WO2017215366A1 - 电路基板、显示面板和显示装置 - Google Patents

电路基板、显示面板和显示装置 Download PDF

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Publication number
WO2017215366A1
WO2017215366A1 PCT/CN2017/083474 CN2017083474W WO2017215366A1 WO 2017215366 A1 WO2017215366 A1 WO 2017215366A1 CN 2017083474 W CN2017083474 W CN 2017083474W WO 2017215366 A1 WO2017215366 A1 WO 2017215366A1
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WIPO (PCT)
Prior art keywords
wires
circuit substrate
circuit
present disclosure
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/083474
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English (en)
French (fr)
Inventor
徐敬义
张琨鹏
任艳伟
赵艳艳
樊祎
刘宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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Application filed by BOE Technology Group Co Ltd, Ordos Yuansheng Optoelectronics Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US15/567,181 priority Critical patent/US10921660B2/en
Publication of WO2017215366A1 publication Critical patent/WO2017215366A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136204—Arrangements to prevent high voltage or static electricity failures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/613—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures by means of interconnecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection

Definitions

  • Embodiments of the present disclosure relate to the field of electronics, and in particular, to a circuit substrate, a display panel, and a display device.
  • Electrostatic discharge (ESD) damage and damage to electronic products includes sudden damage and potential damage. Sudden injury refers to severe damage to the device and loss of function. This damage is usually found in the quality inspection of the production process. The potential damage refers to the partial damage of the device and the loss of function. Potential damage is usually not detected in the production process, which may cause unstable products during use, which may pose a greater hazard to product quality. Therefore, there is a need to continuously improve the electrostatic protection performance of electronic products.
  • Embodiments of the present disclosure provide a circuit substrate, a display panel, and a display device having improved static electricity protection performance.
  • a circuit substrate includes a ground protection circuit that is disposed in a peripheral region of the circuit substrate.
  • the ground protection circuit includes one or more first wires arranged in parallel, a bridge, and a plurality of second wires arranged in parallel. One end of each of the first wires is grounded, and the other end is electrically connected to the bridge portion; one end of each of the second wires is electrically connected to the bridge portion, and the other end is grounded.
  • each of the first wires is electrically connected to the bridge portion, and each One end of the second wire is electrically connected to the bridge portion, so that the first wires are electrically connected to each other, and the second wires are also electrically connected to each other, and further between the first wires and the second wires.
  • each of the first wires and each of the second wires are continuous wires.
  • the bridge portion may include a plurality of bridge portions, each of the first wires being divided into a plurality of first wire segments by at least one of the plurality of bridge portions, and/or each of the second wires The second wire segment is divided into a plurality of second wire segments by at least one of the plurality of bridge portions.
  • each of the first wires is electrically connected to one side of the rectangle, and each of the second wires is electrically connected to the other side of the rectangle opposite the one side.
  • the bridging portion is triangular, circular, elliptical, trapezoidal, or X-shaped. According to this configuration, the bridge can be flexibly implemented in various ways.
  • the bridging portion is located at a center of one side of the circuit substrate. According to this configuration, since the bridging portion is located at the center of one side of the circuit board, it is possible to effectively increase the electrostatic discharge path by utilizing the bilaterally symmetrical structure of the product including the circuit board in the one side direction.
  • the circuit substrate includes an array substrate, and the ground protection circuit described herein may be disposed in a peripheral region of the array substrate.
  • the bridging portion can be disposed at the center of the short side of the array substrate, and the narrow bezel design of the long side of the array substrate is not affected, except that the electrostatic discharge path can be increased by the symmetrical structure of the product.
  • the circuit substrate may further include an additional circuit board on which the ground terminal is disposed, and each of the first wires and each of the second wires are grounded through the ground terminal, respectively. According to this configuration, the electrostatic discharge path can be discharged to the ground through the ground terminal, thereby reducing the risk of static electricity damage to the circuit substrate.
  • a display panel is provided.
  • the display panel may include the circuit substrate described in any of the embodiments of the present disclosure.
  • a display device comprising the display panel described in any of the embodiments of the present disclosure.
  • the display panel and the display device can make static electricity easier to guide away and reduce the risk of static electricity damage to the circuit substrate.
  • 1A is a plan view showing a prior art circuit substrate
  • FIG. 1B shows a schematic diagram of generating static electricity at a plurality of locations in the configuration of FIG. 1A;
  • FIG. 2A illustrates a top view of a circuit substrate in accordance with an embodiment of the present disclosure
  • FIG. 2B shows a schematic diagram of generating static electricity at a plurality of locations in the configuration of FIG. 2A;
  • Figure 3 shows an enlarged view of the exemplary bridge of Figure 2A
  • FIG. 4 illustrates a top view of a circuit substrate in accordance with another embodiment of the present disclosure
  • 5A-5I show schematic views of a bridge in accordance with an alternative embodiment of the present disclosure.
  • connection includes a direct or indirect connection between the elements.
  • circuit substrate including an array substrate for a display panel
  • principles of the present disclosure may be applied to needs. Any other type of circuit substrate that is electrostatically protected.
  • FIG. 1A shows a top view of a prior art circuit substrate
  • FIG. 1B shows a schematic diagram of static generation at a plurality of locations (ie, positions 1, 2, 3, 4, 5, 6, and 7) in the configuration of FIG. 1A.
  • the circuit substrate may include, for example, an array substrate 102 for a liquid crystal display panel or an organic light emitting diode (OLED) display panel for a mobile product, a flexible printed circuit board (FPC) 110, and a wire 104 for discharging static electricity.
  • the wires 104 are disposed along the periphery of the array substrate 102.
  • a flexible printed circuit board (FPC) 110 is attached to the array substrate 102 for providing drive to the array substrate 102.
  • Ground terminals a and b are provided on the FPC 110, and are electrically connected to both ends of the wire 104, respectively.
  • static electricity on the array substrate 102 can be released to the ground through the discharge loop formed by the wires 104 and the ground terminals a and b on the FPC 110.
  • static electricity is not sufficiently sufficient. Entering the ground terminal causes a probability of damage to the circuit on the array substrate.
  • Embodiments of the present disclosure provide a circuit substrate, a display panel, and a display device having improved static electricity protection performance.
  • the circuit substrate, the display panel, and the display device of the present disclosure will be specifically described in the corresponding embodiments.
  • the circuit substrate may include, for example, an array substrate 202 for a liquid crystal display panel or an OLED display panel of a mobile product.
  • the non-peripheral regions of the array substrate 202 may include, for example, existing gate lines, data lines, driving thin film transistors (TFTs), and holding capacitors.
  • the non-peripheral regions of the array substrate 202 may include, for example, existing gate lines, data lines, driving TFTs, and the like.
  • the circuit substrate includes a ground protection circuit disposed along its periphery.
  • a ground protection circuit may be disposed in a peripheral region of the array substrate 202.
  • the ground protection circuit may include two first wires 204-1 and 204-2 arranged in parallel, a bridge 206, and two second wires 208-1 and 208-2 arranged in parallel.
  • Each One ends of the first wires 204-1, 204-2 are grounded, and the other ends are electrically connected to the bridge portion 206.
  • One end of each of the second wires 208-1, 208-2 is electrically connected to the bridge portion 206, and the other end is grounded.
  • the bridge portion 206 is located at a position corresponding to the center of the short side of the array substrate 202.
  • Figure 3 shows an enlarged view of the exemplary bridge portion of Figure 2A.
  • the bridging portion 206 may have a rectangular shape, one short side of the rectangle is electrically connected to each of the first wires 204-1, 204-2, and the other of the rectangles is opposite to the one side. The sides are electrically connected to each of the second wires 208-1, 208-2.
  • the bridge 206 electrically connects the first wire 204-1 with all of the second wires 208-1 and 208-2 and the first wire 204-2 with all of the second wires 208-1 and 208-2 Electrical connection.
  • first wire and the second wire are not limited to two opposite short sides respectively electrically connected to the rectangular bridge.
  • first wire and the second wire may also be electrically connected to the two long sides of the bridge, respectively; as another example, the first wire may be connected to the short side of the bridge and the second wire Electrically connected to the long side of the bridge.
  • the first wire, the bridge, and the second wire may be made of a metal material such as silver, and materials constituting the first wire and the second wire may be the same or different.
  • the circuit substrate may further include an additional circuit board provided with a ground terminal, and each of the first wires and each of the second wires may be grounded through the ground terminals, respectively.
  • the additional circuit board can be an FPC 210 that is attached to the array substrate 202 for providing drive to the array substrate 202.
  • the FPC 210 may include an existing peripheral driver module such as a gate driver, a source driver, or the like.
  • ground terminals a, b, c, and d are provided on the FPC 210, and are electrically connected to the wires 204-1, 204-2, 208-1, and 208-2, respectively.
  • static electricity applied from the outside to the array substrate 202 can be released to the ground through the discharge loop formed by the first wire, the bridge portion, and the second wire and the ground terminals a, b, c, d.
  • the bridging portion 206 electrically connects each of the first wires to all of the second wires, the first wires are electrically connected to each other, and the second wires are also electrically connected to each other, and further between the first wires, An electrostatic discharge path is formed between each of the second wires, and between each of the first wires and the second wires, thereby forming an effective and a large number of shielded ground wires to protect the array base The board is not damaged by ESD.
  • the bridging portion 206 is disposed at a position corresponding to the center of the short side of the array substrate 202, and the left-right symmetric structure of the product in the short-side direction can be effectively utilized to increase the path of the ESD discharge.
  • the lightning-like icons in FIGS. 1B and 2B represent positions where static electricity is generated during the reliability ESD test
  • static electricity is generated at the position 2 in FIG. 2B
  • the discharge path of the circuit substrate The following six discharge paths are included: a ⁇ 204-1 ⁇ 206 ⁇ 208-1 ⁇ c, b ⁇ 204-2 ⁇ 206 ⁇ 208-1 ⁇ c, a ⁇ 204-1 ⁇ 206 ⁇ 208-2 ⁇ d,b ⁇ 204-2 ⁇ 206 ⁇ 208-2 ⁇ d, a ⁇ 204-1 ⁇ 206 ⁇ 204-2 ⁇ b, c ⁇ 208-1 ⁇ 206 ⁇ 208-2 ⁇ d.
  • static electricity is generated at the position 2 in Fig.
  • the embodiment of the present disclosure achieves the effect of increasing the discharge path by the difference of the grounding wires, thereby improving the problem that the ESD breakdown circuit on the circuit substrate caused by the small discharge path is small, and the ability to resist ESD is improved.
  • the static electricity generated at other locations in Figure 2B can also be released through the six paths described above.
  • the ground protection circuit of the circuit substrate can be realized by any existing technique for forming a metal layer.
  • the first wire, the bridge, and the second wire may be formed by photolithography to form a ground protection circuit; or the ground protection circuit may be formed in a peripheral region of the circuit substrate by deposition or sputtering.
  • embodiments of the present disclosure can prevent ESD damage by optimizing the pattern of the ground protection circuit, thereby improving the NG (Negative) problem of ESD testing in product reliability.
  • the embodiment of the present disclosure does not need to add any excess mask, does not change the thickness of the film layer, does not increase the process, so does not reduce the productivity, and can achieve the effect of resisting ESD.
  • the number of each of the first wire and the second wire is not limited to two.
  • the number of one of the first wire and the second wire may be one, and the number of the other of the first wire and the second wire may be two.
  • the first wire and the second wire may each include a plurality of strips.
  • the position of the bridge portion is not limited to the center corresponding to the short side of the array substrate.
  • the bridging portion can be located anywhere along the perimeter of the array substrate, for example, the bridging portion can be disposed at a central location on the long side of the array substrate.
  • FIG. 4 illustrates a top view of a circuit substrate in accordance with another embodiment of the present disclosure.
  • the number of bridging portions is three, and each of the first wires 204-1, 204-2 can be divided into two first wire segments by one of the three bridging portions 206. That is, each of the first wires 204-1, 204-2 may include two first wire segments, which may be electrically connected by the bridge portion 206.
  • each of the second wires 208-1, 208-2 can be divided into two second wire segments by the other of the three bridge portions 206, that is, each of the second wires 208-1, 208- 2 may include two second wire segments that may be electrically connected by bridges 206. It can be understood that in the embodiment shown in FIG. 4, the number of the bridge portions may be more. Accordingly, the bridge portion may also divide the first wire and the second wire into more wire segments. In this embodiment, it is also possible to treat two or more bridges and the wires between them as a whole as one larger bridge.
  • the shape of the bridge portion 206 is not limited to the rectangle shown in FIGS. 3 and 5A.
  • the bridging portion may be triangular (see FIG. 5B, FIG. 5C), circular (see FIG. 5D, FIG. 5E), elliptical (similar to FIG. 5D, FIG. 5E), trapezoidal (see FIG. 5F, FIG. 5G). , or X shape (see Figure 5H, Figure 5I).
  • the bridging portion may also be in any other suitable shape as long as it is electrically connected to each of the first wires and electrically connected to each of the second wires. It should be noted that the bridges shown in Figures 3 and 5A-5I are merely illustrative.
  • the width of each wire can be widened as much as possible to reduce the resistance of each wire, thereby having better static electricity. Release the effect.
  • the ground terminal is not limited to being disposed on the FPC.
  • the ground terminal can be disposed on a non-flexible circuit board that is connected to the array substrate.
  • the ground terminal can also be located on the array substrate.
  • the ground protection circuit of the embodiment of the present disclosure is set in electricity
  • the peripheral area of the circuit substrate so as described above, the present disclosure is not particularly limited in terms of the circuit type or function of the non-peripheral area of the circuit substrate, that is, the ground protection circuit of the embodiment of the present disclosure can be applied to the need for electrostatic protection. Any other type of circuit substrate.
  • a display panel according to an embodiment of the present disclosure may include the circuit substrate of the embodiment of the present disclosure described above, and may be, for example, a liquid crystal display panel or an OLED display panel.
  • the display device according to an embodiment of the present disclosure includes the display panel of the embodiment of the present disclosure described herein, and may be, for example, a liquid crystal display device or an OLED display device.
  • the display panel and the display device according to the embodiments of the present disclosure have improved static electricity protection performance due to the circuit substrate including the embodiment of the present disclosure described above.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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  • Elimination Of Static Electricity (AREA)

Abstract

一种电路基板、显示面板和显示装置。电路基板包括接地保护电路，其被设置在电路基板的周边区域。该接地保护电路包括一条或多条并行排列的第一导线（204-1, 204-2）、桥连部（206）、以及多条并行布置的两条第二导线（208-1, 208-2）；每条第一导线（204-1, 204-2）的一端接地，且另一端与桥连部（206）电连接；每条第二导线（208-1, 208-2）的一端与桥连部（206）电连接，且另一端接地。显示面板包括所述电路基板。显示装置包括所述显示面板。

Description

电路基板、显示面板和显示装置
相关申请的交叉引用
本申请要求于2016年06月17日递交的中国专利申请第201610430337.5号的优先权和权益，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开的实施例涉及电子领域，特别涉及一种电路基板、显示面板和显示装置。
背景技术
静电放电(ESD)对电子产品造成的破坏和损伤包括突发性损伤和潜在性损伤。突发性损伤指的是器件被严重损坏，功能丧失。这种损伤通常在生产过程的质量检测中能够发现。而潜在性损伤指的是器件被部分损坏，功能尚未丧失。潜在性损伤在生产过程的检测中通常不能发现，会使产品在使用过程中出现不稳定的现象，因而可能对产品质量构成更大的危害。因此，存在着不断提高电子产品的静电防护性能的需求。
发明内容
本公开的实施例提供了一种电路基板、显示面板和显示装置，其具有改善的静电防护性能。
根据本公开的第一方面，提供了一种电路基板。该电路基板包括接地保护电路，其被设置在电路基板的周边区域。该接地保护电路包括一条或多条并行布置的第一导线、桥连部、以及多条并行布置的第二导线。每条第一导线的一端接地，且另一端与所述桥连部电连接；每条第二导线的一端与所述桥连部电连接，且另一端接地。
根据上述配置，由于每条第一导线的另一端与桥连部电连接、且每条 第二导线的一端与桥连部电连接，所以各条第一导线相互电连接、且各条第二导线也相互电连接，进而在各条第一导线之间、在各条第二导线之间、以及在各条第一导线与各条第二导线之间都形成静电放电路径，从而增加静电放电路径的数量、使静电更容易通过静电放电路径释放、并降低静电对电路基板的破坏的风险。
在本公开的实施例中，每条第一导线和每条第二导线都为连续的导线。
在本公开的实施例中，桥连部可以包括多个桥连部，每条第一导线被多个桥连部中的至少一个分成多个第一导线段，和/或每条第二导线被多个桥连部中的至少另一个分成多个第二导线段。
在本公开的实施例中，所述桥连部呈矩形。
在本公开的实施例中，每条第一导线电连接到该矩形的一个边，并且每条第二导线电连接到该矩形的与该一个边相对的另一边。
在本公开的实施例中，所述桥连部呈三角形、圆形、椭圆形、梯形、或者X形。根据该配置，桥连部可以以各种方式灵活地实现。
在本公开的实施例中，所述桥连部位于所述电路基板的一个边的中心的位置。根据该配置，由于桥连部位于电路基板的一个边的中心的位置，所以能够有效地利用包含所述电路基板的产品在该一个边方向上的左右对称结构来增加静电放电路径。
在本公开的实施例中，所述电路基板包括阵列基板，可以将本文描述的接地保护电路设置在阵列基板的周边区域。这样，可以将桥连部设置在阵列基板的短边的中心位置，除了能够利用产品的对称结构增加静电放电路径之外，还不会影响阵列基板的长边的窄边框设计。
在本公开的实施例中，电路基板可以进一步包括附加电路板，该附加电路板上设置有接地端子，并且每条第一导线和每条第二导线分别通过接地端子接地。根据这种配置，静电放电路径可以通过接地端子向地放电，从而降低静电对电路基板的破坏的风险。
根据本公开的第二方面，提供一种显示面板。该显示面板可以包括本公开的任一实施例描述的电路基板。
根据本公开的第三方面，提供一种显示装置，包括本公开的任一实施例描述的显示面板。
根据上述配置，由于采用了根据本公开的实施例描述的电路基板，所以显示面板和显示装置能够使静电更容易导走、并降低静电对电路基板的破坏的风险。
附图说明
为了更清楚地说明本公开的实施例的技术方案，下面将对实施例的附图作简单地介绍。明显地，以下附图中的结构示意图不一定按比例绘制，而是以简化形式呈现各特征。而且，下面描述中的附图仅仅涉及本公开的一些实施例，而并非对本公开进行限制。
图1A示出现有技术的电路基板的俯视图；
图1B示出在图1A的配置中在多个位置处产生静电的示意图；
图2A示出根据本公开的一个实施例的电路基板的俯视图；
图2B示出在图2A的配置中在多个位置处产生静电的示意图；
图3示出图2A的示例性桥连部的放大图；
图4示出根据本公开的另一个实施例的电路基板的俯视图；以及
图5A-5I示出根据本公开的可选实施例的桥连部的示意图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
在本文中，术语“连接”包括元件之间的直接连接或间接连接。此外，应注意的是，尽管在本文中在电路基板包括用于显示面板的阵列基板的背景中描述本公开的实施例，但本领域技术人员能够理解的是，本公开的原理可以应用于需要静电防护的任何其他类型的电路基板。
图1A示出现有技术的电路基板的俯视图；图1B示出在图1A的配置中在多个位置处(即位置1、2、3、4、5、6和7)产生静电的示意图。如图1A所示，该电路基板可以包括例如用于移动产品的液晶显示面板或有机发光二极管(OLED)显示面板的阵列基板102、柔性印刷电路板(FPC)110以及用于释放静电的导线104。导线104沿阵列基板102的周边设置。柔性印刷电路板(FPC)110附接在阵列基板102上，用于向阵列基板102提供驱动。在FPC 110上设置有接地端子a和b，分别与导线104的两端电连接。这样，阵列基板102上的静电可以通过导线104与FPC 110上的接地端子a和b所形成的放电回路向地释放。然而，在图1的配置中，由于静电释放路径只有一条即a→104→b，当在电路基板附近(特别是在如图1B所示的多个位置处)产生静电时，静电无法充分地进入接地端子中，从而造成阵列基板上的电路的几率性损伤。
本公开的实施例提供了一种电路基板、显示面板和显示装置，其具有改善的静电防护性能。在下文中，将以相应的实施例对本公开的电路基板、显示面板和显示装置进行具体说明。
I.电路基板
图2A示出根据本公开的一个实施例的电路基板的俯视图；图2B示出在图2A的配置中在多个位置处(即位置1、2、3、4、5、6和7)产生静电的示意图。如图2A所示，该电路基板可以包括例如用于移动产品的液晶显示面板或OLED显示面板的阵列基板202。对于液晶显示面板的情况，阵列基板202的非周边区域可以包括例如现有的栅极线、数据线、驱动薄膜晶体管(TFT)和保持电容等元件。对于OLED显示面板的情况，阵列基板202的非周边区域可以包括例如现有的栅极线、数据线、驱动TFT等元件。
如图2A所示，根据该实施例的电路基板包括沿其周边设置的接地保护电路。在示例性的实施例中，可以将接地保护电路设置在阵列基板202的周边区域。该接地保护电路可以包括并行布置的两条第一导线204-1和204-2、桥连部206、以及并行布置的两条第二导线208-1和208-2。每条 第一导线204-1、204-2的一端接地，且另一端与桥连部206电连接。每条第二导线208-1、208-2的一端与桥连部206电连接，且另一端接地。桥连部206位于与阵列基板202的短边的中心相对应的位置。
图3示出图2A中的示例性桥连部的放大图。如图3所示，该桥连部206可以呈矩形，该矩形的一个短边与每条第一导线204-1、204-2电连接，且该矩形的与该一个边相对的另一个短边与每条第二导线208-1、208-2电连接。由此，该桥连部206将第一导线204-1与所有第二导线208-1和208-2电连接，并且将第一导线204-2与所有第二导线208-1和208-2电连接。
需要说明的是，第一导线和第二导线不限于分别电连接到矩形桥连部的两个相对的短边。作为示例，也可以将第一导线和第二导线分别电连接到桥连部的两个长边；作为另一示例，可以将第一导线连接到桥连部的短边，并且将第二导线电连接到桥连部的长边。
在本公开的实施例中，第一导线、桥连部和第二导线可以由金属材料(例如银)制成，且构成第一导线和第二导线的材料可以相同或不同。
电路基板还可以包括附加电路板，该附加电路板上设置有接地端子，并且每条第一导线和每条第二导线可以分别通过接地端子接地。在一个示例中，如图2A所示，附加电路板可以为FPC 210，该FPC 210附接在阵列基板202上，用于向阵列基板202提供驱动。对于液晶显示面板或OLED显示面板的情况，FPC 210可以包括现有的栅极驱动器、源极驱动器等外围驱动模块。如图2A所示，在FPC 210上设置有接地端子a、b、c、d，分别与导线204-1、204-2、208-1、208-2电连接。这样，从外部施加到阵列基板202上的静电可以通过第一导线、桥连部和第二导线与接地端子a、b、c、d所形成的放电回路向地释放。
由于桥连部206将每条第一导线与所有第二导线电连接，所以各条第一导线相互电连接、且各条第二导线也相互电连接，进而在各条第一导线之间、在各条第二导线之间、以及在各条第一导线与各条第二导线之间都形成静电放电路径，从而形成有效且数量多的屏蔽接地导线，保护阵列基 板不受ESD损伤。
在本公开的实施例中，将桥连部206设置在与阵列基板202的短边的中心相对应的位置，能够有效地利用产品在短边方向上的左右对称结构来增加ESD放电的路径。
作为示例，当执行信赖性ESD测试时(图1B和图2B中的闪电状图标代表信赖性ESD测试时产生静电的位置)，如果在图2B中的位置2产生静电，则电路基板的放电路径包括以下6条放电路径：a→204-1→206→208-1→c，b→204-2→206→208-1→c，a→204-1→206→208-2→d，b→204-2→206→208-2→d，a→204-1→206→204-2→b，c→208-1→206→208-2→d。然而，如果在图1B中的位置2产生静电，电路基板的放电路径只有一条即a→104→b。因此，根据该实施例的如图2A和2B所示的电路基板的放电路径的数量为图1A和图1B所示的电路基板的6倍。由此可见，本公开的实施例通过接地导线差异，达到增加放电路径的效果，进而可以改善因放电路径少造成的ESD击穿电路基板上的驱动电路的问题，提高了抗ESD的能力。类似地，在图2B的其他位置处产生的静电，同样可以通过上述六条路径进行释放。
根据该实施例的电路基板的接地保护电路可以利用任何现有的用于形成金属层的技术来实现。例如，可以通过光刻的方式形成第一导线、桥连部和第二导线，从而形成接地保护电路；或者通过沉积或溅射的方式在电路基板的周边区域形成该接地保护电路。
由此可见，本公开的实施例能够通过优化接地保护电路的图形，防止ESD损伤，从而能够改善产品信赖性中ESD测试的NG(Negative)问题。此外，本公开的实施例不用增加任何多余的掩膜，不用改变膜层厚度，不用增加工序，所以不会降低产能，并且能够达到抗击ESD的效果。
应当理解，本公开并不限于上面描述的实施例。首先，第一导线和第二导线各自的数量并不限于两条。作为示例，如图4A所示，第一导线和第二导线中的一者的数量可以为一条，且第一导线和第二导线中的另一者的数量可以为两条。作为另一示例，第一导线和第二导线可以都包括多条。 其次，桥连部的位置并不限于对应于阵列基板的短边的中心。作为示例，桥连部可以位于沿阵列基板周边的任何位置，例如，桥连部可以设置在阵列基板的长边的中心位置。
还应当理解，在本公开的实施例中，桥连部的数量并不限于一个。图4示出根据本公开的另一实施例的电路基板的俯视图。在图4所示的实施例中，桥连部的数量为3个，每条第一导线204-1、204-2可以被3个桥连部206中的一个分成两个第一导线段，也就是说，每条第一导线204-1、204-2可以包括两个第一导线段，该两个第一导线段可以由桥连部206电连接。类似地，每条第二导线208-1、208-2可以被3个桥连部206中的另一个分成两个第二导线段，也就是说，每条第二导线208-1、208-2可以包括两个第二导线段，该两个第二导线段可以由桥连部206电连接。可以理解，在图4所示的实施例中，桥连部的数量还可以为更多个，相应地，桥连部也可以将第一导线和第二导线分成更多个导线段。在该实施例中，也可以将两个或多个桥连部以及位于它们之间的导线作为一个整体视为一个较大的桥连部。
此外，桥连部206的形状并不限于在图3和图5A中示出的矩形。作为示例，桥连部可以呈三角形(参见图5B、图5C)、圆形(参见图5D、图5E)、椭圆形(类似于图5D、图5E)、梯形(参见图5F、图5G)、或者X形(参见图5H、图5I)。桥连部也可以呈任何其他适合的形状，只要与每条第一导线电连接且与每条第二导线电连接即可。应注意的是，图3和图5A-5I中所示的桥连部仅是示意性的。
需要说明的是，在本公开的实施例中，在接地保护电路的设置空间允许的情况下，各条导线的宽度可以尽可能加宽以减小各条导线的电阻，从而具有更好的静电释放效果。
在本公开的实施例中，接地端子并不限于设置在FPC上。作为示例，接地端子可以设置在与阵列基板相连接的非柔性电路板上。作为另一示例，接地端子也可以位于阵列基板上。
在本公开的实施例中，由于本公开的实施例的接地保护电路设置在电 路基板的周边区域，所以如前所述，本公开在电路基板的非周边区域设置的电路类型或功能方面并不受特别限制，即本公开的实施例的接地保护电路可以应用于需要静电防护的任何其他类型的电路基板。也就是说，本公开的至少一个实施例提供了一种电路基板，包括设置在电路基板的周边区域的接地保护电路，该接地保护电路包括一条或多条并行布置的第一导线、桥连部、以及多条并行布置的第二导线；每条第一导线的一端接地，且另一端与所述桥连部电连接；每条第二导线的一端与所述桥连部电连接，且另一端接地。
II.显示面板和显示装置
根据本公开的实施例的显示面板可以包括上面描述的本公开的实施例的电路基板，且可以是例如液晶显示面板或OLED显示面板。此外，根据本公开的实施例的显示装置包括本文描述的本公开的实施例的显示面板，且可以是例如液晶显示装置或OLED显示装置。
由于包括上面描述的本公开的实施例的电路基板，所以根据本公开的实施例的显示面板和显示装置具有改善的静电防护性能。
应注意的是，以上所述仅是本公开的示范性实施方式，而并非用于限制本公开的保护范围，本公开的保护范围由所附的权利要求确定。

Claims (11)

  1. 一种电路基板，包括接地保护电路，其被设置在所述电路基板的周边区域，其中，
    所述接地保护电路包括一条或多条并行布置的第一导线、桥连部、以及多条并行布置的第二导线；
    每条第一导线的一端接地，且另一端与所述桥连部电连接；
    每条第二导线的一端与所述桥连部电连接，且另一端接地。
  2. 根据权利要求1所述的电路基板，其中，每条所述第一导线和每条所述第二导线都为连续的导线。
  3. 根据权利要求1所述的电路基板，其中，所述桥连部包括多个桥连部，每条所述第一导线被多个桥连部中的至少一个分成多个第一导线段，和/或
    每条所述第二导线被多个桥连部中的至少另一个分成多个第二导线段。
  4. 根据权利要求1所述的电路基板，其中，所述桥连部呈矩形。
  5. 根据权利要求4所述的电路基板，其中，每条第一导线电连接到所述矩形的一个边；并且每条第二导线电连接到所述矩形的与所述一个边相对的另一边。
  6. 根据权利要求1所述的电路基板，其中，所述桥连部呈三角形、圆形、椭圆形、梯形、或者X形。
  7. 根据权利要求1所述的电路基板，其中，所述桥连部位于所述电路基板的一个边的中心位置。
  8. 根据权利要求1-7中任一项所述的电路基板，其中，所述电路基板还包括阵列基板，所述接地保护电路被设置在所述阵列基板的周边区域。
  9. 根据权利要求8所述的电路基板，其中，所述电路基板进一步包括附加电路板，所述附加电路板上设置有接地端子，并且每条所述第一导线和每条所述第二导线分别通过所述接地端子接地。
  10. 一种显示面板，包括根据权利要求1至9中任一项所述的电路基 板。
  11. 一种显示装置，包括根据权利要求10所述的显示面板。
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