WO2018040277A1 - 适合于批量化生产的多层微流体芯片制作方法 - Google Patents

适合于批量化生产的多层微流体芯片制作方法 Download PDF

Info

Publication number
WO2018040277A1
WO2018040277A1 PCT/CN2016/104945 CN2016104945W WO2018040277A1 WO 2018040277 A1 WO2018040277 A1 WO 2018040277A1 CN 2016104945 W CN2016104945 W CN 2016104945W WO 2018040277 A1 WO2018040277 A1 WO 2018040277A1
Authority
WO
WIPO (PCT)
Prior art keywords
transparent cover
layer
microfluidic chip
transparent
mass production
Prior art date
Application number
PCT/CN2016/104945
Other languages
English (en)
French (fr)
Inventor
尤政
赵精晶
Original Assignee
清华大学
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 清华大学 filed Critical 清华大学
Publication of WO2018040277A1 publication Critical patent/WO2018040277A1/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/12—Specific details about manufacturing devices

Definitions

  • the invention relates to the field of microfluidic chips, in particular to a method for manufacturing a multilayer microfluidic chip suitable for mass production.
  • microfluidics With the development of microfluidics, a variety of microfluidic chips have emerged for biomedical testing, chemical experiments, cell culture, bioparticle sorting, nanowire fabrication, fuel cells, microenergy, micro-optics. Fluid-based sensors and actuators, microfluidic physical phenomena research and many other fields. However, at present, such microfluidic chips are mostly processed by laboratory means, and have the disadvantages of high cost and poor repeatability.
  • Embodiments of the present invention provide a method, a device, and a computer storage medium for manufacturing a multilayer microfluidic chip suitable for mass production, which are suitable for mass production and cost reduction.
  • the embodiment of the present invention is implemented as a method for fabricating a multilayer microfluidic chip suitable for mass production, comprising the steps of: providing an internal structural layer, wherein the internal structural layer comprises a plurality of metal plates, the plurality of Forming a micro-channel structure by etching treatment on the layer metal plate, the multi-layer metal plate being assembled as a whole by thermocompression bonding or ultrasonic bonding; providing an upper transparent cover plate and a lower transparent cover plate, wherein the upper portion An opening and an outlet are disposed on the transparent cover; and the upper transparent cover, the inner structural layer and the lower transparent cover are glued and sealed.
  • Another object of embodiments of the present invention is to provide an apparatus comprising: one or more processors; a memory; one or more programs, the one or more programs being stored in the memory when When the plurality of processors are executed, the multi-layer microfluidic chip fabrication method suitable for mass production described in the above embodiments is performed.
  • Another object of embodiments of the present invention is to provide a non-volatile computer storage medium storing one or more programs, when the one or more programs are executed by a device,
  • the apparatus performs the method of fabricating a multilayer microfluidic chip suitable for mass production of the above-described embodiments of the present invention.
  • the microfluidic chip of the embodiment of the invention is composed of a plurality of layers, and each layer is processed with a microstructure such as a flow channel and an interface, and the layers are assembled into one body by means of hot pressing, gluing and the like.
  • the microfluidic chip has a completely transparent area, which can meet the requirements of optical observation and optical detection.
  • the method is suitable for mass production and low cost.
  • FIG. 1 is a schematic structural view of a microfluidic chip in a first embodiment of the present invention
  • FIG. 2 is a schematic view showing the processing flow of the microfluidic chip in the first embodiment of the present invention
  • FIG. 3 is a schematic view showing the function of the microfluidic chip in the first embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a microfluidic chip in a second embodiment of the present invention.
  • Figure 5 is a schematic view showing a transparent sheet embedded in a window in a second embodiment of the present invention.
  • FIG. 6 is a schematic diagram showing the function of a microfluidic chip in a second embodiment of the present invention.
  • Figure 7 is a schematic structural view of a microfluidic chip in a third embodiment of the present invention.
  • FIG. 8 is a flow chart of a method of fabricating a multilayer microfluidic chip suitable for mass production in accordance with an embodiment of the present invention.
  • Figure 8 is a flow diagram of a method of fabricating a multilayer microfluidic chip suitable for mass production in accordance with one embodiment of the present invention.
  • a method for fabricating a multilayer microfluidic chip suitable for mass production includes the following steps:
  • the inner structural layer comprises a plurality of metal plates, and the multi-layer metal plate passes through the etching
  • the micro-channel structure is formed, and the multi-layer metal plate is assembled into a whole by thermocompression bonding or ultrasonic bonding.
  • the material of the metal plate is medical grade 304 or 316 stainless steel, titanium alloy, etc., and has good corrosion resistance.
  • the thickness of the metal plate is between 0.01 and 2 mm, the minimum line width of the etching is up to 50 ⁇ m, the etching precision is up to ⁇ 5 ⁇ m, and the sidewall verticality is approximately 90°.
  • the forming the microchannel structure by the etching process on the multi-layer metal plate further comprises: first forming an anti-corrosion layer around the portion of the multi-layer metal plate that needs to be etched, and secondly, requiring The portion where the etching treatment is performed is etched, and after the etching is completed, the etching resist layer is removed.
  • the corrosion resistant layer is formed by screen printing, pattern plating, laser etching, and lithographic patterning.
  • the process of etching the metal plate includes a cleaning process, an anti-corrosion treatment, etching, and removal of the anti-corrosion layer.
  • the cleaning treatment treats the surface of the metal plate by using an organic solvent, an acid-base chemical solvent, ultrasonic cleaning, electrolytic cleaning, etc., so that the surface thereof is free from dirt, and provides a base material having uniform properties for subsequent processing.
  • the anti-etching treatment forms an anti-etching material on the surface of the metal plate by screen printing, pattern plating, laser etching, photographic chemistry, etc., and exposes the portion to be etched and the portion that does not need to be etched.
  • Etching includes dry etching and wet etching.
  • the patterned metal plate When wet etching, the patterned metal plate is placed in an etching solution to achieve optimum etching by controlling the concentration, temperature and time of the etchant. The effect is to etch a transparent microchannel structure on the metal plate.
  • the process of removing the anti-corrosion layer is to remove the anti-corrosion layer on the surface of the metal plate by the dissolving agent.
  • the step of providing an internal structural layer further includes:
  • the micro flow path that requires optical detection is mostly located in the middle layer. Therefore, if the intermediate layer microchannel is optically detected, it is necessary to replace the opaque metal layer above and below the portion with a transparent material.
  • a first layer of transparent material and a second layer of transparent material of suitable size can be processed into the corresponding metal layer and sealed with a metal layer by UV-curable (Ultraviolet Rays, UV) glue.
  • the material of the first transparent material layer and the second transparent material layer is one or more of glass, quartz, polycarbonate, and polymethyl methacrylate.
  • the method when the material of the upper transparent cover and the first transparent material layer are the same, and/or the materials of the lower transparent cover and the second transparent material layer are the same, the method further includes:
  • the upper transparent cover, the inner structural layer and the lower transparent cover are glued together. Further includes:
  • the ultraviolet curing glue is respectively sprayed on the upper transparent cover and the lower transparent cover by the glue machine, thereby forming a uniform adhesive layer on the upper transparent cover and the lower transparent cover, and secondly pre-curing in the uniform adhesive layer.
  • the upper transparent cover, the inner structural layer and the lower transparent cover are aligned and pressed again, and finally the sealing between the upper transparent cover, the inner structural layer and the lower transparent cover is completed by ultraviolet light irradiation.
  • the UV glue is spin-coated on the upper transparent cover and the lower transparent cover, and the number of rotations of the homogenizer (hundreds to thousands of revolutions per minute) is formed on the transparent cover and the lower transparent cover.
  • a uniform layer of glue from 100 nanometers to several microns thick.
  • the adhesive layer is pre-cured, and then the outer transparent cover and the inner structure are aligned and pressed, and then the inner and outer structures are sealed by ultraviolet light irradiation.
  • a thick piece of quartz glass can be used for pressing. If the pressure is not enough, pressure can be applied to the quartz glass through the press. The use of a thick piece of quartz glass is mainly due to its good permeability to ultraviolet light and provides a uniform pressure distribution.
  • S2 an upper transparent cover and a lower transparent cover are provided, wherein the upper transparent cover is provided with an inflow port and an outflow port.
  • the upper transparent cover and the lower transparent cover provide the function of interface, protection and optical detection for the internal structural layer.
  • Through holes are formed in the upper transparent cover and the lower transparent cover by machining or laser cutting to be connected to the micro flow channels in the inner structural layer to serve as an inflow or outflow interface of the microfluidic chip.
  • the material of the upper transparent cover and the lower transparent cover is one or more of glass, quartz, polycarbonate, and polymethyl methacrylate.
  • step S1 and the step S2 are not limited to each other in the embodiment of the present invention, and it is only necessary to ensure that both step S1 and step S2 are before step S3.
  • the method for fabricating a multi-layer microfluidic chip suitable for batch production according to an embodiment of the present invention further includes:
  • the first transparent substrate, the predetermined metal plate and the second transparent substrate are glued and uniformly cut to obtain a plurality of multilayer microfluidic chips.
  • FIG. 1 is a schematic view showing the structure of a microfluidic chip in a first embodiment of the present invention. As shown in FIG. 2, this embodiment takes a microfluidic chip 1 having a one-dimensional focusing function as an example.
  • the inside of the microfluidic chip is a single-layer micro-channel structure 12, and a transparent cover 11 and 13 are arranged on the upper and lower sides. , describes how to process the chip.
  • FIG. 2 is a schematic view showing the processing flow of the microfluidic chip in the first embodiment of the present invention.
  • a suitable sheet material is cut according to the size of the microfluidic chip.
  • a medical grade 316 stainless steel sheet 21 of 150 ⁇ m thickness of 4 cm ⁇ 6 cm is taken.
  • the stainless steel sheet is cleaned to have a clean surface that can be bonded to the corrosion resistant layer 221.
  • the micro-channel structure pattern to be processed is transferred to the mask plate 231, and when the photo-painting film sheet is used as the mask plate, the processing precision can reach ⁇ 5 ⁇ m; if the processing precision needs to be improved, the chrome plate can be used as the mask version. Its processing accuracy can reach micron to sub-micron.
  • the glue 22 is coated with a photoresist as a resist layer 221 on the front and back sides of the stainless steel sheet, and a photosensitive resist dry film is generally used. Aligning the mask 23, the two masks are aligned and attached to the outer surface of the resist layer, and after exposure 24 and development 25, the pattern on the mask is transferred onto the resist.
  • the metal thin plate 26 is wet etched, and the mixed acid of HNO 3 and H 2 SO 4 is used as an etchant, the temperature is controlled at 60 to 70 ° C, and the etching is performed for 5 to 15 minutes until the transparent microchannel structure is etched on the stainless steel sheet. 121. Finally, the corrosion resistant layer 27 on the surface of the metal sheet is removed. So far, the processing of the internal microchannel structure 121 is completed, and the microchannel structure layer 12 is obtained.
  • Fig. 3 is a schematic view showing the function of the microfluidic chip in the first embodiment of the present invention.
  • the outer transparent cover plates 11 and 13 may be made of a transparent material such as glass, quartz, PC, or PMMA. Two 1 mm thick transparent covers 11 and 13 were machined.
  • the first cover plate 11 is machined or laser-cut by means of machining through holes 1111 to 1114 on the transparent cover to be connected to the micro flow passages in the internal structure to serve as an inflow or outflow interface of the microfluidic chip.
  • a layer of micron thick UV glue 281 and 282 is spin-coated on each of the two transparent cover plates by a homogenizing machine, and the speed of the homogenizing machine is 4000 to 5000 rpm.
  • the glue layer is irradiated for 10 to 15 s under an ultraviolet lamp to reduce the fluidity of the glue layer.
  • the two cover plates and the micro-channel structure are aligned and pressed, and a micro-fluid chip is pressed up and down by a 2 cm-thick quartz glass plate. If the pressure is insufficient, the pressure can be applied through the press. Thereafter, the microfluidic chip is placed under an ultraviolet lamp for 10 to 15 minutes, so that the intermediate microchannel structure 12 and the outer two cover plates 11 and 13 become a unitary body 1.
  • the input interface 1112 of the microfluidic chip 1 is coupled to the pump 32 for injection into the sample stream 34; the interfaces 1111 and 1113 are coupled to the pump 32 for injection into the sheath fluid stream 33; and the interface 1114 is coupled to the waste vial 36. Injecting the liquid and observing the section 35 of the DC channel 37, the sample stream 34 is focused by the sheath fluid stream 33 at the horizontal center of the flow channel to achieve a one-dimensional focusing function.
  • FIG. 4 is a schematic view showing the structure of a microfluidic chip in a second embodiment of the present invention.
  • this embodiment takes a microfluidic chip 4 having a two-dimensional focusing function as an example.
  • the inside of the microfluidic chip is a three-layer micro-channel structure 42, 43 and 44, and a transparent cover is arranged on the upper and lower sides. Plates 41 and 45 are also internally embedded with two transparent sheets for viewing the innermost flow path 43. Slices 46 and 47 describe how to process the chip.
  • microchannel structures 42, 43 and 44 Three layers of microchannel structures 42, 43 and 44 were machined by metal etching, each layer being a 4 cm x 6 cm 150 [mu]m thick medical grade 316 stainless steel sheet.
  • the inner three-layer microchannel structure is combined into a unitary body 48 by vacuum thermocompression bonding.
  • Two 1 mm thick transparent covers 41 and 45 are machined.
  • FIG. 5 is a schematic view showing the transparent sheet embedded in the window in the second embodiment of the present invention. As shown in Fig. 5(A), the transparent sheet was spin-coated with a layer of micron-thick UV glue, which was then embedded in a window and sealed with a metal layer by ultraviolet light to prevent leakage. As shown in FIG.
  • the transparent sheets 46 and 47 can be directly thermocompression bonded to the transparent covers 41 and 46 (for example, Borofloat 33 glass is used, After the transparent sheet and the transparent cover are positioned, the vacuum is evacuated to 1e-2bars for 2.5 minutes, so that the two are adsorbed together under the action of van der Waals force, and then heated at 600 ° C for 6 hours to form a new transparent cover 521 and 522, and then the new transparent cover is directly embedded in the window when it is sealed with the micro flow channel structure. Finally, the transparent cover plate and the microchannel structure are sealed into a whole by means of UV bonding, and the complete microfluidic chip 4 is processed.
  • the transparent covers 41 and 46 for example, Borofloat 33 glass is used
  • Fig. 6 is a schematic view showing the function of the microfluidic chip in the second embodiment of the present invention.
  • the input interface 62 of the microfluidic chip 4 is coupled to the pump 64 to inject the sample stream 66; the ports 61 and 63 are coupled to the pump 65 for injection into the sheath stream 67; and the interface 68 is coupled to the waste bottle 69.
  • the sample stream 66 is focused by the sheath fluid stream 67 at the center of the flow channel to achieve a two-dimensional focusing function.
  • Figure 7 is a schematic view showing the structure of a microfluidic chip in a third embodiment of the present invention. As shown in FIG. 7, this embodiment takes a batch processing of a microfluidic chip having a two-dimensional focusing function as an example, and can process 100 pieces in a single time, and describes how to process the chip.
  • a 150 ⁇ m thick medical grade 316 stainless steel sheet of 40 cm ⁇ 60 cm was taken.
  • 100 identical microfluidic patterns were patterned on a 40 cm x 60 cm photolithographic film.
  • Three-layer structures 72, 73, and 74 of a microfluidic structure were fabricated on three stainless steel sheets by metal etching, each having 100 repeating patterns.
  • the three layers of stainless steel sheets are then heat pressed into a unitary body 77, and 100 sheets of transparent sheets 76 are embedded in the outermost two layers of windows. Accordingly, 100 repeated cover structures were formed on each of the two 40 cm ⁇ 60 cm transparent plates 71 and 75.
  • the transparent plate is sealed to the outer layer of the three-layer stainless steel structure by means of UV bonding to form a five-layered plate structure 78.
  • 100 functionally identical microfluidic chips 79 are then cut from the five-layer structure by means of laser cutting or mechanical cutting. In practice, it is also possible to further increase the number of arrays, such as processing 500 microfluidic chips at a time.
  • Embodiments of the present invention also disclose an apparatus comprising: one or more processors; a memory; one or more programs, the one or more programs being stored in the memory when the one or more When the processors are executed, a mass production method of the multilayer microfluidic chip as described in the above embodiments is performed.
  • Embodiments of the present invention also disclose a non-volatile computer storage medium storing one or more programs that, when executed by a device, cause the device to perform the operations described in the above embodiments. Mass production of multilayer microfluidic chips.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Micromachines (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Hematology (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

本发明公开了一种适合于批量化生产的多层微流体芯片制作方法，包括：提供内部结构层，其中，内部结构层包括多层金属板，多层金属板上通过刻蚀处理形成微流道结构，多层金属板通过热压键合或超声键合组装为一个整体；提供上部透明盖板和下部透明盖板，其中，上部透明盖板上设置有流入口和流出口；将上部透明盖板、内部结构层和下部透明盖板胶合封合。本发明具有如下优点：适合批量生产且成本低。

Description

适合于批量化生产的多层微流体芯片制作方法
相关申请的交叉引用
本申请要求清华大学于2016年8月31日递交的、发明名称为“适合于批量化生产的多层微流体芯片制作方法”的，中国专利申请号为“201610796048.7”的优先权。
技术领域
本发明涉及微流体芯片领域，具体涉及一种适合于批量化生产的多层微流体芯片制作方法。
背景技术
随着微流体技术的发展，涌现出了各式各样的微流体芯片，可用于生物医学检测、化学实验、细胞培养、生物微粒分选、纳米线制作、燃料电池、微能源、微光学器件、基于流体的传感器与执行器、微流体物理现象研究等诸多领域。但目前此类微流体芯片多采用实验室手段加工，具有成本高、重复性差等缺点。
发明内容
本发明实施例提供一种适合于批量化生产的多层微流体芯片制作方法、设备及计算机存储介质，旨在适合批量生产且降低成本。
本发明实施例是这样实现的，一种适合于批量化生产的多层微流体芯片制作方法，包括以下步骤：提供内部结构层，其中，所述内部结构层包括多层金属板，所述多层金属板上通过刻蚀处理形成微流道结构，所述多层金属板通过热压键合或超声键合组装为一个整体；提供上部透明盖板和下部透明盖板，其中，所述上部透明盖板上设置有流入口和流出口；将所述上部透明盖板、所述内部结构层和所述下部透明盖板胶合封合。
本发明实施例的另一目的在于提供一种设备，包括：一个或者多个处理器；存储器；一个或者多个程序，所述一个或者多个程序存储在所述存储器中，当被所述一个或者多个处理器执行时，执行上述实施例所述的适合于批量化生产的多层微流体芯片制作方法。
本发明实施例的另一目的在于提供一种非易失性计算机存储介质，所述计算机存储介质存储有一个或者多个程序，当所述一个或者多个程序被一个设备执行时，使得所述设备执行本发明上述实施例的适合于批量化生产的多层微流体芯片制作方法。
本发明实施例的微流体芯片由多层构成，每层上加工有流道、接口等微结构，通过热压、胶合等手段将各层结构组装为一体。同时，微流体芯片上具有完全通透的区域，能够满足光学观察、光学检测等需求。本方法适合批量生产且成本低。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本发明第一实施例中微流体芯片的结构示意图；
图2是本发明第一实施例中微流体芯片的加工流程示意图；
图3是本发明第一实施例中微流体芯片的功能展现示意图；
图4是本发明第二实施例中的微流体芯片的结构示意图；
图5是本发明第二实施例中的透明薄片嵌入至窗口的示意图；
图6是本发明第二实施例中的微流体芯片的功能展现示意图；
图7是本发明第三实施例中的微流体芯片的结构示意图；
图8是本发明实施例的适合于批量化生产的多层微流体芯片制作方法的流程图。
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
参照下面的描述和附图，将清楚本发明的实施例的这些和其他方面。在这些描述和附图中，具体公开了本发明的实施例中的一些特定实施方式，来表示实施本发明的实施例的原理的一些方式，但是应当理解，本发明的实施例的范围不受此限制。相反，本发明的实施例包括落入所附加权利要求书的精神和内涵范围内的所有变化、修改和等同物。
以下结合附图描述根据本发明。
图8是本发明一个实施例的适合于批量化生产的多层微流体芯片制作方法的流程图。
如图8所示，本发明实施例的适合于批量化生产的多层微流体芯片制作方法，包括以下步骤：
S1：提供内部结构层。其中，内部结构层包括多层金属板，多层金属板上通过刻蚀处 理形成微流道结构，多层金属板通过热压键合或超声键合组装为一个整体。其中，金属板的材料为医用级304或316不锈钢、钛合金等，具有良好的抗蚀性能。金属板的厚度在0.01～2mm之间，刻蚀最小线宽可达50μm，刻蚀精度可达±5μm，侧壁垂直度近似90°。
在本发明的一个实施例中，上述多层金属板上通过刻蚀处理形成微流道结构进一步包括：首先对多层金属板上需要进行刻蚀处理的部位周围形成防蚀层，其次对需要进行刻蚀处理的部位进行刻蚀，最后刻蚀完成后清除防蚀层。在本发明的一个实施例中，防蚀层通过丝网印刷、图形电镀、激光刻蚀和光刻图形化的方式形成。
具体地，对刻蚀金属板的过程包括清洁处理、防蚀处理、刻蚀和去除防蚀层。其中，清洁处理通过使用有机溶剂、酸碱化学溶剂、超声清洗、电解清洁等手段处理金属板的表面，使其表面无污物，为后续加工提供特性均一的基底材料。防蚀处理通过丝网印刷、图形电镀、激光刻蚀、照相化学等防刻蚀技术在金属板的表面图形化出防刻蚀材料，将需要刻蚀的部位露出、不需要刻蚀的部位覆盖上防刻蚀材料。刻蚀包括干法刻蚀和湿法刻蚀，采用湿法刻蚀时，将图形化后的金属板放入刻蚀溶液中，通过控制刻蚀剂浓度、温度和时间实现最佳的刻蚀效果，在金属板上刻蚀出通透的微流道结构。去除防蚀层的过程为通过溶解剂清除金属板表面的防蚀层。
在本发明的一个实施例中，提供内部结构层的步骤中还包括：
在多层金属层中的预设金属层的上下两侧的金属层的指定位置分别形成上开口和下开口；提供与上开口和下开口形状相匹配的第一透明材料层和第二透明材料层；将第一透明材料层和第二透明材料层分别嵌入上开口和下开口中。
具体地，微流体芯片的内部结构由多层构成时，其需要进行光学检测的微流道多位于中间的一层。因而若对中间层微流道进行光学检测，必然需要将该部位上下的不透明的金属层替换为透明材料。可加工适当大小的第一透明材料层和第二透明材料层嵌入到相应的金属层中，并用紫外光固化(Ultraviolet Rays，UV)胶将其与金属层封合。
在本发明的一个实施例中，第一透明材料层和第二透明材料层的材料为玻璃、石英、聚碳酸酯、聚甲基丙烯酸甲酯中的一种或多种。
在本发明的一个实施例中，当上部透明盖板和第一透明材料层的材料相同，和/或下部透明盖板和第二透明材料层的材料相同时，还包括：
将第一透明材料层通过热压键合固化到上部透明盖板上，和/或将第二透明材料层通过热压键合固化到下部透明盖板上，以在上部透明盖板、内部结构层和下部透明盖板胶合封合时，将第一透明材料层嵌入上开口中，和/或将第二透明材料层嵌入下开口中。
在本发明的一个实施例中，上述将上部透明盖板、内部结构层和下部透明盖板胶合封 合进一步包括：
首先通过匀胶机在上部透明盖板和下部透明盖板上分别旋涂紫外光固化胶，从而在上部透明盖板和下部透明盖板上分别形成均匀胶层，其次在均匀胶层进行预固化处理，再次将上部透明盖板、内部结构层和下部透明盖板对准并压紧，最后通过紫外光照射完成上部透明盖板、内部结构层和下部透明盖板之间的封合。
具体地，在上部透明盖板和下部透明盖板上旋涂UV胶，通过控制匀胶机的转速(数百至数千转每分钟)，在部透明盖板和下部透明盖板上形成数百纳米至数微米厚的均匀胶层。对胶层进行预固化，而后将外部透明盖板和内部结构对准并压紧，再用紫外光照射完成内外结构的封合。压紧时可采用一块厚的石英玻璃，若压力不够还可通过压力机在石英玻璃上外加压力。采用一块厚的石英玻璃主要是考虑到其对紫外光良好的透过性，并能够提供均匀的压力分布。
S2：提供上部透明盖板和下部透明盖板，其中，上部透明盖板上设置有流入口和流出口。
具体地，上部透明盖板和下部透明盖板为内部结构层提供接口、保护和光学检测的功能。通过机加工或激光切割的手段在上部透明盖板和下部透明盖板上加工出通孔，以与内部结构层中的微流道相连，从而作为微流体芯片的流入或流出接口。
在本发明的一个实施例中，上部透明盖板和下部透明盖板的材料为玻璃、石英、聚碳酸酯、聚甲基丙烯酸甲酯中的一种或多种。
S3：将上部透明盖板、内部结构层和下部透明盖板胶合封合。
需要说明的是：本发明实施例的步骤S1和步骤S2之间不限定先后关系，仅需保证步骤S1和步骤S2均在步骤S3之前即可。
在本发明的一个实施例中，本发明实施例额适合于批量化生产的多层微流体芯片制作方法还包括：
在一块预设金属板上图形化多个微流道结构；
通过一次刻蚀在所述预设金属板上形成多组内部结构层；
在第一透明基底加工出多组上部透明盖板；
在第二透明基底上加工出多组下部透明盖板；
将第一透明基底、预设金属板和第二透明基底进行胶合后统一切割得到多个多层微流体芯片。
为使本领域技术人员进一步理解本发明，将通过以下实施例进行详细说明。
第一实施例
图1是本发明第一实施例中微流体芯片的结构示意图。如图2所示，本实施例以一种具有一维聚焦功能的微流体芯片1为例，该微流体芯片的内部为单层微流道结构12，上下各有一层透明盖板11和13，叙述如何加工该芯片。
图2是本发明第一实施例中微流体芯片的加工流程示意图。如图2所示，首先，依据微流体芯片的大小裁剪出合适的板材，本实施例取4cm×6cm的150μm厚的医用级316不锈钢薄片21。对不锈钢薄片清洗，使其具有一个清洁的表面，能够与防蚀层221结合牢固。将待加工的微流道结构图形转移到掩膜版上231，采用光绘菲林片作为掩膜版时，其加工精度可达±5μm；若需要提高加工精度，可采用铬版作为掩膜版，其加工精度可达微米至亚微米级。涂胶22，在不锈钢片的正反面涂覆光刻胶作为抗蚀层221，一般采用感光抗蚀干膜。对准掩膜版23，将两片掩膜版对齐并贴附在抗蚀层的外表面，经过曝光24和显影25后将掩膜版上的图形转移到抗蚀层上。湿法刻蚀金属薄板26，采用HNO3和H2SO4的混酸作为腐蚀剂，控制温度60～70℃，刻蚀5～15分钟，直至在不锈钢薄片上刻蚀出通透的微流道结构121。最后，清除金属薄板表面的防蚀层27。至此，完成内部微流道结构121的加工，得到微流道结构层12。
图3是本发明第一实施例中微流体芯片的功能展现示意图。如图3所示，外部透明盖板11和13可采用玻璃、石英、PC、PMMA等透明材质。加工两个1mm厚的透明盖板11和13。第一块盖板11上通过机加工或激光切割的手段在透明盖板上加工出过孔1111～1114，与内部结构中的微流道相连，以作为微流体芯片的流入或流出接口。两块盖板和中间金属层上还有一些用于安装用的通孔112、122和131。利用匀胶机在两块透明盖板上各旋涂一层数微米厚的UV胶281与282，匀胶机转速4000～5000rpm。将胶层在紫外灯下照射10～15s，降低胶层的流动性。然后将两块盖板和微流道结构对齐并压紧，上下可各用一块2cm厚的石英玻璃板压住微流体芯片，如果压力不够可通过压力机外加压力。之后，将微流体芯片放在紫外灯下照射10～15min，使中间的微流道结构12和外部的两块盖板形11与13成为一个整体1。
将微流体芯片1的输入接口1112与泵32相连，注入样本流34；接口1111和1113与泵32相连，注入鞘液流33；接口1114与废液瓶36相连。注入液体，观察直流道37的截面35，则样本流34被鞘液流33聚焦在流道的水平中心位置，实现一维聚焦功能。
第二实施例
图4是本发明第二实施例中的微流体芯片的结构示意图。如图4所示，本实施例以一种具有二维聚焦功能的微流体芯片4为例，该微流体芯片的内部为三层微流道结构42、43和44，上下各有一层透明盖板41和45，内部还嵌有两块用于观察最内层流道43的透明薄 片46和47，叙述如何加工该芯片。
采用金属刻蚀的方法加工出三层微流道结构42、43和44，每层为4cm×6cm的150μm厚的医用级316不锈钢薄片。内部的三层微流道结构通过真空热压焊结的方法组合为一个整体48。加工两个1mm厚的透明盖板41和45。
对于该微流体芯片，位于中间层的直微流道431为需要光学检测的区域。因而该区域上下层的金属薄层进行了开上窗421和下窗441。加工两个与窗口相等大小、与金属薄层等厚度的透明薄片46和47，将透明薄片嵌入至窗口之中。有两种嵌入的方式。图5是本发明第二实施例中的透明薄片嵌入至窗口的示意图。如图5(A)所示，将透明薄片旋涂一层数微米厚的UV胶，而后嵌入至窗口中并采用紫外光使其与金属层封合，防止漏液。如图5(B)所示，当透明薄片和外部透明盖板的材质相同时，可将透明薄片46和47直接热压键合在透明盖板41和46上(例如，选用Borofloat33玻璃，将透明薄片和透明盖板定位后，抽真空至1e-2bars持续2.5分钟，使两者在范德华力的作用下吸附在一起，之后600℃高温下加热6小时)，形成新的透明盖板521和522，而后待新的透明盖板与微流道结构封合时直接嵌入到窗口之中。最后，通过UV胶合的手段将透明盖板和微流道结构封合为整体，加工出完整的微流体芯片4。
图6是本发明第二实施例中的微流体芯片的功能展现示意图。如图6所示，将微流体芯片4的输入接口62与泵64相连，注入样本流66；接口61和63与泵65相连，注入鞘液流67；接口68与废液瓶69相连。注入液体，观察直流道431的截面60，则样本流66被鞘液流67聚焦在流道的中心位置，实现二维聚焦功能。
第三实施例
图7是本发明第三实施例中的微流体芯片的结构示意图。如图7所示，本实施例以批量化加工具有二维聚焦功能的微流体芯片为例，可单次加工100个，叙述如何加工该芯片。
本实施例取40cm×60cm的150μm厚的医用级316不锈钢薄片。在40cm×60cm的光绘菲林片上图形化100个相同的微流道图形。通过金属刻蚀的方法，在3片不锈钢薄片上加工出微流道结构的三层结构72、73和74，每层上各有100个重复图形。之后将三层不锈钢薄片热压为一个整体77，并在最外两层的窗口中各嵌入100片透明薄片76。相应地，在2个40cm×60cm的透明板71和75上各加工出100个重复的盖板结构。通过UV胶合的手段，将透明板封接在三层不锈钢结构的外层，形成一个五层板结构78。之后通过激光切割或机械切割的手段，从五层板结构中切割出100个功能相同的微流体芯片79。实际操作中，还可以进一步扩大阵列数目，如一次加工500个微流体芯片。
本发明的实施例还公开了一种设备，包括：一个或者多个处理器；存储器；一个或者多个程序，所述一个或者多个程序存储在所述存储器中，当被所述一个或者多个处理器执行时，执行如上述实施例所述的批量化生产的多层微流体芯片制作方法。
本发明的实施例还公开了一种非易失性计算机存储介质，计算机存储介质存储有一个或者多个程序，当一个或者多个程序被一个设备执行时，使得设备执行上述实施例所述的批量化生产的多层微流体芯片制作方法。
另外，本发明实施例的批量化生产的多层微流体芯片制作方法、系统和非易失性计算机存储介质的其它构成以及作用对于本领域的技术人员而言都是已知的，为了减少冗余，不做赘述。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本发明的实施例，本领域的普通技术人员可以理解：在不脱离本发明的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本发明的范围由权利要求及其等同限定。

Claims (11)

  1. 一种适合于批量化生产的多层微流体芯片制作方法，其特征在于，包括以下步骤：
    提供内部结构层，其中，所述内部结构层包括多层金属板，所述多层金属板上通过刻蚀处理形成微流道结构，所述多层金属板通过热压键合或超声键合组装为一个整体；
    提供上部透明盖板和下部透明盖板，其中，所述上部透明盖板上设置有流入口和流出口；
    将所述上部透明盖板、所述内部结构层和所述下部透明盖板胶合封合。
  2. 根据权利要求1所述的适合于批量化生产的多层微流体芯片制作方法，其特征在于，所述多层金属板上通过刻蚀处理形成微流道结构进一步包括：
    对所述多层金属板上需要进行刻蚀处理的部位周围形成防蚀层；
    对需要进行刻蚀处理的部位进行刻蚀；
    刻蚀完成后清除所述防蚀层。
  3. 根据权利要求2所述的适合于批量化生产的多层微流体芯片制作方法，其特征在于，所述防蚀层通过丝网印刷、图形电镀、激光刻蚀和光刻图形化的方式形成。
  4. 根据权利要求1所述的适合于批量化生产的多层微流体芯片制作方法，其特征在于，所述上部透明盖板和所述下部透明盖板的材料为玻璃、石英、聚碳酸酯、聚甲基丙烯酸甲酯中的一种或多种。
  5. 根据权利要求1所述的适合于批量化生产的多层微流体芯片制作方法，其特征在于，所述提供内部结构层的步骤中还包括：
    在所述多层金属层中的预设金属层的上下两侧的金属层的指定位置分别形成上开口和下开口；
    提供与所述上开口和所述下开口形状相匹配的第一透明材料层和第二透明材料层；
    将所述第一透明材料层和所述第二透明材料层分别嵌入所述上开口和所述下开口中。
  6. 根据权利要求5所述的适合于批量化生产的多层微流体芯片制作方法，其特征在于，所述第一透明材料层和所述第二透明材料层的材料为玻璃、石英、聚碳酸酯、聚甲基丙烯酸甲酯中的一种或多种。
  7. 根据权利要求5所述的适合于批量化生产的多层微流体芯片制作方法，其特征在于，当所述上部透明盖板和所述第一透明材料层的材料相同，和/或所述下部透明盖板和所述第二透明材料层的材料相同时，还包括：
    将所述第一透明材料层通过热压键合固化到所述上部透明盖板上，和/或将所述第二透 明材料层通过热压键合固化到所述下部透明盖板上，以在所述上部透明盖板、所述内部结构层和所述下部透明盖板胶合封合时，将所述第一透明材料层嵌入所述上开口中，和/或将所述第二透明材料层嵌入所述下开口中。
  8. 根据权利要求1所述的适合于批量化生产的多层微流体芯片制作方法，其特征在于，所述将所述上部透明盖板、所述内部结构层和所述下部透明盖板胶合封合进一步包括：
    通过匀胶机在所述上部透明盖板和下部透明盖板上分别旋涂紫外光固化胶，从而在所述上部透明盖板和下部透明盖板上分别形成均匀胶层；
    在所述均匀胶层进行预固化处理；
    将所述上部透明盖板、所述内部结构层和所述下部透明盖板对准并压紧；
    通过紫外光照射完成所述上部透明盖板、所述内部结构层和所述下部透明盖板之间的封合。
  9. 根据权利要求1所述的适合于批量化生产的多层微流体芯片制作方法，其特征在于，还包括：
    在一块预设金属板上图形化多个微流道结构；
    通过一次刻蚀在所述预设金属板上形成多组所述内部结构层；
    在第一透明基底加工出多组所述上部透明盖板；
    在第二透明基底上加工出多组所述下部透明盖板；
    将所述第一透明基底、所述预设金属板和所述第二透明基底进行胶合后统一切割得到多个所述多层微流体芯片。
  10. 一种设备，其特征在于，包括：
    一个或者多个处理器；
    存储器；
    一个或者多个程序，所述一个或者多个程序存储在所述存储器中，当被所述一个或者多个处理器执行时，执行如权利要求1-9任一项所述的适合于批量化生产的多层微流体芯片制作方法。
  11. 一种非易失性计算机存储介质，其特征在于，所述计算机存储介质存储有一个或者多个程序，当所述一个或者多个程序被一个设备执行时，使得所述设备执行如权利要求1-9任一项所述的适合于批量化生产的多层微流体芯片制作方法。
PCT/CN2016/104945 2016-08-31 2016-11-07 适合于批量化生产的多层微流体芯片制作方法 WO2018040277A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610796048.7 2016-08-31
CN201610796048.7A CN106391151B (zh) 2016-08-31 2016-08-31 适合于批量化生产的多层微流体芯片制作方法

Publications (1)

Publication Number Publication Date
WO2018040277A1 true WO2018040277A1 (zh) 2018-03-08

Family

ID=58001838

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/104945 WO2018040277A1 (zh) 2016-08-31 2016-11-07 适合于批量化生产的多层微流体芯片制作方法

Country Status (2)

Country Link
CN (1) CN106391151B (zh)
WO (1) WO2018040277A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110961167A (zh) * 2018-09-29 2020-04-07 中国科学院微电子研究所 一种微流道网络芯片
CN115304376A (zh) * 2022-08-09 2022-11-08 之江实验室 一种透明陶瓷微流控芯片及其制备方法
CN115529801A (zh) * 2022-10-08 2022-12-27 江苏富乐华功率半导体研究院有限公司 一种微通道散热器的结构及其制备方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109234153B (zh) 2017-07-10 2022-08-09 京东方科技集团股份有限公司 基因测序芯片及其基因测序方法
CN107321400B (zh) * 2017-08-25 2019-12-03 京东方科技集团股份有限公司 微流控芯片的制造方法和微流控芯片
CN109012771B (zh) * 2018-07-23 2020-06-09 武汉大学 一种全透明的微流控声学体波芯片及其制备方法
KR102599473B1 (ko) 2018-08-24 2023-11-09 조에티스 서비시즈 엘엘씨 마이크로 유체 회전자 디바이스를 제조하기 위한 방법
CA3108277C (en) * 2018-08-24 2023-08-08 Zoetis Services Llc Microfluidic rotor device
EP3840883A1 (en) 2018-08-24 2021-06-30 Zoetis Services LLC Microfluidic rotor device
CN109731621B (zh) * 2019-01-02 2020-07-24 京东方科技集团股份有限公司 微流控基板及其制备方法、微流控面板
CN111298853B (zh) * 2020-02-27 2021-08-10 西人马联合测控（泉州）科技有限公司 芯片的切割成型方法以及晶圆
CN111320133B (zh) * 2020-02-27 2022-03-25 西人马联合测控（泉州）科技有限公司 芯片的分离方法以及晶圆
CN111617813B (zh) * 2020-06-05 2021-11-30 深圳市尚维高科有限公司 生物检测芯片及制作方法
CN112295623B (zh) * 2020-11-02 2021-10-08 苏州汉骅半导体有限公司 微流芯片及其制造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020187560A1 (en) * 2001-06-07 2002-12-12 Nanostream, Inc. Microfluidic systems and methods for combining discrete fluid volumes
US20030022505A1 (en) * 2001-07-24 2003-01-30 Luc Ouellet Micro-fluidic devices
CN102921480A (zh) * 2012-10-26 2013-02-13 北京理工大学 一种利用紫外固化光胶制作微流控芯片的方法
EP2628790A1 (en) * 2012-02-16 2013-08-21 Fachhochschule Kaiserslautern Micro fluidic system for simulating in vivo-equivalent cell barriers
CN103301891A (zh) * 2013-05-27 2013-09-18 苏州扬清芯片科技有限公司 一种自加热型微流控芯片

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012004297A1 (en) * 2010-07-09 2012-01-12 Sophion Bioscience A/S A chip assembly for use in a microfluidic analysis system
CN103055985A (zh) * 2012-12-31 2013-04-24 兰州大学 一种基于金属丝热压法的聚合物微流控芯片批量制造工艺
CN103752358B (zh) * 2014-01-23 2015-07-15 西南科技大学 一种聚合物微流控芯片及其制备方法
CN104607256A (zh) * 2014-12-31 2015-05-13 北京同方生物芯片技术有限公司 等离子体辅助热压键合微流控芯片及其制备方法
CN105214747B (zh) * 2015-11-11 2017-05-10 东南大学 一种夹片式微流控器件及制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020187560A1 (en) * 2001-06-07 2002-12-12 Nanostream, Inc. Microfluidic systems and methods for combining discrete fluid volumes
US20030022505A1 (en) * 2001-07-24 2003-01-30 Luc Ouellet Micro-fluidic devices
EP2628790A1 (en) * 2012-02-16 2013-08-21 Fachhochschule Kaiserslautern Micro fluidic system for simulating in vivo-equivalent cell barriers
CN102921480A (zh) * 2012-10-26 2013-02-13 北京理工大学 一种利用紫外固化光胶制作微流控芯片的方法
CN103301891A (zh) * 2013-05-27 2013-09-18 苏州扬清芯片科技有限公司 一种自加热型微流控芯片

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110961167A (zh) * 2018-09-29 2020-04-07 中国科学院微电子研究所 一种微流道网络芯片
CN115304376A (zh) * 2022-08-09 2022-11-08 之江实验室 一种透明陶瓷微流控芯片及其制备方法
CN115529801A (zh) * 2022-10-08 2022-12-27 江苏富乐华功率半导体研究院有限公司 一种微通道散热器的结构及其制备方法
CN115529801B (zh) * 2022-10-08 2024-01-02 江苏富乐华功率半导体研究院有限公司 一种微通道散热器的结构及其制备方法

Also Published As

Publication number Publication date
CN106391151B (zh) 2018-11-09
CN106391151A (zh) 2017-02-15

Similar Documents

Publication Publication Date Title
WO2018040277A1 (zh) 适合于批量化生产的多层微流体芯片制作方法
KR100763907B1 (ko) 미세유동 장치의 제조방법 및 그에 의하여 제조되는미세유동 장치
CN106770294A (zh) 一种离心式微流控芯片、制作方法及其应用方法
CN114433260B (zh) 一种基于纳米裂纹的纳流控芯片及其加工方法
RU2748273C2 (ru) Подложка с наноотпечатком
WO2018105608A1 (ja) 粒子捕捉デバイス
CN1648663A (zh) 一种玻璃微流控芯片及制作方法
US20090010673A1 (en) Filter and method of manufacturing the same
KR101511040B1 (ko) 미세채널에 플라즈모닉 구조를 선택적으로 갖는 미세유체칩을 제조하는 방법
US7682541B2 (en) Manufacturing method of a microchemical chip made of a resin
JP4313682B2 (ja) Ｐｄｍｓ基板と他の合成樹脂基板との接着方法及びマイクロチップの製造方法
JP2002055098A (ja) 液体試料分析素子及び液体試料分析素子の製造方法
CN110227563B (zh) Pdms微流控芯片防蒸发的密封方法及pdms微流控芯片
JP2019155550A (ja) マイクロ流路の製造方法
CN105032509A (zh) 一种基于聚合物基板的微流控芯片的制备方法
CN110560185B (zh) 一种自密封的微纳流控芯片加工方法
WO2003024597A1 (en) Microscale fluid handling system
TWI461230B (zh) 用於過濾血清之過濾薄膜及其製造方法與過濾裝置
CN1641346A (zh) 沉陷铜电极电化学微流控芯片的制备方法
JP4966694B2 (ja) 微細構造金型の製造方法
TWI422823B (zh) 流體檢測試片的製造方法
KR101550221B1 (ko) 신호대 잡음비 향상 금속 형광강화 기판 및 그 제조 방법과, 이를 이용한 바이오칩
WO2023008398A1 (ja) マイクロ流路チップ及びマイクロ流路チップの製造方法
JP4944640B2 (ja) 微細構造金型の製造方法
CN108311177B (zh) 一种3d pdms微流控芯片对准组装结构的制作方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16914840

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16914840

Country of ref document: EP

Kind code of ref document: A1