JP2000227823A - Cooling device, cooling method and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To cool a space around a cooling unit. SOLUTION: When a fan 22 of the cooling unit is rotated, first of all, air from a space above an inhale port 24 of the cooling unit is taken through the inhale port 24 into a housing 42 and flows out through an exhale port 25 of the cooling unit and an exhale port 4 in a main body 2 of a personal computer 1 to the outside (flow A). When the flow A is generated, next, a pressure near an inhale port 43 inside the housing 42 is lowered by Bernouilli's theorem, for example, and air in the space (including a space G) on the downside of a substrate 31 is taken from the inhale port 43. The air taken in like this flows through the exhale ports 25 and 24 to the outside (flow B).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device, a cooling method, and an electronic device, and more particularly, to a cooling device, a method, and an electronic device capable of cooling the entire space inside the device.

[0002]

2. Description of the Related Art Devices such as a CPU and a video chip which constitute a personal computer 1 composed of a main body 2 and a display unit 3 as shown in FIG. 11 require a considerable amount of energy (heat) to execute processing. Release. Therefore, the main body 2 is usually provided with an exhaust port 4 (in this case, the back of the main body 2), and a cooling unit 11 as shown in FIG. That is, the air inside the main body 2 heated by the heat radiation from the device is exhausted to the outside through the exhaust port 4 by the cooling unit 11.

In a cooling unit 11 shown in FIG. 12, a housing 21 accommodates a fan 22 and a fan drive unit 23. An intake port 24 through which external air is taken in by the rotation of the fan 22 is provided on an upper surface of the casing 21, and an exhaust port 25 through which air taken in from the intake port 24 is exhausted is provided on a side surface of the casing 21. Have been.

Next, the main body 2 of the personal computer 1
The cooling operation of the cooling unit 11 will be described with reference to FIG.

As a first cooling operation, a cooling unit 11
Is a board 3 on which devices such as a CPU and a video chip are mounted and the temperature of which rises due to heat radiation from these devices
Cool 1 Since the cooling unit 11 is connected to the substrate 31 via the heat conductor 32 that conducts heat, the cooling unit 11
The heat generated on 1 is transmitted (guided) to the housing 21 of the cooling unit 11 via the heat conductor 32, and the air inside the housing 21 is warmed. The air inside the heated casing 21 is rotated by the rotation of the fan 22 of the cooling unit 11.
Air is exhausted to the outside via the exhaust port 25 of the cooling unit 11 and the exhaust port 4 of the main body 2. In this manner, the heat of the substrate 31 is guided to the cooling unit 11 and the air heated by the heat is exhausted, so that the substrate 31 is cooled.

[0006] As a second cooling function, the space F is cooled. Heat from device (including heat from substrate 31)
Warms the air in the space F and raises its temperature, but the air in the space F is taken in from the air inlet 24 of the cooling unit 11 by the rotation of the fan 22 of the cooling unit 11,
The air is exhausted to the outside through the exhaust port 25 and the exhaust port 4.
In this manner, the space F is cooled by discharging the air whose temperature has increased to the outside.

[0007]

As described above, since the substrate 31 and the space F are cooled, the whole body 2 is cooled to some extent, but the air in the space G heated by the heat from the device is cooled. Is not sufficiently exhausted from the intake port 24, the air is not sufficiently exhausted, and the body 2
However, there is a problem that the rise in the internal temperature cannot be sufficiently suppressed.

The present invention has been made in view of such circumstances, and is intended to suppress the rise in temperature inside the main body 2 by exhausting the entire air inside the main body 2. is there.

[0009]

According to a first aspect of the present invention, there is provided a cooling apparatus comprising: a first suction means for sucking gas; an exhaust means for discharging gas sucked by the first suction means; By the action of the exhausted gas, the gas is sucked in,
A suction / exhaust means for exhausting air.

According to a second aspect of the present invention, there is provided a cooling method comprising: a first suction step of sucking gas, an exhaust step of exhausting gas sucked in the first suction step, and a function of the gas exhausted in the exhaust step. And a suction / exhaust step of sucking and exhausting gas.

[0011] The cooling device according to the first aspect and the second aspect.
In the cooling method described in (1), the gas is sucked, the sucked gas is exhausted, and the gas is sucked and exhausted by the action of the exhausted gas.

In the electronic device according to the present invention, the first suction means for sucking the gas, the exhaust means for exhausting the gas sucked by the first suction means, and the action of the gas exhausted by the exhaust means. And a suction / exhaust means for sucking and exhausting gas.

In the electronic device according to the third aspect, the gas is sucked, the sucked gas is exhausted, and the gas is sucked and exhausted by the action of the exhausted gas.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an example of an external configuration of a cooling unit 41 using the present invention. In the figure,
Parts corresponding to those in FIG. 12 are denoted by the same reference numerals, and description thereof will be omitted below as appropriate. That is, in this example, as shown in FIG. 1B of the bottom view of the cooling unit 41,
An intake port 43 is provided in a portion on the fifth side.

Next, the main body 2 of the personal computer 1
The cooling operation of the cooling unit 41 will be described with reference to FIG.

In the cooling unit 41, as in the case of the cooling unit 11, the substrate 31 and the space F are cooled by the above-described first and second cooling functions. The description of is omitted.

Next, the cooling of the space G (third cooling action) will be described. When the fan 22 of the cooling unit 41 rotates, first, air from a space (a space including the space F) above the intake port 24 of the cooling unit 41 is supplied to the intake port 24.
From the casing 42 and flows out through the exhaust port 25 of the cooling unit 41 and the exhaust port 4 of the main body 2 (flow A).

When the flow A as described above occurs, the pressure in the vicinity of the intake port 43 inside the housing 42 decreases, for example, according to Bernoulli's theorem, and the space below the substrate 31 (space The air in the space (including G) is taken in from the intake port 43. The air thus taken in flows out through the exhaust port 25 and the exhaust port 4 (flow B). As a result, the space G is cooled.

As described above, in the cooling unit 41, in addition to the first cooling operation and the second cooling operation, the third cooling operation is performed.
, The temperature rise inside the main body 2 is sufficiently suppressed.

In the above description, the case where the present invention is applied to the personal computer 1 provided only with the exhaust port 4 and not provided with the intake port has been described as an example. However, as shown in FIG. The mouth 51 can also be used for a personal computer 53 provided in the main body 52 (in this example, provided at the upper right of the upper surface of the main body 52). In the figure, portions corresponding to the case of FIG. 11 are denoted by the same reference numerals, and the description thereof will be appropriately omitted below.

FIG. 4 shows a cross section of the cooling unit 41 mounted inside the main body 52 of the personal computer 53. In this example, in addition to the flow A and the flow B,
Air taken from the air inlet 51 of the main body 52 (flow C)
Are the inlet 24 of the cooling unit 41, the outlet 25 thereof,
And flows out through the exhaust port 4 of the main body 52 to the outside.

Further, in the above, the case where the intake port 43 is provided on the bottom surface of the casing 42 of the cooling unit 41 has been described as an example, but as shown in FIG.
Can be attached to the side surface of the housing 42. Further, flat fins can be attached inside the cooling unit 41 as shown in FIG.

In the above description, the cooling unit 41
However, although the case where it is attached to the substrate 31 via the heat conductor 32 has been described as an example, it may be attached directly to the device.

In the above, the case where the exhaust port 4 is provided on the back surface of the main body of the personal computer has been described as an example, but the personal computer 6 shown in FIG.
0, it can be provided on the side surface of the main body 61 (the left side surface in the example of FIG. 7). In addition, the intake port 51 is
It is provided on the entire display unit 3 side of the main body 61.

In this example, the personal computer 6
The cooling unit 71 shown in FIG. 8 and FIG.
It is attached so as to be exhausted from the exhaust port 4 of FIG. 1 (FIG. 7). The cooling unit 71 is further provided with an intercooler die cast 72, which is attached so that the surface of the intercooler die cast 72 and the back surface of the substrate 31 are in contact with each other (FIG. 7). FIG.
In FIG. 9 and FIG. 9, parts corresponding to those in FIG. 1 are denoted by the same reference numerals.

As shown in FIG. 9, a heat sink 73 having irregularities is provided on the back surface of the intercooler die cast 72. Thereby, the cooling unit 71 includes:
For example, a radiation effective area approximately twice as large as that of the cooling unit 41 is secured. On the back surface of the intercooler die cast 72, a copper heat pipe 74 made of a material having a high heat transfer rate is attached. That is, as described above, the heat generated in the substrate 31 is more effectively cooled by giving the heat radiation effect to the intercooler die cast 72 itself.

FIG. 10 shows the relationship between the temperature of the CPU (for example, the surface temperature of the CPU device) and its processing capability.
The solid line A shows the temperature change of the CPU mounted on the board when the inside of the personal computer is cooled by applying the cooling device of the present invention, and the dotted line A shows the conventional cooling device applied. In this case, the temperature of the CPU is shown. The solid line B indicates the processing capacity of the CPU when the temperature of the CPU changes as indicated by the solid line A, and the dotted line B indicates the processing of the CPU when the temperature of the CPU changes as indicated by the dotted line A. Shows ability.

When the temperature of the CPU is equal to or higher than the temperature T, as indicated by a dotted line A, the processing capability is reduced as indicated by a dotted line B (in the example of FIG. 10, it is reduced from 100% to 80%). ). That is, when the cooling device of the present invention is applied, as shown by the solid line A, the temperature of the CPU is always
Since the temperature is controlled to be equal to or lower than the temperature T, the processing capacity of the CPU is maintained at 100% as shown by the solid line B.

[0029]

According to the cooling device of the first aspect and the cooling method of the second aspect, the intake gas is exhausted,
Since the other gas is sucked in by the action of the exhausted gas, the entire space around the device can be cooled.

According to the electronic device of the third aspect, the first
The gas sucked by the suction means is exhausted, and the gas is sucked by the second suction means by the action of the exhausted gas, so that the entire inside of the electronic device can be cooled.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a configuration example of an external appearance of a cooling unit 41 to which the present invention is applied.

FIG. 2 is a cross-sectional view of the cooling unit 41 attached inside the personal computer 1.

FIG. 3 is a diagram illustrating a configuration example of an external appearance of a personal computer 53.

FIG. 4 is a cross-sectional view of the cooling unit 41 attached inside the personal computer 53.

FIG. 5 shows a cooling unit 41 to which flat fins are attached.
FIG.

FIG. 6 is a diagram illustrating a configuration example of another appearance of the cooling unit 41.

FIG. 7 is a diagram illustrating an example of an external appearance and an internal configuration of a personal computer 60.

FIG. 8 is a diagram illustrating a configuration example of an external appearance of a cooling unit 71.

FIG. 9 is another diagram showing an example of the configuration of the outer appearance of the cooling unit 71.

FIG. 10 is a diagram illustrating a relationship between a temperature change of a CPU and a processing capability.

FIG. 11 is a diagram illustrating a configuration example of an external appearance of the personal computer 1.

FIG. 12 is a diagram illustrating a configuration example of an appearance of a conventional cooling unit 11;

FIG. 13 is a sectional view of the cooling unit 11 attached to the personal computer 1.

[Explanation of symbols]

Reference Signs List 1 personal computer, 2 main body, 3 display unit, 4 exhaust port, 11 cooling unit, 21 housing, 22 fan, 23 fan drive unit, 24 intake port, 25 exhaust port, 31 substrate, 32 heat conductor, 41 cooling unit, 42 case, 43 intake port, 51 intake port, 52 main body, 53 personal computer

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Takashi Sonehara 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Inside Sony Corporation (72) Inventor Shigeyuki Soo 6-35, Kita-Shinagawa, Shinagawa-ku, Tokyo No. Sony Corporation

Claims (3)

[Claims] A first suction means for sucking a gas; an exhaust means for exhausting the gas sucked by the first suction means; and an action of the gas exhausted by the exhaust means.
A cooling device comprising: a suction / exhaust unit that sucks and exhausts gas. A first suction step of sucking gas, an exhaust step of exhausting the gas sucked in the first suction step, and an action of the gas exhausted in the exhaust step.
A cooling and suction step of sucking and exhausting gas. A first intake unit that inhales a gas, an exhaust unit that exhausts the gas that is taken in by the first intake unit, and an action of the gas that is exhausted by the exhaust unit.
An electronic device, comprising: a suction / exhaust unit that sucks and exhausts gas.