WO2018018837A1 - Fpcb结构、扬声器模组及fpcb结构的制作方法 - Google Patents

Fpcb结构、扬声器模组及fpcb结构的制作方法 Download PDF

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Publication number
WO2018018837A1
WO2018018837A1 PCT/CN2016/112175 CN2016112175W WO2018018837A1 WO 2018018837 A1 WO2018018837 A1 WO 2018018837A1 CN 2016112175 W CN2016112175 W CN 2016112175W WO 2018018837 A1 WO2018018837 A1 WO 2018018837A1
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WIPO (PCT)
Prior art keywords
fpcb
bending section
bending
bent
section
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PCT/CN2016/112175
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English (en)
French (fr)
Inventor
伦英军
张翠丽
陈钢
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歌尔股份有限公司
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Publication of WO2018018837A1 publication Critical patent/WO2018018837A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers

Definitions

  • the present invention relates to the field of flexible printed circuit boards, and more particularly to an FPCB structure, a speaker module to which the FPCB structure is applied, and a method of fabricating an FPCB structure.
  • FPCB Flexible Printed Circuit Board
  • a flexible printed circuit board which is a patterned printed circuit board made of a flexible substrate.
  • PCBs rigid printed circuit boards
  • FPCBs have the advantages of free bending, folding, and winding.
  • the FPCB can be arranged arbitrarily according to the layout of the internal space of the product like a wire, so that components can be arbitrarily arranged in a three-dimensional space, and the connection device between the wire and the circuit board can also be canceled. Therefore, the FPCB
  • the electronic products can be miniaturized and refined, and the reliability of the products is greatly improved.
  • FPCB has been widely used in mobile communication products, laptops, consumer electronics, aerospace, military electronics and other fields.
  • the existing FPCB structure 11' is U-shaped, and because of the limitation of its shape, a large number of blank areas are formed in the FPCB imprint 1', so a large amount of coverage is caused during the die cutting process. Waste of the membrane. Since the cover film accounts for a relatively high cost of the entire FPCB product, this will greatly increase the cost of the FPCB product.
  • an FPCB structure comprising: an FPCB body in an original state of an integrated linear connection; and a first bending section and a second bending section respectively located at opposite ends of the FPCB body, An external terminal is disposed on the first bending section and the second bending section;
  • the first bending section and the second bending section are both bent at 180° with respect to the plane of the FPCB body, and the extending directions of the first bending section and the second bending section are both
  • the extending direction of the FPCB body is perpendicular; the first bending segment and the second bending segment are both located on the same side of the FPCB body width direction, the first bending segment, the FPCB body and the first
  • the two bending segments form a U-shaped structure.
  • first bending segment and the second bending segment are located on the same side of the plane of the FPCB body; or the first bending segment and the second bending segment are located on a plane of the FPCB body. On both sides.
  • the external terminal is a pad or a gold finger.
  • a first support member for supporting and connecting the two portions is disposed between the FPCB body and the first bent portion near the bend, and the FPCB body and the first bent portion are The bent portion is an arc segment;
  • a second support member for supporting and connecting the two portions is provided between the FPCB body and the second bent portion near the bend, the FPCB body and the The bend between the second bent sections is an arc segment.
  • the upper surface and the lower surface of the first support member are respectively provided with a glue layer for connecting with the FPCB body and the first bent portion after bending; the second support member A glue layer for connecting with the FPCB body and the bent second bending section is provided on the upper surface and the lower surface.
  • the first support member and the second support member are both made of a material having elasticity.
  • a via hole is disposed on the copper foil layer of the FPCB structure at a position corresponding to the bending position of the first bending segment and the second bending segment.
  • Another object of the present invention is to provide a speaker module to which the FPCB structure of the present invention is applied.
  • a speaker module includes a module housing and a speaker unit mounted in the module housing, the speaker module further including an FPCB structure of the present invention, the FPCB One end of the structure electrically connects the speaker unit and the other end is used to electrically connect an external circuit.
  • Still another object of the present invention is to provide a new technical solution for a method of fabricating an FPCB structure.
  • a method of fabricating an FPCB structure including Next steps:
  • each Flip integrates several FPCB single-boards, each FPCB single-board is linear, and several FPCB single-boards are arranged in an array;
  • the FPCB single board includes an FPCB body and a first bent section and a second bent section at both ends;
  • the first bending section and the second bending section are both bent at 180° with respect to the plane of the FPCB body, and the extending directions of the first bending section and the second bending section are both
  • the first bending section, the FPCB body and the second bending section form a U shape perpendicular to the extending direction of the FPCB body.
  • step C the first bending segment and the second bending segment are bent toward the same side with respect to a plane where the FPCB body is located;
  • first bending segment and the second bending segment are bent toward different sides with respect to a plane in which the FPCB body is located.
  • the inventors of the present invention have found that in the prior art, there is a problem that a large amount of blank areas in the FPCB imposition cause a waste of the cover film. Therefore, the technical task to be achieved by the present invention or the technical problem to be solved is not thought of or expected by those skilled in the art, so the present invention is a new technical solution.
  • One technical effect of the present invention is that the original state of the FPCB body, the first bending section and the second bending section is an integrated linear connection, and the first bending section and the second bending section are bent and can be combined with the FPCB body.
  • U-shaped structure so that the FPCB structure in the FPCB full-page can be linear rather than U-shaped.
  • This FPCB structure has a small footprint and can be arranged tightly in the FPCB full-page, thus avoiding the appearance in the FPCB full-page. A large number of blank areas to achieve the purpose of reducing costs.
  • Another technical effect of the present invention is that an FPCB full-page including a linear FPCB single board can be fabricated by the FPCB structure manufacturing method, thereby avoiding a large number of blank areas in the FPCB full-page and effectively reducing the cost.
  • FIG. 1 is a schematic structural view of a conventional FPCB full plate
  • FIG. 2 is a schematic structural view of a first embodiment of an FPCB structure according to the present invention.
  • FIG. 3 is a schematic structural view of a second embodiment of the FPCB structure of the present invention.
  • FIG. 4 is a schematic structural view of a second embodiment of the FPCB structure of the present invention after being bent;
  • Figure 5 is a cross-sectional view taken along line A-A of Figure 4.
  • FIG. 6 is a schematic structural view of a third embodiment of an FPCB structure according to the present invention.
  • Figure 7 is a partial detail view of Figure 6;
  • FIG. 8 is a schematic structural view of an FPCB full plate having the FPCB structure of the present invention.
  • the present invention provides an FPCB structure 1, which includes an original state as an integrated straight line connection.
  • the FPCB body 101 and the first bending section 102 and the second bending section 103 respectively located at the two ends of the FPCB body 101 are provided on the first bending section 102 and the second bending section 103.
  • the external terminal 104, the external terminal 104 refers to a component of the FPCB structure 1 for connecting with an electrical connector or component, such as a pad and/or a gold finger, etc.; the first bending segment 102 and the second bending The segments 103 are each bent 180° with respect to the plane of the FPCB body 101, and the extending directions of the first bending segment 102 and the second bending segment 103 are both opposite to the extending direction of the FPCB body 101. Vertically; the first bending section 102 and the second bending section 103 are both located on the same side in the width direction of the FPCB body 101, the first bending section 102, the FPCB body 101 and the second bending The segment 103 constitutes a U-shaped structure.
  • the existing FPCB full-page 1′ (shown in FIG. 1 ) can only discharge 24 pcs (piece) of FPCB structure 11 ′, and the present invention
  • the FPCB full-page 2 can discharge 36pcs of FPCB structure 1.
  • the FPCB full-page 2 of the present invention has fewer blank areas than the existing FPCB full-page 1', and wastes less cover film.
  • the FPCB structure 1 on the FPCB full-page 2 of the present invention is closely arranged, and the production efficiency is high, and the FPCB full-size of the size of 250 mm*370 mm is taken as an example, and the production efficiency of the FPCB full-plate 2 of the present invention is compared with the existing one.
  • the FPCB full version 1' can be increased by 50%.
  • the original state of the FPCB body 101, the first bending section 102 and the second bending section 103 of the present invention is an integrated linear connection, and the first bending section 102 and the second bending section 103 are bent and can be combined with the FPCB body 101.
  • Forming a U-shaped structure so that the FPCB structure 1 in the FPCB imposition 2 can be linear rather than U-shaped, and the FPCB structure 1 has a small footprint and can be closely arranged in the FPCB 2 to avoid A large number of blank areas appear in the FPCB full-page 2 to achieve cost reduction.
  • the first bending segment 102 and the second bending segment 103 are located on the same side of the plane of the FPCB body 101, such that the first bending segment 102 is located after bending.
  • the external terminal 104 on the second bending section 103 is located on the same side of the plane where the FPCB body 101 is located; or the first bending section 102 and the second bending section 103 are located on both sides of the plane of the FPCB body 101.
  • the external terminals 104 are located on both sides of the plane of the FPCB body 101.
  • the external terminal 104 in the present invention is typically a pad or a gold finger.
  • the pad and the gold finger are generally located on the first bending segment 102 and the second bending segment 103, respectively.
  • the FPCB structure 1 of the present invention is provided with a first support member 107 for supporting and connecting two portions between the FPCB body 101 and the first bent portion 102 near a bend.
  • a bend between the FPCB body 101 and the first bending section 102 is an arc segment; and a bend between the FPCB body 101 and the second bending section 103 is provided for
  • the two support members 108 are supported and connected, and the bend between the FPCB body 101 and the second bending segment 103 is an arc segment.
  • the present invention forms an arc segment at a bend between the FPCB body 101 and the first bent segment 102 by the first support member 107, and between the FPCB body 101 and the second bent segment 103 through the second support member 108.
  • the curved portion forms an arc segment, so that the concentrated stress at the bending portion is released, thereby more effectively preventing the copper foil inside the FPCB structure 1 from being broken, so that the lower cost electrolytic copper can be selected as the substrate of the FPCB structure 1. Thereby controlling the cost of the FPCB structure 1.
  • connection between the first support member 107 and the first bend segment 102 and the FPCB body 101, between the second support member 108 and the second bend portion 103, and the FPCB body 103 can be achieved by means well known in the art, such as glue Sticking, etc.
  • the upper surface and the lower surface of the first support member 107 are provided with a glue layer 109 for connecting with the FPCB body 101 and the first bent portion 102 after bending;
  • the upper surface and the lower surface of the second support member 108 are respectively provided with a glue layer 109 for connecting with the FPCB body 101 and the bent second bending section 103.
  • the glue layer 109 may be double Face glue or flow glue.
  • the thickness of the adhesive layer 109 is preferably at least 0.05 mm.
  • the bonding adhesive commonly used when the first supporting member 107, the second supporting member 108 and the FPCB body 101 and the first bending segment 102 and the second bending segment 103 are connected is a pressure sensitive adhesive, it is ensured when the pressure sensitive adhesive is used.
  • the adhesive effect requires an elastic pressure holding operation, and therefore, the first support member 107 and the second support member 108 are preferably each made of a material having elasticity. Further, the first support member 107 and the second support member 108 are made of foam material or silicone material. Further, the first support member 107 and the second support member 108 have a thickness of at least 0.5 mm.
  • first support member 107 and the second support member 108 can be selected according to requirements, for example As a triangle, a rectangle, etc., preferably, the first support member 107 and the second support member 108 have a triangular cross section.
  • the copper foil layer 1011 of the FPCB structure 1 is provided with a via hole 1012 at a position corresponding to the bending positions of the first bending segment 102 and the second bending segment 103.
  • a virtual bending reference line defined by the above-mentioned bending positions of the first bending section 102 and the second bending section 103. It should be clear to those skilled in the art that the first bending section 102 and the second bending section 103 The bending reference line is bent relative to the plane of the FPCB body 101, and the via hole 1012 is located at a position corresponding to the bending reference line of the copper foil layer 1011.
  • the bending reference line is a virtual line, but in practical applications, the bending reference line may be marked by a protrusion or the like to facilitate bending, for example, by bending, dangling or along the bending reference line.
  • the first crease line 105 and the second crease line 106 formed by the color mark are arranged to facilitate accurate bending along the bending reference line.
  • the first crease line 105 is the first The bending position of the bending section 102
  • the second crease line 106 is the bending position of the second bending section 103.
  • the present invention reduces the stress dispersion concentrated at the bend of the FPCB structure 1 by providing the via hole 1012 on the copper foil layer 1011 of the FPCB structure 1, thereby preventing the copper foil layer 1011 of the FPCB structure 1 from being broken, so that the lower cost electrolysis can be selected.
  • Copper acts as a substrate for the FPCB structure 1, thereby controlling the cost of the FPCB structure 1, and the via 1012 arrangement also makes bending easier.
  • the via 1012 is optionally an axisymmetric structure having a bending reference line as an axis of symmetry, which arrangement is advantageous for more effectively preventing the copper foil layer 1011 of the FPCB structure 1 from being broken.
  • the shape and size of the via 1012 can be selected according to actual needs.
  • the via 1012 is a waist hole, an elliptical hole, a round hole or a rectangular hole.
  • the width of the copper foil layer 1011 between adjacent two vias 1012 is preferably greater than or equal to the width of the via 1012.
  • a layer of copper foil 1011 is provided in the FPCB structure 1, but the copper foil layer 1011 in the FPCB structure 1 is not limited to one layer.
  • a FPCB structure suitable for a speaker module having two speaker units is provided with two copper foil layers 1011, and more specifically, two copper foil layers 1011 can be divided into inner copper foil and outer layer.
  • the copper foil, the two-layer copper foil layer 1011 can be provided with a via hole 1012, and the through hole 1012 is provided on the inner layer copper foil and the outer layer copper foil, which is beneficial to more effectively reduce the concentrated stress dispersion, thereby simultaneously Prevent the breakage of the inner copper foil and the outer copper foil,
  • the vias 1012 on the inner copper foil and the outer copper foil are preferably staggered; or, only one of the two copper foil layers 1011
  • the copper foil layer 1011 is provided with a via 1012.
  • the basic structure of an FPCB structure having two layers of copper foil typically includes a substrate, an inner layer of copper foil and an outer layer of copper foil on different surfaces of the substrate, and an inner layer of copper foil. And a cover film on the outer copper foil.
  • the present invention also provides a speaker module, comprising a module housing and a speaker unit mounted in the module housing, the speaker module further comprising the FPCB structure 1 according to any of the above embodiments, One end of the FPCB structure 1 is electrically connected to the speaker unit, and the other end is used to electrically connect an external circuit.
  • the invention also provides a method for fabricating an FPCB structure, comprising the following steps:
  • each Flip integrates several FPCB single-boards, each FPCB single-board is linear, and several FPCB single-boards are arranged in an array;
  • the FPCB single board includes an FPCB body and a first bent section and a second bent section at both ends;
  • the first bending section and the second bending section are both bent at 180° with respect to the plane of the FPCB body, and the extending directions of the first bending section and the second bending section are both
  • the first bending section, the FPCB body and the second bending section form a U shape perpendicular to the extending direction of the FPCB body.
  • the FPCB full plate including the linear FPCB single board can be prepared, and the FPCB single board is made into the U-shaped FPCB, thereby avoiding a large number of blank areas in the FPCB full-page, effectively reducing cost.
  • the first bending section and the second bending section are bent toward the same side with respect to the plane of the FPCB body, such that the first bending section and the second bending after bending
  • the folding section is located on the same side of the plane of the FPCB body; or the first bending section and the second bending section are bent toward different sides of the plane of the FPCB body, so that the first bending section after bending And the second bending segment is located on a different side of the plane of the FPCB body.

Abstract

一种FPCB结构（1）、扬声器模组及FPCB结构（1）的制作方法，其中FPCB结构（1）包括原始状态为一体化直线连接的FPCB本体（101）和分别位于FPCB本体（101）两端的第一弯折段（102）和第二弯折段（103）；第一弯折段（102）和第二弯折段（103）均相对于FPCB本体（101）所在平面进行180°弯折，并且第一弯折段（102）和第二弯折段（103）的延伸方向均与FPCB本体（101）的延伸方向相垂直；第一弯折段（102）与第二弯折段（103）均位于FPCB本体（101）宽度方向上的同侧，第一弯折段（102）、FPCB本体（101）和第二弯折段（103）三者构成U型结构。FPCB本体（101）、第一弯折段（102）和第二弯折段（103）的原始状态为一体化直线连接，从而使得FPCB整版（1'）中的FPCB结构（1）可为直线形而非U型形状，这种FPCB结构（1）占位小，且可在FPCB整版（1'）中紧密排布，从而避免在FPCB整版（1'）中出现大量空白区域，达到降低成本的目的。

Description

FPCB结构、扬声器模组及FPCB结构的制作方法 技术领域
本发明涉及柔性印刷电路板领域，更具体地，涉及一种FPCB结构，应用了该FPCB结构的扬声器模组，及一种FPCB结构的制作方法。
背景技术
FPCB(Flexible Printed Circuit Board)是指柔性印刷电路板，其是一种利用柔性基材制成的具有图形的印刷电路板。与硬性印刷电路板(PCB)比较，FPCB具备自由弯曲、折叠、卷绕等优点。组装产品时，FPCB可像导线一样按照产品内部空间的布局进行任意地排布，从而可以在三维空间内任意地排布元器件，并且还可以取消导线和线路板之间连接器件，因此，FPCB可使电子产品小型化、精密化，产品可靠性大大提高。FPCB已经广泛应用在移动通信产品、手提电脑、消费类电子产品、航天、军用电子设备等领域。
目前，随着电子产品结构越来越复杂，对FPCB的要求也越来越高。如图1中所示，现有的FPCB结构11′为U型，因为其形状的局限性，在FPCB整版1′中形成大量空白区域，因此在模刀冲裁过程中会造成大量的覆盖膜的浪费。由于覆盖膜在整个FPCB产品成本中的占比较高，这样会大大增加FPCB产品的成本。
发明内容
本发明的一个目的是提供一种可减小FPCB整版中空白区域的FPCB结构的新技术方案。
根据本发明的第一方面，提供了一种FPCB结构，包括原始状态为一体化直线连接的FPCB本体和分别位于所述FPCB本体两端的第一弯折段和第二弯折段，在所述第一弯折段和所述第二弯折段上均设有外接端子；所 述第一弯折段和所述第二弯折段均相对于所述FPCB本体所在平面进行180°弯折，并且所述第一弯折段和所述第二弯折段的延伸方向均与所述FPCB本体的延伸方向相垂直；所述第一弯折段与所述第二弯折段均位于所述FPCB本体宽度方向上的同侧，所述第一弯折段、FPCB本体和第二弯折段三者构成U型结构。
可选的，所述第一弯折段和第二弯折段位于所述FPCB本体所在平面的同侧；或者，所述第一弯折段和第二弯折段位于所述FPCB本体所在平面的两侧。
可选的，所述外接端子为焊盘或金手指。
可选的，在所述FPCB本体和所述第一弯折段之间靠近弯折处设有用于支撑并连接两部分的第一支撑件，所述FPCB本体与所述第一弯折段之间的弯折处为弧形段；在所述FPCB本体和所述第二弯折段之间靠近弯折处设有用于支撑并连接两部分的第二支撑件，所述FPCB本体与所述第二弯折段之间的弯折处为弧形段。
可选的，所述第一支撑件的上表面和下表面上均设有用于与所述FPCB本体和弯折后的所述第一弯折段连接的胶层；所述第二支撑件的上表面和下表面上均设有用于与所述FPCB本体和弯折后的所述第二弯折段连接的胶层。
可选的，所述第一支撑件和所述第二支撑件均由具有弹性的材料制成。
可选的，所述FPCB结构的铜箔层上与所述第一弯折段和第二弯折段的弯折位置相对应的位置上设有过孔。
本发明的另一目的是提供一种应用了本发明的FPCB结构的扬声器模组。
根据本发明的第二方面，提供了一种扬声器模组，包括模组外壳和安装于所述模组外壳内的扬声器单体，所述扬声器模组还包括本发明的FPCB结构，所述FPCB结构的一端电连接所述扬声器单体，另一端用于电连接外部电路。
本发明还有一个目的是提供一种FPCB结构的制作方法的新技术方案。
根据本发明的第三方面，提供了一种FPCB结构的制作方法，包括以 下步骤：
A.完成FPCB整版的制作，每个整版上集成有若干个FPCB单体板，每个FPCB单体板为直线型，若干个FPCB单体板呈阵列排布；
B.冲裁出单个的直线型的FPCB单体板，FPCB单体板包括FPCB本体和位于两端的第一弯折段、第二弯折段；
C.将所述第一弯折段和第二弯折段均相对于所述FPCB本体所在平面进行180°弯折，且使得所述第一弯折段和第二弯折段的延伸方向均与所述FPCB本体的延伸方向垂直，所述第一弯折段、FPCB本体和第二弯折段三者构成U型。
可选的，在步骤C中，所述第一弯折段和第二弯折段相对于所述FPCB本体所在平面朝向同一侧进行弯折；
或者，所述第一弯折段和第二弯折段相对所述FPCB本体所在平面朝向不同侧进行弯折。
本发明的发明人发现，在现有技术中，确实存在FPCB整版中大量空白区域造成覆盖膜浪费的问题。因此，本发明所要实现的技术任务或者所要解决的技术问题是本领域技术人员从未想到的或者没有预期到的，故本发明是一种新的技术方案。
本发明的一个技术效果在于，FPCB本体、第一弯折段和第二弯折段的原始状态为一体化直线连接，第一弯折段和第二弯折段弯折后可与FPCB本体构成U型结构，从而使得FPCB整版中的FPCB结构可为直线形而非U型形状，这种FPCB结构占位小，且可在FPCB整版中紧密排布，从而避免在FPCB整版中出现大量空白区域，达到降低成本的目的。
本发明的另一个技术效果在于，通过FPCB结构的制作方法可制得包括直线型FPCB单体板的FPCB整版，从而避免在FPCB整版中出现大量空白区域，有效降低成本。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1为现有的FPCB整版的结构示意图；
图2为本发明FPCB结构的第一实施例的结构示意图；
图3为本发明FPCB结构的第二实施例的结构示意图；
图4为本发明FPCB结构的第二实施例弯折后的结构示意图；
图5为图4的A-A向剖示图；
图6为本发明FPCB结构的第三实施例的结构示意图；
图7为图6的局部细节图；
图8为具有本发明的FPCB结构的FPCB整版的结构示意图。
图中标示如下：
FPCB整版-1′，FPCB结构-11′，FPCB结构-1，FPCB本体-101，第一弯折段-102，第二弯折段-103，外接端子-104，第一折痕线-105，第二折痕线-106，第一支撑件-107，第二支撑件-108，胶层-109，铜箔层-1011，过孔-1012，FPCB整版-2。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步 讨论。
为了解决现有的FPCB结构占位大，现有的FPCB排版结构中具有大量空白区域的问题，如图2所示，本发明提供了一种FPCB结构1，其包括原始状态为一体化直线连接的FPCB本体101和分别位于所述FPCB本体101两端的第一弯折段102和第二弯折段103，在所述第一弯折段102和所述第二弯折段103上均设有外接端子104，上述外接端子104是指FPCB结构1用于与电连接器或元件连接的部件，例如焊盘和/或金手指等；所述第一弯折段102和所述第二弯折段103均相对于所述FPCB本体101所在平面进行180°弯折，并且所述第一弯折段102和所述第二弯折段103的延伸方向均与所述FPCB本体101的延伸方向相垂直；所述第一弯折段102与所述第二弯折段103均位于所述FPCB本体101宽度方向上的同侧，所述第一弯折段102、FPCB本体101和第二弯折段103三者构成U型结构。
如图8所示，以尺寸为250mm*370mm的FPCB整版为例，现有的FPCB整版1′(图1所示)只能排24pcs(件)的FPCB结构11′，而本发明的FPCB整版2则可排36pcs的FPCB结构1，明显地本发明的FPCB整版2相较于现有的FPCB整版1′的空白区域少，浪费的覆盖膜少。而且，本发明的FPCB整版2上的FPCB结构1排列紧密，生产效率高，还是以尺寸为250mm*370mm的FPCB整版为例，本发明的FPCB整版2的生产效率相较于现有的FPCB整版1′可提高50％。
本发明的FPCB本体101、第一弯折段102和第二弯折段103的原始状态为一体化直线连接，第一弯折段102和第二弯折段103弯折后可与FPCB本体101构成U型结构，从而使得FPCB整版2中的FPCB结构1可为直线形而非U型形状，这种FPCB结构1占位小，且可在FPCB整版2中紧密排布，从而避免在FPCB整版2中出现大量空白区域，达到降低成本的目的。
在本发明的一个优选实施例中，所述第一弯折段102和第二弯折段103位于所述FPCB本体101所在平面的同侧，这样，弯折后位于第一弯折段102和第二弯折段103上的外接端子104位于FPCB本体101所在平面的同侧；或者，所述第一弯折段102和第二弯折段103位于所述FPCB本体101所在平面的两侧，这样，弯折后位于第一弯折段102和第二弯折段103上 的外接端子104位于FPCB本体101所在平面的两侧。
本发明中的外接端子104通常为焊盘或金手指，在具体实施的过程中，焊盘和金手指通常分别位于第一弯折段102和第二弯折段103上。
如图3至图5所示，本发明的FPCB结构1在所述FPCB本体101和所述第一弯折段102之间靠近弯折处设有用于支撑并连接两部分的第一支撑件107，所述FPCB本体101与所述第一弯折段102之间的弯折处为弧形段；在所述FPCB本体101和所述第二弯折段103之间靠近弯折处设有用于支撑并连接两部分的第二支撑件108，所述FPCB本体101与所述第二弯折段103之间的弯折处为弧形段。
本发明通过第一支撑件107在FPCB本体101与第一弯折段102之间的弯折处形成弧形段，以及通过第二支撑件108在FPCB本体101与第二弯折段103之间的弯折处形成弧形段，使得弯折处集中的应力得到释放，从而更有效地防止FPCB结构1内部的铜箔断裂，使得可选用成本较低的电解铜作为FPCB结构1的基材，从而控制FPCB结构1的成本。
第一支撑件107和第一弯折段102以及FPCB本体101之间、第二支撑件108和第二弯折段103以及FPCB本体103之间的连接可通过本领域熟知的方式实现，例如胶粘等，可选的，所述第一支撑件107的上表面和下表面上均设有用于与所述FPCB本体101和弯折后的所述第一弯折段102连接的胶层109；所述第二支撑件108的上表面和下表面上均设有用于与所述FPCB本体101和弯折后的所述第二弯折段103连接的胶层109，上述胶层109可为双面胶或流动胶。进一步地，为了保证胶层109的胶粘效果，胶层109的厚度优选地至少为0.05mm。
由于第一支撑件107、第二支撑件108与FPCB本体101和第一弯折段102、第二弯折段103在连接时常用的粘接胶为压敏胶，在使用压敏胶时保证胶粘的效果需要进行弹性保压操作，因此，所述第一支撑件107和所述第二支撑件108优选地均由具有弹性的材料制成。进一步地，第一支撑件107和第二支撑件108为泡棉材质或硅胶材质。进一步地，第一支撑件107和第二支撑件108的厚度至少为0.5mm。
此外，第一支撑件107和第二支撑件108的形状可根据需求选择，例 如三角形、矩形等，优选地，第一支撑件107和第二支撑件108的横截面为三角形。
如图6和图7所示，所述FPCB结构1的铜箔层1011上与所述第一弯折段102和第二弯折段103的弯折位置相对应的位置上设有过孔1012，上述定义第一弯折段102和第二弯折段103的弯折位置存在着虚拟的弯折基准线，本领域技术人员应当清楚，第一弯折段102和第二弯折段103以弯折基准线为基准相对FPCB本体101所在平面进行弯折，过孔1012位于铜箔层1011与弯折基准线相对应的位置上。此外，上述弯折基准线为虚拟线，但是在实际应用中可通过凸起等方式对弯折基准线进行标记以方便弯折，例如，沿着弯折基准线设有通过凸起、凹陷或颜色标记形成的第一折痕线105和第二折痕线106，以方便沿着弯折基准线准确地进行弯折，当然，本领域技术人员可容易想到，第一折痕线105为第一弯折段102的弯折位置，第二折痕线106为第二弯折段103的弯折位置。
本发明通过在FPCB结构1的铜箔层1011上设置过孔1012，将FPCB结构1弯折处集中的应力分散减弱，防止FPCB结构1的铜箔层1011断裂，使得可选用成本较低的电解铜作为FPCB结构1的基材，从而控制FPCB结构1的成本，而且过孔1012设置还使得弯折更加方便。
过孔1012可选的是以弯折基准线为对称轴的轴对称结构，这种设置有利于更有效地防止FPCB结构1的铜箔层1011断裂。
而且，过孔1012的形状和大小均可根据实际需求选择，例如过孔1012为腰型孔、椭圆孔、圆孔或矩形孔等。
为了防止过孔1012过于密集而影响到铜箔层1011自身的强度，相邻两个过孔1012之间的铜箔层1011宽度优选地大于或等于过孔1012的宽度。
通常，FPCB结构1内设有一层铜箔层1011，但是，FPCB结构1内的铜箔层1011并不仅限于一层。以扬声器领域为例，具有两个扬声器单体的扬声器模组适用的FPCB结构设有两层铜箔层1011，更具体地，可将两层铜箔层1011区分为内层铜箔和外层铜箔，两层铜箔层1011上均可设有过孔1012，在内层铜箔和外层铜箔上均设置过孔1012有利于更有效地将集中的应力分散减弱，从而同时起到防止内层铜箔和外层铜箔断裂的效果， 为了防止过孔1012过于密集而影响到FPCB结构1自身的强度，位于内层铜箔和外层铜箔上的过孔1012优选地交错设置；或者，两层铜箔层1011中仅其中一层铜箔层1011设有过孔1012。本领域技术人员应当清楚，对于具有两层铜箔层的FPCB结构的基本结构通常包括基材、位于基材的不同表面上的内层铜箔和外层铜箔，以及覆盖在内层铜箔和外层铜箔上的覆盖膜。
本发明还提供了一种扬声器模组，包括模组外壳和安装于所述模组外壳内的扬声器单体，所述扬声器模组还包括上述任一实施例所述的FPCB结构1，所述FPCB结构1的一端电连接所述扬声器单体，另一端用于电连接外部电路。
本发明还提供了一种FPCB结构的制作方法，其包括以下步骤：
A.完成FPCB整版的制作，每个整版上集成有若干个FPCB单体板，每个FPCB单体板为直线型，若干个FPCB单体板呈阵列排布；
B.冲裁出单个的直线型的FPCB单体板，FPCB单体板包括FPCB本体和位于两端的第一弯折段、第二弯折段；
C.将所述第一弯折段和第二弯折段均相对于所述FPCB本体所在平面进行180°弯折，且使得所述第一弯折段和第二弯折段的延伸方向均与所述FPCB本体的延伸方向垂直，所述第一弯折段、FPCB本体和第二弯折段三者构成U型。
通过本发明的FPCB结构的制作方法可制得包括直线型FPCB单体板的FPCB整版，再将FPCB单体板制成U型FPCB，从而避免在FPCB整版中出现大量空白区域，有效降低成本。
优选地，在步骤C中，所述第一弯折段和第二弯折段相对于所述FPCB本体所在平面朝向同一侧进行弯折，这样，弯折后第一弯折段和第二弯折段位于FPCB本体所在平面的同侧；或者，所述第一弯折段和第二弯折段相对所述FPCB本体所在平面朝向不同侧进行弯折，这样，弯折后第一弯折段和第二弯折段位于FPCB本体所在平面的不同侧。
虽然已经通过例子对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限 制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种FPCB结构，其特征在于，包括原始状态为一体化直线连接的FPCB本体(101)和分别位于所述FPCB本体(101)两端的第一弯折段(102)和第二弯折段(103)，在所述第一弯折段(102)和所述第二弯折段(103)上均设有外接端子(104)；
    所述第一弯折段(102)和所述第二弯折段(103)均相对于所述FPCB本体(101)所在平面进行180°弯折，并且所述第一弯折段(102)和所述第二弯折段(103)的延伸方向均与所述FPCB本体(101)的延伸方向相垂直；
    所述第一弯折段(102)与所述第二弯折段(103)均位于所述FPCB本体(101)宽度方向上的同侧，所述第一弯折段(102)、FPCB本体(101)和第二弯折段(103)三者构成U型结构。
  2. 根据权利要求1所述的FPCB结构，其特征在于，所述第一弯折段(102)和第二弯折段(103)位于所述FPCB本体(101)所在平面的同侧；
    或者，所述第一弯折段(102)和第二弯折段(103)位于所述FPCB本体(101)所在平面的两侧。
  3. 根据权利要求1或2所述的FPCB结构，其特征在于，所述外接端子(104)为焊盘或金手指。
  4. 根据权利要求1至3任一项中所述的FPCB结构，其特征在于，在所述FPCB本体(101)和所述第一弯折段(102)之间靠近弯折处设有用于支撑并连接两部分的第一支撑件(107)，所述FPCB本体(101)与所述第一弯折段(102)之间的弯折处为弧形段；在所述FPCB本体(101)和所述第二弯折段(103)之间靠近弯折处设有用于支撑并连接两部分的第二支撑件(108)，所述FPCB本体(101)与所述第二弯折段(103)之间的弯折处为弧形段。
  5. 根据权利要求4所述的FPCB结构，其特征在于，所述第一支撑件(107)的上表面和下表面上均设有用于与所述FPCB本体(101)和弯折后的所述第一弯折段(102)连接的胶层(109)；所述第二支撑件(108) 的上表面和下表面上均设有用于与所述FPCB本体(101)和弯折后的所述第二弯折段(103)连接的胶层(109)。
  6. 根据权利要求4或5所述的FPCB结构，其特征在于，所述第一支撑件(107)和所述第二支撑件(108)均由具有弹性的材料制成。
  7. 根据权利要求1至6任一项中所述的FPCB结构，其特征在于，所述FPCB结构(1)的铜箔层(1011)上与所述第一弯折段(102)和第二弯折段(103)的弯折位置相对应的位置上设有过孔(1012)。
  8. 一种扬声器模组，包括模组外壳和安装于所述模组外壳内的扬声器单体，其特征在于，所述扬声器模组还包括如权利要求1-7任一项所述的FPCB结构(1)，所述FPCB结构(1)的一端电连接所述扬声器单体，另一端用于电连接外部电路。
  9. 一种FPCB结构的制作方法，其特征在于，包括以下步骤：
    A.完成FPCB整版的制作，每个整版上集成有若干个FPCB单体板，每个FPCB单体板为直线型，若干个FPCB单体板呈阵列排布；
    B.冲裁出单个的直线型的FPCB单体板，FPCB单体板包括FPCB本体和位于两端的第一弯折段、第二弯折段；
    C.将所述第一弯折段和第二弯折段均相对于所述FPCB本体所在平面进行180°弯折，且使得所述第一弯折段和第二弯折段的延伸方向均与所述FPCB本体的延伸方向垂直，所述第一弯折段、FPCB本体和第二弯折段三者构成U型。
  10. 根据权利要求9所述的制作方法，其特征在于，在步骤C中，所述第一弯折段和第二弯折段相对于所述FPCB本体所在平面朝向同一侧进行弯折；
    或者，所述第一弯折段和第二弯折段相对所述FPCB本体所在平面朝向不同侧进行弯折。
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106060734A (zh) * 2016-07-27 2016-10-26 歌尔股份有限公司 Fpcb结构、扬声器模组及fpcb结构的制作方法
CN114615804B (zh) * 2022-03-22 2024-03-08 福建世卓电子科技有限公司 单面金手指弯折180°两面接插功能柔性线路板制作方法

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4845315A (en) * 1984-05-02 1989-07-04 Mosaic Systems Cable system
CN101686604A (zh) * 2008-09-24 2010-03-31 比亚迪股份有限公司 一种柔性电路板整版冲切方法
CN201657484U (zh) * 2010-01-28 2010-11-24 比亚迪股份有限公司 一种抗弯折的柔性线路板
CN202998682U (zh) * 2012-12-28 2013-06-12 大连吉星电子有限公司 一种整板冲压的fpc整板
CN204131829U (zh) * 2014-09-28 2015-01-28 深圳市众搏辉科技有限公司 改良结构的fpc柔性线路板
CN204482149U (zh) * 2014-12-30 2015-07-15 宏启胜精密电子(秦皇岛)有限公司 柔性电路板
CN205195972U (zh) * 2015-10-21 2016-04-27 歌尔声学股份有限公司 扬声器模组
CN106060734A (zh) * 2016-07-27 2016-10-26 歌尔股份有限公司 Fpcb结构、扬声器模组及fpcb结构的制作方法
CN205987349U (zh) * 2016-07-27 2017-02-22 歌尔股份有限公司 一种fpcb结构及扬声器模组
CN205987344U (zh) * 2016-07-27 2017-02-22 歌尔股份有限公司 一种fpcb结构及扬声器模组
CN205987345U (zh) * 2016-07-27 2017-02-22 歌尔股份有限公司 一种fpcb结构及扬声器模组

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101932127B1 (ko) * 2012-09-19 2018-12-26 삼성디스플레이 주식회사 표시장치 및 그 제조방법

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4845315A (en) * 1984-05-02 1989-07-04 Mosaic Systems Cable system
CN101686604A (zh) * 2008-09-24 2010-03-31 比亚迪股份有限公司 一种柔性电路板整版冲切方法
CN201657484U (zh) * 2010-01-28 2010-11-24 比亚迪股份有限公司 一种抗弯折的柔性线路板
CN202998682U (zh) * 2012-12-28 2013-06-12 大连吉星电子有限公司 一种整板冲压的fpc整板
CN204131829U (zh) * 2014-09-28 2015-01-28 深圳市众搏辉科技有限公司 改良结构的fpc柔性线路板
CN204482149U (zh) * 2014-12-30 2015-07-15 宏启胜精密电子(秦皇岛)有限公司 柔性电路板
CN205195972U (zh) * 2015-10-21 2016-04-27 歌尔声学股份有限公司 扬声器模组
CN106060734A (zh) * 2016-07-27 2016-10-26 歌尔股份有限公司 Fpcb结构、扬声器模组及fpcb结构的制作方法
CN205987349U (zh) * 2016-07-27 2017-02-22 歌尔股份有限公司 一种fpcb结构及扬声器模组
CN205987344U (zh) * 2016-07-27 2017-02-22 歌尔股份有限公司 一种fpcb结构及扬声器模组
CN205987345U (zh) * 2016-07-27 2017-02-22 歌尔股份有限公司 一种fpcb结构及扬声器模组

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