WO2018076421A1 - Oled封装结构与oled封装方法 - Google Patents

Oled封装结构与oled封装方法 Download PDF

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Publication number
WO2018076421A1
WO2018076421A1 PCT/CN2016/106410 CN2016106410W WO2018076421A1 WO 2018076421 A1 WO2018076421 A1 WO 2018076421A1 CN 2016106410 W CN2016106410 W CN 2016106410W WO 2018076421 A1 WO2018076421 A1 WO 2018076421A1
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Prior art keywords
pixel
region
mask
layer
film thickness
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English (en)
French (fr)
Inventor
唐凡
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to US15/510,227 priority Critical patent/US10224496B2/en
Publication of WO2018076421A1 publication Critical patent/WO2018076421A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present application relates to the field of flexible display technologies, and in particular, to an OLED package structure and an OLED package method.
  • Flexible OLED (Organic Light-Emitting Diode) devices are generally packaged in a thin film, and include an inorganic thin film layer in the package structure.
  • the inorganic film is usually very dense, and there is film stress during the deposition process, so that the bending property of the inorganic film layer is not good.
  • the flexible OLED is curled or folded, the inorganic film layer is liable to crack and peel (Peling); When cracking occurs, the cracked pattern will spread quickly, eventually leading to large area failure of the flexible OLED device.
  • the present application provides an OLED package structure and an OLED packaging method, which can reduce the internal stress of the inorganic thin film layer in the OLED package structure and reduce the abnormality of cracking and peeling.
  • An OLED package structure includes a package unit and a flexible substrate on which an OLED device is deposited; the package unit includes a first package layer, a first organic layer, and a second package layer sequentially stacked on the OLED device,
  • the first encapsulation layer and the second encapsulation layer are both made of an inorganic material;
  • the first encapsulation layer includes a first pixel region and a first pixel defining region, and a film thickness of the first pixel region is greater than the first a film thickness of the pixel defining region, and a film thickness of the first pixel defining region is gradually reduced from an edge to an inner portion of the first pixel defining region;
  • the second encapsulating layer includes a first pixel region corresponding to the first pixel region a second pixel region, and a second pixel defining region corresponding to the first pixel defining region, a film thickness of the second pixel region being smaller than a film thickness of the second pixel defining region, and the The film thickness of the
  • the packaging unit further includes a second organic layer and a third encapsulation layer sequentially stacked on the second encapsulation layer, wherein the third encapsulation layer is made of an inorganic material; a third pixel region corresponding to the first pixel region, and a third pixel defining region corresponding to the first pixel defining region, wherein a film thickness of the third pixel region is greater than a film thickness of the third pixel defining region, and The film thickness of the third pixel defining region is gradually reduced from the edge to the inside of the third pixel defining region.
  • the packaging unit further comprises an inorganic layer disposed on the OLED device, the inorganic layer being located between the OLED device and the first encapsulation layer.
  • the package unit further includes a barrier film disposed on the second encapsulation layer.
  • the package unit further includes a barrier film disposed on the third encapsulation layer.
  • the first pixel area completely covers the pixel area corresponding thereto, and the area of the first pixel area is larger than the area of the pixel area, and the pixel area includes one or two or more OLED devices.
  • An OLED package structure includes a package unit and a flexible substrate deposited with the OLED device; the package unit includes a first package layer and a second package layer sequentially stacked on the OLED device, the first package layer and the
  • the second encapsulation layer is made of a hybrid material;
  • the first encapsulation layer includes a first pixel region and a first pixel defining region, and a film thickness of the first pixel region is larger than a film of the first pixel defining region Thick, and a film thickness of the first pixel defining region is gradually reduced from an edge of the first pixel defining region to an inner portion;
  • the second encapsulating layer includes a second pixel region corresponding to the first pixel region, And a second pixel defining region corresponding to the first pixel defining region, wherein a film thickness of the second pixel region is smaller than a film thickness of the second pixel defining region, and a film thickness of the second pixel region is The edge of the two-pixel area gradually decreases toward
  • An OLED packaging method includes: providing a first mask on a side on which a OLED device is deposited on a flexible substrate, such that a spacing is provided between the first mask and the flexible substrate; wherein the first The mask plate includes a light transmitting portion and a light blocking portion, the light shielding portion of the first mask plate includes opposite first end second ends, and the width of the first end is smaller than the width of the second end, a light shielding portion of a mask corresponding to a pixel defining layer on the flexible substrate, a light transmitting portion of the first mask corresponding to a pixel on the flexible substrate, and the first end facing the OLED device The second end faces away from the OLED device; an inorganic material is deposited on the OLED device through the first mask to form a first encapsulation layer, wherein the first mask layer is removed; wherein a first pixel region corresponding to the pixel and a first pixel defining region corresponding to the pixel defining layer are formed in the first encapsulation layer
  • the method further includes: depositing a second organic layer over the second encapsulation layer; disposing the first mask on the second organic layer to make the first mask and the flexible Having a spacing between the substrates, the light shielding portion of the first mask plate corresponds to a pixel defining layer on the flexible substrate, and the light transmitting portion of the first mask plate corresponds to a pixel on the flexible substrate, and
  • the first end faces the second organic layer, the second end faces away from the second organic layer; an inorganic material is deposited on the second organic layer through the first mask to form a first a third encapsulation layer, wherein the first mask is removed; wherein a third pixel region corresponding to the first pixel region and a third pixel corresponding to the first pixel defining region are formed in the third encapsulation layer
  • the film thickness of the third pixel region is larger than the film thickness of the third pixel defining region, and the film thickness of the third pixel defining region is gradually reduced from the edge to the inside of the third pixel
  • the method further includes: depositing an inorganic layer on the OLED device, the inorganic layer being disposed on the OLED device and Between the first encapsulation layers.
  • the method further includes: providing a barrier film on the second encapsulation layer.
  • the method further includes: providing a barrier film on the third encapsulation layer.
  • An OLED packaging method includes: placing a first mask on a side on which a OLED device is deposited on a flexible substrate, and having a spacing between the first mask and the flexible substrate; wherein the first The mask plate includes a light transmitting portion and a light blocking portion, the light shielding portion of the first mask plate includes opposite first end second ends, and the width of the first end is smaller than the width of the second end, a light shielding portion of a mask corresponding to a pixel defining layer on the flexible substrate, a light transmitting portion of the first mask corresponding to a pixel on the flexible substrate, and the first end facing the OLED device The second end faces away from the OLED device; a hybrid material is deposited over the OLED device through the first mask to form a first encapsulation layer, and then the first mask is removed; Forming, in the first encapsulation layer, a first pixel region corresponding to the pixel, and a first pixel defining region corresponding to the pixel defining layer, wherein a film thickness of
  • the light shielding portion of the first mask and the light shielding portion of the second mask are both disposed to have a shape wider than one end, so that the first mask and the second mask can pass through.
  • the solution can make the film stress of the first encapsulation layer and the second encapsulation layer from the film thickness
  • the large area is gradually reduced to a region with a small film thickness, which reduces the probability of occurrence of cracking and peeling;
  • the flexible first organic layer not only further buffers, absorbs and reduces the film stress of the first encapsulation layer and the second encapsulation layer, further reduces the risk of cracking, and also functions to planarize the first encapsulation layer.
  • the deposition quality of the second encapsulation layer is improved; and, by displacing the light shielding portion of the first mask sheet with the light shielding portion of the first mask layer, the thick portion of the second encapsulation layer and the thin portion of the first encapsulation layer can be formed
  • the structure corresponding to the arrangement is staggered such that the thicker portion of the second encapsulation layer just compensates for the thinner portion of the first encapsulation layer, so that the second encapsulation layer acts to supplement the first encapsulation layer to block water oxygen.
  • FIG. 1 is a schematic view of an OLED package structure of a first embodiment of the present application.
  • FIG. 2 is a schematic diagram of an OLED package structure of a second embodiment of the present application.
  • FIG 3 is a schematic diagram of an OLED package structure according to a third embodiment of the present application.
  • FIG. 4 is a schematic diagram of an OLED package structure according to a fourth embodiment of the present application.
  • FIG. 5 is a schematic diagram of an OLED package structure according to a fifth embodiment of the present application.
  • FIG. 6 is a schematic diagram of an OLED package structure according to a sixth embodiment of the present application.
  • FIG. 7 is a schematic flow chart of an OLED packaging method according to an embodiment of the present application.
  • FIG. 8 is a schematic diagram of a process operation in the OLED packaging method shown in FIG. 7.
  • FIG. 8 is a schematic diagram of a process operation in the OLED packaging method shown in FIG. 7.
  • FIG. 9 is a schematic view showing another process operation in the OLED packaging method shown in FIG. 7.
  • FIG. 10 is a schematic view showing still another process operation in the OLED packaging method shown in FIG. 7.
  • the OLED package structure 10 of the first embodiment includes a package unit 13 and a flexible substrate 11 on which an OLED device 12 is deposited.
  • the OLED device 12 includes an anode 120, a light emitting layer 121, and a cathode 122 which are sequentially deposited on the flexible substrate 11.
  • other functional layers in the OLED device 12 are not shown for the sake of brevity. It should be understood that this is not a limitation of the present application.
  • a package unit 13 is disposed over the OLED device 12 for packaging the OLED device 12.
  • the package unit 13 includes a first encapsulation layer 131, a first organic layer 132, and a second encapsulation layer 133 which are sequentially stacked.
  • the first encapsulation layer 131 and the second encapsulation layer 133 are both made of an inorganic material.
  • a first encapsulation layer 131 is deposited over the cathode 122 in the OLED device 12, a first organic layer 132 is deposited over the first encapsulation layer 131, and a second encapsulation layer 133 is deposited over the first organic layer 132.
  • a plurality of pixels and a pixel defining layer (not shown) are further disposed on the flexible substrate 11, and the pixels are alternately arranged adjacent to the pixel defining layer.
  • the first encapsulation layer 131 includes a first pixel area A and a first pixel defining area B.
  • the first pixel area A corresponds to the area of the pixel distribution
  • the first pixel defining area B corresponds to the area where the pixel defining layer is distributed.
  • the film thickness of the first encapsulation layer 131 is non-uniformly distributed.
  • the film thickness of the first pixel region A is larger than the film thickness of the first pixel defining region B, and the first pixel region A having a larger film thickness and the first pixel defining region B having a smaller film thickness are alternately arranged adjacent to each other.
  • the film thickness of the first pixel defining region B gradually decreases from the edge of the first pixel defining region B to the inside of the first pixel defining region B, and the film thickness decreases in a gradient.
  • the second encapsulation layer 133 includes a second pixel area A1 and a second pixel defining area B1.
  • the second pixel area A1 corresponds to the first pixel area A, that is, the second pixel area A1 also corresponds to the area of the pixel distribution; the second pixel defining area B1 corresponds to the first pixel defining area B, that is, the second pixel defining area B1 Also corresponding to the area in which the pixel defines a layer distribution.
  • the film thickness of the second encapsulation layer 133 is also non-uniformly distributed, but unlike the first encapsulation layer 131, the film thickness of the second pixel region A1 is smaller than the film thickness of the second pixel defining region B1, and has a film thickness.
  • the smaller second pixel area A1 is alternately arranged adjacent to the second pixel defining area B1 having a larger film thickness.
  • the film thickness of the second pixel region A1 gradually decreases from the edge of the second pixel region A1 to the inside of the second pixel region A1, and the film thickness decreases in a gradient.
  • the thicker first pixel region A on the first encapsulation layer 131 corresponds to the thinner second pixel region A1 on the second encapsulation layer 133
  • the thinner first pixel on the first encapsulation layer 131 is defined.
  • the region B corresponds to the thicker second pixel defining region B1 of the second encapsulation layer 133, thereby forming the above
  • the thick portions of the two encapsulation layers are staggered to correspond to the arranged structure.
  • the surface of the A/A1 (A or A1) region on which the pixels are distributed is covered with the first encapsulation layer 131 having a larger film thickness, that is, the first region of the pixel region is the first encapsulation layer 131.
  • the pixel area A is covered.
  • the first pixel area A completely covers the pixel area corresponding thereto, and the area of the first pixel area A is larger than the area of the pixel area; in addition, the first pixel area A is also located in the pixel defining layer area B/B1 (ie, B or The cathode 122 within B1) ensures that the pixel region is effective in isolating water oxygen.
  • the pixel region on the flexible substrate 11 corresponding to the first pixel region A may be composed of a single sub-pixel (ie, a single OLED device), or may be composed of multiple sub-pixels (ie, multiple OLED devices).
  • the film thickness of the corresponding region in the two encapsulation layers is continuously decreasing in a gradient.
  • one side of the cross section of the film thickness is a curve which is recessed from the two sections toward the middle.
  • the curve shown in Figure 1 is an arc.
  • a decreasing gradient of the film thickness can be set as needed to make the curve into other shapes.
  • the first organic layer 132 in the above two encapsulation layers, a "sandwich biscuit" type structure is formed. Since the first organic layer 132 has flexibility, it is possible to buffer, absorb and reduce the film stress of the above two encapsulation layers made of an inorganic material, thereby reducing the risk of cracking of the above two encapsulation layers.
  • the first encapsulation layer 131 and the second encapsulation layer 133 are respectively disposed such that a region having a larger film thickness and a region having a smaller film thickness are alternately arranged adjacent to each other, compared to the first encapsulation layer 131 and the second encapsulation layer 133
  • the film thickness uniformity (the film stress in each region is substantially uniform) can make the film stress of the first encapsulation layer 131 and the second encapsulation layer 133 gradually decrease from a region with a large film thickness to a region with a small film thickness. The probability of occurrence of rupture is further reduced.
  • the first pixel region A having a large film thickness can effectively block the penetration of water and oxygen, and form effective protection for the pixel region.
  • the thick portion on the second encapsulation layer 133 just compensates for the thin portion on the first encapsulation layer 131, thereby To supplement the effect of the first encapsulation layer 131 to block the water oxygen capacity.
  • the first organic layer 132 can also function to planarize the first encapsulation layer 131 to enhance deposition of the second encapsulation layer 133. quality.
  • FIG. 2 shows an OLED package structure 20 of a second embodiment of the present application, which includes a package unit 23.
  • the first organic layer 232 in the package unit 23 is deposited on the first encapsulation layer 231, and the second encapsulation layer 233 is the same as the first embodiment.
  • the package unit 23 further includes an inorganic layer 230 deposited on the OLED device 12, the inorganic layer 230 being disposed on the OLED device 12 and the first package Between layers 231.
  • the inorganic layer 230 is deposited on the cathode 122 in the OLED device 12, and the inorganic layer 230 is disposed between the cathode 122 and the first encapsulation layer 231.
  • the inorganic layer 230 is disposed to protect the OLED device 12 from damage caused by the subsequent package to the OLED device 12.
  • the inorganic layer 230 can be prepared by various processes, for example, by using a method of thermally evaporating lithium fluoride (LiF).
  • FIG. 3 shows an OLED package structure 30 of a third embodiment of the present application, which includes a package unit 33.
  • the first encapsulation layer 331 in the package unit 33 is deposited on the inorganic layer 330, and the first organic layer 332 is deposited on the first embodiment.
  • a second encapsulation layer 333 is deposited on the first organic layer 332.
  • the package unit 33 further includes a barrier film 334 deposited on the second encapsulation layer 333.
  • the barrier film 334 is provided for structural protection of the entire package structure.
  • the process of providing the barrier film 334 includes, but is not limited to, lamination.
  • FIG. 4 shows an OLED package structure 40 of a fourth embodiment of the present application, which includes a package unit 43.
  • the second encapsulation layer 431 in the package unit 43 is deposited on the inorganic layer 430, and the first organic layer 432 is deposited on the first embodiment.
  • a second encapsulation layer 433 is deposited on the first organic layer 432; however, unlike the second embodiment described above, the package unit 43 further includes a second organic layer 434 deposited on the second encapsulation layer 433.
  • a third encapsulation layer 435 deposited on the second organic layer 434.
  • the third encapsulation layer 435 is made of an inorganic material.
  • the third encapsulation layer 435 includes a third pixel area A2 and a third pixel defining area B2, and the third pixel area A2 corresponds to the first pixel area A, that is, the third pixel area A2 also corresponds to the area of the pixel distribution; the third pixel The limited area B2 corresponds to the first pixel defining area B, that is, the third pixel defining area B2 also corresponds to the area in which the pixel defining layer is distributed.
  • the film thickness of the third encapsulation layer 435 is also non-uniformly distributed. Specifically, the film thickness of the third pixel area A2 is greater than the third pixel limit.
  • the film thickness of the region B2 is alternately arranged adjacent to the region B2 having a large film thickness and the region B2 having a small film thickness.
  • the film thickness of the third pixel defining region B2 is gradually decreased from the edge of the third pixel defining region B2 to the inside of the third pixel defining region B2, and the film thickness is decreased by a gradient. That is, the distribution of the thick regions on the third encapsulation layer 435 corresponds to the distribution of the thick regions on the first encapsulation layer 431 and corresponds to the distribution of the thick regions on the second encapsulation layer 433.
  • the film stress of the third encapsulation layer 435 can be reduced, the risk of cracking and more serious abnormality can be reduced, and at the same time, the second encapsulation layer 433 can be supplemented to block the water oxygen capacity. Since the principle of this technical effect has been described in detail above, it will not be described here.
  • the second organic layer 434 and the third encapsulation layer 435 are additionally stacked to form a "double-layered biscuit" type package structure, which can be applied to another OLED device. A packaging requirement.
  • the organic layer and the encapsulation layer may be stacked and deposited as needed to realize a "multilayer sandwich biscuit" type package structure; and/or, in other embodiments, the inorganic layer may not be disposed.
  • the first encapsulation layer 431 is deposited directly on the cathode 122.
  • FIG. 5 shows an OLED package structure 50 of a fifth embodiment of the present application, which includes a package unit 53.
  • the first encapsulation layer 531 in the package unit 53 is deposited on the inorganic layer 530, and the first organic layer 532 is deposited on the first embodiment.
  • a second encapsulation layer 533 is deposited on the first organic layer 532, a second organic layer 534 is deposited on the second encapsulation layer 533, and a third encapsulation layer 535 is deposited on the second organic layer 534.
  • the package unit 53 further includes a barrier film 536 deposited on the third encapsulation layer 535.
  • the barrier film 536 is provided for structural protection of the entire package structure.
  • the process of providing the barrier film 636 includes, but is not limited to, lamination.
  • FIG. 6 shows an OLED package structure 60 of a sixth embodiment of the present application, which includes a package unit 63.
  • the package unit 63 includes only two encapsulation layers, a first encapsulation layer 631 and a second encapsulation layer 632 , and the first encapsulation layer 631 and the first embodiment.
  • the two encapsulation layers 632 are all hybrid materials.
  • the material property of the hybrid material is between the organic material and the inorganic material, and the film layer prepared using the material has improved crack resistance, so there is no need to be between the first encapsulation layer 631 and the second encapsulation layer 632.
  • the organic layer By arranging the organic layer, the risk of cracking of each encapsulation layer can be reduced. Further, by providing a structure in which the thick regions are alternately adjacent to each other on the first encapsulation layer 631 and the second encapsulation layer 632, further The film stress of each encapsulation layer is reduced, the probability of occurrence of cracking is reduced, and the ability of the first encapsulation layer 631 to block water oxygen is complemented.
  • the OLED package structure may further include an inorganic layer deposited on the cathode 122 and/or a barrier film deposited on the second encapsulation layer 632, as described in the above embodiments.
  • the OLED package structure described in the above embodiments is to package all OLED devices (ie, one package unit package all sub-pixels) for all OLED devices on the entire flexible substrate, that is, one package unit.
  • the pixel region on the flexible substrate 11 corresponding to the first pixel region A may be composed of a single sub-pixel (ie, a single OLED device), or may be composed of multiple sub-pixels (ie, multiple OLED devices).
  • a part of the OLED devices (ie, partial sub-pixels) on the flexible substrate may be separately packaged, that is, the package unit may package only one or two or more OLED devices (ie, one or more sub-pixels). ).
  • the structure of the package unit in this embodiment is the same as that described in the above embodiment.
  • the first encapsulation layer 131 and the second encapsulation layer 133 having a non-uniform thickness are disposed in units of single or more than two OLED devices, and the non-uniform inorganic layer is small in thickness compared to the curl radius when the device is crimped
  • the deformation of the setting unit is extremely small, which is equivalent to cutting the original entire packaging unit into a plurality of small packaging units, so that the inorganic layer is not easily peeled off. Therefore, this solution can meet different packaging requirements by adjusting the difficulty of the packaging process.
  • the OLED package structure of the embodiment of the present application is described in detail above with reference to FIG. 1 to FIG. 6.
  • the OLED package method of the embodiment of the present application will be described below with reference to FIG.
  • the OLED packaging method is used to prepare the OLED package structure.
  • the OLED package method 100 of the eighth embodiment of the present application includes:
  • a first mask is disposed on a side of the flexible substrate on which the OLED device is deposited, such that the first mask has a spacing between the first mask and the flexible substrate; wherein the first mask comprises light And a light shielding portion, the light shielding portion of the first mask includes an opposite first end and a second end, the first end has a width smaller than a width of the second end, and the first mask is shielded from light Corresponding to a pixel defining layer on the flexible substrate, the light transmitting portion of the first mask plate corresponds to a pixel on the flexible substrate, and the first end faces the OLED device, the second end Facing away from the OLED device;
  • a second mask is disposed on the first organic layer to have a spacing between the second mask and the flexible substrate; wherein the second mask comprises a light shielding portion and a light transmitting portion, the light shielding portion of the second mask includes opposite third and fourth ends, the third end has a width smaller than a width of the fourth end, and the light shielding portion of the second mask Corresponding to the pixel distribution area on the flexible substrate, the light transmissive portion of the second mask corresponds to the pixel defining layer distribution region on the flexible substrate, and the third end faces the first organic layer, The fourth end faces away from the first organic layer;
  • an OLED device 12 has been deposited on the flexible substrate 11, and the OLED device 12 includes an anode 120, a light-emitting layer 121, and a cathode 122 which are sequentially deposited on the flexible substrate 11.
  • a plurality of pixels and a plurality of pixel defining layers are further distributed on the flexible substrate 11, and the pixels are alternately arranged adjacent to the pixel defining layer.
  • the pixels are distributed in the A region in FIG. 1, and the pixel defining layer is distributed in the B region in FIG.
  • other functional layers in the OLED device 12 are not shown for the sake of brevity. It should be understood that this is not a limitation of the present application.
  • the first mask is disposed on one side of the flexible substrate 11 on which the OLED device 12 is deposited (ie, placed over the cathode 122), and the first mask is spaced from the flexible substrate 11.
  • the distance between the first mask and the flexible substrate 11 is set to be a first distance, and the specific value of the first distance is determined according to actual needs.
  • the first mask includes the light shielding portions 14 and the light transmitting portions 15 alternately arranged adjacent to each other, and the encapsulating material is deposited from the light transmitting portion 15 onto the cathode 122.
  • the light shielding portion 14 includes opposite first ends 141 and second ends 142, and the width of the first end 141 is smaller than the width of the second end 142.
  • the size of the first end 141 in the horizontal direction is smaller than the size of the second end 142, and the light shielding portion 14 has an inverted trapezoidal shape of "upper and lower".
  • the light-shielding portion 14 is taken as an example of the inverted trapezoid; in other embodiments, the light-shielding portion 14 may have other shapes on the premise that the first end width is smaller than the second end.
  • First One end 141 faces the OLED device 12 (ie, toward the cathode 122), the second end 142 faces away from the OLED device 12 (ie, faces away from the cathode 122), and the light shielding portion 14 is placed corresponding to the pixel defining layer (ie, corresponding to the B region), and the light transmitting portion 15 Place the corresponding pixel (ie corresponding to the A area).
  • the inorganic material is deposited on the OLED device (ie, the cathode 122) through the first mask to form the first encapsulation layer 131, and then the first mask is removed. . Since the first mask has a shadow effect, that is, the film thickness deposited at the light transmitting portion 15 is large, and the film thickness deposited at the light shielding portion 14 is small, the first package layer 131 is at the corresponding pixel A. The film thickness of the region is large, and the film thickness is small in the B region corresponding to the pixel defining layer.
  • the first encapsulation layer 131 forms the first pixel region A and the first pixel defining region B, and the film thickness of the first pixel region A is larger than the film thickness of the first pixel defining region B.
  • the light-shielding portion 14 is an inverted trapezoid of "upper and lower"
  • the deposition amount of the inorganic material is closer to the edge of the light-shielding portion 14, and the amount of deposition of the inorganic material closer to the light-shielding portion 14 is less, so that the final formation is performed.
  • the first pixel defining layer B has a gradient of gradient which gradually decreases from its edge to the inside.
  • the first distance enables the first pixel defining region B to also deposit an inorganic material. Otherwise, if the light shielding portion 14 is completely attached to the cathode 122, the inorganic material cannot be deposited into the first pixel defining region B.
  • the different values of the first distance can adjust the film thickness gradient of the first pixel defining region B.
  • the first distance is large, the inside of the first pixel defining area B has a larger film thickness; when the first distance is smaller, the inside of the first pixel defining area B has a smaller film thickness, thereby adjusting from the first The film thickness variation rate from the edge to the inside of the pixel defining region B.
  • the first distance may also be a variable value, thereby adjusting the film thickness at each position in the first pixel defining region B, so as to dynamically adjust the film thickness change rate.
  • a first organic layer 132 is deposited over the first encapsulation layer 131.
  • the first organic layer 132 has flexibility to buffer, absorb, and reduce the film stress of the first encapsulation layer 131 made of an inorganic material.
  • the first organic layer 132 also has the function of planarizing the first encapsulation layer 131, which can improve the deposition quality of the subsequent film layer.
  • the second mask is disposed on the first organic layer 132 such that the distance from the flexible substrate 11 is a second distance.
  • the specific value of the second distance is determined according to actual needs, and the second distance is greater than the first distance.
  • an inorganic material is further deposited on the first organic layer 132 through the second mask to form a second encapsulation layer 133.
  • the second mask includes shading alternately arranged adjacently
  • the portion 24 and the light transmitting portion 25, the encapsulating material will be deposited from the light transmitting portion 25 onto the first organic layer 132.
  • the light shielding portion 24 includes opposite third ends 241 and fourth ends 242, and the width of the third end 241 is smaller than the width of the fourth end 242. That is, in the cross-sectional view of the second mask shown in FIG. 10, the size of the third end 241 in the horizontal direction is smaller than the size of the fourth end 242, and the light shielding portion 24 has an inverted trapezoid "upper and lower".
  • the light-shielding portion 24 is taken as an example of the inverted trapezoid; in other embodiments, the light-shielding portion 24 may have other shapes on the premise that the third end width is smaller than the fourth end.
  • the third end 241 faces the first organic layer 132 and the fourth end 242 faces away from the first organic layer 132.
  • the light shielding portion 24 is placed corresponding to the pixel (ie, corresponding to the A1 region), and the light transmitting portion 25 is disposed corresponding to the pixel defining layer (ie, corresponding to the B1 region), that is, the second mask and the first mask.
  • the opaque portion of the reticle is just misaligned.
  • the first mask may be translated to stagger the last process position for reasons of cost savings and increased utilization of the process equipment, etc., thereby continuing to deposit the second encapsulation layer 133 using the first mask. That is, the second mask refers to the first mask after the misalignment.
  • the first mask and the second mask may also be different masks.
  • the second encapsulation layer 133 will form the second pixel area A1 and the second pixel defining area B1, and the film thickness of the second pixel area A1 is smaller than the film thickness of the second pixel defining area B1. And the film thickness of the second pixel area A1 exhibits a gradient gradation, which gradually decreases from the edge to the inside.
  • the effect of the second distance corresponds to the first distance. That is, the second distance enables the second pixel region A1 to also deposit the inorganic material; the specific value of the second distance is determined according to actual needs, and the different values can adjust the film thickness gradient of the second pixel region A1.
  • the second distance is larger, the inside of the second pixel area A1 has a larger film thickness; when the second distance is smaller, the inside of the second pixel area A1 has a smaller film thickness, thereby adjusting the second pixel area The rate of change in film thickness from the edge to the inside of A1.
  • the second distance may also be a variable value, thereby adjusting the film thickness at each position in the second pixel region A1 to achieve the purpose of dynamically adjusting the film thickness change rate.
  • the light shielding portion 14 of the first mask and the light shielding portion 24 of the second mask are both disposed in a shape having a large end and a small end, so that the two masks can pass through the two masks.
  • the plates respectively form a first encapsulation layer 131 and a second encapsulation layer 133 which are alternately arranged adjacent to the region having a larger film thickness and a region having a smaller film thickness.
  • the encapsulation method 100 can make the first The film stress of one of the encapsulation layer 131 and the second encapsulation layer 133 is gradually reduced from a region having a large film thickness to a region having a small film thickness, thereby reducing the probability of occurrence of cracking; by disposing the light shielding portion 24 in the light shielding portion 14 Forming the structure in which the second encapsulation layer 132 and the thick portion of the first encapsulation layer 131 are alternately arranged, so that the thick portion on the second encapsulation layer 133 just makes up for the thinner portion on the first encapsulation layer 131, thereby making the second The encapsulation layer 133 functions to supplement the first encapsulation layer 131 to block water oxygen; and, by depositing the first organic layer 132 having flexibility, not only the first encapsulation layer
  • the OLED packaging method further includes: after the step S150, the method further includes:
  • a barrier film is disposed on the second encapsulation layer.
  • the barrier film is provided for structural protection of the entire package structure.
  • the manner in which the barrier film is provided includes, but is not limited to, a conformation.
  • the OLED packaging method further includes: after the step S150, the method further includes:
  • the first mask on the second organic layer, such that the first mask has a spacing between the flexible substrate, and the light shielding portion of the first mask corresponds to the a pixel defining layer on the flexible substrate, the light transmitting portion of the first mask plate corresponding to the pixel on the flexible substrate, and the first end facing the second organic layer, the second end facing away The second organic layer;
  • the second organic layer and the third encapsulation layer are stacked and deposited on the original “sandwich biscuit” OLED package structure, thereby forming a “double-layered biscuit” OLED package structure.
  • the deposition process of the second organic layer is the same as that of the first organic layer.
  • the deposition of the third encapsulation layer is performed through the first mask.
  • the first mask is disposed at a third distance from the flexible substrate, such that the first end of the first mask faces the second organic layer, and the second end faces away from the second organic layer, so that The light shielding portion of the mask corresponds to the pixel defining layer on the flexible substrate, and the light transmitting portion of the first mask corresponds to the pixel on the flexible substrate, thereby forming the same shape as the first packaging layer, and only the deposition position is different.
  • Three encapsulation layers Since the above embodiment has been described in detail for the deposition process of the corresponding film layer, it will not be described herein.
  • the third distance is greater than the second distance and the first distance, and the third distance corresponds to the first distance or the second distance, and is not described in detail herein.
  • the OLED packaging method of the present embodiment forms a "two-layer sandwich biscuit" type package structure, which can be applied to another packaging requirement of the OLED device.
  • other quantities of the organic layer and the encapsulation layer may be stacked and deposited as needed to realize a "multilayer sandwich biscuit" type package structure.
  • the OLED packaging method further includes:
  • a barrier film is disposed on the third encapsulation layer. Similarly, the barrier film is provided for structural protection of the entire package structure.
  • the manner in which the barrier film is provided includes, but is not limited to, a conformation.
  • the OLED packaging method further includes:
  • An inorganic layer is deposited over the OLED device, the inorganic layer being disposed between the OLED device and the first encapsulation layer.
  • the inorganic layer is disposed to protect the OLED device from damage caused by the subsequent package.
  • the inorganic layer can be prepared by various processes. For example, a method of thermally evaporating lithium fluoride (LiF) is used.
  • the OLED packaging methods described in the above eighth to twelfth embodiments are all used to form a "sandwich biscuit" type OLED package structure in which an organic layer is disposed between two package layers, wherein each of the package layers is made of an inorganic material.
  • the OLED packaging method includes:
  • the first mask includes a light transmitting portion and a light shielding portion, wherein the light shielding portion of the first mask includes opposite first and second ends, the width of the first end is smaller than the width of the second end, and the light shielding portion of the first mask corresponds to a pixel defining layer on the flexible substrate, a light transmitting portion of the first mask plate corresponding to a pixel on the flexible substrate, and the first end facing the OLED device, the second end facing away The OLED device;
  • first encapsulation layer is formed with the pixel a corresponding first pixel region, and a first pixel defining region corresponding to the pixel defining layer, wherein a film thickness of the first pixel region is greater than a film thickness of the first pixel defining region, the first pixel defining region The film thickness is gradually reduced from the edge of the first pixel defining region to the inside;
  • the second mask comprises a light shielding portion and a light transmission
  • the light shielding portion of the second mask includes opposite third ends and fourth ends, the third end has a width smaller than a width of the fourth end, and the light shielding portion of the second mask is corresponding to the portion a pixel distribution area on the flexible substrate, wherein the light transmissive portion of the second mask corresponds to the pixel defining layer distribution region on the flexible substrate, and the third end faces the first encapsulation layer, The fourth end faces away from the first encapsulation layer;
  • the second encapsulation layer is formed a second pixel region corresponding to the first pixel region, and a second pixel defining region corresponding to the first pixel defining region, wherein a film thickness of the second pixel region is smaller than a film thickness of the second pixel defining region, The film thickness of the second pixel region is gradually reduced from the edge to the inside of the second pixel region.
  • the arrangement of the first mask and the second mask, and the deposition process of the first and second encapsulation layers are the same as those of the eighth to twelfth embodiments; but the difference is that
  • the first encapsulation layer and the second encapsulation layer are both hybrid materials, and the first organic layer is not deposited.
  • the material properties of the hybrid material are between the organic material and the inorganic material.
  • the film layer prepared using such a material has improved crack resistance, so that it is not necessary to provide a first organic layer between the first encapsulation layer and the second encapsulation layer, thereby reducing the risk of cracking of each encapsulation layer. Since the deposition process of the corresponding film layer has been described in detail above, it will not be described here.

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Abstract

一种OLED封装结构和OLED封装方法，OLED封装结构（10）包括封装单元（13）和沉积有OLED器件（12）的柔性基板（11）；封装单元包括依次层叠于OLED器件之上的第一封装层（131）、第一有机层（132）和第二封装层（133），第一封装层与第二封装层均由无机材料制成；第一封装层包括第一像素区域（A）与第一像素限定区域（B），第一像素区域的膜厚大于第一像素限定区域的膜厚，且第一像素限定区域的膜厚由第一像素限定区域的边缘到内部逐渐减小；第二封装层包括与第一像素区域对应的第二像素区域（A1），以及与第一像素限定区域对应的第二像素限定区域（B1），第二像素区域的膜厚小于第二像素限定区域的膜厚，且第二像素区域的膜厚由第二像素区域的边缘到内部逐渐减小。

Description

OLED封装结构与OLED封装方法
本申请要求于2016年10月31日提交中国专利局、申请号为201610969589.5、发明名称为“OLED封装结构与OLED封装方法”的中国专利申请的优先权，上述在先申请的内容以引入的方式并入本文本中。
技术领域
本申请涉及柔性显示技术领域，尤其涉及一种OLED封装结构与OLED封装方法。
背景技术
柔性OLED(Organic Light-Emitting Diode，有机发光二极管)器件一般采用薄膜封装，其封装结构中包括无机薄膜层。无机薄膜通常很致密，在沉积过程中存在薄膜应力，使得无机薄膜层弯折性能不好，在柔性OLED在卷曲或折叠时，无机薄膜层很容易产生破裂(Crack)和剥离(Peeling)；一旦破裂发生，破裂纹将很快扩散，最终导致柔性OLED器件大面积失效。
发明内容
有鉴于此，本申请提供了一种OLED封装结构与OLED封装方法，能够降低OLED封装结构中无机薄膜层的内应力，减少破裂和剥离异常。
一种OLED封装结构，包括封装单元和沉积有OLED器件的柔性基板；所述封装单元包括依次层叠于所述OLED器件之上的第一封装层、第一有机层和第二封装层，所述第一封装层与所述第二封装层均由无机材料制成；所述第一封装层包括第一像素区域与第一像素限定区域，所述第一像素区域的膜厚大于所述第一像素限定区域的膜厚，且所述第一像素限定区域的膜厚由所述第一像素限定区域的边缘到内部逐渐减小；所述第二封装层包括与所述第一像素区域对应的第二像素区域，以及与所述第一像素限定区域对应的第二像素限定区域，所述第二像素区域的膜厚小于所述第二像素限定区域的膜厚，且所述第 二像素区域的膜厚由所述第二像素区域的边缘到内部逐渐减小。
其中，所述封装单元还包括依次层叠于所述第二封装层上的第二有机层和第三封装层，所述第三封装层由无机材料制成；所述第三封装层包括与所述第一像素区域对应的第三像素区域，以及与第一像素限定区域对应的第三像素限定区域，所述第三像素区域的膜厚大于所述第三像素限定区域的膜厚，且所述第三像素限定区域的膜厚由所述第三像素限定区域的边缘到内部逐渐减小。
其中，所述封装单元还包括设在所述OLED器件之上的无机层，所述无机层位于所述OLED器件与所述第一封装层之间。
其中，所述封装单元还包括设在所述第二封装层之上的阻挡膜。
其中，所述封装单元还包括设在所述第三封装层之上的阻挡膜。
其中，所述第一像素区域完全覆盖其所对应的像素区，且所述第一像素区域的面积大于所述像素区的面积，所述像素区内包括一个或两个以上所述OLED器件。
一种OLED封装结构，包括封装单元和沉积有OLED器件的柔性基板；所述封装单元包括依次层叠于所述OLED器件上的第一封装层和第二封装层，所述第一封装层与所述第二封装层均由杂化材料制成；所述第一封装层包括第一像素区域与第一像素限定区域，所述第一像素区域的膜厚大于所述第一像素限定区域的膜厚，且所述第一像素限定区域的膜厚由所述第一像素限定区域的边缘到内部逐渐减小；所述第二封装层包括与所述第一像素区域对应的第二像素区域，以及与第一像素限定区域对应的第二像素限定区域，所述第二像素区域的膜厚小于所述第二像素限定区域的膜厚，且所述第二像素区域的膜厚由所述第二像素区域的边缘到内部逐渐减小。
一种OLED封装方法，包括：在柔性基板上沉积有OLED器件的一侧设置第一掩膜板，使所述第一掩膜板与所述柔性基板之间具有间距；其中，所述第一掩膜板包括透光部及遮光部，所述第一掩膜板的遮光部包括相对的第一端第二端，所述第一端的宽度小于所述第二端的宽度，将所述第一掩膜板的遮光部对应所述柔性基板上的像素限定层，所述第一掩膜板的透光部对应所述柔性基板上的像素，并将所述第一端朝向所述OLED器件，所述第二端背向所述OLED器件；通过所述第一掩膜板在所述OLED器件之上沉积无机材料以形成 第一封装层，之后去除所述第一掩膜板；其中，所述第一封装层中形成与所述像素对应的第一像素区域，以及与所述像素限定层对应的第一像素限定区域，所述第一像素区域的膜厚大于所述第一像素限定区域的膜厚，所述第一像素限定区域的膜厚由所述第一像素限定区域的边缘到内部逐渐减小；在所述第一封装层之上沉积第一有机层；在所述第一有机层之上设置第二掩膜板，使所述第二掩膜板与所述柔性基板的之间具有间距；其中，所述第二掩膜板包括遮光部与透光部，所述第二掩膜板的遮光部包括相对的第三端和第四端，所述第三端的宽度小于所述第四端的宽度，将所述第二掩膜板的遮光部对应所述柔性基板上的像素分布区域，所述第二掩膜板的透光部对应所述柔性基板上的像素限定层分布区域，并将所述第三端朝向所述第一有机层，所述第四端背向所述第一有机层；通过所述第二掩膜板在所述第一有机层之上沉积无机材料以形成第二封装层，之后去除所述第二掩膜板；其中，所述第二封装层中形成与所述第一像素区域对应的第二像素区域，以及与所述第一像素限定区域对应的第二像素限定区域，所述第二像素区域的膜厚小于所述第二像素限定区域的膜厚，所述第二像素区域的膜厚由所述第二像素区域的边缘到内部逐渐减小。
其中，还包括：在所述第二封装层之上沉积第二有机层；在所述第二有机层之上设置所述第一掩膜板，使所述第一掩膜板与所述柔性基板之间具有间距，将所述第一掩膜板的遮光部对应所述柔性基板上的像素限定层，所述第一掩膜板的透光部对应所述柔性基板上的像素，并将所述第一端朝向所述第二有机层，所述第二端背向所述第二有机层；通过所述第一掩膜板在所述第二有机层之上沉积无机材料以形成第三封装层，之后去除所述第一掩膜板；其中，所述第三封装层中形成与所述第一像素区域对应的第三像素区域，以及与第一像素限定区域对应的第三像素限定区域，所述第三像素区域的膜厚大于所述第三像素限定区域的膜厚，所述第三像素限定区域的膜厚由所述第三像素限定区域的边缘到内部逐渐减小。
其中，在步骤在柔性基板上沉积有OLED器件的一侧设置第一掩膜板之前，还包括：在所述OLED器件之上沉积无机层，所述无机层设于所述OLED器件与所述第一封装层之间。
其中，还包括：在所述第二封装层上设置阻挡膜。
其中，还包括：在所述第三封装层上设置阻挡膜。
一种OLED封装方法，包括：在柔性基板上沉积有OLED器件的一侧放置第一掩膜板，使所述第一掩膜板与所述柔性基板之间具有间距；其中，所述第一掩膜板包括透光部及遮光部，所述第一掩膜板的遮光部包括相对的第一端第二端，所述第一端的宽度小于所述第二端的宽度，将所述第一掩膜板的遮光部对应所述柔性基板上的像素限定层，所述第一掩膜板的透光部对应所述柔性基板上的像素，并将所述第一端朝向所述OLED器件，所述第二端背向所述OLED器件；通过所述第一掩膜板在所述OLED器件之上沉积杂化材料以形成第一封装层，之后去除所述第一掩膜板；其中，所述第一封装层中形成与所述像素对应的第一像素区域，以及与所述像素限定层对应的第一像素限定区域，所述第一像素区域的膜厚大于所述第一像素限定区域的膜厚，所述第一像素限定区域的膜厚由所述第一像素限定区域的边缘到内部逐渐减小；在所述第一封装层之上设置第二掩膜板，使所述第二掩膜板与所述柔性基板的之间具有间距；其中，所述第二掩膜板包括遮光部与透光部，所述第二掩膜板的遮光部包括相对的第三端和第四端，所述第三端的宽度小于所述第四端的宽度，将所述第二掩膜板的遮光部对应所述柔性基板上的像素分布区域，所述第二掩膜板的透光部对应所述柔性基板上的像素限定层分布区域，并将所述第三端朝向所述第一封装层，所述第四端背向所述第一封装层；通过所述第二掩膜板在所述第一封装层之上沉积杂化材料以形成第二封装层，之后去除所述第二掩膜板；其中，所述第二封装层中形成与所述第一像素区域对应的第二像素区域，以及与所述第一像素限定区域对应的第二像素限定区域，所述第二像素区域的膜厚小于所述第二像素限定区域的膜厚，所述第二像素区域的膜厚由所述第二像素区域的边缘到内部逐渐减小。
由此，本申请的方案，将第一掩膜板的遮光部与第二掩膜板的遮光部均设置为一端比一端宽的形状，从而能够通过第一掩膜板与第二掩膜板分别形成膜厚较大区域与膜厚较小区域相邻交替排布的第一封装层与第二封装层。相较形成具有均一膜厚的第一封装层与第二封装层的方案(其内各区域薄膜应力基本一致)，本方案能够使得第一封装层与第二封装层的薄膜应力从膜厚较大的区域到膜厚较小的区域逐渐减小，降低了破裂和剥离出现的概率；通过沉积具有 柔性的第一有机层，不但进一步缓冲、吸收和降低了第一封装层与第二封装层的薄膜应力，进一步减少了发生破裂的风险，而且还能够起到平坦化第一封装层的作用，提升了第二封装层的沉积质量；并且，通过将第一掩膜板的遮光部错开第一掩膜板的遮光部布置，能够形成第二封装层的厚薄部分与第一封装层的薄厚部分交错对应排布的结构，使第二封装层上的较厚部分恰好弥补第一封装层上的较薄部分，从而使第二封装层起到补充第一封装层阻隔水氧能力的作用。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请第一实施例的OLED封装结构的示意图。
图2是本申请第二实施例的OLED封装结构的示意图。
图3是本申请第三实施例的OLED封装结构的示意图。
图4是本申请第四实施例的OLED封装结构的示意图。
图5是本申请第五实施例的OLED封装结构的示意图。
图6是本申请第六实施例的OLED封装结构的示意图。
图7是本申请实施例的OLED封装方法的示意性流程框图。
图8是图7所示的OLED封装方法中的一个工艺操作示意图。
图9是图7所示的OLED封装方法中的另一个工艺操作示意图。
图10是图7所示的OLED封装方法中的又一个工艺操作示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例是本申请的一部分实施例，而不是全部实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都应属于本申请保护的范围。
如图1所示，本第一实施例的OLED封装结构10包括封装单元13和沉积有OLED器件12的柔性基板11。OLED器件12包括依次沉积在柔性基板11上的阳极120、发光层121和阴极122。本实施例中，出于简洁的目的，并未示出OLED器件12中的其他功能层。应理解，此并非是对本申请的限制。封装单元13设在OLED器件12之上，用于对OLED器件12进行封装。
其中，封装单元13包括依次层叠的第一封装层131、第一有机层132和第二封装层133。第一封装层131与第二封装层133均由无机材料制成。第一封装层131沉积在OLED器件12中的阴极122之上，第一有机层132沉积在第一封装层131之上，第二封装层133沉积在第一有机层132之上。柔性基板11上还分布有多个像素和像素限定层(图未示)，所述像素与所述像素限定层相邻交替排布。多个所述像素分布在图1中的A/A1(即A或A1)区域，多个所述像素限定层分布在图1中的B/B1(即B或B1)区域。而第一封装层131则包括第一像素区域A与第一像素限定区域B，第一像素区域A对应所述像素分布的区域，第一像素限定区域B对应所述像素限定层分布的区域。第一封装层131的膜厚为非均匀分布。具体为：第一像素区域A的膜厚大于第一像素限定区域B的膜厚，具有膜厚较大的第一像素区域A与膜厚较小的第一像素限定区域B相邻交替排布。且第一像素限定区域B的膜厚由第一像素限定区域B的边缘到第一像素限定区域B的内部逐渐减小，膜厚呈一梯度递减。对应的，第二封装层133包括第二像素区域A1与第二像素限定区域B1。第二像素区域A1与第一像素区域A对应，即第二像素区域A1也对应所述像素分布的区域；第二像素限定区域B1与第一像素限定区域B对应，即第二像素限定区域B1也对应所述像素限定层分布的区域。同样的，第二封装层133的膜厚也为非均匀分布，但与第一封装层131不同的是，第二像素区域A1的膜厚小于第二像素限定区域B1的膜厚，具有膜厚较小的第二像素区域A1与膜厚较大的第二像素限定区域B1相邻交替排布。且第二像素区域A1膜厚由第二像素区域A1的边缘到第二像素区域A1的内部逐渐减小，膜厚呈一梯度递减。如图1所示，第一封装层131上较厚的第一像素区域A对应第二封装层133上较薄的第二像素区域A1，而第一封装层131上较薄的第一像素限定区域B则对应第二封装层133的较厚的第二像素限定区域B1，以此形成上述 两个封装层上厚薄部分交错对应排布的结构。
此外，如图1所示，位于分布有像素的A/A1(A或A1)区域表面上覆盖有具有较大膜厚的第一封装层131，即像素区被第一封装层131的第一像素区域A覆盖。第一像素区域A完全覆盖其所对应的像素区，且第一像素区域A的面积大于该像素区的面积；此外第一像素区域A还覆盖部分位于像素限定层区域B/B1(即B或B1)内的阴极122，以确保像素区能有效隔离水氧。
可以理解的是，本申请实施例中，与第一像素区域A对应的柔性基板11上的像素区，可以由单个子像素(即单个OLED器件)所构成，也可以由多个子像素(即多个OLED器件)构成。
本实施例中，上述两个封装层中相应区域的膜厚呈梯度连续递减。反映到图1中，即为膜厚横截面上的一条边为由两段向中间凹陷的曲线。图1中示出的所述曲线为弧线。但实际上本申请并不限于此。可以根据需要设置膜厚的递减梯度，使所述曲线为其他形状。
本实施例中，通过在上述两个封装层中设置第一有机层132，形成了“夹心饼干”式的结构。由于第一有机层132具有柔性，能够缓冲、吸收和降低由无机材料制成的上述两个封装层的薄膜应力，从而减少了上述两个封装层发生破裂的风险。通过将第一封装层131与第二封装层133分别设置为膜厚较大的区域与膜厚较小的区域相邻交替排布的结构，相较第一封装层131与第二封装层133膜厚均一的方案(其内各区域薄膜应力基本一致)，能够使得第一封装层131与第二封装层133的薄膜应力从膜厚较大的区域到膜厚较小的区域逐渐减小，进一步降低了破裂出现的概率。再者，即使仍然发生了破裂，由于第一像素限定区域B的膜厚较小，破裂异常以及由此导致的膜层剥离现象也只会出现在第一像素限定区域B(此只会引发电容变化等细微改变)，而并不会扩散至第一像素区域A，从而避免了像素无法点亮等严重异常的发生。而且，具有较大膜厚的第一像素区域A可以有效阻挡水、氧的渗透，对像素区形成有效保护。另外，通过设置第二封装层132与第一封装层131的厚薄部分交错对应排布的结构，第二封装层133上的较厚部分恰好弥补第一封装层131上的较薄部分，从而起到补充第一封装层131阻隔水氧能力的作用。并且，第一有机层132还能够起到平坦化第一封装层131的作用，提升第二封装层133的沉积 质量。
图2示出了本申请第二实施例的OLED封装结构20，其包括封装单元23。如图2所示，在本申请第二实施例中，与上述第一实施例相同的是，封装单元23中的第一有机层232沉积在第一封装层231之上，第二封装层233沉积在第一有机层232之上；但与上述第一实施例不同的是，封装单元23还包括沉积在OLED器件12之上的无机层230，无机层230设于OLED器件12与第一封装层231之间。具体的，无机层230沉积在OLED器件12中的阴极122之上，无机层230设于阴极122与第一封装层231之间。本实施例中，设置无机层230是为了对OLED器件12进行防护，避免后续封装对OLED器件12造成损伤。可以采用各种工艺制备无机层230，例如，使用热蒸镀氟化锂(LiF)的方式。
图3示出了本申请第三实施例的OLED封装结构30，其包括封装单元33。如图3所示，在本申请第三实施例中，与上述第二实施例相同的是，封装单元33中的第一封装层331沉积在无机层330上，第一有机层332沉积在第一封装层331上，第二封装层333沉积在第一有机层332上。但与上述第二实施例不同的是，封装单元33还包括沉积在第二封装层333上的阻挡膜334。本实施例中，设置阻挡膜334是为了对整个封装结构进行结构防护。设置阻挡膜334的工艺包括但不限于贴合。
图4示出了本申请第四实施例的OLED封装结构40，其包括封装单元43。如图4所示，在本申请第四实施例中，与上述第二实施例相同的是，封装单元43中的第一封装层431沉积在无机层430上，第一有机层432沉积在第一封装层431上，第二封装层433沉积在第一有机层432上；但与上述第二实施例不同的是，封装单元43还包括沉积在第二封装层433上的第二有机层434，以及沉积在第二有机层434上的第三封装层435。其中，第三封装层435由无机材料制成。第三封装层435包括第三像素区域A2和第三像素限定区域B2，第三像素区域A2与第一像素区域A对应，即第三像素区域A2也对应所述像素分布的区域；第三像素限定区域B2与第一像素限定区域B对应，即第三像素限定区域B2也对应所述像素限定层分布的区域。同样的，第三封装层435的膜厚也为非均匀分布。具体为：第三像素区域A2的膜厚大于第三像素限定 区域B2的膜厚，具有膜厚较大的区域A2与膜厚较小的区B2相邻交替排布。且第三像素限定区域B2的膜厚由第三像素限定区域B2的边缘到第三像素限定区域B2的内部逐渐减小，膜厚呈一梯度递减。即第三封装层435上厚薄区域的分布，与第一封装层431上厚薄区域的分布一致、与第二封装层433上厚薄区域的分布对应。由此能够减小第三封装层435的薄膜应力，降低破裂及更严重异常发生的风险；同时起到补充第二封装层433阻隔水氧能力的作用。由于上文已经对此技术效果的原理做过详细描述，因而此处不再赘述。本实施例中，在上述第二实施例的基础上，额外叠加第二有机层434和第三封装层435，以形成“双层夹心饼干”式的封装结构，能够适用于对OLED器件的另一种封装需求。在其他实施例中，还可以根据需要，层叠沉积其他数量的有机层与封装层，实现“多层夹心饼干”式的封装结构；和/或，在其他实施例中，也可以不设置无机层430，而是将第一封装层431直接沉积在阴极122上。
图5示出了本申请第五实施例的OLED封装结构50，其包括封装单元53。如图4所示，在本申请第五实施例中，与上述第四实施例相同的是，封装单元53中的第一封装层531沉积在无机层530上，第一有机层532沉积在第一封装层531上，第二封装层533沉积在第一有机层532上，第二有机层534沉积在第二封装层533上，第三封装层535沉积在第二有机层534上。但与上述第四实施例不同的是，封装单元53还包括沉积在第三封装层535上的阻挡膜536。本实施例中，设置阻挡膜536是为了对整个封装结构进行结构防护。设置阻挡膜636的工艺包括但不限于贴合。
上述第一至第五实施例描述的都是两个封装层间设一有机层的“夹心饼干”式封装结构，其各个封装层均采用无机材料制成。图6示出了本申请第六实施例的OLED封装结构60，其包括封装单元63。如图6所示，在本实施例中，与上述各个实施例不同的是，封装单元63仅包括第一封装层631与第二封装层632两个封装层，且第一封装层631与第二封装层632均为杂化材料。所述杂化材料的材料性能居于有机材料和无机材料之间，使用此种材料制备的膜层，其抗破裂的性能得到提升，因此无需在第一封装层631与第二封装层632之间再设置有机层，即可减少各个封装层发生破裂的风险。进一步的，通过在第一封装层631与第二封装层632上设置厚薄区域交替相邻的结构，又能够进一步 减少各封装层的薄膜应力、降低破裂发生的概率，并补足第一封装层631阻隔水氧的能力。在其他实施例中，如上述各实施例所述，OLED封装结构还可以包括沉积在阴极122上的无机层和/或沉积在第二封装层632上的阻挡膜。
上述实施例描述的OLED封装结构，都是对整个柔性基板上的全部OLED器件，即一个封装单元封装全部OLED器件(即一个封装单元封装全部子像素)。
如上所述，在本申请实施例中，与第一像素区域A对应的柔性基板11上的像素区，可以由单个子像素(即单个OLED器件)所构成，也可以由多个子像素(即多个OLED器件)构成。在本申请第七实施例中，可以针对柔性基板上的部分OLED器件(即部分子像素)分别做封装，即封装单元可以仅封装单个或两个以上OLED器件(即一个或两个以上子像素)。本实施例中封装单元的结构与上述实施例所描述的相同。以单个或两个以上OLED器件为单元设置厚度非均匀的第一封装层131和第二封装层133，在卷曲器件的时候，与卷曲半径相比，由于每个小的膜厚非均匀无机层设置单元受到的变形极小，相当于把原先的整个封装单元切成很多个小的封装单元，使得无机层不容易发生剥离。从而此种方案通过调整封装工艺难度，能满足不同的封装需求。
以上结合图1-图6详细描述了本申请实施例的OLED封装结构，以下将结合图7-图描述本申请实施例的OLED封装方法。所述OLED封装方法用于制备所述OLED封装结构。
如图7所示，本申请第八实施例的OLED封装方法100包括：
S110，在柔性基板上沉积有OLED器件的一侧设置第一掩膜板，使所述第一掩膜板与所述柔性基板之间具有间距；其中，所述第一掩膜板包括透光部及遮光部，所述第一掩膜板的遮光部包括相对的第一端第二端，所述第一端的宽度小于所述第二端的宽度，将所述第一掩膜板的遮光部对应所述柔性基板上的像素限定层，所述第一掩膜板的透光部对应所述柔性基板上的像素，并将所述第一端朝向所述OLED器件，所述第二端背向所述OLED器件；
S120，通过所述第一掩膜板在所述OLED器件之上沉积无机材料以形成第一封装层，之后去除所述第一掩膜板；其中，所述第一封装层中形成与所述像素对应的第一像素区域，以及与所述像素限定层对应的第一像素限定区域， 所述第一像素区域的膜厚大于所述第一像素限定区域的膜厚，所述第一像素限定区域的膜厚由所述第一像素限定区域的边缘到内部逐渐减小；
S130，在所述第一封装层之上沉积第一有机层；
S140，在所述第一有机层之上设置第二掩膜板，使所述第二掩膜板与所述柔性基板的之间具有间距；其中，所述第二掩膜板包括遮光部与透光部，所述第二掩膜板的遮光部包括相对的第三端和第四端，所述第三端的宽度小于所述第四端的宽度，将所述第二掩膜板的遮光部对应所述柔性基板上的像素分布区域，所述第二掩膜板的透光部对应所述柔性基板上的像素限定层分布区域，并将所述第三端朝向所述第一有机层，所述第四端背向所述第一有机层；
S150，通过所述第二掩膜板在所述第一有机层之上沉积无机材料以形成第二封装层，之后去除所述第二掩膜板；其中，所述第二封装层中形成与所述第一像素区域对应的第二像素区域，以及与所述第一像素限定区域对应的第二像素限定区域，所述第二像素区域的膜厚小于所述第二像素限定区域的膜厚，所述第二像素区域的膜厚由所述第二像素区域的边缘到内部逐渐减小。
在S110中，具体如图8所示，柔性基板11上已沉积有OLED器件12，OLED器件12包括依次沉积在柔性基板11上的阳极120、发光层121和阴极122。柔性基板11上还分布有多个像素和多个像素限定层(图未示)，像素与像素限定层相邻交替排布。像素分布在图1中的A区域，像素限定层分布在图1中的B区域。本实施例中，出于简洁的目的，并未示出OLED器件12中的其他功能层。应理解，此并非是对本申请的限制。将第一掩膜板设置在柔性基板11上沉积有OLED器件12的一侧(即放置在阴极122之上)，且第一掩膜板与柔性基板11间具有间距。本实施例中，设置第一掩膜板与柔性基板11的间距为第一距离，第一距离的具体数值根据实际需要予以确定。第一掩膜板包括交替相邻排布的遮光部14和透光部15，封装材料将从透光部15处沉积到阴极122上。遮光部14包括相对的第一端141与第二端142，第一端141的宽度小于第二端142的宽度。即在图8所示的第一掩膜板的横截面视图中，沿水平方向第一端141的尺寸小于第二端142的尺寸，遮光部14呈“上大下小”的倒梯形。本实施例中，以遮光部14为所述倒梯形为例；在其他实施例中，在满足第一端宽度小于第二端的前提下，遮光部14可以为其他形状。第 一端141朝向OLED器件12(即朝向阴极122)，第二端142背向OLED器件12(即背向阴极122)，且遮光部14对应像素限定层放置(即对应B区域)、透光部15对应像素(即对应A区域)放置。
在S120中，具体如图9所示，将无机材料通过第一掩膜板沉积到OLED器件之上(即阴极122上)，以形成第一封装层131，并在之后去除第一掩膜板。由于第一掩膜板具有阴影效应(Shadow Effect)，即透光部15处沉积的膜厚较大，而遮光部14处沉积的膜厚较小，因此第一封装层131在对应像素的A区域膜厚较大，而在对应像素限定层的B区域膜厚较小。即第一封装层131形成第一像素区域A和第一像素限定区域B，第一像素区域A的膜厚大于第一像素限定区域B的膜厚。又因为遮光部14为“上大下小”的倒梯形，越靠近遮光部14的边缘无机材料的沉积量越多，而越靠近遮光部14的内部无机材料的沉积量越少，所以最终形成的第一像素限定层B膜厚呈现梯度渐变，从其边缘到内部逐渐减小。本实施例中，第一距离能够使第一像素限定区域B也能够沉积无机材料。否则，若令遮光部14完全贴附到阴极122上，则无机材料无法沉积到第一像素限定区域B中。本实施例中，第一距离的不同取值能够调节第一像素限定区域B的膜厚渐变梯度。当第一距离较大时，第一像素限定区域B的内部具有更大膜厚；当第一距离较小时，第一像素限定区域B的内部具有更小膜厚，以此来调节从第一像素限定区域B的边缘至内部的膜厚变化率。并且在一次沉积过程中，第一距离还可以为可变数值，以此来调节第一像素限定区域B内各个位置的膜厚，达到动态调整膜厚变化率的目的。
在S130中，如图10所示，在第一封装层131之上沉积第一有机层132。第一有机层132具有柔性，能够缓冲、吸收和降低由无机材料制成的第一封装层131的薄膜应力。第一有机层132还具有平坦化第一封装层131的作用，能够提升后续膜层的沉积质量。
在S140和S150中，如图10所示，将第二掩膜板设置在第一有机层132之上，使其与柔性基板11的间距为第二距离。其中，第二距离的具体数值根据实际需要予以确定，且第二距离大于第一距离。然后，通过第二掩膜板在第一有机层132上再沉积一层无机材料，形成第二封装层133。
其中，与第一掩膜板结构类似的是，第二掩膜板包括交替相邻排布的遮光 部24和透光部25，封装材料将从透光部25处沉积到第一有机层132上。遮光部24包括相对的第三端241与第四端242，第三端241的宽度小于第四端242的宽度。即在图10所示的第二掩膜板的横截面视图中，沿水平方向第三端241的尺寸小于第四端242的尺寸，遮光部24呈“上大下小”的倒梯形。本实施例中，以遮光部24为所述倒梯形为例；在其他实施例中，在满足第三端宽度小于第四端的前提下，遮光部24可以为其他形状。第三端241朝向第一有机层132，第四端242背向第一有机层132。但是，与第一掩膜板不同的是，遮光部24对应像素放置(即对应A1区域)、透光部25对应像素限定层(即对应B1区域)放置，即第二掩膜板与第一掩膜板的遮光部恰好错位。在实际工艺中，出于节省成本和提升工艺设备利用率等原因，可以将第一掩膜板平移以使其错开上次工艺位置，从而继续使用第一掩膜板沉积第二封装层133。即此时第二掩膜板指的就是错位布置后的第一掩膜板。当然，第一掩膜板与第二掩膜板也可以是不同的两个掩膜板。
由此，根据S120中描述的材料沉积原理，第二封装层133将形成第二像素区域A1和第二像素限定区域B1，第二像素区域A1的膜厚小于第二像素限定区域B1的膜厚；且第二像素区域A1膜厚呈现梯度渐变，从其边缘到内部逐渐减小。
本实施例中，第二距离的作用与第一距离相应。即第二距离能够使第二像素区域A1也能够沉积无机材料；第二距离的具体数值根据实际需要予以确定，其不同取值能够调节第二像素区域A1的膜厚渐变梯度。当第二距离较大时，第二像素区域A1的内部具有更大膜厚；当第二距离较小时，第二像素区域A1的内部具有更小膜厚，以此来调节从第二像素区域A1的边缘至内部的膜厚变化率。并且在一次沉积过程中，第二距离还可以为可变数值，以此来调节第二像素区域A1内各个位置的膜厚，达到动态调整膜厚变化率的目的。
由此，本实施例的OLED封装方法100，将第一掩膜板的遮光部14与第二掩膜板的遮光部24均设置为一端大一端小的形状，从而能够通过上述两个掩膜板分别形成膜厚较大区域与膜厚较小区域相邻交替排布的第一封装层131与第二封装层133。相较形成具有均一膜厚的第一封装层131与第二封装层133的方案(其内各区域薄膜应力基本一致)，本封装方法100能够使得第 一封装层131与第二封装层133的薄膜应力从膜厚较大的区域到膜厚较小的区域逐渐减小，降低了破裂出现的概率；通过将遮光部24错位遮光部14放置，能够形成第二封装层132与第一封装层131的厚薄部分交错对应排布的结构，使第二封装层133上的较厚部分恰好弥补第一封装层131上的较薄部分，从而使第二封装层133起到补充第一封装层131阻隔水氧能力的作用；并且，通过沉积具有柔性的第一有机层132，不但进一步缓冲、吸收和降低了第一封装层131与第二封装层133的薄膜应力，进一步减少了发生破裂的风险，而且还能够起到平坦化第一封装层131的作用，提升了第二封装层133的沉积质量。
进一步的，在本申请第九实施例中，与上述第八实施例不同的是，在上述步骤S150之后，所述OLED封装方法还包括：
在所述第二封装层上设置阻挡膜。设置阻挡膜是为了对整个封装结构进行结构防护。设置阻挡膜的方式包括但不限于贴合。
进一步的，在本申请第十实施例中，与上述第八实施例不同的是，在上述步骤S150之后，所述OLED封装方法还包括：
在所述第二封装层之上沉积第二有机层；
在所述第二有机层之上设置所述第一掩膜板，使所述第一掩膜板与所述柔性基板之间具有间距，将所述第一掩膜板的遮光部对应所述柔性基板上的像素限定层，所述第一掩膜板的透光部对应所述柔性基板上的像素，并将所述第一端朝向所述第二有机层，所述第二端背向所述第二有机层；
通过所述第一掩膜板在所述第二有机层之上沉积无机材料以形成第三封装层，之后去除所述第一掩膜板；其中，所述第三封装层中形成与所述第一像素区域对应的第三像素区域，以及与第一像素限定区域对应的第三像素限定区域，所述第三像素区域的膜厚大于所述第三像素限定区域的膜厚，所述第三像素限定区域的膜厚由所述第三像素限定区域的边缘到内部逐渐减小。
具体的，本实施例中，通过在原有的“夹心饼干”式OLED封装结构上，再次层叠沉积第二有机层和第三封装层，从而形成“双层夹心饼干”式OLED封装结构。其中，第二有机层的沉积过程与第一有机层相同。第三封装层的沉积则是通过第一掩膜板进行。即将第一掩膜板设置在距柔性基板为第三距离的位置，令第一掩膜板的第一端朝向第二有机层、第二端背向第二有机层，使第 一掩膜板的遮光部对应柔性基板上的像素限定层，第一掩膜板的透光部对应柔性基板上的像素，以此形成与第一封装层形状一致、仅仅是沉积位置不同的第三封装层。由于上述实施例已经对相应膜层的沉积过程做过详细描述，此处就不再赘述。本实施例中，第三距离大于第二距离和第一距离，第三距离的作用与第一距离或第二距离相应，此处也不再详述。本实施例的OLED封装方法形成的是“双层夹心饼干”式的封装结构，能够适用于对OLED器件的另一种封装需求。在其他实施例中，还可以根据需要，层叠沉积其他数量的有机层与封装层，实现“多层夹心饼干”式的封装结构。
进一步的，在本申请第十一实施例中，与上述第十实施例不同的是，在上述步骤“通过所述第一掩膜板在所述第二有机层之上沉积无机材料以形成第三封装层，之后去除所述第一掩膜板”之后，所述OLED封装方法还包括：
在所述第三封装层上设置阻挡膜。同样的，设置阻挡膜是为了对整个封装结构进行结构防护。设置阻挡膜的方式包括但不限于贴合。
进一步的，在本申请第十二实施例中，与上述第八或第十实施例不同的是，在上述步骤S110之前，所述OLED封装方法还包括：
在所述OLED器件之上沉积无机层，所述无机层设于所述OLED器件与所述第一封装层之间。本实施例中，设置无机层是为了对OLED器件进行防护，避免后续封装对OLED器件造成损伤。可以采用各种工艺制备无机层。例如，使用热蒸镀氟化锂(LiF)的方式。
上述第八至第十二实施例描述的OLED封装方法都用于形成两个封装层间设一有机层的“夹心饼干”式OLED封装结构，其中各个封装层均采用无机材料制成。与此不同的是，在本第十三实施例中，所述OLED封装方法包括：
在柔性基板上沉积有OLED器件的一侧放置第一掩膜板，使所述第一掩膜板与所述柔性基板之间具有间距；其中，所述第一掩膜板包括透光部及遮光部，所述第一掩膜板的遮光部包括相对的第一端第二端，所述第一端的宽度小于所述第二端的宽度，将所述第一掩膜板的遮光部对应所述柔性基板上的像素限定层，所述第一掩膜板的透光部对应所述柔性基板上的像素，并将所述第一端朝向所述OLED器件，所述第二端背向所述OLED器件；
通过所述第一掩膜板在所述OLED器件之上沉积杂化材料以形成第一封装层，之后去除所述第一掩膜板；其中，所述第一封装层中形成与所述像素对应的第一像素区域，以及与所述像素限定层对应的第一像素限定区域，所述第一像素区域的膜厚大于所述第一像素限定区域的膜厚，所述第一像素限定区域的膜厚由所述第一像素限定区域的边缘到内部逐渐减小；
在所述第一封装层之上设置第二掩膜板，使所述第二掩膜板与所述柔性基板的之间具有间距；其中，所述第二掩膜板包括遮光部与透光部，所述第二掩膜板的遮光部包括相对的第三端和第四端，所述第三端的宽度小于所述第四端的宽度，将所述第二掩膜板的遮光部对应所述柔性基板上的像素分布区域，所述第二掩膜板的透光部对应所述柔性基板上的像素限定层分布区域，并将所述第三端朝向所述第一封装层，所述第四端背向所述第一封装层；
通过所述第二掩膜板在所述第一封装层之上沉积杂化材料以形成第二封装层，之后去除所述第二掩膜板；其中，所述第二封装层中形成与所述第一像素区域对应的第二像素区域，以及与所述第一像素限定区域对应的第二像素限定区域，所述第二像素区域的膜厚小于所述第二像素限定区域的膜厚，所述第二像素区域的膜厚由所述第二像素区域的边缘到内部逐渐减小。
本实施例中，第一掩膜板与第二掩膜板的设置，以及第一封装层与第二封装层的沉积过程与上述第八至第十二实施例一致；但不同的是，本实施例中，第一封装层与第二封装层均为杂化材料，且未沉积第一有机层。所述杂化材料的材料性能居于有机材料和无机材料之间。使用此种材料制备的膜层，其抗破裂的性能得到提升，因此无需在第一封装层与第二封装层之间再设置第一有机层，即可减少各个封装层发生破裂的风险。由于上文已经对相应膜层的沉积过程做过详细描述，此处就不再赘述。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易的想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (13)

  1. 一种OLED封装结构，其中，
    包括封装单元和沉积有OLED器件的柔性基板；所述封装单元包括依次层叠于所述OLED器件之上的第一封装层、第一有机层和第二封装层，所述第一封装层与所述第二封装层均由无机材料制成；所述第一封装层包括第一像素区域与第一像素限定区域，所述第一像素区域的膜厚大于所述第一像素限定区域的膜厚，且所述第一像素限定区域的膜厚由所述第一像素限定区域的边缘到内部逐渐减小；所述第二封装层包括与所述第一像素区域对应的第二像素区域，以及与所述第一像素限定区域对应的第二像素限定区域，所述第二像素区域的膜厚小于所述第二像素限定区域的膜厚，且所述第二像素区域的膜厚由所述第二像素区域的边缘到内部逐渐减小。
  2. 根据权利要求1所述的OLED封装结构，其中，
    所述封装单元还包括依次层叠于所述第二封装层上的第二有机层和第三封装层，所述第三封装层由无机材料制成；所述第三封装层包括与所述第一像素区域对应的第三像素区域，以及与第一像素限定区域对应的第三像素限定区域，所述第三像素区域的膜厚大于所述第三像素限定区域的膜厚，且所述第三像素限定区域的膜厚由所述第三像素限定区域的边缘到内部逐渐减小。
  3. 根据权利要求1所述的OLED封装结构，其中，所述封装单元还包括设在所述OLED器件之上的无机层，所述无机层位于所述OLED器件与所述第一封装层之间。
  4. 根据权利要求2所述的OLED封装结构，其中，所述封装单元还包括设在所述OLED器件之上的无机层，所述无机层位于所述OLED器件与所述第一封装层之间。
  5. 根据权利要求1所述的OLED封装结构，其中，所述封装单元还包括设在所述第二封装层之上的阻挡膜。
  6. 根据权利要求1所述的OLED封装结构，其中，所述第一像素区域完全覆盖其所对应的像素区，且所述第一像素区域的面积大于所述像素区的面积，所述像素区内包括一个或两个以上所述OLED器件。
  7. 根据权利要求2所述的OLED封装结构，其中，所述第一像素区域完全覆盖其所对应的像素区，且所述第一像素区域的面积大于所述像素区的面积，所述像素区内包括一个或两个以上所述OLED器件。
  8. 一种OLED封装结构，其中，
    包括封装单元和沉积有OLED器件的柔性基板；所述封装单元包括依次层叠于所述OLED器件上的第一封装层和第二封装层，所述第一封装层与所述第二封装层均由杂化材料制成；所述第一封装层包括第一像素区域与第一像素限定区域，所述第一像素区域的膜厚大于所述第一像素限定区域的膜厚，且所述第一像素限定区域的膜厚由所述第一像素限定区域的边缘到内部逐渐减小；所述第二封装层包括与所述第一像素区域对应的第二像素区域，以及与第一像素限定区域对应的第二像素限定区域，所述第二像素区域的膜厚小于所述第二像素限定区域的膜厚，且所述第二像素区域的膜厚由所述第二像素区域的边缘到内部逐渐减小。
  9. 一种OLED封装方法，其中，包括：
    在柔性基板上沉积有OLED器件的一侧设置第一掩膜板，使所述第一掩膜板与所述柔性基板之间具有间距；其中，所述第一掩膜板包括透光部及遮光部，所述第一掩膜板的遮光部包括相对的第一端第二端，所述第一端的宽度小于所述第二端的宽度，将所述第一掩膜板的遮光部对应所述柔性基板上的像素限定层，所述第一掩膜板的透光部对应所述柔性基板上的像素，并将所述第一端朝向所述OLED器件，所述第二端背向所述OLED器件；
    通过所述第一掩膜板在所述OLED器件之上沉积无机材料以形成第一封装层，之后去除所述第一掩膜板；其中，所述第一封装层中形成与所述像素对应的第一像素区域，以及与所述像素限定层对应的第一像素限定区域，所述第一像素区域的膜厚大于所述第一像素限定区域的膜厚，所述第一像素限定区域的膜厚由所述第一像素限定区域的边缘到内部逐渐减小；
    在所述第一封装层之上沉积第一有机层；
    在所述第一有机层之上设置第二掩膜板，使所述第二掩膜板与所述柔性基板的之间具有间距；其中，所述第二掩膜板包括遮光部与透光部，所述第二掩膜板的遮光部包括相对的第三端和第四端，所述第三端的宽度小于所述第四端 的宽度，将所述第二掩膜板的遮光部对应所述柔性基板上的像素分布区域，所述第二掩膜板的透光部对应所述柔性基板上的像素限定层分布区域，并将所述第三端朝向所述第一有机层，所述第四端背向所述第一有机层；
    通过所述第二掩膜板在所述第一有机层之上沉积无机材料以形成第二封装层，之后去除所述第二掩膜板；其中，所述第二封装层中形成与所述第一像素区域对应的第二像素区域，以及与所述第一像素限定区域对应的第二像素限定区域，所述第二像素区域的膜厚小于所述第二像素限定区域的膜厚，所述第二像素区域的膜厚由所述第二像素区域的边缘到内部逐渐减小。
  10. 根据权利要求9所述的OLED封装方法，其中，还包括：
    在所述第二封装层之上沉积第二有机层；
    在所述第二有机层之上设置所述第一掩膜板，使所述第一掩膜板与所述柔性基板之间具有间距，将所述第一掩膜板的遮光部对应所述柔性基板上的像素限定层，所述第一掩膜板的透光部对应所述柔性基板上的像素，并将所述第一端朝向所述第二有机层，所述第二端背向所述第二有机层；
    通过所述第一掩膜板在所述第二有机层之上沉积无机材料以形成第三封装层，之后去除所述第一掩膜板；其中，所述第三封装层中形成与所述第一像素区域对应的第三像素区域，以及与第一像素限定区域对应的第三像素限定区域，所述第三像素区域的膜厚大于所述第三像素限定区域的膜厚，所述第三像素限定区域的膜厚由所述第三像素限定区域的边缘到内部逐渐减小。
  11. 根据权利要求9所述的OLED封装方法，其中，
    在步骤在柔性基板上沉积有OLED器件的一侧设置第一掩膜板之前，还包括：
    在所述OLED器件之上沉积无机层，所述无机层设于所述OLED器件与所述第一封装层之间。
  12. 根据权利要求10所述的OLED封装方法，其中，
    在步骤在柔性基板上沉积有OLED器件的一侧设置第一掩膜板之前，还包括：
    在所述OLED器件之上沉积无机层，所述无机层设于所述OLED器件与所述第一封装层之间。
  13. 一种OLED封装方法，其中，包括:
    在柔性基板上沉积有OLED器件的一侧设置第一掩膜板，使所述第一掩膜板与所述柔性基板之间具有间距；其中，所述第一掩膜板包括透光部及遮光部，所述第一掩膜板的遮光部包括相对的第一端第二端，所述第一端的宽度小于所述第二端的宽度，将所述第一掩膜板的遮光部对应所述柔性基板上的像素限定层，所述第一掩膜板的透光部对应所述柔性基板上的像素，并将所述第一端朝向所述OLED器件，所述第二端背向所述OLED器件；
    通过所述第一掩膜板在所述OLED器件之上沉积杂化材料以形成第一封装层，之后去除所述第一掩膜板；其中，所述第一封装层中形成与所述像素对应的第一像素区域，以及与所述像素限定层对应的第一像素限定区域，所述第一像素区域的膜厚大于所述第一像素限定区域的膜厚，所述第一像素限定区域的膜厚由所述第一像素限定区域的边缘到内部逐渐减小；
    在所述第一封装层之上设置第二掩膜板，使所述第二掩膜板与所述柔性基板的之间具有间距；其中，所述第二掩膜板包括遮光部与透光部，所述第二掩膜板的遮光部包括相对的第三端和第四端，所述第三端的宽度小于所述第四端的宽度，将所述第二掩膜板的遮光部对应所述柔性基板上的像素分布区域，所述第二掩膜板的透光部对应所述柔性基板上的像素限定层分布区域，并将所述第三端朝向所述第一封装层，所述第四端背向所述第一封装层；
    通过所述第二掩膜板在所述第一封装层之上沉积杂化材料以形成第二封装层，之后去除所述第二掩膜板；其中，所述第二封装层中形成与所述第一像素区域对应的第二像素区域，以及与所述第一像素限定区域对应的第二像素限定区域，所述第二像素区域的膜厚小于所述第二像素限定区域的膜厚，所述第二像素区域的膜厚由所述第二像素区域的边缘到内部逐渐减小。
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