WO2018032578A1 - 电脑主机箱 - Google Patents

电脑主机箱 Download PDF

Info

Publication number
WO2018032578A1
WO2018032578A1 PCT/CN2016/100572 CN2016100572W WO2018032578A1 WO 2018032578 A1 WO2018032578 A1 WO 2018032578A1 CN 2016100572 W CN2016100572 W CN 2016100572W WO 2018032578 A1 WO2018032578 A1 WO 2018032578A1
Authority
WO
WIPO (PCT)
Prior art keywords
aluminum substrate
computer
heat
cover
dissipating aluminum
Prior art date
Application number
PCT/CN2016/100572
Other languages
English (en)
French (fr)
Inventor
林换堂
Original Assignee
益德电子科技（杭州）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 益德电子科技（杭州）有限公司 filed Critical 益德电子科技（杭州）有限公司
Publication of WO2018032578A1 publication Critical patent/WO2018032578A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution

Definitions

  • the utility model relates to the field of computer accessories, in particular to a computer mainframe box.
  • the computer CPU in the prior art uses a fan to dissipate heat, which is not only noisy, but also has a large amount of dust inhalation during use for a period of time, thereby affecting the stability and service life of the host.
  • the utility model provides a computer mainframe to solve the problem that the computer mainframe in the prior art is noisy, and the fan is sucked into the dust, thereby affecting the stability and the service life of the mainframe.
  • a computer mainframe comprising: a heat dissipating aluminum substrate; a box cover fastened over the heat dissipating aluminum substrate to be in the heat dissipating aluminum substrate and the box cover
  • the motherboard installation space is formed; the motherboard is installed in the motherboard installation space, and the CPU of the motherboard is closely attached to the upper surface of the heat dissipation aluminum substrate.
  • the cover is formed with a recessed portion corresponding to the expansion card slot of the main board;
  • the mainframe of the computer further includes a plurality of expansion slot cover detachably connected to the cover, and the plurality of expansion slot covers are installed The position in the recess.
  • the computer mainframe further comprises a riser card
  • the riser card comprises a circuit board and an expansion slot mounted on the circuit board
  • the circuit board is inserted in the vertical direction on the expansion card slot
  • the expansion slot is installed horizontally On the board.
  • the mainframe of the computer further comprises an extension, one end of the extension being inserted into the expansion slot in a horizontal direction.
  • the heat-dissipating aluminum substrate in the utility model is directly connected with the CPU of the main board, thereby playing the role of active heat dissipation, so that the computer can be operated in a noiseless state, so that it is not necessary to use a fan for heat dissipation.
  • the air duct does not inhale dust, which enhances the stability and longevity of the mainframe.
  • the heat-dissipating aluminum substrate is part of the chassis casing, which can make full use of the external space to assist the computer to dissipate heat.
  • Figure 1 schematically shows an exploded view of the present invention
  • Figure 2 is a schematic view showing the structure of the expansion slot cover when it is partially installed
  • Figure 3 is a schematic view showing the structure of the expansion slot cover when it is completely installed
  • Fig. 4 schematically shows a schematic view of the installation of the extension.
  • the utility model provides a computer mainframe, comprising: a heat dissipating aluminum substrate 1; a box cover 3 fastened over the heat dissipating aluminum substrate 1 to the heat dissipating aluminum substrate 1 and the The main board installation space is formed between the cover 3; the main board 2 is installed in the main board installation space, and the CPU of the main board 2 is in close contact with the upper surface of the heat dissipating aluminum substrate 1.
  • the heat-dissipating aluminum substrate 1 of the utility model is directly connected with the CPU of the main board 2, thereby functioning as an active heat dissipation, so that the computer can be operated in a noiseless state, so that it is not necessary to use a fan for heat dissipation, and accordingly, no heat generation occurs.
  • the air duct draws in dust, thus enhancing the stability of the mainframe and prolonging the service life.
  • the heat-dissipating aluminum substrate 1 is part of the outer casing of the casing, which can make full use of the external space to assist the computer to dissipate heat.
  • the box cover 3 is formed with a recessed portion 4, and the recessed portion 4 is disposed corresponding to the expansion card slot 5 of the main board 2;
  • the mainframe of the computer further includes a plurality of expansion slot cover plates 6 detachably connected to the cover 3, Multiple extensions
  • the groove cover 6 is mounted at the position of the recess 4. In this way, when it is necessary to insert the expansion card, the operation only needs to be opened by opening the corresponding expansion slot cover 6, which is flexible, simple and fast, and does not need to be inserted into the extension as in the current common computer case on the market. It is very cumbersome and time consuming to open the chassis to perform the corresponding operations.
  • the mainframe of the computer further comprises a riser card 7 comprising a circuit board and an expansion slot 8 mounted on the circuit board, the circuit board being inserted in the vertical direction on the expansion card slot 5, the expansion slot 8 Mounted on the board in a horizontal direction.
  • the mainframe of the computer further includes an extension member 9, one end of the extension member 9 being inserted into the expansion slot 8 in the horizontal direction.
  • the extension 9 (such as a video card device) can be inserted into the riser card 7 laterally (flatly) and connected to the motherboard. With such a design, there is no significant change in the footprint of the chassis due to the insertion of the extension.

Abstract

一种电脑主机箱，包括：散热铝基板(1)；箱盖(3)，扣在所述散热铝基板(1)的上方以在所述散热铝基板(1)与所述箱盖(3)之间形成主板安装空间；主板(2)，安装在所述主板安装空间内，且所述主板(2)的CPU与所述散热铝基板(1)的上表面紧贴。散热铝基板直接与主板的CPU连接，从而起到主动散热的作用，从而可使电脑在无噪音状态下运行，因此不需要使用风扇进行散热，相应地就不会产生风道吸入灰尘，因而，增强了主机的稳定性及延长使用寿命；同时散热铝基板又是机箱外壳的一部分，可以充分利用外部空间来协助电脑散热。

Description

电脑主机箱 技术领域
本实用新型涉及电脑配件领域，特别涉及一种电脑主机箱。
背景技术
现有技术中的电脑CPU都是通过风扇来进行散热，不但有噪音且使用一段时间会有大量的灰尘吸入等，从而影响主机的稳定性和使用寿命。
实用新型内容
本实用新型提供了一种电脑主机箱，以解决现有技术中的电脑主机箱有噪音、会因风扇吸入灰尘从而影响主机的稳定性和使用寿命的问题。
为解决上述问题，作为本实用新型的一个方面，提供了一种电脑主机箱，包括：散热铝基板；箱盖，扣在散热铝基板的上方以在所述散热铝基板与所述箱盖之间形成主板安装空间；主板，安装在主板安装空间内，且主板的CPU与散热铝基板的上表面紧贴。
优选地，箱盖上形成有凹陷部，凹陷部对应于主板的扩展卡插槽设置；电脑主机箱还包括多个与箱盖可拆卸地连接的扩展槽盖板，多个扩展槽盖板安装在凹陷部的位置。
优选地，电脑主机箱还还包括转接卡，转接卡包括电路板和安装在电路板上的扩展槽，电路板沿竖直方向插在扩展卡插槽上，扩展槽沿水平方向安装在电路板上。
优选地，电脑主机箱还包括扩展件，扩展件的一端沿水平方向插入扩展槽中。
本实用新型中的散热铝基板直接与主板的CPU连接，从而起到主动散热的作用，从而可使电脑在无噪音状态下运行，因此不需要使用风扇进行散热，相 应地就不会产生风道吸入灰尘，因而，增强了主机的稳定性及延长使用寿命；同时散热铝基板又是机箱外壳的一部分，可以充分利用外部空间来协助电脑散热。
附图说明
图1示意性地示出了本实用新型的爆炸图；
图2示意性地示出了扩展槽盖板处于部分安装时的结构示意图；
图3示意性地示出了扩展槽盖板处于完全安装时的结构示意图；
图4示意性地示出了扩展件的安装示意图。
图中附图标记：1、散热铝基板；2、主板；3、箱盖；4、凹陷部；5、扩展卡插槽；6、扩展槽盖板；7、转接卡；8、扩展槽；9、扩展件。
具体实施方式
以下结合附图对本实用新型的实施例进行详细说明，但是本实用新型可以由权利要求限定和覆盖的多种不同方式实施。
如图1至图4所示，本实用新型提供了一种电脑主机箱，包括：散热铝基板1；箱盖3，扣在散热铝基板1的上方以在所述散热铝基板1与所述箱盖3之间形成主板安装空间；主板2，安装在主板安装空间内，且主板2的CPU与散热铝基板1的上表面紧贴。
本实用新型中的散热铝基板1直接与主板2的CPU连接，从而起到主动散热的作用，从而可使电脑在无噪音状态下运行，因此不需要使用风扇进行散热，相应地就不会产生风道吸入灰尘，因而，增强了主机的稳定性及延长使用寿命；同时散热铝基板1又是机箱外壳的一部分，可以充分利用外部空间来协助电脑散热。
优选地，箱盖3上形成有凹陷部4，凹陷部4对应于主板2的扩展卡插槽5设置；电脑主机箱还包括多个与箱盖3可拆卸地连接的扩展槽盖板6，多个扩展 槽盖板6安装在凹陷部4的位置。这样，当需要插入需要扩展卡的时候，只需要打开相应的扩展槽盖板6即可进行操作，具有灵活、简单、快速的特点，而不需要像当前市面上普通电脑机箱那样需要插入扩展件时要打开机箱来进行相应的操作，非常繁琐耗时。
优选地，电脑主机箱还还包括转接卡7，转接卡7包括电路板和安装在电路板上的扩展槽8，电路板沿竖直方向插在扩展卡插槽5上，扩展槽8沿水平方向安装在电路板上。优选地，电脑主机箱还包括扩展件9，扩展件9的一端沿水平方向插入扩展槽8中。采用这种90度转角的转接卡7，使扩展件9(如显卡等设备)可以横着(平躺式)插入转接卡7后与主板连接。采用这样的设计同，不会因为插入扩展件而导致机箱的占用空间发生较大的变化。
以上所述仅为本实用新型的优选实施例而已，并不用于限制本实用新型，对于本领域的技术人员来说，本实用新型可以有各种更改和变化。凡在本实用新型的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本实用新型的保护范围之内。

Claims (4)

  1. 一种电脑主机箱，其特征在于，包括：
    散热铝基板(1)；
    箱盖(3)，扣在所述散热铝基板(1)的上方以在所述散热铝基板(1)与所述箱盖(3)之间形成主板安装空间；
    主板(2)，安装在所述主板安装空间内，且所述主板(2)的CPU与所述散热铝基板(1)的上表面紧贴。
  2. 根据权利要求1所述的电脑主机箱，其特征在于，所述箱盖(3)上形成有凹陷部(4)，所述凹陷部(4)对应于所述主板(2)的扩展卡插槽(5)设置；
    所述电脑主机箱还包括多个与所述箱盖(3)可拆卸地连接的扩展槽盖板(6)，所述多个扩展槽盖板(6)安装在所述凹陷部(4)的位置。
  3. 根据权利要求2所述的电脑主机箱，其特征在于，所述电脑主机箱还还包括转接卡(7)，所述转接卡(7)包括电路板和安装在所述电路板上的扩展槽(8)，所述电路板沿竖直方向插在所述扩展卡插槽(5)上，所述扩展槽(8)沿水平方向安装在所述电路板上。
  4. 根据权利要求3所述的电脑主机箱，其特征在于，所述电脑主机箱还包括扩展件(9)，所述扩展件(9)的一端沿水平方向插入所述扩展槽(8)中。
PCT/CN2016/100572 2016-08-19 2016-09-28 电脑主机箱 WO2018032578A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201620912556.2U CN206162291U (zh) 2016-08-19 2016-08-19 电脑主机箱
CN201620912556.2 2016-08-19

Publications (1)

Publication Number Publication Date
WO2018032578A1 true WO2018032578A1 (zh) 2018-02-22

Family

ID=58649208

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/100572 WO2018032578A1 (zh) 2016-08-19 2016-09-28 电脑主机箱

Country Status (2)

Country Link
CN (1) CN206162291U (zh)
WO (1) WO2018032578A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113050773A (zh) * 2021-04-25 2021-06-29 扬州恒联照明器材有限公司 一种散热性能好的机箱

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20304204U1 (de) * 2003-03-17 2003-05-28 Woehr Richard Gmbh Computer mit einem Gehäuse mit Mehrschichtenkühlkörperwand und passivem Kühlsystem
CN201274032Y (zh) * 2008-09-12 2009-07-15 东莞市金翔电器设备有限公司 电脑机箱的后板构造
CN201418227Y (zh) * 2009-06-05 2010-03-03 深圳市宾利达智能科技有限公司 新型散热器
CN202939534U (zh) * 2012-06-11 2013-05-15 北京集智达智能科技有限责任公司 无风扇嵌入式平板电脑机箱
CN104750198A (zh) * 2013-12-30 2015-07-01 鸿富锦精密工业(武汉)有限公司 机箱组件
CN204557097U (zh) * 2015-04-28 2015-08-12 研扬科技（苏州）有限公司 一种低功耗无风扇车载通信控制器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20304204U1 (de) * 2003-03-17 2003-05-28 Woehr Richard Gmbh Computer mit einem Gehäuse mit Mehrschichtenkühlkörperwand und passivem Kühlsystem
CN201274032Y (zh) * 2008-09-12 2009-07-15 东莞市金翔电器设备有限公司 电脑机箱的后板构造
CN201418227Y (zh) * 2009-06-05 2010-03-03 深圳市宾利达智能科技有限公司 新型散热器
CN202939534U (zh) * 2012-06-11 2013-05-15 北京集智达智能科技有限责任公司 无风扇嵌入式平板电脑机箱
CN104750198A (zh) * 2013-12-30 2015-07-01 鸿富锦精密工业(武汉)有限公司 机箱组件
CN204557097U (zh) * 2015-04-28 2015-08-12 研扬科技（苏州）有限公司 一种低功耗无风扇车载通信控制器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113050773A (zh) * 2021-04-25 2021-06-29 扬州恒联照明器材有限公司 一种散热性能好的机箱

Also Published As

Publication number Publication date
CN206162291U (zh) 2017-05-10

Similar Documents

Publication Publication Date Title
US7911781B2 (en) Electronic device
US8089763B2 (en) Heat-dissipating assembly for server
US6322042B1 (en) Extracted and positioning device of a fan
WO2009046647A1 (en) A heat sink system, a heat sink apparatus and a heat sink method for a computer
US20080227379A1 (en) Magnetic fan-attaching structure and magnetic attaching element thereof
US7583498B2 (en) Computer casing with a backside cooling CPU heat dissipating function
TWI709363B (zh) 手持式電子裝置
US20090059514A1 (en) Heat dissipating apparatus of computer
TW201305773A (zh) 電腦一體機
JP2019091884A (ja) 電子機器
TW201344405A (zh) 散熱結構及其具有散熱結構之電子裝置
WO2018032578A1 (zh) 电脑主机箱
TWI540261B (zh) 具有組裝便利性之風扇結構
JP5733144B2 (ja) 電子機器
TWI518481B (zh) 伺服器
TWM466467U (zh) 兼具導流與固定功能的支架及其相關電子裝置
TWM601506U (zh) 電腦主機箱
TWI752752B (zh) Gpu卡之輔助支撐組件
TWM417747U (en) Computer case
CN216719054U (zh) 一种计算机散热结构
JP4799686B2 (ja) 電子機器
TWI429388B (zh) 可攜式電子裝置及其可插式散熱裝置
TWM505632U (zh) 筆記型電腦主機配置
EP2031478A1 (en) Heat dissipating apparatus of computer
JP3106844U (ja) 吸引式工業用コンピュータの放熱構造

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16913333

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16913333

Country of ref document: EP

Kind code of ref document: A1