CN101452922B - Light emitting unit - Google Patents
Light emitting unit Download PDFInfo
- Publication number
- CN101452922B CN101452922B CN2008100804727A CN200810080472A CN101452922B CN 101452922 B CN101452922 B CN 101452922B CN 2008100804727 A CN2008100804727 A CN 2008100804727A CN 200810080472 A CN200810080472 A CN 200810080472A CN 101452922 B CN101452922 B CN 101452922B
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- CN
- China
- Prior art keywords
- light
- emitting diode
- diode chip
- luminescence unit
- substrate
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Abstract
The present invention relates to a luminescent unit, which comprises a substrate, at least one LED chip, at least one conductor and at least one seal colloid, wherein the LED chip is arranged on the substrate through an adhesion material; a first end of the conductor is connected with the LED chip; a second end of the conductor is connected with the substrate; the second end of the conductor and the central point of the LED chip are provided with a first distance; the vertex of the conductor and the substrate are provided with a second distance; the seal colloid covers at least partial LED chip; and the total volume of the seal colloid and the LED chip is less than the volume of a cylinder formed by the first distance and the second distance, wherein the first distance is the radius of the cylinder. The second distance is the height of the cylinder and the joint surface between the LED chip and the substrate is arranged in the same level surface with the second end of the conductor.
Description
Technical field
The present invention relates to a kind of luminescence unit, particularly about a kind of luminescence unit with confined space.
Background technology
Because light-emitting diode (Light Emitting Diode LED) has advantages such as high brightness and power saving, therefore, along with the technology of light-emitting diode is ripe gradually, its application also more and more widely, for example light source and backlight.
Please refer to shown in Figure 1ly, a kind of existing luminescence unit 1 comprises a substrate 11, a light-emitting diode chip for backlight unit 12, an adhesive body 13 and a reflection housing (lamp house) 14.Wherein, light-emitting diode chip for backlight unit 12 is arranged on the substrate 11, and the mode and the substrate 11 that utilize routing to engage (wire bonding) electrically connect.Adhesive body 13 is a light transmissive material, and in order to protection light-emitting diode chip for backlight unit 12.14 light directions that utilize reflection to concentrate light-emitting diode of reflection housing.
In the prior art, when light-emitting diode chip for backlight unit 12 is luminous, it can produce a large amount of heat energy, and the thermal expansion degree of the material of the adhesive body 13 after light-emitting diode chip for backlight unit 12, the curing, substrate 11 and reflection housing 14 4 is also inequality, therefore will cause the lead W that is folded between light-emitting diode chip for backlight unit 12, adhesive body 13, substrate 11 and the reflection housing 14, be squeezed or pull and produce the distortion or the fracture, and then may cause the situation that light-emitting diode chip for backlight unit 12 can't be luminous, also can make luminescence unit 1 produce defective.Wherein, the influence that thermal expansion degree difference is caused, especially even more serious in luminescence unit with large tracts of land adhesive body.
In addition, the prior art framework also can not improve the problem of LED heat radiating.The PN interface (junction) that temperature is the highest still is coated among the adhesive body of high thickness, therefore can only be by heat exchange pattern with heat guiding structure to substrate.
Therefore, how to provide a kind of lead that can avoid light-emitting diode chip for backlight unit because of the different luminescence units that produce fracture of thermal expansion degree between housing, adhesive body, light-emitting diode chip for backlight unit and the substrate, and the luminescence unit that can improve heat radiation, become one of important topic.
Summary of the invention
Because above-mentioned problem, the objective of the invention is to overcome the deficiencies in the prior art and defective, propose a kind of lead that can avoid light-emitting diode chip for backlight unit because of the different luminescence units that produce fracture of material thermal expansion degree between housing, adhesive body, light-emitting diode chip for backlight unit and the substrate.
For reaching above-mentioned purpose, the invention provides a kind of luminescence unit, comprise a substrate, at least one light-emitting diode chip for backlight unit, at least one lead and at least one adhesive body.Light-emitting diode chip for backlight unit is arranged at substrate with an adhesion material.Lead one first end is connected in light-emitting diode chip for backlight unit, and one second end is connected in substrate, and the central point of second end and light-emitting diode chip for backlight unit has one first distance, and the peak of lead and substrate have a second distance.Adhesive body is the light-emitting diode chip for backlight unit of cover part at least, and the volume of adhesive body and light-emitting diode chip for backlight unit and less than one of forming cylindrical volume by first distance and second distance, wherein first distance is cylindrical radius, this second distance is this cylindrical height, and this light-emitting diode chip for backlight unit and the joint face of this substrate are that this second end with this lead is positioned at identical horizontal plane.
For reaching above-mentioned purpose, the present invention also provides a kind of luminescence unit, comprises a substrate, at least one light-emitting diode chip for backlight unit, at least one adhesive body and at least one lead.Light-emitting diode chip for backlight unit is arranged at substrate with an adhesion material, and adhesive body is a part of area of covering luminousing diode chip at least.Lead one first end is connected in light-emitting diode chip for backlight unit, and one second end is connected in substrate and at least a portion lead exposes to adhesive body, and wherein this light-emitting diode chip for backlight unit and the joint face of this substrate are that this second end with this lead is positioned at identical horizontal plane.
From the above, the present invention has following useful technique effect: because of the ulking thickness of a kind of luminescence unit of foundation the present invention much smaller than prior art, the lead that can avoid thus being connected between light-emitting diode chip for backlight unit and substrate is pullled or is pushed and produced the situation of distortion or fracture.In addition, after the thickness of adhesive body reduced, the heat dissipation path of light-emitting diode chip for backlight unit also can directly be dispelled the heat via the top the heat radiation except that doing via lower substrate.
Description of drawings
Fig. 1 is a kind of existing luminescence unit schematic diagram;
Fig. 2 A is a kind of luminescence unit schematic diagram of first embodiment of the invention, and Fig. 2 B is the profile along the A-A straight line among Fig. 2 A;
Fig. 3 A and Fig. 3 B are the variation aspect schematic diagram of the luminescence unit of first embodiment of the invention;
Fig. 4 A is the luminescence unit schematic diagram of second embodiment of the invention, and Fig. 4 B is the luminescence unit profile along the A-A straight line among Fig. 4 A;
Fig. 5 A and Fig. 5 B are a variation aspect schematic diagram of the luminescence unit of second embodiment of the invention;
Fig. 6 is another variation aspect schematic diagram of the luminescence unit of second embodiment of the invention;
Fig. 7 is that reflector of the present invention is arranged at the variation aspect schematic diagram on the substrate;
Fig. 8 is the another variation aspect schematic diagram of the luminescence unit of second embodiment of the invention;
Fig. 9 A and Fig. 9 B are the schematic diagram of the luminescence unit of third embodiment of the invention;
Figure 10 is another variation aspect schematic diagram of luminescence unit of third embodiment of the invention;
Figure 11 is the another variation aspect schematic diagram of the luminescence unit of third embodiment of the invention.
Symbol description among the figure
1,2,3,4,5 luminescence units
11,22,32,42 substrates
12,23,33,43,53 light-emitting diode chip for backlight unit
13,25,25A, 25B, 45,55 adhesive bodies
14, L reflection housing
21,31 printing opacity housings
211,411,511 confined spaces
231 central points
24, W lead
241 first ends
242 second ends
26,46 connection electrode
37,37A～37D, 47 reflector
371 peristomes
38,48 fluorescent conversion layers
412,413 casing members
51,51A hollow housing
A-A, B-B straight line
The C cylinder
D1 first distance
The D2 second distance
The H peak
The S lens arrangement
T phosphor body adhesive tape
The T1 adhesion layer
The T2 fluorescent layer
Embodiment
Hereinafter with reference to relevant drawings, a kind of luminescence unit according to the present invention is described, wherein similar elements is represented with same numeral.
First embodiment
Please be simultaneously with reference to shown in Fig. 2 A and Fig. 2 B, wherein Fig. 2 B is the profile of luminescence unit 2 along the A-A straight line among Fig. 2 A.A kind of luminescence unit 2 of first embodiment of the invention comprises a substrate 22, at least one light-emitting diode chip for backlight unit 23, at least one lead 24 and at least one adhesive body 25.Wherein present embodiment is that example explains with two leads 24.In addition, in present embodiment, luminescence unit 2 more comprises a printing opacity housing 21.
Moreover, utilizing the printing opacity housing 21 of macromolecule polymeric material, its a plurality of scattering objects (scattering center) that also can mix are to increase the effect of light diffusion.Wherein, scattering object for example is scattering particles or scattering bubble, and the material of scattering particles can utilize organic scattering particles or the inorganic scattering particles different with the refractive index of printing opacity housing 21, for example aluminium oxide (Al
2O
3), barium sulfate (BaSO
4) or silicon dioxide (SiO
2) etc.
Light-emitting diode chip for backlight unit 23 is arranged at substrate 22 with an adhesion material.The emission spectrum of light-emitting diode chip for backlight unit 23 for example is visible-range and/or ultraviolet light range, if the emission spectrum visible-range of wherein said light-emitting diode chip for backlight unit 23, then light-emitting diode chip for backlight unit 23 can be selected from red light-emitting diode chip, green light LED chip, blue LED chip and group that combination constituted thereof.
Please refer to shown in Fig. 2 B, one first end 241 of lead 24 is connected in light-emitting diode chip for backlight unit 23, and one second end 242 of lead 24 is connected in substrate 22.Wherein second end 242 of lead 24 has one first distance D 1 with the central point 231 of light-emitting diode chip for backlight unit 23, and the peak H of lead 24 and substrate 22 have a second distance D2.Wherein, be noted that the central point 231 of light-emitting diode chip for backlight unit 23 is meant the geometric center point on light-emitting diode chip for backlight unit 23 and substrate 22 composition surfaces.
Please more simultaneously with reference to shown in Fig. 2 A and Fig. 2 B, adhesive body 25 is the light-emitting diode chip for backlight unit 23 of cover part at least, and the cumulative volume of adhesive body 25 and light-emitting diode chip for backlight unit 23 is less than the volume of a cylinder C who is formed by first distance D 1 and second distance D2, wherein first distance D 1 is the radius of cylinder C, and second distance D2 then is the height of cylinder C.In present embodiment, be that example explains with adhesive body 25 complete covering luminousing diode chips 23 and lead 24.Adhesive body 25 can be a multilayer refraction materials structure, its material behavior be along with the distance of each light-emitting diode chip for backlight unit 23 from the near to the remote, the refractive index of material is arranged from large to small.Therefore,, can increase the optical range that of described light-emitting diode chip for backlight unit 23, and then make the bright dipping of luminescence unit 2 more even by the characteristic of adhesive body 25 multilayer refraction materials structures.
In addition, please refer to shown in Fig. 3 A, adhesive body 25A also can extend between lead 24 and the substrate 22.In addition, please refer to shown in Fig. 3 B, also can expose to adhesive body 25B to the lead 24 of small part.
Shown in Fig. 2 A, in the present embodiment, luminescence unit 2 more comprises at least two connection electrode 26.Described connection electrode 26 electrically connects with light-emitting diode chip for backlight unit 23, and connection electrode 26 can be arranged at an end of substrate 22, be arranged at the two ends of substrate 22 or be arranged at any position on the substrate 22 respectively.Wherein, connection electrode 26 is arranged to the outside of printing opacity housing 21.In the present embodiment, described connection electrode 26 is an example with an end that is arranged at substrate 22.
From the above, because light-emitting diode chip for backlight unit 23 is positioned at the confined space 211 of printing opacity housing 21, printing opacity housing 21 can protect light-emitting diode chip for backlight unit 23 not to be subjected to the influence of external environment factors such as aqueous vapor or dust thus.Therefore, the adhesive body 25 of the luminescence unit 2 of present embodiment is only as the light extraction efficiency that improves light-emitting diode chip for backlight unit 23 and go out the function of optical range.Because the ulking thickness of adhesive body 25 can be avoided 22 leads that are connected 24 of light-emitting diode chip for backlight unit 23 and substrate thus much smaller than the ulking thickness of the adhesive body of prior art, the situation of being pullled or pushing and producing distortion or rupturing.In addition, after the thickness of adhesive body 25 reduces, the heat dissipation path of light-emitting diode chip for backlight unit 23 is except that doing the heat radiation via lower substrate 22, also can directly dispel the heat via the top, as if filling gas, liquid state colloid, elastic gel or oleaginous fluid etc. in confined space 211, then more can improve the radiating effect of light-emitting diode chip for backlight unit 23 by its thermal convection effect again.
Second embodiment
Please be simultaneously with reference to shown in Fig. 4 A and Fig. 4 B, wherein Fig. 4 B is luminescence unit 3 profiles along the B-B straight line among Fig. 4 A, and the luminescence unit 3 of second embodiment of the invention and the difference of first embodiment are: luminescence unit 3 more comprises a reflecting part and at least one fluorescent conversion layer 38.Wherein, reflecting part can be the part of printing opacity housing 31, or adds a reflector 37 as described in present embodiment.
Can concentrate the light direction of luminescence unit 3 by the setting in reflector 37, and the light that can utilize reflector 37 that described light-emitting diode chip for backlight unit 33 is sent penetrates behind the mixed light prior to carrying out in the printing opacity housing 31 again.Can change the light color that of luminescence unit 3 by 38 of fluorescent conversion layers again.
In addition, please refer to shown in Fig. 5 A, reflector 37A also can be arranged at the inner surface of printing opacity housing 31, and reflector 37A also has peristome 371, it is corresponding to the exiting surface of described light-emitting diode chip for backlight unit 33, and fluorescent conversion layer 38 also can be arranged at inner surface or outer surface corresponding to the printing opacity housing 31 of peristome 371.Is that example explains in this with the inner surface that fluorescent conversion layer 38 is arranged at corresponding to the printing opacity housing 31 of peristome 371.Again, please refer to shown in Fig. 5 B, also can the while reflector 37B and reflector 37C be set in the inner surface and the outer surface of printing opacity housing 31.Be noted that, be arranged at the reflector 37B of the inner surface of printing opacity housing 31A and outer surface and reflector 37C for shifting to install, but should avoid covering the peristome 371 that bright dipping is used.
Please refer to shown in Figure 6, the fluorescent conversion layer also can change to utilize a phosphor body adhesive tape (phosphor tape) T to replace, phosphor body adhesive tape T is arranged to the outer surface and/or the inner surface of the printing opacity housing 31 of small part, is to be that example explains to paste the outer surface that is arranged at printing opacity housing 31 in this phosphor body adhesive tape T.Phosphor body adhesive tape T for example has an adhesion layer T1 and a fluorescent layer T2, then is doped with phosphor body among the fluorescent layer T2, light color to change.Be noted that wherein phosphor body adhesive tape T can be by different forming according to different demands.
In addition, above-mentioned reflector is the example explanation to be arranged at the printing opacity housing, yet the reflector also can be arranged at the surface of substrate.Please refer to shown in Figure 7ly, a surface of substrate 32 is provided with light-emitting diode chip for backlight unit 33.One reflector 37D be arranged at light-emitting diode chip for backlight unit 33 on the substrate 32 around.Utilize reflector 37D can increase the utilance of described light-emitting diode chip for backlight unit 33 emitted lights thus by the light reflection of light-emitting diode chip for backlight unit 33 substrate that is emitted to 32.Wherein, if substrate 32 is transparency carrier, then reflector 37D also can be arranged at another surface relative with light-emitting diode chip for backlight unit 33.The material in the reflector in the material of reflector 37D and the foregoing description is identical, repeats no more in this.
In addition, please refer to shown in Figure 8ly, described light-emitting diode chip for backlight unit 33 peripheries on circuit substrate 32 also can be provided with reflection housing (lamp house) L, thus can be in order to reflect the light direction of concentrating light-emitting diode chip for backlight unit 33.
The 3rd embodiment
Please be simultaneously with reference to shown in Fig. 9 A and Fig. 9 B, the luminescence unit 4 of third embodiment of the invention and the difference of first embodiment are: the confined space 411 of luminescence unit 4 is made of 412,413 of two casing members.A plurality of light-emitting diode chip for backlight unit 43 that are provided with of substrate 42 reach at least two connection electrode 46.Described light-emitting diode chip for backlight unit 43 is arranged as example with two-dimensional approach, and so it is non-limiting.45 utilizations of adhesive body mode identical with first embodiment coats described light-emitting diode chip for backlight unit 43.Substrate 42 is folded between two casing members 412,413.Wherein, one reflector 47 can be provided with or be formed on the substrate 42, and a fluorescent conversion layer 48 then can be provided with or be formed at casing member 412, and so it is non-limiting, it changes aspect also can be with reference to the foregoing description, and the fluorescent conversion layer also can change to utilize the phosphor body adhesive tape to replace certainly.In addition, casing member 412,413 also can identically with first embodiment have a transmittance section and a non-transmittance section, for example substrate 42 on casing member 412 be the transmittance section, and the casing member 413 under the substrate 42 is non-transmittance section.Again, casing member 412,413 one of them can have a plurality of scattering objects at least, the material of the scattering object among its material and first embodiment is identical, repeats no more in this.
Described casing member 412,413 can utilize mode combinations such as gummed or fusion after correspondence is provided with, to form confined space 411.Wherein, the gummed mode comprises after ultraviolet light polymerization after the sealing, the sealing air dry etc. after hot curing or the sealing.In addition, described casing member 412,413 also can be done combination with gummed or fusion mode more earlier with after sealed or the engaging combination.
In addition, please refer to shown in Figure 10ly, the confined space 511 of luminescence unit 5 also can be formed by a hollow housing 51.Hollow housing 51 also can have a reflector and a fluorescent conversion layer, is arranged at an outer surface and/or an inner surface of the hollow housing 51 of part, and the fluorescent conversion layer also can change to utilize the phosphor body adhesive tape to replace certainly.Wherein, the cross sectional shape of hollow housing 51 is non-limiting, it for example can be circle, ellipse, triangle, quadrangle, polygon or irregular shape, according to different designs different variation aspects can be arranged, and hollow housing 51 can identically with previous embodiment have a plurality of scattering objects.55 same utilization modes identical with first embodiment of adhesive body coat described light-emitting diode chip for backlight unit 53.
In addition, please refer to shown in Figure 11, if the hull shape on described light-emitting diode chip for backlight unit 53 exiting surfaces is triangle, quadrangle, polygon or irregular shape etc., the outer surface or the inner surface of the housing on then corresponding each light-emitting diode chip for backlight unit 53 can have a lens arrangement S, is that example explains in this with the outer surface that lens arrangement S is arranged at hollow housing 51A, and so it is non-limiting.Thus so that the light that light-emitting diode chip for backlight unit 53 is sent produces the effect of optically focused.
In sum, because of light-emitting diode chip for backlight unit being placed in the confined space, protect light-emitting diode chip for backlight unit not to be subjected to the influence of external environment factors such as aqueous vapor or dust by housing according to a kind of luminescence unit of the present invention.Therefore, the adhesive body of luminescence unit of the present invention is as the light extraction efficiency that improves light-emitting diode chip for backlight unit and go out the function of optical range.Because the ulking thickness of adhesive body, can be avoided the lead that is connected between light-emitting diode chip for backlight unit and substrate thus much smaller than prior art, pullled or pushed and produced the situation of distortion or fracture.In addition, after the thickness of adhesive body reduces, the heat dissipation path of light-emitting diode chip for backlight unit is except that doing the heat radiation via lower substrate, also can directly dispel the heat via the top, as if filling gas, liquid state colloid, elastic gel or oleaginous fluid etc. in confined space, its thermal convection effect of mat then more can improve the radiating effect of light-emitting diode chip for backlight unit again.
In addition, luminescence unit of the present invention more can comprise a reflector and a fluorescent conversion layer.Be provided with on the printing opacity housing in reflector except that fixing light direction, and can make light that a plurality of light-emitting diode chip for backlight unit sends prior to carrying out mixed light in the printing opacity housing.The fluorescent conversion layer then can be in order to change the light color that of luminescence unit, to increase the range of application of luminescence unit.The fluorescent conversion layer more can change to utilize the phosphor body adhesive tape to replace, and increases processing procedure efficient and production reliability.
The above only is an illustrative, but not is restricted.Anyly do not break away from spirit of the present invention and category, and, all should be contained in the scope of claims its equivalent modifications of carrying out or change.
Claims (16)
1. a luminescence unit is characterized in that, comprises:
One substrate;
At least one light-emitting diode chip for backlight unit is arranged on this substrate with an adhesion material;
At least one lead, one first end is connected in this light-emitting diode chip for backlight unit, and one second end is connected in this substrate, and the central point of this second end and this light-emitting diode chip for backlight unit has one first distance, and the peak of this lead and this substrate have a second distance; And
At least one adhesive body, at least this light-emitting diode chip for backlight unit of cover part, and the cumulative volume of this adhesive body and this light-emitting diode chip for backlight unit is less than a cylindrical volume that is formed by this first distance and this second distance, wherein this first distance is this cylindrical radius, this second distance is this cylindrical height, and this light-emitting diode chip for backlight unit and the joint face of this substrate are that this second end with this lead is positioned at identical horizontal plane.
2. luminescence unit as claimed in claim 1 wherein, exposes to this adhesive body to this lead of small part.
3. luminescence unit as claimed in claim 1 wherein, more comprises:
One confined space, wherein this light-emitting diode chip for backlight unit, this lead and this adhesive body are positioned at this confined space.
4. luminescence unit as claimed in claim 3 wherein, more comprises:
One printing opacity housing, itself and this substrate links to form this confined space.
5. luminescence unit as claimed in claim 4 wherein, more comprises:
At least one phosphor body adhesive tape, be arranged at this printing opacity housing to the outer surface of small part and/or to the inner surface of small part.
6. luminescence unit as claimed in claim 3 wherein, more comprises:
At least two casing members, wherein this confined space is formed between the described casing member.
7. luminescence unit as claimed in claim 6 wherein, more comprises:
At least one phosphor body adhesive tape is arranged at one of them the part outer surface and/or the part inner surface at least of described casing member.
8. luminescence unit as claimed in claim 3 wherein, more comprises:
One hollow housing, wherein this confined space is formed in this hollow housing.
9. luminescence unit as claimed in claim 8 wherein, more comprises:
At least one phosphor body adhesive tape, be arranged at this hollow housing to the outer surface of small part and/or to the inner surface of small part.
10. as claim 4,6 or 8 described luminescence units, wherein, one of them or this hollow housing at least of this printing opacity housing, described casing member have a plurality of scattering objects.
11. luminescence unit as claimed in claim 10, wherein, described scattering object is scattering particles or scattering bubble.
12. luminescence unit as claimed in claim 3 wherein, more comprises:
One gas, filling is in this confined space.
13. luminescence unit as claimed in claim 12, wherein, this gas is nitrogen or noble gas.
14. luminescence unit as claimed in claim 3 wherein, is a vacuum in this confined space.
15. luminescence unit as claimed in claim 3 wherein, more comprises:
A colloid or a fluid, filling is in this confined space.
16. luminescence unit as claimed in claim 1, wherein, the emission spectrum of this light-emitting diode chip for backlight unit comprises visible-range and/or ultraviolet light range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100804727A CN101452922B (en) | 2007-12-06 | 2008-02-19 | Light emitting unit |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710193353.8 | 2007-12-06 | ||
| CN200710193353 | 2007-12-06 | ||
| CN2008100804727A CN101452922B (en) | 2007-12-06 | 2008-02-19 | Light emitting unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101452922A CN101452922A (en) | 2009-06-10 |
| CN101452922B true CN101452922B (en) | 2011-09-07 |
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| CN2008100804727A Expired - Fee Related CN101452922B (en) | 2007-12-06 | 2008-02-19 | Light emitting unit |
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| CN (1) | CN101452922B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103928450B (en) * | 2014-04-08 | 2017-01-18 | 广东晶科电子股份有限公司 | Product for packaging LEDs with uniform light color and manufacturing method of product |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1858920A (en) * | 2006-06-05 | 2006-11-08 | 江苏奥雷光电有限公司 | Packaging method for white light LED lamp |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1858920A (en) * | 2006-06-05 | 2006-11-08 | 江苏奥雷光电有限公司 | Packaging method for white light LED lamp |
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|---|---|
| CN101452922A (en) | 2009-06-10 |
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Granted publication date: 20110907 Termination date: 20140219 |