JPWO2017183310A1 - Adhesive film integrated adhesive tape and method for manufacturing semiconductor chip - Google Patents

Abstract

An object of the present invention is to provide an adhesive film-integrated pressure-sensitive adhesive tape having good conformability to a wafer having bumps and having both adhesiveness and peelability of the adhesive film and the pressure-sensitive adhesive tape, and a method of manufacturing a semiconductor chip using the same. In an adhesive film-integrated pressure-sensitive adhesive tape in which an adhesive film is bonded to the pressure-sensitive adhesive layer of a pressure-sensitive adhesive tape comprising a base film and a pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer contains a specific component, whereby a wafer having bumps is formed. It is possible to provide an adhesive film-integrated pressure-sensitive adhesive tape having good followability and having both adhesiveness and peelability of the adhesive film and the pressure-sensitive adhesive tape.

Description

  The present invention relates to an adhesive film-integrated pressure-sensitive adhesive tape and a method for manufacturing a semiconductor chip.

  As a method of manufacturing an electronic component, after forming a plurality of circuit patterns on a wafer or an insulating substrate to form an electronic component assembly, the electronic component assembly is processed into a chip, the chip is picked up, and the bottom surface of the chip is A method is known in which an adhesive is applied, a chip is fixed to a lead frame or the like with an adhesive, and the chip is sealed with a resin or the like to form an electronic component.

  As a method of manufacturing a chip by processing an electronic component assembly, the circuit pattern of the electronic component assembly is attached to an adhesive tape, the back surface of the circuit pattern is thinly polished (back grind), the adhesive tape is peeled off, and then the circuit A method is known in which an adhesive tape is bonded to the pattern surface, and further fixed to a ring frame, then cut and separated (diced) into individual chips, and the chips are stacked and fixed using an adhesive. Moreover, the method of using the adhesive film integrated adhesive tape which laminated | stacked the adhesive film and the adhesive tape is proposed (refer patent documents 1-4 etc.).

  By using the adhesive film-integrated pressure-sensitive adhesive tape for the production of electronic components, the step of applying the adhesive after back grinding or dicing can be omitted. The adhesive film-integrated adhesive tape in which the adhesive film and the adhesive tape are integrated is superior in controlling the thickness of the adhesive portion and suppressing the protrusion of the adhesive as compared with a method using an adhesive. The adhesive film-integrated pressure-sensitive adhesive tape is used for manufacturing electronic components such as a chip size package, a stack package, a system-in-package, and a TSV (Through Silicon Via). However, when used in the manufacture of TSV, the adhesive film-integrated pressure-sensitive adhesive tape has insufficient followability to bumps on the circuit pattern surface of the wafer, and adhesion failure is a problem. Moreover, when the adhesive force between the adhesive film and the adhesive tape is low, the adhesiveness between the adhesive film and the adhesive film is poor, so that the adhesive film peels off during the operation, and when the adhesive force is strong, there is a case where defective peeling occurs.

JP 2004-186429 A JP 2006-049509 A Japanese Patent Laid-Open No. 02-248064 Japanese Patent Laid-Open No. 05-211234

  The present invention has been made in view of the above circumstances, and has an adhesive film-integrated pressure-sensitive adhesive tape that has good followability to a wafer having bumps and has both adhesiveness and peelability of the adhesive film and the pressure-sensitive adhesive tape, and the same. An object is to provide a method for manufacturing a semiconductor chip.

The present invention employs the following means in order to solve the above problems.
(1) In an adhesive film-integrated pressure-sensitive adhesive tape in which an adhesive film is bonded to the pressure-sensitive adhesive layer of a pressure-sensitive adhesive tape comprising a base film and a pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer is a (meth) acrylate copolymer (A ) 100 parts by weight and polyfunctional isocyanate curing agent (B) 1 part by weight or more and 10 parts by weight or less,
Adhesive film-integrated pressure-sensitive adhesive in which the (meth) acrylic acid ester copolymer (A) contains 70% by mass to 98% by mass of n-butyl (meth) acrylate and has a weight average molecular weight of 1,200,000 to 2,200,000. tape.
(2) The thickness of the base film is 60 μm or more and 120 μm or less, the thickness of the pressure-sensitive adhesive layer is 15 μm or more and 40 μm or less, and the thickness of the pressure-sensitive adhesive layer is 0.00 with respect to the thickness of the base film. The adhesive film-integrated pressure-sensitive adhesive tape according to (1), which is 2 or more and 0.5 or less.
(3) A process of attaching the adhesive film-integrated pressure-sensitive adhesive tape according to (1) or (2) to a silicon wafer,
A process of peeling the adhesive tape of the adhesive film integrated adhesive tape from the adhesive film;
A process of attaching a dicing adhesive tape to a silicon wafer opposite to the surface on which the adhesive film is applied;
A dicing process for dicing a silicon wafer with an adhesive film into a semiconductor chip;
A method for manufacturing a semiconductor chip, comprising a pick-up step for peeling a semiconductor chip with an adhesive film.

  The adhesive film-integrated pressure-sensitive adhesive tape of the present invention has good followability to a wafer having bumps, and achieves both adhesion and peelability between the adhesive film and the pressure-sensitive adhesive tape. In addition, a semiconductor chip manufacturing method using the same can be provided.

  Hereinafter, the present invention will be described in detail. In the present specification, the monomer unit means a structural unit derived from a monomer. In this specification, the (meth) acryloyl group is a general term for an acryloyl group and a methacryloyl group. Similarly, a compound containing (meth) such as (meth) acrylic acid is a general term for a compound having “meta” in the name and a compound not having “meta”.

Hereinafter, the present invention will be described in more detail using embodiments.
《Adhesive film integrated adhesive tape》
The adhesive film-integrated pressure-sensitive adhesive tape according to the present invention has a pressure-sensitive adhesive tape and an adhesive film. Hereinafter, each member of the adhesive film-integrated pressure-sensitive adhesive tape will be described.

[Adhesive tape]
An adhesive tape has a base film and an adhesive layer.

  The pressure-sensitive adhesive tape is formed by applying a pressure-sensitive adhesive layer on a base film, for example, a method of directly applying a pressure-sensitive adhesive on a base film with a coater such as a gravure coater, comma coater, bar coater, knife coater or roll coater. There is a method in which a pressure-sensitive adhesive is applied to a release film and bonded to a base film after drying. The pressure-sensitive adhesive may be printed on the base film by convex printing, concave printing, flat printing, flexographic printing, offset printing, screen printing, or the like.

The thickness of the pressure-sensitive adhesive layer is preferably 0.2 or more and 0.5 or less, and more preferably 0.3 or more and 0.45 or less with respect to the thickness of the base film. If less than 0.2, workability is poor when the adhesive film-integrated adhesive tape is bonded to the wafer, and air bubbles may be mixed. If it is more than 0.5, the adhesive tape has high wettability and adhesion. Sometimes peeling from the film is difficult.

<Adhesive layer>
The pressure-sensitive adhesive layer of the present invention contains 100 parts by weight of the (meth) acrylic acid ester copolymer (A) and 1 part by weight or more and 10 parts by weight or less of the polyfunctional isocyanate curing agent (B), and the (meth) acrylic acid ester The copolymer (A) contains 70% by mass to 98% by mass of n-butyl (meth) acrylate, and has a weight average molecular weight of 1,200,000 to 2,200,000.

((Meth) acrylic acid ester copolymer (A))
Examples of the (meth) acrylic acid ester copolymer (A) include a polymer obtained by polymerizing a monomer that is an acrylic monomer such as methyl (meth) acrylate, a copolymer obtained by polymerizing plural types of monomers, and these monomers. And a copolymer obtained by copolymerizing an unsaturated monomer copolymerizable with (eg, vinyl acetate, styrene, acrylonitrile).

  Examples of the acrylic monomer include n-butyl (meth) acrylate, 2-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, octyl (meth) acrylate, and 2-ethylhexyl (meth). Acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, tridecyl (meth) acrylate, cyclohexyl (meth) acrylate, Examples include (meth) acrylic monomers such as benzyl (meth) acrylate and 2-methoxyethyl.

The acrylic monomer contains 70% by mass or more and 98% by mass or less of n-butyl (meth) acrylate, and more preferably 80% by mass or more and 96% by mass or less, from the viewpoints of adhesion to the adhesive film and releasability. When the amount is less than 70% by mass, air bubbles may be mixed when bonded to the adhesive film. When the amount exceeds 98% by mass, the adhesive tape has a high adhesive force and may be difficult to peel from the adhesive film.

  The acrylic monomer preferably has a monomer containing a functional group at least in part. The monomer containing this functional group includes a functional group such as hydroxyl group, carboxyl group, epoxy group, amide group, amino group, methylol group, sulfonic acid group, sulfamic acid group or (sub) phosphate group. A monomer having one or more types is exemplified. Of these, vinyl compounds having a hydroxyl group are preferred. In addition, the acrylate mentioned later is included in the vinyl compound here.

  Examples of the functional group-containing monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth) acrylate.

  Examples of the monomer having a carboxyl group include (meth) acrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, fumaric acid, acrylamide N-glycolic acid, and cinnamic acid.

  Examples of the monomer having an epoxy group include allyl glycidyl ether and (meth) acrylic acid glycidyl ether.

  Examples of the monomer having an amide group include (meth) acrylamide.

  Examples of the monomer having an amino group include N, N-dimethylaminoethyl (meth) acrylate.

  Examples of the monomer having a methylol group include N-methylolacrylamide.

  Vinyl monomers other than those described above may be used for the acrylic polymer. For example, ethylene, styrene, vinyl toluene, allyl acetate, vinyl propionate, vinyl butyrate, vinyl versatate, vinyl ethyl ether, vinyl propyl ether, ( And vinyl compounds such as (meth) acrylonitrile and vinyl isobutyl ether.

  The weight average molecular weight of the (meth) acrylic acid ester copolymer (A) is from 1.2 million to 2.2 million, preferably from 1.5 million to 2 million. If it is less than 1,200,000, the adhesive force becomes too strong due to component transfer from the adhesive film, and the adhesive tape and the adhesive film may not be peeled off. If it exceeds 2.2 million, the pressure-sensitive adhesive force is lowered and the adhesive film peels off. There is.

(Multifunctional isocyanate curing agent (B))
The polyfunctional isocyanate curing agent (B) is not particularly limited except that it has two or more isocyanate groups, and examples thereof include aromatic polyisocyanates, aliphatic polyisocyanates, alicyclic polyisocyanates, and adducts thereof. .

  The aromatic polyisocyanate is not particularly limited, and for example, 1,3-phenylene diisocyanate, 4,4′-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2 , 6-tolylene diisocyanate, 4,4'-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate benzene, dianisidine diisocyanate, 4,4'-diphenyl ether diisocyanate, and 4, 4 ', 4 "-triphenylmethane triisocyanate, etc. are mentioned.

  The aliphatic polyisocyanate is not particularly limited. For example, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, dodecamethylene. Examples thereof include diisocyanate and 2,4,4-trimethylhexamethylene diisocyanate.

  The alicyclic polyisocyanate is not particularly limited. For example, 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate, 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, methyl -2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 4,4'-methylenebis (cyclohexyl isocyanate), 1,4-bis (isocyanatomethyl) cyclohexane and the like.

  Among polyisocyanates, 1,3-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate and hexamethylene diisocyanate, which are easily available, are obtained by reacting with a polyol compound such as trimethylolpropane. It may be an adduct body.

The blending ratio of the polyfunctional isocyanate curing agent (B) is preferably 1 to 10 parts by mass with respect to 100 parts by mass of the (meth) acrylic acid ester copolymer (A). When there are few polyfunctional isocyanate hardening | curing agents (B), adhesive force is too strong and an adhesive tape and an adhesive film may be unable to peel. If the polyfunctional isocyanate curing agent (B) is excessive, the adhesive strength is reduced, and the adhesive film may be peeled off.

  Another method for adjusting the adhesive force between the adhesive film and the adhesive tape is to add a tackifying resin to the adhesive. The tackifying resin is not particularly limited. For example, rosin resin, rosin ester resin, terpene resin, terpene phenol resin, phenol resin, xylene resin, coumarone resin, coumarone indene resin, styrene resin, aliphatic petroleum resin, aromatic petroleum resin , Aliphatic aromatic copolymerized petroleum resins, alicyclic hydrocarbon resins, and modified products, derivatives, hydrogenated products, and the like thereof.

  The compounding quantity of tackifying resin is not specifically limited, It is 200 mass parts or less with respect to 100 mass parts of (meth) acrylic acid ester polymer (A), Preferably it is 30 mass parts or less.

The thickness of the pressure-sensitive adhesive layer is preferably 15 μm or more and 40 μm or less, and more preferably 20 μm or more and 35 μm or less. If the thickness is less than 15 μm, bubbles may be mixed in when the adhesive film-integrated pressure-sensitive adhesive tape is bonded to the wafer. If it is thicker than 40 μm, the adhesive tape has high wettability (adhesive strength) and is difficult to peel off from the adhesive film. There are cases.
<Base film>

As the base film, various synthetic resin sheets can be used. The material of the base film is not particularly limited, but polyvinyl chloride, polyethylene terephthalate, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, polyethylene, polypropylene, ethylene-acrylic acid copolymer, ionomer resin, etc. Can be mentioned. A mixture of these resins and a multilayer film can also be used for the base film.

It is preferable to use an ionomer resin as a material for the base film. Among ionomer resins, ionomer resins obtained by crosslinking copolymers having ethylene units, (meth) methacrylic acid units and (meth) acrylic acid alkyl ester units with metal ions such as Na ⁺ , K ⁺ and Zn ²⁺ It tends to suppress air bubbles when bonded to a film, and tends to have good adhesion when bonded to a semiconductor wafer, and is preferably used.

The molding method of the base film is not particularly limited, and examples thereof include calendar, T-die extrusion, inflation, and casting. The thickness of the base film is preferably 60 μm or more and 120 μm or less, and more preferably 70 μm or more and 120 μm or less. When the thickness is less than 60 μm, workability is poor when the adhesive film-integrated pressure-sensitive adhesive tape is bonded to the wafer, and when it is thicker than 120 μm, bubbles may be mixed when the adhesive film-integrated pressure-sensitive adhesive tape is bonded to the wafer. .

In order to prevent the base film from being charged when the adhesive film is peeled off, an antistatic agent may be applied to one side or both sides of the base film to carry out an antistatic treatment.

[Adhesive film]
The adhesive film is not particularly limited, and is, for example, an acrylic, epoxy, polyimide, silicone, phenol, rubber, or a mixture thereof, and includes additives such as a thermal polymerization initiator and a photoinitiator. For example, commercially available NCF (polyimide type) Dexerials 3D-IC mounting required film type underfill (epoxy type), Hitachi Chemical DF-335-7, etc. can be used.

《Method for manufacturing electronic parts》
Although the manufacturing method of the electronic component using the adhesive film integrated adhesive tape of this embodiment is not specifically limited, For example, the following procedure is mentioned.
(1) In a silicon wafer having a hemispherical bump surface and a flat surface on the other surface, the silicon wafer is placed on a stage heated at 70 ° C. with the surface having the bump up, and bonded to the surface having the bump. Affix the film-integrated adhesive tape.
(2) The adhesive tape of the adhesive film integrated adhesive tape is peeled from the adhesive film.
(3) A dicing adhesive tape is bonded to the silicon wafer opposite to the surface on which the adhesive film is bonded.
(4) A silicon wafer with an adhesive film is diced into semiconductor chips.
(5) The semiconductor chip with the adhesive film is peeled off from the dicing adhesive tape and picked up.

The adhesive film integrated pressure-sensitive adhesive tape according to Example 1 was prepared and evaluated according to the following formulation.
《Adhesive film integrated adhesive tape》
An adhesive film was laminated on the pressure-sensitive adhesive layer side of the pressure-sensitive adhesive tape at 23 ° C. to obtain an adhesive film-integrated pressure-sensitive adhesive tape. The adhesive tape etc. are as follows.
[Adhesive tape]
The pressure-sensitive adhesive tape was applied on a PET separator film so that the thickness after drying of the pressure-sensitive adhesive solution was 30 μm, and after drying, a base film (mainly a Zn salt of an ethylene-methacrylic acid copolymer, with an MFR value of 1. It was created by laminating at 5 g / 10 min (JIS K7210, 210 ° C.), melting point 96 ° C. (Mitsui / DuPont Polychemical Co., Ltd., Himiran 1650), 80 μm).
The pressure-sensitive adhesive solution was a (meth) acrylic acid ester copolymer (A) (A-1: a copolymer of 95% by mass of n-butyl acrylate and 5% by mass of 2-hydroxyethyl acrylate, a weight average molecular weight of 1,650,000 (Soken) Chemical, SK Dyne 2147)) 100 parts by mass contains 5 parts by mass of a polyfunctional isocyanate curing agent (B) (trimethylolpropane adduct of 2,4-tolylene diisocyanate (manufactured by Tosoh, Coronate L-45E)) .

The weight average molecular weight of the (meth) acrylic acid ester copolymer (A) was measured by gel permeation chromatography (GPC).
Apparatus: GPC-8020 SEC system (manufactured by Tosoh Corporation)
Column: TSK Guard HZ-L + HZM-N 6.0 × 150 mm × 3
Flow rate: 0.5ml / min
Detector: RI-8020
Concentration: 0.2wt / Vol%
Injection volume: 20 μL
Column temperature: 40 ° C
System temperature: 40 ° C
Solvent: THF
Calibration curve: Created using standard polystyrene (manufactured by PL) Weight average molecular weight (Mw): Polystyrene equivalent [adhesive film]
The adhesive film used was DF-335-7 (thickness 25 μm) manufactured by Hitachi Chemical.
[Evaluation method of adhesive film integrated adhesive tape]
<Adhesive peelability>
Adhesive peelability is obtained by bonding the adhesive film-integrated pressure-sensitive adhesive tape obtained above onto a silicon wafer previously heated to 70 ° C., and at 2 ° C. in an atmosphere at a temperature of 23 ° C. ± 2 ° C. and a humidity of 50 ± 5%. -After one round of crimping, 1 day after crimping, 1. measurement of the number of bubbles at the interface between the adhesive tape and the adhesive film (adhesion); Measure the adhesive strength at the interface between the adhesive tape and adhesive film with a Tensilon universal material testing machine (A & D Co., Ltd., model number: RTG-1210) at 180 ° peel and a pulling speed of 300 mm / min. ) Was evaluated.
◎ (excellent): 0 bubbles / 100 cm ² with 100 μm diameter or more at the interface between the adhesive tape and the adhesive film, adhesive strength of 0.2 / 20 mm or more and less than 1.0 N / 20 mm ○ (good): adhesive tape and adhesive film 1 to 4 bubbles with a diameter of 100 μm or more / 100 cm ^{2 at} the interface
Adhesive strength is 0.2 / 20 mm or more and less than 1.0 N / 20 mm × (impossible): · The number of bubbles having a diameter of 100 μm or more is 4 or less / 100 cm ² at the interface between the adhesive tape and the adhesive film, and the adhesive strength is 0.2 / Less than 20 mm or more than 1.0 N / 20 mm, or
-Five or more bubbles with a diameter of 100 μm or more at the interface between the adhesive tape and the adhesive film / 100 cm ²
<Wafer followability>
Wafer following is a wafer having a hemispherical bump and a flat surface on the other side. The wafer is placed on a stage heated at 70 ° C. with the bump having the upper surface, and the adhesive film is integrated on the surface having the bump. When the pressure-sensitive adhesive tape was bonded with a roller having a cylinder pressure of 0.4 MPa, the adhesive film-integrated pressure-sensitive adhesive tape was evaluated as being adhered to a portion that was not bump. That is, the area (the non-bump part) excluding the bump area (circle) from the area of the wafer having the bumps is defined as 100%, and the ratio of the adhesive film-integrated adhesive tape in contact with the non-bump part is calculated. It was evaluated by. The bumps were hemispherical with a diameter of 20 μm and a height of 10 μm, and were evenly arranged at intervals of 100 μm.
◎ (Excellent): When the bonded area is 95% or more ○ (Good): When the bonded area is 70 or more and less than 95% × (Not possible): When the bonded area is less than 70%

<Examples 2 to 15 and Comparative Examples 1 to 8>
Tables 1 to 3 summarize the designs of the pressure-sensitive adhesive layers of Examples 2 to 15 and Comparative Examples 1 to 8, the thicknesses of the base film and the pressure-sensitive adhesive layer, and the evaluation results. The (meth) acrylic acid ester copolymer (A) and the like are as follows.
((Meth) acrylic acid ester copolymer (A))
The composition is as shown in Table 1, and the model is as follows.

A-1: SK Dyne 2147, manufactured by Soken Chemical
A-4: SK Dyne 2137, manufactured by Soken Chemical
A-5: Made by Nippon Zeon, AR-53L
A-7: SK Dyne 1451, manufactured by Soken Chemical
A-2, 3, 6, 8-11 are in-house polymerization products

(Multifunctional isocyanate curing agent (B))
A trimethylolpropane adduct of 2,4-tolylene diisocyanate (manufactured by Tosoh Corp., Coronate L-45E).

(Base film)
Mainly Zn salt of ethylene-methacrylic acid copolymer, MFR value 1.5 g / 10 min (JIS K7210, 210 ° C.), melting point 96 ° C. (Mitsui, DuPont Polychemical Co., Ltd., Himiran 1650).

From the results of Tables 2 and 3, the pressure-sensitive adhesive tape of the present invention suppresses a decrease in the followability of the adhesive film, suppresses a decrease in the adhesion between the pressure-sensitive adhesive tape and the adhesive film, and has good peelability from the adhesive film. I understood. The comparative example was defective for the following reason.
<Comparative Examples 1 and 2>
Since the content of n-butyl acrylate in the (meth) acrylic acid ester copolymer (A) is low, it is considered that bubbles were mixed when bonded to the adhesive film.
<Comparative Example 3>
Since the content of n-butyl acrylate in the (meth) acrylic acid ester copolymer (A) is high, the adhesive strength becomes too strong, and it is considered that peeling failure from the adhesive film has occurred.
<Comparative example 4>
Since the weight average molecular weight of (meth) acrylic acid ester copolymer (A) is small, it is thought that the adhesive force became too strong and the peeling defect from the adhesive film occurred.
<Comparative Example 5>
Since the (meth) acrylic acid ester copolymer (A) has a large weight average molecular weight, the adhesive strength is lowered, and it is considered that peeling from the adhesive film occurred during the operation.
<Comparative Example 6>
It is thought that since the content of the polyfunctional isocyanate curing agent (B) is small, the adhesive strength becomes too strong, resulting in poor peeling from the adhesive film.
<Comparative Example 7>
Since the content of the polyfunctional isocyanate curing agent (B) is large, the pressure-sensitive adhesive layer becomes hard and the adhesive strength is reduced. It is probable that poor tracking has occurred.
<Comparative Example 8>
Since the content of n-butyl acrylate in the (meth) acrylic acid ester copolymer (A) is low, it is considered that bubbles were mixed when bonded to the adhesive film.

  As described above, the adhesive film-integrated pressure-sensitive adhesive tape has good followability to a wafer having bumps, and achieves both adhesion and peelability between the adhesive film and the pressure-sensitive adhesive tape. Therefore, it is suitably used in a method for manufacturing an electronic component in which chips are stacked and fixed.

Claims (3)

In the adhesive film-integrated pressure-sensitive adhesive tape in which an adhesive film is bonded to the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape comprising a base film and a pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer is 100 parts by weight of the (meth) acrylic acid ester copolymer (A). And a polyfunctional isocyanate curing agent (B) in an amount of 1 to 10 parts by mass, and the (meth) acrylic acid ester copolymer (A) contains 70 to 98% by mass of n-butyl (meth) acrylate. An adhesive film-integrated pressure-sensitive adhesive tape comprising and having a weight average molecular weight of 1.2 million to 2.2 million. The thickness of the base film is 60 μm or more and 120 μm or less, the thickness of the adhesive layer is 15 μm or more and 40 μm or less, and the thickness of the adhesive layer is 0.2 or more and 0.5 or less with respect to the thickness of the base film. The adhesive film-integrated pressure-sensitive adhesive tape according to claim 1. The process of sticking the adhesive film-integrated pressure-sensitive adhesive tape according to claim 1 or 2 to a silicon wafer,
A process of peeling the adhesive tape of the adhesive film integrated adhesive tape from the adhesive film;
A process of attaching a dicing adhesive tape to a silicon wafer opposite to the surface on which the adhesive film is applied;
A dicing process for dicing a silicon wafer with an adhesive film into a semiconductor chip;
A method for manufacturing a semiconductor chip, comprising a pick-up step for peeling a semiconductor chip with an adhesive film.