WO2017185769A1 - 像素阵列及其制造方法和有机发光二极管阵列基板 - Google Patents

像素阵列及其制造方法和有机发光二极管阵列基板 Download PDF

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Publication number
WO2017185769A1
WO2017185769A1 PCT/CN2016/110728 CN2016110728W WO2017185769A1 WO 2017185769 A1 WO2017185769 A1 WO 2017185769A1 CN 2016110728 W CN2016110728 W CN 2016110728W WO 2017185769 A1 WO2017185769 A1 WO 2017185769A1
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Prior art keywords
pixel
sub
pixels
color
same
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PCT/CN2016/110728
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English (en)
French (fr)
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杜小波
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京东方科技集团股份有限公司
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Priority to EP16871783.3A priority Critical patent/EP3451382B1/en
Priority to US15/534,727 priority patent/US10411075B2/en
Publication of WO2017185769A1 publication Critical patent/WO2017185769A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/351—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels comprising more than three subpixels, e.g. red-green-blue-white [RGBW]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0439—Pixel structures
    • G09G2300/0452—Details of colour pixel setup, e.g. pixel composed of a red, a blue and two green components
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a pixel array, a method of fabricating the same, and an organic light emitting diode array substrate.
  • the light emitting structure of an Organic Light-Emitting Diode (OLED) device includes a pair of electrodes and an organic light emitting layer.
  • OLED Organic Light-Emitting Diode
  • a DC voltage When a DC voltage is applied, holes are injected from the anode into the organic light-emitting layer, electrons are injected into the organic light-emitting layer from the cathode, and electrons and holes combine to emit energy in the light-emitting layer, exciting the molecules of the organic light-emitting material to form excited molecules, and when the excited molecules are returned When it reaches the ground state, it emits photons and emits light.
  • the OLED evaporation technique is to form an organic light-emitting device by evaporating the organic light-emitting material and passing through a high-precision metal foil (FMM) on the position of the corresponding pixel on the array substrate.
  • FMM high-precision metal foil
  • Each pixel (pixel) contains red, green, and blue (R, G, B) sub-pixels, each of which has a quadrangular shape, and each sub-pixel has an independent organic light-emitting device.
  • the opening area of the reticle has a lower specification limit, and in order to avoid the influence of the tolerance during the manufacturing process, a sufficient gap needs to be reserved between the openings of the adjacent pixels, so that the pixel density cannot be greatly improved.
  • sub-pixels of different colors are made of different reticle, and the arrangement density cannot be increased, so the resolution cannot be improved.
  • the evaporation has a "shadow effect", there is a certain interval between the two light-emitting areas to prevent color mixing, so the Mask opening cannot be made small.
  • a first aspect of the present disclosure provides a pixel array including a plurality of pixels, wherein each pixel includes four sub-pixels having the same size and shape as an isosceles trapezoid, and the four sub-pixels are Arranged in the form of a half of a regular hexagon.
  • a second aspect of the present disclosure provides an organic light emitting diode array substrate including an organic light emitting layer.
  • the organic light emitting layer has the above pixel array.
  • a third aspect of the present disclosure provides a method of fabricating the above pixel array, comprising fabricating four seed pixel patterns using the same reticle, wherein colors of at least three of the four seed pixel patterns are different from each other.
  • FIG. 1 schematically illustrates a pixel array in accordance with an embodiment of the present disclosure
  • Figure 2 is a schematic enlarged view of a portion of the pixel array of Figure 1;
  • Figure 3 schematically shows two pixels in the pixel array of Figure 1;
  • FIG. 4 is a partial enlarged view of the pixel array of FIG. 1;
  • FIG. 5 schematically illustrates a reticle in accordance with an embodiment of the present disclosure
  • FIG. 6 schematically illustrates a red sub-pixel pattern in accordance with an embodiment of the present disclosure
  • FIG. 7 schematically illustrates a green sub-pixel pattern in accordance with an embodiment of the present disclosure
  • FIG. 10 schematically shows a flow chart of a method of fabricating a pixel array of an embodiment of the present disclosure.
  • An embodiment of the present disclosure provides a pixel array, as shown in FIG. 1, including a plurality of pixels, for example, including a first pixel P1, a second pixel P2, a third pixel P3, a fourth pixel P4, .
  • Each pixel includes four sub-pixels.
  • the first pixel P1 includes sub-pixels R11 (red), G11 (green), B11 (blue), and B12 (blue)
  • the second pixel P2 includes sub-pixels R21 (red), G21 (green), and B21 (blue).
  • the third pixel P3 includes sub-pixels R31 (red), G31 (green), B31 (blue), B32 (blue), and the fourth pixel P4 includes sub-pixels R41 (red), G41 (green), B41 (blue), B42 (blue).
  • the four sub-pixels in each pixel are the same size and are all isosceles trapezoids, and the four sub-pixels are arranged in the form of a half of a regular hexagon.
  • the four sub-pixels G11, R11, B11, and B12 have the same size and the same shape and are isosceles trapezoids, and the four sub-pixels G11, R11, B11, and B12 are arranged in a half-square. Form of form.
  • the second pixel P2, the third pixel P3, and the fourth pixel P4 also have a configuration similar to that of the first pixel P1.
  • the first pixel P1 composed of four sub-pixels G11, R11, B11, and B12 is not a strict half regular hexagon due to the left gap at the boundary of adjacent sub-pixels, but the field The skilled person will understand that this gap is omitted in this paper in order to simplify the description.
  • the colors of at least three of the four sub-pixels are different from each other.
  • the sub-pixels R11, G11, and B11 have three different colors of red, green, and blue, respectively, and the colors of B12 and B11 are the same. Since the efficiency of blue light is low, the aperture area of the blue pixel is larger than the aperture area of the red (or green) pixel.
  • the positions of the four sub-pixels R11, G11, B11, and B12 can be adjusted, for example, the positions of the sub-pixel B11 and the sub-pixel G11 are interchanged, and the positions of R11 and B12 are interchanged.
  • the four sub-pixels may also be red (R), green (G), blue (B), and white (W) pixels, and the arrangement of the sub-pixels of the four colors may be 1 is the same or different, for example, the sub-pixel B11 is red Sub-pixel replacement, sub-pixel G11 is replaced by blue sub-pixel, sub-pixel R11 is replaced by white sub-pixel, and sub-pixel B12 is replaced by green sub-pixel.
  • a regular hexagon is formed by two pixels adjacent in the same row or column.
  • the shapes of the two pixels are complementary.
  • the adjacent first pixel P1 and second pixel P2 on the same column constitute a regular hexagon H1.
  • the first pixel P1 and the third pixel P3 adjacent to each other on the same line can also be formed into a regular hexagon H1. That is to say, after the first pixel P1 is rotated by 180 degrees, it may coincide with the second pixel P2 or the third pixel P3.
  • the six sub-pixels G11, B11, B12, G21, B21, and B22 are adjacent to each other to form a hexagonal ring, and the lower bottom side of each sub-pixel serves as one of the sides of the hexagon.
  • the bottom two sides of the remaining two sub-pixels R11 and R21 are arranged in a hexagonal ring in a relatively opposite manner, that is, a central portion of the hexagon, forming a small hexagon H2.
  • each pixel is composed of a first sub-pixel, a second sub-pixel, a third sub-pixel, and a fourth sub-pixel, wherein the first sub-pixel and the second sub-pixel are disposed to be opposite to the
  • the horizontal centerline of the pixel is mirror symmetrical
  • the third and fourth subpixels are arranged to be mirror symmetrical with respect to a vertical centerline of the pixel.
  • the sub-pixel G11 and the sub-pixel R11 are disposed to be mirror-symmetrical with respect to a horizontal center line X1 of the first pixel P1
  • the sub-pixel B11 and the sub-pixel B12 are disposed to be opposite to each other.
  • the vertical center line Y of the first pixel P1 is mirror-symmetrical. Further, the first pixel P1 and the second pixel P2 adjacent to each other on the same column are disposed to be mirror-symmetrical with respect to the horizontal center line X2 of the regular hexagon.
  • two sub-pixels adjacent in the vertical direction and having the same color to each other constitute a regular hexagon.
  • the red sub-pixel R11 of the first pixel P1 and the red sub-pixel R21 of the second pixel P2 are adjacent to each other and constitute one Regular hexagon H2.
  • the green sub-pixel G31 of the third pixel P3 and the green sub-pixel G41 of the fourth pixel P4 are adjacent to each other and constitute a regular hexagon H2.
  • Two sub-pixels having an angle of 45 or 135 in the oblique direction and having the same color to each other constitute a regular hexagon.
  • the blue sub-pixel B12 and the blue sub-negative are adjacent in the oblique direction at an angle of 45° with respect to the horizontal direction.
  • the pixel B31 constitutes a regular hexagon H2.
  • the blue sub-pixel B22 and the blue sub-pixel B42 adjacent to each other in the oblique direction at an angle of 135° with respect to the horizontal direction constitute a regular hexagon H2.
  • a plurality of pixels having the above-described half regular hexagon shape are sequentially arranged in the horizontal direction and the vertical direction, so that the pixels of the entire display screen have high rotational symmetry, and Higher resolution and uniformity are achieved in each direction of the display.
  • An embodiment of the present disclosure further provides an organic light emitting diode array substrate including an organic light emitting layer, wherein the organic light emitting layer has the pixel array described in the above embodiments.
  • Embodiments of the present disclosure also provide a method of fabricating a pixel array, comprising fabricating at least three sub-pixel patterns different in color from each other using the same reticle.
  • the reticle includes a plurality of openings arranged in an array, the plurality of openings being the same size and being hexagonal in shape.
  • the reticle 1 includes a plurality of openings 10a, 10b, 10c, 10d of the same size, and each of the openings has a regular hexagonal shape.
  • the reticle can be made of a metal material.
  • the spacing between any adjacent two openings 10a, 10b in the same column is S, and the spacing S is the vertical distance from the bottom edge of the opening 10a to the top edge of the opening 10b.
  • the spacing S is equal to the width W of the regular hexagon.
  • the width W is also the vertical distance from the top edge of the opening 10a to the bottom edge.
  • the openings in adjacent columns are arranged offset from one another.
  • the opening 10a and the opening 10b in the left column of Fig. 5 are arranged offset from the opening 10c and the opening 10d in the right column.
  • the above manufacturing method includes:
  • the red sub-pixel patterns R11, R21, R31, R41, ... in FIG. 1 are fabricated on the substrate using the reticle 1 of FIG.
  • the reticle 1 is placed over the substrate, and then the red color film material is evaporated, and the evaporated red color film material is deposited on the substrate through a plurality of openings, thereby forming a red sub-pixel pattern as shown in FIG.
  • the pixel pattern includes a plurality of red regular hexagons, wherein the sub-pixels R11 and R21 in FIG. 1 are formed by one opening, the sub-pixel R41 and the red sub-pixel below it are formed through one opening, and the other red sub-pixels are derived by analogy.
  • step S2 The mask of step S1 is translated in the vertical direction by a distance of one opening width to produce a sub-pixel pattern having the second color.
  • the green sub-pixel patterns G11, G21, G31, G41, ... in FIG. 1 are continuously formed on the same substrate using the reticle 1.
  • the reticle 1 is translated downward by a distance W in the vertical direction, and then the green color film material is evaporated, and the evaporated green color film material is deposited on the substrate through a plurality of openings, thereby forming the structure of FIG.
  • the green sub-pixel pattern includes a plurality of green regular hexagons, wherein the sub-pixel G21 in FIG.
  • the green sub-pixels above thereof are formed by one opening, and the sub-pixel G21 and the green sub-pixel below thereof Formed by one opening, the sub-pixel G31 and the sub-pixel G41 are formed by one opening, and the other green sub-pixels are similarly pushed.
  • the green sub-pixel pattern and the red sub-pixel pattern are arranged offset from each other.
  • step S3 The mask of step S2 is translated by an angle of an opening width at an angle of 45 degrees from the horizontal direction to produce a sub-pixel pattern having a third color.
  • the blue sub-pixel patterns B21, B22, B42, B41, ... in FIG. 1 are continuously formed on the substrate using the reticle 1.
  • the reticle 1 is translated by a distance W at an angle of 45 degrees from the horizontal direction, and then the blue color film material is evaporated, and the evaporated blue color film material is deposited on the substrate through a plurality of openings.
  • the blue sub-pixel pattern comprising a plurality of blue regular hexagons, wherein the sub-pixel B21 in FIG. 1 and the blue sub-pixel on the left side thereof are formed through an opening,
  • the pixel B22 and the sub-pixel B42 are formed by one opening, and the sub-pixel B41 and the blue sub-pixel to the right thereof are formed through one opening.
  • step S4 The mask of step S3 is translated in the vertical direction by a distance of one opening width to produce a sub-pixel pattern having a fourth color.
  • the fourth color may be the same as or different from the third color.
  • the blue sub-pixel patterns B11, B12, B31, B32, ... in FIG. 1 are continuously formed on the substrate using the reticle 1.
  • the reticle 1 is translated upward by a distance W in the vertical direction, and then the blue color film material is evaporated, and the evaporated blue color film material is deposited on the substrate through a plurality of openings, thereby forming the same as shown in FIG. a blue sub-pixel pattern in which the sub-pixel B11 in FIG.
  • the blue sub-pixel pattern, the green sub-pixel pattern, and the red sub-pixel pattern are formed on the substrate without overlapping each other.
  • the opening surface of the reticle can be increased Product, improve display resolution. Moreover, since the different color sub-pixels have the same size, the same reticle can be used for preparation, which reduces the difficulty of reticle fabrication and the difficulty of evaporation.
  • the stable configuration of the regular hexagon can also increase the strength of the reticle, making it less susceptible to deformation and improving product yield. In addition, due to the higher rotational symmetry of the pixels, higher resolution can be obtained in each direction of the display.

Abstract

一种像素阵列及其制造方法和有机发光二极管阵列基板。该像素阵列包括多个像素(P1)，其中，每个像素(P1)包括四个子像素(R11、G11、B11、B12)，所述四个子像素的大小彼此相同并且形状均为等腰梯形，所述四个子像素被排布成正六边形的一半的形式。具有以上结构的显示屏具有较高的旋转对称性，而且在显示屏的每个方向上都可以获得较高的分辨率和均一度。

Description

像素阵列及其制造方法和有机发光二极管阵列基板 技术领域
本公开涉及显示技术领域，尤其涉及一种像素阵列及其制造方法和有机发光二极管阵列基板。
背景技术
有机发光二极管(Organic Light-Emitting Diode，即OLED)器件的发光结构包括一对电极以及有机发光层。当施加直流电压时，空穴从阳极注入有机发光层，电子从阴极注入有机发光层，电子和空穴在发光层中结合放出能量，激发有机发光材料分子形成激发态分子，当激发态分子回到基态时，便会放出光子而发光。
OLED显示屏的制作方法有许多种，其中OLED蒸镀技术是通过将有机发光材料蒸发并且透过高精度金属掩模版(Fine Metal Mask，FMM)在阵列基板上对应像素的位置形成有机发光器件。每个像素(pixel)包含有红，绿，蓝(R，G，B)子像素，每个子像素呈四边形，每个子像素都具有独立的有机发光器件。
由于掩模版的开口面积有规格下限，以及为了避免制作过程中的公差(tolerance)影响，相邻像素的开口之间需要预留足够的间隙(gap)而导致像素密度无法大幅提升。而且，不同颜色的子像素由不同的掩模版制成，其排布密度不能提高，因此分辨率也无法提高。而且，由于蒸镀有“阴影效应”，两个发光区之间还要有一定的间隔以防止混色，因此Mask开口不能做的很小。
发明内容
本公开第一方面提供了一种像素阵列，包括多个像素，其中，每个像素包括四个子像素，所述四个子像素的大小彼此相同并且形状均为等腰梯形，所述四个子像素被排布成正六边形的一半的形式。
本公开第二方面提供了一种有机发光二极管阵列基板，包括有机发光层， 其中有机发光层具有上述像素阵列。
本公开第三方面提供了一种制造上述像素阵列的方法，包括采用同一个掩模版制作四种子像素图案，所述四种子像素图案中至少三种子像素图案的颜色彼此不同。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1示意性示出了根据本公开实施例的像素阵列；
图2示意性示出了图1的像素阵列的局部放大图；
图3示意性示出了图1的像素阵列中的两个像素；
图4示意性示出了图1的像素阵列的局部放大图；
图5示意性示出了根据本公开实施例的掩模版；
图6示意性示出了根据本公开实施例的红色子像素图案；
图7示意性示出了根据本公开实施例的绿色子像素图案；
图8和图9示意性示出了根据本公开实施例的蓝色子像素图案；
图10示意性示出了本公开实施例的像素阵列的制造方法的流程图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另作定义，此处使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开专利申请说明书以及权利要求书中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”或者“一”等类似词语也不表示数量限制，而是表示存在至少一个。“包括”或者“包含”等类 似的词语意指出现在“包括”或者“包含”前面的元件或者物件涵盖出现在“包括”或者“包含”后面列举的元件或者物件及其等同，并不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则所述相对位置关系也可能相应地改变。
本公开实施例提供了一种像素阵列，如图1所示，包括多个像素，例如包括第一像素P1、第二像素P2、第三像素P3、第四像素P4……。每个像素包括四个子像素。例如第一像素P1包括子像素R11(红)、G11(绿)、B11(蓝)、B12(蓝)，第二像素P2包括子像素R21(红)、G21(绿)、B21(蓝)、B22(蓝)，第三像素P3包括子像素R31(红)、G31(绿)、B31(蓝)、B32(蓝)，第四像素P4包括子像素R41(红)、G41(绿)、B41(蓝)、B42(蓝)。每个像素中的四个子像素的大小彼此相同并且形状均为等腰梯形，四个子像素排布成正六边形的一半的形式。例如第一像素P1中，四个子像素G11、R11、B11、B12的大小彼此相同，形状也彼此相同且为等腰梯形，四个子像素G11、R11、B11、B12被排布成半个正六边形的形式。同理，第二像素P2、第三像素P3和第四像素P4也具有与第一像素P1相似的构型。需要说明的是，实际应用中，由于相邻子像素的边界处留有空隙，由四个子像素G11、R11、B11、B12构成的第一像素P1不是严格的半个正六边形，然而本领域技术人员可以理解，为了简化描述，本文将此空隙忽略。
本公开至少一些实施例中，四个子像素中至少三个子像素的颜色彼此不同。例如，第一像素P1中，子像素R11、G11、B11分别具有红、绿、蓝三种不同颜色，B12与B11的颜色相同。由于蓝光的效率较低，因此蓝色像素的开口面积比红(或绿)像素的开口面积大些。可以理解的是，可以对四个子像素R11、G11、B11、B12的位置进行调整，例如，把子像素B11与子像素G11的位置互换，把R11和B12的位置互换。出于示意性目的，图1只列出了其中一种，其他排布方式将不再详细列举。本公开至少一些实施例中，四个子像素还可以分别是红(R),绿(G),蓝(B),白(W)像素，这四种颜色的子像素的排布方式可以与图1相同或不同，例如，子像素B11由红色 子像素替代，子像素G11由蓝色子像素替代，子像素R11由白色子像素替代，子像素B12由绿色子像素替代。
本公开至少一些实施例中，由同一行或同一列上相邻的两个像素组成一正六边形。换言之，两个像素的形状互补。如图2和图3所示，例如，同一列上相邻的第一像素P1和第二像素P2组成一正六边形H1。同一行上相邻的第一像素P1和第三像素P3同样可拼成一正六边形H1。也就是说，第一像素P1旋转180度后与可以与第二像素P2或第三像素P3重合。因此，正六边形的边长实质上等于任一等腰梯形子像素的下底边的长度，即L＝a2。正六边形的对角线的长度实质上等于等腰梯形下底边的长度与两倍于等腰梯形腰的长的和，即D＝a2+2b。
如图2所示，六个子像素G11、B11、B12、G21、B21、B22彼此相邻围成一六边形环，每个子像素的下底边作为六边形的其中一个边。其余两个子像素R11、R21以下底边相对地方式排布在六边形环内，即六边形的中央区域，构成一正小六边形H2。在一个示例中，等腰梯形的腰长等于上底边的长度，即b＝a1。
本公开至少一些实施例中，每个像素由第一子像素、第二子像素、第三子像素和第四子像素构成，其中，第一子像素和第二子像素设置为以相对于该像素的水平中心线镜面对称，第三子像素和第四子像素设置为以相对于该像素的竖直中心线镜面对称。例如，如图3所示，第一像素P1中，子像素G11和子像素R11设置为以相对于该第一像素P1的水平中心线X1呈镜面对称，子像素B11和子像素B12设置为以相对于该第一像素P1的竖直中心线Y呈镜面对称。进一步地，在同一列上相邻的第一像素P1、第二像素P2设置为以相对于正六边形的水平中心线X2呈镜面对称。
本公开至少一些实施例中，同一列上相邻的两个像素中，沿竖直方向相邻的、且彼此具有相同颜色的两个子像素构成一正六边形。例如，如图2所示，同一列上相邻的第一像素P1、第二像素P2中，第一像素P1的红色子像素R11与第二像素P2的红色子像素R21彼此相邻且构成一正六边形H2。同样，同一列上相邻的第三像素P3、第四像素P4中，第三像素P3的绿色子像素G31与第四像素P4的绿色子像素G41彼此相邻且构成一正六边形H2。
本公开至少一些实施例中，同一行上相邻的两个像素中，沿与水平方向 夹角为45°或135°的斜向方向相邻的、且彼此具有相同颜色的两个子像素构成一正六边形。例如，如图4所示，同一行上相邻的第一像素P1、第三像素P3中，沿与水平方向夹角为45°的斜向方向相邻的蓝色子像素B12与蓝色子像素B31构成一正六边形H2。同一行上相邻的第二像素P2、第四像素P4中，沿与水平方向夹角为135°的斜向方向相邻的蓝色子像素B22与蓝色子像素B42构成一正六边形H2。
本公开上述实施例的像素阵列中，具有以上半个正六边形形状的多个像素在水平方向和竖直方向上依次排列，使整个显示屏的像素都具有较高的旋转对称性，而且在显示屏的每个方向上都可以获得较高的分辨率和均一度。
本公开实施例还提供了一种有机发光二极管阵列基板，包括有机发光层，其中有机发光层具有上述实施例所述的像素阵列。
本公开实施例还提供了一种像素阵列的制造方法，包括采用同一个掩模版制作至少三种彼此颜色不同的子像素图案。
本公开至少一些实施例中，掩模版包括排布为阵列形式的多个开口，该多个开口的大小彼此相同并且形状均为正六边形。例如，如图5，掩模版1包括大小相同的多个开口10a、10b、10c、10d，且每个开口的形状均为正六边形。掩模版可以由金属材料制成。至少一些实施例中，同一列上任意相邻的两个开口10a、10b之间的间距为S，间距S也就是开口10a的底边到开口10b的顶边的垂直距离。例如，间距S等于正六边形的宽度W。宽度W也就是开口10a的顶边到底边的垂直距离。本公开至少一些实施例中，相邻两列上的开口彼此错位排布。例如，图5左列中的开口10a和开口10b与右列中的开口10c和开口10d错位排布。
如图10所示，本公开至少一些实施例中，上述制造方法包括：
S1：利用掩模版制作具有第一颜色的子像素图案；
在一个示例中，利用图5的掩模版1在基板上制作图1中的红色子像素图案R11、R21、R31、R41……。例如，将掩模版1放置在基板上方，然后蒸发红色彩膜材料，被蒸发的红色彩膜材料透过多个开口沉积到基板上，从而形成图6所示的红色子像素图案，该红色子像素图案包括多个红色正六边形，其中图1中的子像素R11和R21通过一个开口形成，子像素R41和其下方的红色子像素通过一个开口形成，其他红色子像素以此类推。
S2：将步骤S1的掩模版沿竖直方向平移一个开口宽度的距离，制作具有第二颜色的子像素图案。
在一个示例中，继续利用掩模版1在同一基板上制作图1中的绿色子像素图案G11、G21、G31、G41……。例如，完成步骤S1后，将掩模版1沿竖直方向向下平移距离W，然后蒸发绿色彩膜材料，被蒸发的绿色彩膜材料透过多个开口沉积到基板上，从而形成图7所示的绿色子像素图案，该绿色子像素图案包括多个绿色正六边形，其中图1中的子像素G21和其上方的绿色子像素通过一个开口形成，子像素G21和其下方的绿色子像素通过一个开口形成，子像素G31和子像素G41通过一个开口形成，其他绿色子像素以此类推。绿色子像素图案与红色子像素图案彼此错位排列。
S3：将步骤S2的掩模版沿与水平方向夹角为45度的角度平移一个开口宽度的距离，制作具有第三颜色的子像素图案。
在一个示例中，继续利用掩模版1在基板上制作图1中的蓝色子像素图案B21、B22、B42、B41……。例如，完成步骤S2后，将掩模版1沿与水平方向夹角为45度的角度平移距离W，然后蒸发蓝色彩膜材料，被蒸发的蓝色彩膜材料透过多个开口沉积到基板上，从而形成图8所示的蓝色子像素图案，该蓝色子像素图案包括多个蓝色正六边形，其中图1中的子像素B21和其左边的蓝色子像素通过一个开口形成，子像素B22和子像素B42通过一个开口形成，子像素B41和其右边的蓝色子像素通过一个开口形成。
S4：将步骤S3的掩模版沿竖直方向平移一个开口宽度的距离，制作具有第四颜色的子像素图案。
该第四颜色可以与第三颜色相同或者不同。在一个示例中，继续利用掩模版1在基板上制作图1中的蓝色子像素图案B11、B12、B31、B32……。例如，完成步骤S3后，将掩模版1沿竖直方向向上平移距离W，然后蒸发蓝色彩膜材料，被蒸发的蓝色彩膜材料透过多个开口沉积到基板上，从而形成图9所示的蓝色子像素图案，其中图1中的子像素B11和其右边的蓝色子像素通过一个开口形成，子像素B12和子像素B31通过一个开口形成，子像素B32和其右边的蓝色子像素通过一个开口形成。最终，蓝色子像素图案、绿色子像素图案和红色子像素图案彼此不重叠地形成在基板上。
由于相邻像素的子像素共用掩模版的一个开口，可增加掩模版的开口面 积，提高显示分辨率。而且，由于不同颜色子像素的大小相同，可以使用同一张掩模版进行制备，降低掩模版制作难度和蒸镀难度。正六边形的稳定构型也可以增加掩模版的强度，使其不易变形，提高产品良率。此外，由于像素较高的旋转对称性，在显示器的每个方向上都可以获得较高的分辨率。
以上所述仅是本公开的示范性实施方式，而非用于限制本公开的保护范围，本公开的保护范围由所附的权利要求确定。
本申请基于并且要求于2016年4月29日递交的中国专利申请第201610284035.1号的优先权，在此全文引用上述中国专利申请公开的内容。

Claims (15)

  1. 一种像素阵列，包括多个像素，其中，每个像素包括四个子像素，所述四个子像素的大小彼此相同并且形状均为等腰梯形，所述四个子像素被排布成正六边形的一半的形式。
  2. 根据权利要求1所述的像素阵列，其中所述四个子像素中至少三个子像素的颜色彼此不同。
  3. 根据权利要求2所述的像素阵列，其中所述正六边形的边长等于所述等腰梯形的下底边的长度。
  4. 根据权利要求3所述的像素阵列，其中每个像素由第一子像素、第二子像素、第三子像素和第四子像素构成，其中，第一子像素和第二子像素设置为以相对于该像素的水平中心线镜面对称，第三子像素和第四子像素设置为以相对于该像素的竖直中心线镜面对称。
  5. 根据权利要求4所述的像素阵列，其中所述第一子像素、第二子像素和第三子像素的颜色彼此不同，所述第三子像素和第四子像素的颜色相同。
  6. 根据权利要求4所述的像素阵列，其中所述第一子像素、第二子像素、第三子像素和第四子像素的颜色彼此均不同。
  7. 根据权利要求3所述的像素阵列，其中同一列上相邻的两个像素中，沿竖直方向上相邻的且彼此具有相同颜色的两个子像素构成一正六边形。
  8. 根据权利要求3所述的像素阵列，其中同一行上相邻的两个像素中，沿与水平方向呈45°或135°的斜向方向上相邻的且彼此具有相同颜色的两个子像素构成一正六边形。
  9. 一种有机发光二极管阵列基板，包括有机发光层，其中有机发光层具有权利要求1至8任一项所述的像素阵列。
  10. 一种制造权利要求1所述的像素阵列的方法，包括采用同一个掩模版制作四种子像素图案，所述四种子像素图案中至少三种子像素图案的颜色彼此不同。
  11. 根据权利要求10所述的方法，包括：
    利用所述掩模版制作具有第一颜色的子像素图案；
    将所述掩模版沿竖直方向平移一个开口宽度的距离，制作具有第二颜色 的子像素图案；
    将所述掩模版沿与水平方向夹角为45度的角度平移一个开口宽度的距离，制作具有第三颜色的子像素图案；
    将所述掩模版沿竖直方向平移一个开口宽度的距离，制作具有第四颜色的子像素图案。
  12. 根据权利要求10或11所述的方法，其中所述掩模版包括排布为阵列形式的多个开口，所述多个开口的大小彼此相同并且形状均为所述正六边形。
  13. 根据权利要求12所述的方法，其中在同一列上的多个开口以相同的间距排布，所述间距为所述正六边形的宽度。
  14. 根据权利要求12所述的方法，其中相邻两列上的开口彼此错位排布。
  15. 根据权利要求12所述的方法，其中所述第三颜色和第四颜色的颜色相同。
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