WO2018032859A1 - 一种投影设备及投影系统 - Google Patents

一种投影设备及投影系统 Download PDF

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Publication number
WO2018032859A1
WO2018032859A1 PCT/CN2017/086178 CN2017086178W WO2018032859A1 WO 2018032859 A1 WO2018032859 A1 WO 2018032859A1 CN 2017086178 W CN2017086178 W CN 2017086178W WO 2018032859 A1 WO2018032859 A1 WO 2018032859A1
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WIPO (PCT)
Prior art keywords
substrate
housing
hole
groove
projection
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Ceased
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PCT/CN2017/086178
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English (en)
French (fr)
Inventor
谭亮
林伟
李屹
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Shenzhen Appotronics Corp Ltd
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Appotronics Corp Ltd
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Publication of WO2018032859A1 publication Critical patent/WO2018032859A1/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/16—Cooling; Preventing overheating

Definitions

  • the present invention relates to the field of projection display technology, and more particularly to a projection device and a projection system.
  • the projection apparatus includes a housing, and a heat generating component, a heat sink, and the like disposed in the internal space of the housing.
  • the heat generating component includes a power device such as a processor, a light emitting element, and the like.
  • a power device such as a processor, a light emitting element, and the like.
  • the volume of projection devices is getting smaller and smaller, which makes the internal space more compact.
  • the large amount of heat generated by the heat-generating components during the working process of the projection device cannot be transmitted to the surrounding air in time, thereby making the projection.
  • the temperature of the housing of the device is constantly increasing; especially when the projection device is used in the summer, the large amount of heat generated by the heat-generating component not only causes the temperature of the casing to rise, but also affects the service life of other components.
  • a scheme for lowering the housing temperature of the projection device has been paid more and more attention.
  • the present invention provides a projection apparatus and a projection system for forming a groove on an inner wall of a first substrate and/or a second substrate of a housing of a projection device without changing the appearance of the housing.
  • a projection apparatus and a projection system for forming a groove on an inner wall of a first substrate and/or a second substrate of a housing of a projection device without changing the appearance of the housing.
  • a projection device comprising:
  • a housing including a connection substrate enclosing an internal space, a first substrate and a second substrate, the connection substrate intersecting the first substrate and the second substrate, the first orientation of the connection substrate An air inlet through hole is formed in the region, and the air outlet hole is formed in the second orientation region of the connection substrate;
  • the inner wall of the first substrate and/or the second substrate of the housing is formed with a groove, and a part of the airflow entering the air inlet through hole is discharged from the air outlet through the groove.
  • connection substrate comprises a plurality of sub-substrates, and the sub-substrate is a curved plate or a flat plate.
  • the projection device further includes: at least one fan disposed in an inner space of the housing;
  • the airflow entering the air inlet through hole is discharged from the air outlet through hole through the groove by the fan.
  • the groove is disposed opposite to the heat generating component fixed in the casing, and the distance of the groove from the heat generating component is greater than 0.6 mm.
  • the distance of the groove from the heat generating component is greater than 1 mm and less than 2.2 mm.
  • the projection device further includes: a heat sink disposed in an inner space of the housing, the heat sink is disposed on a side of the air outlet through hole, and the airflow entering the air inlet through hole is A radiator is discharged from the air outlet passage.
  • the groove extends to the air inlet through hole. 7.
  • the depth of the groove extending to the housing region where the fan is located is different from the depth of other portions of the groove.
  • the groove depth is no more than 1.2 mm.
  • the present invention also provides a projection system including the above-described projection apparatus.
  • the technical solution provided by the present invention has at least the following advantages:
  • the present invention provides a projection apparatus and a projection system.
  • the projection apparatus includes: a housing including a connection substrate enclosing an internal space, a first substrate and a second substrate, the connection substrate and the first substrate Intersecting with the second substrate, the first orientation area of the connection substrate is formed with an air inlet through hole, and the second orientation area of the connection substrate is formed with an air outlet hole; wherein the first substrate of the housing And/or a concave wall is formed on an inner wall of the second substrate, and a part of the airflow entering the air inlet through hole is discharged from the air outlet through hole through the groove.
  • the technical solution provided by the present invention expands the heat dissipation space inside the casing by forming a groove on the inner wall of the first substrate and/or the second substrate of the casing of the projection device without changing the appearance of the casing. More cold air enters the inner space of the casing through the air inlet hole, thereby increasing the air flow of the air inlet through hole, effectively controlling the temperature rise of the components of the projection device, and reducing the temperature of the casing.
  • FIG. 1 is a schematic structural diagram of a projection apparatus according to an embodiment of the present application.
  • Figure 1b is a cross-sectional view taken along line AA' of Figure 1a;
  • FIG. 2 is a schematic structural diagram of another projection device according to an embodiment of the present disclosure.
  • Figure 3a is a schematic view showing the distribution of air volume when no groove is formed
  • Fig. 3b is a schematic view showing the distribution of the air volume when the groove is formed.
  • the volume of the projection device is getting smaller and smaller, which makes the internal space more compact, and a large amount of heat generated by the heat-generating component during the operation of the projection device cannot be transmitted to the surroundings in time.
  • the temperature of the housing of the projection device is continuously increased; especially when the projection device is used in summer, the heat generated by the heat-generating component not only causes the temperature of the casing to rise, but also affects the service life of other components. .
  • a scheme for lowering the housing temperature of the projection device has been paid more and more attention.
  • the embodiment of the present application provides a projection device and a projection system, and the groove is formed on the inner wall of the first substrate and/or the second substrate of the housing of the projection device without changing the appearance of the housing.
  • the groove is formed on the inner wall of the first substrate and/or the second substrate of the housing of the projection device without changing the appearance of the housing.
  • more cold air enters the inner space of the casing through the air inlet hole, thereby increasing the air flow of the air inlet through hole, and effectively raising the temperature of the components of the projection device. Control to reduce the temperature of the housing.
  • FIG. 1a is a schematic structural view of a projection apparatus according to an embodiment of the present application
  • FIG. 1b is a cross-sectional view along the AA' direction of FIG. 1a, wherein the projection apparatus includes:
  • a housing 100 including a connection substrate enclosing an internal space, a first substrate and a second substrate, the connection substrate intersecting the first substrate and the second substrate, the connection substrate a windward through hole 101 is formed in an orientation area, and a second airflow direction hole 102 is formed in the second orientation area of the connection substrate;
  • a groove 300 is formed on an inner wall of the first substrate and/or the second substrate of the housing 100, and a part of the airflow entering the air inlet through hole 101 passes through the groove 300 from the air outlet hole. 102 discharge.
  • the projection device provided by the embodiment of the present invention includes a first substrate, a second substrate, and a connection substrate, wherein the first substrate and the second substrate are oppositely disposed, and the connection substrate is disposed on the first substrate and the second substrate Between the substrates, the first substrate and the second substrate are connected and fixed by the connection substrate, and an internal space is enclosed between the first substrate, the second substrate and the connection substrate.
  • the projection apparatus provided by the embodiment of the present application further includes a device such as a heat generating component 200 disposed in an inner space of the housing.
  • the main heat dissipation channel of the housing is formed between the air inlet through hole 101 and the air outlet hole 102; that is, the connection substrate comprises a plate facing the first orientation and a plate facing the second orientation, the first orientation plate and The second oriented plates are respectively formed with an air inlet through hole 101 and an air outlet through hole 102, and a main heat dissipation passage of the casing is formed between the inlet air through hole 101 and the outlet air passage hole 102.
  • the present application does not specifically limit the number of the air inlet through holes and the air outlet through holes provided in the outer casing and the specific position on the connecting substrate; wherein the preferred first orientation and the second orientation are opposite.
  • the connecting substrate in the present application includes a plurality of sub-substrates, the plurality of sub-substrates may be surrounded by a ring shape, and the plurality of sub-substrates may be connected end to end, and the sub-substrate may be a curved plate or a flat plate.
  • the position of the plurality of sub-substrates is not specifically limited in the embodiment of the present application, and only the plurality of sub-substrates are required to connect the first substrate and the second substrate, and form an internal space with the first substrate and the second substrate.
  • the connecting substrate comprises two sub-substrates, and the two sub-substrates are oppositely disposed, and the two sub-substrates and the first substrate and the second substrate enclose an internal space placing device.
  • each of the sub-substrates may be the same or different, so that different shell-shaped structures may be formed; or when the plurality of sub-substrates connecting the substrates are flat plates
  • the sub-substrates may have the same flat plate or different flat plates.
  • the plurality of sub-substrates in the present application may also be partially curved plates, which are flat plates, and need to be specifically designed according to practical applications.
  • the groove is disposed opposite to the heat generating component fixed in the casing, and the distance of the groove from the heat generating component is greater than 0.6 mm. Further, the distance of the groove from the heat generating component is greater than 1 mm and less than 2.2 mm.
  • the groove may overlap with the projected portion of the heat generating component in the direction of the first substrate to the third name, or may overlap all, or the projection of the heat generating component may all fall into the concave portion.
  • the embodiment of the present application does not specifically limit the specific design according to the actual application.
  • the technical solution provided by the embodiment of the present application expands by forming a groove on the inner wall of the first substrate and/or the second substrate of the casing of the projection device without changing the appearance of the casing.
  • the heat dissipation space inside the casing allows more cold air to enter the inner space of the casing through the air inlet hole, thereby increasing the air flow of the air inlet through hole, and effectively controlling the temperature rise of the components of the projection device. Lower the temperature of the housing.
  • the technical solution provided by the embodiment of the present application is to form a groove on the inner wall of the first substrate and/or the second substrate of the housing, thereby avoiding the overall thinning of the inner wall of the frame of the housing, thereby ensuring the housing. High mechanical strength.
  • FIG. 2 a schematic structural diagram of another projection apparatus according to an embodiment of the present disclosure, wherein the projection apparatus further includes: at least one fan 400 disposed in an inner space of the housing 100;
  • the airflow entering the air inlet through hole 101 is discharged from the air outlet through hole 102 through the groove 300 by the fan 400. That is, the airflow entering the air inlet through hole, the partial airflow is entangled into the fan under the centrifugal action of the fan, wherein the airflow entrained by the fan includes part or all of the airflow entering the groove from the air inlet through hole, and finally passes through the fan.
  • the effect is to discharge these airflows from the air outlets.
  • by increasing the fan it is advantageous to accelerate the airflow velocity of the heat dissipation channel between the inlet through hole and the outlet through hole, thereby accelerating the heat dissipation efficiency.
  • the projection device further includes: a heat sink 500 disposed in an inner space of the housing 100, the heat sink 500 being disposed on a side of the air outlet through hole 102, into the The air flow entering the air through hole 101 is discharged from the air outlet passage 102 through the heat sink 500.
  • the heat sink provided by the present application includes a plurality of heat dissipation fins.
  • the heat dissipation fins are metal heat dissipation fins; the specific material of the metal heat dissipation fins in the embodiment of the present application is not limited, and may be copper heat dissipation fins, and may also be metal heat dissipation fins of other materials. Make specific selection according to the actual application.
  • a fan and a heat sink are disposed in the internal space of the housing.
  • the main function of the fan is to accelerate the air flow velocity of the air inlet hole to the heat dissipation channel of the air outlet hole, and the groove is formed on the inner wall of the casing to increase the heat dissipation space, so that the heat dissipation channel increases in the air flow rate.
  • the airflow flow of the heat dissipation channel is increased, thereby increasing the heat taken away by the heat dissipation channel, further reducing the temperature of various devices inside the housing and the temperature of the housing.
  • the heat dissipation of the heat sink further reduces the temperature of various devices inside the housing and the temperature of the housing.
  • FIG. 3a is a schematic diagram of air volume distribution when no groove is formed
  • FIG. 3b is a schematic diagram of air volume distribution when forming a groove, wherein in the projection device, when the groove is not formed, space is limited
  • the air volume at the pre-formed recessed area 301 (as shown by the number of black arrows and the occupied area in FIG. 3a) is small; and after the recess 300 is formed, the heat dissipation space is enlarged, and the air volume at the recess 300 is as shown by the black arrow in FIG. 3b.
  • the increase in the number and footprint ensures that the temperature of the device and the temperature of the housing are low.
  • the groove may extend to the air inlet through hole to facilitate the passage of the airflow through the through hole to the groove, and the temperature of the device and the housing may be more quickly reduced.
  • the groove may extend to the casing area where the fan is located, which facilitates the airflow of the groove to the fan, thereby improving heat dissipation efficiency;
  • the depth of the groove extending to the housing region where the fan is located is different from the depth of other portions of the groove to ensure high heat dissipation efficiency.
  • the groove depth provided by the embodiment of the present application is not more than 1.2 mm, and may specifically be a depth value of 0.8 mm, which not only ensures high heat dissipation efficiency, but also ensures high mechanical strength of the casing.
  • the heat generating component provided by the present application may include one or more of a light emitting element and a processor.
  • the housing provided by the present application is a metal housing or a plastic housing.
  • the embodiment of the present application is not specifically limited; and the shape of the housing may be a cylindrical shape, a rectangular parallelepiped shape, or Other shapes are also not specifically limited in this embodiment of the present application.
  • the embodiment of the present application further provides a projection system, which includes the projection device provided by any of the above embodiments.
  • the embodiment of the present application provides a projection device and a projection system.
  • the projection device includes: a housing, the housing includes a connection substrate enclosing an internal space, a first substrate and a second substrate, and the connection substrate and the first a substrate and the second substrate intersect, a first direction region of the connection substrate is formed with an air inlet through hole, and a second orientation region of the connection substrate is formed with an air outlet hole; wherein the housing is A groove is formed in an inner wall of a substrate and/or a second substrate, and a part of the airflow entering the air inlet through hole is discharged from the air outlet through hole through the groove.
  • the technical solution provided by the embodiment of the present application expands the heat dissipation inside the casing by forming a groove on the inner wall of the first substrate and/or the second substrate of the casing of the projection device without changing the appearance of the casing.
  • the space allows more cold air to enter the inner space of the casing through the air inlet hole, thereby increasing the air flow of the air inlet through hole, effectively controlling the temperature rise of the components of the projection device, and reducing the temperature of the casing. .

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Projection Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种投影设备及投影系统，投影设备包括：壳体（100），壳体（100）包括围成内部空间的连接基板、第一基板和第二基板，连接基板与第一基板和第二基板相交，连接基板的第一朝向区域形成有进风通孔（101），连接基板的第二朝向区域形成有出风通孔（102）；壳体的第一基板和/或第二基板的内壁上形成有凹槽（300），进入进风通孔（101）的部分气流通过凹槽（300）从出风通孔（102）排出。在不改变壳体外观的情况下，通过在投影设备的壳体的第一基板和/或第二基板的内壁上形成凹槽（300），以扩大壳体（100）内部的散热空间，使更多的冷空气自进风通孔（101）进入壳体（100）的内部空间，从而提升了进风通孔（101）的气流量，有效的对投影设备的元器件的温升进行控制，降低壳体（100）的温度。

Description

一种投影设备及投影系统 技术领域
本发明涉及投影显示技术领域，更为具体的说，涉及一种投影设备及投影系统。
 背景技术
一般的，投影设备包括有壳体，以及设置于壳体内部空间的发热部件、散热器等器件。
技术问题
其中，发热部件包括有处理器等功率器件和发光元件等。随着电子器件轻薄化的趋势，投影设备的体积越来越小，使得其内部空间愈发紧凑，发热部件在投影设备工作过程中产生的大量热量不能及时的传递到周围空气中，进而使得投影设备的壳体的温度不断升高；尤其的在夏季使用投影设备时，发热部件产生的大量热量不仅造成壳体的温度升高，严重时还会影响其他器件的使用寿命。随着用户对产品外观设计及舒适度的要求越来越高，降低投影设备的壳体温度的方案越来越被重视。
 技术解决方案
有鉴于此，本发明提供了一种投影设备及投影系统，在不改变壳体外观的情况下，通过在投影设备的壳体的第一基板和/或第二基板的内壁上形成凹槽，以扩大壳体内部的散热空间，使更多的冷空气自进风通孔进入壳体的内部空间，从而提升了进风通孔的气流量，有效的对投影设备的元器件的温升进行控制，降低壳体的温度。
为实现上述目的，本发明提供的技术方案如下：
一种投影设备，包括：
壳体，所述壳体包括围成内部空间的连接基板、第一基板和第二基板，所述连接基板与所述第一基板和所述第二基板相交，所述连接基板的第一朝向区域形成有进风通孔，所述连接基板的第二朝向区域形成有出风通孔；
其中，所述壳体的第一基板和/或第二基板的内壁上形成有凹槽，进入所述进风通孔的部分气流通过所述凹槽从所述出风通孔排出。
可选的，所述连接基板包括多个子基板，所述子基板为弧形板或者平板。
可选的，所述投影设备还包括：设置于所述壳体内部空间的至少一个风扇；
其中，进入所述进风通孔的气流在所述风扇的作用下通过所述凹槽从所述出风通孔排出。
可选的，所述凹槽与固定在所述壳体中的发热部件相对设置，所述凹槽距离所述发热部件的距离大于0.6mm。
可选的，所述凹槽距离所述发热部件的距离大于1mm小于2.2mm。
可选的，所述投影设备还包括：设置于所述壳体内部空间的散热器，所述散热器设置于所述出风通孔一侧，进入所述进风通孔的气流经所述散热器从所述出风通道排出。
可选的，所述凹槽延伸至所述进风通孔。7、根据权利要求2所述的投影设备，其特征在于，所述凹槽延伸至所述风扇所在的壳体区域。
可选的，延伸至所述风扇所在壳体区域的凹槽深度不同于凹槽的其他部分的深度。
可选的，所述凹槽深度不大于1.2mm。
相应的，本发明还提供了一种投影系统，所述投影系统包括上述的投影设备。
 有益效果
相较于现有技术，本发明提供的技术方案至少具有以下优点：
本发明提供了一种投影设备及投影系统，投影设备包括：壳体，所述壳体包括围成内部空间的连接基板、第一基板和第二基板，所述连接基板与所述第一基板和所述第二基板相交，所述连接基板的第一朝向区域形成有进风通孔，所述连接基板的第二朝向区域形成有出风通孔；其中，所述壳体的第一基板和/或第二基板的内壁上形成有凹槽，进入所述进风通孔的部分气流通过所述凹槽从所述出风通孔排出。本发明提供的技术方案，在不改变壳体外观的情况下，通过在投影设备的壳体的第一基板和/或第二基板的内壁上形成凹槽，以扩大壳体内部的散热空间，使更多的冷空气自进风通孔进入壳体的内部空间，从而提升了进风通孔的气流量，有效的对投影设备的元器件的温升进行控制，降低壳体的温度。
 附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据提供的附图获得其他的附图。
图1a为本申请实施例提供的一种投影设备的结构示意图；
图1b为图1a中沿AA’方向的切面图；
图2为本申请实施例提供的另一种投影设备的结构示意图；
图3a为未形成凹槽时的风量分布示意图；
图3b为形成凹槽时的风量分布示意图。
 本发明的最佳实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
正如背景技术所述，随着电子器件轻薄化的趋势，投影设备的体积越来越小，使得其内部空间愈发紧凑，发热部件在投影设备工作过程中产生的大量热量不能及时的传递到周围空气中，进而使得投影设备的壳体的温度不断升高；尤其的在夏季使用投影设备时，发热部件产生的大量热量不仅造成壳体的温度升高，严重时还会影响其他器件的使用寿命。随着用户对产品外观设计及舒适度的要求越来越高，降低投影设备的壳体温度的方案越来越被重视。
基于此，本申请实施例提供了一种投影设备及投影系统，在不改变壳体外观的情况下，通过在投影设备的壳体的第一基板和/或第二基板的内壁上形成凹槽，以扩大壳体内部的散热空间，使更多的冷空气自进风通孔进入壳体的内部空间，从而提升了进风通孔的气流量，有效的对投影设备的元器件的温升进行控制，降低壳体的温度。为实现上述目的，本申请实施例提供的技术方案如下，具体结合图1a至图3b所示，对本申请实施例提供的技术方案进行详细的描述。
结合图1a和图1b所示，图1a为本申请实施例提供的一种投影设备的结构示意图，图1b为图1a中沿AA’方向的切面图，其中，投影设备包括：
壳体100，所述壳体100包括围成内部空间的连接基板、第一基板和第二基板，所述连接基板与所述第一基板和所述第二基板相交，所述连接基板的第一朝向区域形成有进风通孔101，所述连接基板的第二朝向区域形成有出风通孔102；
其中，所述壳体100的第一基板和/或第二基板的内壁上形成有凹槽300，进入所述进风通孔101的部分气流通过所述凹槽300从所述出风通孔102排出。
具体的，本申请一实施例提供的投影设备，壳体包括第一基板、第二基板和连接基板，其中，第一基板和第二基板相对设置，且连接基板设置于第一基板和第二基板之间，通过连接基板将第一基板和第二基板之间连接固定，且第一基板、第二基板和连接基板之间围成一内部空间。本申请实施例提供的投影设备其还包括有设置于壳体内部空间的发热部件200等器件。其中，进风通孔101和出风通孔102之间形成壳体的主散热通道；，即，连接基板包括有朝向第一朝向的板材和朝向第二朝向的板材，第一朝向的板材和第二朝向的板材分别形成有进风通孔101和出风通孔102，进风通孔101和出风通孔102之间形成壳体的主散热通道。需要说明的是，本申请对提供外壳的进风通孔和出风通孔的数量和位于连接基板的具体位置均不做具体限制；其中，优选的第一朝向和第二朝向相对。
本申请中的所述连接基板包括多个子基板，多个子基板可以围绕成环形、且多个子基板首尾相接，所述子基板可以为弧形板或平板。此外，本申请实施例对多个子基板的位置并不做具体限制，只需要多个子基板起到连接第一基板和第二基板、且与第一基板和第二基板围成一内部空间即可，具体如连接基板包括两个子基板，且两个子基板相对设置，通过该两个子基板和第一基板、第二基板围成一内部空间放置器件。
其中，当连接基板的多个子基板均为弧形板时，每个子基板可以相同的也可以是不同的，如此可以形成不同的壳体形状结构；或者，当连接基板的多个子基板均为平板时，各子基板之间可以相同的平板，也可以是不同平板；或者，本申请中多个子基板还可以部分是弧形板部分是平板，对此需要根据实际应用进行具体设计。
可选的，在本申请实施例提供的投影设备中，所述凹槽与固定在所述壳体中的发热部件相对设置，所述凹槽距离所述发热部件的距离大于0.6mm。进一步的，所述凹槽距离所述发热部件的距离大于1mm小于2.2mm。其中，对于凹槽和发热部件的位置关系，凹槽可以与发热部件在第一基板至第三名的方向上的投影部分交叠，也可以全部交叠，或者发热部件的投影全部落入凹槽的投影中（即发热部件的投影被凹槽的投影全部覆盖），对此本申请实施例不作具体限制，需要根据实际的应用进行具体的设计。
由上述内容可知，本申请实施例提供的技术方案，在不改变壳体外观的情况下，通过在投影设备的壳体的第一基板和/或第二基板的内壁上形成凹槽，以扩大壳体内部的散热空间，使更多的冷空气自进风通孔进入壳体的内部空间，从而提升了进风通孔的气流量，有效的对投影设备的元器件的温升进行控制，降低壳体的温度。另外，由于本申请实施例提供的技术方案，是在壳体的第一基板和/或第二基板的内壁上形成凹槽，避免将壳体的边框内壁整体减薄，保证了对壳体的机械强度高。
进一步的，参考图2所示，为本申请实施例提供的另一种投影设备的结构示意图，其中，所述投影设备还包括：设置于所述壳体100内部空间的至少一个风扇400；
其中，进入所述进风通孔101的气流在所述风扇400的作用下通过所述凹槽300从所述出风通孔102排出。即，进入进风通孔的气流，在风扇的离心作用下将部分气流卷入风扇，其中，该被风扇卷入的气流包括自进风通孔进入凹槽的部分或全部气流，最后通过风扇的作用将这些气流从出风通孔排出。其中，通过增加风扇有利于加速进风通孔至出风通孔之间的散热通道的气流流速，加快散热效率。
进一步的，参考图2所示，所述投影设备还包括：设置于所述壳体100内部空间的散热器500，所述散热器500设置于所述出风通孔102一侧，进入所述进风通孔101的气流经所述散热器500从所述出风通道102排出。其中，本申请提供的所述散热器包括多个散热鳍片。其中，所述散热鳍片为金属散热鳍片；本申请实施例对金属散热鳍片的具体材质不做限制，可以为铜散热鳍片，还可以为其他材质的金属散热鳍片，对此需要根据实际应用进行具体选取。
为了加大投影设备的散热效率，在壳体的内部空间设置风扇和散热器。其中，通过风扇的主要作用在于加速进风通孔至出风通孔的散热通道的气流流速，并且由于在壳体的内壁上形成有凹槽以增大散热空间，使得散热通道在气流流速增大的基础上，又增大了散热通道的气流流量，进而提高了被散热通道带走的热量，进一步降低了壳体内部的各种器件的温度和壳体的温度。同时，通过散热器的散热作用，更进一步的降低了壳体内部的各种器件的温度和壳体的温度。
具体结合图3a和图3b所示，图3a为未形成凹槽时的风量分布示意图，图3b为形成凹槽时的风量分布示意图，其中，投影设备中，未形成凹槽时，由于空间有限，预形成凹槽区域301处风量（如图3a中黑色箭头的数量和占用面积）少；而形成凹槽300后，扩大了散热空间，凹槽300处的风量（如图3b中黑色箭头的数量和占用面积）增大，保证了器件的温度和壳体的温度低。
在上述任意一实施例中，所述凹槽可以延伸至所述进风通孔，有利于进风通孔至凹槽的气流的通过，能够更加迅速的降低器件和壳体的温度。另外，当壳体的内部空间设置有风扇时，所述凹槽可以延伸至所述风扇所在的壳体区域，有利于凹槽至风扇的气流通过，进而提高散热效率；且本申请实施例中延伸至所述风扇所在壳体区域的凹槽深度不同于凹槽的其他部分的深度，保证散热效率高。此外，本申请实施例提供的所述凹槽深度不大于1.2mm，其具体可以为0.8mm等深度值，不仅能够保证散热效率高，而且还能保证壳体的机械强度高。本申请提供的所述发热部件可以包括发光元件和处理器中的一种或多种。以及，本申请提供的所述壳体为金属壳体或塑料壳体，对此本申请实施例不做具体限制；以及，对于壳体的形状可以为圆柱形，还可以为长方体形，或者为其他形状，对此本申请实施例同样不做具体限制。
相应的，本申请实施例还提供了一种投影系统，所述投影系统包括上述任意一实施例提供的投影设备。
本申请实施例提供了一种投影设备及投影系统，投影设备包括：壳体，所述壳体包括围成内部空间的连接基板、第一基板和第二基板，所述连接基板与所述第一基板和所述第二基板相交，所述连接基板的第一朝向区域形成有进风通孔，所述连接基板的第二朝向区域形成有出风通孔；其中，所述壳体的第一基板和/或第二基板的内壁上形成有凹槽，进入所述进风通孔的部分气流通过所述凹槽从所述出风通孔排出。本申请实施例提供的技术方案，在不改变壳体外观的情况下，通过在投影设备的壳体的第一基板和/或第二基板的内壁上形成凹槽，以扩大壳体内部的散热空间，使更多的冷空气自进风通孔进入壳体的内部空间，从而提升了进风通孔的气流量，有效的对投影设备的元器件的温升进行控制，降低壳体的温度。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此，本发明将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims (11)

1、一种投影设备，其特征在于，包括：
壳体，所述壳体包括围成内部空间的连接基板、第一基板和第二基板，所述连接基板与所述第一基板和所述第二基板相交，所述连接基板的第一朝向区域形成有进风通孔，所述连接基板的第二朝向区域形成有出风通孔；
其中，所述壳体的第一基板和/或第二基板的内壁上形成有凹槽，进入所述进风通孔的部分气流通过所述凹槽从所述出风通孔排出。
2、根据权利要求1所述的投影设备，其特征在于，所述连接基板包括多个子基板，所述子基板为弧形板或者平板。
3、根据权利要求1所述的投影设备，其特征在于，所述投影设备还包括：设置于所述壳体内部空间的至少一个风扇；
其中，进入所述进风通孔的气流在所述风扇的作用下通过所述凹槽从所述出风通孔排出。
4、据权利要求1所述的投影设备，其特征在于，所述凹槽与固定在所述壳体中的发热部件相对设置，所述凹槽距离所述发热部件的距离大于0.6mm。
5、据权利要求4所述的投影设备，其特征在于，所述凹槽距离所述发热部件的距离大于1mm小于2.2mm。
6、根据权利要求1所述的投影设备，其特征在于，所述投影设备还包括：设置于所述壳体内部空间的散热器，所述散热器设置于所述出风通孔一侧，进入所述进风通孔的气流经所述散热器从所述出风通道排出。
7、根据权利要求1所述的投影设备，其特征在于，所述凹槽延伸至所述进风通孔。
8、根据权利要求3所述的投影设备，其特征在于，所述凹槽延伸至所述风扇所在的壳体区域。
9、根据权利要求8所述的投影设备，其特征在于，延伸至所述风扇所在壳体区域的凹槽深度不同于凹槽的其他部分的深度。
10、根据权利要求1~9任一项所述的投影设备，其特征在于，所述凹槽深度不大于1.2mm。
11、一种投影系统，其特征在于，所述投影系统包括权利要求1~10任意一项所述的投影设备。
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