit 200.
  • the optical system 300 is configured to focus the subject and the sensor unit 200, and the optical system 300 may be formed in various forms such as a barrier rib structure, a micro lens, a fiber optic plate (FOP), and a pinhole structure. have.
  • FOP fiber optic plate
  • a pinhole structure In the present invention, an optical system having a pinhole structure will be described as an example.
  • the optical system 300 includes a glass substrate 310 and a reflective layer 320.
  • the glass substrate 310 is provided on the light receiving unit 220.
  • An adhesive member 221 may be provided between the light receiving unit 220 and the glass substrate 310, and the light receiving unit 220 and the glass substrate 310 may be bonded to each other.
  • the adhesive member 221 may be an optical adhesive film (OCA), an optical adhesive resin (OCR), or the like.
  • the reflective layer 320 is provided on the glass substrate 310.
  • a pinhole 301 is formed in the reflective layer 320, and the reflected light reflected from the object F may be incident to the light receiving unit 220 through the pinhole 301.
  • the pinholes 301 formed in the reflective layer 320 may be formed in plural along the longitudinal direction or the width direction of the reflective layer 320, and the spacing between the pinholes 301 may vary.
  • the pinhole 301 may be formed in various sizes in consideration of the thickness of the sensor unit 200 and the amount of reflected light.
  • the light receiving unit 220 recognizes the user's fingerprint from the reflected light incident through the pinhole 301 formed in the reflective layer 320.
  • the reflective layer 320 transmits only light incident to the pinhole 301 to the light receiving unit 220, and reflects other light.
  • the cover unit 500 is provided on the upper portion of the optical system 300.
  • the cover part 500 uniformly guides the light provided from the light source part 100 to the object F.
  • the cover unit 500 protects the light source unit 100, the optical system 300, and the sensor unit 200 from the outside.
  • the first color coating layer 400 is provided between the cover part 500 and the optical system 300.
  • the first color coating layer 400 may be formed from two or more solutions that are not mixed with each other.
  • the first color coating layer 400 has a size corresponding to that of the cover part 500 and is coupled to the lower part of the cover part 500. That is, the sensor package 1000 may have various colors by the first color coating layer 400.
  • the first color coating layer 400 may be manufactured in the form of nanostructures from the first solution and the second solution. Here, the first solution and the second solution do not mix with each other.
  • the first solution may be an organic solution
  • the second solution may be a fluorine solution.
  • the first solution dissolves the first solute in a first solvent to prepare a first solution
  • the second solution dissolves the second solute in a second solvent to prepare a second solution.
  • magnetic stirring may be used.
  • the first solvent may be an organic solvent
  • the second solvent may be a fluorine solvent. That is, the first solvent and the second solvent are made of a solvent that does not mix with each other.
  • the first solution and the second solution is not limited to the organic solution, fluorine-based solution that is not mixed with each other, it can be made of various solutions, of course.
  • the first solution consists of an organic solution and the second solution consists of a fluorine solution will be described as an example.
  • This first solution may be made of colored paint having a color.
  • the first solute of the colored paint may be a pigment, and the first solvent may be, for example, oil.
  • the first color coating layer 400 may have various colors.
  • the second solution may be made of a fluorine-based solution.
  • the second solvent is a fluorine-based solvent, and may be selected from hydrofluoroether, trifluorotoluene, octafluorotoluene, and perfluorobenzene.
  • This second solvent is not limited to the solvents set forth above, but may be made of other solvents.
  • the second solute may be selected from the group consisting of perfluoropolymers, polyvinyl fluorides, polyvinylidene fluorides, polytetrafluoroethylene and perfluoroalkoxy polymers, which are low molecular organic semiconductors. It is not limited to this.
  • the first solute only needs to be dissolved in the first solvent corresponding to the type of the first solvent
  • the second solute only needs to be dissolved in the second solvent corresponding to the type of the second solvent.
  • the kind of the first solute and the second solute is not particularly limited.
  • the first color coating layer 400 may be manufactured in the form of nanostructures from the first solution and the second solution.
  • the first solution and the second solution are based on different kinds of solvents, and if no special measures are taken, the first solution and the second solution are vertically separated by specific gravity.
  • the first color coating layer 400 is mixed with the first solution and the second solution so that horizontal phase separation is performed through a solution stirrer.
  • the first color coating layer 400 of the nanostructure is formed from the hybrid solution in which the first solution and the second solution are mixed under the cover part 500.
  • the first color coating layer 400 may be spin coating, dip coating, inkjet printing, offset printing, reverse offset printing, gravure printing or roll printing, but is not limited thereto.
  • the first color coating layer 400 may have a thin film form, for example, and the thickness of the thin film may be variously formed to a desired thickness.
  • the first color coating layer 400 uniformly coats the hybrid solution on the lower portion of the cover part 500, and then volatilizes the first solvent and the second solvent through a drying and heat treatment process to form the first color coating layer ( 400).
  • the first color coating layer 400 forms a mixture of a first solute and a second solute in a state in which a first solvent and a second solvent are volatilized.
  • the first solute may be a pigment and the second solute may be a fluorine-based solute.
  • the first color coating layer 400 having a form in which the first solute and the second solute are mixed with each other is formed to have a color and to transmit light. That is, when light is irradiated from the light source unit 100 to the object F, the light irradiated from the light source unit 100 is irradiated to the object through a transparent portion where the second solute of the first color coating layer 400 is disposed. Can be.
  • the first color coating layer 400 may have various colors by the first solute. Therefore, the first color coating layer 400 may be manufactured in the same color as the case printing layer forming the external appearance of the electronic device. As such, the sensor package 1000 mounted on the electronic device does not generate heterogeneity due to color as the color of the case printed layer is the same.
  • the first color coating layer 400 forms a form in which the first solute and the second solute are horizontally mixed with each other, so that the structure is stable and excellent in durability.
  • the first color coating layer 400 may be formed in a form in which only the first solute is provided without the second solvent in the volatilized state of the first solvent and the second solvent.
  • the first solution for manufacturing the first color coating layer 400 may be a colored paint, and the second solution may be made of only a fluorine-based solvent. That is, the first color coating layer 400 may be composed of only the first solute without the second solute in the state in which the first solvent and the second solvent are volatilized.
  • a hole may be formed in a portion where the second solvent is positioned in the process of volatilizing the first solvent and the second solvent.
  • Figure 4 is a perspective view of a sensor package according to a second embodiment of the present invention
  • Figure 5 is an exploded perspective view of a sensor package according to a second embodiment of the present invention
  • Figure 6 is a cross-sectional view II of Figure 4
  • Figure 7 is an operation state of the sensor package according to the second embodiment of the present invention, the components denoted by the same reference numerals as shown in Figs. 1 to 3 have the same function, a detailed description of each of them Will be omitted.
  • the sensor package 1100 according to the second embodiment further includes a second color coating layer 600, a holder part 700, and an optical waveguide part 800.
  • the sensor package 1100 according to the second embodiment includes a light source unit 100, a sensor unit 200, an optical system 300, a first color coating layer 400, a cover unit 500, and a second color coating layer 600.
  • the holder part 700 and the optical waveguide part 800 are included.
  • the light source unit 100 is provided on the upper surface of the holder unit 700 to provide light to the side of the optical waveguide unit 800.
  • the light source unit 100 may be formed of a side view LED. That is, the light source unit 100 provided on the upper surface of the holder unit 700 is configured to irradiate light to the optical waveguide unit 800 disposed on the side surface rather than irradiating light upward. Therefore, a large amount of light may be transmitted to the optical waveguide part 800.
  • the light provided from the light source unit 100 may be various lights such as infrared (IR), near infrared (NIR), red, green, blue, and the like.
  • the holder 700 is provided on the side of the sensor unit 200, it is made to support the sensor unit 200.
  • the holder part 700 is configured to support the optical waveguide part 800 in addition to the sensor part 200.
  • the lower surface of the holder part 700 is provided on the substrate 1 like the sensor part 200.
  • the holder 700 is made to have the same thickness as the thickness of the sensor unit 200 and the optical system 300 is coupled. That is, the light source unit 100 provided on the holder part 700 provides light to the optical waveguide part 800 while maintaining the same height as the optical waveguide part 800 provided on the optical system 300. Done. Therefore, the amount of light incident from the light source unit 100 to the optical waveguide unit 800 increases. In this case, as the distance between the light source unit 100 and the optical waveguide unit 800 becomes closer, the amount of light incident from the light source unit 100 to the optical waveguide unit 800 may increase. Thus, the amount of light guided to the object F through the optical waveguide part 800 may be increased.
  • the holder 700 may not be made of the same thickness as the thickness of the sensor unit 200 and the optical system 300, but may be made of various thicknesses to compensate for the thickness of the light source unit 100.
  • the holder part 700 is configured to electrically connect the substrate 1 and the light source part 100.
  • the holder part 700 may be formed in various forms to electrically connect the substrate 1 and the light source part 100 such as a MID (Printed Circuit Board), a PCB, a metal and a synthetic resin.
  • the sensor package 1100 may further include a touch sensing unit 910.
  • the touch sensing unit 910 is configured to selectively control the power of the light source unit 100. That is, the touch sensing unit 910 transmits and receives an electrical signal toward the object F and checks whether or not the object F is in contact with the cover unit 500.
  • the touch sensing unit 910 transmits touch information to the main board, and the main board supplies power to the light source unit 100.
  • touch information is not transmitted from the touch sensing unit 910 to the main board, power is not supplied to the light source unit 100.
  • the touch sensing unit 910 selectively controls the power of the light source unit 100 according to whether or not the object F is in contact with the cover unit 500.
  • a mounting groove 911 is formed in the touch sensing unit 910.
  • the optical waveguide part 800 is inserted into the seating groove 911 so that the optical waveguide part 800 does not generate a gap with the touch sensing unit 910.
  • the touch sensing unit 910 may be made of a material having excellent heat dissipation that emits heat generated from the light source unit 100 to the outside.
  • the first color coating layer 400 is provided below the cover part 500.
  • the first color coating layer 400 may be adhered to the optical waveguide part 800 by the adhesive film 920.
  • the adhesive film 920 may be an optically clear film (OCA), an optically clear resin (OCR), or the like.
  • the first shielding member 931 may be further provided at both lower ends of the cover part 500, and the second shielding member 932 may be further provided at both lower ends of the optical waveguide part 800.
  • the first shielding member 931 has a predetermined length and is provided at both lower ends of the cover part 500.
  • the second shielding member 932 has a predetermined length and is provided below the optical waveguide part 800.
  • the first shielding member 931 and the second shielding member 932 are configured to shield components such as the light source unit 100 and the holder unit 700 from the outside.
  • the second shielding member 932 may prevent the light provided from the light source unit 100 directly flowing into the sensor unit 200.
  • the second color coating layer 600 may be coupled to the lower portion of the optical waveguide part 800.
  • the second color coating layer 600 has the same configuration as that of the first color coating layer 400 and provides the color of the sensor package 1100.
  • the second color coating layer 600 is provided in the sensor package 1100 together with the first color coating layer 400, the sensor package 1100 is mounted on the electronic device, so that the sensor package 1100 is printed on the case. There is no heterogeneity of layers and colors.
  • the second color coating layer 600 may be manufactured in the same manner as the first color coating layer 400.
  • FIG 8 is an exemplary view showing an optical waveguide part according to a second embodiment of the present invention.
  • the optical waveguide part 800 is provided between the first color coating layer 400 and the optical system 300, and is configured to guide the light provided from the light source part 100 to the object F.
  • the optical waveguide part 800 includes a core part 810, an upper covering part 820, and a lower covering part 830.
  • the upper coating portion 820 is provided on the upper surface of the core portion 810
  • the lower coating portion 830 is provided on the lower surface of the core portion 810.
  • the optical waveguide part 800 is formed such that the core part 810 has a larger refractive index than the upper coating part 820 and the lower coating part 830.
  • the core part 810 may have a refractive index of 1.5 or more, and the upper cover 820 and the lower cover 830 may have a refractive index of less than 1.5.
  • the core part 810 may be made of various transparent materials such as polysiloxane-based, polyimide-based, quartz glass, and other polymers having a refractive index of 1.5 or more.
  • the upper coating part 820 and the lower coating part 830 may be made of a transparent material having a refractive index of less than 1.5.
  • the core part 810, the upper covering part 820, and the lower covering part 830 are made of a transparent material, but are not limited to a specific material.
  • optical waveguide part 800 may be configured to allow total reflection.
  • the light incident from the light source unit 100 into the core 810 is the core portion of which the angle of incidence is greater than the critical angle ⁇ based on the imaginary normal N according to Snell's law. Total reflection is made at the interface between the 810 and the upper covering 820 or the core 810 and the lower covering 830.
  • the light having an incident angle smaller than the critical angle ⁇ based on the imaginary normal line N is partially at the interface between the core part 810 and the upper covering part 820 or the core part 810 and the lower covering part 830. It is made to transmit and reflect. Therefore, light having an incident angle smaller than the critical angle ⁇ among the light incident into the core part 810 may be transmitted to the object F through the upper coating part 820.
  • the optical waveguide part 800 is configured to allow total reflection on the light incident into the core part 810, the light incident from the light source part 100 to the optical waveguide part 800 is an optical waveguide part. It may be uniformly distributed throughout the longitudinal direction of the (800). Therefore, the optical waveguide part 800 guides the light so that the entire uniform light is irradiated toward the object F. Accordingly, the amount of light reflected by the light receiving unit 220 is increased, so that the fingerprint recognition rate of the light receiving unit 220 is increased.
  • the optical waveguide part 800 may be made of only the core part 810 without the upper coating part 820 and the lower coating part 830.
  • FIG. 9 is a schematic cross-sectional view of a sensor package according to a third embodiment of the present invention, in which components referred to by the same reference numerals as those shown in FIGS. 1 to 8 have the same function, Detailed description thereof will be omitted.
  • the sensor package 1200 includes a refracting portion 940.
  • the refraction unit 940 guides the light provided from the light source unit 100 to the side of the optical waveguide unit 800.
  • the refraction unit 940 injects light into the optical waveguide unit 800 through refraction of the light provided from the light source unit 100.
  • the refraction portion 940 may be a prism.
  • An accommodation space S is formed in the sensor package 1200.
  • the accommodation space S is a space between the holder 700 ′ and the touch sensing unit 910 ′ spaced apart from each other.
  • the light source unit 100 is coupled to the substrate 1 in a state in which the light source unit 100 is disposed.
  • the light source unit 100 may be formed of a top view LED. That is, the light source unit 100 provided on the substrate 1 is configured to irradiate light toward the refraction unit 940 supported on the upper surface of the holder unit 700 ′.
  • the light provided from the light source unit 100 may be incident to the optical waveguide unit 800 through the refraction unit 940.
  • the touch sensing unit 910 ′ is formed of the side support part 912 and the upper support part 913, light emitted from the light source part 100 may be prevented from leaking to the outside of the sensor package 1200.
  • FIG. 10 is a schematic cross-sectional illustration of a sensor package according to a fourth embodiment of the present invention, in which components referred to by the same reference numerals as those shown in FIGS. 1 to 9 have the same function, Detailed description thereof will be omitted.
  • the sensor package 1300 includes a reflector 950.
  • the reflection unit 950 guides the light provided from the light source unit 100 to the side of the optical waveguide unit 800.
  • the reflector 950 injects light into the optical waveguide part 800 through the reflection of the light provided from the light source unit 100.
  • the sensor package 1300 according to the fourth embodiment only has a difference in which the refractive unit 940 (see FIG. 9) of the sensor package 1200 (see FIG. 9) according to the third embodiment is changed to the reflecting unit 950.
  • the reflector 950 may have a reflecting surface having a spherical shape to focus light provided from the light source unit 100 to the optical waveguide unit 800.
  • the reflective surface of the reflector 950 may be formed in various shapes such as a plane, an aspheric surface.
  • the aspherical surface is generically referred to as a curved surface rather than a spherical surface, and may be a curved surface having an order of two or more orders such as a parabolic surface, a hyperbolic surface, and an elliptical surface.
  • FIG 11 is an exemplary view of an optical waveguide unit according to a fifth embodiment of the present invention.
  • a light incident hole 821 may be formed in the upper covering part 820.
  • the light incident to the core 810 may be guided to the object F through the light incident hole 821 in the process of passing through the optical waveguide part 800 ′.
  • the light incident hole 821 is formed in the upper covering portion 820, and the aperture ratio is preferably increased from the edge of the upper covering portion 820 toward the center portion C. Therefore, the light guided from the optical waveguide part 800 'toward the object F may be uniformly irradiated onto the object F.
  • the optical waveguide part 800 ′ guides the light to uniformly irradiate the object F by adjusting the aperture ratio of the light incident hole 821 according to the position of the upper coating part 820.
  • FIG. 11A illustrates that the distance between the light incidence holes 821 gradually decreases from the edge of the upper covering part 820 to the central portion C while the light incidence holes 821 are the same size. It is a form.
  • FIG. 11B illustrates a shape in which the size of the light incident hole 821 is gradually increased from the edge of the upper covering part 820 to the center C in a state where the distance between the light incident holes 821 is the same.
  • the optical waveguide portion 800 'receives uniform light from the target object F. Induces light to be irradiated. That is, the size of the light incidence hole 821 gradually increases from the edge of the upper covering part 820 to the center C, or the gap between the adjacent light incidence holes 821 becomes narrower.

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
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  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
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Abstract

Selon un mode de réalisation, la présente invention concerne un boîtier de capteur comprenant : une partie de source de lumière pour fournir de la lumière à un objet ; une partie de capteur, disposée sur un substrat, pour recevoir la lumière réfléchie par l'objet afin de détecter une empreinte digitale ; un système optique, disposé sur la partie de capteur, pour transférer la lumière réfléchie depuis l'objet vers la partie de capteur ; une partie de couvercle disposée sur le système optique ; et une première couche de revêtement de couleur, disposée entre la partie de couvercle et le système optique et permettant à la lumière fournie par la partie de source de lumière de passer à travers celle-ci et d'illuminer l'objet, et ayant une couleur, la première couche de revêtement de couleur étant constituée d'au moins deux solutions qui ne sont pas entremêlées.
PCT/KR2016/012692 2016-11-04 2016-11-04 Boîtier de capteur WO2018084341A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/KR2016/012692 WO2018084341A1 (fr) 2016-11-04 2016-11-04 Boîtier de capteur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2016/012692 WO2018084341A1 (fr) 2016-11-04 2016-11-04 Boîtier de capteur

Publications (1)

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WO2018084341A1 true WO2018084341A1 (fr) 2018-05-11

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WO (1) WO2018084341A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060134314A1 (en) * 2004-11-25 2006-06-22 Shingo Kasai Coating solution for glucose sensing membrane and method of manufacturing optical glucose sensor chip
JP2012150619A (ja) * 2011-01-18 2012-08-09 Mitsumi Electric Co Ltd 指紋検出装置及び指紋検出装置の製造方法
US20160004899A1 (en) * 2014-07-07 2016-01-07 Goodix Technology Inc. Integration of touch screen and fingerprint sensor assembly
KR20160090313A (ko) * 2013-11-22 2016-07-29 선전 후이딩 테크놀로지 컴퍼니 리미티드 안전한 인체 지문 센서
KR20160118779A (ko) * 2015-04-03 2016-10-12 아주대학교산학협력단 변색 센서 및 이의 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060134314A1 (en) * 2004-11-25 2006-06-22 Shingo Kasai Coating solution for glucose sensing membrane and method of manufacturing optical glucose sensor chip
JP2012150619A (ja) * 2011-01-18 2012-08-09 Mitsumi Electric Co Ltd 指紋検出装置及び指紋検出装置の製造方法
KR20160090313A (ko) * 2013-11-22 2016-07-29 선전 후이딩 테크놀로지 컴퍼니 리미티드 안전한 인체 지문 센서
US20160004899A1 (en) * 2014-07-07 2016-01-07 Goodix Technology Inc. Integration of touch screen and fingerprint sensor assembly
KR20160118779A (ko) * 2015-04-03 2016-10-12 아주대학교산학협력단 변색 센서 및 이의 제조 방법

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