WO2018045868A1 - 背光金手指结构和显示装置 - Google Patents

背光金手指结构和显示装置 Download PDF

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Publication number
WO2018045868A1
WO2018045868A1 PCT/CN2017/098334 CN2017098334W WO2018045868A1 WO 2018045868 A1 WO2018045868 A1 WO 2018045868A1 CN 2017098334 W CN2017098334 W CN 2017098334W WO 2018045868 A1 WO2018045868 A1 WO 2018045868A1
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WIPO (PCT)
Prior art keywords
gold finger
film layer
backlight
cover film
gold
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PCT/CN2017/098334
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English (en)
French (fr)
Inventor
怀俊棋
张二帽
史松松
刘鹏辛
盛军
Original Assignee
京东方科技集团股份有限公司
京东方（河北）移动显示技术有限公司
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Application filed by 京东方科技集团股份有限公司, 京东方（河北）移动显示技术有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/761,768 priority Critical patent/US10973121B2/en
Publication of WO2018045868A1 publication Critical patent/WO2018045868A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09027—Non-rectangular flat PCB, e.g. circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0594—Insulating resist or coating with special shaped edges

Definitions

  • the present disclosure relates to the field of display device manufacturing technologies, and in particular, to a backlight gold finger structure and a display device.
  • the LED backlight module has been used in small and medium-sized LCD modules, and with the thinning of the liquid crystal module and the simplification of the interface, the backlight source usually adopts the LED flexible circuit board to be soldered to the gold finger, and then the gold finger is folded. And soldered to the display panel flexible circuit board of the display panel, the existing gold finger needs to be folded, so when the gold finger receives an external force, the solder joint of the gold finger and the display panel flexible circuit board is prone to break, thereby affecting the display device The display effect.
  • embodiments of the present disclosure provide a backlight gold finger structure and display device.
  • the present disclosure provides a backlight gold finger structure, including:
  • each of the gold finger bodies is connected to the backlight flexible circuit board, and the other end is overhanging for connecting to the display panel flexible circuit board on the first side of the gold finger body;
  • a first cover film layer disposed on one side of each of the gold finger bodies, and an edge of the first cover film layer adjacent to an overhanging end of the gold finger body is curved.
  • a second cover film layer is disposed on a second surface of each of the gold finger bodies facing away from the first surface, and the second cover film layer is adjacent to the gold finger The edge of the overhanging end of the body is curved.
  • an edge of the first cover film layer adjacent to an overhanging end of the gold finger body on the display panel flexible circuit board and the second cover film layer do not coincide with each other.
  • an edge of the first cover film layer near an overhanging end of the gold finger body is closer to an edge of the second cover film layer near an overhanging end of the gold finger body. The overhanging end of the gold finger body.
  • a shape of an edge of the first cover film layer adjacent to an overhanging end of the gold finger body and an edge of the second cover film layer near an overhanging end of the gold finger body is the same.
  • the curve is a wavy line.
  • the gold finger body further includes a via hole penetrating the first cover film layer, the gold finger body, and the second cover film layer.
  • the positions of the via holes provided on any two adjacent gold finger bodies are different from each other.
  • the present disclosure also provides a display device comprising: a backlight flexible circuit board and a display panel flexible circuit board, and further comprising the backlight gold finger structure according to any one of the above.
  • FIG. 1 is a schematic diagram of a first side of a backlight gold finger structure according to an embodiment of the present disclosure
  • FIG. 2 is a schematic diagram of a second side of a backlight gold finger structure according to an embodiment of the present disclosure
  • FIG. 3 is a schematic diagram of a connection between a backlight gold finger structure and a backlight flexible circuit board and a display panel flexible circuit board according to an embodiment of the present disclosure.
  • a backlight gold finger structure and a display device including: a plurality of gold finger bodies, one end of each of the gold finger bodies and a backlight flexible circuit a board connection and an overhang at the other end for connecting to the display panel flexible circuit board on the first side of the gold finger body; a first cover film layer disposed on one side of each of the gold finger bodies, and the An edge of a cover film layer adjacent to the overhanging end of the gold finger body is curved.
  • the backlight gold finger structure provided by the present disclosure can be made by setting the gold finger body for connecting the side of the first cover film layer on one side of the flexible circuit board of the display panel to the side corresponding to the overhanging end of the gold finger body.
  • the portion where the first cover film layer is soldered to the display panel flexible circuit board is in a curved contact connection, which can reduce the occurrence of stress concentration.
  • the backlight gold finger structure provided by the present disclosure has better connection strength and can reduce the occurrence of self-breaking phenomenon.
  • FIG. 1 is a schematic diagram of a first side of a backlight gold finger structure according to an embodiment of the present disclosure
  • FIG. 2 is a second embodiment of a backlight gold finger structure according to an embodiment of the present disclosure
  • FIG. 3 is a schematic diagram of a connection between a backlight gold finger structure and a backlight flexible circuit board and a display panel flexible circuit board according to an embodiment of the present disclosure.
  • the present disclosure provides a backlight gold finger structure including:
  • each of the gold finger bodies 21 is connected to the backlight flexible circuit board 10, and the other end is overhanging for connecting to the display panel flexible circuit board 30 on the first side of the gold finger body;
  • the first cover film layer 23 is disposed on the first face of each of the gold finger bodies 21, and the edge of the first cover film layer 23 near the overhanging end 211 of the gold finger body 21 is curved.
  • the backlight gold finger structure provided by the present disclosure is disposed near the edge of the overhanging end 211 of the gold finger body 21 by using the gold finger body 21 for connecting the first cover film layer 23 on the first surface of the display panel flexible circuit board 30 to
  • the curved shape can make the portion where the first cover film layer 23 is welded to the display panel flexible circuit board 30 in a curved contact connection, which can reduce the occurrence of stress concentration.
  • the backlight gold finger structure provided by the present disclosure has better connection strength and can reduce the occurrence of self-breaking phenomenon.
  • a second cover film layer 22 is disposed on the second surface of each of the gold finger bodies 21, and an edge of the second cover film layer 22 adjacent to the overhanging end 211 of the gold finger body 21 is Curved.
  • the edge of the second cover film layer 22 adjacent to the overhanging end 211 of the gold finger body 21 is not soldered to the display panel flexible circuit board 30, and the second cover film layer 22 is located on the side facing away from the display panel flexible circuit board 30, that is, the golden finger
  • the first cover film layer 23 is adjacent to the edge of the overhanging end 211 of the gold finger body 21 on the display panel flexible circuit board 30.
  • the orthographic projection pattern and the orthographic projection pattern of the second cover film layer 22 and the edge of the gold finger body 21 near the overhanging end 211 on the display panel flexible circuit board 30 do not coincide with each other. Such a structural arrangement can avoid the occurrence of large stress caused by the coincidence.
  • the edge of the first cover film layer 23 adjacent to the overhanging end 211 of the gold finger body 21 may be closer to the overhanging end 211 of the gold finger body 21 with respect to the edge of the second cover film layer 22 near the overhanging end 211 of the gold finger body 21 Or the edge of the second cover film layer 22 near the overhanging end 211 of the gold finger body 21 is closer to the overhanging end 211 of the gold finger body 21 than the edge of the first cover film layer 23 near the overhanging end 211 of the gold finger body 21.
  • the specific shape of the edge of the first cover film layer 23 adjacent to the overhanging end 211 of the gold finger body 21 and the edge of the second cover film layer 22 near the overhanging end 211 of the gold finger body 21 may be various, as long as the band is avoided.
  • the shape of the edge of the first cover film layer 23 near the overhanging end 211 of the gold finger body 21 and the second cover film layer 22 near the overhanging end 211 of the gold finger body 21 are optional.
  • the edges have the same shape. This is convenient for preparation.
  • the above curve is a wavy line.
  • the wavy shape has more curved sections, and the curved sections have a curvature, which can reduce stress concentration of the first cover film layer 23 and the second cover film layer 22.
  • the gold finger body 21 further includes a via hole 3 penetrating through the first cover film layer 23, the gold finger body 21, and the second cover.
  • the film layer 22 is disposed through the via hole 3 so that the metal solder can enter the via hole, and the solidified metal solder can further electrically connect the gold finger and the flexible circuit board, so that when the first cover film layer 23 and the display panel flexible circuit board 30 When the disconnected portion occurs, the current on the display panel flexible circuit board 30 can still be conducted to the backlight flexible circuit board 10 through the metal solder in the via hole 3.
  • the positions of the via holes 3 provided in any two adjacent gold finger bodies 21 are different from each other. Such a structure further avoids the simultaneous failure of all the via holes 3 due to the regular arrangement.
  • the present disclosure also provides a display device comprising: a backlight flexible circuit board 10 and a display panel flexible circuit board 30, and further comprising the backlight gold finger structure according to any one of the above. Due to the above-mentioned backlight gold finger The structure has good joint strength and can reduce the occurrence of self-breaking phenomenon. Therefore, the display device provided by the present disclosure has better quality and better display effect.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Liquid Crystal (AREA)

Abstract

提供一种背光金手指结构和显示装置，所述背光金手指结构包括：多个金手指本体（21），每个所述金手指本体（21）的一端与背光柔性电路板（10）连接、另一端悬伸设置，用于在金手指本体（21）的第一面与显示面板柔性电路板（30）相连；设置于每个所述金手指本体（21）的第一面上的第一覆盖膜层（23），且所述第一覆盖膜层（23）的靠近所述金手指本体（21）的悬伸端（211）的边缘为曲线形。

Description

背光金手指结构和显示装置
相关申请的交叉引用
本申请要求于2016年9月6日递交中国专利局的、申请号为201610807038.9的中国专利申请的权益，该申请的全部公开内容以引用方式并入本文。
技术领域
本公开涉及显示装置制备技术领域，特别涉及一种背光金手指结构和显示装置。
背景技术
目前，中小尺寸的液晶模组已使用LED背光模组，并随着液晶模组薄型化及接口简化的需求，背光光源通常采取将LED柔性电路板出线焊接于金手指，再将金手指翻折并焊接到显示面板的显示面板柔性电路板上，现有的金手指由于需要翻折，因此当金手指受到外力时，金手指与显示面板柔性电路板的焊接处容易发生断裂，从而影响显示装置的显示效果。
发明内容
为克服上述缺陷，本公开的实施例提供了一种背光金手指结构和显示装置。
本公开提供一种背光金手指结构，其特征在于，包括：
多个金手指本体，每个所述金手指本体的一端与背光柔性电路板连接、另一端悬伸设置，用于在金手指本体的第一面与显示面板柔性电路板相连；
设置于每个所述金手指本体的一面上的第一覆盖膜层，且所述第一覆盖膜层的靠近所述金手指本体的悬伸端的边缘为曲线形。
在一些可选的实施方式中，每个所述金手指本体的背离所述第一面的第二面上设有第二覆盖膜层，且所述第二覆盖膜层的靠近所述金手指本体的悬伸端的边缘为曲线形。
在一些可选的实施方式中，所述第一覆盖膜层的靠近所述金手指本体的悬伸端的边缘在所述显示面板柔性电路板上的正投影图案和所述第二覆盖膜层的靠近所述金手指本体的悬伸端的边缘在所述显示面板柔性电路板上的正投影图案互不重合。
在一些可选的实施方式中，所述第一覆盖膜层的靠近所述金手指本体的悬伸端的边缘相对所述第二覆盖膜层的靠近所述金手指本体的悬伸端的边缘更接近所述金手指本体的悬伸端。
在一些可选的实施方式中，所述第一覆盖膜层的靠近所述金手指本体的悬伸端的边缘的形状与所述第二覆盖膜层的靠近所述金手指本体的悬伸端的边缘的形状相同。
在一些可选的实施方式中，所述曲线形为波浪线。
在一些可选的实施方式中，所述金手指本体还包括导通孔，所述导通孔贯穿所述第一覆盖膜层、所述金手指本体和所述第二覆盖膜层。
在一些可选的实施方式中，任意相邻两个所述金手指本体上设置的所述导通孔的位置相互不同。
本公开还提供了一种显示装置，包括：背光柔性电路板和显示面板柔性电路板，还包括上述任一项所述的背光金手指结构。
附图说明
此处所说明的附图用来提供对本公开的进一步理解，构成本公开的一部分，本公开的示意性实施例及其说明用于解释本公开，并不构成对本公开的不当限定。在附图中：
图1为本公开实施例提供的背光金手指结构的第一面的示意图；
图2为本公开实施例提供的背光金手指结构的第二面的示意图；
图3为本公开实施例提供的背光金手指结构分别与背光柔性电路板和显示面板柔性电路板的连接示意图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。
下面通过实施例，并结合附图，对本公开的技术方案作进一步具体的说明。在说明书中，相同或相似的附图标号指示相同或相似的部件。下述参照附图对本发明实施方式的说明旨在对本公开的总体发明构思进行解释，而不应当理解为对本公开的一种限制。
另外，在下面的详细描述中，为便于解释，阐述了许多具体的细节以提供对本披露实施例的全面理解。然而明显地，一个或多个实施例在没有这些具体细节的情况下也可以被实施。在其他情况下，公知的结构和装置以图示的方式体现以简化附图。
根据本发明的总体技术构思的一个方面，提供了一种背光金手指结构和显示装置，所述背光金手指结构包括：多个金手指本体，每个所述金手指本体的一端与背光柔性电路板连接、另一端悬伸设置，用于在金手指本体的第一面与显示面板柔性电路板相连；设置于每个所述金手指本体的一面上的第一覆盖膜层，且所述第一覆盖膜层的靠近所述金手指本体的悬伸端的边缘为曲线形。
本公开提供的背光金手指结构，通过将金手指本体用于连接显示面板柔性电路板的一面上的第一覆盖膜层的与金手指本体的悬伸端对应的一边设置为曲线形，可以使得第一覆盖膜层与显示面板柔性电路板焊接的部分为曲线形接触连接，可以减少应力集中现象的发生。
故，本公开提供的背光金手指结构，具有较好的连接强度，可以减少自身断裂现象的发生。
如图1、图2和图3所示，其中：图1为本公开实施例提供的背光金手指结构的第一面的示意图；图2为本公开实施例提供的背光金手指结构的第二面的示意图；图3为本公开实施例提供的背光金手指结构分别与背光柔性电路板和显示面板柔性电路板的连接示意图。本公开提供了一种背光金手指结构，包括：
多个金手指本体21，每个金手指本体21的一端与背光柔性电路板10连接、另一端悬伸设置，用于在金手指本体的第一面与显示面板柔性电路板30相连；
设置于每个金手指本体21的第一面上的第一覆盖膜层23，且第一覆盖膜层23的靠近金手指本体21的悬伸端211的边缘为曲线形。
本公开提供的背光金手指结构，通过将金手指本体21用于连接显示面板柔性电路板30的第一面上的第一覆盖膜层23靠近金手指本体21的悬伸端211的边缘设置为曲线形，可以使得第一覆盖膜层23与显示面板柔性电路板30焊接的部分为曲线形接触连接，可以减少应力集中现象的发生。
故，本公开提供的背光金手指结构，具有较好的连接强度，可以减少自身断裂现象的发生。
进一步地，如图2所示，每个金手指本体21的第二面上设有第二覆盖膜层22，且第二覆盖膜层22的靠近金手指本体21的悬伸端211的边缘为曲线形。第二覆盖膜层22的靠近金手指本体21的悬伸端211的边缘不与显示面板柔性电路板30焊接，第二覆盖膜层22位于背离显示面板柔性电路板30的一面，也就是金手指本体的第二面，故将第二覆盖膜层22与金手指本体21的悬伸端211对应的一边设置为曲线形，可以减少第二覆盖膜层22所受的应力集中现象的发生，进而可以提高背光金手指结构的整体强度。
如图1和图2所示，为了进一步减少应力集中现象的发生，第一覆盖膜层23靠近金手指本体21的悬伸端211的边缘在显示面板柔性电路板30上的 正投影图案和第二覆盖膜层22与金手指本体21靠近悬伸端211的边缘在显示面板柔性电路板30上的正投影图案互不重合。这样的结构设置可以避免重合造成应力较大现象的发生。
上述第一覆盖膜层23靠近金手指本体21的悬伸端211的边缘可以相对第二覆盖膜层22靠近金手指本体21的悬伸端211的边缘更接近金手指本体21的悬伸端211，或者第二覆盖膜层22靠近金手指本体21的悬伸端211的边缘相对第一覆盖膜层23靠近金手指本体21的悬伸端211的边缘更加远离金手指本体21的悬伸端211。
上述第一覆盖膜层23靠近金手指本体21的悬伸端211的边缘和第二覆盖膜层22靠近金手指本体21的悬伸端211的边缘的具体形状可以有多种，只要避免出现带尖角的孔或槽即可，可选地，第一覆盖膜层23靠近金手指本体21的悬伸端211的边缘的形状与第二覆盖膜层22靠近金手指本体21的悬伸端211的边缘的形状相同。这样便于制备。
可选的，上述曲线形为波浪线。波浪形具有较多的弯曲的部段，且弯曲的部段具有弧度，这样可以减少第一覆盖膜层23和第二覆盖膜层22发生应力集中现象。
一种可选的实施方式中，所述金手指本体21还包括导通孔3，所述导通孔3贯穿所述第一覆盖膜层23、所述金手指本体21和所述第二覆盖膜层22导通孔3的设置，使得金属焊料可以进入导通孔，凝固的金属焊料可以将金手指和柔性电路板进一步电连接，从而当第一覆盖膜层23与显示面板柔性电路板30之间出现断开部分时，通过导通孔3中的金属焊料，仍然可以使得显示面板柔性电路板30上的电流传导给背光柔性电路板10。
较佳的实施方式中，任意相邻两个金手指本体21上设有的导通孔3的位置相互不同。这样的结构更加避免因规律的布置引起全部导通孔3同时失效。
本公开还提供了一种显示装置，包括：背光柔性电路板10和显示面板柔性电路板30，还包括上述任一项所述的背光金手指结构。由于上述背光金手指 结构，具有较好的连接强度，可以减少自身断裂现象的发生。故，本公开提供的显示装置，具有较好的品质和较好的显示效果。
显然，本领域的技术人员可以对本公开进行各种改动和变型而不脱离本公开的精神和范围。这样，倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

Claims (9)

  1. 一种背光金手指结构，其特征在于，包括：
    多个金手指本体，每个所述金手指本体的一端与背光柔性电路板连接、另一端悬伸设置，用于在金手指本体的第一面与显示面板柔性电路板相连；
    设置于每个所述金手指本体的第一面上的第一覆盖膜层，且所述第一覆盖膜层的靠近所述金手指本体的悬伸端的边缘为曲线形。
  2. 根据权利要求1所述的背光金手指结构，其中，每个所述金手指本体的背离所述第一面的第二面上设有第二覆盖膜层，且所述第二覆盖膜层的靠近所述金手指本体的悬伸端的边缘为曲线形。
  3. 根据权利要求2所述的背光金手指结构，其特征在于，所述第一覆盖膜层的靠近所述金手指本体的悬伸端的边缘在所述显示面板柔性电路板上的正投影图案和所述第二覆盖膜层的靠近所述金手指本体的悬伸端的边缘在所述显示面板柔性电路板上的正投影图案互不重合。
  4. 根据权利要求3所述的背光金手指结构，其特征在于，所述第一覆盖膜层的靠近所述金手指本体的悬伸端的边缘相对所述第二覆盖膜层的靠近所述金手指本体的悬伸端的边缘更接近所述金手指本体的悬伸端。
  5. 根据权利要求2所述的背光金手指结构，其特征在于，所述第一覆盖膜层的靠近所述金手指本体的悬伸端的边缘的形状与所述第二覆盖膜层的靠近所述金手指本体的悬伸端的边缘的形状相同。
  6. 根据权利要求1所述的背光金手指结构，其特征在于，所述曲线形为波浪线。
  7. 根据权利要求1～6任一项所述的背光金手指结构，其特征在于，所述金手指本体还包括导通孔，所述导通孔贯穿所述第一覆盖膜层、所述金手指本体和所述第二覆盖膜层。
  8. 根据权利要求7所述的背光金手指结构，其特征在于，任意相邻两个所述金手指本体上设置的所述导通孔的位置相互不同。
  9. 一种显示装置，包括：背光柔性电路板和显示面板柔性电路板，其特征在于，还包括如权利要求1～8任一项所述的背光金手指结构。
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