TW201802552A - Devices comprising a patterned color conversion medium and methods for making the same - Google Patents

Devices comprising a patterned color conversion medium and methods for making the same Download PDF

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TW201802552A
TW201802552A TW106118802A TW106118802A TW201802552A TW 201802552 A TW201802552 A TW 201802552A TW 106118802 A TW106118802 A TW 106118802A TW 106118802 A TW106118802 A TW 106118802A TW 201802552 A TW201802552 A TW 201802552A
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color conversion
substrate
light
conversion medium
assembly
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約翰菲立普 厄特爾
提摩西詹姆士 歐斯禮
威廉理查 楚納
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康寧公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/505Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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  • Liquid Crystal (AREA)

Abstract

Disclosed herein are optical assemblies comprising a light emitting device, a color conversion medium at least partially circumscribing the light emitting device, and a transparent lens positioned in overlying registration with the light emitting device and the color conversion medium. Also disclosed herein are color conversion assemblies comprising a color conversion medium arranged in a ring-shaped pattern between two substrates. Further disclosed herein are light conversion devices comprising a substrate having a first surface patterned with a color conversion medium and a reflective layer disposed on the first surface and at least partially encapsulating the color conversion medium. Display, lighting, and electronic devices comprising such assemblies and devices are also disclosed herein.

Description

包含經圖案化之色彩轉換介質的裝置及其製造方法Device including patterned color conversion medium and manufacturing method thereof

本揭示內容總體上係關於包含經圖案化之色彩轉換介質的裝置,且更特地而言係關於包含透鏡、色彩轉換介質、及/或光源中至少兩者的光學總成,以及包含此等總成之顯示及照明裝置。This disclosure relates generally to devices that include patterned color conversion media, and more particularly to optical assemblies that include at least two of a lens, a color conversion medium, and / or a light source, and includes such assemblies. Into a display and lighting device.

液晶顯示器(liquid crystal display; LCD)係通常用於各種電子設備,諸如手機、膝上型電腦、電子平板、電視、及電腦監視器。習知LCD典型地包含藍色發光二極體(light emitting diode; LED)及色彩轉化元件,諸如磷光體或量子點(quantum dot; QD)。LED亦可在諸如照明器具之發光應用中與色彩轉化元件組合使用。例如,來自LED之藍光可經引導穿過色彩轉換介質,該色彩轉換介質可在藍光通過時將一些光轉換成綠光及/或紅光。藍光、綠光、及紅光之組合被人眼感知為白光。Liquid crystal displays (LCDs) are commonly used in various electronic devices, such as mobile phones, laptops, electronic tablets, televisions, and computer monitors. Conventional LCDs typically include a blue light emitting diode (LED) and a color conversion element, such as a phosphor or a quantum dot (QD). LEDs can also be used in combination with color conversion elements in lighting applications such as lighting fixtures. For example, blue light from an LED can be directed through a color conversion medium that can convert some light into green and / or red light when blue light passes. The combination of blue, green, and red light is perceived by the human eye as white light.

諸如磷光體及QD之色彩轉換元件在轉換光中並非100%量子有效的,且一些光能可作為熱而由色彩轉換元件吸收。另外,色彩轉換過程本身可產生熱,例如,歸因於當較短波長轉換至較長波長時之斯托克斯位移。在一些情況下,至多20-40%之吸收光係轉換成熱。因為過量熱可令色彩轉換元件降級,所以建立足夠的冷卻或散熱路徑來耗散所產生的熱並維持色彩轉換元件處於所欲操作溫度內係重要的。雖然磷光體材料可能能夠在中等溫度(例如,至多約300℃)下操作,但QD材料為高度溫度敏感的且可在大於約100℃之溫度下經歷降解。Color conversion elements such as phosphors and QDs are not 100% quantum efficient in converting light, and some light energy can be absorbed by the color conversion element as heat. In addition, the color conversion process itself can generate heat, for example, due to the Stokes shift when a shorter wavelength is converted to a longer wavelength. In some cases, up to 20-40% of the absorbed light is converted into heat. Because excessive heat can degrade the color conversion element, it is important to establish sufficient cooling or heat dissipation paths to dissipate the heat generated and maintain the color conversion element at the desired operating temperature. Although the phosphor material may be capable of operating at moderate temperatures (e.g., up to about 300 ° C), QD materials are highly temperature sensitive and can undergo degradation at temperatures greater than about 100 ° C.

歸因於QD之溫度敏感性,傳統背光單元(backlight unit; BLU)大體上經配置以避免QD與LED之間的緊密近接度及/或直接接觸。此種配置可稱為「遠距」配置。例如,如第1圖之LCD總成所示,QD常常以玻璃或聚合物管、毛細管、片材、或薄膜之形式來供應,例如,QD增強薄膜(QD enhancement film; QDEF) 1,其可置放於佈置在印刷電路板(printed circuit board; PCB) 3上之LED 2的陣列上方(但不與之直接實體接觸)。自LED 2發射之光4可因此在其進行至液晶(liquid crystal; LC)面板5時通過QD。BLU 6可進一步包含附接至PCB之散熱件7,其可耗散藉由LED 2產生的熱。Due to the temperature sensitivity of the QD, traditional backlight units (BLU) are generally configured to avoid the close proximity and / or direct contact between the QD and the LED. This configuration can be referred to as a "remote" configuration. For example, as shown in the LCD assembly in Figure 1, QDs are often supplied in the form of glass or polymer tubes, capillaries, sheets, or films, such as QD enhancement film (QDEF) 1, which can be It is placed above the array of LEDs 2 (but not in direct physical contact) arranged on a printed circuit board (PCB) 3. The light 4 emitted from the LED 2 can thus pass through the QD as it proceeds to the liquid crystal (LC) panel 5. The BLU 6 may further include a heat sink 7 attached to the PCB, which may dissipate heat generated by the LED 2.

然而,此等總成可能不提供足夠的冷卻,因為來自QD之熱係主要藉由通過LED與QDEF之間的間隙的自由或強制對流空氣力8來耗散。QDEF本身係相對較差的熱導體且並不受益於與散熱件7之直接熱接觸。因而,LCD總成可在較低光強度及/或功率下操作以便保護QD免於熱降解,該熱降解可不合需要地導致顯示或發光亮度之總體降低。另外,此等總成可導致顯著的材料浪費,因為QD係均勻分散在整體LED陣列上,而非僅離散地定位在陣列中每一個別LED上方。However, these assemblies may not provide sufficient cooling because the heat from the QD is mainly dissipated by free or forced convection air force 8 through the gap between the LED and QDEF. QDEF itself is a relatively poor thermal conductor and does not benefit from direct thermal contact with the heat sink 7. Thus, the LCD assembly may be operated at a lower light intensity and / or power in order to protect the QD from thermal degradation, which may undesirably cause an overall reduction in display or luminous brightness. In addition, these assemblies can lead to significant material waste, as the QDs are evenly distributed across the overall LED array, rather than just discretely positioned above each individual LED in the array.

因此,有利的是,提供包含經圖案化之色彩轉換介質的裝置,該經圖案化之色彩轉換介質可減少材料浪費,進而降低此等裝置之成本。亦將為有利的是提供包括散熱路徑或其他冷卻機構的裝置,該等散熱路徑或其他冷卻機構可耗散藉由色彩轉換介質產生的熱。Therefore, it would be advantageous to provide a device that includes a patterned color conversion medium that can reduce material waste and thereby reduce the cost of such devices. It would also be advantageous to provide a device that includes a heat dissipation path or other cooling mechanism that can dissipate heat generated by the color conversion medium.

在各種實施例中,本揭示內容係關於光學總成,其包含發光裝置,其安置於基板之第一表面上;環結構,其包含安置於該基板之該第一表面上的色彩轉換介質;及透明透鏡,其以與該發光裝置及該環結構上覆配準之方式定位,其中該色彩轉換介質與該發光裝置間隔分開且至少部分地外接該發光裝置。本文亦揭示包含此等總成或總成陣列之顯示、發光及電子裝置。In various embodiments, the present disclosure relates to an optical assembly including a light emitting device disposed on a first surface of a substrate; and a ring structure including a color conversion medium disposed on the first surface of the substrate; And a transparent lens, which is positioned in a manner of registering with the light emitting device and the ring structure, wherein the color conversion medium is spaced apart from the light emitting device and at least partially externally connects the light emitting device. This article also discloses display, light emitting, and electronic devices including such assemblies or arrays of assemblies.

本揭示內容另外係關於色彩轉換總成,其包含子總成,其包含共同密封來形成包含色彩轉換介質之至少一個空腔的第一基板及第二基板;及透明透鏡,其以與該子總成上覆配準之方式定位,其中該至少一個空腔包含連續環狀空腔或複數個以不連續環狀圖案佈置的空腔,且其中該透明透鏡包含凸狀表面,且該凸狀表面之至少一部分包含等角螺線曲率。本文進一步揭示包含色彩轉換總成及至少一個發光裝置之光學總成,以及包含此等總成之顯示、發光、及電子裝置。The present disclosure also relates to a color conversion assembly including a sub-assembly that includes a first substrate and a second substrate that are collectively sealed to form at least one cavity including a color conversion medium; and a transparent lens, which The assembly is positioned by overlying registration, wherein the at least one cavity includes a continuous annular cavity or a plurality of cavities arranged in a discontinuous annular pattern, and wherein the transparent lens includes a convex surface, and the convex shape At least a portion of the surface includes an equilateral spiral curvature. This article further discloses an optical assembly including a color conversion assembly and at least one light emitting device, and a display, light emitting, and electronic device including such an assembly.

本文亦揭示色彩轉換總成,其包含透明基板及反射基板,其共同密封來形成包含色彩轉換介質之至少一個空腔,其中該至少一個空腔包含連續環狀空腔或複數個以不連續環狀圖案佈置的空腔。本文另外揭示包含色彩轉換總成及至少一個發光裝置及/或透明透鏡之光學總成,以及包含此等總成之顯示、發光、及電子裝置。This article also discloses a color conversion assembly that includes a transparent substrate and a reflective substrate that are sealed together to form at least one cavity containing a color conversion medium, wherein the at least one cavity includes a continuous annular cavity or a plurality of discontinuous rings Cavities arranged like patterns. This document additionally discloses an optical assembly including a color conversion assembly and at least one light emitting device and / or a transparent lens, and a display, light emitting, and electronic device including such an assembly.

本文進一步揭示光轉換裝置,其包含透明基板,其具有第一表面及相對發光表面;色彩轉換介質,其安置於該第一表面上;及反射層,其安置於該第一表面上且封裝該色彩轉換介質之至少一部分。本文亦揭示包含光學地耦合至發光裝置之該光轉換裝置的光導總成。本文更進一步揭示用於製造色彩轉換總成之方法,該等方法包含在透明基板之第一表面上圖案化色彩轉換介質,及在該第一表面上沉積保護層以封裝該色彩轉換介質之至少一部分,其中該基板或該保護層之一包含反射材料。This document further discloses a light conversion device including a transparent substrate having a first surface and a relatively light emitting surface; a color conversion medium disposed on the first surface; and a reflective layer disposed on the first surface and encapsulating the At least a portion of a color conversion medium. A light guide assembly including the light conversion device optically coupled to the light emitting device is also disclosed herein. This article further discloses methods for manufacturing a color conversion assembly. The methods include patterning a color conversion medium on a first surface of a transparent substrate, and depositing a protective layer on the first surface to encapsulate at least the color conversion medium. A portion, wherein one of the substrate or the protective layer comprises a reflective material.

本揭示內容之另外特徵及優點將在以下的詳細描述中闡述,且在部分程度上,熟習此項技術者將根據該描述而容易明白該等特徵及優點,或藉由實踐如本文(包括隨後的實施方式、發明申請專利範圍以及隨附圖式)所述的方法來認識該等特徵及優點。Additional features and advantages of this disclosure will be described in the following detailed description, and to a certain extent, those skilled in the art will readily understand these features and advantages based on the description, or by practicing such as this article (including the following) Embodiments, the scope of invention patent applications, and the methods described in the accompanying drawings) to recognize these features and advantages.

應理解,前述的一般描述及以下詳細描述提出本揭示內容之各種實施例,且意欲提供用於理解發明申請專利範圍之性質及特徵的概述及框架。隨附圖式係納入來提供對本揭示內容的進一步理解,且併入本說明書中並構成本說明書之一部分。圖式例示本揭示內容之各種實施例,且連同說明書一起用以解釋本揭示內容之原理及操作。It should be understood that the foregoing general description and the following detailed description present various embodiments of the disclosure, and are intended to provide an overview and framework for understanding the nature and features of the scope of an invention patent. The accompanying drawings are incorporated to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate various embodiments of the disclosure, and together with the description serve to explain the principles and operations of the disclosure.

現在將參考第2-16圖論述本揭示內容之各種實施例,該等圖式例示透鏡、發光裝置、光轉換裝置、及包含此等裝置之光學總成之示範性實施例。本文亦揭示包含此等裝置及總成之顯示及發光裝置。以下一般描述意欲提供所主張裝置之概述,且各種態樣將在本揭示內容全文中參考非限制描繪的實施例來更明確地論述,此等實施例在本揭示內容之上下文內可彼此互換。 透鏡Various embodiments of the present disclosure will now be discussed with reference to FIGS. 2-16, which illustrate exemplary embodiments of lenses, light emitting devices, light conversion devices, and optical assemblies including such devices. A display and light emitting device including such devices and assemblies is also disclosed herein. The following general description is intended to provide an overview of the claimed device, and various aspects will be discussed more clearly throughout this disclosure with reference to non-limitingly depicted embodiments, which are interchangeable within the context of this disclosure. lens

本文揭示的為透鏡,包含接觸表面、凸狀表面、及安置在其之間的中心區域,其中該凸狀表面包含延伸至中心區域中的負旋轉三稜鏡凹陷。負旋轉三稜鏡凹陷可例如包含中空圓錐區域,其具有範圍在約15°至約40°之圓錐半角。本文亦揭示的為透鏡,包含接觸表面、凸狀表面、及安置在其之間的中心區域,其中該凸狀表面之至少一部分包含等角螺線曲率。在某些實施例中,透鏡可為線性或旋轉對稱的。可構造出透鏡的適合材料包括光學透明材料,諸如玻璃及塑膠。Disclosed herein is a lens including a contact surface, a convex surface, and a central region disposed therebetween, wherein the convex surface includes a negatively rotating triplex depression that extends into the central region. The negative-rotation triple concavity depression may, for example, include a hollow conical region having a cone half-angle ranging from about 15 ° to about 40 °. Also disclosed herein is a lens including a contact surface, a convex surface, and a central region disposed therebetween, wherein at least a portion of the convex surface includes an equilateral spiral curvature. In some embodiments, the lens may be linear or rotationally symmetric. Suitable materials from which lenses can be constructed include optically transparent materials such as glass and plastic.

第2A圖例示根據本揭示內容之實施例的示範性透鏡100之橫截面圖。透鏡100可包含接觸表面101、凸狀表面102、及安置在其之間的中心區域103。凸狀表面102可包含負旋轉三稜鏡凹陷104,其例如處於凸狀表面之頂點處或附近,且此凹陷104可延伸至中心區域103中。在一些實施例中,負旋轉三稜鏡凹陷104可具有頂點107,其指向接觸表面101。在下文更詳細論述的其他實施例中,凸狀表面102可經截斷以使得其不完全地延伸以符合接觸表面101。在此等實施例中,經截斷表面105 (視需要經反射層塗佈)可連接接觸表面101及凸狀表面102。此外,在非限制實施例中,接觸表面101可包含一或多個凹部或切口106,其可視需要提供來容納光學總成中之光源,亦在下文更詳細地論述。FIG. 2A illustrates a cross-sectional view of an exemplary lens 100 according to an embodiment of the present disclosure. The lens 100 may include a contact surface 101, a convex surface 102, and a center region 103 disposed therebetween. The convex surface 102 may include a negative-rotation triple-thickness depression 104, for example, at or near the vertex of the convex surface, and this depression 104 may extend into the central region 103. In some embodiments, the negative-rotation triple-thickness depression 104 may have a vertex 107 that points to the contact surface 101. In other embodiments discussed in more detail below, the convex surface 102 may be truncated such that it does not extend completely to conform to the contact surface 101. In these embodiments, the contact surface 101 and the convex surface 102 can be connected through the truncated surface 105 (coated with a reflective layer if necessary). In addition, in a non-limiting embodiment, the contact surface 101 may include one or more recesses or cutouts 106, which may be provided to accommodate light sources in the optical assembly as needed, which is also discussed in more detail below.

如本文所使用的,術語「凸狀」意欲表示界定透鏡之表面形狀,其在透鏡之外緣處比在透鏡之中心處更薄,例如,當接觸表面為平坦時的情況。在一些實施例中,凸狀第二表面可設想為自透鏡之平坦第一表面之中心線向外彎曲或向外延伸的表面,例如,半球形或半橢圓形狀。透鏡之凸狀表面可設想為圓形頂,其尺寸不必為理想圓形、半球形、或半橢圓形。As used herein, the term "convex" is intended to mean a surface shape that defines a lens, which is thinner at the outer edge of the lens than at the center of the lens, for example, when the contact surface is flat. In some embodiments, the convex second surface may be conceived as a surface that is curved or extended outward from the centerline of the flat first surface of the lens, such as a hemispherical or semi-ellipsoidal shape. The convex surface of the lens can be conceived as a round top, and its size need not be ideally round, hemispherical, or semi-elliptical.

如第2B圖中所描繪,「凸狀」表面可圍繞透鏡100之垂直中心線108旋轉對稱。例如,如所例示的,凸狀表面102可包含旋轉對稱半球,例如,如在典型透鏡中的情況。然而,藉由圍繞中心線使1D輪廓函數回轉而產生的諸如橢圓、拋物線、或2D表面之其他形狀亦為可能的且意欲落入本揭示內容之範疇內。1D輪廓函數可藉由平滑曲線(spline)產生及/或斜率方面可不為連續的。圍繞透鏡之中心線旋轉對稱的凸狀表面亦可藉由標準非球面下垂方程式或富比士多項式非球面下垂方程式來描述。此等方程式描述的表面之下垂係離與中心線成法向的平面於與彼法線之表面交點處的法向距離。凸狀表面之下垂在量值上隨離中心線之距離而大量地增加,且具有使得透鏡在透鏡之邊緣比透鏡之中心更薄的符號。在一些徑向區中,透鏡可隨著離透鏡之徑向距離而變得更厚,但在邊緣處較大程度上為較薄的。As depicted in Figure 2B, the "convex" surface may be rotationally symmetric about the vertical centerline 108 of the lens 100. For example, as illustrated, the convex surface 102 may include a rotationally symmetric hemisphere, for example, as is the case in a typical lens. However, other shapes such as ellipses, parabolas, or 2D surfaces created by turning a 1D contour function around a centerline are also possible and are intended to fall within the scope of this disclosure. The 1D contour function may be generated by a smooth curve and / or may not be continuous in terms of slope. Convex surfaces that are rotationally symmetric about the center line of the lens can also be described by the standard aspheric sag equation or the Forbes polynomial aspheric sag equation. The surface pendant system described by these equations is the normal distance from the plane that is normal to the centerline at the point of intersection with the surface of that normal. The magnitude of the droop of the convex surface increases greatly with the distance from the centerline, and has the symbol that makes the lens thinner at the edge of the lens than at the center of the lens. In some radial regions, the lens can become thicker with the radial distance from the lens, but to a greater extent thinner at the edges.

應理解,術語「凸狀」不限於圍繞垂直中心線旋轉對稱的表面。可能的是,不對稱表面形狀將有益於提供不同的照明輪廓。描述此形狀之方程式可不為標準下垂方程式,但可描述用於光學製造領域的自由形式表面形狀。亦應理解,術語「凸狀」不限於連續的的表面。表面亦可為複合表面,該複合表面的不同空間區域之下垂係藉由不同方程式定義。It should be understood that the term "convex" is not limited to a surface that is rotationally symmetric about a vertical centerline. It is possible that asymmetric surface shapes will be beneficial in providing different lighting profiles. The equation describing this shape may not be a standard droop equation, but may describe a free-form surface shape used in the field of optical manufacturing. It should also be understood that the term "convex" is not limited to a continuous surface. The surface may also be a composite surface, and the droop of different spatial regions of the composite surface is defined by different equations.

第2C圖提供第2A圖中之區域C之詳圖,該區域C包括負旋轉三稜鏡凹陷104。如本文所使用的,術語「負旋轉三稜鏡凹陷」意欲表示能夠發散準直光之中空圓錐區域,其可設想為進入透鏡之凸狀表面中的實質上呈圓錐體之形狀的凹痕或凹陷。根據各種實施例,圓錐體之垂直中心線109可在空間上定向來與凸狀表面之垂直中心線(參見第2B圖中之108)對準或實質上對準或平行或實質上平行。術語「負」用於指示:圓錐表面形成將入射於圓錐體上之準直光發散的透鏡形狀,此與將該光會聚來形成空間中之軸線焦點的正旋轉三稜鏡透鏡相對。正因為光學系統中之球形表面可設計成形狀稍微為非球面的以便改良效能,所以圓錐體之形狀亦可偏離完美圓錐體以改良效能及/或簡化製造。FIG. 2C provides a detailed view of the area C in FIG. 2A, which includes the negatively rotating triple-concave depression 104. As used herein, the term "negatively rotating triple-concave depression" is intended to mean a hollow conical region capable of diverging collimated light, which can be envisaged as a substantially conical indentation or into a convex surface of a lens Sunken. According to various embodiments, the vertical centerline 109 of the cone may be spatially oriented to align or be substantially aligned or parallel or substantially parallel with the vertical centerline of the convex surface (see 108 in Figure 2B). The term "negative" is used to indicate that the conical surface forms a lens shape that diverges collimated light incident on the cone, as opposed to a positively rotating triplex lens that converges the light to form the focal point of the axis in space. Because the spherical surface in the optical system can be designed to be slightly aspherical in shape to improve performance, the shape of the cone can also deviate from a perfect cone to improve performance and / or simplify manufacturing.

例如,在某些情況中,可難以製造具有理想尖端點或頂點107之負旋轉三稜鏡凹陷。因此,在一些實施例中,凹陷104可具有頂點107,該頂點具有鈍的或圓形曲率,例如,如第2C圖中所描繪。因此,替代具有藉由單點定義的「寬度」(如在完美圓錐體之狀況),圓形頂點107可具有大於0的寬度w。然而,應注意,鈍的或圓形頂點107可允許一些光以淺角通過,例如,從而導致在該區域中之不合需要的漏光。雖然頂點107可經機器加工或模製以增加其尖銳度,但在一些實施例中,亦可能改變負旋轉三稜鏡凹陷之一或多個表面來抵消此效應。例如,反射薄膜(未例示)可沉積在圓錐體之圓形頂點之至少一部分上以使得光向後反射,且可能橫越不同路徑並反射以使得其在不同點逸出透鏡。圓形頂點107之至少一部分亦可藉由塗層或固體物件阻斷,該等固體物件諸如附著或受力進入圓錐體之頂點中的小球或球體。For example, in some cases, it can be difficult to make a negatively rotating triplex depression with an ideal tip point or apex 107. Thus, in some embodiments, the depression 104 may have an apex 107 having a blunt or circular curvature, for example, as depicted in Figure 2C. Therefore, instead of having a "width" defined by a single point (as in the case of a perfect cone), the circular vertex 107 may have a width w greater than 0. It should be noted, however, that blunt or rounded apex 107 may allow some light to pass at shallow angles, for example, resulting in unwanted light leakage in the area. Although the apex 107 can be machined or molded to increase its sharpness, in some embodiments, it is also possible to change one or more of the surfaces of the negatively-rotated triplex depression to offset this effect. For example, a reflective film (not illustrated) may be deposited on at least a portion of the circular apex of the cone so that light is reflected backwards, and possibly across different paths and reflected so that it escapes the lens at different points. At least a portion of the circular apex 107 may also be blocked by a coating or solid objects, such as small balls or spheres that attach or are forced into the apex of the cone.

根據各種實施例,負旋轉三稜鏡凹陷104可具有圓錐半角β,其範圍為約15°至約40°,諸如約20°至約35°、或約25°至約30°,包括其之間的所有範圍及子範圍。如本文所使用的,術語「圓錐半角」及其變化形式意欲表示藉由圓錐體之垂直中心線109與橫斷圓錐體之最外點及圓錐體之垂直中心線的線110形成的角度。如上文所指出,凹陷104不必為理想圓錐形,且側面可不為理想線性的。例如,如第2C圖所示,圓錐體之側面可向內朝向圓錐體之垂直中心線彎曲,或在其他實施例中,可向外弧彎(未例示)。According to various embodiments, the negative-rotation triple concavity depression 104 may have a conical half-angle β, ranging from about 15 ° to about 40 °, such as about 20 ° to about 35 °, or about 25 ° to about 30 °, inclusive thereof. All ranges and subranges. As used herein, the term "cone half-angle" and variations thereof are intended to mean the angle formed by the vertical centerline 109 of the cone and the line 110 that traverses the outermost point of the cone and the vertical centerline of the cone. As noted above, the depression 104 need not be ideally conical, and the sides may not be ideally linear. For example, as shown in FIG. 2C, the sides of the cone may be curved inwardly toward the vertical centerline of the cone, or in other embodiments, may be curved outward (not illustrated).

應注意,雖然透鏡100在第2A-C圖中係描繪為平凸形,例如,具有實質上平面的接觸表面101,但亦可能用於為非平面的第一表面。在一些情況中,稍微凸狀的接觸表面(例如,具有大於約100 mm之曲率半徑)可提供改良的光學性質,諸如「向後」(例如,遠離使用者)方向上的減小折射。然而,對實用目的而言,諸如對構造簡易性而言,平凸透鏡可更容易實行於光學總成中。在一些實施例中,接觸表面可為平面的或實質上平面的。此外,雖然第2B圖例示具有圍繞透鏡之垂直中心線108旋轉對稱的球形的接觸表面101,但應理解接觸表面101可圍繞透鏡之垂直中心線旋轉不對稱,可為非球面的,及/或可具有自由形式之形狀。如先前所指出的,接觸表面101可具備一或多個凹部或切口106,其意欲容納諸如光源、色彩轉換介質、電路等之光學組件。It should be noted that although the lens 100 is depicted as a plano-convex shape in FIGS. 2A-C, for example, having a substantially planar contact surface 101, it may also be used for a first surface that is non-planar. In some cases, a slightly convex contact surface (eg, having a radius of curvature greater than about 100 mm) may provide improved optical properties, such as reduced refraction in a "backward" (eg, away from the user) direction. However, for practical purposes, such as for ease of construction, plano-convex lenses can be more easily implemented in optical assemblies. In some embodiments, the contact surface may be planar or substantially planar. In addition, although FIG. 2B illustrates a spherical contact surface 101 having a rotational symmetry about the vertical centerline 108 of the lens, it should be understood that the contact surface 101 may be rotationally asymmetric about the vertical centerline of the lens, may be aspheric, and / or Can have a free-form shape. As previously noted, the contact surface 101 may be provided with one or more recesses or cutouts 106 that are intended to accommodate optical components such as light sources, color conversion media, circuits, and the like.

透鏡100之總高度(或厚度)及/或直徑可例如取決於意欲使用該透鏡的光學總成之尺寸。例如,透鏡之直徑可經選擇以比其可光學耦合的光源之尺寸(例如,直徑、長度、及/或寬度)更大。僅出於說明性目的,在非限制性實施例中,總透鏡高度(或厚度)可在以下範圍:約0.1 mm至約20 mm、約0.2 mm至約15 mm、約0.5至約10 mm、約1 mm至約8 mm、約2 mm至約7 mm、約3 mm至約6 mm、或約4 mm至約5 mm,包括其之間的所有範圍及子範圍。類似地,透鏡之直徑可例如在以下範圍:約1 mm至約100 mm、約5 mm至約90 mm、約10 mm至約80 mm、約20 mm至約70 mm、約30 mm至約60 mm、或約40 mm至約50 mm,包括其之間的所有範圍及子範圍。The overall height (or thickness) and / or diameter of the lens 100 may, for example, depend on the size of the optical assembly in which the lens is intended to be used. For example, the diameter of the lens may be selected to be larger than the size (e.g., diameter, length, and / or width) of the light source to which it may be optically coupled. For illustrative purposes only, in non-limiting embodiments, the total lens height (or thickness) may be in the following ranges: about 0.1 mm to about 20 mm, about 0.2 mm to about 15 mm, about 0.5 to about 10 mm, About 1 mm to about 8 mm, about 2 mm to about 7 mm, about 3 mm to about 6 mm, or about 4 mm to about 5 mm, including all ranges and subranges therebetween. Similarly, the diameter of the lens may be, for example, in the following ranges: about 1 mm to about 100 mm, about 5 mm to about 90 mm, about 10 mm to about 80 mm, about 20 mm to about 70 mm, about 30 mm to about 60 mm, or about 40 mm to about 50 mm, including all ranges and subranges therebetween.

透鏡之大小及/或形狀亦可取決於藉由光學地耦合至透鏡之光源所發射的光的所欲光學路徑。例如,參考第3A圖,凸透鏡表面102之曲率可經設計以使得自光學地耦合至透鏡的光源(例如,LED) 111發射的光110以大於臨界角之角度擊打凸狀表面102,且歸因於全內反射(total internal reflection; TIR)而變得「俘獲」於透鏡內。如本文所使用的,術語「光學地耦合」意欲表示光源相對於透鏡定位以使得將光引入或注入透鏡中。光源可光學地耦合至諸如透鏡、光導板(light guide plate; LGP)、或其他基板之組件,即使未與組件實體接觸亦可。The size and / or shape of the lens may also depend on the desired optical path of light emitted by a light source optically coupled to the lens. For example, referring to FIG. 3A, the curvature of the convex lens surface 102 may be designed so that light 110 emitted from a light source (eg, LED) 111 optically coupled to the lens strikes the convex surface 102 at an angle greater than a critical angle, and returns It becomes "captured" in the lens due to total internal reflection (TIR). As used herein, the term "optically coupled" is intended to mean that the light source is positioned relative to the lens such that light is introduced into or injected into the lens. The light source may be optically coupled to a component such as a lens, light guide plate (LGP), or other substrate, even if it is not in physical contact with the component.

全內反射(total internal reflection; TIR)係在包含第一折射率之第一材料(例如,玻璃、塑膠等)中傳播的光可藉以在與包含低於第一折射率之第二折射率的第二材料(例如,空氣等)之界面處全反射的現象。TIR可使用司乃耳定律來解釋:

Figure TW201802552AD00001
其描述在具有不同折射率之兩種材料之間的界面處的光折射。根據司乃耳定律,n1 為第一材料之折射率,n2 為第二材料之折射率,θi 為在界面處相對於界面法線的入射光之角度(入射角),且θr 為折射光相對於法線之折射角。當折射角(θr )為90°時,例如,sin(θr )= 1,司乃耳定律可表示為:
Figure TW201802552AD00002
在此等條件下的入射角θi 亦可稱為臨界角θc 。具有大於臨界角之入射角(θi >θc )之光將在第一材料內全內反射,而具有等於或小於臨界角之入射角(θi ≤θc )之光將藉由第一材料透射。Total internal reflection (TIR) means that light propagating in a first material (e.g., glass, plastic, etc.) containing a first refractive index can be used to compare the The phenomenon of total reflection at the interface of the second material (for example, air, etc.). TIR can be explained using Snell's law:
Figure TW201802552AD00001
It describes the refraction of light at the interface between two materials with different refractive indices. According to Snell's law, n 1 is the refractive index of the first material, n 2 is the refractive index of the second material, θ i is the angle (incident angle) of the incident light at the interface with respect to the interface normal, and θ r Is the refraction angle of the refracted light relative to the normal. When the refraction angle (θ r ) is 90 °, for example, sin (θ r ) = 1, Snell's law can be expressed as:
Figure TW201802552AD00002
The incidence angle θ i under these conditions can also be referred to as the critical angle θ c . Light having an incident angle (θ i > θ c ) greater than the critical angle will be totally internally reflected in the first material, and light having an incident angle (θ i ≤ θ c ) equal to or less than the critical angle will pass through the first Material transmission.

在空氣(n1 = 1)與玻璃(n2 = 1.5)之間的示範性界面的狀況下,臨界角(θc )可計算為41°。因此,若在玻璃中傳播的光以大於41°之入射角擊打空氣-玻璃界面,則所有入射光將自界面以等於入射角之角度反射。若反射光遇到包含與第一界面相同折射率關係之第二界面,則入射於第二界面上之光將再次以等於入射角之反射角反射。In the case of an exemplary interface between air ( n 1 = 1) and glass ( n 2 = 1.5), the critical angle ( θ c ) can be calculated as 41 °. Therefore, if the light propagating through the glass hits the air-glass interface at an incident angle greater than 41 °, all incident light will be reflected from the interface at an angle equal to the incident angle. If the reflected light encounters a second interface containing the same refractive index relationship as the first interface, the light incident on the second interface will be reflected again at a reflection angle equal to the incident angle.

因此,本文揭示的透鏡可經配置以「俘獲」光,例如以使得藉由光源注入透鏡中的光可在透鏡內重複地傳播,沿凸狀表面102反射或替代地在接觸表面101與凸狀表面102之間反射,除非或直至向界面條件之改變。在一些實施例中,參考第3A圖,凸狀表面102之曲率可經工程設計以使得自光源111發射的實質上所有光110不管光源本身上之原點如何皆會以入射角θi 擊打凸狀表面,其中θi >θc 。例如,自光源111之上拐角(第3A圖中所例示的右上拐角113)發射的光110,可具有相對於透鏡之凸狀表面102最小的入射角,且因此,透鏡可經配置以使得甚至自光源111上之此位置發射的光具有大於臨界角θc 之入射角θiTherefore, the lenses disclosed herein can be configured to "capture" light, for example, so that light injected into the lens by a light source can repeatedly propagate within the lens, reflect along the convex surface 102, or alternatively, contact surface 101 and convex Reflections between surfaces 102 unless or until changes in interface conditions are made. In some embodiments, with reference to FIG. 3A, the curvature of the convex surface 102 may be designed to project from the light source 111 such that substantially all light emitted 110 regardless of the origin of the light source itself will all how the striking angle of incidence θ i Convex surface, where θ i > θ c . For example, light 110 emitted from a corner above the light source 111 (the upper right corner 113 illustrated in FIG. 3A) may have the smallest angle of incidence relative to the convex surface 102 of the lens, and therefore, the lens may be configured such that even The light emitted from this position on the light source 111 has an incident angle θ i greater than the critical angle θ c .

參考第3A圖,色彩轉換介質112可圍繞光源111之周邊分佈以提供改變界面條件之區域,例如以使得入射到色彩轉換介質112上之反射光向前以小於臨界角θc 之角度散射。因而,TIR可在其中分佈有色彩轉換介質112之區域中遭「打斷」或中斷,以使得光110可作為透射光110'逸出透鏡。此種配置亦可具有提供用於色彩轉換介質本身(例如,經由色彩轉換介質下方之PCB (未展示))之散熱路徑之附加益處,以使得使用所揭示配置之光學總成可在高溫下操作。此外,因為來自光源111之光110在空間上反射及/或向外傳播,之後才通過色彩轉換介質112,所以色彩轉換介質可暴露於減少的光通量密度,例如,意指光學總成可在相較於先前技術配置更高的光強度下操作。此等及其他潛在益處在下文參考所揭示的光學總成來更詳細地論述。Referring to FIG. 3A, the color conversion medium 112 may be distributed around the periphery of the light source 111 to provide an area for changing interface conditions, for example, so that the reflected light incident on the color conversion medium 112 is scattered forward at an angle smaller than the critical angle θ c . Thus, the TIR can be "interrupted" or interrupted in the area where the color conversion medium 112 is distributed, so that the light 110 can escape the lens as transmitted light 110 '. This configuration may also have the added benefit of providing a heat dissipation path for the color conversion medium itself (e.g., via a PCB (not shown) underneath the color conversion medium) so that the optical assembly using the disclosed configuration can operate at high temperatures . In addition, because the light 110 from the light source 111 is spatially reflected and / or propagates outward before passing through the color conversion medium 112, the color conversion medium may be exposed to a reduced luminous flux density, for example, meaning that the optical assembly may Operates at higher light intensities than prior art configurations. These and other potential benefits are discussed in more detail below with reference to the disclosed optical assemblies.

應注意,第3A圖中僅例示凸透鏡表面曲率之右半部(以及LED 111及色彩轉換介質112相應半部)。曲線圍繞透鏡之垂直中心線108 (在此狀況下亦為對稱軸)之旋轉將產生具有第3B圖中所例示的拓撲的凸透鏡表面102。此外,如第2圖中所例示,第3A圖中之凸狀表面102經截斷以使得其未完全地延伸來符合接觸表面101。在某些實施例中,截斷表面(未標記)可利用反射層114塗佈以防止光自此區域逸出。It should be noted that FIG. 3A illustrates only the right half of the surface curvature of the convex lens (and the corresponding half of the LED 111 and the color conversion medium 112). Rotation of the curve around the lens's vertical centerline 108 (also the axis of symmetry in this case) will produce a convex lens surface 102 having the topology illustrated in Figure 3B. In addition, as illustrated in FIG. 2, the convex surface 102 in FIG. 3A is truncated so that it does not extend completely to conform to the contact surface 101. In some embodiments, the truncated surface (unlabeled) may be coated with a reflective layer 114 to prevent light from escaping from this area.

根據非限制性實施例,透鏡可經配置以使得自光源發射的實質上所有光以恆定入射角θi 擊打凸狀表面102,其中θi =k >θc 。再次參考第3A圖,凸狀表面102之恆定入射角曲線r(θ)可藉由利用定義為光源之右上拐角113 (如所示)或左上拐角(未展示)之原點來界定坐標系而構造。如第4圖中所描繪,曲線r(θ)之正切向量

Figure TW201802552AD00003
可使用方程式(1)來繪製:
Figure TW201802552AD00004
(1) 其中
Figure TW201802552AD00005
為表示光線之方向的單位向量,且
Figure TW201802552AD00006
Figure TW201802552AD00007
與正交之單位向量。
Figure TW201802552AD00008
Figure TW201802552AD00009
之點積可藉由方程式(2)表示:
Figure TW201802552AD00010
(2) 其中α為在
Figure TW201802552AD00011
Figure TW201802552AD00012
之間形成的角度。因為入射角為α之補角,所以方程式(2)可重寫為以下方程式(3):
Figure TW201802552AD00013
(3) 方程式(3)可進一步簡化來提供極坐標中之微分方程式(4):
Figure TW201802552AD00014
(4) 方程式(4)之解由方程式(5)表示:
Figure TW201802552AD00015
(5) 其中r(0)為θ=0時曲線r(θ)之起始點或原點。According to a non-limiting embodiment, the lens may be configured such that substantially all light emitted from the light source strikes the convex surface 102 at a constant angle of incidence θ i , where θ i = k> θ c . Referring again to FIG. 3A, the constant incidence angle curve r (θ) of the convex surface 102 can be defined by using the origin defined as the upper right corner 113 (as shown) or upper left corner (not shown) of the light source to define the coordinate system structure. As depicted in Figure 4, the tangent vector of the curve r (θ)
Figure TW201802552AD00003
It can be plotted using equation (1):
Figure TW201802552AD00004
(1) of which
Figure TW201802552AD00005
Is a unit vector representing the direction of the ray, and
Figure TW201802552AD00006
for
Figure TW201802552AD00007
Orthogonal unit vector.
Figure TW201802552AD00008
and
Figure TW201802552AD00009
The dot product can be expressed by equation (2):
Figure TW201802552AD00010
(2) where α is in
Figure TW201802552AD00011
versus
Figure TW201802552AD00012
The angle formed between them. Because the angle of incidence is the complement of α, equation (2) can be rewritten as the following equation (3):
Figure TW201802552AD00013
(3) Equation (3) can be further simplified to provide differential equations (4) in polar coordinates:
Figure TW201802552AD00014
(4) The solution of equation (4) is expressed by equation (5):
Figure TW201802552AD00015
(5) where r (0) is the starting point or origin of curve r (θ) when θ = 0.

第5圖描繪用於凸透鏡表面102之示範性恆定入射角曲率,其中r(0) = 0.4 mm且θi = 42°。例示自光源111發射的光的角度θ之範圍(0 <θ<π),每一範圍與透鏡之凸狀表面產生入射角θi =42°。應注意,對角度θ>π,恆定入射角曲線將界定螺線,亦稱為對數螺線、等角螺線、或生長螺線。因而,具有恆定入射角曲率之凸狀表面102可包含具有等角螺線曲率之至少一個區域。在一些實施例中,凸狀表面之實質上全部可具有等角螺線曲率。在其他實施例中,凸狀表面之一部分可具有等角螺線曲率(例如,在具有截斷表面之透鏡的狀況中如此)。Figure 5 depicts an exemplary constant incidence angle curvature for convex lens surface 102, where r (0) = 0.4 mm and θ i = 42 °. Exemplifying the range of the angle θ of the light emitted from the light source 111 (0 <θ <π), each range generates an incident angle θ i = 42 ° with the convex surface of the lens. It should be noted that for an angle θ> π, the constant incidence angle curve will define a spiral, also known as a logarithmic spiral, an equiangular spiral, or a growth spiral. Thus, the convex surface 102 having a constant incidence angle curvature may include at least one region having an equiangular spiral curvature. In some embodiments, substantially all of the convex surface may have an equilateral spiral curvature. In other embodiments, a portion of the convex surface may have an equiangular helical curvature (for example, in the case of a lens with a truncated surface).

應進一步注意,光線趨向於沿透鏡之頂部行進,從而可緊鄰光源111留下間隙115。因而,自光學總成發出的光可感知為圍繞光源111形成周邊之光環,但一些光亦可在相應於負旋轉三稜鏡凹陷之中心區域中漏出,如上文所指出。透鏡頂點可在需要時經機器加工、模製或以其他方式改質(例如,利用反射層)來減少或消除此種漏光。It should be further noted that the light rays tend to travel along the top of the lens so that a gap 115 can be left next to the light source 111. Thus, the light emitted from the optical assembly can be perceived as a halo forming a periphery around the light source 111, but some light can also leak out in the central region corresponding to the negative-rotational triplex depression, as noted above. The lens apex can be machined, molded, or otherwise modified (e.g., using a reflective layer) to reduce or eliminate such light leakage when needed.

曲線r(θ)中針對(0 <θ <π)之峰值可表示為角度θpi +π/2。用於此峰值之笛卡兒坐標可由方程式(6a-b)表示:

Figure TW201802552AD00016
(6a)
Figure TW201802552AD00017
(7b) 凸狀表面至y軸右側的邊界或最大極限116出現在角度θi 處。因而,用於此最右點之笛卡兒坐標可由方程式(7a-b)表示:
Figure TW201802552AD00018
(7a)
Figure TW201802552AD00019
(7b) xr 之值可用於判定可光學地耦合至透鏡之光源之最大半徑。The peak value for (0 <θ <π) in the curve r (θ) can be expressed as an angle θ p = θ i + π / 2. The Cartesian coordinates for this peak can be expressed by equations (6a-b):
Figure TW201802552AD00016
(6a)
Figure TW201802552AD00017
(7b) The boundary or maximum limit 116 of the convex surface to the right of the y-axis appears at the angle θ i . Thus, the Cartesian coordinates for this rightmost point can be represented by equations (7a-b):
Figure TW201802552AD00018
(7a)
Figure TW201802552AD00019
(7b) The value of x r can be used to determine the maximum radius of a light source that can be optically coupled to the lens.

雖然第2-3圖例示經配置以與單一光源光學地耦合的旋轉對稱(例如,半球形)透鏡100,但應注意可使用其他配置,其中透鏡可耦合至多於一個光源。例如,如第6圖中所描繪,線性透鏡100’可具有接觸表面101’、凸狀表面102’,其類似於上文對對稱透鏡100所定義的彼等者。此外,在一些實施例中,線性透鏡100’之凸狀表面102’可經類似工程設計以具有恆定入射角曲率(等角螺線曲率)。此外,透鏡100’可具有如所例示的雙葉形雙葉形(A’-B’)或單葉形配置(A’或B’)。在一些實施例中,在光學總成之構造期間,單獨的葉部A’及B’可配接在一起以形成雙葉形配置。雙葉形(A’-B’)線性透鏡可佈置以與光源陣列111’之上覆配準方式來佈置,或每一單獨的葉部(A’、B’)可各自以與光源陣列111’之一個側面的上覆配準方式來定位。Although Figures 2-3 illustrate a rotationally symmetric (eg, hemispherical) lens 100 configured to be optically coupled with a single light source, it should be noted that other configurations may be used where the lens may be coupled to more than one light source. For example, as depicted in Figure 6, the linear lens 100 'may have a contact surface 101', a convex surface 102 ', similar to those defined above for the symmetric lens 100. Further, in some embodiments, the convex surface 102 'of the linear lens 100' may be similarly engineered to have a constant incidence angle curvature (equivalent spiral curvature). In addition, the lens 100 'may have a double-leaf shape (A'-B') or a single-leaf configuration (A 'or B') as illustrated. In some embodiments, during the construction of the optical assembly, the individual leaf portions A 'and B' may be mated together to form a double leaf configuration. A bilobal (A'-B ') linear lens can be arranged to be registered with the light source array 111', or each individual leaf (A ', B') can be individually aligned with the light source array 111 ' Overlay registration on one side.

第6圖中所描繪的線性透鏡100’可使用此項技術中所知的任何方法來形成,諸如擠出、模製、鑄製、或衝壓,僅舉幾例。類似的製造製程可用於產生旋轉對稱透鏡100或此種透鏡之陣列。此種示範性陣列係描繪於第7圖中,其中每一個別透鏡100可包含相應於伴隨LED陣列中之每一個別光源(未展示)的孔徑或凹部106。 光學總成The linear lens 100 'depicted in Figure 6 can be formed using any method known in the art, such as extrusion, molding, casting, or stamping, to name a few. Similar manufacturing processes can be used to produce the rotationally symmetric lens 100 or an array of such lenses. Such an exemplary array is depicted in Figure 7, where each individual lens 100 may include an aperture or recess 106 corresponding to each individual light source (not shown) in the accompanying LED array. Optical assembly

本文亦揭示的為光學總成,其包含如上文所述的至少一個透鏡與發光裝置及/或色彩轉換介質之至少一者的組合。透鏡可光學地耦合至至少一個光源,諸如LED。光學總成亦可包含透鏡及包含至少一個色彩轉換元件之色彩轉換介質,該色彩轉換元件諸如磷光體、量子點、及/或照明體,例如,螢光團及或發光聚合物。非限制示範性光學總成可包括背光單元(backlight unit; BLU)、光導板(light guide plate; LGP)、色彩轉換裝置、發光裝置、光轉換裝置、或照明器具,僅舉幾例。Also disclosed herein is an optical assembly comprising a combination of at least one lens as described above with at least one of a light emitting device and / or a color conversion medium. The lens may be optically coupled to at least one light source, such as an LED. The optical assembly may also include a lens and a color conversion medium including at least one color conversion element, such as a phosphor, a quantum dot, and / or a lighting body, such as a fluorophore and / or a luminescent polymer. The non-limiting exemplary optical assembly may include a backlight unit (BLU), a light guide plate (LPG), a color conversion device, a light emitting device, a light conversion device, or a lighting fixture, to name a few.

在各種實施例中,光學總成包含發光裝置,其安置於基板之第一表面上;環結構,其包含安置於該基板之該第一表面上的色彩轉換介質;及透明透鏡,其以與該發光裝置及該環結構上覆配準之方式定位,其中該色彩轉換介質與該發光裝置間隔分開且至少部分地外接該發光裝置。本文亦揭示的為此種總成之陣列。In various embodiments, the optical assembly includes a light emitting device that is disposed on the first surface of the substrate; a ring structure that includes a color conversion medium disposed on the first surface of the substrate; and a transparent lens that communicates with The light-emitting device and the ring structure are positioned in an overly-registered manner, wherein the color conversion medium is spaced apart from the light-emitting device and at least partially externally connects the light-emitting device. This article also reveals an array of such assemblies.

參考第8圖,描繪非限制示範性光學總成,其包含透鏡100、光源111、及色彩轉換介質112。總成可進一步包含環結構117,在一些實施例中,其可包含界定空腔120的第一基板118及第二基板119,在該空腔內含有色彩轉換介質112。環結構117可進一步界定凹部121,光源111可至少部分地定位於該凹部中。亦可提供印刷電路板(printed circuit board; PCB) 122,光源111可安裝至該印刷電路板。散熱件123亦可附接至PCB,其可包括一或多個熱通孔(未例示),以用於自光源及/或色彩轉換介質耗散熱。一或多個黏合層(未例示)可視需要存在於光學總成組件中兩個或兩個以上者之間。包括光線110及透射光線110’之示範性路徑以達說明性目的。Referring to FIG. 8, a non-limiting exemplary optical assembly is depicted, which includes a lens 100, a light source 111, and a color conversion medium 112. The assembly may further include a ring structure 117. In some embodiments, it may include a first substrate 118 and a second substrate 119 defining a cavity 120, and the color conversion medium 112 is contained in the cavity. The ring structure 117 may further define a recess 121 in which the light source 111 may be positioned at least partially. A printed circuit board (PCB) 122 may also be provided, and the light source 111 may be mounted on the printed circuit board. The heat sink 123 may also be attached to the PCB, which may include one or more thermal vias (not illustrated) for dissipating heat from the light source and / or the color conversion medium. One or more adhesive layers (not illustrated) may be present between two or more of the optical assembly components as required. Exemplary paths including light 110 and transmitted light 110 'are used for illustrative purposes.

透鏡100可包含如上文所述的接觸表面101及凸狀表面102。凸狀表面102可包括負旋轉三稜鏡凹陷104,其可具有指向接觸表面101之頂點107。根據各種實施例,透鏡100可以與光源111及/或色彩轉換介質112上覆配準之方式定位。在各種實施例中,透鏡100之頂點107可與光源111之垂直中心線對準。在其他實施例中,透鏡100之外周邊可與色彩轉換介質112之外周邊對準。接觸表面101可定位成與環結構117 (例如,第一基板118)實體接觸,及/或可經由黏合層(未例示)附著於環結構117。雖然未在第8圖中所例示,但接觸表面101可包括一或多個凹部或切口,光源111可至少部分地定位在該一或多個凹部或切口中(參見,例如,第2A-B圖及第10圖中之106)。The lens 100 may include the contact surface 101 and the convex surface 102 as described above. The convex surface 102 may include a negative-rotation triple-thickness depression 104, which may have an apex 107 directed toward the contact surface 101. According to various embodiments, the lens 100 may be positioned in an overly-registered manner with the light source 111 and / or the color conversion medium 112. In various embodiments, the apex 107 of the lens 100 may be aligned with the vertical centerline of the light source 111. In other embodiments, the outer periphery of the lens 100 may be aligned with the outer periphery of the color conversion medium 112. The contact surface 101 may be positioned in physical contact with the ring structure 117 (eg, the first substrate 118), and / or may be attached to the ring structure 117 via an adhesive layer (not illustrated). Although not illustrated in FIG. 8, the contact surface 101 may include one or more recesses or cutouts, and the light source 111 may be positioned at least partially in the one or more recesses or cutouts (see, for example, Sections 2A-B 106 and 106).

根據各種非限制性實施例,色彩轉換介質112可以圍繞光源111之環狀圖案佈置,例如以使得色彩轉換環至少部分地外接光源。雖然自僅例示光學總成之橫截面的第8圖可能未瞭解此種環形,但環狀色彩轉換介質之其他實例係例示在第9及13A-B圖中。然而,應指出,術語「環」不僅限於環狀圖案,但亦可包括橢圓形、正方形、矩形、及其他形狀。因而,「環」可界定圍繞光源111延伸的任何規則或不規則周邊。另外,「環」或周邊不必為連續的,如在單環狀之空腔的狀況。實情為,環可含有一或多個間隙,如在以環狀圖案佈置的多個空腔之間的空間之狀況。According to various non-limiting embodiments, the color conversion medium 112 may be arranged around a circular pattern of the light source 111, for example, so that the color conversion ring is at least partially external to the light source. Although such a ring may not be understood from FIG. 8 which illustrates only a cross section of the optical assembly, other examples of the ring-shaped color conversion medium are illustrated in FIGS. 9 and 13A-B. It should be noted, however, that the term "ring" is not limited to circular patterns, but may include ovals, squares, rectangles, and other shapes. Thus, a "ring" may define any regular or irregular perimeter that extends around the light source 111. In addition, the "ring" or periphery need not be continuous, as in the case of a single ring cavity. The truth is that the ring may contain one or more gaps, such as the condition of the space between multiple cavities arranged in a circular pattern.

根據其他實施例,色彩轉換介質112之環可與光源111間隔分開,例如,不與光源實體接觸。然而,在其他非限制性實施例中,環可至少部分地接觸光源,包括觸碰光源之側面或上覆於光源之頂部。在某些實施例中,將色彩轉換介質112間隔遠離光源111以減少在此等兩個組件之間的熱傳遞可為有利的。According to other embodiments, the ring of the color conversion medium 112 may be spaced apart from the light source 111, for example, not in physical contact with the light source. However, in other non-limiting embodiments, the ring may contact the light source at least partially, including touching the side of the light source or overlying the top of the light source. In some embodiments, it may be advantageous to space the color conversion medium 112 away from the light source 111 to reduce heat transfer between these two components.

在各種實施例中,色彩轉換介質可佈置在圍繞光源之周邊延伸的平面中。在一些實施例中,色彩轉換介質可處於與光源相同的水平面中。若色彩轉換介質佈置在與光源相同的水平面中且外接該光源,則光源可不直接發射光至色彩轉換介質之平面中。實情為,自光源直接發射的光可首先反射離開透明透鏡之凸狀表面,且可隨後重定向回光源之平面中,例如,色彩轉換介質之平面中。因而,在非限制性實施例中,色彩轉換介質未暴露於自光源直接發射的光線,但實情為,暴露於藉由透鏡重定向一或多次的反射光線。In various embodiments, the color conversion medium may be arranged in a plane extending around the periphery of the light source. In some embodiments, the color conversion medium may be in the same horizontal plane as the light source. If the color conversion medium is arranged in the same horizontal plane as the light source and is externally connected to the light source, the light source may not directly emit light into the plane of the color conversion medium. The truth is that the light emitted directly from the light source can first be reflected off the convex surface of the transparent lens and can then be redirected back into the plane of the light source, for example, in the plane of a color conversion medium. Thus, in a non-limiting embodiment, the color conversion medium is not exposed to light emitted directly from the light source, but in reality it is exposed to reflected light redirected one or more times by a lens.

色彩轉換介質之環可使用各種結構及其組合來產生。例如,如第8圖中所例示,可使用環結構117,其可包含第一基板118及第二基板119,其共同密封來形成含有色彩轉換介質112之至少一個空腔120。根據各種實施例,第一基板118可接觸透鏡100,且第二基板119可接觸PCB 122,直接或經由黏合層(或其他中間層)。在某些實施例中,空腔120可為環狀空腔,例如,圍繞光源111之周邊連續地延伸。替代地,空腔120可包含以環狀圖案佈置的複數個空腔。如第13A圖所示,第一基板118及第二基板119可共同密封來形成複數個環狀空腔120或環狀空腔120之陣列。The ring of color conversion media can be produced using various structures and combinations thereof. For example, as illustrated in FIG. 8, a ring structure 117 may be used, which may include a first substrate 118 and a second substrate 119 that are sealed together to form at least one cavity 120 containing a color conversion medium 112. According to various embodiments, the first substrate 118 may contact the lens 100 and the second substrate 119 may contact the PCB 122 directly or via an adhesive layer (or other intermediate layer). In some embodiments, the cavity 120 may be an annular cavity, for example, extending continuously around the periphery of the light source 111. Alternatively, the cavity 120 may include a plurality of cavities arranged in a circular pattern. As shown in FIG. 13A, the first substrate 118 and the second substrate 119 may be sealed together to form a plurality of annular cavities 120 or an array of annular cavities 120.

在各種實施例中,第8圖中所描繪的光學總成可重複來形成包含透鏡100之陣列、光源111之陣列、及包含色彩轉換介質112之環之陣列的光學陣列。第9圖中描繪示範性二維陣列。如先前所指出,在一些實施例中,環狀色彩轉換介質112可與光源111間隔分開距離d,以減少此等兩個組件之間的熱相互作用。替代地,雖然未例示,但色彩轉換環可實體上接觸光源111之至少一部分。In various embodiments, the optical assembly depicted in FIG. 8 may be repeated to form an optical array including an array of lenses 100, an array of light sources 111, and an array including a ring of color conversion media 112. Figure 9 depicts an exemplary two-dimensional array. As previously indicated, in some embodiments, the ring-shaped color conversion medium 112 may be spaced apart from the light source 111 by a distance d to reduce thermal interaction between these two components. Alternatively, although not illustrated, the color conversion ring may physically contact at least a part of the light source 111.

第10圖例示根據本揭示內容之各種實施例的用於光學總成之另一非限制配置。如所描繪,透鏡100”可包含至少一個空腔120’,該至少一個空腔包含色彩轉換介質。因而,透鏡100”可充當第一基板且可密封或以其他方式與第二基板119結合在一起以形成環結構117’。在其他未例示實施例中,色彩轉換介質可單獨地密封在兩個單獨的薄膜之間,該等薄膜諸如聚合物薄膜(例如,聚對苯二甲酸乙二酯「PET」),且單獨密封的色彩轉換介質可置放於空腔120 (第8圖)或120’ (第10圖)中。FIG. 10 illustrates another non-limiting configuration for an optical assembly according to various embodiments of the present disclosure. As depicted, the lens 100 "may include at least one cavity 120 'that contains a color conversion medium. Thus, the lens 100" may serve as a first substrate and may be sealed or otherwise combined with a second substrate 119 Together to form a ring structure 117 '. In other non-exemplified embodiments, the color conversion medium may be individually sealed between two separate films, such as a polymer film (e.g., polyethylene terephthalate "PET"), and individually sealed The color conversion media can be placed in cavity 120 (Figure 8) or 120 '(Figure 10).

第11圖例示根據本揭示內容之另外實施例的用於光學總成之又一配置。在所描繪實施例中,環結構117可包含第一基板118及第二基板119。微光源111’可包含例如微LED,其可沉積在第一基板118中之可選空腔或孔(未標記)中。在一些實施例中,微光源111’(例如,微LED)可具有以下高度:小於約10 μm,諸如範圍為約3 μm至約8 μm、約4 μm至約7 μm、或約5 μm至約6 μm,包括其之間的所有範圍及子範圍。黏合層124可安置於第一基板118及微光源111’上方,以將透鏡100黏結至第一基板118。因而,第一基板118可充當其上安裝有微光源之PCB組件並充當環結構117中之密封基板。根據各種實施例,第一基板118可自透明材料構造。FIG. 11 illustrates yet another configuration for an optical assembly according to another embodiment of the present disclosure. In the depicted embodiment, the ring structure 117 may include a first substrate 118 and a second substrate 119. The micro light source 111 &apos; may comprise, for example, a micro LED, which may be deposited in an optional cavity or hole (not labeled) in the first substrate 118. In some embodiments, the micro light source 111 '(e.g., a micro LED) may have a height of less than about 10 μm, such as in a range of about 3 μm to about 8 μm, about 4 μm to about 7 μm, or about 5 μm to Approx. 6 μm, including all ranges and subranges in between. The adhesive layer 124 may be disposed above the first substrate 118 and the micro light source 111 'to adhere the lens 100 to the first substrate 118. Thus, the first substrate 118 may serve as a PCB assembly on which the micro light source is mounted and as a sealing substrate in the ring structure 117. According to various embodiments, the first substrate 118 may be constructed from a transparent material.

第12圖例示根據本揭示內容之其他實施例的用於光學總成之另一配置。如所描繪的,環結構117"可包含第一基板118及第二基板119,其可藉由密封件125與安置在其之間的色彩轉換微層112'共同密封。在一些實施例中,色彩轉換微層112’可具有以下厚度:小於約20 μm,諸如範圍為約5 μm至約20 μm、或約10 μm至約15 μm,包括其之間的所有範圍及子範圍。FIG. 12 illustrates another configuration for an optical assembly according to other embodiments of the present disclosure. As depicted, the ring structure 117 "may include a first substrate 118 and a second substrate 119, which may be co-sealed by a seal 125 and a color conversion microlayer 112 'disposed therebetween. In some embodiments, The color conversion microlayer 112 'may have a thickness of less than about 20 μm, such as a range of about 5 μm to about 20 μm, or about 10 μm to about 15 μm, including all ranges and subranges therebetween.

在一些實施例中,玻璃粉可用於形成第一基板118與第二基板119之間的密封件125。在其他實施例中,薄的無機薄膜可熔融(例如,藉由雷射加熱)以形成密封件125。在其他實施例中,密封件125可包含在兩個基板之間的雷射焊料,例如,不利用玻璃粉或其他居間層。In some embodiments, glass frit may be used to form a seal 125 between the first substrate 118 and the second substrate 119. In other embodiments, the thin inorganic film may be melted (eg, by laser heating) to form the seal 125. In other embodiments, the seal 125 may include a laser solder between two substrates, for example, without using glass frit or other intervening layers.

根據各種實施例,第一基板118及第二基板119可為透明的。反射層126可提供在第一基板118及/或第二基板119之一或多個表面上、於不相應於或對準色彩轉換微層112’及/或微光源111’之區域中。一或多個黏合層124可視需要用於將透鏡100黏結至第一基板118及/或將環結構117’’黏結至PCB 122’。光源可為安裝在透明PCB 122’上之微光源111’ (例如,微LED) (如所例示的),或在替代實施例中,可包含安裝至不透明PCB之習知LED (未例示)。According to various embodiments, the first substrate 118 and the second substrate 119 may be transparent. The reflective layer 126 may be provided on one or more surfaces of the first substrate 118 and / or the second substrate 119 in areas that do not correspond to or align with the color conversion microlayer 112 'and / or the microlight source 111'. The one or more adhesive layers 124 may be used to bond the lens 100 to the first substrate 118 and / or the ring structure 117 '' to the PCB 122 'as required. The light source may be a micro light source 111 '(e.g., a micro LED) mounted on a transparent PCB 122 &apos; (e.g., a micro LED) (as illustrated), or in alternative embodiments, may include a conventional LED (not illustrated) mounted to an opaque PCB.

本文亦揭示色彩轉換總成,其包含透明基板及反射基板,其共同密封來形成包含色彩轉換介質之至少一個空腔,其中該至少一個空腔包含連續環狀空腔或複數個以不連續環狀圖案佈置的空腔。本揭示內容另外係關於色彩轉換總成,其包含子總成,其包含共同密封來形成包含色彩轉換介質之至少一個空腔的第一基板及第二基板;及透明透鏡,其以與該子總成上覆配準之方式定位,其中該至少一個空腔包含連續環狀空腔或複數個以不連續環狀圖案佈置的空腔,且其中該透明透鏡包含凸狀表面,且該凸狀表面之至少一部分包含等角螺線曲率。本文進一步揭示包含此等色彩轉換總成及至少一個發光裝置之光學總成。This article also discloses a color conversion assembly that includes a transparent substrate and a reflective substrate that are sealed together to form at least one cavity containing a color conversion medium, wherein the at least one cavity includes a continuous annular cavity or a plurality of discontinuous rings. Cavities arranged like patterns. The present disclosure also relates to a color conversion assembly including a sub-assembly that includes a first substrate and a second substrate that are collectively sealed to form at least one cavity including a color conversion medium; and a transparent lens that communicates with the sub-assembly. The assembly is positioned by overlying registration, wherein the at least one cavity includes a continuous annular cavity or a plurality of cavities arranged in a discontinuous annular pattern, and wherein the transparent lens includes a convex surface, and the convex shape At least a portion of the surface includes an equilateral spiral curvature. This document further discloses an optical assembly including these color conversion assemblies and at least one light emitting device.

如第13A-B圖中所例示,色彩轉換總成可包含第一基板118,其密封至第二基板119,該等密封基板界定含有色彩轉換介質112之至少一個空腔120。如第13A圖中所描繪,總成可包含多於一個空腔,例如,空腔120之陣列。此外,如第13A圖中所描繪,單一空腔120可為環狀,或替代地,複數個單獨空腔可以環狀圖案組裝(未例示)。此種色彩轉換總成可在第8-12圖中所描繪的實施例中用作例如環結構117。因而,至少一個空腔120可至少部分地外接可包括的可選孔徑128,例如以在光學耦合至LED陣列時容納光源。As illustrated in Figures 13A-B, the color conversion assembly may include a first substrate 118 sealed to a second substrate 119, the sealed substrates defining at least one cavity 120 containing a color conversion medium 112. As depicted in FIG. 13A, the assembly may include more than one cavity, such as an array of cavities 120. In addition, as depicted in FIG. 13A, the single cavity 120 may be circular, or alternatively, a plurality of individual cavities may be assembled in a circular pattern (not illustrated). Such a color conversion assembly may be used as, for example, the ring structure 117 in the embodiment depicted in FIGS. 8-12. As such, the at least one cavity 120 may at least partially circumscribe an optional aperture 128 that may be included, such as to receive a light source when optically coupled to the LED array.

雖然第13A圖描繪具有相同大小及形狀的均勻間隔分開環形空腔120之陣列,但應理解,空腔120可界定具有任何其他形狀之環,諸如正方形、橢圓形、矩形、及類似形狀。另外,應理解,陣列中之所有空腔120不必相同。此外,不需要每一空腔120包含相同數量或量之色彩轉換介質,此量有可能在空腔與空腔間有所變化,且對一些空腔而言,不包含色彩轉換介質,例如以匹配所欲LED陣列。Although FIG. 13A depicts an array of uniformly spaced apart annular cavities 120 of the same size and shape, it should be understood that the cavities 120 may define rings having any other shape, such as square, oval, rectangular, and similar shapes. In addition, it should be understood that all cavities 120 in the array need not be the same. In addition, it is not necessary for each cavity 120 to contain the same number or amount of color conversion media. This amount may vary from cavity to cavity, and for some cavities, color conversion media is not included, for example, to match Desired LED array.

參考第8-13圖中之任何圖,色彩轉換介質112、112’可包含至少一個色彩轉換元件。在一些實施例中,色彩轉換元件可懸置於有機或無機矩陣中,諸如聚矽氧或其他適合的材料。在某些實施例中,色彩轉換元件可懸置於熱導矩陣中。根據各種實施例,色彩轉換材料可作為具有一厚度之層來沉積,該厚度範圍例如為約5 μm至約400 μm,諸如約10 μm至約300 μm、約20 μm至約200 μm、或約50 μm至約100 μm,包括其之間的所有範圍及子範圍。至少一個色彩轉換元件可例如選自磷光體、量子點(quantum dot; QD)、及照明體,諸如螢光團或發光聚合物、及類似物。示範性磷光體可包括但不限於發紅色及發綠色磷光體,諸如,基於釔及硫化鋅之磷光體,例如,釔鋁石榴石(yttrium aluminum garnet; YAG)、Eu2+ 摻雜紅色氮化物、及其組合。Referring to any of the figures 8-13, the color conversion medium 112, 112 'may include at least one color conversion element. In some embodiments, the color conversion elements may be suspended in an organic or inorganic matrix, such as polysiloxane or other suitable materials. In some embodiments, the color conversion elements may be suspended in a thermal conductivity matrix. According to various embodiments, the color conversion material may be deposited as a layer having a thickness ranging from, for example, about 5 μm to about 400 μm, such as about 10 μm to about 300 μm, about 20 μm to about 200 μm, or about 50 μm to about 100 μm, including all ranges and subranges therebetween. The at least one color conversion element may be selected, for example, from a phosphor, a quantum dot (QD), and a lighting body such as a fluorophore or a light emitting polymer, and the like. Exemplary phosphors may include, but are not limited to, red and green phosphors, such as yttrium and zinc sulfide-based phosphors, for example, yttrium aluminum garnet (YAG), Eu 2+ doped red nitride , And combinations thereof.

QD可取決於發射光之所欲波長而具有變化形狀及/或大小。例如,發射光之頻率可隨量子點之大小減小而增加,例如,發射光之色彩可隨量子點之大小減小而自紅色變換成藍色。當利用藍色、UV、或近UV光照射時,量子點可將光轉換成較長的紅色、黃色、綠色、或藍色波長。根據各種實施例,色彩轉換元件可選自當利用藍色、UV、或近UV光照射時以紅色及綠色波長發射的QD。The QD may have a varying shape and / or size depending on the desired wavelength of the emitted light. For example, the frequency of the emitted light may increase as the size of the quantum dot decreases. For example, the color of the emitted light may change from red to blue as the size of the quantum dot decreases. When illuminated with blue, UV, or near-UV light, quantum dots can convert light into longer red, yellow, green, or blue wavelengths. According to various embodiments, the color conversion element may be selected from QDs that emit at red and green wavelengths when illuminated with blue, UV, or near-UV light.

在各種實施例中,至少一個空腔120有可能包含相同或不同類型之色彩轉換元件,例如,發射不同波長之光的元件。例如,在一些實施例中,空腔可包含發射綠色波長及紅色波長二者的色彩轉換元件,以在空腔中產生紅色-綠色-藍色(red-green-blue; RGB)光譜。然而,根據其他實施例,個別空腔有可能僅包含發射相同波長之色彩轉換元件,諸如僅包含綠色量子點之空腔或僅包含紅色磷光體之空腔。在其他實施例中,單一空腔可再分,例如,如同輪子上之輪輻或餡餅塊,其中每隔一個子空腔利用綠色轉換元件填充,且其互補空腔利用紅色轉換元件填充。此種實施例可例如適用於避免光之再轉換,例如,藍色轉換至綠色且隨後綠色在轉換至紅色,或反之亦然。In various embodiments, at least one cavity 120 may contain the same or different types of color conversion elements, for example, elements that emit light of different wavelengths. For example, in some embodiments, the cavity may include a color conversion element that emits both green and red wavelengths to generate a red-green-blue (RGB) spectrum in the cavity. However, according to other embodiments, it is possible for individual cavities to contain only color conversion elements emitting the same wavelength, such as cavities containing only green quantum dots or cavities containing only red phosphors. In other embodiments, a single cavity may be subdivided, for example, like a spoke or pie block on a wheel, where every other sub-cavity is filled with a green conversion element and its complementary cavity is filled with a red conversion element. Such an embodiment may be suitable, for example, to avoid re-conversion of light, for example, blue to green and then green to red, or vice versa.

選擇該或該等空腔之配置及置放在每一空腔中以達成所欲顯示或發光效果的色彩轉換介質之類型及量在熟習此項技術者之能力之內。此外,雖然上文論述紅色及綠色發射元件,但應理解,可使用任何類型之色彩轉換元件,其可發射任何波長之光,包括但不限於可見光譜(例如,約420-750 nm)中之紅色、橙色、黃色、綠色、藍色、或任何其他顏色。例如,在固態發光應用中,具有各種大小之量子點可組合來模仿黑體之輸出,從而可提供極佳之色彩呈現。It is within the ability of those skilled in the art to choose the type and quantity of the configuration and placement of the cavities and to place in each cavity to achieve the desired display or luminous effect. In addition, although the red and green emitting elements are discussed above, it should be understood that any type of color conversion element can be used, which can emit light of any wavelength, including but not limited to those in the visible spectrum (e.g., about 420-750 nm) Red, orange, yellow, green, blue, or any other color. For example, in solid state lighting applications, quantum dots of various sizes can be combined to mimic the output of a black body, which can provide excellent color rendering.

在上文相對於第2-13圖論述的實施例中,透鏡100、100’、100’’、第一基板118、及/或第二基板119可例如包含透明或實質上透明材料,諸如玻璃或塑膠。如本文所使用的,術語「透明」意欲表示透鏡、基板、或材料具有在可見光譜區域(約420-750 nm)中大於約80%之光透射。例如,示範性透明基板或透鏡可在可見光範圍中具有大於約85%之光學透射率,諸如大於約90%、或大於約95%之光學透射率,包括其之間的所有範圍及子範圍。In the embodiments discussed above with respect to FIGS. 2-13, the lenses 100, 100 ', 100' ', the first substrate 118, and / or the second substrate 119 may, for example, include a transparent or substantially transparent material, such as glass Or plastic. As used herein, the term "transparent" is intended to mean that a lens, substrate, or material has a light transmission greater than about 80% in the visible spectral region (about 420-750 nm). For example, an exemplary transparent substrate or lens may have an optical transmission in the visible range of greater than about 85%, such as an optical transmission of greater than about 90%, or greater than about 95%, including all ranges and subranges therebetween.

適合的透明材料可包括例如此項技術中所知的適用於顯示及其他電子裝置中之任何玻璃。示範性玻璃可包括但不限於鋁矽酸鹽、鹼金屬鋁矽酸鹽、硼矽酸鹽、鹼金屬硼矽酸鹽、鋁硼矽酸鹽、鹼金屬鋁硼矽酸鹽、及其他適合的玻璃。在各種實施例中,此等基板可經化學強化及/或熱回火。適合的可商購基板之非限制性實例包括來自Corning Incorporated之EAGLE XG®、LotusTM、IrisTM、Willow®、及Gorilla®玻璃,僅舉幾例。已藉由離子交換化學強化的玻璃可適於作為根據一些非限制性實施例之基板。在其他實施例中,諸如塑膠(例如,聚甲基丙烯酸甲酯「PMMA」、甲基丙烯酸甲酯苯乙烯「MS」、或聚二甲基矽氧烷「PDMS」)之聚合物材料可用作適合的透明材料。Suitable transparent materials may include, for example, any glass known in the art that is suitable for use in displays and other electronic devices. Exemplary glass may include, but is not limited to, aluminosilicate, alkali metal aluminosilicate, borosilicate, alkali metal borosilicate, aluminoborosilicate, alkali metal aluminoborosilicate, and other suitable glass. In various embodiments, these substrates may be chemically strengthened and / or thermally tempered. Non-limiting examples of suitable commercially available substrates include EAGLE XG®, Lotus , Iris , Willow®, and Gorilla® glass from Corning Incorporated, to name a few. Glass that has been chemically strengthened by ion exchange may be suitable as a substrate according to some non-limiting embodiments. In other embodiments, polymer materials such as plastic (e.g., polymethyl methacrylate "PMMA", methyl methacrylate styrene "MS", or polydimethylsiloxane "PDMS") may be used For suitable transparent materials.

在非限制性實施例中,第二基板119可為反射基板,諸如金屬、金屬氧化物、金屬合金、或其混合物。替代地,第二基板可包含透明材料(例如,玻璃、塑膠等)或非透明材料(例如,陶瓷、玻璃陶瓷等),且空腔120之壁(若存在)可塗佈有反射材料(諸如,金屬或氧化物、合金或其鹽等)。空腔120中之一或多個反射表面可在確保光在所欲(向前)方向上散射方面為有利的。例如,藉由色彩轉換介質反向散射的任何光可藉由反射基板(或反射表面)反向散射回所欲方向上。此外,反射離開反射基板(或反射表面)之任何藍色(未轉換)光可具有第二次機會在其反向通過色彩轉換材料時轉換成所欲波長。In a non-limiting embodiment, the second substrate 119 may be a reflective substrate such as a metal, a metal oxide, a metal alloy, or a mixture thereof. Alternatively, the second substrate may include a transparent material (e.g., glass, plastic, etc.) or a non-transparent material (e.g., ceramic, glass ceramic, etc.), and the wall (if present) of the cavity 120 may be coated with a reflective material such as , Metal or oxide, alloy or its salt, etc.). One or more reflective surfaces in the cavity 120 may be advantageous in ensuring that light is scattered in a desired (forward) direction. For example, any light backscattered by a color conversion medium can be backscattered back into a desired direction by a reflective substrate (or reflective surface). In addition, any blue (unconverted) light reflected off the reflective substrate (or reflective surface) may have a second chance to be converted to a desired wavelength when it passes through the color conversion material in the opposite direction.

在某些實施例中,自諸如金屬及/或陶瓷之熱導材料構造第二基板119以促進自色彩轉換介質112的熱耗散可為有利的。示範性陶瓷材料包括氮化鋁、氧化鋁、氧化鈹、氮化硼、及碳化矽,僅舉幾例。示範性反射金屬包括但不限於Al、Au、Ag、Pt、Pd、Cu、其他類似金屬、及其合金。根據各種實施例,第二基板119可至少部分地自無機基板構造,該等無機基板諸如具有熱導率大於玻璃之彼者的無機基板。例如,適合無機基板可包括具有相對高熱導率之彼等基板,該相對高熱導率諸如大於約2.5 W/m-K (例如,大於約2.6、3、5、7.5、10、15、20、25、30、40、50、60、70、80、90、或100 W/m-K),例如,範圍在約2.5 W/m-K至約100 W/m-K,包括其之間的所有範圍及子範圍。在一些實施例中,無機基板之熱導率可大於100 W/m-K,諸如範圍為約100 W/m-K至約300 W/m-K (例如,大於約100、110、120、130、140、150、160、170、180、190、200、210、220、230、240、250、260、270、280、290、或300 W/m-K),包括其之間的所有範圍及子範圍。In some embodiments, it may be advantageous to construct the second substrate 119 from a thermally conductive material such as a metal and / or ceramic to promote heat dissipation from the color conversion medium 112. Exemplary ceramic materials include aluminum nitride, aluminum oxide, beryllium oxide, boron nitride, and silicon carbide, to name a few. Exemplary reflective metals include, but are not limited to, Al, Au, Ag, Pt, Pd, Cu, other similar metals, and alloys thereof. According to various embodiments, the second substrate 119 may be constructed at least partially from an inorganic substrate such as an inorganic substrate having a thermal conductivity greater than that of glass. For example, suitable inorganic substrates may include their substrates having a relatively high thermal conductivity, such as greater than about 2.5 W / mK (e.g., greater than about 2.6, 3, 5, 7.5, 10, 15, 20, 25, 30, 40, 50, 60, 70, 80, 90, or 100 W / mK), for example, ranging from about 2.5 W / mK to about 100 W / mK, including all ranges and subranges therebetween. In some embodiments, the thermal conductivity of the inorganic substrate may be greater than 100 W / mK, such as in the range of about 100 W / mK to about 300 W / mK (e.g., greater than about 100, 110, 120, 130, 140, 150, 160, 170, 180, 190, 200, 210, 220, 230, 240, 250, 260, 270, 280, 290, or 300 W / mK), including all ranges and subranges in between.

在另外實施例中,參考第8-13圖,氣密密封可用於結合第一基板及第二基板(環結構117、117’’)及/或透鏡及第二基板(環結構117’)。氣密密封亦可用於結合光學總成之任何其他組件,諸如將透鏡黏結至環結構等。例如,基板及/或透鏡可氣密密封以使得環結構117、117’、117”不可滲透的或實質上不可滲透水、濕氣、空氣、及/或其他污染物。經由非限制性實例,氣密密封可經配置以限制氧之蒸散(擴散)小於約10-2 cm3 /m2 /天(例如,小於約10'3 /cm3 /m2 /天),且限制水之蒸散至約10-2 g/m2 /天(例如,小於約10-3 、10-4 、10-5 、或10-6 g/m2 /天)。在各種實施例中,氣密密封可實質上防止水、濕氣、及/或空氣接觸藉由氣密密封保護的組件(例如,色彩轉換介質及/或光源)。In another embodiment, referring to FIGS. 8-13, an air-tight seal may be used to combine the first substrate and the second substrate (the ring structure 117, 117 ") and / or the lens and the second substrate (the ring structure 117 '). Hermetic sealing can also be used to incorporate any other component of the optical assembly, such as bonding the lens to a ring structure. For example, the substrate and / or lens may be hermetically sealed so that the ring structure 117, 117 ', 117 "is impermeable or substantially impermeable to water, moisture, air, and / or other contaminants. By way of non-limiting example, Hermetic seals can be configured to limit the evapotranspiration (diffusion) of oxygen to less than about 10 -2 cm 3 / m 2 / day (for example, less than about 10 ' 3 / cm 3 / m 2 / day) and to limit the evapotranspiration of water to About 10 -2 g / m 2 / day (eg, less than about 10 -3 , 10 -4 , 10 -5 , or 10 -6 g / m 2 / day). In various embodiments, the hermetic seal may be substantially Protect water, moisture, and / or air from components that are protected by hermetic seals (eg, color conversion media and / or light sources).

替代使光直接透射穿過色彩轉換介質(「透射」模式),本文揭示的光學總成可經配置以使得藉由光源發射的光例如使用本文揭示的透鏡反射一或多次,以在較大區域上傳播光,之後其在擊打色彩轉換介質(「反射」模式)。因而,裝置內之光通量可減少多於兩個數量級。換言之,碰撞於色彩轉換介質上之反射光具有小於原本自光源透射的光之彼強度之1%的強度。此外,因為光可在色彩轉換介質之下自反射表面反射,反射模式配置可具有使光通過色彩轉換介質多於一次的附加益處,因此增加其轉換成不同波長之機會。Instead of transmitting light directly through the color conversion medium ("transmission" mode), the optical assembly disclosed herein may be configured such that light emitted by a light source is reflected one or more times, such as using a lens disclosed herein, in a larger Light propagates over the area before it hits the color conversion medium ("reflective" mode). As a result, the luminous flux in the device can be reduced by more than two orders of magnitude. In other words, the reflected light hitting the color conversion medium has an intensity that is less than 1% of the other intensity of the light originally transmitted from the light source. In addition, because light can be reflected from a reflective surface under a color conversion medium, a reflection mode configuration can have the added benefit of passing light through the color conversion medium more than once, thus increasing its chances of conversion to different wavelengths.

此外,使用其中色彩轉換介質與光源間隔分開的「遠程」配置,與「反射」模式組合不僅減少介質及/或矩陣經暴露的光通量,而且提供用於耗散任何所產生熱的另外的散熱路徑。此外,「遠程」配置具有允許LED在較冷溫度下且因此更高效地運作的另一優點,因為其不需要充當用於冷卻色彩轉換介質之熱路徑(例如,如共形磷光體塗層之狀況)。光學總成之壽命可因此相較於先前技術裝置延長,此歸因於上述優點之一或多者。 裝置In addition, using a "remote" configuration in which the color conversion medium is separated from the light source, combined with the "reflection" mode not only reduces the exposed luminous flux of the medium and / or matrix, but also provides an additional heat dissipation path for dissipating any generated heat . In addition, the "remote" configuration has the additional advantage of allowing the LED to operate at cooler temperatures and therefore more efficiently, as it does not need to act as a thermal path for cooling the color conversion medium (e.g., as in a conformal phosphor coating). situation). The life of the optical assembly can therefore be extended compared to prior art devices, which is attributed to one or more of the aforementioned advantages. Device

第2-13圖中描繪的透鏡及光學總成可用於各種應用,包括但不限於顯示及發光應用。例如,諸如照明器具或固態發光裝置的照明裝置可包含本文揭示的光學總成。在某些實施例中,光學總成可單獨使用或以陣列使用來模擬太陽之寬頻輸出。此等總成可例如包含在各種波長下發射的各種類型及/或大小之色彩轉換元件,該等各種波長諸如範圍為420-750 nm之可見光波長。The lenses and optical assemblies depicted in Figures 2-13 can be used in a variety of applications, including but not limited to display and lighting applications. For example, a lighting device such as a lighting fixture or a solid state light emitting device may include an optical assembly disclosed herein. In some embodiments, the optical assembly can be used alone or in an array to simulate the wideband output of the sun. These assemblies may, for example, include color conversion elements of various types and / or sizes that emit at various wavelengths, such as visible light wavelengths ranging from 420-750 nm.

例如,「白色」LED可藉由利用聚矽氧/磷光體漿料塗佈發射藍光之LED而產生。然而,聚矽氧可在長時間暴露於LED光通量及熱之後隨時間推移變暗。本文揭示的光學總成可用於此種發光裝置以減少色彩轉換介質及/或矩陣經暴露的光通量,及/或提供另外或替代的熱路徑來耗散藉由LED及/或色彩轉換介質產生的熱。包含一或多個玻璃基板之實施例亦可具有相較於塑膠基板對較長時間段保持光學清透之附加優點。For example, a "white" LED can be produced by coating a blue-emitting LED with a polysiloxane / phosphor paste. However, polysilicon can darken over time after prolonged exposure to LED light flux and heat. The optical assemblies disclosed herein can be used in such light emitting devices to reduce the exposed luminous flux of the color conversion medium and / or matrix, and / or provide additional or alternative thermal paths to dissipate the light generated by the LED and / or color conversion medium. heat. Embodiments including one or more glass substrates may also have the additional advantage of maintaining optical clarity for a longer period of time compared to plastic substrates.

根據各種實施例,本文揭示的光學總成可併入顯示裝置(諸如LCD)中之背光單元(backlight unit; BLU)。如第14圖中所例示,BLU 127及液晶(liquid crystal; LC)面板129可併入諸如電視、電腦、手持式裝置、或類似物之顯示裝置中。BLU 127可包含安裝至PCB 122之光源111之陣列,該PCB可附接至散熱件123。如所例示,PCB 122可配備有複數個熱通孔130,該等熱通孔可定位以提供用於光源111及色彩轉換介質112之散熱路徑。在一些實施例中,熱通孔130可包含PCB 122中利用導電材料(例如,金屬,諸如Cu、Ag等)填充的孔或孔徑,從而可允許自PCB 122之一個側面熱傳遞至另一側面且至散熱件123中(若存在)。雖然在第14圖中例示單一散熱件123,但亦可能提供多於一個散熱件123。例如,單獨的散熱可提供用於色彩轉換介質112及用於LED 111,其可進一步將色彩轉換介質與藉由LED產生的熱隔離。According to various embodiments, the optical assemblies disclosed herein may be incorporated into a backlight unit (BLU) in a display device, such as an LCD. As illustrated in FIG. 14, the BLU 127 and a liquid crystal (LC) panel 129 may be incorporated into a display device such as a television, a computer, a handheld device, or the like. The BLU 127 may include an array of light sources 111 mounted to a PCB 122 that may be attached to a heat sink 123. As illustrated, the PCB 122 may be equipped with a plurality of thermal vias 130 that may be positioned to provide a heat dissipation path for the light source 111 and the color conversion medium 112. In some embodiments, the thermal vias 130 may include holes or apertures in the PCB 122 filled with a conductive material (eg, metal, such as Cu, Ag, etc.), thereby allowing heat transfer from one side of the PCB 122 to the other side And go to the heat sink 123 (if any). Although a single heat sink 123 is illustrated in FIG. 14, more than one heat sink 123 may be provided. For example, separate heat dissipation may be provided for the color conversion medium 112 and for the LED 111, which may further isolate the color conversion medium from the heat generated by the LED.

如在第14圖中所描繪,透鏡100之陣列可光學地耦合至光源111之陣列。一或多個黏合層124可視需要包括來改良BLU 127之各種組件之間及/或BLU 127與LC面板129之間的黏著。另外的層可提供在BLU 127與LC面板129之間,諸如擴散器層131,且另外的層可提供在透鏡100之間,諸如反射壁132。在一些實施例中,將個別光學總成互相完全隔離可不為合乎需要的,且另外的層131、132可相應地經改質或移除以允許總成之間的所欲量之漏光。As depicted in FIG. 14, an array of lenses 100 may be optically coupled to an array of light sources 111. One or more adhesive layers 124 may be included as needed to improve adhesion between various components of the BLU 127 and / or between the BLU 127 and the LC panel 129. An additional layer may be provided between the BLU 127 and the LC panel 129, such as a diffuser layer 131, and another layer may be provided between the lenses 100, such as a reflective wall 132. In some embodiments, it may not be desirable to completely isolate individual optical assemblies from each other, and additional layers 131, 132 may be modified or removed accordingly to allow for a desired amount of light leakage between the assemblies.

本文進一步揭示為光轉換裝置,其包含透明基板,其具有第一表面及相對發光表面;色彩轉換介質,其安置於該第一表面上;及反射層,其安置於該第一表面上且封裝該色彩轉換介質之至少一部分。示範性光轉換裝置包括例如光導板(light guide plate; LGP)及光導總成。例如,如第15A-B圖中所描繪,LGP 134之第一表面133可利用色彩轉換介質112圖案化,該色彩轉換介質可利用諸如反射層135之保護層密封或封裝。在非限制性實施例中,反射層可包含金屬薄膜,諸如包含Al、Au、Ag、Pt、Pd、Cu、及其合金中一或多者的薄膜。在某些實施例中,反射層135可包含具有高熱導率之材料,例如,其能夠自色彩轉換介質耗散熱。此外,反射層135可包含在熱應力下能夠膨脹及/或伸展(例如,歸因於色彩轉換材料之熱膨脹)而不生成裂紋或小孔的延性材料。反射層135可因此充當自色彩轉換介質112耗散熱的散熱件及/或充當防止色彩轉換介質112藉由濕氣及/或空氣降解的密封阻障。This document further discloses a light conversion device comprising a transparent substrate having a first surface and a relatively light emitting surface; a color conversion medium disposed on the first surface; and a reflective layer disposed on the first surface and packaging At least a portion of the color conversion medium. Exemplary light conversion devices include, for example, a light guide plate (LGP) and a light guide assembly. For example, as depicted in Figures 15A-B, the first surface 133 of the LGP 134 may be patterned with a color conversion medium 112, which may be sealed or encapsulated with a protective layer such as a reflective layer 135. In a non-limiting embodiment, the reflective layer may include a thin metal film, such as a thin film including one or more of Al, Au, Ag, Pt, Pd, Cu, and alloys thereof. In some embodiments, the reflective layer 135 may include a material with high thermal conductivity, for example, it can dissipate heat from the color conversion medium. In addition, the reflective layer 135 may include a ductile material capable of expanding and / or expanding under thermal stress (for example, due to thermal expansion of the color conversion material) without generating cracks or pinholes. The reflective layer 135 may thus serve as a heat sink that dissipates heat from the color conversion medium 112 and / or as a sealing barrier that prevents the color conversion medium 112 from being degraded by moisture and / or air.

光源111可耦合至LGP 134之邊緣(光入射)表面。視需要,反射器140可附接至LGP之相反邊緣。傳播穿過LGP 134之光110可在LGP內歸因於TIR反射直至擊打包含色彩轉換介質112之區域,在此點,光可作為透射光110’向前散射穿過發光(第二)表面136。色彩轉換介質亦可改質光110,以使得透射光110’具有不同於光110之原始波長的波長。因而,在第15A-B圖中所描繪的光導總成可整合各種層,該等層習知地作為單獨的BLU組件包括。例如,色彩轉換介質可整合在LGP 134之第一表面133上,而非作為單獨的薄膜供應於光源111上或BLU堆疊中。此外,反射層135亦可整合在第一表面133上替代包括作為與傳統BLU堆疊中之LGP 134分離的另外組件。The light source 111 may be coupled to an edge (light incident) surface of the LGP 134. If desired, the reflector 140 may be attached to the opposite edge of the LGP. The light 110 propagating through the LGP 134 can be attributed to the TIR reflection within the LGP until hitting the area containing the color conversion medium 112, at which point the light can be scattered forward as the transmitted light 110 'across the light emitting (second) surface 136. The color conversion medium may also modify the light 110 so that the transmitted light 110 'has a wavelength different from the original wavelength of the light 110. Thus, the light guide assembly depicted in Figures 15A-B can integrate various layers, which are conventionally included as separate BLU components. For example, the color conversion medium may be integrated on the first surface 133 of the LGP 134 instead of being supplied as a separate film on the light source 111 or in a BLU stack. In addition, the reflective layer 135 may be integrated on the first surface 133 instead of including another component separate from the LGP 134 in the conventional BLU stack.

習知LGP可光學地耦合至白色LED,例如,塗佈有色彩轉換介質之藍色LED,該色彩轉換介質諸如將藍光轉換成白光之聚矽氧/磷光體漿料。白漆或其他光散射特徵可提供在LGP之表面上以將光散射至所欲向前方向中。然而,使用本文揭示的整合色彩轉換器配置,利用藍色LED替換習知白色LED且利用藉由反射層封裝的色彩轉換材料替換白漆係可能的。LGP表面上之整合色彩轉換介質可因此發揮以下雙重功能:在所欲方向上向前散射藍光及將藍光轉換成白光。因此,在某些實施例中,傳統的磷光體塗佈之白色LED可藉由耦合至利用QD圖案化之LGP的藍色LED替換。因為QD具有比磷光體更窄的發射光譜,所以所得總成可具有改良的色域。當然,在其他實施例中,LGP可利用不同於QD之色彩轉換元件圖案化,該等色彩轉換元件諸如磷光體、螢光團、及類似物。Conventional LGPs can be optically coupled to white LEDs, for example, blue LEDs coated with a color conversion medium such as a polysiloxane / phosphor paste that converts blue light to white light. White paint or other light scattering features may be provided on the surface of the LGP to scatter light into a desired forward direction. However, using the integrated color converter configuration disclosed herein, it is possible to replace a conventional white LED with a blue LED and a white paint system with a color conversion material encapsulated by a reflective layer. The integrated color conversion medium on the surface of the LGP can thus perform the following dual functions: to scatter blue light forward in the desired direction and convert blue light to white light. Therefore, in some embodiments, a conventional phosphor-coated white LED can be replaced by a blue LED coupled to an LGP patterned with QD. Because QD has a narrower emission spectrum than phosphors, the resulting assembly can have an improved color gamut. Of course, in other embodiments, the LGP may be patterned with color conversion elements other than QD, such as phosphors, fluorophores, and the like.

雖然第15A圖描繪包含連續反射層135之LGP,但某些實施例亦可整合不連續反射層135’,諸如第15B圖中所例示的彼者。因為諸如鋁之金屬可為稍微吸收性的,所以連續反射金屬塗層可導致LGP之輕微衰減。因而,在一些實施例中,反射層可僅提供在相應於色彩轉換介質112之沉積物之區域中。因而,LGP之區域137可具有玻璃/空氣或塑膠/空氣界面,從而允許較大TIR。另外,雖然未例示,但LGP 134的相應於區域137之表面133可具備其他光散射特徵,諸如白色散射粒子,該等特徵可用於達成針對藉由LGP 134透射的光的所欲色彩平衡。諸如TiO2 粒子之光散射特徵可列印在LGP 134之表面133上,及/或光散射特徵可藉由蝕刻或雷射破壞LGP 134之表面133而提供。Although FIG. 15A depicts an LGP including a continuous reflective layer 135, some embodiments may also integrate a discontinuous reflective layer 135 ', such as the one illustrated in FIG. 15B. Because metals such as aluminum can be slightly absorbent, continuous reflective metal coatings can cause slight attenuation of LGP. Thus, in some embodiments, the reflective layer may be provided only in areas corresponding to the deposits of the color conversion medium 112. Thus, the region 137 of the LGP may have a glass / air or plastic / air interface, thereby allowing a larger TIR. In addition, although not illustrated, the surface 133 of the LGP 134 corresponding to the region 137 may have other light scattering features, such as white scattering particles, which may be used to achieve a desired color balance for light transmitted through the LGP 134. Light scattering features such as TiO 2 particles may be printed on the surface 133 of the LGP 134 and / or light scattering features may be provided by damaging the surface 133 of the LGP 134 by etching or laser.

在替代實施例中,如第15C圖中所描繪,墨水層138可提供在色彩轉換介質112與反射層135之間。墨水層138可包含例如反射性白色墨水,諸如金屬氧化物(例如,TiO2 ),且可用於部分地或完全地自視圖模糊反射層135。若需要,則墨水層138可沿表面133之整體長度施加,甚至在其中不存在色彩轉換介質112之區域中施加,如第15C圖所示。替代地,墨水層138可僅提供在包含色彩轉換介質112之區域中。In an alternative embodiment, as depicted in FIG. 15C, an ink layer 138 may be provided between the color conversion medium 112 and the reflective layer 135. Ink layer 138 may comprise, for example, a white reflective ink, such as metal oxides (e.g., TiO 2), and may be used to partially or fully reflective layer 135 from the view is obscured. If necessary, the ink layer 138 may be applied along the entire length of the surface 133, even in areas where the color conversion medium 112 does not exist, as shown in FIG. 15C. Alternatively, the ink layer 138 may be provided only in a region containing the color conversion medium 112.

根據各種實施例,色彩轉換介質及/或光散射特徵可以適合密度圖案化於表面133上,以使得跨於LGP之發光表面136產生實質上均勻的光輸出強度。在其他實施例中,色彩轉換介質及/或光散射特徵可經圖案化以產生跨於表面136之不均勻的光輸出強度。在某些實施例中,緊鄰光源111之色彩轉換介質及/或光散射特徵之密度可低於在自光源進一步移除的點處的密度,或反之亦然,諸如自一端至另一端之梯度,適當時以產生跨於LGP之所欲光輸出分佈。According to various embodiments, the color conversion medium and / or light scattering features may be suitably patterned on the surface 133 such that the light emitting surface 136 across the LGP produces a substantially uniform light output intensity. In other embodiments, the color conversion medium and / or light scattering features may be patterned to produce an uneven light output intensity across the surface 136. In some embodiments, the density of the color conversion medium and / or light scattering features immediately adjacent to the light source 111 may be lower than the density at a point further removed from the light source, or vice versa, such as a gradient from one end to the other , As appropriate, to produce the desired light output distribution across the LGP.

不同於邊緣點亮LGP之配置亦為可能的且設想為落入本申請案之範疇內。例如,背面點亮LGP亦可受益於如本文所述的整合色彩轉換介質。此外,光轉換裝置不僅限於BLU應用,而且亦可適用於固態發光應用。出於說明性目的,第16A-C圖中描繪三個示範性非限制性發光配置。可使用各種光源111 (例如,線性燈,諸如螢光燈泡)、基板139形狀及/或大小(例如,稜鏡)、及/或反射器140位置來設想大量發光配置。色彩轉換介質112及反射層135之類型及/或位置亦可在配置與配置間不同。 方法Configurations other than the edge-lit LGP are also possible and are envisioned to fall within the scope of this application. For example, a backlit LGP may also benefit from an integrated color conversion medium as described herein. In addition, light conversion devices are not limited to BLU applications, but can also be applied to solid state lighting applications. For illustrative purposes, three exemplary non-limiting light emitting configurations are depicted in Figures 16A-C. A variety of light emitting configurations can be envisaged using various light sources 111 (eg, linear lights such as fluorescent light bulbs), the shape and / or size of the substrate 139 (eg, 设想), and / or the position of the reflector 140. The types and / or positions of the color conversion medium 112 and the reflective layer 135 may also differ between configurations and configurations. method

本文揭示的為用於製造光轉換裝置之方法,該等方法包含在基板之第一表面上圖案化色彩轉換介質,及在該第一表面上沉積保護層以封裝該色彩轉換介質,其中該基板或該保護層之一包含反射材料。本文亦揭示製造光學總成之方法,其包含以環狀圖案沉積該色彩轉換介質,將發光裝置定位於該環狀圖案之周邊內,及以與該發光裝置及色彩轉換介質之上覆配準之方式定位透明透鏡。Disclosed herein are methods for manufacturing a light conversion device, the methods including patterning a color conversion medium on a first surface of a substrate, and depositing a protective layer on the first surface to package the color conversion medium, wherein the substrate Or one of the protective layers contains a reflective material. This article also discloses a method for manufacturing an optical assembly, which includes depositing the color conversion medium in a circular pattern, positioning a light-emitting device within a periphery of the circular pattern, and registering the light-emitting device and the color conversion medium Way to position the transparent lens.

在各種實施例中,基板可為透明基板且保護層可包含至少一種金屬。替代地,基板可為包含至少一種金屬之反射基板,且保護層可包含至少一種透明無機氧化物。另外,基板可包含具有至少一個反射表面之至少一個空腔,且保護層可包含至少一個透明無機氧化物。In various embodiments, the substrate may be a transparent substrate and the protective layer may include at least one metal. Alternatively, the substrate may be a reflective substrate including at least one metal, and the protective layer may include at least one transparent inorganic oxide. In addition, the substrate may include at least one cavity having at least one reflective surface, and the protective layer may include at least one transparent inorganic oxide.

色彩轉換介質可使用此項技術中所知之任何方法沉積在基板之第一表面上。適合的沉積方法可包括印刷,諸如墨噴印刷、網版印刷、微印刷、及類似印刷;塗佈,諸如旋塗、狹槽塗佈、浸漬塗佈、及類似塗佈;掉落-鑄製;移取、或其任何組合。在某些實施例中,懸浮於一或多種溶劑中的色彩轉換介質之液滴可以任何所欲圖案沉積在第一表面上。溶劑可視需要藉由在環境溫度或高溫下乾燥來移除。如本文所使用的,術語「圖案化」意欲表示色彩轉換介質以任何給定圖案或設計存在於第一表面上,該給定圖案或設計可例如為隨機或經佈置的、重複或非重複的、均勻或不均勻的。如上文所論述的,圖案亦可包含自基板之一端至另一端的梯度。The color conversion medium can be deposited on the first surface of the substrate using any method known in the art. Suitable deposition methods may include printing, such as inkjet printing, screen printing, microprinting, and the like; coating, such as spin coating, slot coating, dip coating, and the like; drop-casting ; Removal, or any combination thereof. In some embodiments, droplets of the color conversion medium suspended in one or more solvents may be deposited on the first surface in any desired pattern. Solvents can be removed by drying at ambient or elevated temperatures as needed. As used herein, the term "patterned" is intended to mean that the color conversion medium is present on the first surface in any given pattern or design, which may be, for example, random or arranged, repeating or non-repeating , Uniform or uneven. As discussed above, the pattern may also include a gradient from one end to the other end of the substrate.

用於沉積保護層之方法可包括例如濺鍍或氣相沉積製程。例如,色彩轉換介質可沉積在諸如玻璃或塑膠基板之透明基板之第一表面上,且保護性金屬薄膜可隨後濺鍍或蒸鍍在第一表面上以至少部分地封裝色彩轉換介質。替代地,色彩轉換介質可沉積在反射基板之第一表面上且保護性無機氧化層可濺射或蒸鍍在第一表面上。在各種實施例中,基板及保護層可形成其中含有色彩轉換介質之氣密膠囊。在另外實施例中,基板可包含其中可沉積有色彩轉換介質之一或多個空腔。空腔可提供於基板中,例如,藉由壓製、模製、切割、或任何其他適合的方法達成。根據另外實施例,保護層可具有以下範圍之厚度:約0.1 μm至約10 μm,諸如約0.5 μm至約9 μm、約1 μm至約8 μm、約2 μm至約7 μm、約3 μm至約6 μm、或約4 μm至約5 μm,包括其之間的所有範圍及子範圍。The method for depositing the protective layer may include, for example, a sputtering or vapor deposition process. For example, a color conversion medium may be deposited on a first surface of a transparent substrate such as a glass or plastic substrate, and a protective metal film may be subsequently sputtered or evaporated on the first surface to at least partially encapsulate the color conversion medium. Alternatively, a color conversion medium may be deposited on the first surface of the reflective substrate and a protective inorganic oxide layer may be sputtered or evaporated on the first surface. In various embodiments, the substrate and the protective layer may form an airtight capsule containing a color conversion medium therein. In further embodiments, the substrate may include one or more cavities in which a color conversion medium may be deposited. The cavity may be provided in the substrate, for example, by pressing, molding, cutting, or any other suitable method. According to further embodiments, the protective layer may have a thickness in the following range: about 0.1 μm to about 10 μm, such as about 0.5 μm to about 9 μm, about 1 μm to about 8 μm, about 2 μm to about 7 μm, and about 3 μm To about 6 μm, or about 4 μm to about 5 μm, including all ranges and subranges therebetween.

本文揭示的色彩轉換總成可使用各種方法來製造。例如,色彩轉換介質可使用一對利用相應於所欲空腔形狀(例如,環形或環圖案)之凹部壓花的輥來封裝在第一基板與第二基板之間。在各種實施例中,壓花輥可在足以促進第一基板及第二基板之熔合的溫度及/或壓力下操作。在環狀空腔或圖案之狀況下,另外的處理步驟可包括在環之中心提供孔或孔徑。此種孔可使用此項技術中所知之任何方法切割或衝壓至第一基板及第二基板中。The color conversion assemblies disclosed herein can be manufactured using a variety of methods. For example, the color conversion medium may be encapsulated between the first substrate and the second substrate using a pair of rollers embossed with recesses corresponding to a desired cavity shape (eg, a ring or ring pattern). In various embodiments, the embossing roller may be operated at a temperature and / or pressure sufficient to promote fusing of the first substrate and the second substrate. In the case of a circular cavity or pattern, additional processing steps may include providing a hole or aperture in the center of the ring. Such holes can be cut or stamped into the first substrate and the second substrate using any method known in the art.

用於形成色彩轉換總成之替代方法可包括模製。例如,構成環結構之一或多個基板可模製來包括至少一個空腔。在一些實施例中,透明透鏡可模製來包括至少一個空腔。在利用色彩轉換介質填充空腔之後,模製基板及/或透鏡可隨後例如使用黏合劑或其他密封技術(諸如雷射密封)黏結在一起。上文相對於光轉換裝置論述的濺鍍及氣相沉積製程亦可適用於形成本文揭示的色彩轉換總成。Alternative methods for forming a color conversion assembly may include molding. For example, one or more substrates constituting the ring structure may be molded to include at least one cavity. In some embodiments, the transparent lens may be molded to include at least one cavity. After the cavity is filled with the color conversion medium, the molded substrate and / or lens may then be bonded together, for example, using an adhesive or other sealing techniques such as laser sealing. The sputtering and vapor deposition processes discussed above with respect to the light conversion device can also be adapted to form the color conversion assembly disclosed herein.

用於形成色彩轉換總成之另一方法可包括以所欲圖案(例如,在基板上沉積色彩轉換介質Another method for forming a color conversion assembly may include depositing a color conversion medium on a substrate in a desired pattern (e.g.,

將瞭解,各種所揭示實施例可涉及結合彼特定實施例描述的特定特徵、要素或步驟。亦應瞭解,雖然關於一個特定實施例描述特定特徵、要素或步驟,但可在各種非未例示組合或置換中與替代實施例互換或組合。It will be understood that various disclosed embodiments may involve specific features, elements or steps described in connection with that particular embodiment. It should also be understood that although a particular feature, element, or step is described with respect to a particular embodiment, it may be interchanged or combined with alternative embodiments in various non-illustrated combinations or permutations.

亦應理解,如本文所使用的,術語「該」、「一」意指「至少一個」,且不應限於「僅一個」,除非明確指示為相反。因此,例如,提及「一空腔」包括具有一此種「空腔」或兩個或兩個以上此種「空腔」之實例,除非上下文另有清楚指示。類似地,「複數個」或「陣列」意欲表示兩個或兩個以上,以使得「空腔之陣列」或「複數個空腔」表示兩個或兩個以上此種空腔。It should also be understood that as used herein, the terms "the" and "an" mean "at least one" and should not be limited to "only one" unless explicitly indicated to the contrary. Thus, for example, reference to "a cavity" includes examples having one such "cavity" or two or more such "cavities" unless the context clearly indicates otherwise. Similarly, "plurality" or "array" is intended to mean two or more such that "array of cavities" or "plurality of cavities" means two or more such cavities.

本文中可將範圍表述為自「約」一個特定值,及/或至「約」另一特定值。當表示此種範圍時,實例包括自該一個特定值及/或至該另一特定值。類似地,當藉由使用先行詞「約」將值表述為近似值時,應理解,特定值形成另一態樣。應進一步理解,範圍中每一者之端點相對於另一端點而言及獨立於另一端點而言均有意義。Ranges may be expressed herein as from "about" one particular value, and / or to "about" another particular value. When such a range is expressed, examples include from the one particular value and / or to the other particular value. Similarly, when a value is expressed as an approximate value by using the antecedent "about", it is understood that a specific value forms another aspect. It should be further understood that the endpoints of each of the ranges are significant relative to the other endpoint and independently of the other endpoint.

本文表示的所有數值將解釋為包括「約」,無論是否如此陳述,除非另外明確地指示。然而,應進一步理解,所敘述的每一數值亦受精確涵蓋,不管是否其表示為「約」彼值。因此,「小於10 mm之尺寸」及「小於約10 mm之尺寸」兩者包括「小於約10 mm之尺寸」以及「小於10 mm之尺寸」之實施例。All numerical values expressed herein are to be construed to include "about," whether or not so stated, unless expressly stated otherwise. It should be further understood, however, that every numerical value recited is also accurately covered, whether or not it is expressed as "about" that value. Therefore, both the "size of less than 10 mm" and the "size of less than about 10 mm" include embodiments of "the size of less than about 10 mm" and "the size of less than 10 mm."

除非另外明確地說明,否則絕不意欲將本文中所闡述的任何方法解釋為需要其步驟以特定順序進行。因此,在方法請求項實際上未敘述其步驟所遵循之順序或在發明申請專利範圍或說明書中未另外明確說明步驟應限於一特定順序的情況下,絕不意欲推斷任何特定順序。Unless explicitly stated otherwise, it is by no means intended to interpret any method set forth herein as requiring its steps to be performed in a particular order. Therefore, it is by no means intended to infer any particular order in the case where the method claim does not actually describe the order in which its steps follow or in the scope of the invention application patent or the specification does not otherwise explicitly state that the steps should be limited to a particular order.

雖然可使用過渡片語「包含」來揭示特定實施例之各種特徵、要素或步驟,但應理解暗示了包括可使用過渡片語「由...組成」或「主要由...組成」來描述的彼等實施例之替代實施例。因此,例如,包含A+B+C的對方法所暗示的替代實施例包括其中方法由A+B+C組成之實施例及其中方法主要由A+B+C組成之實施例。Although the transitional phrase "including" may be used to reveal various features, elements, or steps of a particular embodiment, it should be understood that the inclusion of the transitional phrase "consisting of" or "consisting essentially of" Alternatives to those described are described. Thus, for example, alternative embodiments implied by the method including A + B + C include embodiments where the method consists of A + B + C and embodiments where the method consists primarily of A + B + C.

熟習此項技術者將明白的是,可在不脫離本揭示內容之精神及範疇的情況下對本揭示內容做出各種修改及變化。因為併入有本揭示內容之精神及實質的所揭示實施例之修改組合、子組合及變化可由熟習此項技術者思及,所以本揭示內容應解釋來包括隨附發明申請專利範圍及其等效物之範疇內的所有事物。Those skilled in the art will understand that various modifications and changes can be made to the present disclosure without departing from the spirit and scope of the present disclosure. Because the modified combinations, sub-combinations, and changes of the disclosed embodiments incorporating the spirit and substance of this disclosure can be considered by those skilled in the art, this disclosure should be construed to include the scope of patents for accompanying inventions and the like Everything in the category of effects.

1‧‧‧QD增強薄膜
2‧‧‧LED
3‧‧‧印刷電路板
4‧‧‧光
5‧‧‧液晶面板
6‧‧‧BLU
7‧‧‧散熱件
8‧‧‧自由或強制對流空氣力
100‧‧‧示範性透鏡
100’‧‧‧線性透鏡
101‧‧‧接觸表面
101’‧‧‧接觸表面
102‧‧‧凸狀表面/凸透鏡表面
102’‧‧‧凸狀表面
103‧‧‧中心區域
104‧‧‧負旋轉三稜鏡凹陷
105‧‧‧經截斷表面
106‧‧‧凹部/切口
107‧‧‧頂點
108‧‧‧垂直中心線
109‧‧‧垂直中心線
110‧‧‧線/光/光線
110’‧‧‧透射光/透射光線
111‧‧‧光源
111’‧‧‧光源陣列/微光源
112‧‧‧色彩轉換介質
112’‧‧‧色彩轉換微層
113‧‧‧右上拐角
114‧‧‧反射層
115‧‧‧間隙
116‧‧‧邊界或最大極限
117‧‧‧環結構
117’‧‧‧環結構
117’’‧‧‧環結構
118‧‧‧第一基板
119‧‧‧第二基板
120‧‧‧空腔
120’‧‧‧空腔
121‧‧‧凹部
122‧‧‧印刷電路板/PCB
122’‧‧‧PCB
123‧‧‧散熱件
124‧‧‧黏合層
125‧‧‧密封件
126‧‧‧反射層
127‧‧‧BLU
128‧‧‧可選孔徑
129‧‧‧液晶面板/LC面板
130‧‧‧熱通孔
131‧‧‧擴散器層/層
132‧‧‧反射壁/層
133‧‧‧第一表面
134‧‧‧LGP
135‧‧‧反射層
135’‧‧‧不連續反射層
136‧‧‧發光表面
137‧‧‧區域
138‧‧‧墨水層
139‧‧‧基板
140‧‧‧反射器
1‧‧‧QD reinforced film
2‧‧‧LED
3‧‧‧printed circuit board
4‧‧‧ light
5‧‧‧ LCD panel
6‧‧‧BLU
7‧‧‧ heat sink
8‧‧‧ Free or forced convection air power
100‧‧‧ exemplary lens
100'‧‧‧ linear lens
101‧‧‧ contact surface
101'‧‧‧ contact surface
102‧‧‧ convex surface / convex lens surface
102'‧‧‧ convex surface
103‧‧‧ central area
104‧‧‧ Negative Rotation Sanya Sag
105‧‧‧Truncation surface
106‧‧‧ Recess / Incision
107‧‧‧ Vertex
108‧‧‧ vertical centerline
109‧‧‧ vertical centerline
110‧‧‧line / light / light
110'‧‧‧ transmitted light / transmitted light
111‧‧‧light source
111'‧‧‧light source array / micro light source
112‧‧‧color conversion media
112'‧‧‧Color Conversion Microlayer
113‧‧‧Top right corner
114‧‧‧Reflective layer
115‧‧‧ Clearance
116‧‧‧ boundary or maximum
117‧‧‧ ring structure
117'‧‧‧ ring structure
117``‧‧‧ ring structure
118‧‧‧First substrate
119‧‧‧second substrate
120‧‧‧ Cavity
120'‧‧‧ Cavity
121‧‧‧ recess
122‧‧‧Printed Circuit Board / PCB
122'‧‧‧PCB
123‧‧‧ heat sink
124‧‧‧ Adhesive layer
125‧‧‧seals
126‧‧‧Reflective layer
127‧‧‧BLU
128‧‧‧Optional aperture
129‧‧‧LCD panel / LC panel
130‧‧‧Hot through hole
131‧‧‧ diffuser layer / layer
132‧‧‧Reflecting wall / layer
133‧‧‧first surface
134‧‧‧LGP
135‧‧‧Reflective layer
135'‧‧‧ discrete reflection layer
136‧‧‧luminescent surface
137‧‧‧area
138‧‧‧ Ink layer
139‧‧‧ substrate
140‧‧‧ reflector

當結合以下圖式閱讀時,可進一步理解以下詳細描述,在可能的情況下,相同數字用於指代相同元件,且:The following detailed description can be further understood when read in conjunction with the following drawings. Where possible, the same numbers are used to refer to the same elements, and:

1 例示示範性LCD總成; FIG 1 illustrates a first embodiment of an exemplary LCD assembly;

2A-C 例示根據本揭示內容之各種實施例的透鏡之橫截面視圖;Cross-sectional view of the lens of the first embodiment illustrated in FIG. 2A-C in accordance with various embodiments of the present disclosure;

3A 為例示根據本揭示內容之另外實施例的在透鏡內之全內反射(total internal reflection; TIR)的圖解; FIG . 3A is a diagram illustrating total internal reflection (TIR) in a lens according to another embodiment of the present disclosure; FIG .

3B 例示藉由使 3A 之曲線圍繞其旋轉軸旋轉而形成的示範性透鏡之拓撲表面圖; FIG . 3B illustrates a topological surface diagram of an exemplary lens formed by rotating the curve of FIG . 3A about its axis of rotation;

4 例示根據本揭示內容之各種實施例的用於構造旋轉對稱透鏡的坐標系; FIG . 4 illustrates a coordinate system for constructing a rotationally symmetric lens according to various embodiments of the present disclosure;

5 例示根據本揭示內容之其他實施例的恆定入射角曲線; FIG . 5 illustrates a constant incidence angle curve according to other embodiments of the present disclosure;

6 例示根據本揭示內容之某些實施例的線性透鏡之透視圖; FIG . 6 illustrates a perspective view of a linear lens according to some embodiments of the present disclosure;

7 例示根據本揭示內容之另外實施例的透鏡之陣列; FIG . 7 illustrates an array of lenses according to another embodiment of the present disclosure;

8 例示根據本揭示內容之各種實施例的光學總成; FIG . 8 illustrates an optical assembly according to various embodiments of the present disclosure;

9 例示根據本揭示內容之其他實施例的光學總成之陣列; FIG . 9 illustrates an array of optical assemblies according to other embodiments of the present disclosure;

10-12 例示根據本揭示內容之替代實施例的光學總成; FIG 10-12 illustrates an embodiment of an optical assembly according to an alternative embodiment of the present disclosure;

13A-B 例示經圖案化之色彩轉換總成的平面及橫截面視圖; The first embodiment shown in FIG. 13A-B plane of the patterned color-conversion assembly, and a cross-sectional view;

14 例示根據本揭示內容之非限制實施例的包含BLU總成之示範性顯示裝置; FIG . 14 illustrates an exemplary display device including a BLU assembly according to a non-limiting embodiment of the present disclosure;

15A-C 例示包含經圖案化之色彩轉換介質的示範性光導板(light guide plate; LGP);及 The first embodiment of FIG. 15A-C illustrates an exemplary light guide plate comprising (light guide plate; LGP); color conversion of the patterned medium and

16A-C 例示包含經圖案化之色彩轉換介質及反射層之示範性光轉換裝置。 The first embodiment shown in FIG. 16A-C comprises a color conversion medium and exemplary patterned layer of reflective light conversion means.

國內寄存資訊 (請依寄存機構、日期、號碼順序註記) 無Domestic hosting information (please note in order of hosting institution, date, and number) None

國外寄存資訊 (請依寄存國家、機構、日期、號碼順序註記) 無Information on foreign deposits (please note in order of deposit country, institution, date, and number) None

100‧‧‧示範性透鏡 100‧‧‧ exemplary lens

101‧‧‧接觸表面 101‧‧‧ contact surface

102‧‧‧凸狀表面/凸透鏡表面 102‧‧‧ convex surface / convex lens surface

103‧‧‧中心區域 103‧‧‧ central area

104‧‧‧負旋轉三稜鏡凹陷 104‧‧‧ Negative Rotation Sanya Sag

105‧‧‧經截斷表面 105‧‧‧Truncation surface

106‧‧‧凹部/切口 106‧‧‧ Recess / Incision

107‧‧‧頂點 107‧‧‧ Vertex

108‧‧‧垂直中心線 108‧‧‧ vertical centerline

Claims (58)

一種光學總成,其包含: 一發光裝置,其安置於一基板之一第一表面上;一環結構,其包含安置於該基板之該第一表面上的一色彩轉換介質;及一透明透鏡,其以與該發光裝置及該環結構上覆配準之方式定位;其中該色彩轉換介質與該發光裝置間隔分開且至少部分地外接該發光裝置。An optical assembly comprising: a light-emitting device disposed on a first surface of a substrate; a ring structure including a color conversion medium disposed on the first surface of the substrate; and a transparent lens, It is positioned in a manner of registering with the light emitting device and the ring structure; wherein the color conversion medium is spaced apart from the light emitting device and at least partially externally connects the light emitting device. 如請求項1所述之總成,其中該環結構包含含有該色彩轉換介質之至少一個空腔。The assembly of claim 1, wherein the ring structure includes at least one cavity containing the color conversion medium. 如請求項2所述之總成,其中該至少一個空腔係氣密密封的。The assembly of claim 2, wherein the at least one cavity is hermetically sealed. 如請求項2所述之總成,其中該至少一個空腔包含一連續環狀空腔或複數個以一不連續環狀圖案佈置的空腔。The assembly according to claim 2, wherein the at least one cavity comprises a continuous annular cavity or a plurality of cavities arranged in a discontinuous annular pattern. 如請求項2所述之總成,其中該環結構包含一反射表面及一相對透明表面,且其中該反射表面與該基板之該第一表面接觸。The assembly according to claim 2, wherein the ring structure includes a reflective surface and a relatively transparent surface, and wherein the reflective surface is in contact with the first surface of the substrate. 如請求項2所述之總成,其中該環結構包含一透明基板及一第二基板,該等基板共同密封來形成含有該色彩轉換介質之至少一個空腔。The assembly according to claim 2, wherein the ring structure includes a transparent substrate and a second substrate, and the substrates are sealed together to form at least one cavity containing the color conversion medium. 如請求項6所述之總成,其中該透明基板係選自玻璃及聚合物,且其中該第二基板係一反射基板。The assembly according to claim 6, wherein the transparent substrate is selected from glass and polymer, and wherein the second substrate is a reflective substrate. 如請求項7所述之總成,其中該反射基板係選自金屬、金屬合金、或金屬氧化物基板或陶瓷或玻璃陶瓷基板,該等陶瓷或玻璃陶瓷基板包含利用一金屬、金屬合金、或金屬氧化物層塗佈的至少一個表面。The assembly according to claim 7, wherein the reflective substrate is selected from a metal, a metal alloy, or a metal oxide substrate or a ceramic or glass-ceramic substrate, and the ceramic or glass-ceramic substrate comprises a metal, a metal alloy, or The metal oxide layer is coated on at least one surface. 如請求項1所述之總成,其中該透明透鏡包含含有該色彩轉換介質之至少一個空腔,且其中該環結構係藉由該透明透鏡及一第二反射基板界定。The assembly according to claim 1, wherein the transparent lens includes at least one cavity containing the color conversion medium, and wherein the ring structure is defined by the transparent lens and a second reflective substrate. 如請求項1所述之總成,其中該環結構包含一第一透明基板及一第二透明基板,該等基板與安置在其間的色彩轉換介質之一微層密封在一起,該微層具有範圍在約5 μm至約20 μm之一厚度。The assembly according to claim 1, wherein the ring structure includes a first transparent substrate and a second transparent substrate, and the substrates are sealed with a microlayer of a color conversion medium disposed therebetween, the microlayer having The thickness ranges from about 5 μm to about 20 μm. 如請求項1所述之總成,其中透明透鏡包含一凸狀表面,且其中該凸狀表面之至少一部分包含一等角螺線曲率。The assembly of claim 1, wherein the transparent lens includes a convex surface, and wherein at least a portion of the convex surface includes an equiangular spiral curvature. 如請求項1所述之總成,其中該透明透鏡係選自單葉形及雙葉形線性透鏡。The assembly according to claim 1, wherein the transparent lens is selected from the group consisting of a single leaf shape and a double leaf shape linear lens. 如請求項1所述之總成,其中該透明透鏡包含一接觸表面、一凸狀表面、及安置其間的一中心區域,且其中該凸狀表面包含延伸至該中心區域中之一負旋轉三稜鏡凹陷。The assembly according to claim 1, wherein the transparent lens includes a contact surface, a convex surface, and a central area disposed therebetween, and wherein the convex surface includes a negative rotation three extending into the central area.稜鏡 depression. 如請求項13所述之總成,其中該接觸表面係一旋轉對稱平面表面,且該凸狀表面係一旋轉對稱半球形表面。The assembly according to claim 13, wherein the contact surface is a rotationally symmetric plane surface, and the convex surface is a rotationally symmetric hemispherical surface. 如請求項13所述之總成,其中該負旋轉三稜鏡凹陷包含一中空圓錐區域,該中空圓錐區域以與該發光裝置上覆配準之方式定位,且其中該中空圓錐區域之一頂點指向該透明透鏡之該接觸表面。The assembly according to claim 13, wherein the negative-rotational tri-sag depression comprises a hollow cone region, the hollow cone region is positioned in a manner registering with the light-emitting device, and wherein a vertex of the hollow cone region Point at the contact surface of the transparent lens. 如請求項1所述之總成,其中該色彩轉換介質包含選自磷光體、量子點、及照明體之至少一個色彩轉換元件。The assembly according to claim 1, wherein the color conversion medium comprises at least one color conversion element selected from the group consisting of phosphors, quantum dots, and illuminants. 如請求項1所述之總成,其中該色彩轉換介質安置於該基板之該第一表面上,以使得自該發光裝置發射且藉由該透明透鏡之該凸狀表面反射的光入射到該色彩轉換介質之至少一部分上。The assembly according to claim 1, wherein the color conversion medium is disposed on the first surface of the substrate so that light emitted from the light emitting device and reflected by the convex surface of the transparent lens is incident on the On at least a portion of a color conversion medium. 如請求項1所述之總成,其中該色彩轉換介質佈置在圍繞該發光裝置之一周邊延伸的一平面中,且其中該發光裝置不直接地發射光至該色彩轉換介質之該平面中。The assembly of claim 1, wherein the color conversion medium is disposed in a plane extending around a periphery of the light emitting device, and wherein the light emitting device does not directly emit light into the plane of the color conversion medium. 如請求項1所述之總成,其中該色彩轉換介質不實體上接觸該發光裝置。The assembly according to claim 1, wherein the color conversion medium does not physically contact the light emitting device. 如請求項1所述之總成,其進一步包含與該基板之一第二表面接觸的至少一個散熱件。The assembly of claim 1, further comprising at least one heat sink in contact with a second surface of the substrate. 一種光學陣列,其包含複數個根據請求項1所述之總成。An optical array comprising a plurality of assemblies according to claim 1. 一種顯示裝置、電子裝置、或照明裝置,其包含如請求項1所述之光學總成或如請求項21所述之光學陣列。A display device, an electronic device, or a lighting device, comprising the optical assembly according to claim 1 or the optical array according to claim 21. 一種色彩轉換總成,其包含: 一子總成,其包含共同密封來形成包含一色彩轉換介質之至少一個空腔的一第一基板及一第二基板;及一透明透鏡,其以與該子總成上覆配準之方式定位,其中該至少一個空腔包含一連續環狀空腔或複數個以一不連續環狀圖案佈置的空腔;且其中該透明透鏡包含一凸狀表面,且該凸狀表面之至少一部分包含一等角螺線曲率。A color conversion assembly includes: a sub-assembly including a first substrate and a second substrate that are collectively sealed to form at least one cavity including a color conversion medium; and a transparent lens that communicates with the lens The sub-assembly is positioned by overlying registration, wherein the at least one cavity includes a continuous annular cavity or a plurality of cavities arranged in a discontinuous annular pattern; and wherein the transparent lens includes a convex surface, And at least a part of the convex surface includes an equiangular spiral curvature. 如請求項23所述之總成,其中該第一基板為一透明基板且該第二基板為一反射基板。The assembly according to claim 23, wherein the first substrate is a transparent substrate and the second substrate is a reflective substrate. 如請求項23所述之總成,其中該透明透鏡之一接觸表面與該透明基板實體接觸。The assembly according to claim 23, wherein a contact surface of the transparent lens is in physical contact with the transparent substrate. 如請求項25所述之總成,其中該接觸表面係一旋轉對稱平面表面,且該凸狀表面係一旋轉對稱半球形表面。The assembly according to claim 25, wherein the contact surface is a rotationally symmetric plane surface, and the convex surface is a rotationally symmetric hemispherical surface. 如請求項23所述之總成,其中該凸狀表面進一步包含一負旋轉三稜鏡凹陷,該負旋轉三稜鏡凹陷具有指向該透明透鏡之一接觸表面的一頂點。The assembly according to claim 23, wherein the convex surface further comprises a negatively rotating triplex depression, the negatively rotating triplex depression having an apex directed to a contact surface of the transparent lens. 如請求項23所述之總成,其中該色彩轉換介質包含選自磷光體、量子點、及照明體之至少一個色彩轉換元件。The assembly according to claim 23, wherein the color conversion medium comprises at least one color conversion element selected from the group consisting of phosphors, quantum dots, and illuminants. 如請求項23所述之總成,其中該第一基板及該第二基板係氣密密封在一起。The assembly according to claim 23, wherein the first substrate and the second substrate are hermetically sealed together. 一種光學總成,其包含如請求項23所述之總成及至少一個發光裝置。An optical assembly comprising the assembly according to claim 23 and at least one light emitting device. 如請求項30之光學總成,其中該至少一個空腔外接該至少一個發光裝置。The optical assembly of claim 30, wherein the at least one cavity is externally connected to the at least one light emitting device. 如請求項30之光學總成,其中該至少一個發光裝置係定位在該子總成之該第一基板中之一凹部中。The optical assembly of claim 30, wherein the at least one light-emitting device is positioned in a recess in the first substrate of the sub-assembly. 如請求項32之光學總成,其中該至少一個發光裝置係一微LED。The optical assembly of claim 32, wherein the at least one light emitting device is a micro LED. 一種顯示裝置、電子裝置、或照明裝置,其包含如請求項23所述之色彩轉換總成或如請求項30所述之光學總成。A display device, an electronic device, or a lighting device, comprising a color conversion assembly according to claim 23 or an optical assembly according to claim 30. 一種色彩轉換總成,其包含一透明基板及一反射基板,其共同密封來形成包含一色彩轉換介質之至少一個空腔,其中該至少一個空腔包含一連續環狀空腔或複數個以一不連續環狀圖案佈置的空腔。A color conversion assembly includes a transparent substrate and a reflective substrate, which are sealed together to form at least one cavity containing a color conversion medium, wherein the at least one cavity includes a continuous annular cavity or a plurality of cavities. Cavities arranged in a discontinuous circular pattern. 如請求項35所述之總成,其中該透明基板係選自玻璃及聚合物,且其中該反射基板係選自金屬、金屬合金、或金屬氧化物基板或陶瓷或玻璃陶瓷基板,該等陶瓷或玻璃陶瓷基板包含利用一金屬、金屬合金、或金屬氧化物層塗佈的至少一個表面。The assembly according to claim 35, wherein the transparent substrate is selected from glass and polymer, and wherein the reflective substrate is selected from metal, metal alloy, or metal oxide substrate or ceramic or glass ceramic substrate, such ceramics Or the glass ceramic substrate includes at least one surface coated with a metal, metal alloy, or metal oxide layer. 如請求項35所述之總成,其中該色彩轉換介質包含選自磷光體、量子點、及照明體之至少一個色彩轉換元件。The assembly according to claim 35, wherein the color conversion medium comprises at least one color conversion element selected from the group consisting of phosphors, quantum dots, and illuminants. 一種光學總成,其包含如請求項35所述之色彩轉換總成及至少一個發光裝置。An optical assembly comprising the color conversion assembly according to claim 35 and at least one light emitting device. 一種光轉換裝置,其包含: 一透明基板,其具有一第一表面及一相對發光表面;一色彩轉換介質,其安置於該第一表面上;及一反射層,其安置於該第一表面上且封裝該色彩轉換介質之至少一部分。A light conversion device includes: a transparent substrate having a first surface and a relatively light-emitting surface; a color conversion medium disposed on the first surface; and a reflective layer disposed on the first surface And encapsulating at least a part of the color conversion medium. 如請求項39之裝置,其中該色彩轉換介質包含選自磷光體、量子點、及照明體之至少一個色彩轉換元件。The device of claim 39, wherein the color conversion medium includes at least one color conversion element selected from the group consisting of phosphors, quantum dots, and illuminants. 如請求項39之裝置,其中該透明基板係選自玻璃及聚合物,且其中該反射層包含至少一個金屬薄膜。The device of claim 39, wherein the transparent substrate is selected from glass and polymers, and wherein the reflective layer includes at least one metal thin film. 如請求項41所述之裝置,其中該金屬薄膜為不連續的。The device according to claim 41, wherein the metal thin film is discontinuous. 如請求項41所述之裝置,其進一步包含至少一個光散射特徵,其安置於該第一表面上的相應於在該不連續金屬薄膜中之一空隙的至少一個區域中。The device according to claim 41, further comprising at least one light scattering feature disposed in at least one region of the first surface corresponding to a void in the discontinuous metal film. 如請求項41所述之裝置,其進一步包含安置在該色彩轉換介質與該金屬薄膜之間的一白色反射層。The device according to claim 41, further comprising a white reflective layer disposed between the color conversion medium and the metal thin film. 如請求項44所述之裝置,其中該白色反射層為不連續的。The device according to claim 44, wherein the white reflective layer is discontinuous. 一種光導總成,其包含光學地耦合至至少一個光源的如請求項39所述之裝置。A light guide assembly comprising a device as described in claim 39 optically coupled to at least one light source. 如請求項46所述之光導總成,其中該至少一個光源光學地耦合至該透明基板之該第一表面。The light guide assembly of claim 46, wherein the at least one light source is optically coupled to the first surface of the transparent substrate. 如請求項46所述之光導總成,其中該至少一個光源光學地耦合至該透明基板之一邊緣表面。The light guide assembly of claim 46, wherein the at least one light source is optically coupled to an edge surface of the transparent substrate. 如請求項48所述之光導總成,其中該色彩轉換介質係以一梯度圖案化於該第一表面上,該梯度具有隨與該至少一個光源的距離變化的漸增密度。The light guide assembly according to claim 48, wherein the color conversion medium is patterned on the first surface with a gradient, the gradient having a gradually increasing density that varies with distance from the at least one light source. 如請求項46所述之光導總成,其中該至少一個光源為發射紫外光、近紫外光、或藍光之一發光二極體。The light guide assembly according to claim 46, wherein the at least one light source is a light-emitting diode that emits one of ultraviolet light, near-ultraviolet light, or blue light. 一種製造一光轉換裝置之方法,該方法包含以下步驟: 在一基板之一第一表面上圖案化一色彩轉換介質,及在該第一表面上沉積一保護層以封裝該色彩轉換介質,其中該基板或該保護層之一包含一反射材料。A method for manufacturing a light conversion device includes the following steps: patterning a color conversion medium on a first surface of a substrate, and depositing a protective layer on the first surface to encapsulate the color conversion medium, wherein One of the substrate or the protective layer includes a reflective material. 如請求項51所述之方法,其中該基板係選自玻璃及聚合物之一透明基板,且其中該保護層包含至少一種金屬。The method according to claim 51, wherein the substrate is a transparent substrate selected from one of glass and polymer, and wherein the protective layer comprises at least one metal. 如請求項51所述之方法,其中該基板為包含至少一種金屬之一反射基板,且該保護層包含至少一種透明無機氧化物。The method of claim 51, wherein the substrate is a reflective substrate including at least one metal, and the protective layer includes at least one transparent inorganic oxide. 如請求項51所述之方法,其中該基板包含具有至少一個反射表面之至少一個空腔,且該保護層包含至少一種透明無機氧化物。The method of claim 51, wherein the substrate includes at least one cavity having at least one reflective surface, and the protective layer includes at least one transparent inorganic oxide. 如請求項51所述之方法,其中該保護層係藉由氣相沉積或濺鍍來沉積。The method according to claim 51, wherein the protective layer is deposited by vapor deposition or sputtering. 如請求項51所述之方法,其中該色彩轉換介質包含選自磷光體、量子點、及照明體之至少一個色彩轉換元件。The method according to claim 51, wherein the color conversion medium comprises at least one color conversion element selected from the group consisting of phosphors, quantum dots, and illuminants. 如請求項51所述之方法,其中該色彩轉換介質係以一環狀圖案沉積在該第一表面上。The method according to claim 51, wherein the color conversion medium is deposited on the first surface in a circular pattern. 如請求項57所述之方法,其進一步包含以下步驟:藉由將一發光裝置定位於該環狀圖案之一周邊內而形成一光學總成,及以與該發光裝置及色彩轉換介質上覆配準之方式定位一透明透鏡。The method according to claim 57, further comprising the steps of: forming an optical assembly by positioning a light emitting device within a periphery of the circular pattern, and overlaying the light emitting device and the color conversion medium Position a transparent lens by registration.
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