WO2017183310A1 - Adhesive-film-integrated pressure-sensitive adhesive tape and process for producing semiconductor chip - Google Patents

Adhesive-film-integrated pressure-sensitive adhesive tape and process for producing semiconductor chip Download PDF

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Publication number
WO2017183310A1
WO2017183310A1 PCT/JP2017/007735 JP2017007735W WO2017183310A1 WO 2017183310 A1 WO2017183310 A1 WO 2017183310A1 JP 2017007735 W JP2017007735 W JP 2017007735W WO 2017183310 A1 WO2017183310 A1 WO 2017183310A1
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Prior art keywords
film
adhesive tape
pressure
adhesive
sensitive adhesive
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Application number
PCT/JP2017/007735
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French (fr)
Japanese (ja)
Inventor
齊藤　岳史
雄紀 柴山
智章 田中
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デンカ株式会社
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Priority to JP2018512813A priority Critical patent/JP6917362B2/en
Publication of WO2017183310A1 publication Critical patent/WO2017183310A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

Definitions

  • the present invention relates to an adhesive film-integrated pressure-sensitive adhesive tape and a method for producing a semiconductor chip.
  • an electronic component As a method of manufacturing an electronic component, after forming a plurality of circuit patterns on a wafer or an insulating substrate to form an electronic component assembly, the electronic component assembly is processed into a chip, the chip is picked up, and the bottom surface of the chip is A method is known in which an adhesive is applied, a chip is fixed to a lead frame or the like with an adhesive, and the chip is sealed with a resin or the like to form an electronic component.
  • the circuit pattern of the electronic component assembly is attached to an adhesive tape, the back surface of the circuit pattern is thinly polished (back grind), the adhesive tape is peeled off, and then the circuit A method is known in which an adhesive tape is bonded to the pattern surface, and further fixed to a ring frame, then cut and separated (diced) into individual chips, and the chips are stacked and fixed using an adhesive.
  • a method using an adhesive film-integrated adhesive tape in which an adhesive film and an adhesive tape are laminated has been proposed (see Patent Documents 1 to 4, etc.). *
  • the adhesive film integrated adhesive tape can be used for the production of electronic components, thereby eliminating the back grinding and adhesive application steps after dicing.
  • the adhesive film-integrated adhesive tape in which the adhesive film and the adhesive tape are integrated is superior in controlling the thickness of the adhesive portion and suppressing the protrusion of the adhesive as compared with a method using an adhesive.
  • the adhesive film-integrated pressure-sensitive adhesive tape is used for manufacturing electronic components such as a chip size package, a stack package, a system-in-package, and a TSV (Through Silicon Via).
  • TSV Thinit Silicon Via
  • the adhesive film-integrated pressure-sensitive adhesive tape has insufficient followability to bumps on the circuit pattern surface of the wafer, and adhesion failure is a problem.
  • the adhesive force between the adhesive film and the adhesive tape is low, the adhesiveness between the adhesive film and the adhesive film is poor, so that the adhesive film peels off during the operation, and when the adhesive force is strong, there is a case where defective peeling occurs.
  • the present invention has been made in view of the above circumstances, and has an adhesive film-integrated pressure-sensitive adhesive tape that has good followability to a wafer having bumps and has both adhesiveness and peelability of the adhesive film and the pressure-sensitive adhesive tape, and the same.
  • An object is to provide a method for manufacturing a semiconductor chip.
  • the present invention employs the following means in order to solve the above problems.
  • the pressure-sensitive adhesive layer is a (meth) acrylate copolymer (A ) 100 parts by weight and polyfunctional isocyanate curing agent (B) 1 part by weight or more and 10 parts by weight or less
  • Adhesive film-integrated pressure-sensitive adhesive in which the (meth) acrylic acid ester copolymer (A) contains 70% by mass to 98% by mass of n-butyl (meth) acrylate and has a weight average molecular weight of 1,200,000 to 2,200,000.
  • the thickness of the base film is 60 ⁇ m or more and 120 ⁇ m or less, the thickness of the pressure-sensitive adhesive layer is 15 ⁇ m or more and 40 ⁇ m or less, and the thickness of the pressure-sensitive adhesive layer is 0.00 with respect to the thickness of the base film.
  • the adhesive film-integrated pressure-sensitive adhesive tape according to (1) which is 2 or more and 0.5 or less.
  • the adhesive film-integrated pressure-sensitive adhesive tape of the present invention has good followability to a wafer having bumps, and achieves both adhesion and peelability between the adhesive film and the pressure-sensitive adhesive tape.
  • a semiconductor chip manufacturing method using the same can be provided.
  • the monomer unit means a structural unit derived from a monomer.
  • the (meth) acryloyl group is a general term for an acryloyl group and a methacryloyl group.
  • a compound containing (meth) such as (meth) acrylic acid is a general term for a compound having “meta” in the name and a compound not having “meta”.
  • the adhesive film-integrated pressure-sensitive adhesive tape according to the present invention has a pressure-sensitive adhesive tape and an adhesive film.
  • each member of the adhesive film-integrated pressure-sensitive adhesive tape will be described.
  • An adhesive tape has a base film and an adhesive layer.
  • the pressure-sensitive adhesive tape is formed by applying a pressure-sensitive adhesive layer on a base film, for example, a method of directly applying a pressure-sensitive adhesive on a base film with a coater such as a gravure coater, comma coater, bar coater, knife coater or roll coater. There is a method in which a pressure-sensitive adhesive is applied to a release film and bonded to a base film after drying.
  • the pressure-sensitive adhesive may be printed on the base film by convex printing, concave printing, flat printing, flexographic printing, offset printing, screen printing, or the like.
  • the thickness of the pressure-sensitive adhesive layer is preferably 0.2 or more and 0.5 or less, and more preferably 0.3 or more and 0.45 or less with respect to the thickness of the base film. If less than 0.2, workability is poor when the adhesive film-integrated adhesive tape is bonded to the wafer, and air bubbles may be mixed. If it is more than 0.5, the adhesive tape has high wettability and adhesion. Sometimes peeling from the film is difficult.
  • the pressure-sensitive adhesive layer of the present invention contains 100 parts by weight of the (meth) acrylic acid ester copolymer (A) and 1 part by weight or more and 10 parts by weight or less of the polyfunctional isocyanate curing agent (B), and the (meth) acrylic acid ester
  • the copolymer (A) contains 70% by mass to 98% by mass of n-butyl (meth) acrylate, and has a weight average molecular weight of 1,200,000 to 2,200,000.
  • ((Meth) acrylic acid ester copolymer (A)) examples include a polymer obtained by polymerizing a monomer that is an acrylic monomer such as methyl (meth) acrylate, a copolymer obtained by polymerizing plural types of monomers, and these monomers. And a copolymer obtained by copolymerizing an unsaturated monomer copolymerizable with (eg, vinyl acetate, styrene, acrylonitrile).
  • acrylic monomer examples include n-butyl (meth) acrylate, 2-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, octyl (meth) acrylate, and 2-ethylhexyl (meth).
  • the acrylic monomer contains 70% by mass or more and 98% by mass or less, and more preferably 80% by mass or more and 96% by mass or less of n-butyl (meth) acrylate, from the viewpoint of adhesion to the adhesive film and releasability.
  • amount is less than 70% by mass, air bubbles may be mixed when bonded to the adhesive film.
  • amount exceeds 98% by mass, the adhesive tape has a high adhesive force and may be difficult to peel from the adhesive film.
  • the acrylic monomer preferably has a monomer containing a functional group at least in part.
  • the monomer containing this functional group includes a functional group such as hydroxyl group, carboxyl group, epoxy group, amide group, amino group, methylol group, sulfonic acid group, sulfamic acid group or (sub) phosphate group.
  • a monomer having one or more types is exemplified. Of these, vinyl compounds having a hydroxyl group are preferred. In addition, the acrylate mentioned later is included in the vinyl compound here.
  • Examples of the functional group-containing monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth) acrylate.
  • Examples of the monomer having a carboxyl group include (meth) acrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, fumaric acid, acrylamide N-glycolic acid, and cinnamic acid.
  • Examples of the monomer having an epoxy group include allyl glycidyl ether and (meth) acrylic acid glycidyl ether.
  • Examples of the monomer having an amide group include (meth) acrylamide.
  • Examples of the monomer having an amino group include N, N-dimethylaminoethyl (meth) acrylate.
  • Examples of the monomer having a methylol group include N-methylol acrylamide.
  • Vinyl monomers other than those described above may be used for the acrylic polymer.
  • the weight average molecular weight of the (meth) acrylic acid ester copolymer (A) is from 1.2 million to 2.2 million, preferably from 1.5 million to 2 million. If it is less than 1,200,000, the adhesive force becomes too strong due to component transfer from the adhesive film, and the adhesive tape and the adhesive film may not be peeled off. If it exceeds 2.2 million, the pressure-sensitive adhesive force is lowered and the adhesive film peels off. There is.
  • the polyfunctional isocyanate curing agent (B) is not particularly limited except that it has two or more isocyanate groups, and examples thereof include aromatic polyisocyanates, aliphatic polyisocyanates, alicyclic polyisocyanates, and adducts thereof. .
  • the aromatic polyisocyanate is not particularly limited, and for example, 1,3-phenylene diisocyanate, 4,4′-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2, , 6-tolylene diisocyanate, 4,4′-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate benzene, dianisidine diisocyanate, 4,4′-diphenyl ether diisocyanate, and 4, 4 ′, 4 ′′ -triphenylmethane triisocyanate and the like.
  • the aliphatic polyisocyanate is not particularly limited.
  • diisocyanate and 2,4,4-trimethylhexamethylene diisocyanate examples thereof include diisocyanate and 2,4,4-trimethylhexamethylene diisocyanate.
  • the alicyclic polyisocyanate is not particularly limited.
  • 1,3-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate and hexamethylene diisocyanate are obtained by reacting with a polyol compound such as trimethylolpropane. It may be an adduct body.
  • the blending ratio of the polyfunctional isocyanate curing agent (B) is preferably 1 to 10 parts by mass with respect to 100 parts by mass of the (meth) acrylic acid ester copolymer (A).
  • curing agents (B) adhesive force is too strong and an adhesive tape and an adhesive film may be unable to peel. If the polyfunctional isocyanate curing agent (B) is excessive, the adhesive strength is reduced, and the adhesive film may be peeled off.
  • a tackifying resin is not particularly limited.
  • the tackifying resin is not particularly limited.
  • the blending amount of the tackifying resin is not particularly limited, and is preferably 200 parts by mass or less, and preferably 30 parts by mass or less with respect to 100 parts by mass of the (meth) acrylic acid ester polymer (A).
  • the thickness of the pressure-sensitive adhesive layer is preferably 15 ⁇ m or more and 40 ⁇ m or less, and more preferably 20 ⁇ m or more and 35 ⁇ m or less. If the thickness is less than 15 ⁇ m, bubbles may be mixed in when the adhesive film-integrated pressure-sensitive adhesive tape is bonded to the wafer. If it is thicker than 40 ⁇ m, the adhesive tape has high wettability (adhesive strength) and is difficult to peel off from the adhesive film. There are cases. ⁇ Base film>
  • the base film various synthetic resin sheets can be used.
  • the material of the base film is not particularly limited, but polyvinyl chloride, polyethylene terephthalate, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, polyethylene, polypropylene, ethylene-acrylic acid copolymer, ionomer resin, etc. Can be mentioned. A mixture of these resins and a multilayer film can also be used for the base film.
  • ionomer resins obtained by crosslinking copolymers having ethylene units, (meth) methacrylic acid units and (meth) acrylic acid alkyl ester units with metal ions such as Na + , K + and Zn 2+ It tends to suppress air bubbles when bonded to a film, and tends to have good adhesion when bonded to a semiconductor wafer, and is preferably used.
  • the molding method of the base film is not particularly limited, and examples thereof include calendar, T-die extrusion, inflation, and casting.
  • the thickness of the base film is preferably 60 ⁇ m or more and 120 ⁇ m or less, and more preferably 70 ⁇ m or more and 120 ⁇ m or less. When the thickness is less than 60 ⁇ m, workability is poor when the adhesive film-integrated pressure-sensitive adhesive tape is bonded to the wafer, and when it is thicker than 120 ⁇ m, bubbles may be mixed when the adhesive film-integrated pressure-sensitive adhesive tape is bonded to the wafer. .
  • an antistatic agent may be applied to one side or both sides of the base film to carry out an antistatic treatment.
  • the adhesive film is not particularly limited, and is, for example, an acrylic, epoxy, polyimide, silicone, phenol, rubber, or a mixture thereof, and includes additives such as a thermal polymerization initiator and a photoinitiator.
  • additives such as a thermal polymerization initiator and a photoinitiator.
  • commercially available NCF (polyimide) Dexerials 3D-IC mounting required film type underfill (epoxy system) and Hitachi Chemical DF-335-7 can be used.
  • the manufacturing method of the electronic component using the adhesive film integrated adhesive tape of this embodiment is not specifically limited, For example, the following procedure is mentioned. (1) In a silicon wafer having a hemispherical bump surface and a flat surface on the other surface, the silicon wafer is placed on a stage heated at 70 ° C. with the surface having the bump up, and bonded to the surface having the bump. Affix the film-integrated adhesive tape. (2) The adhesive tape of the adhesive film integrated adhesive tape is peeled from the adhesive film. (3) A dicing adhesive tape is bonded to the silicon wafer opposite to the surface on which the adhesive film is bonded. (4) A silicon wafer with an adhesive film is diced into semiconductor chips. (5) The semiconductor chip with the adhesive film is peeled off from the dicing adhesive tape and picked up.
  • the adhesive film integrated pressure-sensitive adhesive tape according to Example 1 was prepared and evaluated according to the following formulation. ⁇ Adhesive film integrated adhesive tape ⁇ An adhesive film was laminated on the pressure-sensitive adhesive layer side of the pressure-sensitive adhesive tape at 23 ° C. to obtain an adhesive film-integrated pressure-sensitive adhesive tape.
  • the adhesive tape etc. are as follows. [Adhesive tape] The pressure-sensitive adhesive tape was applied on a PET separator film so that the thickness of the pressure-sensitive adhesive solution after drying was 30 ⁇ m, and after drying, a base film (mainly a Zn salt of an ethylene-methacrylic acid copolymer, with an MFR value of 1.
  • the pressure-sensitive adhesive solution was a (meth) acrylic acid ester copolymer (A) (A-1: a copolymer of 95% by mass of n-butyl acrylate and 5% by mass of 2-hydroxyethyl acrylate, a weight average molecular weight of 1,650,000 (Soken) Chemical, SK Dyne 2147)) 100 parts by mass contains 5 parts by mass of polyfunctional isocyanate curing agent (B) (trimethylolpropane adduct of 2,4-tolylene diisocyanate (Tosoh Corp., Coronate L-45E)) .
  • A-1 a copolymer of 95% by mass of n-butyl acrylate and 5% by mass of 2-hydroxyethyl acrylate, a weight average molecular weight of 1,650,000 (Soken) Chemical, SK Dyne 2147)
  • B polyfunctional isocyanate curing agent
  • the weight average molecular weight of the (meth) acrylic acid ester copolymer (A) was measured by gel permeation chromatography (GPC).
  • Solvent THF
  • As the adhesive film DF-335-7 (thickness 25 ⁇ m) manufactured by Hitachi Chemical was used.
  • Adhesive peelability is obtained by bonding the adhesive film-integrated pressure-sensitive adhesive tape obtained above onto a silicon wafer previously heated to 70 ° C., and at 2 ° C. in an atmosphere at a temperature of 23 ° C. ⁇ 2 ° C. and a humidity of 50 ⁇ 5%. -After one round of crimping, 1 day after crimping, 1.
  • the wafer is placed on a stage heated at 70 ° C. with the bump having the upper surface, and the adhesive film is integrated on the surface having the bump.
  • the pressure-sensitive adhesive tape was bonded with a roller having a cylinder pressure of 0.4 MPa
  • the adhesive film-integrated pressure-sensitive adhesive tape was evaluated as being adhered to a portion that was not a bump. That is, the area (the non-bump part) excluding the bump area (circle) from the area of the wafer having the bumps is defined as 100%, and the ratio of the adhesive film-integrated adhesive tape in contact with the non-bump part is calculated. It was evaluated by.
  • the bumps were hemispherical with a diameter of 20 ⁇ m and a height of 10 ⁇ m, and were evenly arranged at intervals of 100 ⁇ m.
  • ⁇ Excellent: When the bonded area is 95% or more
  • ⁇ Good: When the bonded area is 70 or more and less than 95%
  • ⁇ (Not possible): When the bonded area is less than 70%
  • Tables 1 to 3 summarize the design of the pressure-sensitive adhesive layers of Examples 2 to 15 and Comparative Examples 1 to 8, the thicknesses of the base film and the pressure-sensitive adhesive layer, and the evaluation results.
  • the (meth) acrylic acid ester copolymer (A) and the like are as follows. ((Meth) acrylic acid ester copolymer (A)) The composition is as shown in Table 1, and the model is as follows.
  • Multifunctional isocyanate curing agent (B) A trimethylolpropane adduct of 2,4-tolylene diisocyanate (Tosoh, Coronate L-45E).
  • Base film Mainly composed of Zn salt of ethylene-methacrylic acid copolymer, MFR value 1.5 g / 10 min (JIS K7210, 210 ° C.), melting point 96 ° C. (manufactured by Mitsui DuPont Polychemical Co., Ltd., Himiran 1650).
  • the pressure-sensitive adhesive tape of the present invention suppresses a decrease in the followability of the adhesive film, suppresses a decrease in the adhesion between the pressure-sensitive adhesive tape and the adhesive film, and has good peelability from the adhesive film.
  • the comparative example was defective for the following reason. ⁇ Comparative Examples 1 and 2> Since the content of n-butyl acrylate in the (meth) acrylic acid ester copolymer (A) is low, it is considered that bubbles were mixed when bonded to the adhesive film.
  • the above adhesive film-integrated pressure-sensitive adhesive tape has good followability to a wafer having bumps and achieves both adhesion and peelability between the adhesive film and the pressure-sensitive adhesive tape. Therefore, it is suitably used in a method for manufacturing an electronic component in which chips are stacked and fixed.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The purpose of the present invention is to provide an adhesive-film-integrated pressure-sensitive adhesive tape which has satisfactory conformability to wafers that have bumps and in which the pressure-sensitive adhesive tape combines adhesion to and separability from the adhesive film, and a process for producing semiconductor chips using said pressure-sensitive adhesive tape. The adhesive-film-integrated pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive tape configured of a base film and a pressure-sensitive adhesive layer and further includes an adhesive film laminated to the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer comprises specific components. Thus, an adhesive-film-integrated pressure-sensitive adhesive tape which has satisfactory conformability to wafers that have bumps and in which the pressure-sensitive adhesive tape combines adhesion to and separability from the adhesive film can be provided.

Description

接着フィルム一体型粘着テープ及び半導体チップの製造方法Adhesive film integrated adhesive tape and method for manufacturing semiconductor chip
　本発明は、接着フィルム一体型粘着テープ及び半導体チップの製造方法に関する。 The present invention relates to an adhesive film-integrated pressure-sensitive adhesive tape and a method for producing a semiconductor chip.
　電子部品の製造方法として、ウエハや絶縁物基板上に複数の回路パターンを形成して電子部品集合体とした後、電子部品集合体を加工してチップとし、チップをピックアップし、チップの底面に接着剤を塗布し、チップを接着剤でリードフレーム等に固定し、チップを樹脂等で封止して電子部品とする方法が知られている。 As a method of manufacturing an electronic component, after forming a plurality of circuit patterns on a wafer or an insulating substrate to form an electronic component assembly, the electronic component assembly is processed into a chip, the chip is picked up, and the bottom surface of the chip is A method is known in which an adhesive is applied, a chip is fixed to a lead frame or the like with an adhesive, and the chip is sealed with a resin or the like to form an electronic component.
　電子部品集合体を加工してチップを製造する方法としては、電子部品集合体の回路パターンを粘着テープに貼付け、回路パターンの裏面を薄く研磨（バックグラインド）する工程、粘着テープを剥離後、回路パターン面に粘着テープを貼り合せ、更にリングフレームに固定してから個々のチップに切断分離（ダイシング）し、接着剤を用いてチップを積層固定する方法が知られている。また、接着フィルムと粘着テープを積層した接着フィルム一体型粘着テープを用いる方法が提案されている（特許文献１～４等参照）。　 As a method of manufacturing a chip by processing an electronic component assembly, the circuit pattern of the electronic component assembly is attached to an adhesive tape, the back surface of the circuit pattern is thinly polished (back grind), the adhesive tape is peeled off, and then the circuit A method is known in which an adhesive tape is bonded to the pattern surface, and further fixed to a ring frame, then cut and separated (diced) into individual chips, and the chips are stacked and fixed using an adhesive. In addition, a method using an adhesive film-integrated adhesive tape in which an adhesive film and an adhesive tape are laminated has been proposed (see Patent Documents 1 to 4, etc.). *
　接着フィルム一体型粘着テープを電子部品の製造に用いることにより、バックグラインドやダイシング後の接着剤の塗布工程を省略できる。接着フィルムと粘着テープを一体型にした接着フィルム一体型粘着テープは、接着剤を用いる方法に比べ、接着剤部分の厚み制御や接着剤のはみ出し抑制に優れている。接着フィルム一体型粘着テープは、チップサイズパッケージ、スタックパッケージ、及びシステムインパッケージやＴＳＶ（Ｔｈｒｏｕｇｈ　Ｓｉｌｉｃｏｎ　Ｖｉａ）等の電子部品の製造に利用されている。しかしながら、ＴＳＶの製造に利用される際は、接着フィルム一体型粘着テープがウエハの回路パターン面のバンプへの追従性が不十分であり、密着不良が問題となっている。また、接着フィルムと粘着テープの粘着力が低くなると、接着フィルムとの接着性が悪く作業中に剥離し、粘着力が強いと剥離不良となる場合があった。 The adhesive film integrated adhesive tape can be used for the production of electronic components, thereby eliminating the back grinding and adhesive application steps after dicing. The adhesive film-integrated adhesive tape in which the adhesive film and the adhesive tape are integrated is superior in controlling the thickness of the adhesive portion and suppressing the protrusion of the adhesive as compared with a method using an adhesive. The adhesive film-integrated pressure-sensitive adhesive tape is used for manufacturing electronic components such as a chip size package, a stack package, a system-in-package, and a TSV (Through Silicon Via). However, when used in the manufacture of TSV, the adhesive film-integrated pressure-sensitive adhesive tape has insufficient followability to bumps on the circuit pattern surface of the wafer, and adhesion failure is a problem. Moreover, when the adhesive force between the adhesive film and the adhesive tape is low, the adhesiveness between the adhesive film and the adhesive film is poor, so that the adhesive film peels off during the operation, and when the adhesive force is strong, there is a case where defective peeling occurs.
特開２００４－１８６４２９号公報JP 2004-186429 A 特開２００６－０４９５０９号公報JP 2006-049509 A 特開平０２－２４８０６４号公報Japanese Patent Laid-Open No. 02-248064 特開平０５－２１１２３４号公報JP 05-2111234 A
　本発明は上記事情に鑑みてなされたものであり、バンプを有するウエハへの追従性が良好で、接着フィルムと粘着テープの密着性と剥離性を両立する接着フィルム一体型粘着テープ及びそれ用いた半導体チップの製造方法を提供することを目的とする。 The present invention has been made in view of the above circumstances, and has an adhesive film-integrated pressure-sensitive adhesive tape that has good followability to a wafer having bumps and has both adhesiveness and peelability of the adhesive film and the pressure-sensitive adhesive tape, and the same. An object is to provide a method for manufacturing a semiconductor chip.
　本発明は上記の課題を解決するために、以下の手段を採用する。
（１）基材フィルムと粘着剤層からなる粘着テープの前記粘着剤層に接着フィルムを貼り合せた接着フィルム一体型粘着テープにおいて、前記粘着剤層が（メタ）アクリル酸エステル共重合体（Ａ）１００質量部と多官能イソシアネート硬化剤（Ｂ）１質量部以上１０質量部以下含有し、
前記（メタ）アクリル酸エステル共重合体（Ａ）がｎ－ブチル（メタ）アクリレートを７０質量％以上９８質量％以下含有し、重量平均分子量が１２０万以上２２０万以下である接着フィルム一体型粘着テープ。
（２）前記基材フィルムの厚みが６０μｍ以上１２０μｍ以下であり、前記粘着剤層の厚みが１５μｍ以上４０μｍ以下であり、前記粘着剤層の厚みが、前記基材フィルムの厚みに対して０．２以上０．５以下である（１）に記載の接着フィルム一体型粘着テープ。
（３）（１）又は（２）に記載の接着フィルム一体型粘着テープをシリコンウエハに貼付ける工程、
接着フィルム一体型粘着テープの粘着テープを接着フィルムから剥離する工程、
接着フィルムが貼られている面とは逆面のシリコンウエハにダイシング用粘着テープを貼り合わせる工程、
接着フィルム付きシリコンウエハをダイシングし半導体チップにするダイシング工程、
接着フィルム付き半導体チップを剥離するピックアップ工程を有する半導体チップの製造方法。 The present invention employs the following means in order to solve the above problems.
(1) In an adhesive film-integrated pressure-sensitive adhesive tape in which an adhesive film is bonded to the pressure-sensitive adhesive layer of a pressure-sensitive adhesive tape comprising a base film and a pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer is a (meth) acrylate copolymer (A ) 100 parts by weight and polyfunctional isocyanate curing agent (B) 1 part by weight or more and 10 parts by weight or less,
Adhesive film-integrated pressure-sensitive adhesive in which the (meth) acrylic acid ester copolymer (A) contains 70% by mass to 98% by mass of n-butyl (meth) acrylate and has a weight average molecular weight of 1,200,000 to 2,200,000. tape.
(2) The thickness of the base film is 60 μm or more and 120 μm or less, the thickness of the pressure-sensitive adhesive layer is 15 μm or more and 40 μm or less, and the thickness of the pressure-sensitive adhesive layer is 0.00 with respect to the thickness of the base film. The adhesive film-integrated pressure-sensitive adhesive tape according to (1), which is 2 or more and 0.5 or less.
(3) A process of attaching the adhesive film-integrated pressure-sensitive adhesive tape according to (1) or (2) to a silicon wafer,
A process of peeling the adhesive tape of the adhesive film integrated adhesive tape from the adhesive film;
A process of attaching a dicing adhesive tape to a silicon wafer opposite to the surface on which the adhesive film is applied;
A dicing process for dicing a silicon wafer with an adhesive film into a semiconductor chip;
A method for manufacturing a semiconductor chip, comprising a pick-up step for peeling a semiconductor chip with an adhesive film.
　本発明の接着フィルム一体型粘着テープは、バンプを有するウエハへの追従性が良好で、接着フィルムと粘着テープの密着性と剥離性を両立する。また、それを用いた半導体チップの製造方法を提供できる。 The adhesive film-integrated pressure-sensitive adhesive tape of the present invention has good followability to a wafer having bumps, and achieves both adhesion and peelability between the adhesive film and the pressure-sensitive adhesive tape. In addition, a semiconductor chip manufacturing method using the same can be provided.
　以下、本発明を詳細に説明する。本明細書において、単量体単位とは単量体に由来する構造単位を意味する。本明細書において（メタ）アクリロイル基とはアクリロイル基及びメタアクリロイル基の総称である。（メタ）アクリル酸等の（メタ）を含む化合物等も同様に、名称中に「メタ」を有する化合物と「メタ」を有さない化合物の総称である。 Hereinafter, the present invention will be described in detail. In the present specification, the monomer unit means a structural unit derived from a monomer. In this specification, the (meth) acryloyl group is a general term for an acryloyl group and a methacryloyl group. Similarly, a compound containing (meth) such as (meth) acrylic acid is a general term for a compound having “meta” in the name and a compound not having “meta”.
以下、本発明につき、実施形態を用いてさらに詳細に説明する。
《接着フィルム一体型粘着テープ》
本発明に係る接着フィルム一体型粘着テープは、粘着テープと接着フィルムを有する。以下、接着フィルム一体型粘着テープの各部材について説明する。 Hereinafter, the present invention will be described in more detail using embodiments.
《Adhesive film integrated adhesive tape》
The adhesive film-integrated pressure-sensitive adhesive tape according to the present invention has a pressure-sensitive adhesive tape and an adhesive film. Hereinafter, each member of the adhesive film-integrated pressure-sensitive adhesive tape will be described.
［粘着テープ］
粘着テープは、基材フィルムと粘着剤層を有する。 [Adhesive tape]
An adhesive tape has a base film and an adhesive layer.
　粘着テープは、基材フィルム上に粘着剤層を塗布等してなり、例えばグラビアコーター、コンマコーター、バーコーター、ナイフコーター又はロールコーターといったコーターで基材フィルム上に粘着剤を直接塗布する方法や、剥離フィルムに粘着剤を塗布し、乾燥後に基材フィルムに貼り合わせる方法がある。凸板印刷、凹板印刷、平板印刷、フレキソ印刷、オフセット印刷又はスクリーン印刷等で基材フィルム上に粘着剤を印刷してよい。 The pressure-sensitive adhesive tape is formed by applying a pressure-sensitive adhesive layer on a base film, for example, a method of directly applying a pressure-sensitive adhesive on a base film with a coater such as a gravure coater, comma coater, bar coater, knife coater or roll coater. There is a method in which a pressure-sensitive adhesive is applied to a release film and bonded to a base film after drying. The pressure-sensitive adhesive may be printed on the base film by convex printing, concave printing, flat printing, flexographic printing, offset printing, screen printing, or the like.
粘着剤層の厚みは、基材フィルルムの厚さに対して０．２以上０．５以下であることが好ましく、０．３以上０．４５以下がより好ましい。０．２未満の場合、接着フィルム一体型粘着テープをウエハに貼り合わせる際に作業性が悪く、又気泡が混入する場合があり、０．５より大きい場合、粘着テープの濡れ性が高く、接着フィルムから剥離が困難な場合がある。 The thickness of the pressure-sensitive adhesive layer is preferably 0.2 or more and 0.5 or less, and more preferably 0.3 or more and 0.45 or less with respect to the thickness of the base film. If less than 0.2, workability is poor when the adhesive film-integrated adhesive tape is bonded to the wafer, and air bubbles may be mixed. If it is more than 0.5, the adhesive tape has high wettability and adhesion. Sometimes peeling from the film is difficult.
＜粘着剤層＞
本発明の粘着剤層は、（メタ）アクリル酸エステル共重合体（Ａ）１００質量部と多官能イソシアネート硬化剤（Ｂ）１質量部以上１０質量部以下含有し、前記（メタ）アクリル酸エステル共重合体（Ａ）がｎ－ブチル（メタ）アクリレートを７０質量％以上９８質量％以下含有し、重量平均分子量が１２０万以上２２０万以下である <Adhesive layer>
The pressure-sensitive adhesive layer of the present invention contains 100 parts by weight of the (meth) acrylic acid ester copolymer (A) and 1 part by weight or more and 10 parts by weight or less of the polyfunctional isocyanate curing agent (B), and the (meth) acrylic acid ester The copolymer (A) contains 70% by mass to 98% by mass of n-butyl (meth) acrylate, and has a weight average molecular weight of 1,200,000 to 2,200,000.
（（メタ）アクリル酸エステル共重合体（Ａ））
　（メタ）アクリル酸エステル共重合体（Ａ）としては、メチル（メタ）アクリレート等のアクリルモノマーである単量体を重合させたポリマー、単量体を複数種重合させたコポリマー、これら単量体と共重合可能な不飽和単量体（例えば、酢酸ビニル、スチレン、アクリロニトリル）とを共重合させたコポリマーがある。 ((Meth) acrylic acid ester copolymer (A))
Examples of the (meth) acrylic acid ester copolymer (A) include a polymer obtained by polymerizing a monomer that is an acrylic monomer such as methyl (meth) acrylate, a copolymer obtained by polymerizing plural types of monomers, and these monomers. And a copolymer obtained by copolymerizing an unsaturated monomer copolymerizable with (eg, vinyl acetate, styrene, acrylonitrile).
　このアクリルモノマーとしては、例えば、ｎ－ブチル（メタ）アクリレート、２－ブチル（メタ）アクリレート、ｔ－ブチル（メタ）アクリレート、ペンチル（メタ）アクリレート、オクチル（メタ）アクリレート、２－エチルヘキシル（メタ）アクリレート、ノニル（メタ）アクリレート、デシル（メタ）アクリレート、ラウリル（メタ）アクリレート、メチル（メタ）アクリレート、エチル（メタ）アクリレート、イソプロピル（メタ）アクリレート、トリデシル（メタ）アクリレート、シクロヘキシル（メタ）アクリレート、ベンジル（メタ）アクリレート、２－メトキシエチル等の（メタ）アクリル単量体が挙げられる。 Examples of the acrylic monomer include n-butyl (meth) acrylate, 2-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, octyl (meth) acrylate, and 2-ethylhexyl (meth). Acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, tridecyl (meth) acrylate, cyclohexyl (meth) acrylate, Examples include (meth) acrylic monomers such as benzyl (meth) acrylate and 2-methoxyethyl.
アクリルモノマーは、接着フィルムとの密着性と剥離性の面から、ｎ－ブチル（メタ）アクリレートを７０質量％以上９８質量％以下含有し、８０質量％以上９６質量％以下がより好ましい。７０質量％未満の場合、接着フィルムと貼り合わせた際に気泡が混入する場合があり、９８質量％を超えると、粘着テープの粘着力が高く、接着フィルムから剥離が困難な場合がある。 The acrylic monomer contains 70% by mass or more and 98% by mass or less, and more preferably 80% by mass or more and 96% by mass or less of n-butyl (meth) acrylate, from the viewpoint of adhesion to the adhesive film and releasability. When the amount is less than 70% by mass, air bubbles may be mixed when bonded to the adhesive film. When the amount exceeds 98% by mass, the adhesive tape has a high adhesive force and may be difficult to peel from the adhesive film.
　また、アクリルモノマーは、少なくとも一部に官能基を含有する単量体を有するものが好ましい。この官能基を含有する単量体としては、ヒドロキシル基、カルボキシル基、エポキシ基、アミド基、アミノ基、メチロール基、スルホン酸基、スルファミン酸基又は（亜）リン酸エステル基といった官能基群の１種以上を有する単量体が挙げられる。そして、これらの中でも、好ましくはヒドロキシル基を有するビニル化合物がよい。なお、ここでいうビニル化合物には、後述するアクリレートが含まれるものとする。 The acrylic monomer preferably has a monomer containing a functional group at least in part. The monomer containing this functional group includes a functional group such as hydroxyl group, carboxyl group, epoxy group, amide group, amino group, methylol group, sulfonic acid group, sulfamic acid group or (sub) phosphate group. A monomer having one or more types is exemplified. Of these, vinyl compounds having a hydroxyl group are preferred. In addition, the acrylate mentioned later is included in the vinyl compound here.
　ヒドロキシル基を有する官能基含有単量体としては、例えば２－ヒドロキシエチル（メタ）アクリレート、２－ヒドロキシプロピル（メタ）アクリレート、及び２－ヒドロキシブチル（メタ）アクリレートがある。 Examples of the functional group-containing monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth) acrylate.
　カルボキシル基を有する単量体としては、例えば（メタ）アクリル酸、クロトン酸、マレイン酸、無水マレイン酸、イタコン酸、フマール酸、アクリルアミドＮ－グリコール酸、及びケイ皮酸等が挙げられる。 Examples of the monomer having a carboxyl group include (meth) acrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, fumaric acid, acrylamide N-glycolic acid, and cinnamic acid.
　エポキシ基を有する単量体としては、例えばアリルグリシジルエーテル、及び（メタ）アクリル酸グリシジルエーテル等が挙げられる。 Examples of the monomer having an epoxy group include allyl glycidyl ether and (meth) acrylic acid glycidyl ether.
　アミド基を有する単量体としては、例えば（メタ）アクリルアミド等が挙げられる。 Examples of the monomer having an amide group include (meth) acrylamide.
　アミノ基を有する単量体としては、例えばＮ，Ｎ－ジメチルアミノエチル（メタ）アクリレート等が挙げられる。 Examples of the monomer having an amino group include N, N-dimethylaminoethyl (meth) acrylate.
　メチロール基を有する単量体としては、例えばＮ－メチロールアクリルアミド等が挙げられる。 Examples of the monomer having a methylol group include N-methylol acrylamide.
　アクリル重合体には、上記以外のビニル単量体を用いてもよく、例えばエチレン、スチレン、ビニルトルエン、酢酸アリル、プロピオン酸ビニル、酪酸ビニル、バーサテイク酸ビニル、ビニルエチルエーテル、ビニルプロピルエーテル、（メタ）アクリロニトリル、及びビニルイソブチルエーテル等のビニル化合物等が挙げられる。 Vinyl monomers other than those described above may be used for the acrylic polymer. For example, ethylene, styrene, vinyl toluene, allyl acetate, vinyl propionate, vinyl butyrate, vinyl versatate, vinyl ethyl ether, vinyl propyl ether, ( And vinyl compounds such as (meth) acrylonitrile and vinyl isobutyl ether.
　（メタ）アクリル酸エステル共重合体（Ａ）の重量平均分子量は、１２０万以上２２０万以下であり、１５０万以上２００万以下が好ましい。１２０万未満の場合、接着フィルムからの成分移行により粘着力が強くなりすぎて粘着テープと接着フィルムが剥離できない場合があり、２２０万を超えると、粘着力が低下し、接着フィルムが剥離する場合がある。 The weight average molecular weight of the (meth) acrylic acid ester copolymer (A) is from 1.2 million to 2.2 million, preferably from 1.5 million to 2 million. If it is less than 1,200,000, the adhesive force becomes too strong due to component transfer from the adhesive film, and the adhesive tape and the adhesive film may not be peeled off. If it exceeds 2.2 million, the pressure-sensitive adhesive force is lowered and the adhesive film peels off. There is.
（多官能イソシアネート硬化剤（Ｂ））
　多官能イソシアネート硬化剤（Ｂ）はイソシアネート基を２個以上有する点以外に特に限定されず、例えば芳香族ポリイソシアネート、脂肪族ポリイソシアネート、脂環族ポリイソシアネート、およびそれらのアダクト体等が挙げられる。 (Multifunctional isocyanate curing agent (B))
The polyfunctional isocyanate curing agent (B) is not particularly limited except that it has two or more isocyanate groups, and examples thereof include aromatic polyisocyanates, aliphatic polyisocyanates, alicyclic polyisocyanates, and adducts thereof. .
　芳香族ポリイソシアネートは特に限定されず、例えば１，３－フェニレンジイソシアネート、４，４'－ジフェニルジイソシアネート、１，４－フェニレンジイソシアネート、４，４'－ジフェニルメタンジイソシアネート、２，４－トリレンジイソシアネート、２，６－トリレンジイソシアネート、４，４'－トルイジンジイソシアネート、２，４，６－トリイソシアネートトルエン、１，３，５－トリイソシアネートベンゼン、ジアニシジンジイソシアネート、４，４'－ジフェニルエーテルジイソシアネート、及び４，４'，４"－トリフェニルメタントリイソシアネート等が挙げられる。 The aromatic polyisocyanate is not particularly limited, and for example, 1,3-phenylene diisocyanate, 4,4′-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2, , 6-tolylene diisocyanate, 4,4′-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate benzene, dianisidine diisocyanate, 4,4′-diphenyl ether diisocyanate, and 4, 4 ′, 4 ″ -triphenylmethane triisocyanate and the like.
　脂肪族ポリイソシアネートは特に限定されず、例えばトリメチレンジイソシアネート、テトラメチレンジイソシアネート、ヘキサメチレンジイソシアネート、ペンタメチレンジイソシアネート、１，２－プロピレンジイソシアネート、２，３－ブチレンジイソシアネート、１，３－ブチレンジイソシアネート、ドデカメチレンジイソシアネート、及び２，４，４－トリメチルヘキサメチレンジイソシアネート等が挙げられる。 The aliphatic polyisocyanate is not particularly limited. For example, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, dodecamethylene Examples thereof include diisocyanate and 2,4,4-trimethylhexamethylene diisocyanate.
　脂環族ポリイソシアネートは特に限定されず、例えば３－イソシアネートメチル－３，５，５－トリメチルシクロヘキシルイソシアネート、１，３－シクロペンタンジイソシアネート、１，３－シクロヘキサンジイソシアネート、１，４－シクロヘキサンジイソシアネート、メチル－２，４－シクロヘキサンジイソシアネート、メチル－２，６－シクロヘキサンジイソシアネート、４，４'－メチレンビス（シクロヘキシルイソシアネート）、及び１，４－ビス（イソシアネートメチル）シクロヘキサン等が挙げられる。 The alicyclic polyisocyanate is not particularly limited. For example, 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate, 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, methyl -2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 4,4'-methylenebis (cyclohexyl isocyanate), 1,4-bis (isocyanatomethyl) cyclohexane and the like.
　ポリイソシアネートのうち、入手が容易な１，３－フェニレンジイソシアネート、２，４－トリレンジイソシアネート、２，６－トリレンジイソシアネート及びヘキサメチレンジイソシアネートにトリメチロールプロパン等のポリオール化合物とを反応させて得られるアダクト体であってもよい。 Of polyisocyanates, easily obtained 1,3-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate and hexamethylene diisocyanate are obtained by reacting with a polyol compound such as trimethylolpropane. It may be an adduct body.
多官能イソシアネート硬化剤（Ｂ）の配合比は（メタ）アクリル酸エステル共重合体（Ａ）１００質量部に対して１～１０質量部が好ましい。多官能イソシアネート硬化剤（Ｂ）が少ないと粘着力が強すぎて粘着テープと接着フィルムが剥離できない場合がある。多官能イソシアネート硬化剤（Ｂ）が過剰であると粘着力が低下し、接着フィルムが剥離する場合がある。 The blending ratio of the polyfunctional isocyanate curing agent (B) is preferably 1 to 10 parts by mass with respect to 100 parts by mass of the (meth) acrylic acid ester copolymer (A). When there are few polyfunctional isocyanate hardening | curing agents (B), adhesive force is too strong and an adhesive tape and an adhesive film may be unable to peel. If the polyfunctional isocyanate curing agent (B) is excessive, the adhesive strength is reduced, and the adhesive film may be peeled off.
　接着フィルムと粘着テープの間の粘着力を調整する別の方法として、粘着剤に粘着付与樹脂を添加する方法が挙げられる。粘着付与樹脂は特に限定されず、例えばロジン樹脂、ロジンエステル樹脂、テルペン樹脂、テルペンフェノール樹脂、フェノール樹脂、キシレン樹脂、クマロン樹脂、クマロンインデン樹脂、スチレン樹脂、脂肪族石油樹脂、芳香族石油樹脂、脂肪族芳香族共重合石油樹脂、脂環族炭化水素樹脂、並びに、これらの変性品、誘導体、及び水素添加品等が挙げられる。 As another method for adjusting the adhesive force between the adhesive film and the adhesive tape, there is a method of adding a tackifying resin to the adhesive. The tackifying resin is not particularly limited. For example, rosin resin, rosin ester resin, terpene resin, terpene phenol resin, phenol resin, xylene resin, coumarone resin, coumarone indene resin, styrene resin, aliphatic petroleum resin, aromatic petroleum resin , Aliphatic aromatic copolymerized petroleum resins, alicyclic hydrocarbon resins, and modified products, derivatives, hydrogenated products, and the like thereof.
　粘着付与樹脂の配合量は特に限定されず、（メタ）アクリル酸エステル重合体（Ａ）１００質量部に対して２００質量部以下、好ましくは３０質量部以下とすることが好ましい。 The blending amount of the tackifying resin is not particularly limited, and is preferably 200 parts by mass or less, and preferably 30 parts by mass or less with respect to 100 parts by mass of the (meth) acrylic acid ester polymer (A).
粘着剤層の厚さは１５μｍ以上４０μｍ以下が好ましく、２０μｍ以上３５μｍ以下がより好ましい。１５μｍ未満の場合、接着フィルム一体型粘着テープをウエハに貼り合わせた際に気泡が混入する場合があり、４０μｍより厚い場合、粘着テープの濡れ性（粘着力）が高く、接着フィルムから剥離が困難な場合がある。
＜基材フィルム＞ The thickness of the pressure-sensitive adhesive layer is preferably 15 μm or more and 40 μm or less, and more preferably 20 μm or more and 35 μm or less. If the thickness is less than 15 μm, bubbles may be mixed in when the adhesive film-integrated pressure-sensitive adhesive tape is bonded to the wafer. If it is thicker than 40 μm, the adhesive tape has high wettability (adhesive strength) and is difficult to peel off from the adhesive film. There are cases.
<Base film>
基材フィルムは各種合成樹脂製のシートが使用可能である。基材フィルムの素材は特に限定されないが、ポリ塩化ビニル、ポリエチレンテレフタレート、エチレン－酢酸ビニル共重合体、エチレン－エチルアクリレート共重合体、ポリエチレン、ポリプロピレン、エチレン－アクリル酸共重合体及びアイオノマ樹脂等が挙げられる。基材フィルムにはこれらの樹脂の混合物及び多層フィルム等も使用可能である。 As the base film, various synthetic resin sheets can be used. The material of the base film is not particularly limited, but polyvinyl chloride, polyethylene terephthalate, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, polyethylene, polypropylene, ethylene-acrylic acid copolymer, ionomer resin, etc. Can be mentioned. A mixture of these resins and a multilayer film can also be used for the base film.
基材フィルムの素材はアイオノマ樹脂を用いることが好ましい。アイオノマ樹脂の中でも、エチレン単位、（メタ）メタアクリル酸単位及び（メタ）アクリル酸アルキルエステル単位を有する共重合体をＮａ＋、Ｋ＋、Ｚｎ２＋等の金属イオンで架橋したアイオノマ樹脂が、接着フィルムと貼り合わせた際に気泡を抑制する傾向にあり、さらに接着フィルム一体型粘着テープを半導体ウエハに貼り合せた際に密着性が良好な傾向にあり、好適に用いられる。 It is preferable to use an ionomer resin as a material for the base film. Among ionomer resins, ionomer resins obtained by crosslinking copolymers having ethylene units, (meth) methacrylic acid units and (meth) acrylic acid alkyl ester units with metal ions such as Na + , K + and Zn 2+ It tends to suppress air bubbles when bonded to a film, and tends to have good adhesion when bonded to a semiconductor wafer, and is preferably used.
基材フィルムの成型方法は特に限定されず、例えばカレンダー、Ｔダイ押出し、インフレーション、及びキャスティング等が挙げられる。基材フィルムの厚さは６０μｍ以上１２０μｍ以下が好ましく、７０μｍ以上１２０μｍ以下がより好ましい。６０μｍ未満の場合、接着フィルム一体型粘着テープをウエハに貼り合わせる際に作業性が悪く、１２０μｍより厚い場合、接着フィルム一体型粘着テープをウエハに貼り合わせた際に、気泡が混入する場合がある。 The molding method of the base film is not particularly limited, and examples thereof include calendar, T-die extrusion, inflation, and casting. The thickness of the base film is preferably 60 μm or more and 120 μm or less, and more preferably 70 μm or more and 120 μm or less. When the thickness is less than 60 μm, workability is poor when the adhesive film-integrated pressure-sensitive adhesive tape is bonded to the wafer, and when it is thicker than 120 μm, bubbles may be mixed when the adhesive film-integrated pressure-sensitive adhesive tape is bonded to the wafer. .
基材フィルムには、接着フィルムの剥離時における帯電を防止するために、基材フィルムの片面又は両面に帯電防止剤を塗布して帯電防止処理を施してもよい。 In order to prevent the base film from being charged when the adhesive film is peeled off, an antistatic agent may be applied to one side or both sides of the base film to carry out an antistatic treatment.
［接着フィルム］
　接着フィルムは、特に限定されず、例えば、アクリル系、エポキシ系、ポリイミド系、シリコーン系、フェノール系、ゴム系の単体又はこれらの混合物であり、熱重合開始剤、光開始剤等の添加剤を含有してもよく、例えば、市販の東レ製ウエハレベル対応可能ＮＣＦ（ポリイミド系）デクセリアルズ製３Ｄ－ＩＣ実装要フィルムタイプアンダーフィル（エポキシ系）及び日立化成製ＤＦ－３３５－７等が使用できる。 [Adhesive film]
The adhesive film is not particularly limited, and is, for example, an acrylic, epoxy, polyimide, silicone, phenol, rubber, or a mixture thereof, and includes additives such as a thermal polymerization initiator and a photoinitiator. For example, commercially available NCF (polyimide) Dexerials 3D-IC mounting required film type underfill (epoxy system) and Hitachi Chemical DF-335-7 can be used.
《電子部品の製造方法》
　本実施形態の接着フィルム一体型粘着テープを使用した電子部品の製造方法は特に限定されないが、例えば下記の手順が挙げられる。
（１）半球状のバンプを有する面ともう一方面が平面であるシリコンウエハにおいて、当該シリコンウエハをバンプを有する面を上として７０℃で加温したステージに設置し、バンプを有する面に接着フィルム一体型粘着テープを貼り合わせる。
（２）接着フィルム一体型粘着テープの粘着テープを接着フィルムから剥離する。
（３）接着フィルムが貼られている面とは逆面のシリコンウエハにダイシング用粘着テープを貼り合わせる。
（４）接着フィルム付きシリコンウエハをダイシングし半導体チップにする。
（５）接着フィルム付き半導体チップをダイシング用粘着テープから剥離しピックアップする。 《Method for manufacturing electronic parts》
Although the manufacturing method of the electronic component using the adhesive film integrated adhesive tape of this embodiment is not specifically limited, For example, the following procedure is mentioned.
(1) In a silicon wafer having a hemispherical bump surface and a flat surface on the other surface, the silicon wafer is placed on a stage heated at 70 ° C. with the surface having the bump up, and bonded to the surface having the bump. Affix the film-integrated adhesive tape.
(2) The adhesive tape of the adhesive film integrated adhesive tape is peeled from the adhesive film.
(3) A dicing adhesive tape is bonded to the silicon wafer opposite to the surface on which the adhesive film is bonded.
(4) A silicon wafer with an adhesive film is diced into semiconductor chips.
(5) The semiconductor chip with the adhesive film is peeled off from the dicing adhesive tape and picked up.
実施例１に係る接着フィルム一体型粘着テープは下記の処方で作成、評価した。
《接着フィルム一体型粘着テープ》
粘着テープの粘着剤層側に接着フィルムを２３℃でラミネートして接着フィルム一体型粘着テープを得た。粘着テープ等は下記のとおりである。
［粘着テープ］
粘着テープは、ＰＥＴセパレーターフィルム上に、粘着剤溶液を乾燥後の厚みが３０μｍとなるようにし塗布、乾燥後に基材フィルム（エチレン－メタアクリル酸共重合体のＺｎ塩を主体、ＭＦＲ値１．５ｇ／１０分（ＪＩＳ　Ｋ７２１０、２１０℃）、融点９６℃（三井・デュポンポリケミカル社製、ハイミラン１６５０）、８０μｍ）に積層することで作成した。
粘着剤溶液は、（メタ）アクリル酸エステル共重合体（Ａ）（Ａ－１：ｎ－ブチルアクリレート９５質量％、２－ヒドロキシエチルアクリレート５質量％の共重合体、重量平均分子量１６５万（綜研化学製、ＳＫダイン２１４７））１００質量部に多官能イソシアネート硬化剤（Ｂ）（２，４－トリレンジイソシアネートのトリメチロールプロパンアダクト体（東ソー製、コロネートＬ－４５Ｅ））５質量部を含有する。 The adhesive film integrated pressure-sensitive adhesive tape according to Example 1 was prepared and evaluated according to the following formulation.
《Adhesive film integrated adhesive tape》
An adhesive film was laminated on the pressure-sensitive adhesive layer side of the pressure-sensitive adhesive tape at 23 ° C. to obtain an adhesive film-integrated pressure-sensitive adhesive tape. The adhesive tape etc. are as follows.
[Adhesive tape]
The pressure-sensitive adhesive tape was applied on a PET separator film so that the thickness of the pressure-sensitive adhesive solution after drying was 30 μm, and after drying, a base film (mainly a Zn salt of an ethylene-methacrylic acid copolymer, with an MFR value of 1. It was created by laminating at 5 g / 10 min (JIS K7210, 210 ° C.), melting point 96 ° C. (Mitsui / DuPont Polychemical Co., Ltd., Himiran 1650), 80 μm).
The pressure-sensitive adhesive solution was a (meth) acrylic acid ester copolymer (A) (A-1: a copolymer of 95% by mass of n-butyl acrylate and 5% by mass of 2-hydroxyethyl acrylate, a weight average molecular weight of 1,650,000 (Soken) Chemical, SK Dyne 2147)) 100 parts by mass contains 5 parts by mass of polyfunctional isocyanate curing agent (B) (trimethylolpropane adduct of 2,4-tolylene diisocyanate (Tosoh Corp., Coronate L-45E)) .
（メタ）アクリル酸エステル共重合体（Ａ）の重量平均分子量は、ゲルパーミエーションクロマトグラフィー法（ＧＰＣ）により、測定した。
装置：ＧＰＣ－８０２０　ＳＥＣ　システム（東ソー社製）
カラム：ＴＳＫ　Ｇｕａｒｄ　ＨＺ－Ｌ　＋　ＨＺＭ－Ｎ　６．０×１５０ｍｍ×３
流量：０．５ｍｌ／ｍｉｎ
検出器：ＲＩ－８０２０
濃度：０．２ｗｔ／Ｖｏｌ％
注入量：２０μＬ
カラム温度：４０℃
システム温度：４０℃
溶媒：ＴＨＦ
検量線：標準ポリスチレン（ＰＬ社製）を用いて作成
重量平均分子量（Ｍｗ）：ポリスチレン換算値
［接着フィルム］
接着フィルムは、日立化成製ＤＦ－３３５－７（厚み２５μｍ）を使用した。
［接着フィルム一体型粘着テープの評価方法］
＜密着剥離性＞
密着剥離性は、上記で得られた接着フィルム一体型粘着テープを、予め７０℃に加温したシリコンウエハ上に貼り合せ、温度２３℃±２℃、湿度５０±５％の雰囲気下で２ｋｇロ－ラの１往復で圧着し、圧着１日後の、１．粘着テープと接着フィルムの界面の気泡数の測定（密着性）と、２．粘着テープと接着フィルムの界面の粘着力をテンシロン万能材料試験機（株式会社　エー・アンド・デイ、型番：ＲＴＧ－１２１０）で１８０°ピ－ル、引張り速度３００ｍｍ／分の条件で測定（剥離性）することにより、評価した。
◎（優）：粘着テープと接着フィルムの界面に１００μｍ径以上の気泡が０個／１００ｃｍ２、粘着力が０．２／２０ｍｍ以上１．０Ｎ／２０ｍｍ未満
○（良）：粘着テープと接着フィルムの界面に１００μｍ径以上の気泡が１～４個／１００ｃｍ２
粘着力が０．２／２０ｍｍ以上１．０Ｎ／２０ｍｍ未満
×（不可）：・粘着テープと接着フィルムの界面に１００μｍ径以上の気泡が４個以下／１００ｃｍ２で、粘着力が０．２／２０ｍｍ未満又は１．０Ｎ／２０ｍｍ超過、あるいは、
　　　　　　・粘着テープと接着フィルムの界面に１００μｍ径以上の気泡が５個以上／１００ｃｍ２
＜ウエハ追従性＞
ウエハ追従性は、半球状のバンプを有する面ともう一方面が平面であるウエハにおいて、バンプを有する面を上として７０℃で加温したステージに設置し、バンプを有する面に接着フィルム一体型粘着テープをシリンダー圧０．４ＭＰａのローラで貼り合せた際に、接着フィルム一体型粘着テープがバンプでない部分に接着している割合で評価した。すなわち、バンプを有する面のウエハの面積からバンプ面積（円）を除外した面積（バンプでない部分）を１００％とし、接着フィルム一体型粘着テープが、バンプでない部分と接触している割合を計算することにより評価した。なお、バンプは、２０μｍ径で高さ１０μｍの半球状であり、１００μｍ間隔で均等に配列した。
◎（優）：接着している面積が９５％以上の場合
○（良）：接着している面積が７０以上９５％未満の場合
×（不可）：接着している面積が７０％未満の場合 The weight average molecular weight of the (meth) acrylic acid ester copolymer (A) was measured by gel permeation chromatography (GPC).
Equipment: GPC-8020 SEC system (manufactured by Tosoh Corporation)
Column: TSK Guard HZ-L + HZM-N 6.0 × 150 mm × 3
Flow rate: 0.5ml / min
Detector: RI-8020
Concentration: 0.2wt / Vol%
Injection volume: 20 μL
Column temperature: 40 ° C
System temperature: 40 ° C
Solvent: THF
Calibration curve: Created using standard polystyrene (manufactured by PL) Weight average molecular weight (Mw): Polystyrene equivalent [adhesive film]
As the adhesive film, DF-335-7 (thickness 25 μm) manufactured by Hitachi Chemical was used.
[Evaluation method of adhesive film integrated adhesive tape]
<Adhesive peelability>
Adhesive peelability is obtained by bonding the adhesive film-integrated pressure-sensitive adhesive tape obtained above onto a silicon wafer previously heated to 70 ° C., and at 2 ° C. in an atmosphere at a temperature of 23 ° C. ± 2 ° C. and a humidity of 50 ± 5%. -After one round of crimping, 1 day after crimping, 1. measurement of the number of bubbles at the interface between the adhesive tape and the adhesive film (adhesion); Measure the adhesive strength at the interface between adhesive tape and adhesive film with Tensilon Universal Material Testing Machine (A & D Co., Ltd., Model No .: RTG-1210) at 180 ° peel and pulling speed of 300mm / min. ) Was evaluated.
◎ (excellent): 0 bubbles / 100 cm 2 with 100 μm diameter or more at the interface between the adhesive tape and the adhesive film, adhesive strength of 0.2 / 20 mm or more and less than 1.0 N / 20 mm ○ (good): adhesive tape and adhesive film 1 to 4 bubbles / 100 cm 2 with a diameter of 100 μm or more at the interface
Adhesive strength is 0.2 / 20 mm or more and less than 1.0 N / 20 mm × (impossible): · The number of bubbles having a diameter of 100 μm or more is 4 or less / 100 cm 2 at the interface between the adhesive tape and the adhesive film, and the adhesive strength is 0.2 / Less than 20 mm or more than 1.0 N / 20 mm, or
-Five or more bubbles with a diameter of 100 μm or more at the interface between the adhesive tape and the adhesive film / 100 cm 2
<Wafer followability>
Wafer following is a wafer having a hemispherical bump and a flat surface on the other side. The wafer is placed on a stage heated at 70 ° C. with the bump having the upper surface, and the adhesive film is integrated on the surface having the bump. When the pressure-sensitive adhesive tape was bonded with a roller having a cylinder pressure of 0.4 MPa, the adhesive film-integrated pressure-sensitive adhesive tape was evaluated as being adhered to a portion that was not a bump. That is, the area (the non-bump part) excluding the bump area (circle) from the area of the wafer having the bumps is defined as 100%, and the ratio of the adhesive film-integrated adhesive tape in contact with the non-bump part is calculated. It was evaluated by. The bumps were hemispherical with a diameter of 20 μm and a height of 10 μm, and were evenly arranged at intervals of 100 μm.
◎ (Excellent): When the bonded area is 95% or more ○ (Good): When the bonded area is 70 or more and less than 95% × (Not possible): When the bonded area is less than 70%
＜実施例２～１５、比較例１～８＞
実施例２～１５、比較例１～８の粘着剤層の設計、基材フィルムと粘着剤層の厚み、及び評価結果を表１～３にまとめる。（メタ）アクリル酸エステル共重合体（Ａ）等は、下記のとおりである。
（（メタ）アクリル酸エステル共重合体（Ａ））
　組成は、表１の通りであり、型式等は以下の通りである。 <Examples 2 to 15 and Comparative Examples 1 to 8>
Tables 1 to 3 summarize the design of the pressure-sensitive adhesive layers of Examples 2 to 15 and Comparative Examples 1 to 8, the thicknesses of the base film and the pressure-sensitive adhesive layer, and the evaluation results. The (meth) acrylic acid ester copolymer (A) and the like are as follows.
((Meth) acrylic acid ester copolymer (A))
The composition is as shown in Table 1, and the model is as follows.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
Ａ－１：綜研化学製、ＳＫダイン２１４７
Ａ－４：綜研化学製、ＳＫダイン２１３７
Ａ－５：日本ゼオン製、ＡＲ－５３Ｌ
Ａ－７：綜研化学製、ＳＫダイン１４５１
Ａ－２、３、６、８～１１は、自社重合品 A-1: SK Dyne 2147, manufactured by Soken Chemical
A-4: SK Dyne 2137, manufactured by Soken Chemical
A-5: Made by Nippon Zeon, AR-53L
A-7: Made by Soken Chemicals, SK Dyne 1451
A-2, 3, 6, 8-11 are in-house polymerized products
（多官能イソシアネート硬化剤（Ｂ））
２，４－トリレンジイソシアネートのトリメチロールプロパンアダクト体（東ソー製、コロネートＬ－４５Ｅ）。 (Multifunctional isocyanate curing agent (B))
A trimethylolpropane adduct of 2,4-tolylene diisocyanate (Tosoh, Coronate L-45E).
（基材フィルム）
エチレン－メタアクリル酸共重合体のＺｎ塩を主体、ＭＦＲ値１．５ｇ／１０分（ＪＩＳ　Ｋ７２１０、２１０℃）、融点９６℃（三井・デュポンポリケミカル社製、ハイミラン１６５０）。 (Base film)
Mainly composed of Zn salt of ethylene-methacrylic acid copolymer, MFR value 1.5 g / 10 min (JIS K7210, 210 ° C.), melting point 96 ° C. (manufactured by Mitsui DuPont Polychemical Co., Ltd., Himiran 1650).
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000003
Figure JPOXMLDOC01-appb-T000003
表２及び３の結果から、本発明の粘着テープは、接着フィルムの追従性低下を抑制し、粘着テープと接着フィルムの密着性低下を抑制し、接着フィルムからの剥離性も良好であることが分かった。なお、比較例は、下記の理由により、不良であった。
＜比較例１，２＞
　（メタ）アクリル酸エステル共重合体（Ａ）のｎ―ブチルアクリレートの含有率が低いため、接着フィルムと貼り合わせた際に気泡混入が生じたと考えられる。
＜比較例３＞
　（メタ）アクリル酸エステル共重合体（Ａ）のｎ―ブチルアクリレートの含有率が高いため、粘着力が強くなりすぎて、接着フィルムからの剥離不良が生じたと考えられる。
＜比較例４＞
（メタ）アクリル酸エステル共重合体（Ａ）の重量平均分子量が小さいため、粘着力が強くなりすぎて、接着フィルムからの剥離不良が生じたと考えられる。
＜比較例５＞
　（メタ）アクリル酸エステル共重合体（Ａ）の重量平均分子量が大きいため、粘着力が低下し、作業中に接着フィルムからの剥離が生じたと考えられる。　
＜比較例６＞
　多官能イソシアネート硬化剤（Ｂ）の含有量が少ないため、粘着力が強くなりすぎて、接着フィルムからの剥離不良が生じたと考えられる。
＜比較例７＞
　多官能イソシアネート硬化剤（Ｂ）の含有量が多いため、粘着剤層が硬くなり、粘着力が低下したため、作業中に接着フィルムから一部剥離が生じ、またウエハへ貼り合せた際に、バンプへの追従不良が生じたと考えられる。
＜比較例８＞
　（メタ）アクリル酸エステル共重合体（Ａ）のｎ―ブチルアクリレートの含有率が低いため、接着フィルムと貼り合わせた際に気泡混入が生じたと考えられる。 From the results of Tables 2 and 3, the pressure-sensitive adhesive tape of the present invention suppresses a decrease in the followability of the adhesive film, suppresses a decrease in the adhesion between the pressure-sensitive adhesive tape and the adhesive film, and has good peelability from the adhesive film. I understood. The comparative example was defective for the following reason.
<Comparative Examples 1 and 2>
Since the content of n-butyl acrylate in the (meth) acrylic acid ester copolymer (A) is low, it is considered that bubbles were mixed when bonded to the adhesive film.
<Comparative Example 3>
Since the content of n-butyl acrylate in the (meth) acrylic acid ester copolymer (A) is high, the adhesive strength becomes too strong, and it is considered that peeling failure from the adhesive film occurred.
<Comparative Example 4>
Since the weight average molecular weight of (meth) acrylic acid ester copolymer (A) is small, it is thought that the adhesive force became too strong and the peeling defect from the adhesive film occurred.
<Comparative Example 5>
Since the (meth) acrylic acid ester copolymer (A) has a large weight average molecular weight, the adhesive strength is lowered, and it is considered that peeling from the adhesive film occurred during the operation.
<Comparative Example 6>
It is thought that since the content of the polyfunctional isocyanate curing agent (B) is small, the adhesive strength becomes too strong, resulting in poor peeling from the adhesive film.
<Comparative Example 7>
Since the content of the polyfunctional isocyanate curing agent (B) is large, the pressure-sensitive adhesive layer becomes hard and the adhesive strength is reduced. It is probable that poor tracking has occurred.
<Comparative Example 8>
Since the content of n-butyl acrylate in the (meth) acrylic acid ester copolymer (A) is low, it is considered that bubbles were mixed when bonded to the adhesive film.
　以上のように、上記の接着フィルム一体型粘着テープは、バンプを有するウエハへの追従性が良好で、かつ、接着フィルムと粘着テープの密着性と剥離性を両立する。そのため、チップを積層固定する電子部品の製造方法に好適に用いられる。 As described above, the above adhesive film-integrated pressure-sensitive adhesive tape has good followability to a wafer having bumps and achieves both adhesion and peelability between the adhesive film and the pressure-sensitive adhesive tape. Therefore, it is suitably used in a method for manufacturing an electronic component in which chips are stacked and fixed.

Claims (3)

  1. 基材フィルムと粘着剤層からなる粘着テープの前記粘着剤層に接着フィルムを貼り合せた接着フィルム一体型粘着テープにおいて、粘着剤層が（メタ）アクリル酸エステル共重合体（Ａ）１００質量部と多官能イソシアネート硬化剤（Ｂ）１質量部以上１０質量部以下含有し、前記（メタ）アクリル酸エステル共重合体（Ａ）がｎ－ブチル（メタ）アクリレートを７０質量％以上９８質量％以下含有し、重量平均分子量が１２０万以上２２０万以下である接着フィルム一体型粘着テープ。 In the adhesive film-integrated pressure-sensitive adhesive tape in which an adhesive film is bonded to the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape comprising a base film and a pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer is 100 parts by weight of the (meth) acrylic acid ester copolymer (A). And 1 to 10 parts by mass of a polyfunctional isocyanate curing agent (B), and the (meth) acrylic acid ester copolymer (A) contains 70% by mass to 98% by mass of n-butyl (meth) acrylate. An adhesive film-integrated pressure-sensitive adhesive tape comprising and having a weight average molecular weight of 1.2 million to 2.2 million.
  2. 前記基材フィルムの厚みが６０μｍ以上１２０μｍ以下であり、粘着剤層の厚みが１５μｍ以上４０μｍ以下であり、粘着剤層の厚みが、基材フィルムの厚みに対して０．２以上０．５以下である請求項１記載の接着フィルム一体型粘着テープ。 The thickness of the base film is 60 μm or more and 120 μm or less, the thickness of the adhesive layer is 15 μm or more and 40 μm or less, and the thickness of the adhesive layer is 0.2 or more and 0.5 or less with respect to the thickness of the base film. The adhesive film-integrated pressure-sensitive adhesive tape according to claim 1.
  3. 請求項１又は請求項２記載の接着フィルム一体型粘着テープをシリコンウエハに貼付ける工程、
    接着フィルム一体型粘着テープの粘着テープを接着フィルムから剥離する工程、
    接着フィルムが貼られている面とは逆面のシリコンウエハにダイシング用粘着テープを貼り合わせる工程、
    接着フィルム付きシリコンウエハをダイシングし半導体チップにするダイシング工程、
    接着フィルム付き半導体チップを剥離するピックアップ工程を有する半導体チップの製造方法。     The process of sticking the adhesive film-integrated pressure-sensitive adhesive tape according to claim 1 or 2 to a silicon wafer,
    A process of peeling the adhesive tape of the adhesive film integrated adhesive tape from the adhesive film;
    A process of attaching a dicing adhesive tape to a silicon wafer opposite to the surface on which the adhesive film is applied;
    A dicing process for dicing a silicon wafer with an adhesive film into a semiconductor chip;
    A method for manufacturing a semiconductor chip, comprising a pick-up step for peeling a semiconductor chip with an adhesive film.
PCT/JP2017/007735 2016-04-21 2017-02-28 Adhesive-film-integrated pressure-sensitive adhesive tape and process for producing semiconductor chip WO2017183310A1 (en)

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JP2013001847A (en) * 2011-06-17 2013-01-07 Hitachi Chemical Co Ltd Laminated sheet for semiconductor, method for manufacturing semiconductor chip with adhesive layer, and method for manufacturing semiconductor device
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WO2012017568A1 (en) * 2010-08-05 2012-02-09 古河電気工業株式会社 Adhesive film and tape for semiconductor wafer processing
JP2013001847A (en) * 2011-06-17 2013-01-07 Hitachi Chemical Co Ltd Laminated sheet for semiconductor, method for manufacturing semiconductor chip with adhesive layer, and method for manufacturing semiconductor device
JP2013187376A (en) * 2012-03-08 2013-09-19 Hitachi Chemical Co Ltd Adhesive film for semiconductor device, semiconductor device manufacturing method and semiconductor device using the same
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