WO2017196952A1 - Échangeur de chaleur de point de distribution pour fluides - Google Patents

Échangeur de chaleur de point de distribution pour fluides Download PDF

Info

Publication number
WO2017196952A1
WO2017196952A1 PCT/US2017/031916 US2017031916W WO2017196952A1 WO 2017196952 A1 WO2017196952 A1 WO 2017196952A1 US 2017031916 W US2017031916 W US 2017031916W WO 2017196952 A1 WO2017196952 A1 WO 2017196952A1
Authority
WO
WIPO (PCT)
Prior art keywords
conduit
fluid
conduit body
assembly
heat exchanger
Prior art date
Application number
PCT/US2017/031916
Other languages
English (en)
Inventor
Joel Rozga
Derrick SANISLO
Howard J. Base
Jack M GEIGER
Original Assignee
Tom Richards, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tom Richards, Inc. filed Critical Tom Richards, Inc.
Publication of WO2017196952A1 publication Critical patent/WO2017196952A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H1/00—Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
    • F24H1/10—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
    • F24H1/12—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium
    • F24H1/14—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium by tubes, e.g. bent in serpentine form
    • F24H1/142—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium by tubes, e.g. bent in serpentine form using electric energy supply
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D7/00—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D7/10—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being arranged one within the other, e.g. concentrically
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/02—Tubular elements of cross-section which is non-circular
    • F28F1/022—Tubular elements of cross-section which is non-circular with multiple channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/02—Tubular elements of cross-section which is non-circular
    • F28F1/04—Tubular elements of cross-section which is non-circular polygonal, e.g. rectangular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • F28F7/02—Blocks traversed by passages for heat-exchange media
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H05B3/42—Heating elements having the shape of rods or tubes non-flexible
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H2250/00—Electrical heat generating means
    • F24H2250/04—Positive or negative temperature coefficients, e.g. PTC, NTC
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/014—Heaters using resistive wires or cables not provided for in H05B3/54
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/02—Heaters using heating elements having a positive temperature coefficient
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/022—Heaters specially adapted for heating gaseous material

Definitions

  • the present disclosure relates to heat exchangers. More particularly, the disclosure relates to an inline heat exchanger for fluids (the term "fluids" includes both liquids and gases).
  • the inline heat exchanger can be used to heat corrosive fluids such as are used in semiconductor manufacturing at or close to the point where such fluids are being dispensed during the manufacturing process. Because the fluids are corrosive, it is important that they be contained in conduits which can resist corrosion. For semiconductor manufacturing, it is also important that the chemicals not be contaminated during their passage through the heat exchanger.
  • a recirculation loop includes a storage vessel, a pump, an inline chemical heater and a filter located within the plumbing module of a wet tool employed in semiconductor manufacturing.
  • the fluid is constantly circulated within the self- contained recirculation loop as it is heated to the desired process temperature. Once the entire volume of fluid is at the desired process temperature, it is distributed to the processing chamber or tank to either produce a single semiconductor wafer or a batch of wafers at a time. The wafer is then typically rinsed with the deionized water many times at elevated temperatures. This can be followed by a drying process which can employ several methods.
  • One of these methods involves the use of the solvent isopropyl alcohol (IPA) which is held at an elevated temperature.
  • Another such method involves the use of nitrogen gas and a point of dispense heater can also be employed or utilized to heat the gas.
  • IPA solvent isopropyl alcohol
  • heaters are contained in the plumbing area of wet tools and distribution plumbing is employed to lead the heated fluid out to the fluid dispensing nozzle within the chambers or tanks where the semiconductor wafers are processed.
  • this takes up a significant amount of room within these processing tools. Since such semiconductor processing takes place in a controlled environment, the room taken up by the heating assemblies for the processing fluids employed is responsible for a significant amount of the costs associated with semiconductor processing equipment.
  • This known distribution method also incurs temperature losses due to the extended travel paths of the recirculated fluids as they travel from the heated recirculation loop to the process chamber or tank.
  • Heating or cooling the processing fluid only at the point of its dispensing or discharge would serve to minimize the footprint of the processing fluid handling and preprocessing preparation section of the plumbing area of the semiconductor tool. It would also mean that the processing fluid is no longer subjected to temperature losses, for example, as the fluid travels from a heated tank to the processing area. This would greatly simplify the cost and configuration of the processing tools and enhance their functionality. It would also save money as less processing fluid would be needed.
  • the heat exchanger in question must be small in size, low in mass and have a very fast response time in order to minimize the waste of processing fluid while it is either being drained or returned to a storage container such as during its initial heating phase. It would also be advantageous for the heat exchanger to accommodate a wide range of flow rates as these can vary based on the process parameters associated with the various processing steps involved in semiconductor manufacture.
  • a heat exchanger assembly comprises an elongated conduit body including a first end, a second end and an outer periphery.
  • a first fluid passage is defined in the conduit body and extends longitudinally in the conduit body from the first end thereof to the second end thereof.
  • a second fluid passage is defined in the conduit body and extends longitudinally in the conduit body from the first end thereof to the second end thereof. The second fluid passage is spaced from and fluidically isolated from the first fluid passage.
  • a heat transfer element is mounted to the outer periphery of the conduit body, wherein the heat transfer element thermally contacts the conduit body and is adapted to transfer heat to or from the conduit body by conduction.
  • a method of controlling heat transfer to a process fluid flowing in a conduit includes the steps of providing a conduit body, including a first end, a second end, an outer periphery and a longitudinal axis and defining a central bore in the conduit body, the central bore extending along the longitudinal axis from the first end of the conduit body to the second end thereof.
  • a first process fluid passage is defined in the conduit body, the first process fluid passage extending parallel to the longitudinal axis from the first end of the conduit to the second end thereof.
  • a second process fluid passage is defined in the conduit body, the second process fluid passage extending parallel to the longitudinal axis from the first end of the conduit body to the second end thereof, wherein the first and second process fluid passages are fluidically isolated from each other and from the central bore.
  • the outer periphery of the conduit body is thermally contacted with a first heat transfer source.
  • the central bore of the conduit body is thermally contacted with a second heat transfer source. A transfer of heat to the process fluid flowing through the first and second fluid passages is regulated.
  • a unitary one- piece tubular fluid conduit for a heat exchanger comprises a first end, a second end, an outer periphery and a longitudinal axis.
  • a first process fluid passage is defined in the conduit and extends in the conduit parallel to the longitudinal axis from the first end thereof to the second end thereof.
  • a second process fluid passage is defined in the conduit and extends in the conduit parallel to the longitudinal axis from the first end thereof to the second end thereof.
  • a central bore is defined in the conduit and extends along the longitudinal axis.
  • the first and second process fluid passages are non- circular in cross section to promote a turbulent flow of the process fluid.
  • FIGURE 1 is schematic perspective view of a one-piece point of dispense heat exchanger for fluids according to a first embodiment of the present disclosure
  • FIGURE 2 is a perspective view of a heat exchanger according to a second embodiment of the present disclosure.
  • FIGURE 3 is a perspective view of a heat exchanger according to a third embodiment of the present disclosure.
  • FIGURE 4 is a perspective view of a heat exchanger according to a fourth embodiment of the present disclosure.
  • FIGURE 5 is a perspective view of a heat exchanger according to a fifth embodiment of the present disclosure.
  • FIGURE 6A is a perspective view of one type of end cap employing a manifold which can be coupled to a heat exchanger according to one embodiment of the present disclosure
  • FIGURE 6B is a perspective view of another type of end cap which can be coupled to a heat exchanger according to another embodiment of the present disclosure
  • FIGURE 6C is a perspective view of still another type of end cap which can be coupled to a heat exchanger according to a still further embodiment of the present disclosure
  • FIGURE 7 is an end elevational view of a conduit which can be used with a heat exchanger according to another embodiment of the present disclosure
  • FIGURE 8 is an end elevational view of a conduit which can be used with a heat exchanger according to still another embodiment of the present disclosure
  • FIGURE 9 is an end elevational view of a conduit which can be used with a heat exchanger according to a further embodiment of the present disclosure.
  • FIGURE 10 is an end elevational view of a conduit which can be used as a heat exchanger according to a still further embodiment of the present disclosure
  • FIGURE 11 is an end elevational view of a conduit which can be used as a heat exchanger according to yet a further embodiment of the present disclosure
  • FIGURE 12 is an end elevational view of a conduit which can be used as a heat exchanger according to an additional embodiment of the present disclosure
  • FIGURE 13 is a perspective view of the conduit of FIGURE 12 illustrated in use in a heat exchanger setting
  • FIGURE 14 is a perspective view of a conduit which can be used as a heat exchanger according to a yet still further embodiment of the present disclosure.
  • FIGURE 15 is a schematic view of a typical nozzle employed in the manufacture of semiconductor devices illustrating schematically where a heat exchanger according to the present disclosure may be positioned inside or secured to such a nozzle.
  • FIGURE 1 illustrates a point of dispense heat exchanger 10 according to a first embodiment of the present disclosure.
  • the heat exchanger includes a conduit or tube 12 which is unitary and of one-piece and comprises a central passageway or bore 16 that extends longitudinally or axially into the tube from a first end of the conduit or tube. It can extend all the way to a second end thereof.
  • Located radially outwardly from the central passageway or bore 16 are a plurality of spaced fluid paths or fluid passageways 18. It is noted that there is no fluid communication between the central passageway 16 and the several fluid paths 18.
  • the central passageway 16 and the several fluid paths 18 are fluidically isolated from each other such that there is no fluid communication between the central passageway and the several fluid paths or fluid passages.
  • the several fluid paths 18 also do not communicate with each other. Rather, all of these extend generally parallel to each other, are spaced from each other and extend axially (parallel to the axis of the conduit 12) from a first end of the conduit to a second end of the conduit. As mentioned, the passageway 16 and fluid paths 18 are oriented generally parallel to each other but are spaced apart. Thus, a fluid flowing in the central passageway 16 and a fluid flowing in the several fluid paths 18 does not mix in the conduit 12. In another embodiment, one or more of the fluid paths 18 could be designed to communicate with another of the fluid paths.
  • a heating element 26 Provided on an outer periphery 22 of the conduit 12 in this embodiment is a heating element 26.
  • the singular or unitary or one-piece conduit or tube serves as the interface between fluid paths and a heating or cooling source.
  • the conduit can be configured to accommodate a broad range of fluids and applications.
  • the quantity, size, and shape of the fluid paths could all be changed based on the specific application of the heat exchange system.
  • an odd number of paths are defined in the one-piece conduit or tube in order to allow for an inlet and an outlet to be located on opposing ends of the conduit.
  • FIGURE 2 Such an embodiment is illustrated in FIGURE 2.
  • the tube or conduit can be made from a range of materials as selected in order to provide optimum heat transfer and chemical compatibility.
  • the material comprising the tube or conduit 12 can be a single crystal sapphire material.
  • Sapphire particularly single crystal sapphire, is advantageous due to its high thermal conductivity, chemical resistance and other characteristics. These characteristics include physical, chemical and optical properties allowing the material to withstand high temperatures, high pressures, thermal shock and water erosion.
  • single crystal sapphire is chemically inert with a low friction coefficient and with excellent electrical, optical and dielectric characteristics. In addition, it is radiation resistant.
  • One type of such a sapphire material is a synthetic sapphire. Synthetic sapphire is a single crystal form of corundum, AL2O3. This is also known as alpha- alumina or alumina.
  • Sapphire is thus an aluminum oxide in its purest form with no porosity or grain boundaries making it theoretically dense.
  • Such synthetic sapphire material has somewhat directional heat transfer properties. With a single crystal sapphire, heat transfer is best when the respective fluid passages are aligned perpendicular to the 011 plane of the single crystal sapphire.
  • the combination of favorable chemical, electrical, mechanical, optical, surface, thermal and durability properties make sapphire a preferred material for high performance systems and component designs. For various semiconductor applications, sapphire is considered to be the best choice when compared to other synthetic single crystals.
  • the manufacturer in question can provide a one- piece conduit as described above having more than one fluid passageway extending longitudinally there through.
  • the conduit can be formed as a single crystal body of the same chemical composition having the same crystal orientation.
  • the conduit is a unitary, one-piece body having multiple longitudinally extending fluid flow paths which are separated from one another and extend from a first end of the conduit to a second end of the conduit.
  • control method described in the '291 patent accounts for all thermal loads of a given process to achieve very accurate temperature control. However, a significant portion of the control is required to account for the thermal mass of the heater itself.
  • the control scheme accounts for time and energy required to heat the heater before the heater can then itself heat the process fluid.
  • the heater must be designed as efficiently as possible. It is efficient from an assembly perspective to provide a one- piece unitary conduit, rather than a multiple piece body that needs to be assembled to form a single conduit. Also, a single one-piece conduit or tube allows for the heat exchanger to be more easily configured based on the process fluid which is meant to be thermally treated, i.e., heated in this embodiment, and based on the required flow rate and the required temperature rise. Because of the many types of processing fluids (wet chemistries) utilized in the production of a semiconductor device with varying thermal and physical processes, a single heat exchanger or heater design would not be effective to achieve the desired results.
  • Ideal thermal transfer occurs when the fluid is in contact with the heat exchange surface (the interior wall of one of the flow paths in the tube) in a turbulent state. In this state, the fluid absorbs heat from the heated surface by continually exposing the cooler fluid to the heated surface creating the largest possible thermal driving force. In laminar flow, a film of fluid is created at the heat exchange surface which film or layer then impedes the transfer of heat by effectively reducing the thermal driving force.
  • One way of promoting a turbulent flow of the process fluid is to form the fluid passages in the conduit body as non-circular fluid passages, such as the elliptical and oval passages illustrated in several embodiments of the present disclosure.
  • a “figure of merit” is a quantity used to characterize the performance of a device relative to its alternatives. It is a numerical expression representing the performance or efficiency of a given design in comparison to other designs. In the present context, figure of merit measures the ratio between the heat transfer rate and the pressure drop through the several fluid paths. Thus, for the instant application, the “figure of merit” is the ratio of improved heat transfer to pressure drop. Optimizing the "figure of merit” permits the most efficient heat exchanger for a given application.
  • the fluid pathways can have regular shapes.
  • the central passageway 16 is circular in cross section, whereas the several fluid paths 18 are oval or elliptical in cross section.
  • six such elliptically-shaped (in cross section) fluid paths are provided arranged radially around the centrally located passageway 16.
  • the number of radial fluid passageways could vary as may be needed for a particular application.
  • an odd number of pathways may be provided in the tube or conduit, so as to allow for an inlet on one end and an outlet on the other end of the tube or conduit.
  • the shapes of the fluid passageways can be regular or irregular as may be required for a particular application.
  • the geometry of the conduit 12 can also be varied. In other words, its cross section need not be circular.
  • Each of the passageways or fluid paths 16 and 18, as well as the conduit 12 can be engineered around the figure of merit.
  • the modified oval or elliptical shape of the fluid paths 18 is such that it maximizes the heat transfer while maintaining a relatively low pressure drop.
  • a round tube or conduit is the most common shape for nearly all heat exchangers.
  • Employing a round tube as the mechanical design is advantageous because it is robust for efficiently withstanding pressure and is relatively simple to produce.
  • the difficulty with using such a round tube is that a relatively high velocity fluid flow is required in order to achieve turbulent flow. This is a good thing when distributing flow, but not ideal for efficient heat transfer.
  • a common example of an improved design for heat transfer is an automotive radiator. In this design, the tubes are oval shaped in order to increase the amount of heat exchange area and also to improve the "figure of merit.”
  • a relatively round or cylindrical tube made of a sapphire material is provided with a round central passageway 16 and elliptical or oval radial fluid flow paths 18.
  • a plurality of freestanding fluid flow paths is defined in the conduit 12. In theory, these could also be machined or molded into the conduit when the conduit is made from one of the other listed materials.
  • the internal fluid paths 18 would be the wetted surface with the main thermal transfer tube serving as the interface between the temperature control elements, such as the heating element 26 and the fluid which is being heated or cooled.
  • the construction or provision of a rounded conduit 12 allows the resistance heating element 26 to be directly wound onto the outer periphery of the tube for intimate thermal contact and likely the lowest overall mass. Having a low overall mass is an advantage for the operation of a heating system.
  • elliptical fluid paths integrated within the round thermal transfer conduit or tube are advantageous.
  • the shape of the fluid flow paths 18 is advantageous for the effective operation of the heat exchanger assembly. There are several attributes of this shape which impact the performance of the design. The first is that it greatly improves the available exchange area per volume when compared to round fluid paths. The second attribute is the figure of merit as discussed above.
  • the outside and inside geometry of the conduit 12 is optimized for the interface with the heat source, in this case the electrical resistance heating element 26.
  • the conduit can be optimized based on requirements as to heat capacity, density and viscosity of the fluid which is being thermally treated.
  • the design of the conduit is not limited by or based on the material of the conduit.
  • the conduit can be configured to be employed with a manifold for a variety of fluid paths, such as parallel fluid paths, series fluid paths or a combination of the two.
  • a heat exchanger 30 comprises a conduit 32 in which are defined a generally round central passageway 36 and, in this embodiment, three radially outer arc-shaped fluid paths 38. Each of these can extend more than 90 degrees around the circumference of the central fluid path. Disposed on an outer periphery 42 of the conduit 32 is a heating element 46. While the conduits in this embodiment and several other embodiments are illustrated as being generally identical to each other in cross section, this does not need to be so. Rather, the conduits could have different shapes in cross section if that is considered advantageous for a particular heat transfer environment. In addition, in one embodiment, the fluid passages can be regular in cross section along the longitudinal axis of the conduit body.
  • the passages could vary in cross section along the longitudinal axis of a conduit body. This may be necessary for certain heat transfer applications.
  • One process for constructing a conduit having fluid passages which are irregular in cross section is via 3D printing.
  • the heat exchanger comprises a conduit 52 which is polygonal in cross section. More particularly, the conduit is generally hexagonal in cross section. Extending longitudinally or axially through the conduit 52 is a central passageway 56. In this embodiment, the central passageway 56 is also generally hexagonal in cross section.
  • a plurality of fluid paths 58 Located radially around the central passageway 56 are a plurality of fluid paths 58, each of which is generally elliptical or oval in cross section. In this embodiment, six such passageways or paths are provided.
  • the heat transfer elements can be flat temperature control elements, such as PTC thermistors or Peltier elements.
  • Peltier elements which are sometimes known as thermoelectric coolers, allow for a substantial amount of heat transfer between the hot side of the device and the cold side thereof.
  • a Peltier device is a small active heat pump. The Peltier effect is used to create a heat flux.
  • One advantage of a Peltier device is that the heating and cooling sides of the element can be reversed simply by changing the orientation of the current flow. Thus, in one orientation of current flow, the cool side is on the bottom surface of the device which is in contact with the outer periphery 62 of the conduit 52, whereas a current flow in the opposite orientation will put the hot side of the device in contact with the outer periphery of the conduit.
  • a Peltier device can be used either for heating or for cooling, although in practice, the main application is cooling.
  • TEC thermo-electric cooler
  • a heat exchanger 70 comprising a conduit 72 which can be generally cylindrical in shape.
  • the conduit includes a central passageway 76 around which are radially arranged one or more fluid paths 78.
  • the central passageway 76 can be circular, whereas the surrounding fluid paths 78 can be oval and somewhat teardrop or egg-shaped. It should be appreciated that the length of the conduit 72 can be any desired length as may be required for a particular heat transfer application.
  • Located on an outer periphery 82 of the conduit 72 can be a heating element (not shown).
  • the central passageway 76 can be used either as a heating passage or as a cooling passage for the several fluid paths 78 extending radially around the central passageway 76.
  • both the heating element and the central passageway 76 could be employed to heat the process fluid which passes through the several fluid paths 78.
  • both heating and cooling are integrated directly into one device. While heating can be provided on the outer periphery of the conduit 72, additional heating or cooling could be channeled through the central pathway or central passage 76. In the case where the central passageway 76 is used for cooling, then both heating and cooling could take place independently or at the same time in the heat exchanger 70 in order to control or regulate the temperature of the process fluid passing through the fluid paths 78, to within a range of 1°C or less and perhaps as closely as a range of 0.1 °C or less.
  • a heat exchanger 90 includes a conduit 92 which can be generally round in cross section.
  • the conduit 92 includes a central passageway 96 which, in this embodiment, is circular in cross section, as well as several radially located fluid paths 98 which can be oval, egg- shaped or teardrop-shaped in this embodiment.
  • Located on an outer periphery 102 of the conduit can be one or more heating elements (not shown). While the heating elements can heat the conduit 92 as the fluid to be thermally treated passes through the fluid paths 98, the central passageway or bore 96 can provide thermal transfer either by provision of a known cartridge heater or passing a heating fluid or a cooling fluid through the central passageway 96.
  • the length of the conduit 92 can be any desired length as may be required for a particular heat transfer application.
  • an end cap includes a conduit 110 which can connect to the tube or conduit, including the several flow paths illustrated in any of the embodiments discussed so far.
  • the conduit 110 has a port 112 which connects to an end of the heat exchanger.
  • the port 112 can be an inlet port or an outlet port as desired.
  • the conduit 110 is mated with an end cap 116 in which there are provided one or more baffles 118.
  • FIGURE 6B there are provided two conduits 110' and 111 which can connect to two different heat exchanger tubes or conduits.
  • one conduit 110' could serve as one of an inlet port or outlet port of the heat exchanger as desired and the other conduit 111 could serve as the other of the outlet port and inlet port for the end cap 116'.
  • the end cap Provided in the end cap are one or more baffles 118'. It should be apparent that in the embodiment of FIGURES 6B, the baffles are not equally located so that the several pads 119 illustrated are of different sizes.
  • FIGURE 6C yet another end cap 116" is there illustrated.
  • this end cap there are provided several baffles 118'.
  • the end cap 116' can be positioned on the opposite end of the tube or conduit to which an end cap similar to the one shown in FIGURE 6B, i.e., having both an inlet conduit and an outlet conduit, is mounted.
  • the end cap 116 is used to manifold the ends of the heat exchanger and is designed in such a way so as to permit changing the flow of fluid through the heat exchanger by the design of the manifold. This could be achieved either by machining, molding or through adding baffles, such as at 118, to the inside of the cap 116 prior to final assembly of the manifold. This allows the heat exchanger to operate at maximum efficiency based upon the specific application.
  • the heat exchanger can, thus, comprise a plurality or multiple of parallel fluid flow paths.
  • the fluid flow paths form a radial array.
  • all of the fluid flow paths could be allowed to flow in parallel to minimize pressure drop.
  • the several fluid paths could be operated in series in order to insure adequate fluid velocity through each tube and thus maintain good heat transfer.
  • the fluid flow could be similarly divided into two, three, four, six or more parallel paths which are "tuned" to the specific application.
  • a heat exchanger 120 which includes a conduit 122. Extending axially in the conduit is a central passageway 126. Extending radially around the central passageway 126 is a plurality of peripheral flow passageways 128. In this embodiment, the central passageway 126 is generally circular in cross section, whereas the peripheral passageways or paths 128 are generally hexagonal in cross section. It should be appreciated that the passageways in numerous embodiments can in cross section be circular, elliptical or polygonal as desired or required for a particular application. Similarly, a cross section of the conduit itself can be circular, elliptical or polygonal, not only in this embodiment, but in numerous embodiments. Located on an outer periphery 132 of the conduit are a plurality of heating elements 136.
  • a heat exchanger 140 which comprises a conduit 142. Extending axially through the conduit is a central passageway 146. Located radially around the central passageway 146 are a plurality of flow paths 148. In this embodiment, eight such elliptical or oval (in cross section) flow paths are provided. Of course, any desired number can be provided. However, the central passageway can be circular in cross section if so desired. Located on an outer periphery 152 of the conduit 142 is a heating element 156. In this embodiment, the heating element comprises an electrical resistance heating wire.
  • one or more of the flow paths 148 can be lined with a chemically resistive layer 158 such as, for example, a layer of a fluoropolymer which can resist the highly corrosive fluids that are meant to be heated or cooled in the conduit.
  • a chemically resistive layer 158 such as, for example, a layer of a fluoropolymer which can resist the highly corrosive fluids that are meant to be heated or cooled in the conduit.
  • Such layers or coatings can be applied via deposition of the coating onto the walls of the passageway.
  • the coating material in addition to being resistant to a range of corrosive fluids, also not be electrically conductive and be a relatively efficient conductor of heat.
  • Polytetrafluoroethylene (PTFE) and certain ceramic materials, such as alumina would be suitable for this purpose.
  • the coating material can be electrically conductive in order to provide a ground plane.
  • a carbon based material which is also chemically resistive would be suitable for this purpose.
  • an electrical resistance heating wire can be employed as the heating element 156, another type of heating element that could be employed would be a printed resistance heater which is directly applied or bonded to the outer surface or periphery 152 of the conduit 142.
  • FIGURES 7 and 8 Located in the central passageways 126 and 146 in at least one of the embodiments shown in FIGURES 7 and 8 can be a cartridge style heater 159 (FIGURE 8) as is known in the art. Therefore, in the embodiments of FIGURES 7 and 8, heat transfer is provided both by the outer heating elements 136 and 156 and by the centrally located heater cartridge. In this way, the fluid passing through the peripheral flow passages 128 and 148 is heated both from the radially inner side of the flow passages 128 and 148 and from the radially outer side thereof.
  • the heat exchanger includes a conduit 162 which is provided with a central passageway 166 and a plurality of radially arrayed passageways 168 surrounding the central passageway.
  • both the central passageway and the peripheral passageways are circular in cross section.
  • a heat exchanger 180 which comprises a conduit 182 that is provided with a central passageway 186 and four radially arrayed or peripherally located passageways 188.
  • the central passageway 186 is circular in cross section
  • the peripheral passageways 188 are oval or elliptical in cross section.
  • a heat exchanger 190 as shown in FIGURE 11 , which comprises a conduit 192 that is provided with a plurality of spaced passageways 194.
  • a unitary one-piece conduit or tube which does not have a central passageway, but rather has a plurality of equally sized, or unequally sized, passages or passageways of any desired particular cross section for use as a heat exchanger for process fluids flowing through the conduit.
  • a heat exchanger 200 comprises a conduit 202 in which are defined spaced first and second passageways 206 and 208.
  • the passageways can extend from a first end 230 of the conduit 202 to a second end 232 of the conduit.
  • the passageways are of generally the same size and shape, although other configurations are also contemplated.
  • the two passageways 206 and 208 are separated from each other by a wall 210.
  • the wall 210 extends along a longitudinal axis of the conduit 202 from the first end of the conduit to a second end thereof.
  • each of the passageways 206 and 208 includes a peripheral wall which is defined by a set of spaced ribs 214 and grooves 216. It is believed that the provision of such ribs and grooves will improve heat transfer from a heater member 240 to a fluid (again, that fluid can be a liquid or a gas) flowing through the passageways 206 and 208.
  • the heater member 240 can be a resistance heating element or a printed heater that is directly applied or bonded to an outer surface 242 of the conduit 202.
  • the heat exchanger embodiment of FIGURES 12 and 13 may be particularly advantageous for heat transfer to one or more gases flowing through the passageways 206 and 208. Of course, more than two passageways or passages can be provided if so desired.
  • a point of dispense heat exchanger 300 comprises a unitary one-piece conduit or tube 302. Defined in the conduit is a central passageway 310 and positioned radially outwardly therefrom are a plurality of spaced fluid paths 312.
  • the central passageway 310 can be hexagonal in cross section, whereas the several fluid paths 312 can be teardrop-shaped or egg-shaped or elliptical with their smaller radius ends pointing towards the central passageway and their larger radius ends pointing towards an outer periphery 314 of the conduit 302.
  • each of the several fluid paths 312 are slots 320 which extend inwardly from the periphery 314 towards the central passageway 310, but stop short of the central passageway. Positioned in these slots can be heating elements such as PTC heaters or chips 330. For each of these heater elements, a first face 332 is located adjacent a first one of the fluid paths 312, whereas a second face 334 is located adjacent a second one of the fluid paths 312. In this way, both of the heat conducting faces of each of the heater elements 330 are located adjacent one of the fluid paths 312. It can be seen that each of the fluid paths 312 is thus heated from both sides by a respective heater element face.
  • heating elements such as PTC heaters or chips 330.
  • Electrodes 340 and 342 Electrically contacting the respective faces 332 and 334 of the PTC chips 330 are a pair of electrodes 340 and 342.
  • the electrodes are illustrated as being somewhat corrugated in an end view. However, the electrodes could take different shapes if so desired.
  • the electrodes can be of any desired length.
  • positioned between the electrodes and the PTC heaters or chips 330 can be a known electrically conductive and stress relieving interface pad, film or coating (not illustrated) for contacting the opposed faces 332 and 334 of each PTC element.
  • such interface pads can be constructed of a graphite film or compound which would provide good electrical and heat transfer from the PTC elements when they are energized, both to the electrodes and to the adjacent walls of the conduit or tube 302. In that way, the heat from the PTC elements or chips can be transmitted via conduction through the walls surrounding the several fluid paths 312 to a fluid flowing through the fluid paths and perhaps also a fluid flowing through the central passageway 310, if so desired.
  • the several fluid paths 312 are located radially outwardly of the central passageway or bore 310 and there is no fluid communication between the central passageway 310 and the several fluid paths 312. Moreover, the several fluid paths 312 also do not communicate with each other. Rather, all of these extend generally parallel to each other and parallel to the central fluid path 310 and extend along an axis of the conduit 302 from a first end thereof to a second end thereof. Thus, a fluid flowing in the several fluid paths 312 does not mix with a fluid flowing in any of the other fluid paths, nor with a potential fluid flowing through the central passageway 310.
  • the central passageway can be employed to house a heater cartridge, if desired. Alternatively, the central passageway can be employed to conduct either a heating fluid or a cooling fluid as may be desired or required for a particular fluid processing technique.
  • the singular or unitary or one-piece conduit or tube 302 serves as the interface between fluid paths and heating or cooling sources.
  • the conduit can be configured to accommodate a broad range of fluids for a variety of applications.
  • the conduit can be made from a range of materials that can be selected in order to provide optimum heat transfer and chemical compatibility.
  • the nozzle 400 includes a first conduit section 402, a second conduit section 404, that can be disposed at a right angle to the first conduit section, and a tip section 406.
  • Any of the various heat transfer or thermal transfer assemblies illustrated in the several embodiments of the instant disclosure can be located in such nozzle 400.
  • the location can be as at 410 in the first conduit section 402.
  • the location can be as at 420 in the second conduit section 404.
  • the conventional fluid recirculation loop is eliminated by placing the process fluid heat exchanger as close to the processing fluid nozzle tip 406 as possible. This creates a point of dispense heat exchanger and allows the processing fluid to remain at ambient temperatures while it is conducted to the nozzle.
  • the process fluid is only heated or cooled at the nozzle, near the tip 406, as required for the processing temperature needed for that fluid directly at the point where the semiconductor wafer is processed.
  • Such a construction serves to minimize the foot print of the processing fluid handling and preprocessing preparation section of the plumbing area of the semiconductor tool.
  • the processing fluid is, thus, no longer subjected to the same types of temperature losses as currently occurs when the fluid transfers from a heated tank of the fluid to the processing area.
  • the amount of processing fluids can be reduced with the heat exchanger assembly illustrated herein and, hence, the cost of employing such processing fluids can also be reduced. It is also potentially possible to increase the yield of each semiconductor manufacturing tool by installing the heat exchanger inside the nozzle, as better control of the temperature of the processing fluid can be obtained. With better temperature control, identical etch rates can be obtained across an entire semiconductor wafer even if multiple nozzles are used.
  • multiple nozzles can be employed simultaneously to dispense one or more types of processing fluids at different temperatures across the width of a wafer so that the yield from a wafer can be increased. Even the periphery of the wafer can be subjected to the same etch rates as is the center of the wafer.
  • a heat exchanger material which is compatible with nearly all semiconductor wet processing fluids is single crystal aluminum oxide or sapphire.
  • sapphire has very good thermal transfer properties, but only in the direction of the crystal. This is optimum for constructing a fluid containment device allowing very low mass and directional heat transfer.
  • Creating a flow path through the sapphire with a plurality of conduits having oval or elliptical or other cross sectional shapes allows for a maximum heat transfer area and figure of merit by sizing the oval, elliptical or other shapes of the cross sections of the conduits based upon desired flow rate, temperature rise and viscosity.
  • conduit materials including various metals such as stainless steel or titanium, a vitreous carbon material or quartz could also be used.
  • a vitreous carbon material or quartz could also be used.
  • Each of these materials would allow for a lower cost alternative to sapphire. But, such alternative materials may not be useable for all of the types of processing fluids required in semiconductor wafer processing.
  • the several embodiments of configurable flow paths discussed above, however, would allow these other materials to be used in many process applications, particularly if one or more flow paths are coated with a layer of a fluoropolymer or other chemically inert material.
  • the elongated one-piece unitary conduit body can be made of or grown as a single crystal
  • there are other potential ways of manufacturing such a unitary one-piece tubular fluid conduit For example, one could manufacture such a tubular fluid conduit by employing newly developed 3D printers which are capable of using several of the materials mentioned herein.
  • additive manufacturing or 3D printing and manufacturing may be employed advantageously to produce or create such unitary one-piece tubular fluid conduits having more than one fluid passage therein.
  • inline heat exchangers described herein are discussed in the context of heaters for semiconductor wafer processing, the heat exchangers clearly have a multitude of other uses in that they can be used for heating or cooling of various types of fluids, both liquid and gas, in a variety of other environments as well.
  • a one-piece or unitary heat exchanger comprising a conduit including at least two spaced passageways.
  • the at least two passageways extend generally parallel to each other in the conduit. They extend axially from a first end of the conduit to a second end of the conduit and do not communicate with each other.
  • a heat transfer element which thermally contacts a surface of the conduit.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Instantaneous Water Boilers, Portable Hot-Water Supply Apparatuses, And Control Of Portable Hot-Water Supply Apparatuses (AREA)

Abstract

L'invention concerne un échangeur de chaleur (10, 30, 50, 70, 90, 120, 140, 160, 180, 190, 200, 300) pour fluides, comprenant un conduit allongé (12, 32, 52, 72, 92, 122, 142, 162, 182, 192, 202, 302). Au moins deux passages de fluide espacés (18, 38, 58, 78, 98, 128, 148, 168, 188, 194, 206, 208, 312) sont délimités dans le conduit et s'étendent longitudinalement à travers le conduit, d'une première extrémité du conduit à une seconde extrémité du conduit. Un élément de transfert de chaleur (26, 46, 66, 136, 159, 240, 330) entre en contact thermique avec une face du conduit afin de transférer de la chaleur vers un fluide s'écoulant à travers lesdits passages espacés ou à partir de ce dernier. Le conduit peut être monobloc et d'une seule pièce. Selon un mode de réalisation, le conduit peut être un cristal unique. L'échangeur de chaleur est conçu pour être installé dans une buse (400) d'un distributeur de fluides tel que celles utilisées pour la fabrication de semi-conducteurs.
PCT/US2017/031916 2016-05-10 2017-05-10 Échangeur de chaleur de point de distribution pour fluides WO2017196952A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662334082P 2016-05-10 2016-05-10
US62/334,082 2016-05-10

Publications (1)

Publication Number Publication Date
WO2017196952A1 true WO2017196952A1 (fr) 2017-11-16

Family

ID=58765925

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2017/031916 WO2017196952A1 (fr) 2016-05-10 2017-05-10 Échangeur de chaleur de point de distribution pour fluides

Country Status (2)

Country Link
US (1) US20170328651A1 (fr)
WO (1) WO2017196952A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018181981A1 (fr) * 2017-03-30 2018-10-04 京セラ株式会社 Élément de saphir tubulaire, échangeur de chaleur, dispositif de fabrication de semi-conducteurs et procédé destiné à fabriquer un élément de saphir tubulaire
WO2019161657A1 (fr) * 2018-02-23 2019-08-29 江苏宝得换热设备股份有限公司 Distributeur de fluide à bloc et son procédé de fabrication
US10562021B2 (en) 2015-03-19 2020-02-18 Beckman Coulter, Inc. Dispenser for an analyzer
EP3855105A1 (fr) * 2020-01-24 2021-07-28 Hamilton Sundstrand Corporation Agencement de collecteur pour échangeur de chaleur fabriqué de manière additive
US11441850B2 (en) 2020-01-24 2022-09-13 Hamilton Sundstrand Corporation Integral mounting arm for heat exchanger
US11453160B2 (en) 2020-01-24 2022-09-27 Hamilton Sundstrand Corporation Method of building a heat exchanger
US11703283B2 (en) 2020-01-24 2023-07-18 Hamilton Sundstrand Corporation Radial configuration for heat exchanger core

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013020469A1 (de) * 2013-12-06 2015-06-11 Webasto SE Wärmeübertrager und Verfahren zum Herstellen eines Wärmeübertragers
AU2017321896A1 (en) * 2016-09-01 2019-04-18 Additive Rocket Corporation Structural heat exchanger
PL3622226T3 (pl) * 2017-05-10 2022-03-07 Gea Food Solutions Weert B.V. Ulepszone środki grzejne dla owijarki przepływowej
US11236866B2 (en) 2018-09-03 2022-02-01 Te-Ming Chiang Liquid transfer apparatus
US11035593B2 (en) * 2018-09-07 2021-06-15 Robert Louis Sparks Vertical heat exchanger for a geothermal heating and cooling system and method of use
MX2021002908A (es) * 2018-09-11 2021-07-16 Eng Profiles Llc Calibrador para una maquina de extrusion con canales de enfriamiento y vacio mejorados.
JP7034047B2 (ja) * 2018-10-11 2022-03-11 日本碍子株式会社 車室暖房用ヒーターエレメント及びその使用方法、並びに車室暖房用ヒーター
US11628653B2 (en) 2019-03-27 2023-04-18 Engineered Profiles LLC Thermally stable multilayer polymer extrusion
GB202003712D0 (en) * 2020-03-13 2020-04-29 Ikm Testing Uk Ltd Heat exchange apparatus, system and method for pipes
US11828490B2 (en) * 2020-04-24 2023-11-28 Lexmark International, Inc. Ceramic heater for heating water in an appliance
WO2022026477A1 (fr) 2020-07-29 2022-02-03 Tom Richards, Inc. Élément chauffant en ligne
KR20230089605A (ko) * 2021-12-13 2023-06-21 삼성전자주식회사 열 교환기 및 이를 포함하는 열 교환 시스템

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5575067A (en) * 1995-02-02 1996-11-19 Hexcel Corporation Method of making a continuous ceramic fiber reinforced heat exchanger tube
DE202010006739U1 (de) * 2010-05-12 2010-08-19 Türk & Hillinger GmbH Durchlauferhitzer
EP2410813A1 (fr) * 2010-07-19 2012-01-25 BSH Bosch und Siemens Hausgeräte GmbH Radiateur électrique et chauffe-eau instantané
EP2693152A1 (fr) * 2012-08-03 2014-02-05 Tom Richards, Inc. Échangeur de chaleur ultra-pure en ligne

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5575067A (en) * 1995-02-02 1996-11-19 Hexcel Corporation Method of making a continuous ceramic fiber reinforced heat exchanger tube
DE202010006739U1 (de) * 2010-05-12 2010-08-19 Türk & Hillinger GmbH Durchlauferhitzer
EP2410813A1 (fr) * 2010-07-19 2012-01-25 BSH Bosch und Siemens Hausgeräte GmbH Radiateur électrique et chauffe-eau instantané
EP2693152A1 (fr) * 2012-08-03 2014-02-05 Tom Richards, Inc. Échangeur de chaleur ultra-pure en ligne

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10562021B2 (en) 2015-03-19 2020-02-18 Beckman Coulter, Inc. Dispenser for an analyzer
WO2018181981A1 (fr) * 2017-03-30 2018-10-04 京セラ株式会社 Élément de saphir tubulaire, échangeur de chaleur, dispositif de fabrication de semi-conducteurs et procédé destiné à fabriquer un élément de saphir tubulaire
CN110475915A (zh) * 2017-03-30 2019-11-19 京瓷株式会社 管状蓝宝石构件、热交换器、半导体制造装置及管状蓝宝石构件的制造方法
JPWO2018181981A1 (ja) * 2017-03-30 2020-04-23 京セラ株式会社 管状サファイア部材、熱交換器、半導体製造装置および管状サファイア部材の製造方法
CN110475915B (zh) * 2017-03-30 2021-11-02 京瓷株式会社 管状蓝宝石构件、热交换器、半导体制造装置及管状蓝宝石构件的制造方法
WO2019161657A1 (fr) * 2018-02-23 2019-08-29 江苏宝得换热设备股份有限公司 Distributeur de fluide à bloc et son procédé de fabrication
EP3855105A1 (fr) * 2020-01-24 2021-07-28 Hamilton Sundstrand Corporation Agencement de collecteur pour échangeur de chaleur fabriqué de manière additive
US11441850B2 (en) 2020-01-24 2022-09-13 Hamilton Sundstrand Corporation Integral mounting arm for heat exchanger
US11453160B2 (en) 2020-01-24 2022-09-27 Hamilton Sundstrand Corporation Method of building a heat exchanger
US11460252B2 (en) 2020-01-24 2022-10-04 Hamilton Sundstrand Corporation Header arrangement for additively manufactured heat exchanger
US11703283B2 (en) 2020-01-24 2023-07-18 Hamilton Sundstrand Corporation Radial configuration for heat exchanger core
US11752691B2 (en) 2020-01-24 2023-09-12 Hamilton Sundstrand Corporation Method of building a heat exchanger

Also Published As

Publication number Publication date
US20170328651A1 (en) 2017-11-16

Similar Documents

Publication Publication Date Title
US20170328651A1 (en) Point of dispense heat exchanger for fluids
US6804965B2 (en) Heat exchanger for high purity and corrosive fluids
US7106957B2 (en) Heat exchanger for high purity fluid handling systems
JP4195392B2 (ja) 毛管蒸発器
KR102100785B1 (ko) 고효율 열교환기 및 고효율 열교환 방법
KR102094009B1 (ko) 반도체 제조를 위한 약액의 온도제어장치
WO2008097557A2 (fr) Échangeur à eau à base de carbone avec échangeur thermique relié pour refroidir des dispositifs électroniques
WO1997020179A1 (fr) Systeme de regulation multi-temperature du type a dispersion et dispositif de regulation de temperature de fluide applicable a ce systeme
CN215176154U (zh) 半导体制造用化学药液的温度控制装置
US20160276197A1 (en) Gas flow for condensation reduction with a substrate processing chuck
US7015437B2 (en) Method device for heating fluids
EP3193127A1 (fr) Relâchement de la contrainte thermique de échangeurs de chaleur
CN220503194U (zh) 控温装置及半导体设备
KR101212575B1 (ko) 반도체 제조를 위한 유체가열용 인라인히터유닛
JP2001082828A (ja) 熱交換器および熱媒供給システム
KR101254531B1 (ko) 반도체 제조를 위한 유체가열용 인라인히터유닛
KR101605082B1 (ko) 유체 온도 조절장치
US20080013930A1 (en) Fluid heating apparatus and fluid treatment apparatus using the same
US20020101891A1 (en) Optical device module using integral heat transfer module
WO2004021392A1 (fr) Coiffe d'extremite d'un tube a gaz destinee a un generateur de plasma micro-ondes
CN220552095U (zh) 一种去离子水加热器
KR101590009B1 (ko) 화학 용액 가열용 금속 바디 인라인 히터
JP2010073826A (ja) 処理液供給装置
JPH1167718A (ja) 半導体処理液用冷却加熱装置
JP3041410U (ja) 熱交換システム

Legal Events

Date Code Title Description
NENP Non-entry into the national phase

Ref country code: DE

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17725407

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 17725407

Country of ref document: EP

Kind code of ref document: A1