WO2018058925A1 - 激光喷焊嘴、喷焊装置及方法 - Google Patents

激光喷焊嘴、喷焊装置及方法 Download PDF

Info

Publication number
WO2018058925A1
WO2018058925A1 PCT/CN2017/078816 CN2017078816W WO2018058925A1 WO 2018058925 A1 WO2018058925 A1 WO 2018058925A1 CN 2017078816 W CN2017078816 W CN 2017078816W WO 2018058925 A1 WO2018058925 A1 WO 2018058925A1
Authority
WO
WIPO (PCT)
Prior art keywords
nozzle
solder ball
laser
spray
soldering
Prior art date
Application number
PCT/CN2017/078816
Other languages
English (en)
French (fr)
Inventor
檀正东
王海英
周旋
Original Assignee
深圳市艾贝特电子科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市艾贝特电子科技有限公司 filed Critical 深圳市艾贝特电子科技有限公司
Publication of WO2018058925A1 publication Critical patent/WO2018058925A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle

Definitions

  • the present invention relates to the field of laser spray welding technology, and in particular, to a laser spray tip, a spray welding device and a method.
  • a solder ball is automatically placed in the nozzle before the welding, the solder ball just blocks the nozzle mouth, and then a protective gas is injected into the sealing cavity formed by the solder ball and the nozzle, when sealing After the gas pressure in the chamber reaches the set value, the laser is controlled to emit laser light to the solder ball.
  • the pressure generated by the protective gas causes the molten high-temperature solder to be instantaneously sprayed to the position where welding is required to achieve welding.
  • the main technical problem to be solved by the present invention is to provide a laser spray tip, a spray welding device and a method, and the laser spray tip, spray welding device and method can prevent the solder melted by the laser spray soldering from remaining on the nozzle The phenomenon of nozzle clogging caused by residue improves the efficiency of laser welding.
  • the present invention provides a laser spray tip, which includes a spray tip body provided with a cavity, and the spray tip body is provided with a gas supply port communicating with the cavity.
  • the tin hole and the nozzle are matched, and the nozzle cooperates with the solder ball to make the solder ball automatically land.
  • the gap between the solder ball and the nozzle is 0.1-0.5 MM.
  • the length of the nozzle is a distance from which the solder ball moves freely from heating to melting.
  • the air supply port is located in the nozzle.
  • the present invention also provides a laser spray welding device, including a laser, a spray tip, a pressure supply mechanism, and a tin feeding mechanism connected to the spray tip, and a tin-feeding mechanism and a pressure supply mechanism.
  • a spray welding controller working with a laser, the spray tip comprising a tip body provided with a cavity, the tip body being provided with a gas supply port, a tin feeding hole and a nozzle communicating with the cavity, the gas supply port
  • the soldering mechanism is connected to the feeding mechanism, and the soldering nozzle is matched with the solder ball to make the solder ball automatically land to move.
  • the gap between the solder ball and the nozzle is 0.1-0.5 MM.
  • the length of the nozzle is a distance from which the solder ball moves freely from heating to melting.
  • the air supply port is located in the nozzle.
  • the laser welding apparatus further includes a temperature collector coupled to the spray welding controller signal.
  • the temperature collector includes an infrared temperature sensor.
  • the pressure gas is an inert gas.
  • the laser welding apparatus further includes a position sensor that is coupled to the spray welding controller to detect the solder ball, and the position sensor is located at the inlet of the nozzle.
  • the present invention also provides a laser spray welding method, the laser welding method includes: first placing a solder ball in the nozzle, when the solder ball is located at the entrance of the nozzle, the laser starts to heat the solder ball, when the solder The ball A is heated to melt, and a pressurized gas is sprayed toward the molten solder ball A to eject the molten solder ball from the exit of the nozzle to the solder joint.
  • the laser nozzle of the present invention comprises a nozzle body provided with a cavity, and the nozzle body is provided with a gas supply port, a tin feeding hole and a nozzle communicating with the cavity, and the nozzle is separated from the solder ball. Cooperate to make the solder ball automatically land. Use the solder ball to move freely in the nozzle. When it is in a molten state, avoid the solder from remaining in contact with the nozzle and reduce nozzle clogging.
  • the laser welding device of the nozzle is used to provide power to the solder after the solder ball is melted and a certain pressure gas generated by the pressure supply mechanism, and the pressure gas is an inert gas, which can protect the solder.
  • solder ball can move freely in the nozzle, there is a gap between the solder ball and the nozzle wall.
  • the pressure gas presses the solder ball, part of the gas The body is discharged from the gap, so that the solder ball and the nozzle wall form a protective gas film, which can prevent the solder from remaining on the nozzle.
  • FIG. 1 is a schematic cross-sectional structural view of an embodiment of a laser torch tip.
  • FIG. 2 is a schematic cross-sectional structural view of an embodiment of a laser welding apparatus.
  • FIG. 3 is a cross-sectional structural view of a laser gas welding device for a pressurized gas gas.
  • the present invention provides an embodiment of a laser spray tip.
  • the laser nozzle includes: a nozzle body 1 provided with a cavity 10, the nozzle body 1 is provided with a gas supply port 13, a tin feeding hole 11 and a nozzle 12 communicating with the cavity 10, The solder ball and the nozzle are in a clearance fit, so that the solder ball automatically moves to the ground.
  • the diameter of the solder ball for soldering is smaller than the diameter of the nozzle 12, and the solder ball can move freely in the nozzle 12, in order to ensure that a pressure gas is applied to the nozzle 12 or the cavity 10, the solder can be soldered.
  • the ball is powered, and the solder ball is in a clearance fit with the nozzle 12, the gap being 0.1-0.5 MM.
  • the pressure of the pressurized gas and the length of the nozzle can be determined. Less can guarantee that the solder ball can be melted by the laser when it is free to fall, so the length of the nozzle can be set as the distance from which the solder ball moves freely from heating to melting.
  • solder ball can freely move in the nozzle, and does not come into contact with the nozzle 11. When it is in a molten state, the solder is prevented from remaining on the nozzle, thereby reducing nozzle clogging and improving the efficiency of laser welding.
  • the gas supply port 13 is located in the nozzle. In order to ensure the precision of the laser heating solder ball, the gas supply port 13 is preferably located at a position where the laser just melts the solder ball.
  • the present invention also provides a laser spray welding device embodiment.
  • the laser welding apparatus comprises: a laser 2, a spray tip 1, a pressure supply mechanism 4, and a tin feeding mechanism 3 connected to the spray tip, and a tin-feeding mechanism 3, a pressure supply mechanism 4, and a laser 2
  • the spray welding controller (not shown in the drawing)
  • the spray tip 1 includes a tip body provided with a cavity 10, and the tip body is provided with a gas supply port 13 and a tin supply hole 11 communicating with the cavity 10.
  • the nozzle 12 the air supply port 13 is connected to the pressure supply mechanism 4, the soldering mechanism 3 is connected to the tin supply hole 11, and the solder ball A and the nozzle are gap-fitted to automatically move the solder ball.
  • the pressure supply mechanism 4 refers to a gas which can supply a certain pressure, and supplies power to the solder ball A which is melted by the light, so that it can be ejected to the welding position.
  • the gas can be inert and protects the molten solder balls.
  • the gap between the solder ball A and the nozzle is 0.1-0.5 MM, which can ensure that the pressure gas ⁇ provides a certain power to the solder ball A, and the same pressure gas is released through the gap, so that the solder is formed between the nozzle and the nozzle.
  • the protective gas film formed by the pressure gas can avoid the contact between the molten solder ball A and the nozzle, and avoid the residual phenomenon of the solder ball which is melted by the solder during the spray welding process.
  • the soldering mechanism 3 is used to feed the solder balls A into the cavity 10 one by one, and the cavity is funnel-shaped, and the solder balls A can enter the nozzle 12.
  • the spray welding controller is used to coordinate the operation of the laser 2, the pressure supply mechanism 4 and the feeding mechanism 3, that is, when the soldering mechanism 3 feeds the solder ball A into the cavity, the spray welding controller controls the laser 2 to work, and emits a laser pair.
  • the solder ball A is heated, and when the solder ball A is heated and melted, the pressure supply mechanism 4 is controlled to release a gas of a certain pressure, so that the molten solder ball A is accelerated to be sprayed toward the solder joint.
  • the pressure of the gas supplied from the pressure supply mechanism 4 is not limited, and it can be determined according to the requirements of the spray welding.
  • the length of the nozzle 12 can be determined by a limited test and calculation, and the pressure and pressure of the pressurized gas can be determined.
  • the length of the nozzle, the length of the nozzle 12 can at least ensure that the solder ball can be melted by the laser when it is free to fall, so the length of the nozzle can be set as the distance from which the solder ball moves freely from heating to melting.
  • the use of the solder ball can freely move in the nozzle, and does not come into contact with the nozzle. When it is in a molten state, the solder is prevented from sticking to the tin at the exit of the nozzle, the nozzle clogging phenomenon is reduced, and the laser spray welding efficiency is improved.
  • the laser welding device of the nozzle is used to supply a certain pressure gas generated by the pressure supply mechanism after the solder ball is melted, and the pressure gas is an inert gas, which can protect the solder. Since the solder ball can move freely in the nozzle, there is a gap between the solder ball and the nozzle wall. When the pressure gas presses the solder ball, part of the gas is discharged from the gap, so that the solder ball forms a protective gas with the nozzle wall. The film prevents the solder from remaining on the nozzle.
  • the gas supply port 13 is located in the nozzle.
  • the gas supply port 13 is preferably located at a position where the laser just melts the solder ball. Reduce the amount of gas used by the pressurized gas.
  • the laser welding apparatus further includes a temperature collector coupled to the spray welding controller signal, the temperature collector including an infrared temperature sensor.
  • the laser welding apparatus further includes a position sensor that is coupled to the spray welding controller signal to detect the solder ball, the position sensor being located at the inlet of the nozzle 12.
  • the sensor detects the solder ball A ⁇ , and the spray welding controller controls the laser 2 to emit laser light, which not only saves energy but also improves the accuracy of solder ball A heating.
  • the present invention also provides a laser spray welding method, the laser welding method includes: first placing the solder ball A in the spray tip, when the solder ball A is located at the entrance of the nozzle 12, the laser starts to the solder ball A Heating, when the solder ball A is heated and melted, a pressurized gas is sprayed toward the molten solder ball A, so that the molten solder ball is ejected from the exit of the nozzle to the solder joint.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laser Beam Processing (AREA)

Abstract

一种激光喷焊嘴及喷焊装置，其中激光喷焊嘴包括设有空腔（10）的喷焊嘴本体（1），该喷焊嘴本体（1）设有与喷焊嘴空腔（10）连通的供气口（13）、送锡孔（11）和喷嘴（12）。所述激光喷焊装置包括激光器（2）、喷焊嘴、供压机构（4）和与喷焊嘴连接的送锡机构（3），以及调协送锡机构、供压机构和激光器工作的喷焊控制器，该焊嘴本体（1）设有与空腔连通的供气口（13）、送锡孔（11）和喷嘴（12），所述供气口（13）与供压机构（4）连接，所述送锡机构（3）与送锡孔（11）连接。所述激光喷焊装置的喷焊方法包括：先将焊锡球A放置在喷焊嘴内，当焊锡球A位于喷嘴（12）的入口时激光开始对焊锡球A加热，当焊锡球A加热熔化时向熔化的焊锡球A喷射压力气体，使熔化的焊锡球从喷嘴（12）的出口向焊接点喷射。所述激光喷焊嘴工作时焊锡球在喷嘴内作自由落体运动，避免焊锡球熔化后熔化的焊锡与喷嘴接触而残留，减少喷嘴堵塞现象。

Description

激光喷焊嘴、 喷焊装置及方法
技术领域
[0001] 本发明涉及激光喷焊技术领域， 尤其涉及一种激光喷焊嘴、 喷焊装置及方法。
背景技术
[0002] 现有的激光喷焊装置， 喷焊前自动向喷嘴内放置焊锡球， 该焊锡球恰好堵住喷 嘴口， 再向由焊锡球与喷嘴配合形成的密封腔内注入保护气体， 当密封腔内气 压达到设定值后， 控制激光器发出激光照射焊锡球， 当焊锡球熔化吋， 保护气 体产生的压力使得熔化的高温焊锡瞬间喷射到需要焊接的位置， 实现焊接。 该 结构虽然可以实现激光喷焊焊接， 但由于在激光未照射焊锡球吋， 该焊锡球恰 好能与喷嘴形成紧密接触， 当激光对焊锡球加热熔化吋容易与喷嘴连接， 在喷 嘴上留有残留， 一方面吋间长了造成喷嘴堵塞， 另一方面减少了每次喷锡量， 影响喷焊效率。
技术问题
[0003] 本发明主要解决的技术问题是提供一种激光喷焊嘴、 喷焊装置及方法， 该激光 喷焊嘴、 喷焊装置及方法可以避免激光喷焊吋熔化的焊锡在喷嘴上留有残留导 致的喷嘴堵塞现象， 提高激光喷焊效率。
问题的解决方案
技术解决方案
[0004] 为了解决上述技术问题， 本发明提供一种激光喷焊嘴， 该激光喷焊嘴包括设有 空腔的喷焊嘴本体， 该喷焊嘴本体设有与空腔连通的供气口、 送锡孔和喷嘴， 该喷嘴与焊锡球间隙配合， 使焊锡球自动落地运动。
[0005] 进一步地说， 所述焊锡球与喷嘴之间的间隙为 0.1-0.5MM。
[0006] 进一步地说， 所述喷嘴的长度为焊锡球从加热至熔化吋间内自由下落运动距离
[0007] 进一步地说， 所述供气口位于喷嘴内。
[0008] [0009] 本发明还提供一种激光喷焊装置， 该激光喷焊装置包括激光器、 喷焊嘴、 供压 机构和与喷焊嘴连接的送锡机构， 以及调协送锡机构、 供压机构和激光器工作 的喷焊控制器， 所述喷焊嘴包括设有空腔的焊嘴本体， 该焊嘴本体设有与空腔 连通的供气口、 送锡孔和喷嘴， 所述供气口与供压机构连接， 所述送锡机构与 送锡孔连接， 该焊喷嘴与焊锡球为间隙配合， 使焊锡球自动落地运动。
[0010] 进一步地说， 所述焊锡球与喷嘴之间的间隙为 0.1-0.5MM。
[0011] 进一步地说， 所述喷嘴的长度为焊锡球从加热至熔化吋间内自由下落运动距离 [0012] 进一步地说， 所述供气口位于喷嘴内。
[0013] 进一步地说， 所述激光喷焊装置还包括与喷焊控制器信号连接的温度采集器。
[0014] 进一步地说， 所述温度采集器包括红外温度传感器。
[0015] 进一步地说， 所述压力气体为惰性气体。
[0016] 进一步地说， 所述激光喷焊装置还包括与喷焊控制器信号连接检测焊锡球的位 置传感器， 该位置传感器位于喷嘴的入口。
[0017]
[0018] 本发明还提供一种激光喷焊方法， 该激光喷焊方法包括， 先将焊锡球放置在喷 焊嘴内， 当焊锡球位于喷嘴的入口吋激光幵始对焊锡球加热， 当焊锡球 A加热熔 化吋向熔化的焊锡球 A喷射压力气体， 使熔化的焊锡球从喷嘴的出口向焊接点喷 射。
发明的有益效果
有益效果
[0019] 本发明激光喷焊嘴， 包括设有空腔的喷焊嘴本体， 该喷焊嘴本体设有与空腔连 通的供气口、 送锡孔和喷嘴， 该喷嘴与焊锡球为间隙配合， 使焊锡球自动落地 运动。 使用吋焊锡球在喷嘴内自由落体运动， 当其熔化状态吋， 避免焊锡与喷 嘴接触而残留， 减少喷嘴堵塞现象。 同吋采用所述喷焊嘴的激光喷焊装置， 在 焊锡球熔化吋由供压机构产生的一定压力气体， 给焊锡提供动力， 该压力气体 为惰性气体， 可以对焊锡起到保护。 同吋由于焊锡球可以在喷嘴内自由落体运 动， 该焊锡球与喷嘴壁之间存在间隙， 当压力气体对焊锡球施压吋， 部分的气 体从间隙排出， 使得焊锡球与喷嘴壁形成保护气膜， 可以避免焊锡在喷嘴上残 留。
对附图的简要说明
附图说明
[0020] 为了更清楚地说明本发明实施例或现有技术中的技术方案， 下面将对实施例或 现有技术描述中所需要使用的附图作简单介绍， 显而易见地， 而描述中的附图 是本发明的一些实施例， 对于本领域普通技术人员来说， 在不付出创造性劳动 的前提下， 还可以根据这些附图获得其他附图。
[0021] 图 1是激光喷焊嘴实施例剖视结构示意图。
[0022] 图 2是激光喷焊装置实施例剖视结构示意图。
[0023] 图 3是激光喷焊装置供压力气体吋实施例剖视结构意图。
[0024] 下面结合实施例， 并参照附图， 对本发明目的的实现、 功能特点及优点作进一 步说明。
实施该发明的最佳实施例
本发明的最佳实施方式
[0025] 为了使发明的目的、 技术方案和优点更加清楚， 下面将结合本发明实施例中的 附图， 对本发明实施例中的技术方案进行清楚、 完整地描述， 显然， 所描述的 实施例是发明一部分实施例， 而不是全部的实施例。 基于本发明中的实施例， 本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例 ， 都属于本发明保护的范围。
[0026] 如图 1所示， 本发明提供一种激光喷焊嘴实施例。
[0027] 该激光喷焊嘴包括： 设有空腔 10的喷焊嘴本体 1， 该喷焊嘴本体 1设有与空腔 10 连通的供气口 13、 送锡孔 11和喷嘴 12， 所述焊锡球与喷嘴为间隙配合， 使焊锡 球自动落地运动。
[0028] 具体地说， 用于焊接的焊锡球直径小于所述喷嘴 12的直径， 该焊锡球可以在喷 嘴 12自由落体运动， 为了保证向喷嘴 12或空腔 10内施加压力气体吋可以为焊锡 球提供动力， 所述焊锡球与喷嘴 12之间为间隙配合， 该间隙为 0.1-0.5MM。 通过 有限的试验和计算， 可以确定压力气体的压力和喷嘴的长度， 该喷嘴的长度至 少可以保证在焊锡球自由下落吋能够被激光器所熔化， 因此可以将喷嘴的长度 设为焊锡球从加热至熔化吋间内自由下落运动距离。
[0029] 使用吋焊锡球能在喷嘴内自由落体运动， 不会与喷嘴 11发生接触， 当其熔化状 态吋， 避免焊锡在喷嘴上残留， 从而减少喷嘴堵塞现象， 提高激光喷焊效率。
[0030] 在本实施例中， 所述供气口 13位于喷嘴内， 为了保证激光加热焊锡球吋间控制 精度， 该供气口 13最好位于激光恰好能使焊锡球熔化位置。
[0031]
[0032] 如图 2所示， 本发明还提供一种激光喷焊装置实施例.
[0033] 该激光喷焊装置包括： 激光器 2、 喷焊嘴 1、 供压机构 4和与喷焊嘴连接的送锡 机构 3， 以及调协送锡机构 3、 供压机构 4和激光器 2工作的喷焊控制器 （附图未 标示） ， 所述喷焊嘴 1包括设有空腔 10的焊嘴本体， 该焊嘴本体设有与空腔 10连 通的供气口 13、 送锡孔 11和喷嘴 12， 所述供气口 13与供压机构 4连接， 所述送锡 机构 3与送锡孔 11连接， 所述焊锡球 A与喷嘴为间隙配合， 使焊锡球自动落地运 动。
[0034] 具体地说， 所述供压机构 4是指可以提供一定压力的气体， 为通过光光熔化的 焊锡球 A提供动力， 使其能喷射到焊接位置。 该气体可以采用惰性气体， 可以对 熔化的焊锡球起到保护作用。 所述焊锡球 A与喷嘴之间的间隙为 0.1-0.5MM, 这 样可以保证施加压力气体吋对焊锡球 A提供一定的动力， 同吋压力气体通过间隙 少量释放， 使得焊锡与喷嘴之间形成由压力气体形成的保护气膜， 可以避免熔 化的焊锡球 A与喷嘴之间接触， 避免在喷焊过程中焊锡熔化的焊锡球在喷嘴上有 残留现象出现。
[0035] 所述送锡机构 3用于将焊锡球 A逐一送至空腔 10内， 由空腔呈漏斗状， 焊锡球 A 都能进入喷嘴 12。 所述喷焊控制器用于协调激光器 2、 供压机构 4和送锡机构 3工 作， 即当送锡机构 3将焊锡球 A送入空腔后， 喷焊控制器控制激光器 2工作， 发出 激光对焊锡球 A加热， 当焊锡球 A加热熔化吋， 控制供压机构 4释放一定压力的气 体， 使熔化的焊锡球 A加速向焊接点喷射。 所述供压机构 4提供的气体压力大小 不作限定， 其可以根据喷焊要求来确定。
[0036] 所述喷嘴 12的长度可以通过有限的试验和计算， 可以确定压力气体的压力和喷 嘴的长度， 该喷嘴 12的长度至少可以保证在焊锡球自由下落吋能够被激光器所 熔化， 因此可以将喷嘴的长度设为焊锡球从加热至熔化吋间内自由下落运动距 离。
[0037] 使用吋焊锡球能在喷嘴内自由落体运动， 不会与喷嘴发生接触， 当其熔化状态 吋， 避免焊锡在喷嘴的出口处出现粘锡， 减少喷嘴堵塞现象， 提高激光喷焊效 率。 同吋采用所述喷焊嘴的激光喷焊装置， 在焊锡球熔化吋由供压机构产生的 一定压力气体， 给焊锡提供动力， 该压力气体为惰性气体， 可以对焊锡起到保 护。 同吋由于焊锡球可以在喷嘴内自由落体运动， 该焊锡球与喷嘴壁之间存在 间隙， 当压力气体对焊锡球施压吋， 部分的气体从间隙排出， 使得焊锡球与喷 嘴壁形成保护气膜， 可以避免焊锡在喷嘴上残留。
[0038] 在本实施例中， 所述供气口 13位于喷嘴内， 为了保证激光加热焊锡球吋间控制 精度， 该供气口 13最好位于激光恰好能使焊锡球熔化位置， 这样还可以减少压 力气体的用气量。
[0039] 为了保证， 对激光焊接温度的实吋监控， 避免损坏焊接材料， 所述激光喷焊装 置还包括与喷焊控制器信号连接的温度采集器， 该温度采集器包括红外温度传 感器。
[0040] 为了更为精准地控制激光加热， 所述激光喷焊装置还包括与喷焊控制器信号连 接检测焊锡球的位置传感器， 该位置传感器位于喷嘴 12的入口。 工作吋当位置 传感器检测到焊锡球 A吋， 喷焊控制器控制激光器 2发出激光， 既可以节约能耗 ， 又可以提高对焊锡球 A加热的精准性。
[0041] 本发明还提供一种激光喷焊方法， 该激光喷焊方法包括， 先将焊锡球 A放置在 喷焊嘴内， 当焊锡球 A位于喷嘴 12的入口吋激光幵始对焊锡球 A加热， 当焊锡球 A加热熔化吋向熔化的焊锡球 A喷射压力气体， 使熔化的焊锡球从喷嘴的出口向 焊接点喷射。
[0042]
[0043] 以上实施例仅用以说明本发明的技术方案， 而非对其限制； 尽管参照前述实施 例对本发明进行了详细的说明， 本领域的普通技术人员应当理解： 其依然可以 对前述各实施例所记载的技术方案进行修改， 或者对其中部分技术特征进行等 同替换， 而这些修改或替换， 并不使相应技术方案的本质脱离本发明各实施例 技术方案的精神和范围。

Claims

权利要求书
[权利要求 1] 激光喷焊嘴， 包括设有空腔的喷焊嘴本体， 该喷焊嘴本体设有与空腔 连通的供气口、 送锡孔和喷嘴， 其特征在于， 该喷嘴与焊锡球间隙配 合， 使焊锡球自动落地运动。
[权利要求 2] 根据权利要求 1所述的激光喷焊嘴， 其特征在于： 所述焊锡球与喷嘴 的间隙为 0.1-0.5MM。
[权利要求 3] 根据权利要求 1或 2所述的激光喷焊嘴， 其特征在于： 所述喷嘴的长度 为焊锡球从加热至熔化吋间内自由下落运动距离。
[权利要求 4] 激光喷焊装置， 包括激光器、 喷焊嘴、 供压机构和与喷焊嘴连接的送 锡机构， 以及调协送锡机构、 供压机构和激光器工作的喷焊控制器， 所述喷焊嘴包括设有空腔的焊嘴本体， 该焊嘴本体设有与空腔连通的 供气口、 送锡孔和喷嘴， 所述供气口与供压机构连接， 所述送锡机构 与送锡孔连接， 其特征在于： 该喷嘴与焊锡球间隙配合， 使焊锡球自 动落地运动。
[权利要求 5] 根据权利要求 4所述的激光喷焊装置， 其特征在于： 所述焊锡球与喷 嘴的间隙为 0.1-0.5MM。
[权利要求 6] 根据权利要求 4或 5所述的激光喷焊装置， 其特征在于： 所述喷嘴的长 度为焊锡球从加热至熔化吋间内自由下落运动距离。
[权利要求 7] 根据权利要求 4所述的激光喷焊装置， 其特征在于： 所述供气口位于 喷嘴内。
[权利要求 8] 根据权利要求 4所述的激光喷焊装置， 其特征在于： 所述激光喷焊装 置还包括与喷焊控制器信号连接的温度采集器。
[权利要求 9] 根据权利要求 4所述的激光喷焊装置， 其特征在于： 所述激光喷焊装 置还包括与喷焊控制器信号连接检测焊锡球的位置传感器， 该位置传 感器位于喷嘴的入口。
[权利要求 10] 激光喷焊方法， 包括先将焊锡球放置在喷焊嘴内， 当焊锡球位于喷嘴 的入口吋激光幵始对焊锡球加热， 当焊锡球 A加热熔化吋向熔化的焊 锡球 A喷射压力气体， 使熔化的焊锡球从喷嘴的出口向焊接点喷射。
PCT/CN2017/078816 2016-09-29 2017-03-30 激光喷焊嘴、喷焊装置及方法 WO2018058925A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610872417.6A CN106271062B (zh) 2016-09-29 2016-09-29 激光喷焊嘴、喷焊装置及方法
CN201610872417.6 2016-09-29

Publications (1)

Publication Number Publication Date
WO2018058925A1 true WO2018058925A1 (zh) 2018-04-05

Family

ID=57716580

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/078816 WO2018058925A1 (zh) 2016-09-29 2017-03-30 激光喷焊嘴、喷焊装置及方法

Country Status (2)

Country Link
CN (1) CN106271062B (zh)
WO (1) WO2018058925A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112091346A (zh) * 2020-09-07 2020-12-18 昆山联滔电子有限公司 一种激光喷射焊球的焊接方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106271062B (zh) * 2016-09-29 2020-01-31 深圳市艾贝特电子科技有限公司 激光喷焊嘴、喷焊装置及方法
CN107570829A (zh) * 2017-10-20 2018-01-12 东莞市卓安精机自动化设备有限公司 一种用于精密细微焊接区域的锡球焊接结构及方法
JP7038004B2 (ja) * 2018-05-24 2022-03-17 本田技研工業株式会社 光学部品の洗浄方法及び洗浄装置
CN109396585B (zh) * 2018-12-10 2022-12-23 深圳市艾贝特电子科技有限公司 一种电机换向器激光焊接装置及方法
CN109365937B (zh) * 2018-12-10 2023-01-20 深圳市艾贝特电子科技有限公司 一种电机换向器与压敏电阻激光焊接装置及方法
DE102020109226A1 (de) * 2020-04-02 2021-10-07 Tdk Electronics Ag Elektrische Lotverbindung, Sensor mit einer Lotverbindung und Verfahren zur Herstellung
CN112620861A (zh) * 2020-12-17 2021-04-09 珠海冠宇电池股份有限公司 一种电池注液孔焊接的方法及装置
CN115178906B (zh) * 2022-09-14 2022-12-30 深圳市艾贝特电子科技有限公司 一种激光焊机及其上料机构

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004288350A (ja) * 2003-03-03 2004-10-14 Shinka Jitsugyo Kk 磁気ヘッド装置の製造方法及び製造装置、並びに磁気ヘッド装置
CN1897118A (zh) * 2005-07-12 2007-01-17 阿尔卑斯电气株式会社 磁头组件的金属球接合方法
US20070075056A1 (en) * 2005-09-30 2007-04-05 Sae Magnetics (H.K.) Ltd. Soldering device and method for forming electrical solder connections in a disk drive unit
CN101038986A (zh) * 2006-03-16 2007-09-19 Tdk株式会社 接合装置以及用于该接合装置的喷嘴单元
CN101722343A (zh) * 2008-10-10 2010-06-09 日立环球储存科技荷兰有限公司 磁头万向架组件的连接焊盘互连装置和该组件制造方法
US20130256281A1 (en) * 2012-03-30 2013-10-03 Tatsumi Tsuchiya Solder-jet nozzle, laser-soldering tool, and method, for lasersoldering head-connection pads of a head-stack assembly for a hard-disk drive
CN103817438A (zh) * 2014-03-07 2014-05-28 深圳市大族激光科技股份有限公司 一种锡球焊接装置及方法
CN106271062A (zh) * 2016-09-29 2017-01-04 深圳市艾贝特电子科技有限公司 激光喷焊嘴、喷焊装置及方法
CN206084135U (zh) * 2016-09-29 2017-04-12 深圳市艾贝特电子科技有限公司 激光喷焊嘴和喷焊装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10132567B4 (de) * 2001-07-10 2005-03-31 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorrichtung zum Aufbringen eines Lötmittels auf ein Substrat
JP4453969B2 (ja) * 2004-09-24 2010-04-21 Ｔｄｋ株式会社 半田ボールの接合方法および接合装置
CN100522442C (zh) * 2005-03-30 2009-08-05 Tdk株式会社 钎焊方法，钎焊设备，接合方法，及接合设备
JP4042914B2 (ja) * 2005-04-22 2008-02-06 Ｔｄｋ株式会社 半田付け装置及び半田分配装置
CN105108264B (zh) * 2015-09-23 2017-03-15 武汉凌云光电科技有限责任公司 一种用于激光锡焊的锡球泵头

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004288350A (ja) * 2003-03-03 2004-10-14 Shinka Jitsugyo Kk 磁気ヘッド装置の製造方法及び製造装置、並びに磁気ヘッド装置
CN1897118A (zh) * 2005-07-12 2007-01-17 阿尔卑斯电气株式会社 磁头组件的金属球接合方法
US20070075056A1 (en) * 2005-09-30 2007-04-05 Sae Magnetics (H.K.) Ltd. Soldering device and method for forming electrical solder connections in a disk drive unit
CN101038986A (zh) * 2006-03-16 2007-09-19 Tdk株式会社 接合装置以及用于该接合装置的喷嘴单元
CN101722343A (zh) * 2008-10-10 2010-06-09 日立环球储存科技荷兰有限公司 磁头万向架组件的连接焊盘互连装置和该组件制造方法
US20130256281A1 (en) * 2012-03-30 2013-10-03 Tatsumi Tsuchiya Solder-jet nozzle, laser-soldering tool, and method, for lasersoldering head-connection pads of a head-stack assembly for a hard-disk drive
CN103817438A (zh) * 2014-03-07 2014-05-28 深圳市大族激光科技股份有限公司 一种锡球焊接装置及方法
CN106271062A (zh) * 2016-09-29 2017-01-04 深圳市艾贝特电子科技有限公司 激光喷焊嘴、喷焊装置及方法
CN206084135U (zh) * 2016-09-29 2017-04-12 深圳市艾贝特电子科技有限公司 激光喷焊嘴和喷焊装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112091346A (zh) * 2020-09-07 2020-12-18 昆山联滔电子有限公司 一种激光喷射焊球的焊接方法

Also Published As

Publication number Publication date
CN106271062B (zh) 2020-01-31
CN106271062A (zh) 2017-01-04

Similar Documents

Publication Publication Date Title
WO2018058925A1 (zh) 激光喷焊嘴、喷焊装置及方法
CN106825819B (zh) 非接触式锡球焊接装置及其焊接工艺
US7067762B2 (en) Plasma cutting process and machine
CN108296591B (zh) 一种锡球焊接的自动化出锡装置及方法
JPWO2013129151A1 (ja) プラズマ−ｍｉｇ溶接方法および溶接トーチ
WO1998030352A1 (fr) Fer a souder du type sans contact et pouvant effectuer une soudure discontinue
US20020053556A1 (en) Laser-beam machining method, laser-beam machining device and auxiliary tool for piercing
JP3541307B2 (ja) 半田ごて
JP5034336B2 (ja) 溶射皮膜形成装置および溶射皮膜形成方法
CN116618779A (zh) 焊锡喷射方法以及焊锡喷射装置
CN116900443A (zh) 激光喷锡焊设备及其喷嘴清洗方法
CN112846510B (zh) 一种半导体焊接头和焊料喷涂方法
JP2016215255A (ja) 熱切断装置及び方法
CN206084135U (zh) 激光喷焊嘴和喷焊装置
KR102097491B1 (ko) 솔더볼 젯팅 노즐 잔여물 제거 장치 및 방법
US11929237B2 (en) Plasma generation device and plasma head cooling method
JP2018069315A (ja) レーザろう付け装置、及びレーザろう付け装置を用いたろう付けワイヤの切断方法
JP2002285316A (ja) 自動溶射方法
JP4457369B1 (ja) はんだ付け装置、はんだ付け方法およびはんだ付け品の製造方法
CN220144950U (zh) 焊锡喷射装置
JP3804744B2 (ja) プラズマ加工方法およびその装置
JP6182586B2 (ja) 半田付け装置
JP3786811B2 (ja) プラズマトーチ、及びプラズマトーチの初期高さ設定方法
JP5751408B2 (ja) プラズマ溶射方法及びプラズマ溶射装置
JP6849909B2 (ja) はんだ付け方法、はんだ付け装置、及び噴流ノズルのはんだ濡れの保持方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17854384

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 23/08/2019)

122 Ep: pct application non-entry in european phase

Ref document number: 17854384

Country of ref document: EP

Kind code of ref document: A1