WO2018016648A1

WO2018016648A1 - Compound, resin, composition, and pattern formation method

Info

Publication number: WO2018016648A1
Application number: PCT/JP2017/026574
Authority: WO
Inventors: 越後　雅敏
Original assignee: 三菱瓦斯化学株式会社
Priority date: 2016-07-21
Filing date: 2017-07-21
Publication date: 2018-01-25
Also published as: CN109476580A; TW201819351A; JP7069530B2; JPWO2018016648A1; KR20190032379A

Abstract

Provided is a compound represented by formula (0).

Description

Compound, resin, composition and pattern forming method

The present invention relates to a compound having a specific structure, a resin, and a composition containing these. The present invention also relates to a pattern forming method using the composition.

In the manufacture of semiconductor devices, microfabrication by lithography using a photoresist material is performed. In recent years, further miniaturization by pattern rules has been demanded as LSI is highly integrated and increased in speed. The light source for lithography used for resist pattern formation has been shortened from KrF excimer laser (248 nm) to ArF excimer laser (193 nm), and extreme ultraviolet light (EUV, 13.5 nm) has been introduced. Is also expected.

However, in lithography using a conventional polymer resist material, the molecular weight is as large as about 10,000 to 100,000, and the molecular weight distribution is wide, resulting in roughness on the pattern surface, making it difficult to control the pattern size, and limiting the miniaturization. There is. Thus, various low molecular weight resist materials have been proposed so far in order to provide resist patterns with higher resolution. Since the low molecular weight resist material has a small molecular size, it is expected to provide a resist pattern with high resolution and low roughness.

At present, various kinds of low-molecular resist materials are known. For example, an alkali development type negative radiation sensitive composition (for example, see Patent Document 1 and Patent Document 2) using a low molecular weight polynuclear polyphenol compound as a main component has been proposed, and a low molecular weight resist material having high heat resistance. As candidates, an alkali development negative radiation-sensitive composition using a low molecular weight cyclic polyphenol compound as a main component (see, for example, Patent Document 3 and Non-Patent Document 1) has also been proposed. Further, it is known that a polyphenol compound as a base compound for a resist material can impart high heat resistance despite its low molecular weight, and is useful for improving the resolution and roughness of a resist pattern (for example, Non-Patent Document 2). reference).

The present inventors have so far developed a resist composition containing a compound having a specific structure and an organic solvent as a material that is excellent in etching resistance, soluble in a solvent, and applicable to a wet process (see Patent Document 4). .) Is proposed.

Further, as the resist pattern is further miniaturized, a problem of resolution or a problem that the resist pattern collapses after development occurs, so that a thinner resist is desired. However, simply thinning the resist makes it difficult to obtain a resist pattern film thickness sufficient for substrate processing. Therefore, not only a resist pattern but also a process for producing a resist underlayer film between the resist and a semiconductor substrate to be processed and providing this resist underlayer film with a function as a mask during substrate processing is required.

Currently, various types of resist underlayer films for such processes are known. For example, unlike a conventional resist underlayer film having a high etching rate, a terminal layer is removed by applying a predetermined energy as a resist underlayer film for lithography having a dry etching rate selection ratio close to that of a resist. A material for forming a lower layer film for a multilayer resist process has been proposed, which contains at least a resin component having a substituent that generates a sulfonic acid residue, and a solvent (see Patent Document 5). Further, a resist underlayer film material containing a polymer having a specific repeating unit has been proposed as a material for realizing a resist underlayer film for lithography having a lower dry etching rate selection ratio than a resist (see Patent Document 6). ). Furthermore, in order to realize a resist underlayer film for lithography having a low dry etching rate selection ratio compared with a semiconductor substrate, a repeating unit of acenaphthylenes and a repeating unit having a substituted or unsubstituted hydroxy group are copolymerized. A resist underlayer film material containing a polymer is proposed (see Patent Document 7).

On the other hand, as a material having high etching resistance in this type of resist underlayer film, an amorphous carbon underlayer film formed by CVD using methane gas, ethane gas, acetylene gas or the like as a raw material is well known. However, from the viewpoint of the process, a resist underlayer film material capable of forming a resist underlayer film by a wet process such as spin coating or screen printing is required.

In addition, the present inventors have a composition for forming an underlayer film for lithography containing a compound having a specific structure and an organic solvent as a material having excellent etching resistance, high heat resistance, soluble in a solvent and applicable to a wet process. The thing (refer patent document 8) is proposed.

Furthermore, regarding the formation method of the intermediate layer used in forming the resist underlayer film in the three-layer process, for example, a silicon nitride film formation method (see Patent Document 9) or a silicon nitride film CVD formation method (see Patent Document 10). )It has been known. As an intermediate layer material for a three-layer process, a material containing a silsesquioxane-based silicon compound is known (see Patent Documents 11 and 12).

Various optical component forming compositions have been proposed, and examples thereof include acrylic resins (see Patent Documents 13 to 14).

JP 2005-326838 A JP 2008-145539 A JP 2009-173623 A International Publication No. 2013/024778 JP 2004-177668 A JP 2004-271838 A JP 2005-250434 A International Publication No. 2013/024779 JP 2002-334869 A International Publication No. 2004/066377 JP 2007-226170 A JP 2007-226204 A JP 2010-138393 A Japanese Patent Laying-Open No. 2015-174877

As described above, many lithographic film-forming compositions for resist applications and lithographic film-forming compositions for underlayer films have been proposed, but wet processes such as spin coating and screen printing are applicable. In addition to having high solvent solubility, there is nothing that combines heat resistance and etching resistance at a high level, and development of new materials is required.
In addition, development of a new material suitable for obtaining a resist permanent film excellent in alkali developability, photosensitivity, and resolution is also demanded.
Furthermore, many compositions for optical members have been proposed in the past, but none of them has both heat resistance, transparency and refractive index at a high level, and development of new materials is required.

The present invention has been made in view of the above-described problems, and its purpose is to form a photoresist and a lower layer film for photoresist that can be applied with a wet process and have excellent heat resistance, solubility, and etching resistance. It is an object of the present invention to provide a compound, a resin, and a film-forming composition for lithography that are useful for the above. Another object of the present invention is to provide a resist film, a resist underlayer film, a resist permanent film, and a pattern forming method using the composition. Furthermore, it is providing the composition for optical members.

As a result of intensive studies in order to solve the above problems, the present inventors have found that the above problems can be solved by using a compound or resin having a specific structure, and have completed the present invention.
That is, the present invention is as follows.
[1]
The compound represented by following formula (0).

(In Formula (0), R ^Y is a hydrogen atom, an alkyl group having 1 to 30 carbon atoms, or an aryl group having 6 to 30 carbon atoms,
R ^Z is an N-valent group having 1 to 60 carbon atoms or a single bond,
R ^T each independently has an alkyl group having 1 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, or a substituent. An optionally substituted alkenyl group having 2 to 30 carbon atoms, an optionally substituted alkoxy group having 1 to 30 carbon atoms, a halogen atom, a nitro group, an amino group, a carboxylic acid group, a thiol group, a hydroxyl group, or a formula The alkyl group, the aryl group, the alkenyl group, and the alkoxy group may include an ether bond, a ketone bond, or an ester bond, where R ^T At least one includes a group represented by formula (0-1),
X represents an oxygen atom, a sulfur atom or no bridge,
m is each independently an integer of 0 to 9, wherein at least one of m is an integer of 1 to 9,
N is an integer of 1 to 4, where, when N is an integer of 2 or more, the structural formulas in N [] may be the same or different,
Each r is independently an integer of 0-2. )

(In formula (0-1), R ^X represents a hydrogen atom or a methyl group.)
[2]
The compound according to [1] above, wherein the compound represented by the formula (0) is a compound represented by the following formula (1).

(In Formula (1), R ⁰ has the same meaning as R ^Y ,
R ¹ is an n-valent group having 1 to 60 carbon atoms or a single bond,
R ² to R ⁵ are each independently an optionally substituted alkyl group having 1 to 30 carbon atoms, an optionally substituted aryl group having 6 to 30 carbon atoms, or a substituent. An alkenyl group having 2 to 30 carbon atoms which may have a substituent, an alkoxy group having 1 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxylic acid group, a thiol group, A hydroxyl group or a group represented by the formula (0-1), and the alkyl group, the aryl group, the alkenyl group, and the alkoxy group may include an ether bond, a ketone bond, or an ester bond, At least one of R ² to R ⁵ includes a group represented by the formula (0-1),
m ² and m ³ are each independently an integer of 0 to 8,
m ⁴ and m ⁵ are each independently an integer of 0 to 9,
However, m ² , m ³ , m ⁴ and m ⁵ are not 0 at the same time,
n is synonymous with N, and when n is an integer of 2 or more, the structural formulas in n [] may be the same or different;
p ² to p ⁵ have the same meaning as r. )
[3]
The compound according to [1] above, wherein the compound represented by the formula (0) is a compound represented by the following formula (2).

(In Formula (2), R ^0A has the same meaning as R ^Y ,
R ^1A is an n ^A valent group having 1 to 60 carbon atoms or a single bond,
R ^2A each independently has an optionally substituted alkyl group having 1 to 30 carbon atoms, an optionally substituted aryl group having 6 to 30 carbon atoms, or a substituent. An optionally substituted alkenyl group having 2 to 30 carbon atoms, an optionally substituted alkoxy group having 1 to 30 carbon atoms, a halogen atom, a nitro group, an amino group, a carboxylic acid group, a thiol group, a hydroxyl group, or a formula The alkyl group, the aryl group, the alkenyl group, and the alkoxy group may include an ether bond, a ketone bond, or an ester bond, where R ^{2A is} a group represented by At least one includes a group represented by formula (0-1),
n ^A has the same meaning as N above. Here, when n ^A is an integer of 2 or more, the structural formulas in n ^A [] may be the same or different,
X ^A represents an oxygen atom, a sulfur atom, or no bridge,
m ^2A is each independently an integer of 0 to 7, provided that at least one m ^2A is an integer of 1 to 7;
q ^A is each independently 0 or 1. )
[4]
The compound according to [2] above, wherein the compound represented by the formula (1) is a compound represented by the following formula (1-1).

(In the formula (1-1), R ⁰ , R ¹ , R ⁴ , R ⁵ , n, p ² to p ⁵ , m ⁴ and m ⁵ are as defined above.
R ⁶ to R ⁷ are each independently an optionally substituted alkyl group having 1 to 30 carbon atoms, an optionally substituted aryl group having 6 to 30 carbon atoms, or a substituent. An alkenyl group having 2 to 30 carbon atoms, a halogen atom, a nitro group, an amino group, a carboxylic acid group, or a thiol group, which may have
R ¹⁰ to R ¹¹ are each independently a hydrogen atom or a group represented by the formula (0-2);
Here, at least one of R ¹⁰ to R ¹¹ is a group represented by the formula (0-2),
m ⁶ and m ⁷ are each independently an integer of 0 to 7,
However, m ⁴ , m ⁵ , m ⁶ and m ⁷ are not 0 at the same time. )

(In the formula (0-2), R ^X is as defined above, R ^W is a linear, branched or cyclic alkylene group having 1 to 30 carbon atoms, and s is an integer of 0 to 30. .)
[5]
The compound according to [4] above, wherein the compound represented by the formula (1-1) is a compound represented by the following formula (1-2).

(In the formula (1-2), R ⁰ , R ¹ , R ⁶ , R ⁷ , R ¹⁰ , R ¹¹ , n, p ² to p ⁵ , m ⁶ and m ⁷ are as defined above.
R ⁸ to R ⁹ have the same meanings as R ⁶ to R ⁷ ,
R ¹² to R ¹³ have the same meanings as R ¹⁰ to R ¹¹ ,
m ⁸ and m ⁹ are each independently an integer of 0 to 8,
However, m ⁶ , m ⁷ , m ⁸ and m ⁹ are not 0 at the same time. )
[6]
The compound according to [3] above, wherein the compound represented by the formula (2) is a compound represented by the following formula (2-1).

(In the formula (2-1), R ^0A , R ^1A , n ^A , q ^A and X ^A are as defined in the formula (2);
Each R ^3A is independently a linear, branched or cyclic alkyl group having 1 to 30 carbon atoms which may have a substituent, and 6 to 30 carbon atoms which may have a substituent. An aryl group, an optionally substituted alkenyl group having 2 to 30 carbon atoms, a halogen atom, a nitro group, an amino group, a carboxylic acid group, or a thiol group,
R ^4A is each independently a hydrogen atom or a group represented by the formula (0-2), wherein at least one of R ^4A is a group represented by the formula (0-2);
m ^6A is each independently an integer of 0 to 5. )
[7]
A resin obtained using the compound according to the above [1] as a monomer.
[8]
Resin as described in said [7] which has a structure represented by following formula (3).

(In formula (3),
L is an optionally substituted alkylene group having 1 to 30 carbon atoms, an optionally substituted arylene group having 6 to 30 carbon atoms, or an optionally substituted carbon number. 1 to 30 alkoxylene groups or single bonds, and the alkylene group, the arylene group, and the alkoxylene group may include an ether bond, a ketone bond, or an ester bond,
R ⁰ has the same meaning as R ^Y ,
R ¹ is an n-valent group having 1 to 60 carbon atoms or a single bond,
R ² to R ⁵ are each independently an optionally substituted alkyl group having 1 to 30 carbon atoms, an optionally substituted aryl group having 6 to 30 carbon atoms, or a substituent. An alkenyl group having 2 to 30 carbon atoms which may have a substituent, an alkoxy group having 1 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxylic acid group, a thiol group, A hydroxyl group or a group represented by the formula (0-1), and the alkyl group, the aryl group, the alkenyl group, and the alkoxy group may include an ether bond, a ketone bond, or an ester bond, At least one of R ² to R ⁵ includes a group represented by the formula (0-1),
m ² and m ³ are each independently an integer of 0 to 8,
m ⁴ and m ⁵ are each independently an integer of 0 to 9,
However, m ² , m ³ , m ⁴ and m ⁵ do not simultaneously become 0, and at least one of R ² to R ⁵ is a group represented by the formula (0-2). )
[9]
Resin as described in said [7] which has a structure represented by following formula (4).

(In Formula (4), L has an optionally substituted alkylene group having 1 to 30 carbon atoms, an optionally substituted arylene group having 6 to 30 carbon atoms, and a substituent. The alkylene group, the arylene group and the alkoxylene group may contain an ether bond, a ketone bond or an ester bond,
R ^0A has the same meaning as R ^Y ,
R ^1A is an n ^A valent group having 1 to 30 carbon atoms or a single bond,
R ^2A each independently has an optionally substituted alkyl group having 1 to 30 carbon atoms, an optionally substituted aryl group having 6 to 30 carbon atoms, or a substituent. An optionally substituted alkenyl group having 2 to 30 carbon atoms, an optionally substituted alkoxy group having 1 to 30 carbon atoms, a halogen atom, a nitro group, an amino group, a carboxylic acid group, a thiol group, a hydroxyl group or a hydroxyl group In which the alkyl group, the aryl group, the alkenyl group, and the alkoxy group may include an ether bond, a ketone bond, or an ester bond. , At least one of R ^2A contains a group of formula (0-1)
n ^A has the same meaning as N above. Here, when n ^A is an integer of 2 or more, the structural formulas in n ^A [] may be the same or different,
X ^A represents an oxygen atom, a sulfur atom, or no bridge,
m ^2A is each independently an integer of 0 to 7, provided that at least one m ^2A is an integer of 1 to 7;
q ^A is each independently 0 or 1. )
[10]
A composition comprising at least one selected from the group consisting of the compound according to any one of [1] to [6] and the resin according to any one of [7] to [9].
[11]
The composition according to the above [10], further comprising a solvent.
[12]
The composition according to [10] or [11] above, further comprising an acid generator.
[13]
The composition according to any one of the above [10] to [12], further comprising a crosslinking agent.
[14]
The cross-linking agent is at least one selected from the group consisting of phenol compounds, epoxy compounds, cyanate compounds, amino compounds, benzoxazine compounds, melamine compounds, guanamine compounds, glycoluril compounds, urea compounds, isocyanate compounds, and azide compounds. The composition according to [13] above.
[15]
The composition according to [13] or [14], wherein the crosslinking agent has at least one allyl group.
[16]
The content of the crosslinking agent is at least one selected from the group consisting of the compound according to any one of [1] to [6] and the resin according to any one of [7] to [9]. The composition according to any one of the above [13] to [15], which is 0.1 to 100 parts by mass when the total mass of the composition containing is 100 parts by mass.
[17]
The composition according to any one of [13] to [16], further comprising a crosslinking accelerator.
[18]
The composition according to [17], wherein the crosslinking accelerator is at least one selected from the group consisting of amines, imidazoles, organic phosphines, and Lewis acids.
[19]
The content of the crosslinking accelerator is at least one selected from the group consisting of the compound according to any one of [1] to [6] and the resin according to any one of [7] to [9]. The composition according to [17] or [18], which is 0.1 to 5 parts by mass when the total mass of the composition to be contained is 100 parts by mass.
[20]
The composition according to any one of [10] to [19], further comprising a radical polymerization initiator.
[21]
Any of the above [10] to [20], wherein the radical polymerization initiator is at least one selected from the group consisting of a ketone photopolymerization initiator, an organic peroxide polymerization initiator, and an azo polymerization initiator. A composition according to any one of the above.
[22]
The content ratio of the radical polymerization initiator is one or more selected from the group consisting of the compound according to any one of [1] to [6] and the resin according to any one of [7] to [9]. The composition according to any one of the above [10] to [21], which is 0.05 to 25 parts by mass, when the total mass of the composition containing is 100 parts by mass.
[23]
The composition according to any one of [10] to [22], which is used for forming a film for lithography.
[24]
The composition according to any one of [10] to [22], which is used for forming a resist permanent film.
[25]
The composition according to any one of [10] to [22], which is used for forming an optical component.
[26]
A method for forming a resist pattern, comprising: forming a photoresist layer on a substrate using the composition described in [23] above; and irradiating a predetermined region of the photoresist layer with radiation to perform development.
[27]
A lower layer film is formed on the substrate using the composition described in [23], and at least one photoresist layer is formed on the lower layer film, and then radiation is applied to a predetermined region of the photoresist layer. The resist pattern formation method including the process of irradiating and developing.
[28]
On the substrate, a lower layer film is formed using the composition described in [23], an intermediate layer film is formed on the lower layer film using a resist intermediate layer film material, on the intermediate layer film, After forming at least one photoresist layer, a predetermined region of the photoresist layer is irradiated with radiation, developed to form a resist pattern, and then the intermediate layer film is etched using the resist pattern as a mask. A method of forming a circuit pattern, comprising: etching the lower layer film using the obtained intermediate layer film pattern as an etching mask; and etching the substrate using the obtained lower layer film pattern as an etching mask to form a pattern on the substrate.

The compound and resin in the present invention are highly soluble in a safe solvent, and have good heat resistance and etching resistance. Moreover, the resist composition containing the compound and / or resin in the present invention gives a good resist pattern shape.

Hereinafter, a mode for carrying out the present invention (hereinafter also referred to as “the present embodiment”) will be described. In addition, the following embodiment is an illustration for demonstrating this invention, and this invention is not limited only to the embodiment.

The compound, resin, and composition containing the compound in the present embodiment can be applied to a wet process, and are useful for forming a photoresist underlayer film having excellent heat resistance and etching resistance. In addition, since the composition in this embodiment uses a compound or resin having a specific structure with high heat resistance and solvent solubility, deterioration of the film during high-temperature baking is suppressed, and etching resistance against oxygen plasma etching and the like In addition, an excellent resist and lower layer film can be formed. In addition, when the lower layer film is formed, the adhesion with the resist layer is also excellent, so that an excellent resist pattern can be formed.
In addition, the compound and resin in the present embodiment are excellent in sensitivity and resolution when used in a photosensitive material, and while maintaining high heat resistance, further, general-purpose organic solvents, other compounds, and resin components , And a resist permanent film excellent in compatibility with the additive.
Furthermore, since the refractive index is high and coloring due to a wide range of heat treatments from low to high temperatures is suppressed, it is also useful as various optical forming compositions.

[Compound represented by Formula (0)]
The compound in this embodiment is represented by the following formula (0).

(In Formula (0), R ^Y is a hydrogen atom, an alkyl group having 1 to 30 carbon atoms, or an aryl group having 6 to 30 carbon atoms,
R ^Z is an N-valent group having 1 to 60 carbon atoms or a single bond,
R ^T is each independently a linear, branched or cyclic alkyl group having 1 to 30 carbon atoms which may have a substituent, and 6 to 30 carbon atoms which may have a substituent. An aryl group, an optionally substituted alkenyl group having 2 to 30 carbon atoms, an optionally substituted alkoxy group having 1 to 30 carbon atoms, a halogen atom, a nitro group, an amino group, a carboxyl group An acid group, a thiol group, a hydroxyl group or a group represented by the formula (0-1), and the alkyl group, the aryl group, the alkenyl group, and the alkoxy group include an ether bond, a ketone bond, or an ester bond. Wherein at least one of R ^T comprises a group of formula (0-1);
X represents an oxygen atom, a sulfur atom or no bridge,
m is each independently an integer of 0 to 9, wherein at least one of m is an integer of 1 to 9,
N is an integer of 1 to 4, where, when N is an integer of 2 or more, the structural formulas in N [] may be the same or different,
Each r is independently an integer of 0-2. )

(In formula (0-1), R ^X represents a hydrogen atom or a methyl group.)

R ^Y is a hydrogen atom, an alkyl group having 1 to 30 carbon atoms, or an aryl group having 6 to 30 carbon atoms. As the alkyl group, a linear, branched or cyclic alkyl group can be used. When R ^Y is a hydrogen atom, a linear, branched or cyclic alkyl group having 1 to 30 carbon atoms, or an aryl group having 6 to 30 carbon atoms, excellent heat resistance and solvent solubility are imparted. Can do.

R ^z is an N-valent group having 1 to 60 carbon atoms or a single bond, and each aromatic ring is bonded through this R ^z . N is an integer of 1 to 4, and when N is an integer of 2 or more, the structural formulas in N [] may be the same or different. The N-valent group refers to an alkyl group having 1 to 60 carbon atoms when N = 1, an alkylene group having 1 to 30 carbon atoms when N = 2, and 2 to carbon atoms when N = 3. 60 alkanepropyl group, and when N = 4, it represents an alkanetetrayl group having 3 to 60 carbon atoms. Examples of the N-valent group include those having a linear hydrocarbon group, a branched hydrocarbon group, or an alicyclic hydrocarbon group. Here, the alicyclic hydrocarbon group includes a bridged alicyclic hydrocarbon group. The N-valent hydrocarbon group may have an alicyclic hydrocarbon group, a double bond, a hetero atom, or an aromatic group having 6 to 60 carbon atoms.

R ^T each independently has an alkyl group having 1 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, or a substituent. An optionally substituted alkenyl group having 2 to 30 carbon atoms, an optionally substituted alkoxy group having 1 to 30 carbon atoms, a halogen atom, a nitro group, an amino group, a carboxylic acid group, a thiol group, a hydroxyl group, or a formula The alkyl group, the aryl group, the alkenyl group, and the alkoxy group may include an ether bond, a ketone bond, or an ester bond, where R ^T At least one includes a group represented by the formula (0-1). The alkyl group, alkenyl group and alkoxy group may be a linear, branched or cyclic group. Here, the group containing a group represented by the formula (0-1) is a group having a group represented by the formula (0-1). For example, a group represented by the formula (0-1), a group represented by the formula (0-1) A methoxy group substituted with a group represented by 0-1), an ethoxy group substituted with a group represented by formula (0-1), a propoxy group substituted with a group represented by formula (0-1), a formula An ethoxyethoxy group substituted with a group represented by (0-1), a propoxypropoxy group substituted with a group represented by formula (0-1), a phenyl substituted with a group represented by formula (0-1) An oxy group etc. are mentioned.

X represents an oxygen atom, a sulfur atom or no bridge, and when X is an oxygen atom or a sulfur atom, it tends to develop high heat resistance, and is more preferably an oxygen atom. X is preferably non-crosslinked from the viewpoint of solubility. M is each independently an integer of 0 to 9, and at least one of m is an integer of 1 to 9.

In the formula (0), the site represented by the naphthalene structure is a monocyclic structure when r = 0, a bicyclic structure when r = 1, and a tricyclic structure when r = 2. It becomes. Each r is independently an integer of 0-2. The numerical range of m described above is determined according to the ring structure determined by r.

[Compound represented by Formula (1)]
The compound (0) in the present embodiment is preferably a compound represented by the following formula (1) from the viewpoints of heat resistance and solvent solubility.

In the above formula (1), R ⁰ is a hydrogen atom, an alkyl group having 1 to 30 carbon atoms, or an aryl group having 6 to 30 carbon atoms. When R ⁰ is a hydrogen atom, a linear, branched or cyclic alkyl group having 1 to 30 carbon atoms or an aryl group having 6 to 30 carbon atoms, heat resistance is relatively high and solvent solubility is improved. Tend to. R ⁰ is a linear, branched or cyclic alkyl group having 1 to 30 carbon atoms or a carbon number from the viewpoint of suppressing oxidative decomposition to suppress coloring of the compound and improving heat resistance and solvent solubility. A 6-30 aryl group is preferred.
R ¹ is an n-valent group having 1 to 60 carbon atoms or a single bond, and each aromatic ring is bonded via R ¹ .
R ² to R ⁵ are each independently an optionally substituted alkyl group having 1 to 30 carbon atoms, an optionally substituted aryl group having 6 to 30 carbon atoms, or a substituent. An alkenyl group having 2 to 30 carbon atoms which may have a substituent, an alkoxy group having 1 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxylic acid group, a thiol group, A hydroxyl group or a group represented by the formula (0-1), and the alkyl group, the aryl group, the alkenyl group, and the alkoxy group may include an ether bond, a ketone bond, or an ester bond, At least one of R ² to R ⁵ includes a group represented by the formula (0-1).
m ² and m ³ are each independently an integer of 0 to 8, and m ⁴ and m ⁵ are each independently an integer of 0 to 9. However, m ² , m ³ , m ⁴ and m ⁵ are not 0 simultaneously.
n is an integer of 1 to 4. Here, when n is an integer of 2 or more, the structural formulas in the n [] may be the same or different.
p ² to p ⁵ are each independently an integer of 0 to 2.

The n-valent group is an alkyl group having 1 to 60 carbon atoms when n = 1, an alkylene group having 1 to 30 carbon atoms when n = 2, and a carbon atom when n = 3. An alkanepropyl group having 2 to 60 carbon atoms, and when n = 4, an alkanetetrayl group having 3 to 60 carbon atoms. Examples of the n-valent group include those having a linear hydrocarbon group, a branched hydrocarbon group, or an alicyclic hydrocarbon group. Here, the alicyclic hydrocarbon group includes a bridged alicyclic hydrocarbon group. The n-valent group may have an aromatic group having 6 to 60 carbon atoms.

The n-valent hydrocarbon group may have an alicyclic hydrocarbon group, a double bond, a hetero atom, or an aromatic group having 6 to 60 carbon atoms. Here, the alicyclic hydrocarbon group includes a bridged alicyclic hydrocarbon group.

The compound represented by the above formula (1) has a relatively low molecular weight but has high heat resistance due to the rigidity of its structure, and therefore can be used under high temperature baking conditions. Moreover, it has tertiary carbon or quaternary carbon in the molecule, and its crystallinity is suppressed, so that it is suitably used as a film forming composition for lithography that can be used for manufacturing a film for lithography.

Moreover, since the solubility with respect to a safe solvent is high, and heat resistance and etching resistance are favorable, the resist formation composition for lithography containing the compound represented by said Formula (1) may give a favorable resist pattern shape. it can.

Furthermore, since the film has a relatively low molecular weight and low viscosity, even a substrate having a step (particularly, a fine space or a hole pattern) can be uniformly filled to every corner of the step and the film can be flattened. As a result, the composition for forming a lower layer film for lithography using the same has good embedding and planarization characteristics. Moreover, since it is a compound having a relatively high carbon concentration, high etching resistance can be imparted.

Furthermore, since the aromatic density is high, the refractive index is high, and coloring is suppressed by a wide range of heat treatments from low to high temperatures, so that it is also useful as a composition for forming various optical parts. Among these, a compound having a quaternary carbon is preferable from the viewpoint of suppressing oxidative decomposition of the compound to suppress coloring and improving heat resistance and solvent solubility. Optical parts include film and sheet parts, plastic lenses (prism lenses, lenticular lenses, micro lenses, Fresnel lenses, viewing angle control lenses, contrast enhancement lenses, etc.), retardation films, electromagnetic shielding films, It is useful as a prism, an optical fiber, a solder resist for flexible printed wiring, a plating resist, an interlayer insulating film for multilayer printed wiring boards, and a photosensitive optical waveguide.

The compound represented by the above formula (1) is preferably a compound represented by the following formula (1-1) from the viewpoint of easy crosslinking and solubility in an organic solvent.

In formula (1-1),
R ⁰ , R ¹ , R ⁴ , R ⁵ , n, p ² to p ⁵ , m ⁴ and m ⁵ are as defined above,
R ⁶ to R ⁷ are each independently a linear, branched or cyclic alkyl group having 1 to 30 carbon atoms which may have a substituent, or a carbon number which may have a substituent. An aryl group having 6 to 30 carbon atoms, an alkenyl group having 2 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxylic acid group, and a thiol group;
R ¹⁰ to R ¹¹ are each independently a hydrogen atom or a group represented by the formula (0-2);
Here, at least one of R ¹⁰ to R ¹¹ is a group represented by the formula (0-2),
m ⁶ and m ⁷ are each independently an integer of 0 to 7,
However, m ⁴ , m ⁵ , m ⁶ and m ⁷ are not 0 at the same time.

(In the formula (0-2), R ^X is as defined above, R ^W is a linear, branched or cyclic alkylene group having 1 to 30 carbon atoms, and s is an integer of 0 to 30. .)

Further, the compound represented by the above formula (1-1) is preferably a compound represented by the following formula (1-2) from the viewpoint of further crosslinking and solubility in an organic solvent.

In formula (1-2),
R ⁰ , R ¹ , R ⁶ , R ⁷ , R ¹⁰ , R ¹¹ , n, p ² to p ⁵ , m ⁶ and m ⁷ are as defined above,
R ⁸ to R ⁹ have the same meanings as R ⁶ to R ⁷ ,
R ¹² to R ¹³ have the same meanings as R ¹⁰ to R ¹¹ ,
m ⁸ and m ⁹ are each independently an integer of 0 to 8.
However, m ⁶ , m ⁷ , m ⁸ and m ⁹ are not 0 at the same time.

In addition, the compound represented by the above (1-1) is preferably a compound represented by the following formula (1a) from the viewpoint of raw material supply.

In the above formula (1a), R ⁰ to R ⁵ , m ² to m ⁵ and n have the same meaning as described in the above formula (1).

The compound represented by the above formula (1a) is more preferably a compound represented by the following formula (1b) from the viewpoint of solubility in an organic solvent.

In the above formula (1b), R ⁰ , R ¹ , R ⁴ , R ⁵ , m ⁴ , m ⁵ , and n are as defined in the above formula (1), and R ⁶ , R ⁷ , R ¹⁰ , R ¹¹ , m ⁶ and m ⁷ have the same meanings as described in the above formula (1-1).

The compound represented by the formula (1a) is more preferably a compound represented by the following formula (1b ′) from the viewpoint of reactivity.

In the above formula (1b ′), R ⁰ , R ¹ , R ⁴ , R ⁵ , m ⁴ , m ⁵ , and n are the same as those described in the above formula (1), and R ⁶ , R ⁷ , R ¹⁰ , R ¹¹ , m ⁶ and m ⁷ have the same meanings as described in the above formula (1-1).

The compound represented by the above formula (1b) is more preferably a compound represented by the following formula (1c) from the viewpoint of solubility in an organic solvent.

In the above formula (1c), R ⁰ , R ¹ , R ⁶ to R ¹³ , m ⁶ to m ⁹ , and n are as defined in the above formula (1-2).

The compound represented by the formula (1b ′) is more preferably a compound represented by the following formula (1c ′) from the viewpoint of reactivity.

In the formula (1c ′), R ⁰ , R ¹ , R ⁶ to R ¹³ , m ⁶ to m ⁹ , and n are as defined in the formula (1-2).

Specific examples of the compound represented by the above formula (0) are illustrated below, but the compound represented by the formula (0) is not limited to the specific examples listed here.

In the above formulas, X is the same as those described in the above formula (0), R T ^'has the same meaning as R ^T described by the above formula (0), m each independently 1-6 Is an integer.

Specific examples of the compound represented by the above formula (0) are further exemplified below, but the compound represented by the formula (0) is not limited to the specific examples listed here.

In the above formulas, X is the same as those described in the above formula (0), also, R ^{Y ^',} R ^{^Z'} are as defined ^R Y, ^{R Z} described by the above formula (0). Furthermore, at least one of OR ^4A includes a group represented by formula (0-1).

(In formula (0-1), R ^X represents a hydrogen atom or a methyl group.)

Hereinafter, specific examples of the compound represented by the above formula (1) are exemplified, but the compound represented by the formula (1) is not limited to the compounds listed here.

In said formula, R < ² >, R < ³ >, R < ⁴ >, R < ⁵ > is synonymous with what was demonstrated by the said Formula (1). m ² and m ³ are integers from 0 to 6, and m ⁴ and m ⁵ are integers from 0 to 7. Provided that at least one selected from R ² , R ³ , R ⁴ and R ⁵ contains a group represented by (0-1), and m ² , m ³ , m ⁴ and m ⁵ are simultaneously 0. Absent.

(In formula (0-1), R ^X represents a hydrogen atom or a methyl group.)

In the above formula, R ¹⁰ , R ¹¹ , R ¹² , and R ¹³ have the same meanings as described in the above formula (1-2), and at least one of R ¹⁰ to R ¹³ is represented by the formula (0-2). Group.

The compound represented by the formula (1) is particularly preferably a compound represented by the following formulas (BiF-1) to (BiF-10) from the viewpoint of further solubility in an organic solvent.

Hereinafter, specific examples of the compound represented by the formula (0) will be further illustrated, but the compound represented by the formula (0) is not limited to the specific examples listed here.

In the above formula, R ⁰ , R ¹ and n are as defined in the above formula (1-1), and R ^{10 ′} and R ^{11 ′} are R ¹⁰ and R described in the above formula (1-1). ¹¹ and R ^{4 ′} and R ^{5 ′} each independently represents an alkyl group having 1 to 30 carbon atoms which may have a substituent, and 6 to 6 carbon atoms which may have a substituent. 30 aryl groups, an optionally substituted alkenyl group having 2 to 30 carbon atoms, an optionally substituted alkoxy group having 1 to 30 carbon atoms, a halogen atom, a nitro group, an amino group, A carboxylic acid group, a thiol group, a hydroxyl group or a group represented by the formula (0-1), and the alkyl group, the aryl group, the alkenyl group and the alkoxy group include an ether bond, a ketone bond or an ester bond. It may have at least one formula of ^{R 10 'and} ^{R 11'} Including a group represented by 0-2). m ^{4 ′} and m ^{5 ′} are integers of 0 to 8, m ^{10 ′} and m ^{11 ′} are integers of 1 to 9, and m ^{4 ′} + m ^{10 ′} and m ^{4 ′} + m ^{11 ′} are independent of each other. It is an integer from 1 to 9.

(In formula (0-1), R ^X represents a hydrogen atom or a methyl group.)

As R ⁰ , for example, methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group, triacontyl group, phenyl group, naphthyl Group, anthracene group, pyrenyl group, biphenyl group and heptacene group.

R ^{4 ′} and R ^{5 ′} include, for example, methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group, triacontyl group , Cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, cyclononyl group, cyclodecyl group, cycloundecyl group, cyclododecyl group, cyclotriacontyl group, norbornyl group, adamantyl group, phenyl Group, naphthyl group, anthracene group, pyrenyl group, biphenyl group, heptacene group, vinyl group, allyl group, triacontenyl group, methoxy group, ethoxy group, triacontoxy group, fluorine atom, chlorine atom, bromine atom, iodine atom And thiol groups.

Each example of R ⁰ , R ^{4 ′} and R ^{5 ′} includes an isomer. For example, the butyl group includes an n-butyl group, an isobutyl group, a sec-butyl group, and a tert-butyl group.

In the above formula, R ¹⁰ to R ¹³ have the same meanings as described in the formula (1-2), R ¹⁶ represents a linear, branched or cyclic alkylene group having 1 to 30 carbon atoms, carbon number A bivalent aryl group having 6 to 30 carbon atoms or a divalent alkenyl group having 2 to 30 carbon atoms.

Examples of R ¹⁶ include methylene group, ethylene group, propene group, butene group, pentene group, hexene group, heptene group, octene group, nonene group, decene group, undecene group, dodecene group, triacontene group, cyclopropene group. , Cyclobutene group, cyclopentene group, cyclohexene group, cycloheptene group, cyclooctene group, cyclononene group, cyclodecene group, cycloundecene group, cyclododecene group, cyclotriacontene group, divalent norbornyl group, divalent adamantyl group, divalent Phenyl group, divalent naphthyl group, divalent anthracene group, divalent pyrene group, divalent biphenyl group, divalent heptacene group, divalent vinyl group, divalent allyl group, divalent tria A contenyl group is mentioned.

Each example of R ¹⁶ includes isomers. For example, the butyl group includes n-butyl group, isobutyl group, sec-butyl group, and tert-butyl group.

In the above formula, R ¹⁰ to R ¹³ have the same meanings as described in the above formula (1-2), and R ¹⁴ each independently represents a linear, branched or cyclic alkyl group having 1 to 30 carbon atoms. A group, an aryl group having 6 to 30 carbon atoms, or an alkenyl group having 2 to 30 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, a halogen atom, and a thiol group, m ¹⁴ is an integer of 0 to 5; ^{14 '} is an integer of 0-4.

Examples of R ¹⁴ include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, an undecyl group, a dodecyl group, a triacontyl group, a cyclopropyl group, Cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, cyclononyl group, cyclodecyl group, cycloundecyl group, cyclododecyl group, cyclotriacontyl group, norbornyl group, adamantyl group, phenyl group, naphthyl group, Anthracene group, pyrenyl group, biphenyl group, heptacene group, vinyl group, allyl group, triacontenyl group, methoxy group, ethoxy group, triacontoxy group, fluorine atom, chlorine atom, bromine atom, iodine atom, thiol group It is done.

Each example of R ¹⁴ includes an isomer. For example, the butyl group includes n-butyl group, isobutyl group, sec-butyl group, and tert-butyl group.

In the above formula, R ⁰ , R ^{4 ′} , R ^{5 ′} , m ^{4 ′} , m ^{5 ′} , m ^{10 ′} and m ^{11 ′} are as defined above, and R ^{1 ′} is a group having 1 to 60 carbon atoms. is there.

In the above formula, R ¹⁰ to R ¹³ have the same meanings as described in the above formula (1-2), and R ¹⁴ each independently represents a linear, branched or cyclic alkyl group having 1 to 30 carbon atoms. A group, an aryl group having 6 to 30 carbon atoms, or an alkenyl group having 2 to 30 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, a halogen atom, and a thiol group, m ¹⁴ is an integer of 0 to 5; ^{14 ′} is an integer from 0 to 4, and m ^{14 ″} is an integer from 0 to 3.

In the above formula, R ¹⁰ to R ¹³ have the same meanings as described in the formula (1-2), R ¹⁵ represents a linear, branched or cyclic alkyl group having 1 to 30 carbon atoms, An aryl group having 6 to 30 carbon atoms, an alkenyl group having 2 to 30 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, a halogen atom, and a thiol group.

As R ¹⁵ , for example, methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group, triacontyl group, cyclopropyl group, Cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, cyclononyl group, cyclodecyl group, cycloundecyl group, cyclododecyl group, cyclotriacontyl group, norbornyl group, adamantyl group, phenyl group, naphthyl group, Anthracene group, pyrenyl group, biphenyl group, heptacene group, vinyl group, allyl group, triacontenyl group, methoxy group, ethoxy group, triacontoxy group, fluorine atom, chlorine atom, bromine atom, iodine atom, thiol group It is done.

Each example of R ¹⁵ includes an isomer. For example, the butyl group includes an n-butyl group, an isobutyl group, a sec-butyl group, and a tert-butyl group.

In the above formula, R ¹⁰ to R ¹³ have the same meanings as described in the formula (1-2).

The compound represented by the formula (0) is more preferably a compound listed below from the viewpoint of availability of raw materials.

Furthermore, the compound represented by the formula (0) is preferably a compound having the following structure from the viewpoint of etching resistance.

In the formula, R ^0A has the same meaning as R ^Y in the formula (0), R ^{1A ′} has the same meaning as R ^Z in the formula (0), and R ¹⁰ to R ¹³ have the same formulas (1) -2) The same meaning as described in 2).

In the above formula, R ¹⁰ to R ¹³ have the same meanings as described in the formula (1-2). R ¹⁴ each independently represents a linear, branched or cyclic alkyl group having 1 to 30 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an alkenyl group having 2 to 30 carbon atoms, or 1 to 30 carbon atoms. An alkoxy group, a halogen atom, and a thiol group, and m ¹⁴ is an integer of 0 to 4.

Examples of R ¹⁴ include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, an undecyl group, a dodecyl group, a triacontyl group, a cyclopropyl group, Cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, cyclononyl group, cyclodecyl group, cycloundecyl group, cyclododecyl group, cyclotriacontyl group, norbornyl group, adamantyl group, phenyl group, naphthyl group, Anthracene group, heptacene group, vinyl group, allyl group, triacontenyl group, methoxy group, ethoxy group, triacontoxy group, fluorine atom, chlorine atom, bromine atom, iodine atom, and thiol group can be mentioned.

Each example of R ¹⁴ includes an isomer. For example, the butyl group includes an n-butyl group, an isobutyl group, a sec-butyl group, and a tert-butyl group.

As R ¹⁵ , for example, methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group, triacontyl group, cyclopropyl group, Cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, cyclononyl group, cyclodecyl group, cycloundecyl group, cyclododecyl group, cyclotriacontyl group, norbornyl group, adamantyl group, phenyl group, naphthyl group, Anthracene group, heptacene group, vinyl group, allyl group, triacontenyl group, methoxy group, ethoxy group, triacontoxy group, fluorine atom, chlorine atom, bromine atom, iodine atom, and thiol group can be mentioned.

Examples of R ¹⁶ include methylene group, ethylene group, propene group, butene group, pentene group, hexene group, heptene group, octene group, nonene group, decene group, undecene group, dodecene group, triacontene group, cyclopropene group. , Cyclobutene group, cyclopentene group, cyclohexene group, cycloheptene group, cyclooctene group, cyclononene group, cyclodecene group, cycloundecene group, cyclododecene group, cyclotriacontene group, divalent norbornyl group, divalent adamantyl group, divalent A phenyl group, a divalent naphthyl group, a divalent anthracene group, a divalent heptacene group, a divalent vinyl group, a divalent allyl group, and a divalent triacontenyl group.

Each example of R ¹⁶ includes isomers. For example, the butyl group includes an n-butyl group, an isobutyl group, a sec-butyl group, and a tert-butyl group.

In the ^formula, R 10 ^{~ R 13} have the same meanings as those described by the formula ^{(1-2), R 14} are each independently C 1 -C 30 linear, alkyl branched or cyclic Group, an aryl group having 6 to 30 carbon atoms, or an alkenyl group having 2 to 30 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, a halogen atom, and a thiol group, and m ^{14 ′} is an integer of 0 to 4.

In the above formula, R ¹⁰ to R ¹³ have the same meanings as described in the above formula (1-2), and R ¹⁴ each independently represents a linear, branched or cyclic alkyl group having 1 to 30 carbon atoms. A group, an aryl group having 6 to 30 carbon atoms, or an alkenyl group having 2 to 30 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, a halogen atom, and a thiol group, and m ¹⁴ is an integer of 0 to 5.

Among the compounds listed above, compounds having a dibenzoxanthene skeleton are more preferable from the viewpoint of heat resistance.

Among the compounds listed above, compounds having a dibenzoxanthene skeleton are preferable from the viewpoint of heat resistance.

Examples of the compound represented by the above formula (0) further include compounds represented by the following formula.

The compounds listed above are more preferably compounds having a xanthene skeleton from the viewpoint of heat resistance.

Examples of the compound represented by the above formula (0) further include compounds represented by the following formulas.

In the above formula, R ¹⁰ to R ¹³ have the same meanings as those described in the above formula (1-2), and R ¹⁴ , R ¹⁵ , R ¹⁶ , m ¹⁴ , and m ^{14 ′} have the same meanings as described in the above formulas. It is.

Hereinafter, as an example of a method for producing the compound represented by the formula (0), a method for producing the compound represented by the formula (1) and the compound represented by the formula (2) will be described.

[Production Method of Compound Represented by Formula (1)]
The compound represented by Formula (1) in this embodiment can be appropriately synthesized by applying a known technique, and the synthesis technique is not particularly limited.
For example, a polyphenol compound is obtained by subjecting a biphenol, binaphthol or bianthracenol and a corresponding aldehyde or ketone to a polycondensation reaction under an acid catalyst under normal pressure, and subsequently, at least one of the polyphenol compounds. It can be obtained by introducing a group represented by the formula (0-1A) into two phenolic hydroxyl groups. Alternatively, it can be obtained by introducing a group represented by the formula (0-1B) and introducing a group represented by the formula (0-1A) into the hydroxy group. Moreover, it can also carry out under pressure as needed.

(In formula (0-1A), R ^X represents a hydrogen atom or a methyl group.)

(In the formula (0-1B), ^{R W} is C 1 -C 30 straight, an alkylene group branched or cyclic, s is an integer of 0 to 30.)

Examples of the biphenols include, but are not limited to, biphenol, methyl biphenol, methoxy binaphthol, and the like. These can be used individually by 1 type or in combination of 2 or more types. Among these, it is more preferable to use biphenol from the viewpoint of stable supply of raw materials.

Examples of the binaphthols include, but are not limited to, binaphthol, methyl binaphthol, methoxy binaphthol, and the like. These can be used alone or in combination of two or more. Among these, it is more preferable to use binaphthol from the viewpoint of increasing the carbon atom concentration and improving the heat resistance.

Examples of the aldehydes include formaldehyde, trioxane, paraformaldehyde, benzaldehyde, acetaldehyde, propylaldehyde, phenylacetaldehyde, phenylpropylaldehyde, hydroxybenzaldehyde, chlorobenzaldehyde, nitrobenzaldehyde, methylbenzaldehyde, ethylbenzaldehyde, butylbenzaldehyde, biphenylaldehyde, Examples include naphthaldehyde, anthracene carbaldehyde, phenanthrene carbaldehyde, pyrene carbaldehyde, furfural, and the like, but are not limited thereto. These can be used alone or in combination of two or more. Among these, from the viewpoint of imparting high heat resistance, benzaldehyde, phenylacetaldehyde, phenylpropylaldehyde, hydroxybenzaldehyde, chlorobenzaldehyde, nitrobenzaldehyde, methylbenzaldehyde, ethylbenzaldehyde, butylbenzaldehyde, cyclohexylbenzaldehyde, biphenylaldehyde, naphthaldehyde, anthracene Carbaldehyde, phenanthrenecarbaldehyde, pyrenecarbaldehyde and furfural are preferably used. From the viewpoint of improving etching resistance, benzaldehyde, hydroxybenzaldehyde, chlorobenzaldehyde, nitrobenzaldehyde, methylbenzaldehyde, ethylbenzaldehyde, butylbenzaldehyde, Hexyl benzaldehyde, biphenyl aldehyde, naphthaldehyde, anthracene carbaldehyde, phenanthrene carbaldehyde, pyrene carbaldehyde, it is preferable to use a furfural.

Examples of the ketones include acetone, methyl ethyl ketone, cyclobutanone, cyclopentanone, cyclohexanone, norbornanone, tricyclohexanone, tricyclodecanone, adamantanone, fluorenone, benzofluorenone, acenaphthenequinone, acenaphthenone, anthraquinone, acetophenone, diacetylbenzene. , Triacetylbenzene, acetonaphthone, diphenylcarbonylnaphthalene, phenylcarbonylbiphenyl, diphenylcarbonylbiphenyl, benzophenone, diphenylcarbonylbenzene, triphenylcarbonylbenzene, benzonaphthone, diphenylcarbonylnaphthalene, phenylcarbonylbiphenyl, diphenylcarbonylbiphenyl, etc. Not particularly limited to . These can be used alone or in combination of two or more. Among these, from the viewpoint of imparting high heat resistance, cyclopentanone, cyclohexanone, norbornanone, tricyclohexanone, tricyclodecanone, adamantanone, fluorenone, benzofluorenone, acenaphthenequinone, acenaphthenone, anthraquinone, acetophenone, diacetylbenzene, It is preferable to use triacetylbenzene, acetonaphthone, diphenylcarbonylnaphthalene, phenylcarbonylbiphenyl, diphenylcarbonylbiphenyl, benzophenone, diphenylcarbonylbenzene, triphenylcarbonylbenzene, benzonaphthone, diphenylcarbonylnaphthalene, phenylcarbonylbiphenyl, diphenylcarbonylbiphenyl, etching resistance From the viewpoint of improving , Diacetylbenzene, triacetylbenzene, acetonaphthone, diphenylcarbonylnaphthalene, phenylcarbonylbiphenyl, diphenylcarbonylbiphenyl, benzophenone, diphenylcarbonylbenzene, triphenylcarbonylbenzene, benzonaphthone, diphenylcarbonylnaphthalene, phenylcarbonylbiphenyl, diphenylcarbonylbiphenyl Is more preferable.
As the aldehydes or ketones, it is preferable to use an aldehyde having an aromatic ring or an aromatic ketone having a high heat resistance and a high etching resistance.

The acid catalyst used in the above reaction can be appropriately selected from known ones and is not particularly limited. As such an acid catalyst, inorganic acids and organic acids are widely known. For example, inorganic acids such as hydrochloric acid, sulfuric acid, phosphoric acid, hydrobromic acid, hydrofluoric acid; oxalic acid, malonic acid, succinic acid, Adipic acid, sebacic acid, citric acid, fumaric acid, maleic acid, formic acid, p-toluenesulfonic acid, methanesulfonic acid, trifluoroacetic acid, dichloroacetic acid, trichloroacetic acid, trifluoromethanesulfonic acid, benzenesulfonic acid, naphthalenesulfonic acid, Organic acids such as naphthalenedisulfonic acid; Lewis acids such as zinc chloride, aluminum chloride, iron chloride, and boron trifluoride; solid acids such as silicotungstic acid, phosphotungstic acid, silicomolybdic acid, and phosphomolybdic acid However, it is not particularly limited to these. Among these, organic acids and solid acids are preferred from the viewpoint of production, and hydrochloric acid or sulfuric acid is more preferred from the viewpoint of production such as availability and ease of handling. In addition, about an acid catalyst, 1 type can be used individually or in combination of 2 or more types. Further, the amount of the acid catalyst used can be appropriately set according to the raw material to be used, the type of the catalyst, and further the reaction conditions, and is not particularly limited, but is 0.01 to 100 parts by mass with respect to 100 parts by mass of the reaction raw material. It is preferable that

In the above reaction, a reaction solvent may be used. The reaction solvent is not particularly limited as long as the reaction of aldehydes or ketones to be used with biphenols, binaphthols or bianthracenediol proceeds, and may be appropriately selected from known ones. it can. Examples of the reaction solvent include water, methanol, ethanol, propanol, butanol, tetrahydrofuran, dioxane, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, or a mixed solvent thereof. In addition, a solvent can be used individually by 1 type or in combination of 2 or more types.

The amount of these reaction solvents used can be appropriately set according to the types of raw materials and catalysts to be used, reaction conditions, and the like, and is not particularly limited, but is 0 to 2000 parts by mass with respect to 100 parts by mass of the reaction raw materials. A range is preferable. Furthermore, the reaction temperature in the above reaction can be appropriately selected according to the reactivity of the reaction raw material, and is not particularly limited, but is usually in the range of 10 to 200 ° C.

In order to obtain a polyphenol compound, a higher reaction temperature is preferable, and specifically, a range of 60 to 200 ° C. is preferable. The reaction method can be appropriately selected from known methods, and is not particularly limited. However, biphenols, binaphthols or bianthracenediol, aldehydes or ketones, a method of charging a catalyst at once, biphenols And a method in which binaphthols, bianthracenediol, aldehydes or ketones are dropped in the presence of a catalyst. After completion of the polycondensation reaction, the obtained compound can be isolated according to a conventional method, and is not particularly limited. For example, in order to remove unreacted raw materials, catalysts, etc. existing in the system, a general method such as raising the temperature of the reaction vessel to 130 to 230 ° C. and removing volatile components at about 1 to 50 mmHg is adopted. As a result, the target compound can be isolated.

As preferable reaction conditions, 1 mol to an excess of biphenols, binaphthols or bianthracenediol, and 0.001 to 1 mol of an acid catalyst are used with respect to 1 mol of an aldehyde or a ketone, The reaction may be carried out at about 150 ° C. for about 20 minutes to 100 hours.

After completion of the reaction, the target product can be isolated by a known method. For example, the reaction solution is concentrated, pure water is added to precipitate the reaction product, cooled to room temperature, filtered and separated, and the resulting solid is filtered and dried, followed by column chromatography. The product represented by the above formula (1), which is the target product, can be obtained by separating and purifying from the by-product by evaporating, evaporating the solvent, filtering and drying.

Further, a method for introducing a group represented by the formula (0-1A) into at least one phenolic hydroxyl group of a polyphenol compound is known. For example, the group represented by the formula (0-1A) can be introduced into at least one phenolic hydroxyl group of the compound as follows. The compound for introducing the group represented by the formula (0-1A) can be synthesized or easily obtained by a known method, and examples thereof include glycidyl acrylate and glycidyl methacrylate, but are not particularly limited thereto.

First, the compound is dissolved or suspended in an aprotic solvent such as acetone, tetrahydrofuran (THF), propylene glycol monomethyl ether acetate or the like. Subsequently, the reaction is carried out at 20 to 150 ° C. for 6 to 72 hours at normal pressure in the presence of a base catalyst such as sodium hydroxide, potassium hydroxide, sodium methoxide, sodium ethoxide and the like. The reaction solution is neutralized with an acid and added to distilled water to precipitate a white solid, and then the separated solid is washed with distilled water, or the solvent is evaporated to dryness and washed with distilled water as necessary. By drying, a compound in which the hydrogen atom of the hydroxyl group is substituted with the group represented by the formula (0-1A) can be obtained.

The timing for introducing the group substituted with the group represented by the formula (0-1A) may be not only after the condensation reaction of binaphthols with aldehydes or ketones, but also before the condensation reaction. Moreover, you may introduce | transduce after manufacturing resin mentioned later.

Also known is a method of introducing a group represented by the formula (0-1B) into at least one phenolic hydroxyl group of a polyphenol compound and introducing a group represented by the formula (0-1A) into the hydroxy group. . For example, as shown below, a group represented by the formula (0-1B) is introduced into at least one phenolic hydroxyl group of the compound, and a group represented by the formula (0-1A) is introduced into the hydroxy group. be able to.

A compound for introducing the group represented by the formula (0-1B) is synthesized by a known method or can be easily obtained. For example, chloroethanol, bromoethanol, 2-chloroethyl acetate, 2-bromoethyl acetate, acetic acid Examples include -2-iodoethyl, ethylene oxide, propylene oxide, butylene oxide, ethylene carbonate, propylene carbonate, and butylene carbonate, but are not particularly limited thereto.

First, the compound is dissolved or suspended in an aprotic solvent such as acetone, tetrahydrofuran (THF), propylene glycol monomethyl ether acetate or the like. Subsequently, the reaction is carried out at 20 to 150 ° C. for 6 to 72 hours at normal pressure in the presence of a base catalyst such as sodium hydroxide, potassium hydroxide, sodium methoxide, sodium ethoxide and the like. The reaction solution is neutralized with an acid and added to distilled water to precipitate a white solid, and then the separated solid is washed with distilled water, or the solvent is evaporated to dryness and washed with distilled water as necessary. By drying, a compound in which the hydrogen atom of the hydroxyl group is substituted with the group represented by the formula (0-1B) can be obtained.

When 2-chloroethyl acetate, 2-bromoethyl acetate, or 2-iodoethyl acetate is used, a hydroxyethyl group is introduced by deacylation after the acetoxyethyl group is introduced.
When ethylene carbonate, propylene carbonate, or butylene carbonate is used, a hydroxyalkyl group is introduced by adding an alkylene carbonate to cause a decarboxylation reaction.

First, the compound is dissolved or suspended in an aprotic solvent such as acetone, tetrahydrofuran (THF), propylene glycol monomethyl ether acetate or the like. Subsequently, the reaction is carried out at 20 to 150 ° C. for 6 to 72 hours at normal pressure in the presence of a base catalyst such as sodium hydroxide, potassium hydroxide, sodium methoxide, sodium ethoxide and the like. The reaction solution is neutralized with an acid and added to distilled water to precipitate a white solid, and then the separated solid is washed with distilled water, or the solvent is evaporated to dryness and washed with distilled water as necessary. By drying, a compound in which the hydrogen atom of the hydroxy group is substituted with a group substituted with a group represented by the formula (0-1A) can be obtained.

In this embodiment, the group substituted with the group represented by the formula (0-1A) reacts in the presence of a radical or an acid / alkali, and reacts with an acid, alkali or organic solvent used in a coating solvent or a developer. Solubility changes. The group substituted with the group represented by the formula (0-1A) has a property of causing a chain reaction in the presence of a radical or an acid / alkali in order to enable pattern formation with higher sensitivity and higher resolution. It is preferable to have.

[Resin obtained using monomer represented by formula (1)]
The compound represented by the formula (1) can be used as it is as a composition (hereinafter also simply referred to as “composition”) used for forming a film for lithography or forming an optical component. In addition, a resin obtained using the compound represented by the formula (1) as a monomer can also be used as a composition. The resin is obtained, for example, by reacting the compound represented by the formula (1) with a compound having a crosslinking reactivity.
Examples of the resin obtained using the compound represented by the formula (1) as a monomer include those having a structure represented by the following formula (3). That is, the composition in the present embodiment may contain a resin having a structure represented by the following formula (3).

In the formula (3), L is a linear, branched or cyclic alkylene group having 1 to 30 carbon atoms which may have a substituent, and 6 to 30 carbon atoms which may have a substituent. An arylene group, an alkoxylene group having 1 to 30 carbon atoms which may have a substituent, or a single bond, wherein the alkylene group, the arylene group or the alkoxylene group is an ether bond, a ketone bond or an ester bond May be included.
R ⁰ , R ¹ , R ² to R ⁵ , m ² and m ³ , m ⁴ and m ⁵ , p ² to p ⁵ , and n are as defined in the formula (1).
However, m ² , m ³ , m ⁴ and m ⁵ are not simultaneously 0, and at least one of R ² to R ⁵ is a group in which a hydrogen atom of a hydroxyl group is represented by the formula (0-2).

[Method for Producing Resin Obtained Using Compound Represented by Formula (1) as Monomer]
The resin in the present embodiment is obtained by reacting the compound represented by the above formula (1) with a compound having crosslinking reactivity. As the compound having a crosslinking reactivity, a known compound can be used without particular limitation as long as the compound represented by the formula (1) can be oligomerized or polymerized. Specific examples thereof include, but are not limited to, aldehydes, ketones, carboxylic acids, carboxylic acid halides, halogen-containing compounds, amino compounds, imino compounds, isocyanates, unsaturated hydrocarbon group-containing compounds, and the like.

Specific examples of the resin having the structure represented by the formula (3) include, for example, a condensation reaction of the compound represented by the formula (1) with an aldehyde and / or a ketone having a crosslinking reactivity. For example, a novolak resin may be used.

Here, as an aldehyde used when novolak-forming the compound represented by the formula (1), for example, formaldehyde, trioxane, paraformaldehyde, benzaldehyde, acetaldehyde, propylaldehyde, phenylacetaldehyde, phenylpropylaldehyde, hydroxybenzaldehyde, Examples thereof include, but are not limited to, chlorobenzaldehyde, nitrobenzaldehyde, methylbenzaldehyde, ethylbenzaldehyde, butylbenzaldehyde, biphenylaldehyde, naphthaldehyde, anthracenecarbaldehyde, phenanthrenecarbaldehyde, pyrenecarbaldehyde, and furfural. Examples of ketones include the aforementioned ketones. Among these, formaldehyde is more preferable. In addition, these aldehydes and / or ketones can be used individually by 1 type or in combination of 2 or more types. The amount of the aldehyde and / or ketone used is not particularly limited, but is preferably 0.2 to 5 mol, more preferably 1 mol with respect to 1 mol of the compound represented by the formula (1). 0.5 to 2 moles.

In the condensation reaction between the compound represented by the formula (1) and the aldehyde and / or ketone, an acid catalyst can be used. The acid catalyst used here can be appropriately selected from known ones and is not particularly limited. As such an acid catalyst, inorganic acids and organic acids are widely known. For example, inorganic acids such as hydrochloric acid, sulfuric acid, phosphoric acid, hydrobromic acid, hydrofluoric acid; oxalic acid, malonic acid, succinic acid, Adipic acid, sebacic acid, citric acid, fumaric acid, maleic acid, formic acid, p-toluenesulfonic acid, methanesulfonic acid, trifluoroacetic acid, dichloroacetic acid, trichloroacetic acid, trifluoromethanesulfonic acid, benzenesulfonic acid, naphthalenesulfonic acid, Organic acids such as naphthalenedisulfonic acid; Lewis acids such as zinc chloride, aluminum chloride, iron chloride, and boron trifluoride; solid acids such as silicotungstic acid, phosphotungstic acid, silicomolybdic acid, and phosphomolybdic acid However, it is not particularly limited to these. Among these, an organic acid and a solid acid are preferable from the viewpoint of production, and hydrochloric acid or sulfuric acid is preferable from the viewpoint of production such as availability and ease of handling. In addition, about an acid catalyst, 1 type can be used individually or in combination of 2 or more types.

Further, the amount of the acid catalyst used can be appropriately set according to the raw material to be used, the type of the catalyst, and further the reaction conditions, and is not particularly limited, but is 0.01 to 100 parts by mass with respect to 100 parts by mass of the reaction raw material. It is preferable that However, indene, hydroxyindene, benzofuran, hydroxyanthracene, acenaphthylene, biphenyl, bisphenol, trisphenol, dicyclopentadiene, tetrahydroindene, 4-vinylcyclohexene, norbornadiene, 5-vinylnorborna-2-ene, α-pinene, β-pinene In the case of a copolymerization reaction with a compound having a nonconjugated double bond such as limonene, aldehydes are not necessarily required.

In the condensation reaction between the compound represented by the formula (1) and the aldehyde and / or ketone, a reaction solvent can be used. The reaction solvent in this polycondensation can be appropriately selected from known solvents and is not particularly limited. Examples thereof include water, methanol, ethanol, propanol, butanol, tetrahydrofuran, dioxane, and mixed solvents thereof. Can be mentioned. In addition, a solvent can be used individually by 1 type or in combination of 2 or more types.

The amount of these solvents used can be appropriately set according to the types of raw materials and catalysts used, and further the reaction conditions, and is not particularly limited, but is in the range of 0 to 2000 parts by mass with respect to 100 parts by mass of the reactive raw materials. It is preferable that Furthermore, the reaction temperature can be appropriately selected according to the reactivity of the reaction raw material, and is not particularly limited, but is usually in the range of 10 to 200 ° C. The reaction method can be appropriately selected from known methods, and is not particularly limited. However, the reaction method may be a method in which the compound represented by the above formula (1), the aldehyde and / or ketone, and a catalyst are charged together, The method of dripping the compound represented by the said Formula (1), an aldehyde, and / or ketones in catalyst presence is mentioned.

After completion of the polycondensation reaction, the obtained compound can be isolated according to a conventional method, and is not particularly limited. For example, in order to remove unreacted raw materials, catalysts, etc. existing in the system, a general method such as raising the temperature of the reaction vessel to 130 to 230 ° C. and removing volatile components at about 1 to 50 mmHg is adopted. As a result, the novolak resin as the target product can be isolated.

Here, the resin having the structure represented by the formula (3) may be a homopolymer of the compound represented by the formula (1), but is a copolymer with other phenols. May be. Examples of the copolymerizable phenols include phenol, cresol, dimethylphenol, trimethylphenol, butylphenol, phenylphenol, diphenylphenol, naphthylphenol, resorcinol, methylresorcinol, catechol, butylcatechol, methoxyphenol, methoxyphenol, Although propylphenol, pyrogallol, thymol, etc. are mentioned, it is not specifically limited to these.

Further, the resin having the structure represented by the formula (3) may be copolymerized with a polymerizable monomer other than the above-described phenols. Examples of the copolymerization monomer include naphthol, methylnaphthol, methoxynaphthol, dihydroxynaphthalene, indene, hydroxyindene, benzofuran, hydroxyanthracene, acenaphthylene, biphenyl, bisphenol, trisphenol, dicyclopentadiene, tetrahydroindene, 4-vinylcyclohexene. , Norbornadiene, vinylnorbornaene, pinene, limonene and the like, but are not particularly limited thereto. The resin having the structure represented by the formula (3) is a binary or more (for example, a quaternary system) copolymer of the compound represented by the formula (1) and the above-described phenols. Even if it is a binary or more (for example, 2-4 quaternary) copolymer of the compound represented by the formula (1) and the above-mentioned copolymerization monomer, it is represented by the formula (1). It may be a ternary or more (for example, ternary to quaternary) copolymer of the above compound, the above-mentioned phenols, and the above-mentioned copolymerization monomer.

The molecular weight of the resin having the structure represented by the formula (3) is not particularly limited, but the polystyrene equivalent weight average molecular weight (Mw) is preferably 500 to 30,000, more preferably 750 to 20,000. Further, from the viewpoint of enhancing the crosslinking efficiency and suppressing the volatile components in the baking, the resin having the structure represented by the formula (3) has a dispersity (weight average molecular weight Mw / number average molecular weight Mn) of 1.2. It is preferably within the range of ˜7. In addition, said Mw and Mn can be calculated | required by the method as described in the Example mentioned later.

The resin having the structure represented by the formula (3) is preferably highly soluble in a solvent from the viewpoint of easier application of a wet process. More specifically, when these compounds and / or resins use 1-methoxy-2-propanol (PGME) and / or propylene glycol monomethyl ether acetate (PGMEA) as a solvent, the solubility in the solvent is 10% by mass or more. It is preferable that Here, the solubility in PGM and / or PGMEA is defined as “resin mass ÷ (resin mass + solvent mass) × 100 (mass%)”. For example, when 10 g of the resin is dissolved in 90 g of PGMEA, the solubility of the resin in PGMEA is “10 mass% or more”, and when it is not dissolved, it is “less than 10 mass%”.

[Compound represented by Formula (2)]
The compound (0) in the present embodiment is preferably a compound represented by the following formula (2) from the viewpoint of heat resistance and solvent solubility.

In Formula (2), R ^0A is a hydrogen atom, a linear, branched or cyclic alkyl group having 1 to 30 carbon atoms, or an aryl group having 6 to 30 carbon atoms.
R ^1A is an n ^A valent group having 1 to 60 carbon atoms or a single bond,
R ^2A is each independently a linear, branched or cyclic alkyl group having 1 to 30 carbon atoms which may have a substituent, and 6 to 30 carbon atoms which may have a substituent. An aryl group, an optionally substituted alkenyl group having 2 to 30 carbon atoms, an optionally substituted alkoxy group having 1 to 30 carbon atoms, a halogen atom, a nitro group, an amino group, a carboxyl group An acid group, a thiol group, a hydroxyl group or a group represented by the formula (0-1), and the alkyl group, the aryl group, the alkenyl group, and the alkoxy group include an ether bond, a ketone bond, or an ester bond. Here, at least one of R ^2A includes a group represented by the formula (0-1).
n ^A is an integer of 1 to 4. Here, in the formula (2), when n ^A is an integer of 2 or more, the structural formulas in n ^A [] may be the same or different. Good.
X ^A each independently represents an oxygen atom, a sulfur atom, or no bridge. Here, X ^A, because there is a tendency to exhibit excellent heat resistance, it is preferable that an oxygen atom or a sulfur atom, more preferably oxygen atom. X ^A, in terms of solubility, it is preferable that the non-crosslinked.
m ^2A is each independently an integer of 0 to 6. However, at least one m ^2A is an integer of 1 to 6.
q ^A is each independently 0 or 1.

The n-valent hydrocarbon group may have an alicyclic hydrocarbon group, a double bond, a hetero atom, or an aromatic group having 6 to 30 carbon atoms. Here, the alicyclic hydrocarbon group includes a bridged alicyclic hydrocarbon group.

The compound represented by the above formula (2) has a relatively low molecular weight, but has high heat resistance due to the rigidity of the structure, and thus can be used under high temperature baking conditions. Moreover, it has tertiary carbon or quaternary carbon in the molecule, the crystallinity is suppressed, and it is suitably used as a film forming composition for lithography that can be used for film production for lithography.

Moreover, since the solubility with respect to a safe solvent is high, and heat resistance and etching tolerance are favorable, the resist formation composition for lithography containing the compound represented by said (2) can give a favorable resist pattern shape. .

Furthermore, because of its relatively low molecular weight and low viscosity, even with a stepped substrate (especially a fine space or hole pattern), the flatness of the film is filled evenly throughout the step. As a result, the composition for forming a lower layer film for lithography using the same has good embedding and planarization characteristics. Moreover, since it is a compound having a relatively high carbon concentration, high etching resistance can be imparted.

The compound represented by the above formula (2) is preferably a compound represented by the following formula (2-1) from the viewpoint of easy crosslinking and solubility in an organic solvent.

In the formula (2-1), R ^0A , R ^1A , n ^A and q ^A and X ^A have the same meaning as described in the above formula (2).
R ^3A is a linear, branched or cyclic alkyl group having 1 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, substituted An alkenyl group having 2 to 30 carbon atoms which may have a group, a halogen atom, a nitro group, an amino group, a carboxylic acid group, or a thiol group, and may be the same or different in the same naphthalene ring or benzene ring. May be.
R ^4A is each independently a hydrogen atom or a group represented by the formula (0-2), wherein at least one of R ^4A is a group represented by the formula (0-2);
m ^6A is each independently an integer of 0 to 5.

When the compound represented by the formula (2-1) is used as a film forming composition for lithography for an alkali development positive resist or an organic development negative resist, at least one of R ^4A is an acid dissociable group. It is. On the other hand, when the compound represented by the formula (2-1) is used as a lithographic film-forming composition for an alkali development negative resist, a lithographic film-forming composition for an underlayer film, or an optical component-forming composition, R ^At least one of ^4A is a hydrogen atom.

Further, the compound represented by the above formula (2-1) is preferably a compound represented by the following formula (2a) from the viewpoint of raw material supply.

In the above formula (2a), X ^A , R ^0A to R ^2A , m ^2A and n ^A are the same as those described in the above formula (2).

In addition, the compound represented by the formula (2-1) is more preferably a compound represented by the following formula (2b) from the viewpoint of solubility in an organic solvent.

In the above formula (2b), X ^A , R ^0A , R ^1A , R ^3A , R ^4A , m ^6A and n ^A are as defined in the above formula (2-1).

The compound represented by the above formula (2-1) is more preferably a compound represented by the following formula (2c) from the viewpoint of solubility in an organic solvent.

In the above formula (2c), X ^A , R ^0A , R ^1A , R ^3A , R ^4A , m ^6A and n ^A have the same meaning as described in the above formula (2-1).

From the viewpoint of further solubility in an organic solvent, the compound represented by the above formula (2) has the following formulas (BisN-1) to (BisN-4), (XBisN-1) to (XBisN-3), ( A compound represented by (BiN-1) to (BiN-4) or (XBiN-1) to (XBiN-3) is particularly preferable.

[Production Method of Compound Represented by Formula (2)]
The compound represented by formula (2) in the present embodiment can be appropriately synthesized by applying a known technique, and the synthesis technique is not particularly limited.
For example, a polyphenol compound is obtained by polycondensation reaction of phenols, naphthols and corresponding aldehydes or ketones under an acid catalyst under normal pressure, and then at least one phenolic hydroxyl group of the polyphenol compound. Can be obtained by introducing a group represented by the formula (0-1A). Alternatively, it can be obtained by introducing a group represented by the formula (0-1B) and introducing a group represented by the formula (0-1A) into the hydroxy group. Moreover, it can also carry out under pressure as needed.

(In formula (0-1A), R ^X represents a hydrogen atom or a methyl group.)

The naphthols are not particularly limited, and examples thereof include naphthol, methyl naphthol, methoxy naphthol, naphthalene diol, etc. Among them, naphthalene diol is preferably used from the viewpoint that a xanthene structure can be easily formed. .

The phenols are not particularly limited, and examples thereof include phenol, methylphenol, methoxybenzene, catechol, resorcinol, hydroquinone, and trimethylhydroquinone.

Examples of the ketones include acetone, methyl ethyl ketone, cyclobutanone, cyclopentanone, cyclohexanone, norbornanone, tricyclohexanone, tricyclodecanone, adamantanone, fluorenone, benzofluorenone, acenaphthenequinone, acenaphthenone, anthraquinone, acetophenone, diacetylbenzene. , Triacetylbenzene, acetonaphthone, diphenylcarbonylnaphthalene, phenylcarbonylbiphenyl, diphenylcarbonylbiphenyl, benzophenone, diphenylcarbonylbenzene, triphenylcarbonylbenzene, benzonaphthone, diphenylcarbonylnaphthalene, phenylcarbonylbiphenyl, diphenylcarbonylbiphenyl, etc. Not particularly limited to . These can be used alone or in combination of two or more. Among these, from the viewpoint of imparting high heat resistance, cyclopentanone, cyclohexanone, norbornanone, tricyclohexanone, tricyclodecanone, adamantanone, fluorenone, benzofluorenone, acenaphthenequinone, acenaphthenone, anthraquinone, acetophenone, diacetylbenzene, It is preferable to use triacetylbenzene, acetonaphthone, diphenylcarbonylnaphthalene, phenylcarbonylbiphenyl, diphenylcarbonylbiphenyl, benzophenone, diphenylcarbonylbenzene, triphenylcarbonylbenzene, benzonaphthone, diphenylcarbonylnaphthalene, phenylcarbonylbiphenyl, diphenylcarbonylbiphenyl, etching resistance From the viewpoint of improving , Diacetylbenzene, triacetylbenzene, acetonaphthone, diphenylcarbonylnaphthalene, phenylcarbonylbiphenyl, diphenylcarbonylbiphenyl, benzophenone, diphenylcarbonylbenzene, triphenylcarbonylbenzene, benzonaphthone, diphenylcarbonylnaphthalene, phenylcarbonylbiphenyl, diphenylcarbonylbiphenyl Is more preferable.
As the ketones, it is preferable to use a ketone having an aromatic ring from the viewpoint of having both high heat resistance and high etching resistance.

The acid catalyst used in the above reaction can be appropriately selected from known ones and is not particularly limited. The acid catalyst can be appropriately selected from known inorganic acids and organic acids. For example, inorganic acids such as hydrochloric acid, sulfuric acid, phosphoric acid, hydrobromic acid and hydrofluoric acid; oxalic acid, formic acid, p-toluenesulfone Acids, organic acids such as methanesulfonic acid, trifluoroacetic acid, trifluoromethanesulfonic acid, benzenesulfonic acid, naphthalenesulfonic acid, naphthalenedisulfonic acid; Lewis acids such as zinc chloride, aluminum chloride, iron chloride, boron trifluoride; or Solid acids such as silicotungstic acid, phosphotungstic acid, silicomolybdic acid or phosphomolybdic acid can be mentioned. Among these, it is preferable to use hydrochloric acid or sulfuric acid from the viewpoint of production such as availability and ease of handling. About an acid catalyst, 1 type can be used individually or in combination of 2 or more types.

In the above reaction, a reaction solvent may be used. The reaction solvent is not particularly limited as long as the reaction between the aldehyde or ketone to be used and naphthol proceeds, but for example, water, methanol, ethanol, propanol, butanol, tetrahydrofuran, dioxane or a mixed solvent thereof is used. Can do. The amount of the reaction solvent is not particularly limited and is, for example, in the range of 0 to 2000 parts by mass with respect to 100 parts by mass of the reaction raw material.

The reaction temperature is not particularly limited and can be appropriately selected according to the reactivity of the reaction raw material, but is preferably in the range of 10 to 200 ° C. From the viewpoint of synthesizing the polyphenol compound in this embodiment with good selectivity, the temperature is preferably lower, and more preferably in the range of 10 to 60 ° C.

The reaction method is not particularly limited, and examples thereof include a method in which naphthols, aldehydes or ketones, and a catalyst are charged all at once, and a method in which naphthols, aldehydes, or ketones are dropped in the presence of a catalyst. After the polycondensation reaction, in order to remove unreacted raw materials, catalysts, etc. existing in the system, the temperature of the reaction kettle can be raised to 130-230 ° C., and volatile matter can be removed at about 1-50 mmHg. .

The amount of the raw material is not particularly limited. For example, 2 mol to an excess amount of naphthols and the like and 0.001 to 1 mol of an acid catalyst are used with respect to 1 mol of aldehydes or ketones, and at normal pressure, 20 mol. The reaction is preferably carried out at ˜60 ° C. for about 20 minutes to 100 hours.

After completion of the reaction, the target product is isolated by a known method. The method for isolating the target product is not particularly limited. For example, the reaction solution is concentrated, pure water is added to precipitate the reaction product, and after cooling to room temperature, the product is separated by filtration. The product can be filtered and dried, and then separated and purified from by-products by column chromatography, followed by solvent distillation, filtration and drying to isolate the target compound.

Also, a method for introducing a group represented by the formula (0-1A) into at least one phenolic hydroxyl group of a polyphenol compound is known. For example, a group represented by the formula (0-1A) can be introduced into at least one phenolic hydroxyl group of the compound as follows. The compound for introducing the group represented by the formula (0-1A) can be synthesized or easily obtained by a known method, and examples thereof include glycidyl acrylate and glycidyl methacrylate, but are not particularly limited thereto.

Also known is a method in which a group represented by the formula (0-1B) is introduced into at least one phenolic hydroxyl group of a polyphenol compound, and a group represented by the formula (0-1A) is introduced into the hydroxy group. is there.
For example, as shown below, a group represented by the formula (0-1B) is introduced into at least one phenolic hydroxyl group of the compound, and a group represented by the formula (0-1A) is introduced into the hydroxy group. can do.
A compound for introducing the group represented by the formula (0-1B) is synthesized by a known method or can be easily obtained. For example, chloroethanol, bromoethanol, 2-chloroethyl acetate, 2-bromoethyl acetate, acetic acid Examples include -2-iodoethyl, ethylene oxide, propylene oxide, butylene oxide, ethylene carbonate, propylene carbonate, and butylene carbonate, but are not particularly limited thereto.

For example, the compound is dissolved or suspended in an aprotic solvent such as acetone, tetrahydrofuran (THF), propylene glycol monomethyl ether acetate or the like. Subsequently, the reaction is carried out at 20 to 150 ° C. for 6 to 72 hours at normal pressure in the presence of a base catalyst such as sodium hydroxide, potassium hydroxide, sodium methoxide, sodium ethoxide and the like. The reaction solution is neutralized with an acid and added to distilled water to precipitate a white solid, and then the separated solid is washed with distilled water, or the solvent is evaporated to dryness and washed with distilled water as necessary. By drying, a compound in which the hydrogen atom of the hydroxyl group is substituted with the group represented by the formula (0-1B) can be obtained.

Thereafter, the compound is dissolved or suspended in an aprotic solvent such as acetone, tetrahydrofuran (THF), propylene glycol monomethyl ether acetate or the like. Subsequently, the reaction is carried out at 20 to 150 ° C. for 6 to 72 hours at normal pressure in the presence of a base catalyst such as sodium hydroxide, potassium hydroxide, sodium methoxide, sodium ethoxide and the like. The reaction solution is neutralized with an acid and added to distilled water to precipitate a white solid, and then the separated solid is washed with distilled water, or the solvent is evaporated to dryness and washed with distilled water as necessary. By drying, a compound in which the hydrogen atom of the hydroxy group is substituted with a group substituted with a group represented by the formula (0-1A) can be obtained.

[Resin obtained using monomer represented by formula (2)]
The compound represented by the formula (2) can be used as it is as a composition used for forming a film for lithography or forming an optical component. In addition, a resin obtained using the compound represented by the formula (2) as a monomer can be used as a composition. The resin is obtained, for example, by reacting the compound represented by the formula (2) with a compound having a crosslinking reactivity.
Examples of the resin obtained using the compound represented by the formula (2) as a monomer include those having a structure represented by the following formula (4). That is, the composition in the present embodiment may contain a resin having a structure represented by the following formula (4).

In the formula (4), L is a linear, branched or cyclic alkylene group having 1 to 30 carbon atoms which may have a substituent, and 6 to 30 carbon atoms which may have a substituent. An arylene group, an alkoxylene group having 1 to 30 carbon atoms which may have a substituent, or a single bond, wherein the alkylene group, the arylene group or the alkoxylene group is an ether bond, a ketone bond or an ester bond May be included.
R ^0A , R ^1A , R ^2A , m ^2A , n ^A , q ^A and X ^A are the same as those in the formula (2),
However, when n ^A is an integer of 2 or more, the structural formulas in n ^A [] may be the same or different, and at least one m ^2A is an integer of 1 to 6, and R ^2A At least one of the groups is a group represented by the formula (0-2).

[Method for producing resin obtained by using compound represented by formula (2) as monomer]
The resin in the present embodiment is obtained by reacting the compound represented by the above formula (2) with a compound having crosslinking reactivity. As the compound having crosslinking reactivity, a known compound can be used without particular limitation as long as the compound represented by the formula (2) can be oligomerized or polymerized. Specific examples thereof include, but are not limited to, aldehydes, ketones, carboxylic acids, carboxylic acid halides, halogen-containing compounds, amino compounds, imino compounds, isocyanates, unsaturated hydrocarbon group-containing compounds, and the like.

Specific examples of the resin having the structure represented by the formula (4) include, for example, a condensation reaction of the compound represented by the formula (2) with an aldehyde and / or a ketone having a crosslinking reactivity. For example, a novolak resin may be used.

Here, as an aldehyde used when novolak-forming the compound represented by the formula (2), for example, formaldehyde, trioxane, paraformaldehyde, benzaldehyde, acetaldehyde, propylaldehyde, phenylacetaldehyde, phenylpropylaldehyde, hydroxybenzaldehyde, Examples thereof include, but are not limited to, chlorobenzaldehyde, nitrobenzaldehyde, methylbenzaldehyde, ethylbenzaldehyde, butylbenzaldehyde, biphenylaldehyde, naphthaldehyde, anthracenecarbaldehyde, phenanthrenecarbaldehyde, pyrenecarbaldehyde, and furfural. Examples of ketones include the aforementioned ketones. Among these, formaldehyde is more preferable. In addition, these aldehydes and / or ketones can be used individually by 1 type or in combination of 2 or more types. The amount of the aldehyde and / or ketone used is not particularly limited, but is preferably 0.2 to 5 mol, more preferably 1 mol with respect to 1 mol of the compound represented by the formula (2). 0.5 to 2 moles.

In the condensation reaction between the compound represented by the formula (2) and the aldehyde and / or ketone, an acid catalyst can be used. The acid catalyst used here can be appropriately selected from known ones and is not particularly limited. As such an acid catalyst, inorganic acids and organic acids are widely known. For example, inorganic acids such as hydrochloric acid, sulfuric acid, phosphoric acid, hydrobromic acid, hydrofluoric acid; oxalic acid, malonic acid, succinic acid, Adipic acid, sebacic acid, citric acid, fumaric acid, maleic acid, formic acid, p-toluenesulfonic acid, methanesulfonic acid, trifluoroacetic acid, dichloroacetic acid, trichloroacetic acid, trifluoromethanesulfonic acid, benzenesulfonic acid, naphthalenesulfonic acid, Organic acids such as naphthalenedisulfonic acid; Lewis acids such as zinc chloride, aluminum chloride, iron chloride, and boron trifluoride; solid acids such as silicotungstic acid, phosphotungstic acid, silicomolybdic acid, and phosphomolybdic acid However, it is not particularly limited to these. Among these, an organic acid or a solid acid is preferable from the viewpoint of production, and hydrochloric acid or sulfuric acid is preferable from the viewpoint of production such as availability and ease of handling. In addition, about an acid catalyst, 1 type can be used individually or in combination of 2 or more types.

In the condensation reaction between the compound represented by the formula (2) and the aldehyde and / or ketone, a reaction solvent can be used. The reaction solvent in this polycondensation can be appropriately selected from known solvents and is not particularly limited. Examples thereof include water, methanol, ethanol, propanol, butanol, tetrahydrofuran, dioxane, and mixed solvents thereof. Can be mentioned. In addition, a solvent can be used individually by 1 type or in combination of 2 or more types.

The amount of these solvents used can be appropriately set according to the raw material used, the type of catalyst used, and the reaction conditions, and is not particularly limited, but is 0 to 2000 parts by mass with respect to 100 parts by mass of the reaction raw material. It is preferable that it is the range of these. Furthermore, the reaction temperature can be appropriately selected according to the reactivity of the reaction raw material, and is not particularly limited, but is usually in the range of 10 to 200 ° C. The reaction method can be appropriately selected from known methods and is not particularly limited. However, the reaction method may be a method in which the compound represented by the above formula (2), the aldehyde and / or ketone, and a catalyst are charged together, The method of dripping the compound represented by the said Formula (2), an aldehyde, and / or ketones in catalyst presence is mentioned.

Here, the resin having the structure represented by the formula (4) may be a homopolymer of the compound represented by the formula (2), but is a copolymer with other phenols. May be. Examples of the copolymerizable phenols include phenol, cresol, dimethylphenol, trimethylphenol, butylphenol, phenylphenol, diphenylphenol, naphthylphenol, resorcinol, methylresorcinol, catechol, butylcatechol, methoxyphenol, methoxyphenol, Although propylphenol, pyrogallol, thymol, etc. are mentioned, it is not specifically limited to these.

In addition, the resin having the structure represented by the formula (4) may be copolymerized with a polymerizable monomer other than the above-described phenols. Examples of the copolymerization monomer include naphthol, methylnaphthol, methoxynaphthol, dihydroxynaphthalene, indene, hydroxyindene, benzofuran, hydroxyanthracene, acenaphthylene, biphenyl, bisphenol, trisphenol, dicyclopentadiene, tetrahydroindene, 4-vinylcyclohexene. , Norbornadiene, vinylnorbornaene, pinene, limonene and the like, but are not particularly limited thereto. The resin having the structure represented by the above formula (4) is a binary or more (for example, 2-4 quaternary) copolymer of the compound represented by the above formula (2) and the above-described phenols. Even in the case of a binary or more (for example, 2-4 quaternary) copolymer of the compound represented by the formula (2) and the above-described copolymerization monomer, it is represented by the formula (2). It may be a ternary or more (for example, ternary to quaternary) copolymer of the above compound, the above-mentioned phenols, and the above-mentioned copolymerization monomer.

The molecular weight of the resin having the structure represented by the formula (4) is not particularly limited, but the polystyrene-equivalent weight average molecular weight (Mw) is preferably 500 to 30,000, more preferably 750 to 20,000. Further, from the viewpoint of increasing the crosslinking efficiency and suppressing the volatile components in the baking, the resin having the structure represented by the formula (4) has a dispersity (weight average molecular weight Mw / number average molecular weight Mn) of 1.2. It is preferably within the range of ˜7. In addition, said Mw and Mn can be calculated | required by the method as described in the Example mentioned later.

The resin having the structure represented by the formula (4) is preferably highly soluble in a solvent from the viewpoint of easier application of a wet process. More specifically, when 1-methoxy-2-propanol (PGME) and / or propylene glycol monomethyl ether acetate (PGMEA) is used as a solvent, the solubility in the solvent is preferably 10% by mass or more. Here, the solubility in PGM and / or PGMEA is defined as “resin mass ÷ (resin mass + solvent mass) × 100 (mass%)”. For example, when 10 g of the resin is dissolved in 90 g of PGMEA, the solubility of the resin in PGMEA is “10 mass% or more”, and when it is not dissolved, it is “less than 10 mass%”.

[Method for purifying compound and / or resin]
The purification method of the compound and / or resin in the present embodiment is represented by the compound represented by the formula (1), the resin obtained by using the compound represented by the formula (1) as a monomer, and the formula (2). And a step of dissolving one or more selected from resins obtained using the compound represented by the formula (2) as a monomer in a solvent to obtain a solution (S), and the obtained solution (S) A step of extracting the compound and / or impurities in the resin by contacting with an acidic aqueous solution (first extraction step), wherein the solvent used in the step of obtaining the solution (S) is optionally water and Contains immiscible solvents.
In the first extraction step, the resin is a resin obtained by a reaction between the compound represented by the formula (1) and / or the compound represented by the formula (2) and a compound having a crosslinking reactivity. preferable. According to the purification method of the present embodiment, the content of various metals that can be contained as impurities in the compound or resin having the specific structure described above can be reduced.
More specifically, in the purification method of the present embodiment, the compound and / or the resin is dissolved in an organic solvent that is arbitrarily immiscible with water to obtain a solution (S), and the solution (S) is further obtained. The extraction treatment can be performed in contact with an acidic aqueous solution. Thereby, after transferring the metal content contained in the solution (S) to the aqueous phase, the organic phase and the aqueous phase can be separated to obtain a compound and / or resin having a reduced metal content.

The compounds and / or resins used in the purification method of this embodiment may be used alone or in combination of two or more. Moreover, the said compound and resin may contain various surfactant, various crosslinking agents, various acid generators, various stabilizers, etc.

The solvent that is not arbitrarily miscible with water used in the purification method of the present embodiment is not particularly limited, but an organic solvent that can be safely applied to a semiconductor manufacturing process is preferable, and specifically, solubility in water at room temperature. Is less than 30%, more preferably less than 20%, and even more preferably less than 10%. The amount of the organic solvent used is preferably 1 to 100 times by mass with respect to the total amount of the compound to be used and the resin.

Specific examples of solvents that are not arbitrarily miscible with water include, but are not limited to, ethers such as diethyl ether and diisopropyl ether; esters such as ethyl acetate, n-butyl acetate and isoamyl acetate, methyl ethyl ketone and methyl isobutyl Ketones such as ketone, ethyl isobutyl ketone, cyclohexanone, cyclopentanone, 2-heptanone, 2-pentanone; ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monoethyl Glycol ether acetates such as ether acetate; Aliphatic hydrocarbons such as n-hexane and n-heptane; Aromatic hydrocarbons such as toluene and xylene Methylene chloride, halogenated hydrocarbons such as chloroform and the like. Among these, toluene, 2-heptanone, cyclohexanone, cyclopentanone, methyl isobutyl ketone, propylene glycol monomethyl ether acetate and ethyl acetate are preferable, methyl isobutyl ketone, ethyl acetate, cyclohexanone and propylene glycol monomethyl ether acetate are more preferable, and methyl More preferred are isobutyl ketone and ethyl acetate. Methyl isobutyl ketone, ethyl acetate, etc. are removed when the solvent is industrially distilled off or dried because the above compound and the resin containing the compound as a constituent component have a relatively high saturation solubility and a relatively low boiling point. It is possible to reduce the load in the process. These solvents can be used alone or in combination of two or more.

The acidic aqueous solution used in the purification method of the present embodiment is appropriately selected from aqueous solutions in which generally known organic compounds or inorganic compounds are dissolved in water. Examples of the acidic aqueous solution include, but are not limited to, for example, a mineral acid aqueous solution in which a mineral acid such as hydrochloric acid, sulfuric acid, nitric acid, and phosphoric acid is dissolved in water; acetic acid, propionic acid, oxalic acid, malonic acid, succinic acid, fumaric acid An organic acid aqueous solution in which an organic acid such as maleic acid, tartaric acid, citric acid, methanesulfonic acid, phenolsulfonic acid, p-toluenesulfonic acid, trifluoroacetic acid or the like is dissolved in water. These acidic aqueous solutions can be used alone or in combination of two or more. Among these acidic aqueous solutions, one or more mineral acid aqueous solutions selected from the group consisting of hydrochloric acid, sulfuric acid, nitric acid and phosphoric acid, or acetic acid, propionic acid, succinic acid, malonic acid, succinic acid, fumaric acid, maleic acid, One or more organic acid aqueous solutions selected from the group consisting of tartaric acid, citric acid, methanesulfonic acid, phenolsulfonic acid, p-toluenesulfonic acid and trifluoroacetic acid are preferred, and sulfuric acid, nitric acid, acetic acid, oxalic acid, An aqueous solution of carboxylic acid such as tartaric acid and citric acid is more preferable, an aqueous solution of sulfuric acid, succinic acid, tartaric acid and citric acid is more preferable, and an aqueous solution of succinic acid is more preferable. It is considered that polyvalent carboxylic acids such as oxalic acid, tartaric acid, and citric acid tend to be able to remove metals more effectively because they coordinate to metal ions and produce a chelate effect. Further, as the water used here, it is preferable to use water having a low metal content, such as ion-exchanged water, in accordance with the purpose of the purification method of the present embodiment.

The pH of the acidic aqueous solution used in the purification method of the present embodiment is not particularly limited, but it is preferable to adjust the acidity of the aqueous solution in consideration of the influence on the compound and the resin. The pH of the acidic aqueous solution is usually about 0 to 5, preferably about 0 to 3.

The amount of the acidic aqueous solution used in the purification method of the present embodiment is not particularly limited, but is used from the viewpoint of reducing the number of extractions for metal removal and ensuring operability in consideration of the total liquid amount. It is preferable to adjust the amount. From the above viewpoint, the amount of the acidic aqueous solution used is preferably 10 to 200% by mass and more preferably 20 to 100% by mass with respect to 100% by mass of the solution (S).

In the purification method of the present embodiment, the metal component can be extracted from the compound or the resin in the solution (S) by bringing the acidic aqueous solution into contact with the solution (S).

In the purification method of the present embodiment, it is preferable that the solution (S) further includes an organic solvent arbitrarily mixed with water. When the solution (S) contains an organic solvent that is arbitrarily miscible with water, the amount of the compound and / or resin charged can be increased, the liquid separation property is improved, and purification is performed with high pot efficiency. There is a tendency to be able to. The method of adding an organic solvent arbitrarily mixed with water is not particularly limited, for example, a method of adding to a solution containing an organic solvent in advance, a method of adding to a water or acidic aqueous solution in advance, a solution containing an organic solvent and water or an acidic aqueous solution. Any of the methods of adding after contacting may be used. Among these, the method of adding to the solution containing an organic solvent in advance is preferable from the viewpoint of the workability of the operation and the ease of management of the charged amount.

The organic solvent arbitrarily mixed with water used in the purification method of the present embodiment is not particularly limited, but an organic solvent that can be safely applied to a semiconductor manufacturing process is preferable. The amount of the organic solvent arbitrarily mixed with water is not particularly limited as long as the solution phase and the aqueous phase are separated from each other, but is 0.1 to 100 times by mass with respect to the total amount of the compound and the resin to be used. It is preferably 0.1 to 50 times by mass, more preferably 0.1 to 20 times by mass.

Specific examples of the organic solvent arbitrarily mixed with water used in the purification method of the present embodiment include, but are not limited to, ethers such as tetrahydrofuran and 1,3-dioxolane; alcohols such as methanol, ethanol and isopropanol Ketones such as acetone and N-methylpyrrolidone; aliphatic hydrocarbons such as glycol ethers such as ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether (PGME) and propylene glycol monoethyl ether Can be mentioned. Among these, N-methylpyrrolidone, propylene glycol monomethyl ether and the like are preferable, and N-methylpyrrolidone and propylene glycol monomethyl ether are more preferable. Each of these solvents can be used alone or in combination of two or more.

The temperature at the time of the extraction treatment is usually 20 to 90 ° C, preferably 30 to 80 ° C. The extraction operation is performed, for example, by mixing well by stirring and then allowing to stand. Thereby, the metal part contained in solution (S) transfers to an aqueous phase. Moreover, the acidity of a solution falls by this operation and the quality change of a compound and / or resin can be suppressed.

Since the mixed solution is allowed to stand to separate into a solution phase containing a compound and / or a resin and a solvent and an aqueous phase, the solution phase is recovered by decantation or the like. The standing time is not particularly limited, but it is preferable to adjust the standing time from the viewpoint of improving the separation between the solvent-containing solution phase and the aqueous phase. Usually, the time for standing is 1 minute or longer, preferably 10 minutes or longer, more preferably 30 minutes or longer. Further, the extraction process may be performed only once, but it is also effective to repeat the operations of mixing, standing, and separation a plurality of times.

In the purification method of the present embodiment, after the first extraction step, the solution phase containing the compound or the resin is further brought into contact with water to extract impurities in the compound or the resin (second extraction). Step). Specifically, for example, after performing the extraction treatment using an acidic aqueous solution, the solution phase containing the compound and / or resin and solvent extracted and recovered from the aqueous solution is further subjected to extraction treatment with water. It is preferable. The extraction treatment with water is not particularly limited, but can be performed, for example, by thoroughly mixing the solution phase and water by stirring or the like and then allowing the obtained mixed solution to stand. Since the mixed solution after standing is separated into a solution phase containing a compound and / or a resin and a solvent and an aqueous phase, the solution phase can be recovered by decantation or the like.

Further, the water used here is preferably water having a low metal content, for example, ion-exchanged water, in accordance with the purpose of the present embodiment. The extraction process may be performed only once, but it is also effective to repeat the operations of mixing, standing, and separation a plurality of times. Further, the use ratio of both in the extraction process, conditions such as temperature and time are not particularly limited, but they may be the same as in the case of the contact process with the acidic aqueous solution.

The water that can be mixed into the solution containing the compound and / or resin and solvent thus obtained can be easily removed by performing an operation such as vacuum distillation. Moreover, a solvent can be added to the said solution as needed, and the density | concentration of a compound and / or resin can be adjusted to arbitrary density | concentrations.

The method for isolating the compound and / or resin from the solution containing the obtained compound and / or resin and solvent is not particularly limited, and known methods such as removal under reduced pressure, separation by reprecipitation, and combinations thereof. Can be done. If necessary, known processes such as a concentration operation, a filtration operation, a centrifugal separation operation, and a drying operation can be performed.

[Film-forming composition for lithography]
The film-forming composition for lithography in the present embodiment includes a compound represented by the formula (1), a resin obtained using the compound represented by the formula (1) as a monomer, and a compound represented by the formula (2) And at least one selected from the group consisting of resins obtained by using the compound represented by the formula (2) as a monomer.

[Film-forming composition for lithography for chemically amplified resist applications]
The film forming composition for lithography for chemical amplification resist application in the present embodiment (hereinafter also referred to as “resist composition”) is represented by the compound represented by the formula (1) and the formula (1). One or more selected from the group consisting of a resin obtained using a compound as a monomer, a compound represented by the formula (2), and a resin obtained using the compound represented by the formula (2) as a monomer as a resist base material contains.

Further, the resist composition in the present embodiment preferably contains a solvent. Examples of the solvent include, but are not limited to, ethylene glycol monoalkyl ether acetates such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol mono-n-propyl ether acetate, and ethylene glycol mono-n-butyl ether acetate. Ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monoethyl ether acetate, propylene glycol mono-n-propyl ether acetate, propylene glycol mono -Propylene glycol such as n-butyl ether acetate Cole monoalkyl ether acetates; propylene glycol monoalkyl ethers such as propylene glycol monomethyl ether (PGME) and propylene glycol monoethyl ether; methyl lactate, ethyl lactate, n-propyl lactate, n-butyl lactate, n-amyl lactate, etc. Lactate esters; aliphatic carboxylic acid esters such as methyl acetate, ethyl acetate, n-propyl acetate, n-butyl acetate, n-amyl acetate, n-hexyl acetate, methyl propionate, ethyl propionate; Methyl propionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 3-methoxy-2-methylpropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyrate Other esters such as acetate, butyl 3-methoxy-3-methylpropionate, butyl 3-methoxy-3-methylbutyrate, methyl acetoacetate, methyl pyruvate and ethyl pyruvate; aromatic hydrocarbons such as toluene and xylene Ketones such as 2-heptanone, 3-heptanone, 4-heptanone, cyclopentanone (CPN), cyclohexanone (CHN); N, N-dimethylformamide, N-methylacetamide, N, N-dimethylacetamide, N -Amides such as methylpyrrolidone; lactones such as γ-lactone can be mentioned, but there is no particular limitation. These solvents may be used alone or in combination of two or more.

The solvent used in this embodiment is preferably a safe solvent, more preferably at least one selected from PGMEA, PGME, CHN, CPN, 2-heptanone, anisole, butyl acetate, ethyl propionate and ethyl lactate. A seed, more preferably at least one selected from PGMEA, PGME and CHN.

In this embodiment, the amount of the solid component and the amount of the solvent are not particularly limited, but 1 to 80% by weight of the solid component and 20 to 99% of the solvent with respect to 100% by weight of the total amount of the solid component and the solvent. The solid component is preferably 1 to 50% by mass, more preferably 1 to 50% by mass of the solid component and 50 to 99% by mass of the solvent, further preferably 2 to 40% by mass of the solid component and 60 to 98% by mass of the solvent, and particularly preferably solid The component is 2 to 10% by mass and the solvent is 90 to 98% by mass.

The resist composition of this embodiment is at least one selected from the group consisting of an acid generator (C), a crosslinking agent (G), an acid diffusion controller (E), and other components (F) as other solid components. It may contain. In the present specification, “solid component” refers to a component other than a solvent.

Here, as the acid generator (C), the crosslinking agent (G), the acid diffusion controller (E) and other components (F), known ones can be used, and are not particularly limited. Those described in Japanese Patent No. / 024778 are preferable.

[Combination ratio of each component]
In the resist composition of the present embodiment, the content of the compound and / or resin used as the resist base material is not particularly limited, but the total mass of the solid component (resist base material, acid generator (C), crosslinking agent (G ), Acid diffusion controller (E) and other components (F) and the like, and the total amount of solid components including the optionally used components, the same shall apply hereinafter)). The amount is preferably 55 to 90% by mass, more preferably 60 to 80% by mass, and particularly preferably 60 to 70% by mass. When the content of the compound and / or resin used as the resist base is in the above range, the resolution is further improved and the line edge roughness (LER) tends to be further reduced.
In addition, when containing both a compound and resin as a resist base material, the said content is the total amount of both components.

[Other components (F)]
The resist composition according to the present embodiment includes a resist substrate, an acid generator (C), a cross-linking agent (G), and an acid diffusion controller (E) as necessary, as long as the object of the present invention is not impaired. As a component, a dissolution accelerator, a dissolution control agent, a sensitizer, a surfactant, an organic carboxylic acid or an oxo acid of phosphorus or a derivative thereof, a thermal and / or photocuring catalyst, a polymerization inhibitor, a flame retardant, a filler Coupling agents, thermosetting resins, photocurable resins, dyes, pigments, thickeners, lubricants, antifoaming agents, leveling agents, UV absorbers, surfactants, colorants, nonionic surfactants, etc. One or more additives can be added. In addition, in this specification, another component (F) may be called arbitrary component (F).

In the resist composition of this embodiment, a resist base material (hereinafter also referred to as “component (A)”), an acid generator (C), a crosslinking agent (G), an acid diffusion controller (E), an optional component ( The content of F) (component (A) / acid generator (C) / crosslinking agent (G) / acid diffusion controller (E) / optional component (F)) is mass% based on solids,
Preferably 50 to 99.4 / 0.001 to 49 / 0.5 to 49 / 0.001 to 49/0 to 49,
More preferably 55 to 90/1 to 40 / 0.5 to 40 / 0.01 to 10/0 to 5,
More preferably 60 to 80/3 to 30/1 to 30 / 0.01 to 5/0 to 1,
Particularly preferred is 60 to 70/10 to 25/2 to 20 / 0.01 to 3/0.
The blending ratio of each component is selected from each range so that the sum is 100% by mass. When the blending ratio of each component is within the above range, the performance such as sensitivity, resolution, developability and the like tends to be excellent.

The resist composition of this embodiment is usually prepared by dissolving each component in a solvent at the time of use to make a uniform solution, and then filtering with a filter having a pore size of about 0.2 μm, for example, as necessary. The

The resist composition of the present embodiment can contain other resins other than the resin of the present embodiment as long as the object of the present invention is not impaired. Other resins are not particularly limited. For example, novolak resins, polyvinylphenols, polyacrylic acid, polyvinyl alcohol, styrene-maleic anhydride resins, and acrylic acid, vinyl alcohol, or vinylphenol as monomer units. Examples thereof include polymers or derivatives thereof. The content of other resins is not particularly limited and is appropriately adjusted according to the type of component (A) to be used, but is preferably 30 parts by mass or less with respect to 100 parts by mass of component (A). More preferably, it is 10 mass parts or less, More preferably, it is 5 mass parts or less, Most preferably, it is 0 mass part.

[Physical properties of resist composition]
An amorphous film can be formed by spin coating using the resist composition of the present embodiment. Moreover, the resist composition of this embodiment can be applied to a general semiconductor manufacturing process. Depending on the compound represented by the above formula (1) and / or formula (2), the type of resin obtained using these as monomers and / or the type of developer used, either a positive resist pattern or a negative resist pattern is used. Can be made separately.

In the case of a positive resist pattern, the dissolution rate of the amorphous film formed by spin-coating the resist composition of the present embodiment with respect to the developer at 23 ° C. is preferably 5 Å / sec or less, and 0.05 to 5 Å / It is more preferable that it is sec, and it is more preferable that it is 0.0005 to 5 cm / sec. When the dissolution rate is 5 kg / sec or less, the resist is insoluble in the developer and tends to be easily formed as a resist. Further, when the dissolution rate is 0.0005 K / sec or more, the resolution may be improved. This is due to the change in the solubility of the compound represented by the above formulas (1) and (2) and / or the resin containing the compound as a constituent component before and after the exposure, and in the developer, It is presumed that the contrast at the interface with the unexposed portion that does not dissolve increases. In addition, LER reduction and defect reduction effects are also seen.

In the case of a negative resist pattern, the dissolution rate of the amorphous film formed by spin-coating the resist composition of the present embodiment in a developing solution at 23 ° C. is preferably 10 Å / sec or more. When the dissolution rate is 10 kg / sec or more, it is easily dissolved in a developer and suitable for a resist. In addition, when the dissolution rate is 10 Å / sec or more, the resolution may be improved. This is presumably because the compound represented by the above formulas (1) and (2) and / or the micro surface portion of the resin containing the compound as a constituent component dissolves and LER is reduced. Defect reduction effect is also seen.

The dissolution rate can be determined by immersing an amorphous film in a developer for a predetermined time at 23 ° C., and measuring the film thickness before and after the immersion by a known method such as visual observation, an ellipsometer, or a QCM method. .

In the case of a positive resist pattern, a portion exposed to radiation such as KrF excimer laser, extreme ultraviolet light, electron beam or X-ray of an amorphous film formed by spin-coating the resist composition of this embodiment is applied to a developer at 23 ° C. The dissolution rate is preferably 10 Å / sec or more. When the dissolution rate is 10 kg / sec or more, it is easily dissolved in a developer and suitable for a resist. In addition, when the dissolution rate is 10 Å / sec or more, the resolution may be improved. This is presumably because the compound represented by the above formulas (1) and (2) and / or the micro surface portion of the resin containing the compound as a constituent component dissolves and LER is reduced. Defect reduction effect is also seen.

In the case of a negative resist pattern, the amorphous film formed by spin-coating the resist composition of this embodiment is exposed to a developing solution at 23 ° C. at a portion exposed by radiation such as KrF excimer laser, extreme ultraviolet light, electron beam or X-ray. The dissolution rate is preferably 5 kg / sec or less, more preferably 0.05 to 5 kg / sec, and further preferably 0.0005 to 5 kg / sec. When the dissolution rate is 5 kg / sec or less, the resist is insoluble in the developer and tends to be easily formed as a resist. Further, when the dissolution rate is 0.0005 K / sec or more, the resolution may be improved. This is because an unexposed portion that dissolves in a developer due to a change in solubility before and after exposure of the compound represented by the above formulas (1) and (2) and / or a resin containing the compound as a constituent component, and a developer This is presumably because the contrast at the interface with the exposed portion that does not dissolve in the substrate increases. In addition, LER reduction and defect reduction effects are also seen.

[Film-forming composition for lithography for non-chemically amplified resist applications]
The component (A) contained in the film forming composition for lithography for non-chemically amplified resist application of the present embodiment (hereinafter also referred to as “radiation sensitive composition”) is a diazonaphthoquinone photoactive compound (B) described later. In addition, a positive resist base material that is easily soluble in a developer by irradiating g-line, h-line, i-line, KrF excimer laser, ArF excimer laser, extreme ultraviolet light, electron beam or X-ray. Useful as. G-line, h-line, i-line, KrF excimer laser, ArF excimer laser, extreme ultraviolet light, electron beam or X-ray does not change the property of component (A) greatly, but diazonaphthoquinone photoactivity is hardly soluble in the developer. Since the compound (B) changes to a readily soluble compound, a resist pattern can be formed by a development process.

Since the component (A) contained in the radiation-sensitive composition of the present embodiment is a compound having a relatively low molecular weight, the roughness of the resulting resist pattern is very small. In the formula (1), at least one selected from the group consisting of R ⁰ to R ⁵ is preferably a group containing an iodine atom. In the formula (2), R ^0A , R ^1A and It is preferable that at least one selected from the group consisting of R ^2A is a group containing an iodine atom. When the component (A) having a group containing an iodine atom, which is such a preferable aspect, is applied to the radiation-sensitive composition of the present embodiment, it is resistant to radiation such as electron beams, extreme ultraviolet rays (EUV), and X-rays. It is preferable because the absorption capacity can be increased and, as a result, the sensitivity can be increased.

The glass transition temperature of the component (A) contained in the radiation-sensitive composition of the present embodiment is preferably 100 ° C. or higher, more preferably 120 ° C. or higher, further preferably 140 ° C. or higher, and particularly preferably 150 ° C. or higher. . Although the upper limit of the glass transition temperature of a component (A) is not specifically limited, For example, it is 400 degreeC. When the glass transition temperature of the component (A) is within the above range, the semiconductor lithography process has heat resistance capable of maintaining the pattern shape and tends to improve performance such as high resolution.

The crystallization calorific value obtained by differential scanning calorimetric analysis of the glass transition temperature of the component (A) contained in the radiation-sensitive composition of the present embodiment is preferably less than 20 J / g. The (crystallization temperature) − (glass transition temperature) is preferably 70 ° C. or higher, more preferably 80 ° C. or higher, still more preferably 100 ° C. or higher, and particularly preferably 130 ° C. or higher. When the crystallization heat generation amount is less than 20 J / g, or (crystallization temperature) − (glass transition temperature) is in the above range, an amorphous film can be easily formed by spin-coating the radiation-sensitive composition, and the resist Therefore, it is likely that the film forming property required for the above can be maintained for a long period of time and the resolution can be improved.

In this embodiment, the crystallization heat generation amount, the crystallization temperature, and the glass transition temperature can be obtained by differential scanning calorimetry using DSC / TA-50WS manufactured by Shimadzu Corporation. About 10 mg of a sample is put into an aluminum non-sealed container and heated to a melting point or higher at a temperature rising rate of 20 ° C./min in a nitrogen gas stream (50 mL / min). After the rapid cooling, the temperature is raised again to the melting point or higher at a temperature rising rate of 20 ° C./min in a nitrogen gas stream (30 mL / min). Further, after rapid cooling, the temperature is increased again to 400 ° C. at a rate of temperature increase of 20 ° C./min in a nitrogen gas stream (30 mL / min). The temperature at the midpoint of the step difference of the baseline that has changed in a step shape (where the specific heat has changed to half) is the glass transition temperature (Tg), and the temperature of the exothermic peak that appears thereafter is the crystallization temperature. The calorific value is obtained from the area of the region surrounded by the exothermic peak and the baseline, and is defined as the crystallization calorific value.

The component (A) contained in the radiation-sensitive composition of the present embodiment is 100 or less, preferably 120 ° C. or less, more preferably 130 ° C. or less, further preferably 140 ° C. or less, and particularly preferably 150 ° C. or less under normal pressure. It is preferable that sublimability is low. Low sublimation means that, in thermogravimetric analysis, the weight loss when held at a predetermined temperature for 10 minutes is 10% or less, preferably 5% or less, more preferably 3% or less, even more preferably 1% or less, particularly preferably Indicates 0.1% or less. Since the sublimation property is low, it is possible to prevent exposure apparatus from being contaminated by outgas during exposure. In addition, a good pattern shape can be obtained with low roughness.

Component (A) contained in the radiation-sensitive composition of the present embodiment is propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl ether (PGME), cyclohexanone (CHN), cyclopentanone (CPN), 2-heptanone Selected from the group consisting of anisole, butyl acetate, ethyl propionate and ethyl lactate and exhibiting the highest solubility in component (A) at 23 ° C., preferably 1% by mass or more, more preferably Dissolves in an amount of 5% by mass or more, more preferably 10% by mass or more. Particularly preferably, it is selected from the group consisting of PGMEA, PGME, and CHN, and (A) a solvent that exhibits the highest solubility in the resist base material, at 23 ° C., 20% by mass or more, and particularly preferably PGMEA On the other hand, 20 mass% or more dissolves at 23 ° C. By satisfying the above conditions, the use in the semiconductor manufacturing process in actual production becomes easy.

[Diazonaphthoquinone Photoactive Compound (B)]
The diazonaphthoquinone photoactive compound (B) contained in the radiation-sensitive composition of the present embodiment is a diazonaphthoquinone substance containing a polymeric and non-polymeric diazonaphthoquinone photoactive compound. Generally, in a positive resist composition, As long as it is used as a photosensitive component (photosensitive agent), one or more kinds can be arbitrarily selected and used without any particular limitation.

Component (B) is a compound obtained by reacting naphthoquinone diazide sulfonic acid chloride, benzoquinone diazide sulfonic acid chloride, etc., with a low molecular compound or polymer compound having a functional group capable of condensation reaction with these acid chlorides. Is preferred. Here, the functional group capable of condensing with acid chloride is not particularly limited, and examples thereof include a hydroxyl group and an amino group, and a hydroxyl group is particularly preferable. The compound that can be condensed with an acid chloride containing a hydroxyl group is not particularly limited, and examples thereof include hydroquinone, resorcin, 2,4-dihydroxybenzophenone, 2,3,4-trihydroxybenzophenone, 2,4,6-trihydroxybenzophenone. 2,4,4'-trihydroxybenzophenone, 2,3,4,4'-tetrahydroxybenzophenone, 2,2 ', 4,4'-tetrahydroxybenzophenone, 2,2', 3,4,6 ' Hydroxybenzophenones such as pentahydroxybenzophenone; hydroxyphenylalkanes such as bis (2,4-dihydroxyphenyl) methane, bis (2,3,4-trihydroxyphenyl) methane, bis (2,4-dihydroxyphenyl) propane 4, 4 ′, 3 ″, 4 ″ -tetrahydroxy-3, 5, Hydroxytriphenylmethane such as 3 ′, 5′-tetramethyltriphenylmethane, 4, 4 ′, 2 ″, 3 ″, 4 ″ -pentahydroxy-3, 5, 3 ′, 5′-tetramethyltriphenylmethane And the like.
Examples of acid chlorides such as naphthoquinone diazide sulfonic acid chloride and benzoquinone diazide sulfonic acid chloride include 1,2-naphthoquinone diazide-5-sulfonyl chloride, 1,2-naphthoquinone diazide-4-sulfonyl chloride, and the like. Can be mentioned.

The radiation-sensitive composition of the present embodiment is prepared by, for example, dissolving each component in a solvent at the time of use to obtain a uniform solution, and then filtering by, for example, a filter having a pore size of about 0.2 μm as necessary. It is preferred that

[Characteristics of radiation-sensitive composition]
An amorphous film can be formed by spin coating using the radiation-sensitive composition of the present embodiment. Moreover, the radiation sensitive composition of this embodiment can be applied to a general semiconductor manufacturing process. Depending on the type of developer used, either a positive resist pattern or a negative resist pattern can be created.

In the case of a positive resist pattern, the dissolution rate of the amorphous film formed by spin-coating the radiation-sensitive composition of this embodiment at 23 ° C. with respect to the developing solution is preferably 5 Å / sec or less, and 0.05 to More preferably, it is 5 Å / sec, and further preferably 0.0005 to 5 Å / sec. When the dissolution rate is 5 kg / sec or less, the resist is insoluble in the developer and tends to be easily formed as a resist. Further, when the dissolution rate is 0.0005 K / sec or more, the resolution may be improved. This is due to the change in the solubility of the compound represented by the above formulas (1) and (2) and / or the resin containing the compound as a constituent component before and after the exposure, and in the developer, It is presumed that the contrast at the interface with the unexposed portion that does not dissolve increases. In addition, LER reduction and defect reduction effects are also seen.

In the case of a negative resist pattern, the dissolution rate of the amorphous film formed by spin-coating the radiation-sensitive composition of the present embodiment in a developer at 23 ° C. is preferably 10 Å / sec or more. When the dissolution rate is 10 kg / sec or more, it is easily dissolved in a developer and suitable for a resist. In addition, when the dissolution rate is 10 Å / sec or more, the resolution may be improved. This is presumably because the compound represented by the above formulas (1) and (2) and / or the micro surface portion of the resin containing the compound as a constituent component dissolves and LER is reduced. Defect reduction effect is also seen.

In the case of a positive resist pattern, the amorphous film formed by spin-coating the radiation-sensitive composition of this embodiment is irradiated with radiation such as KrF excimer laser, extreme ultraviolet light, electron beam or X-ray, or 20 to The dissolution rate of the exposed portion after heating at 500 ° C. in the developer at 23 ° C. is preferably 10 Å / sec or more, more preferably 10 to 10000 Å / sec, and even more preferably 100 to 1000 Å / sec. When the dissolution rate is 10 kg / sec or more, it is easily dissolved in a developer and suitable for a resist. In addition, when the dissolution rate is 10,000 kg / sec or less, the resolution may be improved. This is presumably because the compound represented by the above formulas (1) and (2) and / or the micro surface portion of the resin containing the compound as a constituent component dissolves and LER is reduced. Defect reduction effect is also seen.

In the case of a negative resist pattern, the amorphous film formed by spin-coating the radiation-sensitive composition of the present embodiment is irradiated with radiation such as KrF excimer laser, extreme ultraviolet light, electron beam or X-ray, or 20 to The dissolution rate of the exposed portion after heating at 500 ° C. with respect to the developer at 23 ° C. is preferably 5 K / sec or less, more preferably from 0.05 to 5 K / sec, more preferably from 0.0005 to More preferably, it is 5 kg / sec. When the dissolution rate is 5 kg / sec or less, the resist is insoluble in the developer and tends to be easily formed as a resist. Further, when the dissolution rate is 0.0005 K / sec or more, the resolution may be improved. This is because an unexposed portion that dissolves in a developer due to a change in solubility before and after exposure of the compound represented by the above formulas (1) and (2) and / or a resin containing the compound as a constituent component, and a developer This is presumably because the contrast at the interface with the exposed portion that does not dissolve in the substrate increases. In addition, LER reduction and defect reduction effects are also seen.

[Combination ratio of each component]
In the radiation-sensitive composition of the present embodiment, the content of the component (A) is arbitrarily selected from the total weight of the solid component (component (A), diazonaphthoquinone photoactive compound (B), and other components (D)). The total of the solid components to be used, the same shall apply hereinafter) is preferably 1 to 99% by mass, more preferably 5 to 95% by mass, still more preferably 10 to 90% by mass, and particularly preferably 25 to 75% by mass. %. When the content of the component (A) is within the above range, the radiation-sensitive composition of the present embodiment tends to obtain a pattern with high sensitivity and small roughness.

In the radiation-sensitive composition of the present embodiment, the content of the diazonaphthoquinone photoactive compound (B) is the total weight of the solid component (component (A), diazonaphthoquinone photoactive compound (B) and other components (D), etc.) The total of solid components optionally used in the following, the same shall apply hereinafter) is preferably 1 to 99% by mass, more preferably 5 to 95% by mass, still more preferably 10 to 90% by mass, and particularly preferably. 25 to 75% by mass. When the content of the diazonaphthoquinone photoactive compound (B) is within the above range, the radiation-sensitive composition of the present embodiment tends to obtain a highly sensitive and small roughness pattern.

[Other components (D)]
In the radiation-sensitive composition of the present embodiment, an acid generator, a cross-linkage, and a component other than the component (A) and the diazonaphthoquinone photoactive compound (B) are included as necessary, as long as the object of the present invention is not impaired. Agent, acid diffusion control agent, dissolution accelerator, dissolution control agent, sensitizer, surfactant, organic carboxylic acid or phosphorus oxo acid or derivative thereof, heat and / or photocuring catalyst, polymerization inhibitor, flame retardant, Fillers, coupling agents, thermosetting resins, photocurable resins, dyes, pigments, thickeners, lubricants, antifoaming agents, leveling agents, UV absorbers, surfactants, colorants, nonionic surfactants 1 type, or 2 or more types can be added. In addition, in this specification, another component (D) may be called arbitrary component (D).

In the radiation-sensitive composition of the present embodiment, the blending ratio of each component (component (A) / diazonaphthoquinone photoactive compound (B) / arbitrary component (D)) is mass% based on the solid component,
Preferably 1 to 99/99 to 1/0 to 98,
More preferably 5 to 95/95 to 5/0 to 49,
More preferably, 10 to 90/90 to 10/0 to 10,
Even more preferably, 20-80 / 80-20 / 0-5,
Particularly preferred is 25 to 75/75 to 25/0.
The blending ratio of each component is selected from each range so that the sum is 100% by mass. When the blending ratio of each component of the radiation-sensitive composition of the present embodiment is in the above range, it tends to be excellent in performance such as sensitivity and resolution in addition to roughness.

The radiation-sensitive composition of the present embodiment may contain other resins other than the present embodiment as long as the object of the present invention is not impaired. Examples of such other resins include novolak resins, polyvinylphenols, polyacrylic acid, polyvinyl alcohol, styrene-maleic anhydride resins, and polymers containing acrylic acid, vinyl alcohol, or vinyl phenol as monomer units or These derivatives are mentioned. The blending amount of these resins is appropriately adjusted according to the type of component (A) used, but is preferably 30 parts by mass or less, more preferably 10 parts per 100 parts by mass of component (A). It is not more than part by mass, more preferably not more than 5 parts by mass, particularly preferably 0 part by mass.

[Method of forming resist pattern]
In the present embodiment, a resist pattern is formed by forming a photoresist layer on a substrate using the resist composition or radiation-sensitive composition of the present embodiment described above, and then applying radiation to a predetermined region of the photoresist layer. And developing.
More specifically, a step of forming a resist film on a substrate using the resist composition or radiation-sensitive composition of the present embodiment described above, a step of exposing the formed resist film, and developing the resist film And a step of forming a resist pattern. The resist pattern in this embodiment can also be formed as an upper layer resist in a multilayer process.

The method for forming the resist pattern is not particularly limited, and examples thereof include the following methods. First, a resist film is formed by applying a resist composition or a radiation sensitive composition on a conventionally known substrate by a coating means such as spin coating, cast coating, roll coating or the like. The conventionally known substrate is not particularly limited, and examples thereof include a substrate for electronic components and a substrate on which a predetermined wiring pattern is formed. More specifically, a silicon substrate, a metal substrate such as copper, chromium, iron, and aluminum, a glass substrate, and the like can be given. Examples of the wiring pattern material include copper, aluminum, nickel, and gold. Further, if necessary, an inorganic and / or organic film may be provided on the substrate. An inorganic antireflection film (inorganic BARC) is an example of the inorganic film. Examples of the organic film include an organic antireflection film (organic BARC). Surface treatment with hexamethylene disilazane or the like may be performed on the substrate.

Next, if necessary, the substrate coated with the resist composition or radiation-sensitive composition is heated. The heating conditions vary depending on the composition of the resist composition or the radiation-sensitive composition, but are preferably 20 to 250 ° C, more preferably 20 to 150 ° C. Heating is preferred because the adhesion of the resist to the substrate tends to be improved. Next, the resist film is exposed to a desired pattern with any radiation selected from the group consisting of visible light, ultraviolet light, excimer laser, electron beam, extreme ultraviolet light (EUV), X-ray, and ion beam. The exposure conditions and the like are appropriately selected according to the composition of the resist composition or the radiation sensitive composition. In the present embodiment, it is preferable to heat after radiation irradiation in order to stably form a high-precision fine pattern in exposure. The heating conditions vary depending on the composition of the resist composition or the radiation-sensitive composition, but are preferably 20 to 250 ° C, more preferably 20 to 150 ° C.

Next, a predetermined resist pattern is formed by developing the exposed resist film with a developer. As the developer, a solubility parameter (SP value) for the compound obtained by using the compound represented by the formula (1) or (2) or the compound represented by the formula (1) or (2) as a monomer is used. It is preferable to select a solvent close to), and polar solvents such as ketone solvents, ester solvents, alcohol solvents, amide solvents, ether solvents, etc., hydrocarbon solvents or alkaline aqueous solutions can be used.

Examples of the ketone solvent include 1-octanone, 2-octanone, 1-nonanone, 2-nonanone, acetone, 4-heptanone, 1-hexanone, 2-hexanone, diisobutyl ketone, cyclohexanone, methylcyclohexanone, phenylacetone, methyl ethyl ketone. Methyl isobutyl ketone, acetyl acetone, acetonyl acetone, ionone, diacetyl alcohol, acetyl carbinol, acetophenone, methyl naphthyl ketone, isophorone, propylene carbonate and the like.

Examples of ester solvents include methyl acetate, butyl acetate, ethyl acetate, isopropyl acetate, amyl acetate, propylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl-3 -Ethoxypropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, methyl formate, ethyl formate, butyl formate, propyl formate, ethyl lactate, butyl lactate, propyl lactate and the like.

Examples of the alcohol solvent include methyl alcohol, ethyl alcohol, n-propyl alcohol, isopropyl alcohol (2-propanol), n-butyl alcohol, sec-butyl alcohol, tert-butyl alcohol, isobutyl alcohol, n-hexyl alcohol, Alcohols such as 4-methyl-2-pentanol, n-heptyl alcohol, n-octyl alcohol, n-decanol, glycol solvents such as ethylene glycol, diethylene glycol, triethylene glycol, ethylene glycol monomethyl ether, propylene glycol monomethyl Ether, ethylene glycol monoethyl ether, propylene glycol monoethyl ether, diethylene glycol monomethyl ether, triethylene Glycol monoethyl ether, glycol monoethyl ether and methoxymethyl butanol.

Examples of the ether solvent include dioxane, tetrahydrofuran and the like in addition to the glycol ether solvent.

Examples of amide solvents include N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, hexamethylphosphoric triamide, 1,3-dimethyl-2-imidazolidinone and the like. Can be mentioned.

Examples of the hydrocarbon solvent include aromatic hydrocarbon solvents such as toluene and xylene, and aliphatic hydrocarbon solvents such as pentane, hexane, octane and decane.

A plurality of the above-mentioned solvents may be mixed, or may be used by mixing with a solvent other than the above or water within the range having performance. However, from the viewpoint that the effects of the present invention are sufficiently achieved, the water content of the developer as a whole is preferably less than 70% by mass, more preferably less than 50% by mass, and less than 30% by mass. More preferably, it is still more preferable that it is less than 10 mass%, and it is especially preferable not to contain water | moisture content substantially. That is, the content of the organic solvent with respect to the developer is preferably 30% by mass or more and 100% by mass or less, more preferably 50% by mass or more and 100% by mass or less, based on the total amount of the developer. It is more preferable that the content is from 100% by mass to 100% by mass, even more preferable from 90% by mass to 100% by mass, and particularly preferable from 95% by mass to 100% by mass.

Examples of the alkaline aqueous solution include alkaline compounds such as mono-, di- or trialkylamines, mono-, di- or trialkanolamines, heterocyclic amines, tetramethylammonium hydroxide (TMAH), and choline. Can be mentioned.

In particular, the developer is at least selected from a ketone solvent, an ester solvent, an alcohol solvent, an amide solvent, and an ether solvent from the viewpoint of improving resist performance such as resist pattern resolution and roughness. A developer containing one solvent is preferred.

The vapor pressure of the developer is preferably 5 kPa or less, more preferably 3 kPa or less, and even more preferably 2 kPa or less at 20 ° C. When the vapor pressure of the developing solution is 5 kPa or less, evaporation of the developing solution on the substrate or in the developing cup is suppressed, temperature uniformity in the wafer surface is improved, and as a result, dimensional uniformity in the wafer surface is good. It tends to become.

Examples of specific developers having a vapor pressure of 5 kPa or less at 20 ° C. include 1-octanone, 2-octanone, 1-nonanone, 2-nonanone, 4-heptanone, 2-hexanone, diisobutylketone, cyclohexanone, methyl Ketone solvents such as cyclohexanone, phenylacetone, methyl isobutyl ketone; butyl acetate, amyl acetate, propylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl-3-ethoxypro Pionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, butyl formate, propyl formate, ethyl lactate, butyl lactate, milk Ester solvents such as propyl; n-propyl alcohol, isopropyl alcohol, n-butyl alcohol, sec-butyl alcohol, tert-butyl alcohol, isobutyl alcohol, n-hexyl alcohol, 4-methyl-2-pentanol, n-heptyl Alcohol solvents such as alcohol, n-octyl alcohol and n-decanol; glycol solvents such as ethylene glycol, diethylene glycol and triethylene glycol; ethylene glycol monomethyl ether, propylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monoethyl Ether, diethylene glycol monomethyl ether, triethylene glycol monoethyl ether, methoxymethylbutanol, etc. Recall ether solvents; ether solvents such as tetrahydrofuran; N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide amide solvents; toluene, xylene and other aromatic hydrocarbon solvents; Aliphatic hydrocarbon solvents such as octane and decane are listed.

Examples of specific developers having a vapor pressure of 2 kPa or less at 20 ° C. include 1-octanone, 2-octanone, 1-nonanone, 2-nonanone, 4-heptanone, 2-hexanone, diisobutylketone, cyclohexanone, methyl Ketone solvents such as cyclohexanone and phenylacetone; butyl acetate, amyl acetate, propylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl-3-ethoxypropionate, 3 -Ester solvents such as methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, ethyl lactate, butyl lactate, propyl lactate; n-butyl alcohol alcohol solvents such as sec-butyl alcohol, tert-butyl alcohol, isobutyl alcohol, n-hexyl alcohol, 4-methyl-2-pentanol, n-heptyl alcohol, n-octyl alcohol, n-decanol; ethylene glycol, diethylene glycol Glycol solvents such as triethylene glycol; glycol ethers such as ethylene glycol monomethyl ether, propylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monoethyl ether, diethylene glycol monomethyl ether, triethylene glycol monoethyl ether, methoxymethyl butanol Solvents: N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethyl Formamide amide solvents, aromatic hydrocarbon solvents such as xylene; octane include aliphatic hydrocarbon solvents decane.

An appropriate amount of a surfactant can be added to the developer as necessary. The surfactant is not particularly limited, and for example, ionic or nonionic fluorine-based and / or silicon-based surfactants can be used. Examples of these fluorine and / or silicon surfactants include, for example, JP-A-62-36663, JP-A-61-226746, JP-A-61-226745, JP-A-62-170950. JP-A-63-334540, JP-A-7-230165, JP-A-8-62834, JP-A-9-54432, JP-A-9-5988, US Pat. No. 5,405,720 No. 5,360,692, No. 5,529,881, No. 5,296,330, No. 5,543,098, No. 5,576,143, No. 5,294,511, No. 5,824,451. Preferably, it is a nonionic surfactant. Although it does not specifically limit as a nonionic surfactant, Preferably, they are a fluorine-type surfactant or a silicon-type surfactant.

The amount of the surfactant used is usually 0.001 to 5% by mass, preferably 0.005 to 2% by mass, and more preferably 0.01 to 0.5% by mass with respect to the total amount of the developer.

As a development method, for example, a method in which a substrate is immersed in a tank filled with a developer for a certain period of time (dip method), a method in which the developer is raised on the surface of the substrate by surface tension and is left stationary for a certain time (paddle) Method), a method of spraying the developer on the substrate surface (spray method), a method of continuously applying the developer while scanning the developer coating nozzle on the substrate rotating at a constant speed (dynamic dispensing method) ) Etc. can be applied. The time for developing the pattern is not particularly limited, but is preferably 10 seconds to 90 seconds.

In addition, after the step of developing, a step of stopping development may be performed while substituting with another solvent.

After the development, it is preferable to include a step of washing with a rinse solution containing an organic solvent.

The rinsing liquid used in the rinsing step after development is not particularly limited as long as the resist pattern cured by crosslinking is not dissolved, and a solution or water containing a general organic solvent can be used. As the rinsing liquid, it is preferable to use a rinsing liquid containing at least one organic solvent selected from hydrocarbon solvents, ketone solvents, ester solvents, alcohol solvents, amide solvents and ether solvents. . More preferably, after the development, a cleaning step is performed using a rinse solution containing at least one organic solvent selected from the group consisting of ketone solvents, ester solvents, alcohol solvents, and amide solvents. Even more preferably, after the development, a washing step is performed using a rinse solution containing an alcohol solvent or an ester solvent. Even more preferably, after the development, a step of washing with a rinsing solution containing a monohydric alcohol is performed. Particularly preferably, after the development, a washing step is performed using a rinsing liquid containing a monohydric alcohol having 5 or more carbon atoms. The time for rinsing the pattern is not particularly limited, but is preferably 10 seconds to 90 seconds.

Here, examples of the monohydric alcohol used in the rinsing step after development include linear, branched, and cyclic monohydric alcohols, and specifically, 1-butanol, 2-butanol, 3-methyl- 1-butanol, tert-butyl alcohol, 1-pentanol, 2-pentanol, 1-hexanol, 4-methyl-2-pentanol, 1-heptanol, 1-octanol, 2-hexanol, cyclopentanol, 2- Heptanol, 2-octanol, 3-hexanol, 3-heptanol, 3-octanol, 4-octanol and the like can be used. Particularly preferable monohydric alcohols having 5 or more carbon atoms include 1-hexanol, 2-hexanol, 4 -Methyl-2-pentanol, 1-pentanol, 3-methyl-1-butanol, etc. It is.

A plurality of the above components may be mixed, or may be used by mixing with an organic solvent other than the above.

The water content in the rinsing liquid is preferably 10% by mass or less, more preferably 5% by mass or less, and further preferably 3% by mass or less. When the water content in the rinsing liquid is 10% by mass or less, better development characteristics tend to be obtained.

The vapor pressure of the rinsing liquid used after development is preferably 0.05 kPa or more and 5 kPa or less at 20 ° C., more preferably 0.1 kPa or more and 5 kPa or less, and 0.12 kPa or more and 3 kPa or less. Is more preferable. When the vapor pressure of the rinsing liquid is 0.05 kPa or more and 5 kPa or less, the temperature uniformity in the wafer surface is further improved, and further, the swelling due to the penetration of the rinsing liquid is further suppressed, and the dimension in the wafer surface is uniform. Tend to be better.

An appropriate amount of a surfactant can be added to the rinse solution.

In the rinsing step, the developed wafer is cleaned using a rinsing solution containing the organic solvent. The cleaning method is not particularly limited. For example, a method of continuously applying a rinsing liquid onto a substrate rotating at a constant speed (rotary coating method), or immersing the substrate in a bath filled with the rinsing liquid for a certain period of time. A method (dip method), a method of spraying a rinsing liquid onto the substrate surface (spray method), etc. can be applied. Among them, a cleaning process is performed by a spin coating method, and the substrate is rotated at a rotational speed of 2000 rpm to 4000 rpm after cleaning. It is preferable to remove the rinse liquid from the substrate.

After forming the resist pattern, the pattern wiring board is obtained by etching. The etching can be performed by a known method such as dry etching using plasma gas and wet etching using an alkali solution, a cupric chloride solution, a ferric chloride solution, or the like.

It is also possible to perform plating after forming the resist pattern. Examples of the plating method include copper plating, solder plating, nickel plating, and gold plating.

The residual resist pattern after etching can be stripped with an organic solvent. Examples of the organic solvent include PGMEA (propylene glycol monomethyl ether acetate), PGME (propylene glycol monomethyl ether), EL (ethyl lactate) and the like. Examples of the peeling method include a dipping method and a spray method. The wiring board on which the resist pattern is formed may be a multilayer wiring board or may have a small diameter through hole.

The wiring board in this embodiment can also be formed by a method of depositing a metal in a vacuum after forming a resist pattern and then dissolving the resist pattern with a solution, that is, a lift-off method.

[Film forming composition for lithography for underlayer film use]
In the present embodiment, a film forming composition for lithography for use in an underlayer film (hereinafter, also referred to as “underlayer film forming material”) includes a compound represented by the above formula (1) and a compound represented by the above formula (1) as a monomer. And at least one substance selected from the group consisting of a resin obtained using the compound represented by formula (2) and the compound represented by formula (2) as a monomer. In this embodiment, the substance is preferably 1 to 100% by mass, more preferably 10 to 100% by mass, and more preferably 50 to 100% by mass in the lower layer film-forming material from the viewpoints of coatability and quality stability. % Is more preferable, and 100% by mass is particularly preferable.

The underlayer film forming material of this embodiment can be applied to a wet process and has excellent heat resistance and etching resistance. Furthermore, since the lower layer film forming material of the present embodiment uses the above-mentioned substances, it is possible to form a lower layer film that suppresses deterioration of the film during high-temperature baking and has excellent etching resistance against oxygen plasma etching and the like. . Furthermore, since the lower layer film forming material of this embodiment is also excellent in adhesion to the resist layer, an excellent resist pattern can be obtained. In addition, the lower layer film forming material of the present embodiment may include a known lower layer film forming material for lithography and the like as long as the effects of the present invention are not impaired.

[solvent]
The lower layer film forming material in the present embodiment may contain a solvent. As a solvent used for the lower layer film forming material, a known one can be appropriately used as long as it can dissolve at least the above-described substances.

Specific examples of the solvent include, but are not limited to, ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; cellosolv solvents such as propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate; ethyl lactate and methyl acetate Ester solvents such as ethyl acetate, butyl acetate, isoamyl acetate, ethyl lactate, methyl methoxypropionate, methyl hydroxyisobutyrate; alcohol solvents such as methanol, ethanol, isopropanol, 1-ethoxy-2-propanol; toluene, xylene And aromatic hydrocarbons such as anisole. These solvents can be used alone or in combination of two or more.

Among the above solvents, cyclohexanone, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, ethyl lactate, methyl hydroxyisobutyrate and anisole are particularly preferable from the viewpoint of safety.

The content of the solvent is not particularly limited, but from the viewpoint of solubility and film formation, it is preferably 100 to 10,000 parts by mass with respect to 100 parts by mass of the lower layer film-forming material, and 200 to 5, The amount is more preferably 000 parts by mass, and even more preferably 200 to 1,000 parts by mass.

[Crosslinking agent]
The lower layer film-forming material in the present embodiment may contain a crosslinking agent as necessary from the viewpoint of suppressing intermixing. Although it does not specifically limit as a crosslinking agent, For example, what was described in the international publication 2013/024779 can be used.

Specific examples of the crosslinking agent that can be used in the present embodiment include, for example, phenol compounds, epoxy compounds, cyanate compounds, amino compounds, benzoxazine compounds, acrylate compounds, melamine compounds, guanamine compounds, glycoluril compounds, urea compounds, isocyanates. Examples thereof include, but are not limited to, compounds and azide compounds. These crosslinking agents can be used alone or in combination of two or more. Among these, a benzoxazine compound, an epoxy compound, or a cyanate compound is preferable, and a benzoxazine compound is more preferable from the viewpoint of improving etching resistance.

As the phenol compound, known compounds can be used. Examples of phenols include phenols, alkylphenols such as cresols and xylenols, polyhydric phenols such as hydroquinone, polycyclic phenols such as naphthols and naphthalenediols, and bisphenols such as bisphenol A and bisphenol F. Or polyfunctional phenol compounds such as phenol novolac and phenol aralkyl resin. Among these, aralkyl type phenol resins are preferable from the viewpoint of heat resistance and solubility.

As the epoxy compound, known compounds can be used and selected from those having two or more epoxy groups in one molecule. For example, bisphenol A, bisphenol F, 3,3 ′, 5,5′-tetramethyl-bisphenol F, bisphenol S, fluorene bisphenol, 2,2 ′ -biphenol, 3,3 ′, 5,5′-tetramethyl- Epoxidized dihydric phenols such as 4,4'-dihydroxybiphenol, resorcin, naphthalenediols, tris- (4-hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane Tris (2,3-epoxypropyl) isocyanurate, trimethylol methane triglycidyl ether, trimethylol propane triglycidyl ether, triethylol ethane triglycidyl ether, phenol novolac, o-cresol novolac, etc. D Xylide, epoxidation of co-condensation resin of dicyclopentadiene and phenol, epoxidation of phenol aralkyl resin synthesized from phenol and paraxylylene dichloride, biphenyl synthesized from phenol and bischloromethylbiphenyl, etc. Examples thereof include epoxidized products of aralkyl type phenol resins, and epoxidized products of naphthol aralkyl resins synthesized from naphthols and paraxylylene dichloride. These epoxy resins may be used independently and may use 2 or more types together. Among these, from the viewpoint of heat resistance and solubility, a solid epoxy resin at room temperature such as an epoxy resin obtained from phenol aralkyl resins and biphenyl aralkyl resins is preferable.

The cyanate compound is not particularly limited as long as it is a compound having two or more cyanate groups in one molecule, and a known one can be used. In the present embodiment, as a preferred cyanate compound, one having a structure in which a hydroxyl group of a compound having two or more hydroxyl groups in one molecule is substituted with a cyanate group can be mentioned. Further, the cyanate compound preferably has an aromatic group, and a cyanate compound having a structure in which the cyanate group is directly connected to the aromatic group can be suitably used. Examples of such cyanate compounds include bisphenol A, bisphenol F, bisphenol M, bisphenol P, bisphenol E, phenol novolac resin, cresol novolac resin, dicyclopentadiene novolac resin, tetramethylbisphenol F, bisphenol A novolac resin, bromine. Bisphenol A, brominated phenol novolak resin, trifunctional phenol, tetrafunctional phenol, naphthalene type phenol, biphenyl type phenol, phenol aralkyl resin, biphenyl aralkyl resin, naphthol aralkyl resin, dicyclopentadiene aralkyl resin, alicyclic phenol, phosphorus The thing of the structure which substituted hydroxyl groups, such as containing phenol, by the cyanate group is mentioned. These cyanate compounds may be used alone or in combination of two or more. The cyanate compound described above may be in any form of a monomer, an oligomer, and a resin.

Examples of the amino compound include m-phenylenediamine, p-phenylenediamine, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylpropane, 4,4′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 3 , 3'-diaminodiphenyl ether, 4,4'-diaminodiphenyl sulfone, 3,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfide, 3,4'-diaminodiphenyl Sulfide, 3,3′-diaminodiphenyl sulfide, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene, 1,3-bis (3-aminopheno B) benzene, bis [4- (4-aminophenoxy) phenyl] sulfone, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [4- (3-aminophenoxy) Phenyl] propane, 4,4′-bis (4-aminophenoxy) biphenyl, 4,4′-bis (3-aminophenoxy) biphenyl, bis [4- (4-aminophenoxy) phenyl] ether, bis [4- (3-Aminophenoxy) phenyl] ether, 9,9-bis (4-aminophenyl) fluorene, 9,9-bis (4-amino-3-chlorophenyl) fluorene, 9,9-bis (4-amino-3) -Fluorophenyl) fluorene, O-tolidine, m-tolidine, 4,4'-diaminobenzanilide, 2,2'-bis (trifluoromethyl) -4 4'-aminobiphenyl, 4-aminophenyl-4-amino benzoate, 2- (4-aminophenyl) -6-amino-benzoxazole and the like. Further, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylpropane, 4,4′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 3,3′-diaminodiphenyl ether, 4,4′-diaminodiphenyl Sulfone, 3,3′-diaminodiphenylsulfone, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene, 1,3-bis (3-aminophenoxy) benzene, bis [4- (4-aminophenoxy) phenyl] sulfone, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [4- (3-Aminophenoxy) phenyl] propane, 4,4′-bis (4-aminopheno) A) Aromatic amines such as biphenyl, 4,4′-bis (3-aminophenoxy) biphenyl, bis [4- (4-aminophenoxy) phenyl] ether, bis [4- (3-aminophenoxy) phenyl] ether Diaminocyclohexane, diaminodicyclohexylmethane, dimethyl-diaminodicyclohexylmethane, tetramethyl-diaminodicyclohexylmethane, diaminodicyclohexylpropane, diaminobicyclo [2.2.1] heptane, bis (aminomethyl) -bicyclo [2.2.1]. ] Alicyclic amines such as heptane, 3 (4), 8 (9) -bis (aminomethyl) tricyclo [5.2.1.02,6] decane, 1,3-bisaminomethylcyclohexane, isophoronediamine , Ethylenediamine, hexamethylenediamine, Kuta diamine, decamethylene diamine, diethylene triamine, aliphatic amines such as triethylenetetramine, and the like.

Examples of the benzoxazine compound include Pd-type benzoxazine obtained from bifunctional diamines and monofunctional phenols, and Fa-type benzoxazine obtained from monofunctional diamines and bifunctional phenols. It is done.

Specific examples of the melamine compound include hexamethylol melamine, hexamethoxymethyl melamine, a compound in which 1 to 6 methylol groups of hexamethylol melamine are methoxymethylated or a mixture thereof, hexamethoxyethyl melamine, hexaacyloxymethyl. Examples thereof include compounds in which 1 to 6 methylol groups of melamine and hexamethylolmelamine are acyloxymethylated, or a mixture thereof.

Specific examples of the guanamine compound include, for example, tetramethylolguanamine, tetramethoxymethylguanamine, a compound in which 1 to 4 methylol groups of tetramethylolguanamine are methoxymethylated, or a mixture thereof, tetramethoxyethylguanamine, tetraacyloxyguanamine And compounds in which 1 to 4 methylol groups of tetramethylolguanamine are acyloxymethylated, or a mixture thereof.

Specific examples of the glycoluril compound include, for example, tetramethylol glycoluril, tetramethoxyglycoluril, tetramethoxymethylglycoluril, a compound in which 1 to 4 methylol groups of tetramethylolglycoluril are methoxymethylated, or a mixture thereof, Examples thereof include compounds in which 1 to 4 methylol groups of tetramethylol glycoluril are acyloxymethylated, or mixtures thereof.

Specific examples of the urea compound include tetramethylol urea, tetramethoxymethyl urea, a compound in which 1 to 4 methylol groups of tetramethylol urea are methoxymethylated or a mixture thereof, tetramethoxyethyl urea, and the like.

In this embodiment, a crosslinking agent having at least one allyl group may be used from the viewpoint of improving the crosslinkability. Specific examples of the crosslinking agent having at least one allyl group include 2,2-bis (3-allyl-4-hydroxyphenyl) propane, 1,1,1,3,3,3-hexafluoro-2,2 -Bis (3-allyl-4-hydroxyphenyl) propane, bis (3-allyl-4-hydroxyphenyl) sulfone, bis (3-allyl-4-hydroxyphenyl) sulfide, bis (3-allyl-4-hydroxyphenyl) ) Allylphenols such as ether, 2,2-bis (3-allyl-4-cyanatophenyl) propane, 1,1,1,3,3,3-hexafluoro-2,2-bis (3 -Allyl-4-cyanatophenyl) propane, bis (3-allyl-4-cyanatosiphenyl) sulfone, bis (3-allyl-4-cyanatophenyl) sulfide, bis (3- Examples include allyl cyanates such as (ryl-4-cyanatophenyl) ether, diallyl phthalate, diallyl isophthalate, diallyl terephthalate, triallyl isocyanurate, trimethylolpropane diallyl ether, pentaerythritol allyl ether, and the like. It is not limited to what was done. These may be used alone or as a mixture of two or more. Among these, 2,2-bis (3-allyl-4-hydroxyphenyl) propane, 1,1,1,3,3,3-hexafluoro-2,2-bis (3-allyl-4-hydroxyphenyl) Allylphenols such as propane, bis (3-allyl-4-hydroxyphenyl) sulfone, bis (3-allyl-4-hydroxyphenyl) sulfide, bis (3-allyl-4-hydroxyphenyl) ether are preferred. .

The content of the crosslinking agent in the lower layer film-forming material is not particularly limited, but is preferably 0.1 to 100 parts by weight with respect to 100 parts by weight of the lower layer film-forming material, and 5 to 50 parts by weight. Is more preferably 10 to 40 parts by mass. By making the content of the crosslinking agent in the above range, the occurrence of the mixing phenomenon with the resist layer tends to be suppressed, the antireflection effect is enhanced, and the film forming property after crosslinking tends to be enhanced. .

[Crosslinking accelerator]
In the lower layer film forming material of the present embodiment, a crosslinking accelerator for accelerating crosslinking and curing reactions can be used as necessary.

The crosslinking accelerator is not particularly limited as long as it promotes crosslinking and curing reaction, and examples thereof include amines, imidazoles, organic phosphines, and Lewis acids. These crosslinking accelerators can be used alone or in combination of two or more. Among these, imidazoles or organic phosphines are preferable, and imidazoles are more preferable from the viewpoint of lowering the crosslinking temperature.

Examples of the crosslinking accelerator include, but are not limited to, for example, 1,8-diazabicyclo (5,4,0) undecene-7, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylamino). Tertiary amines such as methyl) phenol, 2-methylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 2-heptadecylimidazole, 2,4,5- Imidazoles such as triphenylimidazole, organic phosphines such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine, phenylphosphine, tetraphenylphosphonium tetraphenylborate, teto Tetraphenyl such as phenylphosphonium / ethyltriphenylborate, tetrabutylphosphonium / tetrabutylborate, etc., 2-ethyl-4-methylimidazole / tetraphenylborate, N-methylmorpholine / tetraphenylborate, etc. Examples thereof include boron salts.

The blending amount of the crosslinking accelerator is usually preferably 0.1 to 10 parts by mass when the entire lower layer film-forming material is 100 parts by mass, and more preferably easy to control and economical. From the viewpoint, it is 0.1 to 5 parts by mass, and more preferably 0.1 to 3 parts by mass.

[Radical polymerization initiator]
In the lower layer film forming material of the present embodiment, a radical polymerization initiator can be blended as necessary. The radical polymerization initiator may be a photopolymerization initiator that initiates radical polymerization with light or a thermal polymerization initiator that initiates radical polymerization with heat.

Such a radical polymerization initiator is not particularly limited, and those conventionally used can be appropriately employed. For example, 1-hydroxycyclohexyl phenyl ketone, benzyl dimethyl ketal, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2 -Methyl-1-propan-1-one, 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl} -2-methylpropan-1-one, 2 , 4,6-Trimethylbenzoyl-diphenyl-phosphine oxide, ketone photopolymerization initiators such as bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, methyl ethyl ketone peroxide, cyclohexanone peroxide, methylcyclohexanone peroxide Oxide, methyl acetoacetate Oxide, acetyl acetate peroxide, 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) -cyclohexane, 1,1-bis ( t-butylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-butylperoxy) -2-methylcyclohexane, 1,1-bis (t-butylperoxy) -cyclohexane, 1 , 1-bis (t-butylperoxy) cyclododecane, 1,1-bis (t-butylperoxy) butane, 2,2-bis (4,4-di-t-butylperoxycyclohexyl) propane, p -Menthane hydroperoxide, diisopropylbenzene hydroperoxide, 1,1,3,3-tetramethylbutylhydride Peroxide, cumene hydroperoxide, t-hexyl hydroperoxide, t-butyl hydroperoxide, α, α'-bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2 , 5-bis (t-butylperoxy) hexane, t-butylcumyl peroxide, di-t-butylperoxide, 2,5-dimethyl-2,5-bis (t-butylperoxy) hexyne-3, Isobutyryl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, succinic acid peroxide, m-toluoylbenzoyl peroxide, benzoyl peroxide, di-n -Propylpa Oxydicarbonate, diisopropyl peroxydicarbonate, bis (4-t-butylcyclohexyl) peroxydicarbonate, di-2-ethoxyethyl peroxydicarbonate, di-2-ethoxyhexyl peroxydicarbonate, di-3- Methoxybutyl peroxydicarbonate, di-s-butylperoxydicarbonate, di (3-methyl-3-methoxybutyl) peroxydicarbonate, α, α'-bis (neodecanoylperoxy) diisopropylbenzene, kumi Luperoxyneodecanoate, 1,1,3,3-tetramethylbutylperoxyneodecanoate, 1-cyclohexyl-1-methylethylperoxyneodecanoate, t-hexylperoxyneodecanoate, t-Butylperoxyneodeca Ate, t-hexyl peroxypivalate, t-butyl peroxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexanoate, 1-cyclohexyl-1-methylethylperoxy-2-ethylhexanoate, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2- Ethyl hexanoate, t-hexyl peroxyisopropyl monocarbonate, t-butyl peroxyisobutyrate, t-butyl peroxymalate, t-butyl peroxy-3,5,5-trimethylhexanoate, t -Butyl peroxylaurate, t-butyl peroxyisopropyl monocarbonate, t- Butyl peroxy-2-ethylhexyl monocarbonate, t-butyl peroxyacetate, t-butyl peroxy-m-toluyl benzoate, t-butyl peroxybenzoate, bis (t-butylperoxy) isophthalate, 2,5- Dimethyl-2,5-bis (m-toluylperoxy) hexane, t-hexylperoxybenzoate, 2,5-dimethyl-2,5-bis (benzoylperoxy) hexane, t-butylperoxyallyl monocarbonate, Organic peroxide polymerization initiators such as t-butyltrimethylsilyl peroxide, 3,3 ′, 4,4′-tetra (t-butylperoxycarbonyl) benzophenone, 2,3-dimethyl-2,3-diphenylbutane Is mentioned.

2-phenylazo-4-methoxy-2,4-dimethylvaleronitrile, 1-[(1-cyano-1-methylethyl) azo] formamide, 1,1′-azobis (cyclohexane-1-carbonitrile), 2,2′-azobis (2-methylbutyronitrile), 2,2′-azobisisobutyronitrile, 2,2′-azobis (2,4-dimethylvaleronitrile), 2,2′-azobis ( 2-methylpropionamidine) dihydrochloride, 2,2′-azobis (2-methyl-N-phenylpropionamidine) dihydrochloride, 2,2′-azobis [N- (4-chlorophenyl) -2-methylpropionamidine] Dihydride chloride, 2,2'-azobis [N- (4-hydrophenyl) -2-methylpropionamidine] dihydrochloride 2,2′-azobis [2-methyl-N- (phenylmethyl) propionamidine] dihydrochloride, 2,2′-azobis [2-methyl-N- (2-propenyl) propionamidine] dihydrochloride, 2, , 2'-azobis [N- (2-hydroxyethyl) -2-methylpropionamidine] dihydrochloride, 2,2'-azobis [2- (5-methyl-2-imidazolin-2-yl) propane] dihydrochloride 2,2′-azobis [2- (2-imidazolin-2-yl) propane] dihydrochloride, 2,2′-azobis [2- (4,5,6,7-tetrahydro-1H-1,3- Diazepin-2-yl) propane] dihydrochloride, 2,2'-azobis [2- (3,4,5,6-tetrahydropyrimidin-2-yl) propa ] Dihydrochloride, 2,2'-azobis [2- (5-hydroxy-3,4,5,6-tetrahydropyrimidin-2-yl) propane] dihydrochloride, 2,2'-azobis [2- [1- (2-Hydroxyethyl) -2-imidazolin-2-yl] propane] dihydrochloride, 2,2′-azobis [2- (2-imidazolin-2-yl) propane], 2,2′-azobis [2- Methyl-N- [1,1-bis (hydroxymethyl) -2-hydroxyethyl] propionamide], 2,2′-azobis [2-methyl-N- [1,1-bis (hydroxymethyl) ethyl] propion Amido], 2,2′-azobis [2-methyl-N- (2-hydroxyethyl) propionamide], 2,2′-azobis (2-methylpropionamide), 2,2 '-Azobis (2,4,4-trimethylpentane), 2,2'-azobis (2-methylpropane), dimethyl-2,2-azobis (2-methylpropionate), 4,4'-azobis ( Examples also include azo polymerization initiators such as 4-cyanopentanoic acid) and 2,2′-azobis [2- (hydroxymethyl) propionitrile]. As the radical polymerization initiator in the present embodiment, one of these may be used alone, or two or more may be used in combination, or other known polymerization initiators may be used in further combination.

The content of the radical polymerization initiator may be a stoichiometrically required amount, but is preferably 0.05 to 25 parts by mass when the lower layer film forming material is 100 parts by mass. More preferably, the content is 0.1 to 10 parts by mass. When the content of the radical polymerization initiator is 0.05 parts by mass or more, there is a tendency that curing can be prevented from being insufficient. On the other hand, the content of the radical polymerization initiator is 25 parts by mass or less. In such a case, the long-term storage stability of the lower layer film-forming material at room temperature tends to be prevented from being impaired.

[Acid generator]
The lower layer film-forming material in the present embodiment may contain an acid generator as necessary from the viewpoint of further promoting the crosslinking reaction by heat. As the acid generator, those that generate an acid by thermal decomposition and those that generate an acid by light irradiation are known, and any of them can be used. As an acid generator, what was described in the international publication 2013/024779 can be used, for example.

The content of the acid generator in the lower layer film forming material is not particularly limited, but is preferably 0.1 to 50 parts by weight, more preferably 0.5 to 50 parts by weight with respect to 100 parts by weight of the lower layer film forming material. 40 parts by mass. By setting the content of the acid generator in the above range, the acid generation amount tends to increase and the crosslinking reaction tends to be enhanced, and the occurrence of the mixing phenomenon with the resist layer tends to be suppressed.

[Basic compounds]
The lower layer film-forming material in the present embodiment may contain a basic compound from the viewpoint of improving storage stability.

The basic compound serves as a quencher for the acid to prevent a slight amount of acid generated from the acid generator from causing the crosslinking reaction to proceed. Such a basic compound is not particularly limited, and examples thereof include those described in International Publication No. 2013/024779.

The content of the basic compound in the lower layer film forming material is not particularly limited, but is preferably 0.001 to 2 parts by mass, more preferably 0.01 to 2 parts by mass with respect to 100 parts by mass of the lower layer film forming material. 1 part by mass. By making content of a basic compound into the said range, it exists in the tendency for storage stability to be improved, without impairing a crosslinking reaction too much.

[Other additives]
Moreover, the lower layer film forming material in the present embodiment may contain other resins and / or compounds for the purpose of imparting curability by heat or light and controlling the absorbance. Such other resins and / or compounds include: naphthol resins, xylene resins, naphthol modified resins, phenol modified resins of naphthalene resins; polyhydroxystyrene, dicyclopentadiene resin, (meth) acrylate, dimethacrylate, trimethacrylate, tetra Resins containing no heteroaromatic ring such as methacrylate, vinylnaphthalene, naphthalene rings such as polyacenaphthylene, biphenyl rings such as phenanthrenequinone and fluorene, heterocycles having heteroatoms such as thiophene, indene, etc .; rosin resins; Examples thereof include resins or compounds containing an alicyclic structure such as cyclodextrin, adamantane (poly) ol, tricyclodecane (poly) ol, and derivatives thereof, but are not particularly limited thereto. Furthermore, the lower layer film-forming material in the present embodiment may contain a known additive. Known additives include, but are not limited to, for example, heat and / or photocuring catalysts, polymerization inhibitors, flame retardants, fillers, coupling agents, thermosetting resins, photocurable resins, dyes, pigments , Thickeners, lubricants, antifoaming agents, leveling agents, ultraviolet absorbers, surfactants, colorants, nonionic surfactants, and the like.

[Liquid lower layer film and multilayer resist pattern forming method]
The lower layer film for lithography in the present embodiment is formed from the lower layer film forming material described above.

Further, in the resist pattern forming method of the present embodiment, a lower layer film is formed on a substrate using the above composition, and at least one photoresist layer is formed on the lower layer film. And a step of performing development by irradiating a predetermined region with radiation. More specifically, a step (A-1) of forming a lower layer film on the substrate using the lower layer film forming material of the present embodiment, and a step of forming at least one photoresist layer on the lower layer film ( A-2) and a step (A-3) of performing development by irradiating a predetermined region of the photoresist layer with radiation after the step (A-2).

Further, in the circuit pattern forming method of the present embodiment, an interlayer film is formed on a substrate using the above composition, an interlayer film is formed on the lower film using a resist interlayer film material, and the interlayer Forming at least one photoresist layer on the film;
Irradiating a predetermined region of the photoresist layer with radiation and developing to form a resist pattern;
Etching the intermediate layer film using the resist pattern as a mask, etching the lower layer film using the obtained intermediate layer film pattern as an etching mask, and etching the substrate using the obtained lower layer film pattern as an etching mask. Forming a pattern.
More specifically, a step (B-1) of forming a lower layer film on the substrate using the lower layer film forming material of the present embodiment, and a resist intermediate layer film material containing silicon atoms on the lower layer film are used. After the step (B-2) of forming an intermediate layer film, the step (B-3) of forming at least one photoresist layer on the intermediate layer film, and the step (B-3), A step (B-4) of irradiating a predetermined region of the photoresist layer and developing to form a resist pattern, and after the step (B-4), the intermediate layer film using the resist pattern as a mask Etching the lower layer film using the obtained intermediate layer film pattern as an etching mask, and etching the substrate using the obtained lower layer film pattern as an etching mask to form a pattern on the substrate (B-5) When Having.

The formation method of the lower layer film for lithography in the present embodiment is not particularly limited as long as it is formed from the lower layer film forming material of the present embodiment, and a known method can be applied. For example, after applying the lower layer film material of the present embodiment on a substrate by a known coating method such as spin coating or screen printing or a printing method, the organic solvent is volatilized and removed, and then a known method is used. The lower layer film for lithography of this embodiment can be formed by crosslinking and curing. Examples of the crosslinking method include methods such as thermosetting and photocuring. The lower layer film can be formed by removing the organic solvent by evaporating it.

During the formation of the lower layer film, it is preferable to perform baking in order to suppress the occurrence of the mixing phenomenon with the upper layer resist and promote the crosslinking reaction. In this case, the baking temperature is not particularly limited, but is preferably in the range of 80 to 450 ° C., more preferably 200 to 400 ° C. Also, the baking time is not particularly limited, but is preferably within the range of 10 to 300 seconds. The thickness of the lower layer film can be appropriately selected according to the required performance, and is not particularly limited, but is usually preferably about 30 to 20,000 nm, more preferably 50 to 15,000 nm. .

After the formation of the lower layer film, in the case of a two-layer process, a silicon-containing resist layer thereon, or a single-layer resist made of normal hydrocarbon, and in the case of a three-layer process, a silicon-containing intermediate layer is further formed thereon. It is preferable to prepare a single-layer resist layer that does not contain silicon. In this case, a well-known thing can be used as a photoresist material for forming this resist layer.

After forming the lower layer film on the substrate, in the case of the two-layer process, a silicon-containing resist layer or a single layer resist made of normal hydrocarbon can be formed on the lower layer film. In the case of a three-layer process, a silicon-containing intermediate layer can be formed on the lower layer film, and a single-layer resist layer not containing silicon can be formed on the silicon-containing intermediate layer. In these cases, the photoresist material for forming the resist layer can be appropriately selected from known materials and is not particularly limited.

As a silicon-containing resist material for a two-layer process, from the viewpoint of oxygen gas etching resistance, a silicon atom-containing polymer such as a polysilsesquioxane derivative or a vinylsilane derivative is used as a base polymer, and an organic solvent, an acid generator, If necessary, a positive photoresist material containing a basic compound or the like is preferably used. Here, as the silicon atom-containing polymer, a known polymer used in this type of resist material can be used.

As the silicon-containing intermediate layer for the three-layer process, a polysilsesquioxane-based intermediate layer is preferably used. By providing the intermediate layer with an effect as an antireflection film, reflection tends to be effectively suppressed. For example, in a 193 nm exposure process, if a material containing many aromatic groups and high substrate etching resistance is used as the lower layer film, the k value increases and the substrate reflection tends to increase, but the reflection is suppressed in the intermediate layer. Thus, the substrate reflection can be reduced to 0.5% or less. The intermediate layer having such an antireflection effect is not limited to the following, but for 193 nm exposure, a polysilsesquide crosslinked with an acid or heat in which a light absorbing group having a phenyl group or a silicon-silicon bond is introduced. Oxane is preferably used.

Also, an intermediate layer formed by a Chemical-Vapor-deposition (CVD) method can be used. Although the intermediate layer produced by the CVD method and having a high effect as an antireflection film is not limited to the following, for example, a SiON film is known. In general, it is simpler and more cost-effective to form the intermediate layer by a wet process such as spin coating or screen printing than by CVD. The upper layer resist in the three-layer process may be either a positive type or a negative type, and the same one as a commonly used single layer resist can be used.

Furthermore, the lower layer film in this embodiment can also be used as an antireflection film for a normal single layer resist or a base material for suppressing pattern collapse. Since the lower layer film of this embodiment is excellent in etching resistance for the base processing, it can be expected to function as a hard mask for the base processing.

In the case of forming a resist layer from the photoresist material, a wet process such as spin coating or screen printing is preferably used as in the case of forming the lower layer film. Further, after the resist material is applied by spin coating or the like, prebaking is usually performed, but this prebaking is preferably performed at 80 to 180 ° C. for 10 to 300 seconds. Then, according to a conventional method, a resist pattern can be obtained by performing exposure, post-exposure baking (PEB), and development. The thickness of the resist film is not particularly limited, but is generally preferably 30 to 500 nm, more preferably 50 to 400 nm.

Further, the exposure light may be appropriately selected and used according to the photoresist material to be used. In general, high energy rays having a wavelength of 300 nm or less, specifically, 248 nm, 193 nm, 157 nm excimer laser, 3 to 20 nm soft X-ray, electron beam, X-ray and the like can be mentioned.

The resist pattern formed by the above-described method is one in which pattern collapse is suppressed by the lower layer film. Therefore, by using the lower layer film in the present embodiment, a finer pattern can be obtained, and the exposure amount necessary for obtaining the resist pattern can be reduced.

Next, etching is performed using the obtained resist pattern as a mask. Gas etching is preferably used as the etching of the lower layer film in the two-layer process. As gas etching, etching using oxygen gas is suitable. In addition to oxygen gas, an inert gas such as He or Ar, or CO, CO ₂ , NH ₃ , SO ₂ , N ₂ , NO _{2 or} H ₂ gas can be added. Further, it is possible to perform gas etching using only CO, CO ₂ , NH ₃ , N ₂ , NO _{2, and} H ₂ gas without using oxygen gas. In particular, the latter gas is preferably used for side wall protection for preventing undercut of the pattern side wall.

On the other hand, gas etching is also preferably used for etching the intermediate layer in the three-layer process. As the gas etching, the same one as described in the above two-layer process can be applied. In particular, the processing of the intermediate layer in the three-layer process is preferably performed using a fluorocarbon gas and a resist pattern as a mask. Thereafter, as described above, the lower layer film can be processed by, for example, oxygen gas etching using the intermediate layer pattern as a mask.

Here, when an inorganic hard mask intermediate layer film is formed as an intermediate layer, a silicon oxide film, a silicon nitride film, or a silicon oxynitride film (SiON film) is formed by a CVD method, an ALD method, or the like. The method for forming the nitride film is not limited to the following, but for example, a method described in Japanese Patent Application Laid-Open No. 2002-334869 (Patent Document 6) and WO 2004/066377 (Patent Document 7) can be used. A photoresist film can be formed directly on such an intermediate film, but an organic antireflection film (BARC) is formed on the intermediate film by spin coating, and a photoresist film is formed thereon. May be.

As the intermediate layer, a polysilsesquioxane-based intermediate layer is also preferably used. By providing the resist intermediate layer film with an effect as an antireflection film, reflection tends to be effectively suppressed. Specific materials of the polysilsesquioxane-based intermediate layer are not limited to the following, but are described, for example, in JP-A-2007-226170 (Patent Document 8) and JP-A-2007-226204 (Patent Document 9). Can be used.

Etching of the next substrate can also be performed by a conventional method. For example, if the substrate is SiO ₂ or SiN, etching mainly using a chlorofluorocarbon gas, and p-Si, Al, or W is chlorine or bromine. Etching mainly with gas can be performed. When the substrate is etched with a chlorofluorocarbon gas, the silicon-containing resist of the two-layer resist process and the silicon-containing intermediate layer of the three-layer process are peeled off simultaneously with the substrate processing. On the other hand, when the substrate is etched with a chlorine-based or bromine-based gas, the silicon-containing resist layer or the silicon-containing intermediate layer is separately peeled, and generally, dry etching peeling with a chlorofluorocarbon-based gas is performed after the substrate is processed. .

The lower layer film in the present embodiment has a feature that the etching resistance of the substrate is excellent. As the substrate, known substrates can be appropriately selected and used, and are not particularly limited. Examples thereof include Si, α-Si, p-Si, SiO ₂ , SiN, SiON, W, TiN, and Al. It is done. The substrate may be a laminate having a film to be processed (substrate to be processed) on a base material (support). Examples of such processed films include various Low-k films and stoppers thereof such as Si, SiO ₂ , SiON, SiN, p-Si, α-Si, W, W-Si, Al, Cu, and Al—Si. A film etc. are mentioned, The thing of a different material from a base material (support body) is used normally. The thickness of the substrate to be processed or the film to be processed is not particularly limited, but is usually preferably about 50 to 10,000 nm, more preferably 75 to 5,000 nm.

The resist permanent film formed by applying the composition in the present embodiment is suitable as a permanent film remaining in the final product after forming a resist pattern as necessary. Specific examples of the permanent film include a solder resist, a package material, an underfill material, a package adhesive layer such as a circuit element, an adhesive layer between an integrated circuit element and a circuit board, and a thin film display protective film for a thin display. Examples include a liquid crystal color filter protective film, a black matrix, and a spacer. In particular, the permanent film made of the composition according to the present embodiment has excellent heat resistance and moisture resistance, and also has a very excellent advantage of less contamination due to sublimation components. In particular, a display material is a material that has high sensitivity, high heat resistance, and moisture absorption reliability with little deterioration in image quality due to important contamination.

When the composition in this embodiment is used for resist permanent film applications, in addition to the curing agent, if necessary, various additions such as other resins, surfactants and dyes, fillers, crosslinking agents, dissolution accelerators, etc. A composition for a resist permanent film can be obtained by adding an agent and dissolving in an organic solvent.

The film forming composition for lithography and the composition for resist permanent film in the present embodiment can be prepared by blending the above components and mixing them using a stirrer or the like. Further, when the resist underlayer film composition or resist permanent film composition in the present embodiment contains a filler or a pigment, it is dispersed or mixed using a dispersing device such as a dissolver, a homogenizer, or a three roll mill. Can be prepared. *

Hereinafter, the present embodiment will be described in more detail with reference to synthesis examples and examples, but the present embodiment is not limited to these examples.

(Carbon concentration and oxygen concentration)
Carbon concentration and oxygen concentration (mass%) were measured by organic elemental analysis.
Apparatus: CHN coder MT-6 (manufactured by Yanaco Analytical Co., Ltd.)

(Molecular weight)
The molecular weight of the compound was measured by LC-MS analysis using Water's Acquity UPLC / MALDI-Synapt HDMS.
Moreover, the gel permeation chromatography (GPC) analysis was performed on the following conditions, and the polystyrene conversion weight average molecular weight (Mw), number average molecular weight (Mn), and dispersity (Mw / Mn) were calculated | required.
Apparatus: Shodex GPC-101 (manufactured by Showa Denko KK)
Column: KF-80M x 3
Eluent: THF 1mL / min
Temperature: 40 ° C

(Solubility)
At 23 ° C., the compound was stirred so as to be a 3% by mass solution with respect to propylene glycol monomethyl ether (PGME), cyclohexanone (CHN), ethyl lactate (EL), methyl amyl ketone (MAK) or tetramethyl urea (TMU). After dissolution, the results after one week were evaluated according to the following criteria.
Evaluation A: Visually confirmed that there was no precipitate in any solvent Evaluation C: Visually confirmed that there was a precipitate in all solvents

(Structure of the compound)
The structure of the compound was confirmed by ¹ H-NMR measurement under the following conditions using “Advanced600II spectrometer” manufactured by Bruker.
Frequency: 400MHz
Solvent: d6-DMSO
Internal standard: TMS
Measurement temperature: 23 ° C

<Synthesis Example 1> Synthesis of XBisN-1 In a 100 ml container equipped with a stirrer, a condenser tube and a burette, 3.20 g (20 mmol) of 2,6-naphthalenediol (Sigma-Aldrich reagent) and 4-biphenylcarboxy 1.82 g (10 mmol) of aldehyde (manufactured by Mitsubishi Gas Chemical Co., Inc.) was charged into 30 ml methyl isobutyl ketone, 5 ml of 95% sulfuric acid was added, and the reaction solution was stirred at 100 ° C. for 6 hours for reaction. Next, the reaction solution was concentrated, 50 g of pure water was added to precipitate the reaction product, cooled to room temperature, and then filtered to separate. The obtained solid was filtered and dried, followed by separation and purification by column chromatography to obtain 3.05 g of the target compound represented by the following formula. It was confirmed by 400 MHz- ¹ H-NMR that it had a chemical structure of the following formula.
¹ H-NMR: (d-DMSO, internal standard TMS)
δ (ppm) 9.7 (2H, OH), 7.2 to 8.5 (19H, Ph—H), 6.6 (1H, C—H)
It was confirmed that the substitution position of 2,6-naphthalenediol was the 1st position because the proton signals at the 3rd and 4th positions were doublets.

<Synthesis Example 1A> Synthesis of E-XBisN-1 10 g (21 mmol) of the compound represented by the above formula (XBisN-1) and 14.8 g of potassium carbonate were placed in a container having an internal volume of 100 ml equipped with a stirrer, a condenser tube and a burette. 107 mmol) in 50 ml dimethylformamide, 6.56 g (54 mmol) of 2-chloroethyl acetate was added, and the reaction was stirred at 90 ° C. for 12 hours to carry out the reaction. Next, the reaction solution was cooled in an ice bath to precipitate crystals, which were separated by filtration. Subsequently, 40 g of the crystal, 40 g of methanol, 100 g of THF, and 24% aqueous sodium hydroxide solution were charged in a 100-ml container equipped with a stirrer, a condenser, and a burette, and the reaction was stirred for 4 hours under reflux to carry out the reaction. . Thereafter, the mixture was cooled in an ice bath, the reaction solution was concentrated, and the precipitated solid was filtered and dried, followed by separation and purification by column chromatography to obtain 5.9 g of the target compound represented by the following formula. It was confirmed by 400 MHz- ¹ H-NMR that it had a chemical structure of the following formula.
¹ H-NMR: (d-DMSO, internal standard TMS)
δ (ppm) 8.6 (2H, OH), 7.2 to 7.8 (19H, Ph—H), 6.7 (1H, C—H), 4.0 (4H, —O—) CH ₂ —), 3.8 (4H, —CH ₂ —OH)

<Synthesis Example 2> Synthesis of BisF-1 A container having an internal volume of 200 ml equipped with a stirrer, a cooling tube and a burette was prepared. In this container, 30 g (161 mmol) of 4,4-biphenol (reagent manufactured by Tokyo Chemical Industry Co., Ltd.), 15 g (82 mmol) of 4-biphenylaldehyde (manufactured by Mitsubishi Gas Chemical Co., Inc.) and 100 ml of butyl acetate are charged, and p-toluenesulfone is added. 3.9 g (21 mmol) of acid (a reagent manufactured by Kanto Chemical Co., Inc.) was added to prepare a reaction solution. The reaction was stirred at 90 ° C. for 3 hours to carry out the reaction. Next, the reaction solution was concentrated and 50 g of heptane was added to precipitate the reaction product. After cooling to room temperature, the solution was filtered and separated. The solid obtained by filtration was dried and then subjected to separation and purification by column chromatography to obtain 5.8 g of the target compound (BisF-1) represented by the following formula.
The following peaks were found by 400 MHz- ¹ H-NMR, and confirmed to have a chemical structure of the following formula.
¹ H-NMR: (d-DMSO, internal standard TMS)
δ (ppm) 9.4 (4H, OH), 6.8 to 7.8 (22H, Ph—H), 6.2 (1H, C—H)
It was 536 as a result of measuring molecular weight by the said method about the obtained compound.

<Synthesis Example 2A>
In a container having a volume of 100 ml equipped with a stirrer, a condenser and a burette, 11.2 g (21 mmol) of the compound represented by the above formula (BisF-1) and 14.8 g (107 mmol) of potassium carbonate were charged in 50 ml dimethylformamide. The reaction was carried out by adding 6.56 g (54 mmol) of 2-chloroethyl acetate and stirring the reaction solution at 90 ° C. for 12 hours. Next, the reaction solution was cooled in an ice bath to precipitate crystals, which were separated by filtration. Subsequently, 40 g of the crystal, 40 g of methanol, 100 g of THF, and 24% aqueous sodium hydroxide solution were charged in a 100-ml container equipped with a stirrer, a condenser, and a burette, and the reaction was stirred for 4 hours under reflux to carry out the reaction. . Thereafter, the reaction mixture is cooled in an ice bath, the reaction mixture is concentrated, and the precipitated solid is filtered and dried, followed by separation and purification by column chromatography, and the target compound represented by the following formula (E-BisF-1) 5.9 g was obtained.
It was confirmed by 400 MHz- ¹ H-NMR that the compound had a chemical structure of the following formula (E-BisF-1).
¹ H-NMR: (d-DMSO, internal standard TMS)
δ (ppm) 8.6 (4H, OH), 6.8 to 7.8 (22H, Ph—H), 6.2 (1H, C—H), 4.0 (8H, —O—) CH ₂ —), 3.8 (8H, —CH ₂ —OH)
As a result of measuring the molecular weight of the obtained compound by the above method, it was 712.

<Synthesis Example 1-1> Synthesis of EaXBisN-1 10.0 g (21 mmol) of the compound represented by the above formula (XBisN-1) and glycidyl methacrylate 6 in a container having a volume of 100 ml equipped with a stirrer, a condenser tube and a burette. .1 g, 0.5 g of triethylamine, and 0.05 g of p-methoxyphenol were charged into 50 ml of methyl isobutyl ketone, and the mixture was stirred for 24 hours while being heated to 80 ° C. and stirred.
The reaction mixture was cooled to 50 ° C., the reaction solution was dropped into pure water, and the precipitated solid was filtered and dried, followed by separation and purification by column chromatography, and the object represented by the following formula (EaXBisN-1) 3.0 g of compound was obtained.
It was confirmed by 400 MHz- ¹ H-NMR that the compound had a chemical structure of the following formula (EaXBisN-1).
¹ H-NMR: (d-DMSO, internal standard TMS)
δ (ppm)
7.2 to 7.8 (19H, Ph—H), 6.7 (1H, C—H), 6.5 (4H, ═CH2), 5.7 (2H, —OH), 4.1 to 4.7 (10H, -O-CH2-CH-CH2-O-), 2.0 (6H, -CH3)

As a result of measuring the molecular weight of the obtained compound by the above method, it was 750.
The thermal decomposition temperature was 370 ° C., the glass transition point was 95 ° C., and the melting point was 200 ° C., confirming that it had high heat resistance.

<Synthesis Example 1-2> Synthesis of EaE-XBisN-1 Instead of using the compound represented by the above formula (E-XBisN-1) instead of the compound represented by the above formula (XBisN-1) Was reacted in the same manner as in Synthesis Example 1-1 to obtain 3.2 g of the target compound represented by the following formula (EaE-XBisN-1).
It was confirmed by 400 MHz- ¹ H-NMR that the compound had a chemical structure of the following formula (EaE-XBisN-1).
¹ H-NMR: (d-DMSO, internal standard TMS)
7.2 to 7.8 (19H, Ph—H), 6.7 (1H, C—H), 6.5 (4H, ═CH2), 5.7 (2H, —OH), 4.1 to 4.7 (10H, —O—CH ₂ —CH—CH ₂ —O—), 4.0 (4H, —O—CH ₂ —), 3.8 (4H, —CH ₂ —OH), 2.0 ( 6H, -CH3)

It was 838 as a result of measuring molecular weight by the said method about the obtained compound.
The thermal decomposition temperature was 360 ° C., the glass transition point was 90 ° C., and the melting point was 195 ° C., confirming that it had high heat resistance.

<Synthesis Example 2-1> Synthesis of EaBisF-1 Synthesis Example except that the compound represented by the above formula (BisF-1) was used instead of the compound represented by the above formula (XBisN-1). The reaction was conducted in the same manner as in 1-1 to obtain 2.5 g of the desired compound represented by the following formula (EaBisF-1).
It was confirmed by 400 MHz- ¹ H-NMR that it had a chemical structure of the following formula (EaBisF-1).
¹ H-NMR: (d-DMSO, internal standard TMS)
δ (ppm) 6.8 to 7.8 (22H, Ph—H), 6.5 (8H, ═CH2), 6.2 (1H, C—H), 5.7 (4H, —OH), 4.1 to 4.7 (20H, —O—CH 2 —CH—CH 2 —O—), 2.0 (12H, —CH 3)

It was 1104 as a result of measuring molecular weight by the said method about the obtained compound.
The thermal decomposition temperature was 365 ° C., the glass transition point was 60 ° C., and the melting point was 185 ° C., confirming that it had high heat resistance.

<Synthesis Example 2-2> Synthesis of EaE-BisF-1 Other than using the compound represented by the above formula (E-BisF-1) instead of the compound represented by the above formula (XBisN-1) Then, the reaction was carried out in the same manner as in Synthesis Example 1-1 to obtain 2.6 g of the target compound represented by the following formula (EaE-BisF-1).
It was confirmed by 400 MHz- ¹ H-NMR that the compound had a chemical structure of the following formula (EaE-BisF-1).
¹ H-NMR: (d-DMSO, internal standard TMS)
δ (ppm) 6.8 to 7.8 (22H, Ph—H), 6.5 (8H, ═CH2), 6.2 (1H, C—H), 5.7 (4H, —OH), 4.1 to 4.7 (20H, —O—CH ₂ —CH—CH ₂ —O—), 4.0 (8H, —O—CH ₂ —), 3.8 (8H, —CH ₂ —OH), 2.0 (12H, -CH3)

As a result of measuring the molecular weight of the obtained compound by the above method, it was 1281.
The thermal decomposition temperature was 355 ° C., the glass transition point was 55 ° C., and the melting point was 175 ° C., confirming that it had high heat resistance.

<Synthesis Example 3> Synthesis of BiN-1 After melting 10 g (69.0 mmol) of 2-naphthol (reagent manufactured by Sigma-Aldrich) at 120 ° C. in a 300 mL internal vessel equipped with a stirrer, a condenser and a burette, 0.27 g of sulfuric acid was added, 2.7 g (13.8 mmol) of 4-acetylbiphenyl (Sigma-Aldrich reagent) was added, and the contents were stirred at 120 ° C. for 6 hours to carry out the reaction to obtain a reaction solution. It was. Next, 100 mL of N-methyl-2-pyrrolidone (manufactured by Kanto Chemical Co., Inc.) and 50 mL of pure water were added to the reaction solution, followed by extraction with ethyl acetate. Next, pure water was added to separate the solution until neutrality, followed by concentration to obtain a solution.
After separation of the resulting solution by column chromatography, 1.0 g of the target compound (BiN-1) represented by the following formula (BiN-1) was obtained.
The obtained compound (BiN-1) was measured to have a molecular weight of 466 by the method described above.
The obtained compound (BiN-1) was subjected to NMR measurement under the above-described measurement conditions. As a result, the following peaks were found and confirmed to have a chemical structure of the following formula (BiN-1).
δ (ppm) 9.69 (2H, OH), 7.01 to 7.67 (21H, Ph—H), 2.28 (3H, C—H)

<Synthesis Example 3A> Synthesis of E-BiN-1 10.5 g (21 mmol) of the compound (BiN-1) represented by the above formula and 14.8 g of potassium carbonate were placed in a 100-ml container equipped with a stirrer, a condenser tube and a burette. (107 mmol) was charged into 50 ml dimethylformamide, 6.56 g (54 mmol) of 2-chloroethyl acetate was added, and the reaction solution was stirred at 90 ° C. for 12 hours to carry out the reaction. Next, the reaction solution was cooled in an ice bath to precipitate crystals, which were separated by filtration. Subsequently, 40 g of the crystal, 40 g of methanol, 100 g of THF and 24% aqueous sodium hydroxide solution were charged in a 100 ml internal container equipped with a stirrer, a condenser and a burette, and the reaction was stirred for 5 hours under reflux to carry out the reaction. . Thereafter, the mixture was cooled in an ice bath, the reaction solution was concentrated, and the precipitated solid was filtered and dried, followed by separation and purification by column chromatography to obtain 4.6 g of the target compound represented by the following formula. It was confirmed by 400 MHz- ¹ H-NMR that it had a chemical structure of the following formula.
¹ H-NMR: (d-DMSO, internal standard TMS)
δ (ppm) 8.6 (2H, OH), 7.2 to 7.8 (19H, Ph—H), 6.7 (1H, C—H), 4.0 (4H, —O—) CH ₂ —), 3.8 (4H, —CH ₂ —OH)

<Synthesis Example 3-1> Synthesis of EaBiN-1 Synthesis Example except that the compound represented by the above formula (BiN-1) was used instead of the compound represented by the above formula (XBisN-1). The reaction was conducted in the same manner as in 1-1 to obtain 3.5 g of the target compound represented by the following formula (EaBiN-1).
It was confirmed by 400 MHz- ¹ H-NMR that the compound had a chemical structure of the following formula (EaBiN-1).
¹ H-NMR: (d-DMSO, internal standard TMS)
δ (ppm) 7.2 to 7.8 (21H, Ph—H), 6.5 (4H, ═CH2), 5.7 (2H, —OH), 4.1 to 4.7 (10H, − O-CH2-CH-CH2-O-), 2.3 (3H, -CH3), 2.0 (6H, -CH3)

As a result of measuring the molecular weight of the obtained compound by the above method, it was 750.
The thermal decomposition temperature was 380 ° C., the glass transition point was 85 ° C., and the melting point was 203 ° C., confirming that it had high heat resistance.

<Synthesis Example 3-2> Synthesis of EaE-BiN-1 Other than using the compound represented by the above formula (E-BiN-1) instead of the compound represented by the above formula (XBisN-1) Then, the reaction was conducted in the same manner as in Synthesis Example 1-1 to obtain 2.9 g of the target compound represented by the following formula (EaE-BiN-1).
It was confirmed by 400 MHz- ¹ H-NMR that the compound had a chemical structure of the following formula (EaE-BiN-1).
¹ H-NMR: (d-DMSO, internal standard TMS)
δ (ppm) 7.2 to 7.8 (21H, Ph—H), 6.5 (4H, ═CH2), 5.7 (2H, —OH), 4.1 to 4.7 (10H, − _{O-CH2-CH-CH2-} O -), 4.0 (4H, -O-CH 2 -), 3.8 (4H, -CH 2 -OH), 2.3 (3H, -CH3), 2 .0 (6H, -CH3)

It was 838 as a result of measuring molecular weight by the said method about the obtained compound.
The thermal decomposition temperature was 371 ° C., the glass transition point was 72 ° C., and the melting point was 221 ° C., confirming that it had high heat resistance.

<Synthesis Example 4> Synthesis of BiP-1 The reaction was conducted in the same manner as in Synthesis Example 3 except that o-phenylphenol was used instead of 2-naphthol, and the target compound represented by the following formula (BiP-1) was 1 0.0 g was obtained.
The obtained compound (BiP-1) was measured to have a molecular weight of 466 by the method described above.
The obtained compound (BiP-1) was subjected to NMR measurement under the above-described measurement conditions. As a result, the following peaks were found and confirmed to have a chemical structure of the following formula (BiP-1).
δ (ppm) 9.67 (2H, OH), 6.98-7.60 (25H, Ph-H), 2.25 (3H, C—H)

<Synthesis Example 4A> Synthesis of E-BiP-1 11.2 g (21 mmol) of the compound represented by the above formula (BiP-1) and potassium carbonate 14. 8 g (107 mmol) was charged into 50 ml dimethylformamide, 6.56 g (54 mmol) of 2-chloroethyl acetate was added, and the reaction was stirred at 90 ° C. for 12 hours to carry out the reaction. Next, the reaction solution was cooled in an ice bath to precipitate crystals, which were separated by filtration. Subsequently, 40 g of the crystal, 40 g of methanol, 100 g of THF, and 24% aqueous sodium hydroxide solution were charged in a 100-ml container equipped with a stirrer, a condenser, and a burette, and the reaction was stirred for 4 hours under reflux to carry out the reaction. . Thereafter, the reaction mixture is cooled in an ice bath, the reaction mixture is concentrated, and the precipitated solid is filtered and dried, followed by separation and purification by column chromatography, and the target compound represented by the following formula (E-BiP-1) 5.9 g was obtained.
It was confirmed by 400 MHz- ¹ H-NMR that the compound had a chemical structure of the following formula (E-BiP-1).
¹ H-NMR: (d-DMSO, internal standard TMS)
δ (ppm) 8.6 (4H, OH), 6.8 to 7.6 (25H, Ph—H), 4.0 (4H, —O—CH ₂ —), 3.8 (4H, —CH ₂ —OH), 2.2 (3H, C—H)
It was 606 as a result of measuring molecular weight about the obtained compound by the said method.

<Synthesis Example 4-1> Synthesis of EaBiP-1 Synthesis Example except that the compound represented by the above formula (BiP-1) was used instead of the compound represented by the above formula (XBisN-1). The reaction was conducted in the same manner as in 1-1 to obtain 3.5 g of the target compound represented by the following formula (EaBiP-1).
It was confirmed by 400 MHz- ¹ H-NMR that the compound had a chemical structure of the following formula (EaBiP-1).
¹ H-NMR: (d-DMSO, internal standard TMS)
δ (ppm) 6.8 to 7.8 (25H, Ph—H), 6.5 (4H, ═CH2), 5.7 (2H, —OH), 4.1 to 4.7 (10H, − O-CH2-CH-CH2-O-), 2.3 (3H, -CH3), 2.2 (3H, C-H), 2.0 (6H, -CH3)
The thermal decomposition temperature was 371 ° C., the glass transition point was 78 ° C., and the melting point was 212 ° C., confirming that it had high heat resistance.

As a result of measuring the molecular weight of the obtained compound by the above method, it was 802.

<Synthesis Example 4-2> Synthesis of EaE-BiP-1 A compound represented by the above formula (E-BiP-1) was used in place of the compound represented by the above formula (XBisN-1). Then, the reaction was carried out in the same manner as in Synthesis Example 1-1 to obtain 3.2 g of the target compound represented by the following formula (EaE-BiP-1).
It was confirmed by 400 MHz- ¹ H-NMR that the compound had a chemical structure of the following formula (EaE-BiP-1).
¹ H-NMR: (d-DMSO, internal standard TMS)
δ (ppm) 6.8 to 7.8 (25H, Ph—H), 6.5 (4H, ═CH2), 5.7 (2H, —OH), 4.1 to 4.7 (10H, − _{O-CH2-CH-CH2-} O -), 4.0 (4H, -O-CH 2 -), 3.8 (4H, -CH 2 -OH), 2.3 (3H, -CH3), 2 .0 (6H, -CH3)

As a result of measuring the molecular weight of the obtained compound by the above method, it was 890.
The thermal decomposition temperature was 362 ° C., the glass transition point was 75 ° C., and the melting point was 220 ° C., confirming that it had high heat resistance.

(Synthesis Examples 5 to 17)
2-naphthol (raw material 1) and 4-acetylbiphenyl (starting material 2) as raw materials of Synthesis Example 3 were changed as shown in Table 1, and the others were carried out in the same manner as in Synthesis Example 3 to obtain the respective target compounds.
Each target compound was identified by 1H-NMR.

(Synthesis Examples 18 to 20)
2-naphthol (raw material 1) and 4-biphenylaldehyde (starting material 2), which are the raw materials of Synthesis Example 3, were changed as shown in Table 3, and the others were carried out in the same manner as in Synthesis Example 3 to obtain the respective target compounds.
Each target compound was identified by 1H-NMR.

(Synthesis Examples 21 to 22)
The raw materials of Synthesis Example 3, 2-naphthol (raw material 1) and 4-acetylbiphenyl (raw material 2) were changed as shown in Table 5, 1.5 mL of water, 73 mg (0.35 mmol) of dodecyl mercaptan, 37% hydrochloric acid 2 .3 g (22 mmol) was added, the reaction temperature was changed to 55 ° C., and the others were carried out in the same manner as in Synthesis Example 3 to obtain each target compound.
Each target compound was identified by 1H-NMR.

(Synthesis Examples 5A to 22A)
The compound represented by the formula (BiN-1), which is the raw material of Synthesis Example 3A, was changed as shown in Table 7, and the others were synthesized under the same conditions as in Synthesis Example 3A to obtain the target compound. The structure of each target compound was identified by confirming the molecular weight with 400 MHz- ¹ H-NMR (d-DMSO, internal standard TMS) and LC-MS.

(Synthesis Examples 5-1 to 22-1)
The compound represented by the formula (BiN-1) as the raw material of Synthesis Example 3-1 was changed as shown in Table 7, and the others were synthesized under the same conditions as in Synthesis Example 3-1, Each target compound was obtained. The structure of each compound was identified by confirming the molecular weight with 400 MHz- ¹ H-NMR (d-DMSO, internal standard TMS) and LC-MS.

(Synthesis Examples 5-2 to 22-2)
The compound represented by the formula (E-BiN-1) as the raw material of Synthesis Example 3-2 was changed as shown in Table 7, and the others were synthesized under the same conditions as in Synthesis Example 3-2. Each object was obtained. The structure of each compound was identified by confirming the molecular weight with 400 MHz- ¹ H-NMR (d-DMSO, internal standard TMS) and LC-MS.

(Synthesis Example 23) Synthesis of Resin (R1-XBisN-1) A four-necked flask having an inner volume of 1 L and equipped with a Dimroth condenser, a thermometer, and a stirring blade and capable of bottoming out was prepared. In a four-necked flask, 32.6 g (70 mmol, manufactured by Mitsubishi Gas Chemical Co., Ltd.) of the compound (XBisN-1) obtained in Synthesis Example 1 and 21.0 g of a 40 mass% formalin aqueous solution (in a nitrogen stream) As the formaldehyde, 280 mmol, manufactured by Mitsubishi Gas Chemical Co., Ltd.) and 0.97 mL of 98% by mass sulfuric acid (manufactured by Kanto Chemical Co., Ltd.) were charged and reacted for 7 hours while refluxing at 100 ° C. under normal pressure. Thereafter, 180.0 g of ortho-xylene (special grade reagent manufactured by Wako Pure Chemical Industries, Ltd.) as a diluent solvent was added to the reaction solution, and after standing, the lower aqueous phase was removed. Further, neutralization and washing with water were carried out, and orthoxylene was distilled off under reduced pressure to obtain 34.1 g of a brown solid resin (R1-XBisN-1).

The obtained resin (R1-XBisN-1) had Mn: 1975, Mw: 3650, and Mw / Mn: 1.84.

(Synthesis Example 24) Synthesis of Resin (R2-XBisN-1) A four-necked flask having an inner volume of 1 L and equipped with a Dimroth condenser, a thermometer, and a stirring blade was prepared. In a four-necked flask, 32.6 g (70 mmol, manufactured by Mitsubishi Gas Chemical Co., Ltd.) of the compound (XBisN-1) obtained in Synthesis Example 1 and 50.9 g (280 mmol, 4-biphenylaldehyde) were obtained in a nitrogen stream. Mitsubishi Gas Chemical Co., Ltd.), Anisole (Kanto Chemical Co., Ltd.) 100 mL, and oxalic acid dihydrate (Kanto Chemical Co., Ltd.) 10 mL were charged and reacted for 7 hours at 100 ° C. under normal pressure. I let you. Thereafter, 180.0 g of ortho-xylene (special grade reagent manufactured by Wako Pure Chemical Industries, Ltd.) as a diluent solvent was added to the reaction solution, and after standing, the lower aqueous phase was removed. Further, neutralization and washing with water were performed, and the organic phase solvent and unreacted 4-biphenylaldehyde were distilled off under reduced pressure to obtain 34.7 g of a brown solid resin (R2-XBisN-1).

The obtained resin (R2-XBisN-1) had Mn: 1610, Mw: 2567, and Mw / Mn: 1.59.

<Synthesis Example 23A> Synthesis of E-R1-XBisN-1 30 g of the above resin (R1-XBisN-1) and 29.6 g (214 mmol) of potassium carbonate were placed in a 500-ml container equipped with a stirrer, a condenser tube and a burette. Was added to 100 ml dimethylformamide, 13.12 g (108 mmol) of 2-chloroethyl acetate was added, and the reaction was stirred at 90 ° C. for 12 hours to carry out the reaction. Next, the reaction solution was cooled in an ice bath to precipitate crystals, which were separated by filtration. Subsequently, 40 g of the crystal, 80 g of methanol, 100 g of THF, and 24% aqueous sodium hydroxide solution were charged into a 100-ml container equipped with a stirrer, a condenser and a burette, and the reaction was stirred for 4 hours under reflux to carry out the reaction. . Thereafter, the mixture was cooled in an ice bath, the reaction solution was concentrated, and the precipitated solid was filtered and dried to obtain 26.5 g of a brown solid resin (E-R1-XBisN-1).

The obtained resin (E-R1-XBisN-1) was Mn: 2176, Mw: 3540, and Mw / Mn: 1.62.

<Synthesis Example 23-1> Synthesis of EaR1-XBisN-1 20.0 g of the resin represented by the above formula (R1-XBisN-1) and glycidyl methacrylate in a 500-ml container equipped with a stirrer, a condenser tube and a burette 12.2 g, 1.0 g of triethylamine and 0.1 g of p-methoxyphenol were charged into 100 ml of methyl isobutyl ketone, and the reaction was carried out by stirring for 24 hours while heating to 80 ° C. and stirring.
After cooling to 50 ° C. and dropping the reaction solution into pure water, the precipitated solid was filtered and dried to obtain 26.2 g of a resin represented by (EaR1-XBisN-1) as a gray solid. .

The obtained resin (EaR1-XBisN-1) was Mn: 2219, Mw: 3540, and Mw / Mn: 1.59.

<Synthesis Example 23-2> Synthesis of EaE-R1-XBisN-1 Instead of the resin represented by the above formula (R1-XBisN-1) obtained in Synthesis Example 23, the above-mentioned obtained in Synthesis Example 23A The reaction was conducted in the same manner as in Synthesis Example 23-1, except that the formula (E-R1-XBisN-1) was used, to obtain 25.0 g of a resin represented by (EaE-R1-XBisN-1) as a brown solid It was.

The obtained resin (EaE-R1-XBisN-1) was Mn: 2678, Mw: 4330, and Mw / Mn: 1.61.

<Synthesis Example 24A> Synthesis of E-R2-XBisN-1 30 g of the above resin (R2-XBisN-1) and 29.6 g (214 mmol) of potassium carbonate were placed in a 500-ml container equipped with a stirrer, a condenser tube and a burette. Was added to 100 ml dimethylformamide, 13.12 g (108 mmol) of 2-chloroethyl acetate was added, and the reaction was stirred at 90 ° C. for 12 hours to carry out the reaction. Next, the reaction solution was cooled in an ice bath to precipitate crystals, which were separated by filtration. Subsequently, 40 g of the crystal, 80 g of methanol, 100 g of THF, and 24% aqueous sodium hydroxide solution were charged into a 100-ml container equipped with a stirrer, a condenser and a burette, and the reaction was stirred for 4 hours under reflux to carry out the reaction. . Thereafter, the mixture was cooled in an ice bath, the reaction mixture was concentrated, and the precipitated solid was filtered and dried to obtain 22.3 g of a brown solid resin (E-R2-XBisN-1).

The obtained resin (E-R2-XBisN-1) was Mn: 2516, Mw: 3960, and Mw / Mn: 1.62.

<Synthesis Example 24-1> Synthesis of EaR2-XBisN-1 Instead of the above formula (R1-XBisN-1) obtained in Synthesis Example 23, the above formula (R2-XBisN-1) obtained in Synthesis Example 24 was used. The reaction was carried out in the same manner as in Synthesis Example 23-1 except that 31.2 g of the compound represented by (2) was used to obtain 37.1 g of a resin represented by (EaR2-XBisN-1) as a gray solid.

The obtained resin (EaR2-XBisN-1) was Mn: 2641, Mw: 4415, and Mw / Mn: 1.67.

<Synthesis Example 24-2> Synthesis of EaE-R2-XBisN-1 Instead of the resin represented by the above formula (R1-XBisN-1) obtained in Synthesis Example 23, the above-mentioned obtained in Synthesis Example 24A The reaction was conducted in the same manner as in Synthesis Example 23-1, except that the formula (E-R2-XBisN-1) was used, to obtain 27.0 g of a resin represented by (EaE-R2-XBisN-1) as a brown solid It was.

The obtained resin (EaE-R2-XBisN-1) was Mn: 2576, Mw: 4230, and Mw / Mn: 1.64.

(Synthesis Comparative Example 1)
A four-necked flask with an internal volume of 10 L capable of bottoming was prepared, equipped with a Dimroth condenser, thermometer, and stirring blade. To this four-necked flask, in a nitrogen stream, 1.09 kg of 1,5-dimethylnaphthalene (7 mol, manufactured by Mitsubishi Gas Chemical Co., Ltd.), 2.1 kg of 40% by weight formalin aqueous solution (28 mol of formaldehyde, Mitsubishi Gas Chemical Co., Ltd.) )) And 98 mass% sulfuric acid (manufactured by Kanto Chemical Co., Ltd.) 0.97 ml were charged and reacted for 7 hours under reflux at 100 ° C. under normal pressure. Thereafter, 1.8 kg of ethylbenzene (special grade reagent manufactured by Wako Pure Chemical Industries, Ltd.) as a diluent solvent was added to the reaction solution, and after standing, the lower aqueous phase was removed. Further, neutralization and washing with water were performed, and ethylbenzene and unreacted 1,5-dimethylnaphthalene were distilled off under reduced pressure to obtain 1.25 kg of a light brown solid dimethylnaphthalene formaldehyde resin.
The molecular weight of the obtained dimethylnaphthalene formaldehyde was Mn: 562.

Subsequently, a four-necked flask having an internal volume of 0.5 L equipped with a Dimroth condenser, a thermometer, and a stirring blade was prepared. This four-necked flask was charged with 100 g (0.51 mol) of the dimethylnaphthalene formaldehyde resin obtained as described above and 0.05 g of paratoluenesulfonic acid under a nitrogen stream, and the temperature was raised to 190 ° C. Stir after heating for hours. Thereafter, 52.0 g (0.36 mol) of 1-naphthol was further added, and the temperature was raised to 220 ° C. and reacted for 2 hours. After the solvent was diluted, neutralization and water washing were performed, and the solvent was removed under reduced pressure to obtain 126.1 g of a dark brown solid modified resin (CR-1).
The obtained resin (CR-1) was Mn: 885, Mw: 2220, and Mw / Mn: 4.17.

(Examples 1-1 to 24-2, Comparative Example 1)
A solubility test was conducted using the compounds or resins described in Synthesis Examples 1-1 to 24-2 and CR-1 described in Synthesis Comparative Example 1. The results are shown in Table 8.
Moreover, the lower layer film forming material for lithography of the composition shown in Table 8 was prepared, respectively.
Next, these lower-layer film forming materials for lithography were spin-coated on a silicon substrate, and then baked at 240 ° C. for 60 seconds and further at 400 ° C. for 120 seconds to prepare 200 nm-thick underlayer films. The following were used about the acid generator, the crosslinking agent, and the organic solvent.
Acid generator: Ditertiary butyl diphenyliodonium nonafluoromethanesulfonate (DTDDPI) manufactured by Midori Chemical Co., Ltd.
Cross-linking agent: Nikalac MX270 (Nikalac) manufactured by Sanwa Chemical Co., Ltd.
Organic solvent: Propylene glycol monomethyl ether acetate acetate (PGMEA)

(Examples 25 to 44)
In addition, materials for forming a lower layer film for lithography having the composition shown in Table 9 below were prepared. Next, these lower layer film forming materials for lithography are spin-coated on a silicon substrate, and then baked at 110 ° C. for 60 seconds to remove the solvent of the coating film. Then, an integrated exposure amount of 600 mJ is obtained with a high-pressure mercury lamp. / cm ^2, and is cured by irradiation time of 20 seconds to produce each an underlying film having a thickness of 200 nm. The following were used for the radical photopolymerization initiator, the crosslinking agent, and the organic solvent.

Radical polymerization initiator: IRGACURE184 manufactured by BASF
Cross-linking agent:
(1) Sanka Chemical Co., Ltd. Nicarak MX270 (Nicarak)
(2) Diallyl bisphenol A cyanate (DABPA-CN) manufactured by Mitsubishi Gas Chemical
(3) Diallyl bisphenol A (BPA-CA) manufactured by Konishi Chemical Industries
(4) Benzoxazine (BF-BXZ) manufactured by Konishi Chemical Industries
(5) Nippon Kayaku Biphenyl Aralkyl Epoxy Resin (NC-3000-L)
Organic solvent: Propylene glycol monomethyl ether acetate acetate (PGMEA)

The structure of the crosslinking agent is shown by the following formula.

And the etching test was done on the conditions shown below, and etching tolerance was evaluated. The evaluation results are shown in Table 8 and Table 9.
[Etching test]
Etching device: RIE-10NR manufactured by Samco International
Output: 50W
Pressure: 20Pa
Time: 2min
Etching gas Ar gas flow rate: CF ₄ gas flow rate: O ₂ gas flow rate = 50: 5: 5 (sccm)
[Evaluation of etching resistance]
Etching resistance was evaluated according to the following procedure.
First, a novolak underlayer film was produced under the same conditions as in Example 1 except that novolak (PSM4357 manufactured by Gunei Chemical Co., Ltd.) was used instead of the compound (EaXBisN-1). Then, the above-described etching test was performed on this novolac lower layer film, and the etching rate at that time was measured.
Next, the above-mentioned etching test was similarly performed for the lower layer films of each Example and Comparative Example 1, and the etching rate at that time was measured.
Then, the etching resistance was evaluated according to the following evaluation criteria based on the etching rate of the novolak underlayer film.
[Evaluation criteria]
A: Etching rate is less than -10% compared to the novolac lower layer film B: Etching rate is -10% to + 5% compared to the novolac lower layer film
C: Etching rate is more than + 5% compared to the novolak underlayer

(Examples 45 to 48)
Next, each solution of an underlayer film forming material for lithography including EaXBisN-1, EaE-XBisN-1, EaBisF-1, and EaE-BisF-1 was applied on a SiO ₂ substrate having a thickness of 300 nm at 240 ° C. By baking for 120 seconds at 400 ° C. for 60 seconds, a lower layer film having a thickness of 70 nm was formed. On this lower layer film, an ArF resist solution was applied and baked at 130 ° C. for 60 seconds to form a 140 nm-thick photoresist layer. As the ArF resist solution, a compound of the following formula (11): 5 parts by mass, triphenylsulfonium nonafluoromethanesulfonate: 1 part by mass, tributylamine: 2 parts by mass, and PGMEA: 92 parts by mass are blended. The prepared one was used.
The compound of the formula (11) is 4.15 g of 2-methyl-2-methacryloyloxyadamantane, 3.00 g of methacryloyloxy-γ-butyrolactone, 2.08 g of 3-hydroxy-1-adamantyl methacrylate, azobisisobutyronitrile. 0.38 g was dissolved in 80 mL of tetrahydrofuran to obtain a reaction solution. This reaction solution was polymerized for 22 hours under a nitrogen atmosphere while maintaining the reaction temperature at 63 ° C., and then the reaction solution was dropped into 400 ml of n-hexane. The resulting resin thus obtained was coagulated and purified, and the resulting white powder was filtered and obtained by drying overnight at 40 ° C. under reduced pressure.

In the above formula (11), 40, 40 and 20 indicate the ratio of each structural unit, and do not indicate a block copolymer.

Next, the photoresist layer was exposed using an electron beam drawing apparatus (ELIONX, ELS-7500, 50 keV), baked at 115 ° C. for 90 seconds (PEB), and 2.38 mass% tetramethylammonium hydroxide ( A positive resist pattern was obtained by developing with an aqueous solution of TMAH for 60 seconds.

As for the shape of the resist pattern after development, the resist pattern was evaluated as “good” when the pattern was not collapsed and the rectangularity was good, and “bad”. As a result of the observation, the minimum line width with no pattern collapse and good rectangularity was defined as “resolution” and used as an evaluation index. Furthermore, the minimum amount of electron beam energy that can draw a good pattern shape was defined as “sensitivity” and used as an evaluation index.
The evaluation results are shown in Table 10.

(Comparative Example 2)
Except that the lower layer film was not formed, a photoresist layer was directly formed on the SiO ₂ substrate in the same manner as in Example 45 to obtain a positive resist pattern. The results are shown in Table 2.

As is clear from Table 8, in Examples 1 to 24 using the compound or resin in the present embodiment, it was confirmed that the heat resistance, solubility, and etching resistance were all good. On the other hand, Comparative Example 1 using CR-1 (phenol-modified dimethylnaphthalene formaldehyde resin) had poor etching resistance.
In Examples 45 to 48, it was confirmed that the resist pattern shape after development was good and no defects were observed. It was confirmed that both the resolution and sensitivity were significantly superior to those of Comparative Example 2 in which the formation of the lower layer film was omitted.
From the difference in the resist pattern shape after development, it was shown that the lower layer film forming material for lithography used in Examples 45 to 48 had good adhesion to the resist material.

<Examples 49 to 52>
The solution of the material for forming a lower layer film for lithography in Examples 1-1 to 2-2 was applied on a SiO ₂ substrate having a film thickness of 300 nm and baked at 240 ° C. for 60 seconds and further at 400 ° C. for 120 seconds. A lower layer film having a thickness of 80 nm was formed. On this lower layer film, a silicon-containing intermediate layer material was applied and baked at 200 ° C. for 60 seconds to form an intermediate layer film having a thickness of 35 nm. Further, the ArF resist solution was applied on this intermediate layer film and baked at 130 ° C. for 60 seconds to form a 150 nm-thick photoresist layer. As the silicon-containing intermediate layer material, a silicon atom-containing polymer described in JP-A-2007-226170 <Synthesis Example 1> was used.
Next, the photoresist layer was subjected to mask exposure using an electron beam lithography apparatus (ELIONX, ELS-7500, 50 keV), baked at 115 ° C. for 90 seconds (PEB), and 2.38 mass% tetramethylammonium hydroxide. By developing with (TMAH) aqueous solution for 60 seconds, a positive resist pattern of 55 nm L / S (1: 1) was obtained.
Thereafter, dry etching of the silicon-containing intermediate layer film (SOG) was performed using the obtained resist pattern as a mask, using RIE-10NR manufactured by Samco International Co., and then the obtained silicon-containing intermediate layer film pattern was A dry etching process for the lower layer film using the mask and a dry etching process for the SiO ₂ film using the obtained lower layer film pattern as a mask were sequentially performed.

Each etching condition is as shown below.
Etching condition output to resist intermediate layer film of resist pattern : 50W
Pressure: 20Pa
Time: 1 min
Etching gas Ar gas flow rate: CF ₄ gas flow rate: O ₂ gas flow rate = 50: 8: 2 (sccm)
Output of etching condition to resist underlayer film of resist intermediate film pattern : 50W
Pressure: 20Pa
Time: 2min
Etching gas Ar gas flow rate: CF ₄ gas flow rate: O ₂ gas flow rate = 50: 5: 5 (sccm)
Etching condition output to SiO ₂ film of resist underlayer film pattern : 50W
Pressure: 20Pa
Time: 2min
Etching gas Ar gas flow rate: C ₅ F ₁₂ gas flow rate: C ₂ F ₆ gas flow rate: O ₂ gas flow rate = 50: 4: 3: 1 (sccm)

[Evaluation]
When the pattern cross section (shape of the SiO ₂ film after etching) obtained as described above was observed using an electron microscope (S-4800) manufactured by Hitachi, Ltd., the lower layer film of this embodiment was used. In this example, it was confirmed that the shape of the SiO ₂ film after etching in the multilayer resist processing was rectangular, and no defects were observed, which was good.

[Examples 53 to 56]
Using each compound synthesized in the synthesis example, an optical component-forming composition was prepared with the formulation shown in Table 11 below. Of the components of the optical component-forming composition in Table 11, the following were used for the acid generator, the crosslinking agent, the acid diffusion inhibitor, and the solvent.
Acid generator: Ditertiary butyl diphenyliodonium nonafluoromethanesulfonate (DTDDPI) manufactured by Midori Chemical Co., Ltd.
Cross-linking agent: Nikalac MX270 (Nikalac) manufactured by Sanwa Chemical Co., Ltd.
Organic solvent: Propylene glycol monomethyl ether acetate acetate (PGMEA)

[Evaluation of film formation]
The optical component-forming composition in a uniform state was spin-coated on a clean silicon wafer and then pre-baked (PB) in an oven at 110 ° C. to form an optical component-forming film having a thickness of 1 μm. The prepared optical component-forming composition was evaluated as “A” when the film formation was good and “C” when the formed film had defects.

[Evaluation of refractive index and transmittance]
A uniform optical component forming composition was spin-coated on a clean silicon wafer, and then PB was performed in an oven at 110 ° C. to form a film having a thickness of 1 μm. The refractive index (λ = 589.3 nm) at 25 ° C. of the film was measured with a multi-angle-of-incidence spectroscopic ellipsometer VASE manufactured by JA Woollam. The prepared film was evaluated as “A” when the refractive index was 1.65 or more, “B” when it was 1.6 or more and less than 1.65, and “C” when it was less than 1.6. . When the transmittance (λ = 632.8 nm) was 90% or more, “A” was evaluated, and when it was less than 90%, “C” was evaluated.

[Examples 57 to 60]
Using each compound synthesized in the synthesis example, a resist composition was prepared with the formulation shown in Table 12 below. Of the components of the resist composition in Table 12, the following were used for the radical generator, radical diffusion inhibitor, and solvent.
Radical generator: IRGACURE184 manufactured by BASF
Radical diffusion control agent: IRGACURE1010 manufactured by BASF
Organic solvent: Propylene glycol monomethyl ether acetate acetate (PGMEA)

[Evaluation methods]
(1) Storage stability of resist composition and thin film formation The storage stability of the resist composition was determined by standing the resist composition at 23 ° C. and 50% RH for 3 days and visually checking for the presence or absence of precipitation. Evaluation was made by observation. The resist composition after standing for 3 days was evaluated as A when it was a homogeneous solution and there was no precipitation, and C when there was precipitation. Moreover, after spin-coating the resist composition of a uniform state on the clean silicon wafer, it prebaked (PB) in 110 degreeC oven, and formed the resist film with a thickness of 40 nm. The prepared resist composition was evaluated as A when the thin film formation was good and as C when the formed film had defects.

(2) Pattern evaluation of resist pattern A uniform resist composition was spin-coated on a clean silicon wafer and then pre-exposure baked (PB) in an oven at 110 ° C. to form a resist film having a thickness of 60 nm. The obtained resist film was irradiated with an electron beam with a line and space setting of 1: 1 at intervals of 50 nm, 40 nm, and 30 nm using an electron beam drawing apparatus (ELS-7500, manufactured by Elionix Co., Ltd.). . After the irradiation, each resist film was heated at a predetermined temperature for 90 seconds and immersed in PGME for 60 seconds for development. Thereafter, the resist film was washed with ultrapure water for 30 seconds and dried to form a negative resist pattern. With respect to the formed resist pattern, the line and space was observed with a scanning electron microscope (S-4800, manufactured by Hitachi High-Technology Corporation), and the reactivity of the resist composition by electron beam irradiation was evaluated.
Sensitivity was expressed as the minimum amount of energy per unit area necessary for obtaining a pattern, and was evaluated according to the following.
A: When a pattern is obtained at less than 50 μC / cm ² C: When a pattern is obtained at 50 μC / cm ² or more In pattern formation, the obtained pattern shape is transferred to an SEM (Scanning Electron Microscope). And evaluated according to the following.
A: When a rectangular pattern is obtained B: When a substantially rectangular pattern is obtained C: When a non-rectangular pattern is obtained

As described above, the present invention is not limited to the above-described embodiments and examples, and appropriate modifications can be made without departing from the scope of the invention.

The compound and resin of the present embodiment have high solubility in a safe solvent, good heat resistance and etching resistance, and the resist composition of the present embodiment gives a good resist pattern shape.
In addition, a wet process can be applied, and a compound, a resin, and a film forming composition for lithography useful for forming a photoresist underlayer film having excellent heat resistance and etching resistance can be realized. And since this film-forming composition for lithography uses a compound or resin having a specific structure that has high heat resistance and high solvent solubility, deterioration of the film during high-temperature baking is suppressed, oxygen plasma etching, etc. It is possible to form a resist and an underlayer film that are also excellent in etching resistance to. Furthermore, when the lower layer film is formed, the adhesion with the resist layer is also excellent, so that an excellent resist pattern can be formed.
Furthermore, since the refractive index is high and coloring is suppressed by low-temperature to high-temperature treatment, it is useful as various optical component-forming compositions.
Accordingly, the present invention provides, for example, an electrical insulating material, a resist resin, a semiconductor sealing resin, an adhesive for a printed wiring board, an electrical laminate mounted on an electrical device / electronic device / industrial device, etc.・ Matrix resin for prepregs, built-up laminate materials, resin for fiber reinforced plastics, sealing resin for liquid crystal display panels, paints, various coating agents, adhesives, and coatings for semiconductors installed in electronic equipment and industrial equipment In addition to resin, resin for semiconductor resist, resin for forming lower layer film, film and sheet, plastic lens (prism lens, lenticular lens, micro lens, Fresnel lens, viewing angle control lens, contrast enhancement lens, etc.) , Retardation film, electromagnetic shielding film, prism, optical fiber, flexible film Solder resist cement lines, plating resist, multilayer printed wiring boards interlayer insulating film, the optical component such as a photosensitive optical waveguide, it is widely and effectively available.

This application is based on a Japanese patent application (Japanese Patent Application No. 2016-143684) filed with the Japan Patent Office on July 21, 2016, the contents of which are incorporated herein by reference.

The present invention has industrial applicability in the fields of lithography resist, lithography underlayer film, multilayer resist underlayer film and optical components.

Claims

The compound represented by following formula (0).

(In Formula (0), R Y is a hydrogen atom, an alkyl group having 1 to 30 carbon atoms, or an aryl group having 6 to 30 carbon atoms,
R Z is an N-valent group having 1 to 60 carbon atoms or a single bond,
R T each independently has an alkyl group having 1 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, or a substituent. An optionally substituted alkenyl group having 2 to 30 carbon atoms, an optionally substituted alkoxy group having 1 to 30 carbon atoms, a halogen atom, a nitro group, an amino group, a carboxylic acid group, a thiol group, a hydroxyl group, or a formula The alkyl group, the aryl group, the alkenyl group, and the alkoxy group may include an ether bond, a ketone bond, or an ester bond, where R T At least one includes a group represented by formula (0-1),
X represents an oxygen atom, a sulfur atom or no bridge,
m is each independently an integer of 0 to 9, wherein at least one of m is an integer of 1 to 9,
N is an integer of 1 to 4, where, when N is an integer of 2 or more, the structural formulas in N [] may be the same or different,
Each r is independently an integer of 0-2. )

(In formula (0-1), R X represents a hydrogen atom or a methyl group.)
The compound of Claim 1 whose compound represented by said Formula (0) is a compound represented by following formula (1).

(In Formula (1), R 0 has the same meaning as R Y ,
R 1 is an n-valent group having 1 to 60 carbon atoms or a single bond,
R 2 to R 5 are each independently an optionally substituted alkyl group having 1 to 30 carbon atoms, an optionally substituted aryl group having 6 to 30 carbon atoms, or a substituent. An alkenyl group having 2 to 30 carbon atoms which may have a substituent, an alkoxy group having 1 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxylic acid group, a thiol group, A hydroxyl group or a group represented by the formula (0-1), and the alkyl group, the aryl group, the alkenyl group, and the alkoxy group may include an ether bond, a ketone bond, or an ester bond, At least one of R 2 to R 5 includes a group represented by the formula (0-1),
m 2 and m 3 are each independently an integer of 0 to 8,
m 4 and m 5 are each independently an integer of 0 to 9,
However, m 2 , m 3 , m 4 and m 5 are not 0 at the same time,
n is synonymous with N, and when n is an integer of 2 or more, the structural formulas in n [] may be the same or different;
p 2 to p 5 have the same meaning as r. )
The compound of Claim 1 whose compound represented by said Formula (0) is a compound represented by following formula (2).

(In Formula (2), R 0A has the same meaning as R Y ,
R 1A is an n A valent group having 1 to 60 carbon atoms or a single bond,
R 2A each independently has an optionally substituted alkyl group having 1 to 30 carbon atoms, an optionally substituted aryl group having 6 to 30 carbon atoms, or a substituent. An optionally substituted alkenyl group having 2 to 30 carbon atoms, an optionally substituted alkoxy group having 1 to 30 carbon atoms, a halogen atom, a nitro group, an amino group, a carboxylic acid group, a thiol group, a hydroxyl group, or a formula The alkyl group, the aryl group, the alkenyl group, and the alkoxy group may include an ether bond, a ketone bond, or an ester bond, where R 2A is a group represented by At least one includes a group represented by formula (0-1),
n A has the same meaning as N above. Here, when n A is an integer of 2 or more, the structural formulas in n A [] may be the same or different,
X A represents an oxygen atom, a sulfur atom, or no bridge,
m 2A is each independently an integer of 0 to 7, provided that at least one m 2A is an integer of 1 to 7;
q A is each independently 0 or 1. )
The compound according to claim 2, wherein the compound represented by the formula (1) is a compound represented by the following formula (1-1).

(In the formula (1-1), R 0 , R 1 , R 4 , R 5 , n, p 2 to p 5 , m 4 and m 5 are as defined above.
R 6 to R 7 are each independently an optionally substituted alkyl group having 1 to 30 carbon atoms, an optionally substituted aryl group having 6 to 30 carbon atoms, or a substituent. An alkenyl group having 2 to 30 carbon atoms, a halogen atom, a nitro group, an amino group, a carboxylic acid group, or a thiol group, which may have
R 10 to R 11 are each independently a hydrogen atom or a group represented by the formula (0-2);
Here, at least one of R 10 to R 11 is a group represented by the formula (0-2),
m 6 and m 7 are each independently an integer of 0 to 7,
However, m 4 , m 5 , m 6 and m 7 are not 0 at the same time. )

(In the formula (0-2), R X is as defined above, R W is a linear, branched or cyclic alkylene group having 1 to 30 carbon atoms, and s is an integer of 0 to 30. .)
The compound according to claim 4, wherein the compound represented by the formula (1-1) is a compound represented by the following formula (1-2).

(In the formula (1-2), R 0 , R 1 , R 6 , R 7 , R 10 , R 11 , n, p 2 to p 5 , m 6 and m 7 are as defined above.
R 8 to R 9 have the same meanings as R 6 to R 7 ,
R 12 to R 13 have the same meanings as R 10 to R 11 ,
m 8 and m 9 are each independently an integer of 0 to 8,
However, m 6 , m 7 , m 8 and m 9 are not 0 at the same time. )
The compound according to claim 3, wherein the compound represented by the formula (2) is a compound represented by the following formula (2-1).

(In the formula (2-1), R 0A , R 1A , n A , q A and X A are as defined in the formula (2);
Each R 3A is independently a linear, branched or cyclic alkyl group having 1 to 30 carbon atoms which may have a substituent, and 6 to 30 carbon atoms which may have a substituent. An aryl group, an optionally substituted alkenyl group having 2 to 30 carbon atoms, a halogen atom, a nitro group, an amino group, a carboxylic acid group, or a thiol group,
R 4A is each independently a hydrogen atom or a group represented by the formula (0-2), wherein at least one of R 4A is a group represented by the formula (0-2);
m 6A is each independently an integer of 0 to 5. )
A resin obtained by using the compound according to claim 1 as a monomer.
The resin of Claim 7 which has a structure represented by following formula (3).

(In formula (3),
L is an optionally substituted alkylene group having 1 to 30 carbon atoms, an optionally substituted arylene group having 6 to 30 carbon atoms, or an optionally substituted carbon number. 1 to 30 alkoxylene groups or single bonds, and the alkylene group, the arylene group, and the alkoxylene group may include an ether bond, a ketone bond, or an ester bond,
R 0 has the same meaning as R Y ,
R 1 is an n-valent group having 1 to 60 carbon atoms or a single bond,
R 2 to R 5 are each independently an optionally substituted alkyl group having 1 to 30 carbon atoms, an optionally substituted aryl group having 6 to 30 carbon atoms, or a substituent. An alkenyl group having 2 to 30 carbon atoms which may have a substituent, an alkoxy group having 1 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxylic acid group, a thiol group, A hydroxyl group or a group represented by the formula (0-1), and the alkyl group, the aryl group, the alkenyl group, and the alkoxy group may include an ether bond, a ketone bond, or an ester bond, At least one of R 2 to R 5 includes a group represented by the formula (0-1),
m 2 and m 3 are each independently an integer of 0 to 8,
m 4 and m 5 are each independently an integer of 0 to 9,
However, m 2 , m 3 , m 4 and m 5 do not simultaneously become 0, and at least one of R 2 to R 5 is a group represented by the formula (0-2). )
The resin of Claim 7 which has a structure represented by following formula (4).

(In Formula (4), L has an optionally substituted alkylene group having 1 to 30 carbon atoms, an optionally substituted arylene group having 6 to 30 carbon atoms, and a substituent. The alkylene group, the arylene group and the alkoxylene group may contain an ether bond, a ketone bond or an ester bond,
R 0A has the same meaning as R Y ,
R 1A is an n A valent group having 1 to 30 carbon atoms or a single bond,
R 2A each independently has an optionally substituted alkyl group having 1 to 30 carbon atoms, an optionally substituted aryl group having 6 to 30 carbon atoms, or a substituent. An optionally substituted alkenyl group having 2 to 30 carbon atoms, an optionally substituted alkoxy group having 1 to 30 carbon atoms, a halogen atom, a nitro group, an amino group, a carboxylic acid group, a thiol group, a hydroxyl group or a hydroxyl group In which the alkyl group, the aryl group, the alkenyl group, and the alkoxy group may include an ether bond, a ketone bond, or an ester bond. , At least one of R 2A contains a group of formula (0-1)
n A has the same meaning as N above. Here, when n A is an integer of 2 or more, the structural formulas in n A [] may be the same or different,
X A represents an oxygen atom, a sulfur atom, or no bridge,
m 2A is each independently an integer of 0 to 7, provided that at least one m 2A is an integer of 1 to 7;
q A is each independently 0 or 1. )
A composition comprising at least one selected from the group consisting of the compound according to any one of claims 1 to 6 and the resin according to any one of claims 7 to 9.
The composition according to claim 10, further comprising a solvent.
The composition according to claim 10 or 11, further comprising an acid generator.
The composition according to any one of claims 10 to 12, further comprising a crosslinking agent.
The cross-linking agent is at least one selected from the group consisting of phenol compounds, epoxy compounds, cyanate compounds, amino compounds, benzoxazine compounds, melamine compounds, guanamine compounds, glycoluril compounds, urea compounds, isocyanate compounds, and azide compounds. The composition according to claim 13.
The composition according to claim 13 or 14, wherein the crosslinking agent has at least one allyl group.
A composition containing at least one selected from the group consisting of the compound according to any one of claims 1 to 6 and the resin according to any one of claims 7 to 9 in which the content of the crosslinking agent is The composition according to any one of claims 13 to 15, which is 0.1 to 100 parts by mass when the total mass of the product is 100 parts by mass.
The composition according to any one of claims 13 to 16, further comprising a crosslinking accelerator.
The composition according to claim 17, wherein the crosslinking accelerator is at least one selected from the group consisting of amines, imidazoles, organic phosphines, and Lewis acids.
The content ratio of the crosslinking accelerator contains one or more selected from the group consisting of the compound according to any one of claims 1 to 6 and the resin according to any one of claims 7 to 9. The composition according to claim 17 or 18, which is 0.1 to 5 parts by mass when the total mass of the composition is 100 parts by mass.
The composition according to any one of claims 10 to 19, further comprising a radical polymerization initiator.
21. The composition according to claim 20, wherein the radical polymerization initiator is at least one selected from the group consisting of a ketone photopolymerization initiator, an organic peroxide polymerization initiator, and an azo polymerization initiator.
The content ratio of the radical polymerization initiator contains at least one selected from the group consisting of the compound according to any one of claims 1 to 6 and the resin according to any one of claims 7 to 9. The composition according to claim 20 or 21, which is 0.05 to 25 parts by mass when the total mass of the composition to be used is 100 parts by mass.
The composition according to any one of claims 10 to 22, which is used for forming a film for lithography.
The composition according to any one of claims 10 to 22, which is used for forming a resist permanent film.
The composition according to any one of claims 10 to 22, which is used for forming an optical component.
25. A resist pattern forming method, comprising: forming a photoresist layer on a substrate using the composition according to claim 23; and irradiating a predetermined region of the photoresist layer with radiation to perform development.
24. A lower layer film is formed on a substrate using the composition according to claim 23, and at least one photoresist layer is formed on the lower layer film, and then a predetermined region of the photoresist layer is irradiated with radiation. And a resist pattern forming method including a step of developing.
24. A lower layer film is formed on a substrate using the composition according to claim 23, an intermediate layer film is formed on the lower layer film using a resist intermediate layer film material, and at least one layer is formed on the intermediate layer film. Forming a photoresist layer of
Irradiating a predetermined region of the photoresist layer with radiation and developing to form a resist pattern;
Etching the intermediate layer film using the resist pattern as a mask, etching the lower layer film using the obtained intermediate layer film pattern as an etching mask, and etching the substrate using the obtained lower layer film pattern as an etching mask. Forming a pattern;
A circuit pattern forming method.