WO2018032859A1

WO2018032859A1 - Projection apparatus and projection system

Info

Publication number: WO2018032859A1
Application number: PCT/CN2017/086178
Authority: WO
Inventors: 谭亮; 林伟; 李屹
Original assignee: 深圳市光峰光电技术有限公司
Priority date: 2016-04-25
Filing date: 2017-05-26
Publication date: 2018-02-22
Also published as: CN205982963U; CN107305310B; CN107305310A

Abstract

A projection apparatus and a projection system. The projection apparatus comprises: a housing (100), comprising a connecting substrate, a first substrate and a second substrate arranged in a surrounding manner so as to form an internal space, wherein the connecting substrate intersects the first substrate and the second substrate, an air inlet hole (101) is formed at a first facing region of the connecting substrate, and an air outlet hole (102) is formed at a second facing region of the substrate; and a recess (300), formed on an inner wall of the first substrate and/or the second substrate of the housing, wherein a part of an airflow entering the air inlet hole (101) passes through the recess (300) and is discharged from the air outlet hole (102). Without changing the appearance of the housing, by forming the recess on the inner wall of the first substrate and/or the second substrate of the housing of the projection apparatus, space for heat dissipation in the housing (100) is expanded to allow more cool air to enter the internal space of the housing (100) via the air inlet hole (101), increasing the volume of the airflow passing through the air inlet hole (101), effectively limiting the temperature rise of components of the projection apparatus and reducing the temperature of the housing (100).

Description

Projection device and projection system

Technical field

The present invention relates to the field of projection display technology, and more particularly to a projection device and a projection system.

Background technique

Generally, the projection apparatus includes a housing, and a heat generating component, a heat sink, and the like disposed in the internal space of the housing.

technical problem

Among them, the heat generating component includes a power device such as a processor, a light emitting element, and the like. With the trend of thinner and lighter electronic devices, the volume of projection devices is getting smaller and smaller, which makes the internal space more compact. The large amount of heat generated by the heat-generating components during the working process of the projection device cannot be transmitted to the surrounding air in time, thereby making the projection The temperature of the housing of the device is constantly increasing; especially when the projection device is used in the summer, the large amount of heat generated by the heat-generating component not only causes the temperature of the casing to rise, but also affects the service life of other components. As the user's requirements for product design and comfort are getting higher and higher, a scheme for lowering the housing temperature of the projection device has been paid more and more attention.

Technical solution

In view of the above, the present invention provides a projection apparatus and a projection system for forming a groove on an inner wall of a first substrate and/or a second substrate of a housing of a projection device without changing the appearance of the housing. In order to enlarge the heat dissipation space inside the casing, more cold air enters the inner space of the casing from the air inlet hole, thereby increasing the air flow of the air inlet through hole, and effectively performing temperature rise of the components of the projection device. Control to reduce the temperature of the housing.

To achieve the above object, the technical solution provided by the present invention is as follows:

A projection device comprising:

a housing including a connection substrate enclosing an internal space, a first substrate and a second substrate, the connection substrate intersecting the first substrate and the second substrate, the first orientation of the connection substrate An air inlet through hole is formed in the region, and the air outlet hole is formed in the second orientation region of the connection substrate;

The inner wall of the first substrate and/or the second substrate of the housing is formed with a groove, and a part of the airflow entering the air inlet through hole is discharged from the air outlet through the groove.

Optionally, the connection substrate comprises a plurality of sub-substrates, and the sub-substrate is a curved plate or a flat plate.

Optionally, the projection device further includes: at least one fan disposed in an inner space of the housing;

The airflow entering the air inlet through hole is discharged from the air outlet through hole through the groove by the fan.

Optionally, the groove is disposed opposite to the heat generating component fixed in the casing, and the distance of the groove from the heat generating component is greater than 0.6 mm.

Optionally, the distance of the groove from the heat generating component is greater than 1 mm and less than 2.2 mm.

Optionally, the projection device further includes: a heat sink disposed in an inner space of the housing, the heat sink is disposed on a side of the air outlet through hole, and the airflow entering the air inlet through hole is A radiator is discharged from the air outlet passage.

Optionally, the groove extends to the air inlet through hole. 7. A projection apparatus according to claim 2 wherein the recess extends to a housing region in which the fan is located.

Optionally, the depth of the groove extending to the housing region where the fan is located is different from the depth of other portions of the groove.

Optionally, the groove depth is no more than 1.2 mm.

Accordingly, the present invention also provides a projection system including the above-described projection apparatus.

Beneficial effect

Compared with the prior art, the technical solution provided by the present invention has at least the following advantages:

The present invention provides a projection apparatus and a projection system. The projection apparatus includes: a housing including a connection substrate enclosing an internal space, a first substrate and a second substrate, the connection substrate and the first substrate Intersecting with the second substrate, the first orientation area of the connection substrate is formed with an air inlet through hole, and the second orientation area of the connection substrate is formed with an air outlet hole; wherein the first substrate of the housing And/or a concave wall is formed on an inner wall of the second substrate, and a part of the airflow entering the air inlet through hole is discharged from the air outlet through hole through the groove. The technical solution provided by the present invention expands the heat dissipation space inside the casing by forming a groove on the inner wall of the first substrate and/or the second substrate of the casing of the projection device without changing the appearance of the casing. More cold air enters the inner space of the casing through the air inlet hole, thereby increasing the air flow of the air inlet through hole, effectively controlling the temperature rise of the components of the projection device, and reducing the temperature of the casing.

DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description are only It is an embodiment of the present invention, and those skilled in the art can obtain other drawings according to the provided drawings without any creative work.

FIG. 1 is a schematic structural diagram of a projection apparatus according to an embodiment of the present application;

Figure 1b is a cross-sectional view taken along line AA' of Figure 1a;

2 is a schematic structural diagram of another projection device according to an embodiment of the present disclosure;

Figure 3a is a schematic view showing the distribution of air volume when no groove is formed;

Fig. 3b is a schematic view showing the distribution of the air volume when the groove is formed.

BEST MODE FOR CARRYING OUT THE INVENTION

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

As described in the background art, with the trend of thinning and thinning of electronic devices, the volume of the projection device is getting smaller and smaller, which makes the internal space more compact, and a large amount of heat generated by the heat-generating component during the operation of the projection device cannot be transmitted to the surroundings in time. In the air, the temperature of the housing of the projection device is continuously increased; especially when the projection device is used in summer, the heat generated by the heat-generating component not only causes the temperature of the casing to rise, but also affects the service life of other components. . As the user's requirements for product design and comfort are getting higher and higher, a scheme for lowering the housing temperature of the projection device has been paid more and more attention.

Based on this, the embodiment of the present application provides a projection device and a projection system, and the groove is formed on the inner wall of the first substrate and/or the second substrate of the housing of the projection device without changing the appearance of the housing. In order to enlarge the heat dissipation space inside the casing, more cold air enters the inner space of the casing through the air inlet hole, thereby increasing the air flow of the air inlet through hole, and effectively raising the temperature of the components of the projection device. Control to reduce the temperature of the housing. The technical solutions provided by the embodiments of the present application are as follows. The technical solutions provided by the embodiments of the present application are described in detail in conjunction with FIG. 1a to FIG. 3b.

1a and FIG. 1b, FIG. 1a is a schematic structural view of a projection apparatus according to an embodiment of the present application, and FIG. 1b is a cross-sectional view along the AA' direction of FIG. 1a, wherein the projection apparatus includes:

a housing 100 including a connection substrate enclosing an internal space, a first substrate and a second substrate, the connection substrate intersecting the first substrate and the second substrate, the connection substrate a windward through hole 101 is formed in an orientation area, and a second airflow direction hole 102 is formed in the second orientation area of the connection substrate;

a groove 300 is formed on an inner wall of the first substrate and/or the second substrate of the housing 100, and a part of the airflow entering the air inlet through hole 101 passes through the groove 300 from the air outlet hole. 102 discharge.

Specifically, the projection device provided by the embodiment of the present invention includes a first substrate, a second substrate, and a connection substrate, wherein the first substrate and the second substrate are oppositely disposed, and the connection substrate is disposed on the first substrate and the second substrate Between the substrates, the first substrate and the second substrate are connected and fixed by the connection substrate, and an internal space is enclosed between the first substrate, the second substrate and the connection substrate. The projection apparatus provided by the embodiment of the present application further includes a device such as a heat generating component 200 disposed in an inner space of the housing. Wherein, the main heat dissipation channel of the housing is formed between the air inlet through hole 101 and the air outlet hole 102; that is, the connection substrate comprises a plate facing the first orientation and a plate facing the second orientation, the first orientation plate and The second oriented plates are respectively formed with an air inlet through hole 101 and an air outlet through hole 102, and a main heat dissipation passage of the casing is formed between the inlet air through hole 101 and the outlet air passage hole 102. It should be noted that the present application does not specifically limit the number of the air inlet through holes and the air outlet through holes provided in the outer casing and the specific position on the connecting substrate; wherein the preferred first orientation and the second orientation are opposite.

The connecting substrate in the present application includes a plurality of sub-substrates, the plurality of sub-substrates may be surrounded by a ring shape, and the plurality of sub-substrates may be connected end to end, and the sub-substrate may be a curved plate or a flat plate. In addition, the position of the plurality of sub-substrates is not specifically limited in the embodiment of the present application, and only the plurality of sub-substrates are required to connect the first substrate and the second substrate, and form an internal space with the first substrate and the second substrate. Specifically, the connecting substrate comprises two sub-substrates, and the two sub-substrates are oppositely disposed, and the two sub-substrates and the first substrate and the second substrate enclose an internal space placing device.

Wherein, when the plurality of sub-substrates connecting the substrates are all curved plates, each of the sub-substrates may be the same or different, so that different shell-shaped structures may be formed; or when the plurality of sub-substrates connecting the substrates are flat plates The sub-substrates may have the same flat plate or different flat plates. Alternatively, the plurality of sub-substrates in the present application may also be partially curved plates, which are flat plates, and need to be specifically designed according to practical applications.

Optionally, in the projection apparatus provided in the embodiment of the present application, the groove is disposed opposite to the heat generating component fixed in the casing, and the distance of the groove from the heat generating component is greater than 0.6 mm. Further, the distance of the groove from the heat generating component is greater than 1 mm and less than 2.2 mm. Wherein, for the positional relationship between the groove and the heat generating component, the groove may overlap with the projected portion of the heat generating component in the direction of the first substrate to the third name, or may overlap all, or the projection of the heat generating component may all fall into the concave portion. In the projection of the slot (that is, the projection of the heat-generating component is completely covered by the projection of the groove), the embodiment of the present application does not specifically limit the specific design according to the actual application.

It can be seen from the above that the technical solution provided by the embodiment of the present application expands by forming a groove on the inner wall of the first substrate and/or the second substrate of the casing of the projection device without changing the appearance of the casing. The heat dissipation space inside the casing allows more cold air to enter the inner space of the casing through the air inlet hole, thereby increasing the air flow of the air inlet through hole, and effectively controlling the temperature rise of the components of the projection device. Lower the temperature of the housing. In addition, the technical solution provided by the embodiment of the present application is to form a groove on the inner wall of the first substrate and/or the second substrate of the housing, thereby avoiding the overall thinning of the inner wall of the frame of the housing, thereby ensuring the housing. High mechanical strength.

Further, referring to FIG. 2, a schematic structural diagram of another projection apparatus according to an embodiment of the present disclosure, wherein the projection apparatus further includes: at least one fan 400 disposed in an inner space of the housing 100;

The airflow entering the air inlet through hole 101 is discharged from the air outlet through hole 102 through the groove 300 by the fan 400. That is, the airflow entering the air inlet through hole, the partial airflow is entangled into the fan under the centrifugal action of the fan, wherein the airflow entrained by the fan includes part or all of the airflow entering the groove from the air inlet through hole, and finally passes through the fan. The effect is to discharge these airflows from the air outlets. Among them, by increasing the fan, it is advantageous to accelerate the airflow velocity of the heat dissipation channel between the inlet through hole and the outlet through hole, thereby accelerating the heat dissipation efficiency.

Further, referring to FIG. 2, the projection device further includes: a heat sink 500 disposed in an inner space of the housing 100, the heat sink 500 being disposed on a side of the air outlet through hole 102, into the The air flow entering the air through hole 101 is discharged from the air outlet passage 102 through the heat sink 500. The heat sink provided by the present application includes a plurality of heat dissipation fins. The heat dissipation fins are metal heat dissipation fins; the specific material of the metal heat dissipation fins in the embodiment of the present application is not limited, and may be copper heat dissipation fins, and may also be metal heat dissipation fins of other materials. Make specific selection according to the actual application.

In order to increase the heat dissipation efficiency of the projection device, a fan and a heat sink are disposed in the internal space of the housing. Wherein, the main function of the fan is to accelerate the air flow velocity of the air inlet hole to the heat dissipation channel of the air outlet hole, and the groove is formed on the inner wall of the casing to increase the heat dissipation space, so that the heat dissipation channel increases in the air flow rate. On the large basis, the airflow flow of the heat dissipation channel is increased, thereby increasing the heat taken away by the heat dissipation channel, further reducing the temperature of various devices inside the housing and the temperature of the housing. At the same time, the heat dissipation of the heat sink further reduces the temperature of various devices inside the housing and the temperature of the housing.

3a and 3b, FIG. 3a is a schematic diagram of air volume distribution when no groove is formed, and FIG. 3b is a schematic diagram of air volume distribution when forming a groove, wherein in the projection device, when the groove is not formed, space is limited The air volume at the pre-formed recessed area 301 (as shown by the number of black arrows and the occupied area in FIG. 3a) is small; and after the recess 300 is formed, the heat dissipation space is enlarged, and the air volume at the recess 300 is as shown by the black arrow in FIG. 3b. The increase in the number and footprint) ensures that the temperature of the device and the temperature of the housing are low.

In any of the above embodiments, the groove may extend to the air inlet through hole to facilitate the passage of the airflow through the through hole to the groove, and the temperature of the device and the housing may be more quickly reduced. In addition, when the inner space of the casing is provided with a fan, the groove may extend to the casing area where the fan is located, which facilitates the airflow of the groove to the fan, thereby improving heat dissipation efficiency; The depth of the groove extending to the housing region where the fan is located is different from the depth of other portions of the groove to ensure high heat dissipation efficiency. In addition, the groove depth provided by the embodiment of the present application is not more than 1.2 mm, and may specifically be a depth value of 0.8 mm, which not only ensures high heat dissipation efficiency, but also ensures high mechanical strength of the casing. The heat generating component provided by the present application may include one or more of a light emitting element and a processor. The housing provided by the present application is a metal housing or a plastic housing. The embodiment of the present application is not specifically limited; and the shape of the housing may be a cylindrical shape, a rectangular parallelepiped shape, or Other shapes are also not specifically limited in this embodiment of the present application.

Correspondingly, the embodiment of the present application further provides a projection system, which includes the projection device provided by any of the above embodiments.

The embodiment of the present application provides a projection device and a projection system. The projection device includes: a housing, the housing includes a connection substrate enclosing an internal space, a first substrate and a second substrate, and the connection substrate and the first a substrate and the second substrate intersect, a first direction region of the connection substrate is formed with an air inlet through hole, and a second orientation region of the connection substrate is formed with an air outlet hole; wherein the housing is A groove is formed in an inner wall of a substrate and/or a second substrate, and a part of the airflow entering the air inlet through hole is discharged from the air outlet through hole through the groove. The technical solution provided by the embodiment of the present application expands the heat dissipation inside the casing by forming a groove on the inner wall of the first substrate and/or the second substrate of the casing of the projection device without changing the appearance of the casing. The space allows more cold air to enter the inner space of the casing through the air inlet hole, thereby increasing the air flow of the air inlet through hole, effectively controlling the temperature rise of the components of the projection device, and reducing the temperature of the casing. .

The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments are obvious to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but the scope of the invention is to be accorded

Claims

A projection device, comprising:

2. The projection apparatus according to claim 1, wherein the connection substrate comprises a plurality of sub-substrates, and the sub-substrate is a curved plate or a flat plate.

The projection device according to claim 1, further comprising: at least one fan disposed in an inner space of the housing;

4. The projection apparatus according to claim 1, wherein the recess is disposed opposite to a heat generating component fixed in the housing, and a distance of the recess from the heat generating component is greater than 0.6 mm.

5. A projection apparatus according to claim 4, wherein the distance of the groove from the heat generating component is greater than 1 mm and less than 2.2 mm.

The projection apparatus according to claim 1, further comprising: a heat sink disposed in an inner space of the housing, wherein the heat sink is disposed on a side of the air outlet through hole. Airflow entering the air inlet passage is discharged from the air outlet passage through the radiator.

7. The projection apparatus of claim 1 wherein the recess extends to the air inlet aperture.

8. Projection device according to claim 3, characterized in that the groove extends to the housing region in which the fan is located.

9. A projection apparatus according to claim 8, wherein the depth of the groove extending to the housing region in which the fan is located is different from the depth of other portions of the recess.

The projection apparatus according to any one of claims 1 to 9, wherein the groove depth is no more than 1.2 mm.

A projection system, characterized in that the projection system comprises the projection device according to any one of claims 1 to 10.