WO2018032475A1 - Dispositif de commande électronique pour un système de suivi - Google Patents

Dispositif de commande électronique pour un système de suivi Download PDF

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Publication number
WO2018032475A1
WO2018032475A1 PCT/CN2016/095917 CN2016095917W WO2018032475A1 WO 2018032475 A1 WO2018032475 A1 WO 2018032475A1 CN 2016095917 W CN2016095917 W CN 2016095917W WO 2018032475 A1 WO2018032475 A1 WO 2018032475A1
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WO
WIPO (PCT)
Prior art keywords
module
motor
main board
electronic control
motherboard
Prior art date
Application number
PCT/CN2016/095917
Other languages
English (en)
Chinese (zh)
Inventor
彭程
施秋东
朱超
徐亚东
Original Assignee
苏州聚晟太阳能科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 苏州聚晟太阳能科技股份有限公司 filed Critical 苏州聚晟太阳能科技股份有限公司
Priority to PCT/CN2016/095917 priority Critical patent/WO2018032475A1/fr
Priority to CN201680027876.2A priority patent/CN108028574B/zh
Publication of WO2018032475A1 publication Critical patent/WO2018032475A1/fr

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/24—Casings; Enclosures; Supports specially adapted for suppression or reduction of noise or vibrations
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30—Structural association with control circuits or drive circuits

Definitions

  • the present application relates to an electronic control device, and more particularly to an integrated electronic control device that integrates a control module into a motor.
  • the solar tracking bracket is a steel structural bracket with an electrically controlled rotating structure.
  • the rotation of the motor drives the bracket to better align the solar module with the sun.
  • the motor, control module, sensor, etc. used to realize the sun tracking are usually used as independent modules or components, and are mounted on the bracket by screws or the like, and the cables are connected between the parts.
  • the independent installation of each part is complicated to install, and the control module, the motor, etc. need to be protected, and the interconnected cable sets increase the cost of production and maintenance, and the three-proof protection of the cable connection is unreliable.
  • a more concise and efficient solution is needed.
  • the device can include a motherboard that can include a first module area.
  • the apparatus can further include a control module mountable in the first module area and generating a control signal.
  • the apparatus may further include a shock absorbing member and a motor.
  • the motor can generate a driving force according to the control signal, and the main board can be integrated on the motor, and the damping component can reduce the vibration transmitted by the motor to the main board.
  • control module can be installed in the first module area by plugging.
  • the integrated electronic control device may further include a sensor
  • the main board may include a second module area
  • the sensor may be installed in the second module area
  • the second module area may be electrically connected to the first through the main board Module area.
  • the senor can be installed in the second module area by plugging.
  • the senor can be an angle sensor or a light sensor.
  • control module can include a protection unit that provides overcurrent protection for the motor.
  • the integrated electronic control device may include a sealing member that seals the main board and the motor as a whole.
  • the motor can be coupled to a rotating shaft of a bracket of a photovoltaic module, and the driving force generated by the motor can control the movement of the rotating shaft.
  • the integrated electronic control device may further include a communication module
  • the mainboard may include a second module area
  • the communication module may be installed in the second module area
  • the second module area may be electrically connected through the motherboard The first module area.
  • the communication module can be installed in the second module area by plugging.
  • the motherboard is integrated on the motor, and the motherboard can be connected to the motor by screws or slots.
  • the motherboard may include a printed circuit connecting the first module area and the second module area.
  • the motherboard is integrated on the motor and may include a motor connected to the motherboard through a cable.
  • the shock absorbing member may include a shock absorbing material, a shock absorbing structure, or a combination of both.
  • the integrated electronic control device may further include a limit switch
  • the main board may include a second module area
  • the limit switch is installed in the second module area
  • the second module area is electrically connected to the motherboard The first module area.
  • the integrated electronic control device can supply power to the control module and the motor through the main board.
  • FIG. 1 is a schematic diagram of an electronic control system based on some embodiments of the present application.
  • FIG. 2 is a schematic diagram of an electronic control device based on some embodiments of the present application.
  • FIG. 3 is a schematic diagram of a control module based on some embodiments of the present application.
  • FIG. 4 is a schematic diagram of module connections of an electronic control device based on some embodiments of the present application.
  • FIG. 5 is a schematic diagram of a motherboard structure in accordance with some embodiments of the present application.
  • FIG. 6 is a schematic diagram of a motherboard structure in accordance with some embodiments of the present application.
  • FIG. 7 is a schematic diagram of the structure of an electronic control device based on some embodiments of the present application.
  • FIG. 8 is a schematic diagram showing the structure of another electronic control unit 113 based on some embodiments of the present application.
  • FIG. 9 is a schematic diagram of the structure of another electronic control device 113 in accordance with some embodiments of the present application.
  • the photovoltaic power plant system 100 can include a power plant apparatus 110, a server 130, a database 140, a terminal equipment 150, and a network 120 that can be used for communication between one or more of the above components.
  • the plant equipment 110 can include a bracket 111, an electronic control unit 113, an inverter 115, a battery 117, or any combination of one or more of the above components.
  • the power station equipment 110 may be a power station equipment of an off-grid power generation system or a power station equipment of a grid-connected power generation system.
  • power plant equipment 110 Devices such as a charge and discharge controller (not shown in Figure 1) may also be included.
  • the bracket 111 can be used to secure a photovoltaic component.
  • the photovoltaic component may be a crystalline silicon solar cell, a dye-sensitized solar cell, an organic thin film solar cell, a compound solar cell, or the like.
  • the stent 111 can include a single-axis stent, a multi-axis stent, or a combination of both.
  • the stent 111 can include a flat shaft bracket, a tilt shaft bracket, or a combination of both.
  • the stent 111 can include a flat single-axis stent, an oblique single-axis stent, or a diagonal dual-axis stent, or a combination of multiples thereof. Other types of stents are also contemplated by this application.
  • multiple modules or components can be integrated on the bracket 111.
  • the modules include communication modules and the like.
  • the components include sensors, limit switches, and the like.
  • the sensor may be a different type of sensor, such as one or more of a tilt sensor, a height sensor, a temperature sensor, a wind speed sensor, and the like.
  • the integration includes separately fixing a plurality of modules or components (for example, sensors, limit switches) in a reserved position of the bracket 111, or integrating a plurality of modules or components on one main board and mounting the main board on the bracket 111. Reserved location.
  • the bracket 111 can be controlled by the electronic control unit 113.
  • the electronic control unit 113 may generate a signal to drive the movement of the bracket 111 in combination with one or more of the current operating parameters of the bracket, the environmental parameters, the historical operating data of the bracket, and the like. For example, the electronic control unit 113 can drive the bracket 111 to track the position of the sun, increase the direct component of sunlight on the surface of the photovoltaic module, and thereby increase the amount of power generated. In some embodiments, the electronic control device 113 can be integrated on the bracket 111. A detailed description of the electronic control unit 113 will be embodied elsewhere in this specification.
  • the inverter 115 can convert direct current into alternating current.
  • the inverter 115 may be an off-grid inverter or a grid-connected inverter.
  • the inverter 115 may be one or a combination of a square wave inverter, a staircase wave inverter, a sine wave inverter, or a combined three-phase inverter.
  • Battery 117 can be used to store the amount of electricity produced by the photovoltaic module.
  • Battery 117 can be a battery or battery pack.
  • the battery 117 may include a lead storage battery, a nickel cadmium battery, a nickel hydrogen battery, and a lithium ion. Subcell, lithium ion polymer battery, etc.
  • Network 120 may include a wired connection or a wireless connection.
  • Network 120 can be a single network or a combination of multiple networks.
  • network 120 can include one or a combination of a local area network, a wide area network, a public network, a private network, a wireless local area network, a virtual network, a metropolitan area network, a public switched telephone network, and the like.
  • Network 120 may include a variety of network access points, such as wired or wireless access points, base stations, or network switching points.
  • the components of the photovoltaic power plant system 100 interact with each other through the above access point connection network 150.
  • Server 130 can be used for analysis, processing or storage of data.
  • the data includes one or more of the current operating state of the bracket 111, historical operating data, environmental parameters, and the like.
  • the data may be derived from real-time monitoring of the rack 111 by the plant equipment 110 or from historical data stored by some storage devices (eg, database 140).
  • the server may be one or a combination of a file server, a database server, an FTP server, an application server, a proxy server, a mail server, and the like.
  • Server 130 can be a local server, a remote server, a distributed server, or the like.
  • server 130 can be a cloud server.
  • the database 140 can be used to store data related to the operational status of the plant equipment 110.
  • the database 140 may be a combination of one or more of a hierarchical database, a networked database, and a relational database.
  • the terminal device 150 can receive information of the electronic control device 130, including the operating status of the bracket 111, a fault alarm, or other information requested by the user to view.
  • the terminal device 150 can also send user input to the electronic control device 130, including control commands, parameter settings, and the like.
  • the user can use the terminal device 150 to send a control command to the electronic control device 113, and adjust the bracket 111 to make the photovoltaic module horizontal.
  • the user can use the terminal device 150 to send a control command to the electronic control device 113, and adjust the bracket 111 so that the photovoltaic module and the horizontal plane are at a predetermined maximum angle.
  • terminal device 180 can include a laptop A combination of one or more of 180-1, mobile phone 180-2, tablet 180-3, console 180-4, smart wearable device (eg, smart watch, etc.).
  • database 140 can be a local database of server 130 that is directly coupled to server 130.
  • server 130 and database 140 may be integrated within power plant device 110, and analysis, processing, or storage of data may be performed by electronic control device 113.
  • the electronic control unit 130 can include a main board 210, a control module 220, a sensor 230, an input and output module 240, a communication module 250, and a motor 260.
  • the main board 210 can be used to connect different modules and components in the electronic control unit 113.
  • the connection may include a cable connection, a plug connection, a pin weld, and the like.
  • the control module 220, the sensor 230, the input and output module 240, and the communication module 250 can be respectively installed in a reserved position on the main board 210 by plugging.
  • the motherboard 210 can be coupled to the motor 260 via a cable or to the motor 260 by screws or slots.
  • the motherboard 210 can be connected to an external circuit by means of a cable connection or a wireless connection for transmission of signals and/or power.
  • the main board 210 can supply power to each module inside the electronic control unit 130 by means of non-contact power transmission (such as microwave, electromagnetic induction, magnetic resonance, etc.).
  • motherboard 210 can be a printed circuit, an integrated circuit, or the like.
  • the motherboard 210 can include a plurality of connection ports and connection lines. A plurality of connection ports can be connected by the connection line.
  • the connection line may include circuitry inside the motherboard, printed circuitry or lithographic circuitry on the surface of the motherboard, cables external to the motherboard, and the like.
  • a signal/electrical connection can be made between any two components of the electronic control unit 113.
  • the signal/electrical connection can be achieved by a printed circuit on the main board 210, a lithography line, or the like.
  • the sensor 230 can be connected to the control module 220 through the main board 210, and send the acquired signal to the control module 220 for processing through the connection line in the main board 210.
  • the control module 220 can provide the electronic control device 130 with functions of processing signals, control signal transmission, and power input. In some embodiments, control module 220 can process the received signals to generate decision decisions or control instructions. In some embodiments, the signals received by control module 220 may be derived from sensor 230, input output module 240, motor 260, server 130, database 140, terminal device 150, or any combination of one or more of the above components. Control module 220 may process the acquired signals by one or more methods and generate decision decisions or control instructions. The processing method may include linear regression analysis, variance analysis, interpolation operation, discrete Fourier transform, Z transform, analog to digital conversion, image enhancement, image reconstruction, image encoding, contrast judgment, logic programming, and the like.
  • control module 220 can process the operating parameters (such as current, temperature, etc.) of the motor 260 by one or more of the above methods, determine whether there is an abnormality in the operation of the motor 260, and infer whether the bracket 111 has a jam, on the basis of which Control commands are generated, including processing of existing motor faults to protect internal components of the motor.
  • operating parameters such as current, temperature, etc.
  • control module 220 can control signal transmission between different modules or components in electronic control device 113.
  • the signal can include a data signal and a control signal.
  • the transmission of the data signals may include data transmitted between the control module 220 and the sensors 230, the input and output modules 240, the server 130, the database 140, or the terminal device 150. Transmission of the control signals may include the control module 220 receiving control signals transmitted by the terminal device 150 and/or the server 130.
  • different modules or components in the electronic control device 113 may perform operational state adjustments, operational mode switching, etc. in response to the control signals.
  • the signal can be transmitted through circuitry on the motherboard 210.
  • control module 220 can control the power input.
  • the power input may include power input to the module 230, the control module 220, the input and output module 240, the communication module 250, the motor 260, and the like.
  • control module 220 can process the input voltage or current. The processing may include AC to DC conversion, step down, changing voltage and current directions, and the like.
  • the control module 220 can control the activation of the respective module by controlling the power input of the respective module.
  • the paths on the main board 210 for signal transmission and power input may be the same or different.
  • control module 220 can be a control element or device that is coupled to main board 210.
  • the control module 220 can be a microcontroller unit (MCU), a central processing unit (CPU), a digital signal processor (DSP), a programmable logic device (PLD). ), an application specific integrated circuit (ASIC), a single chip microcomputer (SCM), or a system on a chip (SoC).
  • MCU microcontroller unit
  • CPU central processing unit
  • DSP digital signal processor
  • PLD programmable logic device
  • ASIC application specific integrated circuit
  • SCM single chip microcomputer
  • SoC system on a chip
  • control module 220 can be a specially designed control function component or device coupled to main board 210.
  • Sensor 230 may obtain information related to the environment and plant equipment 110.
  • the environmental related information includes wind speed, temperature, relative humidity, solar radiation, precipitation, snowfall, geographic coordinates, time, solar azimuth, solar elevation angle, cloud formation, atmospheric pressure, and the like.
  • the information related to the power plant apparatus 110 includes a bracket tilt angle, a bracket height, a photovoltaic component surface temperature, a photovoltaic component output current, a photovoltaic component output voltage, a motor current, a motor voltage, a motor temperature, a battery current, a battery voltage, and an inverter current. , inverter power, etc.
  • Sensors for acquiring environmental related information include wind speed sensors, wind direction sensors, temperature sensors, humidity sensors, light sensors, rain sensors, snow sensors, GPS locators, audio sensors, video sensors, infrared sensors, air pressure sensors, and the like.
  • Sensors for acquiring information related to the plant equipment 110 include tilt sensors, position sensors, temperature sensors, current sensors, voltage sensors, and the like.
  • some or all of the sensor 230 may be mounted inside the electronic control unit 113.
  • a current sensor that acquires a motor current can be mounted on the main board 210 by plugging.
  • part or all of the sensor 230 may be external to the electronic control unit 130 and connected to the main board 210 by cable or wirelessly.
  • the tilt sensor that obtains the tilt angle of the bracket can be mounted on the bracket and connected to the main board 210 through a cable or a wireless connection for signal transmission.
  • the electronic control unit 113 performs information interaction with the external device through the input and output module 240.
  • the information input or output through the input and output module 240 may include numbers, text, graphics, sound, and the like.
  • the input and output module 240 can obtain input information by means of buttons or key operations, handwriting operations, touch screen operations, voice control operations, and the like.
  • the input and output module 240 can output information in one or more forms of light, text, sound, image, vibration, and the like.
  • the input and output module 240 can include one or more components or devices such as LED indicators, touch screen displays, speakers, microphones, and the like.
  • the component or device can be integrated on the housing of the electronic control unit 113.
  • the input and output module 240 can be coupled to the network 120 via the communication module 250 to enable input and output of information.
  • the communication module 250 can establish communication between the electronic control device 130 and the network 120 or other external devices.
  • the manner of communication may include wired communication and wireless communication.
  • Wired communications may include communication over transmission media such as wires, cables, fiber optic cables, waveguides, nanomaterials, etc.
  • Wireless communications may include IEEE 802.11 series wireless local area network communications, IEEE 802.15 series wireless communications (eg, Bluetooth, ZigBee, etc.), mobile communications (eg, TDMA) , CDMA, WCDMA, TD-SCDMA, TD-LTE, FDD-LTE, etc.), satellite communications, microwave communications, scatter communications, etc.
  • the communication module 250 can encode the transmitted information using one or more encoding methods.
  • the encoding method may include phase encoding, non-returning zeroing, differential Manchester encoding, and the like.
  • the communication module 250 can select different transmission and encoding modes depending on the type of data that needs to be transmitted or the different types of networks.
  • the communication module 250 can include one or more communication interfaces. For example, RS485, RS232, etc.
  • the motor 260 can drive the carriage 111 to move.
  • the motor 260 can be a low speed motor (such as a geared motor, a claw pole synchronous motor, etc.), a high speed motor, a constant speed motor, a speed regulating motor (such as an electromagnetic speed regulating motor, a switched reluctance speed regulating motor, a DC speed regulating motor, etc.).
  • a speed regulating motor such as an electromagnetic speed regulating motor, a switched reluctance speed regulating motor, a DC speed regulating motor, etc.
  • the motor 260 can be coupled to a speed reduction mechanism that can reduce the output speed of the motor 260.
  • the speed reduction mechanism can be a mechanical transmission, an electromagnetic device, or the like.
  • the electric machine 260 can be a power take off device such as a hydraulic device.
  • the motor 260 can adjust the operating state according to a control signal generated by the control module 220.
  • the operating state may include start, stop, running time, rotational speed, direction of rotation, and the like of the motor 260.
  • the control module 230 is mounted on the motherboard 210, and the motherboard 210 is mounted in a reserved position of the motor 260 by screws or slots.
  • the electronic control unit 130 may further include a limit switch for defining a motion limit position of the bracket 111.
  • the limit switch can be a contactless proximity switch, including a passive proximity switch, a vortex proximity switch, a Hall proximity switch, a photoelectric proximity switch, and the like.
  • the limit switch can be mounted on the bracket 111 or in the electronic control device 113.
  • the electronic control unit 130 may also include a shock absorbing member for mitigating vibrations from the motor 260 or the external environment.
  • the shock absorbing member may be located between the main board 210 and the motor 260, thereby reducing vibration transmitted from the motor 260 to the main board 210.
  • the material constituting the shock absorbing member may be silicone, plastic, rubber, or the like.
  • the electronic control device 130 can further include a sealing component for providing a seal to one or more of the electronic control devices 130.
  • the sealing member may include a partial sealing member (such as a heat-conductive silicone for filling and sealing, an O-ring, a screw-on gasket seal, etc.), an integral sealing member (such as a casing, etc.).
  • the sealing member may integrally package the main board 210, the control module 220, the sensor 230, the input and output module 240, the communication module 250, the motor 260, the shock absorbing member, and the like.
  • the integrated package refers to the sealing of the module or component formed by the sealing member, which is different from separately sealing different modules or components.
  • control module 220 can include a control unit 310, a protection unit 320, a storage unit 330, and a clock unit 340.
  • the various units in control module 220 can be integrated into one circuit.
  • control unit 310, protection unit 320, storage unit 330, and clock unit 340 can be separate circuits or elements that are interconnected by motherboard 210.
  • the control unit 310 can process the information acquired by the control module 220 and generate a control signal.
  • Control unit 310 can process the acquired information by one or more methods.
  • the processing may include numerical calculations, waveform processing, image processing, logic processing, and the like.
  • Numerical calculation methods may include principal component analysis, fitting, iteration, interpolation, sorting, and the like.
  • the control unit 310 can calculate and compare the solar radiation intensity obtained by the photosensitive sensors at different inclination angles to determine the solar elevation angle.
  • the waveform processing method may include analog to digital conversion, wavelet transform, Fourier transform, low pass filtering, frequency modulation, amplitude modulation, and the like.
  • the control unit 310 may perform a Fourier transform on the voltage analog signal generated by the wind speed sensor to convert into a discrete digital signal.
  • Image processing methods may include image enhancement, image encoding, geometric processing, arithmetic processing, image reconstruction, and the like.
  • the control unit 310 can perform image enhancement on the satellite cloud image of the power station device 110, and display the distribution and quantity of the power plant devices 110 in a certain place on the satellite cloud image. And other information.
  • Logic processing methods can include comparisons with historical results, programming, and the like.
  • control unit 310 can control the motor operation according to the historical operation data of the motor (such as the motor operation data of yesterday and last year) in the case of a sensor failure, and ensure that the photovoltaic component tracks the orientation of the sun.
  • the angle increases the direct component of sunlight on the surface of the photovoltaic module to increase the amount of electricity generated.
  • the control unit 310 can generate a control signal according to the processing result.
  • the control signal may include starting a motor, setting a motor running speed, acquiring a motor current, a power supply signal, adjusting a sensor operating parameter, acquiring a motor historical running data, storing information, and the like.
  • the control unit 310 can control the power input of the electronic control device 130 and the power supply of the module or component of the sensor 230, the control module 220, the input and output module 240, the communication module 250, the motor 260, and the like.
  • control unit 310 can include one or more power control circuits or components for controlling the voltage or current in the power supply circuit.
  • the power supply control circuit can include a rectifier circuit, an equalization circuit, a thyristor, an oscillator, an inverter, and the like.
  • control unit 310 can be a control element.
  • the control unit 310 can be a microcontroller unit (MCU), a digital signal processor (DSP), a programmable logic device (PLD), or the like.
  • MCU microcontroller unit
  • DSP digital signal processor
  • PLD programmable logic device
  • the protection unit 320 can monitor and protect the operation of the electronic control device 130. Protection unit 320 can monitor one or more operational parameters of electronic control device 130. In some embodiments, the protection unit 320 can monitor modules or components such as the motherboard 210, the sensor 230, the input and output module 240, the communication module 250, the motor 260, the sealing component, and the like. In some embodiments, the one or more operational parameters may include current, voltage, temperature, power, pressure, and the like. The protection unit 320 may compare the acquired one or more operating parameters with corresponding preset conditions. The preset condition may be a threshold or a range of values.
  • the preset conditions may include a motor current threshold, a motor temperature threshold, a motherboard voltage range, a sensor current voltage range, a seal component pressure threshold, and the like.
  • the control unit 310 may generate Corresponding control signals. For example, when the protection unit 320 detects that the current flowing through the motor 260 exceeds the preset current threshold, the control unit 310 can generate a control signal that cuts off the power supply to the motor or adjusts the operating state of the motor 260 (eg, reduces the speed).
  • the one or more preset conditions may be set by a system preset, a user setting (such as a user setting by the input/output module 240 or the terminal device 150), or an electronic control device 113 adaptively adjusting. .
  • Protection unit 320 can be a protection circuit or component.
  • the protection unit 320 may include an overcurrent protection circuit, an overvoltage protection circuit, a short circuit protection circuit, an overheat protection circuit, and the like.
  • protection unit 320 can be a motor overcurrent protection circuit.
  • the overcurrent protection circuit can monitor the current flowing through the motor 260 through components or devices such as an analog to digital converter, a Hall current sensor, a Rogowski coil, a fiber optic current sensor, and the like.
  • the storage unit 330 can be used to store information acquired and generated by the control module 220.
  • the information that the storage unit 330 can store includes signals of the sensor 230, input/output information through the input and output module 240, processing results generated by the control unit 310, preset conditions for the protection unit 320 for comparison, and the like.
  • the storage unit 330 can store information related to the environment and the plant equipment 110, including wind speed, solar azimuth, solar elevation angle, bracket inclination, astronomical calculation results, time, location, fault record, motor operation history data. , user instructions, etc.
  • the form in which the storage unit 330 stores information may be text, numbers, curves, tables, images, and the like.
  • the storage unit 330 may include, but is not limited to, various types of storage devices such as a solid state drive, a mechanical hard disk, a USB flash drive, an SD memory card, an optical disk, a random-access memory (RAM), and a read-only memory. (read-only memory, ROM), etc.
  • the stored information may be shared between the storage unit 330, the server 160, the database 170, and the terminal device 180 through the network 120.
  • the information stored in storage unit 330 can be periodically synchronized to server 160.
  • Clock unit 340 can be used to provide time information to control unit 310.
  • the clock Unit 340 can compensate for leap years, precession, and the like.
  • Clock unit 340 can be a digital circuit timer, a software timer, or the like.
  • clock unit 340 can be a digital circuit timer such as a 555 timer, a DS1302 clock circuit, or the like.
  • clock unit 340 can be a software timer such as a windows timer.
  • control module 220 can be integrated into a reserved area of the motherboard 210.
  • the control unit 310, the protection unit 320, the storage unit 330, and the clock unit 340 may be integrally mounted on one circuit board and integrated in the reserved area of the main board 210 through the circuit board.
  • the integration may include a plug-in connection to the motherboard 210.
  • the control unit 310, the protection unit 320, the storage unit 330, and the clock unit 340 may also be installed in the different reserved areas of the main board 210, respectively.
  • control module 220 each unit in the control module 220 is merely a specific embodiment and should not be regarded as the only feasible solution. It will be apparent to those skilled in the art that various modifications and changes can be made to the configuration of control module 220 without departing from the principles of the various elements. However, these modifications and changes are still within the scope of the above description.
  • the control unit 310 can be coupled to the sensor 230, the communication module 250, the motor 260, the protection unit 320, the clock unit 340, and the storage unit 330, and controls signal transmission between the different units or components described above.
  • the different units or components described above may be connected by a motherboard 210.
  • the control unit 310, the sensor 230, the communication module 250, the motor 260, the protection unit 320, the clock unit 340, and/or the storage unit 330 may be mounted on different areas on the main board 210 by plugging or soldering. Different areas on the main board 210 can be connected by circuits on the main board.
  • the method of mounting on the main board can simplify the connection, save the cost, reduce the sealing device, avoid the wrong connection, and improve the installation and maintenance efficiency.
  • the required modules or components can be mounted on the main board by plugging according to actual conditions.
  • control unit 310 can acquire information from the sensor 230 or send it to the sensor 230.
  • control signal In some embodiments, sensor 230 can send the acquired information to control unit 310 for processing.
  • the information may include peripheral environment information or plant equipment 110 information.
  • control unit 310 can send a control signal to sensor 230.
  • the control signal may include adjusting a sensor launch angle, setting parameters, and the like.
  • all or a portion of the sensors may be mounted on the main board 210 by plugging. In some embodiments, all or a portion of the sensor may be mounted external to the electronic control unit 113, such as on the battery 117 or on the bracket 111.
  • Control unit 310 can be coupled to network 120 via communication module 250.
  • the control unit 310 can retrieve and transmit information from the server 130, the database 140, or the terminal device 150.
  • control unit 310 can set the encoding mode and transmission mode of communication module 250.
  • the control unit 310 and the communication module 250 may be respectively mounted in different areas of the main board 210 and electrically connected through circuits on the main board 210.
  • Control unit 310 may generate one or more control commands to control operation of motor 260.
  • the control command can set the operating state of the motor 260.
  • control unit 310 can include one or more circuit components mounted on motherboard 210.
  • the control unit 310 can control the operating state of the motor 260 by controlling the switching state of the circuit components.
  • control unit 310 can include a relay and a transistor.
  • the motor start signal generated by the control unit 310 can control the relay to pull in and the transistor to conduct, thereby activating the motor 260.
  • the motor 260 can be coupled to the shaft of the bracket 111 by a reduction mechanism.
  • the motor 260 can drive the rotational movement of the bracket 111 to adjust the tilt angle of the photovoltaic module fixed to the bracket 111.
  • Protection unit 320 may acquire operational parameters of motor 260 and send a protection command to control unit 310 when the operational parameter exceeds a threshold or range.
  • the control unit 310 generates a control command to drive the motor 260 according to the protection command of the protection unit 320, thereby protecting the operation of the motor.
  • the protection unit 320 can be mounted on the main board 210 and connected to the control unit 310 through the main board 210.
  • the control unit 310 may store information to the storage unit 330 or acquire history information from the storage unit 330.
  • the information sent by the control unit 310 to the storage unit 330 may include information acquired from the sensor 230, information acquired by the input and output module 240, real-time operating parameters of the motor 260, from the server 130, the database 140 through the network 120. And/or information acquired by the terminal device 150, and the like.
  • the control unit 310 can acquire time from the clock unit 340 and set the clock unit 340. In some embodiments, control unit 310 can utilize the acquired time to calculate the current sun position. For example, in conjunction with the current geographic location and one or more astronomical algorithms, control unit 310 can calculate the solar azimuth and solar elevation angle. In some embodiments, based on the current sun position, control unit 310 can adjust the tilt of bracket 111 by controlling motor 260 to operate. In some embodiments, the control unit 310 can send the acquired time to the sensor 230, the communication device 250, the motor 260, or the protection unit 320 for determining the sampling time, the start and end time, and the like.
  • FIG. 5 is a schematic diagram of a motherboard structure in accordance with some embodiments of the present application.
  • Different modules or components can be mounted on the motherboard 210.
  • the main board 210 may be a flat plate, a box, or the like.
  • the motherboard 210 may include three module areas 501-503.
  • different modules or components in the electronic control device 113 can be mounted in the module area 501, the module area 502, or the module area 503.
  • the mounting may include the module or component being coupled to the motherboard 210 by a cable connection, stitch soldering, or plugging.
  • the motherboard 210 may include a plurality of module areas, and the number and layout of the module areas may be set according to modules or components in the electronic control unit 113.
  • connection ports may be included within module area 501, module area 502, and module area 503.
  • the module area 501 may include one connection port 505 and one connection port 507; the module area 502 may include one connection port 509; the module area 503 may include one connection port 510 and one connection port 511.
  • the module or component can be connected to the main board 210 through the connection port, and realize the phase through the main board Mutual signal transmission.
  • the connection port types in the same module area can be the same or different.
  • the connection port type may include a wire clip, a contact type interface, a pin type interface, a socket, an expansion slot, a cable interface, a USB interface, and the like.
  • connection ports can be connected by a connection line 512.
  • the connection line 512 can be used to connect different connection ports within the same module area and connection ports within different module areas.
  • the connection line 512 may be internal, surface or external to the main board 210.
  • the connection lines can be cables, films, integrated circuit connections, printed circuit connections, and the like.
  • the connection lines may include copper wires, aluminum wires, carbon nanotubes, printed wiring, lithography lines, and the like.
  • the module area 501 can be used to install the control module 220.
  • the units in control module 220 may correspond to one or more modular structures.
  • the units within control module 220 may be separate, each corresponding to a modular structure.
  • the units within control module 220 may be a single unit, corresponding to a modular structure.
  • the modular structure can be connected to the main board 210 through a connection port.
  • the modular structure can be a packaged miniaturized component, such as a chip or the like.
  • control module 220 can include a modular structure 504 and a modular structure 506.
  • modular structure 504 and modular structure 506 can include one or more of control unit 310, protection unit 320, storage unit 330, and clock unit 340, respectively.
  • the modular structure 504 and the modular structure 506 can be mounted on the main board 210 via a connection port 505 and a connection port 507, respectively.
  • the manner of installation may include cable connection, pin welding or plugging, and the like.
  • connection port 504 and modular structure 506 can have different internal structures and interfaces.
  • the connection port 504 can be an expansion slot.
  • the expansion slot may include ISA, PCI, AGP, CNR, AMR, and the like.
  • the connection port 507 can be a socket, such as a Type 86 socket, a Type 118 socket, a Type 120 socket, or a specially designed socket having a particular shape or number of sockets.
  • the connection port 505 and the connection port 507 can be distinguished by way of character identification. Do not The same connection port can adopt different interface shapes and/or connection manners to prevent the circuit from being connected incorrectly and reversely.
  • the module area 502 can be used to mount modules or components such as the sensor 230, the input and output module 240, the communication module 250, or a limit switch.
  • the sensor 230, the input and output module 240, the communication module 250, the limit switch module or the component are connected to the main board 210 by plugging, stitching, or the like, alone or in a modular structure.
  • a sensor can be mounted on the main board 210 independently by plugging or stitching.
  • a plurality of sensors can be mounted to the main board 210 by plug or pin soldering through a modular structure such as the modular structure 508.
  • the modular structure 508, including one or more of the above modules or components, may be coupled to the motherboard 210 via a connection port 509.
  • the modular structure 508 can be mounted to the motherboard 210 by stitching or plugging.
  • motor 260 (not shown in FIG. 5) can be coupled to main board 210 via connection port 510 within module area 503.
  • the connection method may include a cable connection or a plug connection.
  • the electronic control device 113 may include a plurality of main boards, and the plurality of main boards may be fixed in parallel by screws, brackets, or the like, or respectively fixed to different parts of the electronic control device 113.
  • the modules or components in the electronic control unit 113 can be mounted on different motherboards.
  • the different motherboards can be connected by cable connection or plugging.
  • the motherboard 210 can be connected to other motherboards through one or more connection ports (such as the connection port 511).
  • the connection port 511 can be a cable interface.
  • the layout of the module areas may be such that the interface of the control unit 310 is at a central location of the motherboard 210, and the interfaces of other modules or components may be distributed in a manner around the interface of the control unit 310.
  • the manner of distribution may be related to interface type, signal type, signal flow direction, and the like.
  • the modules and components of the electronic control unit 113 that are connected to the main board 210 can be installed or removed by plugging and unplugging in a modular structure.
  • the required modules or components can be mounted on the main board 210 by plugging and unplugging according to actual conditions.
  • the protection unit 310 may be included
  • the modular structure is plugged into the corresponding module area of the main board 210, and real-time current data of the motor 260 can be acquired.
  • the modular structure may have a particular connection port, a particular connection, and a particular volume, etc., for ease of production, installation, and maintenance.
  • the modular structure can be connected to the main board 210 by a cable and fixedly mounted at a location within the sealing component of the electronic control unit 113.
  • the one or more modules may be separately connected to the main board 210 by a cable connection.
  • the one or more modules may be mounted inside or outside of the electronic control unit 113.
  • the sensor 230 can be separately attached to the bracket 111 and connected to the corresponding module area of the main board 210 by a cable.
  • connection port 606 can include a wire clip, a contact interface, a pin interface, a socket, an expansion slot, a cable interface, a USB interface, and the like.
  • the top of a modular structure 602 can include a connection port 605.
  • the modular structure 602 can be coupled to the motherboard 600 via a connection port 606 that can be coupled to the modular structure 602 via a connection port 605.
  • the connections may include cable connections, pin soldering, plugging, and the like.
  • the modular structure 601 and the modular structure 602 can be connected and provide signal transmission through the connection port 606 and the connection port 605.
  • modular structure 601 and modular structure 602 can include different modules or components.
  • modular structure 601 and modular structure 602 can be different types of sensors.
  • the connection port 605 can be different than the connection port 606.
  • the modular structure 601 can be connected to the modular structure 602 by a connection port 605 in a cable connection, and the modular structure 602 can be connected to the main board 600 in a plugged manner through the connection port 606.
  • the electronic control unit 113 may include a main board 210, a module or assembly (not shown in FIG. 7) connected to the main board 210, a motor 260, a shock absorbing member 710, and a sealing member 720.
  • the module or component connected to the main board 210 may include a control module 220, a sensor 230, an input and output module 240, a communication module 250, a limit switch, and the like.
  • the shock absorbing member 710 can alleviate the vibration of the main board 210, the module or the component on the main board.
  • the vibrations may include vibrations from the electric machine 260 and vibrations caused by an external environment such as storms, rain, snow, earthquakes, and the like.
  • the shock absorbing component 710 can comprise one or more shock absorbing materials.
  • the shock absorbing material may include foam, rubber, plastic, silica gel, cork, fiberglass, felt, metal foam, metal rubber, and the like.
  • the shock absorbing member 710 can mitigate vibrations by one or more shock absorbing structures.
  • the structure may include a coil spring, a toroidal wire rope, a bellows, a honeycomb air cushion, and the like.
  • the shock absorbing component 710 can include a combination of a shock absorbing material and a shock absorbing structure.
  • the shock absorbing component 710 can be selected or designed in accordance with one or more factors.
  • the one or more factors may be associated with one or more modules or components in the electronic control device 113.
  • the one or more factors may include the vibration frequency of the motor 260, the sensitivity of the control unit 310 to vibration, the manner in which the modules and components on the main board 210 are connected, and the installation of the preset damping component 710.
  • the integrated motherboard damper components may be selected in consideration of the motherboard 210 and the modules or components on the motherboard. For example, the natural frequency of the damper member 710 is taken as 1/2 to 1/3 of the vibration frequency of the motor.
  • the shock absorbing member 710 can be located between the motor 260 and the main board 210.
  • Sealing member 720 can be used to seal electronic control device 113.
  • the sealing member 720 can seal the motherboard 210, the module or assembly connected to the motherboard 210, the motor 260, and the shock absorbing member 710 to prevent The influence of dust, rain, corrosive liquids, etc. in the external environment.
  • the seal may include a mechanical seal, an oil seal, a water seal, a pneumatic seal, a hydraulic seal, and the like.
  • the sealing component can include a partial sealing component and an integral sealing component.
  • the partial sealing member may include a seal, an auxiliary seal, a sealing mechanism, and the like.
  • the seal may include an O-ring, a sealing plug, a gasket, a glue, a thermal silica gel, and the like.
  • the auxiliary seal may include a spring, a screw, or the like.
  • the sealing mechanism may include a ferrule sealing structure, a clamp sealing structure, and the like.
  • the integral sealing member may include an outer sealed housing that is integrally selected according to the shape of the motor, the main board, the module or assembly on the main board, and the shock absorbing member.
  • the sealing component 720 can be selected or designed in accordance with one or more factors.
  • the one or more factors may be associated with one or more modules or components in the electronic control device 113.
  • the one or more factors may include an operating speed of the motor 260, a running direction of the motor 260, a temperature level of the electronic control device 113, an overall size of the electronic control device 113, an internal pressure of the sealing member 720, Main board 210 position and so on.
  • Motor 260 can include a housing 730.
  • the motor 260 can be mounted to the front of the electronic control unit 113 and output a driving force through the front shaft.
  • the main board 210 is integrated on the motor 260 by a shock absorbing member 710.
  • the main board 210 can be mounted at an upper, outer, rear, etc. position of the motor 260 and integrally sealed with the motor 260 by a sealing member 720.
  • the motherboard 210 and the modules or components connected to the motherboard 210 are located on the axis of the motor 260 and are at the rear of the electronic control unit 113.
  • the transmission of signals and the input of power can be performed between the motor 260 and the main board 210 via a cable.
  • the motherboard 210 can be secured to a reserved location on the motor 260.
  • the reserved location may be related to the motherboard 210, the module or component connected to the motherboard 210, the manner in which the module or component is connected to the motherboard, the motor model, the selection of the damping component, and the like.
  • the size of the reserved location may be determined according to the overall shape of the motherboard 210 and the modules or components connected to the motherboard 210.
  • the sealing member 720 can integrally package the main board 210, the motor 260, and the damper unit 710.
  • the integrated package can include sealing the module or assembly by a unitary sealed outer casing and one or more partial sealing members. For example, it can be sealed by an integrally formed outer casing and with a bearing sealing mechanism.
  • modules or components (such as sensor 230, communication module 250, etc.) coupled to motherboard 210 may be mounted within a unitary sealed enclosure, such as on motherboard 210 or on an integral sealed enclosure.
  • the sealing member 720 can include an internal support structure on which the module or assembly that is coupled to the motherboard 210 can be mounted.
  • other modules or components than the control module 220 can be mounted outside of the integral sealed enclosure.
  • the senor 230 can be mounted on the bracket 111 and connected to the main board 210 by a cable connection.
  • a cable for transmitting signals and input power between the motor 260 and the main board 210 can be attached to a surface or internal support structure of the integral sealed housing.
  • the integration of the main board 210 to the motor 260 can include insertion into the card slot reserved on the motor housing 730 by plugging and unplugging.
  • the sealing member 720 can be mounted to the rear of the motor 260 by splicing to seal the motherboard 210 and the modules or units connected to the motherboard 210. The splicing can be a flanged connection.
  • the main board 210 is integrated into the motor 260, and the module or component on the main board 210 and the main board is mounted on the motor 260 by screws, card slots, etc., and the motor 260 is connected by cables, plugs, and the like.
  • the path of the transmission is integrated with the motor 260.
  • FIG. 8 is a schematic diagram showing the structure of another electronic control device 113 based on some embodiments of the present application.
  • the electrical control device 113 of FIG. 8 differs from that of FIG. 7 in that the main board 210 can be integrated into the outer casing 820 of the motor 260.
  • the main board 210 is integrated on the motor 260 through the shock absorbing member 810.
  • the main board 210 may be mounted at an upper portion, a side edge, a corner, or the like of the motor housing 820 by a shock absorbing member.
  • the motor housing 820 can integrally package the main board 210, the motor 260, and the shock absorbing member 810.
  • the integrated package may include the above module or an integral sealing component and one or more partial sealing components
  • the components are sealed.
  • it can be sealed by an integrally formed outer casing and with a bearing sealing mechanism.
  • modules or components (such as sensor 230, communication module 250, etc.) coupled to motherboard 210 may be mounted within a unitary sealed enclosure, such as on motherboard 210 or on an integral sealed enclosure.
  • other modules or components than the control module 220 can be mounted outside of the integral sealed enclosure.
  • a limit switch can be mounted on the bracket 111 to limit the range of tilt angles of the bracket.
  • a cable for transmitting signals and input power between the motor 260 and the main board 210 can be attached to a surface or internal support structure of the integral sealed housing.
  • a middle spacer layer may be included between the motor 260 and the main board 210 for separating the motor 260 from the main board 210.
  • the control module 220, the sensor 230, the input and output module 240, and the shock absorbing member 810 can be mounted on one side of the intermediate spacer layer.
  • the intermediate spacer layer can reduce the effects of noise, vibration, grease contaminants, and the like of the motor 260 on the motherboard 210 and the modules or components connected thereto.
  • the intermediate spacer layer can be part of the shock absorbing member 810.
  • the interior of the motor 210 can include a support structure to which the motherboard 210 can be bolted.
  • the electronic control unit 113 can include a motor 909, a shock absorbing member 905, a main board 906, a module or assembly coupled to the main board 906, and a partial sealing member 904.
  • the motor 909 can include a motor shaft 901, a motor rotor 902, a motor stator 903, and a motor housing 908.
  • the motor 909 can include a speed reduction mechanism for adjusting the rotational speed of the rotating shaft 901.
  • the motor 909 can include a support structure inside, and the main plate 906 can be coupled to the support structure by a shock absorbing member 905.
  • the connection manner may include a card slot connection, a screw connection, a spring press, and the like.
  • the shock absorbing member 905 can include a shock absorbing material, a shock absorbing structure, or a combination of both.
  • the shock absorbing material may include silica gel, plastic, foam, metal foam, and the like.
  • the shock absorbing structure may include Coil spring, ring wire rope, bellows, etc.
  • the partial sealing component 904 and the motor housing 908 can seal the electronic control unit 113.
  • Motor housing 908 can include a window to which partial sealing member 904 seals.
  • the sealing means may include a screw connection, an interference fit connection, a spring press fit, and the like.
  • the partial sealing component 904 can be coupled to the integral sealed housing 908 by a spring or screw that compresses the rubber ring at its edges to integrally seal the motherboard 906 and the module or assembly that is coupled to the motherboard 906.
  • the present application uses specific words to describe embodiments of the present application.
  • a "one embodiment,” “an embodiment,” and/or “some embodiments” means a feature, structure, or feature associated with at least one embodiment of the present application. Therefore, it should be emphasized and noted that “an embodiment” or “an embodiment” or “an alternative embodiment” that is referred to in this specification two or more times in different positions does not necessarily refer to the same embodiment. . Furthermore, some of the features, structures, or characteristics of one or more embodiments of the present application can be combined as appropriate.
  • aspects of the present application can be illustrated and described by a number of patentable categories or conditions, including any new and useful process, machine, product, or combination of materials, or Any new and useful improvements. Accordingly, various aspects of the present application can be performed entirely by hardware, It can be executed entirely by software (including firmware, resident software, microcode, etc.) or by a combination of hardware and software.
  • the above hardware or software may be referred to as a "data block,” “module,” “engine,” “unit,” “component,” or “system.”
  • aspects of the present application may be embodied in a computer product located in one or more computer readable medium(s) including a computer readable program code.
  • the computer program code required for the operation of various parts of the application can be written in any one or more programming languages, including object oriented programming languages such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.NET, Python. Etc., regular programming languages such as C, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages such as Python, Ruby and Groovy, or other programming languages.
  • the program code can run entirely on the user's computer, or run as a stand-alone software package on the user's computer, or partially on the user's computer, partly on a remote computer, or entirely on a remote computer or server.
  • the remote computer can be connected to the user's computer via any network, such as a local area network (LAN) or wide area network (WAN), or connected to an external computer (eg via the Internet), or in a cloud computing environment, or as a service.
  • LAN local area network
  • WAN wide area network
  • an external computer eg via the Internet
  • SaaS software as a service

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)

Abstract

La présente invention concerne un dispositif de commande électronique intégré (113). Le dispositif (113) comprend une carte principale (210), la carte principale (210) comprenant une première zone de module. Le dispositif (113) comprend en outre un module de commande (220), le module de commande (220) étant monté dans la première zone de module et générant un signal de commande. Le dispositif (113) comprend en outre un composant d'absorption des chocs (710, 810, 905) et un moteur électrique (260, 909). Le moteur (260, 909) génère une force d'entraînement sur la base du signal de commande ; la carte principale (210) est intégrée sur le moteur électrique (260, 909) ; et le composant d'absorption des chocs (710, 810, 905) réduit la vibration transmise à la carte principale (210) depuis le moteur électrique (260, 909).
PCT/CN2016/095917 2016-08-18 2016-08-18 Dispositif de commande électronique pour un système de suivi WO2018032475A1 (fr)

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PCT/CN2016/095917 WO2018032475A1 (fr) 2016-08-18 2016-08-18 Dispositif de commande électronique pour un système de suivi
CN201680027876.2A CN108028574B (zh) 2016-08-18 2016-08-18 一种一体化电控装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/095917 WO2018032475A1 (fr) 2016-08-18 2016-08-18 Dispositif de commande électronique pour un système de suivi

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