WO2017214122A1 - Devices comprising a patterned color conversion medium and methods for making the same - Google Patents
Devices comprising a patterned color conversion medium and methods for making the same Download PDFInfo
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- WO2017214122A1 WO2017214122A1 PCT/US2017/036123 US2017036123W WO2017214122A1 WO 2017214122 A1 WO2017214122 A1 WO 2017214122A1 US 2017036123 W US2017036123 W US 2017036123W WO 2017214122 A1 WO2017214122 A1 WO 2017214122A1
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- Prior art keywords
- color conversion
- assembly
- substrate
- conversion medium
- light
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Definitions
- the disclosure relates generally to devices comprising a patterned color conversion medium, and more particularly to optical assemblies comprising at least two of a lens, a color conversion medium, and/or a light source, as well as display and illumination devices comprising such assemblies.
- LCDs Liquid crystal displays
- LEDs blue light emitting diode
- QDs quantum dots
- LEDs may also be used in combination with color converting elements in lighting applications, such as luminaires.
- blue light from an LED can be directed through a color conversion medium which may convert some of the light to green and/or red light as it passes through. The combination of blue, green, and red light is perceived by the human eye as white light.
- Color converting elements such as phosphors and QDs
- phosphors and QDs are not 100% quantum efficient in converting light and some of the light energy may be absorbed by the color converting element as heat. Additionally, the color conversion process itself may generate heat, e.g., due to Stokes shift when shorter wavelengths are converted to longer wavelengths. In some instances, up to 20-40% of the absorbed light is converted to heat. Because excess heat may degrade the color converting element, it can be important to establish adequate cooling or heat sink pathways to dissipate the l generated heat and maintain the color converting element within a desired operating temperature. While phosphor materials may be able to operate at moderate
- QD materials are highly temperature sensitive and may experience degradation at temperatures of greater than about 100°C.
- BLUs backlight units
- QDs are often supplied in the form of a glass or polymeric tube, capillary, sheet, or film, e.g., a QD enhancement film (QDEF) 1 , which can be placed over (but not in direct physical contact with) an array of LEDs 2 arranged on a printed circuit board (PCB) 3.
- QDEF QD enhancement film
- the BLU 6 can further comprise a heat sink 7 attached to the PCB, which may dissipate heat generated by the LEDs 2.
- these assemblies may not provide sufficient cooling because heat from the QDs is dissipated mainly by free or forced convective air forces 8 passing through the gap between the LEDs and QDEF.
- the QDEF itself is a relatively poor thermal conductor and does not benefit from direct thermal contact with the heat sink 7.
- the LCD assembly may be operated at a lower light intensity and/or power to protect the QDs from thermal degradation, which may undesirably result in an overall reduction in display or lighting brightness.
- such assemblies can result in significant material waste because the QDs are uniformly dispersed over the entire LED array, rather than discretely positioned only over each individual LED in the array.
- the disclosure relates, in various embodiments, to optical assemblies comprising a light emitting device disposed on a first surface of a substrate, a ring structure comprising a color conversion medium disposed on the first surface of the substrate, and a transparent lens positioned in overlying registration with the light emitting device and the ring structure, wherein the color conversion medium is spaced apart from and at least partially circumscribes the light emitting device.
- Display, lighting, and electronic devices comprises such assemblies or assembly arrays are also disclosed herein.
- the disclosure additionally relates to color conversion assemblies comprising a sub-assembly comprising a first substrate and a second substrate sealed together to form at least one cavity comprising a color conversion medium, and a transparent lens positioned in overlying registration with the sub-assembly, wherein the at least one cavity comprises a continuous ring-shaped cavity or a plurality of cavities arranged in a discontinuous ring-shaped pattern, and wherein the transparent lens comprises a convex surface and at least a portion of the convex surface comprises an equiangular spiral curvature.
- Optical assemblies comprising the color conversion assembly and at least one light emitting device are further disclosed herein, as well as display, lighting, and electronic devices comprises such assemblies.
- color conversion assemblies comprising a transparent substrate and a reflective substrate sealed together to form at least one cavity comprising a color conversion medium, wherein the at least one cavity comprises a continuous ring-shaped cavity or a plurality of cavities arranged in a discontinuous ring-shaped pattern.
- Optical assemblies comprising the color conversion assembly and at least one light emitting device and/or transparent lens are additionally disclosed herein, as well as display, lighting, and electronic devices comprises such assemblies.
- light conversion devices comprising a transparent substrate having a first surface and an opposing light emitting surface, a color conversion medium disposed on the first surface, and a reflective layer disposed on the first surface and encapsulating at least a portion of the color conversion medium.
- Light guide assemblies comprising the light conversion device optically coupled to a light emitting device are also disclosed herein.
- methods for making a color conversion assembly comprising patterning a color conversion medium on a first surface of a transparent substrate and depositing a protective layer on the first surface to encapsulate at least a portion of the color conversion medium, wherein one of the substrate or the protective layer comprises a reflective material.
- FIG. 1 illustrates an exemplary LCD assembly
- FIGS. 2A-C illustrate cross-sectional views of lenses according to various embodiments of the disclosure
- FIG. 3A is a schematic illustrating total internal reflection (TIR) within a lens according to additional embodiments of the disclosure
- FIG. 3B illustrates a topographical surface map of an exemplary lens formed by rotation of the curve of FIG. 3A around its axis of rotation;
- FIG. 4 illustrates a coordinate system used to construct a rotationally symmetric lens according to various embodiments of the disclosure
- FIG. 5 illustrates a constant incidence angle curve according to further embodiments of the disclosure
- FIG. 6 illustrates a perspective view of a linear lens according to certain embodiments of the disclosure
- FIG. 7 illustrates an array of lenses according to additional embodiments of the disclosure
- FIG. 8 illustrates an optical assembly according to various embodiments of the disclosure
- FIG. 9 illustrates an array of optical assemblies according to further embodiments of the disclosure.
- FIGS. 10-12 illustrate optical assemblies according to alternative embodiments of the disclosure
- FIGS. 13A-B illustrate plan and cross-sectional views of a patterned color conversion assembly
- FIG. 14 illustrates an exemplary display device comprising a BLU assembly according to non-limiting embodiments of the disclosure
- FIGS. 15A-C illustrate exemplary light guide plates (LGPs) comprising a patterned color conversion medium
- FIGS. 16A-C illustrate exemplary light conversion devices comprising a patterned color conversion medium and a reflective layer.
- FIGS. 2-16 illustrate exemplary embodiments of lenses, light emitting devices, light conversion devices, and optical assemblies comprising such devices. Display and lighting devices comprising these devices and assemblies are also disclosed herein.
- the following general description is intended to provide an overview of the claimed devices, and various aspects will be more specifically discussed throughout the disclosure with reference to the non-limiting depicted embodiments, these embodiments being interchangeable with one another within the context of the disclosure.
- Lenses
- lenses comprising a contact surface, a convex surface, and a central region disposed therebetween, wherein the convex surface comprises a negative axiconic depression extending into the central region.
- the negative axiconic depression can, for example, comprise a hollow conical region having a cone half-angle ranging from about 15° to about 40°.
- lenses comprising a contact surface, a convex surface, and a central region disposed therebetween, where at least a portion of the convex surface comprises an equiangular spiral curvature.
- the lenses may be linear or rotationally symmetric. Suitable materials from which the lens may be constructed include optically transparent materials, such as glasses and plastics.
- FIG. 2A illustrates a cross-sectional view of an exemplary lens 100 according to embodiments of the disclosure.
- the lens 100 can comprise a contact surface 101 , a convex surface 102, and a central region 103 disposed therebetween.
- the convex surface 102 can comprise a negative axiconic depression 104, e.g., at or near its apex, and this depression 104 can extend into the central region 103.
- the negative axiconic depression 104 can have a vertex 107 that points towards the contact surface 101.
- the convex surface 102 can be truncated such that it does not fully extend to meet the contact surface 101. In such embodiments, a truncated surface 105
- the contact surface 101 can, in non-limiting embodiments, comprise one or more recesses or cut-outs 106, which can optionally be provided to house a light source in an optical assembly, also discussed in more detail below.
- the term "convex" is intended to denote a surface shape defining a lens that is thinner at its outer edges than at its center, e.g., when the contact surface is planar.
- the convex second surface may be
- a surface that curves out or extends outward from a centerline of a planar first surface of the lens e.g., a semi-spherical or semi-ellipsoidal shape.
- the convex surface of the lens can be envisioned as a rounded dome, the dimensions of which need not be perfectly rounded, semi-spherical, or semi-ellipsoidal.
- a "convex" surface may be rotationally symmetric around a vertical center line 108 of the lens 100.
- the convex surface 102 may comprise a rotationally symmetric hemisphere, e.g., as in a typical lens.
- other shapes such as elliptical, parabolic, or 2D surfaces generated by revolving a 1 D profile function around the center line are also possible and intended to fall within the scope of the disclosure.
- a 1 D profile function may be generated by splines and/or may not be continuous in slope.
- a convex surface that is rotational symmetric around the center line of the lens can also be described by a standard aspheric sag equation, or the Forbes polynomial aspheric sag equation.
- the sag of the surface that these equations describe is the normal distance from a plane normal to the center line at the surface intersection with that normal line.
- the sag of a convex surface largely increases in magnitude with distance from the centerline and has a sign that makes the lens thinner at the edge of the lens than the center of the lens. In some radial zones, the lens may become thicker with radial distance from the lens, but is largely thinner at the edge.
- asymmetric surface shape would be beneficial to provide different illumination profiles.
- the equations that describe this shape might not be standard sag equations, but may describe a free-form surface shape used in the field of optical fabrication. It is also to be understood that the term "convex" is not limited to surfaces that are continuous. The surface may also be a compound surface for which the sag of different spatial regions is defined by different equations.
- FIG. 2C provides a detailed view of region C in FIG. 2A, which includes the negative axiconic depression 104.
- the term "negative axiconic depression” is intended to denote a hollow conical region capable of diverging
- collimated light which may be envisioned as an indent or depression into the convex surface of the lens substantially in the shape of a cone.
- the vertical centerline 109 of the cone can be spatially oriented to align or substantially align with, or to be parallel or substantially parallel to, the vertical centerline of the convex surface (see 108 in FIG. 2B).
- the term "negative” is used to indicate that the conical surface forms a lens shape that diverges collimated light incident on the cone, as opposed to a positive axiconic lens that converges said light to form an axial line focus in space.
- a spherical surface in optical systems can be designed to be slightly aspherical in shape to improve performance
- the shape of the cone can also be deviated from a perfect cone to improve performance and/or to simplify manufacture.
- the depression 104 may have a vertex 107 with a blunt or rounded curvature, e.g., as depicted in FIG. 2C.
- the rounded vertex 107 may have a width w that is greater than 0.
- a blunt or rounded vertex 107 may allow some light to pass through at shallow angles, e.g., resulting in undesirable light leakage in this region.
- vertex 107 may be machined or molded to increase its sharpness, in some embodiments, it may also be possible to alter one or more surfaces of the negative axiconic depression to counteract this effect.
- a reflective film (not illustrated) may be deposited on at least a portion of the rounded vertex of the cone such that light may be reflected backward and can possibly traverse a different path and reflect such that it escapes the lens at a different point.
- At least a portion of the rounded vertex 107 may also be blocked by coatings or solid objects, such as small balls or spheres affixed or forced into the apex of the cone.
- the negative axiconic depression 104 may have a cone half-angle ⁇ ranging from about 15° to about 40°, such as from about 20° to about 35°, or from about 25° to about 30°, including all ranges and subranges therebetween.
- the term "cone half-angle" and variations thereof is intended to denote the angle formed by the vertical centerline 109 of the cone with a line 110 transecting an outermost point x of the cone and the vertical centerline of the cone.
- the depression 104 need not be perfectly conical and the sides may not be perfectly linear. For instance, as shown in FIG. 2C, the sides of the cone may curve inward toward the vertical centerline of the cone or, in other embodiments, may bow outward (not illustrated).
- the lens 100 is depicted in FIGS. 2A-C as plano-convex, e.g., having a contact surface 101 that is substantially planar, it is also possible for the first surface to be non-planar.
- a slightly convex contact surface e.g., having a radius of curvature greater than about 100 mm
- a plano-convex lens may be more easily implemented into an optical assembly.
- the contact surface can be planar or substantially planar.
- the contact surface 101 may be rotationally asymmetric around the vertical centerline of the lens, may be aspherical, and/or may have a free-form shape.
- the contact surface 101 may be provided with one or more recesses or cut-outs 106 intended to accommodate optical components such as light sources, color conversion medium, circuits, etc.
- the overall height (or thickness) and/or diameter of the lens 100 may be dependent, e.g., on the dimensions of the optical assembly in which it is intended to be used.
- the diameter of the lens may be chosen to be larger than a dimension (e.g., diameter, length, and/or width) of a light source to which it may be optically coupled.
- the overall lens height may range, in non-limiting embodiments, from about 0.1 mm to about 20 mm, from about 0.2 mm to about 15 mm, from about 0.5 to about 10 mm, from about 1 mm to about 8 mm, from about 2 mm to about 7 mm, from about 3 mm to about 6 mm, or from about 4 mm to about 5 mm, including all ranges and subranges therebetween.
- a diameter of the lens can range, for example, from about 1 mm to about 100 mm, from about 5 mm to about 90 mm, from about 10 mm to about 80 mm, from about 20 mm to about 70 mm, from about 30 mm to about 60 mm, or from about 40 mm to about 50 mm, including all ranges and subranges therebetween.
- the size and/or shape of the lens may also depend upon a desired optical pathway for light emitted by a light source optically coupled to the lens. For example, with reference to FIG.
- the curvature of a convex lens surface 102 can be designed such that light 110 emitted from a light source (e.g., LED) 111 optically coupled to the lens strikes the convex surface 102 at an angle greater than the critical angle and become “trapped" within the lens due to total internal reflection (TIR).
- a light source e.g., LED
- TIR total internal reflection
- the term "optically coupled” is intended to denote that a light source is positioned relative to the lens so as to introduce or inject light into the lens.
- a light source may be optically coupled to a component such as a lens, light guide plate (LGP), or other substrate even though it is not in physical contact with the component.
- TIR Total internal reflection
- a first material e.g., glass, plastic, etc.
- a second material e.g., air, etc.
- TIR can be explained using Snell's law:
- ni is the refractive index of a first material
- n 2 is the refractive index of a second material
- 0 is the angle of the light incident at the interface relative to a normal to the interface (incident angle)
- ⁇ ⁇ is the angle of refraction of the refracted light relative to the normal.
- the incident angle 0, under these conditions may also be referred to as the critical angle 0 C .
- Light having an incident angle greater than the critical angle (0, > 0 C ) will be totally internally reflected within the first material, whereas light with an incident angle equal to or less than the critical angle (0, ⁇ 0 C ) will be transmitted by the first material.
- the critical angle (0 C ) can be calculated as 41 0
- the lenses disclosed herein may be configured to "trap" light, e.g., such that light injected into the lens by the light source can repeatedly propagate within the lens, reflecting along the convex surface 102 or alternately between the contact surface 101 and convex surface 102 unless or until there is a change to the interfacial conditions.
- the curvature of the convex surface 102 may be engineered such that substantially all light 110 emitted from the light source 111 , regardless of the point of origin on the light source itself, strikes the convex surface at incidence angle ⁇ ,, where ⁇ , > 0 C .
- light 110 emitted from the upper corners upper right corner 113 illustrated in FIG.
- the lens 3A) of the light source 111 may have the smallest incident angle with respect to the convex surface 102 of the lens and, thus, the lens may be configured such that even light emitted from this position on the light source 111 has an incident angle ⁇ , greater than the critical angle
- color conversion medium 112 can be distributed around a perimeter of the light source 111 to provide regions of altered interfacial conditions, e.g., such that reflected light incident upon the color conversion medium 112 is scattered forward at an angle less than the critical angle 0 C .
- TIR may be "broken" or interrupted in regions where the color conversion medium 112 is distributed, such that light 110 can escape the lens as transmitted light 110'.
- Such an arrangement may also have the added benefit of providing a heat sink pathway for the color conversion medium itself (e.g., via the PCB below the color conversion medium (not shown)), such that an optical assembly employing the disclosed configuration can operate at elevated temperatures.
- the color conversion medium 112 may be exposed to a reduced light flux density, e.g., meaning the optical assembly can be operated at a higher light intensity as compared to prior art configurations.
- FIG. 3A it is noted that only the right half of the convex lens surface curvature is illustrated in FIG. 3A (as well as the corresponding half of the LED 111 and color conversion medium 112). Rotation of the curve around the vertical centerline 108 of the lens (in this case also an axis of symmetry) will generate a convex lens surface 102 having the topography illustrated in FIG. 3B. Moreover, as illustrated in FIG. 2, the convex surface 102 in FIG. 3A is truncated such that it does not fully extend to meet the contact surface 101. The truncated surface (not labeled) can, in certain embodiments, be coated with a reflective layer 114 to prevent the escape of light from this region.
- a constant incidence angle curve r(0) of the convex surface 102 can be constructed by defining a coordinate system with the origin defined as the upper right corner 113 of the light source (as shown), or upper left corner (not shown).
- a tangent vector t to curve r(0) can be drawn using equation (1 ):
- equation (2) can be rewritten as the following equation (3):
- Equation (3) can be further simplified to provide a differential equation (4) in polar coordinates:
- substantially all of the convex surface may have an equiangular spiral curvature. In other embodiments, a portion of the convex surface may have an equiangular spiral curvature (e.g., in the case of a lens with a truncated surface).
- light rays tend to travel along the top of the lens, which may leave a gap 115 proximate the light source 111.
- light emanating from the optical assembly may be perceived as a ring of light forming a perimeter around the light source 111 , although some light may also leak out in a central region corresponding to the negative axiconic depression, as noted above.
- the lens apex can be machined, molded, or otherwise modified (e.g., with a reflective layer) to reduce or eliminate such light leakage, if desired.
- x r r(O)e 0itan0i sin0j (7b)
- the value of x r can be used to determine the maximum radius of a light source that can be optically coupled to the lens.
- FIGS. 2-3 illustrate a rotationally symmetric (e.g., hemispherical) lens 100, configured to optically couple with a single light source
- a linear lens 100' can have a contact surface 101' a convex surface 102' similar to those defined above for a symmetrical lens 100.
- the convex surface 102' of the linear lens 100' can similarly be engineered to have a constant incidence angle curvature
- the lens 100' can have a double-lobed configuration ( ⁇ '- ⁇ ') as illustrated or a single-lobed configuration (A' or B').
- ⁇ '- ⁇ ' double-lobed configuration
- A' or B' single-lobed configuration
- separate lobes A' and B' may be mated together to form a double-lobed configuration.
- the double-lobed ( ⁇ '- ⁇ ') linear lens can be arranged in overlying registration with a light source array 111', or each separate lobe ( ⁇ ', ⁇ ') can each be positioned in overlying registration with one side of the light source array 111'.
- the linear lens 100' depicted in FIG. 6 can be formed using any method known in the art, such as extrusion, molding, casting, or stamping, to name a few.
- each individual lens 100 may comprise an aperture or recess 106 corresponding to each individual light source (not shown) in an accompanying LED array.
- optical assemblies comprising at least one lens as described above in combination with at least one of a light emitting device and/or color conversion medium.
- the lens may be optically coupled to at least one light source, such as an LED.
- the optical assembly may also comprise a lens and a color conversion medium comprising at least one color converting element, such as phosphors, quantum dots, and/or lumiphores, e.g., fluorophores, and or light emitting polymers.
- Non-limiting exemplary optical assemblies may include backlight units (BLUs), light guide plates (LGPs), color conversion devices, light emitting devices, light conversion devices, or luminaires, to name a few.
- the optical assemblies comprise a light emitting device disposed on a first surface of a substrate, a ring structure comprising a color conversion medium disposed on the first surface of the substrate, and a transparent lens positioned in overlying registration with the light emitting device and the ring structure, wherein the color conversion medium is spaced apart from and at least partially circumscribes the light emitting device.
- Arrays of such assemblies are also disclosed herein.
- a non-limiting exemplary optical assembly which comprises a lens 100, a light source 111 , and a color conversion medium 112.
- the assembly may further comprise a ring structure 117 which may, in some
- a first substrate 118 and a second substrate 119 defining a cavity 120 in which the color conversion medium 112 is contained.
- the ring structure 117 may further define a recess 121 in which the light source 111 may be at least partially positioned.
- a printed circuit board (PCB) 122 may also be provided, to which the light source 111 may be mounted.
- a heat sink 123 may also be attached to the PCB, which can include one or more thermal vias (not illustrated), for dissipating heat from the light source and/or color conversion medium.
- One or more adhesive layers may optionally be present between two or more of the optical assembly components. Exemplary paths for light rays 110 and transmitted light rays 110' are included for illustrative purposes.
- Lens 100 can comprise contact surface 101 and convex surface 102 as described above.
- Convex surface 102 can include a negative axiconic depression 104, which can have a vertex 107 pointing toward contact surface 101.
- the lens 100 may be positioned in overlying registration with the light source 111 and/or color conversion medium 112.
- the vertex 107 of lens 100 may be aligned with a vertical centerline of the light source 111.
- the outer perimeter of the lens 100 may be aligned with the outer perimeter of the color conversion medium 112.
- the contact surface 101 can be positioned in physical contact with ring structure 117 (e.g., first substrate 118) and/or may be adhered to the ring structure 117 by way of an adhesive layer (not illustrated). Although not illustrated in FIG. 8, contact surface 101 may include one or more recesses or cut-outs in which the light source 111 may be at least partially positioned (see, e.g., 106 in FIGS. 2A-B and 10).
- color conversion medium 112 may be arranged in a ring-shaped pattern around the light source 111 , e.g., such that the color conversion ring at least partially circumscribes the light source. While such a ring shape may not be appreciated from FIG. 8, which illustrates only a cross- section of the optical assembly, further examples of ring-shaped color conversion medium are illustrated in FIGS. 9 and 13A-B. It should be noted, however, that the term “ring” is not limited only to circular patterns, but may also include oval, square, rectangular, and other shapes. As such a "ring” may define any regular or irregular perimeter extending around the light source 111. Additionally, the "ring" or perimeter need not be continuous, as in the case of a single ring-shaped cavity. Rather, the ring may contain one or more gaps, as in the case of space between multiple cavities arranged in a ring-shaped pattern.
- the ring of color conversion medium 112 may be spaced apart from the light source 111 , e.g., not in physical contact with the light source. However, in other non-limiting embodiments, the ring may at least partially contact the light source, including touching the sides or overlying the top of the light source. In certain embodiments, it may be advantageous to space the color conversion medium 112 away from the light source 111 to reduce heat transfer between these two components.
- the color conversion medium may be arranged in a plane extending around a perimeter of the light source.
- the color conversion medium may, in some embodiments, be in the same horizontal plane as the light source. If the color conversion medium is arranged in the same horizontal plane as the light source and circumscribes the light source, the light source may not directly emit light into the plane of the color conversion medium. Rather, light emitted directly from the light source may first reflect off of the convex surface of the transparent lens and may then be redirected back into the plane of the light source, e.g., the plane of the color conversion medium. As such, in non-limiting embodiments, the color conversion medium is not exposed to light rays directly emitted from the light source but, rather, to reflected rays redirected one or more times by the lens.
- a ring of color conversion medium may be produced using a variety of structures and combinations thereof.
- a ring structure 117 may be employed, which can comprise a first substrate 118 and a second substrate 119 sealed together to form at least one cavity 120 containing the color conversion medium 112.
- the first substrate 118 can contact the lens 100 and the second substrate 119 can contact the PCB 122, either directly or via an adhesive layer (or other intermediate layer).
- cavity 120 can be a ring-shaped cavity, e.g., extending continuously around a perimeter of the light source 111.
- cavity 120 can comprise a plurality of cavities arranged in a ring-shaped pattern.
- first and second substrates 118, 119 can be sealed together to form a plurality or array of ring-shaped cavities 120.
- the optical assembly depicted in FIG. 8 can, in various embodiments, be repeated to form an optical array comprising an array of lenses 100, an array of light sources 111 , and an array of rings comprising color conversion medium 112.
- An exemplary two-dimensional array is depicted in FIG. 9.
- the ring-shaped color conversion medium 112 may be spaced apart from the light source 111 by a distance d to reduce thermal interaction between these two components.
- the color conversion ring may physically contact at least a portion of the light source 111.
- FIG. 10 illustrates an additional non-limiting configuration for an optical assembly according to various embodiments of the disclosure.
- the lens 100" can comprise at least one cavity 120' comprising the color conversion medium.
- the lens 100" can serve as a first substrate and can be sealed or otherwise joined together with second substrate 119 to form ring structure 117'.
- the color conversion medium may be separately sealed between two separate films, such as polymeric films (e.g., polyethylene terephthalate "PET"), and the separately sealed color conversion medium can be placed in cavity 120 (FIG. 8) or 120' (FIG. 10)
- FIG. 11 illustrates a further configuration for an optical assembly according to additional embodiments of the disclosure.
- ring structure 117 can comprise a first substrate 118 and a second substrate 119.
- the micro-light source 111' can comprise, for example, microLEDs, which can be deposited in optional cavities or wells (not labeled) in the first substrate 118.
- Micro-light sources 111' e.g., microLEDs
- An adhesive layer 124 may be disposed over the first substrate 118 and the micro-light sources 111' to bond the lens 100 to the first substrate 118.
- the first substrate 118 e.g., the first substrate
- the first substrate 118 can serve both as a PCB component upon which the micro-light sources may be mounted and as a sealing substrate in the ring structure 117.
- the first substrate 118 can be constructed from transparent materials.
- FIG. 12 illustrates yet another configuration for an optical assembly according to further embodiments of the disclosure.
- ring structure 117" can comprise a first substrate 118 and a second substrate 119, which can be sealed together by seal 125 with a color conversion micro-layer 112' disposed therebetween.
- a color conversion micro-layer 112' can, in some embodiments, have a thickness of less than about 20 pm, such as ranging from about 5 pm to about 20 pm, or from about 10 pm to about 15 pm, including all ranges and subranges therebetween.
- a glass frit may be used to form the seal 125 between the first and second substrates 118, 119.
- a thin inorganic film may be melted (e.g., by laser heating) to form the seal 125.
- the seal 125 can comprise a laser weld between the two substrates, e.g., without a glass frit or other intervening layer.
- the first and second substrates 118 are identical to each other.
- a reflective layer 126 can be provided on one or more surfaces of the first and/or second substrates 118, 119 in regions that do not
- the light source can be a micro-light source 111' (e.g., microLED) mounted on a transparent PCB 122' (as illustrated) or, in alternative embodiments, can comprise a conventional LED mounted to a non-transparent PCB (not illustrated).
- micro-light source 111' e.g., microLED
- transparent PCB 122' as illustrated
- non-transparent PCB not illustrated
- color conversion assemblies comprising a transparent substrate and a reflective substrate sealed together to form at least one cavity comprising a color conversion medium, wherein the at least one cavity comprises a continuous ring-shaped cavity or a plurality of cavities arranged in a discontinuous ring-shaped pattern.
- the disclosure additionally relates to color conversion assemblies comprising a sub-assembly comprising a first substrate and a second substrate sealed together to form at least one cavity comprising a color conversion medium, and a transparent lens positioned in overlying registration with the sub-assembly, wherein the at least one cavity comprises a continuous ring-shaped cavity or a plurality of cavities arranged in a discontinuous ring-shaped pattern, and wherein the transparent lens comprises a convex surface and at least a portion of the convex surface comprises an equiangular spiral curvature.
- Optical assemblies comprising these color conversion assemblies and at least one light emitting device are further disclosed herein.
- a color conversion assembly can comprise a first substrate 118 sealed to a second substrate 119, the sealed substrates defining at least one cavity 120 containing a color conversion medium 112.
- the assembly can comprise more than one cavity, e.g., an array of cavities 120.
- a single cavity 120 can be ring-shaped or, alternatively, a plurality of separate cavities can be assembled in a ring-shaped pattern (not illustrated).
- Such a color conversion assembly can be used, for instance, as a ring structure 117 in any of the embodiments depicted in FIGS. 8-12.
- the at least one cavity 120 may at least partially circumscribe an optional aperture 128, which can be included, e.g., to accommodate a light source upon optical coupling to an LED array.
- FIG. 13A depicts an array of evenly spaced-apart circular cavities 120 of the same size and shape
- the cavities 120 may define rings having any other shape, such as square, oval, rectangular, and similar shapes.
- all cavities 120 in the array need not be identical.
- each cavity 120 comprise the same number or amount of color conversion medium, it being possible for this amount to vary from cavity to cavity and for some cavities to comprise no color conversion medium, for instance, to match a desired LED array.
- the color conversion medium 112, 112' can comprise at least one color converting element.
- the color converting element may, in some embodiments, be suspended in an organic or inorganic matrix, such as a silicone or other suitable material. In certain embodiments, the color converting element may be suspended in a thermally conductive matrix.
- the color converting material may be deposited as a layer having a thickness, for example, ranging from about 5 pm to about 400 pm, such as from about 10 pm to about 300 pm, from about 20 pm to about 200 pm, or from about 50 pm to about 100 pm, including all ranges and subranges therebetween.
- the at least one color converting element can be chosen, for example, from phosphors, quantum dots (QDs), and lumiphores such as fluorophores or light emitting polymers, and the like.
- Exemplary phosphors can include, but are not limited to, red and green emitting phosphors, such as yttrium- and zinc sulfide-based phosphors, e.g., yttrium aluminum garnet (YAG), Eu 2+ doped red nitride, and combinations thereof.
- red and green emitting phosphors such as yttrium- and zinc sulfide-based phosphors, e.g., yttrium aluminum garnet (YAG), Eu 2+ doped red nitride, and combinations thereof.
- QDs can have varying shapes and/or sizes depending on the desired wavelength of emitted light.
- the frequency of emitted light may increase as the size of the quantum dot decreases, e.g., the color of the emitted light can shift from red to blue as the size of the quantum dot decreases.
- a quantum dot may convert the light into longer red, yellow, green, or blue wavelengths.
- the color converting element can be chosen from QDs that emit in red and green wavelengths when irradiated with blue, UV, or near-UV light.
- the at least one cavity 120 can comprise the same or different types of color converting element, e.g., elements emitting different wavelengths of light.
- a cavity can comprise color converting elements emitting both green and red wavelengths, to produce a red-green-blue (RGB) spectrum in the cavity.
- RGB red-green-blue
- an individual cavity it is possible for an individual cavity to comprise only color converting elements emitting the same wavelength, such as a cavity comprising only green quantum dots or a cavity comprising only red phosphors.
- a single cavity may be subdivided, e.g., like spokes on a wheel or pie pieces, with every other sub-cavity filled with green color converting elements and its complement filled with red color converting elements.
- Such an embodiment may be useful, for instance, in avoiding reconversion of light, e.g., blue converted to green and then green reconverted to red, or vice versa.
- red and green emitting elements are discussed above, it is to be understood that any type of color converting element can be used, which can emit any wavelength of light including, but not limited to, red, orange, yellow, green, blue, or any other color in the visible spectrum (e.g., ⁇ 420-750nm).
- quantum dots having various sizes may be combined to emulate the output of a black body, which may provide excellent color rendering.
- the lens 100, 100', 100", first substrate 118, and/or second substrate 119 can, for example, comprise a transparent or substantially transparent material, such as a glass or plastic.
- transparent is intended to denote that a lens, substrate, or material has an optical transmission of greater than about 80% in the visible region of the spectrum ( ⁇ 420-750nm).
- an exemplary transparent substrate or lens may have greater than about 85% optical transmittance in the visible light range, such as greater than about 90%, or greater than about 95%, including all ranges and subranges therebetween.
- Suitable transparent materials may include, for instance, any glass known in the art for use in display and other electronic devices.
- Exemplary glasses can include, but are not limited to, aluminosilicate, alkali-aluminosilicate, borosilicate, alkali- borosilicate, aluminoborosilicate, alkali-aluminoborosilicate, and other suitable glasses.
- These substrates may, in various embodiments, be chemically strengthened and/or thermally tempered.
- suitable commercially available substrates include EAGLE XG ® Lotus ' lris' M Willow ® and Gorilla ® glasses from Corning Incorporated, to name a few.
- Glasses that have been chemically strengthened by ion exchange may be suitable as substrates according to some non-limiting embodiments.
- polymeric materials such as plastics (e.g., polymethylmethacrylate “PMMA,” methylmethacrylate styrene “MS,” or
- PDMS polydimethylsiloxane
- the second substrate 119 can, in non-limiting embodiments, be a reflective substrate, such as a metal, metal oxide, metal alloy, or mixtures thereof.
- the second substrate can comprise a transparent material (e.g., glass, plastic, etc.) or a non-transparent material (e.g., ceramic, glass-ceramic, etc.) and the walls of cavity 120 (if present) can be coated with a reflective material (such as a metal or an oxide, alloy, or salt thereof, etc.).
- a reflective material such as a metal or an oxide, alloy, or salt thereof, etc.
- One or more reflective surfaces in cavity 120 may be advantageous in terms of ensuring that light is scattered in the desired (forward) direction. For example, any light back scattered by the color conversion medium can be scattered back in the desired direction by the reflective substrate (or reflective surface). Moreover, any blue (unconverted) light reflected off the reflective substrate (or reflective surface) may have a second opportunity to be converted to the desired wavelength as it passes back through the color conversion material.
- the second substrate 119 it may be advantageous to construct the second substrate 119 from a thermally-conductive material, such as a metal and/or ceramic, to promote the dissipation of heat from the color conversion medium 112.
- a thermally-conductive material such as a metal and/or ceramic
- Exemplary ceramic materials include aluminum nitride, aluminum oxide, beryllium oxide, boron nitride, and silicon carbide, to name a few.
- Exemplary reflective metals include, but are not limited to, Al, Au, Ag, Pt, Pd, Cu, other similar metals, and alloys thereof.
- the second substrate 119 can be constructed at least in part from inorganic substrates, such as inorganic substrates having a thermal conductivity greater than that of glass.
- suitable inorganic substrates may include those with a relatively high thermal conductivity, such as greater than about 2.5 W/m-K (e.g., greater than about 2.6, 3, 5, 7.5, 10, 15, 20, 25, 30, 40, 50, 60, 70, 80, 90, or 100 W/m-K), for instance, ranging from about 2.5 W/m-K to about 100 W/m-K, including all ranges and subranges therebetween.
- a relatively high thermal conductivity such as greater than about 2.5 W/m-K (e.g., greater than about 2.6, 3, 5, 7.5, 10, 15, 20, 25, 30, 40, 50, 60, 70, 80, 90, or 100 W/m-K), for instance, ranging from about 2.5 W/m-K to about 100 W/m-K, including all ranges and subranges therebetween.
- the thermal conductivity of the inorganic substrate can be greater than 100 W/m-K, such as ranging from about 100 W/m-K to about 300 W/m-K (e.g., greater than about 100, 1 10, 120, 130, 140, 150, 160, 170, 180, 190, 200, 210, 220, 230, 240, 250, 260, 270, 280, 290, or 300 W/m-K), including all ranges and subranges therebetween.
- a hermetic seal can be used to join the first and second substrates (ring structures 117, 117") and/or the lens and the second substrate (ring structure 117').
- Hermetic seals can also be used to join any other components of the optical assembly, such as bonding the lens to the ring structure, etc.
- the substrates and/or lenses can be hermetically sealed such that the ring structures 117, 117', 117" are impervious or substantially impervious to water, moisture, air, and/or other contaminants.
- a hermetic seal can be configured to limit the transpiration (diffusion) of oxygen to less than about 10 "2 cm 3 /m 2 /day (e.g., less than about 10 "3 /cm 3 /m 2 /day), and limit transpiration of water to about 10 "2 g/m 2 /day (e.g. , less than about 10 "3 , 10 "4 , 10 "5 , or 10 "6 g/m 2 /day).
- a hermetic seal can substantially prevent water, moisture, and/or air from contacting the components (e.g., color conversion medium and/or light source) protected by the hermetic seal.
- the optical assemblies disclosed herein may be configured such that light emitted by the light source is reflected one or more times, e.g., using a lens disclosed herein, to spread the light over a larger area before it strikes the color conversion medium ("reflectance" mode).
- the optical flux within the device may be reduced by more than two orders of magnitude.
- reflected light impinging on the color conversion medium has an intensity less than 1 % of that of the light originally transmitted from the light source.
- a reflectance mode configuration may have the added benefit of passing light through the color conversion medium more than once, thus increasing the chance that it is converted to a different wavelength.
- a "remote" configuration has an additional advantage of allowing the LED to run at cooler temperatures and, thus, more efficiently, because it does not need to serve as a thermal path for cooling the color conversion medium (e.g., as in the case of conformal phosphor coatings).
- the lifetime of the optical assembly can therefore be extended as compared to prior art devices due to one or more of the above advantages.
- the lenses and optical assemblies depicted in FIGS. 2-13 can be used in a variety of applications including, but not limited to, display and lighting applications.
- an illuminating device such as a luminaire or solid state lighting device
- the optical assemblies can be used alone or in an array to mimic the broadband output of the sun.
- Such assemblies can comprise, for example, color converting elements of various types and/or sizes emitting at various wavelengths, such as visible wavelengths ranging from 420-750nm.
- a "white" LED can be produced by coating an LED emitting blue light with a silicone/phosphor slurry.
- silicone may darken over time after prolonged exposure to the LED optical flux and heat.
- the optical assemblies disclosed herein may be used in such lighting devices to reduce the optical flux to which the color conversion medium and/or matrix is exposed and/or to provide additional or alternative thermal pathways to dissipate the heat generated by the LED and/or color conversion medium.
- Embodiments comprising one or more glass substrates may also have the added advantage of remaining optically clear for longer periods of time as compared to plastic substrates.
- an optical assembly disclosed herein can be incorporated into a backlight unit (BLU) in a display device, such as an LCD.
- a BLU 127 and liquid crystal (LC) panel 129 can be incorporated into a display device, such as a television, computer, handheld device, or the like.
- the BLU 127 can comprise an array of light sources 111 mounted to a PCB 122, which may be attached to a heat sink 123.
- the PCB 122 may be equipped with a plurality of thermal vias 130, which can be positioned to provide heat sink pathways for the light sources 111 and color conversion medium 112.
- Thermal vias 130 may comprise, in some embodiments, holes or apertures in the PCB 122 filled with a conductive material (e.g., metals such as Cu, Ag, etc.), which can allow for heat transfer from one side of the PCB 122 to the other side and into the heat sink 123 (if present). While a single heat sink 123 is illustrated in FIG. 14, it is also possible to provide more than one heat sink 123. For instance, separate heat sinks can be provided for the color conversion medium 112 and for the LEDs 111 , which may further isolate the color conversion medium from heat generated by the LEDs.
- a conductive material e.g., metals such as Cu, Ag, etc.
- an array of lenses 100 can be optically coupled to an array of light sources 111.
- One or more adhesive layers 124 can be optionally included to improve adhesion between various components of the BLU 127 and/or between the BLU 127 and the LC panel 129. Additional layers may be provided between the BLU 127 and the LC panel 129, such as a diffuser layer 131 , and/or additional layers may be provided between lenses 100, such as reflecting walls 132. In some embodiments, it may not be desirable to completely isolate the individual optical assemblies from one another, and the additional layers 131 , 132 may correspondingly be modified or removed to allow for a desired amount of light leakage between the assemblies.
- light conversion devices comprising a transparent substrate having a first surface and an opposing light emitting surface, a color conversion medium disposed on the first surface, and a reflective layer disposed on the first surface and encapsulating at least a portion of the color conversion medium.
- Exemplary light conversion devices include, for instance, light guide plates (LGPs) and light guide assemblies.
- LGPs light guide plates
- a first surface 133 of an LGP 134 may be patterned with a color conversion medium 112, which can be sealed or encapsulated with a protective layer, such as reflective layer 135.
- the reflective layer can comprise a metallic film, such as a film comprising one or more Al, Au, Ag, Pt, Pd, Cu, and alloys thereof.
- the reflective layer 135 may comprise a material with high thermal conductivity, e.g., capable of dissipating heat from the color conversion medium. Furthermore, the reflective layer 135 may comprise a ductile material capable of expanding and/or stretching under thermal stress (e.g., due to thermal expansion of the color conversion material) without developing cracks or pinholes. The reflective layer 135 can thus serve both as a heat sink for dissipating heat from the color conversion medium 112 and/or as a hermetic barrier preventing degradation of the color conversion medium 112 by moisture and/or air.
- a light source 111 may be coupled to an edge (light incident) surface of the LGP 134.
- a reflector 140 may be attached to an opposite edge of the LGP.
- Light 110 propagating through the LGP 134 may reflect within the LGP due to TIR until striking a region comprising the color conversion medium 112, at which point it may be scattered forward as transmitted light 110' through the light-emitting (second) surface 136.
- the color conversion medium may also modify the light 110, such that transmitted light 110' has a different wavelength than the original wavelength of light 110.
- the light guide assembly depicted in FIGS. 15A-B may integrate various layers that are conventionally included as separate BLU components.
- the color conversion medium can be integrated on the first surface 133 of the LGP 134, rather than being supplied as a separate film, either on the light source 111 or in the BLU stack.
- the reflective layer 135 may also be integrated on the first surface 133 instead of being included as an additional component separate from the LGP 134 in traditional BLU stacks.
- LGPs may be optically coupled to white LEDs, e.g., blue LEDs coated with a color conversion medium such as a silicone/phosphor slurry that converts the blue light to white light.
- a color conversion medium such as a silicone/phosphor slurry that converts the blue light to white light.
- White paint or other light scattering features may be provided on a surface of the LGP to scatter light in a desired forward direction.
- the integrated color converter configuration disclosed herein it may be possible to replace the conventional white LED with a blue LED and to replace the white paint with color conversion material encapsulated by a reflective layer.
- the integrated color conversion medium on the LGP surface may thus serve the dual function of scattering blue light forward in the desired direction and converting the blue light to white light.
- a traditional phosphor-coated white LED can be replaced by a blue LED coupled to a LGP patterned with QDs. Since QDs have a narrower emission spectrum than phosphors, the resulting assembly may have an improved color gamut.
- the LGP may be patterned with color converting elements other than QDs, such as phoshors, fluorophores, and the like.
- FIG. 15A depicts an LGP comprising a continuous reflective layer 135, certain embodiments may also incorporate a discontinuous reflective layer 135', such as that illustrated in FIG. 15B. Because metals, such as aluminum, may be slightly absorbing, a continuous reflective metallic coating may result in slight attenuation of the LGP. As such, in some embodiments, the reflective layer may be provided only in regions corresponding to deposits of color conversion medium 112. As such, regions 137 of the LGP may have a glass/air or plastic/air interface, allowing for greater TIR.
- the surface 133 of the LGP 134 corresponding to regions 137 may be provided with other light scattering features, such as white scattering particles, which may be used to achieve a desired color balance for light transmitted by the LGP 134.
- Light scattering features such as ⁇ 2 particles, may be printed on the surface 133 of the LGP 134 and/or light scattering features may be provided by etching or laser damaging the surface 133 of the LGP 134.
- an ink layer 138 may be provided between the color conversion medium 112 and the reflective layer
- the ink layer may 138 comprise, for example, reflective white inks such as metal oxides (e.g., ⁇ 2 ), and may serve to partially or completely obscure the reflective layer 135 from view. If desired, the ink layer 138 can be applied along the entire length of surface 133, even in regions where there is no color conversion medium 112, as shown in FIG. 15C. Alternatively, ink layer 138 may be provided only in regions comprising color conversion medium 112.
- the color conversion medium and/or light scattering features may be patterned in a suitable density on surface 133 so as to produce substantially uniform light output intensity across light-emitting surface 136 of the LGP. In other embodiments, the color conversion medium and/or light scattering features may be patterned to produce non-uniform light output intensity across surface
- a density of the color conversion medium and/or light scattering features proximate the light source 111 may be lower than a density at a point further removed from the light source, or vice versa, such as a gradient from one end to another, as appropriate to create the desired light output distribution across the LGP.
- Configurations other than edge-lit LGPs are also possible and envisioned as falling within the scope of the application.
- back-lit LGPs may also benefit from an integrated color conversion medium as described herein.
- the light conversion devices are not limited only to BLU applications, but may also be useful in solid state lighting applications.
- three exemplary non- limiting lighting configurations are depicted in FIGS. 16A-C.
- a large number of lighting configurations can be imagined using a variety of light sources 111 (e.g., linear lamps such as fluorescent bulbs), substrate 139 shapes and/or sizes (e.g., prisms), and/or reflector 140 positions.
- the type and/or position of the color conversion medium 112 and reflective layer 135 may also be varied from configuration to configuration.
- a light conversion device comprising patterning a color conversion medium on a first surface of a substrate and depositing a protective layer on the first surface to encapsulate the color conversion medium, wherein one of the substrate or the protective layer comprises a reflective material. Also disclosed herein are methods of making an optical assembly comprising depositing the color conversion medium in a ring-shaped pattern, positioning a light emitting device within a perimeter of the ring-shaped pattern, and positioning a transparent lens in overlying registration with the light emitting device and color conversion medium.
- the substrate may be a transparent substrate and the protective layer may comprise at least one metal.
- the substrate may be a reflective substrate comprising at least one metal and the protective layer may comprise at least one transparent inorganic oxide.
- the substrate may comprise at least one cavity having at least one reflective surface and the protective layer may comprise at least one transparent inorganic oxide.
- the color conversion medium can be deposited on the first surface of the substrate using any method known in the art. Suitable deposition methods can include printing, such as inkjet printing, screen printing, microprinting, and the like, coating, such as spin coating, slot coating, dip coating, and the like, drop-casting, pipetting, or any combination thereof.
- droplets of color conversion medium suspended in one or more solvents can be deposited onto the first surface in any desired pattern.
- the solvent(s) may optionally be removed by drying at ambient or elevated temperatures.
- patterning is intended to denote that the color conversion medium is present on the first surface in any given pattern or design, which may, for example, be random or arranged, repetitive or non-repetitive, uniform or non-uniform.
- a pattern can also comprise a gradient from one end of the substrate to the other.
- Methods for depositing the protective layer can include, for example, sputtering or vapor deposition processes.
- the color conversion medium can be deposited on a first surface of a transparent substrate, such as a glass or plastic substrate, and a protective metallic film can subsequently be sputtered or evaporated onto the first surface to at least partially encapsulate the color conversion medium.
- the color conversion medium can be deposited on a first surface of a reflective substrate and a protective inorganic oxide layer can be sputtered or evaporated onto the first surface.
- the substrate and protective layer may form a hermetic capsule in which the color conversion medium is contained.
- the substrate may comprise one or more cavities in which the color conversion medium may be deposited.
- the protective layer may have a thickness ranging from about 0.1 pm to about 10 pm, such as from about 0.5 pm to about 9 pm, from about 1 pm to about 8 pm, from about 2 pm to about 7 pm, from about 3 pm to about 6 pm, or from about 4 pm to about 5 pm, including all ranges and subranges therebetween.
- Color conversion assemblies disclosed herein can be manufacturing using a variety of methods.
- the color conversion medium can be encapsulated between first and second substrates using a pair of rollers embossed with recesses corresponding to the desired cavity shape (e.g., a ring shape or ring pattern).
- the embossed rollers may be operated at a temperature and/or pressure sufficient to promote fusion of the first and second substrates.
- additional processing steps may include providing a hole or aperture in the center of the ring. Such a hole may be cut or punched into the first and second substrates using any method known in the art.
- Alternative methods for forming the color conversion assemblies may include molding.
- one or more substrates making up the ring structure may be molded to include at least one cavity.
- the transparent lens may be molded to include at least one cavity.
- the molded substrate(s) and/or lens may then be bonded together, e.g., using an adhesive or other sealing technique, such as laser sealing. Sputtering and vapor deposition processes discussed above with respect to the light conversion devices may also be suitable for forming the color conversion assemblies disclosed herein.
- Yet another method for forming the color conversion assemblies can include depositing a color conversion medium on a substrate in a desired pattern (e.g.,
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CN201780047410.3A CN109564919A (en) | 2016-06-08 | 2017-06-06 | Device and its manufacturing method including patterned color conversion medium |
JP2018563552A JP2019523990A (en) | 2016-06-08 | 2017-06-06 | Device comprising patterned color conversion medium and method for producing the same |
KR1020197000361A KR20190006204A (en) | 2016-06-08 | 2017-06-06 | Devices comprising a patterned color conversion medium and methods of forming the same |
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US201662347351P | 2016-06-08 | 2016-06-08 | |
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JP (1) | JP2019523990A (en) |
KR (1) | KR20190006204A (en) |
CN (1) | CN109564919A (en) |
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CN111615749A (en) * | 2018-01-24 | 2020-09-01 | 苹果公司 | Display panel based on miniature LED |
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CN111739953B (en) * | 2020-07-08 | 2024-03-15 | 中国人民解放军国防科技大学 | Optical structure for improving photoelectric conversion efficiency of silicon carbide photoconductive switch |
US11404612B2 (en) | 2020-08-28 | 2022-08-02 | Applied Materials, Inc. | LED device having blue photoluminescent material and red/green quantum dots |
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US20120092747A1 (en) * | 2010-10-18 | 2012-04-19 | Qualcomm Mems Technologies, Inc. | Display having an embedded microlens array |
KR20130007265A (en) * | 2011-06-30 | 2013-01-18 | 엘지이노텍 주식회사 | Light emitting device and light emitting deivce package including the same |
KR20150013400A (en) * | 2014-12-17 | 2015-02-05 | 주식회사 루멘스 | Light emitting device package and its manufacturing method |
US20150062490A1 (en) * | 2012-01-13 | 2015-03-05 | Research Cooperation Foundation Of Yeungnam University | Backlight unit and liquid crystal display device including same |
US20160085118A1 (en) * | 2014-09-23 | 2016-03-24 | Au Optronics Corporation | Liquid crystal lens display device |
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2017
- 2017-06-06 KR KR1020197000361A patent/KR20190006204A/en unknown
- 2017-06-06 CN CN201780047410.3A patent/CN109564919A/en not_active Withdrawn
- 2017-06-06 WO PCT/US2017/036123 patent/WO2017214122A1/en active Application Filing
- 2017-06-06 JP JP2018563552A patent/JP2019523990A/en active Pending
- 2017-06-07 TW TW106118802A patent/TW201802552A/en unknown
Patent Citations (5)
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US20120092747A1 (en) * | 2010-10-18 | 2012-04-19 | Qualcomm Mems Technologies, Inc. | Display having an embedded microlens array |
KR20130007265A (en) * | 2011-06-30 | 2013-01-18 | 엘지이노텍 주식회사 | Light emitting device and light emitting deivce package including the same |
US20150062490A1 (en) * | 2012-01-13 | 2015-03-05 | Research Cooperation Foundation Of Yeungnam University | Backlight unit and liquid crystal display device including same |
US20160085118A1 (en) * | 2014-09-23 | 2016-03-24 | Au Optronics Corporation | Liquid crystal lens display device |
KR20150013400A (en) * | 2014-12-17 | 2015-02-05 | 주식회사 루멘스 | Light emitting device package and its manufacturing method |
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CN111615749A (en) * | 2018-01-24 | 2020-09-01 | 苹果公司 | Display panel based on miniature LED |
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Also Published As
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TW201802552A (en) | 2018-01-16 |
KR20190006204A (en) | 2019-01-17 |
CN109564919A (en) | 2019-04-02 |
JP2019523990A (en) | 2019-08-29 |
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