WO2018034442A1 - Dispositif de chauffage et système de chauffage pour moyen de transport - Google Patents

Dispositif de chauffage et système de chauffage pour moyen de transport Download PDF

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Publication number
WO2018034442A1
WO2018034442A1 PCT/KR2017/008076 KR2017008076W WO2018034442A1 WO 2018034442 A1 WO2018034442 A1 WO 2018034442A1 KR 2017008076 W KR2017008076 W KR 2017008076W WO 2018034442 A1 WO2018034442 A1 WO 2018034442A1
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WO
WIPO (PCT)
Prior art keywords
disposed
heating
ceramic layer
heat
ceramic substrate
Prior art date
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PCT/KR2017/008076
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English (en)
Korean (ko)
Inventor
이인재
김원진
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from KR1020160105805A external-priority patent/KR102583758B1/ko
Priority claimed from KR1020160131651A external-priority patent/KR20180040054A/ko
Priority claimed from KR1020170000744A external-priority patent/KR20180079956A/ko
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to CN201790001187.4U priority Critical patent/CN210518876U/zh
Publication of WO2018034442A1 publication Critical patent/WO2018034442A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
    • B60H1/00—Heating, cooling or ventilating [HVAC] devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
    • B60H1/00—Heating, cooling or ventilating [HVAC] devices
    • B60H1/22—Heating, cooling or ventilating [HVAC] devices the heat being derived otherwise than from the propulsion plant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/03—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H05B3/42—Heating elements having the shape of rods or tubes non-flexible
    • H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
    • H05B3/50—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material heating conductor arranged in metal tubes, the radiating surface having heat-conducting fins

Definitions

  • This embodiment relates to a heating system for a heater and a vehicle.
  • the heater functions to generate heat to the components of the heating system.
  • the heater is essentially installed in a moving means such as a car in response to the needs of the consumer, and may also be referred to as a "heating device", “heating device”.
  • Electric cars are also equipped with heating systems, just like regular internal combustion engine cars.
  • the present embodiment is to provide a heater and a vehicle heating system including the same that can increase energy efficiency and durability.
  • the heater according to the present embodiment includes a case in which the inlet and the outlet are disposed to face each other so that the heat medium passes; A heating module disposed between the inlet and the outlet of the case; And a power module disposed on one side of the case and electrically connected to the heat generating module, wherein the heat generating module includes a plurality of heat dissipation fins and a plurality of heating cores alternately arranged with each other.
  • a ceramic substrate part including a first ceramic layer and a second ceramic layer disposed on the first ceramic layer; And a heat diffusion element disposed between the first ceramic layer and the second ceramic layer, wherein the thermal diffusion plate is disposed on any one of the first ceramic layer and the second ceramic layer.
  • the heat generating element may include a first heat generating unit extending from one side to the other side, and a second heat generating unit extending from the predetermined point on the other side back to one side and a third heat generation extending from the predetermined point on one side of the second heat generating unit to the other side again.
  • the first heating unit, the second heating unit and the third heating unit may be spaced apart from each other.
  • the heating module may further include a first gasket and a second gasket disposed on one side and the other side of the case.
  • the heating core further includes a cover part covering the ceramic substrate part, wherein the cover part is formed to extend from the ceramic substrate part on one side and the other side, and one side of the cover part is inserted into the first gasket, and the cover part The other side may be inserted into the second gasket to support the heating core by the first gasket and the second gasket.
  • the heating module further includes a first electrode terminal disposed on one side and electrically connected to the heating element, and the power module includes a first connection terminal coupled to the first electrode terminal and the first electrode.
  • the terminal includes a first binding member and a second binding member that face each other in a direction through which the heat medium passes, and the first binding member extends to one side and is bent to move closer to the second binding member and to be separated from each other.
  • the second binding member extends to one side and is bent to approach and move away from the first binding member.
  • the first connection terminal is interposed between the first binding member and the second binding member. It may be coupled to the first electrode terminal.
  • the first heat diffusion plate and the second heat diffusion plate may be disposed to face each other in a direction in which the heating cores are arranged.
  • the thermal expansion coefficients of the first thermal diffusion plate, the ceramic substrate part, and the second thermal diffusion plate may be the same.
  • At least one of the first and second thermal diffusion plates may include a first thermal diffusion layer, a second thermal diffusion layer disposed on the first thermal diffusion layer, and a third thermal diffusion layer disposed on the second thermal diffusion layer. It may include.
  • the second thermal diffusion layer may include molybdenum.
  • the first thermal diffusion layer and the third thermal diffusion layer may include copper or aluminum.
  • a protrusion may be formed on a surface of at least one of the first and second heat diffusion plates.
  • the electronic device may further include a thermal conductor disposed between the first ceramic layer and the second ceramic layer and disposed on a side surface of the heat generating element.
  • the thermal conductivity of the thermal conductor may be higher than that of the first ceramic layer and the second ceramic layer.
  • the thermal conductor may include at least one of aluminum nitride, silicon nitride, and boron nitride.
  • the first ceramic layer and the second ceramic layer may be integrally bonded at the edge.
  • the porosity of the ceramic substrate may be 3% or less.
  • the display device may further include a first electrode pad disposed on the first ceramic layer or the second ceramic layer and connected to the first end of the heating element, and a second electrode pad connected to the second end of the heating element.
  • Heating system used in the moving means is a flow path for moving air; An air supply unit installed at one side of the flow path to introduce air from the outside; An exhaust unit installed at the other side of the flow path and discharging air to the interior of the moving unit; And a heater disposed between the air supply unit and the exhaust unit to heat air in the flow path, wherein the heater comprises: a case in which an inlet and an outlet are disposed to face each other; A heating module disposed between the inlet and the outlet of the case; And a power module disposed on one side of the case and electrically connected to the heat generating module, wherein the heat generating module extends from one side to the other side, and includes a plurality of heat dissipation fins and a plurality of heating cores alternately arranged.
  • the heating core includes: a ceramic substrate part including a first ceramic layer and a second ceramic layer disposed on the first ceramic layer; And a heat diffusion element disposed between the first ceramic layer and the second ceramic layer, wherein the thermal diffusion plate is disposed on any one of the first ceramic layer and the second ceramic layer.
  • the heating core is a first thermal diffusion plate, a first ceramic layer disposed on the first thermal diffusion plate, a heating element disposed on the first ceramic layer, disposed on the first ceramic layer A second ceramic layer, and a second thermal diffusion plate disposed on the second ceramic layer.
  • It may further include a thermal conductor disposed on the first ceramic layer, disposed on the side of the heat generating element.
  • the heat efficiency is increased by using a ceramic heater in which the heat generating elements are stacked in the direction in which the heat medium (air) passes.
  • the heater can be sized up without changing the cross-sectional area of the heater occupied by the dashboard.
  • the heating module of this embodiment is coupled to the power module by an electrode terminal including a curved pair of binding members.
  • the shape of the binding member enhances the coupling force of the heating module and the power module to improve the durability of the heater of the present embodiment.
  • this embodiment presents design conditions in which the ratio of the cross-sectional area of the ceramic substrate and the heating element and the thickness of the heat dissipation fin and the heating core are optimally adjusted.
  • the present invention provides a heating system for moving means including the heater of the present embodiment.
  • FIG. 1 is a perspective view showing a heater of this embodiment.
  • FIG. 2 is a plan view showing a heating module of the present embodiment.
  • FIG 3 is an exploded perspective view showing the heating rod of the present embodiment.
  • FIG. 4 is a cross-sectional view showing the ceramic substrate, the first thermal diffusion plate and the second thermal diffusion plate of this embodiment.
  • FIG. 5 is a horizontal sectional view showing the ceramic substrate of this embodiment.
  • FIG. 6 is an exploded perspective view showing a heater of this embodiment.
  • FIG. 7 is a conceptual diagram illustrating a state in which the first electrode terminal and the second connection terminal of the present embodiment are coupled.
  • FIG. 8 is a block diagram showing a heating system for a moving means of the present embodiment.
  • FIG. 9 is a cross-sectional view of a ceramic substrate according to another embodiment of the present invention.
  • FIG. 10 is an exploded view of a ceramic substrate according to another embodiment of the present invention.
  • FIG 11 is various shapes of a heating element disposed in a ceramic substrate according to another embodiment of the present invention.
  • FIG. 12 is a cross-sectional view of a ceramic substrate according to another embodiment of the present invention.
  • FIG. 13 is a cross-sectional view of a ceramic substrate according to still another embodiment of the present invention.
  • FIG. 14 is a flowchart illustrating a method of manufacturing a ceramic substrate according to the embodiments of FIGS. 9 to 13.
  • FIG. 15A shows a cross-sectional view of a ceramic substrate manufactured according to a comparative example
  • FIG. 15B shows a cross-sectional view of a ceramic substrate manufactured according to the embodiment.
  • FIG. 16 shows an example of a ceramic substrate having a cylindrical shape.
  • FIG. 17 is a cross-sectional view of a thermal diffusion plate and a ceramic substrate according to an embodiment of the present invention.
  • FIG. 18 shows a thermal diffusion plate according to an embodiment of the present invention.
  • FIG. 19 shows a heater according to another embodiment of the present invention.
  • first, second, A, B, (a), and (b) may be used. These terms are only for distinguishing the components from other components, and the nature, order or order of the components are not limited by the terms.
  • a component is described as being “connected”, “coupled” or “connected” to another component, the component may be directly connected, coupled or connected to the other component, but the component and its other components It is to be understood that another component may be “connected”, “coupled” or “connected” between the elements.
  • the " front and rear direction " used below is the y-axis direction shown in the drawing.
  • forward is set in the direction of the arrow on the y-axis.
  • up-down direction is taken as the z-axis direction shown in the drawing.
  • lower side refers to the direction of the arrow on the z-axis.
  • left-right direction is taken as the x-axis direction shown in drawing. In this case, “left” is set in the direction of the arrow on the x-axis.
  • FIG. 1 is a perspective view showing a heater of this embodiment
  • Figure 2 is a plan view showing a heat generating module of the present embodiment
  • Figure 3 is an exploded perspective view showing a heating rod of the present embodiment
  • Figure 4 is a ceramic substrate of the present embodiment
  • the first 6 is an exploded perspective view illustrating a heater of the present embodiment
  • FIG. 7 is a conceptual diagram illustrating a state in which the first electrode terminal and the second connection terminal of the present embodiment are coupled to each other.
  • the heater 1000 of the present embodiment may include a case 100, a heating module 200, and a power module 300.
  • the case 100 may be an exterior member of the heater 1000.
  • the heating module 200 may be accommodated in the case 100.
  • the power module 300 may be disposed below the case 100.
  • the case 100 may be supported by the power module 300.
  • the case 100 and the power module 300 may be coupled to each other.
  • the lower part of the case 100 is accommodated in the case guide hole 310 of the power module 300, which will be described later, the case 100 and the power module 300 may be fitted into the coupling.
  • the lower part of the front, rear, left and right sides of the case 100 may be accommodated in the case guide hole 310.
  • the case 100 may have a hollow block shape or a cage shape.
  • the case 100 may include a case front surface 110 and a case rear surface 120.
  • the case front surface 110 may be a surface located in front of the case 100.
  • the case rear surface 120 may be a surface located behind the case 100.
  • a plurality of inlets may be formed in the case front surface 110.
  • the plurality of inlets may be arranged in rows in up, down, left, and right directions.
  • a plurality of outlets may be formed on the rear surface 120 of the case. In this case, the plurality of outlets may be formed to correspond to the inlet of the case front surface 110 by matching the columns in the vertical direction.
  • the outer heating medium is introduced into the case 100 through the inlet of the case front surface 110, and then heated by the heat generating module 200 inside the case 100 to open the outlet of the case rear surface 120. Through the case 100 may be discharged to the outside. That is, the external heat medium (air) can pass through the case 100 from the front to the back.
  • the heating module 200 may be disposed inside the case 100.
  • the heating module 200 may be electrically connected to the power module 300.
  • the heat generating module 200 may include a heat dissipation fin 210, a heating core 220, a first gasket 230, and a second gasket 240.
  • the plurality of heat dissipation fins 210 and the heating cores 220 extending from the lower side to the upper side may be alternately arranged.
  • the arrangement direction of the heat dissipation fin 210 and the heating core 220 may be left and right directions.
  • the upper side of the heating core 220 may be supported by the first gasket 230.
  • the lower side of the heating core 220 may be supported by the second gasket 240.
  • the heat dissipation fin 210 may be disposed in the case 100. There may be a plurality of heat dissipation fins 210. The plurality of heat dissipation fins 210 may be spaced apart from each other in the left and right directions. A plurality of heating cores 220 may be disposed between the plurality of heat dissipation fins 210. Therefore, the heat dissipation fin 210 and the heating core 220 may be adjacent to each other. In this case, the left and right sides of the heat dissipation fin 210 and the left and right sides of the heating core 220 may be joined. Silver paste or thermally conductive silicon may be used as a bonding agent of the heat dissipation fin 210 and the heating core 220. As a result, heat generated in the heating core 220 may be transferred to the heat dissipation fin 210.
  • the heat dissipation fin 210 may be extended from the lower side to the upper side.
  • the heat dissipation fin 210 may be a louver fin.
  • the shape of the heat dissipation fin 210 may be a waveform vibrating from side to side in a wave traveling from the lower side to the upper side. That is, the heat dissipation fins 210 may have a form in which plates inclined in a left and right direction and a reverse direction thereof are stacked in a vertical direction. Therefore, a plurality of gaps may be formed in the heat dissipation fin 210 through which the heat medium (air) can pass in the front-rear direction.
  • the heat transfer area in which heat generated from the heating core 220 is transferred to the heat medium (air) may be increased, thereby improving thermal efficiency.
  • the heating core 220 may be disposed inside the case 100 as a heat generating portion.
  • the heating core 220 may be electrically connected to the power module 300.
  • the plurality of heating cores 220 may be spaced apart from each other in the left and right directions.
  • a plurality of heat dissipation fins 210 may be disposed between the plurality of heating cores 220. Therefore, the heating core 220 and the heat dissipation fin 210 may be adjacent to each other.
  • the left and right side surfaces of the heating core 220 may contact the left and right sides of the heat dissipation fin 210.
  • Thermal conductive silicon may be used as a bonding agent between the heating core 220 and the heat dissipation fin 210. As a result, heat generated in the heating core 220 may be transferred to the heat dissipation fin 210.
  • the heating core 220 may have a shape extending from the lower side to the upper side.
  • the heating core 220 includes a ceramic substrate 221, a heating element 222, a first thermal diffusion plate 223, a second thermal diffusion plate 224, a first electrode terminal 225, and a second electrode terminal 226.
  • the cover unit 227 may be included.
  • the ceramic substrate 221 may accommodate the heat generating element 222 made of a ceramic material.
  • the heating core 220 of the present embodiment may be lighter than the PTC thermistor by the ceramic covering the heat generating element 222, free from heavy metals such as lead (Pb), far-infrared rays, and the like, and have a high thermal conductivity.
  • the first thermal diffusion plate 223 may be disposed on the left side of the ceramic substrate 221.
  • the second thermal diffusion plate 224 may be disposed on the right side of the ceramic substrate 221.
  • the ceramic substrate 221 may be accommodated in the cover 227 together with the first heat spreader 223 and the second heat spreader 224.
  • the ceramic substrate 221 may include a first ceramic substrate 221a and a second ceramic substrate 221b.
  • the ceramic substrate 221 may include a left side and a right side opposite thereto.
  • the left surface of the ceramic substrate portion 221 may be referred to as a "first surface.”
  • the right side surface of the ceramic substrate unit 221 may be referred to as a "second surface”.
  • the first ceramic substrate 221a may be disposed on the left side, and the second ceramic substrate 221b may be disposed on the right side.
  • the heating element 222 may be disposed on the right side of the first ceramic substrate 221a by printing, patterning, or deposition. After the heating element 222 is disposed on the first ceramic substrate 221a, the first ceramic substrate 221a and the second ceramic substrate 221b are sintered 1500 to integrally form the ceramic substrate portion 221. Can be. In this case, the right side surface of the first ceramic substrate 221a and the left side surface of the second ceramic substrate 221b may be aligned and sintered.
  • Terminal 226 may be disposed and bonded.
  • the first and second electrode terminals 225 and 226 may be disposed and bonded to lower ends of the first and second ceramic substrates 221a and 221b.
  • the first and second electrode terminals 225 and 226 may be electrically connected to the heating element 222.
  • the heating element 222 may be electrically connected to the first and second electrode terminals 225 and 226. Separate leader line may be extended.
  • the heat generating element 222 may be disposed in the ceramic substrate 221.
  • the heating element 222 may be disposed on the right side of the first ceramic substrate 221a by printing, patterning, or deposition.
  • the heating element 222 may be a resistor line.
  • the heat generating element 222 may be a resistor such as tungsten (w) and molybdenum (Mo). Therefore, the heating element 222 may generate heat when electricity flows.
  • the heating element 222 may be arranged to be stacked in the front-rear direction (the direction in which the heat medium passes) while alternately extending from the lower side to the upper side and then turned up (bending or bending) to extend from the upper side to the lower side.
  • the heating element 222 extends from one side to the other side from the first heat generating portion extending from one side and the other side from the predetermined point of the other side and the second heat generating portion extending from one side to the other side again from another predetermined point.
  • Including a third heat generating portion, the first heat generating portion, the second heat generating portion and the third heat generating portion may be spaced apart from each other. Therefore, while the heat medium (air) passes through the heat generating module 200, the heat medium (air) may be heated while passing through the heat generating portion of the heater core 220. That is, the contact area of heat generated from the heat medium (air) and the heater core 220 can be increased by the arrangement of the heat generating elements 222.
  • Both ends of the heating element 222 may be electrically connected to each of the first and second electrode terminals 225 and 226.
  • An end positioned at the front of both ends of the heating element 222 may be electrically connected to the first electrode terminal 225.
  • An end located at the rear of both ends of the heating element 222 may be electrically connected to the second electrode terminal 226.
  • the first and second electrode terminals 225 and 226 may receive power from the power module 300 to be described later. Therefore, a current may flow in the heating element 222.
  • the heat generating element 222 may generate heat. In this case, the intensity, direction, and wavelength of the current supplied to the heating element 222 may be controlled by the power module 300.
  • Each of the first and second thermal diffusion plates 223 and 224 may be bonded to the left and right sides of the ceramic substrate 221.
  • the first thermal diffusion plate 223 may be bonded to the left surface of the first ceramic substrate 221a.
  • the second thermal diffusion plate 224 may be bonded to the right side surface of the second ceramic substrate 221b.
  • An active metal layer may be used to bond the first and second thermal diffusion plates 223 and 224 to the first and second ceramic substrates 221a and 221b.
  • the active metal layer may be an active metal alloy of the titanium group.
  • the active metal layer may be disposed on the left side of the first ceramic substrate 221a and the right side of the second ceramic substrate 221b.
  • the active metal layer and the ceramic may react to form oxides or nitrides.
  • the first and second thermal diffusion plates 223 and 224 and the first and second ceramic substrates 221a and 221b may be aligned and bonded to each other.
  • the first thermal diffusion plate 223 may include a first thermal diffusion layer 223a, a second thermal diffusion layer 223b, and a third thermal diffusion layer 223c sequentially stacked on the outer side (left side) of the first ceramic substrate 221a. Can be. Bonding of the first, second, and third thermal diffusion layers 223a, 223b, and 223c may be performed by hot pressing.
  • the second thermal diffusion plate 223 may include a fourth thermal diffusion layer 224a, a fifth thermal diffusion layer 224b, and a sixth thermal diffusion layer 224c that are sequentially stacked on the outer side (right side) of the second ceramic substrate 221b. Can be. The bonding of the fourth, fifth and sixth thermal diffusion layers 224a, 224b and 224c may be performed by hot pressing.
  • the material of the first, third, fourth, and sixth thermal diffusion layers 223a, 223c, 224a, and 224c may include copper (Cu) or aluminum (Al).
  • the material of the second and fifth thermal diffusion layers 223b and 224b may include molybdenum (Mo). Therefore, the first, second, second, third, fourth, fifth, and sixth thermal diffusion layers 223a, 223b, 223c, 224a, 224b, and 224c have high thermal conductivity and thus may evenly distribute heat generated from the ceramic substrate 221. .
  • the thermal expansion coefficient may be adjusted by adjusting the thicknesses (left and right directions) of the second and fourth thermal diffusion layers 223b and 224b.
  • the thermal expansion coefficients of the first and second thermal diffusion plates 223 and 224 may be determined according to preset conditions reflecting the thermal expansion coefficient of the ceramic substrate 221. That is, the thermal expansion coefficients of the first and second thermal diffusion plates 223 and 224 may have a value similar to that of the ceramic substrate portion 221. Further, the thermal expansion coefficients of the first and second thermal diffusion plates 223 and 224 may have the same value as the thermal expansion coefficient of the ceramic substrate 221. For example, when the thermal expansion coefficient of the ceramic substrate portion 221 is 7 ppm /, the thermal expansion coefficient of the first thermal diffusion plate 223 and the second thermal diffusion plate 224 may also be 7 ppm /, respectively. At this time, the thermal conductivity of the thermal diffusion plate may be 230W / mK.
  • the thermal expansion coefficients of the first thermal diffusion plate 223 and the second thermal diffusion plate 224 may be 0.8 to 1.2 times the thermal expansion coefficient of the ceramic substrate 221.
  • the ceramic substrate portion 221 having good thermal conductivity but brittle and easily damaged by thermal shock can be reinforced.
  • the first and second thermal diffusion plates 223 and 224 may be additional components that can be changed by design request. That is, any one of the first and second thermal diffusion plates 223 and 224 may be omitted from the heating core 220. In addition, both of the first and second thermal diffusion plates 223 and 224 may be omitted from the heating core 220.
  • the first and second electrode terminals 225 and 226 may be disposed under the heating core 220.
  • the first and second electrode terminals 225 and 226 may be disposed under the ceramic substrate 221.
  • the first electrode terminal 225 may be disposed below the front of the ceramic substrate 221.
  • the second electrode terminal 226 may be disposed under the rear of the ceramic substrate 221.
  • the first and second electrode terminals 225 and 226 may be electrically connected to the heating element 222.
  • the first and second electrode terminals 225 and 226 may be electrically connected to the power module 300.
  • the first electrode terminal 225 may be electrically connected to the first connection terminal 330 of the power module 300 to be described later.
  • the second electrode terminal 226 may be electrically connected to the second connection terminal 340 of the power module 300 to be described later.
  • the first electrode terminal 225 may include a first connector 225a, a first electrode terminal body 225b, a first binding member 225c, and a second binding member 225d.
  • the first connector 225a, the first electrode terminal body 225b, the first binding member 225c and the second binding member 225d may be integrally formed.
  • the first connector 225a may have a plate shape having a surface formed in a left and right direction.
  • the first connector 225a may be bonded to the lower front of the left side of the first ceramic substrate 221a.
  • the first connector 225a may be bonded to the lower front of the right side of the first ceramic substrate 221a. In this case, the first connector 225a may be interposed between the first ceramic substrate 221a and the second ceramic substrate 221b.
  • the first connector 225a may be bonded to the lower front of the right side of the second ceramic substrate 221b.
  • the first connector 225a may be electrically connected to an end positioned at the front of both ends (the start point and the end point of the heat generation line) of the heating element 222.
  • the first electrode terminal body 225b may have a block shape, and a first connection part 225a may be connected to an upper portion thereof.
  • the first binding member 225c may be connected to the lower front of the first electrode terminal body 225b.
  • the second binding member 225d may be connected to the lower rear side of the first electrode terminal body 225b.
  • the first binding member 225c may be in the form of a plate that is curved or bent (bent) backward.
  • the second binding member 225d may be in the form of a plate that is curved or bent (bent) forward.
  • the first and second binding members 225c and 225d may be disposed to face each other in the front-rear direction. Accordingly, the first binding member 225c may be bent or bent to move closer to the lower side and closer to the second binding member 225d, and the second binding member 225d may be bent toward the lower side. It may be bent or bent to close to and away from).
  • a first connection terminal 330 described later may be inserted between the first and second binding members 225c and 225d. As a result, the first electrode terminal 225 and the power module 300 may be electrically connected.
  • the second electrode terminal 226 may include a second connector 226a, a second electrode terminal body 226b, a third binding member 226c, and a fourth binding member 226d.
  • the second connector 226a, the second electrode terminal body 226b, the third binding member 226c, and the fourth binding member 226d may be integrally formed.
  • the second connector 226a may be in the form of a plate having a surface formed in the left and right directions.
  • the second connector 226a may be bonded to the lower back of the left side of the first ceramic substrate 221a.
  • the second connector 226a may be bonded to the lower rear side of the right surface of the first ceramic substrate 221a.
  • the second connector 226a may be interposed between the first ceramic substrate 221a and the second ceramic substrate 221b.
  • the second connector 226a may be bonded to the lower front of the right side of the second ceramic substrate 221b.
  • the second connector 226a may be electrically connected to an end positioned at a rear side of both ends (starting point and end point of the heating line) of the heating element 222.
  • the second electrode terminal body 226b may have a block shape, and a second connector 226a may be connected to an upper portion thereof.
  • the third binding member 226c may be connected to the lower front of the second electrode terminal body 226b.
  • a fourth binding member 226d may be connected to the lower rear side of the second electrode terminal body 225b.
  • the third binding member 226c may be in the form of a plate that is curved or bent backwards.
  • the fourth binding member 226d may have a plate shape that is curved or bent forward.
  • the third and fourth binding members 226c and 226d may be disposed to face each other in the front-rear direction. Therefore, the third binding member 226c may be bent or bent to move closer to the lower side and closer to the fourth binding member 226d, and the fourth binding member 226d may have a third binding member 226c toward the lower side. It may be bent or bent to close to and away from).
  • a second connection terminal 340 to be described later may be inserted between the third and fourth binding members 226c and 226d.
  • the second electrode terminal 226 and the power module 300 may be electrically connected.
  • Current may be supplied from the power module 300 to the heating element 222 through the first and second electrode terminals 225 and 226.
  • the heat generating element 222 may generate heat.
  • the material of the cover part 227 may include aluminum (Al).
  • the cover part 227 may be in the form of a hollow bar or rod extending in the vertical direction to the exterior member of the heating rod 220. Therefore, the cover portion 227 may be formed with a cover hole 227a penetrating in the vertical direction.
  • the ceramic substrate 221, the heat generating element 222, the first heat diffusion plate 223, and the second heat diffusion plate 224 may be accommodated in the cover 227.
  • the inner surface of the cover hole 227a may be in contact with the front surface and the rear surface of the ceramic substrate portion 221, the left surface of the first thermal diffusion plate 223, and the right surface of the second thermal diffusion plate 224.
  • the first and second thermal diffusion plates 223 and 224 may be omitted.
  • the inner surface of the cover hole 227a may be in contact with four front, rear, left, and right sides of the ceramic substrate 221.
  • Thermally conductive silicon may be used to bond the cover part 227 to the ceramic substrate part 221 and the first and second thermal diffusion plates 223 and 224.
  • the left side of the cover 227 may be in contact with the right side of the heat dissipation fin 210 located on the left side of the cover 227.
  • the right side surface of the cover portion 227 may be in contact with the left side portion of the heat dissipation fin 210 located on the right side of the cover portion 227.
  • Thermally conductive silicon may be used to bond the cover part 227 to the heat dissipation fin 227.
  • the cover 227 may serve to protect the ceramic substrate 221 and the first and second thermal diffusion plates 223.
  • the cover 227 may have a high thermal conductivity and may serve to diffuse heat generated from the heat generating element 222 of the ceramic substrate 221.
  • the cover part 227 may be easily bonded to the heating rod 220 and the heat dissipation fin 210 because of good adhesion.
  • the cover part 227 may be formed to have an upper side extending upward from an upper side of the ceramic substrate 221 and the first and second thermal diffusion plates 223 and 224.
  • the lower side of the cover portion 227 may be formed to extend below the lower side of the ceramic substrate portion 221 and the first and second thermal diffusion plates 223 and 224. That is, the vertical length of the cover part 227 may be longer than the vertical length of the ceramic substrate part 221 and the first and second thermal diffusion plates 223 and 224.
  • the upper portion (upper side) of the cover part 227 may be inserted into the first accommodation hole 231 of the first gasket 230 to be described later.
  • the cover portion 227 may be inserted into the first accommodating portion 231. Accordingly, the first gasket 230 may not directly receive heat transfer from the ceramic substrate 221 and the first and second thermal diffusion plates 223 and 224. As a result, damage due to deterioration of the first gasket 230 can be prevented.
  • the lower portion (lower side) of the cover portion 227 may be inserted into the second accommodation portion 241 of the second gasket 240 to be described later. In this case, only the lower portion extending from the cover portion 227 beyond the ceramic substrate portion 221 and the first and second thermal diffusion plates 223 and 224 may be inserted into the first accommodation hole 231.
  • the second gasket 240 may not directly receive heat transfer from the ceramic substrate 221 and the first and second thermal diffusion plates 223 and 224. As a result, damage due to deterioration of the second gasket 240 can be prevented.
  • the first and second electrode terminals 225 and 226 of the heating core 220 may be exposed downward through the second receiving portion downward. As a result, the first and second electrode terminals 225 and 226 may be electrically connected to the power module 300 positioned under the heating core 220.
  • the heating core 220 may be supported by inserting the cover 227 into the first and second gaskets 230 and 240. Therefore, the cover portion 227 may also perform the function of the support member.
  • the cover 227 may not be an essential component of the heating core 220. That is, the cover part 227 may be omitted by design request.
  • the upper and lower portions of the ceramic substrate 221 may be inserted into the first and second gaskets 230 and 240.
  • upper and lower portions of the ceramic substrate 221 and the first and second thermal diffusion plates 223 and 224 may be inserted into the first and second gaskets 230 and 240.
  • the first gasket 230 may be located above the inside of the case 100.
  • the second gasket 240 may be located below the case 100.
  • the case 100 is in the form of a hollow box, and the first and second gaskets 230 and 240 may be coupled and fixed to the upper and lower portions of the case 100 by pinching and bonding, respectively.
  • the first and second gaskets 230 and 240 may be provided with a plurality of first and second accommodation parts 231 and 241 spaced apart in the left and right directions.
  • a plurality of first accommodating parts 231 protruding upward may be formed in the first gasket 230.
  • a plurality of second accommodating parts 241 protruding downward may be formed in the second gasket 240.
  • the plurality of first and second accommodating parts 231 and 241 may be formed in one-to-one correspondence with the plurality of heating cores 220. Therefore, the upper portion of the heating core 220 may be inserted into the corresponding first receiving portion 231. In addition, the lower portion of the heating core 220 may be inserted into the corresponding second receiving portion 241.
  • the first and second electrode terminals 225 and 226 of the heating core 220 may extend downward through the second receiving portion 241. Accordingly, the first and second electrode terminals 225 and 226 may be exposed to the lower side and electrically connected to the power module 300 disposed under the heating core 220.
  • the heating core 220 may be securely fixed in the form of a pillar having upper and lower fixed ends, and may be embedded in the case 100.
  • the power module 300 may be disposed below the case 100.
  • the power module 300 may be combined with the case 100.
  • the power module 300 may be electrically connected to the heat generating module 200.
  • the power module 300 may control the strength, direction, wavelength, etc. of the current supplied to the heating module 200.
  • the power module 300 may be connected to an external power supply device by a conductive line (not shown) to be charged or supplied with power.
  • the power module 300 may include a case guide part 310, a connection terminal part 320, a first connection terminal 330, and a second connection terminal 340 in a block form.
  • the case guide part 310 may be formed at the center of the upper surface of the power module 300.
  • the case guide part 310 may have a rectangular groove or hole shape, and a connection terminal part 320 may be formed therein.
  • a groove or a hole corresponding to the lower portion of the case 100 may be formed by the rectangular groove or the hole of the case guide part 310 and the side wall of the connection terminal 320. Therefore, the case 100 may be guided in a form inserted into the case guide part 310.
  • the power module 300 may be aligned and disposed below the case 100. In this case, the lower portion of the case 100 and the power module 300 may be combined.
  • various methods such as mechanical (screw, etc.), structural (such as pinching), and adhesive (adhesive) may be used.
  • connection terminal 320 may be a support formed in the inner center of the case guide part 310.
  • a connection terminal groove 321 may be formed in the center of the connection terminal unit 320.
  • a plurality of first and second connection terminals 330 and 340 may be arranged on the bottom surface of the connection terminal groove 321.
  • the first and second connection terminals 330 and 340 may be plural in number.
  • the first and second connection terminals 330 and 340 may be spaced apart in the front-back direction. In this case, the first connection terminal 330 may be disposed in front.
  • the second connection terminal 340 may be disposed at the rear.
  • the first and second connection terminals 330 and 340 may have a plate shape having front and rear surfaces.
  • the plurality of first and second connection terminals 330 and 340 may correspond one-to-one with the plurality of heating cores 220.
  • the plurality of first and second connection terminals 330 and 340 may face each other in a one-to-one correspondence with the plurality of first and second electrode terminals 225 and 226.
  • the first connection terminal 330 may be coupled to the first electrode terminal 225 corresponding thereto.
  • the second connection terminal 340 may be coupled to the second electrode terminal 226 corresponding thereto.
  • the first connection terminal 330 may be interposed between the first binding member 225c and the second binding member 225d of the first electrode terminal 225. Therefore, the first connection terminal 330 and the first electrode terminal 225 may be pinched, coupled or assembled to be electrically connected.
  • the second connection terminal 340 may be interposed between the third binding member 226c and the fourth binding member 226d of the second electrode terminal 226. Therefore, the second connection terminal 340 and the second electrode terminal 226 may be pinched or assembled to be electrically connected.
  • FIG. 8 is a block diagram showing a heating system for a moving means of the present embodiment.
  • the heating system 2000 for moving means of this embodiment can be used for various moving means.
  • the means of transportation is not limited to vehicles that run on land such as automobiles, and may include ships and airplanes.
  • the heating system 2000 for a means of transportation of this embodiment is used for a motor vehicle is demonstrated as an example.
  • the vehicle heating system 2000 may be accommodated in an engine room of a vehicle.
  • the vehicle heating system 2000 may include an air supply unit 1400, a flow path 1500, an exhaust unit 1600, and a heater 1000.
  • the air supply unit 1400 various air supply devices such as a blowing fan and a pump may be used.
  • the air supply unit 1400 may move the heat medium (air in the engine room) of the outside of the heating system 2000 for the vehicle to the inside of the flow path 1500 to be described later, and move along the flow path 1500.
  • the flow path 1500 may be a passage through which a heat medium (air) flows.
  • the air supply unit 1400 may be disposed at one side of the flow path 1500, and the exhaust unit 1600 may be disposed at the other side of the flow path 1500.
  • the flow path 1500 may cooperatively connect the engine room and the interior of the vehicle.
  • the exhaust part 1600 As the exhaust part 1600, a blade which can be opened and closed may be used.
  • the exhaust part 1600 may be disposed on the other side of the flow path 1500.
  • the exhaust part 1600 may communicate with the interior of the vehicle. Therefore, the heat medium (air) moved along the flow path 1500 may flow into the vehicle interior through the exhaust part 1600.
  • the heater 1000 of the present embodiment may be used as the heater 1000 of the heating system 2000 for the vehicle.
  • the heater 1000 may be arranged in the form of a partition wall in the middle of the flow path 1500.
  • the front and rear of the heater 1000 may be the same or similar to the front and rear of the vehicle.
  • the cold heat medium (air) of the engine room supplied to the flow path 1500 through the air supply unit 1400 is heated while passing through the heater 1000 from the front side to the rear side, and then flows along the flow path 1500 again and the exhaust unit 1600 Can be supplied to the room.
  • FIG. 2 is a plan view showing the heating module of the present embodiment
  • Figure 5 is a horizontal cross-sectional view showing a ceramic substrate of the present embodiment
  • Figure 7 is a conceptual diagram showing a state in which the first electrode terminal and the second connection terminal of the present embodiment is coupled. .
  • the heater 1000 of the present embodiment may generate heat transfer by a resistor (heating element 222) covered by the ceramic substrate 221.
  • the thermal efficiency can be improved by using a high heat generation amount of the resistor (heating element 222).
  • the high heat generation amount of the resistor (heating element 222) is covered with a ceramic having a high heat transfer rate to achieve thermal stability and maintain thermal efficiency.
  • the first and second thermal diffusion plates 223 and 224 disposed in contact with the ceramic substrate 221 diffuse heat at the main heating point (the point where the heating element 222 is disposed) of the ceramic substrate 221 to distribute the heat. You can even out.
  • the ceramic substrate 221 including the brittle material may be vulnerable to damage due to deterioration.
  • the first and second thermal diffusion plates 223 and 224 having the same or similar thermal expansion coefficients as those of the ceramic substrate 221 may be disposed on the ceramic substrate 221 to thermally reinforce the ceramic substrate 221.
  • the heater 1000 of the present embodiment may be free from heavy metal materials such as lead (Pb), and may be lightweight.
  • the heater 1000 of this embodiment has high durability. This is because the heating core 220 has a columnar structure in which both ends are fixed by the first and second gaskets 230 and 240. Further, as shown in FIG. 7, the first binding member 225c disposed in front of the first electrode terminal 225 may be curved or bent backwards. In addition, the second binding member 225d disposed behind the first electrode terminal 225 may be curved or bent forward. In addition, the first connection terminal 330 may be interposed between the first and second binding members 225c and 225d. As a result, the first connection terminal 330 may be tightly interposed between the first and second binding members 225c and 225d.
  • the structures of the first and second binding members 225c and 225d described above are strong against front and rear vibrations. This is because even if the first connection terminal 330 is separated from the narrowest part of the first and second fastening members 225c and 225d, the first connection terminal 330 is easily seated in the narrowest part by the curved or bent structure of the first and second fastening members 225c and 225d. . Furthermore, when the lower portions of the first and second binding members 225c and 225d are supported by the bottom surface of the connection terminal 320, the front and rear vibrations may be more effectively countered.
  • Mass air flow (MAF) of the heater 1000 of the present embodiment should be designed to 300kg / h.
  • the room of the proper means of transportation must be reached at an appropriate set temperature at an appropriate time.
  • the size of the heating core 220, excluding the cover portion 227 in the heating module 200 may be 180 * 15 * 1.3 (mm, in turn, up and down, front and rear, left and right directions).
  • the electric power supplied to the heating element 222 in a typical medium-sized car is 7 kW, and based on this, it is located in the center of the heating core 220 and the ceramic substrate portion 221 in a cross-sectional area perpendicular to the extending direction of the heating core 220.
  • Ceramic and the cross-sectional area of the heating element 222 (tungsten) may be 180: 1 to 190: 1. If it is smaller than this, the room cannot be reached at the proper time at the proper temperature. In addition, if it is larger than this, the amount of heat generation is too large and is thermally unstable, and may be overheated. (See FIG. 7)
  • the heating element 222 is a heat medium (air).
  • the length of the single heat dissipation fin 210 and the heating core 220 in the direction (left and right directions) in which the heat dissipation fin 210 and the heating core 220 are arranged (except P of FIG. 2 and the cover part 227) It may be more than 8mm and less than 17mm. If the cover part 227 is added, the length (P of FIG. 2) in the left and right directions of the heat dissipation fin 210 and the heating core 220 may be 10 mm or more and 19 mm or less. Since the length of the heating core 220 (except for the cover part 227) in the left and right directions is usually set to 13 mm, this may be viewed as a left and right condition of the heat dissipation fin 210. If smaller than this, the mass air flow (MAF) of the heater 1000 is less than 300kg / h is not preferable. Moreover, when larger than this, since it cannot reach a suitable temperature in a suitable time, it is unpreferable.
  • MAF mass air flow
  • the heat conductor may be further disposed on the side of the heat generating element.
  • FIG. 9 is a cross-sectional view of a ceramic substrate according to another embodiment of the present invention
  • FIG. 10 is an exploded view of a ceramic substrate according to another embodiment of the present invention
  • FIG. 11 is disposed in a ceramic substrate according to another embodiment of the present invention.
  • Various shapes of the heating element. 12 is a cross-sectional view of a ceramic substrate according to still another embodiment of the present invention
  • FIG. 13 is a cross-sectional view of a ceramic substrate according to another embodiment of the present invention.
  • the ceramic substrate part 221 includes a first ceramic layer 400 and a second ceramic layer 430 disposed on the first ceramic layer 400, and includes a first ceramic layer (
  • the heating element 410 and the thermal conductor 420 are disposed between the 400 and the second ceramic layer 430.
  • the first ceramic layer 400 and the second ceramic layer 430 correspond to the ceramic substrate portions 221a and b of FIGS. 1 to 8, and the heating element 410 is the heating element 222 of FIGS. 1 to 8. ) Can be used.
  • the first ceramic layer 400 and the second ceramic layer 430 may include alumina.
  • the first ceramic layer 400 and the second ceramic layer 430 may further include at least one of aluminum nitride (AlN), silicon nitride (SiN), and boron nitride (BN).
  • AlN aluminum nitride
  • SiN silicon nitride
  • BN boron nitride
  • the first ceramic layer 400 and the second ceramic layer 430 may be glass frit, such as calcium oxide (CaO), magnesium oxide (MgO), sodium oxide (Na 2 O), or silicon oxide (SiO 2 ). And titanium oxide (TiO 2 ) or one or a mixture thereof.
  • the first ceramic layer 400 and the second ceramic layer 430 may further include metal particles, for example, copper (Cu) or silver (Ag) particles.
  • the first ceramic layer 400 and the second ceramic layer 430 further include copper or silver particles dispersed in the glass frit, not only have a high thermal conductivity, Since it can be reduced, it is resistant to thermal shock and can minimize cracking problems.
  • the particle size of the glass frit and the particle size of the metal particles may be 1 to 10 ⁇ m, respectively, and the metal particles may be included in an amount of 1 to 20 wt% with respect to the first ceramic layer 400 and the second ceramic layer 430.
  • the thickness of the first ceramic layer 400 and the second ceramic layer 430 may be 0.5 to 2 mm, respectively.
  • the heat generating element 410 is disposed on the first ceramic layer 400 and generates heat when electricity flows.
  • the heating element 410 is selected from tungsten (W), molybdenum (Mo), nickel (Ni), chromium (Cr), copper (Cu), silver (Ag), indium tin oxide (ITO), and barium titanate (BaTiO). It may comprise any one or mixtures thereof.
  • the heating element 410 may be printed, patterned, coated or deposited on the first ceramic layer 400 in various shapes as shown in FIG. 11. For example, as shown in FIG. 11A, the heating element 410 is formed to repeat the pattern extending in the first direction and then turned up to extend in the second direction opposite to the first direction.
  • the heat generating element 410 includes a plurality of heat generating patterns 410-1 and 410-2 connected in a predetermined pattern, and the thermoelectric element is disposed in a spaced area between the plurality of heat generating patterns 410-1 and 410-2.
  • Conductor 420 may be disposed. The larger the printed area of the heating element 410 is, the greater the amount of heat generated by the ceramic substrate 221.
  • the heating element 410 may be mixed with a resistor, a heating pattern, a heating element, and the like.
  • the thermal conductor 420 is disposed on the first ceramic layer 400, and is disposed between the heating elements 410, and heat generated from the heating elements 410 is transferred to the ceramic substrate portion 221 through the thermal conductors 420. Can be passed out of.
  • the height of the heating element 410 and the thermal conductor 420 may be 5 to 20 ⁇ m respectively.
  • the thermal conductivity of the thermal conductor 420 is higher than the thermal conductivity of the first ceramic layer 400 and the second ceramic layer 430.
  • the thermal conductor 420 may include at least one of aluminum nitride, silicon nitride, and boron nitride.
  • at least some of the side surfaces of the thermal conductor 420 and the side surfaces of the heating element 410 may contact each other. Accordingly, heat generated from the heat generating element 410 may be transferred to the outside of the ceramic substrate portion 221 through the heat conductor 420.
  • the heating patterns 410-1 and 410-2 constituting the heating element 410 are filled with the thermal conductor 420, the bonding between the first ceramic layer 400 and the second ceramic layer 430 is performed.
  • the porosity of the ceramic substrate portion 221 may be lowered to 3% or less.
  • the porosity means a percentage of the pore area per unit area with respect to the cross section of the ceramic substrate portion 221.
  • the thermal conductor 420 may not only be disposed between the heating patterns 410-1 and 410-2 disposed on the first ceramic layer 400, but also further disposed outside the heating element 410. May be In this case, an area of the heat conductor 420 disposed on the first ceramic layer 400 may be 0.5 times or more of the area of the heat generating element 410. When the area of the heat conductor 420 is less than 0.5 times the area of the heat generating element 410, the thermal conductivity of heat generated from the heat generating element 410 may be low.
  • one end T1 of the heating element 410 may be connected to the first electrode pad 440, and the other end T2 of the heating element 410 may be connected to the second electrode pad 450.
  • At least one of the first electrode pad 440 and the second electrode pad 450 may be disposed on at least one of the first ceramic layer 400 and the second ceramic layer 430.
  • the first electrode pad 440 and the second electrode pad 450 are disposed on the first ceramic layer 400, and the heat generating element 410 is provided. It may be connected to one end (T1) and the other end (T2) of each.
  • the second ceramic layer 430 may include a through hole formed to connect the first electrode pad 440 and the second electrode pad 450 to the wires W1 and W2 respectively connected to the power module 300. 432, 434).
  • the wirings W1 and W2 correspond to the first electrode terminal 225 and the second electrode terminal 226 of FIGS. 1 to 8, or the first connecting portion 225a and the second electrode of the first electrode terminal 225. It may correspond to the second connection portion 226a of the electrode terminal 226.
  • the first electrode pad 440 and the second electrode pad 450 may be disposed on the first ceramic layer 400, and the heat generating element 410 may be formed. It may be connected to one end (T1) and the other end (T2), respectively.
  • the wires W1 and W2 connected to the power module 300 are connected to the first electrode pad 440 and the second electrode pad 450, respectively, and the first ceramic layer 400 and the second ceramic layer are respectively connected to the power module 300. It may be drawn out between the 430.
  • one of the first electrode pad 440 and the second electrode pad 450 may be disposed on the first ceramic layer 410, and the other may be disposed on the second ceramic layer 430. At least one of the first electrode pad 440 and the second electrode pad 450 may be disposed on an outer surface of the first ceramic layer 400 or the second ceramic layer 430. In this case, one end T1 of the heating element 410 and the first electrode pad 440 or the other end of the heating element 420 and the second electrode pad 450 may be formed of the first ceramic layer 410 or the second ceramic layer ( It may be connected through the through hole formed in 430.
  • one end T1 and the other end T2 of the heating element 410 may be electrically connected to the power module 300 through the first electrode pad 440 and the second electrode pad 450. Electricity may flow in 410.
  • the thickness of the thermal conductor 420 disposed outside the heat generating element 410 may become thinner toward the edge of the ceramic substrate 221. According to this, when the first ceramic layer 400 and the second ceramic layer 430 are bonded to each other, it is possible to reduce the possibility of voids occurring at the edge of the ceramic substrate portion 221.
  • the heat conductor 420 may be disposed on the heat generating element 410 as well as the side surface of the heat generating element 410. Accordingly, the thermal conductivity may be increased not only in the side surface of the ceramic substrate portion 221 but also in the direction toward the surface of the second ceramic layer 430.
  • FIG. 14 is a flowchart illustrating a method of manufacturing a ceramic substrate according to the embodiments of FIGS. 9 to 13.
  • a first ceramic layer is prepared (S900).
  • the first ceramic layer may include alumina, and may include calcium oxide (CaO), magnesium oxide (MgO), sodium oxide (Na 2 O), silicon oxide (SiO 2 ), and titanium oxide (TiO 2 ). It may further comprise any one selected from or a mixture thereof.
  • the first ceramic layer may be in the form of a green sheet mixed with an organic material.
  • the heating element is coated or printed on the first ceramic layer (S910).
  • the heating element is any one selected from tungsten (W), molybdenum (Mo), nickel (Ni), chromium (Cr), copper (Cu), silver (Ag), ITO (Indium Tin Oxide) and barium titanate (BaTiO) It may comprise one or a mixture thereof.
  • the first ceramic layer on which the heating element is formed is dried (S920).
  • a thermal conductor is printed between the heating elements (S930).
  • a paste or slurry containing at least one of aluminum nitride, silicon nitride and boron nitride may be used.
  • a second ceramic layer is laminated on the heating element and the thermal conductor (S940), and heated and pressed (S950).
  • heating and pressurization may be performed by using a hot pressing process, for example, pressurized at a temperature of 150 to 200.
  • the sintering process is performed to bond the first ceramic layer and the second ceramic layer (S960).
  • the sintering process is performed at about 1500, whereby the first ceramic layer and the second ceramic layer may be integrally formed by bonding at edges where the heating element and the thermal conductor are not disposed.
  • the heating element was printed on the first alumina layer, the second alumina layer was laminated, and then heated and pressed.
  • the heating element was printed on the first alumina layer, and after the thermal conductor was further printed between the printed heating elements, the second alumina layer was laminated, heated and pressed.
  • FIG. 15A shows a cross-sectional view of a ceramic substrate manufactured according to a comparative example
  • FIG. 15B shows a cross-sectional view of a ceramic substrate manufactured according to the embodiment.
  • Table 1 shows the thermal conductivity and porosity of the ceramic substrate according to the comparative example and the example.
  • the ceramic substrate according to the embodiment has a lower porosity and a higher thermal conductivity than the ceramic substrate according to the comparative example.
  • the ceramic substrate has a plate shape as an example, the present invention is not limited thereto.
  • the ceramic substrate according to the embodiment of the present invention may have a cylindrical shape as illustrated in FIG. 16.
  • the ceramic substrate part 221 includes a first ceramic layer 400 and a second ceramic layer 430.
  • the heating element 410 and the thermal conductor 420 are disposed between the first ceramic layer 400 and the second ceramic layer 430.
  • the first ceramic layer 400 may have a cylindrical shape, and the heat generating element 410 and the thermal conductor 420 may be disposed on the outer circumferential surface of the first ceramic layer 400.
  • the second ceramic layer 430 may be disposed to surround the outer circumferential surface of the first ceramic layer 400, the heat generating element 410, and the thermal conductor 420.
  • one end T1 of the heating element 410 may be connected to the first electrode pad 440, and the other end T2 of the heating element 410 may be connected to the second electrode pad 450.
  • the wires W1 and W2 connected to the power module 300 are connected to the first electrode pad 440 and the second electrode pad 450, respectively, and the first ceramic layer 400 and the second ceramic layer are respectively connected to the power module 300. It may be drawn out between the 430.
  • a through hole is formed in the second ceramic layer 430, and wirings W1 and W1 that connect the first electrode pad 440 and the second electrode pad 450 to the power module 300 through the through hole. You can also connect to W2).
  • a thermal diffusion plate may be further disposed on the outer circumferential surface of the second ceramic layer 430.
  • FIG. 17 is a cross-sectional view of a thermal diffusion plate and a ceramic substrate according to an embodiment of the present invention.
  • the first bonding layer 21 disposed between the first thermal diffusion plate 223 and the ceramic substrate part 221 and the second thermal diffusion plate 224 between the ceramic substrate 221 may be disposed. 2 bonding layer 22 can be confirmed.
  • the first bonding layer 21 and the second bonding layer 22 are active metal layers, and may be formed by coating, depositing, and printing.
  • the bonding layers 21 and 22 may use an active metal alloy of a titanium group such as titanium (Ti) or zirconium (Zr).
  • the thermal diffusion plate may be bonded using a metal oxide layer and an active metal layer formed on the ceramic substrate 221.
  • the surface of the metal oxide layer is adhesive, so that the surface of the active metal layer can be bonded.
  • the active metal layer bonded to the metal oxide layer may be formed using any one selected from aluminum oxide (Al 2 O 3 ), aluminum nitride (AlN), silicon nitride (SiN), silicon carbide (SiC) or an alloy thereof. Can be formed.
  • the active metal layer may be formed by coating, depositing, and printing.
  • the metal oxide layer may include, for example, copper oxide (CuO, Cu 2 O).
  • protrusions may be formed on the surface of the thermal diffusion plate.
  • FIG. 18 shows a thermal diffusion plate according to an embodiment of the present invention.
  • FIG. 18A illustrates protrusions 32 formed on the surfaces of the thermal diffusion plates 223 and 224 to emboss the surfaces
  • FIG. 18B illustrates protrusions elongated on the surfaces of the thermal diffusion plates 223 and 224. 34) is formed and implemented.
  • the heat radiation plate in the form of an elongated protrusion as in this embodiment, the contact area with the cooling water becomes wider, so that the cooling water can be heated more efficiently.
  • the surface of the thermal diffusion plate is not limited to the protruding shape and may be modified in various forms.
  • the surface of the thermal diffusion plate may be formed curved without regular shape.
  • the heater according to the embodiment of the present invention may be a heater by a cooling water heating method as well as a heater by an air heating method.
  • FIG. 19 shows a heater according to another embodiment of the present invention.
  • the heater system 3000 may include a coolant tank 3100 in which a coolant 3110 is stored, a heating core 3200 according to an embodiment of the present invention submerged in coolant, and a heat exchanger 3300.
  • the coolant 3110 cools the heating parts 3400 of the electric vehicle and is stored in the coolant tank 3100 through the coolant pipe 3500.
  • the heat generating part 3400 may include an inverter or a motor.
  • the heating core 3200 may be the heating core shown in FIGS. 1 to 18.
  • the heating core 3200 may be used in a form coupled to the coolant tank 3100 and may be replaced.
  • One or more heating cores in the coolant tank 3100 may be immersed in the coolant.
  • the heating core 3200 may be used by supporting the whole of the cooling water except for a portion of the cooling water or the electrode portion coupled to the cooling water tank.
  • attaching the thermal diffusion plate to the ceramic substrate may prevent the ceramic substrate from being damaged.
  • the thermal diffusion plate when the thermal diffusion plate is applied to the ceramic substrate, the heat loss is minimized due to the high thermal conductivity of the thermal diffusion plate, and the thermal conductivity is high, so all the heat generated from the heating core can be used to heat the cooling water. .
  • the reliability of the heating core itself can be improved.
  • the heat exchanger 3300 is to provide heat of the cooled coolant to the interior of the vehicle, and the heat exchanger 3300 may be connected to the coolant tank 3100 through the coolant pipe 3500.
  • the coolant that has cooled the heating component 3400 is moved to the coolant tank 3100 through the coolant pipe 3500, the coolant is heated by the heating core 3200 and then again through the coolant pipe After moving to the heat exchanger 3300, heat is exchanged to provide heat to the interior of the vehicle.
  • the heat-exchanged coolant again moves along the coolant pipe to cool the heating element 3400.
  • the cooling water may be cooled by the heating core and then heated by the heating core to provide heat to the vehicle interior.
  • the volume can be reduced by 50% or more, and the thermal efficiency can be ensured by 95% or more compared with the conventional heating apparatus.

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  • Resistance Heating (AREA)

Abstract

Le présent mode de réalisation concerne un dispositif de chauffage et un système de chauffage de moyen de transport comprenant celui-ci, le dispositif de chauffage comprenant : un boîtier ayant une entrée et une sortie agencées pour se faire face de telle sorte qu'un milieu chauffant passe au entre elles ; un module de chauffage disposé à l'intérieur du boîtier ; et un module de puissance disposé sur un côté du boîtier et connecté électriquement au module de chauffage, le module de chauffage comprenant une pluralité d'ailettes rayonnantes et une pluralité de noyaux chauffants, qui s'étendent d'un côté de celui-ci à l'autre côté de celui-ci et présentent un alignement alterné, le noyau de chauffage comprenant : un substrat céramique ; et des éléments chauffants agencés à l'intérieur du substrat céramique, et les éléments chauffants, d'une manière alternée, s'étendent d'un côté de celui-ci à l'autre côté de celui-ci, tournent, et s'étendent de l'autre côté de celui-ci à un côté de celui-ci, et sont alignés de manière à être empilés dans la direction dans laquelle passe le milieu chauffant.
PCT/KR2017/008076 2016-08-19 2017-07-27 Dispositif de chauffage et système de chauffage pour moyen de transport WO2018034442A1 (fr)

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KR1020160105805A KR102583758B1 (ko) 2016-08-19 2016-08-19 세라믹 히터 및 이를 이용한 전기 자동차의 난방 장치
KR10-2016-0105805 2016-08-19
KR10-2016-0131651 2016-10-11
KR1020160131651A KR20180040054A (ko) 2016-10-11 2016-10-11 히터 및 이동수단용 히팅 시스템
KR1020170000744A KR20180079956A (ko) 2017-01-03 2017-01-03 히터 코어 및 이를 포함하는 히팅 장치
KR10-2017-0000744 2017-01-03

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Citations (5)

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KR20080037325A (ko) * 2006-10-26 2008-04-30 현대모비스 주식회사 세라믹히터 일체형 온수히터코어
KR20110048639A (ko) * 2009-11-03 2011-05-12 백영신 면상 발열체를 이용한 에너지 절약형 온풍 난방기
KR20140040441A (ko) * 2012-09-26 2014-04-03 주식회사 엑사이엔씨 자동차용 히터
US20150183295A1 (en) * 2012-05-14 2015-07-02 Behr-Hella Thermocontrol Gmbh Electrical vehicle heater, in particular for vehicles having a hybrid drive or having an electric drive
KR20160002897A (ko) * 2013-04-28 2016-01-08 비와이디 컴퍼니 리미티드 전기 가열기, 디프로스터, 가열 및 에어컨 시스템 및 차량

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080037325A (ko) * 2006-10-26 2008-04-30 현대모비스 주식회사 세라믹히터 일체형 온수히터코어
KR20110048639A (ko) * 2009-11-03 2011-05-12 백영신 면상 발열체를 이용한 에너지 절약형 온풍 난방기
US20150183295A1 (en) * 2012-05-14 2015-07-02 Behr-Hella Thermocontrol Gmbh Electrical vehicle heater, in particular for vehicles having a hybrid drive or having an electric drive
KR20140040441A (ko) * 2012-09-26 2014-04-03 주식회사 엑사이엔씨 자동차용 히터
KR20160002897A (ko) * 2013-04-28 2016-01-08 비와이디 컴퍼니 리미티드 전기 가열기, 디프로스터, 가열 및 에어컨 시스템 및 차량

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