WO2008097557A2 - Échangeur à eau à base de carbone avec échangeur thermique relié pour refroidir des dispositifs électroniques - Google Patents
Échangeur à eau à base de carbone avec échangeur thermique relié pour refroidir des dispositifs électroniques Download PDFInfo
- Publication number
- WO2008097557A2 WO2008097557A2 PCT/US2008/001540 US2008001540W WO2008097557A2 WO 2008097557 A2 WO2008097557 A2 WO 2008097557A2 US 2008001540 W US2008001540 W US 2008001540W WO 2008097557 A2 WO2008097557 A2 WO 2008097557A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- coolant
- heat transfer
- cooling block
- carbon
- combination
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2210/00—Heat exchange conduits
- F28F2210/02—Heat exchange conduits with particular branching, e.g. fractal conduit arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
L'invention concerne un bloc de refroidissement par liquide constitué essentiellement de carbone, destiné à être utilisé avec des dispositifs électriques produisant de la chaleur, comprenant en combinaison; le bloc de refroidissement contient des grains dans une orientation sensiblement perpendiculaire à la surface de transfert thermique entre le bloc de refroidissement et le dispositif électrique; une chambre ayant une paroi inférieure ayant des saillies prismatiques pour augmenter la surface; l'agent refroidissant est injecté au centre de la chambre de refroidissement et se déplace de manière centrifuge vers les canaux de sortie du bloc en relation de transfert thermique avec les saillies; et dans lequel le bloc de refroidissement communique avec un dispositif de refroidissement recevant du produit de refroidissement provenant des canaux de sortie du bloc de refroidissement liquide.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US90011107P | 2007-02-08 | 2007-02-08 | |
US60/900,111 | 2007-02-08 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2008097557A2 true WO2008097557A2 (fr) | 2008-08-14 |
WO2008097557A3 WO2008097557A3 (fr) | 2008-11-06 |
WO2008097557B1 WO2008097557B1 (fr) | 2008-12-18 |
Family
ID=39682309
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2008/001540 WO2008097557A2 (fr) | 2007-02-08 | 2008-02-06 | Échangeur à eau à base de carbone avec échangeur thermique relié pour refroidir des dispositifs électroniques |
Country Status (2)
Country | Link |
---|---|
US (1) | US8528628B2 (fr) |
WO (1) | WO2008097557A2 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2357428A1 (fr) * | 2009-05-04 | 2011-08-17 | LG Electronics Inc. | Systeme de climatiseur |
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US8561673B2 (en) * | 2006-09-26 | 2013-10-22 | Olantra Fund X L.L.C. | Sealed self-contained fluidic cooling device |
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US20110186267A1 (en) * | 2010-02-01 | 2011-08-04 | Suna Display Co. | Heat transfer device with anisotropic thermal conducting micro structures |
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US20150168086A1 (en) * | 2013-12-16 | 2015-06-18 | KULR Technology Corporation | Carbon Fiber Heat Exchangers |
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US9953899B2 (en) | 2015-09-30 | 2018-04-24 | Microfabrica Inc. | Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems |
CN105263301B (zh) * | 2015-11-12 | 2017-12-19 | 深圳市研派科技有限公司 | 一种液冷散热系统及其液体散热排 |
US10096537B1 (en) | 2015-12-31 | 2018-10-09 | Microfabrica Inc. | Thermal management systems, methods for making, and methods for using |
US20190041104A1 (en) * | 2017-08-07 | 2019-02-07 | Asia Vital Components Co., Ltd. | Heat exchange structure of heat dissipation device |
CN109890171A (zh) * | 2017-12-06 | 2019-06-14 | 泽鸿(广州)电子科技有限公司 | 液冷式散热模块 |
US11255534B2 (en) * | 2018-10-03 | 2022-02-22 | Coretronic Corporation | Thermal module and projector |
US11280550B2 (en) * | 2019-03-08 | 2022-03-22 | Hamilton Sundstrand Corporation | Radially layered helical core geometry for heat exchanger |
US11274886B2 (en) | 2019-03-08 | 2022-03-15 | Hamilton Sundstrand Corporation | Heat exchanger header with fractal geometry |
US11359864B2 (en) | 2019-03-08 | 2022-06-14 | Hamilton Sundstrand Corporation | Rectangular helical core geometry for heat exchanger |
US11121058B2 (en) | 2019-07-24 | 2021-09-14 | Aptiv Technologies Limited | Liquid cooled module with device heat spreader |
US11268770B2 (en) * | 2019-09-06 | 2022-03-08 | Hamilton Sunstrand Corporation | Heat exchanger with radially converging manifold |
US11751365B2 (en) * | 2019-10-29 | 2023-09-05 | Alliance For Sustainable Energy, Llc | Jet impingement manifolds for cooling power electronics modules |
KR20220001196A (ko) * | 2020-06-29 | 2022-01-05 | 에스케이하이닉스 주식회사 | 액체 냉각 구조체 및 이를 구비하는 액체 냉각 시스템 |
US11209222B1 (en) | 2020-08-20 | 2021-12-28 | Hamilton Sundstrand Corporation | Spiral heat exchanger header |
US11382205B2 (en) | 2020-09-16 | 2022-07-05 | Aptiv Technologies Limited | Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly |
CN113873849B (zh) * | 2021-10-12 | 2022-10-11 | 西北工业大学 | 一种自适应调节半浸没式液冷散热腔体、循环系统及应用 |
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- 2008-02-05 US US12/012,654 patent/US8528628B2/en active Active
- 2008-02-06 WO PCT/US2008/001540 patent/WO2008097557A2/fr active Application Filing
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2357428A1 (fr) * | 2009-05-04 | 2011-08-17 | LG Electronics Inc. | Systeme de climatiseur |
EP2357428A4 (fr) * | 2009-05-04 | 2014-10-22 | Lg Electronics Inc | Systeme de climatiseur |
US9080795B2 (en) | 2009-05-04 | 2015-07-14 | Lg Electronics Inc. | Air conditioning system |
Also Published As
Publication number | Publication date |
---|---|
US20080190586A1 (en) | 2008-08-14 |
US8528628B2 (en) | 2013-09-10 |
WO2008097557A3 (fr) | 2008-11-06 |
WO2008097557B1 (fr) | 2008-12-18 |
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