CN113437052A - Color conversion layer for improving microminiature LED backlight or display uniformity and preparation method thereof - Google Patents

Color conversion layer for improving microminiature LED backlight or display uniformity and preparation method thereof Download PDF

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CN113437052A
CN113437052A CN202110492736.5A CN202110492736A CN113437052A CN 113437052 A CN113437052 A CN 113437052A CN 202110492736 A CN202110492736 A CN 202110492736A CN 113437052 A CN113437052 A CN 113437052A
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color conversion
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conversion layer
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CN113437052B (en
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陈恩果
陈瑜
申琼鑫
林鉴垚
叶媛媛
胡新培
郭太良
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Fuzhou University
Mindu Innovation Laboratory
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    • H—ELECTRICITY
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    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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Abstract

The invention relates to a color conversion layer for improving the backlight or display uniformity of a microminiature LED and a preparation method thereof. The material is formed by tightly compounding three parts of a non-uniform luminous dielectric film, a scattering particle film and other optical functional films; the non-uniform luminous dielectric film is used for converting short-wavelength exciting light generated by the micro-miniature LED module into light with other wavelengths; the overall structure of the non-uniform luminous dielectric film is a rotationally symmetric curved surface or a non-rotationally symmetric curved surface, the non-uniform luminous dielectric film is formed into an array by connecting a plurality of unit structures, and the unit structures and the microminiature LEDs form one-to-one, one-to-many or many-to-one corresponding relations; the scattering particle film is used for scattering converted light and flattening the film layer; the other optical functional film is used for adding optical performance or playing a protection role. The invention can realize accurate matching with the micro-LED, high-efficiency conversion of light energy, uniform light emission, high-color gamut display and the like, and can be used for solving the problem of large-angle distribution uniformity of the light emission of the micro-LED.

Description

Color conversion layer for improving microminiature LED backlight or display uniformity and preparation method thereof
Technical Field
The invention relates to the technical field of displays, in particular to a color conversion layer for improving the backlight or display uniformity of a microminiature LED and a preparation method thereof.
Background
LEDs have been in existence for over 50 years, and the chip size of typical display signs is on the millimeter scale, and not until the last decade. The microminiature LED has high light utilization rate and excellent display performance, and is superior to the LCD and the traditional LED in the aspects of brightness, contrast, definition and other image quality, response speed, service life, power consumption and other performances. The microminiature LED backlight can bring upgrading with better display effect and thinner thickness, and when the microminiature LED backlight is used as the liquid crystal panel backlight, the microminiature LED backlight has the advantages of completely retaining three primary colors of RGB, realizing refined control and high display contrast, having thinner thickness, having high brightness and uniform heat dissipation. The small-sized LED chip will become the mainstream trend of future display devices.
Luminescable dielectric materials are capable of absorbing energy in some form and converting it to light radiation, often in the form of color filters or color conversion layers, which are key components of colorization in displays. The luminescent medium material comprises a plurality of types such as fluorescent powder, quantum dots, long afterglow luminescent materials, up-conversion luminescent materials and the like. At present, fluorescent powder is commonly used in commercial display devices as a main material of color pixels, and quantum dot displays using quantum dots as a pixel material or a color conversion layer material are rapidly rising in recent years. The nano semiconductor quantum dots become a new focus of attention in the field of information display by the characteristics of low power consumption, ultra-light and thinness, narrow-band light emission, high color saturation and light emission brightness, solution-soluble processing and the like. At present, a micro-miniature LED display panel using photo-induced quantum dots as a color conversion layer has become one of two foremost applications using quantum dot materials as an autonomous light-emitting panel, which also makes the application of a color conversion film layer of a micro-miniature LED an important development direction and research hotspot of display technology.
However, the micro-miniature LED backlight display panel has some problems, such as uneven light output at a large angle in a corresponding area of a single LED, and the like, and it is necessary to provide an optimized film layer using a light-emitting medium material as a matching micro-miniature LED, which not only can exert the display advantages of the micro-miniature LED chip, but also can further improve the color gamut, efficiency, and the like, thereby greatly improving the backlight effect.
Chinese patent No. CNCN109979960A discloses a method for manufacturing a full-color Micro-LED display device based on a quantum dot light conversion layer, which provides a method for manufacturing a Micro-LED display device of the quantum dot light conversion layer, and can solve the problems of light crosstalk after a quantum dot material is directly coated on the surface of the Micro-LED and difficulty in separation of a light source array and a color conversion film layer. Although the Micro-LED display device capable of emitting red, green and blue light can be obtained by the technical scheme, the problems of display effects such as non-uniform light emission and unstable light emission effect still exist, and therefore an improved light-emitting medium color conversion layer suitable for Micro/Mini-LEDs is still to be provided.
Disclosure of Invention
The invention aims to provide a color conversion layer for improving the backlight or display uniformity of a microminiature LED and a preparation method thereof.
In order to achieve the purpose, the technical scheme of the invention is as follows: a color conversion layer for improving the backlight or display uniformity of a microminiature LED is formed by tightly compounding three parts of a non-uniform luminous dielectric film, a scattering particle film and other optical functional films;
the non-uniform luminous dielectric film is used for converting short-wavelength exciting light generated by the micro-miniature LED module into light with other wavelengths; the overall structure of the non-uniform luminous dielectric film is a rotationally symmetric curved surface or a non-rotationally symmetric curved surface, the non-uniform luminous dielectric film is formed into an array by connecting a plurality of unit structures, and the unit structures and the microminiature LEDs form one-to-one, one-to-many or many-to-one corresponding relations;
the scattering particle film is used for scattering converted light and flattening the film layer;
the other optical functional film is used for adding optical performance or playing a protection role.
In an embodiment of the present invention, the array form formed by the plurality of unit structures in succession includes one or more of a rectangular array, a circular distribution array, a concentric circular array, a planar closest packing, and an archimedean spiral array; the unit structure size is 10-5000 μm.
In an embodiment of the present invention, a cross-sectional profile of the unit structure includes one or a combination of a conical type, a truncated cone type, a conic curve type and a normal type, and a geometric or functional relationship between the thickness d of the unit structure and the direction of the light emitted by the micro-miniature LED is as follows:
(1) if the cross-sectional profile of the unit structure is conical, that is, a right triangle is a rotating body formed by rotating 360 degrees with a right side as an axis, d is defined by the following formula:
Figure BDA0003051969290000021
wherein R is the radius of the bottom surface of the unit structure, d0And theta is the maximum thickness, theta is the included angle formed by the connecting line of the incident point and the light source and the vertical direction, h is the distance between the light source and the film, and d is the thickness of the film layer at the theta angle.
(2) If the cross-sectional profile of the cell structure is truncated cone-shaped, i.e. the upper half of the cone is truncated at a horizontal position, d is defined by the following formula:
Figure BDA0003051969290000022
wherein R is the radius of the lower bottom surface of the unit structure, R is the radius of the upper bottom surface of the unit structure, d0Is the height of the truncated front cone, theta is the included angle formed by the connecting line of the incident point and the light source and the vertical direction, h is the distance between the light source and the film, and d is the film thickness at the theta angle.
(3) If the section profile of the unit structure is a conic curve type, namely a rotating body formed by rotating the conic curve for 360 degrees along the central axis, the line type comprises one of an ellipse and a hyperbola and a parabola;
an elliptical film thickness distribution, d is defined by the following formula:
Figure BDA0003051969290000031
wherein a and b are ellipse equation parameters, determine the shape of elliptic curve, and can be the upper half part (a) of ellipse with focus distributed along horizontal axis>b) Or the upper half (a) of an ellipse with the focal points distributed along the longitudinal axis<b) X is the distance between the point of incidence and the central point of incidence (abscissa) and Δ d represents the distance by which the pattern is translated in the direction of the longitudinal axis. In particular, when a is b and Δ d is 0, the plane curve shows a semicircle and the film thickness distribution is hemispherical, and d may be represented by the formula d r sin α or d2＝(h·tanθ)2+r2Where r is a sphere radius (r ═ a ═ b), θ is an azimuth angle of the target position relative to the light source, h is a distance between the light source and the film, d is a film thickness at the θ angle, and α is an angle between the hemispherical exit point and the center of the sphere.
Hyperbolic film thickness profile, d is defined by the following formula:
Figure BDA0003051969290000032
wherein a and b are hyperbolic equation parameters determining the shape of the hyperbola, x is the distance between the incident point and the central incident point, and d0The film thickness at the central incidence point (where the film thickness is the largest) is shown by the planar curve with the focus in the lower part of the longitudinal hyperbolic curve.
Parabolic film thickness profile, d is defined by the following equation:
d＝-px2+d0(p＞0)
wherein p is a parabolic equation parameter which determines the shape of the parabola, x is the distance between the incident point and the central incident point, and d0The film thickness at the center incidence point (the maximum film thickness).
Further, for the above conic section, at (x, d) there is: and x is h and tan theta, wherein h is the distance between the light source and the film, and theta is an included angle formed by a connecting line of an incidence point and the light source and the vertical direction.
(4) If the cross-sectional profile of the unit structure is normal, the unit structure may be a rotating body formed by rotating a one-dimensional normal distribution curve by 360 degrees along a central axis, or a three-dimensional structure formed by enclosing a two-dimensional normal distribution and a plane.
d is defined by the following equation:
Figure BDA0003051969290000033
wherein x is the distance between the incident point and the central incident point, σ is the standard deviation of the one-dimensional normal distribution obeyed by the film thickness, and μ is the expectation of the one-dimensional normal distribution obeyed by the film thickness; at (x, d) there are: and x is h and tan theta, wherein h is the distance between the light source and the film, and theta is an included angle formed by a connecting line of an incidence point and the light source and the vertical direction.
Or, defined by a two-dimensional normal distribution formula:
Figure BDA0003051969290000041
i.e., the joint distribution of the following two one-dimensional normal distribution components:
Figure BDA0003051969290000042
wherein x and y are horizontal and longitudinal distances between the incident point and the incident center point of the light source (horizontal two-dimensional plane coordinate values established by using the incident center point as the origin), and σ1、σ2The standard deviation mu of the film thickness obeying one-dimensional normal distribution in the x and y directions1、μ2The film thickness is expected to follow one-dimensional normal distribution in the x and y directions, respectively, ρ is the correlation coefficient (binding tightness parameter) of x and y, and d is the film thickness at the target position. Further, at (x, y, d) there is:
Figure BDA0003051969290000043
wherein h is the distance between the light source and the film, and theta is an included angle formed by a connecting line of the incident point and the light source and the vertical direction.
In an embodiment of the invention, the LED chip of the Micro-miniature LED module comprises one or more of a Mini-LED with the size of 100-500 μm or a Micro-LED with the size of below 50 μm, and can emit blue light or ultraviolet light with high purity and high brightness; the micro LED module is formed by a plurality of LED arrays, and the array arrangement form comprises one or a combination of a plurality of matrix arrays, concentric circle arrays and plane closest packing; the gap between the micro LED module and the color conversion layer can be filled and immersed by an organic material with light transmittance in a visible light range of 390-760 nm.
In an embodiment of the present invention, the matrix material of the non-uniform light emitting dielectric film and the scattering particle film is selected from one or more of Polyethylene (PE), polypropylene (PP), polyethylene naphthalate (PEN), Polycarbonate (PC), polymethyl acrylate (PMA), polymethyl methacrylate (PMMA), Cellulose Acetate Butyrate (CAB), siloxane, polyvinyl chloride (PVC), polyvinyl alcohol (PVA), polyethylene terephthalate (PET), modified polyethylene terephthalate (PETG), Polydimethylsiloxane (PDMS), or Cyclic Olefin Copolymer (COC).
In an embodiment of the present invention, the light-emitting medium in the non-uniform light-emitting medium film may be a photoluminescent material, including but not limited to an inorganic fluorescent material, an organic light-emitting material, a self-luminous body, a phosphorescent body, a long-afterglow light-emitting material, and an upconversion light-emitting material, which may display red, green, blue, or a mixture of one or more colors.
In one embodiment of the invention, the scattering particle film is tightly coated on the non-uniform luminous dielectric film and formed by uniformly dispersing scattering particles in the film substrate, and is used for converting the secondary scattering of light and flattening the film; the scattering particles are one or more of silicon dioxide, titanium dioxide, tin dioxide, aluminum oxide, calcium oxide, zinc oxide, zirconium oxide, magnesium oxide, lanthanum oxide, beryllium oxide, or a combination of one or more of organic materials, such as polystyrene, polymethyl methacrylate, styrene acrylate.
In one embodiment of the present invention, the other optical functional film includes one or more of a diffusion film, an antireflection film, a reflection film, a light filter film, a prism film, a polarizing film, a spectroscopic film, a phase film, an optical protective film, a cold light film, a hydrophobic film, a barrier film, a diamond and diamond-like film, a soft X-ray multilayer film, a solar selective absorption film, and an optical film for optical communication; the refractive index of the film layer of the other optical functional film can be changed suddenly at the interface, but is continuous in the film layer; the film layer of the other optical functional film is a transparent medium or an absorption medium and has a smooth surface.
The invention also provides a preparation method of the color conversion layer for improving the backlight or display uniformity of the microminiature LED, which comprises the following steps:
step S1, manufacturing a mold: using Polydimethylsiloxane (PDMS) material to manufacture a mould with a corresponding shape according to the required morphological structure of the non-uniform luminous dielectric film;
step S2, preparing a film forming material: selecting a first film substrate, adding a luminescent medium, and magnetically stirring at room temperature for 0.5-6h to uniformly distribute the luminescent medium in the first film substrate to obtain a luminescent medium film-forming material; selecting a second film substrate, adding scattering particles, and magnetically stirring at room temperature for 0.5-6h to uniformly distribute the scattering particles in the second film substrate to obtain a scattering particle film-forming material;
step S3, injection molding of the luminous medium film: transferring the prepared luminescent medium film-forming material to the side surface of a PDMS mold, standing for 1-6h, and fully injecting liquid into the mold by utilizing a capillary phenomenon; transferring to a heating table, heating at 5-300 deg.C for 10-60min for molding, standing and cooling for 10-40min, demolding, and transferring to an oven for drying at 80-300 deg.C for 5-30min to obtain non-uniform luminous dielectric film;
step S4, coating and molding the scattering particle film: placing the non-uniform luminous dielectric film on a substrate, placing the substrate in a spin coater/spin coater or a blade coater, and uniformly coating the scattering particle film forming material on the non-uniform luminous dielectric film to obtain a flattened film surface; transferring to a heating table, heating at 5-300 deg.C for 5-40min for molding, and transferring to an oven for drying at 80-300 deg.C for 5-30 min;
step S5, compounding other optical functional films: coating a layer of adhesive for optical films, or selecting optical films with the adhesive, adhering other optical functional films above the scattering particle film, and tightly attaching the films by adopting a flat stamping or blade coating mode; or, according to the size or performance requirement of the target device, other optical films are directly placed above the scattering particle film; a color conversion layer is obtained.
And step S6, taking down the manufactured color conversion layer combined structure from the substrate, transferring the color conversion layer combined structure to the upper part of the miniature LED module, and aligning and attaching according to the matching relation and the arrangement mode.
In an embodiment of the present invention, the color conversion layer may also be filled with only scattering particles, that is, a scattering layer with non-uniform thickness distribution is made of the scattering particles and used as the scattering layer, and the color of the light source should match the color of the light output required by the display or backlight.
Compared with the prior art, the invention has the following beneficial effects: the non-uniform luminous dielectric film has multiple advantages, such as accurate matching with a micro-LED, efficient conversion of light energy, uniform light emission, high color gamut display and the like, and can be used for solving the problem of large-angle distribution uniformity of light emission of the micro-LED.
Drawings
FIG. 1 is a schematic diagram of a micro-miniature LED and a non-uniform color conversion film matched convex structure according to the present invention;
FIG. 2 is a schematic diagram of a concave structure of the micro-miniature LED of the present invention matched with a non-uniform color conversion film;
FIG. 3 is a schematic view of a PDMS film forming process according to the present invention;
FIG. 4 is a schematic cross-sectional view of a conical unit structure according to the present invention;
FIG. 5 is a cross-sectional view of a truncated cone-shaped unit structure according to the present invention;
FIG. 6 is a schematic cross-sectional view of a conic section unit structure according to the present invention;
FIG. 7 is a schematic sectional view of a normal cell structure according to the present invention;
FIG. 8 is a schematic diagram of a two-dimensional normal distribution type unit structure according to the present invention;
in the figure: 1-LED array, 2-inhomogeneous luminous dielectric film, 3-scattering particle film, 4-other optical structure, 5-filling material, 6-PDMS mold, 7-microstructure for forming membrane in PDMS mold, and 8-conduit for injecting membrane forming material.
Detailed Description
The technical scheme of the invention is specifically explained below with reference to the accompanying drawings.
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular is intended to include the plural unless the context clearly dictates otherwise.
A quantum dot color conversion layer for improving the display uniformity of a microminiature LED and a preparation method thereof are provided, wherein the quantum dot color conversion layer is composed of a non-uniform luminous dielectric film, a scattering particle film and other optical films, and can be used for matching backlight display and direct display of blue light provided by a microminiature LED array module.
The micro LED light source array is used as a backlight or a display module to generate short-wavelength exciting light and provide energy to excite quantum dots, and a gap between the LED module and the color conversion layer can be filled and immersed by organic materials with light transmittance in a visible light range of 390-760 nm, such as silica gel, resin, organic glass and the like.
The quantum dot color conversion layer is composed of a non-uniform luminous dielectric film, a scattering particle film and other optical functional films from bottom to top. The non-uniform quantum dot color conversion film is used for converting short-wavelength exciting light into light with other wavelengths, the scattering particle film is used for scattering the converted light and enabling the film layer to be flattened, and the other optical functional films are used for adding other optical properties or playing a protection role.
The overall structure of the non-uniform luminous dielectric film can be a rotationally symmetric curved surface or a non-rotationally symmetric curved surface and is formed by a plurality of unit structure arrays, and the array form can be one or a combination of more of a rectangular array, a circular distribution array, a concentric circular array, plane closest packing and an Archimedes spiral array; the units and the microminiature LED light source form one-to-one or one-to-many corresponding relationship. The unit structure can be one or a combination of a plurality of cone types, circular truncated cone types, conical curve types and normal types, but is not limited to the combination, and the thickness d of the unit structure has a certain geometric or functional relationship with the direction of emergent light of the Mini-LED.
A plurality of scattering particles are distributed in the scattering particle film, and converted light passing through the scattering particle film can be subjected to secondary scattering.
The addition of the additional optical film may bring about more optical properties.
As shown in fig. 1 and 2, the schematic diagram of the matching structure of the micro-miniature LED and the quantum dot color conversion layer sequentially comprises a 1-LED array, a 2-non-uniform light-emitting dielectric film, a 3-scattering particle film, 4-other optical films and 5-filling materials from bottom to top.
The matrix material for forming the light-emitting dielectric film and the scattering particle film is one or more selected from Polyethylene (PE), polypropylene (PP), polyethylene naphthalate (PEN), Polycarbonate (PC), polymethyl acrylate (PMA), polymethyl methacrylate (PMMA), Cellulose Acetate Butyrate (CAB), siloxane, polyvinyl chloride (PVC), polyvinyl alcohol (PVA), polyethylene terephthalate (PET), modified polyethylene terephthalate (PETG), Polydimethylsiloxane (PDMS) or cycloolefin copolymer (COC).
The luminescent medium for color conversion may be a photoluminescent material, including but not limited to inorganic fluorescent materials, organic luminescent materials, self-luminophores, phosphorescent objects, long-afterglow luminescent materials, and up-conversion luminescent materials, and may be a mixture of one or more of rare earth ion luminescent and rare earth fluorescent materials, electron capture materials, quantum dot materials, yttrium oxide doped materials, and the like, which may display red, green, blue, or a mixture of one or more colors. If the quantum dots are selected, the quantum dots can be selected from II-VI compounds, can also be selected from III-V compounds, can be inorganic compounds, can also be organic compounds, preferably silicon quantum dots, germanium quantum dots, cadmium sulfide quantum dots, cadmium selenide quantum dots, cadmium telluride quantum dots, zinc selenide quantum dots, lead sulfide quantum dots, lead selenide quantum dots, indium phosphide quantum dots, indium arsenide quantum dots and perovskite quantum dot materials, can be used for displaying red, green and blue, and have the following characteristics:
(1) the wavelength of light that can be emitted can extend from the visible band to the infrared band;
(2) the full width at half maximum (FWHM) of the emitted light is less than 20 nm;
(3) the quantum efficiency can reach 90%;
(4) the quantum dot LED can be manufactured after being mixed with the organic transmission layer.
The invention realizes the excitation of different colors of light by controlling different particle diameters of the quantum dots selected for coating, for example, the quantum dots with the particle diameter of 18-20nm can be excited to emit red light, the quantum dots with the particle diameter of 12-14nm can be excited to emit green light, and the quantum dots with the particle diameter of 6-8nm can be excited to emit blue light.
The scattering particles used for manufacturing the scattering particle film in the present invention may be one or more of silicon dioxide, titanium dioxide, tin dioxide, aluminum oxide, calcium oxide, zinc oxide, zirconium oxide, magnesium oxide, lanthanum oxide, beryllium oxide, or one or more of organic materials, such as polystyrene, polymethyl methacrylate, styrene acrylate, and the like.
The color conversion layer can also be filled with only scattering particles, i.e. a scattering layer with non-uniform thickness distribution is made of the scattering particles and used as the scattering layer, and the color of the light source should be matched with the light-emitting color required by the display or backlight.
As shown in fig. 3, the structure of the PDMS film forming process is sequentially a microstructure for forming a membrane in a 6-PDMS mold, a microstructure for forming a PDMS film in a 7-PDMS mold, and a conduit for injecting a film forming material.
Example one
Taking the convex surface type as an example, the cross section of the conical non-uniform light-emitting dielectric film structure shown in fig. 4 is an isosceles triangle.
2-the non-uniform luminescent medium film thickness d is defined by the following formula:
Figure BDA0003051969290000081
wherein R is the radius of the bottom surface of the unit structure, d0And theta is the maximum thickness, theta is the included angle formed by the connecting line of the incident point and the light source and the vertical direction, h is the distance between the light source and the film, and d is the thickness of the film layer at the theta angle.
The specific process steps are as follows:
step S1: and (5) manufacturing a mould. Using Polydimethylsiloxane (PDMS) material to manufacture a mould with a corresponding shape according to the required shape structure of the non-uniform luminous dielectric film;
step S2: preparing the film-forming material. Selecting a proper film forming substrate A, adding quantum dots, and magnetically stirring at room temperature for 0.5-6h to uniformly distribute the quantum dots in the substrate A to obtain a luminescent medium film forming material; selecting a proper matrix B, adding scattering particles, and magnetically stirring at room temperature for 0.5-6h to uniformly distribute the scattering particles in the matrix B to obtain the scattering particle film-forming material.
Step S3: and injection molding the non-uniform luminous dielectric film. Transferring the prepared luminescent medium film-forming material to the side surface of a PDMS mold, standing for 1-6h, and fully injecting liquid into the mold by utilizing a capillary phenomenon; transferring to a heating table, heating at 5-300 deg.C for 10-60min for molding, standing and cooling for 10-40min, demolding, and oven drying at 80-300 deg.C for 5-30min to obtain non-uniform luminous dielectric film.
Step S4: and coating and forming a scattering particle film. Placing the non-uniform luminous dielectric film on a substrate, placing the substrate in a spin coater (spin coater) or a blade coater, and uniformly coating the scattering particle film-forming material on the non-uniform luminous dielectric film to obtain a flattened film surface; transferring to a heating table, heating at 5-300 deg.C for 5-40min, molding, and transferring to an oven for drying at 80-300 deg.C for 5-30 min.
Step S5: compounding other optical functional films. Coating a layer of adhesive for optical films, or selecting optical films with the adhesive, adhering other optical functional films above the scattering particle film, and tightly attaching the films by adopting a flat stamping or blade coating mode; alternatively, other optical films may be placed directly over the scattering particle film depending on the target device size or performance requirements. A color conversion layer is obtained.
Step S6: and taking down the manufactured color conversion layer combined structure from the substrate, transferring the color conversion layer combined structure to the upper part of the LED module, and aligning and attaching according to the matching relation and the arrangement mode.
The manufactured module is as shown in fig. 1, pure blue light is emitted by a 1-LED array at the bottom, the intensity of the blue light is different at different angles, and the module particularly follows lambert cosine distribution; blue light with different angles and intensities passes through the 5-filling material, is incident at the bottom of the 2-non-uniform luminous dielectric film and enters the non-uniform luminous dielectric film, the blue light excites the quantum dots to be converted into light with other colors corresponding to the particle sizes of the quantum dots, and the light emitted from the upper surface of the non-uniform luminous dielectric film is more uniform in brightness and color due to matching of the light intensities and film thicknesses at different angles and the scattering effect of the quantum dots; then, the light passes through the 3-scattering particle layer, and under the strong scattering action of the light, converted light with uniform brightness and color is obtained above the scattering particle layer; 4-other optical films are additionally arranged on the quantum dot color conversion layer, so that the light effect is further enhanced or other optical properties are increased, and a uniform backlight source, a monochromatic light source and the like are provided for the display.
Example two
Taking the convex surface type as an example, the truncated cone quantum dot film structure shown in fig. 5 is a truncated cone with the upper half of the cone cut off at a certain horizontal position, and the cross section of the truncated cone is an isosceles trapezoid.
2-the non-uniform luminescent medium film thickness d is defined by the following formula:
Figure BDA0003051969290000091
wherein R is the radius of the lower bottom surface of the unit structure, R is the radius of the upper bottom surface of the unit structure, d0Is the height of the truncated front cone, theta is the included angle formed by the connecting line of the incident point and the light source and the vertical direction, h is the distance between the light source and the film, and d is the film thickness at the theta angle.
The manufacturing process steps and the film layer structure are the same as those of the first embodiment.
EXAMPLE III
Taking the convex type as an example, the conic curve type sub-point membrane structure shown in fig. 6 has a cross section of one branch or parabola of the upper half of an ellipse or a hyperbola.
2-the non-uniform luminescent dielectric film satisfies an elliptical film thickness distribution, d is defined by the following formula:
Figure BDA0003051969290000092
wherein a and b are ellipse equation parameters, determine the shape of elliptic curve, and can be the upper half part (a) of ellipse with focus distributed along horizontal axis>b) Or the upper half (a) of an ellipse with the focal points distributed along the longitudinal axis<b) X is the distance between the point of incidence and the central point of incidence (abscissa), and Δ d represents the flatness of the graph in the direction of the longitudinal axisThe distance of movement. In particular, when a is b and Δ d is 0, the plane curve shows a semicircle and the film thickness distribution is hemispherical, and d may be represented by the formula d r sin α or d2＝(h·tanθ)2+r2Where r is a sphere radius (r ═ a ═ b), θ is an azimuth angle of the target position relative to the light source, h is a distance between the light source and the film, d is a film thickness at the θ angle, and α is an angle between the hemispherical exit point and the center of the sphere.
Or, the 2-non-uniform luminous dielectric film satisfies a hyperbolic film thickness distribution, and d is defined by the following formula:
Figure BDA0003051969290000101
wherein a and b are hyperbolic equation parameters determining the shape of the hyperbola, x is the distance between the incident point and the central incident point, and d0The film thickness at the central incidence point (where the film thickness is the largest) is shown by the planar curve with the focus in the lower part of the longitudinal hyperbolic curve.
Or, 2-the non-uniform luminous dielectric film satisfies the parabolic film thickness distribution, d is defined by the following formula:
d＝-px2+d0(p＞0)
wherein p is a parabolic equation parameter which determines the shape of the parabola, x is the distance between the incident point and the central incident point, and d0The film thickness at the center incidence point (the maximum film thickness).
Further, for the above conic section, at (x, d) there is: and x is h and tan theta, wherein h is the distance between the light source and the film, and theta is an included angle formed by a connecting line of an incidence point and the light source and the vertical direction.
The manufacturing process steps and the film layer structure are the same as those of the first embodiment.
Example four
Taking the convex surface type as an example, the normal type light-emitting dielectric film structure shown in fig. 7 is a rotating body formed by rotating a normal distribution curve by 360 degrees along a central axis, and the cross section of the rotating body is a graph formed by enclosing a one-dimensional normal distribution curve and an x axis. d is defined by the following equation:
Figure BDA0003051969290000102
wherein x is the distance between the incident point and the central incident point, σ is the standard deviation of the one-dimensional normal distribution obeyed by the film thickness, and μ is the expectation of the one-dimensional normal distribution obeyed by the film thickness; at (x, d) there are: and x is h and tan theta, wherein h is the distance between the light source and the film, and theta is an included angle formed by a connecting line of an incidence point and the light source and the vertical direction.
Or, as shown in fig. 8, d is defined by the two-dimensional normal distribution formula:
Figure BDA0003051969290000103
i.e., the joint distribution of the following two one-dimensional normal distribution components:
Figure BDA0003051969290000104
wherein x and y are horizontal and longitudinal distances between the incident point and the incident center point of the light source (horizontal two-dimensional plane coordinate values established by using the incident center point as the origin), and σ1、σ2The standard deviation mu of the film thickness obeying one-dimensional normal distribution in the x and y directions1、μ2The film thickness is expected to follow one-dimensional normal distribution in the x and y directions, respectively, ρ is the correlation coefficient (binding tightness parameter) of x and y, and d is the film thickness at the target position. Further, at (x, y, d) there is:
Figure BDA0003051969290000111
wherein h is the distance between the light source and the film, and theta is an included angle formed by a connecting line of the incident point and the light source and the vertical direction.
The manufacturing process steps and the film layer structure are the same as those of the first embodiment.
EXAMPLE five
Fig. 2 is a schematic diagram showing a concave structure matched with the non-uniform color conversion film, wherein the cross-sectional structure can be obtained by turning or rotating 180 ° based on the structures of the first to fourth embodiments, and has similar or identical film thickness distribution properties, but has an inverse matching manner in relation to the LED module. And step S4 should be modified to:
step S4: and coating and forming a scattering particle film. Placing the substrate in a spin coater or a blade coater, and uniformly coating the film-forming material of the scattering particles on the substrate to obtain a flattened film surface; transferring to a heating table, and heating at 5-300 deg.C for 5-40min for molding. And placing the non-uniform luminous dielectric film on the upper surface of the scattering particle film, attaching, and transferring to an oven to be dried for 5-30min at the temperature of 80-300 ℃.
EXAMPLE six
The color conversion layer can also be filled with only scattering particles, i.e. a scattering layer with non-uniform thickness distribution is made of the scattering particles and used as the scattering layer, and the color of the light source should be matched with the light-emitting color required by the display or backlight. In the preparation process, the non-uniform luminescent medium film-forming material is replaced by a scattering particle film-forming material, the curing parameters of the material are selected for curing, and then other steps are carried out.
The foregoing is directed to preferred embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow. However, any simple modification, equivalent change and modification of the above embodiments according to the technical essence of the present invention are within the protection scope of the technical solution of the present invention.

Claims (10)

1. A color conversion layer for improving the backlight or display uniformity of a microminiature LED is characterized by being formed by tightly compounding three parts of a non-uniform luminous dielectric film, a scattering particle film and other optical functional films;
the non-uniform luminous dielectric film is used for converting short-wavelength exciting light generated by the micro-miniature LED module into light with other wavelengths; the overall structure of the non-uniform luminous dielectric film is a rotationally symmetric curved surface or a non-rotationally symmetric curved surface, the non-uniform luminous dielectric film is formed into an array by connecting a plurality of unit structures, and the unit structures and the microminiature LEDs form one-to-one, one-to-many or many-to-one corresponding relations;
the scattering particle film is used for scattering converted light and flattening the film layer;
the other optical functional film is used for adding optical performance or playing a protection role.
2. The color conversion layer for improving backlight or display uniformity of micro-miniature LEDs as claimed in claim 1, wherein the array form formed by the plurality of unit structures comprises one or more of rectangular array, circular distribution array, concentric circle array, planar closest packing, and Archimedes spiral array; the unit structure size is 10-5000 μm.
3. The color conversion layer for improving backlight or display uniformity of micro-miniature LEDs as claimed in claim 1, wherein the cross-sectional profile of said unit structure comprises one or more of a combination of a cone type, a truncated cone type, a conic curve type and a normal type, and the thickness d of the unit structure has a geometric or functional relationship with the direction of light emitted from the micro-miniature LED as follows:
(1) if the cross-sectional profile of the unit structure is conical, that is, a right triangle is a rotating body formed by rotating 360 degrees with a right side as an axis, d is defined by the following formula:
Figure FDA0003051969280000011
wherein R is the radius of the bottom surface of the unit structure, d0The maximum thickness is theta, the included angle formed by the connecting line of the incident point and the light source and the vertical direction is theta, h is the distance between the light source and the film, and d is the thickness of the film layer at the theta angle;
(2) if the cross-sectional profile of the cell structure is truncated cone-shaped, i.e. the upper half of the cone is truncated at a horizontal position, d is defined by the following formula:
Figure FDA0003051969280000012
wherein R is the radius of the lower bottom surface of the unit structure, R is the radius of the upper bottom surface of the unit structure, d0The height of a truncated front cone is theta, theta is an included angle formed by a connecting line of an incident point and a light source and the vertical direction, h is the distance between the light source and the film, and d is the thickness of the film layer at the theta angle;
(3) if the section profile of the unit structure is a conic curve type, namely a rotating body formed by rotating the conic curve for 360 degrees along the central axis, the line type comprises one of an ellipse and a hyperbola and a parabola;
an elliptical film thickness distribution, d is defined by the following formula:
Figure FDA0003051969280000021
wherein a and b are ellipse equation parameters, determine the shape of elliptic curve, and can be the upper half part (a) of ellipse with focus distributed along horizontal axis>b) Or the upper half (a) of an ellipse with the focal points distributed along the longitudinal axis<b) X is the distance between the point of incidence and the central point of incidence (abscissa), and Δ d represents the distance by which the graph is translated in the direction of the longitudinal axis; in particular, when a is b and Δ d is 0, the plane curve shows a semicircle and the film thickness distribution is hemispherical, and d may be represented by the formula d r sin α or d2＝(h·tanθ)2+r2Defining, wherein r is a sphere radius (r ═ a ═ b), θ is an azimuth angle of the target position relative to the light source, h is a distance between the light source and the film, d is a film thickness at the θ angle, and α is an included angle between a hemispherical exit point and a sphere center;
hyperbolic film thickness profile, d is defined by the following formula:
Figure FDA0003051969280000022
wherein a and b are hyperbolic equationsThe parameter determines the shape of the hyperbola, x is the distance between the incident point and the central incident point, d0The film thickness at the central incidence point, namely the maximum film thickness, and the plane curve shows that the focus is positioned at the lower part of the longitudinal axis hyperbola;
parabolic film thickness profile, d is defined by the following equation:
d＝-px2+d0(p＞0)
wherein p is a parabolic equation parameter which determines the shape of the parabola, x is the distance between the incident point and the central incident point, and d0The film thickness at the central incident point, namely the position with the maximum film thickness;
further, for the above conic section, at (x, d) there is: x is h and tan theta, wherein h is the distance between the light source and the film, and theta is an included angle formed by a connecting line of an incident point and the light source and the vertical direction;
(4) if the section profile of the unit structure is normal, the unit structure can be a rotating body formed by rotating a one-dimensional normal distribution curve for 360 degrees along a central axis, or a three-dimensional structure formed by surrounding a two-dimensional normal distribution and a certain plane;
d is defined by the following equation:
Figure FDA0003051969280000023
wherein x is the distance between the incident point and the central incident point, σ is the standard deviation of the one-dimensional normal distribution obeyed by the film thickness, and μ is the expectation of the one-dimensional normal distribution obeyed by the film thickness; at (x, d) there are: x is h and tan theta, wherein h is the distance between the light source and the film, and theta is an included angle formed by a connecting line of an incident point and the light source and the vertical direction;
or, defined by a two-dimensional normal distribution formula:
Figure FDA0003051969280000031
i.e., the joint distribution of the following two one-dimensional normal distribution components:
Figure FDA0003051969280000032
wherein x and y are the horizontal and longitudinal distances between the incident point and the incident center point of the light source, i.e. horizontal two-dimensional plane coordinate values established by using the incident center point as the origin, sigma1、σ2The standard deviation mu of the film thickness obeying one-dimensional normal distribution in the x and y directions1、μ2Respectively the film thickness is expected to obey one-dimensional normal distribution in the x and y directions, rho is a combination tightness parameter of x and y, and d is the thickness of the target position film layer; further, at (x, y, d) there is:
Figure FDA0003051969280000033
wherein h is the distance between the light source and the film, and theta is an included angle formed by a connecting line of the incident point and the light source and the vertical direction.
4. The color conversion layer for improving backlight or display uniformity of Micro LEDs as claimed in claim 1, wherein the LED chip of the Micro LED module comprises one or more of Mini-LED with size of 100-500 μm or Micro-LED with size of 50 μm or less, and can emit blue light or ultraviolet light with high purity and high brightness; the micro LED module is formed by a plurality of LED arrays, and the array arrangement form comprises one or a combination of a plurality of matrix arrays, concentric circle arrays and plane closest packing; the gap between the micro LED module and the color conversion layer can be filled and immersed by an organic material with light transmittance in a visible light range of 390-760 nm.
5. The color conversion layer for improving backlight or display uniformity of micro LED's according to claim 1, wherein the matrix material of the non-uniform light-emitting dielectric film and the scattering particle film is selected from one or more of Polyethylene (PE), polypropylene (PP), polyethylene naphthalate (PEN), Polycarbonate (PC), polymethyl acrylate (PMA), polymethyl methacrylate (PMMA), Cellulose Acetate Butyrate (CAB), siloxane, polyvinyl chloride (PVC), polyvinyl alcohol (PVA), polyethylene terephthalate (PET), modified polyethylene terephthalate (PETG), Polydimethylsiloxane (PDMS), or Cyclic Olefin Copolymer (COC).
6. The color conversion layer for improving backlight or display uniformity of micro-miniature LED as claimed in claim 1, wherein said non-uniform luminescent medium film comprises photoluminescent material, including but not limited to inorganic fluorescent material, organic luminescent material, self-luminescent material, phosphorescent material, long afterglow luminescent material, and up-conversion luminescent material, which can display red, green, blue or a mixture of one or more colors.
7. The color conversion layer for improving backlight or display uniformity of micro-miniature LEDs as claimed in claim 1, wherein said scattering particle film is tightly coated on top of the non-uniform luminescent dielectric film, formed by uniformly dispersing scattering particles in the film substrate, for converting the secondary scattering of light and planarizing the film; the scattering particles are one or more of silicon dioxide, titanium dioxide, tin dioxide, aluminum oxide, calcium oxide, zinc oxide, zirconium oxide, magnesium oxide, lanthanum oxide, beryllium oxide, or a combination of one or more of organic materials, such as polystyrene, polymethyl methacrylate, styrene acrylate.
8. The color conversion layer for improving the backlight or display uniformity of micro-miniature LEDs as claimed in claim 1, wherein said other optical functional films comprise one or more of diffusion film, antireflection film, reflection film, light filter film, prism film, polarizing film, light splitting film, phase film, optical protection film, cold light film, hydrophobic film, barrier film, diamond and diamond-like film, soft X-ray multilayer film, solar selective absorption film, and optical film for optical communication; the refractive index of the film layer of the other optical functional film can be changed suddenly at the interface, but is continuous in the film layer; the film layer of the other optical functional film is a transparent medium or an absorption medium and has a smooth surface.
9. The method for preparing the color conversion layer for improving the backlight or display uniformity of the microminiature LED according to any one of claims 1 to 8, comprising the steps of:
step S1, manufacturing a mold: using Polydimethylsiloxane (PDMS) material to manufacture a mould with a corresponding shape according to the required morphological structure of the non-uniform luminous dielectric film;
step S2, preparing a film forming material: selecting a first film substrate, adding a luminescent medium, and magnetically stirring at room temperature for 0.5-6h to uniformly distribute the luminescent medium in the first film substrate to obtain a luminescent medium film-forming material; selecting a second film substrate, adding scattering particles, and magnetically stirring at room temperature for 0.5-6h to uniformly distribute the scattering particles in the second film substrate to obtain a scattering particle film-forming material;
step S3, injection molding of the luminous medium film: transferring the prepared luminescent medium film-forming material to the side surface of a PDMS mold, standing for 1-6h, and fully injecting liquid into the mold by utilizing a capillary phenomenon; transferring to a heating table, heating at 5-300 deg.C for 10-60min for molding, standing and cooling for 10-40min, demolding, and transferring to an oven for drying at 80-300 deg.C for 5-30min to obtain non-uniform luminous dielectric film;
step S4, coating and molding the scattering particle film: placing the non-uniform luminous dielectric film on a substrate, placing the substrate in a spin coater/spin coater or a blade coater, and uniformly coating the scattering particle film forming material on the non-uniform luminous dielectric film to obtain a flattened film surface; transferring to a heating table, heating at 5-300 deg.C for 5-40min for molding, and transferring to an oven for drying at 80-300 deg.C for 5-30 min;
step S5, compounding other optical functional films: coating a layer of adhesive for optical films, or selecting optical films with the adhesive, adhering other optical functional films above the scattering particle film, and tightly attaching the films by adopting a flat stamping or blade coating mode; or, according to the size or performance requirement of the target device, other optical films are directly placed above the scattering particle film; obtaining a color conversion layer;
and step S6, taking down the manufactured color conversion layer combined structure from the substrate, transferring the color conversion layer combined structure to the upper part of the miniature LED module, and aligning and attaching according to the matching relation and the arrangement mode.
10. The method as claimed in claim 9, wherein the color conversion layer is filled with scattering particles, that is, the scattering layer with non-uniform thickness distribution is made of scattering particles, and the color of the light source is matched with the color of the light emitted from the display or backlight.
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CN115411023B (en) * 2022-08-22 2023-09-19 深圳市未林森科技有限公司 COB light source color uniformity control process method with small error

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